WO2021135267A1 - 天线单元及阵列天线 - Google Patents

天线单元及阵列天线 Download PDF

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Publication number
WO2021135267A1
WO2021135267A1 PCT/CN2020/110272 CN2020110272W WO2021135267A1 WO 2021135267 A1 WO2021135267 A1 WO 2021135267A1 CN 2020110272 W CN2020110272 W CN 2020110272W WO 2021135267 A1 WO2021135267 A1 WO 2021135267A1
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WIPO (PCT)
Prior art keywords
antenna
antenna unit
substrate
feed
cavity structure
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PCT/CN2020/110272
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English (en)
French (fr)
Inventor
李明超
黄子茂
陈礼涛
刘培涛
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京信通信技术(广州)有限公司
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Publication of WO2021135267A1 publication Critical patent/WO2021135267A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/2002—Dielectric waveguide filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure
    • H01Q1/526—Electromagnetic shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/0006—Particular feeding systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q21/00—Antenna arrays or systems
    • H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
    • H01Q21/061—Two dimensional planar arrays

Definitions

  • the present invention relates to the field of mobile communication technology, in particular to an antenna unit and an array antenna.
  • 5G mobile communication technology has accumulated a certain amount of technology.
  • the current mainstream 5G large-scale antennas mainly use sheet metal, die-casting or PCB vibrators as radiating units, and are supplemented by PCB boards for power feeding.
  • a filter and other radio frequency components are needed on the back of the antenna to achieve the corresponding antenna indicators.
  • An antenna unit including:
  • the integrally formed dielectric substrate includes a power feeding substrate and a cavity structure protruding from one side of the power feeding substrate, and the surface of the cavity structure is covered with a metal layer to form a shielding cavity;
  • the radiating unit is installed on one side of the feeding substrate
  • a feeder network circuit layer formed on the surface of the feeder substrate and used to feed the radiation unit
  • the dielectric filter module is arranged in the cavity structure, and the output end of the dielectric filter module is electrically connected to the line layer of the feeder network.
  • one side of the cavity structure has an opening
  • the antenna unit further includes a shielding cover
  • the shielding cover covers the opening of the cavity structure
  • the bottom of the cavity structure is formed with a first limit post extending to the opening of the cavity structure
  • the dielectric filter module has a first fixing hole
  • the first limit The position post is penetrated in the first fixing hole.
  • a second limiting post is formed on the edge of the opening of the cavity structure, a second fixing hole is opened on the shielding cover, and the second limiting post penetrates through the second fixing ⁇ In the hole.
  • it further includes a feeding structure circuit layer integrally formed with the feeding network circuit layer, and the feeding structure circuit layer extends from the feeding substrate to the radiating unit so as to The radiating unit is fed.
  • a balun pole is formed on the surface of the feeding substrate, and the radiating unit is plate-shaped and is installed at an end of the balun pole away from the feeding substrate.
  • the circuit layer of the feed structure extends toward the radiating unit along the surface of the balun pole.
  • the feeding substrate is partially recessed to form a hollow columnar protrusion
  • the radiation unit is a metal layered structure attached to the outer surface of the columnar protrusion.
  • the circuit layer of the feed structure extends toward the radiating unit along the inner wall of the columnar protrusion.
  • the radiation unit is installed on the side of the feeding substrate away from the cavity structure.
  • it further includes a calibration network circuit layer, the calibration network circuit layer is formed on the side of the feeding substrate away from the radiation unit, and is electrically connected to the input end of the dielectric filter module .
  • a metal reflector is further included, and the metal reflector is disposed on the side of the feed substrate away from the radiation unit.
  • a third limiting post is formed on the side of the feeding substrate facing away from the radiation unit, a third fixing hole is opened on the metal reflector, and the third limiting post penetrates Set in the third fixing hole.
  • the side of the feeding substrate facing away from the radiating unit is formed with ribs scattered on the surface of the feeding substrate, and the ribs abut the metal reflector.
  • the above-mentioned antenna unit, dielectric filter module and cavity structure cooperate, which can be functionally equivalent to a traditional dielectric filter, and the feeder network line layer can be formed on the surface of the feeder substrate by means of coating or the like. Therefore, it is equivalent to integrating the feed network and the dielectric filter in the traditional antenna on the dielectric substrate.
  • the feeder network line layer can be formed on the surface of the feeder substrate by means of coating or the like. Therefore, it is equivalent to integrating the feed network and the dielectric filter in the traditional antenna on the dielectric substrate.
  • An array antenna includes a plurality of antenna units according to any one of the above preferred embodiments.
  • FIG. 1 is a schematic diagram of the structure of an array antenna in an embodiment of the present invention
  • FIG. 2 is a schematic diagram of the structure of an array antenna in another embodiment of the present invention.
  • FIG. 3 is a schematic diagram of the structure of an antenna unit in an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the front assembly of the antenna unit shown in FIG. 3;
  • FIG. 5 is a schematic diagram of rear assembly of the antenna unit shown in FIG. 3;
  • FIG. 6 is a schematic diagram of the structure of the antenna unit in the second embodiment of the present invention.
  • FIG. 7 is a schematic diagram of rear assembly of the antenna element shown in FIG. 6;
  • FIG. 8 is a schematic diagram of rear assembly of the antenna unit in the third embodiment of the present invention.
  • FIG. 9 is a schematic diagram of the structure of the antenna unit in the fourth embodiment of the present invention.
  • FIG. 10 is a schematic diagram of rear assembly of the antenna unit shown in FIG. 9.
  • the present invention provides an antenna unit 100 and an array antenna 10.
  • the array antenna 10 may be a 5G array antenna.
  • the array antenna 10 includes a plurality of antenna units 100.
  • the multiple antenna units 100 can be arranged according to a preset rule.
  • the array antenna 10 shown in FIG. 1 includes 8 antenna units 100, and every 8 antenna units 100 are distributed in 2 rows and 4 columns.
  • the number of antenna units 100 contained therein and the arrangement of the antenna units 100 can also be adjusted accordingly.
  • the antenna unit 100 in an embodiment of the present invention includes a dielectric substrate 110, a radiation unit 120, a feed network circuit layer 130 and a dielectric filter module 140.
  • the media substrate 110 is an integrally formed structure, and its material can be plastic, resin, or the like.
  • the dielectric substrate 110 is integrally formed by injection molding.
  • the dielectric substrate 110 includes a feeding substrate 112 and a cavity structure 114, and the cavity structure 114 protrudes from one side of the feeding substrate 112.
  • the outer contour of the cavity structure 114 may be cubic, elliptical, or the like.
  • the surface of the cavity structure 114 is covered with a metal layer (not shown) to form a shielding cavity.
  • the metal layer may be distributed on the inner surface or the outer surface of the cavity structure 114.
  • the radiation unit 120 is used to receive and radiate electromagnetic wave signals, and a dual-polarization radiation unit 120 is generally used.
  • the radiation unit 120 may be in the form of a metal vibrator structure, a PCB vibrator structure, a plastic metalized vibrator, a metal layered structure, and the like.
  • the radiation unit 120 is installed on one side of the feeding substrate 112. Wherein, the radiation unit 120 and the cavity structure 114 may be located on the same side of the feeding substrate 112, or may be located on different sides.
  • the radiation unit 120 is installed on the side of the feeding substrate 112 facing away from the cavity structure 114. With this arrangement, on the one hand, it can prevent the convex cavity structure 114 from blocking the radiation unit 120, thereby affecting the signal receiving and sending effect. On the other hand, since the radiating unit 120 and the cavity structure 114 are respectively located on different sides of the feeding substrate 112, they are allowed to overlap laterally (that is, the orthographic projections of the two on the feeding substrate 112 at least partially overlap) In this way, the space on the surface of the dielectric substrate 110 can be rationally utilized, thereby reducing the size of the antenna unit 100.
  • each feeding substrate 112 may be provided with one or more radiation units 120. As shown in FIG. 3, in this embodiment, each feeding substrate 112 is provided with one radiation unit 120; and as shown in FIGS. 6 and 9, in other implementations, each feeding substrate 112 is provided with three radiation units 120.
  • the feeding network circuit layer 130 is formed on the surface of the feeding substrate 112 and is used to feed the radiation unit 120.
  • the feeder network circuit layer 130 can integrate functional circuits such as sub-circuits and filter circuits, which is equivalent to a traditional feeder network.
  • a circuit with a predetermined circuit structure can be formed on the surface of the feeder substrate 112 by selective electroplating, electroless plating and LDS (Laser Direct Forming Technology) and other surface metal forming methods to obtain the feeder network circuit layer 130.
  • the material can be a good conductor such as copper and silver.
  • the dielectric filter module 140 is disposed in the cavity structure 114, and the output end of the dielectric filter module 140 is electrically connected to the feeder network circuit layer 130. Since the cavity structure 114 cooperates with the metal layer on the surface to form a shielding cavity, the isolation can be greatly improved. Specifically, the output end of the dielectric filter module 140 may be provided with a metalized via hole, and is electrically connected to the feeder network circuit layer 130 through a metal pillar penetrating the feeder substrate 112. The electromagnetic wave signal can be input through the input end of the dielectric filter module 140 and output from the output end to the feeding network circuit layer 130, and further used to feed the radiation unit 120.
  • the antenna unit 100 further includes a calibration network circuit layer 170.
  • the calibration network circuit layer 170 is formed on the side of the feed substrate 112 facing away from the radiation unit 120, and is connected to the dielectric filter module 140.
  • the input terminal is electrically connected.
  • the calibration network circuit layer 170 can be formed in the same manner as the feed network circuit layer 130, and the feed substrate 112 is used as a substrate.
  • the dielectric substrate 110 is equivalent to integrating the traditional calibration network and the feeding network at the same time, so it is beneficial to simplify the structure of the antenna unit 100.
  • the corresponding position on the surface of the feeding substrate 112 is also covered with a metal coating (not shown).
  • the metal coating is used to form the grounding layer of the circuit layers such as the feeder network circuit layer 130 and the calibration network circuit layer 170.
  • the metal coating is generally integrally connected with the metal layer on the surface of the cavity structure 114.
  • the antenna unit 100 further includes a shielding cover 150, and the shielding cover 150 covers the opening of the cavity structure 114.
  • the shielding cover 150 may be a metal plate, a PCB board, or a composite dielectric plate structure with a metal-plated surface, which covers the opening of the cavity structure 114 to form a closed shielding cavity.
  • the opening of the cavity structure 114 facilitates quick installation of the dielectric filter module 140 into the cavity structure 114, thereby facilitating assembly.
  • the opening of the cavity structure 114 and the radiation unit 120 may be located on the same side. As shown in FIGS. 7, 8 and 10, in other embodiments, the opening of the cavity structure 114 may also be located on the side facing away from the radiation unit 120. In this way, it is possible to prevent the radiation unit 120 from restricting the installation of the dielectric filter module 140.
  • a small-sized notch may also be opened on the side of the cavity structure 114.
  • the dielectric filter module 140 can be inserted into the cavity structure 114 through the gap, and after being inserted in place, the end of the dielectric filter module 140 can also play a role in shielding the gap, thereby ensuring the airtightness of the shielding cavity.
  • the bottom of the cavity structure 114 is formed with a first limiting post 1141 extending toward the opening of the cavity structure 114, and the dielectric filter module 140 has a first limiting post 1141.
  • the first limiting post 1141 is integrally formed when the dielectric substrate 110 is formed. Through the first limiting post 1141 and the first fixing hole 141, the dielectric filter module 140 can be independent of other metal connecting parts and threaded parts, and The installation is realized without welding operation, which is beneficial to reduce the weight of the antenna unit 100. Moreover, fewer metal components and solder joints are also beneficial to ensure the intermodulation performance of the dielectric filter module 140.
  • the first limiting column 1141 is a hot melt column.
  • the filter module 140 is fixed in the cavity structure 114.
  • first limiting post 1141 and the first fixing hole 141 are not limited to be fixed only by heat melting.
  • first limiting post 1141 may be arranged in a conical shape. When the first limiting post 1141 passes through the first fixing hole 141, it will gradually be locked with the wall of the first fixing hole 141.
  • the edge of the opening of the cavity structure 114 is formed with a second limiting post 1143
  • the shielding cover 150 is provided with a second fixing hole 151
  • the second limiting post 1143 penetrates through the second fixing hole. 151 within.
  • the second limiting column 1143 has the same structure and forming method as the first limiting column 1141. Similarly, this can reduce the use of metal connectors such as screws and avoid welding operations. Therefore, while reducing the weight of the antenna unit 100, the intermodulation performance of the dielectric filter module 140 can be further ensured.
  • the second limiting post 1143 may also be a hot melt post.
  • the shield cover 150 is fixed on the edge of the opening of the cavity structure 114.
  • the dielectric substrate 110 is equivalent to integrating the feed network and the dielectric filter components in a traditional antenna. Moreover, the dielectric substrate 110 can also support the radiation unit 120, making the installation of the radiation unit 120 convenient.
  • the metal-plated composite structure on the surface of the cavity structure 114 can simultaneously achieve a better shielding effect, and the mass of the antenna unit 100 can be further reduced, thereby realizing the lightweight of the array antenna 10.
  • the antenna unit 100 further includes a feed structure circuit layer 160 integrally formed with the feed network circuit layer 130, and the feed structure circuit layer 160 is formed by the feed substrate 112.
  • the radiation unit 120 extends to feed power to the radiation unit 120.
  • the feed structure circuit layer 160 can be formed in the same manner as the feed network circuit layer 130. Since the feeder network circuit layer 130 and the feeder structure circuit layer 160 are integrally formed, there is no need for soldering between them, and there is no solder joint.
  • the function of the feeding structure circuit layer 160 is similar to that of a traditional feeding structure, such as a feeding balun and a feeding column, and is used for feeding the radiating unit 120. In this way, there is no need to provide an additional feeding part.
  • the structure of the antenna unit 100 can be further simplified, and on the other hand, its intermodulation performance can also be improved.
  • the feeding structure circuit layer 160 can be directly electrically connected to the radiating unit 120 for power feeding, and can also realize non-contact coupling and feeding.
  • the radiating unit 120 can be implemented in many different ways. As shown in FIG. 3 and FIG. 6, in one embodiment, the radiation unit 120 has a plate shape. Moreover, a balun pole 1121 is formed on the surface of the feeding substrate 112, and the radiation unit 120 is installed at an end of the balun pole 1121 away from the feeding substrate 112.
  • the radiation unit 120 may be a metal plate, a PCB board, or a patch vibrator structure.
  • the balun pole 1121 plays a supporting role, and the radiation unit 120 can be directly welded to the end of the balun pole 1121.
  • the feed structure circuit layer 160 extends along the surface of the balun pole 1121 toward the radiation unit 120.
  • the balun post 1121 serves as a carrier of the feed structure circuit layer 160 and supports the feed structure circuit layer 160. Therefore, the balun post 1121 cooperates with the circuit layer 160 of the feed structure, which is equivalent to a traditional feed balun and feed post.
  • the feeding structure circuit layer 160 may extend along the balun pole 1121 to contact the radiating unit 120 to realize direct feeding, or it may extend to a certain distance from the radiating unit 120 to realize coupled feeding.
  • the feeding substrate 112 is partially recessed to form hollow columnar protrusions 1123
  • the radiation unit 120 is a metal layered structure attached to the outer surface of the columnar protrusions 1123.
  • the columnar protrusions 1123 serve as a support for the metal layered structure, so that the radiation unit 120 and the dielectric substrate 110 form an integrated structure.
  • the radiating unit, the feeding network, and the dielectric filter can be integrated on the dielectric substrate 110 at the same time, so the structure of the antenna unit 100 can be further simplified, and its volume and mass can be further reduced.
  • the hollow columnar protrusion 1123 may be cubic or cylindrical, that is, its cross-section is rectangular or circular.
  • the feed structure circuit layer 160 extends toward the radiation unit 120 along the inner wall of the columnar protrusion.
  • the feed structure circuit layer 160 can extend along the inner wall of the columnar protrusion 1123 to below the radiating unit 120, and be electrically connected through metallized vias to achieve direct power feeding, or it can extend to a certain distance from the radiating unit 120 to achieve coupling Feed.
  • the antenna unit 100 further includes a metal reflector 180, and the metal reflector 180 is disposed on the side of the feeding substrate 112 facing away from the radiation unit 120.
  • the metal reflector 180 can reflect electromagnetic wave signals multiple times, thereby enhancing the efficiency of signal transmission and reception of the radiation unit 120.
  • the surface profile of the metal reflector 180 is generally substantially the same as the surface profile of the feeding substrate 112, and the surfaces of the two are arranged opposite to each other.
  • the metal reflector 180 can be mounted on the dielectric substrate 110 by screwing, welding, or the like.
  • a third limiting post 1125 is formed on the side of the feeding substrate 112 facing away from the radiation unit 120, and a third fixing hole 181 is opened on the metal reflector 180. The third limiting post 1125 penetrates through the third fixing hole 181.
  • the third limiting column 1125 may have the same structure and type as the first limiting column 1141 and the second limiting column 1143. Specifically, the third limiting column 1125 may be a hot melt column.
  • the metal reflector 180 When installing the metal reflector 180, first pass the third limiting post 1125 through the third fixing hole 181; then use a hot-melting process to melt the end of the third limiting post 1125 protruding from the back of the metal reflector 180; after it solidifies The metal reflector 180 can be fixed on one side of the feeding substrate 112.
  • the metal reflector 180 is also provided with an escape hole 183.
  • the cavity structure 114 passes through the avoidance hole 183.
  • the side of the feeding substrate 112 facing away from the radiation unit 120 is formed with ribs 1127 scattered on the surface of the feeding substrate 112, and the ribs 1127 abut against the metal reflector 180.
  • the ribs 1127 may be distributed in a ring shape on the surface of the feeding substrate 112, or may extend linearly on the surface of the feeding substrate 112. On the one hand, the ribs 1127 can play a role in strengthening the mechanical strength of the feeding substrate 112. On the other hand, the ribs 1127 can support the metal reflector 180 so as to maintain a stable gap between the metal reflector 180 and the feeding substrate 112.
  • the metal reflector 180 may be omitted.
  • the array antenna 10 includes a reflector 200.
  • the material and structure of the reflector 200 and the metal reflector 180 are substantially the same, and the difference is that the surface area of the reflector 200 is larger. Therefore, multiple antenna units 100 can share the reflector 200.
  • the feeder network circuit layer 130 can be formed on the surface of the feeder substrate 112 by coating or the like, and the dielectric filter module 140 can be integrated with the feeder network circuit through the cavity structure 114 integrally formed with the feeder substrate 112. Integration of layer 130 and radiation unit 120.
  • the dielectric filter module 140 can be integrated with the feeder network circuit through the cavity structure 114 integrally formed with the feeder substrate 112. Integration of layer 130 and radiation unit 120.

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Abstract

本发明涉及一种天线单元及阵列天线，天线单元包括一体成型的介质基材、辐射单元、馈电网络线路层及介质滤波器模块。介质滤波器模块与腔体结构配合，可在功能上相当于传统的介质滤波器，而馈电网络线路层又可通过镀膜等方式形成于馈电基板的表面。因此，相当于将传统天线中的馈电网络及介质滤波器集成于介质基材上。组装阵列天线时，无需再进行馈电网络、滤波器的焊接及螺接等操作，只需将预设数量的天线单元按照一定规则排列即可，故能有效地简化操作及结构。而且，腔体结构表面镀金属的复合结构相较于金属腔体结构的密度更小，故天线单元的质量也更轻。因此，上述天线单元能实现阵列天线的轻量化。

Description

天线单元及阵列天线 技术领域
本发明涉及移动通信技术领域，特别涉及一种天线单元及阵列天线。
背景技术
5G移动通信技术经过几年的发展已经有一定的技术积累。当前主流5G大规模天线主要使用钣金、压铸或者PCB振子作为辐射单元，并辅以PCB板进行馈电。此外，天线背面还需附加滤波器等射频组件，以实现相应的天线指标。
现有天线几个必要部件一般分别单独装配，最后通过螺钉、铆钉拼装成整机。由于阵列天线的元件众多，故这种方式不仅装配复杂，且会导致天线整机的体积大、重量大。
发明内容
基于此，有必要提供一种能实现轻量化的天线单元及阵列天线。
一种天线单元，包括：
一体成型的介质基材，包括馈电基板及突出于所述馈电基板一侧的腔体结构，且所述腔体结构的表面覆设有金属层，以构成屏蔽腔；
辐射单元，安装于所述馈电基板的一侧；
馈电网络线路层，形成于所述馈电基板的表面，并用于为所述辐射单元馈电；及
介质滤波器模块，设于所述腔体结构内，且所述介质滤波器模块的输出端与所述馈电网络线路层电连接。
在其中一个实施例中，所述腔体结构的一侧开口，所述天线单元还包括屏蔽盖，且所述屏蔽盖覆盖所述腔体结构的开口。
在其中一个实施例中，所述腔体结构的底部形成有向所述腔体结构的开口延伸的第一限位柱，所述介质滤波器模块上具有第一固定孔，所述第一限位柱穿设于所述第一固定孔内。
在其中一个实施例中，所述腔体结构开口的边缘形成有第二限位柱，所述屏蔽盖上开设有第二固定孔，所述第二限位柱穿设于所述第二固定孔内。
在其中一个实施例中，还包括与所述馈电网络线路层一体成型的馈电结构线路层，所述馈电结构线路层由所述馈电基板向所述辐射单元延伸，以向所述辐射单元馈电。
在其中一个实施例中，所述馈电基板的表形成有巴伦柱，所述辐射单元呈板状，并安装于所述巴伦柱远离所述馈电基板的一端。
在其中一个实施例中，所述馈电结构线路层沿所述巴伦柱的表面向所述辐射单元延伸。
在其中一个实施例中，所述馈电基板局部凹陷形成中空的柱状凸起，所述辐射单元为附着于所述柱状凸起外表面的金属层状结构。
在其中一个实施例中，所述馈电结构线路层沿柱状凸起的内壁向所述辐射单元延伸。
在其中一个实施例中，所述辐射单元安装于所述馈电基板背向所述腔体结构的一侧。
在其中一个实施例中，还包括校准网络线路层，所述校准网络线路层形成于所述馈电基板背向所述辐射单元的一侧，并与所述介质滤波器模块的输入端电连接。
在其中一个实施例中，还包括金属反射板，所述金属反射板设置于所述馈电基板背向所述辐射单元的一侧。
在其中一个实施例中，所述馈电基板背向所述辐射单元的一侧形成有第三限位柱，所述金属反射板上开设有第三固定孔，所述第三限位柱穿设于所述第三固定孔内。
在其中一个实施例中，所述馈电基板背向所述辐射单元的一侧形成有散布于所述馈电基板表面的筋条，且所述筋条与所述金属反射板抵接。
上述天线单元，介质滤波器模块与腔体结构配合，可在功能上相当于传统的介质滤波器，而馈电网络线路层又可通过镀膜等方式形成于馈电基板的表面。因此，相当于将传统天线中的馈电网络及介质滤波器集成于介质基材上。组装阵列天线时，无需再进行馈电网络、滤波器的焊接及螺接等操作，只需将预设数量的天线单元按照一定规则排列即可，故能有效地简化操作及结构。而且，腔体结构表面镀金属的复合结构相较于金属腔体结构的密度更小，故天线单元的质量也更轻。因此，上述天线单元能实现阵列天线的轻量化。
一种阵列天线，包括多个如上述优选实施例中任一项所述的天线单元。
附图说明
图1为本发明一个实施例中阵列天线的结构示意图；
图2为本发明另一个实施例中阵列天线的结构示意图；
图3为本发明一个实施例中天线单元的结构示意图；
图4为图3所示天线单元的正面组装示意图；
图5为图3所示天线单元的背面组装示意图；
图6为本发明第二个实施例中天线单元的结构示意图；
图7为图6所示天线振子的背面组装示意图；
图8为本发明第三个实施例中天线单元的背面组装示意图；
图9为本发明第四个实施例中天线单元的结构示意图；
图10为图9所示天线单元的背面组装示意图。
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
请参阅图1及图2，本发明提供了一种天线单元100及阵列天线10。阵列天线10可以是5G阵列天线。其中，阵列天线10包括多个天线单元100。
多个天线单元100可按照预设规则排列。譬如，图1所示的阵列天线10包括8个天线单元100，且每8个天线单元100呈2行4列分布。显然，根据阵列天线10不同的规模需求，其包含的天线单元100的数量以及天线单元100的排 列方式也可相应调整。
请一并参阅图3至图5，本发明一个实施例中的天线单元100包括介质基材110、辐射单元120、馈电网络线路层130及介质滤波器模块140。
介质基材110为一体成型的结构，其材质可以是塑料、树脂等。通常，介质基材110采用注塑的方式一体成型。介质基材110包括馈电基板112及腔体结构114，腔体结构114突出于馈电基板112的一侧。腔体结构114的外部轮廓可以呈立方体形、椭圆形等。其中，腔体结构114的表面覆设有金属层(图未示)，以构成屏蔽腔。金属层可分布于腔体结构114的内表面或外表面。
辐射单元120用于接收及向外辐射电磁波信号，一般采用的是双极化辐射单元120。辐射单元120可以是金属振子结构、PCB振子结构、塑料金属化振子以及金属层状结构等形式。辐射单元120安装于馈电基板112的一侧。其中，辐射单元120既可以与腔体结构114位于馈电基板112的同一侧，也可分别位于不同的两侧。
在本实施例中，辐射单元120安装于馈电基板112背向腔体结构114的一侧。如此设置，一方面可避免外凸的腔体结构114对辐射单元120造成遮挡，从而影响其信号收发效果。另一方面，由于辐射单元120与腔体结构114分别位于馈电基板112不同的两侧，故允许两者存在横向的重叠(即，两者在馈电基板112上的正投影至少部分重叠)，这样有利于合理利用介质基材110表面的空间，从而减小天线单元100的尺寸。
进一步的，每个馈电基板112可设置一个或者多个辐射单元120。如图3所示，该实施例中每个馈电基板112设置一个辐射单元120；而如图6及图9所示，在其他实施中，每个馈电基板112设置三个辐射单元120。
馈电网络线路层130形成于馈电基板112的表面，并用于为辐射单元120 馈电。馈电网络线路层130中可集成功分电路、滤波电路等功能电路，相当于传统的馈电网络。具体的，可通过选择性电镀、化学镀及LDS(激光直接成型技术)等表面金属成型的方式，在馈电基板112的表面形成预设电路结构的线路，以得到馈电网络线路层130，其材质可以是铜、银等良导体。
介质滤波器模块140设于腔体结构114内，且介质滤波器模块140的输出端与馈电网络线路层130电连接。由于腔体结构114与其表面的金属层配合构成屏蔽腔，从而能大幅提升隔离度。具体的，介质滤波器模块140的输出端可设置金属化过孔，并通过贯穿馈电基板112的金属柱与馈电网络线路层130电连接。电磁波信号可经介质滤波器模块140的输入端输入并由输出端输出至馈电网络线路层130中，并进一步用于对辐射单元120馈电。
请参阅图8，在一个实施例中，天线单元100还包括校准网络线路层170，校准网络线路层170形成于馈电基板112背向辐射单元120的一侧，并与介质滤波器模块140的输入端电连接。
校准网络线路层170可采用与馈电网络线路层130相同的方式成型，以馈电基板112作为基板。也就是说，介质基材110上相当于同时集成了传统的校准网络及馈电网络，故有利于简化天线单元100的结构。
需要指出的是，馈电基板112表面对应的位置还覆设有金属覆层(图未示)。该金属覆层用于构成馈电网络线路层130及校准网络线路层170等线路层的接地层。而且，该金属覆层一般与腔体结构114表面的金属层一体连接。
在本实施例中，腔体结构114的一侧开口，天线单元100还包括屏蔽盖150，且屏蔽盖150覆盖腔体结构114的开口。
具体的，屏蔽盖150可以是金属板、PCB板或表面镀金属的复合介质板结构，其覆盖腔体结构114的开口，从而形成封闭的屏蔽腔。腔体结构114的开 口有利于快速将介质滤波器模块140装入腔体结构114，从而便于组装。
如图3所示，腔体结构114的开口可与辐射单元120位于同一侧。如图7、图8及图10所示，在其他实施例中，腔体结构114的开口也可位于背向辐射单元120的一侧。这样，可避免辐射单元120对介质滤波器模块140的装入造成限位。
需要指出的是，在其他实施例中，为了将介质滤波器模块140装入，也可在腔体结构114的侧面开设尺寸较小的缺口。介质滤波器模块140可通过缺口插入腔体结构114，且插入到位后，介质滤波器模块140的端部还可起到遮挡缺口的作用，从而保证屏蔽腔的密闭性。
进一步的，请再次参阅图3及图4，在本实施例中，腔体结构114的底部形成有向腔体结构114的开口延伸的第一限位柱1141，介质滤波器模块140上具有第一固定孔141，第一限位柱1141穿设于第一固定孔141内。
第一限位柱1141在介质基材110成型时便一体成型，通过第一限位柱1141与第一固定孔141配合，介质滤波器模块140可在不依赖其他金属连接件及螺纹件，且不用进行焊接操作的前提下实现安装，从而有利于减轻天线单元100的重量。而且，更少的金属元件及焊点还有利于保证介质滤波器模块140的互调性能。
具体在本实施例中，第一限位柱1141为热熔柱。组装时，先使第一限位柱1141穿过第一固定孔141；再通过烫熔工艺将第一限位柱1141突出于介质滤波器模块140的末端融化；待其凝固后便可将介质滤波器模块140固定在腔体结构114内。
需要指出的是，第一限位柱1141与第一固定孔141并不限于仅通过热熔一种方式固定。譬如，第一限位柱1141可设置呈圆锥形，当第一限位柱1141穿 过第一固定孔141时，将逐步与第一固定孔141的孔壁实现卡持。
进一步的，在本实施例中，腔体结构114开口的边缘形成有第二限位柱1143，屏蔽盖150上开设有第二固定孔151，第二限位柱1143穿设于第二固定孔151内。
第二限位柱1143与第一限位柱1141的结构及成型方式相同。同样的，这样可以减少螺钉等金属连接件的使用，并避免进行焊接操作。因此，在减轻天线单元100重量的同时，还能进一步保证介质滤波器模块140的互调性能。
第二限位柱1143也可以是热熔柱。安装屏蔽盖150时，先使第二限位柱1143穿过第二固定孔151；再通过烫熔工艺将第二限位柱1143突出于屏蔽盖150的末端融化；待其凝固后便可将屏蔽盖150固定在腔体结构114开口的边缘。
根据以上分析可知，介质基材110相当于将传统天线中的馈电网络及介质滤波器件集成于一体。而且，介质基材110还可对辐射单元120起到支撑作用，使得辐射单元120安装方便。
整机组装时，无需再进行馈电网络、滤波器的焊接及螺接等操作。可见，组装工序显著简化，这有利于自动化生产以降低成本。而且，由于减少了螺钉等连接件的使用，故还有利于简化天线单元100的结构并减轻其重量。此外，多个部件构成一个整体，天线单元100的结构更紧凑，故还有利于减小天线单元100的体积，实现阵列天线10的小型化。
进一步的，腔体结构114表面镀金属的复合结构能同时起到较好的屏蔽效果，且天线单元100的质量可进一步减轻，从而实现阵列天线10的轻量化。
为了更进一步简化天线单元100的结构，在本实施例中，天线单元100还包括与馈电网络线路层130一体成型的馈电结构线路层160，馈电结构线路层160由馈电基板112向辐射单元120延伸，以向辐射单元120馈电。
馈电结构线路层160可采用与馈电网络线路层130相同的方式成型。由于馈电网络线路层130及馈电结构线路层160一体成型，故之间无需焊接，不存在焊点。
而且，馈电结构线路层160与传统的馈电结构，如馈电巴伦、馈电柱的功能类似，用于辐射单元120馈电。这样，无需再额外设置馈电部件。一方面，可进一步简化天线单元100的结构，另一方面也可改善其互调性能。其中，馈电结构线路层160即可直接与辐射单元120电连接馈电，也可实现不接触的耦合馈电。
如前所述，辐射单元120可采用多种不同的实现方式。如图3及图6所示，在一个实施例中，辐射单元120呈板状。而且，馈电基板112的表面形成有巴伦柱1121，辐射单元120安装于巴伦柱1121远离馈电基板112的一端。
具体的，辐射单元120可以是金属板、PCB板或贴片振子结构。巴伦柱1121起支撑作用，辐射单元120可直接焊接于巴伦柱1121的末端。
进一步的，在一个实施例中，馈电结构线路层160沿巴伦柱1121的表面向辐射单元120延伸。
巴伦柱1121作为馈电结构线路层160载体，对馈电结构线路层160起到支撑作用。因此，巴伦柱1121与馈电结构线路层160配合，相当于传统的馈电巴伦、馈电柱。具体的，馈电结构线路层160可沿巴伦柱1121延伸至与辐射单元120接触，以实现直接馈电，也可延伸至与辐射单元120间隔一定距离，实现耦合馈电。
如图9及图10所示，在另一个实施例中，馈电基板112局部凹陷形成中空的柱状凸起1123，辐射单元120为附着于柱状凸起1123外表面的金属层状结构。
柱状凸起1123作为金属层状结构的支撑，从而将辐射单元120与介质基材 110构成一体式的结构。也就是说，介质基材110上可同时集成辐射单元、馈电网络及介质滤波器，故天线单元100的结构可进一步的简化，其体积及质量可进一步减小。
具体的，中空的柱状凸起1123可以呈立方体形或圆柱形，即其横截面呈矩形或圆形。通过在馈电基板112上做局部凹陷的方式形成辐射单元120的支撑结构，可使介质基材110的结构更合理，注塑的良品率更好。
进一步的，在一个实施例中，馈电结构线路层160沿柱状凸起的内壁向辐射单元120延伸。
馈电结构线路层160可沿柱状凸起1123的内壁延伸至与辐射单元120下方，并通过金属化过孔电连接以实现直接馈电，也可延伸至与辐射单元120间隔一定距离，实现耦合馈电。
请参阅图8至图10，在一个实施例中，天线单元100还包括金属反射板180，金属反射板180设置于馈电基板112背向辐射单元120的一侧。
具体的，金属反射板180可对电磁波信号进行多次反射，从而增强辐射单元120信号收发的效率。金属反射板180的表面轮廓一般与馈电基板112的表面轮廓大致相同，且两者的表面相对设置。金属反射板180可通过螺接、焊接等方式安装于介质基材110上。
为了减少焊点并避免引入其他元件，在一个实施例中，馈电基板112背向辐射单元120的一侧形成有第三限位柱1125，金属反射板180上开设有第三固定孔181，第三限位柱1125穿设于第三固定孔181内。
第三限位柱1125可以与第一限位柱1141及第二限位柱1143的结构及类型相同。具体的，第三限位柱1125可以是热熔柱。安装金属反射板180时，先使第三限位柱1125穿过第三固定孔181；再通过烫熔工艺将第三限位柱1125突出 于金属反射板180背面的末端融化；待其凝固后便可将金属反射板180固定在馈电基板112的一侧。
对于辐射单元120与腔体结构114分别位于馈电基板112两侧的情况，金属反射板180上还开设有避位孔183。安装金属反射板180时，腔体结构114穿过避位孔183。
进一步的，在一个实施例中，馈电基板112背向辐射单元120的一侧形成有散布于馈电基板112表面的筋条1127，且筋条1127与金属反射板180抵接。
具体的，筋条1127可在馈电基板112的表面呈环状分布，也可在馈电基板112的表面直线延伸。一方面，筋条1127可起到加强馈电基板112机械强度的作用。另一方面，筋条1127可支撑金属反射板180，从而使金属反射板180与馈电基板112之间保持稳定的间隙。
需要指出的的是，在其他实施例中，金属反射板180可省略。譬如，图2所示的一个实施例中，阵列天线10包括反射板200。该反射板200与金属反射板180的材质及结构大致相同，其区别在于反射板200的表面积更大。因此，多个天线单元100可共用该反射板200。
上述天线单元100，馈电网络线路层130可通过镀膜等方式形成于馈电基板112的表面，介质滤波器模块140可通过与馈电基板112一体成型的腔体结构114实现与馈电网络线路层130、辐射单元120的集成。组装阵列天线10时，无需再进行馈电网络、滤波器的焊接及螺接等操作，只需将预设数量的天线单元100按照一定规则排列即可，故能有效地简化操作及结构。而且，能同时起到较好的屏蔽效果，且天线单元100的质量也更轻。因此，上述天线单元100能实现阵列天线的轻量化。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (15)

  1. 一种天线单元，其特征在于，包括：
    一体成型的介质基材，包括馈电基板及突出于所述馈电基板一侧的腔体结构，且所述腔体结构的表面覆设有金属层，以构成屏蔽腔；
    辐射单元，安装于所述馈电基板的一侧；
    馈电网络线路层，形成于所述馈电基板的表面，并用于为所述辐射单元馈电；及
    介质滤波器模块，设于所述腔体结构内，且所述介质滤波器模块的输出端与所述馈电网络线路层电连接。
  2. 根据权利要求1所述的天线单元，其特征在于，所述腔体结构的一侧开口，所述天线单元还包括屏蔽盖，且所述屏蔽盖覆盖所述腔体结构的开口。
  3. 根据权利要求2所述的天线单元，其特征在于，所述腔体结构的底部形成有向所述腔体结构的开口延伸的第一限位柱，所述介质滤波器模块上具有第一固定孔，所述第一限位柱穿设于所述第一固定孔内。
  4. 根据权利要求2所述的天线单元，其特征在于，所述腔体结构开口的边缘形成有第二限位柱，所述屏蔽盖上开设有第二固定孔，所述第二限位柱穿设于所述第二固定孔内。
  5. 根据权利要求1所述的天线单元，其特征在于，还包括与所述馈电网络线路层一体成型的馈电结构线路层，所述馈电结构线路层由所述馈电基板向所述辐射单元延伸，以向所述辐射单元馈电。
  6. 根据权利要求5所述的天线单元，其特征在于，所述馈电基板的表形成有巴伦柱，所述辐射单元呈板状，并安装于所述巴伦柱远离所述馈电基板的一端。
  7. 根据权利要求6所述的天线单元，其特征在于，所述馈电结构线路层沿所述巴伦柱的表面向所述辐射单元延伸。
  8. 根据权利要求5所述的天线单元，其特征在于，所述馈电基板局部凹陷形成中空的柱状凸起，所述辐射单元为附着于所述柱状凸起外表面的金属层状结构。
  9. 根据权利要求8所述的天线单元，其特征在于，所述馈电结构线路层沿柱状凸起的内壁向所述辐射单元延伸。
  10. 根据权利要求1所述的天线单元，其特征在于，所述辐射单元安装于所述馈电基板背向所述腔体结构的一侧。
  11. 根据权利要求1所述的天线单元，其特征在于，还包括校准网络线路层，所述校准网络线路层形成于所述馈电基板背向所述辐射单元的一侧，并与所述介质滤波器模块的输入端电连接。
  12. 根据权利要求1所述的天线单元，其特征在于，还包括金属反射板，所述金属反射板设置于所述馈电基板背向所述辐射单元的一侧。
  13. 根据权利要求12所述的天线单元，其特征在于，所述馈电基板背向所述辐射单元的一侧形成有第三限位柱，所述金属反射板上开设有第三固定孔，所述第三限位柱穿设于所述第三固定孔内。
  14. 根据权利要求12所述的天线振子，其特征在于，所述馈电基板背向所述辐射单元的一侧形成有散布于所述馈电基板表面的筋条，且所述筋条与所述金属反射板抵接。
  15. 一种阵列天线，其特征在于，包括多个如上述权利要求1至14任一项所述的天线单元。
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