WO2021134487A1 - Light-emitting diode display module and repair method therefor, and display device - Google Patents

Light-emitting diode display module and repair method therefor, and display device Download PDF

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Publication number
WO2021134487A1
WO2021134487A1 PCT/CN2019/130524 CN2019130524W WO2021134487A1 WO 2021134487 A1 WO2021134487 A1 WO 2021134487A1 CN 2019130524 W CN2019130524 W CN 2019130524W WO 2021134487 A1 WO2021134487 A1 WO 2021134487A1
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Prior art keywords
light
emitting diode
electrode layer
emitting
electrode
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PCT/CN2019/130524
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French (fr)
Chinese (zh)
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许时渊
林子平
洪温振
汪楷伦
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重庆康佳光电技术研究院有限公司
许时渊
林子平
洪温振
汪楷伦
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Application filed by 重庆康佳光电技术研究院有限公司, 许时渊, 林子平, 洪温振, 汪楷伦 filed Critical 重庆康佳光电技术研究院有限公司
Priority to CN201980004131.8A priority Critical patent/CN113574673B/en
Priority to PCT/CN2019/130524 priority patent/WO2021134487A1/en
Publication of WO2021134487A1 publication Critical patent/WO2021134487A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission

Definitions

  • the invention relates to the technical field of micro-LEDs (Micro-LED), and in particular to a light-emitting diode display module, a repair method thereof, and a display device.
  • Micro-LED micro-LED
  • the current repair methods for defective micro-light-emitting diodes usually first use the automatic optical inspection (AOI, Automated Optical Inspection) method to detect the display back At the position of the defective micro-light-emitting diode on the board, use a laser to remove the defective micro-light-emitting diode. After the removal is completed, another micro-light-emitting diode that normally emits light is welded at the same position.
  • AOI Automated Optical Inspection
  • the defective micro-light-emitting diode is repaired, and a high-power laser must be used to completely remove the defective micro-light-emitting diode. Therefore, in the process of removing defective micro-LEDs by the laser, the solder (indium and tin) under the defective micro-LEDs may be damaged due to excessive power, which may increase the difficulty of the subsequent repair process. After using the laser to remove the defective micro-LEDs, the solder in a certain area needs to be heated again to supplement the new micro-LEDs in the original position, and the micro-LEDs and the backplane have good conduction and fixation through the solder . However, when the laser removes a lot of solder, it is necessary to add solder to the position to better conduct and fix the micro light-emitting diode with the backplane.
  • the invention provides a light emitting diode display module, a repair method of the light emitting diode display module, and a display device using the light emitting diode display module, which can improve the repair efficiency of the light emitting diode display module.
  • an embodiment of the present invention provides a light emitting diode display module.
  • the light emitting diode display module includes:
  • a substrate is provided, the substrate is provided with a plurality of pixel regions at equal intervals, and each of the pixel regions is provided with a plurality of pixel subregions emitting different monochromatic light, and each of the pixel subregions includes a first light-emitting region and a second light-emitting region.
  • a light-emitting area, the first light-emitting area is provided with a first light-emitting diode;
  • a second light-emitting diode is provided in the second light-emitting area, the second light-emitting area is located adjacent to the first light-emitting area, and the color of the second light-emitting diode is the same as the color of the defective first light-emitting diode .
  • an embodiment of the present invention provides a display device.
  • the display device includes a housing and a display module arranged in the housing, and the display module is the light-emitting diode display module as described above.
  • FIG. 3 is a top view of the display module provided by the second embodiment of the present invention.
  • FIG. 4 is a schematic cross-sectional view of the display module provided by the first embodiment of the present invention.
  • FIG. 8 is a schematic cross-sectional view of the repair method process provided by the first embodiment of the present invention.
  • the insulating layer 60 is disposed on the substrate 10 and covers the first electrode layer 31 and the second electrode layer 32, and exposes the first electrode layer 31 and the second electrode layer 32 at positions corresponding to the pixel sub-region 21.
  • FIG. 6, FIG. 8 and FIG. 10 are schematic diagrams of the repair method of the light-emitting diode display module according to the first embodiment of the present invention.
  • the repairing method of the LED display module is used to repair the defective LEDs on the LED display module 99.
  • the repair steps include:
  • the substrate 10 is provided.
  • the substrate 10 is provided with a plurality of pixel regions 20 at equal intervals, and each pixel region 20 is provided with a plurality of pixel subregions 21 emitting different monochromatic light.
  • Each pixel subregion 21 includes a first light-emitting region 211 and a second light-emitting region. Area 212.
  • the first light-emitting area 211 is provided with a first light-emitting diode 40, wherein the first electrode and the second electrode of the first light-emitting diode 40 are respectively electrically connected to the corresponding first electrode layer 31 and the second electrode layer 32;
  • step S105 automatic optical inspection is used to detect whether the first light emitting diode 40 has a defect. Specifically, automatic optical inspection is used to detect whether there is a defective first light emitting diode 400 in the first light emitting diode 40 on the substrate 10;
  • step S107 if there is a defect, the position of the defective first light-emitting diode 400 on the substrate 10 is further detected. Specifically, automatic optical inspection is used to detect the position of the defective first light-emitting diode 400 on the substrate 10;
  • Step S109 short-circuit the first light emitting diode 400 that is detected to be defective.
  • a pair of connecting holes 90 is provided on the side of the defective first light emitting diode 400 away from the second light emitting region 212, and each pair of connecting holes 90 penetrates the insulating layer 60 and exposes the first electrode layer 31 and the second electrode layer 32;
  • a conductive object 50 is used to short-circuit the defective first light emitting diode 400, and one end of the conductive object 50 is connected to the first electrode layer 31 or the second electrode layer 32 through a pair of connecting holes 90 on the side of the defective first light emitting diode 400, and the conductive object 50 The other end of is connected to the first electrode layer 31 or the second electrode layer 32 of the second light-emitting region 212 on the other side of the defective first light-emitting diode 400.
  • the conductive object 50 can be, but is not limited to, metal or conductive adhesive;
  • the pixel sub-region 21 may include a plurality of second light-emitting regions 212 for setting backup options of the second light-emitting diodes 41, please refer to FIG. 11 for details.
  • the first light-emitting area 211 and the second light-emitting area 212 are provided in each pixel sub-area 21, when the first light-emitting diode 40 on the first light-emitting area 211 is damaged or defective, it is directly Use conductive material 50 to short-circuit the defective first light-emitting diode 400, and then set a second light-emitting diode 41 in the second light-emitting area 212 of the same pixel sub-area 21, eliminating the cumbersome steps of laser removing the defective first light-emitting diode 400.
  • the repair efficiency of the LED display module is greatly improved.

Abstract

A light-emitting diode display module (99). The display module (99) comprises: a substrate (10); a plurality of pixel regions (20) that are provided on the substrate (10) at equal intervals, wherein each pixel region (20) is provided with a plurality of pixel sub regions (21) that emit different monochromatic light, and each pixel sub region (21) comprises a first light-emitting region (211) and a second light-emitting region (212); a first electrode layer (31) and a second electrode layer (32) provided on the substrate (10), wherein the positions of the first electrode layer (31) and the second electrode layer (32) correspond to those of the pixel sub regions (21); a first light-emitting diode (40) provided in the first light-emitting region (211); and a second light-emitting diode (41), wherein when the first light-emitting diode (40) cannot be turned on, after the first light-emitting diode (40) is short-circuited, the color of the light emitted by the second light-emitting diode provided in the second light-emitting region (212) is the same as that of the light emitted by the first light-emitting diode (40). In addition, further provided is a repair method for a light-emitting diode display module, and a display device (1000).

Description

一种发光二极管显示模组及其修补方法、以及显示设备Light-emitting diode display module and repair method thereof, and display equipment 技术领域Technical field
本发明涉及微型发光二极管（Micro-LED）技术领域，尤其涉及一种发光二极管显示模组及其修补方法、以及显示设备。The invention relates to the technical field of micro-LEDs (Micro-LED), and in particular to a light-emitting diode display module, a repair method thereof, and a display device.
背景技术Background technique
当微型发光二极管显示背板上的微型发光二极管出现损坏或接触不良等情况时，目前关于缺陷微型发光二极管的修补方法，通常是先用自动光学检测（AOI，Automated Optical Inspection）的方法检测显示背板上缺陷微型发光二极管的位置，再使用激光将缺陷微型发光二极管去除，去除完毕后在相同位置再焊接一个正常发光的微型发光二极管。When the micro-light-emitting diodes on the micro-light-emitting diode display backplane are damaged or have poor contact, the current repair methods for defective micro-light-emitting diodes usually first use the automatic optical inspection (AOI, Automated Optical Inspection) method to detect the display back At the position of the defective micro-light-emitting diode on the board, use a laser to remove the defective micro-light-emitting diode. After the removal is completed, another micro-light-emitting diode that normally emits light is welded at the same position.
通过这种方法对缺陷微型发光二极管进行修补，必须用高功率的激光才能将缺陷微型发光二极管完全去除干净。因此激光在将缺陷微型发光二极管去除的过程中，可能由于功率过高而造成缺陷微型发光二极管下方的焊料（铟和锡）受损，导致后续修补制程困难度增加。在使用激光去除缺陷微型发光二极管后，需再次集中对一定区域的焊料进行加热，才能在原来的位置补充新的微型发光二极管，并通过焊料让微型发光二极管与背板有良好的导通与固定。但是在激光去除焊料较多的情况下，还需要对该位置补充焊料才能让微型发光二极管更好地与背板导通与固定。In this way, the defective micro-light-emitting diode is repaired, and a high-power laser must be used to completely remove the defective micro-light-emitting diode. Therefore, in the process of removing defective micro-LEDs by the laser, the solder (indium and tin) under the defective micro-LEDs may be damaged due to excessive power, which may increase the difficulty of the subsequent repair process. After using the laser to remove the defective micro-LEDs, the solder in a certain area needs to be heated again to supplement the new micro-LEDs in the original position, and the micro-LEDs and the backplane have good conduction and fixation through the solder . However, when the laser removes a lot of solder, it is necessary to add solder to the position to better conduct and fix the micro light-emitting diode with the backplane.
因此，解决在修补过程中激光去除缺陷微型发光二极管时对焊料的影响是亟需克服的问题。Therefore, it is a problem that needs to be overcome urgently to solve the influence on solder when the defective micro-light emitting diode is removed by laser in the repair process.
技术问题technical problem
本发明提供了一种发光二极管显示模组、发光二极管显示模组的修补方法、以及应用该发光二极管显示模组的显示设备，可以提高发光二极管显示模组的修补效率。The invention provides a light emitting diode display module, a repair method of the light emitting diode display module, and a display device using the light emitting diode display module, which can improve the repair efficiency of the light emitting diode display module.
技术解决方案Technical solutions
第一方面，本发明实施例提供一种发光二极管显示模组。所述发光二极管显示模组包括：In the first aspect, an embodiment of the present invention provides a light emitting diode display module. The light emitting diode display module includes:
基板；Substrate
等间隔设置于所述基板上的多个像素区域，每个所述像素区域设置有多个发射不同单色光的像素子区域，每个所述像素子区域包括第一发光区域和第二发光区域；A plurality of pixel regions arranged on the substrate at equal intervals, each of the pixel regions is provided with a plurality of pixel sub-regions emitting different monochromatic light, and each of the pixel sub-regions includes a first light-emitting area and a second light-emitting area. area;
设置于所述基板上的第一电极层和第二电极层，所述第一电极层与所述第二电极层间隔设置于所述基板，且与所述像素子区域位置对应；A first electrode layer and a second electrode layer disposed on the substrate, the first electrode layer and the second electrode layer are disposed on the substrate at intervals and corresponding to the positions of the pixel sub-regions;
设置于所述第一发光区域的第一发光二极管，所述第一发光二极管的第一电极和第二电极分别与对应的所述第一电极层和所述第二电极层电连接；A first light emitting diode arranged in the first light emitting area, the first electrode and the second electrode of the first light emitting diode are electrically connected to the corresponding first electrode layer and the second electrode layer;
当所述第一发光二极管不能点亮时，还包括将所述第一发光二极管短接后，设置在所述第二发光区域与所述第一发光二极管发光颜色相同的第二发光二极管。When the first light-emitting diode cannot be lighted, the method further includes a second light-emitting diode having the same light-emitting color as the first light-emitting diode and arranged in the second light-emitting area after the first light-emitting diode is short-circuited.
第二方面，本发明实施例提供一种发光二极管显示模组的修补方法，所述修补方法包括：In a second aspect, an embodiment of the present invention provides a method for repairing a light-emitting diode display module, the repair method including:
提供基板，所述基板等间隔设置有多个像素区域，每个所述像素区域设置有多个发射不同单色光的像素子区域，每个所述像素子区域包括第一发光区域和第二发光区域，所述第一发光区域设置有第一发光二极管；A substrate is provided, the substrate is provided with a plurality of pixel regions at equal intervals, and each of the pixel regions is provided with a plurality of pixel subregions emitting different monochromatic light, and each of the pixel subregions includes a first light-emitting region and a second light-emitting region. A light-emitting area, the first light-emitting area is provided with a first light-emitting diode;
将检测到存在缺陷的所述第一发光二极管短接；Short-circuit the first light-emitting diode detected to be defective;
在所述第二发光区域设置第二发光二极管，所述第二发光区域处于所述第一发光区域相邻位置，且所述第二发光二极管的发光颜色与所述缺陷第一发光二极管颜色相同。A second light-emitting diode is provided in the second light-emitting area, the second light-emitting area is located adjacent to the first light-emitting area, and the color of the second light-emitting diode is the same as the color of the defective first light-emitting diode .
第三方面，本发明实施例提供一种显示设备。所述显示设备包括外壳、设置于外壳内的显示模组，所述显示模组为如上所述的发光二极管显示模组。In the third aspect, an embodiment of the present invention provides a display device. The display device includes a housing and a display module arranged in the housing, and the display module is the light-emitting diode display module as described above.
有益效果Beneficial effect
上述发光二极管显示模组、修补方法以及显示设备，在同一像素子区域设置了第一发光区域和第二发光区域，当第一发光区域上的第一发光二极管损坏或产生缺陷，无需使用激光的方法去除第一发光二极管，有效解决了在修补过程中激光去除缺陷发光二极管时对焊料的影响，提高修补效率。In the above-mentioned light-emitting diode display module, repair method and display device, the first light-emitting area and the second light-emitting area are arranged in the same pixel sub-area. When the first light-emitting diode on the first light-emitting area is damaged or defective, there is no need to use laser The method removes the first light-emitting diode, which effectively solves the influence of the solder on the solder when the defective light-emitting diode is removed by laser in the repair process, and improves the repair efficiency.
附图说明Description of the drawings
图1为本发明实施例提供的显示设备的示意图。FIG. 1 is a schematic diagram of a display device provided by an embodiment of the present invention.
图2为本发明第一实施例提供的显示模组的俯视图。FIG. 2 is a top view of the display module provided by the first embodiment of the present invention.
图3为本发明第二实施例提供的显示模组的俯视图。FIG. 3 is a top view of the display module provided by the second embodiment of the present invention.
图4为本发明第一实施例提供的显示模组的剖面示意图。4 is a schematic cross-sectional view of the display module provided by the first embodiment of the present invention.
图5为本发明第二实施例提供的显示模组的剖面示意图。5 is a schematic cross-sectional view of the display module provided by the second embodiment of the present invention.
图6为本发明第一实施例提供的修补方法的过程示意图。FIG. 6 is a schematic diagram of the repair method provided by the first embodiment of the present invention.
图7为本发明第二实施例提供的修补方法的过程示意图。FIG. 7 is a schematic diagram of the repair method provided by the second embodiment of the present invention.
图8为本发明第一实施例提供的修补方法过程的剖面示意图。FIG. 8 is a schematic cross-sectional view of the repair method process provided by the first embodiment of the present invention.
图9为本发明第二实施例提供的修补方法过程的剖面示意图。FIG. 9 is a schematic cross-sectional view of the repair method process provided by the second embodiment of the present invention.
图10为本发明实施例提供的修补方法的流程示意图。FIG. 10 is a schematic flowchart of a repair method provided by an embodiment of the present invention.
图11为本发明实施例提供的显示模组的局部俯视图。FIG. 11 is a partial top view of a display module provided by an embodiment of the present invention.
本发明的最佳实施方式The best mode of the present invention
为使得对本发明的内容有更清楚及更准确的理解，现将结合附图详细说明。说明书附图示出本发明的实施例的示例，其中，相同的标号表示相同的元件。可以理解的是，说明书附图示出的比例并非本发明实际实施的比例，其仅为示意说明为目的，并非依照原尺寸作图。In order to have a clearer and more accurate understanding of the content of the present invention, it will now be described in detail with reference to the accompanying drawings. The drawings of the specification show examples of embodiments of the present invention, in which the same reference numerals denote the same elements. It can be understood that the scale shown in the drawings in the specification is not the scale of the actual implementation of the present invention, and is only for illustrative purposes, and is not drawn according to the original size.
请参看图1，其为本发明实施例提供的显示设备1000的示意图。显示设备1000可以为具有显示功能的产品，例如笔记本电脑、平板电脑、显示器、电视机、手机等。显示设备1000包括外壳110、以及设置于外壳内的发光二极管显示模组99。Please refer to FIG. 1, which is a schematic diagram of a display device 1000 according to an embodiment of the present invention. The display device 1000 may be a product with a display function, such as a notebook computer, a tablet computer, a monitor, a television, a mobile phone, and so on. The display device 1000 includes a housing 110 and a light emitting diode display module 99 arranged in the housing.
请结合参看图2和图4，其为本发明第一实施例提供的发光二极管显示模组99的示意图。发光二极管显示模组99包括基板10、多个像素区域20、第一电极层31和第二电极层32、绝缘层60、第一发光二极管40。其中，第一发光二极管40为倒装结构。具体地，第一发光二极管40包括发光部、第一电极和第二电极。发光部包括第一导电半导体层、形成于第一导电半导体层上的活性层、形成于活性层上的第二导电半导体层。第一电极形成于第一导电半导体层远离活性层的一侧，第二电极形成于第二导电半导体层朝向第一电极的一侧。Please refer to FIG. 2 and FIG. 4 in combination, which are schematic diagrams of the light emitting diode display module 99 provided by the first embodiment of the present invention. The light emitting diode display module 99 includes a substrate 10, a plurality of pixel regions 20, a first electrode layer 31 and a second electrode layer 32, an insulating layer 60, and a first light emitting diode 40. Among them, the first light emitting diode 40 has a flip-chip structure. Specifically, the first light emitting diode 40 includes a light emitting part, a first electrode, and a second electrode. The light emitting part includes a first conductive semiconductor layer, an active layer formed on the first conductive semiconductor layer, and a second conductive semiconductor layer formed on the active layer. The first electrode is formed on the side of the first conductive semiconductor layer away from the active layer, and the second electrode is formed on the side of the second conductive semiconductor layer facing the first electrode.
像素区域20等间隔设置于基板10，每个像素区域20有多个发射不同单色光的像素子区域21。每个像素子区域21设置有第一发光区域211和第二发光区域212。The pixel regions 20 are arranged on the substrate 10 at equal intervals, and each pixel region 20 has a plurality of pixel sub-regions 21 emitting different monochromatic light. Each pixel sub-area 21 is provided with a first light-emitting area 211 and a second light-emitting area 212.
第一电极层31和第二电极层32设置于基板10，第一电极层31和第二电极层32间隔设置于基板10，且与像素子区域21位置对应。The first electrode layer 31 and the second electrode layer 32 are disposed on the substrate 10, and the first electrode layer 31 and the second electrode layer 32 are disposed on the substrate 10 at intervals and correspond to the position of the pixel sub-region 21.
绝缘层60设置于基板10并覆盖第一电极层31和第二电极层32，且在与像素子区域21相对应的位置露出第一电极层31和第二电极层32。The insulating layer 60 is disposed on the substrate 10 and covers the first electrode layer 31 and the second electrode layer 32, and exposes the first electrode layer 31 and the second electrode layer 32 at positions corresponding to the pixel sub-region 21.
第一发光二极管40设置于第一发光区域211。具体地，第一发光二极管40的第一电极和第二电极分别与第一电极层31和第二电极层32电连接。即第一发光二极管40的第一电极和第二电极分别通过焊料80与第一电极层31和第二电极层32连接。第一发光二极管40远离第二发光区域212的一侧设置有一对连接孔90，每一对连接孔90贯穿绝缘层60并露出第一电极层31和第二电极层32。连接孔90用于当检测到第一发光二极管40不能点亮时，将第一发光二极管40短接。具体地，每一设置于第一发光二极管40一侧的连接孔90与第一发光二极管40另一侧的电极层30用于连接导电物50，以将第一发光二极管40短接。导电物50由导电材料制成。The first light emitting diode 40 is disposed in the first light emitting area 211. Specifically, the first electrode and the second electrode of the first light emitting diode 40 are electrically connected to the first electrode layer 31 and the second electrode layer 32, respectively. That is, the first electrode and the second electrode of the first light emitting diode 40 are connected to the first electrode layer 31 and the second electrode layer 32 through the solder 80, respectively. A pair of connecting holes 90 is provided on the side of the first light emitting diode 40 away from the second light emitting area 212, and each pair of connecting holes 90 penetrates the insulating layer 60 and exposes the first electrode layer 31 and the second electrode layer 32. The connecting hole 90 is used to short-circuit the first light-emitting diode 40 when it is detected that the first light-emitting diode 40 cannot be lit. Specifically, each connecting hole 90 provided on one side of the first light emitting diode 40 and the electrode layer 30 on the other side of the first light emitting diode 40 are used to connect the conductive object 50 to short the first light emitting diode 40. The conductive object 50 is made of a conductive material.
请结合参看图6、图8和图10，其为本发明第一实施例提供的发光二极管显示模组的修补方法的示意图。发光二极管显示模组的修补方法用于修补发光二极管显示模组99上产生缺陷的发光二极管。修补步骤包括：Please refer to FIG. 6, FIG. 8 and FIG. 10 in combination, which are schematic diagrams of the repair method of the light-emitting diode display module according to the first embodiment of the present invention. The repairing method of the LED display module is used to repair the defective LEDs on the LED display module 99. The repair steps include:
步骤S101，涂布绝缘层60于基板10并覆盖间隔设置于基板10的第一电极层31和第二电极层32。其中，绝缘层60在像素子区域21相对应的位置露出第一电极层31和第二电极层32；Step S101, coating the insulating layer 60 on the substrate 10 and covering the first electrode layer 31 and the second electrode layer 32 spaced apart on the substrate 10. Wherein, the insulating layer 60 exposes the first electrode layer 31 and the second electrode layer 32 at positions corresponding to the pixel sub-region 21;
步骤S103，提供基板10。其中，基板10等间隔设置有多个像素区域20，每个像素区域20设置有多个发射不同单色光的像素子区域21，每个像素子区域21包括第一发光区域211和第二发光区域212。第一发光区域211设置有第一发光二极管40，其中，第一发光二极管40的第一电极和第二电极分别与对应的第一电极层31和第二电极层32电连接；In step S103, the substrate 10 is provided. Wherein, the substrate 10 is provided with a plurality of pixel regions 20 at equal intervals, and each pixel region 20 is provided with a plurality of pixel subregions 21 emitting different monochromatic light. Each pixel subregion 21 includes a first light-emitting region 211 and a second light-emitting region. Area 212. The first light-emitting area 211 is provided with a first light-emitting diode 40, wherein the first electrode and the second electrode of the first light-emitting diode 40 are respectively electrically connected to the corresponding first electrode layer 31 and the second electrode layer 32;
步骤S105，利用自动光学检测检测第一发光二极管40是否存在缺陷。具体地，利用自动光学检测检测基板10上的第一发光二极管40中是否存在缺陷第一发光二极管400；In step S105, automatic optical inspection is used to detect whether the first light emitting diode 40 has a defect. Specifically, automatic optical inspection is used to detect whether there is a defective first light emitting diode 400 in the first light emitting diode 40 on the substrate 10;
步骤S107，若存在缺陷，则进一步检测存在缺陷的第一发光二极管400在基板10上的位置。具体地，使用自动光学检测检测缺陷第一发光二极管400在基板10的位置；In step S107, if there is a defect, the position of the defective first light-emitting diode 400 on the substrate 10 is further detected. Specifically, automatic optical inspection is used to detect the position of the defective first light-emitting diode 400 on the substrate 10;
步骤S109，将检测到存在缺陷的第一发光二极管400短接。具体地，设置一对连接孔90于缺陷第一发光二极管400远离第二发光区域212的一侧，每一对连接孔90贯穿绝缘层60并露出第一电极层31和第二电极层32；使用导电物50将缺陷第一发光二极管400短接，导电物50的一端通过缺陷第一发光二极管400一侧的一对连接孔90连接第一电极层31或第二电极层32，导电物50的另一端连接缺陷第一发光二极管400另一侧的第二发光区域212的第一电极层31或第二电极层32。其中，导电物50可以为但不限于金属、导电胶材；Step S109, short-circuit the first light emitting diode 400 that is detected to be defective. Specifically, a pair of connecting holes 90 is provided on the side of the defective first light emitting diode 400 away from the second light emitting region 212, and each pair of connecting holes 90 penetrates the insulating layer 60 and exposes the first electrode layer 31 and the second electrode layer 32; A conductive object 50 is used to short-circuit the defective first light emitting diode 400, and one end of the conductive object 50 is connected to the first electrode layer 31 or the second electrode layer 32 through a pair of connecting holes 90 on the side of the defective first light emitting diode 400, and the conductive object 50 The other end of is connected to the first electrode layer 31 or the second electrode layer 32 of the second light-emitting region 212 on the other side of the defective first light-emitting diode 400. Wherein, the conductive object 50 can be, but is not limited to, metal or conductive adhesive;
步骤S111，在第二发光区域212设置第二发光二极管41。其中，第二发光区域212处于第一发光区域211相邻位置。具体地，第二发光二极管41为倒装结构，包括第一电极和第二电极。第二发光二极管41的第一电极和第二电极分别与第一电极层31和第二电极层32电连接，即第二发光二极管41的第一电极和第二电极分别通过焊料80与第一电极层31和第二电极层32连接。第二发光二极管41的发光颜色与缺陷第一发光二极管400颜色相同。In step S111, the second light emitting diode 41 is arranged in the second light emitting area 212. Among them, the second light-emitting area 212 is located adjacent to the first light-emitting area 211. Specifically, the second light emitting diode 41 has a flip-chip structure and includes a first electrode and a second electrode. The first electrode and the second electrode of the second light-emitting diode 41 are electrically connected to the first electrode layer 31 and the second electrode layer 32, respectively, that is, the first electrode and the second electrode of the second light-emitting diode 41 are respectively connected to the first electrode layer 31 and the second electrode through the solder 80. The electrode layer 31 and the second electrode layer 32 are connected. The light-emitting color of the second light-emitting diode 41 is the same as the color of the defective first light-emitting diode 400.
请结合参看图3和图5，其为本发明第二实施例提供的发光二极管显示模组999的示意图。第二实施例提供的发光二极管显示模组999与第一实施例提供的发光二极管显示模组99的差异在于，第二实施例提供的发光二极管显示模组999的第一发光二极管40两侧分别设置有一对连接孔90，连接孔90贯穿绝缘层60并露出第一电极层31和第二电极层32。具体地，当检测到第一发光二极管40不能点亮时，每一设置于第一发光二极管40一侧的连接孔90与第一发光二极管40另一侧的连接孔90用于连接导电物50，以将第一发光二极管40短接。发光二极管显示模组999的其他结构与发光二极管显示模组99的基本一致，在此不再赘述。Please refer to FIG. 3 and FIG. 5 in combination, which are schematic diagrams of the light emitting diode display module 999 provided by the second embodiment of the present invention. The difference between the LED display module 999 provided in the second embodiment and the LED display module 99 provided in the first embodiment is that the two sides of the first LED 40 of the LED display module 999 provided in the second embodiment are respectively A pair of connection holes 90 are provided, and the connection holes 90 penetrate the insulating layer 60 and expose the first electrode layer 31 and the second electrode layer 32. Specifically, when it is detected that the first light emitting diode 40 cannot be lit, each connecting hole 90 provided on one side of the first light emitting diode 40 and the connecting hole 90 on the other side of the first light emitting diode 40 are used to connect the conductive object 50 , To short-circuit the first light emitting diode 40. The other structures of the LED display module 999 are basically the same as those of the LED display module 99, and will not be repeated here.
请结合参看图7、图9和图10，其为本发明第二实施例提供的发光二极管显示模组的修补方法的示意图。发光二极管显示模组的修补方法用于修补发光二极管显示模组999上产生缺陷的发光二极管。第二实施例提供的发光二极管显示模组的修补方法与第一实施例提供的发光二极管显示模组的修补方法的差异在于，第二实施例提供的发光二极管显示模组的修补方法中，将检测到存在缺陷的第一发光二极管400短接具体包括：Please refer to FIG. 7, FIG. 9 and FIG. 10 in combination, which are schematic diagrams of the repair method of the light-emitting diode display module according to the second embodiment of the present invention. The repairing method of the LED display module is used to repair the defective LEDs on the LED display module 999. The difference between the repair method of the light emitting diode display module provided in the second embodiment and the repair method of the light emitting diode display module provided in the first embodiment is that in the repair method of the light emitting diode display module provided in the second embodiment, The short-circuiting of the first light-emitting diode 400 detected to be defective specifically includes:
分别设置一对连接孔90于缺陷发光二极管400两侧，每一对连接孔90贯穿绝缘层60并露出第一电极层31和第二电极层32；使用导电物50将缺陷第一发光二极管400短接，导电物50的一端通过缺陷第一发光二极管400一侧的一对连接孔90连接第一电极层31或第二电极层32，导电物50的另一端通过缺陷第一发光二极管400另一侧的一对连接孔90连接第一电极层31或第二电极层32。A pair of connecting holes 90 are respectively provided on both sides of the defective light emitting diode 400, and each pair of connecting holes 90 penetrates the insulating layer 60 and exposes the first electrode layer 31 and the second electrode layer 32; Short-circuit, one end of the conductive object 50 is connected to the first electrode layer 31 or the second electrode layer 32 through a pair of connecting holes 90 on the side of the defective first light emitting diode 400, and the other end of the conductive object 50 is connected to the other through the defective first light emitting diode 400. A pair of connecting holes 90 on one side connects the first electrode layer 31 or the second electrode layer 32.
第二实施例提供的发光二极管显示模组的修补方法修补缺陷发光二极管400的其他过程与第一实施例提供的发光二极管显示模组的修补方法的基本一致，在此不再赘述。The repairing method of the light-emitting diode display module provided by the second embodiment is basically the same as the repairing method of the light-emitting diode display module provided by the first embodiment, and the rest of the process of repairing the defective light-emitting diode 400 is basically the same, and will not be repeated here.
在一些可行的实施例中，像素子区域21可包括多个第二发光区域212，用于设置第二发光二极管41的备用选择，具体请参看图11。In some feasible embodiments, the pixel sub-region 21 may include a plurality of second light-emitting regions 212 for setting backup options of the second light-emitting diodes 41, please refer to FIG. 11 for details.
在上述实施例中，由于在每个像素子区域21设置了第一发光区域211和第二发光区域212，当第一发光区域211上的第一发光二极管40出现损坏现象或产生缺陷时，直接使用导电物50将缺陷第一发光二极管400短路，再在同一像素子区域21的第二发光区域212设置一个第二发光二极管41，免去了激光去除缺陷第一发光二极管400的繁琐步骤，极大地提高了发光二极管显示模组地修补效率。In the above-mentioned embodiment, since the first light-emitting area 211 and the second light-emitting area 212 are provided in each pixel sub-area 21, when the first light-emitting diode 40 on the first light-emitting area 211 is damaged or defective, it is directly Use conductive material 50 to short-circuit the defective first light-emitting diode 400, and then set a second light-emitting diode 41 in the second light-emitting area 212 of the same pixel sub-area 21, eliminating the cumbersome steps of laser removing the defective first light-emitting diode 400. The repair efficiency of the LED display module is greatly improved.
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘且本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. In this way, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies, the present invention is also intended to include these modifications and variations.
以上所列举的仅为本发明较佳实施例而已，当然不能以此来限定本发明之权力范围，因此依本发明权利要求所作的等同变化，仍属于本发明所涵盖的范围。The above-listed are only preferred embodiments of the present invention, which of course cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention still fall within the scope of the present invention.

Claims (1)

  1. 一种发光二极管显示模组，其特征在于，所述发光二极管显示模组包括：A light-emitting diode display module, characterized in that the light-emitting diode display module includes:
    基板；Substrate
    等间隔设置于所述基板上的多个像素区域，每个所述像素区域设置有多个发射不同单色光的像素子区域，每个所述像素子区域包括第一发光区域和第二发光区域；A plurality of pixel regions arranged on the substrate at equal intervals, each of the pixel regions is provided with a plurality of pixel sub-regions emitting different monochromatic light, and each of the pixel sub-regions includes a first light-emitting area and a second light-emitting area. area;
    设置于所述基板上的第一电极层和第二电极层，所述第一电极层与所述第二电极层间隔设置于所述基板，且与所述像素子区域位置对应；A first electrode layer and a second electrode layer disposed on the substrate, the first electrode layer and the second electrode layer are disposed on the substrate at intervals and corresponding to the positions of the pixel sub-regions;
    设置于所述第一发光区域的第一发光二极管，所述第一发光二极管的第一电极和第二电极分别与对应的所述第一电极层和所述第二电极层电连接；A first light emitting diode arranged in the first light emitting area, the first electrode and the second electrode of the first light emitting diode are electrically connected to the corresponding first electrode layer and the second electrode layer;
    当所述第一发光二极管不能点亮时，还包括将所述第一发光二极管短接后，设置在所述第二发光区域与所述第一发光二极管发光颜色相同的第二发光二极管。When the first light-emitting diode cannot be lighted, the method further includes a second light-emitting diode having the same light-emitting color as the first light-emitting diode and arranged in the second light-emitting area after the first light-emitting diode is short-circuited.
     To
    2.如权利要求1所述的显示模组，其特征在于，所述第一发光二极管和第二发光二极管为倒装结构，所述第一发光二极管和第二发光二极管包括发光部、第一电极和第二电极，所述发光部包括第一导电半导体层、形成于所述第一导电半导体层上的活性层、形成于所述活性层上的第二导电半导体层，所述第一电极形成于所述第一导电半导体层远离所述活性层的一侧，所述第二电极形成于所述第二导电半导体层朝向第一电极的一侧。2. The display module of claim 1, wherein the first light-emitting diode and the second light-emitting diode have a flip-chip structure, and the first light-emitting diode and the second light-emitting diode include a light-emitting part, a first light-emitting diode, and a first light-emitting diode. An electrode and a second electrode, the light-emitting portion includes a first conductive semiconductor layer, an active layer formed on the first conductive semiconductor layer, a second conductive semiconductor layer formed on the active layer, the first electrode The second electrode is formed on the side of the first conductive semiconductor layer away from the active layer, and the second electrode is formed on the side of the second conductive semiconductor layer facing the first electrode.
     To
    3.如权利要求1所述的显示模组，其特征在于，所述显示模组还包括：3. The display module of claim 1, wherein the display module further comprises:
    绝缘层，所述绝缘层设置于所述基板并覆盖所述第一电极层和所述第二电极层，且在与所述像素子区域相对应的位置露出所述第一电极层和所述第二电极层。The insulating layer is disposed on the substrate and covers the first electrode layer and the second electrode layer, and exposes the first electrode layer and the second electrode layer at a position corresponding to the pixel sub-region. The second electrode layer.
     To
    4.如权利要求1所述的显示模组，其特征在于，所述第一发光二极管远离所述第二发光区域的一侧设置有一对连接孔，所述每一对连接孔贯穿所述绝缘层并露出所述第一电极层和所述第二电极层，每一设置于所述第一发光二极管一侧的所述连接孔与所述第一发光二极管另一侧的所述电极层用于连接导电物以将所述第一发光二极管短接。4. The display module of claim 1, wherein a pair of connecting holes is provided on a side of the first light-emitting diode away from the second light-emitting area, and each pair of connecting holes penetrates the insulation Layer and expose the first electrode layer and the second electrode layer, each of the connection holes provided on one side of the first light emitting diode and the electrode layer on the other side of the first light emitting diode are used A conductive object is connected to short-circuit the first light-emitting diode.
     To
    5.如权利要求1所述的显示模组，其特征在于，所述第一发光二极管两侧分别设置有一对连接孔，所述每一对连接孔贯穿所述绝缘层并露出所述第一电极层和所述第二电极层，每一设置于所述第一发光二极管一侧的所述连接孔与每一设置于所述第一发光二极管另一侧的所述连接孔用于连接导电物以将所述第一发光二极管短接。5. The display module of claim 1, wherein a pair of connecting holes are respectively provided on both sides of the first light emitting diode, and each pair of connecting holes penetrates the insulating layer and exposes the first light emitting diode. The electrode layer and the second electrode layer, each of the connecting holes provided on one side of the first light-emitting diode and each of the connecting holes provided on the other side of the first light-emitting diode are used for connecting conductive The object is to short-circuit the first light-emitting diode.
     To
    6.一种发光二极管显示模组的修补方法，其特征在于，所述修补方法包括：6. A repair method for a light emitting diode display module, characterized in that the repair method includes:
    提供基板，所述基板等间隔设置有多个像素区域，每个所述像素区域设置有多个发射不同单色光的像素子区域，每个所述像素子区域包括第一发光区域和第二发光区域，所述第一发光区域设置有第一发光二极管；A substrate is provided, the substrate is provided with a plurality of pixel regions at equal intervals, and each of the pixel regions is provided with a plurality of pixel subregions emitting different monochromatic light, and each of the pixel subregions includes a first light-emitting region and a second light-emitting region. A light-emitting area, the first light-emitting area is provided with a first light-emitting diode;
    将检测到存在缺陷的所述第一发光二极管短接；Short-circuit the first light-emitting diode detected to be defective;
    在所述第二发光区域设置第二发光二极管，所述第二发光区域处于所述第一发光区域相邻位置，且所述第二发光二极管的发光颜色与所述缺陷第一发光二极管颜色相同。A second light-emitting diode is provided in the second light-emitting area, the second light-emitting area is located adjacent to the first light-emitting area, and the light-emitting color of the second light-emitting diode is the same as the color of the defective first light-emitting diode .
     To
    7.如权利要求6所述的修补方法，其特征在于，所述将检测到存在缺陷的所述第一发光二极管短接之前还包括步骤：7. The repair method according to claim 6, characterized in that, before the short-circuiting of the first light-emitting diode detected to have a defect, the method further comprises the step of:
    利用自动光学检测检测所述第一发光二极管是否存在缺陷；Using automatic optical inspection to detect whether the first light-emitting diode has a defect;
    若存在缺陷，则进一步检测存在缺陷的所述第一发光二极管在所述基板上的位置。If there is a defect, further detecting the position of the defective first light-emitting diode on the substrate.
     To
    8.如权利要求6所述的修补方法，其特征在于，所述提供基板之前还包括步骤：8. The repair method according to claim 6, characterized in that, before said providing the substrate, the method further comprises the following steps:
    涂布绝缘层于所述基板并覆盖第一电极层和第二电极层，其中，所述第一电极层和所述第二电极层间隔设置于所述基板，所述绝缘层在与所述像素子区域相对应的位置露出所述第一电极层和所述第二电极层。Coating an insulating layer on the substrate and covering the first electrode layer and the second electrode layer, wherein the first electrode layer and the second electrode layer are disposed on the substrate at intervals, and the insulating layer is in contact with the The position corresponding to the pixel sub-region exposes the first electrode layer and the second electrode layer.
     To
    9.如权利要求8所述的修补方法，其特征在于，所述将检测到存在缺陷的所述第一发光二极管短接具体包括：9. The repair method according to claim 8, wherein the short-circuiting the first light-emitting diode detected to have a defect specifically comprises:
    设置一对连接孔于所述缺陷第一发光二极管远离所述第二发光区域的一侧，其中，所述每一对连接孔贯穿所述绝缘层并露出所述第一电极层和所述第二电极层；A pair of connecting holes is provided on the side of the defective first light-emitting diode away from the second light-emitting area, wherein each pair of connecting holes penetrates the insulating layer and exposes the first electrode layer and the first electrode layer. Two electrode layer
    使用导电物将所述缺陷第一发光二极管短接，其中，所述导电物的一端通过所述缺陷第一发光二极管一侧的所述一对连接孔连接所述第一电极层或所述第二电极层，另一端连接所述缺陷第一发光二极管另一侧的所述第二发光区域的所述第一电极层或所述第二电极层。Use a conductive object to short-circuit the defective first light-emitting diode, wherein one end of the conductive object is connected to the first electrode layer or the first electrode layer through the pair of connection holes on the side of the defective first light-emitting diode. Two electrode layers, the other end of which is connected to the first electrode layer or the second electrode layer of the second light-emitting area on the other side of the defective first light-emitting diode.
     To
    10.如权利要求8所述的修补方法，其特征在于，所述将检测到存在缺陷的所述第一发光二极管短接还包括：10. The repair method of claim 8, wherein the short-circuiting the first light-emitting diode detected to have a defect further comprises:
    分别设置一对连接孔于所述缺陷第一发光二极管两侧，其中，所述每一对连接孔贯穿所述绝缘层并露出所述第一电极层和所述第二电极层；Respectively disposing a pair of connecting holes on both sides of the defective first light emitting diode, wherein each pair of connecting holes penetrates the insulating layer and exposes the first electrode layer and the second electrode layer;
    使用导电物将所述缺陷第一发光二极管短接，其中，所述导电物的一端通过所述缺陷第一发光二极管一侧的所述一对连接孔连接所述第一电极层或所述第二电极层，另一端通过所述缺陷第一发光二极管另一侧的所述一对连接孔连接所述第一电极层或所述第二电极层。Use a conductive object to short-circuit the defective first light emitting diode, wherein one end of the conductive object is connected to the first electrode layer or the first electrode layer through the pair of connection holes on the side of the defective first light emitting diode. Two electrode layers, the other end of which is connected to the first electrode layer or the second electrode layer through the pair of connection holes on the other side of the defective first light emitting diode.
     To
    11.如权利要求8所述的修补方法，其特征在于，所述在所述第二发光区域设置第二发光二极管具体包括：11. The repair method of claim 8, wherein the arranging a second light-emitting diode in the second light-emitting area specifically comprises:
    将所述第二发光二极管的第一电极和第二电极分别与对应的所述第一电极层和所述第二电极层电连接。The first electrode and the second electrode of the second light emitting diode are electrically connected to the corresponding first electrode layer and the second electrode layer, respectively.
     To
    12.一种显示设备，所述显示设备包括外壳、设置于外壳内的显示模组，其特征在于，所述显示模组为如权利要求1~5任意一项所述的发光二极管显示模组。12. A display device comprising a housing and a display module arranged in the housing, wherein the display module is the light-emitting diode display module according to any one of claims 1 to 5 .
PCT/CN2019/130524 2019-12-31 2019-12-31 Light-emitting diode display module and repair method therefor, and display device WO2021134487A1 (en)

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