WO2021106581A1 - Control device, substrate processing system, and control method - Google Patents

Control device, substrate processing system, and control method Download PDF

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Publication number
WO2021106581A1
WO2021106581A1 PCT/JP2020/042170 JP2020042170W WO2021106581A1 WO 2021106581 A1 WO2021106581 A1 WO 2021106581A1 JP 2020042170 W JP2020042170 W JP 2020042170W WO 2021106581 A1 WO2021106581 A1 WO 2021106581A1
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WIPO (PCT)
Prior art keywords
processing
substrate
lot
schedule
unit
Prior art date
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PCT/JP2020/042170
Other languages
French (fr)
Japanese (ja)
Inventor
孝文 土屋
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東京エレクトロン株式会社
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Application filed by 東京エレクトロン株式会社 filed Critical 東京エレクトロン株式会社
Priority to CN202080079771.8A priority Critical patent/CN114651318B/en
Priority to JP2021561285A priority patent/JP7098072B2/en
Priority to KR1020227020543A priority patent/KR102506832B1/en
Publication of WO2021106581A1 publication Critical patent/WO2021106581A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present disclosure relates to a control device, a substrate processing system, and a control method.
  • Patent Document 1 discloses that when the total consumption of pure water per hour in all the substrate processing devices exceeds the maximum supply amount, the processing unit of any of the substrate processing devices is instructed to reschedule. Has been done.
  • the present disclosure provides a technique for suppressing a power shortage in a substrate processing apparatus.
  • the control device includes an acquisition unit, a selection unit, a calculation unit, and a setting unit.
  • the acquisition unit acquires the processing schedule of the substrate processing apparatus for the substrate from the plurality of substrate processing apparatus.
  • the selection unit selects a board processing device scheduled to start, which is scheduled to start a processing schedule for a new board, based on the priority of the plurality of board processing devices.
  • the calculation unit calculates the total value of the force used by the processing schedule at which the processing is started and the force used by the scheduled start processing schedule which is the processing schedule newly started in the scheduled start substrate processing apparatus.
  • the setting unit sets the start timing of the scheduled start processing schedule so that the total value is equal to or less than the given upper limit value when the total value is larger than the given upper limit value.
  • FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to an embodiment.
  • FIG. 2 is a schematic plan view of the substrate processing apparatus according to the embodiment.
  • FIG. 3 is a schematic block diagram of the server device according to the embodiment.
  • FIG. 4 is a flowchart illustrating a processing schedule management process according to the embodiment.
  • FIG. 5 is a time table and a time chart (No. 1) for explaining the management process of the processing schedule according to the embodiment.
  • FIG. 6 is a time table and a time chart (No. 2) for explaining the management process of the processing schedule according to the embodiment.
  • control device the substrate processing system, and the control method disclosed in the present application will be described in detail with reference to the attached drawings.
  • the control device, the substrate processing system, and the control method disclosed by the following embodiments are not limited.
  • the drawings are schematic, and the dimensional relationship of each element, the ratio of each element, and the like may differ from the reality. Further, even between the drawings, there may be parts having different dimensional relationships and ratios from each other.
  • FIG. 1 is a diagram showing a schematic configuration of a substrate processing system 1 according to an embodiment.
  • the board processing system 1 includes a plurality of board processing devices 100 and a server device 200 (an example of a control device).
  • the plurality of board processing devices 100 and the server device 200 are communicably connected via a network by wire or wirelessly.
  • the plurality of substrate processing devices 100 may include a substrate processing device 100 that performs the same processing on the substrate 8 (see FIG. 2), or may include a substrate processing device 100 that performs different processing. That is, the plurality of substrate processing devices 100 may be the same device or different devices.
  • the plurality of substrate processing devices 100 are supplied with power from the power supply source 300.
  • the force is, for example, DIW (DeIonized Water) or electric power.
  • an upper limit value (an example of a given upper limit value) is set.
  • the force is DIW
  • an upper limit value of DIW that can be used simultaneously in a plurality of substrate processing devices 100 is set.
  • the power is electric power
  • an upper limit value of electric power that can be used simultaneously in the plurality of substrate processing devices 100 is set.
  • DIW may be used as an example of the force.
  • FIG. 2 is a schematic plan view of the substrate processing apparatus 100 according to the embodiment.
  • the direction orthogonal to the horizontal direction will be described as the vertical direction.
  • the substrate processing device 100 includes a carrier loading / unloading unit 2, a lot forming unit 3, a lot loading unit 4, a lot transport unit 5, a lot processing unit 6, and a control unit 50.
  • the carrier loading / unloading section 2 carries in and out the carrier 9 in which a plurality of (for example, 25) substrates 8 are arranged vertically in a horizontal posture.
  • the carrier loading / unloading section 2 includes a carrier stage 10 on which a plurality of carriers 9 are placed, a carrier transport mechanism 11 for transporting the carriers 9, carrier stocks 12 and 13 for temporarily storing the carriers 9, and carriers.
  • a carrier mounting table 14 on which the 9 is mounted is provided.
  • the carrier loading / unloading section 2 transports the carrier 9 carried into the carrier stage 10 from the outside to the carrier stock 12 and the carrier mounting table 14 using the carrier transport mechanism 11.
  • the carrier stock 12 temporarily stores the carrier 9 that houses the plurality of substrates 8 before being processed by the lot processing unit 6.
  • a plurality of boards 8 are carried out from the carrier 9 which is transported to the carrier mounting table 14 and accommodates the plurality of boards 8 before being processed by the lot processing unit 6 by the board transport mechanism 15 described later.
  • a plurality of substrates 8 after being processed by the lot processing unit 6 are carried in from the substrate transport mechanism 15 to the carrier 9 which is mounted on the carrier mounting table 14 and does not accommodate the substrate 8.
  • the carrier loading / unloading section 2 is mounted on the carrier mounting table 14, and the carrier 9 accommodating a plurality of substrates 8 after being processed by the lot processing section 6 is used as a carrier stock 13 or a carrier by using the carrier transport mechanism 11. Transport to stage 10.
  • the carrier stock 13 temporarily stores a plurality of substrates 8 after being processed by the lot processing unit 6.
  • the carrier 9 conveyed to the carrier stage 10 is carried out.
  • the lot forming unit 3 is provided with a substrate transfer mechanism 15 that conveys a plurality of (for example, 25) substrates 8.
  • the lot forming unit 3 transfers a plurality of (for example, 25) substrates 8 twice by the substrate transport mechanism 15, and forms a lot composed of a plurality of (for example, 50) substrates 8.
  • the lot forming unit 3 uses the substrate transfer mechanism 15 to transfer a plurality of substrates 8 from the carrier 9 mounted on the carrier mounting table 14 to the lot mounting portion 4, and mounts the plurality of substrates 8 in lots. A lot is formed by placing it on the part 4.
  • the lot forming unit 3 is processed by the lot processing unit 6, and a plurality of substrates 8 are transferred from the lot placed on the lot mounting unit 4 to the carrier 9 by using the substrate transfer mechanism 15.
  • the lot loading unit 4 temporarily places (stands by) the lot transferred between the lot forming unit 3 and the lot processing unit 6 by the lot transport unit 5 on the lot loading table 16.
  • the lot loading unit 4 is provided with a loading side lot loading table 17 and a loading side lot loading table 18.
  • the lot before processing is placed on the lot loading table 17 on the carry-in side.
  • the processed lot is placed on the carry-out side lot loading table 18.
  • a plurality of substrates 8 for one lot are placed side by side in a vertical position on the carry-in side lot mounting table 17 and the carry-out side lot mounting table 18.
  • the lot transfer unit 5 transfers lots between the lot loading unit 4 and the lot processing unit 6 and between the inside of the lot processing unit 6.
  • the lot transport unit 5 is provided with a lot transport mechanism 19 for transporting lots.
  • the lot transfer mechanism 19 has a rail 20 arranged along the lot loading unit 4 and the lot processing unit 6, and a moving body 21 that moves along the rail 20 while holding the lot.
  • the moving body 21 is provided with a board holding body 22 for holding a lot formed by a plurality of boards 8 arranged in a vertical posture in the front-rear direction.
  • the lot transfer unit 5 receives the lot placed on the carry-in side lot loading table 17 by the substrate holder 22 of the lot transfer mechanism 19, and delivers the received lot to the lot processing unit 6.
  • the lot transfer unit 5 receives the lot processed by the lot processing unit 6 by the substrate holder 22 of the lot transfer mechanism 19, and delivers the received lot to the unloading side lot loading table 18.
  • the lot transfer unit 5 transfers the lot inside the lot processing unit 6 by using the lot transfer mechanism 19.
  • the lot processing unit 6 performs processing such as etching, cleaning, and drying on a lot formed of a plurality of substrates 8.
  • the lot processing unit 6 is provided with an etching processing device 23, a cleaning processing device 24, a substrate holder cleaning device 25, and a drying processing device 26 side by side.
  • the etching processing apparatus 23 performs an etching processing on the lot.
  • the cleaning processing device 24 performs a lot cleaning processing.
  • the substrate holder cleaning device 25 and the substrate holder 22 are cleaned.
  • the drying processing apparatus 26 performs a lot drying processing.
  • the number of each device 23 to 26 is not limited to the number shown in FIG.
  • the number of etching processing devices 23 is not limited to two, and may be one or three or more.
  • the etching processing device 23 includes a processing tank 27 for etching, a processing tank 28 for rinsing, and substrate elevating mechanisms 29 and 30.
  • the etching treatment tank 27 stores an etching treatment liquid (hereinafter referred to as "etching liquid").
  • DIW which is a treatment liquid for rinsing, is stored in the rinsing treatment tank 28.
  • a plurality of substrates 8 forming a lot are held side by side in a vertical posture in the substrate elevating mechanisms 29 and 30.
  • the etching processing device 23 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate elevating mechanism 29, and lowers the received lot by the substrate elevating mechanism 29 to immerse the lot in the etching solution of the processing tank 27. Etching process is performed.
  • the etching processing device 23 takes out the lot from the processing tank 27 by raising the substrate elevating mechanism 29, and delivers the lot from the substrate elevating mechanism 29 to the substrate holder 22 of the lot transfer mechanism 19.
  • the lot is received from the substrate holder 22 of the lot transfer mechanism 19 by the substrate elevating mechanism 30, and the received lot is lowered by the substrate elevating mechanism 30 to immerse the lot in the rinsing treatment liquid of the processing tank 28 for rinsing. Perform processing.
  • the etching processing device 23 takes out the lot from the processing tank 28 by raising the substrate elevating mechanism 30, and delivers the lot from the substrate elevating mechanism 30 to the substrate holder 22 of the lot transfer mechanism 19.
  • the cleaning processing device 24 includes a processing tank 31 for cleaning, a processing tank 32 for rinsing, and substrate elevating mechanisms 33 and 34.
  • the cleaning treatment liquid (SC-1, etc.) is stored in the cleaning treatment tank 31.
  • DIW which is a treatment liquid for rinsing, is stored in the rinsing treatment tank 32.
  • a plurality of substrates 8 for one lot are held side by side in a vertical posture in the substrate elevating mechanisms 33 and 34.
  • the drying processing device 26 has a processing tank 35 and a substrate elevating mechanism 36 that moves up and down with respect to the processing tank 35.
  • a processing gas for drying (IPA (isopropyl alcohol), etc.) is supplied to the processing tank 35.
  • a plurality of substrates 8 for one lot are held side by side in a vertical posture in the substrate elevating mechanism 36.
  • the drying processing device 26 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate elevating mechanism 36, lowers the received lot by the substrate elevating mechanism 36, carries it into the processing tank 35, and supplies it to the processing tank 35.
  • the lot is dried with a processing gas for drying. Then, the drying processing device 26 raises the lot by the substrate elevating mechanism 36, and delivers the dried lot from the substrate elevating mechanism 36 to the substrate holding body 22 of the lot transfer mechanism 19.
  • the substrate holder cleaning device 25 has a processing tank 37.
  • the substrate holder cleaning device 25 can supply DIW, which is a cleaning treatment liquid, and a drying gas to the processing tank 37, and supplies the cleaning treatment liquid to the substrate holder 22 of the lot transfer mechanism 19. After that, the substrate holder 22 is cleaned by supplying a dry gas.
  • the control unit 50 controls the operation of each unit (carrier loading / unloading unit 2, lot forming unit 3, lot loading unit 4, lot transport unit 5, lot processing unit 6) of the substrate processing device 100.
  • the control unit 50 controls the operation of each unit of the substrate processing device 100 based on a signal from a switch or the like.
  • the control unit 50 is composed of, for example, a computer, and has a storage medium 38 that can be read by the computer.
  • the storage medium 38 stores programs that control various processes executed by the substrate processing apparatus 100.
  • the storage medium 38 stores the processing schedule in the substrate processing apparatus 100.
  • the processing schedule is a schedule of all processing performed on the substrate 8 by the substrate processing apparatus 100. That is, the processing schedule is the processing schedule of the entire processing performed by the substrate processing apparatus 100 for the lot. Specifically, the processing schedule is the processing schedule in the lot processing unit 6. For example, the processing schedule is a schedule from when the lot before processing is carried out from the loading side lot loading table 17 to when the processed lot is carried into the loading side lot loading table 18.
  • the processing schedule contains information about the forces used in the processing.
  • the processing schedule includes information on the amount of DIW used when each processing is performed on the lot by the lot processing unit 6.
  • the control unit 50 controls the operation of the substrate processing device 100 by reading and executing the program stored in the storage medium 38.
  • the program may be stored in a storage medium 38 that can be read by a computer, and may be installed in the storage medium 38 of the control unit 50 from another storage medium.
  • Examples of the storage medium 38 that can be read by a computer include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.
  • HD hard disk
  • FD flexible disk
  • CD compact disk
  • MO magnet optical disk
  • control unit 50 starts processing for the lot based on the processing schedule start signal transmitted from the server device 200.
  • FIG. 3 is a schematic block diagram of the server device 200 according to the embodiment.
  • the server device 200 includes a communication unit 201, a control unit 202, and a storage unit 203.
  • the communication unit 201 is a communication interface that communicates with each board processing device 100 via a network.
  • the communication unit 201 receives the processing schedule from each board processing device 100. Further, the communication unit 201 transmits the start signal of the processing schedule in each board processing device 100 permitted by the control unit 202 to each board processing device 100.
  • the storage unit 203 is realized by a semiconductor memory element such as a RAM (Random Access Memory) or a flash memory (Flash Memory), or a storage device such as a hard disk or an optical disk.
  • the storage unit 203 stores programs that control various processes executed by the server device 200. Further, the storage unit 203 stores the timetable generated based on the processing schedule of each substrate processing apparatus 100.
  • the control unit 202 controls the operation of the server device 200 by reading and executing the program stored in the storage unit 203.
  • the program may be recorded on a storage medium readable by a computer, and may be installed from the storage medium in the storage unit 203 of the server device 200.
  • Computer-readable storage media include, for example, hard disks, compact discs, memory cards, and the like.
  • the control unit 202 includes an acquisition unit 210, a priority setting unit 211, a timetable generation unit 212, a selection unit 213, a determination unit 214, a calculation unit 215, a setting unit 216, and an instruction unit 217. ..
  • the control unit 202 is a controller, and various programs stored in the storage device inside the storage unit 203 are executed using the RAM as a work area by a CPU (Central Processing Unit), an MPU (Micro Processing Unit), or the like. To. As a result, the control unit 202 functions as an acquisition unit 210, a priority setting unit 211, a timetable generation unit 212, a selection unit 213, a determination unit 214, a calculation unit 215, a setting unit 216, and an instruction unit 217.
  • a CPU Central Processing Unit
  • MPU Micro Processing Unit
  • the control unit 202 functions as an acquisition unit 210, a priority setting unit 211, a timetable generation unit 212, a selection unit 213, a determination unit 214, a calculation unit 215, a setting unit 216, and an instruction unit 217.
  • control unit 202 can be realized by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array).
  • ASIC Application Specific Integrated Circuit
  • FPGA Field Programmable Gate Array
  • the acquisition unit 210, the priority setting unit 211, the timetable generation unit 212, the selection unit 213, the determination unit 214, the calculation unit 215, the setting unit 216, and the instruction unit 217 may be integrated or divided into a plurality of units. May be done.
  • the acquisition unit 210 acquires the processing schedule of the substrate processing apparatus 100 for the substrate 8 from the plurality of substrate processing apparatus 100.
  • the processing schedule includes a processing schedule for the lot for which processing has started and a processing schedule for the lot to be processed.
  • the lot to be processed is the lot to be processed next in the lot processing unit 6 of the substrate processing apparatus 100.
  • the acquisition unit 210 acquires information about the substrate 8 before the carrier loading / unloading unit 2 is carried in and the processing is started from each substrate processing device 100.
  • the information about the substrate 8 before the processing is started is, for example, information about the number of the substrates 8 before the processing carried into the carrier loading / unloading section 2.
  • the priority setting unit 211 sets the priority in each board processing device 100.
  • the priority setting unit 211 sets a predetermined priority for each substrate processing device 100. For example, the priority setting unit 211 sets the priority "1" for a certain substrate processing device 100. Further, the priority setting unit 211 sets the priority "2" for another substrate processing device 100. The lower the number, the higher the priority. The larger the value, the higher the priority.
  • the priority setting unit 211 sets the priority based on the states of the plurality of board processing devices 100. Specifically, the priority setting unit 211 lowers the priority of the substrate processing apparatus 100 having the processing tank (an example of the processing unit) during warning or maintenance. For example, the priority setting unit 211 lowers the priority of the substrate processing apparatus 100 when a certain processing tank of the substrate processing apparatus 100 having the priority of "1" is under warning or maintenance. The priority is set to "2".
  • the priority setting unit 211 raises the priority of the substrate processing apparatus 100 having a large number of substrates 8 before processing. For example, in the substrate processing apparatus 100 having a priority of "3", the priority setting unit 211 has a priority of the substrate processing apparatus 100 when the number of substrates 8 before processing is larger than a preset predetermined number. Is set to high, and the priority is set to "2". Further, for example, the priority setting unit 211 sets the priority of the substrate processing device 100 having a large number of substrates 8 before processing among the plurality of substrate processing devices 100, and the substrate processing device having a small number of substrates 8 before processing. It may be higher than the priority of 100.
  • the priority is set according to the number of substrate processing devices 100. For example, when the number of the substrate processing devices 100 is “10", the priority is set from “1" to "10". Moreover, the priority may be set as a hierarchy. The priority may be set as “1-1”, “1-2", “2-1", “2-2", “2-3", “3-1” and the like. In this case, for example, the priority "1-2" is lower than “1-1” and higher than "2-1".
  • the timetable generation unit 212 generates a timetable based on the processing schedule acquired from each substrate processing apparatus 100.
  • the timetable generation unit 212 generates a force timetable for the lot processing started by each substrate processing apparatus 100 based on the processing schedule of the lot processing started.
  • the timetable generation unit 212 updates the timetable based on the processing schedule of the lot in which the processing is newly permitted and the processing is started. .. Specifically, the timetable generation unit 212 updates the force timetable by adding the force processing schedule in the lot in which the processing is started to the force timetable in the lot in which the processing is started.
  • the selection unit 213 is an example of the substrate processing apparatus 100 (an example of the substrate processing apparatus scheduled to start) that is scheduled to start the processing schedule for a new lot (an example of the substrate 8) based on the priority of the plurality of substrate processing apparatus 100. ) Is selected. That is, the selection unit 213 selects the substrate processing device 100 that determines whether or not to allow lot processing based on the priority. The selection unit 213 selects the substrate processing apparatus 100 in descending order of priority.
  • the determination unit 214 determines whether or not there is a lot before processing in the substrate processing apparatus 100 selected by the selection unit 213. Further, the determination unit 214 determines whether or not the total value of the forces described later is larger than the upper limit value.
  • the calculation unit 215 uses the force used by the processing schedule at which processing is started, and the substrate processing apparatus 100 (an example of the substrate processing apparatus scheduled to start) that is scheduled to start the processing schedule for a new lot (an example of a substrate). ), The total value of the forces used by the scheduled start processing schedule, which is the newly started processing schedule, is calculated. Specifically, the calculation unit 215 adds the force used by the scheduled start processing schedule to the added value of the force used until the end of the processing schedule at which the processing is started in each substrate processing device 100. Calculate the total value. For example, the calculation unit 215 adds the value of each DIW used until the end of the processing schedule in which the processing is started in each substrate processing apparatus 100, and the value of the DIW used by the scheduled start processing schedule. Is added to calculate the total value of DIW.
  • the setting unit 216 sets the start timing of the scheduled start processing schedule in each board processing device 100.
  • the setting unit 216 permits execution of the scheduled start processing schedule when the total value is equal to or less than the upper limit value. That is, when the total value is equal to or less than the upper limit value, the setting unit 216 permits processing according to the scheduled start processing schedule, and causes the substrate processing apparatus 100 to start processing for a new lot.
  • the setting unit 216 sets the start timing of the scheduled start processing schedule so that the total value becomes equal to or less than the upper limit value when the total value is larger than the upper limit value (an example of a given upper limit value). Specifically, the setting unit 216 delays the start timing of the scheduled start processing schedule so that the total value becomes equal to or less than the upper limit value when the total value is larger than the upper limit value.
  • the instruction unit 217 generates a processing schedule start signal for the board processing device 100 that executes the start schedule processing schedule permitted by the setting unit 216.
  • FIG. 4 is a flowchart illustrating a processing schedule management process according to the embodiment.
  • the server device 200 acquires the processing schedule for the lot for which processing has started and the number of lots before processing from each substrate processing device 100 (S100), and generates a timetable for the lot for which processing has started (S101).
  • the server device 200 sets the priority of each board processing device 100 (S102).
  • the server device 200 selects the substrate processing device 100 that determines whether or not to allow processing for a new lot based on the priority (S103).
  • the server device 200 determines whether or not there is a lot before processing in the selected substrate processing device 100 (S104). When there is no lot before processing (S104: No), the server device 200 determines whether or not there is an unselected board processing device 100 (S111). If there is a lot before processing (S104: Yes), the server device 200 acquires the processing schedule for the lot to be processed (S105). That is, the server device 200 acquires the scheduled start processing schedule.
  • the server device 200 calculates the total value of the force (S106) and determines whether or not the total value is larger than the upper limit value (S107).
  • the force is a preset force, for example, DIW.
  • the force may include a plurality of forces, for example, DIW and electric power. If the force includes a plurality of forces, a determination is made for each force.
  • the server device 200 suppresses the start of lot processing when the total value of the force is larger than the upper limit value (S107: Yes) (S108). Specifically, the server device 200 sets the start timing of the scheduled start processing schedule so that the total value of the force is smaller than the upper limit value.
  • the server device 200 permits processing for the lot to be processed (S109). That is, the server device 200 permits the start of the scheduled start processing schedule. The server device 200 adds the processing schedule for the permitted lot to the timetable and updates the timetable (S110).
  • the server device 200 determines whether or not there is an unselected board processing device 100 (S111), and if there is an unselected board processing device 100 (S111: Yes), newly selects the board processing device 100. (S103). The server device 200 ends the process when there is no unselected board processing device 100 (S111: No).
  • FIG. 5 is a time table and a time chart (No. 1) for explaining the management process of the processing schedule according to the embodiment.
  • FIG. 6 is a time table and a time chart (No. 2) for explaining the management process of the processing schedule according to the embodiment.
  • the substrate processing system 1 has three substrate processing devices 100 (hereinafter, may be referred to as substrate processing devices A to C).
  • the priority of the substrate processing device B is the lowest, and the priority is higher in the order of the substrate processing device A and the substrate processing device C.
  • the substrate processing apparatus A executes six processes (processes A-1 to A-6) as processes for the lot.
  • the substrate processing apparatus B executes six processes (processes B-1 to B-6) as processes for the lot.
  • the substrate processing apparatus C executes five processes (processes C-1 to C-5) as processes for the lot.
  • the substrate processing device A has two processing devices that perform the processing "A-1” and the processing "A-2", and performs the processing "A-3” and the processing "A-4". Has two.
  • the substrate processing device B has two processing devices that perform the processing "B-1” and the processing "B-2", and performs the processing "B-3” and the processing "B-4". Has two.
  • the lot processing order in each of the substrate processing devices A to C is assigned in the order of "1" to "5" or “1" to “3".
  • DIW is taken as an example as a force, and the amount of DIW used in each process is shown below the process.
  • the upper limit of DIW is 700 L / min.
  • DIW is not used in the processing "A-1"
  • 80L / min DIW is used in the processing "A-2”.
  • the process "A-4" is executed for the lot "1"
  • the process “A-3” is executed for the lot "2”.
  • the process “A-2” is executed for the lot "3”
  • the process “A-1” is executed for the lot "4".
  • lot "5" is scheduled to be processed.
  • the processing "B-4" is executed for the lot "1"
  • the processing "B-3” is executed for the lot "2”.
  • the process "B-2" is executed for the lot "3”
  • the process "B-1” is executed for the lot "4". Further, the processing has not been started for the lot "5".
  • the processing "C-5" is executed for the lot "1"
  • the processing "C-2" is executed for the lot "2”.
  • the server device 200 sets the start timing of the processing schedule for the new lot, as shown in FIG.
  • the server device 200 determines whether or not the total value of DIW becomes larger than the upper limit value when the processing of lot "5" is started for the substrate processing device A having a high priority at time t0. Here, even if the processing of lot "5" is started in the substrate processing apparatus A, the total value of DIW does not become larger than the upper limit value, so that the server apparatus 200 processes the lot "5" in the substrate processing apparatus A. Allow.
  • the server device 200 determines whether or not the total value of DIW becomes larger than the upper limit value when the processing of the lot "5" in the board processing device B is started.
  • the start timing for starting the processing schedule of the lot "5" for the substrate processing apparatus B is started. To delay.
  • the server device 200 determines that the total value of DIW is equal to or less than the upper limit value even when the processing of the lot "5" is started for the board processing device B at the time t2. Therefore, the server device 200 allows the board processing device B to process the lot "5".
  • the server device 200 includes an acquisition unit 210, a selection unit 213, a calculation unit 215, and a setting unit 216.
  • the acquisition unit 210 acquires the processing schedule of the substrate processing apparatus 100 for the substrate 8 from the plurality of substrate processing apparatus 100.
  • the selection unit 213 selects the substrate processing apparatus 100 (an example of the substrate processing apparatus scheduled to start) that is scheduled to start the processing schedule for the new substrate 8 based on the priority of the plurality of substrate processing apparatus 100.
  • the calculation unit 215 calculates the total value of the force used by the processing schedule at which the processing is started and the force used by the scheduled start processing schedule which is the processing schedule newly started by the substrate processing apparatus 100.
  • the setting unit 216 sets the start timing of the scheduled start processing schedule so that the total value is equal to or less than the given upper limit value when the total value is larger than the given upper limit value.
  • the processing schedule is a schedule of all processing performed on the substrate 8 by the substrate processing apparatus 100.
  • the server device 200 can prevent the server device 200 from running out of power. Further, the server device 200 can suppress the stoppage of the processing schedule due to insufficient power after the processing schedule for the substrate 8 is started. Therefore, the server device 200 can suppress the processing of the substrate 8 from being stopped in the middle of the processing schedule, and can end the processing schedule for the substrate 8 in a fixed time. Therefore, the server device 200 can suppress the occurrence of processing variation with respect to the substrate 8.
  • the server device 200 includes a priority setting unit 211.
  • the priority setting unit 211 sets the priority based on the states of the plurality of board processing devices 100.
  • the server device 200 can start the processing schedule of each board processing device 100 based on the state of each board processing device 100. That is, the server device 200 can change the order in which the processing schedule is started based on the state of each board processing device 100.
  • the priority setting unit 211 lowers the priority of the substrate processing apparatus 100 having the lot processing unit 6 (an example of the processing unit) during warning or maintenance.
  • the server device 200 can suppress the start of processing on the board in the board processing device 100 having the lot processing unit 6 during warning or maintenance.
  • the priority setting unit 211 raises the priority of the board processing device 100 having a large number of boards 8 before processing.
  • the server device 200 can accelerate the processing in the board processing device 100 having a large number of boards 8 before processing.
  • the server device 200 according to the modified example may give higher priority to the board processing device 100 having a long standby time of the board 8 before processing.
  • the server device 200 according to the modified example raises the priority of the substrate processing device 100, which has a lot waiting time longer than a preset predetermined waiting time.
  • the server device 200 according to the modified example gives the priority of the substrate processing device 100 having a lot having a long standby time among the plurality of substrate processing devices 100 to the substrate processing device 100 having a lot having a short standby time. May also be higher.
  • the server device 200 can accelerate the processing in the board processing device 100 having the board 8 having a long standby time.
  • the server device 200 may collectively acquire a processing schedule for a lot that has started processing from a plurality of board processing devices 100 and a processing schedule for a new lot before processing.
  • the substrate processing device 100 may be a single-wafer type substrate processing device 100 that processes substrates one by one. Further, the substrate processing apparatus 100 may include a single-wafer type substrate processing apparatus 100.
  • the substrate processing system 1 according to the above embodiment and the modified example may be applied in combination.

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Abstract

A control device (200) according to an embodiment comprises: an acquisition unit (210); a selection unit (213); a calculation unit (215); and a setting unit (216). The acquisition unit (210) acquires, from a plurality of substrate processing devices (100), processing schedules of the substrate processing devices (100) with respect to substrates. The selection unit (213) selects, on the basis of priority levels of the plurality of substrate processing devices (100), a scheduled-start substrate processing device (100) which is scheduled to start a processing schedule with respect to a new substrate. The calculation unit (215) calculates the total value of the effort expended in a processing schedule for which processing has started, and the effort to be expended in a scheduled-start processing schedule, which is the processing schedule that is to be newly started by the scheduled-start substrate processing device (100). The setting unit (216) sets the timing to start the scheduled-start processing schedule so that, if the total value is greater than a given upper limit value, said total value does not exceed the given upper limit value.

Description

制御装置、基板処理システム、および制御方法Control device, board processing system, and control method
　本開示は、制御装置、基板処理システム、および制御方法に関する。 The present disclosure relates to a control device, a substrate processing system, and a control method.
　特許文献１には、全基板処理装置における純水の時間あたりの合計消費量が最大供給量を超えている場合に、いずれかの基板処理装置の処理部に対し再スケジュールを指示することが開示されている。 Patent Document 1 discloses that when the total consumption of pure water per hour in all the substrate processing devices exceeds the maximum supply amount, the processing unit of any of the substrate processing devices is instructed to reschedule. Has been done.
特開２０１０－１２９６００号公報Japanese Unexamined Patent Publication No. 2010-129600
　本開示は、基板処理装置における用力不足を抑制する技術を提供する。 The present disclosure provides a technique for suppressing a power shortage in a substrate processing apparatus.
　本開示の一態様による制御装置は、取得部と、選択部と、算出部と、設定部とを備える。取得部は、基板に対する基板処理装置の処理スケジュールを複数の基板処理装置から取得する。選択部は、複数の基板処理装置の優先度に基づいて、新たな基板に対して処理スケジュールを開始する予定である開始予定基板処理装置を選択する。算出部は、処理が開始された処理スケジュールによって使用される用力、および開始予定基板処理装置において新たに開始される処理スケジュールである開始予定処理スケジュールによって使用される用力の合計値を算出する。設定部は、合計値が所与の上限値よりも大きい場合に、合計値が所与の上限値以下となるように、開始予定処理スケジュールの開始タイミングを設定する。 The control device according to one aspect of the present disclosure includes an acquisition unit, a selection unit, a calculation unit, and a setting unit. The acquisition unit acquires the processing schedule of the substrate processing apparatus for the substrate from the plurality of substrate processing apparatus. The selection unit selects a board processing device scheduled to start, which is scheduled to start a processing schedule for a new board, based on the priority of the plurality of board processing devices. The calculation unit calculates the total value of the force used by the processing schedule at which the processing is started and the force used by the scheduled start processing schedule which is the processing schedule newly started in the scheduled start substrate processing apparatus. The setting unit sets the start timing of the scheduled start processing schedule so that the total value is equal to or less than the given upper limit value when the total value is larger than the given upper limit value.
　本開示によれば、基板処理装置における用力不足を抑制することができる。 According to the present disclosure, it is possible to suppress a power shortage in the substrate processing apparatus.
図１は、実施形態に係る基板処理システムの概略構成を示す図である。FIG. 1 is a diagram showing a schematic configuration of a substrate processing system according to an embodiment. 図２は、実施形態に係る基板処理装置の概略平面図である。FIG. 2 is a schematic plan view of the substrate processing apparatus according to the embodiment. 図３は、実施形態に係るサーバ装置の概略ブロック図である。FIG. 3 is a schematic block diagram of the server device according to the embodiment. 図４は、実施形態に係る処理スケジュールの管理処理を説明するフローチャートである。FIG. 4 is a flowchart illustrating a processing schedule management process according to the embodiment. 図５は、実施形態に係る処理スケジュールの管理処理を説明するタイムテーブル、およびタイムチャート（その１）である。FIG. 5 is a time table and a time chart (No. 1) for explaining the management process of the processing schedule according to the embodiment. 図６は、実施形態に係る処理スケジュールの管理処理を説明するタイムテーブル、およびタイムチャート（その２）である。FIG. 6 is a time table and a time chart (No. 2) for explaining the management process of the processing schedule according to the embodiment.
　以下、添付図面を参照して、本願の開示する制御装置、基板処理システムおよび制御方法の実施形態を詳細に説明する。なお、以下に示す実施形態により開示される制御装置、基板処理システムおよび制御方法が限定されるものではない。また、図面は模式的なものであり、各要素の寸法の関係、各要素の比率などは、現実と異なる場合があることに留意する必要がある。さらに、図面の相互間においても、互いの寸法の関係や比率が異なる部分が含まれている場合がある。 Hereinafter, embodiments of the control device, the substrate processing system, and the control method disclosed in the present application will be described in detail with reference to the attached drawings. The control device, the substrate processing system, and the control method disclosed by the following embodiments are not limited. In addition, it should be noted that the drawings are schematic, and the dimensional relationship of each element, the ratio of each element, and the like may differ from the reality. Further, even between the drawings, there may be parts having different dimensional relationships and ratios from each other.
＜基板処理システムの概要＞
　図１は、実施形態に係る基板処理システム１の概略構成を示す図である。基板処理システム１は、複数の基板処理装置１００と、サーバ装置２００（制御装置の一例）とを備える。複数の基板処理装置１００と、サーバ装置２００とは、ネットワークを介して有線、または無線によって通信可能に接続される。 <Outline of board processing system>
FIG. 1 is a diagram showing a schematic configuration of a substrate processing system 1 according to an embodiment. The board processing system 1 includes a plurality of board processing devices 100 and a server device 200 (an example of a control device). The plurality of board processing devices 100 and the server device 200 are communicably connected via a network by wire or wirelessly.
　複数の基板処理装置１００は、基板８（図２参照）に対し同じ処理を行う基板処理装置１００が含まれてもよく、異なる処理を行う基板処理装置１００が含まれてもよい。すなわち、複数の基板処理装置１００は、同じ装置であってもよく、異なる装置であってもよい。 The plurality of substrate processing devices 100 may include a substrate processing device 100 that performs the same processing on the substrate 8 (see FIG. 2), or may include a substrate processing device 100 that performs different processing. That is, the plurality of substrate processing devices 100 may be the same device or different devices.
　複数の基板処理装置１００は、用力供給源３００から用力が供給される。用力は、例えば、ＤＩＷ（DeIonized　Water：脱イオン水）や、電力である。基板処理システム１においては、上限値（所与の上限値の一例）が設定されている。例えば、用力がＤＩＷである場合には、複数の基板処理装置１００において同時に使用可能なＤＩＷの上限値が設定されている。また、用力が電力である場合には、複数の基板処理装置１００において同時に使用可能な電力の上限値が設定されている。なお、以下においては、用力の一例として、ＤＩＷを用いて説明することがある。 The plurality of substrate processing devices 100 are supplied with power from the power supply source 300. The force is, for example, DIW (DeIonized Water) or electric power. In the substrate processing system 1, an upper limit value (an example of a given upper limit value) is set. For example, when the force is DIW, an upper limit value of DIW that can be used simultaneously in a plurality of substrate processing devices 100 is set. Further, when the power is electric power, an upper limit value of electric power that can be used simultaneously in the plurality of substrate processing devices 100 is set. In the following, DIW may be used as an example of the force.
＜基板処理装置の概要＞
　ここで、基板処理装置１００の一例について、図２を参照し説明する。図２は、実施形態に係る基板処理装置１００の概略平面図である。ここでは、水平方向に直交する方向を上下方向として説明する。 <Outline of board processing equipment>
Here, an example of the substrate processing apparatus 100 will be described with reference to FIG. FIG. 2 is a schematic plan view of the substrate processing apparatus 100 according to the embodiment. Here, the direction orthogonal to the horizontal direction will be described as the vertical direction.
　基板処理装置１００は、キャリア搬入出部２と、ロット形成部３と、ロット載置部４と、ロット搬送部５と、ロット処理部６と、制御部５０とを有する。 The substrate processing device 100 includes a carrier loading / unloading unit 2, a lot forming unit 3, a lot loading unit 4, a lot transport unit 5, a lot processing unit 6, and a control unit 50.
　キャリア搬入出部２は、複数枚（例えば、２５枚）の基板８を水平姿勢で上下に並べて収容したキャリア９の搬入、および搬出を行う。 The carrier loading / unloading section 2 carries in and out the carrier 9 in which a plurality of (for example, 25) substrates 8 are arranged vertically in a horizontal posture.
　キャリア搬入出部２には、複数個のキャリア９を載置するキャリアステージ１０と、キャリア９の搬送を行うキャリア搬送機構１１と、キャリア９を一時的に保管するキャリアストック１２，１３と、キャリア９を載置するキャリア載置台１４とが設けられている。 The carrier loading / unloading section 2 includes a carrier stage 10 on which a plurality of carriers 9 are placed, a carrier transport mechanism 11 for transporting the carriers 9, carrier stocks 12 and 13 for temporarily storing the carriers 9, and carriers. A carrier mounting table 14 on which the 9 is mounted is provided.
　キャリア搬入出部２は、外部からキャリアステージ１０に搬入されたキャリア９を、キャリア搬送機構１１を用いてキャリアストック１２や、キャリア載置台１４に搬送する。キャリアストック１２は、ロット処理部６で処理する前の複数枚の基板８を収容するキャリア９を、一時的に保管する。 The carrier loading / unloading section 2 transports the carrier 9 carried into the carrier stage 10 from the outside to the carrier stock 12 and the carrier mounting table 14 using the carrier transport mechanism 11. The carrier stock 12 temporarily stores the carrier 9 that houses the plurality of substrates 8 before being processed by the lot processing unit 6.
　キャリア載置台１４に搬送され、ロット処理部６で処理する前の複数枚の基板８を収容するキャリア９からは、後述する基板搬送機構１５によって複数枚の基板８が搬出される。 A plurality of boards 8 are carried out from the carrier 9 which is transported to the carrier mounting table 14 and accommodates the plurality of boards 8 before being processed by the lot processing unit 6 by the board transport mechanism 15 described later.
　また、キャリア載置台１４に載置され、基板８を収容していないキャリア９には、基板搬送機構１５から、ロット処理部６で処理した後の複数枚の基板８が搬入される。 Further, a plurality of substrates 8 after being processed by the lot processing unit 6 are carried in from the substrate transport mechanism 15 to the carrier 9 which is mounted on the carrier mounting table 14 and does not accommodate the substrate 8.
　キャリア搬入出部２は、キャリア載置台１４に載置され、ロット処理部６で処理した後の複数枚の基板８を収容するキャリア９を、キャリア搬送機構１１を用いてキャリアストック１３や、キャリアステージ１０に搬送する。 The carrier loading / unloading section 2 is mounted on the carrier mounting table 14, and the carrier 9 accommodating a plurality of substrates 8 after being processed by the lot processing section 6 is used as a carrier stock 13 or a carrier by using the carrier transport mechanism 11. Transport to stage 10.
　キャリアストック１３は、ロット処理部６で処理した後の複数枚の基板８を一時的に保管する。キャリアステージ１０に搬送されたキャリア９は、外部へ搬出される。 The carrier stock 13 temporarily stores a plurality of substrates 8 after being processed by the lot processing unit 6. The carrier 9 conveyed to the carrier stage 10 is carried out.
　ロット形成部３には、複数枚（例えば、２５枚）の基板８を搬送する基板搬送機構１５が設けられている。ロット形成部３は、基板搬送機構１５による複数枚（例えば、２５枚）の基板８の搬送を２回行い、複数枚（例えば、５０枚）の基板８からなるロットを形成する。 The lot forming unit 3 is provided with a substrate transfer mechanism 15 that conveys a plurality of (for example, 25) substrates 8. The lot forming unit 3 transfers a plurality of (for example, 25) substrates 8 twice by the substrate transport mechanism 15, and forms a lot composed of a plurality of (for example, 50) substrates 8.
　ロット形成部３は、基板搬送機構１５を用いて、キャリア載置台１４に載置されたキャリア９からロット載置部４へ複数枚の基板８を搬送し、複数枚の基板８をロット載置部４に載置することで、ロットを形成する。 The lot forming unit 3 uses the substrate transfer mechanism 15 to transfer a plurality of substrates 8 from the carrier 9 mounted on the carrier mounting table 14 to the lot mounting portion 4, and mounts the plurality of substrates 8 in lots. A lot is formed by placing it on the part 4.
　また、ロット形成部３は、ロット処理部６で処理が行われ、ロット載置部４に載置されたロットから、基板搬送機構１５を用いて複数枚の基板８をキャリア９へ搬送する。 Further, the lot forming unit 3 is processed by the lot processing unit 6, and a plurality of substrates 8 are transferred from the lot placed on the lot mounting unit 4 to the carrier 9 by using the substrate transfer mechanism 15.
　ロット載置部４は、ロット搬送部５によってロット形成部３とロット処理部６との間で搬送されるロットをロット載置台１６で一時的に載置（待機）する。ロット載置部４には、搬入側ロット載置台１７と、搬出側ロット載置台１８とが設けられている。 The lot loading unit 4 temporarily places (stands by) the lot transferred between the lot forming unit 3 and the lot processing unit 6 by the lot transport unit 5 on the lot loading table 16. The lot loading unit 4 is provided with a loading side lot loading table 17 and a loading side lot loading table 18.
　搬入側ロット載置台１７には、処理前のロットが載置される。搬出側ロット載置台１８には、処理後のロットが載置される。搬入側ロット載置台１７、および搬出側ロット載置台１８には、１ロット分の複数枚の基板８が垂直姿勢で前後に並べて載置される。 The lot before processing is placed on the lot loading table 17 on the carry-in side. The processed lot is placed on the carry-out side lot loading table 18. A plurality of substrates 8 for one lot are placed side by side in a vertical position on the carry-in side lot mounting table 17 and the carry-out side lot mounting table 18.
　ロット搬送部５は、ロット載置部４とロット処理部６との間や、ロット処理部６の内部間でロットの搬送を行う。ロット搬送部５には、ロットの搬送を行うロット搬送機構１９が設けられている。ロット搬送機構１９は、ロット載置部４とロット処理部６とに沿わせて配置したレール２０と、ロットを保持しながらレール２０に沿って移動する移動体２１とを有する。 The lot transfer unit 5 transfers lots between the lot loading unit 4 and the lot processing unit 6 and between the inside of the lot processing unit 6. The lot transport unit 5 is provided with a lot transport mechanism 19 for transporting lots. The lot transfer mechanism 19 has a rail 20 arranged along the lot loading unit 4 and the lot processing unit 6, and a moving body 21 that moves along the rail 20 while holding the lot.
　移動体２１には、垂直姿勢で前後に並んだ複数枚の基板８で形成されるロットを保持する基板保持体２２が設けられている。 The moving body 21 is provided with a board holding body 22 for holding a lot formed by a plurality of boards 8 arranged in a vertical posture in the front-rear direction.
　ロット搬送部５は、搬入側ロット載置台１７に載置されたロットをロット搬送機構１９の基板保持体２２で受取り、受取ったロットをロット処理部６に受け渡す。 The lot transfer unit 5 receives the lot placed on the carry-in side lot loading table 17 by the substrate holder 22 of the lot transfer mechanism 19, and delivers the received lot to the lot processing unit 6.
　また、ロット搬送部５は、ロット処理部６で処理されたロットをロット搬送機構１９の基板保持体２２で受取り、受取ったロットを搬出側ロット載置台１８に受け渡す。 Further, the lot transfer unit 5 receives the lot processed by the lot processing unit 6 by the substrate holder 22 of the lot transfer mechanism 19, and delivers the received lot to the unloading side lot loading table 18.
　さらに、ロット搬送部５は、ロット搬送機構１９を用いてロット処理部６の内部においてロットの搬送を行う。 Further, the lot transfer unit 5 transfers the lot inside the lot processing unit 6 by using the lot transfer mechanism 19.
　ロット処理部６は、複数枚の基板８で形成されたロットにエッチングや、洗浄や、乾燥などの処理を行う。 The lot processing unit 6 performs processing such as etching, cleaning, and drying on a lot formed of a plurality of substrates 8.
　ロット処理部６には、エッチング処理装置２３と、洗浄処理装置２４と、基板保持体洗浄装置２５と、乾燥処理装置２６とが並べて設けられている。エッチング処理装置２３は、ロットにエッチング処理を行う。洗浄処理装置２４は、ロットの洗浄処理を行う。基板保持体洗浄装置２５、基板保持体２２の洗浄処理を行う。乾燥処理装置２６は、ロットの乾燥処理を行う。なお、各装置２３～２６の台数は、図２に示す台数に限られない。例えば、エッチング処理装置２３の台数は、２台に限られることはなく、１台でもよく、３台以上であってもよい。 The lot processing unit 6 is provided with an etching processing device 23, a cleaning processing device 24, a substrate holder cleaning device 25, and a drying processing device 26 side by side. The etching processing apparatus 23 performs an etching processing on the lot. The cleaning processing device 24 performs a lot cleaning processing. The substrate holder cleaning device 25 and the substrate holder 22 are cleaned. The drying processing apparatus 26 performs a lot drying processing. The number of each device 23 to 26 is not limited to the number shown in FIG. For example, the number of etching processing devices 23 is not limited to two, and may be one or three or more.
　エッチング処理装置２３は、エッチング用の処理槽２７と、リンス用の処理槽２８と、基板昇降機構２９，３０とを有する。 The etching processing device 23 includes a processing tank 27 for etching, a processing tank 28 for rinsing, and substrate elevating mechanisms 29 and 30.
　エッチング用の処理槽２７には、エッチング用の処理液（以下、「エッチング液」という。）が貯留される。リンス用の処理槽２８には、リンス用の処理液であるＤＩＷが貯留される。 The etching treatment tank 27 stores an etching treatment liquid (hereinafter referred to as "etching liquid"). DIW, which is a treatment liquid for rinsing, is stored in the rinsing treatment tank 28.
　基板昇降機構２９,３０には、ロットを形成する複数枚の基板８が垂直姿勢で前後に並べて保持される。 A plurality of substrates 8 forming a lot are held side by side in a vertical posture in the substrate elevating mechanisms 29 and 30.
　エッチング処理装置２３は、ロット搬送機構１９の基板保持体２２からロットを基板昇降機構２９で受取り、受取ったロットを基板昇降機構２９で降下させることでロットを処理槽２７のエッチング液に浸漬させてエッチング処理を行う。 The etching processing device 23 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate elevating mechanism 29, and lowers the received lot by the substrate elevating mechanism 29 to immerse the lot in the etching solution of the processing tank 27. Etching process is performed.
　その後、エッチング処理装置２３は、基板昇降機構２９を上昇させることでロットを処理槽２７から取り出し、基板昇降機構２９からロット搬送機構１９の基板保持体２２にロットを受け渡す。 After that, the etching processing device 23 takes out the lot from the processing tank 27 by raising the substrate elevating mechanism 29, and delivers the lot from the substrate elevating mechanism 29 to the substrate holder 22 of the lot transfer mechanism 19.
　そして、ロット搬送機構１９の基板保持体２２からロットを基板昇降機構３０で受取り、受取ったロットを基板昇降機構３０で降下させることでロットを処理槽２８のリンス用の処理液に浸漬させてリンス処理を行う。 Then, the lot is received from the substrate holder 22 of the lot transfer mechanism 19 by the substrate elevating mechanism 30, and the received lot is lowered by the substrate elevating mechanism 30 to immerse the lot in the rinsing treatment liquid of the processing tank 28 for rinsing. Perform processing.
　その後、エッチング処理装置２３は、基板昇降機構３０を上昇させることでロットを処理槽２８から取り出し、基板昇降機構３０からロット搬送機構１９の基板保持体２２にロットを受け渡す。 After that, the etching processing device 23 takes out the lot from the processing tank 28 by raising the substrate elevating mechanism 30, and delivers the lot from the substrate elevating mechanism 30 to the substrate holder 22 of the lot transfer mechanism 19.
　洗浄処理装置２４は、洗浄用の処理槽３１と、リンス用の処理槽３２と、基板昇降機構３３,３４とを有する。 The cleaning processing device 24 includes a processing tank 31 for cleaning, a processing tank 32 for rinsing, and substrate elevating mechanisms 33 and 34.
　洗浄用の処理槽３１には、洗浄用の処理液（ＳＣ－１等）が貯留される。リンス用の処理槽３２には、リンス用の処理液であるＤＩＷが貯留される。基板昇降機構３３,３４には、１ロット分の複数枚の基板８が垂直姿勢で前後に並べて保持される。 The cleaning treatment liquid (SC-1, etc.) is stored in the cleaning treatment tank 31. DIW, which is a treatment liquid for rinsing, is stored in the rinsing treatment tank 32. A plurality of substrates 8 for one lot are held side by side in a vertical posture in the substrate elevating mechanisms 33 and 34.
　乾燥処理装置２６は、処理槽３５と、処理槽３５に対して昇降する基板昇降機構３６とを有する。 The drying processing device 26 has a processing tank 35 and a substrate elevating mechanism 36 that moves up and down with respect to the processing tank 35.
　処理槽３５には、乾燥用の処理ガス（ＩＰＡ（イソプロピルアルコール）等）が供給される。基板昇降機構３６には、１ロット分の複数枚の基板８が垂直姿勢で前後に並べて保持される。 A processing gas for drying (IPA (isopropyl alcohol), etc.) is supplied to the processing tank 35. A plurality of substrates 8 for one lot are held side by side in a vertical posture in the substrate elevating mechanism 36.
　乾燥処理装置２６は、ロット搬送機構１９の基板保持体２２からロットを基板昇降機構３６で受取り、受取ったロットを基板昇降機構３６で降下させて処理槽３５に搬入し、処理槽３５に供給した乾燥用の処理ガスでロットの乾燥処理を行う。そして、乾燥処理装置２６は、基板昇降機構３６でロットを上昇させ、基板昇降機構３６からロット搬送機構１９の基板保持体２２に、乾燥処理を行ったロットを受け渡す。 The drying processing device 26 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate elevating mechanism 36, lowers the received lot by the substrate elevating mechanism 36, carries it into the processing tank 35, and supplies it to the processing tank 35. The lot is dried with a processing gas for drying. Then, the drying processing device 26 raises the lot by the substrate elevating mechanism 36, and delivers the dried lot from the substrate elevating mechanism 36 to the substrate holding body 22 of the lot transfer mechanism 19.
　基板保持体洗浄装置２５は、処理槽３７を有する。基板保持体洗浄装置２５は、処理槽３７に洗浄用の処理液であるＤＩＷ、および乾燥ガスを供給できるようになっており、ロット搬送機構１９の基板保持体２２に洗浄用の処理液を供給した後、乾燥ガスを供給することで基板保持体２２の洗浄処理を行う。 The substrate holder cleaning device 25 has a processing tank 37. The substrate holder cleaning device 25 can supply DIW, which is a cleaning treatment liquid, and a drying gas to the processing tank 37, and supplies the cleaning treatment liquid to the substrate holder 22 of the lot transfer mechanism 19. After that, the substrate holder 22 is cleaned by supplying a dry gas.
　制御部５０は、基板処理装置１００の各部（キャリア搬入出部２、ロット形成部３、ロット載置部４、ロット搬送部５、ロット処理部６）の動作を制御する。制御部５０は、スイッチなどからの信号に基づいて、基板処理装置１００の各部の動作を制御する。 The control unit 50 controls the operation of each unit (carrier loading / unloading unit 2, lot forming unit 3, lot loading unit 4, lot transport unit 5, lot processing unit 6) of the substrate processing device 100. The control unit 50 controls the operation of each unit of the substrate processing device 100 based on a signal from a switch or the like.
　制御部５０は、例えばコンピュータからなり、コンピュータで読み取り可能な記憶媒体３８を有する。記憶媒体３８には、基板処理装置１００において実行される各種の処理を制御するプログラムが格納される。例えば、記憶媒体３８には、基板処理装置１００における処理スケジュールが格納される。 The control unit 50 is composed of, for example, a computer, and has a storage medium 38 that can be read by the computer. The storage medium 38 stores programs that control various processes executed by the substrate processing apparatus 100. For example, the storage medium 38 stores the processing schedule in the substrate processing apparatus 100.
　処理スケジュールは、基板処理装置１００が基板８に対して行う全処理のスケジュールである。すなわち、処理スケジュールは、ロットに対し、基板処理装置１００で行われる処理全体の処理スケジュールである。具体的には、処理スケジュールは、ロット処理部６における処理スケジュールである。例えば、処理スケジュールは、処理前のロットが搬入側ロット載置台１７から搬出されてから、処理後のロットが搬出側ロット載置台１８に搬入されるまでのスケジュールである。 The processing schedule is a schedule of all processing performed on the substrate 8 by the substrate processing apparatus 100. That is, the processing schedule is the processing schedule of the entire processing performed by the substrate processing apparatus 100 for the lot. Specifically, the processing schedule is the processing schedule in the lot processing unit 6. For example, the processing schedule is a schedule from when the lot before processing is carried out from the loading side lot loading table 17 to when the processed lot is carried into the loading side lot loading table 18.
　処理スケジュールには、処理において使用される用力に関する情報が含まれる。処理スケジュールには、ロットに対しロット処理部６によって各処理を行う場合に使用されるＤＩＷの量に関する情報が含まれる。 The processing schedule contains information about the forces used in the processing. The processing schedule includes information on the amount of DIW used when each processing is performed on the lot by the lot processing unit 6.
　制御部５０は、記憶媒体３８に記憶されたプログラムを読み出して実行することによって基板処理装置１００の動作を制御する。なお、プログラムは、コンピュータによって読み取り可能な記憶媒体３８に記憶されていたものであって、他の記憶媒体から制御部５０の記憶媒体３８にインストールされたものであってもよい。 The control unit 50 controls the operation of the substrate processing device 100 by reading and executing the program stored in the storage medium 38. The program may be stored in a storage medium 38 that can be read by a computer, and may be installed in the storage medium 38 of the control unit 50 from another storage medium.
　コンピュータによって読み取り可能な記憶媒体３８としては、例えばハードディスク（ＨＤ）、フレキシブルディスク（ＦＤ）、コンパクトディスク（ＣＤ）、マグネットオプティカルディスク（ＭＯ）、メモリカードなどがある。 Examples of the storage medium 38 that can be read by a computer include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnet optical disk (MO), and a memory card.
　また、制御部５０は、サーバ装置２００から送信される処理スケジュールの開始信号に基づいてロットに対する処理を開始する。 Further, the control unit 50 starts processing for the lot based on the processing schedule start signal transmitted from the server device 200.
＜サーバ装置＞
　次に、サーバ装置２００について図３を参照し説明する。図３は、実施形態に係るサーバ装置２００の概略ブロック図である。 <Server device>
Next, the server device 200 will be described with reference to FIG. FIG. 3 is a schematic block diagram of the server device 200 according to the embodiment.
　サーバ装置２００は、通信部２０１と、制御部２０２と、記憶部２０３とを備える。通信部２０１は、各基板処理装置１００とネットワークを介して通信を行う通信インターフェースである。通信部２０１は、各基板処理装置１００から処理スケジュールを受信する。また、通信部２０１は、制御部２０２によって許可された各基板処理装置１００における処理スケジュールの開始信号を各基板処理装置１００に送信する。 The server device 200 includes a communication unit 201, a control unit 202, and a storage unit 203. The communication unit 201 is a communication interface that communicates with each board processing device 100 via a network. The communication unit 201 receives the processing schedule from each board processing device 100. Further, the communication unit 201 transmits the start signal of the processing schedule in each board processing device 100 permitted by the control unit 202 to each board processing device 100.
　記憶部２０３は、ＲＡＭ（Random　Access　Memory）、フラッシュメモリ（Flash　Memory）等の半導体メモリ素子、または、ハードディスク、光ディスク等の記憶装置によって実現される。記憶部２０３には、サーバ装置２００において実行される各種の処理を制御するプログラムが格納される。また、記憶部２０３には、各基板処理装置１００の処理スケジュールに基づいて生成されたタイムテーブルが記憶される。制御部２０２は、記憶部２０３に記憶されたプログラムを読み出して実行することによってサーバ装置２００の動作を制御する。 The storage unit 203 is realized by a semiconductor memory element such as a RAM (Random Access Memory) or a flash memory (Flash Memory), or a storage device such as a hard disk or an optical disk. The storage unit 203 stores programs that control various processes executed by the server device 200. Further, the storage unit 203 stores the timetable generated based on the processing schedule of each substrate processing apparatus 100. The control unit 202 controls the operation of the server device 200 by reading and executing the program stored in the storage unit 203.
　なお、かかるプログラムは、コンピュータによって読み取り可能な記憶媒体に記録されていたものであって、その記憶媒体からサーバ装置２００の記憶部２０３にインストールされたものであってもよい。コンピュータによって読み取り可能な記憶媒体としては、例えば、ハードディスク、コンパクトディスク、メモリカードなどがある。 The program may be recorded on a storage medium readable by a computer, and may be installed from the storage medium in the storage unit 203 of the server device 200. Computer-readable storage media include, for example, hard disks, compact discs, memory cards, and the like.
　制御部２０２は、取得部２１０と、優先度設定部２１１と、タイムテーブル生成部２１２と、選択部２１３と、判定部２１４と、算出部２１５と、設定部２１６と、指示部２１７とを備える。 The control unit 202 includes an acquisition unit 210, a priority setting unit 211, a timetable generation unit 212, a selection unit 213, a determination unit 214, a calculation unit 215, a setting unit 216, and an instruction unit 217. ..
　制御部２０２は、コントローラ（controller）であり、ＣＰＵ（Central　Processing　Unit）やＭＰＵ（Micro　Processing　Unit）等によって、記憶部２０３内部の記憶デバイスに記憶されている各種プログラムがＲＡＭを作業領域として実行される。これにより、制御部２０２は、取得部２１０、優先度設定部２１１、タイムテーブル生成部２１２、選択部２１３、判定部２１４、算出部２１５、設定部２１６、および指示部２１７として機能する。 The control unit 202 is a controller, and various programs stored in the storage device inside the storage unit 203 are executed using the RAM as a work area by a CPU (Central Processing Unit), an MPU (Micro Processing Unit), or the like. To. As a result, the control unit 202 functions as an acquisition unit 210, a priority setting unit 211, a timetable generation unit 212, a selection unit 213, a determination unit 214, a calculation unit 215, a setting unit 216, and an instruction unit 217.
　また、制御部２０２は、ＡＳＩＣ（Application　Specific　Integrated　Circuit）やＦＰＧＡ（Field　Programmable　Gate　Array）等の集積回路により実現することができる。なお、取得部２１０、優先度設定部２１１、タイムテーブル生成部２１２、選択部２１３、判定部２１４、算出部２１５、設定部２１６、および指示部２１７は、統合されてもよく、また複数に分けられてもよい。 Further, the control unit 202 can be realized by an integrated circuit such as an ASIC (Application Specific Integrated Circuit) or an FPGA (Field Programmable Gate Array). The acquisition unit 210, the priority setting unit 211, the timetable generation unit 212, the selection unit 213, the determination unit 214, the calculation unit 215, the setting unit 216, and the instruction unit 217 may be integrated or divided into a plurality of units. May be done.
　取得部２１０は、基板８に対する基板処理装置１００の処理スケジュールを複数の基板処理装置１００から取得する。処理スケジュールには、処理が開始されたロットに関する処理スケジュール、および処理予定のロットに関する処理スケジュールが含まれる。処理予定のロットは、基板処理装置１００のロット処理部６において次に処理が開始されるロットである。 The acquisition unit 210 acquires the processing schedule of the substrate processing apparatus 100 for the substrate 8 from the plurality of substrate processing apparatus 100. The processing schedule includes a processing schedule for the lot for which processing has started and a processing schedule for the lot to be processed. The lot to be processed is the lot to be processed next in the lot processing unit 6 of the substrate processing apparatus 100.
　また、取得部２１０は、キャリア搬入出部２に搬入され、処理が開始される前の基板８に関する情報を各基板処理装置１００から取得する。処理が開始される前の基板８に関する情報は、例えば、キャリア搬入出部２に搬入された処理前の基板８の枚数に関する情報である。 Further, the acquisition unit 210 acquires information about the substrate 8 before the carrier loading / unloading unit 2 is carried in and the processing is started from each substrate processing device 100. The information about the substrate 8 before the processing is started is, for example, information about the number of the substrates 8 before the processing carried into the carrier loading / unloading section 2.
　優先度設定部２１１は、各基板処理装置１００における優先度を設定する。優先度設定部２１１は、各基板処理装置１００に対して定められた優先度を設定する。例えば、優先度設定部２１１は、或る基板処理装置１００に対して優先度「１」を設定する。また、優先度設定部２１１は、別の基板処理装置１００に対して優先度「２」を設定する。優先度は、数値が小さいほど優先度が高いことを意味する。なお、数値が大きいほど優先度を高くしてもよい。 The priority setting unit 211 sets the priority in each board processing device 100. The priority setting unit 211 sets a predetermined priority for each substrate processing device 100. For example, the priority setting unit 211 sets the priority "1" for a certain substrate processing device 100. Further, the priority setting unit 211 sets the priority "2" for another substrate processing device 100. The lower the number, the higher the priority. The larger the value, the higher the priority.
　また、優先度設定部２１１は、複数の基板処理装置１００の状態に基づいて優先度を設定する。具体的には、優先度設定部２１１は、警告中、またはメンテナンス中の処理槽（処理部の一例）を有する基板処理装置１００の優先度を低くする。例えば、優先度設定部２１１は、優先度が「１」である基板処理装置１００の或る処理槽が警告中、またはメンテナンス中である場合には、基板処理装置１００の優先度を低くし、優先度「２」とする。 Further, the priority setting unit 211 sets the priority based on the states of the plurality of board processing devices 100. Specifically, the priority setting unit 211 lowers the priority of the substrate processing apparatus 100 having the processing tank (an example of the processing unit) during warning or maintenance. For example, the priority setting unit 211 lowers the priority of the substrate processing apparatus 100 when a certain processing tank of the substrate processing apparatus 100 having the priority of "1" is under warning or maintenance. The priority is set to "2".
　また、優先度設定部２１１は、処理前の基板８の数が多い基板処理装置１００の優先度を高くする。例えば、優先度設定部２１１は、優先度が「３」である基板処理装置１００において、処理前の基板８の数が予め設定された所定数よりも多い場合に、基板処理装置１００の優先度を高くし、優先度を「２」とする。また、例えば、優先度設定部２１１は、複数の基板処理装置１００のうち、処理前の基板８の数が多い基板処理装置１００の優先度を、処理前の基板８の数が少ない基板処理装置１００の優先度よりも高くしてもよい。 Further, the priority setting unit 211 raises the priority of the substrate processing apparatus 100 having a large number of substrates 8 before processing. For example, in the substrate processing apparatus 100 having a priority of "3", the priority setting unit 211 has a priority of the substrate processing apparatus 100 when the number of substrates 8 before processing is larger than a preset predetermined number. Is set to high, and the priority is set to "2". Further, for example, the priority setting unit 211 sets the priority of the substrate processing device 100 having a large number of substrates 8 before processing among the plurality of substrate processing devices 100, and the substrate processing device having a small number of substrates 8 before processing. It may be higher than the priority of 100.
　なお、優先度は、基板処理装置１００の数に応じて設定される。例えば、基板処理装置１００の数が「１０」である場合には、優先度は、「１」～「１０」まで設定される。また、優先度は、階層として設定されてもよい。優先度は、「１－１」、「１－２」、「２－１」、「２－２」、「２－３」および「３－１」などと設定されてもよい。この場合、例えば、優先度「１－２」は、「１－１」よりも低く、かつ「２－１」よりも高い。 The priority is set according to the number of substrate processing devices 100. For example, when the number of the substrate processing devices 100 is "10", the priority is set from "1" to "10". Moreover, the priority may be set as a hierarchy. The priority may be set as "1-1", "1-2", "2-1", "2-2", "2-3", "3-1" and the like. In this case, for example, the priority "1-2" is lower than "1-1" and higher than "2-1".
　タイムテーブル生成部２１２は、各基板処理装置１００から取得された処理スケジュールに基づいてタイムテーブルを生成する。タイムテーブル生成部２１２は、処理が開始されたロットの処理スケジュールに基づいて、各基板処理装置１００によって処理が開始されたロットにおける用力のタイムテーブルを生成する。 The timetable generation unit 212 generates a timetable based on the processing schedule acquired from each substrate processing apparatus 100. The timetable generation unit 212 generates a force timetable for the lot processing started by each substrate processing apparatus 100 based on the processing schedule of the lot processing started.
　また、タイムテーブル生成部２１２は、基板処理装置１００におけるロットの処理が許可された場合に、新たに処理が許可されて、処理が開始されるロットの処理スケジュールに基づいて、タイムテーブルを更新する。具体的には、タイムテーブル生成部２１２は、処理が開始されたロットにおける用力のタイムテーブルに、処理が開始されるロットにおける用力の処理スケジュールを加え、用力のタイムテーブルを更新する。 Further, when the lot processing in the substrate processing apparatus 100 is permitted, the timetable generation unit 212 updates the timetable based on the processing schedule of the lot in which the processing is newly permitted and the processing is started. .. Specifically, the timetable generation unit 212 updates the force timetable by adding the force processing schedule in the lot in which the processing is started to the force timetable in the lot in which the processing is started.
　選択部２１３は、複数の基板処理装置１００の優先度に基づいて、新たなロット（基板８の一例）に対して処理スケジュールを開始する予定である基板処理装置１００(開始予定基板処理装置の一例)を選択する。すなわち、選択部２１３は、優先度に基づいてロットの処理を許可するか否かを判定する基板処理装置１００を選択する。選択部２１３は、優先度が高い順に基板処理装置１００を選択する。 The selection unit 213 is an example of the substrate processing apparatus 100 (an example of the substrate processing apparatus scheduled to start) that is scheduled to start the processing schedule for a new lot (an example of the substrate 8) based on the priority of the plurality of substrate processing apparatus 100. ) Is selected. That is, the selection unit 213 selects the substrate processing device 100 that determines whether or not to allow lot processing based on the priority. The selection unit 213 selects the substrate processing apparatus 100 in descending order of priority.
　判定部２１４は、選択部２１３によって選択された基板処理装置１００において処理前のロットがあるか否かを判定する。また、判定部２１４は、後述する用力の合計値が上限値よりも大きいか否かを判定する。 The determination unit 214 determines whether or not there is a lot before processing in the substrate processing apparatus 100 selected by the selection unit 213. Further, the determination unit 214 determines whether or not the total value of the forces described later is larger than the upper limit value.
　算出部２１５は、処理が開始された処理スケジュールによって使用される用力、および新たなロット（基板の一例）に対して処理スケジュールを開始する予定である基板処理装置１００（開始予定基板処理装置の一例）において新たに開始される処理スケジュールである開始予定処理スケジュールによって使用される用力の合計値を算出する。具体的には、算出部２１５は、各基板処理装置１００において処理が開始された処理スケジュールを終了するまでに使用される用力の加算値に、開始予定処理スケジュールによって使用される用力を加算し、合計値を算出する。例えば、算出部２１５は、各基板処理装置１００において処理が開始された処理スケジュールを終了するまでに使用される各ＤＩＷの値を加算した加算値に、開始予定処理スケジュールによって使用されるＤＩＷの値を加算し、ＤＩＷの合計値を算出する。 The calculation unit 215 uses the force used by the processing schedule at which processing is started, and the substrate processing apparatus 100 (an example of the substrate processing apparatus scheduled to start) that is scheduled to start the processing schedule for a new lot (an example of a substrate). ), The total value of the forces used by the scheduled start processing schedule, which is the newly started processing schedule, is calculated. Specifically, the calculation unit 215 adds the force used by the scheduled start processing schedule to the added value of the force used until the end of the processing schedule at which the processing is started in each substrate processing device 100. Calculate the total value. For example, the calculation unit 215 adds the value of each DIW used until the end of the processing schedule in which the processing is started in each substrate processing apparatus 100, and the value of the DIW used by the scheduled start processing schedule. Is added to calculate the total value of DIW.
　設定部２１６は、各基板処理装置１００における開始予定処理スケジュールの開始タイミングを設定する。設定部２１６は、合計値が上限値以下である場合には、開始予定処理スケジュールの実行を許可する。すなわち、設定部２１６は、合計値が上限値以下である場合には、開始予定処理スケジュールによる処理を許可し、基板処理装置１００において新たなロットに対する処理を開始させる。 The setting unit 216 sets the start timing of the scheduled start processing schedule in each board processing device 100. The setting unit 216 permits execution of the scheduled start processing schedule when the total value is equal to or less than the upper limit value. That is, when the total value is equal to or less than the upper limit value, the setting unit 216 permits processing according to the scheduled start processing schedule, and causes the substrate processing apparatus 100 to start processing for a new lot.
　また、設定部２１６は、合計値が上限値（所与の上限値の一例）よりも大きい場合に、合計値が上限値以下となるように、開始予定処理スケジュールの開始タイミングを設定する。具体的には、設定部２１６は、合計値が上限値よりも大きい場合に、合計値が上限値以下となるように、開始予定処理スケジュールの開始タイミングを遅らせる。 Further, the setting unit 216 sets the start timing of the scheduled start processing schedule so that the total value becomes equal to or less than the upper limit value when the total value is larger than the upper limit value (an example of a given upper limit value). Specifically, the setting unit 216 delays the start timing of the scheduled start processing schedule so that the total value becomes equal to or less than the upper limit value when the total value is larger than the upper limit value.
　指示部２１７は、設定部２１６によって許可された開始予定処理スケジュールを実行する基板処理装置１００に対する処理スケジュールの開始信号を生成する。 The instruction unit 217 generates a processing schedule start signal for the board processing device 100 that executes the start schedule processing schedule permitted by the setting unit 216.
　次に、実施形態に係る処理スケジュールの管理処理について図４を参照し、説明する。図４は、実施形態に係る処理スケジュールの管理処理を説明するフローチャートである。 Next, the process schedule management process according to the embodiment will be described with reference to FIG. FIG. 4 is a flowchart illustrating a processing schedule management process according to the embodiment.
　サーバ装置２００は、処理を開始したロットに関する処理スケジュール、および処理前のロットの数を各基板処理装置１００から取得し（Ｓ１００）、処理が開始されたロットに対するタイムテーブルを生成する（Ｓ１０１）。 The server device 200 acquires the processing schedule for the lot for which processing has started and the number of lots before processing from each substrate processing device 100 (S100), and generates a timetable for the lot for which processing has started (S101).
　サーバ装置２００は、各基板処理装置１００の優先度を設定する（Ｓ１０２）。サーバ装置２００は、優先度に基づいて新たなロットに対する処理を許可するか否かを判定する基板処理装置１００を選択する（Ｓ１０３）。 The server device 200 sets the priority of each board processing device 100 (S102). The server device 200 selects the substrate processing device 100 that determines whether or not to allow processing for a new lot based on the priority (S103).
　サーバ装置２００は、選択した基板処理装置１００において、処理前のロットが有るか否かを判定する（Ｓ１０４）。サーバ装置２００は、処理前のロットが無い場合には（Ｓ１０４：Ｎｏ）、未選択の基板処理装置１００が有るか否か判定する（Ｓ１１１）。サーバ装置２００は、処理前のロットが有る場合には（Ｓ１０４：Ｙｅｓ）、処理予定のロットにおける処理スケジュールを取得する（Ｓ１０５）。すなわち、サーバ装置２００は、開始予定処理スケジュールを取得する。 The server device 200 determines whether or not there is a lot before processing in the selected substrate processing device 100 (S104). When there is no lot before processing (S104: No), the server device 200 determines whether or not there is an unselected board processing device 100 (S111). If there is a lot before processing (S104: Yes), the server device 200 acquires the processing schedule for the lot to be processed (S105). That is, the server device 200 acquires the scheduled start processing schedule.
　サーバ装置２００は、用力の合計値を算出し（Ｓ１０６）、合計値が上限値よりも大きいか否かを判定する（Ｓ１０７）。用力は、予め設定された用力、例えば、ＤＩＷである。なお、用力は、複数の用力、例えば、ＤＩＷ、および電力が含まれてもよい。用力に複数の用力が含まれる場合には、用力毎に判定が行われる。 The server device 200 calculates the total value of the force (S106) and determines whether or not the total value is larger than the upper limit value (S107). The force is a preset force, for example, DIW. The force may include a plurality of forces, for example, DIW and electric power. If the force includes a plurality of forces, a determination is made for each force.
　サーバ装置２００は、用力の合計値が上限値よりも大きい場合には（Ｓ１０７：Ｙｅｓ）、ロットの処理開始を抑制する（Ｓ１０８）。具体的には、サーバ装置２００は、用力の合計値が上限値よりも小さくなるように、開始予定処理スケジュールの開始タイミングを設定する。 The server device 200 suppresses the start of lot processing when the total value of the force is larger than the upper limit value (S107: Yes) (S108). Specifically, the server device 200 sets the start timing of the scheduled start processing schedule so that the total value of the force is smaller than the upper limit value.
　サーバ装置２００は、用力の合計値が上限値以下である場合には（Ｓ１０７：Ｎｏ）、処理予定のロットに対する処理を許可する（Ｓ１０９）。すなわち、サーバ装置２００は、開始予定処理スケジュールの開始を許可する。サーバ装置２００は、許可したロットに対する処理スケジュールをタイムテーブルに追加し、タイムテーブルを更新する（Ｓ１１０）。 When the total value of the force is equal to or less than the upper limit value (S107: No), the server device 200 permits processing for the lot to be processed (S109). That is, the server device 200 permits the start of the scheduled start processing schedule. The server device 200 adds the processing schedule for the permitted lot to the timetable and updates the timetable (S110).
　サーバ装置２００は、未選択の基板処理装置１００が有るか否か判定し（Ｓ１１１）、未選択の基板処理装置１００が有る場合には（Ｓ１１１：Ｙｅｓ）、新たに基板処理装置１００を選択する（Ｓ１０３）。サーバ装置２００は、未選択の基板処理装置１００が無い場合には（Ｓ１１１：Ｎｏ）、処理を終了する。 The server device 200 determines whether or not there is an unselected board processing device 100 (S111), and if there is an unselected board processing device 100 (S111: Yes), newly selects the board processing device 100. (S103). The server device 200 ends the process when there is no unselected board processing device 100 (S111: No).
　次に、実施形態に係る処理スケジュール管理処理について図５、および図６のタイムテーブル、およびタイムチャートを参照し説明する。図５は、実施形態に係る処理スケジュールの管理処理を説明するタイムテーブル、およびタイムチャート（その１）である。図６は、実施形態に係る処理スケジュールの管理処理を説明するタイムテーブル、およびタイムチャート（その２）である。 Next, the processing schedule management process according to the embodiment will be described with reference to the timetables and time charts of FIGS. 5 and 6. FIG. 5 is a time table and a time chart (No. 1) for explaining the management process of the processing schedule according to the embodiment. FIG. 6 is a time table and a time chart (No. 2) for explaining the management process of the processing schedule according to the embodiment.
　ここでは、基板処理システム１は、３つの基板処理装置１００（以下、基板処理装置Ａ～Ｃと称する場合がある。）を有するものとする。優先度は、基板処理装置Ｂが最も低く、基板処理装置Ａ、および基板処理装置Ｃの順に高い。 Here, it is assumed that the substrate processing system 1 has three substrate processing devices 100 (hereinafter, may be referred to as substrate processing devices A to C). The priority of the substrate processing device B is the lowest, and the priority is higher in the order of the substrate processing device A and the substrate processing device C.
　また、基板処理装置Ａは、ロットに対する処理として、６つの処理（処理Ａ－１～Ａ－６）を実行する。基板処理装置Ｂは、ロットに対する処理として、６つの処理（処理Ｂ－１～Ｂ－６）を実行する。また、基板処理装置Ｃは、ロットに対する処理として、５つの処理（処理Ｃ－１～Ｃ－５）を実行する。 Further, the substrate processing apparatus A executes six processes (processes A-1 to A-6) as processes for the lot. The substrate processing apparatus B executes six processes (processes B-1 to B-6) as processes for the lot. Further, the substrate processing apparatus C executes five processes (processes C-1 to C-5) as processes for the lot.
　また、基板処理装置Ａは、処理「Ａ－１」、および処理「Ａ－２」を行う処理装置を２つ有し、処理「Ａ－３」、および処理「Ａ－４」を行う処理装置を２つ有する。また、基板処理装置Ｂは、処理「Ｂ－１」、および処理「Ｂ－２」を行う処理装置を２つ有し、処理「Ｂ－３」、および処理「Ｂ－４」を行う処理装置を２つ有する。 Further, the substrate processing device A has two processing devices that perform the processing "A-1" and the processing "A-2", and performs the processing "A-3" and the processing "A-4". Has two. Further, the substrate processing device B has two processing devices that perform the processing "B-1" and the processing "B-2", and performs the processing "B-3" and the processing "B-4". Has two.
　また、図５、および図６では、各基板処理装置Ａ～Ｃにおけるロットの処理順を「１」～「５」、または「１」～「３」の順で付す。また、用力としてＤＩＷを一例とし、各処理で使用されるＤＩＷの量を、処理の下に示す。また、ＤＩＷの上限値は、７００Ｌ／ｍｉｎである。例えば、基板処理装置Ａにおいて、処理「Ａ－１」ではＤＩＷは使用されず、処理「Ａ－２」では８０Ｌ／ｍｉｎのＤＩＷが使用される。 Further, in FIGS. 5 and 6, the lot processing order in each of the substrate processing devices A to C is assigned in the order of "1" to "5" or "1" to "3". In addition, DIW is taken as an example as a force, and the amount of DIW used in each process is shown below the process. The upper limit of DIW is 700 L / min. For example, in the substrate processing apparatus A, DIW is not used in the processing "A-1", and 80L / min DIW is used in the processing "A-2".
　まず、図５を用いて各基板処理装置１００における処理スケジュールを説明する。 First, the processing schedule in each substrate processing apparatus 100 will be described with reference to FIG.
　時間ｔ０では、基板処理装置Ａでは、ロット「１」に対し、処理「Ａ－４」が実行されており、ロット「２」に対し、処理「Ａ－３」が実行されている。また、ロット「３」に対し、処理「Ａ－２」が実行されており、ロット「４」に対し、処理「Ａ－１」が実行されている。また、ロット「５」に対しては、処理予定となっている。 At time t0, in the substrate processing apparatus A, the process "A-4" is executed for the lot "1", and the process "A-3" is executed for the lot "2". Further, the process "A-2" is executed for the lot "3", and the process "A-1" is executed for the lot "4". In addition, lot "5" is scheduled to be processed.
　また、基板処理装置Ｂでは、ロット「１」に対し、処理「Ｂ－４」が実行されており、ロット「２」に対し、処理「Ｂ－３」が実行されている。また、ロット「３」に対し、処理「Ｂ－２」が実行されており、ロット「４」に対し、処理「Ｂ－１」が実行されている。また、ロット「５」に対しては、処理は開始されていない。 Further, in the substrate processing apparatus B, the processing "B-4" is executed for the lot "1", and the processing "B-3" is executed for the lot "2". Further, the process "B-2" is executed for the lot "3", and the process "B-1" is executed for the lot "4". Further, the processing has not been started for the lot "5".
　また、基板処理装置Ｃでは、ロット「１」に対し、処理「Ｃ－５」が実行されており、ロット「２」に対し、処理「Ｃ－２」が実行されている。 Further, in the substrate processing apparatus C, the processing "C-5" is executed for the lot "1", and the processing "C-2" is executed for the lot "2".
　このような状況において、基板処理装置Ａ、および基板処理装置Ｂが、各ロット「５」に対し、処理を開始すると、時間ｔ１において、基板処理システム１の全体におけるＤＩＷの合計値が、上限値よりも大きくなる。そのため、基板処理装置Ａ～Ｃの少なくとも一つに十分なＤＩＷを供給できなくなる。 In such a situation, when the substrate processing apparatus A and the substrate processing apparatus B start processing for each lot "5", the total value of DIW in the entire substrate processing system 1 becomes an upper limit value at time t1. Will be larger than. Therefore, sufficient DIW cannot be supplied to at least one of the substrate processing devices A to C.
　そのため、実施形態に係るサーバ装置２００は、図６に示すように、新たなロットに対する処理スケジュールの開始タイミングを設定する。 Therefore, the server device 200 according to the embodiment sets the start timing of the processing schedule for the new lot, as shown in FIG.
　サーバ装置２００は、時間ｔ０において、優先度が高い基板処理装置Ａについてロット「５」の処理を開始した場合に、ＤＩＷの合計値が上限値よりも大きくなるか否かを判定する。ここでは、基板処理装置Ａにおいてロット「５」の処理を開始しても、ＤＩＷの合計値は、上限値よりも大きくならないため、サーバ装置２００は、基板処理装置Ａにおけるロット「５」の処理を許可する。 The server device 200 determines whether or not the total value of DIW becomes larger than the upper limit value when the processing of lot "5" is started for the substrate processing device A having a high priority at time t0. Here, even if the processing of lot "5" is started in the substrate processing apparatus A, the total value of DIW does not become larger than the upper limit value, so that the server apparatus 200 processes the lot "5" in the substrate processing apparatus A. Allow.
　さらに、サーバ装置２００は、基板処理装置Ｂにおけるロット「５」の処理を開始した場合に、ＤＩＷの合計値が上限値よりも大きくなるか否かを判定する。ここでは、基板処理装置Ｂにおいてロット「５」の処理を開始すると、ＤＩＷの合計値が上限値よりも大きくなるため、基板処理装置Ｂに対し、ロット「５」の処理スケジュールを開始する開始タイミングを遅らせる。 Further, the server device 200 determines whether or not the total value of DIW becomes larger than the upper limit value when the processing of the lot "5" in the board processing device B is started. Here, when the processing of the lot "5" is started in the substrate processing apparatus B, the total value of the DIW becomes larger than the upper limit value. Therefore, the start timing for starting the processing schedule of the lot "5" for the substrate processing apparatus B is started. To delay.
　そして、サーバ装置２００は、時間ｔ２において基板処理装置Ｂについてロット「５」の処理を開始した場合であっても、ＤＩＷの合計値が上限値以下になると判定する。そのため、サーバ装置２００は、基板処理装置Ｂに対し、ロット「５」の処理を許可する。 Then, the server device 200 determines that the total value of DIW is equal to or less than the upper limit value even when the processing of the lot "5" is started for the board processing device B at the time t2. Therefore, the server device 200 allows the board processing device B to process the lot "5".
　サーバ装置２００は、取得部２１０と、選択部２１３と、算出部２１５と、設定部２１６とを備える。取得部２１０は、基板８に対する基板処理装置１００の処理スケジュールを複数の基板処理装置１００から取得する。選択部２１３は、複数の基板処理装置１００の優先度に基づいて、新たな基板８に対して処理スケジュールを開始する予定である基板処理装置１００（開始予定基板処理装置の一例）を選択する。算出部２１５は、処理が開始された処理スケジュールによって使用される用力、および基板処理装置１００において新たに開始される処理スケジュールである開始予定処理スケジュールによって使用される用力の合計値を算出する。設定部２１６は、合計値が所与の上限値よりも大きい場合に、合計値が所与の上限値以下となるように、開始予定処理スケジュールの開始タイミングを設定する。処理スケジュールは、基板処理装置１００が基板８に対して行う全処理のスケジュールである。 The server device 200 includes an acquisition unit 210, a selection unit 213, a calculation unit 215, and a setting unit 216. The acquisition unit 210 acquires the processing schedule of the substrate processing apparatus 100 for the substrate 8 from the plurality of substrate processing apparatus 100. The selection unit 213 selects the substrate processing apparatus 100 (an example of the substrate processing apparatus scheduled to start) that is scheduled to start the processing schedule for the new substrate 8 based on the priority of the plurality of substrate processing apparatus 100. The calculation unit 215 calculates the total value of the force used by the processing schedule at which the processing is started and the force used by the scheduled start processing schedule which is the processing schedule newly started by the substrate processing apparatus 100. The setting unit 216 sets the start timing of the scheduled start processing schedule so that the total value is equal to or less than the given upper limit value when the total value is larger than the given upper limit value. The processing schedule is a schedule of all processing performed on the substrate 8 by the substrate processing apparatus 100.
　これにより、サーバ装置２００は、用力が不足することを抑制ことができる。また、サーバ装置２００は、基板８に対する処理スケジュールが開始された後に、用力不足による処理スケジュールの停止を抑制することができる。そのため、サーバ装置２００は、処理スケジュールの途中で、基板８の処理が停止することを抑制し、基板８に対する処理スケジュールを一定の時間で終了させることができる。従って、サーバ装置２００は、基板８に対する処理ばらつきの発生を抑制することができる。 As a result, the server device 200 can prevent the server device 200 from running out of power. Further, the server device 200 can suppress the stoppage of the processing schedule due to insufficient power after the processing schedule for the substrate 8 is started. Therefore, the server device 200 can suppress the processing of the substrate 8 from being stopped in the middle of the processing schedule, and can end the processing schedule for the substrate 8 in a fixed time. Therefore, the server device 200 can suppress the occurrence of processing variation with respect to the substrate 8.
　サーバ装置２００は、優先度設定部２１１を備える。優先度設定部２１１は、複数の基板処理装置１００の状態に基づいて優先度を設定する。 The server device 200 includes a priority setting unit 211. The priority setting unit 211 sets the priority based on the states of the plurality of board processing devices 100.
　これにより、サーバ装置２００は、各基板処理装置１００の状態に基づいて、各基板処理装置１００の処理スケジュールを開始させることができる。すなわち、サーバ装置２００は、各基板処理装置１００の状態に基づいて、処理スケジュールを開始させる順番を変更することができる。 Thereby, the server device 200 can start the processing schedule of each board processing device 100 based on the state of each board processing device 100. That is, the server device 200 can change the order in which the processing schedule is started based on the state of each board processing device 100.
　優先度設定部２１１は、警告中、またはメンテナンス中のロット処理部６（処理部の一例）を有する基板処理装置１００の優先度を低くする。 The priority setting unit 211 lowers the priority of the substrate processing apparatus 100 having the lot processing unit 6 (an example of the processing unit) during warning or maintenance.
　これにより、サーバ装置２００は、警告中、またはメンテナンス中のロット処理部６を有する基板処理装置１００において基板に対する処理が開始されることを抑制することができる。 As a result, the server device 200 can suppress the start of processing on the board in the board processing device 100 having the lot processing unit 6 during warning or maintenance.
　優先度設定部２１１は、処理前の基板８の数が多い基板処理装置１００の優先度を高くする。 The priority setting unit 211 raises the priority of the board processing device 100 having a large number of boards 8 before processing.
　これにより、サーバ装置２００は、処理前の基板８の数が多い基板処理装置１００における処理を促進させることができる。 Thereby, the server device 200 can accelerate the processing in the board processing device 100 having a large number of boards 8 before processing.
＜変形例＞
　変形例に係るサーバ装置２００は、処理前の基板８の待機時間が長い基板処理装置１００の優先度を高くしてもよい。例えば、変形例に係るサーバ装置２００は、ロットの待機時間が予め設定された所定待機時間よりも長い基板処理装置１００の優先度を高くする。また、例えば、変形例に係るサーバ装置２００は、複数の基板処理装置１００のうち、待機時間が長いロットを有する基板処理装置１００の優先度を、待機時間が短いロットを有する基板処理装置１００よりも高くしてもよい。 <Modification example>
The server device 200 according to the modified example may give higher priority to the board processing device 100 having a long standby time of the board 8 before processing. For example, the server device 200 according to the modified example raises the priority of the substrate processing device 100, which has a lot waiting time longer than a preset predetermined waiting time. Further, for example, the server device 200 according to the modified example gives the priority of the substrate processing device 100 having a lot having a long standby time among the plurality of substrate processing devices 100 to the substrate processing device 100 having a lot having a short standby time. May also be higher.
　これにより、変形例に係るサーバ装置２００は、待機時間が長い基板８を有する基板処理装置１００における処理を促進させることができる。 Thereby, the server device 200 according to the modified example can accelerate the processing in the board processing device 100 having the board 8 having a long standby time.
　変形例に係るサーバ装置２００は、複数の基板処理装置１００から処理を開始したロットに対する処理スケジュール、および処理前の新たなロットに対する処理スケジュールをまとめて取得してもよい。 The server device 200 according to the modified example may collectively acquire a processing schedule for a lot that has started processing from a plurality of board processing devices 100 and a processing schedule for a new lot before processing.
　基板処理装置１００は、基板を一枚ずつ処理する枚葉式の基板処理装置１００であってもよい。また、基板処理装置１００は、枚葉式の基板処理装置１００が含まれてもよい。 The substrate processing device 100 may be a single-wafer type substrate processing device 100 that processes substrates one by one. Further, the substrate processing apparatus 100 may include a single-wafer type substrate processing apparatus 100.
　上記実施形態、および変形例に係る基板処理システム１は、組み合わせて適用されてもよい。 The substrate processing system 1 according to the above embodiment and the modified example may be applied in combination.
　なお、今回開示された実施形態は全ての点で例示であって制限的なものではないと考えられるべきである。実に、上記した実施形態は多様な形態で具現され得る。また、上記の実施形態は、添付の請求の範囲及びその趣旨を逸脱することなく、様々な形態で省略、置換、変更されてもよい。 It should be considered that the embodiment disclosed this time is an example in all respects and is not restrictive. Indeed, the above embodiments can be embodied in a variety of forms. Further, the above-described embodiment may be omitted, replaced or changed in various forms without departing from the scope of the appended claims and the purpose thereof.
１　　　基板処理システム
６　　　ロット処理部
８　　　基板
５０　　制御部
１００　基板処理装置
２００　サーバ装置（制御装置）
２０１　通信部
２０２　制御部
２０３　記憶部
２１０　取得部
２１１　優先度設定部
２１２　タイムテーブル生成部
２１３　選択部
２１４　判定部
２１５　算出部
２１６　設定部
３００　用力供給源 1 Board processing system 6 Lot processing unit 8 Board 50 Control unit 100 Board processing device 200 Server device (control device)
201 Communication unit 202 Control unit 203 Storage unit 210 Acquisition unit 211 Priority setting unit 212 Timetable generation unit 213 Selection unit 214 Judgment unit 215 Calculation unit 216 Setting unit 300 Power supply source

Claims (8)

  1. 　基板に対する基板処理装置の処理スケジュールを複数の基板処理装置から取得する取得部と、
    　前記複数の基板処理装置の優先度に基づいて、新たな基板に対して処理スケジュールを開始する予定である開始予定基板処理装置を選択する選択部と、
    　処理が開始された前記処理スケジュールによって使用される用力、および前記開始予定基板処理装置において新たに開始される前記処理スケジュールである開始予定処理スケジュールによって使用される用力の合計値を算出する算出部と、
    　前記合計値が所与の上限値よりも大きい場合に、前記合計値が前記所与の上限値以下となるように、前記開始予定処理スケジュールの開始タイミングを設定する設定部と
    　を備える制御装置。     An acquisition unit that acquires the processing schedule of the substrate processing apparatus for the substrate from a plurality of substrate processing apparatus, and
    A selection unit that selects a board processing device scheduled to start, which is scheduled to start a processing schedule for a new board, based on the priority of the plurality of board processing devices.
    A calculation unit that calculates the total value of the force used by the processing schedule at which processing is started and the force used by the scheduled start processing schedule that is the processing schedule newly started in the scheduled start substrate processing apparatus. ,
    A control device including a setting unit that sets a start timing of the scheduled start processing schedule so that the total value becomes equal to or less than the given upper limit value when the total value is larger than the given upper limit value.
  2. 　前記処理スケジュールは、前記基板処理装置が前記基板に対して行う全処理のスケジュールである
    　請求項１に記載の制御装置。     The control device according to claim 1, wherein the processing schedule is a schedule of all processing performed on the substrate by the substrate processing apparatus.
  3. 　前記複数の基板処理装置の状態に基づいて前記優先度を設定する優先度設定部
    　を備える請求項１または２に記載の制御装置。     The control device according to claim 1 or 2, further comprising a priority setting unit that sets the priority based on the states of the plurality of substrate processing devices.
  4. 　前記優先度設定部は、
    　警告中、またはメンテナンス中の処理部を有する基板処理装置の前記優先度を低くする
    　請求項３に記載の制御装置。     The priority setting unit is
    The control device according to claim 3, wherein the priority of the substrate processing device having the processing unit during warning or maintenance is lowered.
  5. 　前記優先度設定部は、
    　処理前の前記基板の数が多い前記基板処理装置の前記優先度を高くする
    　請求項３に記載の制御装置。     The priority setting unit is
    The control device according to claim 3, wherein the priority of the substrate processing apparatus having a large number of substrates before processing is increased.
  6. 　前記優先度設定部は、
    　処理前の前記基板の待機時間が長い前記基板処理装置の前記優先度を高くする
    　請求項３に記載の制御装置。     The priority setting unit is
    The control device according to claim 3, wherein the priority of the substrate processing apparatus having a long standby time before processing is increased.
  7. 　請求項１～６のいずれか一つに記載の制御装置と、
    　前記複数の基板処理装置と
    　を備える基板処理システム。     The control device according to any one of claims 1 to 6.
    A substrate processing system including the plurality of substrate processing devices.
  8. 　基板に対する基板処理装置の処理スケジュールを複数の基板処理装置から取得する取得工程と、
    　前記複数の基板処理装置の優先度に基づいて、新たな基板に対して処理スケジュールを開始する予定である開始予定基板処理装置を選択する選択工程と、
    　処理が開始された前記処理スケジュールによって使用される用力、および前記開始予定基板処理装置において新たに開始される前記処理スケジュールである開始予定処理スケジュールによって使用される用力の合計値を算出する算出工程と、
    　前記合計値が所与の上限値よりも大きい場合に、前記合計値が前記所与の上限値以下となるように、前記開始予定処理スケジュールの開始タイミングを設定する設定工程と
    　を含む制御方法。     The acquisition process of acquiring the processing schedule of the substrate processing apparatus for the substrate from a plurality of substrate processing apparatus, and
    A selection step of selecting a substrate processing apparatus to be started, which is scheduled to start a processing schedule for a new substrate, based on the priority of the plurality of substrate processing apparatus.
    A calculation step for calculating the total value of the force used by the processing schedule at which processing is started and the force used by the scheduled start processing schedule which is the processing schedule newly started in the scheduled start substrate processing apparatus. ,
    A control method including a setting step of setting a start timing of the scheduled start processing schedule so that the total value is equal to or less than the given upper limit value when the total value is larger than the given upper limit value.
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