WO2021104244A1

WO2021104244A1 - Cooling device

Info

Publication number: WO2021104244A1
Application number: PCT/CN2020/131079
Authority: WO
Inventors: 马杰; 王大斌; 黄熠; 褚永兴
Original assignee: 青岛海尔电冰箱有限公司; 海尔智家股份有限公司
Priority date: 2019-11-26
Filing date: 2020-11-24
Publication date: 2021-06-03
Also published as: US20230003441A1; CN110895091A

Abstract

A cooling device (100) comprising a first cooling part (10), a second cooling part (20) and a first containing cavity (S1) clamped between the first cooling part (10) and the second cooling part (20), wherein the first cooling part (10) is arranged around the second cooling part (20), and the first cooling part (10) and the second cooling part (20) are distributed in a spaced manner. Liquid to be cooled in the first containing cavity (S1) is cooled by means of the first cooling part (10) and the second cooling part (20) at the same time, additives are not needed, and the cooling effect is greatly improved.

Description

Cooling device

This application claims the priority of the Chinese patent application whose application date is November 26, 2019, the application number is 201911174823.5, and the invention title is "cooling device", the entire content of which is incorporated into this application by reference.

Technical field

The present invention relates to the field of cooling technology, in particular to a cooling device.

Background technique

In the hot summer, some consumers like to drink frozen beverages. In addition, frozen beverages also bring better taste. At present, one way to cool freshly squeezed beverages is to add ice cubes to the refrigerated cups of beverages, but due to ice cubes Melting into liquid water and mixing with the beverage will reduce the concentration of the beverage, which will affect the taste of the beverage.

In view of this, it is necessary to provide a cooling device to solve the above-mentioned problems.

Summary of the invention

The object of the present invention is to provide a cooling device, which can realize rapid cooling.

In order to achieve one of the above-mentioned objects of the invention, an embodiment of the present invention provides a cooling device including a first cooling part, a second cooling part, and a first cooling part sandwiched between the first cooling part and the second cooling part. An accommodating cavity, the first cooling part is arranged around the second cooling part, and the first cooling part and the second cooling part are spaced apart.

As a further improvement of an embodiment of the present invention, the cooling device includes a cup body, the cup body includes an outer wall and a first inner wall in sequence from the outside to the inside, and the first cooling device is formed between the outer wall and the first inner wall. Part, the second cooling part is located in a cavity formed by the first inner wall, and the first accommodating cavity is formed between the first inner wall and the second cooling part.

As a further improvement of an embodiment of the present invention, the cooling device further includes a cover body matched with the cup body.

As a further improvement of an embodiment of the present invention, the outer wall includes an outer bottom wall and an outer peripheral wall disposed around the outer bottom wall, and the first inner wall includes a first bottom wall and a first bottom wall disposed around the first bottom wall. A peripheral wall, a first gap is provided between the outer bottom wall and the first bottom wall, a second gap is provided between the outer peripheral wall and the first peripheral wall, and the first gap and the first The two gaps are connected.

As a further improvement of an embodiment of the present invention, there are gaps between the outer surface of the second cooling part and the first bottom wall and the first peripheral wall.

As a further improvement of an embodiment of the present invention, the first cooling part is a first refrigerant circuit, and the second cooling part is a semiconductor cooling part.

As a further improvement of an embodiment of the present invention, the cooling device further includes a cover body matched with the cup body, and the semiconductor cooling portion is connected to the cover body.

As a further improvement of an embodiment of the present invention, the first cooling part is a first refrigerant circuit, and the second cooling part is a second refrigerant circuit.

As a further improvement of an embodiment of the present invention, the cup body further includes a second inner wall, the second inner wall is far from the outer wall relative to the first inner wall, and between the first inner wall and the second inner wall The first accommodating cavity is formed, and the second inner wall is surrounded to form the second refrigerant circuit.

As a further improvement of an embodiment of the present invention, the cup body further includes a third inner wall, the third inner wall is far from the outer wall relative to the second inner wall, and between the second inner wall and the third inner wall The second refrigerant circuit is formed, the third inner wall is surrounded to form a second accommodating cavity, and the second accommodating cavity is connected to the first accommodating cavity.

Compared with the prior art, the beneficial effect of the present invention is that: an embodiment of the present invention simultaneously cools the liquid to be cooled in the first accommodating cavity through the first cooling part and the second cooling part, and no additives are required, which greatly improves Cooling effect.

Description of the drawings

Fig. 1 is a schematic diagram of a cooling device according to a first specific example of the present invention;

Fig. 2 is a schematic diagram of a cooling device according to a second specific example of the present invention;

Fig. 3 is a schematic diagram of a cooling device according to a third specific example of the present invention.

Detailed ways

Hereinafter, the present invention will be described in detail with reference to the specific embodiments shown in the drawings. However, these embodiments do not limit the present invention, and the structural, method, or functional changes made by those skilled in the art based on these embodiments are all included in the protection scope of the present invention.

In the various drawings of the present invention, for the convenience of illustration, some dimensions of the structure or part are exaggerated relative to other structures or parts, and therefore, they are only used to illustrate the basic structure of the subject of the present invention.

In addition, the terms such as "outer", "inner", "above", "below" and other relative positions in space used herein are for the purpose of facilitating explanation to describe a unit or feature as shown in the drawings relative to The relationship of another unit or feature. The terms of relative spatial position may be intended to include different orientations of the device in use or operation other than those shown in the figures. For example, if the device in the figure is turned over, the unit described as being "below" the other unit or feature will be "above" the other unit or feature. Therefore, the exemplary term "below" can encompass both the above and below orientations. The device can be oriented in other ways (rotated by 90 degrees or other orientations), and the space-related descriptors used herein are explained accordingly.

Refer to FIG. 1, which is a schematic diagram of a cooling device 100 according to an embodiment of the present invention.

The cooling device 100 includes a first cooling part 10, a second cooling part 20, and a first accommodating cavity S1 sandwiched between the first cooling part 10 and the second cooling part 20.

Here, the first accommodating cavity S1 is used for accommodating liquid to be cooled, such as hot drinks, but not limited to this, and the first accommodating cavity S1 can also be used for accommodating solid or other substances.

The first cooling part 10 is arranged around the second cooling part 20, and the first cooling part 10 and the second cooling part 20 are spaced apart.

Here, "the first cooling part 10 is arranged around the second cooling part 20" means that the first cooling part 10 is arranged to surround all the outer surfaces of the second cooling part 20, or the part of the first cooling part 10 that surrounds the second cooling part 20 External surface setting.

"The first cooling part 10 and the second cooling part 20 are spaced apart" means that the first cooling part 10 and the second cooling part 20 are cooling parts that work independently, and the two are structurally disconnected from each other, or both Although there is a connection part in the structure, the connection part only plays a role of connecting, and does not play a role of transmitting the coolant.

It can be seen that this embodiment simultaneously cools the liquid to be cooled in the first accommodating cavity S1 through the first cooling part 10 and the second cooling part 20, and no additives are required, which greatly improves the cooling effect.

In this embodiment, the cooling device 100 includes a cup body 30. The cup body 30 includes an outer wall 31 and a first inner wall 32 in sequence from the outside to the inside. The outer wall 31 and the first inner wall 32 form a first cooling portion 10 and a second cooling portion. 20 is located in a cavity S surrounded by the first inner wall 32, and a first accommodating cavity S1 is formed between the first inner wall 32 and the second cooling part 20.

The thickness of the outer wall 31 may be greater than the thickness of the first inner wall 32 to avoid deformation of the cooling device 100. The outer wall 31 may be made of ABS material, and the first inner wall 32 may be made of semiconductor material, but it is not limited thereto.

Specifically, the outer wall 31 includes an outer bottom wall 311 and an outer peripheral wall 312 disposed around the outer bottom wall 311. The first inner wall 32 includes a first bottom wall 321 and a first peripheral wall 322 disposed around the first bottom wall 321. The outer bottom wall There is a first gap P1 between the 311 and the first bottom wall 321, a second gap P2 between the outer peripheral wall 312 and the first peripheral wall 322, and the first gap P1 and the second gap P2 are connected.

Assuming that the cup body 30 is a cylindrical or conical cup body, at this time, the outer bottom wall 311 and the first bottom wall 321 are both circular, and the outer peripheral wall 312 and the first peripheral wall 322 are both hollow cylinders or hollow cones. That is, referring to FIG. 1, the longitudinal section connecting the first gap P1 and the second gap P2 at this time is roughly U-shaped, and the first cooling part 10 is formed in the first gap P1 and the second gap P2. In this way, The overlapping area of the first cooling portion 10 and the first accommodating cavity S1 is enlarged, thereby improving the cooling effect.

Of course, in other embodiments, the outer bottom wall 311 and the first bottom wall 321 may be an integral structure, that is, there is no first gap P1 at this time.

In this embodiment, there are gaps between the outer surface of the second cooling part 20 and the first bottom wall 321 and the first peripheral wall 322.

In other words, the second cooling part 20 is substantially located above the first bottom wall 321, there is a gap between the lower part of the second cooling part 20 and the first bottom wall 321, and the first peripheral wall 322 is arranged around the second cooling part 20 In this way, the longitudinal section of the first accommodating cavity S1 is U-shaped, and the liquid to be cooled in the first accommodating cavity S1 fully contacts the first cooling portion 10 (or the first inner wall 32) and the second cooling portion 20, which further improves Cooling effect.

In this embodiment, the cooling device 100 further includes a cover body 40 that is matched with the cup body 30, and the cover body 40 can be sealed and matched with the cup body 30. For example, a sealing ring or the like is also provided between the cover body 40 and the cup body 30. .

It should be noted that the cooling device 100 of this embodiment may be an independent device, the first cooling part 10 and the second cooling part 20 may be integrated in the cooling device 100, or the first cooling part 10 and the second cooling part 20 is installed independently of the cooling device 100, and the first cooling part 10 and the second cooling part 20 are loaded in the cooling device 100 when needed.

The cooling device 100 can be used with refrigeration equipment such as refrigerators. In actual operation, the cooling device 100 with the first cooling part 10 and the second cooling part 20 can be used with the refrigerator for cooling, so that the first cooling part 10 and the second cooling part The portion 20 reserves sufficient cooling capacity, and the post-cooling device 100 can be used independently, for example, the cooling device 100 is used for outdoor cooling of hot drinks, storage of medicines, and the like.

Here, since the first cooling part 10 and the second cooling part 20 can reserve enough cold capacity, the cooling time of the cooling device 100 can be prolonged, and the first cooling part 10 and the second cooling part 20 can sufficiently cool the liquid to be cooled. The effect is better. The cooling device 100 of this embodiment has a simple structure, is convenient to use, and has a good user experience.

In the following, a number of specific embodiments of the cooling device 100 are introduced.

In the first specific embodiment, with reference to FIG. 1, the first cooling part 10 is the first refrigerant circuit 10, the second cooling part 20 is the semiconductor cooling part 20, and the first refrigerant circuit 10 is formed between the outer wall 31 and the first inner wall 32. The semiconductor cooling portion 20 is located in a cavity S surrounded by the first inner wall 32, and a first accommodating cavity S1 is formed between the first inner wall 32 and the semiconductor cooling portion 20.

Here, the first refrigerant circuit 10 can be filled with refrigerant. The refrigerant can be, for example, a liquid with a high specific heat capacity or a phase change material. The first refrigerant circuit 10 can store cold energy by changing the state of the refrigerant, and the refrigerant can be sealed and stored in the first refrigerant circuit. In the refrigerant circuit 10, alternatively, the refrigerant may be circulated in the first refrigerant circuit 10 by connecting the first refrigerant circuit 10, or the like.

The semiconductor cooling part 20 may be a thermal superconducting alloy or the like, and the semiconductor cooling part 20 may directly absorb and store cold energy in the refrigerator for subsequent cooling use.

In this specific embodiment, the semiconductor cooling part 20 has a solid strip structure, and the semiconductor cooling part 20 is connected to the cover body 40. Here, the semiconductor cooling part 20 is connected to the central part of the cover body 40.

It should be noted that the semiconductor connecting portion 20 may be integrally formed with the cover body 40, or the semiconductor connecting portion 20 and the cover body 40 may be assembled and connected according to actual conditions.

In addition, the semiconductor connecting portion 20 is not limited to one, and multiple semiconductor connecting portions 20 may be provided under the cover body 40. When the cover body 40 and the cup body 30 are mated together, the semiconductor connecting portion 20 and the first inner wall 32 A first accommodating cavity S1 is formed therebetween.

In actual use, the cup body 30 and the cover body 40 can be placed together in the refrigerator for cooling. The first refrigerant circuit 10 stores the cold energy through the refrigerant, and the semiconductor connection part 20 directly stores the cold energy. Then, when the liquid is to be cooled, take it The lower cover 40 and the semiconductor connecting portion 20 place the liquid to be cooled in the cavity S, cover the cover 40, the semiconductor connecting portion 20 just extends into the liquid to be cooled, the first refrigerant circuit 10 and the semiconductor connecting portion 20 Cool the liquid to be cooled together.

Refer to FIG. 2, which is a schematic diagram of a second specific embodiment. For ease of description, similar structures use similar numbers.

In this specific embodiment, the first cooling part 10a is a first refrigerant circuit 10a, and the second cooling part 20a is a second refrigerant circuit 20a.

The cup body 30a includes an outer wall 31a, a first inner wall 32a, and a second inner wall 33a in order from the outside to the inner. The second inner wall 33a is away from the outer wall 31a relative to the first inner wall 32a. A first refrigerant circuit 10a is formed between the outer wall 31a and the first inner wall 32a. A first accommodating cavity S1 is formed between the first inner wall 32a and the second inner wall 33a, and the second inner wall 33a surrounds and forms a second refrigerant circuit 20a.

Here, a U-shaped first accommodating chamber S1 is formed between the second inner wall 33a and the first inner wall 32a. The space enclosed by the second inner wall 33a is filled with refrigerant to form a second refrigerant circuit 20a. The description of can refer to the first specific embodiment, which will not be repeated here.

It should be noted that the refrigerants in the first refrigerant circuit 10a and the second refrigerant circuit 20a may be the same or different materials, which may be determined according to actual conditions.

In addition, in this embodiment, the cover body 40a is detachably disposed above the cup body 30a, and the part of the cover body 40a corresponding to the first receiving cavity S1 may be formed with an escape portion 41a, which can avoid waiting to be cooled during the cooling process. The liquid flows out to the outside of the cooling device 100a.

In actual use, the cup body 30a and the cover body 40a can be placed together in the refrigerator for cooling. The first refrigerant circuit 10a and the second refrigerant circuit 20a store the cold through the refrigerant, and then, when the liquid is to be cooled, remove the cover body 40. Place the liquid to be cooled in the first accommodating chamber S1 and cover the cover 40a. The first refrigerant circuit 10a and the second refrigerant circuit 20a jointly cool the liquid to be cooled. It is understandable that the cover 40a may not be covered. The cooling operation is performed.

3, it is a schematic diagram of the third embodiment. The difference between the third embodiment and the second embodiment is that: the cup body 30b further includes a third inner wall 34b, and the third inner wall 34b is far away from the outer wall relative to the second inner wall 33b. 31b, a second refrigerant circuit 20b is formed between the second inner wall 33b and the third inner wall 34b, the third inner wall 34b encloses a second accommodating cavity S2, and the second accommodating cavity S2 communicates with the first accommodating cavity S1.

Here, the first accommodating cavity S1 and the second accommodating cavity S2 can be communicated through a through hole penetrating the second refrigerant circuit 20b, and both the first accommodating cavity S1 and the second accommodating cavity S2 can accommodate the liquid to be cooled. Of course, the first accommodating cavity S1 and the second accommodating cavity S2 can also be separated from each other, so that it can be adapted to different substances to be cooled.

In summary, the cooling device of the present invention simultaneously cools the liquid to be cooled in the first accommodating cavity S1 through the first cooling part 10 and the second cooling part 20, and no additives are required, which greatly improves the cooling effect.

In addition, since the first cooling part 10 and the second cooling part 20 can reserve enough cooling capacity, the cooling time of the cooling device 100 can be prolonged, and the first cooling part 10 and the second cooling part 20 can sufficiently cool the liquid to be cooled, The effect is better. The cooling device 100 of this embodiment has a simple structure, is convenient to use, and has a good user experience.

The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to preferred embodiments, for example, if the technologies in different embodiments can be used in combination to achieve corresponding effects at the same time, The solution is also within the protection scope of the present invention. Those of ordinary skill in the art should understand that the technical solution of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solution of the present invention.

Claims

A cooling device, characterized in that it comprises a first cooling part, a second cooling part, and a first accommodating cavity sandwiched between the first cooling part and the second cooling part, the first cooling part It is arranged around the second cooling part, and the first cooling part and the second cooling part are spaced apart.
The cooling device according to claim 1, wherein the cooling device comprises a cup body, the cup body includes an outer wall and a first inner wall in sequence from the outside to the inside, and a space is formed between the outer wall and the first inner wall. The first cooling part, the second cooling part are located in a cavity formed by the first inner wall, and the first accommodating cavity is formed between the first inner wall and the second cooling part.
The cooling device according to claim 2, wherein the cooling device further comprises a cover body matched with the cup body.
The cooling device according to claim 2, wherein the outer wall includes an outer bottom wall and an outer peripheral wall disposed around the outer bottom wall, and the first inner wall includes a first bottom wall and an outer peripheral wall surrounding the first bottom wall. A first peripheral wall provided with a wall, a first gap is provided between the outer bottom wall and the first bottom wall, a second gap is provided between the outer peripheral wall and the first peripheral wall, and the first gap Connected with the second gap.
The cooling device according to claim 4, wherein a gap exists between the outer surface of the second cooling part and the first bottom wall and the first peripheral wall.
The cooling device according to any one of claims 2-5, wherein the first cooling part is a first refrigerant circuit, and the second cooling part is a semiconductor cooling part.
7. The cooling device according to claim 6, wherein the cooling device further comprises a cover body matched with the cup body, and the semiconductor cooling part is connected to the cover body.
The cooling device according to any one of claims 2-5, wherein the first cooling part is a first refrigerant circuit, and the second cooling part is a second refrigerant circuit.
The cooling device according to claim 8, wherein the cup body further comprises a second inner wall, the second inner wall being away from the outer wall with respect to the first inner wall, and the first inner wall and the first inner wall are far away from the outer wall. The first accommodating cavity is formed between the two inner walls, and the second inner wall is surrounded to form the second refrigerant circuit.
The cooling device according to claim 9, wherein the cup body further comprises a third inner wall, the third inner wall is far from the outer wall with respect to the second inner wall, and the second inner wall is connected to the first inner wall. The second refrigerant circuit is formed between the three inner walls, the third inner wall is surrounded to form a second accommodating cavity, and the second accommodating cavity is connected to the first accommodating cavity.