WO2021115309A1 - 集成电路板以及电子设备 - Google Patents

集成电路板以及电子设备 Download PDF

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Publication number
WO2021115309A1
WO2021115309A1 PCT/CN2020/134813 CN2020134813W WO2021115309A1 WO 2021115309 A1 WO2021115309 A1 WO 2021115309A1 CN 2020134813 W CN2020134813 W CN 2020134813W WO 2021115309 A1 WO2021115309 A1 WO 2021115309A1
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WIPO (PCT)
Prior art keywords
circuit board
integrated circuit
heat dissipation
cavity
conductive coil
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PCT/CN2020/134813
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English (en)
French (fr)
Inventor
吴会兰
徐波
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维沃移动通信有限公司
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Application filed by 维沃移动通信有限公司 filed Critical 维沃移动通信有限公司
Publication of WO2021115309A1 publication Critical patent/WO2021115309A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications

Definitions

  • the present invention relates to the technical field of circuit boards, in particular to an integrated circuit board and a mobile terminal.
  • the invention provides a new type of integrated circuit board and electronic equipment.
  • the embodiment of the present invention provides an integrated circuit board to solve the problem that the circuit board cannot achieve rapid heat dissipation in the prior art.
  • an integrated circuit board comprising:
  • a circuit board assembly includes a first circuit board, and a second circuit board fixedly connected to the first circuit board;
  • the first circuit board and the second circuit board are enclosed to form a cavity, and components are arranged in the cavity;
  • a heat dissipation hole is provided on the circuit board assembly
  • a heat dissipation device is arranged in the cavity, and the heat dissipation device is electrically connected with the circuit board assembly.
  • the first circuit board and the second circuit board of the present invention are connected and enclosed to form a cavity, and components are arranged in the cavity; when the components are arranged in the cavity, the heat dissipation device arranged in the cavity can remove the heat generated by the components from The heat dissipation holes are discharged in time to prevent the heat generated by the components from being discharged in time, which affects the service life of the integrated circuit board.
  • an embodiment of the present invention also provides an electronic device, and the electronic device includes the above-mentioned integrated circuit board.
  • Applying the integrated circuit board of the present invention to an electronic device can enrich the functions of the electronic device and improve the user's experience; on the other hand, it also solves the problem that the existing electronic device generates heat after being used for a long time.
  • Fig. 1 is a schematic diagram of an integrated circuit board according to the first embodiment of the present invention.
  • Fig. 2 is a schematic diagram of an integrated circuit board according to a second embodiment of the present invention.
  • an integrated circuit board includes:
  • a circuit board assembly includes a first circuit board, and a second circuit board fixedly connected to the first circuit board;
  • the first circuit board and the second circuit board are enclosed to form a cavity, and components are arranged in the cavity;
  • a heat dissipation hole is provided on the circuit board assembly
  • a heat dissipation device is arranged in the cavity, and the heat dissipation device is electrically connected with the circuit board assembly.
  • the first circuit board and the second circuit board are connected and enclosed to form a cavity, and components are arranged in the cavity; when the components are arranged in the cavity, the heat dissipation device arranged in the cavity can dissipate the heat generated by the components It is discharged from the heat dissipation hole in time to prevent the heat generated by the components from being discharged in time, which affects the service life of the integrated circuit board.
  • the integrated circuit board includes a circuit board assembly
  • the circuit board assembly includes a first circuit board 101, and a first circuit board fixedly connected to the first circuit board 101.
  • Two circuit board 102 Two circuit board 102.
  • a cavity 108 is formed in the circuit board assembly, wherein the bottom wall of the cavity 108 can be provided with components 107.
  • components 107 are provided on the upper surface, the lower surface and the bottom wall of the second circuit board of the first circuit board.
  • the components 107 can also be arranged on the lower surface of the outer surface of the second circuit board.
  • an integrated circuit board with a three-dimensional structure is formed by integrating two circuit boards with different structures, which increases the space for arranging the components 107.
  • the integrated circuit board is applied to electronic equipment, it meets the needs of multifunctional electronic equipment without expanding the structure and volume of the electronic equipment.
  • the integrated circuit board includes a heat sink 103, and the heat sink 103 is electrically connected to the circuit board assembly.
  • the heat sink 103 is fixed on the circuit board assembly, the inner layer of the circuit board assembly corresponding to the fixed position of the heat sink 103 forms a conductive coil, and the heat sink 103 is electrically connected to the conductive coil.
  • the heat dissipation device 103 may be a fan, a heat sink, a heat sink, and the like.
  • the first circuit board and the second circuit board are enclosed to form a cavity 108, and a heat dissipation device 103 is disposed in the cavity; as shown in FIG. 1, the heat dissipation device 103 is disposed on the bottom wall of the second circuit board 102 On the bottom wall, a conductive coil 111 is formed on the inner layer of the bottom wall. Both ends of the conductive coil 111 are electrically connected to the heat sink 103. When the conductive coil 111 and the external charging coil generate electromagnetic induction, the conductive coil 111 is electrically connected to the heat sink 103.
  • the conductive coil 111 can drive the heat dissipation device 103 to work, and the heat dissipation device 103 can timely discharge the heat generated in the integrated circuit board from the heat dissipation hole 104 to avoid overheating of the heat in the integrated circuit board and cause safety hazards.
  • a through hole 110 is opened in the circuit board assembly, and both ends of the conductive coil 111 are electrically connected to the heat sink 103 through the through hole 110.
  • a through hole 110 connecting the bottom wall and the outer surface of the second circuit board is opened on the bottom wall of the second circuit board 102.
  • the two ends of the conductive coil 111 formed on the inner layer of the bottom wall are electrically connected to the heat sink 103 through the through hole 110.
  • the through hole 110 facilitates the electrical connection between the conductive coil and the heat sink 103; on the other hand, the opening of the through hole facilitates the smooth discharge of the heat generated in the integrated circuit board through the through hole.
  • a heat dissipation hole 104 is provided on the first circuit board 101.
  • a heat dissipation hole 104 is provided on the first circuit board 101.
  • the heat dissipation hole 104 is configured to discharge the heat generated in the integrated circuit board; on the other hand, the operation of the heat dissipation device can promptly discharge the heat in the integrated circuit board through the heat dissipation hole.
  • a heat dissipation hole is provided directly above the heat dissipation device, which is beneficial to promptly dissipate the heat in the integrated circuit board through the heat dissipation hole.
  • the conductive coil 111 in this example is a copper coil, and the conductive coil 111 can be formed on the inner layer of the circuit board assembly by way of line etching.
  • the method of forming the conductive coil 111 on the inner layer of the circuit board assembly is the same as the method of forming the conductive wire on the surface of the circuit board in the prior art, and the present invention will be repeated here.
  • a power module is provided on the circuit board assembly, and the heat sink 103 is electrically connected to the power module.
  • the power module is configured to provide power to the heat sink 103 and drive the heat sink 103 to work.
  • the operation of the heat sink 103 can discharge the heat generated in the integrated circuit board in time.
  • a control module 109 is provided on the circuit board assembly; the control module 109 is electrically connected to the circuit board assembly, and the control module 109 is configured to control the operation of the heat sink 103 .
  • the control module 109 can control the heat dissipation device to work in different ways.
  • the inner layer of the circuit board assembly forms a conductive coil 111
  • the heat sink 103 and the control module 109 are respectively electrically connected to the conductive coil 111; when the control module 109 senses the external charging coil, the control module 109 disconnects and conducts electricity. The electrical connection of the coil.
  • the conductive coil 111 and the external charging coil are electromagnetically induced to realize electrical communication between the conductive coil 111 and the heat dissipation device 103, and then the heat dissipation device 103 is driven to operate, and the heat generated by the integrated circuit board is timely discharged.
  • control module 109 when the control module 109 senses the external charging coil, the control module 109 is actively disconnected from the conductive coil, so that when the conductive coil 111 and the external charging coil are electromagnetically induced, the conductive coil 111 can specifically drive the heat sink 103 to work and improve the heat sink.
  • the work efficiency of 103 can in turn discharge the heat in the integrated circuit board in time.
  • the integrated circuit board also includes a power module, and the heat sink 103 and the control module 109 are electrically connected to the power module respectively.
  • the control module 109 does not sense the external charging coil, the control module 109 is electrically connected to the wire coil 111, and at the same time, the control module 109 can drive the power module to supply power to the heat sink 103, drive the heat sink 103 to operate, and remove the heat in the integrated circuit board in time. discharge.
  • a first groove is formed on the second circuit board 102, for example, the second circuit board 102 has a U-shaped structure.
  • the first groove and the first circuit board form the cavity 108.
  • a cavity is formed in the circuit board assembly.
  • the upper and lower surfaces of the first circuit board and the bottom wall of the cavity can be used to install components. Therefore, the integrated circuit board of the present invention does not expand the area of the integrated circuit board. Bottom, can accommodate and attach more components.
  • a second groove 208b is formed in the cavity 208a, and the heat dissipation device 203 is disposed in the second groove.
  • a second groove is formed on an inner wall of the cavity 208a, and the space formed by the second groove is larger than the volume occupied by the heat dissipation device 203.
  • a second groove 208b is formed on the bottom wall of the cavity 208a, wherein the heat dissipation device 203 is arranged in the second groove 208b, which is beneficial to reduce the overall thickness of the integrated circuit board.
  • the integrated circuit board includes a circuit board assembly
  • the circuit board assembly includes a first circuit board 201, and a second circuit board 202 fixedly connected to the first circuit board 201 .
  • a cavity 208a is formed in the circuit board assembly, wherein the bottom wall of the cavity 208a can be provided with components 207.
  • a second groove 208b is formed on the bottom wall of the cavity 208a, wherein the heat dissipation device 203 is arranged in the second groove 208b, which is beneficial to reduce the space of the integrated circuit board while not reducing the space for accommodating the components 207.
  • the overall thickness is beneficial to reduce the space of the integrated circuit board while not reducing the space for accommodating the components 207.
  • a heat dissipation device is provided in the cavity 208a, and the heat dissipation device 203 is electrically connected to the circuit board assembly, and a heat dissipation hole 204 is provided in the circuit board assembly.
  • the heat dissipation device arranged in the cavity can discharge the heat generated by the components from the heat dissipation holes in time to prevent the heat generated by the components from being discharged in time and affect the service life of the integrated circuit board.
  • the inner layer of the circuit board assembly corresponding to the fixed position of the heat sink 203 forms a conductive coil, and the heat sink 203 is electrically connected to the conductive coil.
  • the heat sink 203 is fixed in the second groove 208b, wherein the inner layer of the bottom wall of the second groove is formed with a conductive coil 211, and both ends of the conductive coil 211 are electrically connected to the heat sink 203.
  • the conductive coil 211 and the external charging coil generate electromagnetic induction
  • the conductive coil 211 is electrically connected to the heat sink.
  • the conductive coil 211 can drive the heat sink 203 to work.
  • the heat sink 203 can discharge the heat generated in the integrated circuit board in time to avoid the integrated circuit board. The internal heat is overheated, causing safety hazards.
  • a through hole 210 is provided in the circuit board assembly, and two ends of the conductive coil 211 are electrically connected to the heat sink 203 through the through hole 210.
  • the second groove 208b is provided with a through hole 210 connecting the second groove and the outer surface of the second circuit board.
  • the two ends of the conductive coil 211 are electrically connected to the heat dissipation device 203 through the through hole 210.
  • the through hole 210 facilitates the electrical connection between the conductive coil and the heat sink 203; on the other hand, the opening of the through hole facilitates the smooth discharge of the heat generated in the integrated circuit board through the through hole.
  • a control module 209 is provided on the circuit board assembly; the control module 209 is electrically connected to the circuit board assembly, and the control module 209 is configured to control the operation of the heat sink 203 .
  • the control module 209 can control the heat dissipation device to work in different ways.
  • a conductive coil 211 is formed on the inner layer of the circuit board assembly, and the heat sink 203 and the control module 209 are respectively electrically connected to the conductive coil 211; in this example, a conductive coil 211 is formed on the inner layer corresponding to the second groove 208b, The control module 209 is arranged on the side wall of the cavity 208a.
  • control module 209 When the control module 209 senses the external charging coil, the control module 209 disconnects the electrical connection with the conductive coil 211. At this time, the conductive coil 211 and the external charging coil are electromagnetically induced to realize electrical communication between the conductive coil 211 and the heat dissipation device 203, and then the heat dissipation device 203 is driven to operate, and the heat generated by the integrated circuit board is discharged in time.
  • control module 209 when the control module 209 senses the external charging coil, the control module 209 is actively disconnected from the conductive coil, so that when the conductive coil 211 and the external charging coil are electromagnetically induced, the conductive coil 211 can specifically drive the heat dissipation device 203 to work, improving the heat dissipation device The work efficiency of 203 can in turn discharge the heat in the integrated circuit board in time.
  • the integrated circuit board also includes a power module, and the heat sink 203 and the control module 209 are electrically connected to the power module, respectively.
  • the control module 209 does not sense the external charging coil, the control module 209 is electrically connected to the wire coil 211, and can drive the power module to supply power to the heat sink 203, drive the heat sink 203 to operate, and discharge the heat in the integrated circuit board in time.
  • a heat dissipation hole 204 is provided on the first circuit board 201.
  • the heat dissipation hole 204 is configured to dissipate the heat generated in the integrated circuit board; on the other hand, when the heat dissipation device is operated, the heat in the integrated circuit board is quickly discharged through the heat dissipation hole.
  • a heat dissipation hole is provided above the heat dissipation device, which is beneficial for the heat in the integrated circuit board to be quickly discharged through the heat dissipation hole.
  • the first circuit board and the second circuit board are welded and fixed.
  • pads 106 are respectively provided on the opposite surfaces of the first circuit board 101 and the second circuit board 102, and the two pads are fixed by soldering with a solder paste 105.
  • pads 206 are respectively provided on the opposite surfaces of the first circuit board 201 and the second circuit board 202, and the two pads are fixed by soldering with a solder paste 205.
  • the electrical performance connection between the first circuit board and the second circuit board is realized by welding.
  • a metal elastic sheet is provided on a surface of the first circuit board away from the second circuit board, and the second circuit board and the metal elastic sheet are fixedly connected by a fastener.
  • a metal shrapnel can be arranged on the pad on the upper surface of the first circuit board, and the metal shrapnel and the second circuit board can use screws.
  • the first circuit board and the second circuit board are electrically connected by metal shrapnel.
  • an electronic device includes the above-mentioned integrated circuit board.
  • applying the integrated circuit board of the present invention to an electronic device can enrich the functions of the electronic device and improve the user's experience; on the other hand, it also solves the problem of heating of the electronic device after the existing electronic device is used for a long time.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种集成电路板以及电子设备。集成电路板包括：电路板组件，电路板组件包括第一电路板（101），和与第一电路板（101）固定连接的第二电路板（102）；第一电路板（101）与第二电路板（102）围合形成腔体（108），腔体（108）内设置有元器件（107）；电路板组件上开设散热孔（104）；在腔体（108）内设置散热装置（103），散热装置（103）与电路板组件电连接。

Description

集成电路板以及电子设备
相关申请的交叉引用
本申请主张在2019年12月10日在中国提交的中国专利申请号No.201911261741.4的优先权，其全部内容通过引用包含于此。
技术领域
本发明涉及电路板技术领域，具体地涉及一种集成电路板以及移动终端。
背景技术
为满足用户的极致体验，电子设备的功能越来越丰富，对应的电子设备内的各种功能模块越来越多。
因此在各种功能模块越来越多的情况下，如何散热是亟需解决的问题。
本发明提供一种新型的集成电路板以及电子设备。
发明内容
本发明实施例提供一种集成电路板，以解决现有技术中电路板无法实现快速散热的问题。
为了解决上述技术问题，本发明是这样实现的：一种集成电路板，所述集成电路板包括：
电路板组件，所述电路板组件包括第一电路板，和与所述第一电路板固定连接的第二电路板；
所述第一电路板与第二电路板围合形成腔体，所述腔体内设置有元器件；
所述电路板组件上开设散热孔；
在所述腔体内设置散热装置，所述散热装置与电路板组件电连接。
本发明第一电路板与第二电路板连接围合形成腔体，在腔体内设置有元器件；当在腔体内设置元器件时，设置在腔体内的散热装置能够将元器件产生的热量从散热孔中及时排出，避免元器件产生的热量不能够及时排出，影响集成电路板的使用寿命。
第一方面，本发明实施例还提供了一种电子设备，所述电子设备包括上述所述的集成电路板。
将本发明的集成电路板应用到电子设备中，能够丰富电子设备的功能，提高用户的体验感；另一方面也解决了现有电子设备在长时间使用之后电子设备发热的问题。
通过以下参照附图对本发明的示例性实施例的详细描述，本发明的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本发明的实施例，并且连同其说明一起用于解释本发明的原理。
图1所示为本发明第一实施例集成电路板的示意图。
图2所示为本发明第二实施例集成电路板的示意图。
具体实施方式
现在将参照附图来详细描述本发明的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本发明的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本发明及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
根据本发明的一个实施例，提供一种集成电路板。所述集成电路板包括：
电路板组件，所述电路板组件包括第一电路板，和与所述第一电路板固定连接的第二电路板；
所述第一电路板与第二电路板围合形成腔体，所述腔体内设置有元器件；
所述电路板组件上开设散热孔；
在所述腔体内设置散热装置，所述散热装置与电路板组件电连接。
本例子中第一电路板与第二电路板连接围合形成腔体，在腔体内设置有元器件；当在腔体内设置元器件时，设置在腔体内的散热装置能够将元器件产生的热量从散热孔中及时排出，避免元器件产生的热量不能够及时排出，影响集成电路板的使用寿命。
在一个可选地实施例中，如图1所示，所述集成电路板包括电路板组件，所述电路板组件包括第一电路板101，和与所述第一电路板101固定连接的第二电路板102。
其中第一电路板101与第二电路板102固定连接连接之后，使得电路板组件内形成腔体108，其中腔体108的底壁都可以设置元器件107。
如图1所示，本例子在第一电路板的上表面，下表面和第二电路板的底壁均设置元器件107。其中还可以在第二电路板中外表面的下表面设置元器件107。本例子通过集成两种不同结构的电路板形成立体结构的集成电路板，增加了设置元器件107的空间。当所述集成电路板应用到电子设备中，在不扩大电子设备结构和体积的情况下，满足了多功能电子设备的需求。
所述集成电路板包括散热装置103，散热装置103与电路板组件电连接。例如当散热装置103固定在电路板组件上，与散热装置103的固定位置对应的电路板组件的内层形成导电线圈，散热装置103与导电线圈电连接。例如所述散热装置103可以是风扇，散热片，散热器等。
具体地，所述第一电路板与第二电路板围合形成腔体108，在所述腔体内设置散热装置103；如图1所示，散热装置103设置在第二电路板102的底壁上，在底壁的内层形成有导电线圈111，导电线圈111两端分别与散热装置103电连接，当所述导电线圈111与外部充电线圈产生电磁感应时，导电线圈111与散热装置电连通，导电线圈111能够驱动散热装置103工作，散热装置103能够将集成电路板内产生的热量从散热孔104及时排出，避免集成电路板内热量过热，引发安全隐患。
可选地，所述电路板组件内开设导通孔110，所述导电线圈111的两端通过所述导通孔110与散热装置103电连接。如图1所示，在第二电路板102 的底壁上开设连通底壁和第二电路板外表面的导通孔110。形成在底壁内层的导电线圈111的两端通过所述导通孔110与散热装置103电连接。本例子一方面通过导通孔110方便了导电线圈与散热装置103的电连接；另一方面开设导通孔有利于集成电路板内产生的热量通过所述导通孔顺利的排出。
如图1所示，在第一电路板101上开设散热孔104。本例子在第一电路板101上开设散热孔104。所述散热孔104配置为用于将集成电路板内产生的热量排出；另一方面散热装置工作能够及时将集成电路板内的热量通过散热孔迅速排出。
或者在散热装置的正上方开设散热孔，有利于及时将集成电路板内的热量通过散热孔迅速排出。
或者在元器件集中的区域开设散热孔，有利于集成电路板内的热量通过散热孔迅速排出。
可选地，本例子中导电线圈111为铜线圈，可以通过线路蚀刻的方式在电路板组件的内层形成所述导电线圈111。其中在电路板组件的内层形成导电线圈111的方式与现有技术中在电路板表面形成导电线的方式相同，本发明在此做赘述。
在一个例子中，所述电路板组件上设置电源模块，所述散热装置103与所述电源模块电连接。所述电源模块配置为用于给散热装置103提供电能，驱动散热装置103工作。散热装置103运转能够将集成电路板内产生的热量及时排出。
在一个例子中，如图1所示，所述电路板组件上设置控制模块109；所述控制模块109与所述电路板组件电连接，所述控制模块109配置为用于控制散热装置103工作。例如，所述控制模块109能够控制散热装置采用不同的方式进行工作。
例如，电路板组件的内层形成导电线圈111，所述散热装置103和控制模块109分别与所述导电线圈111电连接；当控制模块109感应到外部充电线圈时，控制模块109断开与导电线圈的电连通。此时导电线圈111与外部充电线圈电磁感应，实现导电线圈111与散热装置103的电连通，进而驱动散热装置103运转，将集成电路板产生热量及时排出。
本例子中当控制模块109感应到外部充电线圈时，控制模块109主动与导电线圈断开，使得导电线圈111与外部充电线圈电磁感应时，导电线圈111能够专门驱动散热装置103工作，提高散热装置103的工作效率，进而能够及时将集成电路板内的热量排出。
同时集成电路板还包括有电源模块，所述散热装置103和控制模块109分别与所述电源模块电连接。当控制模块109未感应到外部充电线圈时，控制模块109与导线线圈111电连接，同时控制模块109能够驱动电源模块给散热装置103供电，驱动散热装置103运转，将集成电路板内的热量及时排出。
可选地，如图1所示，所述第二电路板102上形成第一凹槽，例如第二电路板102呈U型结构。所述第一凹槽与第一电路板形成所述腔体108。本例子中通过在电路板组件内形成腔体，同时第一电路板的上下表面和腔体的底壁均能够用于设置元器件，因此本发明集成电路板在不扩大集成电路板面积的情况下，能够容纳和贴附更多的元器件。
在一个可选地实施例中，如图2所示，所述腔体208a内形成第二凹槽208b，所述第二凹槽内设置所述散热装置203。例如，在所述腔体208a的一个内壁上形成第二凹槽，其中第二凹槽形成的空间大于散热装置203占用的体积。本例子中在腔体208a的底壁上形成第二凹槽208b，其中第二凹槽208b内设置有所述散热装置203，有利于降低集成电路板的整体厚度。
在一个例子中，如图2所示，所述集成电路板包括电路板组件，所述电路板组件包括第一电路板201，和与所述第一电路板201固定连接的第二电路板202。
其中第一电路板101与第二电路板102固定连接连接之后，使得电路板组件内形成腔体208a，其中腔体208a的底壁都可以设置元器件207。
本例子中在腔体208a的底壁上形成第二凹槽208b，其中第二凹槽208b内设置有所述散热装置203，在不减少容纳元器件207空间的同时有利于降低集成电路板的整体厚度。
在所述腔体208a内设置散热装置，所述散热装置203与电路板组件电连 接，所述电路板组件上开设散热孔204。
当在腔体内设置元器件时，设置在腔体内的散热装置能够将元器件产生的热量从散热孔中及时排出，避免元器件产生的热量不能够及时排出，影响集成电路板的使用寿命。
例如当散热装置203固定在电路板组件上，与散热装置203的固定位置对应的电路板组件的内层形成导电线圈，散热装置203与导电线圈电连接。
如图2所示，散热装置203固定在第二凹槽208b内，其中第二凹槽底壁的内层形成有导电线圈211，导电线圈211两端分别与散热装置203电连接，当所述导电线圈211与外部充电线圈产生电磁感应时，导电线圈211与散热装置电连通，导电线圈211能够驱动散热装置203工作，散热装置203能够将集成电路板内产生的热量及时排出，避免集成电路板内热量过热，引发安全隐患。
可选地，所述电路板组件内开设导通孔210，所述导电线圈211的两端通过所述导通孔210与散热装置203电连接。例如，如图2所示，在第二凹槽208b上开设连通第二凹槽和第二电路板外表面的导通孔210。其中导电线圈211的两端通过所述导通孔210与散热装置203电连接。本例子一方面通过导通孔210方便了导电线圈与散热装置203的电连接；另一方面开设导通孔有利于集成电路板内产生的热量通过所述导通孔顺利的排出。
在一个例子中，如图2所示，所述电路板组件上设置控制模块209；所述控制模块209与所述电路板组件电连接，所述控制模块209配置为用于控制散热装置203工作。例如，所述控制模块209能够控制散热装置采用不同的方式进行工作。
例如，电路板组件的内层形成导电线圈211，所述散热装置203和控制模块209分别与所述导电线圈211电连接；本例子中在第二凹槽208b对应的内层形成导线线圈211，控制模块209设置在腔体208a的侧壁上。
当控制模块209感应到外部充电线圈时，控制模块209断开与导电线圈211的电连通。此时导电线圈211与外部充电线圈电磁感应，实现导电线圈211与散热装置203的电连通，进而驱动散热装置203运转，将集成电路板产生热量及时排出。
本例子中当控制模块209感应到外部充电线圈时，控制模块209主动与导电线圈断开，使得导电线圈211与外部充电线圈电磁感应时，导电线圈211能够专门驱动散热装置203工作，提高散热装置203的工作效率，进而能够及时将集成电路板内的热量排出。
同时集成电路板还包括电源模块，所述散热装置203与控制模块209分别与所述电源模块电连接。当控制模块209未感应到外部充电线圈时，控制模块209与导线线圈211电连接，同时能够驱动电源模块给散热装置203供电，驱动散热装置203运转，将集成电路板内的热量及时排出。
例如如图2所示，在第一电路板201上开设散热孔204。所述散热孔204配置为用于将集成电路板内产生的热量排出；另一方面散热装置通过运转，集成电路板内的热量通过散热孔迅速排出。
或者在散热装置的上方开设散热孔，有利于集成电路板内的热量通过散热孔迅速排出。
或者在元器件集中的区域开设散热孔，有利于集成电路板内的热量通过散热孔迅速排出。
在一个可选地实施例中，本发明中如图1和图2所示，所述第一电路板与第二电路板焊接固定。例如，如图1所示，在第一电路板101和第二电路板102相对的表面分别设置焊盘106，其中两个焊盘通过锡膏105焊接固定。例如，如图2所示，在第一电路板201和第二电路板202相对的表面分别设置焊盘206，其中两个焊盘通过锡膏205焊接固定。本例子通过焊接方式实现第一电路板与第二电路板的电气性能连接。
可选地，所述第一电路板远离所述第二电路板的表面设置金属弹片，所述第二电路板与所述金属弹片通过紧固件固定连接。例如可以在第一电路板上表面的焊盘上设置金属弹片，金属弹片与第二电路板采用螺钉。本例子中第一电路板与第二电路板通过金属弹片实现电气性能连接。
根据本发明另一方面，提供一种电子设备。所述电子设备包括上述所述集成电路板。本例子中将本发明的集成电路板应用到电子设备中，能够丰富电子设备的功能，提高用户的体验感；另一方面也解决了现有电子设备在长时间使用之后电子设备发热的问题。
上面结合附图对本发明的实施例进行了描述，但是本发明并不局限于上述的具体实施方式，上述的具体实施方式仅仅是示意性的，而不是限制性的，本领域的普通技术人员在本发明的启示下，在不脱离本发明宗旨和权利要求所保护的范围情况下，还可做出很多形式，均属于本发明的保护之内。

Claims (13)

  1. 一种集成电路板，包括：
    电路板组件，所述电路板组件包括第一电路板，和与所述第一电路板固定连接的第二电路板；
    所述第一电路板与第二电路板围合形成腔体，所述腔体内设置有元器件；
    所述电路板组件上开设散热孔；
    在所述腔体内设置散热装置，所述散热装置与电路板组件电连接。
  2. 根据权利要求1所述的集成电路板，其中，所述电路板组件的内层形成导电线圈，所述散热装置与所述导线线圈电连接。
  3. 根据权利要求2所述的集成电路板，其中，所述电路板组件内开设导通孔，所述导电线圈的两端通过所述导通孔与散热装置电连接。
  4. 根据权利要求1所述的集成电路板，其中，所述电路板组件上设置电源模块，所述散热装置与所述电源模块电连接。
  5. 根据权利要求1所述的集成电路板，其中，所述电路板组件上设置控制模块；所述控制模块与所述电路板组件电连接。
  6. 根据权利要求5所述的集成电路板，其中，所述电路板组件的内层形成导电线圈，所述导电线圈与外部充电线圈感应时，所述控制模块与导电线圈断开电连接，所述导电线圈驱动所述散热装置工作。
  7. 根据权利要求6所述的集成电路板，还包括电源模块，所述散热装置与控制模块与所述电源模块电连接；所述控制模块与所述导电线圈电连接，所述电源模块驱动所述散热装置工作。
  8. 根据权利要求1所述的集成电路板，其中，所述第二电路板上形成第一凹槽，所述第一凹槽与第一电路板形成所述腔体。
  9. 根据权利要求8所述的集成电路板，其中，所述第一电路板的下表面设置元器件；和/或所述腔体的底壁设置元器件。
  10. 根据权利要求1所述的集成电路板，其中，所述腔体内形成第二凹槽，所述第二凹槽内设置所述散热装置。
  11. 根据权利要求1所述的集成电路板，其中，所述第一电路板与所述第 二电路板焊接固定。
  12. 根据权利要求1所述的集成电路板，其中，所述第一电路板远离所述第二电路板的表面设置金属弹片，所述第二电路板与所述金属弹片通过紧固件固定连接。
  13. 一种电子设备，包括权利要求1至12中任一项所述的集成电路板。
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