WO2021100945A1 - Dispositif électronique ayant un boîtier formé par procédé d'impression 3d - Google Patents

Dispositif électronique ayant un boîtier formé par procédé d'impression 3d Download PDF

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Publication number
WO2021100945A1
WO2021100945A1 PCT/KR2019/016265 KR2019016265W WO2021100945A1 WO 2021100945 A1 WO2021100945 A1 WO 2021100945A1 KR 2019016265 W KR2019016265 W KR 2019016265W WO 2021100945 A1 WO2021100945 A1 WO 2021100945A1
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WO
WIPO (PCT)
Prior art keywords
pattern
housing
output
electronic device
coupled
Prior art date
Application number
PCT/KR2019/016265
Other languages
English (en)
Korean (ko)
Inventor
이광성
이충현
Original Assignee
주식회사 파트론
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 파트론 filed Critical 주식회사 파트론
Publication of WO2021100945A1 publication Critical patent/WO2021100945A1/fr

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus

Definitions

  • the present invention relates to an electronic device in which a housing is formed by a 3D printing method.
  • the injection molding process is a molding process in which a plastic resin is injected into a mold to form a structure having a desired shape.
  • the injection molding process requires a high cost to manufacture a mold for injection molding, but once the mold is made, it is possible to repeatedly inject several times, so the manufacturing cost per piece is low and work efficiency is high, so it is mainly used for mass production.
  • the injection molding process has a problem in that the manufacturing cost per unit is increased due to the high initial mold manufacturing cost. In addition, it takes a considerable amount of time to manufacture the mold, and these products often require rapid development and modification, so using the injection molding process may cause problems.
  • the thickness of the electronic device is very thin, so that the internal space in which the substrate is located is very narrow, and as the electronic device is miniaturized, the antenna space required for communication is very narrow. To form, a problem is occurring.
  • An object of the present invention is to provide an electronic device in which a housing is formed by a 3D printing method.
  • An electronic device includes: a housing formed of an insulating material and including an output portion formed by a 3D printing method; And an output pattern coupled to the surface of the housing and coupled to the output portion and an extension pattern connected to the output pattern, wherein the output pattern is formed together with the output portion by a 3D printing method.
  • the extension pattern may be formed of a flexible circuit board or a plating layer coupled to the surface of the housing.
  • the housing may be coupled to the output portion and further include an injection portion formed by injection molding, and at least a portion of the extension pattern may be coupled to the injection portion.
  • the output portion may be formed by being laminated on a surface of a portion of the injection portion.
  • a substrate accommodated in the inner space of the housing may be further included, and the output pattern may be electrically connected to a terminal portion of the substrate.
  • the output portion may include a protrusion protruding from a peripheral portion, at least a portion of the output pattern may be formed on a surface of the protrusion, and a terminal portion of the substrate may face an output pattern formed on the surface of the protrusion.
  • the protrusion may be formed to face another portion of the housing and at least a portion of the substrate.
  • the output pattern and the terminal portion of the substrate may be connected via a contact member coupled to the substrate.
  • the conductive pattern is an antenna pattern, and the extension pattern may be coupled to a surface of the housing.
  • the housing includes an input/output terminal exposed to the outside, and the extension pattern may be electrically connected to the input/output terminal.
  • an electronic device in which a housing is formed by a 3D printing method is an electronic device worn on a smartphone or a wrist by forming an output portion of the housing and an output pattern of the conductive pattern portion together by a 3D printing method.
  • a 3D printing method As described above, it is possible to more easily manufacture a housing and a conductive pattern provided with a narrow inner space.
  • FIG. 1 to 2 are diagrams for explaining an example of an electronic device according to the present invention
  • FIG. 3 is a diagram illustrating a first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention. It is also for.
  • FIG 4 is a view for explaining a second embodiment of the housing 100 and the conductive pattern portion 200 in the electronic device of the present invention.
  • FIG 5 is a view for explaining a third embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • 6 and 7 are diagrams for explaining an example of a method of manufacturing the first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • FIGS. 8 to 10 are diagrams for explaining an example of a method of manufacturing the second embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • FIG. 1 to 2 are diagrams for explaining an example of an electronic device according to the present invention
  • FIG. 3 is a diagram illustrating a first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention. It is also for.
  • the electronic device may include a housing 100, a conductive pattern part 200, and a substrate 300.
  • the housing 100 is a part corresponding to a case of an electronic device, may be formed of an insulating material, and may include an output part formed by a 3D printing method.
  • the insulating material of the housing 100 may be made of an insulating material such as synthetic resin, plastic, synthetic rubber, or silicone.
  • the housing 100 may have an internal space to protect various constituent parts of an electronic device provided therein from the outside.
  • the housing 100 is formed in a first portion (100a) formed in a first direction (x), a second direction (y) intersecting the first direction (x), the second and third portions spaced apart from each other (100b, 100c) and the second and third portions (100b, 100c) protruding from any one of the portion, and spaced apart from the first portion (100a) and formed in the first direction (x) may include a projection (100d), ,
  • the inner space may be formed by the first, second, and third portions 100a, 100b, and 100c.
  • the protrusion 100d may be formed to face another portion of the housing 100 (eg, the first portion 100a) with at least a portion of the substrate 300 therebetween.
  • the housing 100 may be formed by a 3D printing method or an injection molding method.
  • the entire housing 100 may be formed by a 3D printing method, and some of the housing 100 may be formed by an injection molding method, and some of the housing 100 may be formed by a 3D printing method.
  • the housing 100 according to the first embodiment of the present invention all of the first, second, and third parts 100a, 100b, and 100c and the protrusion 100d are formed by a 3D printing method. It can be formed as an output part.
  • the conductive pattern part 200 may be located on the surface of the housing 100, is formed of a conductive material such as gold, silver, copper, or aluminum, and has an antenna pattern to perform a function as an antenna for transmitting and receiving signals, or Or, the surface of the housing 100 may perform a function as an electrical pattern performing other functions.
  • the conductive pattern part 200 is an example of the surface of the housing 100, which may be located on the inner space side, and is located in the inner space of the housing 100, and is a substrate on which a communication chip 310 or various integrated circuit chips are mounted. It can be connected to 300.
  • the conductive pattern part 200 may include an output pattern 210 and an extension pattern 220.
  • the output pattern 210 may be coupled to the surface of the output portion of the housing 100, and the extended pattern 220 may be formed by being connected to the output pattern 210.
  • the output pattern 210 may be formed together when the output portion is formed in the housing 100 by the 3D printing method.
  • the output pattern 210 includes a portion formed on a portion of the inner surface of the first portion 100a of the housing 100, a portion formed on the inner surface of the second portion 100b of the housing 100, and a protrusion ( It may include a portion formed on the surface of 100d).
  • At least a portion of the output pattern 210 may be formed on the surface of the protrusion 100d and may be electrically connected to the terminal portion of the substrate 300.
  • the extension pattern 220 is electrically connected to the end of the output pattern 210 and may be located in the inner space of the housing 100.
  • the extension pattern 220 is a flexible circuit board (FPCB) formed of an electrode layer 222 and a base film 221 on the surface of the housing 100 to be electrically connected to the output pattern 210.
  • Flexible Printed Circuit Board may be attached or formed as a plating layer on the surface of the housing 100 by laser direct structuring (LDS).
  • LDS laser direct structuring
  • the extension pattern 220 may also be formed by an injection molding process.
  • the substrate 300 is accommodated in the inner space of the housing 100 and may be located in an inner space formed by the first, second, and third portions 100a, 100b, and 100c of the housing 100, and the communication chip ( 310) Or various integrated circuit chips may be mounted.
  • At least a portion of the substrate 300 may be located between the protrusion 100d and the first portion 100a of the housing 100, and the terminal portion of the substrate 300 is formed on the output pattern 210 formed on the protrusion 100d. Can be electrically connected.
  • the communication chip mounted on the substrate 300 may be electrically connected to a terminal portion of the substrate 300 through an electrode line, and the terminal portion of the substrate 300 is an output pattern 210 via the contact member 40. ) Can be electrically connected.
  • the contact member 40 may have a C-clip structure, as shown in FIG. 2, or, alternatively, may have a pogo pin structure.
  • FIG 4 is a view for explaining a second embodiment of the housing 100 and the conductive pattern portion 200 in the electronic device of the present invention.
  • the housing 100 according to the second embodiment of the present invention may include an output portion formed by a 3D printing method and an injection portion formed by injection molding.
  • the injection portion may be combined with the output portion, and the output portion may be formed by being laminated on a surface of a portion of the injection portion.
  • the first, second, and third parts 100a, 100b, and 100c of the housing 100 may be formed as an injection part, and the protrusion 100d of the housing 100 is the housing 100 by a 3D printing method. It may be stacked on the second portion 100b and formed as an output portion.
  • a plurality of unevenness P may be formed in a part where the output part and the injection part are coupled to each other.
  • the conductive pattern part 200 may include an output pattern 210 and an extension pattern 220, and at least a part or all of the extension pattern 220 may be formed by injection molding, and may be coupled to an injection part. .
  • the output pattern 210 may be formed by being laminated on a part of the conductive pattern part 200 formed by injection molding by a 3D printing method.
  • first, second, and third parts 100a, 100b, and 100c of the housing 100 are formed as injection parts, and when forming the protrusion 100d, which is the injection part, FIG. 3
  • a part of the first part 100a and the conductive pattern part 200 positioned on the surface of the second part 100b of the housing 100 are formed as the output pattern 210, and the extension pattern 220 is formed in the housing ( It is also possible to form a flexible circuit board attached to the first portion 100a of 100).
  • FIG 5 is a view for explaining a third embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • all of the first, second, and third portions 100a, 100b, and 100c and the protrusion 100d of the housing 100 are It may be formed as an output portion formed by a 3D printing method, and may further include an input/output terminal 130 through which the housing 100 is exposed to the outside.
  • the input/output terminal 130 exposed to the outside may be provided in the third part 100c of the housing 100 through the third part 100c.
  • the conductive pattern unit 200 may include an output pattern 210 and an extended pattern 220, and the extended pattern 220 may be electrically connected to the input/output terminal 130.
  • the extension pattern 220 may be formed to extend to the surface of the third portion 100c of the housing 100 by attaching the flexible circuit board, and the extension pattern 220 may be connected to the input/output terminal 130 in the third portion 100c. ) And can be electrically connected.
  • 6 and 7 are diagrams for explaining an example of a method of manufacturing the first embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • an example of a manufacturing method according to the present invention may include a 3D printing step (S11), an extension pattern 220 forming step (S12), and a circuit board 300 connection step (S13). .
  • the output portion of the housing 100 and the output pattern 210 of the conductive pattern portion 200 may be formed by a 3D printing method.
  • the output portion of the housing 100 and the output pattern 210 of the conductive pattern portion 200 may be formed together with the same 3D printing process. .
  • the output part and the output pattern 210 are formed regardless of the order. It can be formed while laminating together by a 3D printing method.
  • the extension pattern 220 electrically connected to the output pattern 210 in the step of forming the extension pattern 220 (S12 ). ) May be formed on the surface of the housing 100.
  • a flexible circuit board is attached to the end of the output pattern 210 to form the extension pattern 220 of the conductive pattern part 200. can do.
  • the flexible circuit board When attaching the flexible circuit board to the end of the output pattern 210, it may be attached using an electrically conductive adhesive (ECA) or anisotropic conductive adhesives (ACAs).
  • ECA electrically conductive adhesive
  • ACAs anisotropic conductive adhesives
  • the terminal part of the circuit board 300 may be connected to the output pattern 210 formed on the protrusion 100d that is an output part of the housing 100.
  • FIGS. 8 to 10 are diagrams for explaining an example of a method of manufacturing the second embodiment of the housing 100 and the conductive pattern part 200 in the electronic device of the present invention.
  • another example of the manufacturing method according to the present invention may include an injection process step (S21), a 3D printing step (S22), and a circuit board 300 connection step (S23).
  • the first, second, and third portions 100a, 100b, and 100c of the housing 100 may be formed by injection molding.
  • the protrusion 100d of the housing 100 is stacked on a part of the second part 100b of the housing 100 to obtain the output part. It may be formed and formed by stacking the output pattern 210 together with the protrusion 100d.
  • the terminal portion of the circuit board 300 may be connected to the output pattern 210 formed on the protrusion 100d that is an output portion of the housing 100.
  • the electronic device and manufacturing method to which the housing of the present invention is applied can be applied to a very miniaturized electronic device, and the structure of the housing is a part corresponding to an undercut structure requiring high cost or a difficult process for injection molding. Even when necessary, the 3D printing method can be applied together to simplify the manufacturing process and reduce the manufacturing cost.
  • a conductive pattern can be easily formed by a 3D printing method, so that a narrow internal space of the housing can be efficiently used.
  • each technical feature is mainly described, but as long as the respective technical features are not compatible with each other, they may be merged and applied with each other.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention se rapporte à un dispositif électronique comportant un boîtier formé par un procédé d'impression 3D. Un dispositif électronique selon un mode de réalisation de la présente invention peut comprendre : un boîtier qui est formé d'un matériau isolant et comprend une partie sortie formée par un procédé d'impression 3D ; et une partie motif conducteur qui comprend un motif de sortie couplé à la surface du boîtier et couplé à la partie sortie, et un motif d'extension connecté au motif de sortie, le motif de sortie pouvant être formé conjointement avec la partie de sortie par le procédé d'impression 3D.
PCT/KR2019/016265 2019-11-20 2019-11-25 Dispositif électronique ayant un boîtier formé par procédé d'impression 3d WO2021100945A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190149504A KR102293941B1 (ko) 2019-11-20 2019-11-20 3d 프린팅 방법에 의해 하우징이 형성되는 전자 장치
KR10-2019-0149504 2019-11-20

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WO2021100945A1 true WO2021100945A1 (fr) 2021-05-27

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PCT/KR2019/016265 WO2021100945A1 (fr) 2019-11-20 2019-11-25 Dispositif électronique ayant un boîtier formé par procédé d'impression 3d

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KR (1) KR102293941B1 (fr)
WO (1) WO2021100945A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160023874A (ko) * 2013-06-24 2016-03-03 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 프린트된 3차원(3d) 기능 부품 및 이것의 제작 방법
KR20160057284A (ko) * 2014-11-13 2016-05-23 주식회사 에이치시티엠 3d 프린팅을 이용한 안테나 베이스 및 안테나 방사체 제조방법
KR20170071200A (ko) * 2015-12-15 2017-06-23 삼성전자주식회사 안테나를 구비한 전자 장치
KR20180117279A (ko) * 2017-04-19 2018-10-29 주식회사 럭스로보 모듈 및 이를 포함하는 모듈 어셈블리
KR20190016251A (ko) * 2017-08-08 2019-02-18 삼성전자주식회사 안테나들 간의 간섭을 줄여 안테나 성능을 높인 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160023874A (ko) * 2013-06-24 2016-03-03 프레지던트 앤드 펠로우즈 오브 하바드 칼리지 프린트된 3차원(3d) 기능 부품 및 이것의 제작 방법
KR20160057284A (ko) * 2014-11-13 2016-05-23 주식회사 에이치시티엠 3d 프린팅을 이용한 안테나 베이스 및 안테나 방사체 제조방법
KR20170071200A (ko) * 2015-12-15 2017-06-23 삼성전자주식회사 안테나를 구비한 전자 장치
KR20180117279A (ko) * 2017-04-19 2018-10-29 주식회사 럭스로보 모듈 및 이를 포함하는 모듈 어셈블리
KR20190016251A (ko) * 2017-08-08 2019-02-18 삼성전자주식회사 안테나들 간의 간섭을 줄여 안테나 성능을 높인 전자 장치

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KR20210061675A (ko) 2021-05-28
KR102293941B1 (ko) 2021-08-26

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