WO2021128691A1 - Epoxy-modified silicone resin composition and use thereof - Google Patents

Abstract

The present invention relates to an epoxy-modified silicone resin composition and use thereof. The composition is prepared from the following raw materials in parts by weight: 10 to 70 parts of the epoxy-modified silicone resin, 10 to 30 parts of a functional resin, and 15 to 100 parts of an auxiliary agent. The epoxy-modified silicone resin has a structure as shown in formula I, wherein R1 is methyl or ethyl phenyl; R2 is methyl or phenyl; R3 is methyl or phenyl; m is an integer in the range of 1-20; and n is an integer in the range of 1-20.

Description

Epoxy modified silicone resin composition and its application Technical field

The present invention relates to the field of LED technology, in particular to epoxy-modified silicone resin compositions and applications thereof.

Background technique

LED (Light-Emitting Diode), as a light source with small size, high luminous efficiency, low power consumption, and long service life, is widely used in fields such as display screens, lighting, and radiation sources. In recent years, with the development of LED miniaturization, thinning, and high-density trends, packaging methods that directly mount components on a printed wiring board have developed rapidly. With the development of high-brightness LED technology, LEDs have become more high-brightness, and at the same time, the heat generation of LED components has increased. In the past, most of the substrates used to carry LED components are made of epoxy resin. However, epoxy resin has poor weather resistance and is exposed to high heat radiation for a long time, which causes the color of the substrate to age and turn yellow, and the reflectivity of light is somewhat Decrease, reducing LED performance.

CN201410782137 discloses a yellowing-resistant resin composition, the raw materials of which include: cycloaliphatic epoxy resin, general epoxy resin, cyanate ester resin, glycidyl methacrylate, curing agent, titanium dioxide, and fluorescent whitening It has the advantages of good yellowing resistance, high reflectivity of the substrate, and high peel strength between the substrate and the metal foil. Adding cycloaliphatic epoxy resin directly, the weather resistance of the material is better than epoxy resin. However, the cost of alicyclic epoxy resin is high, and it is difficult to meet the increasingly stringent performance requirements.

CN201410829372 is compounded by condensed silicone resin, catalyst, white filler, auxiliary agent and optionally other components to obtain a silicone resin composition with excellent heat resistance, weather resistance and yellowing resistance. The resin is used in the LED white copper clad laminate to make it also have excellent heat resistance, weather resistance and yellowing resistance. However, the material has poor adhesion.

Summary of the invention

Based on this, the present invention provides an epoxy-modified silicone resin composition, which has good mechanical properties, adhesive properties, excellent electrical insulation properties, and is resistant to high temperature aging, ultraviolet light, and radiation. The composition is a laminate prepared from a raw material, and when used as a substrate of an LED element, it can effectively improve the luminous effect of the LED and prolong the service life.

The specific technical methods are:

An epoxy-modified silicone resin composition is prepared from raw materials including the following parts by weight:

Epoxy modified silicone resin 10 parts-70 parts,

Functional resin 10-30 copies,

Auxiliary 15 copies-100 copies,

The epoxy-modified silicone resin has a structure represented by formula I:

Formula I

Wherein, R ₁ is methyl, ethyl or phenyl;

R ₂ is methyl or phenyl;

R ₃ is methyl or phenyl;

m is an integer in the range of 1-20;

n is an integer in the range of 1-20.

The present invention also provides a prepreg. The raw material of the prepreg includes the above-mentioned epoxy-modified silicone resin composition.

The present invention also provides a laminate. The raw material of the laminate includes the above-mentioned epoxy-modified silicone resin composition or the above-mentioned prepreg.

Compared with the existing solutions, the present invention has the following beneficial effects:

The epoxy-modified silicone resin composition of the present invention is prepared by using epoxy-modified silicone resin with a specific structure of both epoxy groups and siloxy groups as one of the raw materials, together with functional resins and additives. As a result, the epoxy-modified silicone resin composition can give full play to the good mechanical properties, adhesive properties, and excellent electrical insulation properties of the epoxy resin, and can also give full play to the high temperature aging resistance, ultraviolet light resistance, and UV resistance of the silicone resin. Radiation resistance, the laminate prepared with the epoxy modified silicone resin composition of the present invention as a raw material, compared with the traditional ordinary laminate, the performance is greatly improved, when used as the substrate of the LED element, it can effectively Improve the luminous effect of LED and extend the service life.

Detailed ways

The present invention will be further described in detail below in conjunction with specific embodiments. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The term "and/or" as used herein includes any and all combinations of one or more related listed items.

An epoxy-modified silicone resin composition is prepared from raw materials including the following parts by weight:

Epoxy modified silicone resin 10 parts-70 parts,

Functional resin 10-30 copies,

Assistant 15 copies-100 copies,

The epoxy-modified silicone resin has a structure represented by formula I:

Formula I

among them,

R ₁ is methyl, ethyl or phenyl;

R ₂ is methyl or phenyl;

R ₃ is methyl or phenyl;

m is an integer in the range of 1-20;

n is an integer in the range of 1-20.

The epoxy-modified silicone resin with the above-mentioned structure contains both epoxy groups and siloxy groups on the molecular chain, which not only has good mechanical properties, adhesive properties, excellent electrical insulation properties, and can withstand high temperature aging, Resistant to ultraviolet light and radiation.

Wherein, in the structure of the epoxy-modified silicone resin, the molar ratio of the organic substituent (R) to the silicon atom (Si), that is, the R/Si value, has a great relationship with the quality of the epoxy-modified silicone resin , It will affect the curability, flexibility, hardness, heat resistance and heat cracking resistance of epoxy modified silicone resin. Wherein, the organic substituent R represents the organic functional groups R ₁ , R ₂ , R ₃ , -C ₆ H ₅ and -CH _{3 in} the formula I, and the value of R/Si is R ₁ , R ₂ , R ₃ , -C The ratio of the total moles of ₆ H ₅ and -CH _{3 to the moles of silicon atoms.}

Preferably, the R/Si value is 1.5-2.0.

More preferably, the R/Si value is 1.75-1.85.

Preferably, the molecular weight of the epoxy-modified silicone resin is 1,000 to 30,000.

More preferably, the molecular weight of the epoxy-modified silicone resin is 1,000-15,000.

The preparation method of the above epoxy modified silicone resin is as follows:

Mix 100-300 parts of tetramethyltetraphenylcyclotetrasiloxane monomer, 50-250 parts of T-segment organosilicon monomer and 30-100 parts of capping agent, heat up to 50-80°C and reduce pressure to remove Water for 1h-2h, and then add 0.02%-0.08% of the total weight of the tetramethyltetraphenylcyclotetrasiloxane monomer, T-segment silicone monomer and capping agent with an acid catalyst, and heat preservation reaction for 4h- 10h, adjust the pH value to 6-7, filter and distill under reduced pressure to remove unreacted monomers to obtain vinyl-terminated silicone resin;

Add 10-50 parts of oxidizing agent to 10-50 parts of the vinyl-terminated silicone resin at a temperature of -5-5℃, react at a temperature of 5-10℃ for 10min-60min, and then add 1-10 parts of a reducing agent , Stirring for 10min-60min, and drying after extraction to obtain epoxy-modified silicone resin.

In the above preparation method, tetramethyltetraphenylcyclotetrasiloxane monomer, T-link organosilicon monomer (organosilicon trifunctional unit), and capping agent are used as reactive monomers, and under the action of an acid catalyst, First, a vinyl-terminated silicone resin was prepared. Then, the vinyl-terminated silicone resin prepared above is further oxidized with an oxidizing agent, and then a reducing agent is added to consume the excess oxidizing agent, and finally an epoxy-modified silicone resin is obtained, which avoids the epoxy resin, Compatibility issues between silicone resins, lower preparation costs.

Understandably, the R/Si value can be adjusted by controlling the ratio of reaction monomers.

Preferably, 100-200 parts of tetramethyltetraphenylcyclotetrasiloxane monomer, 50-150 parts of T-link silicone monomer and 30-60 parts of capping agent are mixed, and the temperature is increased to 50-80°C. Remove water under reduced pressure for 1h-2h, then add 0.02%-0.05% of the total weight of the tetramethyltetraphenylcyclotetrasiloxane monomer, T-segment silicone monomer and capping agent, and keep the temperature warm. React for 4h-10h, adjust the pH value to 6-7, filter and distill under reduced pressure to remove unreacted monomers to obtain vinyl-terminated silicone resin.

Preferably, the tetramethyltetraphenylcyclotetrasiloxane monomer is selected from 2,2,4,4-tetramethyl-6,6,8,8-tetraphenylcyclotetrasiloxane, 1 ,1,5,5-tetramethyl-1,3,3,5-tetraphenylcyclotetrasiloxane and 2,4,6,8-tetramethyl-2,4,6,8-tetraphenyl One or more of Cyclotetrasiloxane.

Preferably, the T-link organosilicon monomer is selected from methyl tris(dimethylsiloxy) silane, ethyl tris(dimethylsiloxy) silane, phenyl tris(dimethylsilyl) Any one of oxyalkyl) silanes.

Preferably, the capping agent is selected from 1,1,3,3-tetramethyl-1,3-divinyldisiloxane, 1,3-dimethyl-1,3-diphenyl- Any one of 1,3-divinyldisiloxane and 1,1,3,3-tetraphenyl-1,3-divinyldisiloxane.

Preferably, the acid catalyst is selected from any one of sulfuric acid, phosphoric acid, trifluoromethanesulfonic acid and toluenesulfonic acid.

Preferably, the oxidant is selected from one or more of sodium hypochlorite and dilute sulfuric acid.

Preferably, the reducing agent is sodium sulfite.

The synthetic route of the epoxy modified silicone resin is as follows:

Polymerization between monomers:

The capping agent terminates the polymerization reaction:

Vinyl epoxidation:

Understandably, the functional resin is selected from one or more of epoxy resin and bismaleimide.

The epoxy resin includes, but is not limited to, one of cycloaliphatic epoxy resin, hydrogenated bisphenol A epoxy resin, glycidyl ester epoxy resin, cyanuric acid epoxy resin, hydantoin epoxy resin, etc. Or multiple.

The bismaleimide includes, but is not limited to, one or more of diphenylmethane bismaleimide, N`-m-phenylene bismaleimide, and polyamino bismaleimide, etc. Kind.

The auxiliary agents are curing agents, fillers, coupling agents, curing accelerators, and the like.

In a preferred embodiment, the epoxy-modified silicone resin composition is prepared from raw materials including the following parts by weight:

The curing agent includes, but is not limited to, cyanate ester curing agent, aliphatic polyamine curing agent, aromatic amine curing agent, polyamide curing agent, Lewis acid-amine complex curing agent, acid anhydride curing agent and phenolic aldehyde One or more types of curing agents.

The filler includes, but is not limited to, one of titanium dioxide, silicon dioxide, magnesium oxide, magnesium hydroxide, talc, mica powder, aluminum oxide, silicon carbide, boron nitride, aluminum nitride, molybdenum oxide, barium sulfate, etc. Or multiple.

The coupling agent includes, but is not limited to, one or more of silane coupling agents, titanate coupling agents, aluminate coupling agents, and organic chromium complex coupling agents.

The curing accelerator includes, but is not limited to, imidazole accelerators, peroxide accelerators, azo accelerators, tertiary amine accelerators, phenol accelerators, organic metal salt accelerators, inorganic metal salt accelerators, etc. One or more of.

A prepreg whose raw material includes the above-mentioned epoxy-modified silicone resin composition.

Understandably, the preparation method of the prepreg includes the following steps:

The above-mentioned resin composition is covered on the surface of the reinforcing material by an impregnation method, and heated to semi-cured to obtain a prepreg.

Preferably, the process parameters of the semi-curing are: heating to a constant temperature of 130-250° C. for 2 min-10 min.

It should be understood that the reinforcing material is a well-known inorganic or organic fiber material. The inorganic fibrous reinforcing substrate includes but is not limited to glass fiber (including E, NE, D, S, T and other different types), carbon fiber, silicon carbide fiber , Asbestos fiber, etc. Organic fiber reinforced substrates include, but are not limited to, nylon, ultra-high molecular weight polyethylene fibers, aramid fibers, polyimide fibers, polyester fibers, cotton fibers, and the like.

A laminate, the raw material of which comprises the above-mentioned epoxy-modified silicone resin composition or the above-mentioned prepreg.

Understandably, the preparation method of the laminate includes the following steps:

A number of the above-mentioned prepregs are laminated.

Preferably, the process parameters of the lamination are: under the conditions of a temperature of 150-300° C., a pressure of 10 kgf/cm ² -30 kgf/cm ² , and a degree of vacuum of less than 2 kPa, hot pressing for 100 min-300 min.

The "several of the prepregs" refers to at least one of the prepregs.

It should be noted that, during lamination, several of the prepregs, that is, one side or both sides of the laminate, can be clad with metal copper foil, and then laminated to obtain a metal-clad copper foil laminate.

Preferably, the thickness of the metal copper foil is 3 μm-35 μm.

The following is a further description in conjunction with specific examples. Unless otherwise specified, all the raw materials described in the present invention can be sourced and sold commercially.

Hydrogenated bisphenol A epoxy resin can be purchased from Guodu Chemical, the model is ST-1000.

The cycloaliphatic epoxy resin can be purchased from Daicel, the model is 2021P.

Bismaleimide can be purchased from KI-Chemical, and the model is BMI-70.

Silicone resin can be purchased from Elecco, model SC2006.

Example 1

This embodiment provides a white epoxy-modified silicone resin composition, prepreg and laminate, and the preparation method is as follows:

Dissolve 70 parts of epoxy-modified silicone resin, 10 parts of hydrogenated bisphenol A epoxy resin, and 5 parts of acid anhydride curing agent in a mixed solvent of methyl ethyl ketone, toluene and propylene glycol methyl ether. Among them, methyl ethyl ketone, toluene and Propylene glycol methyl ether is mixed in a mass ratio of 1:1:1. Under stirring conditions, add 10 parts of titanium dioxide, 25 parts of silicon dioxide, 0.1 parts of silane coupling agent and 2 parts of 2-methylimidazole, and continue to stir to obtain a uniform glue solution, namely epoxy-modified silicon Resin composition.

The 2116 glass fiber cloth (basis weight 105g/m ² ) was immersed in the epoxy-modified silicone resin composition, and baked in a hot-air circulating oven at 180°C for 3 minutes to obtain a prepreg with a resin content of 50%.

Laminate 4 sheets of prepreg, and cover the upper and lower sides of the laminate with an electrolytic copper foil with a thickness of 12μm, and place them in a vacuum press with programmable temperature and pressure. In a vacuum state, at a temperature of 25kgf/cm ² Cure for 100 minutes under pressure and at a temperature of 200°C to form a copper clad laminate with a thickness of 0.4 mm.

Example 2

This embodiment provides a white epoxy-modified silicone resin composition, prepreg and laminate, and the preparation method is as follows:

Dissolve 10 parts of epoxy-modified silicone resin, 30 parts of alicyclic epoxy resin, and 30 parts of anhydride curing agent in a mixed solvent of methyl ethyl ketone, toluene and propylene glycol methyl ether. Among them, methyl ethyl ketone, toluene and propylene glycol Methyl ether is mixed in a mass ratio of 1:1:1. Under stirring conditions, add 10 parts of titanium dioxide, 10 parts of alumina, 40 parts of silicon dioxide, 2 parts of silane coupling agent and 0.1 part of 2-methylimidazole, and continue to stir to obtain a uniform glue solution. That is, epoxy modified silicone resin composition.

The 2116 glass fiber cloth (basis weight 105g/m ² ) was impregnated in the epoxy-modified silicone resin composition, and baked in a hot-air circulating oven at 180°C for 3 minutes to obtain a prepreg with a resin content of 55%.

Laminate 4 sheets of prepreg, and cover the upper and lower sides of the laminate with an electrolytic copper foil with a thickness of 12μm, and place them in a vacuum press with programmable temperature and pressure. In a vacuum state, at a temperature of 25kgf/cm ² It was cured under pressure for 100 minutes at a temperature of 200° C. to form a copper clad laminate with a thickness of 0.4 mm.

Example 3

This embodiment provides a white epoxy-modified silicone resin composition, prepreg and laminate, and the preparation method is as follows:

Dissolve 50 parts of epoxy-modified silicone resin, 20 parts of bismaleimide, and 20 parts of phenolic curing agent in a mixed solvent of methyl ethyl ketone, toluene and propylene glycol methyl ether. Among them, methyl ethyl ketone, toluene and propylene glycol Methyl ether is mixed in a mass ratio of 1:1:1. Under stirring conditions, add 10 parts of titanium dioxide, 10 parts of alumina, 25 parts of silica, 0.5 parts of silane coupling agent, 0.5 parts of 2-methylimidazole and 0.7 parts of dicumyl peroxide , Continue to stir to obtain a uniform glue solution, that is, epoxy modified silicone resin composition.

The 2116 glass fiber cloth (basis weight 105g/m ² ) was immersed in the epoxy-modified silicone resin composition, and baked in a hot-air circulating oven at 180°C for 3 minutes to obtain a prepreg with a resin content of 50%.

Laminate 4 pieces of prepreg, and cover the upper and lower sides of the laminate with an electrolytic copper foil with a thickness of 12 μm, and place them in a vacuum press with programmable temperature and pressure. In a vacuum state, at a temperature of 25kgf/cm ² Cure for 100 minutes at a temperature of 200°C under pressure to form a copper clad laminate with a thickness of 0.4 mm.

Example 4

This embodiment provides a white epoxy-modified silicone resin composition, prepreg and laminate, and the preparation method is as follows:

Dissolve 50 parts of epoxy-modified silicone resin, 10 parts of cycloaliphatic epoxy resin, and 15 parts of anhydride curing agent in a mixed solvent of methyl ethyl ketone, toluene and propylene glycol methyl ether. Among them, methyl ethyl ketone, toluene and propylene glycol Methyl ether is mixed in a mass ratio of 1:1:1. Under stirring conditions, add 10 parts of titanium dioxide, 10 parts of alumina, 0.2 parts of silane coupling agent and 0.8 parts of 2-methylimidazole, and continue to stir to obtain a uniform glue solution, namely epoxy modified silicone resin combination.

The 2116 glass fiber cloth (basis weight 105g/m ² ) was immersed in the epoxy-modified silicone resin composition, and baked in a hot-air circulating oven at 180°C for 3 minutes to obtain a prepreg with a resin content of 50%.

Laminate 4 sheets of prepreg, and cover the upper and lower sides of the laminate with an electrolytic copper foil with a thickness of 12μm, and place them in a vacuum press with programmable temperature and pressure. In a vacuum state, at a temperature of 25kgf/cm ² It was cured under pressure for 100 minutes at a temperature of 200° C. to form a copper clad laminate with a thickness of 0.4 mm.

Comparative example 1

This comparative example provides a white epoxy modified silicone resin composition, prepreg and laminate, and the preparation method is as follows:

Dissolve 40 parts of cycloaliphatic epoxy resin and 30 parts of acid anhydride curing agent in a mixed solvent of methyl ethyl ketone, toluene and propylene glycol methyl ether in sequence. Among them, methyl ethyl ketone, toluene and propylene glycol methyl ether are in a mass ratio of 1:1: 1 Mix. Under stirring conditions, add 10 parts of titanium dioxide, 10 parts of alumina, 40 parts of silicon dioxide, 2 parts of silane coupling agent and 0.1 part of 2-methylimidazole, and continue to stir to obtain a uniform glue solution. That is, epoxy modified silicone resin composition.

The 2116 glass fiber cloth (basis weight 105 g/m ² ) was immersed in the epoxy-modified silicone resin composition, and baked in a hot air circulating oven at 180° C. for 3 minutes to obtain a prepreg with a resin content of 50%.

Laminate 4 sheets of prepreg, and cover the upper and lower sides of the laminate with an electrolytic copper foil with a thickness of 12μm, and place them in a vacuum press with programmable temperature and pressure. In a vacuum state, at a temperature of 25kgf/cm ² It was cured under pressure for 100 minutes at a temperature of 200° C. to form a copper clad laminate with a thickness of 0.4 mm.

Comparative example 2

This comparative example provides a white epoxy modified silicone resin composition, prepreg and laminate, and the preparation method is as follows:

Dissolve 100 parts of silicone resin and 1 part of dibutyltin dilaurate in a mixed solvent of methyl ethyl ketone, toluene and propylene glycol methyl ether. Among them, methyl ethyl ketone, toluene and propylene glycol methyl ether are in a mass ratio of 1:1:1. mixing. Under stirring conditions, add 10 parts of titanium dioxide, 10 parts of alumina, and 0.7 parts of silane coupling agent, and continue to stir to obtain a uniform glue solution.

The 2116 glass fiber cloth (basis weight 105g/m ² ) was immersed in the above glue solution and baked in a hot air circulating oven at 180°C for 3 minutes to obtain a prepreg with a resin content of 50%.

Laminate 4 sheets of prepreg, and cover the upper and lower sides of the laminate with an electrolytic copper foil with a thickness of 12μm, and place them in a vacuum press with programmable temperature and pressure. In a vacuum state, at a temperature of 25kgf/cm ² It was cured under pressure for 100 minutes at a temperature of 200° C. to form a copper clad laminate with a thickness of 0.4 mm.

Performance Testing

Performance tests were performed on the products prepared in Examples 1-4 and Comparative Examples 1-2. The test methods are as follows, and the test results are shown in Table 1.

Peel strength: The test method is in accordance with IPC-TM-650 2.4.8.

High temperature yellowing resistance test: the copper clad laminate is etched to obtain a white laminate. The white laminate is cut into 4inch*4inch samples and placed in an oven at 200℃ for baking. The baking time is 4h and 24h respectively. , 72h, and then test its reflectivity and whiteness respectively, and compare with the unbaked sample.

Weather resistance test: the above-mentioned copper clad laminate is etched to obtain a white laminate. The obtained white laminate is cut into 4inch*4inch samples, placed in an ultraviolet light aging resistance test box, and placed at 85°C for 500h, 750h, Test the change of reflectance and whiteness after 1000h.

Table 1

The epoxy-modified silicone resin composition prepared in Examples 1-4 has high peel strength and good mechanical properties. After curing, it can maintain good whiteness for a long time, and the laminate prepared from it as a raw material has high High temperature yellowing resistance, weather resistance, used as the substrate of LED components, can effectively improve the luminous effect of the LED and prolong the service life.

Compared with Example 2, Comparative Example 1 did not add epoxy-modified silicone resin, but replaced it with the same weight of cycloaliphatic epoxy resin. While the cost increased, its high temperature yellowing and weather resistance were far inferior.

Example 2 illustrates that the addition of epoxy-modified silicone resin plays an important role in improving the weather resistance of the composition and even the laminate. Comparative Example 2 simply uses silicone resin material, and its peel strength is poor.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and their description is relatively specific and detailed, but they should not be understood as a limitation on the patent scope of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (12)

1. An epoxy-modified silicone resin composition, characterized in that it is prepared from raw materials comprising the following parts by weight:

   Epoxy modified silicone resin 10 parts-70 parts,

   Functional resin 10-30 copies,

   Assistant 15 copies-100 copies,

   The epoxy-modified silicone resin has a structure represented by formula I:

   

   Wherein, R ₁ is methyl, ethyl or phenyl;

   R ₂ is methyl or phenyl;

   R ₃ is methyl or phenyl;

   m is an integer in the range of 1-20;

   n is an integer in the range of 1-20.
2. The epoxy-modified silicone resin composition according to claim 1, wherein the functional resin is selected from one or more of epoxy resin and bismaleimide.
3. The epoxy-modified silicone resin composition according to claim 2, wherein the epoxy resin is selected from cycloaliphatic epoxy resins, hydrogenated bisphenol A epoxy resins, glycidyl ester epoxy resins, One or more of cyanuric epoxy resin and hydantoin epoxy resin.
4. The epoxy-modified silicone resin composition according to claim 2, wherein the bismaleimide is selected from the group consisting of diphenylmethane bismaleimide, N`-m-phenylene bismaleimide One or more of imine and polyamino bismaleimide.
5. The epoxy-modified silicone resin composition according to any one of claims 1 to 4, wherein the auxiliary agent is selected from one or more of curing agents, fillers, coupling agents and curing accelerators .
6. The epoxy-modified silicone resin composition according to claim 5, wherein it is prepared from raw materials comprising the following parts by weight:

   
7. The epoxy-modified silicone resin composition according to claim 6, wherein the curing agent is selected from the group consisting of cyanate ester curing agents, aliphatic polyamine curing agents, aromatic amine curing agents, and polyamide curing agents. One or more of Lewis acid-amine complex curing agent, acid anhydride curing agent and phenolic curing agent.
8. The epoxy-modified silicone resin composition according to claim 6, wherein the filler is selected from the group consisting of titanium dioxide, silicon dioxide, magnesium oxide, magnesium hydroxide, talc, mica powder, alumina, silicon carbide, One or more of boron nitride, aluminum nitride, molybdenum oxide, and barium sulfate.
9. The epoxy-modified silicone resin composition according to claim 6, wherein the coupling agent is selected from the group consisting of silane coupling agents, titanate coupling agents, aluminate coupling agents and organic chromium complexes. One or more of the compound coupling agent.
10. The epoxy-modified silicone resin composition according to claim 6, wherein the curing accelerator is selected from the group consisting of imidazole accelerators, peroxide accelerators, azo accelerators, and tertiary amine accelerators , One or more of phenolic accelerators, organic metal salt accelerators and inorganic metal salt accelerators.
11. A prepreg, characterized in that the raw material of the prepreg comprises the epoxy-modified silicone resin composition according to any one of claims 1-10.
12. A laminate, characterized in that the raw material of the laminate comprises the epoxy-modified silicone resin composition according to any one of claims 1-10, or the prepreg according to claim 11.