WO2021114823A1 - 散热装置 - Google Patents

散热装置 Download PDF

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Publication number
WO2021114823A1
WO2021114823A1 PCT/CN2020/118101 CN2020118101W WO2021114823A1 WO 2021114823 A1 WO2021114823 A1 WO 2021114823A1 CN 2020118101 W CN2020118101 W CN 2020118101W WO 2021114823 A1 WO2021114823 A1 WO 2021114823A1
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WO
WIPO (PCT)
Prior art keywords
housing
sub
heat dissipation
main board
drive
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PCT/CN2020/118101
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English (en)
French (fr)
Inventor
王凯
Original Assignee
中兴通讯股份有限公司
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Application filed by 中兴通讯股份有限公司 filed Critical 中兴通讯股份有限公司
Priority to EP20899235.4A priority Critical patent/EP4017232A4/en
Priority to JP2022517259A priority patent/JP7386975B2/ja
Publication of WO2021114823A1 publication Critical patent/WO2021114823A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/012—Housings with variable shape or dimensions, e.g. by means of elastically deformable materials or by movement of parts forming telescopic extensions of the housing body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H05K5/0214—Venting apertures; Constructional details thereof with means preventing penetration of rain water or dust
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209—Thermal management, e.g. fan control

Definitions

  • the embodiment of the present invention relates to the field of hardware equipment, and specifically to a heat dissipation device.
  • the current network access equipment due to the huge heat generation, adopts a fixed hole heat dissipation method.
  • the hole position is relatively hidden and the heat dissipation method is limited.
  • a small hole is opened in the bottom groove, and cold air passes through.
  • the heat convection effect of the air is sucked in from the bottom, passing through the heating element of the main board and the metal heat sink, and then convectively discharged from the top to form heat exchange.
  • the hidden position of the openings, and the shielding of the air from the internal structure resulting in the position of the intermediate device, such as the circular position in Figure 1, the heating cannot be effectively relieved.
  • the embodiment of the present invention provides a heat dissipation device to solve one of the related technical problems at least to a certain extent, including: in some cases, small holes are opened at the bottom and top of the device to allow cold air to be sucked in from the bottom and from the top. Convection exhaust forms the problem of low heat dissipation efficiency of the heat dissipation method of heat exchange.
  • a heat dissipation device including: a housing; wherein the housing includes: a first sub-housing and a second sub-housing; the second sub-housing is close to the bottom of the heat dissipation device, The first sub-housing is close to the top of the heat sink; one or more holes are provided on the second sub-housing and overlapping with the first sub-housing, and the first sub-housing and The second sub-housing is relatively movable, wherein through the relative movement, one or more holes provided on the second sub-housing can be exposed to form an air duct.
  • FIG. 1 is a schematic diagram of the structure of a heat sink in some situations
  • Fig. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention
  • Fig. 3 is a first structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • Fig. 4 is a second structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • Fig. 5 is a third structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • Fig. 6 is a fourth structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • Fig. 7 is a fifth structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • 5G technology can bring users a better user experience, and its transmission rate is much higher than previous cellular networks, up to 10Gbit/s; its other advantage is low network delay and faster response speed. Due to its outstanding advantages, it will be able to meet the application scenarios of high-definition video, virtual reality and other big data transmission, as well as low-latency scenarios such as autonomous driving and telemedicine.
  • the implementation of 5G puts forward higher requirements for the hardware system, and the requirements of high speed, low latency, and multiple antennas put forward more stringent requirements for the heating scene of the hardware.
  • the current 4G terminals have relatively low power consumption due to their low speed. In the 5G era, the size of the terminal has not changed, but the power consumption has increased significantly, especially for network access equipment.
  • innovative solutions for heat dissipation are needed to meet the 5G era.
  • the normal working conditions of the various components of the terminal product enable the product to perform its normal function and satisfy the user's experience.
  • the starting point of the embodiments of the present invention is based on the principle of convection heat dissipation. While objectively not reducing the appearance, an active convection air duct design is added, so that the convective heat dissipation air duct of the product can be adjusted automatically according to the heating state of the product, and the product will be as
  • the air duct is designed near the device with large heat generation to strengthen the air convection effect in key areas, shorten the air duct length to reduce the wind resistance of the fan, optimize the heating state of the product under different conditions, and maximize the hardware performance and improve the product performance. 5G product user experience requirements.
  • the heat dissipation device involved in the embodiments of the present invention can also be applied to product equipment that requires heat dissipation in other application scenarios, such as 4G-related product equipment, or other communication equipment, computer equipment, etc. hardware equipment.
  • FIG. 2 is a schematic structural diagram of a heat dissipation device according to an embodiment of the present invention.
  • the heat dissipation device 11 includes: a housing 200; wherein, the housing 200 includes: a first A sub-housing 201 and a second sub-housing 203; the second sub-housing 203 is close to the bottom of the heat sink 11, and the first sub-housing 201 is close to the top of the heat sink 11;
  • one or more holes 202 are provided on the second sub-housing 203 and overlapping with the first sub-housing 201, and the first sub-housing 201 and the second sub-housing 203 can move relative to each other.
  • One or more holes 202 provided on the second sub-housing 203 can be exposed to form an air duct.
  • the housing 200 can be arranged around the device to be dissipated, and the device to be dissipated includes: a bottom cover 103 arranged at the bottom of the device and a top cover 101 arranged on the top of the device, wherein the bottom cover 103
  • the openings provided on the grooves and the openings provided on the top cover form air convection
  • the first sub-housing 201 and the second sub-housing 201 are provided with one or more holes 202.
  • one or more holes 202 provided on the second sub-housing 203 can be exposed to form an air duct, which improves the heat dissipation efficiency of the device, thereby solving the problem of adopting the bottom of the device in some situations.
  • There is a small hole on the top so that cold air is sucked in from the bottom and convectively discharged from the top to form the problem of low heat dissipation efficiency.
  • the second sub-housing 203 is composed of, of course, it may not be a sub-housing provided by an integrated device, that is, each side is composed of a separate first sub-housing 201 and a second sub-housing 203, or only one or more sides are provided with the first sub-housing.
  • the housing 201 and the second sub-housing 203 do not need to be provided with the first sub-housing 201 and the second sub-housing 203 on all sides.
  • the first sub-housing 201 is not provided with holes, so when the first sub-housing 201 overlaps with the second sub-housing 203, one or more holes 202 on the second sub-housing 203 are blocked. That is, an air duct cannot be formed to cool down.
  • the shape of one or more holes 202 in FIG. 2 is only an example, and it can also be other shapes, such as one or more holes in a circle, one or more holes in a rectangle, etc., according to actual conditions. It needs to be adjusted, and its shape is not limited in the embodiment of the present invention.
  • FIG. 2 only shows that there is only one row of holes 202 on the second sub-housing 203. This is only an example. The number of holes and several rows of holes can be set according to actual needs, and the number of holes in each row is also It can be set according to actual conditions. As shown in FIG. 3, two rows of holes 202 are provided on the second sub-housing 203.
  • one or more holes 202 on the second sub-housing 203 are provided in an area where the device generates high heat, for example, a chip area.
  • the dotted circle corresponds to the area where the device heats up relatively high, so that the heat can be dissipated in time under the condition of high work load, and the heat dissipation effect of this area is accelerated.
  • the heat dissipation device further includes: a motherboard bracket 405;
  • the main board bracket 405 is assembled into the second sub-housing 203 from the bottom of the heat sink; the first sub-housing 201 is inserted into the second sub-housing 203 from the top of the heat sink and is guided by the outer side wall of the second sub-housing 203; The bracket 405 is electrically connected to the main board 406 of the device to be dissipated through lead wires.
  • the main board bracket 405 is provided with a lead screw 404, and the lead screw 404 is provided with a lead screw sleeve 502; the lead screw 404 and the main board support 405 are fixedly connected; the first sub-housing 201 is connected to the screw
  • the screw sleeve 502 of the rod 404 is fixedly connected; the fixed connection may be through a screw.
  • the rotation of the screw 404 can drive the screw sleeve 502 to reciprocate, and the reciprocating movement of the screw sleeve 502 drives the relative movement of the first sub-housing 201 and the second sub-housing 203.
  • the heat dissipating device 11 further includes a driving motor; wherein the driving motor is used to receive a control command to drive the lead screw 404 to rotate.
  • a first control instruction is sent to the drive motor, where the first control instruction is used to instruct the drive motor to drive the lead screw 404 performs a rotating movement to drive the relative movement of the first sub-housing 201 and the second sub-housing 203, so that one or more holes provided on the second sub-housing 203 are exposed to form an air duct;
  • a second control instruction is sent to the drive motor, where the second control instruction is used to instruct the drive motor to drive the lead screw 404 to rotate and drive the first sub-housing 201
  • the relative movement with the second sub-housing 203 makes the first sub-housing 201 cover one or more holes 202 on the second sub-housing 203.
  • the temperature sensor inside the component will detect the operating temperature of the key internal position, and the system will keep the current status and continue to operate when the temperature does not reach the preset starting point.
  • the system drives the motor to drive the first sub-housing 201 to move relative to the second sub-housing 203, exposing one or more holes 202 set in advance to form an air duct, accelerating heat dissipation, and ensuring integrity The machine runs reliably.
  • the temperature detection continues.
  • the system drives the motor to further drive the first sub-housing 201 to move in the opposite direction relative to the second sub-housing 203, thereby causing the first sub-housing to move in the opposite direction.
  • the housing 201 covers one or more holes 202 on the second sub-housing 203, thereby closing the air duct and continuing to operate.
  • the temperature detection is always in operation.
  • the motor mechanism will detect the position of the air duct and shut down after closing the air duct.
  • the cold air enters from the bottom through the heating cycle of the motherboard 406 to the top, forming convection cooling.
  • the cold air cannot reach the chip area effectively due to the high temperature of the chip area.
  • the first sub-housing 201 and the second sub-housing 203 slide apart through the motor under the control of the driver, exposing one or more holes 202 for heat dissipation in the chip area.
  • the cold air can quickly reach the motherboard chip to heat up under the action of the fan.
  • the zone forms convection to cool down.
  • the driver controls the motor to pull the first sub-housing 201 and the second sub-housing 203 back to the original state to ensure the original appearance and avoid long-term leakage of heat dissipation holes
  • the device can be a 5G device or other hardware devices, so that the heating performance of the device under extreme working conditions is greatly alleviated, and the user experience is improved.
  • a buckle 503 is provided on the first sub-housing, and the buckle 503 is connected to the first sub-housing 201 and the second sub-housing 203.
  • the first sub-housing 201 moves under the drive of the lead screw 404 and the sleeve 502, on the one hand, it is limited by the stroke of the lead screw 404, and on the other hand, the first sub-housing is ensured by the buckle 503.
  • the housing 201 and the second sub-housing 203 prevent the second sub-housing 203 and the first sub-housing 201 from being separated due to external forces during the movement process, which improves the assembly reliability of the whole machine.
  • the first sub-housing 201 is installed inside the buckle 503, the first sub-housing 201 is installed. When there is an opening, when maintenance is needed, use a clamp to open the buckle through the opening position to separate the second sub-housing 203 from the first sub-housing 201 to repair the whole machine.
  • a fan 601 is also provided on the main board bracket 405, wherein the air duct of the fan 601 and the air duct formed by one or more holes 202 provided on the second sub-housing 203 can be exposed through relative movement. Unanimous.
  • the lead screw 404 drives the first sub-housing 201 to slide relative to the second sub-housing 203, exposing one or more holes 202 set in advance, and the leaking one or more holes 202 form an air duct, which can effectively provide cold air, so that the cold air can be Quickly reach the heat sink area, shorten the air duct of the fan 601 and reduce the wind pressure, thereby improving the efficiency of the fan 601 and extending the life of the fan 601.
  • the position of the fan in the embodiment of the present invention is adjusted and set according to the conceptual design and thermal design of the product.
  • a sleeve rail 701 is provided on the main board bracket 405; wherein, the sleeve rail 701 is provided with a first magnet 702 and a second magnet 703; the first magnet 702 is arranged in the sleeve rail close to the main board bracket 405 The second magnet 703 is arranged in the sleeve rail at one end away from the main board bracket 405; the main board bracket 405 is fixedly connected to the first sub-housing 201.
  • the first magnet 702 may be a permanent magnet
  • the second magnet 703 may be an electromagnet; wherein the magnetic poles of the electromagnet are adjusted by energizing the electromagnet so that the electromagnet and the permanent magnet attract and repel each other
  • the main board bracket 405 can move relatively to drive the first sub-housing 201 to move relative to the second sub-housing 203.
  • the first sub-housing and the second sub-housing are provided with one or more holes.
  • one or more holes provided on the second sub-housing can be exposed to form an air duct, which improves the heat dissipation efficiency of the device, thereby solving some situations where the bottom and top of the device are opened. Holes, so that cold air is sucked in from the bottom and convectively discharged from the top to form the problem of low heat dissipation efficiency.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热装置，包括：外壳；其中，外壳包括：第一子外壳和第二子外壳；第二子外壳靠近散热装置的底部，第一子外壳靠近散热装置的顶部；在第二子外壳上且与第一子外壳重叠的部分上设置有一个或多个孔，且第一子外壳与第二子外壳可相对运动，其中，通过相对运动可使设置在第二子外壳上的一个或多个孔露出以形成风道。

Description

散热装置
相关申请的交叉引用
本申请基于申请号为201911285515.X、申请日为2019年12月13日的中国专利申请提出，并要求该中国专利申请的优先权，该中国专利申请的全部内容在此引入本申请作为参考。
技术领域
本发明实施例涉及硬件设备领域，具体而言，涉及一种散热装置。
背景技术
目前的网络接入设备，由于发热巨大，都采取了固定式开孔散热的方式，开孔位置相对隐蔽，散热方式有限，如图1所示，在底部凹槽内开小孔，冷空气通过空气的热对流效应，从底部吸入，经过主板发热器件、金属散热块后，从顶部对流排出，形成热交换。但由于整个热交换过程路径长，开孔位置隐蔽，内部结构对空气的遮蔽等原因，造成中间器件位置，如图1中圆形位置，发热无法得到有效的缓解。
针对一些情形中的上述问题，目前尚未存在有效的解决方案。
发明内容
本发明实施例提供了一种散热装置，以至少在一定程度上解决相关的技术问题之一，包括：一些情形中采用在设备的底部和顶部开小孔，以使冷空气从底部吸入从顶部对流排出形成热交换的散热方式散热效率低的问题。
根据本发明的一个实施例，提供了一种散热装置，包括：外壳；其中，所述外壳包括：第一子外壳和第二子外壳；所述第二子外壳靠近所述散热装置的底部，所述第一子外壳靠近所述散热装置的顶部；在所述第二子外壳上且与所述第一子外壳重叠的部分上设置有一个或多个孔，且所述第一子外壳与所述第二子外壳可相对运动，其中，通过所述相对运动可使设置在所述第二子外壳上的一个或多个孔露出以形成风道。
附图说明
此处所说明的附图用来提供对本发明的进一步理解，构成本发明的一部分，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1是一些情形中的散热装置的结构示意图；
图2是根据本发明实施例的散热装置的结构示意图；
图3是根据本发明实施例的散热装置的结构示意图一；
图4是根据本发明实施例的散热装置的结构示意图二；
图5是根据本发明实施例的散热装置的结构示意图三；
图6是根据本发明实施例的散热装置的结构示意图四；
图7是根据本发明实施例的散热装置的结构示意图五。
具体实施方式
下文中将参考附图并结合实施例来详细说明本发明。需要说明的是，在不冲突的情况下，本发明中的实施例及实施例中的特征可以相互组合。
需要说明的是，本发明的说明书和权利要求书及上述附图中的术语“第一”、“第二”等是用于区别类似的对象，而不必用于描述特定的顺序或先后次序。
5G技术能够给用户带来更好的用户体验，其传输速率远远高于以前的蜂窝网络，最高可达10Gbit/s；其另外一个优点就是网络延迟低，响应速度更快。由于其突出的优点，将能满足高清视频、虚拟现实等大数据传输的应用场景，以及自动驾驶、远程医疗等低延时场景。但5G的实现对硬件系统提出了更高的要求，高速率，低延时，多天线等需求对于硬件的发热场景提出了更加苛刻的要求。目前的4G终端，由于速率低，功耗相对较小，那么到了5G时代，由于终端的尺寸未发生变化，功耗却大幅增长，尤其是网络接入设备，散热问题需要有创新方案，才能满足终端产品各个元器件正常的工作条件，使产品发挥其正常的功效，满足用户的体验。
本发明实施例的出发点就是基于对流散热的原则，在客观上不降低外观的同时，增加主动的对流风道设计，使得产品的对流散热风道根据产品的发热状态自行调整，并尽最大可能将风道设计在发热量大的器件附近，加强重点区域的空气对流效果，缩短风道长度减少风扇风阻，优化产品在不同状态下的发热状态，使其硬件性能达到最大化发挥进而提升产品性能满足5G产品用户体验需求。
需要说明的是，本发明实施例所涉及到的散热装置除了5G产品，也是可以适用到其他应用场景中需要散热的产品设备的，如与4G相关的产品设备，或者其他通信设备，计算机设备等硬件设备。
在本实施例中提供了一种散热装置，图2是根据本发明实施例的散热装置的结构示意图，如图2所示，该散热装置11包括：外壳200；其中，外壳200包括：第一子外壳201和第二子外壳203；第二子外壳203靠近散热装置11的底部，第一子外壳201靠近散热装置11的顶部；
其中，在第二子外壳203上且与第一子外壳201重叠的部分上设置有一个或多个孔202，且第一子外壳201与第二子外壳203可相对运动，其中，通过相对运动可使设置在第二子 外壳203上的一个或多个孔202露出以形成风道。
在本发明的一些实施方式中，该外壳200可环绕设置在待散热设备外，该待散热设备包括：设置在设备底部的底盖103和设置在设备顶部的顶盖101，其中，底盖103的凹槽上设置的开孔与顶盖上设置的开孔形成空气对流，
可见，在本发明实施例的散热装置11中，由于在第二子外壳上203且与第一子外壳201重叠的部分上设置有一个或多个孔202，在第一子外壳201与第二子外壳203的相对运动后，可使设置在第二子外壳203上的一个或多个孔202露出以形成风道，提高了对设备的散热效率，从而解决了一些情形中采用在设备的底部和顶部开小孔，以使冷空气从底部吸入从顶部对流排出形成热交换的散热方式散热效率低的问题。
需要说明的是，虽然在图2中散热装置11外壳200中的第一子外壳201与第二子外壳203可以是一体设置的，即整个散热装置11的外壳由一个第一子外壳201和一个第二子外壳203组成，当然也可以不是一体设备设置的子外壳，即每一个侧面由单独的第一子外壳201与第二子外壳203，或者只在某一个或多个侧面设置第一子外壳201与第二子外壳203，而不用在所有侧面均设置第一子外壳201与第二子外壳203。
此外，第一子外壳201上是没有设置孔的，因此在第一子外壳201与第二子外壳203重叠的情况下，第二子外壳203上的一个或多个孔202是被挡住的，即无法形成风道进行降温。此外，在图2中对于一个或多个孔202的形状仅仅是举例示出，也可以是其他形状，如圆形的一个或多个孔，矩形的一个或多个孔等等，可以根据实际需要进行调整，在本发明实施例中并不限定其形状。
另外，在图2仅仅是示出了第二子外壳203上只有一排孔202，这仅仅是举例说明，可以根据实际需要进行孔数量的设置以及设置几排孔，且每排孔的数量也是可以根据实际情况进行设置的，如图3所示，在第二子外壳203上设置有两排孔202。
需要说明的是，第二子外壳203上的一个或多个孔202设置在设备发热较高的区域，例如，芯片区。如图2所示，虚线圆圈所对应的就是设备发热较高的区域，这样能够在工作负荷较高的情况下，及时对其进行散热，加快了对该区域的散热效果。
如图4所示，该散热装置还包括：主板支架405；
其中，主板支架405从散热装置的底部组装入第二子外壳203中；第一子外壳201从散热装置的顶部装入第二子外壳203中且靠第二子外壳203的外侧壁导向；主板支架405通过引线与待散热设备的主板406电气连接。
在本发明的一些实施方式中，该主板支架405上设置有丝杠404，丝杠404上设置有丝杠套筒502；丝杠404和主板支架405通过固定连接；第一子外壳201与丝杠404的丝 杠套筒502通过固定连接；该固定连接的方式可以是通过螺钉。
其中，通过丝杠404的旋转运动可带动丝杠套筒502进行往复运动，该丝杠套筒502的往复运动带动第一子外壳201与第二子外壳203的相对运动。
在本发明的一些实施方式中，该散热装置11还包括：驱动电机；其中，驱动电机，用于接收控制指令以驱动丝杠404进行旋转运动。
需要说明的是，在内置在外壳200内的待散热设备的温度超过第一预设阈值的情况下，向驱动电机发送第一控制指令，其中，第一控制指令用于指示驱动电机驱动丝杠404进行旋转运动，带动第一子外壳201与第二子外壳203的相对运动，以使设置在第二子外壳上203的一个或多个孔露出以形成风道；在内置在外壳内200的待散热设备的温度低于第二预设阈值的情况下，向驱动电机发送第二控制指令，其中，第二控制指令用于指示驱动电机驱动丝杠404进行旋转运动，带动第一子外壳201与第二子外壳203的相对运动，以使设置在第一子外壳201覆盖第二子外壳203上的一个或多个孔202。
因此，在具体应用场景中：开机后，整机系统运行，元器件内部的温度传感器会检测内部的关键位置运行温度，当温度没有达到预设的启动点时，系统保持现状持续运转。一旦检测温度达到设定的高温启动点，系统驱动电机，驱动第一子外壳201相对于第二子外壳203相对运动，露出预先设置的一个或多个孔202形成风道，加速散热，确保整机可靠运行。同时温度检测持续进行，当检测到关键位置温度下降，达到预设的低温启动点后，系统驱动电机，进一步驱动第一子外壳201相对于第二子外壳203反向运动，从而使得第一子外壳201覆盖第二子外壳203上的一个或多个孔202，进而关闭风道并持续运行。在整机运行过程中，温度检测始终处于运行状态。当用户关闭系统时，电机机构会检测风道位置，关闭风道后关机。
也就是说，在普通使用场景时，冷风从底部进去经过主板406加热循环到顶部，形成对流降温，在长时间大功耗场景下时，由于芯片区域温度过高，冷风无法有效到达芯片区域，此时，第一子外壳201和第二子外壳203通过电机在驱动程序控制下滑动拉开距离，露出芯片区散热一个或多个孔202，冷空气在风扇的作用下可以快速达到主板芯片发热区形成对流降温。当温度降低到预设的温度或者使用场景功耗降低后，驱动程序控制电机将第一子外壳201和第二子外壳203拉回到原始状态，保证原始的外观形态，避免长期外漏散热孔造成的粉尘等影响，从而实现对设备主动散热需求，该设备可以是5G设备或其他硬件设备，使器件在极限工况下的发热性能大大缓解，提升用户体验。
如图5所示，第一子外壳上设置有卡扣503，卡扣503与第一子外壳201和第二子外壳203连接。
在具体应用场景中，当第一子外壳201在丝杠404和套筒502的带动下运动时，一方面靠丝杠404的行程限位，另外一方面，靠卡扣503来保证第一子外壳201和第二子外壳203在运动过程中防止外力导致的第二子外壳203和第一子外壳201脱开，提升整机的组装可靠性，在卡扣503内侧，第一子外壳201上有开孔，需要维修的时候，使用夹具通过开孔位置顶开卡扣，使得第二子外壳203和第一子外壳201分开，维修整机。
此外，如图5所示，第一子外壳201组装后和丝杠套筒502通过螺钉501固定在一起；丝杠404和主板支架405通过螺钉504固定。
如图6所示，主板支架405上还设置有风扇601，其中，风扇601的风道与通过相对运动可使设置在第二子外壳203上的一个或多个孔202露出以形成的风道一致。
即丝杠404带动第一子外壳201相对第二子外壳203滑动，露出预先设置的一个或多个孔202，漏出的一个或多个孔202形成风道能有效提供冷空气，使得冷空气能快速到达散热片区域，缩短风扇601的风道，降低风压，从而提高风扇601效率，延长风扇601寿命。需要说明的是，本发明实施例中的风扇的位置根据产品的方案设计以及热设计进行调整和设置。
如图7所示，主板支架405上设置有套筒导轨701；其中，套筒导轨701内部设置有第一磁铁702和第二磁铁703；第一磁铁702设置在套筒轨道内靠近主板支架405的一端，第二磁铁703设置在套筒轨道内远离主板支架405的一端；主板支架405与第一子外壳201固定连接。
在具体应用场景中，该第一磁铁702可以是永磁铁，而第二磁铁703可以是电磁铁；其中，通过对电磁铁通电调整电磁铁的磁极以使电磁铁和永磁铁相互吸引和相互排斥以使主板支架405相对运动，以带动第一子外壳201相对第二子外壳203相对运动。
通过本发明实施例，在本发明实施例的散热装置中，由于在第二子外壳上且与第一子外壳重叠的部分上设置有一个或多个孔，在第一子外壳与第二子外壳的相对运动后，可使设置在第二子外壳上的一个或多个孔露出以形成风道，提高了对设备的散热效率，从而解决了一些情形中采用在设备的底部和顶部开小孔，以使冷空气从底部吸入从顶部对流排出形成热交换的散热方式散热效率低的问题。
以上所述仅为本发明的一些实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (8)

  1. 一种散热装置，包括：外壳；其中，所述外壳包括：第一子外壳和第二子外壳；所述第二子外壳靠近所述散热装置的底部，所述第一子外壳靠近所述散热装置的顶部；
    在所述第二子外壳上且与所述第一子外壳重叠的部分上设置有一个或多个孔，且所述第一子外壳与所述第二子外壳可相对运动，其中，通过所述相对运动可使设置在所述第二子外壳上的一个或多个孔露出以形成风道。
  2. 根据权利要求1所述的散热装置，还包括：主板支架；
    其中，所述主板支架从所述散热装置底部组装入所述第二子外壳中；所述第一子外壳从所述散热装置的顶部装入所述第二子外壳中且靠所述第二子外壳的外侧壁导向；所述主板通过引线与待散热设备的主板电气连接。
  3. 根据权利要求2所述的散热装置，其中，所述主板支架上设置有丝杠，所述丝杠上设置有丝杠套筒；其中，所述丝杠和所述主板支架固定连接；所述第一子外壳与所述丝杠的丝杠套筒固定连接；
    其中，通过所述丝杠的旋转运动可带动所述丝杠套筒进行往复运动，所述丝杠套筒的往复运动带动所述第一子外壳与所述第二子外壳的相对运动。
  4. 根据权利要求3所述的散热装置，还包括：驱动电机；
    其中，所述驱动电机，用于接收控制指令以驱动所述丝杠进行旋转运动。
  5. 根据权利要求4所述的散热装置，其中，
    在内置在所述外壳内的待散热设备的温度超过第一预设阈值的情况下，向所述驱动电机发送第一控制指令，其中，所述第一控制指令用于指示所述驱动电机驱动所述丝杠进行旋转运动，带动所述第一子外壳与所述第二子外壳的相对运动，以使设置在所述第二子外壳上的一个或多个孔露出以形成风道；
    在内置在所述外壳内的待散热设备的温度低于第二预设阈值的情况下，向所述驱动电机发送第二控制指令，其中，所述第二控制指令用于指示所述驱动电机驱动所述丝杠进行旋转运动，带动所述第一子外壳与所述第二子外壳的相对运动，以使设置在所述第一子外壳覆盖所述第二子外壳上的一个或多个孔。
  6. 根据权利要求1所述的散热装置，其中，所述第一子外壳上设置有卡扣，所述卡扣与所述第一子外壳和所述第二子外壳连接。
  7. 根据权利要求2所述的散热装置，其中，所述主板支架上还设置有风扇，其中，所述风扇的风道与通过所述相对运动使设置在所述第二子外壳上的一个或多个孔露出以形成的风道一致。
  8. 根据权利要求2所述的散热装置，其中，所述主板支架上设置有套筒导轨；
    其中，所述套筒导轨内部设置有第一磁铁和第二磁铁；所述第一磁铁设置在所述套筒轨道内靠近所述主板支架的一端，所述第二磁铁设置在所述套筒轨道内远离所述主板支架的一端；所述主板支架与所述第一子外壳固定连接；
    其中，通过所述第一磁铁的所述第二磁铁的相互吸引和相互排斥以使所述主板支架相对运动，以带动所述第一子外壳相对所述第二子外壳相对运动。
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113840524A (zh) * 2021-10-14 2021-12-24 国网江苏省电力有限公司宿迁供电分公司 安全运维审计操作一体化终端及防护方法
CN114400883A (zh) * 2021-12-28 2022-04-26 江苏力普通瑞电力电子科技有限公司 一种便于维护的高压变频器预充电系统

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114857698B (zh) * 2022-05-31 2024-04-02 Tcl空调器(中山)有限公司 一种加湿组件及净化器

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204231854U (zh) * 2014-12-02 2015-03-25 南京润杰电控设备有限公司 一种控制柜散热装置
CN106982537A (zh) * 2016-01-19 2017-07-25 中兴通讯股份有限公司 风道风阻的无极可调式方法及装置
US20190099286A1 (en) * 2016-05-11 2019-04-04 Vivonics, Inc. Cooling System and Method For A Prosthetic Socket
CN109585732A (zh) * 2018-11-21 2019-04-05 合肥泽尼特新能源有限公司 一种新能源汽车电池散热套
CN209043090U (zh) * 2018-09-12 2019-06-28 天津市利鑫达夏星散热器股份有限公司 一种便于携带的铝合金散热器
CN109981867A (zh) * 2019-03-26 2019-07-05 努比亚技术有限公司 散热方法、移动终端及计算机可读存储介质

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1154975A (ja) * 1997-07-31 1999-02-26 Ricoh Co Ltd 筐体内排気装置
JP2007234791A (ja) 2006-02-28 2007-09-13 Fuji Electric Retail Systems Co Ltd 電子機器冷却装置
JP5835067B2 (ja) 2011-07-04 2015-12-24 株式会社Ｊｖｃケンウッド プロジェクタ
CN105555082B (zh) * 2016-01-18 2018-07-06 杭州奕胜科技有限公司 一种汽车功放外壳
CN106852046B (zh) * 2017-02-10 2023-04-07 浙江远望通信技术有限公司 一种新型室外电子设备箱
CN107979950A (zh) * 2017-11-13 2018-05-01 中国航空工业集团公司西安航空计算技术研究所 通风集成机架的自动分风装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204231854U (zh) * 2014-12-02 2015-03-25 南京润杰电控设备有限公司 一种控制柜散热装置
CN106982537A (zh) * 2016-01-19 2017-07-25 中兴通讯股份有限公司 风道风阻的无极可调式方法及装置
US20190099286A1 (en) * 2016-05-11 2019-04-04 Vivonics, Inc. Cooling System and Method For A Prosthetic Socket
CN209043090U (zh) * 2018-09-12 2019-06-28 天津市利鑫达夏星散热器股份有限公司 一种便于携带的铝合金散热器
CN109585732A (zh) * 2018-11-21 2019-04-05 合肥泽尼特新能源有限公司 一种新能源汽车电池散热套
CN109981867A (zh) * 2019-03-26 2019-07-05 努比亚技术有限公司 散热方法、移动终端及计算机可读存储介质

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113840524A (zh) * 2021-10-14 2021-12-24 国网江苏省电力有限公司宿迁供电分公司 安全运维审计操作一体化终端及防护方法
CN113840524B (zh) * 2021-10-14 2024-02-27 国网江苏省电力有限公司宿迁供电分公司 安全运维审计操作一体化终端及防护方法
CN114400883A (zh) * 2021-12-28 2022-04-26 江苏力普通瑞电力电子科技有限公司 一种便于维护的高压变频器预充电系统

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