WO2021114308A1 - 柔性线路板及发声器件 - Google Patents

柔性线路板及发声器件 Download PDF

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Publication number
WO2021114308A1
WO2021114308A1 PCT/CN2019/125420 CN2019125420W WO2021114308A1 WO 2021114308 A1 WO2021114308 A1 WO 2021114308A1 CN 2019125420 W CN2019125420 W CN 2019125420W WO 2021114308 A1 WO2021114308 A1 WO 2021114308A1
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WIPO (PCT)
Prior art keywords
circuit board
flexible circuit
layer
reinforcing layer
reinforcing
Prior art date
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Ceased
Application number
PCT/CN2019/125420
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English (en)
French (fr)
Inventor
陈国辉
杨桂霞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AAC Technologies Holdings Shenzhen Co Ltd
AAC Technologies Pte Ltd
Original Assignee
AAC Acoustic Technologies Shenzhen Co Ltd
AAC Technologies Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by AAC Acoustic Technologies Shenzhen Co Ltd, AAC Technologies Pte Ltd filed Critical AAC Acoustic Technologies Shenzhen Co Ltd
Priority to PCT/CN2019/125420 priority Critical patent/WO2021114308A1/zh
Publication of WO2021114308A1 publication Critical patent/WO2021114308A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the utility model relates to the field of circuit boards, in particular to a flexible circuit board.
  • Flexible circuit boards also known as "soft boards" are printed circuits made of flexible insulating substrates, and have many advantages that rigid circuits do not have.
  • flexible printed circuit boards are divided into single-sided, double-sided and multi-layer boards. They are mainly based on polyimide or polyester film. This material has high heat resistance, good dimensional stability, and mechanical protection. The cover film with good electrical insulation properties is pressed into the final product.
  • flexible circuit boards have high reliability, excellent flexibility, high wiring density, light weight and thin thickness, and are widely used in the connection of electronic devices.
  • the reinforcing layer will be glued on the back of the substrate to increase the rigidity and flatness of the flexible circuit board. Easy to weld.
  • the purpose of the utility model is to provide a flexible circuit board that can avoid warpage.
  • the present invention provides a flexible circuit board, which includes a flexible circuit board layer and a reinforcing layer attached to the flexible circuit board.
  • the flexible circuit board layer includes relatively disposed The first surface and the second surface, the reinforcing layer is attached to the first surface and/or the second surface, the reinforcing layer is provided with a split opening, and the split opening connects the reinforcing layer
  • the separation is at least two reinforcing sub-segments separated from each other.
  • the shape of the breaking opening is any one of a linear shape, a circular arc shape, and a wave shape.
  • the periphery of the reinforcing layer is flush with the periphery of the current layer of the flexible circuit board.
  • the reinforcing layer covers a part of this layer of the flexible circuit board.
  • the reinforcing layer is any one of polyimide, steel sheet, beryllium copper, and epoxy fiberglass cloth substrate.
  • the length of the reinforcing sub-segment in a direction perpendicular to the thickness of the reinforcing sub-segment is not greater than 20 mm.
  • the utility model also provides a sound generating device, which includes a vibration system and a magnetic circuit system for driving the vibration system to vibrate and produce sound.
  • the vibration system includes an elastic sheet, and the elastic sheet is the above-mentioned flexible circuit board.
  • the reinforcing layer is provided with a breaking opening.
  • the area of the reinforcing layer is larger, and the material shrinkage rate of the reinforcing layer
  • the reinforcing layer is provided with a breaking opening, and the reinforcing layer is divided into two or more reinforcing sub-segments, which reduces the overall shrinkage accumulation value and reduces the deformation of the flexible circuit board. In this way, the undesirable phenomenon of warpage of the flexible circuit board is avoided, which affects the flatness of the flexible circuit board.
  • Figure 1 is a schematic diagram of the three-dimensional structure of the local bonding reinforcement and the entire surface bonding reinforcement of the flexible circuit board of the present invention
  • Figure 2 is a schematic diagram of the three-dimensional structure of the flexible circuit board of the present invention for partial bonding and reinforcement;
  • Fig. 3 is a schematic diagram of the three-dimensional structure of the entire surface of the flexible circuit board of the present invention that is bonded and reinforced.
  • the present invention provides a flexible circuit board 10, which includes a flexible circuit board main layer 1 and a reinforcing layer 2 attached to the flexible circuit board main layer 1.
  • the main layer 1 of the flexible circuit board includes a first surface 11 and a second surface 12 opposite to each other.
  • the reinforcement layer 2 is attached to the first layer 1 of the flexible circuit board, and there are three attachment methods to choose from.
  • the reinforcement layer 2 is attached to the first surface 11;
  • the reinforcement layer 2 is attached to the second surface 12; the reinforcement layer 2 is attached to the first surface 11 and the second surface 12 at the same time.
  • the periphery of the reinforcing layer 2 is flush with the periphery of the first layer 1 of the flexible circuit board.
  • the reinforcement layer 2 with an area smaller than the first layer of the flexible circuit board is selected, and the reinforcement layer 2 covers a part of the current layer 1 of the flexible circuit board; when the current layer 1 of the flexible circuit board
  • a reinforcement layer 2 with the same shape and size as the flexible circuit board 1 is selected, and the reinforcement layer 2 completely covers the entire surface.
  • the reinforcing layer 2 of any area can completely cover the current layer 1 of the flexible circuit board or cover a part of the current layer 1 of the flexible circuit board.
  • the reinforcing layer 2 is any one of polyimide, steel sheet, beryllium copper, and epoxy fiberglass cloth substrate, of course, it is not limited to this.
  • the reinforcing layer 2 is provided with a split 21 which separates the reinforcing layer 2 into at least two reinforcing sub-segments 22 spaced apart from each other.
  • the shape of the breaking opening 21 is any one of a straight line, a circular arc, and a wave shape. Of course, the shape of the breaking opening 21 is not limited to this.
  • the reinforcing layer 2 is provided with a breaking opening 21.
  • the reinforcing layer 2 is provided with a split 21, which divides the reinforcing layer 2 into two or more reinforcing sub-segments 22, and the reinforcing sub-segments 22 extend along a length perpendicular to its thickness direction. The length is not greater than 20mm, which reduces the overall cumulative shrinkage value and reduces the impact on the deformation of the flexible circuit board 10, thereby avoiding the undesirable phenomenon of warpage of the flexible circuit board 10 and affecting the flatness of the flexible circuit board 10 degree.
  • the reinforcement 2 is provided with a breaking opening 21, which can be set according to the size of the flexible circuit board 1, the material expansion and contraction of the flexible circuit board 1, and the bending requirements of the flexible circuit board 1.
  • the number of the breaking openings 21 and the width of the breaking openings 21, that is, the influence on the deformation of the flexible circuit board 1 is reduced by dividing the reinforcing layer 2 into sections and setting the distance between the sections.
  • the present invention also provides a sound generating device 100 (not shown), which includes a vibration system 20 and a magnetic circuit system 30 that drives the vibration system 20 to vibrate and produce sound.
  • the vibration system 20 includes an elastic sheet, which is the above-mentioned flexible sheet.
  • the circuit board 10 is made.
  • the reinforcing layer is provided with a breaking opening.
  • the area of the reinforcing layer is larger, and the shrinkage rate of the material of the reinforcing layer is When it is large, the reinforcing layer is provided with a breaking opening, and the reinforcing layer is divided into two or more reinforcing sub-segments, which reduces the overall shrinkage accumulation value and reduces the deformation of the flexible circuit board. In this way, the undesirable phenomenon of warpage of the flexible circuit board is avoided, and the flatness of the flexible circuit board is affected.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Multimedia (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本实用新型提供了一种柔性线路板，其包括柔性线路板本层和贴合于所述柔性线路板本层上的补强层，所述柔性线路板本层包括相对设置的第一表面和第二表面，所述补强层贴合于所述第一表面和/或所述第二表面，所述补强层设有分断口，所述分断口将所述补强层分隔呈相互间隔的至少两段补强子段。与相关技术相比，本实用新型的柔性线路板及发声器件可以避免柔性线路板发生翘曲的不良现象。

Description

柔性线路板及发声器件 技术领域
本实用新型涉及电路板领域，尤其涉及一种柔性线路板。
 背景技术
柔性线路板又称“软板”是用柔性的绝缘基材制成的印刷电路，具有许多硬性电路不具备的优点。另外，柔性印刷线路板有单面、双面和多层板之分，主要以聚酰亚胺或聚脂薄膜为基材，该材料耐热性高、尺寸稳定性好，与兼有机械保护和良好电气绝缘性能的覆盖膜通过压制而成最终产品。与一般电路板 相比，柔性线路板具有高度可靠性，绝佳的可挠性，具有配线密度高、重量轻和厚度薄的特性，广泛应用于电子器件的连接上。
传统的柔性线路板设计及制造领域，当柔性线路板的基板一面有电子器件或者结构器件时，会在基板的背面通过贴合胶贴合补强层，以增加柔性线路板硬度和平整性，便于焊接。
 技术问题
但是，如果柔性线路板贴合补强层的面积较大时，会因补强材料与柔性线路板的材料收缩不同，导致结合补强后的柔性线路板有相应程度的翘曲，从而影响产品的平整度。
因此，实有必要提供一种新的柔性线路板解决上述技术问题。
 技术解决方案
本实用新型的目的在于提供一种可以避免翘曲的柔性线路板。
为达到上述目的，本实用新型提供一种柔性线路板，其包括柔性线路板本层和贴合于所述柔性线路板本层上的补强层，所述柔性线路板本层包括相对设置的第一表面和第二表面，所述补强层贴合于所述第一表面和/或所述第二表面，所述补强层设有分断口，所述分断口将所述补强层分隔呈相互间隔的至少两段补强子段。  
优选的，所述分断口的形状为直线形、圆弧形以及波浪形中的任意一种。
优选的，所述补强层的周缘与所述柔性线路板本层的周缘平齐。
优选的，所述补强层覆盖所述柔性线路板本层的一部分。
优选的，所述补强层为聚酰亚胺、钢片、铍铜以及环氧玻纤布基板的任意一种。
优选的，所述补强子段沿垂直于所述补强子段的厚度方向的长度不大于20mm。
本实用新型还提供一种发声器件，包括振动系统和驱动所述振动系统振动发声的磁路系统，所述振动系统包括弹片，所述弹片为上述的柔性线路板。
 有益效果
与相关技术相比，本实用新型的柔性线路板中，所述补强层设有分断口，当所述柔性线路板贴合补强层的面积较大，且补强层的材质的收缩率大时，在所述补强层上设有分断口，将所述补强层分成两段或者多段补强子段，减小了总体的收缩累积值，降低了对所述柔性线路板形变的影响，从而避免所述柔性线路板翘曲的不良现象，影响所述柔性线路板的平整度。
 附图说明
为了更清楚地说明本实用新型实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其它的附图，其中：
图1为本实用新型柔性线路板的局部贴合补强和整面贴合补强的立体结构示意图；
图2为本实用新型柔性线路板的局部贴合补强的立体结构示意图；
图3为本实用新型柔性线路板的整面贴合补强的立体结构示意图。
 本发明的实施方式
下面将结合本实用新型实施例中的附图，对本实用新型实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本实用新型的一部分实施例，而不是全部的实施例。基于本实用新型中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本实用新型保护的范围。
请同时参照1-3，本实用新型提供一种柔性线路板10，其包括柔性线路板本层1和贴合于所述柔性线路板本层1上的补强层2。
所述柔性线路板本层1包括相对设置的第一表面11和第二表面12。
在本实施方式中，所述补强层2贴合于所述柔性线路板本层1上有三种贴合方式可供选择，所述补强层2贴合于所述第一表面11；所述补强层2贴合于所述第二表面12；所述补强层2同时贴合于所述第一表面11和所述第二表面12。
具体的，所述补强层2的周缘与所述柔性线路板本层1的周缘平齐，当所述柔性线路板本层1的所述第一表面11或所述第二表面12只需局部位置补强，则选择面积小于所述柔性线路板本层1的补强层2，所述补强层2覆盖所述柔性线路板本层1的一部分；当所述柔性线路板本层1的所述第一表面11或所述第二表面12的整面都需要补强时，则选择形状大小与所述柔性线路板1相等的补强层2，所述补强层2完全覆盖所述柔性线路板本层1的第一表面11或第二表面12；当所述柔性线路板本层1的所述第一表面11和所述第二表面12都需要补强时，则可以选择任意面积的补强层2，可完全覆盖所述柔性线路板本层1或覆盖所述柔性线路板本层1的一部分。
值得一提的是，所述补强层2为聚酰亚胺、钢片、铍铜以及环氧玻纤布基板的任意一种，当然，不限于此。
进一步的，所述补强层2设有分断口21，所述分断口21将所述补强层2分隔呈相互间隔的至少两段补强子段22。且所述分断口21的形状为直线形、圆弧形以及波浪形的任意一种，当然，所述分断口21的形状不限于此。
在本实施方式中，所述补强层2设有分断口21，当所述柔性线路板本层1贴合补强层2的面积较大，且补强层2的材质的收缩率大时，在所述补强层2上设有分断口21，将所述补强层2分成两段或者多段补强子段22，且所述补强子段22沿垂直于其厚度方向的长的长度不大于20mm，减小了总体的收缩累积值，降低了对所述柔性线路板10形变的影响，从而避免所述柔性线路板10翘曲的不良现象，影响所述柔性线路板10的平整度。
更优的，所述补强2上设有分断口21，可根据所述柔性线路板1的尺寸、所述柔性线路板1材料涨缩以及所述柔性线路板1的弯曲要求来设置所述分断口21的数量和所述分断口21的宽度，即，通过将所述补强层2分段和设置分段之间的间距来降低对所述柔性线路板1 形变的影响。
本实用新型还提供一种发声器件100（图未示），包括振动系统20和驱动所述振动系统20振动发声的磁路系统30，所述振动系统20包括弹片，所述弹片为上述的柔性线路板10制成。
与相关技术相比，本实用新型的柔性线路板中，所述补强层设有分断口，当所述柔性线路板贴合补强层的面积较大，且补强层的材质的收缩率大时，在所述补强层上设有分断口，将所述补强层分成两段或者多段补强子段，减小了总体的收缩累积值，降低了对所述柔性线路板形变的影响，从而避免所述柔性线路板翘曲的不良现象，影响所述柔性线路板的平整度。
以上所述的仅是本实用新型的实施方式，在此应当指出，对于本领域的普通技术人员来说，在不脱离本实用新型创造构思的前提下，还可以做出改进，但这些均属于本实用新型的保护范围。

Claims (7)

  1. 一种柔性线路板，其包括柔性线路板本层和贴合于所述柔性线路板本层上的补强层，所述柔性线路板本层包括相对设置的第一表面和第二表面，所述补强层贴合于所述第一表面和/或所述第二表面，其特征在于，所述补强层设有分断口，所述分断口将所述补强层分隔呈相互间隔的至少两段补强子段。
  2. 根据权利要求1所述的柔性线路板，其特征在于，所述分断口的形状为直线形、圆弧形以及波浪形中的任意一种。
  3. 根据权利要求1所述的柔性线路板，其特征在于，所述补强层的周缘与所述柔性线路板本层的周缘平齐。
  4. 根据权利要求1所述的柔性线路板，其特征在于，所述补强层覆盖所述柔性线路板本层的一部分。
  5. 根据权利要求1所述的柔性线路板，其特征在于，所述补强层为聚酰亚胺、钢片、铍铜以及环氧玻纤布基板的任意一种。
  6. 根据权利要求1所述的柔性线路板，其特征在于，所述补强子段沿垂直于所述补强子段的厚度方向的长度不大于20mm。
  7. 一种发声器件，包括振动系统和驱动所述振动系统振动发声的磁路系统，所述振动系统包括弹片，所述弹片为权利要求1-6任意一项所述的柔性线路板。
PCT/CN2019/125420 2019-12-14 2019-12-14 柔性线路板及发声器件 Ceased WO2021114308A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010212320A (ja) * 2009-03-09 2010-09-24 Toshiba Hokuto Electronics Corp フレキシブルプリント配線板
CN101986772A (zh) * 2010-10-27 2011-03-16 淳华科技(昆山)有限公司 软性电路板的制造方法
CN203984616U (zh) * 2014-07-18 2014-12-03 歌尔声学股份有限公司 扬声器模组
CN205545913U (zh) * 2016-01-28 2016-08-31 瑞声光电科技(常州)有限公司 微型发声器件
CN107666769A (zh) * 2017-09-29 2018-02-06 广东欧珀移动通信有限公司 一种移动终端及其双面电路板
CN207219151U (zh) * 2017-08-28 2018-04-10 深圳市柔宇科技有限公司 柔性印刷电路板及电子装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010212320A (ja) * 2009-03-09 2010-09-24 Toshiba Hokuto Electronics Corp フレキシブルプリント配線板
CN101986772A (zh) * 2010-10-27 2011-03-16 淳华科技(昆山)有限公司 软性电路板的制造方法
CN203984616U (zh) * 2014-07-18 2014-12-03 歌尔声学股份有限公司 扬声器模组
CN205545913U (zh) * 2016-01-28 2016-08-31 瑞声光电科技(常州)有限公司 微型发声器件
CN207219151U (zh) * 2017-08-28 2018-04-10 深圳市柔宇科技有限公司 柔性印刷电路板及电子装置
CN107666769A (zh) * 2017-09-29 2018-02-06 广东欧珀移动通信有限公司 一种移动终端及其双面电路板

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