WO2021103975A1 - 一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备 - Google Patents

一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备 Download PDF

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Publication number
WO2021103975A1
WO2021103975A1 PCT/CN2020/126768 CN2020126768W WO2021103975A1 WO 2021103975 A1 WO2021103975 A1 WO 2021103975A1 CN 2020126768 W CN2020126768 W CN 2020126768W WO 2021103975 A1 WO2021103975 A1 WO 2021103975A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
cover
shielding
opening
Prior art date
Application number
PCT/CN2020/126768
Other languages
English (en)
French (fr)
Inventor
于唤唤
丁东庆
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to US17/780,896 priority Critical patent/US20230019918A1/en
Priority to EP20891510.8A priority patent/EP4048042A4/en
Publication of WO2021103975A1 publication Critical patent/WO2021103975A1/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0033—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids disposed on both PCB faces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Definitions

  • This application relates to the technical field of shielding equipment, and in particular to a shielding cover, a shielding cover, an equipped printed circuit board, and electronic equipment.
  • a shielding cover is often placed on the device to block the interference path between the interfering device and the interfered device, thereby realizing the protection and shielding effect of the device.
  • the commonly used shielding cover generally consists of a shielding frame and a shielding cover provided on the shielding frame.
  • PCBA printed circuit board assembly
  • PCBA includes PCB (printed circuit board, printed circuit board) and devices arranged on the PCB.
  • the shielding cover covers the devices arranged on the PCB and is welded to the PCB. It is understandable that in order to avoid affecting the performance of the components on the PCB, the shielding cover usually has to avoid all the components on the PCB. In this way, the component with the largest height protruding from the PCB surface determines the distance between the shielding cover and the PCB.
  • the spacing determines the overall thickness of the PCBA, which is not conducive to the realization of the thinning design of the entire electronic device.
  • the technical solution of the present application provides a shielding cover, a shielding cover, an equipped printed circuit board, and electronic equipment, so as to comply with the development trend of the thin and light design of electronic equipment.
  • the technical solution of the present application provides a shielding cover, which can be used in an electronic device to shield and protect the components in the electronic device.
  • the shielding cover includes a cover body and an FPC arranged on the cover body, wherein a first opening is opened on the end surface of the cover body.
  • the FPC can be fixed to the outside of the end surface of the cover body by welding or bonding, and acts as a countermeasure. The blocking effect of the first opening.
  • the FPC when the FPC is specifically provided, the FPC includes a substrate layer and a metal plating layer provided on the substrate layer.
  • the material of the substrate layer can be plastic or resin, and its thickness can be 5 ⁇ m-50 ⁇ m; the metal plating layer plays a main shielding role, and can be selected as a copper plating layer, and its thickness can be 6 ⁇ m-36 ⁇ m.
  • a cover film may be provided on the metal plating layer, the cover film may be arranged around the opening, and the thickness of the cover film may be 15 ⁇ m to 45 ⁇ m.
  • the cover film has a plurality of grooves for exposing the metal plating layer, so that the solder used for soldering FPC can be accommodated in the groove, thereby facilitating the printing of FPC solder and improving the soldering of FPC quality.
  • the minimum wavelength of the signal emitted by the device in the electronic device can also be set to ⁇ .
  • the gap between two adjacent grooves can be set The spacing is not more than 1/20 ⁇ .
  • the technical solution of the present application also provides a shielding cover, which can be arranged on the device to be shielded.
  • the shielding cover includes a shielding frame, and the shielding cover according to the first aspect, wherein the shielding frame has a first end and a second end that are opposed to each other, the first end has a second opening, and the second end has a first end. Three openings, the device to be shielded can enter the shielding cavity of the shielding cover through the second opening of the first end.
  • the shielding cover When the shielding cover is arranged on the shielding frame, the shielding cover can be arranged on the second end of the shielding frame. At this time, the first opening and the third opening are arranged oppositely, the device to be shielded can pass through the third opening and the first opening in sequence, and there is a set distance between the device and the FPC to avoid affecting the performance of the device.
  • the shielding cover when the shielding cover is arranged on the device to be shielded, since the device can pass through the third opening and the first opening, it is possible to avoid the shielding frame from designing the part where the device penetrates the third opening and the first opening. This helps to reduce the distance between the first end and the second end of the shield frame.
  • the inner side wall of the shielding cover may be provided with a plurality of protrusions
  • the shielding frame is provided with a plurality of grooves, so that the shielding cover and the shielding frame can correspond one-to-one with the grooves through the protrusions
  • the snap connection realizes the detachable connection, thereby facilitating maintenance of the devices arranged in the shielding cavity of the shielding cover.
  • the first end of the shield frame is further provided with a support part, and the support part may extend into the inside of the shield frame.
  • the supporting part can be attached to the end surface of the cover body of the shielding cover, which is beneficial for realizing the effective support of the supporting part to the shielding cover, so as to improve the stability of the overall structure of the shielding cover.
  • an embodiment of the present application also provides a printed circuit board equipped with a printed circuit board, the printed circuit board equipped with a PCB, a device provided on the PCB, and the shield cover as described in the second aspect covering the device.
  • the device can pass through the third opening of the frame of the shielding cover and the first opening of the shielding cover, so as to avoid the shielding frame from designing the part where the device penetrates the third opening and the first opening to avoid The distance between the first end and the second end of the small shielding frame.
  • the thickness of the current FPC is small, so that the height of the shielding cover protruding from the PCB surface is small, which is beneficial to realize the realization of the printed circuit board. The overall thickness of the thinner design.
  • the embodiments of the present application also provide an electronic device, which includes a display screen, a middle frame, a rear case, and an equipment printed circuit board, wherein: the middle frame is used to carry the equipment printed circuit board and the display screen , The display screen and the equipment printed circuit board are located on both sides of the middle frame, and the rear shell is located on the side of the equipment printed circuit board away from the middle frame.
  • the design of the printed circuit board for the equipment of the embodiment of the present application can be realized, it can be beneficial to realize the design of the thinning of the whole electronic device.
  • the structural stability of the middle frame as the bearing structure is required to be high. At this time, the thickness of the middle frame cannot be designed to be too small. Therefore, the equipment printed circuit board can be thinned to meet the requirements of the middle frame. On the basis of the structural stability, avoid the increase of the thickness of the whole electronic equipment.
  • the equipment printed circuit board when the equipment printed circuit board is specifically set up, the equipment printed circuit board includes a PCB, a device arranged on the PCB, and a shielding cover arranged on the device, the shielding cover includes a shielding frame, and Shield cover.
  • the shielding cover is arranged on the shielding frame and includes a cover body and a flexible printed circuit board arranged on the cover body. The end surface of the cover body is provided with a first opening, and the flexible printed circuit board is fixed on the end surface of the cover body away from the shielding frame.
  • the shield frame is fixed to the printed circuit board, and one end of the shield frame away from the printed circuit board has a second opening; the second opening is arranged opposite to the first opening, and the device can pass through the second
  • the opening and the first opening have a set distance between the device and the flexible printed circuit board.
  • the shielding frame can avoid the design of the part where the device penetrates the second opening and the first opening, which is beneficial to reduce the height of the shielding frame.
  • the current FPC has a small thickness, which can make the shielding cover protrude from The height of the PCB surface is small, which facilitates the realization of a thinner design for the overall thickness of the equipment printed circuit board.
  • the FPC when the FPC is specifically provided, the FPC includes a substrate layer and a metal plating layer provided on the substrate layer.
  • the material of the substrate layer can be plastic or resin, and its thickness can be 5 ⁇ m-50 ⁇ m; the metal plating layer plays a main shielding role, and can be selected as a copper plating layer, and its thickness can be 6 ⁇ m-36 ⁇ m.
  • a cover film may be provided on the metal plating layer, the cover film may be arranged around the opening, and the thickness of the cover film may be 15 ⁇ m to 45 ⁇ m.
  • the cover film has a plurality of grooves for exposing the metal plating layer, so that the solder used for soldering FPC can be accommodated in the groove, thereby facilitating the printing of FPC solder and improving the soldering of FPC quality.
  • the minimum wavelength of the signal emitted by the device in the electronic device can also be set to ⁇ .
  • the gap between two adjacent grooves can be set The spacing is not more than 1/20 ⁇ .
  • the inner side wall of the shielding cover may be provided with a plurality of protrusions
  • the shielding frame is provided with a plurality of grooves, so that the shielding cover and the shielding frame can correspond one-to-one with the grooves through the protrusions
  • the snap connection realizes the detachable connection, thereby facilitating maintenance of the devices arranged in the shielding cavity of the shielding cover.
  • the first end of the shield frame is further provided with a support part, and the support part may extend into the inside of the shield frame.
  • the supporting part can be attached to the end surface of the cover body of the shielding cover, which is beneficial for realizing the effective support of the supporting part to the shielding cover, so as to improve the stability of the overall structure of the shielding cover.
  • the shielding cover can be arranged on the side facing the middle frame of the equipped printed circuit board.
  • a receiving groove can be provided on the middle frame to allow part or all of the shielding cover to be accommodated. It is placed in the accommodating slot to realize the fixation of the equipment printed circuit board.
  • a bracket may be provided between the equipment printed circuit board and the rear case, so that when the shield cover is arranged on the side of the equipment printed circuit board facing the rear case, the shield case can be fixed to the support.
  • an embodiment of the present application also provides a shielding cover, which has a cover body and an FPC provided on the cover body.
  • the cover has a shielding cavity that can accommodate devices.
  • One end of the cover is provided with an opening.
  • the device to be shielded can enter the shielding cavity through the end of the cover opposite to the opening.
  • the device can also pass through the opening, and There is a set distance between the FPC. Therefore, the shielding cover can avoid the design of avoiding the part where the device penetrates into the opening, so as to help reduce the height of the shielding cover along the penetration direction of the device.
  • the FPC When the FPC is specifically set up, the FPC can be soldered to the side of the opening away from the shielding cavity by soldering such as solder paste, so as to block the opening and realize the sealing and shielding of the shielding cover.
  • soldering such as solder paste
  • the shielding cover of the embodiment of the present application only includes a cover body and an FPC provided at the opening, so the structure of the shielding cover is relatively simple.
  • the FPC when the FPC is specifically provided, the FPC includes a substrate layer and a metal plating layer provided on the substrate layer.
  • the material of the substrate layer can be plastic or resin, and its thickness can be 5 ⁇ m-50 ⁇ m; the metal plating layer plays a main shielding role, and can be selected as a copper plating layer, and its thickness can be 6 ⁇ m-36 ⁇ m.
  • a cover film may be provided on the metal plating layer, the cover film may be arranged around the opening, and the thickness of the cover film may be 15 ⁇ m to 45 ⁇ m.
  • the cover film has a plurality of grooves for exposing the metal plating layer, so that the solder used for soldering FPC can be accommodated in the groove, thereby facilitating the printing of FPC solder and improving the soldering of FPC quality.
  • the minimum wavelength of the signal emitted by the device in the electronic device can also be set to ⁇ .
  • the gap between two adjacent grooves can be set The spacing is not more than 1/20 ⁇ .
  • the embodiments of the present application also provide an equipped printed circuit board, the equipped printed circuit board including a PCB, a device arranged on the PCB, and the shielding cover according to the fifth aspect covering the device, wherein:
  • the device can also pass through the opening and have a set distance from the FPC. Therefore, the shielding cover can avoid the design of avoiding the part where the device penetrates into the opening, so as to help reduce the height of the shielding cover along the penetration direction of the device.
  • the thickness of the current FPC is small, so that the height of the shielding cover protruding from the surface of the PCB is small, thereby facilitating the realization of a thinner design for the overall thickness of the equipment printed circuit board.
  • an embodiment of the present application also provides an electronic device, which includes a display screen, a middle frame, a rear case, and the equipment printed circuit board according to the sixth aspect, wherein: the middle frame is used to carry Equipped with a printed circuit board and a display screen, the display screen and the equipped printed circuit board are located on both sides of the middle frame, and the rear shell is located on the side of the equipment printed circuit board away from the middle frame.
  • the design of the printed circuit board for the equipment of the embodiment of the present application can be realized, it can be beneficial to realize the design of the thinning of the whole electronic device.
  • the structural stability of the middle frame as the bearing structure is required to be high. At this time, the thickness of the middle frame cannot be designed to be too small. Therefore, the equipment printed circuit board can be thinned to meet the requirements of the middle frame. On the basis of the structural stability, avoid the increase of the thickness of the whole electronic equipment.
  • FIG. 1 is a schematic diagram of the structure of an electronic device provided by an embodiment of the application.
  • FIG. 2 is a schematic structural diagram of an electronic device provided by another embodiment of this application.
  • FIG. 3 is a schematic diagram of the structure of a PCBA provided by an embodiment of the application.
  • FIG. 4 is a schematic structural diagram of a shielding cover provided by an embodiment of the application.
  • FIG. 5 is a schematic structural diagram of a shielding frame provided by an embodiment of the application.
  • Fig. 6 is a schematic structural diagram of an FPC provided by an embodiment of the application.
  • Figure 7 is a B-B cross-sectional view in Figure 6;
  • FIG. 8 is a schematic diagram of the processing process of the shielding cover provided by an embodiment of the application.
  • FIG. 9 is a schematic diagram of the structure of a PCBA provided by an embodiment of the application.
  • FIG. 10 is a schematic diagram of a PCBA structure provided by another embodiment of the application.
  • FIG. 11 is a schematic structural diagram of a shielding cover provided by another embodiment of the application.
  • FIG. 12 is a schematic structural diagram of a PCBA provided by another embodiment of the application.
  • FIG. 13 is a schematic diagram of the structure of a PCBA provided by another embodiment of the application.
  • the shielding cover can be installed in mobile phones, tablet computers, wearable devices, and personal digital assistants (PDAs). ) And other electronic equipment to protect and shield the devices in the electronic equipment.
  • PDAs personal digital assistants
  • Fig. 1 provides a schematic structural diagram of an electronic device.
  • the electronic equipment can usually include a display screen 01, a middle frame 02, a rear case 03, and a PCBA 04 (printed circuit board assembly).
  • the middle frame 02 can be used to carry the PCBA 04 and the display 01, displaying
  • the screen 01 and the PCBA 04 are located on both sides of the middle frame 02, and the rear case 03 is located on the side of the PCBA 04 away from the middle frame 02.
  • the PCBA 04 When the PCBA 04 is specifically set, the PCBA 04 includes a PCB (printed circuit board, printed circuit board) and a device provided on the PCB. Wherein, the device can be arranged on the side of the PCB facing the display screen, and the device can also be arranged on the side of the PCB facing the rear case.
  • the PCBA 04 also includes a shielding cover arranged on the device to avoid signal interference between the device on the PCBA 04 and other devices in the electronic equipment, thereby protecting and shielding the device.
  • the part of the shielding cover provided on the side of the PCB facing the middle frame can be embedded in the middle frame 02.
  • a bracket is also provided between the PCBA 04 and the rear shell 03, so that the shielding cover provided on the side of the PCB facing the rear shell 03 can be fixed to the bracket, thereby realizing the fixing of the PCBA 04.
  • the electronic device may also include a battery 05.
  • the battery 05 may be disposed between the middle frame 02 and the rear case 03.
  • the battery 05 may also be arranged between the PCBA 04 and the rear case 03.
  • Fig. 3 shows a way of setting the shielding cover 1 that is often used for PCBA in electronic equipment.
  • PCBA includes a PCB 3, a device 2 arranged on the PCB 3, and a shielding cover 1 arranged on the device 2.
  • the shielding cover 1 includes a shielding frame 11 and a shielding cover 12 covering the shielding frame 11.
  • the shielding cover 12 is an integral structure.
  • the shielding cover 1 formed by the shielding cover 12 and the shielding frame 11 has a shielding cavity for accommodating the device 2.
  • the maximum height of the device 2 protruding from the PCB 3 is set to d1, the minimum distance between the device 2 and the shielding cover 12 is d2, and the thickness of the shielding cover 12 is d3 .
  • the maximum height d1 of the device 2 protruding from the PCB 3 is constant, those skilled in the art can reduce the minimum distance d2 between the device 2 and the shielding cover 12 and the thickness d3 of the shielding cover 12 to reduce the PCBA. Thin design.
  • the minimum distance d2 between the device 2 and the shield cover 12 is usually 0.05 mm.
  • the minimum distance between the device 2 and the shield cover 12 is difficult to reduce.
  • the thickness of the shielding cover 12 of an integrally formed structure should not be too thin, usually 0.1 mm.
  • the shielding cover 10 provided by an embodiment of the present application includes a shielding frame 101 and a shielding cover 102.
  • the shielding cover 102 is disposed on the shielding frame 101. It can be understood that the shielding frame 101 and the shielding cover The opposite end of 102 allows the device to be shielded to enter the shielding cavity of the shielding cover 10.
  • the shield frame 101 has an opening 1011 at one end for connecting with the shield cover 102.
  • the shield frame 101 may also be provided with a support portion 1012 that can support the shield cover 102. As shown in FIG.
  • the supporting portion 1012 extends toward the inside of the shielding cavity of the shielding cover 10, and its extending direction can be parallel to the end surface of the shielding cover 102, so that the supporting portion 1012 can be attached to the end surface of the shielding cover 102 to achieve The supporting portion 1012 effectively supports the shielding cover 102.
  • the shield frame 101 of the embodiment of the present application may be provided as an integral structure, and the extension length of the support portion 1012 may be represented by L1. In some possible embodiments, the shield frame 101 may also be a spliced structure.
  • the shielding cover 102 After the shielding cover 102 is placed on the shielding frame 101, the two need to be fixed.
  • a plurality of protrusions (Not shown in the figure)
  • grooves (not shown in the figure) corresponding to the protrusions are provided on the shield frame, so that the shield cover 102 and the shield frame 101 are locked by the protrusions and the grooves.
  • the connection method can effectively improve the convenience of fixing and disassembling the shielding cover 102 and the shielding frame 101.
  • the shielding cover 102 includes a cover body 1021. Referring to FIGS.
  • the cover body 1021 is provided with an opening 1021a, and the opening 1021a is arranged opposite to the opening 1011.
  • the shielding cover 102 further has an FPC 1022 corresponding to the opening 1021a, and the FPC 1022 can be soldered to the side of the cover body 1021 away from the shield frame 101 by solder 1023 such as solder paste.
  • FIG. 6 is a schematic structural diagram of an FPC 1022 according to an embodiment of the application
  • FIG. 7 is a cross-sectional view of FIG. 6 along B-B.
  • the FPC 1022 includes a substrate layer 1022a, and a metal plating layer 1022b disposed on the substrate layer 1022a.
  • the material of the base layer 1022a may be plastic, resin, etc., and the thickness may be 5 ⁇ m-50 ⁇ m.
  • the metal plating layer 1022b as the main shielding layer of the FPC 1022, can be selected as a copper plating layer.
  • the thickness of the metal plating layer can be 6 ⁇ m to 36 ⁇ m, so that the metal plating layer can have better shielding effect and smaller thickness. Based on this, the manufacturing cost of the FPC 1022 is well controlled. In summary, the thickness of the FPC 1022 of the embodiment of the present application may be less than 0.04 mm.
  • a cover film 1022c may also be provided on the metal plating layer 1022b.
  • the cover film 1022c may be disposed around the opening 1021a (refer to FIG. 5), and the thickness may be 15 ⁇ m to 45 ⁇ m.
  • the cover film 1022c has a plurality of grooves 1022d for exposing the metal plating layer 1022b, so that the solder used for soldering the FPC 1022 can be accommodated in the groove 1022d, thereby facilitating the printing of the solder of the FPC 1022. It is beneficial to improve the welding quality of FPC 1022.
  • the shielding cover in order to meet the shielding performance requirements of the shielding cover, set the minimum wavelength of the signal emitted by the device in the electronic device to ⁇ , then the gap L2 between two adjacent grooves 1022d on the FPC 1022 needs to be less than 1/20 ⁇ , so When the shielding cover is applied to electronic equipment, it can shield any device in the electronic equipment. At present, the maximum frequency of the signal of the device in the mobile phone and other electronic equipment is about 15 GHz. Therefore, in the mobile phone and other electronic equipment, the gap L2 between two adjacent grooves 1022d can be designed to be no greater than 1 mm. Therefore, the shielding cover formed by the shielding cover and the shielding frame provides an environment with good shielding performance for the device to reduce the risk of radiated spurious emission (RSE).
  • RSE radiated spurious emission
  • an opening 1021a can be opened on the end surface of the cover body 1021 of the shielding cover according to the position requirements of the opening 1021a; then, an FPC 1022 with an area much larger than the opening 1021a can be expanded Flat, and print solder paste in the groove 1022d of the FPC 1022; after that, the end surface of the cover body 1021 is soldered to the flat FPC in the direction shown in FIG. 8 through a surface mount technology (SMT) reflow oven 1022 on. Finally, the redundant FPC 1022 is cut to form the shielding cover of the embodiment of the present application.
  • SMT surface mount technology
  • the PCBA of the embodiment of the present application includes a PCB 30, a device 20 provided on the PCB 30, and a shielding cover 10 is provided on the device 20 to shield and protect the device 20.
  • the PCB 30 includes a first surface 301 and a second surface 302.
  • the device 20 can be arranged on the first surface 301 or the second surface 302. When there are multiple devices 20, it can also be arranged according to the specific requirements of the PCBA. , A plurality of devices 20 are separately arranged on the first surface 301 and the second surface 302.
  • the shielding cover 10 When the shielding cover 10 is specifically set up, since no matter which side of the PCB 30 the device 20 is set on, the setting method of the shielding cover 10 set on the device 20 can be the same. Therefore, in the embodiment of the present application, first set it on the PCB 30
  • the shielding frame 101 of the shielding cover 10 is arranged on the peripheral side of the device 20 to be shielded, the opening 1011 on the shielding frame 101 and the opening 1021a on the shielding cover 102 can allow the device 20 to pass through to protect the device 20, or The other structures provided on the device 20 avoid it.
  • One end of the shield frame 101 close to the PCB 30 is fixed to the first surface 301 of the PCB 30, and the fixing method may be welding or bonding.
  • the shielding cover 10 as a way of assembling the shielding frame 101 and the shielding cover 102, when the device 20 needs maintenance, the shielding frame 101 can be directly connected to the PCB 30 without damaging the connection relationship between the shielding frame 101 and the PCB 30.
  • the cover 10 can be removed, and its operation is relatively simple.
  • the maximum height of the device 20 protruding from the PCB 30 that can be set on the first side 301 of the PCB 30 is d11
  • the minimum distance between the device 20 and the FPC 1022 of the shielding cover 102 is d22.
  • the thickness of 1022 is d33.
  • the thickness d33 of the FPC 1022 of the embodiment of the present application may be less than 0.04mm, which is much smaller than the thickness d3 (0.1mm) of the shielding cover 12 in FIG.
  • the minimum distance d22 between 1022 can also be set to 0.05mm. In this way, when the maximum height d11 of the device 20 protruding from the PCB 30 is constant, the solution of the embodiment of the present application can effectively reduce the protrusion of the shielding cover 10. Due to the height of the first side 301 of the PCB 30, it is beneficial to realize the thinning design of the PCBA.
  • the shielding cover 10 needs to avoid multiple devices 20 (or structures disposed on the devices 20). At this time, it is necessary to place the shielding cover 102 at the corresponding positions of the cover body 1021 respectively.
  • An opening 1021a is opened, and an FPC 1022 is arranged at a position corresponding to each opening 1021a to realize the sealing of each opening 1021a.
  • the shielding cover 10 on the second surface 302 of the PCB 30 can be set with reference to the first surface 301, which will not be repeated here.
  • a shielding cover 100 is also provided.
  • the shielding cover 100 includes a cover body 1001 with an integrated structure, and the cover body 1001 has a shielding cavity capable of accommodating devices.
  • the end surface of one end of the cover 1001 is provided with an opening 1001a. It can be understood that the device to be shielded can enter the shielding cavity through the end of the cover 1001 opposite to the opening 1001a.
  • an FPC 1002 corresponding to the opening 1001a needs to be provided on the cover 1001.
  • the FPC 1002 can be soldered to the side of the opening 1001a far away from the shielding cavity through solder 1003 such as solder paste.
  • solder 1003 such as solder paste.
  • the shielding cover 100 of the embodiment of the present application only includes a cover body 1001 and an FPC 1002 provided at the opening 1001a, so the structure of the shielding cover 100 is relatively simple.
  • the FPC 1002 includes a substrate layer, and a metal plating layer disposed on the substrate layer.
  • the material of the substrate layer can be plastic, resin, etc., and the thickness can be 5 ⁇ m-50 ⁇ m.
  • the metal plating layer can be selected as a copper plating layer.
  • the thickness of the metal plating layer can be 6 ⁇ m to 36 ⁇ m, so that the metal plating layer can have a better shielding effect and a smaller thickness.
  • the manufacturing cost of the FPC 1002 is well controlled.
  • the thickness of the FPC 1002 of the embodiment of the present application may be less than 0.04 mm.
  • a cover film may be provided on the metal plating layer, the cover film may be arranged around the opening, and the thickness of the cover film may be 15 ⁇ m to 45 ⁇ m.
  • the cover film has a plurality of grooves for exposing the metal plating layer, so that the solder used for soldering FPC 1002 can be accommodated in the groove, thereby facilitating the printing of the solder of FPC 1002 and improving the FPC 1002 welding quality.
  • the minimum wavelength of the signal in the electronic device is set to ⁇ , and the gap between two adjacent grooves on the FPC 1002 needs to be less than 1/20 ⁇ .
  • the maximum frequency of signals in electronic devices such as mobile phones is about 15 GHz. Therefore, in this application, the gap between two adjacent grooves can be designed to be no greater than 1 mm. Therefore, the shielding cover formed by the shielding cover and the shielding frame provides an environment with good shielding performance for the device to reduce the risk of radiated spurious emission (RSE).
  • RSE radiated spurious emission
  • the shielding cover 100 of this embodiment of the present application can be applied to protect the device 200 of the PCBA.
  • the PCBA of this embodiment of the present application includes a PCB 300, a device 200 provided on the PCB 300, and a shielding cover 100 provided on the device 200.
  • the PCB 300 includes a first surface 3001 and a second surface 3002.
  • the device 200 can be arranged on the first surface 3001 or the second surface 3002. When there are multiple devices 200, it can also be arranged according to the specific requirements of the PCBA. , The multiple devices 200 are separately arranged on the first surface 3001 and the second surface 3002.
  • the shielding cover 100 When the shielding cover 100 is specifically set up, since no matter which side of the PCB 300 the device 200 is set on, the setting method of the shielding cover 100 set on the device 200 can be the same. Therefore, in the embodiment of the present application, first set it on the PCB 300
  • the cover 1001 of the shielding cover 100 is disposed on the device 200 to be shielded, and its end close to the PCB 300 can be fixed to the first surface 3001 of the PCB 300 by welding or the like.
  • the opening 1001 a of the cover body 1001 of the shielding cover 100 can avoid the device 200 or other structures provided on the device 200.
  • the maximum height of the device 200 protruding from the PCB 300 that can be set on the first side 3001 of the PCB 300 is d111
  • the minimum distance between the device 200 and the FPC 1002 is d222
  • the thickness of the FPC 1002 is d333.
  • the thickness d333 of the FPC 1002 of the embodiment of the present application may be less than 0.04mm, which is much smaller than the thickness d3 (0.1mm) of the shielding cover 12 in FIG.
  • the minimum distance d222 between 1002 can also be set to 0.05mm.
  • the solution of the embodiment of the present application can effectively reduce the protrusion of the shielding cover 100. Due to the height of the surface of the PCB 300, it is beneficial to realize the thinning design of the PCBA. In addition, the shielding cover 100 can be directly covered on the device 200 to be shielded when in use, and then fixed to the PCB 300, and the operation is relatively simple.
  • the shielding cover on the second side 3002 of the PCB 300 can be set with reference to the first side 3001, which will not be repeated here.
  • an embodiment of the present application also provides a PCBA.
  • the PCBA includes a PCB 300, a device 200 arranged on the PCB 300, and a shielding cover 100 arranged on the device 200.
  • the PCB 300 includes a first surface 3001 and a second surface 3002, a device 200 arranged on the first surface 3001, a device 20 arranged on the second surface 3002, a shielding cover 100 arranged on the device 200, and a device 200 arranged on the device 20 of the shielding cover 10.
  • the shielding cover 100 When the shielding cover 100 is specifically set up, the shielding cover 100 includes an integrated cover body 1001, which is arranged on the device 200 to be shielded, and its end close to the PCB 300 can be fixed to the first part of the PCB 300 by welding or the like. 3001 on one side.
  • the end surface of the cover 1001 far away from the PCB 300 is provided with an opening 1001a for the device 200 to pass through.
  • the opening 1001a can avoid the device 200 or other structures provided on the device 200.
  • an FPC 1002 corresponding to the opening 1001a needs to be provided on the cover 1001.
  • the FPC 1002 can be soldered to the cover 1001 of the shielding cover 100 away from the PCB 300 by soldering such as solder paste.
  • soldering such as solder paste.
  • the shielding cover 100 only includes a cover body 1001 and an FPC 1002 disposed at the opening 1001a on the end surface, the structure of the shielding cover 100 is relatively simple.
  • the shielding cover 100 can be directly arranged on the device 200 to be shielded when in use, and then fixed to the PCB 300, and the operation is relatively simple.
  • the shielding cover 10 When specifically setting the shielding cover 10, the shielding cover 10 includes a shielding frame 101 and a shielding cover 102, wherein the shielding frame 101 is arranged on the peripheral side of the device 20 to be shielded, and the end of the shielding frame 101 close to the PCB 300 can be fixed by welding or the like. On the second side 3002 of the PCB 300.
  • the shield frame 101 has an opening 1011 at one end away from the PCB 300 for the device 20 to pass through, and the opening 1011 can avoid the device 20 or other structures provided on the device 20.
  • the shielding cover 102 of the shielding cover 10 can be disposed on the shielding frame 101 and fixedly connected to the end of the shielding frame 101 away from the PCB 300.
  • the connection method can be but not limited to welding.
  • the shielding cover 102 includes a cover body 1021, the cover body 1021 is provided with an opening 1021 a, and the opening 1021 a is disposed opposite to the opening 1011.
  • the shielding cover 102 also has an FPC 1022 corresponding to the opening 1021a, and the FPC 1022 can be soldered to the side of the cover body 1021 away from the PCB 300 by soldering such as solder paste to block the opening 1021a.
  • the shielding cover 10 By setting the shielding cover 10 as a separate form in which the shielding frame 101 and the shielding cover 102 are assembled, when the device 20 needs maintenance, the shielding frame 101 and the PCB 300 can be directly connected without destroying the connection relationship between the shielding frame 101 and the PCB 300.
  • the cover 102 is removed and the operation is relatively simple.

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Abstract

本申请提供了一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备。涉及屏蔽设备技术领域。该屏蔽盖可用于电子设备中，以起到对电子设备中的器件的屏蔽以及保护的作用。屏蔽盖包括盖本体，以及设置于盖本体的柔性印刷电路板，其中，在盖本体的端面上开设有第一开口，柔性印刷电路板可通过焊接或者粘接等方式固定于盖本体的端面的外侧，并起到对第一开口的封堵作用。

Description

一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备
相关申请的交叉引用
本申请要求在2019年11月30日提交中国专利局、申请号为201911208185.4、申请名称为“一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及到屏蔽设备技术领域，尤其涉及到一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备。
背景技术
在电子设备中，经常会在器件上罩设一屏蔽罩，来阻断干扰器件和被干扰器件之间的干扰路径，从而实现对器件的保护和屏蔽作用。
目前，常用的屏蔽罩一般由屏蔽框，以及盖设于屏蔽框上的屏蔽盖组成。以PCBA(printed circuit board assembly，装备印刷电路板)为例，PCBA包括PCB(printed circuit board，印刷电路板)，以及设置于PCB上的器件。屏蔽罩罩设于PCB上的器件，且与PCB焊接。可以理解的是，为了避免影响PCB上的器件的性能，屏蔽罩通常要对PCB上的所有器件进行避让设置，这样，凸出于PCB表面的高度最大的器件决定了屏蔽盖与PCB之间的间距，从而决定了PCBA的整体厚度，而这不利于实现电子设备的整机的减薄设计。
发明内容
本申请技术方案提供了一种屏蔽盖、屏蔽罩、装备印刷电路板及电子设备，以顺应电子设备轻薄化设计的发展趋势。
第一方面，本申请技术方案提供了一种屏蔽盖，该屏蔽盖可用于电子设备中，以起到对电子设备中的器件的屏蔽以及保护的作用。屏蔽盖包括盖本体，以及设置于盖本体的FPC，其中，在盖本体的端面上开设有第一开口，FPC可通过焊接或者粘接等方式固定于盖本体的端面的外侧，并起到对第一开口的封堵作用。
在本申请的一个可能的实施例中，具体设置FPC时，FPC包括基材层，以及设置于基材层的金属镀层。其中，基材层的材质可以为塑料或者树脂等，其厚度可以为5μm～50μm；金属镀层起到主要的屏蔽作用，可以选为铜镀层，其厚度可以为6μm～36μm。
另外，还可以在金属镀层上设置覆盖膜，该覆盖膜可围绕开口设置，其厚度可以为15μm～45μm。另外，覆盖膜上具有多个用于使金属镀层露出的凹槽，这样，用于焊接FPC的焊料可以容置于该凹槽，从而便于实现FPC的焊料的印刷，以有利于提高FPC的焊接质量。
在本申请的一个可能的实施例中，还可以将电子设备中的器件发射的信号的最小波长设为λ，为了使该屏蔽盖能够满足屏蔽要求，可以使相邻两个凹槽之间的间距不大于1/20λ。
第二方面，本申请技术方案还提供了一种屏蔽罩，该屏蔽罩可罩设于待屏蔽的器件。 该屏蔽罩包括屏蔽框，以及如第一方面所述的屏蔽盖，其中屏蔽框具有相对设置的第一端部和第二端部，第一端部具有第二开口，第二端部具有第三开口，待屏蔽的器件可以通过第一端部的第二开口进入该屏蔽罩的屏蔽腔。
在将屏蔽盖设置于屏蔽框时，可使屏蔽盖盖设于屏蔽框的第二端部。此时，第一开口与第三开口相对设置，待屏蔽的器件可以依次穿过第三开口以及第一开口，且器件与FPC之间具有设定距离，以避免影响器件的性能。另外，在该屏蔽罩罩设于待屏蔽的器件时，由于器件可以穿过第三开口和第一开口，从而可避免屏蔽框对器件穿入第三开口和第一开口的部分做避让设计，以有利于减小屏蔽框的第一端部与第二端部之间距离。
在本申请的一个可能的实施例中，屏蔽盖的内侧壁可以设置有多个凸起，屏蔽框上设置有多个凹槽，这样屏蔽盖与屏蔽框可以通过凸起与凹槽一一对应卡接的方式实现可拆卸连接，从而便于对设置于该屏蔽罩的屏蔽腔内的器件进行维护。
在本申请的一个可能的实施例中，屏蔽框的第一端部还设置有支撑部，该支撑部可以向屏蔽框的内部延伸。另外，还可以使支撑部与屏蔽盖的盖本体的端面相贴合，这样有利于实现支撑部对屏蔽盖的有效支撑，以提高该屏蔽罩的整体结构的稳定性。
第三方面，本申请实施例还提供了一种装备印刷电路板，该装备印刷电路板包括PCB，设置于PCB的器件，以及罩设于器件的如第二方面所述的屏蔽罩。其中，器件可以穿过屏蔽罩的框体的第三开口，以及屏蔽盖的第一开口，这样可避免屏蔽框对器件穿入第三开口和第一开口的部分做避让设计，以有利于减小屏蔽框的第一端部与第二端部之间距离，另外，目前的FPC的厚度较小，这样可以使屏蔽罩凸出于PCB表面的高度较小，从而有利于实现装备印刷电路板的整体厚度的较薄设计。
第四方面，本申请实施例还提供了一种电子设备，该电子设备包括显示屏、中框、后壳，以及装备印刷电路板，其中：中框，用于承载装备印刷电路板和显示屏，显示屏和装备印刷电路板位于中框的两侧，后壳位于装备印刷电路板远离中框的一侧。在可实现本申请实施例的装备印刷电路板的设计的基础上，可有利于实现电子设备的整机的减薄的设计。另外，在一些场景下，对于作为承载结构的中框的结构稳定性要求较高，这时，中框的厚度不可设计的过小，因此对装备印刷电路板进行减薄，可在满足中框的结构稳定性的基础上，避免电子设备整机厚度的增加。
在本申请的一个可能的实施例中，在具体设置装备印刷电路板时，该装备印刷电路板包括PCB，设置于PCB的器件，以及罩设于器件的屏蔽罩，屏蔽罩包括屏蔽框，以及屏蔽盖。其中，屏蔽盖，盖设于屏蔽框，包括盖本体，以及设置于盖本体的柔性印刷电路板，盖本体的端面开设有第一开口，柔性印刷电路板固定于盖本体的端面的远离屏蔽框的一侧，且封堵第一开口；屏蔽框，固定于印刷电路板，屏蔽框远离印刷电路板的一端具有第二开口；第二开口与第一开口相对设置，器件可以依次穿过第二开口以及第一开口，且器件与柔性印刷电路板之间具有设定距离。这样可避免屏蔽框对器件穿入第二开口和第一开口的部分做避让设计，以有利于减小屏蔽框的高度，另外，目前的FPC的厚度较小，这样可以使屏蔽罩凸出于PCB表面的高度较小，从而有利于实现装备印刷电路板的整体厚度的较薄设计。
在本申请的一个可能的实施例中，具体设置FPC时，FPC包括基材层，以及设置于基材层的金属镀层。其中，基材层的材质可以为塑料或者树脂等，其厚度可以为5μm～50μm；金属镀层起到主要的屏蔽作用，可以选为铜镀层，其厚度可以为6μm～36μm。
另外，还可以在金属镀层上设置覆盖膜，该覆盖膜可围绕开口设置，其厚度可以为15μm～45μm。另外，覆盖膜上具有多个用于使金属镀层露出的凹槽，这样，用于焊接FPC的焊料可以容置于该凹槽，从而便于实现FPC的焊料的印刷，以有利于提高FPC的焊接质量。
在本申请的一个可能的实施例中，还可以将电子设备中的器件发射的信号的最小波长设为λ，为了使该屏蔽盖能够满足屏蔽要求，可以使相邻两个凹槽之间的间距不大于1/20λ。
在本申请的一个可能的实施例中，屏蔽盖的内侧壁可以设置有多个凸起，屏蔽框上设置有多个凹槽，这样屏蔽盖与屏蔽框可以通过凸起与凹槽一一对应卡接的方式实现可拆卸连接，从而便于对设置于该屏蔽罩的屏蔽腔内的器件进行维护。
在本申请的一个可能的实施例中，屏蔽框的第一端部还设置有支撑部，该支撑部可以向屏蔽框的内部延伸。另外，还可以使支撑部与屏蔽盖的盖本体的端面相贴合，这样有利于实现支撑部对屏蔽盖的有效支撑，以提高该屏蔽罩的整体结构的稳定性。
在本申请的一个可能的实施例中，屏蔽罩可以设置于装备印刷电路板的朝向中框的一侧，这时可以在中框上设置有容置槽，以使屏蔽罩的部分或全部容置于容置槽，从而实现装备印刷电路板的固定。
另外，还可以在装备印刷电路板与后壳之间设置有支架，这样当屏蔽罩设置于装备印刷电路板的朝向后壳的一侧时，屏蔽罩可以固定于支架。
第五方面，本申请实施例还提供了一种屏蔽罩，该屏蔽罩具有罩体，以及设置于罩体的FPC。该罩体具有可容置器件的屏蔽腔，罩体的一端的端面开设有开口，待屏蔽的器件可通过罩体的与开口相对的一端进入屏蔽腔，另外，器件还可以穿过开口，且与FPC之间具有设定距离。从而可避免屏蔽罩对器件穿入开口的部分做避让设计，以有利于减小屏蔽罩沿器件的穿入方向的高度。
在具体设置FPC时，FPC可通过锡膏等焊料焊接于开口的远离屏蔽腔的一侧，以实现对开口的封堵，以实现屏蔽罩的密封屏蔽。本申请实施例的屏蔽罩只包括罩体，以及设置于开口处的FPC，因此该屏蔽罩的结构较为简单。
在本申请的一个可能的实施例中，具体设置FPC时，FPC包括基材层，以及设置于基材层的金属镀层。其中，基材层的材质可以为塑料或者树脂等，其厚度可以为5μm～50μm；金属镀层起到主要的屏蔽作用，可以选为铜镀层，其厚度可以为6μm～36μm。
另外，还可以在金属镀层上设置覆盖膜，该覆盖膜可围绕开口设置，其厚度可以为15μm～45μm。另外，覆盖膜上具有多个用于使金属镀层露出的凹槽，这样，用于焊接FPC的焊料可以容置于该凹槽，从而便于实现FPC的焊料的印刷，以有利于提高FPC的焊接质量。
在本申请的一个可能的实施例中，还可以将电子设备中的器件发射的信号的最小波长设为λ，为了使该屏蔽盖能够满足屏蔽要求，可以使相邻两个凹槽之间的间距不大于1/20λ。
第六方面，本申请实施例还提供了一种装备印刷电路板，该装备印刷电路板包括PCB，设置于PCB的器件，以及罩设于器件的如第五方面所述的屏蔽罩，其中：器件还可以穿过开口，且与FPC之间具有设定距离。从而可避免屏蔽罩对器件穿入开口的部分做避让设计，以有利于减小屏蔽罩沿器件的穿入方向的高度。另外，目前的FPC的厚度较小，这样可以使屏蔽罩凸出于PCB表面的高度较小，从而有利于实现装备印刷电路板的整体厚度的较薄设计。
第七方面，本申请实施例还提供了一种电子设备，该电子设备包括显示屏、中框、后壳，以及如第六方面所述的装备印刷电路板，其中：中框，用于承载装备印刷电路板和显示屏，显示屏和装备印刷电路板位于中框的两侧，后壳位于装备印刷电路板远离中框的一侧。在可实现本申请实施例的装备印刷电路板的设计的基础上，可有利于实现电子设备的整机的减薄的设计。另外，在一些场景下，对于作为承载结构的中框的结构稳定性要求较高，这时，中框的厚度不可设计的过小，因此对装备印刷电路板进行减薄，可在满足中框的结构稳定性的基础上，避免电子设备整机厚度的增加。
附图说明
图1为本申请一实施例提供的电子设备的结构示意图；
图2为本申请另一实施例提供的电子设备的结构示意图；
图3为本申请一实施例提供的PCBA的结构示意图；
图4为本申请一实施例提供的屏蔽罩的结构示意图；
图5为本申请一实施例提供的屏蔽框的结构示意图；
图6为本申请一实施例提供的FPC的结构示意图；
图7为图6中的B-B剖视图；
图8为本申请一实施例提供的屏蔽盖的加工过程示意图；
图9为本申请一实施例提供的PCBA的结构示意图；
图10为本申请另一实施例提供的PCBA的结构示意图；
图11为本申请另一实施例提供的屏蔽罩的结构示意图；
图12为本申请另一实施例提供的PCBA的结构示意图；
图13为本申请另一实施例提供的PCBA的结构示意图。
具体实施方式
为了方便理解本申请实施例提供的屏蔽罩，下面首先说明一下本申请实施例提供的屏蔽罩的应用场景，该屏蔽罩可以设置于手机、平板电脑、穿戴设备、掌上电脑(personal digital assistant，PDA)等电子设备中，以起到对电子设备中的器件的保护及屏蔽作用。
参照图1，图1提供了一种电子设备的结构示意图。该电子设备通常可以包括显示屏01、中框02、后壳03，以及PCBA 04(printed circuit board assembly，装备印刷电路板)，其中，中框02可以用来承载PCBA 04和显示屏01，显示屏01和PCBA 04位于中框02的两侧，后壳03位于PCBA 04远离中框02的一侧。
在具体设置PCBA 04时，PCBA 04包括PCB(printed circuit board，印刷电路板)，以及设置于PCB的器件。其中，器件可设置于PCB的朝向显示屏的一侧，器件也可以设置于PCB的朝向后壳的一侧。PCBA 04还包括罩设于器件的屏蔽罩，以避免PCBA 04上的器件与电子设备中的其它器件之间产生信号干扰，从而起到对器件的保护以及屏蔽的作用。在将PCBA 04设置于电子设备中时，设置于PCB的朝向中框一侧的屏蔽罩的部分可以嵌入至中框02中。另外，在一些实施例中，PCBA 04与后壳03之间还设置有支架，这样设置于PCB的朝向后壳03一侧的屏蔽罩可以固定于支架，从而实现PCBA 04的固定。
除了上述结构外，电子设备还可以包括电池05，参照图1，电池05可以设置于中框 02与后壳03之间。或者参照图2，电池05还可以设置于PCBA 04与后壳03之间。
目前，为了顺应电子设备轻薄化设计的发展趋势，要求对电子设备中的各部件进行减薄设计。由于PCBA在电子设备中的体积占比较大，因此，对PCBA的减薄有利于实现电子设备整机的减薄。另外，在一些场景下，对于作为承载结构的中框的结构稳定性要求较高，这时，中框的厚度不可设计的过小，因此对PCBA进行减薄，可在满足中框的结构稳定性的基础上，避免电子设备整机厚度的增加。
参照图3，图3展示了一种电子设备中PCBA的常采用的屏蔽罩1的设置方式。其中，PCBA包括PCB 3、设置于PCB 3的器件2，以及罩设于器件2的屏蔽罩1。屏蔽罩1包括屏蔽框11，以及盖设于屏蔽框11的屏蔽盖12，该屏蔽盖12为一体成型结构，屏蔽盖12与屏蔽框11形成的屏蔽罩1具有容置器件2的屏蔽腔。其中，以图3中PCBA的A面为例，设定器件2凸出于PCB 3的最大高度为d1，该器件2与屏蔽盖12之间的最小间距为d2，屏蔽盖12的厚度为d3。据此，PCBA的A面的屏蔽罩1凸出于PCB 3的高度D可表达为D＝d1+d2+d3。在器件2凸出于PCB 3的最大高度d1一定的情况下，本领域技术人员可通过减小器件2与屏蔽盖12之间的最小间距d2，以及屏蔽盖12的厚度d3来实现PCBA的减薄设计。但是，目前器件2与屏蔽盖12之间的最小间距d2通常为0.05mm，为了不影响器件2的性能，器件2与屏蔽盖12之间的最小间距很难再缩小。另外，为了满足屏蔽盖12的结构稳定性的要求，一体成型结构的屏蔽盖12的厚度也不宜做的过薄，通常为0.1mm。为了解决上述问题，顺应电子设备薄型化设计的发展趋势，本申请实施例提供了一种屏蔽罩。为了便于对本申请的屏蔽罩进行了解，下面结合附图来说明该屏蔽罩的结构。
参照图4，本申请一个实施例提供的屏蔽罩10，该屏蔽罩10包括屏蔽框101和屏蔽盖102，屏蔽盖102盖设于屏蔽框101，可以理解的是，屏蔽框101的与屏蔽盖102相对的一端可供待屏蔽的器件进入屏蔽罩10的屏蔽腔。其中，屏蔽框101用于与屏蔽盖102相连接的一端具有开口1011，另外，屏蔽框101还可以设置有支撑部1012，该支撑部1012可起到对屏蔽盖102的支撑作用。如图4所示，该支撑部1012朝向屏蔽罩10的屏蔽腔内部延伸，其延伸方向可以与屏蔽盖102的端面平行，这样可以使支撑部1012与屏蔽盖102的端面相贴合，以实现支撑部1012对屏蔽盖102的有效支撑。其中，本申请实施例的屏蔽框101可为一体结构设置，支撑部1012的延伸长度可用L1表示。而在一些可能的实施例中，屏蔽框101还可以为拼接结构。
继续参照图4，屏蔽盖102在盖设于屏蔽框101之后，需要将二者进行固定，其固定方式可以有多种，例如可以在屏蔽盖102的内侧壁的周侧设置多个凸起(图中未示出)，同时在屏蔽框上设置与该多个凸起一一对应的凹槽(图中未示出)，从而使屏蔽盖102与屏蔽框101通过凸起与凹槽相卡接的方式进行固定，该连接方式可以有效的提高屏蔽盖102与屏蔽框101的固定以及拆卸的便利性。在具体设置屏蔽盖102时，屏蔽盖102包括盖本体1021，一并参照图4和图5，盖本体1021上开设有开口1021a，该开口1021a与开口1011相对设置。另外，参照图4，屏蔽盖102还具有与开口1021a对应设置的FPC 1022，该FPC 1022可通过锡膏等焊料1023焊接于盖本体1021远离屏蔽框101的一侧。
在具体设置FPC 1022时，一并参照图6和图7，图6为本申请一个实施例的FPC 1022的结构示意图，图7为图6的B-B剖视图。从图7中可以看出，该FPC 1022包括基材层1022a，设置于基材层1022a的金属镀层1022b。其中，基材层1022a的材质可以为塑料、树脂等，其厚度可以为5μm～50μm。金属镀层1022b作为FPC 1022的主要起屏蔽作用的屏 蔽层，可以选择为铜镀层，该金属镀层的厚度可以为6μm～36μm，这样可使金属镀层在具有较好的屏蔽作用以及较小的厚度的基础上，很好的控制该FPC 1022的制造成本。综上，本申请实施例的FPC 1022的厚度可小于0.04mm。
参照图6，在本申请实施例中，还可以在金属镀层1022b上设置覆盖膜1022c，该覆盖膜1022c可围绕开口1021a(可参照图5)设置，其厚度可以为15μm～45μm。另外，覆盖膜1022c上具有多个用于使金属镀层1022b露出的凹槽1022d，这样，用于焊接FPC 1022的焊料可以容置于该凹槽1022d，从而便于实现FPC 1022的焊料的印刷，以有利于提高FPC 1022的焊接质量。
另外，为了满足屏蔽盖的屏蔽性能要求，设定电子设备中的器件发射的信号的最小波长为λ，则FPC 1022上相邻两个凹槽1022d之间的间隙L2需要小于1/20λ，从而可使该屏蔽盖应用于电子设备时，可以对电子设备中的任一器件都可以起到屏蔽的作用。目前手机等电子设备中的器件的信号的最大频率约为15G Hz，所以在手机等电子设备中，可将相邻两个凹槽1022d间隙L2按照不大于1mm进行设计。从而使屏蔽盖与屏蔽框形成的屏蔽罩为器件提供一个屏蔽性能良好的环境，以降低RSE(radiated spurious emission，辐射杂散发射)风险。
参照图8，本申请实施例的屏蔽盖在制作时，可首先按照开口1021a的位置要求，在屏蔽盖的盖本体1021的端面上开设开口1021a；然后，将面积远大于开口1021a的FPC 1022展平，并在FPC 1022的凹槽1022d内印刷锡膏；之后，通过表面组装技术(surface mount technology，SMT)回流炉将盖本体1021的端面沿图8中所示的方向焊接于展平的FPC 1022上。最后，再对多余的FPC 1022进行剪裁，即形成本申请实施例的屏蔽盖。另外，由于在FPC 1022上焊接器件的工艺较为成熟，因此，在本申请中可使FPC 1022与盖本体1021的连接较为可靠，从而可提高包含该屏蔽盖的屏蔽罩的屏蔽效果。
在了解了本申请实施例的屏蔽罩后，可将其应用于PCBA。参照图9，本申请实施例的PCBA包括PCB 30，设置于PCB 30的器件20，屏蔽罩10罩设于器件20，以起到对器件20的屏蔽以及保护的作用。其中，PCB 30包括第一面301和第二面302，器件20可以设置于第一面301，也可以设置于第二面302，当器件20为多个时，还可以根据PCBA的具体设置需要，将多个器件20分设于第一面301和第二面302。
在具体设置屏蔽罩10时，由于无论器件20设置于PCB 30的哪一面，罩设于器件20的屏蔽罩10的设置方式均可以相同，故在本申请实施例中，首先以设置于PCB 30的第一面301的器件20以及屏蔽罩10的设置进行详细说明。参照图9，屏蔽罩10的屏蔽框101设置于待屏蔽的器件20的周侧，屏蔽框101上的开口1011以及屏蔽盖102上的开口1021a可供器件20穿过，以对器件20，或者设置于器件20上的其它结构进行避让。屏蔽框101靠近PCB 30的一端固定于PCB 30的第一面301，其固定方式可以为焊接或者粘接等。另外，通过将屏蔽罩10设置为屏蔽框101与屏蔽盖102组装的方式，这样当器件20需要维护时，可以在不破坏屏蔽框101与PCB 30之间的连接关系的基础上，直接将屏蔽盖10取下即可，其操作较为简单。
在图9中，可设定设置于PCB 30的第一面301的器件20凸出于PCB 30的最大高度为d11，该器件20与屏蔽盖102的FPC 1022之间的最小间距为d22，FPC 1022的厚度为d33。据此，PCB 30的第一面301的屏蔽罩10凸出于PCB 30的高度D′可表达为D′＝d11+d22+d33。其中，本申请实施例的FPC 1022的厚度d33可小于0.04mm，其远小于图 3中的屏蔽盖12的厚度d3(0.1mm)，而器件20(或器件20上设置的其它结构)与FPC 1022之间的最小间距d22也可以设置为0.05mm，这样，在器件20凸出于PCB 30的最大高度d11一定的情况下，采用本申请实施例的方案，可有效的减小屏蔽罩10凸出于PCB 30第一面301的高度，从而有利于实现PCBA的减薄设计。
另外，参照图10，在一些实施例中，屏蔽罩10需要对多个器件20(或者设置于器件20上的结构)进行避让，这时就要在屏蔽盖102的盖本体1021的对应位置分别开设开口1021a，并在对应每个开口1021a的位置设置FPC 1022以实现对各个开口1021a的封堵。
继续参照图10，PCB 30的第二面302上的屏蔽罩10可以参照第一面301进行设置，此处不再赘述。
参照图11，在本申请的一些实施例中，还提供了一种屏蔽罩100，该屏蔽罩100包括一体结构的罩体1001，罩体1001具有可容置器件的屏蔽腔。罩体1001的一端的端面开设有开口1001a，可以理解的是，待屏蔽的器件可通过罩体1001的与开口1001a相对的一端进入屏蔽腔。另外，为了实现屏蔽罩100的密封屏蔽，还需要在罩体1001上设置与开口1001a相对应的FPC 1002，该FPC 1002可通过锡膏等焊料1003焊接于开口1001a的远离屏蔽腔的一侧，以实现对开口1001a的封堵。本申请实施例的屏蔽罩100只包括罩体1001，以及设置于开口处1001a的FPC 1002，因此该屏蔽罩100的结构较为简单。
在具体设置FPC 1002时，其可参照图6和图7所示实施例进行设置。FPC 1002包括基材层，设置于基材层的金属镀层。其中，基材层的材质可以为塑料、树脂等，其厚度可以为5μm～50μm。金属镀层作为FPC 1002的主要起屏蔽作用的屏蔽层，可以选择为铜镀层，该金属镀层的厚度可以为6μm～36μm，这样可使金属镀层在具有较好的屏蔽作用以及较小的厚度的基础上，很好的控制该FPC 1002的制造成本。综上，本申请实施例的FPC 1002的厚度可小于0.04mm。
另外，还可以在金属镀层上设置覆盖膜，该覆盖膜可围绕开口设置，其厚度可以为15μm～45μm。另外，覆盖膜上具有多个用于使金属镀层露出的凹槽，这样，用于焊接FPC 1002的焊料可以容置于该凹槽，从而便于实现FPC 1002的焊料的印刷，以有利于提高FPC 1002的焊接质量。
为了满足屏蔽盖的屏蔽性能要求，设定电子设备中的信号的最小波长为λ，则FPC 1002上相邻两个凹槽之间的间隙需要小于1/20λ。目前手机等电子设备中信号的最大频率约为15G Hz，所以在本申请中，可将相邻两个凹槽间隙按照不大于1mm进行设计。从而使屏蔽盖与屏蔽框形成的屏蔽罩为器件提供一个屏蔽性能良好的环境，以降低RSE(radiated spurious emission，辐射杂散发射)风险。
本申请该实施例的屏蔽罩100可应用于对PCBA的器件200进行保护。参照图12，本申请该实施例的PCBA包括PCB 300，设置于PCB 300的器件200，以及罩设于器件200的屏蔽罩100。其中，PCB 300包括第一面3001和第二面3002，器件200可以设置于第一面3001，也可以设置于第二面3002，当器件200为多个时，还可以根据PCBA的具体设置需要，将多个器件200分设于第一面3001和第二面3002。
在具体设置屏蔽罩100时，由于无论器件200设置于PCB 300的哪一面，罩设于器件200的屏蔽罩100的设置方式均可以相同，故在本申请实施例中，首先以设置于PCB 300的第一面3001的器件200以及屏蔽罩100的设置进行详细说明。参照图12，该屏蔽罩100的罩体1001罩设于待屏蔽的器件200，且其靠近PCB 300的一端可通过焊接等方式固定于 PCB 300的第一面3001。屏蔽罩100的罩体1001的开口1001a可对器件200，或者设置于器件200上的其它结构进行避让。
在图12中，可设定设置于PCB 300的第一面3001的器件200凸出于PCB 300的最大高度为d111，该器件200与FPC 1002之间的最小间距为d222，FPC 1002的厚度为d333。据此，PCB 300的第一面3001的屏蔽罩100凸出于PCB 300的高度D〃可表达为D〃＝d111+d222+d333。其中，本申请实施例的FPC 1002的厚度d333可小于0.04mm，其远小于图3中的屏蔽盖12的厚度d3(0.1mm)，而器件200(或器件200上设置的其它结构)与FPC 1002之间的最小间距d222也可以设置为0.05mm，这样，在器件200凸出于PCB 300的最大高度d111一定的情况下，采用本申请实施例的方案，可有效的减小屏蔽罩100凸出于PCB 300表面的高度，从而有利于实现PCBA的减薄设计。另外，该屏蔽罩100在使用时可直接罩设于待屏蔽的器件200，再将其与PCB 300进行固定即可，操作较为简单。
继续参照图12，在本申请该实施例中，PCB 300的第二面3002的屏蔽罩可以参照第一面3001进行设置，此处不再赘述。
参照图13，本申请实施例还提供了一种PCBA，该PCBA包括PCB 300，设置于PCB 300的器件200，以及罩设于器件200的屏蔽罩100。其中，PCB 300包括第一面3001和第二面3002，设置于第一面3001的器件200，设置于第二面3002的器件20，罩设于器件200的屏蔽罩100，以及罩设于器件20的屏蔽罩10。
在具体设置屏蔽罩100时，屏蔽罩100包括一体结构的罩体1001，该罩体1001罩设于待屏蔽的器件200，且其靠近PCB 300的一端可通过焊接等方式固定于PCB 300的第一面3001。罩体1001远离PCB 300的一端的端面开设有供器件200穿过的开口1001a，该开口1001a可对器件200，或者设置于器件200上的其它结构进行避让。
另外，为了实现屏蔽罩100的密封屏蔽，还需要在罩体1001上设置与开口1001a相对应的FPC 1002，该FPC 1002可通过锡膏等焊料焊接于屏蔽罩100的罩体1001远离PCB 300的一侧。由于屏蔽罩100只包括罩体1001，以及设置于端面上的开口1001a处的FPC 1002，因此该屏蔽罩100的结构较为简单。该屏蔽罩100在使用时可直接罩设于待屏蔽的器件200，再将其与PCB 300进行固定即可，操作较为简单。
在具体设置屏蔽罩10时，屏蔽罩10包括屏蔽框101和屏蔽盖102，其中，屏蔽框101设置于待屏蔽的器件20的周侧，屏蔽框101靠近PCB 300的一端可通过焊接等方式固定于PCB 300的第二面3002。屏蔽框101远离PCB 300的一端具有供器件20穿过的开口1011，该开口1011可对器件20，或者设置于器件20上的其它结构进行避让。
继续参照图13，屏蔽罩10的屏蔽盖102可盖设于屏蔽框101，并与屏蔽框101远离PCB 300的一端固定连接，其连接方式可以但不限于为焊接。在具体设置屏蔽盖102时，屏蔽盖102包括盖本体1021，盖本体1021上开设有开口1021a，该开口1021a与开口1011相对设置。另外，屏蔽盖102还具有与开口1021a对应设置的FPC 1022，该FPC 1022可通过锡膏等焊料焊接于盖本体1021远离PCB 300的一侧，以封堵开口1021a。通过将屏蔽罩10设置为屏蔽框101与屏蔽盖102相组装的分体形式，在器件20需要维护时，可在不破坏屏蔽框101与PCB 300之间的连接关系的基础上，直接将屏蔽盖102取下进行，其操作较为简单。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本 申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (25)

  1. 一种屏蔽盖，应用于电子设备，其特征在于，包括盖本体，以及设置于所述盖本体的柔性印刷电路板，其中：
    所述盖本体的端面开设有第一开口，所述柔性印刷电路板固定于所述盖本体的端面的外侧，且封堵所述第一开口。
  2. 如权利要求1所述的屏蔽盖，其特征在于，所述柔性印刷电路板包括基材层，所述基材层的厚度为5μm～50μm。
  3. 如权利要求2所述的屏蔽盖，其特征在于，所述柔性电路板还包括设置于所述基材层的金属镀层，所述金属镀层的厚度为6μm～36μm。
  4. 如权利要求3所述的屏蔽盖，其特征在于，所述柔性印刷电路板还包括设置于所述金属镀层的覆盖膜，所述覆盖膜沿所述第一开口的周侧设置；
    所述覆盖膜，具有多个凹槽，所述金属镀层从所述凹槽露出；所述屏蔽盖还包括焊料，所述焊料容置于所述凹槽。
  5. 如权利要求4所述的屏蔽盖，其特征在于，所述电子设备中的器件发射的信号的最小波长为λ，相邻两所述凹槽之间的间距不大于1/20λ。
  6. 如权利要求4或5所述的屏蔽盖，其特征在于，所述覆盖膜的厚度为15μm～45μm。
  7. 一种屏蔽罩，罩设于待屏蔽的器件，其特征在于，包括屏蔽框，以及如权利要求1～6任一项所述的屏蔽盖，其中：
    所述屏蔽框，具有相对设置的第一端部和第二端部，所述第一端部具有第二开口，所述第二端部具有第三开口，所述器件通过所述第二开口进入所述屏蔽罩的屏蔽腔；
    所述屏蔽盖，盖设于所述屏蔽框的第二端部，所述第一开口与所述第三开口相对设置，所述器件依次穿过所述第三开口以及所述第一开口，且所述器件与所述柔性印刷电路板之间具有设定距离。
  8. 如权利要求7所述的屏蔽罩，其特征在于，所述屏蔽盖的内侧壁设置有多个凸起，所述屏蔽框上设置有多个凹槽，所述凸起与所述凹槽一一对应卡接。
  9. 如权利要求7或8所述的屏蔽罩，其特征在于，所述屏蔽框的第一端部还设置有支撑部，所述支撑部向所述屏蔽框的内部延伸；所述屏蔽盖的所述盖本体的端面与所述支撑部相贴合。
  10. 一种装备印刷电路板，其特征在于，包括印刷电路板，设置于所述印刷电路板的器件，以及罩设于所述器件的如权利要求7～9任一项所述的屏蔽罩。
  11. 一种电子设备，其特征在于，包括显示屏、中框、后壳，以及装备印刷电路板，其中：
    所述中框，用于承载所述装备印刷电路板和所述显示屏，所述显示屏和所述装备印刷电路板位于所述中框的两侧，所述后壳位于所述装备印刷电路板远离所述中框的一侧；
    所述装备印刷电路板，包括印刷电路板，设置于所述印刷电路板的器件，以及罩设于所述器件的屏蔽罩，所述屏蔽罩包括屏蔽框，以及屏蔽盖；
    所述屏蔽盖，盖设于所述屏蔽框，包括盖本体，以及设置于所述盖本体的柔性印刷电路板，所述盖本体的端面开设有第一开口，所述柔性印刷电路板固定于所述盖本体的端面的远离所述屏蔽框的一侧，且封堵所述第一开口；
    所述屏蔽框，固定于所述印刷电路板，所述屏蔽框远离所述印刷电路板的一端具有第二开口；所述第二开口与所述第一开口相对设置，所述器件依次穿过所述第二开口以及所述第一开口，且所述器件与所述柔性印刷电路板之间具有设定距离。
  12. 如权利要求11所述的电子设备，其特征在于，所述柔性印刷电路板包括基材层，所述基材层的厚度为5μm～50μm。
  13. 如权利要求12所述的电子设备，其特征在于，所述柔性电路板还包括设置于所述基材层的金属镀层，所述金属镀层的厚度为6μm～36μm。
  14. 如权利要求13所述的电子设备，其特征在于，所述柔性印刷电路板还包括设置于所述金属镀层的覆盖膜，所述覆盖膜沿所述第一开口的周侧设置；
    所述覆盖膜，具有多个凹槽，所述金属镀层从所述凹槽露出；所述屏蔽盖还包括焊料，所述焊料容置于所述凹槽。
  15. 如权利要求14所述的电子设备，其特征在于，所述电子设备中的器件发射的信号的最小波长为λ，相邻两所述凹槽之间的间距不大于1/20λ。
  16. 如权利要求14或15所述的电子设备，其特征在于，所述覆盖膜的厚度为15μm～45μm。
  17. 如权利要求16所述的电子设备，其特征在于，所述屏蔽盖的内侧壁设置有多个凸起，所述屏蔽框上设置有多个凹槽，所述凸起与所述凹槽一一对应卡接。
  18. 如权利要求11～17任一项所述的电子设备，其特征在于，所述屏蔽框远离所述印刷电路板的一端还设置有支撑部，所述支撑部向所述屏蔽框的内部延伸；所述屏蔽盖的所述盖本体的端面与所述支撑部相贴合。
  19. 如权利要求11～18任一项所述的电子设备，其特征在于，所述屏蔽罩设置于所述装备印刷电路板的朝向所述中框的一侧，所述中框设置有容置槽，所述屏蔽罩的部分或全部容置于所述容置槽。
  20. 如权利要求11～19任一项所述的电子设备，其特征在于，所述装备印刷电路板与所述后壳之间还设置有支架，所述屏蔽罩设置于所述装备印刷电路板的朝向所述后壳的一侧，所述屏蔽罩固定于所述支架。
  21. 一种装备印刷电路板，其特征在于，包括印刷电路板，设置于印刷电路板的器件，以及罩设于所述器件的屏蔽罩，其中：
    所述屏蔽罩，包括固定于所述印刷电路板的罩体，以及设置于所述罩体的柔性印刷电路板；
    所述罩体，远离所述印刷电路板的一端具有开口；
    所述柔性印刷电路板，固定于所述罩体远离所述印刷电路板的一侧，且封堵所述开口；
    所述器件，穿过所述开口，且与所述柔性印刷电路板之间具有设定距离。
  22. 如权利要求21所述的装备印刷电路板，其特征在于，所述柔性印刷电路板包括基材层，所述基材层的厚度为5μm～50μm。
  23. 如权利要求22所述的装备印刷电路板，其特征在于，所述柔性电路板还包括设置于所述基材层的金属镀层，所述金属镀层的厚度为6μm～36μm。
  24. 如权利要求23所述的装备印刷电路板，其特征在于，所述柔性印刷电路板还包括设置于所述金属镀层的覆盖膜，所述覆盖膜沿所述开口的周侧设置；
    所述覆盖膜，具有多个凹槽，所述金属镀层从所述凹槽露出；所述屏蔽罩还包括焊料， 所述焊料容置于所述凹槽。
  25. 如权利要求24所述的装备印刷电路板，其特征在于，所述电子设备中的器件发射的信号的最小波长为λ，相邻两所述凹槽之间的间距不大于1/20λ。
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