KR100609776B1 - Chip on glass typed organic electroluminescent cell - Google Patents

Abstract

The present invention relates to a seedage-type organic electroluminescent cell which prevents damage to pads upon detection of pixel defects and prevents cuts from being shorted after being cut by a laser. The seedage type organic electroluminescent cell includes indium tin oxide layers, metal electrode layers, data line integrated circuit parts, data line cut parts, data line connectors, scan line integrated circuit parts, scan line cut parts, and scan line connections. do. The indium tin oxide layers intersect the metal electrode layers, and light emitting pixels are formed in the intersecting regions. The data line integrated circuit units are respectively coupled to the indium tin oxide layers. The data line cutouts are respectively coupled to the data line integrated circuit parts and each has a data line conductive layer and a data line insulating film partially deposited thereon. The data line connection unit connects the data line cutouts. The scan line integrated circuit units are respectively coupled to the metal electrode layers. The scan line cutouts are respectively coupled to the scan line integrated circuit parts and each has a scan line conductive layer and a scan line insulating film partially deposited thereon. The scan line connection unit connects the scan line cutouts. In the seed-type organic electroluminescent cell, since the cut portions include an insulating layer on the conductive layer, a short circuit does not occur even when the cut portions are cut by the laser and then connected to the integrated circuit chip.

Luminous Cells, Pixels, COG

Description

CIO type organic electroluminescent cell {CHIP ON GLASS TYPED ORGANIC ELECTROLUMINESCENT CELL}

1A is a plan view showing a substrate having conventional organic electroluminescent cells.

FIG. 1B is an enlarged plan view of portion A of FIG. 1A.

FIG. 2A is a plan view illustrating a substrate including seedage-type organic electroluminescent cells according to a preferred embodiment of the present invention.

FIG. 2B is an enlarged plan view of a portion B of FIG. 2A.

3A is a cross-sectional view illustrating the data line cutout of FIG. 2B.

3B and 3C are plan views illustrating an ACF bonding process.

4 is a plan view schematically illustrating the cell unit of FIG. 2B.

FIG. 5 is a plan view illustrating a seed-edge organic electroluminescent cell according to another exemplary embodiment of the present invention. FIG.

The present invention relates to a seedage-type organic electroluminescent cell, and more particularly, a seedage that prevents pads from being damaged when detecting a pixel defect and prevents cuts from being shorted when combined with an integrated circuit chip after being cut by a laser. It relates to a type organic electroluminescent cell.

An organic electroluminescent cell means a cell that generates light of a predetermined wavelength. The organic electroluminescent cell includes a chip on film type organic electroluminescent cell (COF typed organic electroluminescent cell) and a seed on organic type electroluminescent cell (cog on glass typed organic electroluminescent cell, cog type organic electroluminescent cell). ).

In the CFC type organic electroluminescent cell, an integrated circuit chip having a driving circuit for driving the cell is connected to pads of the cell outside the cell. On the other hand, in the seed-type organic electroluminescent cell, the integrated circuit chip is connected with pads of the cell on the cell. Therefore, the CFP organic electroluminescent cell is bulkier than the CIO type organic electroluminescent cell and requires a lot of cost for fabrication, and thus, implementation of a cergy type organic electroluminescent cell is required. However, CFO type organic electroluminescent cells have been required to be improved due to the following problems. Detailed description thereof will be described below with reference to the accompanying drawings.

1A is a plan view showing a substrate having conventional organic electroluminescent cells.

Referring to FIG. 1A, the substrate includes a plurality of organic electroluminescent cells, and each of the organic electroluminescent cells includes indium tin oxide layers, metal electrode layers, data line pads, and scan line pads. Detailed description thereof will be described below with reference to the accompanying drawings.

FIG. 1B is an enlarged plan view of portion A of FIG. 1A.

Referring to FIG. 1B, the organic electroluminescent cell includes a cell unit 10, data line pads 30, first scan line pads 50, and second scan line pads 70.

The cell unit 10 includes a plurality of indium tin oxide layers and metal electrode layers, and has a plurality of pixels in a region where the indium tin oxide layers and the metal electrode layers intersect.

The data line pads 30 are respectively coupled to the indium tin oxide layers, and provide the indium tin oxide layers with a predetermined voltage applied through predetermined pins of the fail detection device when detecting pixel defects.

First scan line pads 50 are respectively coupled to some of the metal electrode layers of the metal electrode layers, and provide a predetermined voltage applied to the some metal electrode layers through predetermined pins of the failure detection apparatus.

The second scan line pads 70 are respectively coupled to the remaining metal electrode layers of the metal electrode layers, and provide the remaining metal electrode layers with a predetermined voltage applied through predetermined pins of the failure detection apparatus.

Hereinafter, the CFO type organic electroluminescent cell and the CIO type organic electroluminescent cell will be compared.

In detecting pixel defects, defects of pixels were detected by using connections connecting pads in the CFC type organic electroluminescent cell. Subsequently, end portions of the pads were cut using a scribing blade to connect the integrated circuit chip and the pads. This was possible because the connecting portions are formed outside of the cell in the CS type organic electroluminescent cell.

On the other hand, in the seed-type organic electroluminescent cell, connecting parts connecting pads could not be formed on the cell for pixel defect detection. When the pixel defects are detected by forming the connecting portions connecting the pads, the end portions of the pads must be cut by using a scribing blade to connect the integrated circuit chip and the pads after the pixel defect is detected. . However, in the case of the scribing process using the scribing blade, the substrate should be cut into the entire horizontal / vertical whole, and thus the seed paper organic electroluminescent cell may be cut by the scribing blade due to its structural characteristics. There was no.

Thus, an organic electroluminescent cell in which pads are cut by using a laser has been developed. Specifically, in the organic electroluminescent cell, connections are formed between the data line pads 30 and the scan line pads 50 and 70, and the pads 30 are formed by the laser when combined with the integrated circuit chip. , 50 and 70) were cut. However, in this case, a short circuit may occur in an ACF bonding process connecting the integrated circuit chip and the pads 30, 50, and 70 after cutting by the laser. Therefore, there is a need for a seedage organic electroluminescent cell capable of preventing the short circuit.

 It is an object of the present invention to provide a seedage type organic electroluminescent cell in which a short circuit is prevented after the connection between the pads and the connecting portions is cut by the laser.

In order to achieve the object as described above, the sea-geo type organic electroluminescent cell according to a preferred embodiment of the present invention is indium tin oxide layers, metal electrode layers, data line integrated circuits, data line cutouts, data lines Connections, scan line integrated circuits, scan line cutouts and scan line connections. The indium tin oxide layers intersect the metal electrode layers, and light emitting pixels are formed in the intersecting regions. The data line integrated circuit units are respectively coupled to the indium tin oxide layers. The data line cutouts are respectively coupled to the data line integrated circuit parts and each has a data line conductive layer and a data line insulating film partially deposited thereon. The data line connection unit connects the data line cutouts. The scan line integrated circuit units are respectively coupled to the metal electrode layers. The scan line cutouts are respectively coupled to the scan line integrated circuit parts and each has a scan line conductive layer and a scan line insulating film partially deposited thereon. The scan line connection unit connects the scan line cutouts.

According to another preferred embodiment of the present invention, the sea-gauge organic electroluminescent cell may include indium tin oxide layers, metal electrode layers, data line integrated circuit units, data line cutting units, data line connectors, first scan line integrated circuit units, And first scan line cutouts, first scan line cutouts, second scan line integrated circuits, second scan line cutouts, and second scan line cutouts. The indium tin oxide layers and the metal layers intersect, and light emitting pixels are formed in the intersecting regions. The data line integrated circuit units are respectively coupled to the indium tin oxide layers. The data line cutouts are respectively coupled to the data line integrated circuit parts and each has a data line conductive layer and a data line insulating film partially deposited thereon. The data line connection unit connects the data line integrated circuit units. The first scan line integrated circuit units are respectively coupled to some of the metal electrode layers. The first scan line cutouts are respectively coupled to the first scan line integrated circuit portions, each having a first scan line conductive layer and a first scan line insulating film partially deposited thereon. The first scan line connection unit connects the first scan line cutouts. The second scan line integrated circuit units are respectively coupled to the remaining metal electrode layers of the metal electrode layers. The second scan line cutouts are respectively coupled to the second scan line integrated circuit portions and each has a second scan line conductive layer and a second scan line insulating film partially deposited thereon. The second scan line connection unit connects the second scan line cutouts.

In the seed-type organic electroluminescent cell according to the present invention, since the cutouts include an insulating film on the conductive layer, a short circuit does not occur even when the cutouts are cut by the laser and then connected to the integrated circuit chip.

Hereinafter, with reference to the accompanying drawings will be described in detail preferred embodiments of the sea-gauge organic electroluminescent cell according to the present invention.

FIG. 2A is a plan view illustrating a substrate including seedage-type organic electroluminescent cells according to a preferred embodiment of the present invention.

Referring to FIG. 2A, the substrate includes a plurality of cells, wherein each of the cells includes a cell unit, data line pads, data line connectors, data line electrode units, first scan line pads, first scan line connectors, and a first cell. And a first scan line electrode part, second scan line pads, a second scan line connection part, and a second scan line electrode part. Detailed description thereof will be described below with reference to the accompanying drawings.

FIG. 2B is an enlarged plan view of a portion B of FIG. 2A.

Referring to FIG. 2B, the organic electroluminescent cell of the present invention includes the cell unit 110, the data line pads 130, the data line connection unit 150, the data line electrode unit 170, and the first scan line pads 190. ), The first scan line connection unit 210, the first scan line electrode unit 230, the second scan line pads 250, the second scan line connection unit 270, and the second scan line electrode unit 290. Include.

The cell unit 110 includes pixels formed in a region where indium tin oxide layers (hereinafter, referred to as “ITO layers”) and the metal electrode layers intersect.

Each of the pixels includes the ITO layer, the organic material layer, and the metal electrode layer, which are sequentially stacked, and generate light having a predetermined wavelength when a positive voltage is applied to the ITO layer and a negative voltage is applied to the metal electrode layer.

The organic layer may include a hole injection layer (HIL), a hole transporting layer (HTL), an emission layer (ETL), an electron transporting layer (ETL), and an electron injection layer (ETL). EIL). Alternatively, the organic material layer includes only the hole transport layer, the light emitting layer, and the electron transport layer.

The data line pads 130 include data line integrated circuit units 130a and data line cutouts 130b.

The data line integrated circuit units 130a are coupled to the ITO layers, and the data line integrated circuit units 130a are connected to the ITO layers through the data line electrode unit 170, the data line connection unit 150, and the data line cutouts 130b from an external defect detection device. Provide a predetermined voltage applied to the ITO layers. As a result, when the voltage is a positive voltage, the ITO layers provide holes to the organic material layer. In addition, the data line integrated circuit units 130a are connected to an integrated circuit chip having a driving circuit. However, since the light emitting cell of the present invention is a chip on glass type organic electroluminescent cell (COG typed organic electroluminescent cell), the integrated circuit chip is a chip on film type organic electroluminescent cell, Unlike the COF typed organic electroluminescent cell, the organic light emitting cell is connected to the data line integrated circuit units 130a.

The data line cutouts 130b are coupled between the data line integrated circuit units 130a and the data line connectors 150 and include a data line conductive layer, which is a conductor, and data line insulating films partially deposited thereon, and have pixel defects. After detection, portions between the data line insulating films are cut by the laser. Detailed description thereof will be described below with reference to the accompanying drawings. In addition, the data line cutouts 130b provide the data line integrated circuit units 130a with a voltage applied from the failure detection device through the data line electrode unit 170 and the data line connection unit 150. Therefore, the cut portion of the data line cutouts 130b is a material that is easily cut by the laser, and the data line cutouts 130b are made of metal or indium such as chromium (Cr), aluminum (Al), or molybdenum (Mo). It consists of a tin oxide layer.

The data line connector 150 connects the data line pads 130 and is shorted as a conductor. Therefore, the data line connector 150 equally provides the data line pads 130 with the voltage applied from the failure detection device through the data line electrode unit 170.

When the data line electrode unit 170 detects a pixel defect, a predetermined pin of the defect detection apparatus contacts the predetermined pin to apply a predetermined voltage, and the applied voltage is applied to the data line connection unit 150 and the data line pads 130. It is provided to the ITO layer through. Therefore, the data line electrode portion 170 is a conductor, for example, metal.

The first scan line pads 190 include first scan line integrated circuit units 190a and first scan line cutouts 190b.

The first scan line integrated circuit parts 190a are coupled to some of the metal electrode layers of the metal electrode layers, and the first scan line electrode 230 and the first scan line connector 210 are connected to the first scan line electrode 230 from the failure detection device when pixel defects are detected. ) And a predetermined voltage applied through the first scan line cutouts 190b to the metal electrode layers. As a result, when the voltage is a negative voltage, the some metal electrode layers provide electrons to the organic layer. In addition, the first scan line integrated circuit units 190a are connected to an integrated circuit chip having a driving circuit.

The first scan line cutouts 190b are coupled between the first scan line integrated circuit units 190a and the first scan line connection unit 210, and have a first scan line conductive layer, which is a conductor, and a partially deposited thereon. 1 scan line insulating films, wherein a portion between the first scan line insulating films is cut by a laser after pixel defect detection. Detailed description thereof will be described below with reference to the accompanying drawings. In addition, the first scan line cutouts 190b provide the first scan line integrated circuit units 190a with a voltage applied from the failure detection apparatus through the first scan line electrode unit 230. Therefore, a portion of the first scan line cutouts 190b that is cut may be a material that is easily cut by a laser, for example, the first scan line cuts 190b may include chromium (Cr), aluminum (Al), or molybdenum ( It is formed of a metal or indium tin oxide layer such as Mo).

The first scan line connector 210 connects the first scan line pads 190 and is short-circuited as a conductor. Therefore, the first scan line connection unit 210 equally provides the first scan line pads 190 with the voltage applied from the failure detection device through the first scan line electrode unit 230.

When the first scan line electrode unit 230 detects a pixel defect, a predetermined pin of the defect detection device contacts the predetermined pin to apply a predetermined voltage, and the applied voltage is applied to the first scan line connection unit 210 and the first scan. The metal pads may be provided to the metal electrode layers through line pads 190. Therefore, the first scan line electrode portion 230 is a conductor, for example, metal.

 The second scan line pads 250 include second scan line integrated circuit portions 250a and second scan line cutouts 250b.

The second scan line integrated circuit units 250a are coupled to the remaining metal electrode layers of the metal electrode layers. For example, when the first scan line pads 190 are coupled to odd-numbered metal electrode layers of the metal electrode layers, the second scan line integrated circuit units 250a may be even-numbered metal electrode layers of the metal electrode layers. Is coupled to. In addition, the second scan line integrated circuit units 250a may include the second scan line electrode unit 290, the second scan line connection unit 270, and the second scan line cutouts 250b from the defect detection apparatus when the pixel defect is detected. Predetermined voltage applied through the remaining metal electrode layers is provided. As a result, when the voltage is a negative voltage, the remaining metal electrode layers provide electrons to the organic layer. In addition, the second scan line integrated circuit units 250a are connected to an integrated circuit chip having a driving circuit.

The second scan line cutouts 250b are coupled between the second scan line integrated circuit portions 250a and the second scan line connection 270, and have a second scan line conductive layer, which is a conductor, and a partially deposited thereon. 2 scan line insulating films, wherein a portion between the second scan line insulating films is cut by a laser after pixel defect detection. Detailed description thereof will be described below with reference to the accompanying drawings. In addition, the second scan line cutouts 250b provide the second scan line integrated circuit units 250a with a voltage applied from the failure detection apparatus through the second scan line electrode unit 290. Therefore, a material in which the cut portion of the second scan line cut portions 250b is easily cut by the laser, for example, the second scan line cut portions 250b may be formed of chromium (Cr), aluminum (Al), or molybdenum ( It is formed of a metal or indium tin oxide layer such as Mo).

The second scan line connector 270 connects the second scan line pads 250 and is shorted as a conductor. Therefore, the second scan line connector 270 equally provides the second scan line pads 250 with the voltage applied from the failure detection device through the second scan line electrode part 290.

When the second scan line electrode unit 290 detects a pixel defect, a predetermined pin of the defect detection apparatus contacts the predetermined pin to apply a predetermined voltage, and the applied voltage is applied to the second scan line connection unit 270 and the second scan. The metal pads may be provided to the metal electrode layers through line pads 250. Therefore, the second scan line electrode portion 290 is a conductor, for example, metal.

Since the cutouts 130b, 190b, and 250b of the present invention include the insulating films and a portion between the insulating films is cut by a laser, the cut portions are not shorted.

3A is a cross-sectional view illustrating a cut line of the data line of FIG. 2B, and FIGS. 3B and 3C are plan views illustrating an ACF bonding process.

Referring to FIG. 3A, the data line cutout 130b may include a data line conductive layer 140a and data line insulating layers 140b.

The data line insulating layers 140b are deposited on the data line conductive layer 140a, and a portion between the data line insulating layers 140b is cut by the laser after pixel defect detection. Subsequently, the ACF bonding is performed to connect the data line integrated circuit unit 130a and the integrated circuit chip.

3B and 3C, an ACF tape is formed on the data line pads 130, the data line connectors 150, and the data line electrode units 170 for the ACF bonding. The ACF tape has circular conductive balls as shown in FIG. 3B. When the data line pads 130 and the integrated circuit chip are connected, the conductive balls are deformed into ellipses as shown in FIG. 3C by heat and pressure. In this case, the cut portions may be connected by the conductive balls as shown in FIG. 3C. If the data line cutout 130b of the present invention did not include the data line insulating layers 140b, the data line pads and the data line connection part were connected, that is, shorted, so that the cutting effect by the laser could not occur. However, since the data line cutout 130b of the present invention includes the data line insulating layers 140b, the electrical connection is blocked by the insulating layer even when the conductive balls are connected as shown in FIG. 3C. As a result, the cutting effect by the laser is maintained.

The first and second scan line cutouts 190b and 250b are deposited on the conductive layer in the same manner as the data line cutouts 130b.

4 is a plan view schematically illustrating the cell unit of FIG. 2B.

Referring to FIG. 4, the cell unit 110 includes ITO layers 300 and metal electrode layers 320.

The ITO layers 300 and the metal electrode layers 320 cross each other, and pixels are formed in the crossing regions.

Hereinafter, a pixel defect detection process will be described in detail.

First, the lighting inspection process of the organic electroluminescent cell will be described in detail.

A predetermined positive voltage is applied to the data line pads 130, a predetermined negative voltage is applied to the first scan line pads 190, and the negative voltage is applied to the second scan line pads 250. Is applied. The data line pads 130 then provide the applied positive voltage to the ITO layers 300, and the first scan line pads 190 provide the applied negative voltage as shown in FIG. 2C. The second scan line pads 250 provide the applied negative voltage to the even-numbered metal electrode layers. As a result, the pixels formed in the region where the ITO layers 300 and the metal electrode layers 320 intersect are turned on. The failure detection device detects whether the pixels are poor in lighting through the lit pixels. In particular, the same amount of voltage is applied to the data line pads 130 through the data line connector 150 and the first and second scan line pads 190 and the first and second scan line connectors 210 and 270. Since the same negative voltage is applied to 250, the failure detection apparatus can accurately detect a lighting failure of the pixels.

Next, the leakage current detection process will be described in detail.

A predetermined negative voltage is applied to the data line pads 130, and a predetermined positive voltage is applied to the first and second scan line pads 190 and 250. Subsequently, the data line pads 130 provide the applied negative voltage to the ITO layers 300, and the first and second scan line pads 190 and 250 respectively supply the applied positive voltage to an odd number. Metal electrode layers and even metal electrode layers. In this case, if the pixels are not bad, a reverse voltage is applied to the pixels so that the leakage current does not flow through the pixels. In reality, however, a minute current flows. On the other hand, when the pixels are bad, for example when some of the pixels are shorted, a leakage current flows through the bad pixels. Subsequently, the failure detecting apparatus measures the leakage current to determine that a failure occurs in the pixels.

5 is a plan view illustrating an organic electroluminescent cell according to another exemplary embodiment of the present invention.

Referring to FIG. 5, the organic electroluminescent cell of the present invention includes a cell unit 400, data line pads 420, data line connection unit 440, data line electrode unit 460, scan line pads 480, The scan line connection part 500 and the scan line electrode part 520 are included.

The cell unit 400 includes a plurality of ITO layers and a plurality of metal electrode layers, and has a plurality of pixels formed in an area where the ITO layers and the metal electrode layers intersect.

The data line pads 420 include data line integrated circuit portions 420a and data line cutouts 420b.

The data line integrated circuit units 420a are coupled to the ITO layers, and are connected to the ITO layers through the data line electrode unit 460, the data line connection unit 440, and the data line cutouts 420b from a failure detection apparatus outside the pixel defect detection system. Provide a predetermined voltage applied to the ITO layers. As a result, when the voltage is a positive voltage, the ITO layers provide holes to the organic material layer. In addition, the data line integrated circuit units 420a are connected to an integrated circuit chip having a driving circuit.

The data line cutouts 420b are coupled between the data line integrated circuits 420a and the data line connectors 440, and include a data line conductive layer, which is a conductor, and data line insulating films partially deposited thereon, and have pixel defects. After detection, portions between the data line insulating films are cut by the laser. In addition, the data line cutouts 420b provide the data line integrated circuit units 420a with a voltage applied from the failure detection device through the data line electrode unit 460 and the data line connection unit 440. Therefore, the cut portion of the data line cut portions 420b is a material that is easily cut by a laser, for example, the data line cut portions 420b may be formed of chromium (Cr), aluminum (Al), molybdenum (Mo), or the like. It is formed of the same metal or indium tin oxide layer.

The data line connector 440 connects the data line pads 420 and is shorted as a conductor. Therefore, the data line connection part 440 provides the data line pads 420 with the voltage applied from the failure detection device through the data line electrode part 460.

In the data line electrode unit 460, when a pixel defect is detected, a predetermined pin of the defect detection apparatus contacts the predetermined pin to apply a predetermined voltage, and the applied voltage is applied to the data line connection unit 440 and the data line pads 420. It is provided to the ITO layer through. Therefore, the data line electrode portion 460 is a conductor, for example, metal.

Scan line pads 480 include scan line integrated circuit portions 480a and scan line cutouts 480b.

Scan line integrated circuit units 480a are coupled to the metal electrode layers, and the scan line electrode unit 520, the scan line connection unit 500, and the scan line cutouts 480b are provided from the defect detection apparatus when the pixel defect is detected. The applied predetermined voltage is applied to the metal electrode layers. As a result, when the voltage is a negative voltage, the metal electrode layers provide electrons to the organic material layer. In addition, the scan line integrated circuit units 480a are connected to an integrated circuit chip having a driving circuit.

The scan line cutouts 480b are coupled between the scan line integrated circuit units 480a and the scan line connectors 500, and include scan line conductive layers, which are conductors, and scan line insulating films partially deposited thereon, and have pixel defects. After detection, portions between the scan line insulating films are cut by a laser. In addition, the scan line cutoff parts 480b provide the scan line integrated circuit parts 480a with a voltage applied from the failure detection apparatus through the scan line electrode part 520 and the scan line connection part 500. Therefore, a portion of the scan line cutouts 480b may be cut by a laser material, for example, the scan line cutouts 480b may be formed of chromium (Cr), aluminum (Al), or molybdenum (Mo). It is formed of the same metal or indium tin oxide layer.

The scan line connection unit 500 connects the scan line pads 480 and is shorted as a conductor. Therefore, the scan line connection unit 500 equally provides the scan line pads 480 with the voltage applied from the failure detection apparatus through the scan line electrode unit 520.

When the scan line electrode 520 detects a pixel defect, a predetermined pin of the defect detection apparatus contacts the predetermined pin to apply a predetermined voltage, and the scan line connection part 500 and the scan line pads 480 are applied to the scan line electrode part 520. It provides to the metal electrode layers through. Therefore, the scan line electrode portion 520 is a conductor, for example, metal.

Preferred embodiments of the present invention described above are disclosed for purposes of illustration, and those skilled in the art having ordinary knowledge of the present invention will be able to make various modifications, changes, additions within the spirit and scope of the present invention, such modifications, changes and Additions should be considered to be within the scope of the following claims.

As described above, in the sea-gauge organic electroluminescent cell according to the present invention, since the cutouts include an insulating layer on the conductive layer, a short circuit does not occur even when the cutouts are cut by a laser and connected to an integrated circuit chip. There is an advantage.

Claims (7)

In a seedage type organic electroluminescent cell comprising light emitting pixels formed in regions where indium tin oxide layers corresponding to an anode and metal electrode layers corresponding to a cathode intersect, A plurality of data line integrated circuit units respectively coupled to the indium tin oxide layers; A plurality of data line cutoff portions coupled to the data line integrated circuit portions, each having a data line conductive layer and a data line insulating film partially deposited thereon; A data line connection unit connecting the data line cutting units; A plurality of scan line integrated circuit units respectively coupled to the metal electrode layers; A plurality of scan line cutoff portions respectively coupled to the scan line integrated circuit portions, each scan line conductive portion having a scan line conductive layer and a scan line insulating film partially deposited thereon; And And a scan line connection unit connecting the scan line cutouts to each other. The display device of claim 1, further comprising: a data line electrode part coupled to the data line connection part and configured to contact a predetermined pin of the failure detection device when a pixel failure is detected and apply a predetermined voltage; And And a scan line electrode unit coupled to the scan line connection unit and contacting a predetermined pin of the failure detection device to apply a predetermined voltage. The CIO type organic electroluminescent cell of claim 1, wherein the data line conductive layers and the scan line conductive layers are formed of a metal or an indium tin oxide layer. The seaside type organic electroluminescent cell according to claim 1, wherein after the pixel defect is detected, portions of the cut portions formed only of the conductive layer are respectively cut by a laser. In a seedage type organic electroluminescent cell comprising light emitting pixels formed in regions where indium tin oxide layers corresponding to an anode and metal electrode layers corresponding to a cathode intersect, A plurality of data line integrated circuit units respectively coupled to the indium tin oxide layers; A plurality of data line cutoff portions coupled to the data line integrated circuit portions, each having a data line conductive layer and a data line insulating film partially deposited thereon; A data line connection unit connecting the data line integrated circuit units; A plurality of first scan line integrated circuit units respectively coupled to some of the metal electrode layers; A plurality of first scan line cutoff portions coupled to the first scan line integrated circuit portions, each having a first scan line conductive layer and a first scan line insulating film partially deposited thereon; A first scan line connector connecting the first scan line cutouts; A plurality of second scan line integrated circuit units respectively coupled to the remaining metal electrode layers of the metal electrode layers; A plurality of second scan line cutoff portions coupled to the second scan line integrated circuit portions, each having a second scan line conductive layer and a second scan line insulating film partially deposited thereon; And And a second scan line connection unit connecting the second scan line cutouts. The display apparatus of claim 5, further comprising: a data line electrode unit coupled to the data line connection unit and configured to contact a predetermined pin of a failure detection device to apply a predetermined voltage when detecting a pixel failure; A first scan line electrode part coupled to the first scan line connection part and contacting a predetermined pin of the failure detection device to apply a predetermined voltage; And And a second scan line electrode part coupled to the second scan line connection part and contacting a predetermined pin of the failure detection device to apply a predetermined voltage. 6. The seedling type organic electroluminescent cell according to claim 5, wherein after the pixel defect is detected, portions of the cut portions formed only of the conductive layer are respectively cut by a laser.

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