WO2021134869A1 - 线路板及终端设备 - Google Patents

线路板及终端设备 Download PDF

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Publication number
WO2021134869A1
WO2021134869A1 PCT/CN2020/076402 CN2020076402W WO2021134869A1 WO 2021134869 A1 WO2021134869 A1 WO 2021134869A1 CN 2020076402 W CN2020076402 W CN 2020076402W WO 2021134869 A1 WO2021134869 A1 WO 2021134869A1
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WO
WIPO (PCT)
Prior art keywords
device layer
circuit board
area
chip
processing chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/076402
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English (en)
French (fr)
Inventor
黄晓天
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Huizhou TCL Mobile Communication Co Ltd
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Huizhou TCL Mobile Communication Co Ltd
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Filing date
Publication date
Application filed by Huizhou TCL Mobile Communication Co Ltd filed Critical Huizhou TCL Mobile Communication Co Ltd
Publication of WO2021134869A1 publication Critical patent/WO2021134869A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09972—Partitioned, e.g. portions of a PCB dedicated to different functions; Boundary lines therefore; Portions of a PCB being processed separately or differently

Definitions

  • This application relates to the field of electronic technology, in particular to a circuit board and terminal equipment.
  • Circuit boards have developed from single-layer to double-sided boards, multilayer boards and flexible boards, and continue to develop in the direction of high precision, high density and high reliability. By continuously reducing the size, reducing the cost, and improving the performance, the circuit board can still maintain a strong vitality in the development of electronic products in the future.
  • circuit board manufacturing technology is to develop in the direction of high density, high precision, fine aperture, fine wire, small pitch, high reliability, multilayer, light weight, and thinness in performance.
  • the embodiments of the present application provide a circuit board and terminal equipment, which can effectively solve the problem of unreasonable layout of processing chips and storage chips in the current circuit board.
  • an embodiment of the present application provides a circuit board, including: a first device layer; a second device layer disposed opposite to the first device layer; and a camera module area disposed in The middle part of the first device layer and the second device layer; wherein the first device layer is provided with an area in which a processing chip and a memory chip are arranged, the processing chip and the memory chip
  • the angle formed by the orthographic projection on the first device layer and the horizontal axis direction of the first device layer is a predetermined angle.
  • the circuit board further includes: at least one third device layer, disposed between the first device layer and the second device layer, the third device layer is used for wiring; wherein the preset angle It is 40 degrees to 50 degrees, preferably, the preset angle is 45 degrees.
  • the circuit board further includes: a charging chip arranged at the lower right of the first device layer.
  • the area is substantially L-shaped, the area includes a horizontal portion and a vertical portion, and the width of the horizontal portion is 15.0 mm.
  • the size of the processing chip is 12.1 mm ⁇ 12.1 mm
  • the size of the memory chip is 13.1 mm ⁇ 11.6 mm.
  • the circuit board further includes: an emulation device area located on the second device layer, the emulation device area corresponding to the area where the processing chip of the first device layer is located.
  • the circuit board further includes: a radio frequency power management chip located on the first device layer, and the radio frequency power management chip is disposed under the camera module area.
  • an embodiment of the present application provides a circuit board, including: a first device layer; a second device layer disposed opposite to the first device layer; and a camera module area disposed In the middle of the first device layer and the second device layer; wherein the first device layer is provided with a region, and a processing chip and a memory chip are provided in the region, the processing chip and the memory
  • the angle formed by the orthographic projection of the chip on the first device layer and the horizontal axis direction of the first device layer is a predetermined angle.
  • the circuit board further includes: at least one third device layer disposed between the first device layer and the second device layer, and the third device layer is used for wiring.
  • the preset angle is 40 degrees to 50 degrees, and preferably, the preset angle is 45 degrees.
  • the circuit board further includes: a charging chip arranged at the lower right of the first device layer.
  • the area is substantially L-shaped, the area includes a horizontal portion and a vertical portion, and the width of the horizontal portion is 15.0 mm.
  • the size of the processing chip is 12.1 mm ⁇ 12.1 mm
  • the size of the memory chip is 13.1 mm ⁇ 11.6 mm.
  • the circuit board further includes: an emulation device area located on the second device layer, the emulation device area corresponding to the area where the processing chip of the first device layer is located.
  • the circuit board further includes: a radio frequency power management chip located on the first device layer, and the radio frequency power management chip is disposed under the camera module area.
  • the circuit board further includes a fingerprint connector located on the second device layer, and the fingerprint connector is located below the camera module area.
  • an embodiment of the present application provides a terminal device, including the above-mentioned circuit board.
  • the advantage of the present application is that by placing the processing chip and the storage chip in the L-shaped area obliquely, this application facilitates the layout of the entire circuit board, facilitates the processing of the chip’s outgoing wires, and increases the distance between the processing chip and the charging chip. Conducive to the heat dissipation of the processing chip.
  • the area corresponding to the area of the second device layer and the processing chip there is enough space to set up the simulation device area, which can ensure that the circuit board can smoothly pass the power distribution network simulation.
  • FIG. 1 is a schematic top view of a first device layer structure of a circuit board provided by an embodiment of the application.
  • FIG. 2 is a schematic bottom view of the second device layer structure of the circuit board provided by the embodiment of the application.
  • FIG. 3 is a schematic diagram of the positional relationship between the first device layer, the second device layer, and the third device layer of the circuit board provided by the embodiment of the application.
  • FIG. 4 is a schematic diagram of the angle between the processing chip and the horizontal axis provided by an embodiment of the application.
  • Fig. 5 is a schematic structural diagram of a terminal device provided by an embodiment of the application.
  • FIG. 6 is a schematic diagram of another structure of a terminal device provided by an embodiment of the application.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Therefore, the features defined with “first” and “second” may explicitly or implicitly include one or more of the features. In the description of the present application, “multiple” means two or more than two, unless otherwise specifically defined.
  • connection should be understood in a broad sense, unless otherwise clearly specified and limited.
  • it can be a fixed connection or a detachable connection. Connected or integrally connected; it can be mechanically connected, or electrically connected or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two components or the interaction of two components relationship.
  • the analog display screen touch module is connected to the head tracking module, and is used to obtain the movement path of the sensor cursor in the display device.
  • the "on" or “under” of the first feature of the second feature may include direct contact between the first and second features, or may include the first and second features Not in direct contact but through other features between them.
  • the "above”, “above” and “above” of the first feature on the second feature include the first feature directly above and obliquely above the second feature, or it simply means that the first feature is higher in level than the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature include the first feature directly below and obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the circuit board includes: a first device layer 10, a second device layer 20 and a camera module area 1.
  • the circuit board further includes: a charging chip 5 arranged at the lower right of the first device layer 10.
  • the first device layer 10 is provided with a region 2 in which a processing chip 3 and a memory chip 4 are provided.
  • the processing chip 3 and the memory chip 4 are located in the
  • the angle between the orthographic projection on the first device layer 10 and the horizontal axis direction of the first device layer 10 is a preset angle ⁇ (in combination, refer to FIG. 4, which is a processing chip 3 Schematic diagram of the angle with the horizontal axis 11).
  • the preset angle ⁇ is 40 degrees to 50 degrees. Due to the limitation of circuit board manufacturing tools, the outlet angle of circuit board manufacturing tools is generally 0 degrees, 45 degrees or 90 degrees. Other angles belong to any angle wiring, and any angle wiring increases the difficulty of wiring. Therefore, the preferred preset angle is 45 degree.
  • the purpose of this arrangement is to place the processing chip 3 and the memory chip 4 in the L-shaped area 2 obliquely, which is beneficial to the layout of the entire circuit board, facilitates the processing of the chip 3 to spread out, and increases the processing chip 3 and the charging chip 5 The distance is conducive to the heat dissipation of the processing chip 3.
  • the circuit board further includes: at least one third device layer is disposed between the first device layer 10 and the second device layer 20, and the third device layer is used for wiring.
  • the third device layer is two layers (30 and 40 in FIG. 3), but it is not limited thereto. In other embodiments, the third device layer can be set according to actual needs.
  • the area 2 is substantially L-shaped (that is, the position shown by reference number 2 in FIG. 1), the area 2 includes a horizontal portion and a vertical portion, and the width of the horizontal portion is 15.0 mm (That is, the dotted line shown by the number 7 in Figure 1).
  • the processing chip 3 is SDM636, the size of the processing chip 3 is 12.1 mm ⁇ 12.1 mm, and the size of the memory chip 4 is 13.1 mm ⁇ 11.6 mm. It can be seen from this that if it is assumed that the processing chip 3 with a width of 12.1 mm is placed in the horizontal part of the area 2, the processing chip 3 can only be accommodated just now. However, since there is no extra space, it is not conducive to processing the wiring of the chip 3.
  • the processing chip 3 and the storage chip 4 by placing the processing chip 3 and the storage chip 4 obliquely, it is not only advantageous to place the processing chip 3 and the storage chip 4, but also has a certain distance from the boundary of the L-shaped area. Since the processing chip 3 and the storage chip 4 are placed obliquely, the area occupied by the processing chip 3 and the storage chip 4 is released, which is beneficial to the wiring of the processing chip 3, and the placement of the processing chip 3 and the storage chip 4 is set in this way.
  • the direction can increase the distance from the charging chip 5 at the lower right of the first device layer 10, which is beneficial to the heat dissipation of the processing chip 3.
  • the circuit board also includes: a radio frequency power management chip 6 and a fingerprint connector 8.
  • the radio frequency power management chip 6 is located on the first device layer 10, and the radio frequency power management chip 6 is arranged under the camera module area 1.
  • the fingerprint connector 8 is located on the second device layer 20, and the fingerprint connector 8 is located below the camera module area 1.
  • the advantage of the present application is that by placing the processing chip and the storage chip in the L-shaped area obliquely, this application facilitates the layout of the entire circuit board, facilitates the processing of the chip’s outgoing wires, and increases the distance between the processing chip and the charging chip. Conducive to the heat dissipation of the processing chip. And in the area corresponding to the area of the second device layer and the processing chip, there is enough space to set up the simulation device area, which can ensure that the circuit board can smoothly pass the power distribution network simulation.
  • this embodiment of the present application also provides a terminal device.
  • the terminal device adopts the circuit board described in the foregoing embodiment.
  • the terminal device may be a device such as a smart phone or a tablet computer.
  • the terminal device 200 includes a processor 201 and a memory 202. Wherein, the processor 201 and the memory 202 are electrically connected.
  • the processor 201 is the control center of the terminal device 200. It uses various interfaces and lines to connect the various parts of the entire terminal device. It executes the terminal by running or loading application programs stored in the memory 202 and calling data stored in the memory 202. Various functions and processing data of the equipment can be used to monitor the terminal equipment as a whole.
  • Fig. 6 shows a specific structural block diagram of a terminal device provided by an embodiment of the present application.
  • the terminal device 300 may be a smart phone or a tablet computer.
  • the terminal device may also include the following components.
  • the RF circuit 310 is used to receive and send electromagnetic waves, realize the mutual conversion between electromagnetic waves and electrical signals, so as to communicate with a communication network or other devices.
  • the RF circuit 310 may include various existing circuit elements for performing these functions, for example, an antenna, a radio frequency transceiver, a digital signal processor, an encryption/decryption chip, a subscriber identity module (SIM) card, a memory, and so on.
  • SIM subscriber identity module
  • the RF circuit 310 can communicate with various networks such as the Internet, an intranet, and a wireless network, or communicate with other devices through a wireless network.
  • the aforementioned wireless network may include a cellular telephone network, a wireless local area network, or a metropolitan area network.
  • the above-mentioned wireless network can use various communication standards, protocols and technologies, including but not limited to the Global System for Mobile Communications (Global System for Mobile Communication, GSM), enhanced mobile communication technology (Enhanced Data GSM Environment, EDGE), wideband code division multiple access technology (Wideband Code Division Multiple Access, WCDMA), Code Division Multiple Access (Code Division Multiple Access) Access, CDMA), Time Division Multiple Access (TDMA), Wireless Fidelity (Wi-Fi) (such as the American Institute of Electrical and Electronics Engineers standards IEEE 802.11a, IEEE 802.11b, IEEE802.11g) And/or IEEE 802.11n), Internet phone (Voice over Internet Protocol, VoIP), Worldwide Interconnection for Microwave Access (Worldwide Interoperability for Microwave Access, Wi-Max), other protocols used for mail, instant messaging and short messages, and any other suitable communication protocols, even those that have not yet been developed.
  • GSM Global System for Mobile Communication
  • EDGE Enhanced Data GSM Environment
  • WCDMA Wideband Code Division Multiple Access
  • CDMA Code Division Multiple Access
  • the memory 320 may be used to store software programs and modules.
  • the processor 380 executes various functional applications and data processing by running the software programs and modules stored in the memory 320.
  • the memory 320 may include a high-speed random access memory, and may also include a non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory.
  • the memory 320 may further include a memory remotely provided with respect to the processor 380, and these remote memories may be connected to the terminal device 300 through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.
  • the input unit 330 may be used to receive inputted digital or character information, and generate keyboard, mouse, joystick, optical or trackball signal input related to user settings and function control.
  • the input unit 330 may include a touch-sensitive surface 331 and other input devices 332.
  • the touch-sensitive surface 331 also called a touch screen or a touchpad, can collect the user's touch operations on or near it (for example, the user uses any suitable objects or accessories such as fingers, stylus, etc.) on or on the touch-sensitive surface 331. Operation near the touch-sensitive surface 331), and drive the corresponding connection device according to the preset program.
  • the touch-sensitive surface 331 may include two parts: a touch detection device and a touch controller.
  • the touch detection device detects the user's touch position, detects the signal brought by the touch operation, and transmits the signal to the touch controller; the touch controller receives the touch information from the touch detection device, converts it into contact coordinates, and then sends it To the processor 380, and can receive and execute the commands sent by the processor 380.
  • the touch-sensitive surface 331 can be realized in multiple types such as resistive, capacitive, infrared, and surface acoustic wave.
  • the input unit 330 may also include other input devices 332.
  • the other input device 332 may include, but is not limited to, one or more of a physical keyboard, function keys (such as a volume control button, a switch button, etc.), a trackball, a mouse, and a joystick.
  • the display unit 340 may be used to display information input by the user or information provided to the user and various graphical user interfaces of the terminal device 300. These graphical user interfaces may be composed of graphics, text, icons, videos, and any combination thereof.
  • the display unit 340 may include a display panel 341.
  • an LCD Liquid
  • the display panel 341 is configured in the form of Crystal Display (Liquid Crystal Display), OLED (Organic Light-Emitting Diode, Organic Light-Emitting Diode), etc.
  • the touch-sensitive surface 331 may cover the display panel 341.
  • the touch-sensitive surface 331 When the touch-sensitive surface 331 detects a touch operation on or near it, it is transmitted to the processor 380 to determine the type of the touch event, and then the processor 380 determines the type of the touch event.
  • the type provides corresponding visual output on the display panel 341.
  • the touch-sensitive surface 331 and the display panel 341 are used as two independent components to realize the input and output functions, in some embodiments, the touch-sensitive surface 331 and the display panel 341 can be integrated to realize the input and output functions. And output function.
  • the terminal device 300 may also include at least one sensor 350, such as a light sensor, a motion sensor, and other sensors.
  • the light sensor may include an ambient light sensor and a proximity sensor.
  • the ambient light sensor can adjust the brightness of the display panel 341 according to the brightness of the ambient light, and the proximity sensor can close the display panel 341 when the terminal device 300 is moved to the ear. And/or backlight.
  • the gravity acceleration sensor can detect the magnitude of acceleration in various directions (usually three-axis), and can detect the magnitude and direction of gravity when it is stationary.
  • the terminal device 300 can also be configured with other sensors such as gyroscopes, barometers, hygrometers, thermometers, infrared sensors, here No longer.
  • the audio circuit 360, the speaker 361, and the microphone 362 can provide an audio interface between the user and the terminal device 300.
  • the audio circuit 360 can transmit the electrical signal converted from the received audio data to the speaker 361, and the speaker 361 converts it into a sound signal for output; on the other hand, the microphone 362 converts the collected sound signal into an electrical signal, which is then output by the audio circuit 360. After being received, it is converted into audio data, and then processed by the audio data output processor 380, and sent to, for example, another terminal via the RF circuit 310, or the audio data is output to the memory 320 for further processing.
  • the audio circuit 360 may also include an earplug jack to provide communication between a peripheral earphone and the terminal device 300.
  • the terminal device 300 can help users send and receive emails, browse webpages, and access streaming media through the transmission module 370 (for example, a Wi-Fi module), and it provides users with wireless broadband Internet access.
  • the transmission module 370 for example, a Wi-Fi module
  • FIG. 6 shows the transmission module 370, it is understandable that it is not a necessary component of the terminal device 300, and can be omitted as needed without changing the essence of the invention.
  • the processor 380 is the control center of the terminal device 300, which uses various interfaces and lines to connect the various parts of the entire mobile phone, runs or executes software programs and/or modules stored in the memory 320, and calls data stored in the memory 320 , Perform various functions of the terminal device 300 and process data, so as to monitor the mobile phone as a whole.
  • the processor 380 may include one or more processing cores; in some embodiments, the processor 380 may integrate an application processor and a modem processor, where the application processor mainly processes the operating system, user interface, and For application programs, the modem processor mainly deals with wireless communication. It can be understood that the foregoing modem processor may not be integrated into the processor 380.
  • the terminal device 300 also includes a power source 390 (such as a battery) for supplying power to various components.
  • the power source may be logically connected to the processor 380 through a power management system, so as to manage charging, discharging, and power consumption through the power management system. Management and other functions.
  • the power supply 390 may also include any components such as one or more DC or AC power supplies, a recharging system, a power failure detection circuit, a power converter or inverter, and a power status indicator.
  • the terminal device 300 may also include a camera (such as a front camera, a rear camera), a Bluetooth module, etc., which will not be repeated here.
  • a camera such as a front camera, a rear camera
  • a Bluetooth module etc., which will not be repeated here.
  • each of the above modules can be implemented as an independent entity, or can be combined arbitrarily, and implemented as the same or several entities.
  • each of the above modules please refer to the previous method embodiments, which will not be repeated here.

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  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本申请公开了一种线路板及终端设备，本申请通过将L型区域内的处理芯片和存储芯片倾斜摆放，有利于整个线路板的布局，方便处理芯片往外散线，增加了处理芯片与充电芯片的距离，有利于处理芯片的散热。另外在第二器件层与处理芯片所在区域相对应的区域，有足够的空间设置仿真器件区，能保证线路板顺利通过电源分配网络仿真。

Description

线路板及终端设备
本申请要求于2019年12月31日提交中国专利局、申请号201911408523.9、发明名称为“线路板及终端设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，尤其涉及一种线路板及终端设备。
 背景技术
线路板从单层发展到双面板、多层板和挠性板，并不断地向高精度、高密度和高可靠性方向发展。通过不断缩小体积、减少成本、提高性能，能够使得线路板在未来电子产品的发展过程中，仍然保持强大的生命力。
未来线路板生产制造技术发展趋势是在性能上向高密度、高精度、细孔径、细导线、小间距、高可靠、多层化、轻量、薄型方向发展。
有鉴于此，如何合理利用线路板的空间，提高线路板的工作效率和性能，成为首要的研究课题，以期达到更具有更加实用价值性的目的。
 技术问题
本申请实施例提供一种线路板及终端设备，能够有效解决目前线路板中处理芯片和存储芯片布局不合理的问题。
 技术解决方案
根据本申请的一方面，本申请实施例提供一种线路板，包括：一第一器件层；一第二器件层，与所述第一器件层相对设置；以及一摄像模组区，设置于所述第一器件层及所述第二器件层的中部；其中所述第一器件层设有一区域，在所述区域内设有一处理芯片及一存储芯片，所述处理芯片及所述存储芯片在所述第一器件层上的正投影与所述第一器件层的横轴方向所形成的夹角为一预设角度。其中所述线路板还包括：至少一第三器件层，设置于所述第一器件层与所述第二器件层之间，所述第三器件层用于走线；其中所述预设角度为40度至50度，优选地，预设角度为45度。
进一步地，所述线路板还包括：一充电芯片，设置于所述第一器件层的右下方。
进一步地，所述区域大体上呈L型，所述区域包括一水平部和一垂直部，所述水平部的宽度为15.0mm。
进一步地，所述处理芯片的尺寸为12.1mm×12.1mm，所述存储芯片的尺寸13.1mm×11.6mm。
进一步地，所述线路板还包括：一仿真器件区，位于所述第二器件层，所述仿真器件区与所述第一器件层的所述处理芯片所在区域相对应。
进一步地，所述线路板还包括：一射频电源管理芯片，位于所述第一器件层，所述射频电源管理芯片设置于所述摄像模组区的下方。
根据本申请的另一方面，本申请实施例提供一种线路板，包括：一第一器件层；一第二器件层，与所述第一器件层相对设置；以及一摄像模组区，设置于所述第一器件层及所述第二器件层的中部；其中所述第一器件层设有一区域，在所述区域内设有一处理芯片及一存储芯片，所述处理芯片及所述存储芯片在所述第一器件层上的正投影与所述第一器件层的横轴方向所形成的的夹角为一预设角度。
进一步地，所述线路板还包括：至少一第三器件层，设置于所述第一器件层与所述第二器件层之间，所述第三器件层用于走线。
进一步地，所述预设角度为40度至50度，优选地，预设角度为45度。
进一步地，所述线路板还包括：一充电芯片，设置于所述第一器件层的右下方。
进一步地，所述区域大体上呈L型，所述区域包括一水平部和一垂直部，所述水平部的宽度为15.0mm。
进一步地，所述处理芯片的尺寸为12.1mm×12.1mm，所述存储芯片的尺寸13.1mm×11.6mm。
进一步地，所述线路板还包括：一仿真器件区，位于所述第二器件层，所述仿真器件区与所述第一器件层的所述处理芯片所在区域相对应。
进一步地，所述线路板还包括：一射频电源管理芯片，位于所述第一器件层，所述射频电源管理芯片设置于所述摄像模组区的下方。
进一步地，所述线路板还包括：一指纹连接器，位于所述第二器件层，所述指纹连接器位于所述摄像模组区的下方。
根据本申请的又一方面，本申请实施例提供一种终端设备，包括上述的线路板。
 有益效果
本申请的优点在于，本申请通过将L型区域内的处理芯片和存储芯片倾斜摆放，有利于整个线路板的布局，方便处理芯片往外散线，增加了处理芯片与充电芯片的距离，有利于处理芯片的散热。另外在第二器件层与处理芯片所在区域相对应的区域，有足够的空间设置仿真器件区，能保证线路板顺利通过电源分配网络仿真。
 附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例所提供的线路板的第一器件层结构示意俯视图。
图2为本申请实施例所提供的线路板的第二器件层结构示意仰视图。
图3为本申请实施例所提供的线路板的第一器件层、第二器件层、第三器件层的位置关系示意图。
图4为本申请实施例所提供的处理芯片与横轴夹角示意图。
图5为本申请实施例所提供的终端设备的结构示意图。
图6为本申请实施例所提供的终端设备的另一结构示意图。
 本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
在本申请的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接或可以相互通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。在本实施例中，所述模拟显示屏触摸模块与所述头部追踪模块连接，用于获取所述显示设备中的感应光标的移动路径。
在本申请中，除非另有明确的规定和限定，第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触，也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且，第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方，或仅仅表示第一特征水平高度小于第二特征。
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开，下文中对特定例子的部件和设置进行描述。当然，它们仅仅为示例，并且目的不在于限制本申请。此外，本申请可以在不同例子中重复参考数字和/或参考字母，这种重复是为了简化和清楚的目的，其本身不指示所讨论各种实施方式和/或设置之间的关系。此外，本申请提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
如图1和2所示，所述线路板包括：一第一器件层10、一第二器件层20及一摄像模组区1。
所述线路板还包括：一充电芯片5设置于所述第一器件层10的右下方。
在本申请实施例中，所述第一器件层10设有一区域2，在所述区域2内设有一处理芯片3及一存储芯片4，所述处理芯片3及所述存储芯片4在所述第一器件层10上的正投影与所述第一器件层10的横轴方向（即图1中11标号）的夹角为一预设角度θ（结合参阅图4，图4为处理芯片3与横轴11夹角示意图）。预设角度θ为40度至50度。由于线路板的制作工具的限制，线路板的制作工具的出线角度一般是0度、45度或90度，其它角度属于任意角度布线，任意角度布线增加布线的难度，因此优选的预设角度为45度。如此设置的目的在于通过将L型区域2内的处理芯片3和存储芯片4倾斜摆放，有利于整个线路板的布局，方便处理芯片3往外散线，增加了处理芯片3与充电芯片5的距离，有利于处理芯片3的散热。
结合参阅图3。
所述线路板还包括：至少一第三器件层设置于所述第一器件层10与所述第二器件层20之间，所述第三器件层用于走线。在本实施例中，所述第三器件层为两层（如图3中的30及40），但不限于此。在其他实施例中所述第三器件层可以根据实际需要设置。
在本实施例中，所述区域2大体上呈L型（即图1中标号2所示的位置），所述区域2包括一水平部和一垂直部，所述水平部的宽度为15.0mm（即图1中标号7所示的虚线）。
在本实施例中，所述处理芯片3为SDM636，所述处理芯片3的尺寸为12.1mm×12.1mm，所述存储芯片4的尺寸为13.1mm×11.6mm。由此可以看出，若假设在所述区域2的水平部内放置宽度为12.1mm的处理芯片3，仅为刚刚能够容纳所述处理芯片3。但由于没有多余空间，因此不利于处理芯片3的走线。
在本实施例中，通过将处理芯片3和存储芯片4倾斜放置，不仅能够有利于放置处理芯片3和存储芯片4，且与L型区域的边界有一定的间距。由于处理芯片3和存储芯片4倾斜放置，将原本处理芯片3和存储芯片4水平放置所占用的区域释放出来，有利于处理芯片3的走线，而且如此设置处理芯片3和存储芯片4的放置方向，能够增加与所述第一器件层10右下方的充电芯片5的距离，有利于处理芯片3的散热。
所述线路板还包括：一射频电源管理芯片6和一指纹连接器8。
所述射频电源管理芯片6位于所述第一器件层10，所述射频电源管理芯片6设置于所述摄像模组区1的下方。所述指纹连接器8位于所述第二器件层20，所述指纹连接器8位于所述摄像模组区1的下方。
在本实施例中，在第二器件层20与处理芯片3所在区域相对应的区域，有足够的空间设置仿真器件区9，能保证线路板顺利通过电源分配网络仿真。所述仿真器件区9内设置多个电容。
本申请的优点在于，本申请通过将L型区域内的处理芯片和存储芯片倾斜摆放，有利于整个线路板的布局，方便处理芯片往外散线，增加了处理芯片与充电芯片的距离，有利于处理芯片的散热。且在第二器件层与处理芯片所在区域相对应的区域，有足够的空间设置仿真器件区，能保证线路板顺利通过电源分配网络仿真。
如图5所示，为本申请实施例还提供一种终端设备，所述终端设备采用上述实施例所述线路板，该终端设备可以是智能手机、平板电脑等设备。具体地，如图5所示，终端设备200包括处理器201和存储器202。其中，处理器201与存储器202电性连接。
处理器201是终端设备200的控制中心，利用各种接口和线路连接整个终端设备的各个部分，通过运行或加载存储在存储器202内的应用程序，以及调用存储在存储器202内的数据，执行终端设备的各种功能和处理数据，从而对终端设备进行整体监控。
图6示出了本申请实施例提供的终端设备的具体结构框图。该终端设备300可以为智能手机或平板电脑。
所述终端设备还可以包括以下部件。RF电路310用于接收以及发送电磁波，实现电磁波与电信号的相互转换，从而与通讯网络或者其他设备进行通讯。RF电路310可包括各种现有的用于执行这些功能的电路元件，例如，天线、射频收发器、数字信号处理器、加密/解密芯片、用户身份模块（SIM）卡、存储器等等。RF电路310可与各种网络如互联网、企业内部网、无线网络进行通讯或者通过无线网络与其他设备进行通讯。上述的无线网络可包括蜂窝式电话网、无线局域网或者城域网。上述的无线网络可以使用各种通信标准、协议及技术，包括但并不限于全球移动通信系统（Global System for Mobile Communication, GSM）、增强型移动通信技术（Enhanced Data GSM Environment, EDGE)，宽带码分多址技术（Wideband Code Division Multiple Access, WCDMA），码分多址技术（Code Division Access, CDMA）、时分多址技术（Time Division Multiple Access, TDMA），无线保真技术（Wireless Fidelity，Wi-Fi）（如美国电气和电子工程师协会标准 IEEE 802.11a， IEEE 802.11b, IEEE802.11g 和/或 IEEE 802.11n）、网络电话（Voice over Internet Protocol, VoIP）、全球微波互联接入（Worldwide Interoperability for Microwave Access， Wi-Max）、其他用于邮件、即时通讯及短消息的协议，以及任何其他合适的通讯协议，甚至可包括那些当前仍未被开发出来的协议。
存储器320可用于存储软件程序以及模块，处理器380通过运行存储在存储器320内的软件程序以及模块，从而执行各种功能应用以及数据处理。存储器320可包括高速随机存储器，还可包括非易失性存储器，如一个或者多个磁性存储装置、闪存、或者其他非易失性固态存储器。在一些实例中，存储器320可进一步包括相对于处理器380远程设置的存储器，这些远程存储器可以通过网络连接至终端设备300。上述网络的实例包括但不限于互联网、企业内部网、局域网、移动通信网及其组合。
输入单元330可用于接收输入的数字或字符信息，以及产生与用户设置以及功能控制有关的键盘、鼠标、操作杆、光学或者轨迹球信号输入。具体地，输入单元330可包括触敏表面331以及其他输入设备332。触敏表面331，也称为触摸显示屏或者触控板，可收集用户在其上或附近的触摸操作（比如用户使用手指、触笔等任何适合的物体或附件在触敏表面331上或在触敏表面331附近的操作），并根据预先设定的程式驱动相应的连接装置。可选的，触敏表面331可包括触摸检测装置和触摸控制器两个部分。其中，触摸检测装置检测用户的触摸方位，并检测触摸操作带来的信号，将信号传送给触摸控制器；触摸控制器从触摸检测装置上接收触摸信息，并将它转换成触点坐标，再送给处理器380，并能接收处理器380发来的命令并加以执行。此外，可以采用电阻式、电容式、红外线以及表面声波等多种类型实现触敏表面331。除了触敏表面331，输入单元330还可以包括其他输入设备332。具体地，其他输入设备332可以包括但不限于物理键盘、功能键（比如音量控制按键、开关按键等）、轨迹球、鼠标、操作杆等中的一种或多种。
显示单元340可用于显示由用户输入的信息或提供给用户的信息以及终端设备300的各种图形用户接口，这些图形用户接口可以由图形、文本、图标、视频和其任意组合来构成。显示单元340可包括显示面板341，可选的，可以采用LCD(Liquid Crystal Display，液晶显示器)、OLED(Organic Light-Emitting Diode,有机发光二极管)等形式来配置显示面板341。进一步的，触敏表面331可覆盖显示面板341，当触敏表面331检测到在其上或附近的触摸操作后，传送给处理器380以确定触摸事件的类型，随后处理器380根据触摸事件的类型在显示面板341上提供相应的视觉输出。虽然在图6中，触敏表面331与显示面板341是作为两个独立的部件来实现输入和输出功能，但是在某些实施例中，可以将触敏表面331与显示面板341集成而实现输入和输出功能。
终端设备300还可包括至少一种传感器350，比如光传感器、运动传感器以及其他传感器。具体地，光传感器可包括环境光传感器及接近传感器，其中，环境光传感器可根据环境光线的明暗来调节显示面板341的亮度，接近传感器可在终端设备300移动到耳边时，关闭显示面板341和/或背光。作为运动传感器的一种，重力加速度传感器可检测各个方向上（一般为三轴）加速度的大小，静止时可检测出重力的大小及方向，可用于识别手机姿态的应用（比如横竖屏切换、相关游戏、磁力计姿态校准）、振动识别相关功能（比如计步器、敲击）等; 至于终端设备300还可配置的陀螺仪、气压计、湿度计、温度计、红外线传感器等其他传感器，在此不再赘述。
音频电路360、扬声器361，传声器362可提供用户与终端设备300之间的音频接口。音频电路360可将接收到的音频数据转换后的电信号，传输到扬声器361，由扬声器361转换为声音信号输出；另一方面，传声器362将收集的声音信号转换为电信号，由音频电路360接收后转换为音频数据，再将音频数据输出处理器380处理后，经RF电路310以发送给比如另一终端，或者将音频数据输出至存储器320以便进一步处理。音频电路360还可能包括耳塞插孔，以提供外设耳机与终端设备300的通信。
终端设备300通过传输模块370（例如Wi-Fi模块）可以帮助用户收发电子邮件、浏览网页和访问流式媒体等，它为用户提供了无线的宽带互联网访问。虽然图6示出了传输模块370，但是可以理解的是，其并不属于终端设备300的必须构成，完全可以根据需要在不改变发明的本质的范围内而省略。
处理器380是终端设备300的控制中心，利用各种接口和线路连接整个手机的各个部分，通过运行或执行存储在存储器320内的软件程序和/或模块，以及调用存储在存储器320内的数据，执行终端设备300的各种功能和处理数据，从而对手机进行整体监控。可选的，处理器380可包括一个或多个处理核心；在一些实施例中，处理器380可集成应用处理器和调制解调处理器，其中，应用处理器主要处理操作系统、用户界面和应用程序等，调制解调处理器主要处理无线通信。可以理解的是，上述调制解调处理器也可以不集成到处理器380中。
终端设备300还包括给各个部件供电的电源390（比如电池），在一些实施例中，电源可以通过电源管理系统与处理器380逻辑相连，从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。电源390还可以包括一个或一个以上的直流或交流电源、再充电系统、电源故障检测电路、电源转换器或者逆变器、电源状态指示器等任意组件。
尽管未示出，终端设备300还可以包括摄像头（如前置摄像头、后置摄像头）、蓝牙模块等，在此不再赘述。
具体实施时，以上各个模块可以作为独立的实体来实现，也可以进行任意组合，作为同一或若干个实体来实现，以上各个模块的具体实施可参见前面的方法实施例，在此不再赘述。
在上述实施例中，对各个实施例的描述都各有侧重，某个实施例中没有详述的部分，可以参见其他实施例的相关描述。
本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (16)

  1. 一种线路板，其包括：
    一第一器件层；
    一第二器件层，与所述第一器件层相对设置；以及
    一摄像模组区，设置于所述第一器件层及所述第二器件层的中部；
    其中所述第一器件层设有一区域，在所述区域内设有一处理芯片及一存储芯片，所述处理芯片及所述存储芯片在所述第一器件层上的正投影与所述第一器件层的横轴方向所形成的夹角为一预设角度。
    其中所述线路板还包括：至少一第三器件层，设置于所述第一器件层与所述第二器件层之间，所述第三器件层用于走线；
    其中所述预设角度为40度至50度，优选地，预设角度为45度。
  2. 根据权利要求1所述的线路板，其中所述线路板还包括：一充电芯片，设置于所述第一器件层的右下方。
  3. 根据权利要求1所述的线路板，其中所述区域大体上呈L型，所述区域包括一水平部和一垂直部，所述水平部的宽度为15.0mm。
  4. 根据权利要求3所述的线路板，其中所述处理芯片的尺寸为12.1mm×12.1mm，所述存储芯片的尺寸13.1mm×11.6mm。
  5. 根据权利要求1所述的线路板，其中所述线路板还包括：一仿真器件区，位于所述第二器件层，所述仿真器件区与所述第一器件层的所述处理芯片所在区域相对应。
  6. 根据权利要求1所述的线路板，其中所述线路板还包括：一射频电源管理芯片，位于所述第一器件层，所述射频电源管理芯片设置于所述摄像模组区的下方。
  7. 一种线路板，其包括：
    一第一器件层；
    一第二器件层，与所述第一器件层相对设置；以及
    一摄像模组区，设置于所述第一器件层及所述第二器件层的中部；
    其中所述第一器件层设有一区域，在所述区域内设有一处理芯片及一存储芯片，所述处理芯片及所述存储芯片在所述第一器件层上的正投影与所述第一器件层的横轴方向所形成的夹角为一预设角度。
  8. 根据权利要求7所述的线路板，其中所述线路板还包括：至少一第三器件层，设置于所述第一器件层与所述第二器件层之间，所述第三器件层用于走线。
  9. 根据权利要求7所述的线路板，其中所述预设角度为40度至50度，优选地，预设角度为45度。
  10. 根据权利要求7所述的线路板，其中所述线路板还包括：一充电芯片，设置于所述第一器件层的右下方。
  11. 根据权利要求7所述的线路板，其中所述区域大体上呈L型，所述区域包括一水平部和一垂直部，所述水平部的宽度为15.0mm。
  12. 根据权利要求11所述的线路板，其中所述处理芯片的尺寸为12.1mm×12.1mm，所述存储芯片的尺寸13.1mm×11.6mm。
  13. 根据权利要求1所述的线路板，其中所述线路板还包括：一仿真器件区，位于所述第二器件层，所述仿真器件区与所述第一器件层的所述处理芯片所在区域相对应。
  14. 根据权利要求1所述的线路板，其中所述线路板还包括：一射频电源管理芯片，位于所述第一器件层，所述射频电源管理芯片设置于所述摄像模组区的下方。
  15. 根据权利要求1所述的线路板，其中所述线路板还包括：一指纹连接器，位于所述第二器件层，所述指纹连接器位于所述摄像模组区的下方。
  16. 一种终端设备，其包括权利要求7所述的线路板。
PCT/CN2020/076402 2019-12-31 2020-02-24 线路板及终端设备 Ceased WO2021134869A1 (zh)

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