WO2021115249A1 - 电路板装置以及电子设备 - Google Patents

电路板装置以及电子设备 Download PDF

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Publication number
WO2021115249A1
WO2021115249A1 PCT/CN2020/134476 CN2020134476W WO2021115249A1 WO 2021115249 A1 WO2021115249 A1 WO 2021115249A1 CN 2020134476 W CN2020134476 W CN 2020134476W WO 2021115249 A1 WO2021115249 A1 WO 2021115249A1
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Prior art keywords
circuit board
semiconductor structure
electronic device
semiconductor
structural members
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PCT/CN2020/134476
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English (en)
French (fr)
Inventor
刘秒
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Vivo Mobile Communication Co Ltd
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Vivo Mobile Communication Co Ltd
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Publication date
Application filed by Vivo Mobile Communication Co Ltd filed Critical Vivo Mobile Communication Co Ltd
Publication of WO2021115249A1 publication Critical patent/WO2021115249A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat

Definitions

  • the present invention relates to the technical field of communication equipment, and in particular to a circuit board device and electronic equipment.
  • the best way to solve the heat dissipation is to increase the self-heat dissipation ability in direct contact with the heating element.
  • Conduction or emission through the PCB board is one of the effective ways to solve the heat dissipation problem.
  • the widely used PCB boards are copper clad/epoxy glass cloth substrates or phenolic resin glass cloth substrates. Although these substrates have excellent electrical properties and processing properties, they have poor heat dissipation. Generally, they are used from the surface of the component to the surrounding air. In heat dissipation, circuit board parts commonly use heat dissipation methods to radiate outwards and the surrounding air flow. There are also other methods, such as air-cooling and water-cooling, fans, etc., but as electronic products have entered the miniaturization of components, high-density installation, and high In the era of heat-generating assembly, it is not enough to rely on the surface of a component with a very small surface area to dissipate heat. At the same time, due to the massive use of surface-mounted components, a large amount of heat generated by the components is transferred to the PCB board.
  • the current heat dissipation method has at least the following shortcomings: 1.
  • the heat dissipation effect is not good according to the way the parts themselves radiate and the surrounding air flow; 2.
  • the area of the parts and the circuit board is miniaturized, and the metal area in direct contact with the original is getting smaller and smaller , The heat dissipation effect is getting worse and worse; 3.
  • the installation of circuit board devices interferes greatly with the structure of existing electronic equipment.
  • the invention discloses a circuit board device and an electronic device to solve the problem of poor heat dissipation effect of the existing heat dissipation method and interference with the structure of the electronic device.
  • an embodiment of the present invention discloses a circuit board device, which includes a circuit board and electronic devices arranged on the circuit board.
  • the circuit board device further includes a refrigeration component and a DC power supply.
  • the refrigeration component includes a spacer. At least two semiconductor structural members arranged on the circuit board, two adjacent semiconductor structural members are connected in series through a conductor, and one of the two adjacent semiconductor structural members is an N-type semiconductor structural member, The other is a P-type semiconductor structure.
  • the refrigeration assembly is provided with an insulating structure towards the cold end of the electronic device.
  • the refrigeration assembly is connected to the electronic device through the insulating structure.
  • the DC power supply is connected to the electronic device.
  • the refrigeration assembly is electrically connected.
  • an embodiment of the present invention also discloses an electronic device, including the circuit board device described above.
  • the circuit board device disclosed in the present invention connects the electronic device in the electronic equipment with the cold end of the refrigeration component.
  • the DC power supply When the DC power supply is turned on, the current will cause the electrons in the semiconductor structure to be transferred. In the process of current transmission and electron transfer In the semiconductor structure, the temperature difference and heat transfer will occur at the joint.
  • the direction of heat transfer in the semiconductor structure can be controlled by the direction of current flow.
  • the current direction of the DC power supply is selected to control the heat from the semiconductor structure.
  • the end close to the electronic device moves toward the other end, so that the end of the semiconductor structure close to the electronic device is cooled down, thereby realizing the heat dissipation of the electronic device.
  • the electronic device disclosed in the present invention does not need to add a structure such as a heat dissipation fan, thereby reducing interference to the structure of the electronic device, saving space, and at the same time, using the heat transfer of the semiconductor structure to replace the traditional Radiation heat dissipation and air convection greatly improve the heat dissipation efficiency.
  • FIG. 1 is a schematic diagram of a circuit board device disclosed in an embodiment of the present invention.
  • Figure 2 is a schematic diagram of a circuit board disclosed in an embodiment of the present invention.
  • Figure 3 is a schematic diagram of a refrigeration assembly disclosed in an embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the first connection of the semiconductor structure disclosed in the embodiment of the present invention.
  • FIG. 5 is a schematic diagram of the second connection of the semiconductor structure disclosed in the embodiment of the present invention.
  • FIG. 6 is a schematic diagram of the third connection of the semiconductor structure disclosed in the embodiment of the present invention.
  • 100-electronic device 200-circuit board; 210-through hole; 300-refrigeration component; 310-semiconductor structure; 311-P-type semiconductor structure; 312-N-type semiconductor structure; 320-first electrical conductor; 330 -Second conductor; 400-insulating layer; 500-heat sink; 600-DC power supply.
  • the disclosed circuit board device includes a refrigeration assembly 300, a DC power supply 600, a circuit board 200, and an electronic device 100 arranged on the circuit board 200.
  • the refrigeration assembly 300 includes a spacer. At least two semiconductor structures 310 are arranged on the circuit board 200. The two adjacent semiconductor structures 310 are connected in series and are respectively an N-type semiconductor structure 312 and a P-type semiconductor structure 311.
  • the refrigeration component 300 faces the electronic components.
  • One side of the device 100 is provided with an insulating structure, and the refrigeration assembly 300 is connected to the electronic device 100 through the insulating structure, so that the cold end of the refrigeration assembly 300 is insulated from the electronic device 100 and connected with heat conduction.
  • the DC power supply 600 is connected to the refrigeration
  • the assembly 300 is electrically connected.
  • the circuit board device disclosed in this embodiment connects the electronic device 100 in the electronic device with the cold end of the refrigeration assembly 300.
  • the DC power supply 600 When the DC power supply 600 is turned on, the current will cause the electrons in the semiconductor structure 310 to transfer. During the process of electron transfer and electron transfer, the semiconductor structure 310 will produce temperature difference and heat transfer at the joint.
  • the direction of heat transfer in the semiconductor structure 310 can be controlled by the direction of current flow.
  • the DC power supply 600 is selected to control The direction of the current causes the heat to move from the end of the semiconductor structure 310 close to the electronic device 100 toward the other end, so that the end of the semiconductor structure 310 close to the electronic device 100 cools down, thereby realizing the heat dissipation of the electronic device 100.
  • the circuit board device disclosed in this embodiment does not need to add a heat dissipation fan and other structures, thereby reducing the interference to the structure of the electronic equipment, saving space, and at the same time, using the semiconductor structure 310 Heat transfer replaces traditional radiant heat dissipation and air convection, which greatly improves heat dissipation efficiency.
  • the direction of heat transfer is determined by the direction of the current, that is, when a direct current flows in the semiconductor structure 310, heat will flow from one end of the device. To the other end, change the direction of the current, you can change the direction of the heat flow, transfer the heat to the other end, change the size of the current, and the temperature of the refrigeration is different.
  • the direction of the current is controlled so that the end of the semiconductor structure 310 close to the electronic device 100 is the cold end. According to different electronic devices 100, the current can be adjusted so that electronic devices of different powers can be obtained. Adequate heat dissipation.
  • the heat transfer of the semiconductor structure 310 makes one end become the cold end and the other end becomes the hot end.
  • heat will continue to accumulate at the hot end of the semiconductor structure 310.
  • a heat sink 500 can be provided on the hot end of the semiconductor structure 310.
  • the setting of the heat sink 500 It can help the hot end of the semiconductor to quickly dissipate heat, so as to prevent the temperature of the hot end of the semiconductor structure 310 from being too high.
  • the heat sink 500 and the semiconductor structure 310 should also be insulated connection, so as to avoid leakage.
  • the circuit board 200 can be a PCB board.
  • the PCB board can be directly made into a large PCB pad or a large copper surface of the PCB, or it can be laid in the form of grid copper. In order to prevent oxidation of the pad, it can also be butt welded.
  • the plate is made of immersion gold surface treatment.
  • a through hole 210 may be opened on the circuit board 200, and then the semiconductor structure 310 is installed in the through hole 210. Utilizing the positions on the circuit board 200 without lines to open the through holes 210 to accommodate the semiconductor structure 310 can integrate the semiconductor structure 310 and the circuit board 200 into one body, thereby further saving space and further reducing the influence of structural interference.
  • the number of the through holes 210 may be at least two, the number of the semiconductor structure 310 and the number of the through holes 210 may be equal, and each semiconductor structure 310 is correspondingly mounted in one through hole 210.
  • the through holes 210 can be arranged in a row, that is, a plurality of through holes 210 are located on the same straight line, which can simplify the wiring and make the conduction of the semiconductor structure 310 more convenient and orderly.
  • the two ends of the semiconductor structure 310 can be extended to the two ends of the through hole 210, or the two ends of the semiconductor structure 310 can extend out of the two ends of the through hole 210, and then the adjacent semiconductor structure 310 can pass through The ends are connected to each other. In this way, when the temperature of the semiconductor structure 310 is transferred, the cold end of the semiconductor structure 310 can fully exchange heat with the electronic device 100, and the hot end of the semiconductor structure 310 can transfer heat to a location other than the circuit board 200. Avoid causing heat to accumulate on the circuit board 200, so as to avoid affecting the normal operation of the circuit board 200.
  • first conductive body 320 can be used to connect the two semiconductor structures 310.
  • the first conductive body 320 can be mounted on either end of the semiconductor structure 310, so that a "U"-shaped structure is formed between the two semiconductor structures 310 and the first conductive body 320, so that the semiconductor structure 310 can be close to the electronics.
  • One end of the device 100 forms a cold end, and the other end of the semiconductor structure 310 forms a hot end, so as to dissipate heat.
  • the first conductive body 320 may not be arranged between the two semiconductor structural members 310.
  • the ends of the two semiconductor structural members 310 are close to each other. Connect to form a "V" shape between the two semiconductor structures 310, or form a series connection between the semiconductor structures 310, and form a hot end and a cold end for heat dissipation. At this time, only the circuit board 200
  • the through holes 210 are arranged to be inclined to each other and communicate with each other so that the two semiconductor structures 310 can form such a structure.
  • the semiconductor structural members 310 when the number of semiconductor structural members 310 is more than three, if the first conductor 320 is not arranged between the semiconductor structural members 310, the semiconductor structural members 310 can be inclined to each other, so that a plurality of semiconductors
  • the structural member 310 is formed in the shape of "W". If the semiconductor structures 310 are arranged in parallel, the first conductor 320 needs to be installed between the semiconductor structures 310.
  • the end of the semiconductor structure 310 facing the insulating layer 400 is the first end, and the semiconductor structure 310 is away from the insulating layer.
  • One end of 400 is the second end, a plurality of semiconductor structures 310 are arranged at intervals, the first end of the semiconductor structure 310 and the first end of the adjacent semiconductor structure 310 are electrically connected by the first conductor 320, and the semiconductor structure The second end of 310 and the second end of another adjacent semiconductor structure 310 are electrically connected by a first conductive body 320. That is, a plurality of semiconductor structures 310 are connected end to end to form a series connection, so that when current flows through the semiconductor structure 310, if the current flows in from the second end of the first semiconductor structure 310, the current will flow from the semiconductor structure.
  • the first end of the member 310 flows out and flows in from the first end of the second semiconductor structure member 310, and then flows out from the second end of the second semiconductor structure member 310, and from the second end of the third semiconductor structure member 310.
  • the end flows into the third semiconductor structure 310, so that the first ends of all the semiconductor structures 310 are cold ends, and the second ends of the semiconductor structure 310 are hot ends.
  • the first electrical conductor 320 may be placed at the port of the through hole 210.
  • the through hole 210 includes a first end facing the electronic device 100 and a second end facing away from the electronic device 100.
  • a first conductor 320 is arranged between the first end of the through hole 210 and the first end of the adjacent through hole 210.
  • a second conductive body 330 is provided between the second end of the through hole 210 and the second end of another adjacent through hole 210, so that the plurality of semiconductor structures 310 are connected in series.
  • both the first electrical conductor 320 and the second electrical conductor 330 are metal conductors, and the metal conductors are exposed on the surface while conducting two adjacent semiconductor structures 310.
  • the metal conductor may be a conductive material directly attached to the circuit board 200 such as a conductive coating or a conductive plating layer.
  • the first conductive body 320 is small in size, and can make full use of the blank part on the circuit board 200, so that the connection between the semiconductor structural members 310 is more stable, and the structural interference of the electronic device is smaller.
  • the insulating structure may be an insulating layer 400 or an insulating layer 400. It can be an insulating material with good thermal conductivity such as ceramic sheet or rubber.
  • the main covering positions of the insulating layer 400 are the positions of the semiconductor structure 310 and the metal conductors, and other positions may be open to facilitate the electrical connection between the electronic device 100 and the circuit board 200. Since the insulating layer 400 is an integral structure, when heat is transferred inside the insulating layer 400, it is faster and more uniform.
  • the temperature of the insulating layer 400 will be lower than the temperature of the electronic device 100 when it is in a heating state. It can be in full contact with the entire bottom of the electronic device 100, so that the electronic device 100 has a larger heat dissipation surface, so that the electronic device 100 has a faster heat dissipation speed.
  • the first conductor 320 and the second conductor 330 are both configured as the first conductor 320, such as a wire, which is wrapped with an insulating material.
  • the insulating material on the outer periphery of the wire can be regarded as a refrigeration material.
  • the first conductor 320 can be arbitrarily arranged on the circuit board 200 without worrying about affecting the circuit of the circuit board 200 itself. Therefore, when connecting two semiconductor insulating parts, The shortest line can be used for connection, thereby reducing power loss.
  • an insulating layer 400 may also be provided between the wire and the electronic device 100 at this time.
  • This embodiment also discloses an electronic device, including the circuit board device as described above.
  • the electronic device provided in this embodiment does not need to add a heat dissipation fan and other structures, thereby reducing interference with the structure of the electronic device and saving space.
  • the heat transfer of the semiconductor structure 310 is used to replace the traditional radiation heat dissipation and air convection, which greatly improves the heat dissipation efficiency.
  • the electronic devices disclosed in the embodiments of the present invention may be devices such as mobile phones, tablet computers, e-book readers, game consoles, smart watches, etc.
  • the embodiments of the present invention do not limit the specific types of electronic devices.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种电路板装置，其包括电路板（200）以及设置在电路板（200）上的电子器件（100），电路板装置还包括制冷组件（300）和直流电源（600），制冷组件（300）包括间隔设置在电路板（200）上的至少两个半导体结构件（310），相邻的两个半导体结构件（310）串联、且分别为N型半导体结构件（312）和P型半导体结构件（311），制冷组件（300）的冷端与电子器件（100）通过绝缘结构件（400）相连，直流电源（600）与制冷组件（300）电连接。

Description

电路板装置以及电子设备
相关申请的交叉引用
本申请主张在2019年12月12日在中国提交的中国专利申请号No.201911272371.4的优先权，其全部内容通过引用包含于此。
技术领域
本发明涉及通信设备技术领域，尤其涉及一种电路板装置以及电子设备。
背景技术
随着5G设备的发展，电子设备的功能越来越多，电子设备在工作的过程中势必会产生更多的热量，处理好电子设备的热管理，则有助于避免因高温导致的电路性能恶化和可靠性降低。电子设备在工作期间所消耗的电能，除了有用功外，大部分转化成热量散发。电子设备产生的热量，使内部温度迅速上升，如果不及时将该热量散发，设备会继续升温，器件就会因过热失效，电子设备的可靠性将下降。如今表面贴装技术(Surface Mounted Technology，SMT)使电子设备的安装密度增大，有效散热面积减小，设备温升严重地影响可靠性。目前为改善散热效果，解决散热的最好方法是提高与发热元件直接接触的自身散热能力，通过PCB板传导出去或散发出去是解决散热问题的有效途径之一。
目前广泛应用的PCB板材是覆铜/环氧玻璃布基材或酚醛树脂玻璃布基材，这些基材虽然具有优良的电气性能和加工性能，但散热性差，一般采用从元件的表面向周围空气中散热，电路板零件常用散热方式向外辐射和周围空气流动，也有带有其它方式的，比如风冷水冷，风扇等等，但随着电子产品已进入到部件小型化、高密度安装、高发热化组装时代，若只靠表面积十分小的元件表面来散热是非常不够的。同时由于表面安装元件的大量使用，元器件产生的热量大量地传给PCB板。
目前的散热方式至少存在如下的缺点：1.依照零件自身向外辐射和周围空气流的方式散热效果不好；2.零件和线路板面积小型化，与原件直接接触 的金属面积越来越小，散热效果越来越差；3.加装电路板装置对现有电子设备的结构干涉较大。
发明内容
本发明公开一种电路板装置以及电子设备，以解决现有的散热方式散热效果差，且会对电子设备的结构产生干涉的问题。
本发明的实施例是这样实现的：
基于上述的目的，本发明的实施例公开了一种电路板装置，包括电路板以及设置在电路板上的电子器件，所述电路板装置还包括制冷组件和直流电源，所述制冷组件包括间隔设置在所述电路板上的至少两个半导体结构件，相邻的两个所述半导体结构件通过导电体串联、且相邻的两个所述半导体结构件中一个为N型半导体结构件，另一个为P型半导体结构件，所述制冷组件朝向所述电子器件的冷端设置有绝缘结构件，所述制冷组件通过所述绝缘结构件与所述电子器件相连，所述直流电源与所述制冷组件电连接。
基于上述的目的，本发明的实施例还公开了一种电子设备，包括如上所述的电路板装置。
本发明采用的技术方案能够达到以下有益效果：
本发明公开的电路板装置，将电子设备中的电子器件与制冷组件的冷端连接，当直流电源接通后，电流会使半导体结构件内的电子发生转移，在电流传动和电子转移的过程中，半导体结构件在接头处会产生温差和热量转移，在此，可以通过电流的流动方向来控制半导体结构件内热量转移的方向，此处选择控制直流电源的电流方向使热量由半导体结构件靠近电子器件的一端朝向另一端移动，从而使半导体结构件靠近电子器件的一端降温，进而实现对电子器件的散热。与现有的散热方法相比，本发明公开的电子设备无需添加散热风扇等结构，从而减少了对电子设备的结构的干涉，节约了空间，同时，利用半导体结构件的热量转移来替代传统的辐射散热和空气对流，大大提高了散热效率。
附图说明
此处所说明的附图用来公开对本发明的进一步理解，构成本发明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1为本发明实施例公开的电路板装置的示意图；
图2为本发明实施例公开的电路板的示意图；
图3为本发明实施例公开的制冷组件的示意图；
图4为本发明实施例公开的半导体结构件的第一种连接示意图；
图5为本发明实施例公开的半导体结构件的第二种连接示意图；
图6为本发明实施例公开的半导体结构件的第三种连接示意图。
附图标记说明：
100-电子器件；200-电路板；210-通孔；300-制冷组件；310-半导体结构件；311-P型半导体结构件；312-N型半导体结构件；320-第一导电体；330-第二导电体；400-绝缘层；500-散热片；600-直流电源。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚，下面将结合本发明具体实施例及相应的附图对本发明技术方案进行清楚、完整地描述。显然，所描述的实施例仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
以下结合附图，详细说明本发明各个实施例公开的技术方案。
请参阅图1，本实施例公开一种电路板装置，所公开的电路板装置包括制冷组件300、直流电源600、电路板200以及设置在电路板200上的电子器件100，制冷组件300包括间隔设置在电路板200上的至少两个半导体结构件310，相邻的两个半导体结构件310串联、且分别为N型半导体结构件312和P型半导体结构件311，制冷组件300朝向所述电子器件100的一侧设置有绝缘结构件，制冷组件300通过绝缘结构件与所述电子器件100相连，以使制冷组件300的冷端与电子器件100绝缘设置、且导热相连，直流电源600与制冷组件300电连接。
本实施例公开的电路板装置，将电子设备中的电子器件100与制冷组件300的冷端连接，当直流电源600接通后，电流会使半导体结构件310内的电子发生转移，在电流传动和电子转移的过程中，半导体结构件310在接头处会产生温差和热量转移，在此，可以通过电流的流动方向来控制半导体结构件310内热量转移的方向，此处选择控制直流电源600的电流方向使热量由半导体结构件310靠近电子器件100的一端朝向另一端移动，从而使半导体结构件310靠近电子器件100的一端降温，进而实现对电子器件100的散热。与现有的加装散热的方法相比，本实施例公开的电路板装置无需添加散热风扇等结构，从而减少了对电子设备的结构的干涉，节约了空间，同时，利用半导体结构件310的热量转移来替代传统的辐射散热和空气对流，大大提高了散热效率。
其中，参阅图3，半导体结构件310中有电流流动时，其热量传递的方向是由电流的方向决定的，即在半导体结构件310中有直流电流流过时，热量就会从元件的一端流到另一端，改变电流方向，就可以改变热流的方向，将热量输送到另一端，改变电流的大小，制冷的温度就不同。在本实施例中，控制电流的方向，使半导体结构件310靠近电子器件100的一端为冷端，而根据不同的电子器件100，可以调节电流的大小，以使不同功率的电子器件均可以得到充分的散热。
半导体结构件310通过热量转移，使其一端成为冷端，而其另一端也就成为了热端，当半导体结构件310在持续工作时，热量会在半导体结构件310的热端持续积累，为了避免半导体结构件310的热端温度过高，影响其自身的正常工作或者因其温度过高而对电子设备造成损伤，可以在半导体结构件310的热端设置散热片500，散热片500的设置可以帮助半导体的热端进行快速散热，从而避免半导体结构件310的热端温度过高，当然，散热片500与半导体结构件310之间也应该为绝缘连接，这样能够避免漏电。
在本实施例中，电路板200可以为PCB板，PCB板可以直接制作成PCB大焊盘或PCB大铜面，亦可以铺成网格铜的形式，为防止焊盘氧化，还可以对焊盘做沉金表面处理。
参阅图2，在本实施例的一些实施方式中，在电路板200上可以开设通孔 210，然后将半导体结构件310安装在该通孔210中。利用电路板200上没有线路的位置来开设通孔210容纳半导体结构件310，可以让半导体结构件310与电路板200结合为一体，从而更进一步的节约空间，使结构干涉的影响被进一步降低。
其中，通孔210的数量可以至少为两个，半导体结构件310的数量与通孔210的数量可以相等，每个半导体结构件310对应地安装在一个通孔210中。在电路板200上开设通孔210时，可以将通孔210设置成一排，即多个通孔210位于同一直线上，这样能简化线路，使半导体结构件310的导通更加的方便有序。
进一步地，可以让半导体结构件310的两端分别延伸至通孔210的两端，或者半导体结构件310的两端分别伸出通孔210的两端，然后让相邻的半导体结构件310通过端部相互连接。这样可以半导体结构件310的温度在传递时，半导体结构件310的冷端可以与电子器件100进行充分的热交换，而半导体结构件310的热端可以将热量传递至电路板200以外的位置，避免造成热量淤积在电路板200上，从而避免对电路板200的正常工作造成影响。
参阅图4，在本实施例的一些实施方式中，如果半导体结构件310只有两个，那两个半导体结构件310之间可以只用一个第一导电体320进行连接。这个第一导电体320可以是安装在半导体结构件310的任一端，使两个半导体结构件310与第一导电体320之间形成“U”字型结构，即可让半导体结构件310靠近电子器件100的一端形成冷端，而让半导体结构件310的另一端形成热端，从而进行散热。当然，在本实施例中，两个半导体结构件310之间也可以不设置第一导电体320，当两个半导体结构件310之间倾斜设置，并使两个半导体结构件310的一端相互靠近连接，使两个半导体结构件310之间形成“V”字型，也可以形成半导体结构件310之间的串联，并形成热端和冷端进行散热，此时只需将电路板200上的通孔210设置来相互倾斜且相互连通即可让两个半导体结构件310形成这种结构。
参阅图5和图6，当半导体结构件310的数量为三个以上时，若半导体结构件310之间不设置第一导电体320，则可以让半导体结构件310相互倾斜，以使多个半导体结构件310形成“W”的形状。若要让半导体结构件310 之间平行设置，则需要在半导体结构件310之间安装第一导电体320，半导体结构件310朝向绝缘层400的一端为第一端，半导体结构件310背离绝缘层400的一端为第二端，多个半导体结构件310间隔设置，半导体结构件310的第一端与相邻的半导体结构件310的第一端通过第一导电体320电连接，且半导体结构件310的第二端与另一个相邻的半导体结构件310的第二端通过第一导电体320电连接。即多个半导体结构件310之间首尾相连，形成的串联，令电流在流过半导体结构件310时，若电流从第一个半导体结构件310的第二端流入，那电流将从该半导体结构件310的第一端流出，并从第二个半导体结构件310的第一端流入，然后从第二个半导体结构件310的第二端流出，并从第三个半导体结构件310的第二端流入第三个半导体结构件310，以此让所有半导体结构件310的第一端均为冷端，而让半导体结构件310的第二端为热端。
当半导体结构件310安装到电路板200上的通孔210内时，可以将第一导电体320安置在通孔210的端口处。
通孔210包括朝向电子器件100的第一端和背离电子器件100的第二端，通孔210的第一端与相邻的通孔210的第一端之间设置有第一导电体320、且通孔210的第二端与另一个相邻的通孔210的第二端之间设置有第二导电体330，以此让多个半导体结构件310之间形成串联。
在本实施例的一些实施方式中，第一导电体320和第二导电体330均为金属导体，金属导体在将相邻的两个半导体结构件310导通的同时，其表面呈裸露状态，例如金属导体可以是导电涂层或者导电镀层等直接附着在电路板200上的导电物质。这种第一导电体320体积小，可以充分利用电路板200上空白的部分，使半导体结构件310之间的连接更加的稳定，且对电子设备的结构干涉更小。
此时，由于第一导电体320为金属导体，且其表面裸露，因此需要在制冷组件300和电子器件100之间设置一层绝缘结构件，该绝缘结构件可以是绝缘层400，绝缘层400可以是陶瓷片或者橡胶等具有良好导热性的绝缘物质。绝缘层400的主要覆盖位置为半导体结构件310以及金属导体的位置，而在其他位置可以是呈开放式，以方便电子器件100与电路板200之间进行 电连接。由于绝缘层400为一个整体结构，因此，热量在绝缘层400内部传递时，更加的快捷均匀。当电子器件100被安装在绝缘层400上时，由于绝缘层400是与制冷组件300的冷端连接的，因此绝缘层400的温度会低于处于发热状态时电子器件100的温度，绝缘层400可以与电子器件100的整个底部完全接触，使电子器件100具有更大的散热面，从而使电子器件100具有更快的散热速度。
而在本实施例的另一些实施方式中，第一导电体320和第二导电体330均设置为导线等本身包裹有绝缘物的第一导电体320，导线外周的绝缘物即可以视为制冷组件300与电子器件100之间的绝缘结构件，此时第一导电体320可以在电路板200上任意布置，无需担心影响电路板200本身的电路，因此，在连接两个半导体绝缘件时，可以采用最短的线路进行连接，从而减少电能的损耗。此时，即使不安装绝缘层400，也能够通过导线使半导体结构件310与电子器件100之间绝缘，从而起到散热的作用。当然，为了让电子器件100的散热更加快捷均匀，也为了提高半导体结构件310与电子器件100之间的绝缘安全性，此时也是可以在导线与电子器件100之间设置绝缘层400的。
本实施例还公开了一种电子设备，包括如上文所述的电路板装置，本实施例提供的电子设备无需添加散热风扇等结构，从而减少了对电子设备的结构的干涉，节约了空间，同时，利用半导体结构件310的热量转移来替代传统的辐射散热和空气对流，大大提高了散热效率。
本发明实施例公开的电子设备可以是手机、平板电脑、电子书阅读器、游戏机、智能手表等设备，本发明实施例不限制电子设备的具体种类。
本发明上文实施例中重点描述的是各个实施例之间的不同，各个实施例之间不同的优化特征只要不矛盾，均可以组合形成更优的实施例，考虑到行文简洁，在此则不再赘述。
以上所述仅为本发明的实施例而已，并不用于限制本发明。对于本领域技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原理之内所作的任何修改、等同替换、改进等，均应包含在本发明的权利要求范围之内。

Claims (10)

  1. 一种电路板装置，包括电路板(200)以及设置在电路板(200)上的电子器件(100)，所述电路板装置还包括制冷组件(300)和直流电源(600)，所述制冷组件(300)包括间隔设置在所述电路板(200)上的至少两个半导体结构件(310)，相邻的两个所述半导体结构件(310)串联，且相邻的两个所述半导体结构件中一个为N型半导体结构件(312)，另一个为P型半导体结构件(311)，所述制冷组件(300)朝向所述电子器件(100)的冷端设置有绝缘结构件，所述制冷组件(300)通过所述绝缘结构件与所述电子器件(100)相连，所述直流电源(600)与所述制冷组件(300)电连接。
  2. 根据权利要求1所述的电路板装置，其中，所述电路板(200)上开设有通孔(210)，所述半导体结构件(310)安装在所述通孔(210)中。
  3. 根据权利要求2所述的电路板装置，其中，所述通孔(210)的数量至少为两个，所述半导体结构件(310)的数量与所述通孔(210)的数量相等，每个所述半导体结构件(310)对应地安装在一个所述通孔(210)中。
  4. 根据权利要求3所述的电路板装置，其中，所述半导体结构件(310)的两端分别延伸至所述通孔(210)的两端，或者，所述半导体结构件(310)的两端分别伸出所述通孔(210)的两端。
  5. 根据权利要求1所述的电路板装置，其中，所述半导体结构件(310)包括朝向所述电子器件(100)的第一端和背离所述电子器件(100)的第二端，所述半导体结构件(310)的第一端与相邻一个所述半导体结构件(310)的第一端之间电连接有第一导电体(320)，所述半导体结构件(310)的第二端与相邻的另一个所述半导体结构件(310)的第二端之间电连接有第二导电体(330)。
  6. 根据权利要求5所述的电路板装置，其中，所述第一导电体(320)为金属导体，所述第二导电体(330)为金属导体。
  7. 根据权利要求1所述的电路板装置，其中，所述绝缘结构件为绝缘层(400)，所述绝缘层(400)位于所述制冷组件(300)和所述电子器件(100)之间，所述制冷组件(300)的冷端通过所述绝缘层(400)与所述电子器件 (100)连接。
  8. 根据权利要求1所述的电路板装置，其中，相邻的两个所述半导体结构件(310)通过导线串联。
  9. 根据权利要求1至8任一项所述的电路板装置，还包括散热片(500)，所述散热片(500)设置在所述制冷组件(300)背离所述电子器件(100)的一侧。
  10. 一种电子设备，包括权利要求1至9任一项所述的电路板装置。
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