CN110895091A

CN110895091A - Cooling device

Info

Publication number: CN110895091A
Application number: CN201911174823.5A
Authority: CN
Inventors: 马杰; 王大斌; 黄熠; 褚永兴
Original assignee: Qingdao Haier Refrigerator Co Ltd; Haier Smart Home Co Ltd
Current assignee: Qingdao Haier Refrigerator Co Ltd; Haier Smart Home Co Ltd
Priority date: 2019-11-26
Filing date: 2019-11-26
Publication date: 2020-03-20
Also published as: US20230003441A1; WO2021104244A1

Abstract

The invention discloses a cooling device which comprises a first cooling part, a second cooling part and a first accommodating cavity clamped between the first cooling part and the second cooling part, wherein the first cooling part is arranged around the second cooling part, and the first cooling part and the second cooling part are distributed at intervals. According to the invention, the liquid to be cooled in the first accommodating cavity is simultaneously cooled through the first cooling part and the second cooling part, additives are not required, and the cooling effect is greatly improved.

Description

Cooling device

Technical Field

The invention relates to the technical field of cooling, in particular to a cooling device.

Background

In hot summer, partial consumers like to drink frozen beverages, the frozen beverages also bring better mouthfeel, and one method for cooling freshly squeezed beverages at present is to add ice blocks to a refrigerating cup containing the beverages, but the ice blocks are melted into liquid water to be mixed with the beverages, so that the concentration of the beverages is reduced, and the mouthfeel of the beverages is affected.

In view of the above, it is desirable to provide a cooling device to solve the above problems.

Disclosure of Invention

The object of the invention is to provide a cooling device which can achieve rapid cooling.

In order to achieve one of the above objects, an embodiment of the present invention provides a cooling device, including a first cooling portion, a second cooling portion, and a first accommodating cavity interposed between the first cooling portion and the second cooling portion, wherein the first cooling portion is disposed around the second cooling portion, and the first cooling portion and the second cooling portion are spaced apart from each other.

As a further improvement of an embodiment of the present invention, the cooling device includes a cup body, the cup body includes an outer wall and a first inner wall in sequence from outside to inside, the first cooling portion is formed between the outer wall and the first inner wall, the second cooling portion is located in a cavity defined by the first inner wall, and the first accommodating cavity is formed between the first inner wall and the second cooling portion.

As a further improvement of an embodiment of the present invention, the cooling device further includes a lid body that is fitted to the cup body.

As a further improvement of the embodiment of the present invention, the outer wall includes an outer bottom wall and an outer peripheral wall disposed around the outer bottom wall, the first inner wall includes a first bottom wall and a first peripheral wall disposed around the first bottom wall, a first gap is formed between the outer bottom wall and the first bottom wall, a second gap is formed between the outer peripheral wall and the first peripheral wall, and the first gap is connected to the second gap.

As a further improvement of the embodiment of the present invention, a gap is provided between the outer surface of the second cooling portion and each of the first bottom wall and the first peripheral wall.

In a further improvement of an embodiment of the present invention, the first cooling unit is a first refrigerant circuit, and the second cooling unit is a semiconductor cooling unit.

As a further improvement of an embodiment of the present invention, the cooling device further includes a lid body that fits to the cup body, and the semiconductor cooling portion is connected to the lid body.

As a further improvement of the embodiment of the present invention, the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.

As a further improvement of the embodiment of the present invention, the cup body further includes a second inner wall, the second inner wall is far away from the outer wall relative to the first inner wall, the first accommodating cavity is formed between the first inner wall and the second inner wall, and the second inner wall encloses to form the second refrigerant loop.

As a further improvement of the embodiment of the present invention, the cup body further includes a third inner wall, the third inner wall is far away from the outer wall relative to the second inner wall, the second refrigerant circuit is formed between the second inner wall and the third inner wall, the third inner wall surrounds a second accommodating cavity, and the second accommodating cavity is communicated with the first accommodating cavity.

Compared with the prior art, the invention has the beneficial effects that: according to the embodiment of the invention, the first cooling part and the second cooling part are used for cooling the liquid to be cooled in the first accommodating cavity at the same time, so that additives are not needed, and the cooling effect is greatly improved.

Drawings

FIG. 1 is a schematic view of a cooling apparatus according to a first specific example of the present invention;

FIG. 2 is a schematic view of a cooling apparatus according to a second specific example of the present invention;

fig. 3 is a schematic view of a cooling apparatus according to a third specific example of the present invention.

Detailed Description

The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.

In the various drawings of the present invention, some dimensions of structures or portions are exaggerated relative to other structures or portions for convenience of illustration, and thus, are used only to illustrate the basic structure of the subject matter of the present invention.

Also, terms used herein such as "outer," "inner," "above," "below," and the like, denote relative spatial positions, and are used for convenience in description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

Fig. 1 is a schematic view of a cooling apparatus 100 according to an embodiment of the present invention.

The cooling device 100 includes a first cooling unit 10, a second cooling unit 20, and a first accommodation chamber S1 interposed between the first cooling unit 10 and the second cooling unit 20.

Here, the first receiving chamber S1 is used for receiving liquid to be cooled, such as hot drink, etc., but not limited thereto, the first receiving chamber S1 may also be used for receiving solid or other state substances.

The first cooling portion 10 is disposed around the second cooling portion 20, and the first cooling portion 10 and the second cooling portion 20 are spaced apart from each other.

Here, the phrase "the first cooling part 10 is disposed around the second cooling part 20" means that the first cooling part 10 is disposed around all outer surfaces of the second cooling part 20, or that the first cooling part 10 is disposed around a portion of the outer surfaces of the second cooling part 20.

The phrase "the first cooling part 10 and the second cooling part 20 are spaced apart" means that the first cooling part 10 and the second cooling part 20 are independently operated cooling parts, and they are structurally disconnected from each other, or they have a connecting part, but the connecting part only serves to connect them and does not serve to transmit the coolant.

It can be seen that in the present embodiment, the first cooling portion 10 and the second cooling portion 20 cool the liquid to be cooled in the first accommodating chamber S1 at the same time, so that no additive is required, and the cooling effect is greatly improved.

In the present embodiment, the cooling device 100 includes the cup 30, the cup 30 includes an outer wall 31 and a first inner wall 32 in sequence from outside to inside, the first cooling portion 10 is formed between the outer wall 31 and the first inner wall 32, the second cooling portion 20 is located in a cavity S defined by the first inner wall 32, and a first accommodating cavity S1 is formed between the first inner wall 32 and the second cooling portion 20.

The thickness of the outer wall 31 may be greater than that of the first inner wall 32 to avoid deformation of the cooling device 100, the outer wall 31 may be made of ABS material, and the first inner wall 32 may be made of semiconductor material, but not limited thereto.

Specifically, the outer wall 31 includes an outer bottom wall 311 and an outer peripheral wall 312 disposed around the outer bottom wall 311, the first inner wall 32 includes a first bottom wall 321 and a first peripheral wall 322 disposed around the first bottom wall 321, a first gap P1 is formed between the outer bottom wall 311 and the first bottom wall 321, a second gap P2 is formed between the outer peripheral wall 312 and the first peripheral wall 322, and the first gap P1 is connected to the second gap P2.

Assuming that the cup 30 is a cylindrical or conical cup, the outer bottom wall 311 and the first bottom wall 321 are both circular, the outer peripheral wall 312 and the first peripheral wall 322 are both hollow cylindrical or hollow conical, that is, referring to fig. 1, the longitudinal section connecting the first gap P1 and the second gap P2 is substantially U-shaped, and the first cooling portion 10 is formed in the first gap P1 and the second gap P2, so that the overlapping area of the first cooling portion 10 and the first accommodating cavity S1 can be increased, and the cooling effect can be further improved.

Of course, in other embodiments, the outer bottom wall 311 and the first bottom wall 321 may be of an integral structure, i.e., the first gap P1 is not present.

In the present embodiment, a gap is present between the outer surface of the second cooling portion 20 and each of the first bottom wall 321 and the first peripheral wall 322.

That is, the second cooling portion 20 is substantially located above the first bottom wall 321, a gap is formed between the lower portion of the second cooling portion 20 and the first bottom wall 321, and the first peripheral wall 322 is disposed around the second cooling portion 20, so that the longitudinal section of the first accommodating cavity S1 is U-shaped, and the liquid to be cooled located in the first accommodating cavity S1 is fully contacted with the first cooling portion 10 (or the first inner wall 32) and the second cooling portion 20, thereby further improving the cooling effect.

In the present embodiment, the cooling device 100 further includes a lid 40 engaged with the cup 30, and the lid 40 may be engaged with the cup 30 in a sealing manner, for example, a seal ring or the like may be provided between the lid 40 and the cup 30.

Note that the cooling device 100 of the present embodiment may be a separate device, and the first cooling unit 10 and the second cooling unit 20 may be integrated into the cooling device 100, or the first cooling unit 10 and the second cooling unit 20 may be provided separately from the cooling device 100, and the first cooling unit 10 and the second cooling unit 20 may be mounted on the cooling device 100 as needed.

The cooling device 100 can be used with a refrigerator or other refrigeration equipment, and in practical operation, the cooling device 100 with the first cooling portion 10 and the second cooling portion 20 can be used with a refrigerator to refrigerate, so that the first cooling portion 10 and the second cooling portion 20 can store enough cold, and then the cooling device 100 can be used independently, for example, the cooling device 100 is used for outdoor cooling of hot drinks, medicine storage, and the like.

Here, because the first cooling portion 10 and the second cooling portion 20 can store sufficient cooling capacity, the cooling time of the cooling device 100 can be prolonged, and the first cooling portion 10 and the second cooling portion 20 can sufficiently cool the liquid to be cooled, the cooling effect is better, the cooling device 100 of the present embodiment has a simple structure, is convenient to use, and has good user experience.

Next, a plurality of specific embodiments of the cooling device 100 will be described.

In the first embodiment, referring to fig. 1, the first cooling portion 10 is a first cooling medium circuit 10, the second cooling portion 20 is a semiconductor cooling portion 20, the first cooling medium circuit 10 is formed between the outer wall 31 and the first inner wall 32, the semiconductor cooling portion 20 is located in a cavity S defined by the first inner wall 32, and a first accommodating cavity S1 is formed between the first inner wall 32 and the semiconductor cooling portion 20.

Here, the first refrigerant circuit 10 may be filled with a refrigerant, for example, a liquid having a high specific heat capacity, a phase change material, or the like, the first refrigerant circuit 10 may store refrigeration energy by a state change of the refrigerant, the refrigerant may be stored in the first refrigerant circuit 10 in a sealed manner, or the refrigerant may be circulated in the first refrigerant circuit 10 by connecting the first refrigerant circuit 10, or the like.

The semiconductor cooling part 20 may be a thermal superconducting alloy, etc., and the semiconductor cooling part 20 may directly absorb and store cold in the refrigerator for subsequent refrigeration.

In the present embodiment, the semiconductor cooling portion 20 has a solid bar structure, and the semiconductor cooling portion 20 is connected to the cover 40, where the semiconductor cooling portion 20 is connected to the central portion of the cover 40.

The semiconductor connecting portion 20 may be integrally formed with the cover 40, or the semiconductor connecting portion 20 may be assembled with the cover 40, depending on the actual situation.

In addition, there is no limitation to one semiconductor bonding portion 20, and a plurality of semiconductor bonding portions 20 may be disposed under the cover 40, and when the cover 40 is fitted to the cup 30, the first receiving cavity S1 may be formed between the semiconductor bonding portions 20 and the first inner wall 32.

During practical use, the cup body 30 and the cover body 40 can be placed in a refrigerator together for refrigeration, the first refrigerant loop 10 stores cold energy through a refrigerant, the semiconductor connecting portion 20 directly stores the cold energy, then, when liquid needs to be cooled, the cover body 40 and the semiconductor connecting portion 20 are taken down, the liquid to be cooled is placed in the cavity S, the cover body 40 is covered, the semiconductor connecting portion 20 just extends into the liquid to be cooled, and the first refrigerant loop 10 and the semiconductor connecting portion 20 cool the liquid to be cooled together.

Referring to fig. 2, which is a schematic diagram of a second embodiment, for convenience of description, like structures are numbered similarly.

In the present embodiment, the first cooling portion 10a is a first refrigerant circuit 10a, and the second cooling portion 20a is a second refrigerant circuit 20 a.

The cup 30a sequentially includes an outer wall 31a, a first inner wall 32a and a second inner wall 33a from outside to inside, the second inner wall 33a is far away from the outer wall 31a relative to the first inner wall 32a, a first refrigerant loop 10a is formed between the outer wall 31a and the first inner wall 32a, a first accommodating cavity S1 is formed between the first inner wall 32a and the second inner wall 33a, and the second inner wall 33a is surrounded to form a second refrigerant loop 20 a.

Here, a first accommodating cavity S1 with a U-shaped longitudinal section is formed between the second inner wall 33a and the first inner wall 32a, and a space surrounded by the second inner wall 33a is completely filled with a refrigerant to form the second refrigerant circuit 20 a.

It should be noted that the refrigerants in the first refrigerant circuit 10a and the second refrigerant circuit 20a may be the same or different materials, and may be determined according to actual situations.

In addition, in the present embodiment, the cover 40a is detachably disposed above the cup 30a, and a portion of the cover 40a corresponding to the first receiving cavity S1 may be formed with a relief portion 41a, so as to prevent the liquid to be cooled from flowing out of the cooling device 100a during the cooling process.

In practical use, the cup body 30a and the cover body 40a may be placed in a refrigerator together for refrigeration, the first refrigerant circuit 10a and the second refrigerant circuit 20a store cold energy through refrigerant, and then, when liquid is to be cooled, the cover body 40 is removed, the liquid to be cooled is placed in the first accommodating cavity S1, the cover body 40a is covered, and the liquid to be cooled is cooled by the first refrigerant circuit 10a and the second refrigerant circuit 20a together, which can be understood that the cooling operation may be performed without covering the cover body 40 a.

Referring to fig. 3, a schematic diagram of a third embodiment is shown, where the third embodiment differs from the second embodiment in that: the cup 30b further includes a third inner wall 34b, the third inner wall 34b is far away from the outer wall 31b relative to the second inner wall 33b, a second refrigerant loop 20b is formed between the second inner wall 33b and the third inner wall 34b, the third inner wall 34b encloses to form a second containing cavity S2, and the second containing cavity S2 is communicated with the first containing cavity S1.

Here, the first receiving cavity S1 and the second receiving cavity S2 may be communicated through a through hole penetrating through the second refrigerant circuit 20b, and both the first receiving cavity S1 and the second receiving cavity S2 may receive liquid to be cooled, but of course, the first receiving cavity S1 and the second receiving cavity S2 may be spaced apart from each other, so as to be adapted to different substances to be cooled.

In summary, in the cooling device of the present invention, the first cooling part 10 and the second cooling part 20 simultaneously cool the liquid to be cooled in the first accommodating chamber S1, so that no additive is required, and the cooling effect is greatly improved.

In addition, because the first cooling portion 10 and the second cooling portion 20 can store sufficient cooling capacity, the cooling time of the cooling device 100 can be prolonged, and the first cooling portion 10 and the second cooling portion 20 can sufficiently cool the liquid to be cooled, the cooling effect is better, the cooling device 100 of the embodiment has a simple structure, is convenient to use, and has good user experience.

Although the present invention has been described in detail with reference to the preferred embodiments, for example, if the techniques in different embodiments can be used in a superposition manner to achieve the corresponding effects, the embodiments are also within the protection scope of the present invention. It will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the invention.

Claims

1. The cooling device is characterized by comprising a first cooling part, a second cooling part and a first accommodating cavity arranged between the first cooling part and the second cooling part in a clamping mode, wherein the first cooling part is arranged around the second cooling part, and the first cooling part and the second cooling part are distributed at intervals.

2. The cooling device according to claim 1, wherein the cooling device comprises a cup body, the cup body comprises an outer wall and a first inner wall from outside to inside, the first cooling portion is formed between the outer wall and the first inner wall, the second cooling portion is located in a cavity defined by the first inner wall, and the first accommodating cavity is formed between the first inner wall and the second cooling portion.

3. The cooling apparatus of claim 2, further comprising a lid engaged with the cup.

4. The cooling device as claimed in claim 2, wherein the outer wall includes an outer bottom wall and an outer peripheral wall disposed around the outer bottom wall, the first inner wall includes a first bottom wall and a first peripheral wall disposed around the first bottom wall, a first gap is provided between the outer bottom wall and the first bottom wall, a second gap is provided between the outer peripheral wall and the first peripheral wall, and the first gap is connected to the second gap.

5. The cooling device according to claim 4, wherein a gap is present between an outer surface of the second cooling portion and each of the first bottom wall and the first peripheral wall.

6. The cooling apparatus as claimed in any one of claims 2 to 5, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a semiconductor cooling portion.

7. The cooling apparatus as claimed in claim 6, further comprising a cover body engaged with the cup body, the semiconductor cooling portion being connected to the cover body.

8. The cooling device as claimed in any one of claims 2 to 5, wherein the first cooling portion is a first refrigerant circuit, and the second cooling portion is a second refrigerant circuit.

9. The cooling device as claimed in claim 8, wherein the cup further includes a second inner wall, the second inner wall is far away from the outer wall relative to the first inner wall, the first receiving cavity is formed between the first inner wall and the second inner wall, and the second inner wall encloses the second refrigerant loop.

10. The cooling device as claimed in claim 9, wherein the cup further includes a third inner wall, the third inner wall is far away from the outer wall relative to the second inner wall, the second refrigerant loop is formed between the second inner wall and the third inner wall, the third inner wall encloses a second accommodating cavity, and the second accommodating cavity is communicated with the first accommodating cavity.