JP6118689B2 - Substrate liquid processing apparatus, substrate liquid processing method, and computer readable storage medium storing substrate liquid processing program - Google Patents

Description

  The present invention relates to a substrate liquid processing apparatus, a substrate liquid processing method, and a computer-readable storage medium storing a substrate liquid processing program, in which a lot formed of a plurality of substrates is processed with a processing liquid stored in a processing tank. is there.

  Conventionally, when manufacturing semiconductor components, flat panel displays, etc., etching, cleaning, etc. using a processing liquid such as an etching liquid or a cleaning liquid for a substrate such as a semiconductor wafer or a liquid crystal substrate using a substrate liquid processing apparatus. Apply the process.

  In this substrate liquid processing apparatus, a lot formed of a plurality of substrates is immersed in a processing tank in which a processing liquid is stored, and the substrates for one lot are collectively subjected to liquid processing. As the processing solution, for example, when etching is performed, a phosphoric acid aqueous solution in which phosphoric acid is diluted with pure water to a predetermined concentration is used. Further, since the capability (etching rate) of the processing solution depends on the silicon concentration in the processing solution, it is necessary to keep the silicon concentration in the processing solution within a certain concentration range in order to process the substrate satisfactorily.

  When the substrate liquid processing apparatus repeatedly processes the substrate, the silicon concentration in the processing liquid increases, the capacity of the processing liquid changes, and the substrate cannot be processed satisfactorily. Therefore, in the substrate liquid processing apparatus, when the silicon concentration increases to a predetermined concentration or higher, all the processing liquid in the processing tank is replaced with a new processing liquid. At that time, adjustment is made so that the silicon concentration in the processing solution after replacement is equal to or higher than a predetermined concentration and falls within a predetermined concentration range. The silicon concentration is adjusted by using a dummy substrate in which a silicon nitride film is formed on the surface of a substrate made of silicon, forming a dummy lot with a plurality of dummy substrates, and immersing the dummy lot in a processing bath (for example, (See Patent Document 1).

JP 2010-74060 A

  In the above conventional substrate liquid processing apparatus, after the processing of the product lot formed with a plurality of substrates as products is completed, the processing liquid in the processing tank is replaced with a new processing liquid, and then a plurality of dummy substrates are used. A dummy lot was formed, and the dummy lot was transferred to a treatment tank and immersed in the treatment solution after replacement to adjust the silicon concentration. Then, after the processing of the dummy lot is finished, the processing of the product lot (formation of the product lot, conveyance of the product lot, etc.) is started again.

  For this reason, in the conventional substrate liquid processing apparatus, the time during which the product lot is not processed (the time required for changing the processing liquid or adjusting the silicon concentration using the dummy lot) becomes long, and the processing efficiency of the product lot is increased. It was falling.

  Therefore, in the present invention, in a substrate liquid processing apparatus for processing a lot formed of a plurality of substrates with a processing solution stored in a processing tank, a carrier loading / unloading unit that loads and unloads a carrier containing a plurality of substrates. A lot forming unit for forming a lot from a plurality of substrates received from the carrier loading / unloading unit, a lot mounting unit for mounting a lot formed by the lot forming unit, and a mounting unit on the lot mounting unit A lot transfer unit that transfers the lots to the processing tank, and a plurality of substrates that form a lot by immersing the lots transferred in the lot transfer unit in a processing solution stored in the processing tanks are collectively processed. A lot processing unit, and a control unit that controls the carrier carry-in / out unit, the lot forming unit, the lot transport unit, and the lot processing unit, and the control unit replaces the processing liquid in the processing tank with the product. Goodbye When processing the dummy lot formed with multiple dummy substrates, the silicon concentration of the processing solution is adjusted by the lot processing unit, and the replacement of the processing solution is started when the processing solution in the processing tank is replaced Determining a replacement start time to be determined, obtaining a replacement end scheduled time for ending the replacement of the processing liquid from the replacement start time, and forming a dummy lot and placing the dummy lot on the lot mounting portion; and The dummy lot formation start time for starting the formation of the dummy lot is obtained from the scheduled replacement end time, and at least when the replacement of the treatment liquid is completed, the dummy lot is placed on the lot placement unit.

Further, the control unit obtains a product lot transportable scheduled time during which the product lot can be transported to the processing tank by the lot transport unit after discharging the dummy lot from the processing tank from the replacement end scheduled time, The product lot formation start time for starting the formation of the product lot from the product lot formation time required to form and place on the lot placement unit and the product lot transportable scheduled time is obtained, and at least the dummy from the processing tank When the lot was discharged, the product lot was placed on the lot placement section.

  In addition, the control unit changes the posture of the substrate accommodated in the carrier in a horizontal posture to a vertical posture and places the substrate on the lot placement unit, conveys the substrate in the vertical posture in the lot transportation unit, and I decided to make it processed in the lot processing part.

  Further, in the present invention, in a substrate liquid processing method for processing a lot formed of a plurality of substrates with a processing liquid stored in a processing tank, a plurality of dummy sheets that do not become products after the processing liquid in the processing tank is replaced. The silicon concentration of the processing liquid is adjusted by processing the dummy lot formed with the substrate in the processing tank, and when replacing the processing liquid in the processing tank, the replacement start time for starting the replacement of the processing liquid is determined. The replacement end scheduled time for ending the replacement of the processing liquid is obtained from the replacement start time, and the dummy lot forming time required for forming the dummy lot and placing it on the lot mounting portion is determined from the replacement end scheduled time. The dummy lot formation start time for starting the formation of the dummy lot is obtained, and at least when the replacement of the processing liquid is completed, the dummy lot is placed on the lot placement unit.

Further, after the dummy lot is discharged from the processing tank from the scheduled completion time of the replacement, a product lot transportable scheduled time in which the product lot can be transported to the processing tank by the lot transport unit is obtained, and the product lot is formed and mounted on the lot. When a product lot formation start time for starting the formation of a product lot is determined from the product lot formation time required to be placed on the mounting section and the product lot transportable scheduled time, and at least when the dummy lot is discharged from the processing tank We decided to place the product lot on the lot placement section.

  Further, the substrate accommodated in the carrier in a horizontal posture is changed to a vertical posture and placed on the lot placement unit, and the substrate is transported and processed in the vertical posture.

  Further, in the present invention, in the computer-readable storage medium storing the substrate liquid processing program for processing the lot formed of a plurality of substrates with the processing liquid stored in the processing tank, the processing liquid in the processing tank is replaced. When processing the dummy lot formed with a plurality of dummy substrates that will not become products later in the processing tank, the silicon concentration of the processing liquid is adjusted, and when the processing liquid in the processing tank is replaced, the processing liquid A replacement start time for starting the replacement of the liquid, and determining a replacement end scheduled time for ending the replacement of the processing solution from the replacement start time, and forming a dummy lot and placing it on the lot mounting portion The dummy lot formation start time for starting the formation of the dummy lot is obtained from the lot formation time and the scheduled replacement end time, and at least when the replacement of the processing liquid is completed. It was to be placed on the Rotto lot placement portion.

  In the present invention, the time during which the product lot is not processed (the time required for changing the processing solution and adjusting the silicon concentration using the dummy lot) can be shortened, and the processing efficiency of the product lot can be improved. .

Plane explanatory drawing which shows a substrate liquid processing apparatus. Side surface explanatory drawing which shows the processing tank for an etching. The flowchart which shows a substrate liquid processing program (process of a product lot). The flowchart which shows a substrate liquid processing program (exchange of a processing liquid). The flowchart which shows a substrate liquid processing program (process of a dummy lot). The flowchart which shows a substrate liquid processing program (setting of lot formation start time). The timing chart which shows a substrate liquid processing program (conveyance start of a dummy lot). The timing chart which shows a board | substrate liquid processing program (The conveyance start of a product lot when not measuring a silicon concentration). The timing chart which shows a board | substrate liquid processing program (The conveyance start of a product lot in the case of measuring a silicon concentration).

  Hereinafter, specific configurations of a substrate liquid processing apparatus, a substrate liquid processing method, and a substrate liquid processing program according to the present invention will be described with reference to the drawings.

  As shown in FIG. 1, the substrate liquid processing apparatus 1 includes a carrier carry-in / out unit 2, a lot forming unit 3, a lot placement unit 4, a lot transport unit 5, a lot processing unit 6, and a control unit 7.

  The carrier loading / unloading unit 2 loads and unloads a carrier 9 in which a plurality of (for example, 25) substrates 8 are accommodated in a horizontal posture.

  The carrier loading / unloading unit 2 includes a carrier stage 10 on which a plurality of carriers 9 are placed, a carrier transport mechanism 11 that transports the carriers 9, carrier stocks 12 and 13 that temporarily store the carriers 9, A carrier mounting table 14 on which the carrier 9 is mounted is provided. Here, the carrier stock 12 temporarily stores the substrate 8 to be a product before or after processing. The carrier stock 13 temporarily stores a dummy substrate 8 that is not a product (a substrate 8 having a silicon nitride film formed on the surface of the silicon substrate in order to adjust the silicon concentration of the processing liquid).

  Then, the carrier carry-in / out unit 2 carries the carrier 9 carried into the carrier stage 10 from the outside to the carrier stocks 12 and 13 and the carrier mounting table 14 using the carrier carrying mechanism 11. The carrier loading / unloading unit 2 transports the carrier 9 placed on the carrier placing table 14 to the carrier stocks 12 and 13 and the carrier stage 10 using the carrier carrying mechanism 11. The carrier 9 conveyed to the carrier stage 10 is carried out to the outside.

  The lot forming unit 3 forms a lot composed of a plurality of (for example, 50) substrates 8 that are processed simultaneously by combining the substrates 8 accommodated in one or a plurality of carriers 9.

  The lot forming unit 3 is provided with a substrate transfer mechanism 15 for transferring a plurality of substrates 8. The substrate transport mechanism 15 can change the posture of the substrate 8 from the horizontal posture to the vertical posture and from the vertical posture to the horizontal posture during the transportation of the substrate 8.

  Then, the lot forming unit 3 transports the substrate 8 from the carrier 9 placed on the carrier placing table 14 to the lot placing unit 4 using the substrate carrying mechanism 15, and the lot placing unit 4 forms a lot. Further, the lot forming unit 3 transports the lot placed on the lot placing unit 4 to the carrier 9 placed on the carrier placing table 14 by the substrate carrying mechanism 15. The substrate transport mechanism 15 serves as a substrate support unit for supporting a plurality of substrates 8, a pre-process substrate support unit that supports the substrate 8 before processing (before being transported by the lot transport unit 5), and a process There are two types of post-process substrate support units that support the subsequent substrate 8 (after being transported by the lot transport unit 5). This prevents particles or the like adhering to the substrate 8 before processing from being transferred to the substrate 8 after processing.

  The lot placement unit 4 temporarily places (waits) a lot transported between the lot forming unit 3 and the lot processing unit 6 by the lot transport unit 5.

  The lot placement unit 4 includes a loading-side lot placement table 17 for placing a lot before processing (before being transported by the lot transport unit 5), and after processing (after transported by the lot transport unit 5). An unloading lot mounting table 18 on which the lot is mounted is provided. On the carry-in lot mounting table 17 and the carry-out lot mounting table 18, a plurality of substrates 8 for one lot are placed side by side in a vertical posture.

  In the lot placing unit 4, the lot formed by the lot forming unit 3 is placed on the carry-in side lot placing table 17, and the lot is carried into the lot processing unit 6 via the lot transport unit 5. Further, in the lot placement unit 4, the lot carried out from the lot processing unit 6 via the lot transport unit 5 is placed on the carry-out lot placement table 18, and the lot is transported to the lot forming unit 3.

  The lot transport unit 5 transports lots between the lot placing unit 4 and the lot processing unit 6 or between the lot processing units 6.

  The lot transport unit 5 is provided with a lot transport mechanism 19 for transporting a lot. The lot transport mechanism 19 includes a rail 20 disposed along the lot placement unit 4 and the lot processing unit 6, and a moving body 21 that moves along the rail 20 while holding a plurality of substrates 8. The moving body 21 is provided with a substrate holding body 22 that holds a plurality of substrates 8 aligned in the front-rear direction in a vertical posture so as to freely advance and retract.

  Then, the lot transport unit 5 receives the lot placed on the carry-in side lot placing table 17 by the substrate holder 22 of the lot transport mechanism 19 and delivers the lot to the lot processing unit 6. In addition, the lot transfer unit 5 receives the lot processed by the lot processing unit 6 by the substrate holder 22 of the lot transfer mechanism 19 and transfers the lot to the unload-side lot mounting table 18. Further, the lot transport unit 5 transports a lot inside the lot processing unit 6 using the lot transport mechanism 19.

  The lot processing unit 6 performs processing such as etching, cleaning, and drying by using a plurality of substrates 8 arranged in the front and back in a vertical posture as one lot.

  The lot processing unit 6 includes a drying processing device 23 for drying the substrate 8, a substrate holder cleaning processing device 24 for cleaning the substrate holder 22, and a cleaning processing device 25 for cleaning the substrate 8. And two etching processing apparatuses 26 for performing the etching process of the substrate 8 are provided side by side.

  The drying processing apparatus 23 is provided with a substrate elevating mechanism 28 in a processing tank 27 so as to be movable up and down. A processing gas for drying such as IPA (isopropyl alcohol) for drying the substrate 8 is supplied to the processing tank 27. The substrate lifting mechanism 28 holds a plurality of substrates 8 for one lot side by side in a vertical posture. The drying processing device 23 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate lifting mechanism 28 and moves the lot up and down by the substrate lifting mechanism 28 so that the lot is immersed in the drying processing liquid in the processing tank 27. Then, the substrate 8 is dried. Further, the drying processing device 23 delivers the lot from the substrate lifting mechanism 28 to the substrate holder 22 of the lot transport mechanism 19.

  The substrate holder cleaning processing device 24 can supply the processing liquid and the drying gas for cleaning to the processing tank 29. After supplying the processing liquid for cleaning to the substrate holder 22 of the lot transport mechanism 19, The substrate holder 22 is cleaned by supplying the dry gas.

  The cleaning processing apparatus 25 includes a cleaning processing tank 30 and a rinsing processing tank 31, and substrate lifting mechanisms 32 and 33 are provided in the processing tanks 30 and 31 so as to be movable up and down. A cleaning processing liquid such as SC-1 for cleaning the substrate 8 is stored in the processing tank 30 for cleaning. The rinsing treatment tank 31 stores a rinsing treatment liquid such as pure water for rinsing the substrate 8. The substrate lifting mechanisms 32 and 33 hold a plurality of substrates 8 for one lot side by side in a vertical posture. The cleaning processing device 25 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate lifting mechanism 32 and moves the lot up and down by the substrate lifting mechanism 32 so that the lot is immersed in the cleaning processing liquid of the processing tank 30. Then, the substrate 8 is cleaned. Thereafter, the cleaning processing device 25 delivers the lot from the substrate lifting mechanism 32 to the substrate holder 22 of the lot transport mechanism 19. Further, the cleaning processing device 25 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate lifting mechanism 33, and lifts the lot by the substrate lifting mechanism 33 so that the lot is rinsed in the processing bath 31. Then, the substrate 8 is rinsed. Thereafter, the cleaning processing device 25 delivers the lot from the substrate lifting mechanism 33 to the substrate holder 22 of the lot transport mechanism 19.

  The etching processing apparatus 26 includes a processing tank 34 for etching and a processing tank 35 for rinsing, and substrate lifting mechanisms 36 and 37 are provided in the processing tanks 34 and 35 so as to be movable up and down. The etching treatment tank 34 stores an etching treatment liquid such as a phosphoric acid aqueous solution for etching the substrate 8. The rinsing treatment tank 35 stores a rinsing treatment liquid such as pure water for rinsing the substrate 8. The substrate lifting mechanisms 36 and 37 hold a plurality of substrates 8 for one lot side by side in a vertical posture. The etching processing apparatus 26 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate lifting mechanism 36 and moves the lot up and down by the substrate lifting mechanism 36 so that the lot is immersed in the etching processing liquid in the processing tank 34. Then, the substrate 8 is etched. Thereafter, the etching processing apparatus 26 delivers the lot from the substrate lifting mechanism 36 to the substrate holder 22 of the lot transport mechanism 19. In addition, the etching processing apparatus 26 receives the lot from the substrate holder 22 of the lot transport mechanism 19 by the substrate lifting mechanism 37, and lifts the lot by the substrate lifting mechanism 37, thereby processing the lot into the processing bath 35. Then, the substrate 8 is rinsed. Thereafter, the etching processing apparatus 26 delivers the lot from the substrate lifting mechanism 37 to the substrate holder 22 of the lot transport mechanism 19.

  As shown in FIG. 2, the etching processing apparatus 26 includes a processing liquid supply mechanism 38 that supplies a processing liquid to an etching processing tank 34, a processing liquid discharge mechanism 39 that discharges the processing liquid from the processing tank 34, A silicon concentration sensor 40 that detects the concentration of silicon in the processing liquid is provided. The treatment liquid supply mechanism 38 is provided with a nozzle 41 at the bottom of the treatment tank 34, and a treatment liquid supply source 42 is connected to the nozzle 41 via a flow rate regulator 43. The treatment liquid discharge mechanism 39 forms a drain port 44 at the bottom of the processing tank 34, and connects the drain port 44 to an external drain via a switch 45.

  Then, the etching processing apparatus 26 discharges the entire amount of the processing liquid stored in the processing tank 34 to the outside by the processing liquid discharge mechanism 39, and then supplies the processing liquid to the inside of the processing tank 34 by the processing liquid supply mechanism 38. By supplying, the whole amount of the processing liquid stored in the processing tank 34 can be exchanged.

  The control unit 7 controls the operation of each unit of the substrate liquid processing apparatus 1 (such as the carrier carry-in / out unit 2, the lot forming unit 3, the lot placing unit 4, the lot transport unit 5, and the lot processing unit 6).

  The control unit 7 is a computer, for example, and includes a control device 46 and a storage device 47. The storage device 47 stores a program for controlling various processes executed in the substrate liquid processing apparatus 1. The control device 46 controls the operation of the substrate liquid processing apparatus 1 by reading and executing the program stored in the storage device 47. Note that the program may be stored in a computer-readable storage medium and installed in the storage device 47 from the storage medium. Examples of the computer-readable storage medium include a hard disk (HD), a flexible disk (FD), a compact disk (CD), a magnetic optical disk (MO), and a memory card.

  The substrate liquid processing apparatus 1 is configured as described above, and is controlled by the control unit 7.

  In normal use, the substrate liquid processing apparatus 1 performs various processes on a product lot formed of a plurality of substrates 8 serving as products according to the substrate liquid processing program (product lot processing) shown in FIG.

  In that case, first, the substrate liquid processing apparatus 1 forms a product lot (product lot forming step S1). In this product lot forming process, the control unit 7 causes the carrier carry-in / out unit 2 and the lot forming unit 3 to cooperate to form a product lot with a plurality of substrates 8 to be products, and then form the product lot. The product lot is transported from the unit 3 to the lot mounting unit 4 and the product lot is mounted on the loading-side lot mounting table 17. In this product lot forming process, the substrate 8 accommodated in the two carriers 9 in the horizontal posture is divided into two times, and the posture is changed from the horizontal posture to the vertical posture by the substrate transport mechanism 15 to the loading-side lot mounting table 17. While being transported, the transported substrates 8 are combined at the loading-side lot mounting table 17 to form a product lot. Alternatively, the substrate 8 accommodated in one carrier 9 is changed in posture from a horizontal posture to a vertical posture by the substrate transport mechanism 15 and placed on the loading-side lot placing table 17. The carrier 9 may be placed on the carrier stage 10 or may be stored in the carrier stock 12.

  Next, the substrate liquid processing apparatus 1 carries the product lot from the lot placement unit 4 to the lot processing unit 6 (product lot carry-in step S2). In this product lot carry-in process, the control unit 7 controls the lot carrying mechanism 19 to carry the product lot placed on the carry-in lot placing table 17 to the substrate lifting mechanism 36 of the etching processing apparatus 26.

  Next, the substrate liquid processing apparatus 1 performs an etching process on the substrate 8 forming the product lot (etching process step S3). In this etching process, the control unit 7 lowers the substrate lifting mechanism 36 of the etching processing apparatus 26 and raises it after a predetermined time has elapsed, so that the product lot is immersed in the etching processing liquid stored in the processing tank 34.

  Next, the substrate solution processing apparatus 1 transfers the product lot between the processing tanks 34 and 35 of the etching processing apparatus 26 (inter-tank transfer step S4). In this inter-vessel transfer process, the control unit 7 controls the lot transfer mechanism 19 to transfer the product lot held by the substrate elevating mechanism 36 of the etching processing tank 34 to the substrate elevating mechanism 37 of the processing tank 35 for rinsing. To transport.

  Next, the substrate liquid processing apparatus 1 rinses the substrate 8 on which the product lot is formed (rinse processing step S5). In this rinsing process, the control unit 7 lowers the substrate lifting mechanism 37 of the etching processing apparatus 26 and raises it after a predetermined time so that the product lot is immersed in the rinsing processing liquid stored in the processing tank 35.

  Next, the substrate solution processing apparatus 1 transfers the product lot between the etching processing apparatus 26 and the cleaning processing apparatus 25 (inter-apparatus transfer step S6). In this inter-device transfer process, the control unit 7 controls the lot transfer mechanism 19 to transfer the product lot held by the substrate lifting mechanism 37 of the etching processing apparatus 26 to the substrate lifting mechanism 32 of the cleaning processing apparatus 25.

  Next, the substrate liquid processing apparatus 1 cleans the substrate 8 forming the product lot (cleaning processing step S7). In this cleaning processing step, the control unit 7 lowers the substrate lifting mechanism 32 of the cleaning processing device 25 and raises it after a predetermined time has passed, so that the product lot is immersed in the cleaning processing liquid stored in the processing tank 30.

  Next, the substrate liquid processing apparatus 1 transports the product lot between the processing tanks 30 and 31 of the cleaning processing apparatus 25 (inter-tank transporting step S8). In this inter-vessel transfer process, the control unit 7 controls the lot transfer mechanism 19 to transfer the product lot held by the substrate elevating mechanism 32 of the cleaning processing tank 30 to the substrate elevating mechanism 33 of the rinsing process tank 31. To transport.

  Next, the substrate liquid processing apparatus 1 rinses the substrate 8 on which the product lot is formed (rinsing process step S9). In this rinsing process, the control unit 7 lowers the substrate lifting mechanism 33 of the cleaning processing apparatus 25 and raises it after a predetermined time has elapsed, so that the product lot is immersed in the rinsing process liquid stored in the processing tank 31.

  Next, the substrate liquid processing apparatus 1 transfers the product lot between the cleaning processing apparatus 25 and the drying processing apparatus 23 (inter-apparatus transfer step S10). In this inter-device transfer step, the control unit 7 controls the lot transfer mechanism 19 to transfer the product lot held by the substrate lifting mechanism 33 of the cleaning processing device 25 to the substrate lifting mechanism 28 of the drying processing device 23.

  Next, the substrate liquid processing apparatus 1 performs a drying process on the substrate 8 forming the product lot (drying step S11). In this drying processing step, the control unit 7 lowers the substrate lifting mechanism 28 of the drying processing apparatus 23 and raises it after a predetermined time, and supplies a processing gas for drying to the product lot in the processing tank 27.

  Next, the substrate solution processing apparatus 1 carries the product lot from the lot processing unit 6 to the lot placing unit 4 (product lot carrying out step S12). In this product lot carrying-out process, the control unit 7 controls the lot carrying mechanism 19 to place the product lot held by the substrate lifting mechanism 28 of the drying processing device 23 on the carrying-out lot placing table 18.

  Thereafter, the substrate liquid processing apparatus 1 accommodates the substrate 8 forming the product lot in the carrier 9 (carrier accommodation step S13). In this carrier accommodation step, the control unit 7 causes the carrier carry-in / out unit 2 and the lot forming unit 3 to cooperate with each other to accommodate the substrate 8 on which the product lot is formed in the carrier 9. In this carrier accommodation step, the product lot placed on the carry-out side lot placement table 18 is changed from the vertical posture to the horizontal posture by the substrate transfer mechanism 15 and transferred to the two carriers 9 in two steps. Alternatively, the product lot placed on the carry-out lot placing table 18 is changed from the vertical posture to the horizontal posture by the substrate transfer mechanism 15 and transferred to one carrier 9. The carrier 9 may be placed on the carrier stage 10 or may be stored in the carrier stock 12.

  When it is necessary to replace the etching processing liquid during normal use as described above, the substrate liquid processing apparatus 1 performs processing liquid replacement according to the substrate liquid processing program (exchange of processing liquid) shown in FIG. Exchange. For example, when the silicon concentration of the processing liquid (phosphoric acid aqueous solution) stored in the processing tank 34 by the silicon concentration sensor 40 of the etching processing apparatus 26 is outside a predetermined range, or stored in the processing tank 34. When the number of product lots processed with the processing solution (phosphoric acid aqueous solution) or the number of substrates 8 exceeds a predetermined value, it is determined that the processing solution needs to be replaced.

  In that case, the substrate liquid processing apparatus 1 starts discharging the processing liquid stored in the processing tank 34 (processing liquid discharge start step S21). In this processing liquid discharge start step, the control unit 7 opens the switch 45 of the processing liquid discharge mechanism 39 to discharge the processing liquid from the processing tank 34 to the external drain.

  Next, the substrate liquid processing apparatus 1 ends the discharge of the processing liquid (processing liquid discharge end step S22). In this processing liquid discharge ending step, the controller 7 switches the switch after a predetermined time has elapsed from the processing liquid discharge start step S21 or after detecting that the processing liquid does not remain in the processing tank 34 with a sensor (not shown). 45 is closed and the discharge of the processing liquid is terminated.

  Next, the substrate liquid processing apparatus 1 starts supplying a new processing liquid (processing liquid supply start step S23). In this processing liquid supply start step, the control unit 7 opens the flow rate regulator 43 of the processing liquid supply mechanism 38 to process a new processing liquid (aqueous phosphoric acid solution within a predetermined concentration range) from the processing liquid supply source 42. The tank 34 is supplied.

  Thereafter, the substrate liquid processing apparatus 1 ends the supply of the new processing liquid (processing liquid supply end step S24). In this processing liquid supply end step, the control unit 7 detects that a predetermined amount of processing liquid has been stored in the processing tank 34 after a fixed time has elapsed from the processing liquid supply start step S23 or by a sensor (not shown). Later, the flow rate regulator 43 is closed, and the supply of the processing liquid is terminated.

  When replacing the processing liquid described above, the substrate liquid processing apparatus 1 performs a dummy lot formed with a plurality of substrates 8 that are not products according to the substrate liquid processing program (dummy lot processing) shown in FIG. Is used to adjust the concentration of silicon in the processing solution. As will be described later, this silicon concentration adjustment step is executed in parallel with the processing liquid replacement step described above.

  In that case, first, the substrate liquid processing apparatus 1 forms a dummy lot (dummy lot forming step S31). In this dummy lot forming process, the control unit 7 cooperates the carrier carry-in / out unit 2 and the lot forming unit 3 to make a plurality of dummy substrates 8 (in order to adjust the silicon concentration of the processing solution) which are not products. A dummy lot is formed by the substrate 8) having a silicon nitride film formed on the surface of the silicon substrate, and then the dummy lot is transferred from the lot forming unit 3 to the lot mounting unit 4 and the dummy lot is transferred to the loading-side lot mounting table 17. Place. In this dummy lot forming step, the dummy substrate 8 housed in the carrier 9 stored in the carrier stock 13 is changed in posture from the horizontal posture to the vertical posture by the substrate transport mechanism 15 and placed on the loading-side lot placement table 17. .

  Next, the substrate solution processing apparatus 1 carries the dummy lot from the lot placement unit 4 to the lot processing unit 6 (dummy lot loading step S32). In this dummy lot carrying-in process, the control unit 7 controls the lot carrying mechanism 19 to carry the dummy lot placed on the carrying-in lot placing table 17 to the substrate lifting mechanism 36 of the etching processing apparatus 26.

  Next, the substrate liquid processing apparatus 1 immerses the substrate 8 on which the dummy lot is formed in the processing tank 34 of the etching processing apparatus 26 (dummy lot immersing step S33). In this dummy lot dipping process, the control unit 7 lowers the substrate lifting mechanism 36 of the etching processing apparatus 26 and raises it after a predetermined time so that the dummy lot is immersed in the etching processing liquid stored in the processing tank 34. .

  Next, the substrate liquid processing apparatus 1 transfers the dummy lot between the processing tanks 34 and 35 of the etching processing apparatus 26 (inter-tank transfer step S34). In this inter-vessel transfer process, the control unit 7 controls the lot transfer mechanism 19 to transfer the dummy lot held by the substrate elevating mechanism 36 of the etching processing bath 34 to the substrate elevating mechanism 37 of the processing bath 35 for rinsing. To transport.

  Next, the substrate liquid processing apparatus 1 rinses the substrate 8 on which the dummy lot is formed (rinse processing step S35). In this rinsing process, the control unit 7 lowers the substrate lifting mechanism 37 of the etching processing apparatus 26 and raises the substrate lifting mechanism 37 after a predetermined time so that the dummy lot is immersed in the rinsing processing liquid stored in the processing tank 35.

  Next, the substrate solution processing apparatus 1 transfers the dummy lot between the etching processing apparatus 26 and the drying processing apparatus 23 (inter-apparatus transfer step S36). In this inter-device transfer step, the control unit 7 controls the lot transfer mechanism 19 to transfer the dummy lot held by the substrate lifting mechanism 37 of the etching processing apparatus 26 to the substrate lifting mechanism 28 of the drying processing apparatus 23.

  Next, the substrate liquid processing apparatus 1 performs a drying process on the substrate 8 on which the dummy lot is formed (drying process step S37). In this drying processing step, the control unit 7 lowers the substrate lifting mechanism 28 of the drying processing apparatus 23 and raises it after a predetermined time, and supplies the processing gas for drying to the dummy lot in the processing tank 27.

  Next, the substrate liquid processing apparatus 1 carries out the dummy lot from the lot processing unit 6 to the lot placing unit 4 (dummy lot carrying out step S38). In this dummy lot unloading process, the control unit 7 controls the lot transport mechanism 19 to place the dummy lot held by the substrate lifting mechanism 28 of the drying processing apparatus 23 on the unloading-side lot mounting table 18.

  Thereafter, the substrate liquid processing apparatus 1 accommodates the substrate 8 forming the dummy lot in the carrier 9 stored in the carrier stock 13 (carrier accommodation step S39). In this carrier accommodation step, the control unit 7 causes the carrier 9 to accommodate the substrate 8 on which the dummy lot is formed by cooperating the carrier carry-in / out unit 2 and the lot forming unit 3. In this carrier accommodation step, the dummy lot placed on the carry-out lot placing table 18 is changed from the vertical posture to the horizontal posture by the substrate transfer mechanism 15 and transferred to the carrier 9.

  When performing the processing liquid exchange process and the silicon concentration adjustment process described above, the substrate liquid processing apparatus 1 performs the processing liquid replacement process and the silicon concentration according to the substrate liquid processing program (setting of the lot formation start time) shown in FIG. The time (timing) for performing the adjustment process is set (see FIG. 7).

  In that case, first, the control unit 7 determines the time for starting the replacement of the processing liquid (exchange start time determining step S41). In this case, for example, when the number of product lots processed with the processing liquid (phosphoric acid aqueous solution) stored in the processing tank 34 or the number of substrates 8 exceeds a predetermined value, the processing liquid It is determined that the replacement is necessary, and the time suitable for starting the replacement of the processing liquid is determined as the replacement start time in consideration of the operation status of each part of the substrate liquid processing apparatus 1.

  Next, the control unit 7 calculates a time at which the replacement of the processing liquid is scheduled to be completed (calculated replacement end time calculating step S42). In that case, as shown in FIG. 7, the time required to execute the processing liquid replacement steps (S21 to S24) (processing liquid replacement time) is added to the replacement start time determined in the replacement start time determination step S41. To calculate the scheduled replacement end time.

  Next, the control unit 7 calculates the time for starting the formation of the dummy lot (dummy lot formation start time calculating step S43). In that case, as shown in FIG. 7, the time required to execute the dummy lot forming step S31 (dummy lot forming time) is subtracted from the scheduled replacement end time calculated in the planned replacement end time calculating step S42. The dummy lot formation start time is calculated. Here, the dummy lot formation time is calculated as an actual time required for forming the dummy lot in consideration of the number of carriers forming the dummy lot. Alternatively, the dummy lot formation start time may be simply subtracted from the planned replacement end time, and the dummy lot formation start time may be used as the dummy lot formation start time minus a preset margin (time). It may be the lot formation start time.

  Then, as shown in FIG. 7, the control unit 7 executes the substrate liquid processing program (replacement of processing liquid) shown in FIG. 4 when the replacement start time determined in the replacement start time determination step S41 is reached. Then, when the dummy lot formation start time calculated in the dummy lot formation start time calculation step S43 is reached, the substrate liquid processing program (dummy lot processing) shown in FIG. 5 is executed. Then, the silicon concentration adjustment process is performed.

  As described above, the substrate liquid processing apparatus 1 places the dummy lot on the lot mounting unit 4 at least when the replacement of the processing liquid is completed, and immediately after the replacement of the processing liquid, The dummy lot is carried into the lot processing unit 6 and immersed in the processing tank 34. Since the dummy lot is formed and the dummy lot is made to stand by in the vicinity of the processing tank, the substrate lot processing apparatus 1 does not process the product lot because it can be put in immediately after the processing liquid is replaced. (Time required for processing solution replacement and silicon concentration adjustment using a dummy lot) can be shortened, and the processing efficiency of the product lot can be improved.

  In the substrate liquid processing apparatus 1, the time (timing) for processing a normal product lot after the silicon concentration adjustment process is also set according to the substrate liquid processing program (setting of the lot formation start time) shown in FIG. 6 (see FIG. 8). .)

  In that case, the control unit 7 calculates a time during which the product lot can be transported to the processing tank 34 (product lot transportable scheduled time calculating step S44). At that time, as shown in FIG. 8, the dummy lot carry-in step S32, the dummy lot immersion step S33, and the inter-vessel conveyance step S34 are executed at the exchange completion scheduled time calculated in the replacement completion scheduled time calculation step S42. The time required for the product lot (dummy lot processing time) is added to calculate the estimated product lot transportable time. Here, the dummy lot processing time is set for dummy lot processing (dummy lot loading, dummy lot immersion, tank-to-vessel transfer) in consideration of operating conditions such as the distance and speed at which each part of the substrate liquid processing apparatus 1 is transported. Calculate the actual time required.

  Next, the control unit 7 calculates the time for starting the formation of the product lot (product lot formation start time calculating step S45). In that case, as shown in FIG. 8, the time required to execute the product lot formation step S1 from the planned product lot transferable time calculated in the product lot transferable scheduled time calculation step S44 (product lot formation time) To calculate the product lot formation start time. Here, as the product lot formation time, the actual time required for forming the product lot is calculated in consideration of the number of carriers forming the product lot. Alternatively, the product lot formation start time may be the time obtained by simply subtracting the product lot formation time from the product lot transfer scheduled time, and the product lot formation time and a preset margin (time) are subtracted from the product lot transfer scheduled time. This time may be the product lot formation start time.

  Then, as shown in FIG. 8, when the dummy lot formation start time calculated in the dummy lot formation start time calculation step S43 is reached, the control unit 7 performs the substrate liquid processing program (dummy lot processing shown in FIG. ) To perform the silicon concentration adjustment process, and when the product lot formation start time selected in the product lot formation start time calculation step S45 is reached, the substrate liquid processing program (product lot processing) shown in FIG. ) To process the product lot.

  As described above, the substrate liquid processing apparatus 1 places the product lot on the lot mounting unit 4 at least when the dummy lot is discharged from the processing tank 34, and immediately after the dummy lot is discharged from the processing tank 34, the lot mounting is performed. The product lot is carried from the placement unit 4 into the lot processing unit 6 and immersed in the processing tank 34. Thereby, in the substrate liquid processing apparatus 1, it is possible to shorten the time during which the product lot is not processed and to improve the processing efficiency of the product lot.

  In the operation shown in FIG. 8, when the dummy lot is discharged from the processing tank 34, the product lot can be transferred to the processing tank 34. However, after the dummy lot is immersed in the processing tank 34, the silicon concentration of the processing liquid is changed to the silicon concentration. When it is detected by the sensor 40 and it is confirmed that the concentration is within a predetermined concentration range, as shown in FIG. 9, the product lot is treated when the silicon concentration measurement by the silicon concentration sensor 40 is completed. 34 can also be conveyed. Note that the substrate liquid processing apparatus 1 may continuously perform processing such as transfer of the dummy lot between tanks even during the measurement of the silicon concentration.

  In that case, in the product lot transfer scheduled time calculation step S44, as shown in FIG. 9, the dummy lot carry-in, dummy lot immersion, and silicon concentration measurement are performed at the replacement end scheduled time determined in the replacement end scheduled time calculation step S42. The time required for the product lot (dummy lot processing time) is added to calculate the estimated product lot transportable time. Here, the dummy lot processing time is used for dummy lot processing (dummy lot carry-in, dummy lot immersion, silicon concentration measurement) in consideration of operating conditions such as the distance and speed at which each part of the substrate liquid processing apparatus 1 is transported. Calculate the actual time required.

  If the concentration detected by the silicon concentration sensor 40 is outside the predetermined concentration range, the product lot placed on the carry-in lot placement table 17 is divided into two times by the substrate transport mechanism 15 and is transferred to the carrier 9. Transport. At this time, normally, when the substrate transport mechanism 15 transports the substrate 8 from the unload-side lot mounting table 18 to the carrier 9, the substrate 8 is supported by the post-processing substrate support unit, but the unprocessed substrate 8 is transferred from the loading-side lot mounting table 17. When transporting to the carrier 9, the substrate 8 is supported and transported by the pre-processing substrate support unit. As a result, it is possible to prevent particles or the like adhering to the substrate 8 before processing from adhering to the post-processing substrate support portion and then transferring to the substrate 8 after processing.

  In the lot mounting unit 4 of the present embodiment, a loading-side lot mounting table 17 for mounting a lot before processing (before being transported by the lot transporting unit 5), and after processing (transported by the lot transporting unit 5) The latter lot loading table 18 is provided, but depending on the time when the product lot is processed in the lot processing unit 6 and the time when the processing liquid is exchanged in the processing tank 34 The dummy lot is placed on the carrying-in lot placing table 17 and the product lot is carried out from the lot processing unit 6 to the carrying-out lot placing table 18 so that the product lot is placed on the carrying-out lot placing table 18. Later, the dummy lot placed on the carry-in lot placement 17 can be immediately transferred to the processing tank 34, the time during which the product lot is not processed can be shortened, and the processing efficiency of the product lot is improved. be able to

  As described above, in the substrate liquid processing apparatus 1 and the substrate liquid processing method and the substrate liquid processing program used in the substrate liquid processing apparatus 1, a dummy that does not become a product after the processing liquid in the processing tank 34 is replaced. The silicon concentration of the processing liquid is adjusted by processing the dummy lot formed on the substrate 8 in the processing tank 34. At that time, at least when the replacement of the processing liquid is completed, the dummy lot is placed on the lot placement unit 4. At least when the dummy lot is discharged from the processing tank 34, the product lot is placed on the lot placement unit 4. Product lots and dummy lots are placed on the lot placement unit 4 by changing the posture from a horizontal posture to a vertical posture. Thereafter, the product lot and the dummy lot are conveyed and processed in a vertical posture. As a result, the time during which the product lot is not processed (the time required for processing solution replacement, silicon concentration adjustment using a dummy lot, etc.) can be shortened, and the product lot processing efficiency can be improved. .

DESCRIPTION OF SYMBOLS 1 Substrate liquid processing apparatus 2 Carrier carrying in / out part 3 Lot formation part 4 Lot mounting part 5 Lot conveyance part 6 Lot processing part 7 Control part 8 Substrate 9 Carrier 26 Etching processing apparatus 34 Processing tank

Claims (7)

In a substrate liquid processing apparatus that performs liquid processing with a processing liquid stored in a processing tank on a lot formed of a plurality of substrates,
A carrier loading / unloading section for loading and unloading a carrier containing a plurality of substrates;
A lot forming unit for forming a lot from a plurality of substrates received from the carrier loading / unloading unit;
A lot placement unit for placing a lot formed by the lot formation unit;
A lot transport unit for transporting a lot placed on the lot placement unit to a processing tank;
A lot processing unit that batch-processes a plurality of substrates forming a lot by immersing the lot transported in the lot transport unit in a processing solution stored in a processing tank;
A control unit for controlling the carrier carry-in / out unit, the lot forming unit, the lot conveying unit, and the lot processing unit;
Have
The control unit adjusts the silicon concentration of the processing liquid by processing a dummy lot formed of a plurality of dummy substrates that are not products after replacing the processing liquid in the processing tank by the lot processing unit,
When exchanging the treatment liquid in the treatment tank, the exchange start time for starting the exchange of the treatment liquid is determined, and the replacement end scheduled time for ending the exchange of the treatment liquid is determined from the exchange start time, and a dummy lot is formed. The dummy lot formation start time for starting dummy lot formation is determined from the dummy lot formation time required for placement on the lot placement section and the scheduled replacement completion time, and at least when the replacement of the processing liquid is completed. A substrate liquid processing apparatus, wherein a lot is placed on a lot placement section. The control unit obtains a scheduled product lot transportable time during which the lot transport unit can transport the product lot to the processing tank after discharging the dummy lot from the processing tank from the scheduled replacement end time, and forms a product lot. The product lot formation start time for starting the formation of the product lot is determined from the product lot formation time required to be placed on the lot placement unit and the product lot transportable scheduled time, and at least the dummy lot is removed from the processing tank. The substrate liquid processing apparatus according to claim 1, wherein the product lot is placed on the lot placement unit when discharged.   The control unit changes the posture of a substrate accommodated in a horizontal posture on the carrier to a vertical posture and places the substrate on the lot placement portion, and conveys the substrate in the lot posture in the vertical posture and performs the lot processing. The substrate liquid processing apparatus according to claim 1, wherein the substrate liquid processing apparatus is processed by a unit. In the substrate liquid processing method for liquid processing with a processing liquid stored in a processing tank for a lot formed of a plurality of substrates,
Adjust the silicon concentration of the processing liquid by processing in the processing tank a dummy lot formed with a plurality of dummy substrates that are not products after replacing the processing liquid in the processing tank,
When exchanging the treatment liquid in the treatment tank, the exchange start time for starting the exchange of the treatment liquid is determined, and the replacement end scheduled time for ending the exchange of the treatment liquid is determined from the exchange start time, and a dummy lot is formed. The dummy lot formation start time for starting dummy lot formation is determined from the dummy lot formation time required for placement on the lot placement section and the scheduled replacement completion time, and at least when the replacement of the processing liquid is completed. A substrate liquid processing method comprising placing a lot on a lot placement unit. After the dummy lot is discharged from the processing tank from the scheduled replacement end time, a product lot transportable scheduled time during which the product lot can be transported to the processing tank by the lot transport unit is determined, and a product lot is formed to form a lot placement unit The product lot formation start time required to start the formation of the product lot from the product lot formation time required to be placed on the product lot and the scheduled product lot transportable time is obtained, and at least when the dummy lot is discharged from the processing tank The substrate liquid processing method according to claim 4, wherein the substrate is placed on a lot placement unit.   5. The substrate stored in the carrier in a horizontal posture is changed in a vertical posture and placed on the lot placement unit, and the substrate is transported and processed in the vertical posture. 5. The substrate liquid processing method according to 5. In a computer-readable storage medium storing a substrate liquid processing program for processing a lot formed with a plurality of substrates with a processing liquid stored in a processing tank,
After processing the treatment liquid in the treatment tank, the silicon concentration of the treatment liquid is adjusted by processing in the treatment tank a dummy lot formed with a plurality of dummy substrates that are not products.
When exchanging the treatment liquid in the treatment tank, the exchange start time for starting the exchange of the treatment liquid is determined, and the replacement end scheduled time for ending the exchange of the treatment liquid is determined from the exchange start time, and a dummy lot is formed. The dummy lot formation start time for starting dummy lot formation is determined from the dummy lot formation time required for placement on the lot placement section and the scheduled replacement completion time, and at least when the replacement of the processing liquid is completed. A computer-readable storage medium storing a substrate liquid processing program, wherein a lot is placed on a lot placement unit.

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