TWI742744B - Display apparatus and manufacturing method thereof - Google Patents

Abstract

A display apparatus including a substrate, a conductive structure, a pixel unit, a signal line, a transmission line, and a repair structure is provided. The substrate has a first surface, a second surface opposite to the first surface, and a through hole penetrating the first surface and the second surface. The conductive structure is disposed in the through hole. The pixel unit is disposed on the first surface. The pixel unit includes a first connection pad, a second connection pad, a third connection pad, a fourth connection pad, a driving device, and a light-emitting device. The light emitting device is electrically connected to the first connection pad and the second connection pad. The signal line is disposed on the first surface. The driving device is electrically connected to the first connection pad and the third connection pad through the signal line. The transmission line is disposed on the second surface. The transmission line is electrically connected to the second connection pad or the fourth connection pad at least through the conductive structure. The repair structure is disposed between the transmission line and the conductive structure.

Description

Display device and manufacturing method thereof

The present invention relates to a display device and a manufacturing method thereof, and more particularly to a display device with a repair structure and a manufacturing method thereof.

In the manufacturing process of the display device, there are often unavoidable defects (such as abnormal bright spots). Therefore, how to repair the above-mentioned defects to improve the quality of the display device has become an urgent problem to be solved at present.

The present invention provides a display device and a manufacturing method thereof, which can enable the display device to have a better display effect.

The display device of the present invention includes a substrate, a first conductive structure, a first pixel unit, a first signal line, a transmission line, and a first repair structure. The substrate has a first surface, a second surface opposite to the first surface, and a first through hole penetrating the first surface and the second surface. The first conductive structure is located in the first through hole. The first pixel unit is located on the first surface of the substrate. The pixel unit includes a first connecting pad, a second connecting pad, and a third connecting pad. The contact pad, the fourth connection pad, the first driving element and the first light emitting element. The first light-emitting element is electrically connected to the first connection pad and the second connection pad. The first signal line is located on the first surface of the substrate. The first driving element is electrically connected to the first connection pad and the third connection pad through the first signal line. The transmission line is located on the second surface of the substrate. The transmission line is electrically connected to the second connection pad or the fourth connection pad through at least the first conductive structure. The first repair structure is located between the transmission line and the first conductive structure.

The manufacturing method of the display device of the present invention includes the following steps. Provide display structure. The display structure includes a substrate, a first conductive structure, a first pixel unit, a first signal line, a transmission line, and a first repair structure. The substrate has a first surface, a second surface opposite to the first surface, and a first through hole penetrating the first surface and the second surface. The first conductive structure is located in the first through hole. The first pixel unit is located on the first surface of the substrate. The pixel unit includes a first connection pad, a second connection pad, a third connection pad, a fourth connection pad, a first driving element, and a first light emitting element. The first light-emitting element is electrically connected to the first connection pad and the second connection pad. The first signal line is located on the first surface of the substrate. The first driving element is electrically connected to the first connection pad and the third connection pad through the first signal line. The transmission line is located on the second surface of the substrate. The transmission line is electrically connected to the second connection pad and the fourth connection pad through at least the first conductive structure. The first repair structure is located between the transmission line and the first conductive structure. The first light-emitting element of the display structure was tested. After testing the first light-emitting element, the transmission line is not electrically connected to the second connection pad. The second light emitting element is arranged on the first surface and is electrically connected to the third connection pad and the fourth connection pad.

Based on the above, in the manufacturing process of the display device, the first light-emitting element is After the device is tested, if it is deemed that it does not have the expected light-emitting state, the second light-emitting element can be configured and the transmission line is not electrically connected to the second connection pad, so that the repaired display device has a good display . In this way, the display device can have a better display effect.

100, 200: display device

101: Substrate structure

102: display structure

110: substrate

111: first surface

112: second surface

115: through hole

115a: first through hole

115b: second through hole

215c: third through hole

120: The first patterned conductive layer

121: The first signal line

222: second signal line

129: Open

131: The first drive element

232: second drive element

141: The first connection pad

142: The second connecting pad

143: The third connection pad

144: The fourth connection pad

245: Fifth connection pad

246: The sixth connection pad

150: second patterned conductive layer

151, 151’: First repair structure

252: first connection line

253’: Second repair structure

156: Transmission Line

158, 358, 458: conductive structure

158a: first conductive structure

158b: second conductive structure

258c: third conductive structure

171: The first light-emitting element

172: second light-emitting element

273: The third light-emitting element

388: protective layer

387: Insulation layer

PU1: The first pixel unit

PU2: second pixel unit

D1: First direction

D2: second direction

D3: Third party

L1: first distance

L2: second distance

L3: third distance

L4: fourth distance

FIG. 1A is a partial perspective view of a part of a manufacturing method of a display device according to a first embodiment of the present invention.

FIG. 1B is a schematic partial top view of a part of a manufacturing method of a display device according to the first embodiment of the present invention.

FIG. 1C is a partial perspective view of a part of a manufacturing method of a display device according to the first embodiment of the present invention.

FIG. 1D is a partial perspective view of a part of a manufacturing method of a display device according to the first embodiment of the present invention.

1E is a schematic partial top view of a part of a manufacturing method of a display device according to the first embodiment of the present invention.

2A to 2C are schematic top views of a method of partially forming a conductive structure according to an embodiment of the present invention.

3A to 3C are schematic cross-sectional views of a method of partially forming a conductive structure according to an embodiment of the present invention.

4A to 4C are diagrams of a conductive structure according to another embodiment of the present invention A schematic top view of the partial formation method.

5A to 5C are schematic cross-sectional views of a method of partially forming a conductive structure according to another embodiment of the present invention.

FIG. 6 is a schematic partial top view of a display device according to the second embodiment of the present invention.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings. As those skilled in the art would realize, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present invention.

In the drawings, the thickness or size of each element and the like are exaggerated for clarity. Throughout the specification, the same reference numerals denote the same elements. It should be understood that when an element such as a layer, film, region, or substrate is referred to as being “on”, “connected to,” or “overlapped on another element”, it may be directly on the other element. On or connected to another element, or intermediate elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements. As used herein, "connected" can refer to physical and/or electrical connections.

It should be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers and/or parts, these elements, components, regions, and/or Or part should not be restricted by these terms. These terms are only used to associate one element, component, region, layer or section with another element, component, Distinguish by region, layer or part. Therefore, the “first element,” “component,” “region,” “layer,” or “portion” discussed below may be referred to as a second element, component, region, layer or section without departing from the teachings herein.

The terminology used here is only for the purpose of describing specific embodiments and is not restrictive. As used herein, unless the content clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms, including "at least one." "Or" means "and/or". As used herein, the term "and/or" includes any and all combinations of one or more of the related listed items. It should also be understood that when used in this specification, the terms "including" and/or "including" designate the presence of the features, regions, wholes, steps, operations, elements, and/or components, but do not exclude one or more The existence or addition of other features, regions as a whole, steps, operations, elements, components, and/or combinations thereof.

In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used herein to describe the relationship between one element and another element, as shown in the figure. It should be understood that relative terms are intended to include different orientations of the device in addition to the orientation shown in the figures. For example, if the device in one figure is turned over, elements described as being on the "lower" side of other elements will be oriented on the "upper" side of the other elements. Therefore, the exemplary term "lower" may include an orientation of "lower" and "upper", depending on the specific orientation of the drawing. Similarly, if the device in one figure is turned over, elements described as "below" or "beneath" other elements will be oriented "above" the other elements. Thus, the exemplary terms "below" or "below" can include an orientation of above and below.

As used herein, "substantially" includes the stated value and the average value within the acceptable deviation range of the specific value determined by a person of ordinary skill in the art, taking into account the discussion The measurement and the specific number of errors associated with the measurement (ie, the limit of the measurement system). For example, "substantially" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%.

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of related technologies and the present invention, and will not be interpreted as idealized or excessive The formal meaning, unless explicitly defined as such in this article.

The exemplary embodiments are described herein with reference to cross-sectional views that are schematic diagrams of idealized embodiments. Therefore, a change in the shape of the diagram as a result of, for example, manufacturing technology and/or tolerances can be expected. Therefore, the embodiments described herein should not be interpreted as being limited to the specific shape of the area as shown herein, but include, for example, shape deviations caused by manufacturing. For example, regions shown or described as flat may generally have rough and/or non-linear characteristics. In addition, the acute angles shown may be rounded. Therefore, the regions shown in the figures are schematic in nature, and their shapes are not intended to show the precise shape of the regions, and are not intended to limit the scope of the claims.

1A to 1E are partial top schematic three-dimensional or partial top schematic diagrams of a part of a manufacturing method of a display device according to a first embodiment of the present invention. For example, the display structure in FIG. 1B may be a partial top view diagram corresponding to the display structure in FIG. 1A, and the display device in FIG. 1E may be a partial top view diagram corresponding to the display structure in FIG. 1D. And, for clarity, in Figure 1A to Figure In 1E, some of the film layers or components may be omitted.

1A and 1B, a substrate structure 101 is provided. The substrate structure 101 may include a substrate 110, at least one conductive structure 158, a first connection pad 141, a second connection pad 142, a third connection pad 143, a fourth connection pad 144, a first signal line 121, a first driving element 131, The transmission line 156 and the first repair structure 151'. The substrate 110 has a first surface 111, a second surface 112 and at least one through hole 115. The second surface 112 is opposite to the first surface 111. The aforementioned through hole 115 penetrates the first surface 111 and the second surface 112. The conductive structure 158 is located in the corresponding through hole 115. The first connection pad 141, the second connection pad 142, the third connection pad 143, the fourth connection pad 144, the first signal line 121 and the first driving element 131 are located on the first surface 111 of the substrate 110. The first driving element 131 is electrically connected to the first connection pad 141 and the third connection pad 143 through the first signal line 121. The transmission line 156 is located on the second surface 112 of the substrate 110. The transmission line 156 is electrically connected to the second connection pad 142 or the fourth connection pad 144 at least through the conductive structure 158. The first repair structure 151' is located between the transmission line 156 and at least one of the conductive structures 158.

For example, the conductive structure 158 may include a first conductive structure 158a and a second conductive structure 158b, and the through hole 115 may include a first through hole 115a and a second through hole 115b. The first conductive structure 158a is located in the first through hole 115a. The second conductive structure 158b is located in the second through hole 115b. The transmission line 156 may be electrically connected to the fourth connection pad 144 through the second conductive structure 158b.

In the structure of FIG. 1A and FIG. 1B, the first repair structure 151' is located between the transmission line 156 and the first conductive structure 158a, and the conductor in the first repair structure 151' It is a continuous structure. That is, in the structure of FIG. 1A and FIG. 1B, the transmission line 156 can be electrically connected to the second connection pad 142 through the first conductive structure 158a.

In an embodiment, the first driving element 131 may be a thin film transistor (TFT), but the invention is not limited thereto. For example, the first driving element 131 may be a thin film transistor including a source electrode, a drain electrode, and a gate electrode. The drain of the first driving element 131 can be electrically connected to the first connection pad 141 and the third connection pad 143 through the first signal line 121. The aforementioned thin film transistor may be a top gate TFT, a bottom gate TFT, or a dual gate TFT.

In an embodiment, the first driving element 131 may be a driving chiplet (driving chiplet), but the invention is not limited thereto.

In an embodiment, a method for forming a conductive structure 358 (one of the conductive structures 158 may include) may be as follows.

Please refer to FIGS. 2A to 2C and FIGS. 3A to 3C, wherein FIGS. 2A to 2C are schematic top views of a method for partially forming a conductive structure according to an embodiment of the present invention, and FIGS. 3A to 3C are in accordance with the present invention. A schematic cross-sectional view of a method for partially forming a conductive structure according to an embodiment of the invention. For example, FIG. 3A may be a schematic cross-sectional view corresponding to the line II-II′ in FIG. 2A, FIG. 3B may be a schematic cross-sectional view corresponding to the II-II′ line in FIG. 2B, and/or FIG. 3C may be It is a schematic cross-sectional view corresponding to the line III-III' in FIG. 2C.

2A and 3A, in an embodiment, the first patterned conductive layer 120 may be formed on the first surface 111 of the substrate 110. First patterned conductive layer Part of the patterned lines in 120 may constitute part of the first signal line 121.

In an embodiment, the first patterned conductive layer 120 may have an opening 129.

In an embodiment, the first patterned conductive layer 120 may be formed by sputtering.

In an embodiment, an insulating layer 387 may be provided between the first patterned conductive layer 120 and the substrate 110. In an embodiment, the insulating layer 387 may be referred to as a buffer layer, but the present invention is not limited thereto.

In an embodiment, a protective layer 388 may be provided on the first surface 111 of the substrate 110. The protective layer 388 may include an insulating layer or an insulating film formed by plating, coating, pasting or other suitable methods. In this way, in the subsequent removal steps (for example, when a part of the film or components is removed by laser burning), it may be possible to reduce the conductive flying debris or conductive particles directly adhering to the first patterning. Possible on the conductive layer 120 (or; the first signal line 121).

Referring to FIGS. 2A to 2B and FIGS. 3A to 3B, at least one through hole 115 is formed on the substrate 110. For example, a laser burning method may be used to form a through hole 115 that penetrates the substrate 110 from the first surface 111 to the second surface 112 from the first surface 111 of the substrate 110. The through hole 115 may correspond to the opening 129 of the first patterned conductive layer 120. In addition, by the above method, an opening corresponding to the through hole 115 may be formed on the protective layer 388, and/or an opening corresponding to the through hole 115 may be formed on the insulating layer 387.

Please refer to FIG. 2B to FIG. 2C and FIG. 3B to FIG. 3C, on the substrate 110 After at least one through hole 115 is formed, a second patterned conductive layer 150 may be formed on the second surface 112 of the substrate 110. Part of the patterned lines in the second patterned conductive layer 150 may constitute part of the first repair structure 151' and/or part of the transmission line 156. In addition, part of the conductive material used to form the second patterned conductive layer 150 may be more filled into the through hole 115 (such as the first through hole 115a or the first through hole 115a), and the conductive structure 158 (such as the first through hole 115a) may be formed. A conductive structure 158a or a first conductive structure 158b).

In one embodiment, a seed layer may be formed on the second surface 112 of the substrate 110, and then an electroplated layer may be plated on the aforementioned seed layer by electroplating. Furthermore, after the patterning step is performed on the aforementioned seed layer, and after the patterning step is performed on the aforementioned seed layer, the patterned seed layer and the patterned electroplating layer may constitute the second patterned conductive layer 150.

In one embodiment, before forming the second patterned conductive layer 150, a part of the protective layer 388 may be removed.

In an embodiment, the conductive material filled in the through hole 115 may further cover the first surface 111 of the substrate 110, and may cover part of the first patterned conductive layer.

In another embodiment, a method for forming a conductive structure 458 (one of the conductive structures 158 may include) may be as follows.

Please refer to FIGS. 4A to 4C and FIGS. 5A to 5C, in which FIGS. 4A to 4C are schematic top views of a method for partially forming a conductive structure according to another embodiment of the present invention, and FIGS. 5A to 5C are in accordance with A schematic cross-sectional view of a method for partially forming a conductive structure according to another embodiment of the present invention. For example, Figure 5A can be Corresponding to the schematic cross-sectional view on the IV-IV' cross-sectional line in FIG. 4A, FIG. 5B may be a schematic cross-sectional view corresponding to the V-V' cross-sectional line in FIG. 4B, and/or FIG. 5C may correspond to the VI- in FIG. 4C A schematic cross-sectional view on the VI' section line. In addition, the formation method of the conductive structure 458 of this embodiment is similar to the formation method of the conductive structure 358 of the foregoing embodiment, and similar components are denoted by the same reference numerals, and have similar functions, materials, formation methods or configurations, and The description is omitted.

Referring to FIGS. 4A and 5A, in an embodiment, the first patterned conductive layer 120 may be formed on the first surface 111 of the substrate 110. Part of the patterned lines in the first patterned conductive layer 120 may constitute part of the first signal line 121.

Referring to FIGS. 4A to 4B and FIGS. 5A to 5B, at least one through hole 115 is formed on the substrate 110. For example, a laser burning method may be used to form a through hole 115 that penetrates the substrate 110 from the second surface 112 to the first surface 111 from the second surface 112 of the substrate 110. The through hole 115 may expose a portion of the first patterned conductive layer 120. In addition, by the above-mentioned method, an opening corresponding to the through hole 115 can be formed on the insulating layer 387.

Referring to FIGS. 4B to 4C and FIGS. 5B to 5C, after at least one through hole 115 is formed on the substrate 110, a second patterned conductive layer 150 may be formed on the second surface 112 of the substrate 110. Part of the patterned lines in the second patterned conductive layer 150 may constitute part of the first repair structure 151' and/or part of the transmission line 156. In addition, the conductive material used to form the second patterned conductive layer 150 can be more filled in the through hole 115 (such as the first through hole 115a or the second through hole 115b), and the conductive structure 158 (such as the first through hole 115b) can be formed. The conductive structure 158a or the second conductive structure 158b).

1C, the first light-emitting element 171 is arranged on the first surface 111 of the substrate 110, and the two poles (such as the anode and the cathode) of the first light-emitting element 171 can be electrically connected to the first connection pad 141 and the first connection pad 141, respectively. Two connection pad 142.

In this embodiment, the first light-emitting element 171 may be a semiconductor die, and it is not limited that the first light-emitting element 171 disposed on the substrate 110 needs to be a known good die (KGD).

In this embodiment, the substrate structure 101 and the first light-emitting element 171 disposed thereon can be referred to as the display structure 102. The first connection pad 141, the second connection pad 142, the third connection pad 143, the fourth connection pad 144, the first driving element 131 and the first light emitting element 171 may constitute the first pixel unit PU1 of the display structure 102.

In this embodiment, the first light-emitting element 171 of the display structure 102 can be tested to confirm whether the first light-emitting element 171 of the first pixel unit PU1 can have an expected light-emitting state. For example, a common bright point defect test (bright point defect test) can be performed on the first light emitting element 171 of the display structure 102.

Please refer to FIGS. 1C to 1D and 1E. After testing the first light emitting element 171 as shown in FIG. 156 is not electrically connected to the second connection pad 142. For example, after performing a bright point test on the first light-emitting element 171 as shown in FIG. 1C, if it is considered to be an abnormal bright point defect, the transmission line 156 can be made to fail as shown in FIG. 1D. It is electrically connected to the second connection pad 142.

In this embodiment, a part of the conductor of the first repair structure 151' as shown in FIG. 1C can be removed, so that the first repair structure as shown in FIG. 1D or FIG. 1E 151 is open circuit. That is to say, the conductor in the first repair structure 151 shown in FIG. 1D and FIG. 1E is a discontinuous structure, making it open.

In this embodiment, a part of the conductor of the first repair structure 151' as shown in FIG. 1C can be removed by laser burning.

In this embodiment, since the first repair structure (which may include the first repair structure 151' or the first repair structure 151) is located on the second surface 112 of the substrate 110, if laser burning is used In order to remove part of the conductors of the first repair structure 151' as shown in FIG. The pad 142, the third connection pad 143, the fourth connection pad 144, the first driving element 131, the first light emitting element 171 or the first signal line 121, but not limited to the possibility of damage or damage.

In this embodiment, in the direction perpendicular to the first surface 111 or the second surface 112, the first repair structure 151 does not overlap the first connection pad 141, the second connection pad 142, the first driving element 131 and the first Light-emitting element 171. For example, similar to that shown in FIG. 1B, the projection of the first repair structure 151 on the first surface 111/the second surface 112 may not overlap the first connection pad 141, the second connection pad 142, and the first driving element at all. 131 and the projection of the first light emitting element 171 on the first surface 111/the second surface 112. In this way, if a part of the conductor of the first repair structure 151' as shown in FIG. 1C is removed by laser burning, it may be possible to reduce the first connection pad 141, the second connection pad 142, and the first The driving element 131 and the first light-emitting element 171 may be damaged or damaged.

In this embodiment, the first repair structure 151 is derived from the first conductive structure 158a Extending in the first direction D1, the first signal line 121 extends from the first connection pad 141 in the second direction D2, and the first direction D1 is different from the second direction D2. In this way, if a part of the conductor of the first repair structure 151' as shown in FIG. 1C is removed by laser burning, the possibility of damage or damage to the first signal line 121 may be reduced.

In this embodiment, in a direction perpendicular to the first surface 111 or the second surface 112, the first repair structure 151 may not overlap the first signal line 121. For example, similar to that shown in FIG. 1B, the projection of the first repair structure 151 on the first surface 111/the second surface 112 may not overlap the first signal line 121 on the first surface 111/the second surface 112 at all. Projection.

Please refer to FIGS. 1C to 1D and 1E. After testing the first light-emitting element 171 as shown in FIG. 1C, if it is deemed that it does not have the expected light-emitting state, it can be as shown in FIG. 1D or FIG. 1E. The second light-emitting element 172 is grounded on the first surface 111 of the substrate 110, and the two poles (such as the anode and the cathode) of the second light-emitting element 172 can be electrically connected to the third connection pad 143 and the fourth connection pad 144, respectively .

In this embodiment, the second light-emitting element 172 may be disposed on the first surface 111 of the substrate 110 after the first repair structure 151 of the open circuit is formed. In an embodiment, the disconnected first repair structure 151 may be formed after the second light emitting element 172 is disposed on the first surface 111 of the substrate 110.

In this embodiment, the light-emitting color of the second light-emitting element 172 is substantially the same as the expected light-emitting color of the first light-emitting element 171. In an embodiment, the structure of the second light-emitting element 172 is substantially the same as the structure of the first light-emitting element 171. For example, the second light-emitting element 172 and the first light-emitting element 171 may include A semiconductor light-emitting diode element with a film layer with the same doping element and/or doping concentration.

After the above-mentioned manufacturing method, the manufacturing of the display device 100 of this embodiment can be substantially completed.

1D and 1E, the display device 100 includes a substrate 110, a first conductive structure 158a, a first pixel unit PU1, a first signal line 121, a transmission line 156, and a first repair structure 151. The first pixel unit PU1 is located on the first surface 111 of the substrate 110. The first pixel unit PU1 includes a first connection pad 141, a second connection pad 142, a third connection pad 143, a fourth connection pad 144, a first driving element 131, and a first light emitting element 171. The first repair structure 151 is located between the transmission line 156 and the first conductive structure 158a.

In this embodiment, the first repair structure 151 may be open. In other words, the transmission line 156 and the first conductive structure 158a can be electrically insulated therebetween.

In this embodiment, the first pixel unit PU1 may further include a second light-emitting element 172. In one embodiment, in the manufacturing process of the display device 100, after the first light-emitting element 171 is tested, if it is deemed that it does not have the expected light-emitting state (such as a bright spot), the second light-emitting element can be configured 172 and the way that the transmission line 156 is not electrically connected to the second connection pad 142 (for example, the first repair structure 151 is disconnected), so that the repaired display device 100 has a good display. In this way, the display device 100 can have a better display effect.

In one embodiment, in a horizontal direction parallel to the first surface 111 or the second surface 112, there is a first conductive structure 158a between the first conductive structure 158a and the transmission line 156. The distance L1 is a second distance L2 between the first conductive structure 158a and the first light emitting element 171, and the first distance L1 is greater than the second distance L2. In this way, if a part of the conductor similar to the first repair structure 151' as shown in FIG. 1C is removed by laser burning, the damage of the first conductive structure 158a or the first light-emitting element 171 may be reduced. Or the possibility of damage.

In an embodiment, the first distance L1 may be greater than or equal to 1 micrometer (micrometer; μm) and less than or equal to 30 micrometers, but the present invention is not limited thereto.

In one embodiment, after testing the first light-emitting element 171 as shown in FIG. 1C, if it is deemed to have the expected light-emitting state, the display structure 102 as shown in FIG. 1C can still be called a display Device. In one embodiment, if the first light-emitting element 171 has the expected light-emitting state as shown in FIG. 1C, the third connection pad 143 and the fourth connection pad 144 may not have the light-emitting element (such as: the same or similar to Light-emitting element of the second light-emitting element 172). That is, in an embodiment, the display device may have a first state (such as the state of the display structure 102 called the display device) or a second state (such as the state of the display device 100), wherein the first state The difference from the second state is that in the first state, the transmission line 156 is electrically connected to the second connection pad 142, and the third connection pad 143 and the fourth connection pad 144 do not have light-emitting elements; in the second state Next, the transmission line 156 is not electrically connected to the second connection pad 142, and the second light-emitting element 172 is provided on the third connection pad 143 and the fourth connection pad 144.

FIG. 6 is a schematic partial top view of a display device according to the second embodiment of the present invention. The display device 200 of this embodiment and the display device of the first embodiment 100 is similar, and similar components are denoted by the same reference numerals, and have similar functions, materials, formation methods, or configuration methods, and the description is omitted.

Referring to FIG. 6, in an embodiment, the display device 200 may include a substrate 110, a first conductive structure 158a, a first pixel unit PU1, a first signal line 121, a transmission line 156, a first repair structure 151, and a first connection The line 252 and the second conductive structure 158b. The first connection line 252 is located on the second surface 112 of the substrate 110 and is electrically connected to the transmission line 156. The fourth connection pad 144 is electrically connected to the transmission line 156 through the second conductive structure 158 b and the first connection line 252. The first repair structure 151 extends from the first conductive structure 158a in the first direction D1, the first connection line 252 extends from the second conductive structure 158b to the third direction D3, and the first direction D1 is different from the third direction D3. In this way, if a part of the conductor similar to the first repair structure 151' as shown in FIG. 1C is removed by laser burning, the possibility of damage or damage to the first connection line 252 may be reduced.

In an embodiment, the first connection line 252 may be formed in the same or similar manner as the transmission line 156, but the present invention is not limited thereto.

In an embodiment, the second direction D2 may be the same or similar to the third direction D3, but the invention is not limited thereto.

Referring to FIG. 6, in an embodiment, the display device 200 may include a substrate 110, a first conductive structure 158a, a first pixel unit PU1, a first signal line 121, a transmission line 156, a first repair structure 151, and a second picture.素unit PU2. The second pixel unit PU2 is located on the first surface 111 of the substrate 110. The second pixel unit PU2 includes a fifth connection pad 245, a sixth connection pad 246, a second driving element 232, and a third generator. Light element 273. The third light emitting element 273 is electrically connected to the fifth connection pad 245 and the sixth connection pad 246. The second driving element 232 is electrically connected to the fifth connection pad 245. The transmission line 156 is electrically connected to the sixth connection pad 246.

In an embodiment, the two electrodes (eg, anode and cathode) of the third light-emitting element 273 may be electrically connected to the fifth connection pad 245 and the sixth connection pad 246, respectively.

In an embodiment, the light-emitting color of the third light-emitting element 273 is different from the light-emitting color expected by the first light-emitting element 171 or the light-emitting color expected by the second light-emitting element 172.

In an embodiment, the second driving element 232 may be similar to the first driving element 131. For example, the second driving element 232 may be a thin film transistor including a source, a drain, and a gate, and the drain of the second driving element 232 may be electrically connected to the fifth connection pad through the second signal line 222 245.

In an embodiment, the display device 200 may further include a first connection line 252, a second repair structure 253', and a third conductive structure 258c. The substrate 110 further has a third through hole 215 c penetrating through the first surface 111 and the second surface 112. The third conductive structure 258c is located in the third through hole 215c and is electrically connected to the fifth connection pad 245 and the second repair structure 253'. The second repair structure 253' is located between the transmission line 156 and the third conductive structure 258c. Part of the first connection line 252 is not located on the line connecting the first repair structure 151 and the second repair structure 253'. For example, the line connecting any part of the first repairing structure 151 and any part of the second repairing structure 253' will not intersect part of the first connecting line 252. In this way, if laser burning is used to remove part of the conductor similar to the first repair structure 151' as shown in FIG. 1C And/or, if it is necessary to remove part of the conductor of the second repair structure 253' by laser burning, the possibility of damage or damage to the first connection line 252 may be reduced.

In an embodiment, there is a third distance L3 between the second conductive structure 158b and the first conductive structure 158a, a fourth distance L4 between the third conductive structure 258c and the first conductive structure 158a, and the fourth distance L4 is greater than The third distance is L3. In this way, if a part of the conductor similar to the first repair structure 151' as shown in FIG. 1C is removed by laser burning; and/or, if necessary, by laser burning When part of the conductors of the second repair structure 253 ′ are removed, it is more likely that the possibility of damage or damage to the first connection line 252 can be reduced. In this way, the display device 200 can have a better display effect.

In an embodiment, the third distance L3 may be greater than or equal to 10 micrometers and less than or equal to 85 micrometers, but the invention is not limited thereto.

In the foregoing embodiments, the conductive layer may have a single-layer or multi-layer structure. If it is a conductive layer with a multi-layer structure, the aforementioned multi-layer structure may not have an insulating material between them.

In the foregoing embodiments, the insulating layer may have a single-layer or multi-layer structure. If it is an insulating layer with a multi-layer structure, the aforementioned multi-layer structure may not have conductive materials between them.

In summary, in the manufacturing process of the display device of the present invention, after the first light-emitting element is tested, if it is deemed that it does not have the expected light-emitting state, the second light-emitting element can be configured and the transmission line can be made electrically non-conductive. The way of connecting to the second connecting pad enables the repaired display device to have a good display. In this way, the display device can have a better display effect.

100: display device

110: substrate

111: first surface

112: second surface

121: The first signal line

131: The first drive element

141: The first connection pad

142: The second connecting pad

143: The third connection pad

144: The fourth connection pad

151: The first repair structure

156: Transmission Line

158: conductive structure

158a: first conductive structure

158b: second conductive structure

171: The first light-emitting element

172: second light-emitting element

PU1: The first pixel unit

Claims (16)

A display device includes: a substrate having a first surface, a second surface opposite to the first surface, and a first through hole penetrating the first surface and the second surface; In the first through hole; a first pixel unit located on the first surface of the substrate, and the pixel unit includes a first connection pad, a second connection pad, a third connection pad, and a fourth connection Pad, a first driving element, and a first light-emitting element, wherein the first light-emitting element is electrically connected to the first connection pad and the second connection pad; the first signal line is located on the first connection pad of the substrate On a surface, and the first driving element is electrically connected to the first connection pad and the third connection pad through the first signal line; the transmission line is located on the second surface of the substrate , And the transmission line is electrically connected to the second connection pad or the fourth connection pad through at least the first conductive structure; and a first repair structure located on the second surface of the substrate and Located between the transmission line and the first conductive structure. The display device according to claim 1, wherein the first repair structure is a passage. The display device according to claim 1, wherein the first repair structure is an open circuit, and the first pixel unit further includes: The second light-emitting element is electrically connected to the third connection pad and the fourth connection pad. The display device according to claim 3, wherein the emission color of the first light-emitting element and the emission color of the second light-emitting element are substantially the same. The display device according to claim 1, wherein in a direction perpendicular to the first surface or the second surface, the first repair structure does not overlap the first connection pad and the second connection Pad, the first driving element, and the first light-emitting element. The display device according to claim 1, wherein the first repair structure extends from the first conductive structure in a first direction, the first signal line extends from the first connection pad in a second direction, and The first direction is different from the second direction. The display device according to claim 1, wherein in a horizontal direction parallel to the first surface or the second surface, there is a first distance between the first conductive structure and the transmission line, and the first There is a second distance between a conductive structure and the first light-emitting element, and the first distance is greater than the second distance. The display device according to claim 1, wherein the substrate further has a second through hole penetrating the first surface and the second surface, and the display device further includes: a first connection line located in the On the second surface of the substrate and electrically connected to the transmission line; and The second conductive structure is located in the second through hole and is electrically connected to the third connection pad and the first connection line, wherein the first repair structure extends from the first conductive structure to the first direction Extending, the first connecting line extends from the second conductive structure in a third direction, and the first direction is different from the third direction. The display device according to claim 1, further comprising: a second pixel unit located on the first surface of the substrate, and the second pixel unit includes a fifth connection pad, a sixth connection pad, The second driving element and the third light emitting element, wherein the third light emitting element is electrically connected to the fifth connection pad and the sixth connection pad, and the second driving element is electrically connected to the fifth connection Pad, and the transmission line is electrically connected to the sixth connection pad. The display device according to claim 9, wherein the light emission color of the first light emitting element is different from the light emission color of the third light emitting element. The display device according to claim 9, wherein the substrate further has a second through hole and a third through hole penetrating the first surface and the second surface, and the display device further includes: a first connection A circuit located on the second surface of the substrate and electrically connected to the transmission line; a second conductive structure located in the second through hole and electrically connected to the fourth connection pad and the first A connection line; a third conductive structure located in the third through hole and electrically connected to the fifth connection pad; and The second repair structure is located between the transmission line and the third conductive structure, and part of the first connection line is not located on the connection line between the first repair structure and the second repair structure. The display device according to claim 9, wherein there is a third distance between the second conductive structure and the first conductive structure, and there is a fourth distance between the third conductive structure and the first conductive structure , And the fourth distance is greater than the third distance. A method for manufacturing a display device includes: providing a display structure, which includes: a substrate having a first surface, a second surface opposite to the first surface, and a first surface penetrating the first surface and the second surface. A through hole; a first conductive structure located in the first through hole; a first pixel unit located on the first surface of the substrate, and the pixel unit includes a first connection pad and a second connection Pad, third connection pad, fourth connection pad, first driving element and first light emitting element, wherein said first light emitting element is electrically connected to said first connection pad and said second connection pad; a first signal Line is located on the first surface of the substrate, and the first driving element is electrically connected to the first connection pad and the third connection pad through the first signal line; the transmission line is located On the second surface of the substrate and electrically connected to the second connection pad and the fourth connection through at least the first conductive structure Pad; and a first repair structure located on the second surface of the substrate and between the transmission line and the first conductive structure; testing the first light-emitting element of the display structure; After the first light-emitting element is tested, the transmission line is not electrically connected to the second connection pad; and the second light-emitting element is arranged on the first surface and is electrically connected to the third The connection pad and the fourth connection pad. The method of manufacturing a display device according to claim 13, wherein before the transmission line is not electrically connected to the second connection pad, a protective layer is formed on the first surface of the substrate. The method for manufacturing a display device according to claim 13, wherein before the first light-emitting element is tested, the first repair structure is a via, so that the transmission line is not electrically connected to the second connection pad The steps include: removing part of the first repair structure to make the first repair structure open. The method of manufacturing a display device according to claim 15, wherein the step of removing part of the first repair structure includes burning by laser.

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