WO2021135082A1 - 一种用于二极管封装的料架顶杆 - Google Patents

一种用于二极管封装的料架顶杆 Download PDF

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Publication number
WO2021135082A1
WO2021135082A1 PCT/CN2020/095635 CN2020095635W WO2021135082A1 WO 2021135082 A1 WO2021135082 A1 WO 2021135082A1 CN 2020095635 W CN2020095635 W CN 2020095635W WO 2021135082 A1 WO2021135082 A1 WO 2021135082A1
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WIPO (PCT)
Prior art keywords
ejector rod
lock block
diode packaging
right lock
material rack
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PCT/CN2020/095635
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English (en)
French (fr)
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顾健
顾剑辉
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太仓佳锐精密模具有限公司
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Publication of WO2021135082A1 publication Critical patent/WO2021135082A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66083—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by variation of the electric current supplied or the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched, e.g. two-terminal devices
    • H01L29/6609—Diodes

Definitions

  • the invention relates to the field of molds, in particular to a material rack ejector rod for diode packaging
  • Diode packaging is by setting a mold box on the movable mold, placing the diodes to be packaged on the material rack, and then placing the material rack on the movable mold, so that the packaging parts of hundreds of diodes on the material rack are placed in the mold box Inside, the movable mold is moved upward to close the mold with the fixed mold, and then the glue for packaging is injected into the mold box through the glue injection system. However, if the clamping is inaccurate or other reasons, the glue may leak out. After cooling, the glue will solidify and bond the material frame and the mold box together.
  • the material frame is usually made of aluminum. If the ejector rod ejects it, the material rack is easily deformed, and a material rack is worth several thousand or even tens of thousands, which will increase the equipment cost.
  • the main purpose of the present invention is to overcome the deficiencies of the prior art, and discloses a material rack ejector rod for diode packaging, including an upper ejector rod, a lower ejector rod, a spring, and a lock Pin mechanism
  • the upper mandrel is recessed along its axial direction with a sliding groove matching the lower mandrel
  • the spring is arranged in the sliding groove
  • the upper mandrel is slidably sleeved on the lower roof
  • the side wall of the upper mandrel is symmetrically provided with guide grooves along its axial direction
  • a first mounting hole is radially provided at the corresponding position of the lower mandrel
  • the lock pin mechanism is provided in the first mounting hole On the upper side, the lock pin mechanism is used to restrict and guide the upper top rod to move up and down.
  • the lock pin mechanism includes a left lock block and a right lock block, a connecting rod is arranged on one side of the left lock block to extend outward, and the right lock block is arranged at the other end of the connecting rod.
  • the side wall of the end portion of the connecting rod is vertically provided with a first card slot, and a matching first card bar is provided at a corresponding position of the right lock block.
  • the connecting rod axially penetrates a second mounting hole for mounting the pin shaft, a side wall of the inner hole of the second mounting hole is provided with a second clamping groove, and in the first A third card slot communicating with the second card slot is provided at a corresponding position of a card strip, and a second card matching the second card slot and the third card slot is axially provided on the side wall of the pin shaft Article.
  • the second card slot is arranged at a position of three o'clock or nine o'clock.
  • the pin shaft is an elastic pin.
  • left lock block and the right lock block are provided with an arc surface matching the side wall of the lower mandrel near one side of the lower mandrel.
  • the contact surface of the right lock block and the connecting rod is provided with a detachment port communicating with the second mounting hole.
  • the left lock block and the right lock block have magnetism, and the lower jack is made of a material that can be attracted by a magnet.
  • the right lock block is provided with an opening of the first clamping strip located on the upper surface.
  • the present invention elastically connects the upper ejector rod and the lower ejector rod through a spring, so that the material rack will not be damaged by strong ejection when it is ejected; the connecting rod and the right lock block adopt the card slot and the card strip to cooperate, and the installation is convenient.
  • a card slot is provided in the circumferential direction, and the connecting rod is fixedly connected with the right lock block through the elastic pin and the clamping strip, which effectively prevents the right lock block from falling off during use; in addition, the left lock block and the right lock block are provided with arcs matching the lower ejector rod
  • the shape surface makes the disassembly and assembly of the lock pin mechanism convenient.
  • Fig. 1 is a schematic structural diagram of a material rack ejector rod for diode packaging according to the present invention
  • Figure 2 is a schematic diagram of the structure of the upper ejector rod
  • Figure 3 is a schematic diagram of the structure of the lower ejector rod
  • Figure 4 is a schematic diagram of the structure of the lock pin mechanism
  • Figure 5 is a schematic diagram of the structure of the left lock block and the connecting rod
  • Figure 6 is a right side view of Figure 5;
  • Figure 7 is a schematic diagram of the structure of the right lock block
  • Fig. 8 is a schematic diagram of Fig. 7 from another perspective
  • Figure 9 is a schematic diagram of the structure of the pin shaft
  • Figure 10 is a state diagram of an intermediate step of installing the locking pin mechanism
  • a material rack ejector rod for diode packaging includes an upper ejector rod 1, a lower ejector rod 2, a spring 3, and a lock pin mechanism 4.
  • the upper ejector rod 1 is recessed along its axial direction with the lower ejector rod.
  • the chute 11 is matched with the rod, the spring 3 is arranged in the chute 11, and the upper mandrel 1 is slidably sleeved on the lower mandrel 2.
  • the side wall of the upper mandrel 1 is provided with guide grooves 12 symmetrically along its axial direction.
  • the first mounting hole 21 is set radially at the corresponding position of 2, and the lock pin mechanism 4 is set on the first mounting hole 21.
  • the lock pin mechanism 4 is used to restrict and guide the upper lift rod 1 to move up and down, and to prevent the upper lift rod 1 from moving up and down.
  • Rod 2 is separated.
  • the ejector rod is driven to move to the material frame, and then the material frame is ejected; when the material frame is bonded to the mold box, its force is greater than the elastic force of spring 3, then spring 3 is compressed, and the material frame will not be hardened.
  • the ejector causes the material rack to deform.
  • the use rate of the ejector rod is very frequent. Even when not in use, the upper ejector rod 1 always acts on the spring 3. Therefore, the spring 3 will be deformed and insufficient elasticity after a period of use. It can be seen that in order to ensure the ejection effect, the spring 3 needs to be replaced frequently.
  • the lock pin mechanism 4 includes a left lock block 41 and a right lock block 42. A connecting rod 44 is provided on one side of the left lock block 41, and the right lock block 42 is arranged at The other end of the connecting rod 44.
  • the end side wall of the connecting rod 44 is vertically and symmetrically provided with the first slot 442, and the matching first clip 421 is provided at the corresponding position of the right lock block 42 .
  • the right lock block 42 inserts the first card bar 421 into the first card slot 442 from bottom to top, and the first card bar 421 is in interference fit with the first card slot 442, thereby realizing the right lock block 42 and the connection Rod 44 connection.
  • the right lock block 42 is provided with an opening of the first clamping strip 421 located on the upper surface, so that the reaction force of the spring 3 pushing the upper push rod 1 acts on the bottom of the right lock block 42.
  • the right lock block 42 in order to further improve the reliability of the connection between the right lock block 42 and the connecting rod 44, it also includes a pin 43.
  • the connecting rod 44 axially penetrates the second mounting hole 441 of the mounting pin 43, and the inner hole of the second mounting hole 441
  • the side wall of the pin shaft is provided with a second card slot 443, and a third card slot 422 connected to the second card slot 443 is provided at the corresponding position of the first card bar 421.
  • the pin shaft 43 is axially provided with the second card slot 443 A second card strip 431 that matches the third card slot 422.
  • the right lock block 42 After the right lock block 42 is mounted on the connecting rod 43, insert the pin 43 into the second mounting hole 441, and use the second clip 431 to connect the second slot 443 and the third slot 422 together to prevent The right lock block 42 slides down when in use.
  • the second card slot is set at the three o'clock or nine o'clock position
  • the third card slot 422 is also set at the three o'clock or nine o'clock position.
  • the right lock block 42 can only move vertically, and the lock reliability of the right lock block 42 can be ensured at the above two positions.
  • the pin shaft 43 is an elastic pin; its purpose is twofold.
  • One is that the elastic pin itself has an outward expansion force to ensure that the elastic pin is in close contact with the second mounting hole 441. Closed to prevent the elastic pin from sliding out of the second mounting hole 441 from the axial movement.
  • Second, the elastic pin always pushes the second clamping strip 431 in the second mounting hole 441 radially along the second mounting hole 441, thereby ensuring that the second clamping strip 431 is always in the second slot 443 and the third slot 422 .
  • the left lock block 41 and the right lock block 42 are provided with an arc surface matching the side wall of the lower mandrel 2 on a side surface close to the lower mandrel 2.
  • the setting of the curved surface can facilitate the disassembly of the lock pin mechanism 4; specifically, when installing the ejector rod, first install the spring 3 in the chute 11, and cover the upper ejector rod 1 on the lower ejector rod 2.
  • the guide groove 12 is aligned with the first mounting hole 21, pressing the upper top rod 1 to compress the spring 3, and then inserting the connecting rod 44 into the first mounting hole 21 until the left lock block 41 is attached to the lower top rod 2, Place the right lock block 42 at the bottom of the guide groove 12, as shown in Fig. 10, release the upper ejector rod 1, and the upper ejector rod 1 moves upward under the force of the spring 3, that is, the right lock block 42 moves toward the connecting rod 44, following the trend Insert the first card strip 421 into the first card slot 442, and then insert the pin 43 to connect the second card slot 442 and the third card slot 422.
  • the removal process is the reverse step of the installation process.
  • the left lock block 41 and the right lock block 42 are magnetic
  • the lower jack 2 is made of a material that can be attracted by a magnet, such as iron, cobalt, and nickel; iron materials are usually used. Utilizing the attractive force of the magnet, the left lock block 41 and the right lock block 42 are closely attached to the lower top rod 2, thereby ensuring that the first clamping strip 421 is aligned with the first clamping slot 442.
  • the contact surface between the right lock block 42 and the connecting rod 44 is provided with a detachment port 423 communicating with the second mounting hole 441.
  • the dismounting port 423 cannot allow the pin shaft 43 to pass through, which is equivalent to the reference plane for installing the pin shaft 43. The worker only needs to press one end of the pin shaft 43 against the dismounting port 423 to complete the installation. At the same time, during disassembly, the pin 43 is pushed out from the other end through the disassembly opening 423, which facilitates the disassembly of the pin 43.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Ceramic Engineering (AREA)
  • Jet Pumps And Other Pumps (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

一种用于二极管封装的料架顶杆，包括上顶杆（1）、下顶杆（2）、弹簧（3）和锁销机构（4），上顶杆（1）沿其轴向凹设于下顶杆（2）匹配的滑槽（11），弹簧（3）设置在滑槽（11）内，并且上顶杆（1）滑动套设在下顶杆（2）上，上顶杆（1）的侧壁沿其轴向对称设置引导槽（12），在下顶杆（2）的对应位置径向设置第一安装孔（21），锁销机构（4）设置在第一安装孔（21）上，利用锁销机构（4）限制和引导上顶杆（1）上下移动。通过弹簧（3）将上顶杆（1）与下顶杆（2）弹性连接，使得料架在顶出时不会受到强硬顶出造成料架损坏；连杆（44）与右锁块（42）采用卡槽和卡条配合，安装方便，并且周向设置卡槽，通过弹性销配合卡条将连杆（44）与右锁块（42）固定连接，有效避免右锁块（42）在使用时脱落；另外，左锁块（41）和右锁块（42）设置与下顶杆（2）匹配的弧形面，使得锁销机构（4）拆装便捷。

Description

一种用于二极管封装的料架顶杆 技术领域
本发明涉及模具领域，特别涉及一种用于二极管封装的料架顶杆
背景技术
二极管封装是通过在动模上设置模盒，将需要封装的二极管放置在料架上，而后将料架放置在动模上，使得料架上成百上千个二极管的封装部位置于模盒内，通过动模向上移动与定模合模，而后通过注胶系统将封装用的胶液注入模盒内。但是如果合模不精确或者其他原因，可能出现胶液外漏的现象，冷却后胶液凝固，将料架和模盒黏连在一起，而料架通常为铝制材料制成，而此时如果顶杆将其顶出，极易出现料架变形，而一个料架价值几千甚至几万不等，这样会增加设备成本。
发明内容
针对以上现有技术存在的缺陷，本发明的主要目的在于克服现有技术的不足之处，公开了一种用于二极管封装的料架顶杆，包括上顶杆、下顶杆、弹簧和锁销机构，所述上顶杆沿其轴向凹设与所述下顶杆匹配的滑槽，所述弹簧设置在所述滑槽内，并且所述上顶杆滑动套设在所述下顶杆上，所述上顶杆的侧壁沿其轴向对称设置引导槽，在所述下顶杆的对应位置径向设置第一安装孔，所述锁销机构设置在所述第一安装孔上，利用所述锁销机构限制和引导所述上顶杆上下移动。
进一步地，所述锁销机构包括左锁块和右锁块，所述左锁块一侧边向外延伸设置连杆，所述右锁块设置在所述连杆的另一端。
进一步地，所述连杆的端部侧壁竖直设置第一卡槽，并且在所述右锁 块的对应位置设置匹配的第一卡条。
进一步地，还包括销轴，所述连杆轴向贯穿设置安装所述销轴的第二安装孔，所述第二安装孔的内孔的侧壁设置第二卡槽，并且在所述第一卡条的对应位置设置与所述第二卡槽连通的第三卡槽，所述销轴侧壁上轴向设置与所述第二卡槽和所述第三卡槽匹配的第二卡条。
进一步地，所述第二卡槽设置在三点钟或者九点钟位置处。
进一步地，所述销轴为弹性销。
进一步地，所述左锁块和所述右锁块靠近所述下顶杆一侧面设置与下顶杆侧壁匹配的弧面。
进一步地，所述右锁块与所述连杆接触面设置与所述第二安装孔连通的拆卸口。
进一步地，所述左锁块和所述右锁块具有磁性，所述下顶杆由能够被磁铁吸引的材料制成。
进一步地，所述右锁块设置第一卡条的开口位于上表面。
本发明取得的有益效果：
本发明通过弹簧将上顶杆与下顶杆弹性连接，使得料架在顶出时不会受到强硬顶出造成料架损坏；连杆与右锁块采用卡槽和卡条配合，安装方便，并且周向设置卡槽，通过弹性销配合卡条将连杆与右锁块固定连接，有效避免右锁块在使用时脱落；另外，左锁块和右锁块设置与下顶杆匹配的弧形面，使得锁销机构拆装便捷。
附图说明
图1为本发明的一种用于二极管封装的料架顶杆的结构示意图；
图2为上顶杆的结构示意图；
图3为下顶杆的结构示意图；
图4为锁销机构的结构示意图；
图5为左锁块与连杆的结构示意图；
图6为图5的右视图；
图7为右锁块的结构示意图；
图8为图7另一视角示意图；
图9为销轴的结构示意图；
图10为安装锁销机构的中间步骤状态图；
附图标记如下：
1、上顶杆，2、下顶杆，3、弹簧，4、锁销机构，11、滑槽，12、引导槽，21、第一安装孔，41、左锁块，42、右锁块，43、销轴，44、连杆，421、第一卡条，422、第三卡槽，423、拆卸口，431、第二卡条，441、第二安装孔，442、第一卡槽，443、第二卡槽。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，下面结合附图及实施例对本发明作进一步详细说明。应当理解，此处所描述的具体实施例仅用以解释本发明，并不用于限定本发明。
一种用于二极管封装的料架顶杆，如图1所示，包括上顶杆1、下顶杆2、弹簧3和锁销机构4，上顶杆1沿其轴向凹设与下顶杆匹配的滑槽11，弹簧3设置在滑槽11内，并且上顶杆1滑动套设在下顶杆2上，上顶杆1的侧壁沿其轴向对称设置引导槽12，在下顶杆2的对应位置径向设置第一安装孔21，锁销机构4设置在第一安装孔21上，利用锁销机构4限制和引导上顶杆1上下移动，并防止上顶杆1与下顶杆2分离。当模具开模后，驱动顶杆向料架移动，进而将料架顶出；当料架与模盒黏连后，其力大于弹簧3的弹力，则弹簧3压缩，料架不会被硬顶顶出，造成料架变形。
在上述实施例中，顶杆的使用率非常频繁，即使在不使用时，上顶杆1始终作用在弹簧3上，因此，弹簧3在使用一段时间后会出现变形、弹力不足等情况。可见，为了保证顶出效果，弹簧3需要经常更换。在一优选 实施例中，如图1-9所示，锁销机构4包括左锁块41和右锁块42左锁块41一侧边向外延伸设置连杆44，右锁块42设置在连杆44的另一端。
在一实施例中，如图1-9所示，连杆44的端部侧壁竖直且对称设置第一卡槽442，并且在右锁块42的对应位置设置匹配的第一卡条421。当使用时，右锁块42自下而上将第一卡条421插入第一卡槽442内，通过第一卡条421与第一卡槽442过盈配合，进而实现右锁块42与连杆44的连接。优选的，右锁块42设置第一卡条421的开口位于上表面，使得弹簧3推动上顶杆1上推力的反作用力作用在右锁块42的底部。
另外，为了进一步提高右锁块42与连杆44连接的可靠性，还包括销轴43，连杆44轴向贯穿设置安装销轴43的第二安装孔441，第二安装孔441的内孔的侧壁设置第二卡槽443，并且在第一卡条421的对应位置设置与第二卡槽443连通的第三卡槽422，销轴43侧壁上轴向设置与第二卡槽443和第三卡槽422匹配的第二卡条431。当右锁块42安装在连杆43上后，将销轴43插入第二安装孔441内，并且利用第二卡条431将第二卡槽443和第三卡槽422连接在一起，以防止右锁块42在使用时向下滑落。优选的，第二卡槽设置在三点钟或者九点钟位置处，对应的，第三卡槽422也设置在三点钟或者九点钟位置处。在使用时，右锁块42只能竖直移动，而在上述两位置处能够保证右锁块42锁定的牢靠性。
在上述实施例中，如图1-9所示，销轴43为弹性销；其目的有两个，其一，弹性销自身具有向外扩张力，保证弹性销与第二安装孔441紧密贴合，防止弹性销轴向移动从第二安装孔441内滑出。其二，弹性销在第二安装孔441内始终推动第二卡条431沿第二安装孔441径向推动，进而保证第二卡条431始终处于第二卡槽443和第三卡槽422内。
在一实施例中，如图1-10所示，左锁块41和右锁块42靠近下顶杆2的一侧面设置与下顶杆2侧壁匹配的弧面。而该弧形面的设置，能够方便锁销机构4的拆卸；具体的，在对顶杆安装时，首先将弹簧3安装在滑槽11内，并且将上顶杆1套在下顶杆2上，引导槽12与第一安装孔21对其，按压上顶杆1，使得弹簧3压缩，而后将连杆44插入第一安装孔21内，直 至左锁块41与下顶杆2贴合，将右锁块42放置在引导槽12底部，如图10所示位置，释放上顶杆1，上顶杆1受到弹簧3的作用力向上移动，即右锁块42向连杆44移动，顺势将第一卡条421插入第一卡槽442内，而后插入销轴43将第二卡槽442和第三卡槽422连接。拆卸过程为安装过程的反向步骤。优选的，左锁块41和右锁块42具有磁性，下顶杆2由能够被磁铁吸引的材料制成，例如铁、钴、镍；通常采用铁质材料。利用磁铁的吸引力，使得左锁块41和右锁块42紧密贴合在下顶杆2上，进而保证第一卡条421与第一卡槽442对其。
在一实施例中，如图1-9所示，右锁块42与连杆44接触面设置与第二安装孔441连通的拆卸口423。拆卸口423无法使销轴43通过，相当于销轴43安装的基准面，工作人员只需要将销轴43一端顶住拆卸口423即表示完成安装。同时，在拆卸时，通过拆卸口423推动销轴43从另一端推出，方便销轴43的拆卸。
以上仅为本发明的较佳实施例，并非用来限定本发明的实施范围；如果不脱离本发明的精神和范围，对本发明进行修改或者等同替换，均应涵盖在本发明权利要求的保护范围当中。

Claims (10)

  1. 一种用于二极管封装的料架顶杆，其特征在于，包括上顶杆、下顶杆、弹簧和锁销机构，所述上顶杆沿其轴向凹设与所述下顶杆匹配的滑槽，所述弹簧设置在所述滑槽内，并且所述上顶杆滑动套设在所述下顶杆上，所述上顶杆的侧壁沿其轴向对称设置引导槽，在所述下顶杆的对应位置径向设置第一安装孔，所述锁销机构设置在所述第一安装孔上，利用所述锁销机构限制和引导所述上顶杆上下移动。
  2. 根据权利要求1所述的一种用于二极管封装的料架顶杆，其特征在于，所述锁销机构包括左锁块和右锁块，所述左锁块一侧边向外延伸设置连杆，所述右锁块设置在所述连杆的另一端。
  3. 根据权利要求2所述的一种用于二极管封装的料架顶杆，其特征在于，所述连杆的端部侧壁竖直设置第一卡槽，并且在所述右锁块的对应位置设置匹配的第一卡条。
  4. 根据权利要求3所述的一种用于二极管封装的料架顶杆，其特征在于，还包括销轴，所述连杆轴向贯穿设置安装所述销轴的第二安装孔，所述第二安装孔的内孔的侧壁设置第二卡槽，并且在所述第一卡条的对应位置设置与所述第二卡槽连通的第三卡槽，所述销轴侧壁上轴向设置与所述第二卡槽和所述第三卡槽匹配的第二卡条。
  5. 据权利要求4所述的一种用于二极管封装的料架顶杆，其特征在于，所述第二卡槽设置在三点钟或者九点钟位置处。
  6. 据权利要求2所述的一种用于二极管封装的料架顶杆，其特征在于，所述销轴为弹性销。
  7. 据权利要求2所述的一种用于二极管封装的料架顶杆，其特征在于，所述左锁块和所述右锁块靠近所述下顶杆一侧面设置与下顶杆侧壁匹配的弧面。
  8. 据权利要求2所述的一种用于二极管封装的料架顶杆，其特征在于，所述右锁块与所述连杆接触面设置与所述第二安装孔连通的拆卸口。
  9. 据权利要求7所述的一种用于二极管封装的料架顶杆，其特征在于，所述左锁块和所述右锁块具有磁性，所述下顶杆由能够被磁铁吸引的材料制成。
  10. 据权利要求3所述的一种用于二极管封装的料架顶杆，其特征在于，所述右锁块设置第一卡条的开口位于上表面。
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113356919A (zh) * 2021-07-27 2021-09-07 中南大学 一种组合式隧道塌方救援装置及救援方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110911337A (zh) * 2019-12-29 2020-03-24 太仓佳锐精密模具有限公司 一种用于二极管封装的料架顶杆

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2353052Y (zh) * 1998-06-17 1999-12-08 李春生 Ic封装模具的模座驱动机构
CN2400900Y (zh) * 1999-11-02 2000-10-11 苏树旺 半导体的模具
US20130256721A1 (en) * 2012-04-01 2013-10-03 Shenzhen China Star Optoelectronics Technology Co. Ltd. LED Light with Electrostatic Protection and Backlight Module Using the LED Light
CN104416832A (zh) * 2013-08-29 2015-03-18 上海雷博司电气股份有限公司 用于包胶注射工艺制造真空灭弧室包封的模具
CN208428605U (zh) * 2018-06-26 2019-01-25 曼盛包装（上海）有限公司 一种用于注塑模具上的定模顶出机构
CN110911337A (zh) * 2019-12-29 2020-03-24 太仓佳锐精密模具有限公司 一种用于二极管封装的料架顶杆

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2353052Y (zh) * 1998-06-17 1999-12-08 李春生 Ic封装模具的模座驱动机构
CN2400900Y (zh) * 1999-11-02 2000-10-11 苏树旺 半导体的模具
US20130256721A1 (en) * 2012-04-01 2013-10-03 Shenzhen China Star Optoelectronics Technology Co. Ltd. LED Light with Electrostatic Protection and Backlight Module Using the LED Light
CN104416832A (zh) * 2013-08-29 2015-03-18 上海雷博司电气股份有限公司 用于包胶注射工艺制造真空灭弧室包封的模具
CN208428605U (zh) * 2018-06-26 2019-01-25 曼盛包装（上海）有限公司 一种用于注塑模具上的定模顶出机构
CN110911337A (zh) * 2019-12-29 2020-03-24 太仓佳锐精密模具有限公司 一种用于二极管封装的料架顶杆

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113356919A (zh) * 2021-07-27 2021-09-07 中南大学 一种组合式隧道塌方救援装置及救援方法
CN113356919B (zh) * 2021-07-27 2024-04-12 中南大学 一种组合式隧道塌方救援装置及救援方法

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