WO2021134877A1 - 一种大功率 led 照明装置 - Google Patents

一种大功率 led 照明装置 Download PDF

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Publication number
WO2021134877A1
WO2021134877A1 PCT/CN2020/076994 CN2020076994W WO2021134877A1 WO 2021134877 A1 WO2021134877 A1 WO 2021134877A1 CN 2020076994 W CN2020076994 W CN 2020076994W WO 2021134877 A1 WO2021134877 A1 WO 2021134877A1
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WO
WIPO (PCT)
Prior art keywords
boss
lighting device
bottom plate
lens
led lighting
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PCT/CN2020/076994
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English (en)
French (fr)
Inventor
陈国平
李秀斌
Original Assignee
广州光联电子科技有限公司
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Publication of WO2021134877A1 publication Critical patent/WO2021134877A1/zh

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the utility model relates to the field of stage lights, and more specifically, to a high-power LED lighting device.
  • FIG. 1 shows the high-power LED light sources used in the field of stage lights in the prior art.
  • the LED chip array on the copper substrate 1 radiates white light, which is collimated into nearly parallel light by the collimating lens group mounted on the lens holder 2 corresponding to the LED chip, and is focused on a specific focal position by the condenser A specific uniform white light illumination area is formed, wherein the collimating lens is composed of two lenses, and the second lens is spliced to form a lens array 3.
  • the client will often add CMY glass sheets between the LED light source and the focal position to change the color of the light spot to achieve the color diversity of the lamps.
  • the heat of high-power light sources mainly comes from two aspects. One is the energy radiated by the LED chip, and part of the heat is taken away by the copper substrate. Part of the heat will be transferred to the lens holder, causing the temperature of the lens holder and the adjacent lens array to rise; second, the energy emitted by CMY is concentrated near the center of the optical axis after passing through the condenser, mainly on the surface of the light source and the collimation system. In addition, the lens holder will re-emit energy to the lens array. The temperature of the lens array, lens holder and the central area of the copper substrate is too high, causing the center of the lens array to burst, and the LED junction temperature in the central area of the copper substrate is too high, which reduces the life of the LED.
  • the utility model aims to overcome at least one of the above-mentioned drawbacks of the prior art, and provides a high-power LED lighting device for solving the problems of the lens array center burst and the LED junction temperature in the center area is too high.
  • the technical scheme adopted by the utility model is a high-power LED lighting device, which includes a substrate with LED chips, a lens holder and a lens array that are sequentially installed, and the lens holder is provided with collimators corresponding to the LED chips one-to-one.
  • a lens, the center of the lens holder is a hollow structure, a bottom plate corresponding to the position of the hollow structure is provided on the substrate, the bottom plate is provided with a boss, and an LED chip mounting cavity is formed between the boss and the bottom plate, and A collimating lens corresponding to the LED chip is arranged on the boss.
  • the utility model sets the center of the original lens holder as a hollow structure to form a new lens holder.
  • the base plate corresponding to the hollow structure area is equipped with a bottom plate, and the bottom plate is provided with a convex platform.
  • the collimating lens in the structure area is no longer fixed on the lens holder, but bears on the boss.
  • the cavity formed between the boss and the bottom plate is used to install the LED chip.
  • the function of the boss is equivalent to the lens holder.
  • the collimating lens is installed on the boss, so that the collimating lens and the LED form a one-to-one correspondence and keep a certain distance from the LED.
  • the utility model avoids the deformation of the lens holder due to excessively high temperature in the central area, and at the same time prevents the heat radiation from the central area of the lens holder from being transferred to the central area of the lens array, and also prevents the light from being reflected twice. It acts on the central area of the lens array to solve the problem of the central area and the periphery of the lens array exploding due to uneven heating; the bottom plate is set on the position of the substrate corresponding to the hollow structure to increase the heat dissipation surface, which is conducive to heat conduction and reduces the overall board temperature , Solve the problem of excessively high junction temperature of the LED in the center area, and improve the service life of the LED.
  • the boss includes a plurality of sub bosses, and there are gaps between the sub bosses.
  • the number of the sub-boss is two, and the sub-boss has an L-shaped structure.
  • the boss of the present invention is composed of two sub bosses, and the two sub bosses with an L-shaped structure have a symmetrical structure.
  • the inner surface of the boss is arc-shaped, and/or the bend on the outer surface of the boss is arc-shaped.
  • the arc-shaped design of the inner surface of the boss is to meet the circular bottom surface design of the collimating lens, and to better fit the bottom surface of the collimating lens, facilitating the stable installation of the collimating lens.
  • top of the boss is stepped and includes a first stepped surface arranged inside and a second stepped surface arranged outside.
  • the top of the boss is stepped.
  • the upper surface includes a first step surface and a second step surface.
  • the first step surface is close to the inside of the boss, the second step surface is close to the outside of the boss, and the height of the first step surface is smaller than the height of the second step surface.
  • the utility model adopts a convex platform with a stepped top end, so that the small lens is installed stably or the position of the small lens does not move during the installation process.
  • collimating lens mounted on the boss and the collimating lens on the lens holder have the same height.
  • the height of the steps designed for the boss on the base plate should make the collimating lens installed on the boss the same height as the collimating lens on the lens holder, so as to prevent the optical efficiency from being affected.
  • boss is a detachable installation structure.
  • the collimating lens corresponding to the LED chip is provided on the boss and has a detachable installation structure.
  • the base plate is a detachable installation structure as a whole, in which the installation structure of the bottom plate, the boss and the collimating lens installed on the boss in the central area is a detachable installation structure.
  • the collimating lens installation structure is unavoidably damaged, it is convenient to replace the installation structure in the central area and save costs.
  • a lead hole is provided on the edge of the bottom plate, and the lead hole is used to connect the LED chip circuit on the bottom plate and the overall circuit.
  • the edge of the bottom plate is provided with a lead hole, and the bottom plate and the substrate are installed together by welding or other methods.
  • the lead hole on the edge of the bottom plate is used for gold wire connection to make the LED chip circuit on the bottom plate communicate with the overall circuit.
  • the hollow structure is a quadrangular structure, and the bottom plate is made of ceramic material.
  • the middle hollow structure is rationally set as a quadrilateral structure.
  • the bottom plate of the utility model is made of ceramic material, which has good heat dissipation effect and helps to improve the service life of the LED chip in the central area.
  • the utility model avoids the deformation of the lens holder due to the excessively high temperature in the central area, and at the same time prevents the heat radiation from the central area of the lens holder from being transferred to the central area of the lens array, and also avoids light passing through After the second reflection, it acts on the central area of the lens array to solve the problem that the central area and the periphery of the lens array burst due to uneven heating;
  • the utility model is provided with a bottom plate on the position of the substrate corresponding to the hollow structure, which increases the heat dissipation surface, which is beneficial to conduct heat, reduces the overall board temperature, solves the problem of excessively high LED junction temperature in the center area, and improves the service life of the LED.
  • This utility model is an improvement to the existing structure, does not involve optical elements, optical efficiency is not affected, the cost of modification is low, and the efficiency of mass production is not affected.
  • Figure 1 is a structural diagram of the prior art.
  • Figure 2 is a structural diagram of the utility model.
  • Figure 3 is a structural diagram of the lens holder of the present invention.
  • Figure 4 is a diagram of the overall installation structure of the collimator lens installed on the boss.
  • Figure 5 is the installation structure diagram of the bottom plate and the boss.
  • a high-power LED lighting device includes a substrate 1, a lens holder 2 and a lens array 3 mounted in sequence with LED chips.
  • the lens holder 2 is provided with a one-to-one correspondence with the LED chips.
  • Straight lens the center of the lens holder is a hollow structure 4, a bottom plate 5 corresponding to the position of the hollow structure 4 is provided on the substrate, the bottom plate is provided with a boss, and the bottom plate can be connected to the substrate by welding or other means together.
  • the role of the substrate with the LED chip is to dissipate heat.
  • the material of the substrate can be copper substrate, aluminum substrate or other materials with good thermal conductivity; the role of the bottom plate is also the role of heat dissipation. The material can also be a material with better heat dissipation effect.
  • the bottom plate is made of ceramic material.
  • the hollow structure in this embodiment is a quadrilateral structure 4.
  • Figure 4 is a schematic diagram of the installation of the collimating lens on the bottom plate.
  • the boss 6 is arranged on the bottom plate 5.
  • the LED chip mounting cavity is formed between the bosses 6 and the boss 6 is installed with One-to-one correspondence of the collimating lens to the LED chip.
  • FIG. 5 is a schematic diagram of the structure of the bottom plate 5 and the boss 6.
  • the boss includes two sub bosses, the sub bosses have an L-shaped structure, and there are gaps between the sub bosses.
  • the inner surface of the boss 6 is arc-shaped, and/or the bend on the outer surface of the boss is arc-shaped.
  • the top end of the boss 6 in this embodiment is stepped, and includes a first stepped surface arranged on the inner side and a second stepped surface arranged on the outer side.
  • the collimating lens mounted on the boss 6 and the collimating lens on the lens holder 2 have the same height.
  • the boss 6 in this embodiment is a detachable installation structure, and the collimating lens corresponding to the LED chip is provided on the boss 6 as a detachable installation structure.
  • the entire substrate is a detachable installation structure, and the bottom plate, the boss, and the collimating lens installed on the boss in the central area are all detachably installed to facilitate damage to the central area. Replacement afterwards.
  • a lead hole 7 is provided on the edge of the bottom plate in this embodiment, and the lead hole 7 is used to connect the LED chip circuit on the bottom plate and the overall circuit.

Abstract

一种大功率LED照明装置，用于解决透镜阵列中心炸裂以及中心区域LED结温过高的问题，包括依次安装的带有LED芯片的基板（1）、透镜支架（2）和透镜阵列（3），透镜支架（2）上设有与LED芯片一一对应的准直透镜，透镜支架（2）的中心为镂空结构（4），基板（1）上设有与镂空结构（4）位置相对应的底板（5），底板（5）设置有凸台（6），凸台（6）与底板（5）之间形成LED芯片的安装内腔，且凸台（6）上设有与LED芯片对应的准直透镜。

Description

一种大功率LED照明装置 技术领域
本实用新型涉及舞台灯领域，更具体地，涉及一种大功率LED照明装置。
 背景技术
随着半导体照明技术的发展，LED芯片发光密度越来越高，使得大功率LED光源的发展也越来越快，如图1所示为现有技术中应用于舞台灯领域的大功率LED光源，铜基板1上的LED芯片阵列辐射出白光，经安装在透镜支架2上的与LED芯片一一对应的准直透镜组准直成近平行光出射，并经聚光镜聚焦于一特定的焦点位置形成特定的均匀白光照明区域，其中，准直透镜由两片透镜组成，第二片透镜拼接形成透镜阵列3。为了实现灯具的颜色多样性，客户端往往会在LED光源到焦点位置中间增加CMY玻璃片来改变出光斑的颜色从而实现灯具的颜色多样性。
目前大功率光源的应用，使得光源内部产生较大热量，因此解决散热的问题迫在眉睫，大功率光源的热量主要来源于两个方面，一是LED芯片辐射的能量，部分热量被铜基板带走，部分热量会传递到透镜支架上，导致透镜支架和相邻的透镜阵列温度上升；二是应用CMY发射回来的能量经过聚光镜后集中在光轴中心附近，主要集中在光源表面及准直系统上，且透镜支架会二次发射能量到透镜阵列上，透镜阵列、透镜支架及铜基板中心区域温度过高，导致透镜阵列中心炸裂，铜基板中心区域的LED结温过高，降低LED寿命。
 技术问题
本实用新型旨在克服上述现有技术的至少一种缺陷，提供一种大功率LED照明装置，用于解决透镜阵列中心炸裂以及中心区域LED结温过高的问题。
 技术解决方案
本实用新型采取的技术方案是，一种大功率LED照明装置，包括依次安装的带有LED芯片的基板、透镜支架和透镜阵列，所述透镜支架上设有与LED芯片一一对应的准直透镜，所述透镜支架的中心为镂空结构，基板上设有与所述镂空结构位置相对应的底板，所述底板设置有凸台，凸台与底板之间形成LED芯片的安装内腔，且凸台上设有与LED芯片对应的准直透镜。
本实用新型在现有技术的基础上，将原有的透镜支架中心设置为镂空结构，形成一个新的透镜支架，与镂空结构区域对应的基板上安装有底板，底板上设有凸台，镂空结构区域内的准直透镜不再固定在透镜支架上，而是承靠在凸台上，凸台与底板之间形成的空腔用于安装LED芯片，此时凸台的作用相当于透镜支架，准直透镜安装于凸台上，使准直透镜与LED形成一一对应的关系并且与LED保持一定的距离。本实用新型通过将透镜支架的中心设置为镂空结构，避免因中心区域温度过高出现透镜支架形变，同时避免透镜支架中心区域热辐射传递到透镜阵列中心区域，也避免了光线经二次反射后作用到透镜阵列中心区域上，解决透镜阵列中心区域与周边因受热不均匀而炸裂的问题；在镂空结构对应的基板位置上设置底板，增加了散热面，有利于传导热量，使得整体板温下降，解决中心区域LED结温过高的问题，提高LED的使用寿命。
进一步地，所述凸台包括若干个子凸台，且子凸台之间具有缺口。
子凸台之间具有缺口，便于LED芯片空腔通风，提高LED的散热效率。
进一步地，所述子凸台数量为两个，且子凸台呈L型结构。
本实用新型的凸台由两个子凸台构成，且两个呈L型结构的子凸台呈对称结构。
进一步地，所述凸台内侧面为圆弧状，和/或所述凸台外侧面折弯处为圆弧状。
凸台内侧面的圆弧状的设计是为了满足准直透镜的圆形底面设计，更好地与准直透镜底面贴合，便于准直透镜的安装稳固。
进一步地，所述凸台顶端呈阶梯状，包括靠内设置的第一阶梯面及靠外设置的第二阶梯面。
凸台顶端呈阶梯状，上表面包括第一阶梯面和第二阶梯面，第一阶梯面靠近凸台内侧，第二阶梯面靠近凸台外侧，且第一阶梯面高度小于第二阶梯面高度。本实用新型采用呈阶梯状顶端的凸台，使得小透镜安装稳固或者在安装过程中，小透镜位置不会发生移动。
进一步地，所述安装在凸台上的准直透镜与所述透镜支架上的准直透镜高度一致。
底板上的凸台设计的台阶高度要使得安装在凸台上的准直透镜与透镜支架上的准直透镜的高度一致，避免光学效率受到影响。
进一步地，所述凸台为可拆卸安装结构。
进一步地，所述凸台上设有与LED芯片对应的准直透镜为可拆卸安装结构。
本实用新型中，基板整体为可拆卸安装结构，其中，中心区域的底板、凸台和安装在凸台上的准直透镜的安装结构为可拆卸安装结构，当中心区域的底板、凸台和准直透镜安装结构发生不可避免的损坏时，便于更替中心区域的安装结构，节省成本。
进一步地，所述底板边缘设有引线孔，所述引线孔用于连通底板上的LED芯片线路与整体线路。
本实用新型中的底板边缘设置有引线孔，底板与基板通过焊接或者其他方式安装在一起，底板边缘上的引线孔，用于金线连接使得底板上的LED芯片线路与整体线路连通。
进一步地，所述镂空结构为四边形结构，所述底板为陶瓷材质。
根据实际工艺和准直透镜的排列规律，合理化地将中间镂空结构设置为四边形结构，本实用新型中底板采用陶瓷材质，散热效果良好，有助于提高中心区域LED芯片的使用寿命。
 有益效果
与现有技术相比，本实用新型的有益效果为：
1.本实用新型通过将透镜支架中心区域设置为镂空结构，避免了因中心区域温度过高出现透镜支架形变，同时避免透镜支架中心区域热辐射传递到透镜阵列中心区域，也避免了光线经二次反射后作用到透镜阵列中心区域上，解决透镜阵列中心区域与周边因受热不均匀而炸裂的问题；
2.本实用新型在镂空结构对应的基板位置上设置底板，增加了散热面，有利于传导热量，使得整体板温下降，解决中心区域LED结温过高的问题，提高LED的使用寿命。
3.本实用新型是对现有结构的改进，不涉及光学元件，光学效率不受影响，改动成本低，不影响量产的效率。
 附图说明
图1为现有技术的结构图。
图2为本实用新型的结构图。
图3为本实用新型透镜支架结构图。
图4为准直透镜安装在凸台的整体安装结构图。
图5为底板与凸台的安装结构图。
 本发明的最佳实施方式
如图2所示，一种大功率LED照明装置，包括依次安装的带有LED芯片的基板1、透镜支架2和透镜阵列3，所述透镜支架2上设有与LED芯片一一对应的准直透镜，所述透镜支架的中心为镂空结构4，基板上设有与所述镂空结构4位置相对应的底板5，所述底板设置有凸台，底板可通过焊接或者其他方式与基板连接在一起。
对本实施例来说，更具体地，带有LED芯片的基板的作用是散热，因此基板的材料可选用铜基板、铝基板或者其他导热性能好的材料；底板的作用同样是散热作用，底板的材质也可采用散热效果较好的材质，在本实施例中底板采用陶瓷材质。
如图3所示，本实施例中所述镂空结构为四边形结构4。
如图4所示，图4为准直透镜安装在底板上的安装示意图，凸台6设置于底板5上，凸台6之间形成LED芯片的安装内腔，且凸台6上安装有与LED芯片一一对应的准直透镜。
如图5所示，图5为底板5和凸台6的结构示意图，本实施例中凸台包括两个个子凸台，子凸台呈L型结构，且子凸台之间具有缺口。
优选地，本实施例中所述凸台6内侧面为圆弧状，和/或所述凸台外侧面折弯处为圆弧状。
优选地，本实施例中所述凸台6顶端呈阶梯状，包括靠内设置的第一阶梯面及靠外设置的第二阶梯面。
优选地，本实施例中所述安装在凸台6上的准直透镜与所述透镜支架2上的准直透镜高度一致。
优选地，本实施例中凸台6为可拆卸安装结构，所述凸台6上设有与LED芯片对应的准直透镜为可拆卸安装结构。
对本实施例来说，更具体地，基板的整体为可拆卸的安装结构，中心区域的底板、凸台、安装在凸台上的准直透镜的安装方式均为可拆卸安装，便于中心区域损坏后进行更替。
优选地，本实施例中所述底板边缘设有引线孔7，所述引线孔7用于连通底板上的LED芯片线路与整体线路。

Claims (10)

  1. 一种大功率LED照明装置，包括依次安装的带有LED芯片的基板、透镜支架和透镜阵列，所述透镜支架上设有与LED芯片一一对应的准直透镜，其特征在于，所述透镜支架的中心为镂空结构，基板上设有与所述镂空结构位置相对应的底板，所述底板设置有凸台，凸台与底板之间形成LED芯片的安装内腔，且凸台上设有与LED芯片对应的准直透镜。
  2. 根据权利要求1所述的一种大功率LED照明装置，其特征在于，所述凸台包括若干个子凸台，且子凸台之间具有缺口。
  3. 根据权利要求2所述的一种大功率LED照明装置，其特征在于，所述子凸台数量为两个，且子凸台呈L型结构。
  4. 根据权利要求1所述的一种大功率LED照明装置，其特征在于，所述凸台内侧面为圆弧状，和/或所述凸台外侧面折弯处为圆弧状。
  5. 根据权利要求1至4任一项所述的一种大功率LED照明装置，其特征在于，所述凸台顶端呈阶梯状，包括靠内设置的第一阶梯面及靠外设置的第二阶梯面。
  6. 根据权利要求1所述的一种大功率LED照明装置，其特征在于，所述安装在凸台上的准直透镜与所述透镜支架上的准直透镜高度一致。
  7. 根据权利要求1所述的一种大功率LED照明装置，其特征在于，所述凸台为可拆卸安装结构。
  8. 根据权利要求1所述的一种大功率LED照明装置，其特征在于，所述凸台上设有的与LED芯片对应准直透镜为可拆卸安装结构。
  9. 根据权利要求1所述的一种大功率LED照明装置，其特征在于，所述底板边缘设有引线孔，所述引线孔用于连通底板上的LED芯片线路与整体线路。
  10. 根据权利要求1所述的一种大功率LED照明装置，其特征在于，所述镂空结构为四边形结构，所述底板为陶瓷材质。
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CN211289621U (zh) * 2019-09-16 2020-08-18 深圳市绎立锐光科技开发有限公司 一种照明装置
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CN101963295A (zh) * 2010-07-07 2011-02-02 杨东佐 Led集成结构及制造方法、灯、显示屏、背光装置、投影装置、成型塑胶件的注塑模
WO2012003700A1 (zh) * 2010-07-07 2012-01-12 Yang Dongzuo 一种led集成结构的制造方法
CN209196569U (zh) * 2018-11-15 2019-08-02 深圳市绎立锐光科技开发有限公司 一种照明装置

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CN101963295A (zh) * 2010-07-07 2011-02-02 杨东佐 Led集成结构及制造方法、灯、显示屏、背光装置、投影装置、成型塑胶件的注塑模
WO2012003700A1 (zh) * 2010-07-07 2012-01-12 Yang Dongzuo 一种led集成结构的制造方法
CN209196569U (zh) * 2018-11-15 2019-08-02 深圳市绎立锐光科技开发有限公司 一种照明装置

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