WO2021119897A1 - Transmission line - Google Patents
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- WO2021119897A1 WO2021119897A1 PCT/CN2019/125516 CN2019125516W WO2021119897A1 WO 2021119897 A1 WO2021119897 A1 WO 2021119897A1 CN 2019125516 W CN2019125516 W CN 2019125516W WO 2021119897 A1 WO2021119897 A1 WO 2021119897A1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Definitions
- the invention relates to the field of signal transmission, in particular to a transmission line.
- the existing coaxial transmission line layout requires a certain amount of space and has certain limitations for the high-speed development of terminal products.
- due to the low profile characteristics of flat transmission lines the use of terminal products is becoming more and more widespread.
- the symmetrically designed flexible board used in the existing planar transmission line such as the strip line has a high cost, a complicated process, and a high production cost.
- the object of the present invention is to provide a transmission line that can reduce the production cost.
- a transmission line of the present invention includes a first ground layer, a second ground layer, a signal layer located between the first ground layer and the second ground layer, and a signal layer located between the first ground layer and the signal layer Between the signal layer and the second ground layer, the distance between the signal layer and the first ground layer and the distance between the signal layer and the second ground layer The distance varies.
- the number of substrate layers between the first ground layer and the signal layer is different from the number of substrate layers between the signal layer and the second ground layer.
- the distance between the signal layer and the first ground layer is smaller than the distance between the signal layer and the second ground layer.
- the multilayer substrate layer includes a first substrate layer located between the signal layer and the first ground layer, and a second substrate layer located between the signal layer and the second ground layer.
- a material layer and a third substrate layer, and the second substrate layer is located between the first substrate layer and the third substrate layer.
- the substrate layer is made of LCP material.
- the first ground layer, the second ground layer and the signal layer are all copper layers on the surface of the substrate layer.
- it further comprises a first protective layer covering the outer side of the first ground layer and a second protective layer covering the outer side of the second ground layer.
- the beneficial effect of the present invention is that by designing the distance between the signal layer and the first ground layer and the second ground layer to be unequal, that is, an asymmetric structure, more substrate layer solutions can be flexibly selected, and at the same time, By adopting this structure, at least one substrate layer can be reduced, and the production cost can be reduced.
- FIG. 1 is a schematic diagram of a cross-sectional structure of a transmission line provided by an embodiment of the present invention.
- a transmission line 100 includes a first ground layer 101, a second ground layer 102, and a plurality of substrates arranged between the first ground layer 101 and the second ground layer 102 Layer, and a signal layer 105 disposed on the substrate layer.
- a first protective layer 106 and a second protective layer 107 are provided on the outer sides of the first ground layer 101 and the second ground layer 102 (that is, the side away from the substrate layer), respectively.
- the first protection layer 106 and the second protection layer 107 are used to protect the first ground layer 101 and the second ground layer 102, respectively.
- the first ground layer 101, the second ground layer 102, the substrate layer, the signal layer 105, and the protective layer 106 are all pressed together by a press to form an integrated flexible circuit board.
- the transmission line 100 includes a first protective layer 106, a first ground layer 101, a first substrate layer 1031, a signal layer 105, a third substrate layer 1033, a second substrate layer 1032, a second ground layer, which are sequentially stacked. 102 and a second protective layer 107.
- both the first ground layer 101 and the second ground layer 102 are copper layers on the surface of the substrate layer, which are used as the reference ground of the transmission line.
- a first substrate layer 1031 is provided between the first ground layer 101 and the third substrate layer 1033.
- the transmission line 100 also includes a plurality of metalized blind holes 110 for connecting the lines in the first ground layer 101 and the lines in the signal layer 105.
- the surface of the metalized blind hole 110 is a copper layer.
- the transmission line 100 also includes a plurality of metalized through holes 120 for connecting the first ground layer 101 and the second ground layer 102.
- the surface of the metalized through holes 120 is a copper layer, thereby realizing the first ground layer 101 and the second ground layer. Electrical connections between layers 102.
- the metalized through holes 120 and the metalized blind holes 110 are spaced apart from each other.
- the first base material layer 1031, the second base material layer 1032, and the third base material layer 1033 can be made of the same high-frequency material or different high-frequency materials.
- the design flexibility is high. , And maintain good radio frequency transmission performance.
- the high-frequency material is preferably an LCP (liquid crystal polymer) material.
- the signal layer 105 is disposed on the first substrate layer 1031, and the distance B between the signal layer 105 and the first ground layer 101 along the thickness direction T of the transmission line 100 and the signal layer 105 and the second ground layer
- the distance A between 102 along the thickness direction T of the transmission line 100 varies.
- the distance B between the signal layer 105 and the first ground layer 101 is smaller than the distance A between the signal layer 105 and the second ground layer 102, so as to form an asymmetrically designed flexible circuit board.
- the insertion loss of the transmission line of the asymmetric structure provided by the present invention is close to that of the transmission line of the symmetric structure in the prior art, thereby indicating that the transmission line of the asymmetric structure does not adversely affect the signal transmission performance of the transmission line.
- the distance between the signal layer and the ground layers on both sides of it is usually set equal to form a symmetrical structure.
- the distance between the signal layer and the ground layer on one side is usually set to 75 ⁇ m, and the distance is achieved by stacking a 50 ⁇ m substrate and a 25 ⁇ m substrate.
- the 150 ⁇ m strip line includes a total of four substrate layers.
- the distance between the signal layer and the ground layers on both sides of the signal layer is not equal, and the number of substrate layers on both sides of the signal layer can also be different.
- it can be set on the signal layer side. One layer of 50 ⁇ m substrate, and two layers of 50 ⁇ m substrate on the other side of the signal layer. Then, the 150 ⁇ m strip line includes only three substrate layers in total, and the cost is lower.
- the asymmetrically designed flexible circuit board provided by the present invention can flexibly select more substrate layer solutions, and at the same time, the use of this structure can reduce at least one Layer base material layer, production cost is reduced.
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Abstract
Provided are a transmission line, comprising a first grounding layer, a second grounding layer, a signal layer located between the first grounding layer and the second grounding layer, and a base material layer located between the first grounding layer and the signal layer or between the signal layer and the second grounding layer. The distance between the signal layer and the first grounding layer is not equal to the distance between the signal layer and the second grounding layer.
Description
本发明涉及信号传输领域，尤其涉及一种传输线。The invention relates to the field of signal transmission, in particular to a transmission line.
现有的同轴传输线布局上需要一定的空间，对于高速发展的终端产品内部有一定的局限性，而平面传输线由于具有低剖面的特点，因此在终端产品内的使用也越来越广泛。但现有的平面传输线如带状线使用的对称设计的挠性板成本高，工艺复杂，且生产成本高。The existing coaxial transmission line layout requires a certain amount of space and has certain limitations for the high-speed development of terminal products. However, due to the low profile characteristics of flat transmission lines, the use of terminal products is becoming more and more widespread. However, the symmetrically designed flexible board used in the existing planar transmission line such as the strip line has a high cost, a complicated process, and a high production cost.
因此，有必要提供一种改善上述问题的传输线。Therefore, it is necessary to provide a transmission line that improves the above-mentioned problems.
本发明的目的在于提供一种可使生产成本降低的传输线。The object of the present invention is to provide a transmission line that can reduce the production cost.
为实现上述目的，本发明一种传输线，包括第一接地层、第二接地层、位于第一接地层与第二接地层之间的信号层以及位于所述第一接地层和所述信号层之间或所述信号层和所述第二接地层之间的基材层，所述信号层与所述第一接地层之间的距离与所述信号层与所述第二接地层之间的距离不等。To achieve the above objective, a transmission line of the present invention includes a first ground layer, a second ground layer, a signal layer located between the first ground layer and the second ground layer, and a signal layer located between the first ground layer and the signal layer Between the signal layer and the second ground layer, the distance between the signal layer and the first ground layer and the distance between the signal layer and the second ground layer The distance varies.
优选地，所述第一接地层与所述信号层之间的基材层层数与所述信号层与所述第二接地层之间的基材层层数不等。Preferably, the number of substrate layers between the first ground layer and the signal layer is different from the number of substrate layers between the signal layer and the second ground layer.
优选地，所述信号层与第一接地层之间的距离小于所述信号层与所述第二接地层之间的距离。Preferably, the distance between the signal layer and the first ground layer is smaller than the distance between the signal layer and the second ground layer.
优选地，所述多层基材层包括位于所述信号层与所述第一接地层之间的第一基材层，位于所述信号层与所述第二接地层之间的第二基材层和第三基材层，所述第二基材层位于所述第一基材层和所述第三基材层之间。Preferably, the multilayer substrate layer includes a first substrate layer located between the signal layer and the first ground layer, and a second substrate layer located between the signal layer and the second ground layer. A material layer and a third substrate layer, and the second substrate layer is located between the first substrate layer and the third substrate layer.
优选地，所述基材层由LCP材料制成。Preferably, the substrate layer is made of LCP material.
优选地，所述第一接地层、第二接地层及所述信号层均均为所述基材层表面的铜层。Preferably, the first ground layer, the second ground layer and the signal layer are all copper layers on the surface of the substrate layer.
优选地，还包括分别包覆在所述第一接地层外侧的第一保护层和所述第二接地层外侧的第二保护层。Preferably, it further comprises a first protective layer covering the outer side of the first ground layer and a second protective layer covering the outer side of the second ground layer.
本发明的有益效果在于：通过将信号层与第一接地层和第二接地层之间的距离设计成不等的，即非对称结构，可灵活地选择更多的基材层方案，同时，采用该种结构可减少至少一层基材层， 生产成本降低。The beneficial effect of the present invention is that by designing the distance between the signal layer and the first ground layer and the second ground layer to be unequal, that is, an asymmetric structure, more substrate layer solutions can be flexibly selected, and at the same time, By adopting this structure, at least one substrate layer can be reduced, and the production cost can be reduced.
图1为本发明实施例提供的传输线的剖面结构示意图。FIG. 1 is a schematic diagram of a cross-sectional structure of a transmission line provided by an embodiment of the present invention.
下面结合附图1和实施方式对本发明作进一步说明。The present invention will be further described below in conjunction with FIG. 1 and the embodiments.
需要说明的是，本发明实施例中所有方向性指示（诸如上、下、左、右、前、后、内、外、顶部、底部……）仅用于解释在某一特定姿态（如附图所示）下各部件之间的相对位置关系等，如果该特定姿态发生改变时，则该方向性指示也相应地随之改变。It should be noted that all directional indicators (such as up, down, left, right, front, back, inside, outside, top, bottom...) in the embodiments of the present invention are only used to explain that they are in a specific posture (as attached As shown in the figure below), the relative positional relationship between the components, etc., if the specific posture changes, the directional indication will also change accordingly.
还需要说明的是，当元件被称为“固定于”或“设置于”另一个元件上时，该元件可以直接在另一个元件上或者可能同时存在居中元件。当一个元件被称为“连接”另一个元件，它可以是直接连接另一个元件或者可能同时存在居中元件。It should also be noted that when an element is referred to as being "fixed on" or "disposed on" another element, the element may be directly on the other element or a centering element may exist at the same time. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time.
请参阅图1，依照本发明实施例提供的一种传输线100，包括第一接地层101、第二接地层102、设置在第一接地层101和第二接地层102之间的多个基材层，以及设置于基材层上的信号层105。优选地，该第一接地层101和第二接地层102的外侧（即远离所述基材层的一侧）分别设有第一保护层106和第二保护层107。第一保护层106和第二保护层107分别用于保护第一接地层101和第二接地层102。该第一接地层101、第二接地层102、基材层、信号层105以及保护层106均通过压机压合形成整体的柔性电路板。Referring to FIG. 1, a transmission line 100 according to an embodiment of the present invention includes a first ground layer 101, a second ground layer 102, and a plurality of substrates arranged between the first ground layer 101 and the second ground layer 102 Layer, and a signal layer 105 disposed on the substrate layer. Preferably, a first protective layer 106 and a second protective layer 107 are provided on the outer sides of the first ground layer 101 and the second ground layer 102 (that is, the side away from the substrate layer), respectively. The first protection layer 106 and the second protection layer 107 are used to protect the first ground layer 101 and the second ground layer 102, respectively. The first ground layer 101, the second ground layer 102, the substrate layer, the signal layer 105, and the protective layer 106 are all pressed together by a press to form an integrated flexible circuit board.
具体地，传输线100包括顺序堆叠的第一保护层106、第一接地层101、第一基材层1031、信号层105、第三基材层1033、第二基材层1032、第二接地层102以及第二保护层107。在本实施方式中，第一接地层101和第二接地层102均为基材层表面的铜层，用作传输线的参考地。第一接地层101与第三基材层1033之间设置有第一基材层1031。Specifically, the transmission line 100 includes a first protective layer 106, a first ground layer 101, a first substrate layer 1031, a signal layer 105, a third substrate layer 1033, a second substrate layer 1032, a second ground layer, which are sequentially stacked. 102 and a second protective layer 107. In this embodiment, both the first ground layer 101 and the second ground layer 102 are copper layers on the surface of the substrate layer, which are used as the reference ground of the transmission line. A first substrate layer 1031 is provided between the first ground layer 101 and the third substrate layer 1033.
传输线100还包括多个用于连接第一接地层101中线路和所述信号层105中线路之间的金属化盲孔110。金属化盲孔110的表面为铜层。The transmission line 100 also includes a plurality of metalized blind holes 110 for connecting the lines in the first ground layer 101 and the lines in the signal layer 105. The surface of the metalized blind hole 110 is a copper layer.
传输线100还包括多个用于连接第一接地层101和第二接地层102的金属化通孔120，该金属化通孔120的表面为铜层，从而实现第一接地层101与第二接地层102之间的电连接。金属化通孔120与金属化盲孔110相互间隔设置。The transmission line 100 also includes a plurality of metalized through holes 120 for connecting the first ground layer 101 and the second ground layer 102. The surface of the metalized through holes 120 is a copper layer, thereby realizing the first ground layer 101 and the second ground layer. Electrical connections between layers 102. The metalized through holes 120 and the metalized blind holes 110 are spaced apart from each other.
在本实施方式中，第一基材层1031、第二基材层1032和第三基材层1033，可采用相同的高频材料或分别采用不同的高频材料制成，该设计灵活性高，且保持良好的射频传输性能。该高频材料优选为LCP（liquid crystal polymer）材料。In this embodiment, the first base material layer 1031, the second base material layer 1032, and the third base material layer 1033 can be made of the same high-frequency material or different high-frequency materials. The design flexibility is high. , And maintain good radio frequency transmission performance. The high-frequency material is preferably an LCP (liquid crystal polymer) material.
在本发明中，信号层105设置于第一基材层1031上，则信号层105与第一接地层101之间沿该传输线100厚度方向T上的距离B与信号层105与第二接地层102之间沿该传输线100厚度方向T上的距离A不等。优选地，信号层105与第一接地层101之间的距离B小于信号层105与第二接地层102之间的距离A，从而构成非对称设计的柔性电路板。In the present invention, the signal layer 105 is disposed on the first substrate layer 1031, and the distance B between the signal layer 105 and the first ground layer 101 along the thickness direction T of the transmission line 100 and the signal layer 105 and the second ground layer The distance A between 102 along the thickness direction T of the transmission line 100 varies. Preferably, the distance B between the signal layer 105 and the first ground layer 101 is smaller than the distance A between the signal layer 105 and the second ground layer 102, so as to form an asymmetrically designed flexible circuit board.
本发明提供的非对称结构的传输线与现有技术中的对称结构的传输线的插入损耗接近，从而表明非对称结构的传输线并未对传输线的信号传输性能产生不良影响。The insertion loss of the transmission line of the asymmetric structure provided by the present invention is close to that of the transmission line of the symmetric structure in the prior art, thereby indicating that the transmission line of the asymmetric structure does not adversely affect the signal transmission performance of the transmission line.
现有的带状线结构，通常将信号层与其两侧的接地层的距离设置为相等，形成对称结构。例如，为了形成一个总厚150μm的带状线，通常会设置信号层与一侧接地层之间的距离为75μm，并通过叠设50μm基材和25μm的基材以实现该距离。那么，该150μm的带状线总共包括四层基材层。而本发明中，信号层和其两侧的接地层之间的距离不等，且信号层两侧的基材层层数也可不等，对于150μm的带状线，可在信号层一侧设置一层50μm的基材，在信号层的另一侧设置两层50μm的基材。那么，该150μm的带状线总共只包括三层基材层，成本更低。 In the existing stripline structure, the distance between the signal layer and the ground layers on both sides of it is usually set equal to form a symmetrical structure. For example, in order to form a strip line with a total thickness of 150 μm, the distance between the signal layer and the ground layer on one side is usually set to 75 μm, and the distance is achieved by stacking a 50 μm substrate and a 25 μm substrate. Then, the 150 μm strip line includes a total of four substrate layers. In the present invention, the distance between the signal layer and the ground layers on both sides of the signal layer is not equal, and the number of substrate layers on both sides of the signal layer can also be different. For a 150μm strip line, it can be set on the signal layer side. One layer of 50 μm substrate, and two layers of 50 μm substrate on the other side of the signal layer. Then, the 150 μm strip line includes only three substrate layers in total, and the cost is lower.
因此，相比现有技术中采用的对称设计的柔性电路板，本发明提供的非对称设计的柔性电路板可灵活地选择更多的基材层方案，同时，采用该种结构可减少至少一层基材层，生产成本降低。Therefore, compared with the symmetrically designed flexible circuit board used in the prior art, the asymmetrically designed flexible circuit board provided by the present invention can flexibly select more substrate layer solutions, and at the same time, the use of this structure can reduce at least one Layer base material layer, production cost is reduced.
以上所述的仅是本发明的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出改进，但这些均属于本发明的保护范围。The above are only the embodiments of the present invention. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present invention, but these all belong to the present invention. The scope of protection.
Claims (7)
- 一种传输线，包括第一接地层、第二接地层、位于第一接地层与第二接地层之间的信号层以及位于所述第一接地层和所述信号层之间或所述信号层和所述第二接地层之间的基材层，其特征在于，所述信号层与所述第一接地层之间的距离与所述信号层与所述第二接地层之间的距离不等。A transmission line includes a first ground layer, a second ground layer, a signal layer located between the first ground layer and the second ground layer, and a signal layer located between the first ground layer and the signal layer or between the signal layer and the signal layer. The substrate layer between the second ground layers is characterized in that the distance between the signal layer and the first ground layer is not equal to the distance between the signal layer and the second ground layer .
- 根据权利要求1所述的传输线，其特征在于，所述第一接地层与所述信号层之间的基材层层数与所述信号层与所述第二接地层之间的基材层层数不等。The transmission line according to claim 1, wherein the number of substrate layers between the first ground layer and the signal layer and the number of substrate layers between the signal layer and the second ground layer The number of layers varies.
- 根据权利要求1所述的传输线，其特征在于，所述信号层与第一接地层之间的距离小于所述信号层与所述第二接地层之间的距离。The transmission line according to claim 1, wherein the distance between the signal layer and the first ground layer is smaller than the distance between the signal layer and the second ground layer.
- 根据权利要求1或2所述的传输线，其特征在于，所述多层基材层包括位于所述信号层与所述第一接地层之间的第一基材层，位于所述信号层与所述第二接地层之间的第二基材层和第三基材层，所述第二基材层位于所述第一基材层和所述第三基材层之间。The transmission line according to claim 1 or 2, wherein the multilayer substrate layer comprises a first substrate layer located between the signal layer and the first ground layer, and is located between the signal layer and the first ground layer. The second base material layer and the third base material layer between the second grounding layer, and the second base material layer is located between the first base material layer and the third base material layer.
- 根据权利要求1所述的传输线，其特征在于，所述基材层由LCP材料制成。The transmission line according to claim 1, wherein the substrate layer is made of LCP material.
- 根据权利要求1所述的传输线，其特征在于，所述第一接地层、第二接地层及所述信号层均均为所述基材层表面的铜层。The transmission line according to claim 1, wherein the first ground layer, the second ground layer and the signal layer are all copper layers on the surface of the substrate layer.
- 根据权利要求1所述的传输线，其特征在于，还包括分别包覆在所述第一接地层外侧的第一保护层和所述第二接地层外侧的第二保护层。4. The transmission line according to claim 1, further comprising a first protective layer covering the outer side of the first grounding layer and a second protective layer covering the outer side of the second grounding layer, respectively.
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| PCT/CN2019/125516 WO2021119897A1 (en) | 2019-12-16 | 2019-12-16 | Transmission line |
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2019
- 2019-12-16 WO PCT/CN2019/125516 patent/WO2021119897A1/en active Application Filing
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101861051A (en) * | 2009-04-13 | 2010-10-13 | 鸿富锦精密工业（深圳）有限公司 | Flexible printed circuit board |
| WO2017122376A1 (en) * | 2016-01-13 | 2017-07-20 | 日立化成株式会社 | Multilayer transmission line plate |
| CN107834139A (en) * | 2017-10-20 | 2018-03-23 | 绵阳鑫阳知识产权运营有限公司 | A kind of transmission line structure of low-noise amplifier |
| CN109065223A (en) * | 2018-07-26 | 2018-12-21 | 维沃移动通信有限公司 | A kind of signal transmssion line and preparation method thereof, terminal device |
| CN110364798A (en) * | 2019-06-29 | 2019-10-22 | 瑞声精密制造科技(常州)有限公司 | A kind of transmission line |
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