WO2021098031A1 - Led灯带基板、led灯带以及终端设备 - Google Patents

Led灯带基板、led灯带以及终端设备 Download PDF

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Publication number
WO2021098031A1
WO2021098031A1 PCT/CN2020/070764 CN2020070764W WO2021098031A1 WO 2021098031 A1 WO2021098031 A1 WO 2021098031A1 CN 2020070764 W CN2020070764 W CN 2020070764W WO 2021098031 A1 WO2021098031 A1 WO 2021098031A1
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WIPO (PCT)
Prior art keywords
led
light strip
substrate
chip
area
Prior art date
Application number
PCT/CN2020/070764
Other languages
English (en)
French (fr)
Inventor
彭胜钦
钟云
Original Assignee
深圳市欣上科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201911125257.9A external-priority patent/CN110729388A/zh
Priority claimed from CN201921987307.XU external-priority patent/CN210485369U/zh
Application filed by 深圳市欣上科技有限公司 filed Critical 深圳市欣上科技有限公司
Priority to EP20889983.1A priority Critical patent/EP3996156A4/en
Priority to CA3151509A priority patent/CA3151509A1/en
Priority to US17/640,417 priority patent/US20220364692A1/en
Publication of WO2021098031A1 publication Critical patent/WO2021098031A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/053—Tails
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Definitions

  • the present disclosure relates to the technical field of electronic appliances, and in particular to an LED light strip substrate, an LED light strip and terminal equipment.
  • the common side-emitting light strips mainly include the following types: side-emitting light strips that use LED patch lamp beads as the light source, and conventional light strips are wrapped in a silicone sleeve.
  • the side-emitting light strip is formed, or the side-emitting light strip is packaged by covering the chip lamp beads of the conventional LED light strip with an optical lens and changing the light output angle of the lamp beads through the optical lens.
  • the purpose of the exemplary embodiments of the present disclosure includes, for example, providing an improved LED light strip substrate, LED light strip, and terminal equipment to overcome the large volume and luminous efficiency of the LED side-emitting light strip in the prior art. Low defects.
  • An exemplary embodiment of the present disclosure provides an LED light strip substrate including a main body area and a peninsula area.
  • the peninsula area is arranged at intervals along the edge of the main body area and the peninsula area can be bent to form a predetermined angle with the main body area; the peninsula area is used for setting the LED flip chip; and the main body area is provided with a circuit for connecting the LED flip chip.
  • the peninsula area includes a wafer placement area and a bending area provided between the main body area and the wafer placement area; the wafer placement area is used for setting LED flip chips; and the width of the bending area is smaller than that of the wafer placement area. width.
  • the width at the first section with the narrowest width in the transverse direction of the bending area is smaller than the width at the second section with the narrowest width in the transverse direction of the wafer placement area.
  • the narrowest width in the transverse direction of the bending area is smaller than the narrowest width in the transverse direction of the wafer placement area.
  • the shape formed by the edge or part of the edge between two adjacent bending regions is a circular arc shape.
  • a light-shielding reflection part is provided on both sides of the chip placement area for placing the LED flip chip to adjust the light output angle of the LED flip chip; the extending direction of the light-shielding reflection part is perpendicular to the extending direction of the chip placement area .
  • the predetermined angle is the angle of the included angle between the peninsula area and the main body area, the predetermined angle is greater than 0 degrees and less than 180 degrees; on the angle side, that is, on the side of the main body area related to the included angle and Between the side of the peninsula area related to the included angle, a filling and setting part is provided for supporting and fixing the peninsula area and the main body area; the filling and setting part is on the opposite side of the surface side for setting the LED flip chip.
  • each peninsula area may be 1mm-5mm, for example, it may optionally be 1.8mm-2.5mm, and the length may be 1.5mm-5mm.
  • Exemplary embodiments of the present disclosure also provide an LED light strip, which includes an LED light strip substrate and an LED flip chip disposed on the peninsula area.
  • the LED flip chip is wrapped with fluorescent glue.
  • Exemplary embodiments of the present disclosure also provide a terminal device, which includes the above-mentioned LED light strip.
  • the terminal device includes a light box.
  • the LED light strip substrate provided by the exemplary embodiment of the present disclosure helps to realize an LED side-emitting light strip with a light and low overall volume and a low cost, and is suitable for terminal equipment with a small internal installation structure space and a bending area.
  • the LED light strip provided by the exemplary embodiment of the present disclosure can effectively cause the light emitted by the LED flip chip to be emitted from the side of the LED light strip substrate, and the structure of the LED side-emitting light strip thus constructed is simple and easy to implement.
  • the LED light strips provided by the exemplary embodiments of the present disclosure are particularly convenient to bend and mount in the gap of the terminal device, and are not easy to be broken and at the same time help to achieve a more continuous side-emitting effect, so as to meet the light-emitting requirements of the terminal device and improve the performance of the terminal device. Lighting display effect.
  • Exemplary embodiments of the present disclosure also provide another LED side-emitting light strip, which includes: a substrate, a first dam provided on the substrate, and a plurality of flip-chip LED chips.
  • Each flip-chip LED chip is arranged at a predetermined distance from the edge of a substrate; the first dam is arranged at a position closer to the inner side of the substrate relative to the flip-chip LED chip.
  • the edge of the substrate is located on the outer side of the substrate opposite to the inner side of the substrate; or the inner side of the substrate is the side of the LED substrate where no LED flip chip is provided.
  • the other LED side-emitting light strip further includes a fluorescent glue that wraps the flip-chip LED chip.
  • the other LED side-emitting light strip further includes a second dam.
  • the second dam may be at least partially arranged above the fluorescent glue.
  • the second dam may be partly arranged on the fluorescent glue and partly arranged on the first dam, that is, the side or side of the second dam away from the edge of the substrate is at least partly connected to the first dam. The dam is connected.
  • the side of the second dam close to the edge of the substrate extends to a position flush with the edge of the substrate.
  • the thickness of the LED side-emitting light strip is 1mm-5mm, particularly 1mm-3mm.
  • the spacing between the flip-chip LED chips is 1mm-5mm, particularly 1.5mm-2.2mm.
  • the substrate is a flexible substrate.
  • the fluorescent glue is continuously arranged on the substrate and covers each flip-chip LED chip.
  • Exemplary embodiments of the present disclosure also provide another terminal device such as a light box, which includes the above-mentioned another LED side-emitting light strip.
  • the other LED side-emitting light strip provided by the exemplary embodiment of the present disclosure can effectively make the light emitting direction of the flip-chip LED chip extend from the side of the substrate.
  • the light-emitting angle of the LED chip plays a limiting role to prevent the light emitted from it from spreading too much.
  • the overall volume of the other LED side-emitting light strip provided by the exemplary embodiment of the present disclosure is lighter and thinner, and the cost is lower, which can meet the light source requirements of terminal devices with a relatively small internal installation space.
  • another LED side-emitting light strip described above may be installed in a terminal device such as a light box provided by an exemplary embodiment of the present disclosure to be used as a light source.
  • the LED side-emitting light strip can be installed on the side or gap inside the device or in a bent installation structure to provide a light source for the screen.
  • the terminal device obtains an improved light transmittance due to the use of such LED light strips, thereby achieving a better display effect, and obtaining an improved device integration, thereby achieving a thinner and lighter body.
  • Fig. 1 shows a front view of an LED light strip substrate provided by an embodiment of the present disclosure
  • Fig. 2 shows a side view of the LED light strip substrate provided by the embodiment of the present disclosure after bending
  • Fig. 3 shows another front view of the LED light strip substrate provided by the embodiment of the present disclosure
  • 4A and 4B show another side view of the LED light strip substrate provided by the embodiment of the present disclosure after bending;
  • 5A, 5B, and 5C show another side view of the LED light strip substrate provided by the embodiment of the present disclosure after bending;
  • Figure 6 shows a schematic diagram of an LED light strip provided by an embodiment of the present disclosure
  • FIG. 7 shows a first structural schematic diagram of another LED side-emitting light strip provided by an embodiment of the present disclosure
  • FIG. 8 shows a second structural schematic diagram of another LED side-emitting light strip provided by an embodiment of the present disclosure
  • FIG. 9 shows a third structural schematic diagram of another LED side-emitting light strip provided by an embodiment of the present disclosure.
  • FIG. 10 shows a fourth structural schematic diagram of another LED side-emitting light strip provided by an embodiment of the present disclosure.
  • FIG. 11 shows a fifth structural schematic diagram of another LED side-emitting light strip provided by an embodiment of the present disclosure.
  • Figure 12 shows a schematic diagram of the structure of a side-emitting light strip in the prior art.
  • the terms “including” or “may include” that may be used in various embodiments of the present disclosure indicate the existence of the disclosed function, operation, or element, and do not limit the existence of one or more functions, operations, or elements. increase.
  • the terms “including”, “having” and their cognates are only intended to indicate specific features, numbers, steps, operations, elements, components, or combinations of the foregoing, And should not be understood as first excluding the existence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing items or adding one or more features, numbers, steps, operations, elements, components Or the possibility of a combination of the foregoing.
  • the expression “at least one of A or/and B” includes any combination or all combinations of words listed at the same time.
  • the expression “A or B” or “at least one of A or/and B” may include A, may include B, or may include both A and B.
  • Expressions used in various embodiments of the present disclosure may modify various constituent elements in the various embodiments, but may not limit the corresponding constituent elements.
  • the above expression does not limit the order and/or importance of the elements.
  • the above expressions are only used for the purpose of distinguishing one element from other elements.
  • the first user device and the second user device indicate different user devices, although both are user devices.
  • the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.
  • first constituent element can be directly connected to the second constituent element, and the first constituent element and the second constituent element can be “connected” "The third component.
  • first constituent element and the second constituent element can be “connected” "The third component.
  • an embodiment of the present disclosure provides an LED light strip substrate, which includes a main body area 110 and a peninsula area 120.
  • the peninsula area 120 may be arranged at intervals along at least one edge of the main body area 110, such as a lateral edge shown in FIG. 1, and the peninsula area 120 may be bent to form a predetermined angle with the main body area 110.
  • the peninsula 120 can be used to set up LED flip chips.
  • the body area 110 may be provided with a circuit for connecting the LED flip chip.
  • the main body area 110 may be a substrate surface on the LED strip substrate on which a circuit connected to the LED flip chip is provided.
  • the peninsula area 120 may be a small substrate surface spaced along the edge of the main body area 110, which can be used to install LED flip chips.
  • the length x along the longitudinal direction of the peninsula area 120 is generally smaller than the length y along the longitudinal direction of the main body area 110, as shown in FIG. 1, for example, the length of the peninsula area may be about 1.5 mm to 3 mm, which roughly occupies the length y of the main body area 110. 1/8-1/3 of that.
  • the peninsula area 120 may be bent to form a predetermined angle ⁇ with the main body area 110, as shown in FIG. 2, so that when an LED flip chip 150 is disposed at the peninsula area 120 on the LED strip substrate At this time, the light of the LED flip chip 150 can be emitted from the lateral direction of the LED strip substrate to form side light, and the light of the LED flip chip 150 can be prevented from diverging upward relative to the front surface of the main body area 110.
  • the peninsula area 120 may be arranged at equal intervals or unequal intervals along the edge of the main body area 110, preferably at equal intervals.
  • the distance between adjacent peninsula regions 120 may be 1mm-5mm, and further optionally 1.8mm-2.5mm.
  • the circuit for connecting the LED flip chip includes the positive pole 190 and the negative pole 200 of the power supply connected to the flip chip LED, as shown in FIG. 3.
  • the size of the power supply may be 24V, for example.
  • the circuit may also include a current limiting resistor 210.
  • the LED light strip substrate provided by the embodiment of the present disclosure is beneficial to form a side-emitting LED light strip.
  • a light strip based on the LED light strip substrate is embedded in a terminal device, it is possible to avoid adding additional devices for guiding the light emitted by the LED to be emitted laterally from the substrate, which makes the design of the light strip Simplified and therefore thinner and lighter, thereby reducing manufacturing costs and operating costs.
  • the conventional light strip substrate is not easy to be bent and curled because the edge side is flat, and when it must be bent and curled, such a light strip substrate will have edges and corners and is easy to be broken, which is not conducive to installation in a narrow space.
  • the LED light strip substrate provided by the embodiment of the present disclosure is provided with the peninsula area 120 at intervals on the edge of the main body area 110, that is, there are gaps between adjacent peninsula areas 120, so that when it is bent and curled It can form a certain arc, for example, it can be curled into an arc or a circle, which can ensure that the bent and curled edge remains smooth and is not easy to be broken.
  • the LED light strip substrate provided by the embodiment of the present disclosure can effectively make the light emitted by the LED flip chip diverge from the side of the LED light strip substrate, that is, to the lateral direction of the substrate; and, the embodiment of the present disclosure provides
  • the LED light strip substrate helps to realize the overall light and thin, low-cost LED side-emitting light strip, which is suitable for terminal equipment with a small internal installation structure and a bending area; and in addition, the LED light provided by the embodiment of the present disclosure
  • the belt substrate is easy to be bent to be embedded in the gap of the terminal device, is not easy to be broken, and is beneficial to achieve a more continuous side-emitting effect, so as to meet the different lighting needs of the terminal device and improve the lighting display effect of the terminal device.
  • the peninsula area 120 may include a wafer placement area 130 and a bending area 140 disposed between the main body area 110 and the wafer placement area 130.
  • the wafer placement area 130 can be used to install LED flip chips.
  • the lateral width i of the bending area 140 may be smaller than the lateral width j of the wafer placement area 130, as shown in FIG. 1.
  • the width i corresponds to the width at the section with the narrowest width in the lateral direction of the bending area
  • the width j corresponds to the width at the section with the narrowest width in the lateral direction of the wafer placement area.
  • the width i of the bending area 140 is designed to be smaller than the width j of the chip placement area 130, so that the peninsula area is convenient for bending and shaping, thereby effectively realizing the side-emitting LED light strip.
  • additional devices for directing light to the side of the substrate can be omitted, making the light strip lighter and thinner. cost.
  • the shape formed by the edge or part of the edge between the adjacent bending regions 140 may be an arc shape or a circular arc shape.
  • the edge shape between the adjacent bending regions 140 is preferably a circular arc shape, so that the peninsula region 120 is bent to form a predetermined angle with the main body region 110. At the same time, such a bending area is not easy to be broken when being bent, so as to ensure a smooth edge after bending.
  • the LED light strip substrate of the embodiment of the present disclosure can form a side-emitting LED light strip by arranging an LED flip chip on the peninsula area 120.
  • the structure of such an LED light strip is thin, simple and easy to implement.
  • the LED light strip based on the LED light strip substrate of the embodiment of the present disclosure can be installed in a terminal device with a relatively small internal space, such as in a gap.
  • the LED light strip provided by the embodiment of the present disclosure alleviates the limitation of the internal installation structure, and can meet the different lighting requirements of most terminal devices.
  • one or more light-shielding and reflecting parts 160 may be provided in the wafer placement area 130 on both sides for placing the LED flip chip 150.
  • the extending direction of the light-shielding and reflecting part 160 may be perpendicular to the extending direction of the chip placement area 130, so that the light-shielding and reflecting part 160 can be continuously arranged in the chip placement area 130 to prevent the LED flip chip 150 from leaking light, thereby improving the side-emitting LED light strip
  • the extending direction of the wafer placement area 130 is the direction in which the peninsula area 120 protrudes from the main body area 110 as a whole.
  • the light-shielding and reflection part 160 may be a structure made of light-shielding and reflective materials, such as a dam glue, which can be used to limit the light-emitting angle of the LED flip chip 150.
  • the height of the light-shielding reflection part 160 may be higher than the height of the LED flip chip 150, and the desired light emission angle and light-concentrating effect may be obtained by adjusting the height shape of the light-shielding reflection part 160.
  • the height of the light-shielding reflection part 160 shown in FIG. 4B is lower than the height of the light-shielding reflection part 160 shown in FIG. 4A. If it is assumed that the light output angle of the LED flip chip 150 in FIG. 4B is about 120°, then the light output angle of the LED flip chip 150 in FIG. 4A is smaller than that of FIG. 4B, for example, about 90°.
  • At least one light-shielding and reflecting part 160 is provided in the chip placement area 130 on the circumferential side of the position where the LED flip chip 150 is placed.
  • the light-emitting angle of the LED flip chip plays a limiting role, thereby producing a significant positive effect on the light-emitting rate of the side-emitting LED light strip in the embodiment of the present disclosure.
  • the predetermined angle ⁇ is the angle of the included angle between the peninsula area 120 and the main body area 110.
  • the predetermined angle ⁇ can be bent into any angle greater than 0 degrees and less than 180 degrees according to actual needs, so as to achieve the desired side light effect of the light strip.
  • the preset angle ⁇ is preferably 60 to 120 degrees, more preferably 80 to 110 degrees, and can usually be set to 90 degrees.
  • a filling and shaping portion 170 may be provided to support the fixed peninsula area 120 and the main body area 110.
  • the filling and shaping part 170 may be provided on the opposite side of the peninsula area 120 to the surface side where the LED flip chip 150 is mounted, so as to have a shaping effect on the LED strip substrate.
  • the filling and shaping part 170 may be filled and shaped by a silicone sleeve or other materials.
  • the distance between adjacent peninsula areas may be 1.8mm-2.5mm but is not limited to this.
  • the distance between adjacent peninsula areas may be in a larger range such as 1mm-5mm. Inside, the length can be 1.5mm-5mm.
  • the length of each peninsula should not be too long, and the distance between the peninsulas should not be too wide, because too long or too wide will easily lead to edges and corners when being bent and curled. In turn, the substrate is easily broken. Therefore, the pitch of the peninsula area can be, for example, 1.8mm-2.5mm, such as 1.8mm, 2mm, or 2.5mm, preferably 2mm, and the length can be, for example, 1.5mm, 2mm, 3mm, 4mm, or 5mm, which is more preferred.
  • the ground is 3mm.
  • the LED light strip substrate provided by the embodiments of the present disclosure is easy to bend and curl, and when the side-emitting light strip formed by it is installed in the curved gap of the terminal device, it can ensure that there is enough area to flip the light of the LED chip. It can also achieve continuous side-lighting effect while receiving to terminal equipment to meet the light output rate, which meets the light-emitting requirements for different shapes of equipment. Furthermore, the LED light strip substrate provided by the embodiments of the present disclosure is light in volume and low in cost.
  • an embodiment of the present disclosure also provides an LED light strip, which includes an LED light strip substrate and an LED flip chip 150 arranged on the peninsula 120.
  • LED light strip substrate in this embodiment is the same as that of the LED light strip substrate described in the foregoing embodiments, and will not be repeated here.
  • each LED flip chip 150 is arranged on the same side surface of each peninsula area 120. After the peninsula area 120 is bent, the side surface of the peninsula area 120 where the LED flip chip 150 is arranged A predetermined angle is formed with a corresponding side surface of the main body area 110. Or, as shown in FIG. 2, preferably, another side surface opposite to the side surface provided with the LED flip chip 150 forms a predetermined angle ⁇ with a corresponding side surface of the main body area 110.
  • the LED light strip provided by the embodiment of the present disclosure can easily cause the light emitted by the LED flip chip 150 to be emitted from the side of the LED light strip substrate.
  • the overall volume of the LED light strip is light and low in cost.
  • additional devices for directing light to the side of the substrate can be omitted, so that it is suitable for small and existing internal installation structures. Terminal equipment in the bending area.
  • a fluorescent glue 180 is optionally wrapped on the LED flip chip 150.
  • the fluorescent glue 180 can adjust and protect the color of the LED flip chip 150. Furthermore, the fluorescent glue 180 can also function as a lens, which can increase the light output angle of the LED flip chip and increase the lateral light output rate of the light strip.
  • the LED flip chip 150 is wrapped by the fluorescent glue 180, and light-shielding reflection parts 160 are provided on both sides of the LED flip chip 150.
  • the LED flip chip may use flip chip LED chips of different colors according to actual lighting requirements.
  • a CSP packaged LED flip chip can also be used.
  • the CSP package refers to a chip size package.
  • the surface of the chip is coated with fluorescent glue, and the ratio of the area of the core chip to the area of the coated fluorescent glue is 1:1.1.
  • the embodiment of the present disclosure also provides a terminal device, which includes the above-mentioned LED light strip.
  • LED light strips included in the terminal device in this embodiment have the same limitations as the LED light strips described in the foregoing embodiments, and will not be repeated here.
  • the LED light strip can be installed in a side or gap inside the device or in a bent installation structure to provide a light source for the screen.
  • the terminal device obtains an improved light transmittance due to the use of such LED light strips, thereby achieving a better display effect, and obtaining an improved device integration, thereby achieving a thinner and lighter body.
  • the embodiment of the present disclosure also provides another LED side-emitting light strip, including a substrate 310, a first dam 330 provided on the substrate 310, and a plurality of flip-chip LED chips 320 (such inverted
  • the LED chip is small in size and can be used under high current. At the same time, it has strong heat dissipation and antistatic ability, which can increase the service life of the light strip.
  • Each flip-chip LED chip 320 may be disposed at a predetermined distance from the edge 340 of the substrate; the first dam 330 may be disposed at a position closer to the inner side of the substrate 310 relative to the flip-chip LED chip 320.
  • the flip-chip LED chips 320 can be arranged along the edge 340 of the substrate, and the preset distance between the flip-chip LED chip 320 and the edge of the substrate can be determined according to the width of the substrate 310, for example, it can be zero, or it can be 1% of the substrate width. Between /8 and 1/3, to ensure that the flip-chip LED chip 320 is closer to the edge 340 of the substrate, and at the same time reserve an appropriate position between the edge 340 of the substrate, and facilitate the subsequent packaging and processing of the light strip without affecting the light strip The normal glow.
  • the first dam 330 is arranged closer to the inner side of the substrate 310 relative to the flip-chip LED chip 320, that is, on the other side opposite to the side where the edge 340 of the substrate is located.
  • the first dam 330 can be made of materials with light-shielding and reflective effects, such as dam glue, which can shield and reflect the light emitted by the flip-chip LED chip 320, so that the light emitted by the flip-chip LED chip 320 can be concentrated on Within the specified range, the lateral light extraction rate is effectively guaranteed.
  • the height of the first dam 330 can be higher than the height of the flip-chip LED chip 320, and the lateral light emission angle of the flip-chip LED chip 320 can be adjusted by adjusting the height and shape of the first dam 330.
  • the LED side light strip provided by the embodiments of the present disclosure can effectively make the light emitting direction of the flip-chip LED chip 320 extend toward the side of the substrate, limit the light-emitting angle of the flip-chip LED chip 320, and prevent the emitted light from spreading too much. The situation of reducing the lateral light extraction rate occurs. At the same time, the overall volume of the LED side-emitting light strip provided by the embodiments of the present disclosure is lighter and thinner, and the cost is lower, which can meet the light source requirements of terminal equipment with relatively small internal installation space, such as light boxes and counters.
  • the LED side-emitting light strip may further include a fluorescent glue 350 that wraps the flip-chip LED chip 320.
  • a first dam 330 may be provided on one side of the fluorescent glue 350.
  • the fluorescent glue 350 wrapped on the flip-chip LED chip 320 can be fluorescent silica gel mixed with a suitable proportion of fluorescent powder to protect the flip-chip LED chip 320 and adjust the light emission. colour.
  • the LED side-emitting light strip may further include a second dam 360.
  • the second dam 360 is disposed above the fluorescent glue 350, and the side of the second dam 360 away from the edge of the substrate is connected to the first dam 130.
  • a second dam 360 can be added to reduce the flip-chip LED chip 320 from the front surface of the substrate 310 Raise and face the light-emitting surface to increase its lateral light-emitting rate. For example, by adjusting the shape and size of the first dam 330 and the second dam 360, etc., the lateral light emitting angle of the flip-chip LED chip 320 can be adjusted.
  • the first dam 330 and the second dam 360 can be connected, so that terminal devices can be provided with side-emitting light strips with different light emission angles according to different internal installation structures. .
  • such a design can also increase the lateral light extraction rate and reduce the limitations caused by the small space, thereby meeting the different light-emitting requirements of the terminal equipment.
  • the side of the second dam 360 provided by the embodiment of the present disclosure close to the edge of the substrate may also extend to a position flush with the edge of the substrate.
  • the LED side-emitting light strip provided by the embodiment of the present disclosure adopts the first dam 330 and the second dam 360 that are connected, and the second dam 360 extends to be flush with the edge of the substrate, which can prevent excessive light divergence and light leakage. , The effect of side light emission is effectively enhanced, so that the light emitted by the flip-chip LED chip 320 is concentrated and emitted from one side of the substrate 310 in a relatively complete manner.
  • the LED side-emitting light strip provided by the embodiments of the present disclosure can provide a light source for terminal equipment with a small internal installation space by way of side-emitting, reduce light loss, improve light permeability, and prevent areas that do not need light from being exposed to light. Interference.
  • the thickness of the LED side-emitting light strip provided by the embodiments of the present disclosure may be 1mm-5mm, particularly 1mm-3mm, such as 1mm, 2mm or 3mm, particularly 1.5mm.
  • Such LED side-emitting light strips can achieve the side-emission effect while also making the thickness of the light strip lighter and thinner as a whole, so as to better meet the needs of terminal equipment with a narrow internal installation space, for example, it can be easily embedded in the interior. In the gap, save internal space.
  • the LED side-emitting light strip uses flip-chip LED chips with a smaller volume, and the distance between adjacent flip-chip LED chips can be 1mm-5mm, especially 1.5mm.
  • -2.2mm such as 1.5mm, 1.8mm, 2mm or 2.2mm, which makes it possible to arrange more densely on the substrate, and the number of flip-chip LED chips that can be installed per meter of light strip can reach, for example, 500 , which significantly helps to achieve continuous luminous effect without spot.
  • the substrate may be a flexible substrate, which can adjust the installation position according to the structure of the installation space without being easy to break the light strip, thereby facilitating installation in a terminal with a narrow space and a bending structure In the equipment, to meet the lighting needs of different terminal equipment.
  • the fluorescent glue can be continuously arranged on each flip-chip LED chip. This design is convenient to quickly cover each flip-chip LED chip with fluorescent glue on the substrate.
  • the first dam and the second dam can be continuously coated respectively, so that the flip-chip LED chip can emit light laterally, and prevent excessive light diffusion and light leakage. Occurs, effectively reducing the light emitting area from the front of the substrate and toward the upper side, and improving its lateral light emission rate.
  • the first dam and the second dam can be made of dam glue
  • the main component of the dam glue can be silica gel with the effect of shading and reflecting light, but not only It is limited to silica gel, but any other material that can provide light-shielding and reflective effects.
  • the LED side-emitting light strip provided by the embodiment of the present disclosure may further include a positive pole 520 and a negative pole 510 of a power supply connected to the flip-chip LED chip, and the voltage of the power supply may be 24V, for example.
  • the LED side-emitting light strip may also include a current limiting resistor 530.
  • the substrate may further include a die bonding area, on which a flip-chip LED chip is correspondingly provided.
  • a fluorescent glue layer is coated on the flip-chip LED chip, and then the flip-chip LED chip is placed on the other side opposite to the side close to the edge of the substrate.
  • a first dam is arranged (the first dam is arranged on one side of the fluorescent glue), and a second dam is arranged above the fluorescent glue.
  • the first type the light source is mainly SMD LED lamp beads
  • SMD LED lamp beads are in the form of a bowl cup 610
  • the light-emitting angle is generally about 120 degrees. As shown in Figure 12, it has a certain volume and is difficult to intensively mount. Realize the effect of continuous light without light spots.
  • the second is that it uses a silicone sleeve to wrap the conventional front-emitting light strip to achieve side-emission.
  • the silicone sleeve needs to completely wrap the LED light strip, the cost is increased and the volume is too large, and the surface silica gel blocks light. , The actual luminous rate is low.
  • the third type, the light source is also SMD LED lamp beads.
  • This kind of lamp belt is provided with a lens with a side opening on the surface of each SMD LED lamp bead, and the light emitted from the front of the LED is reflected by the lens, so that it can be seen from the side of the lens.
  • the finished product In order to achieve the side light-emitting effect of the light strip, the finished product has a large volume and a high cost, and the continuous light-emitting effect cannot be achieved.
  • the LED side-emitting light strips Compared with the existing LED side-emitting light strips, the LED side-emitting light strips provided by the embodiments of the present disclosure can effectively make the light-emitting direction of the flip-chip LED chip extend from the side of the substrate, which is effective for the light-emitting angle of the flip-chip LED chip. Limiting function to prevent the light emitted from spreading too much.
  • the overall volume of the LED side-emitting light strip of the present disclosure is lighter and thinner, and the cost is lower, which can meet the light source requirements of terminal devices with relatively small internal installation space.
  • the embodiment of the present disclosure also provides a terminal device, which includes the above-mentioned LED side-emitting light strip.
  • LED side light emitting light strip included in the terminal device in this embodiment is the same as the LED side light emitting light strip of the foregoing embodiments, and will not be repeated here.
  • the LED light strip can be installed in a side or gap inside the device or in a bent installation structure to provide a light source for the screen.
  • the terminal device obtains an improved light transmittance due to the use of such LED light strips, thereby achieving a better display effect, and obtaining an improved device integration, thereby achieving a thinner and lighter body.
  • modules in the device in the implementation scenario can be distributed in the device in the implementation scenario according to the description of the implementation scenario, or can be changed to be located in one or more devices different from the implementation scenario.
  • the modules of the above implementation scenarios can be combined into one module or further divided into multiple sub-modules.
  • the LED light strip substrate provided by the embodiments of the present disclosure promotes the realization of an LED side light emitting light strip with an overall light and low cost; the LED side light emitting light strip provided by the embodiments of the present disclosure can effectively make the light emitting direction of the flip-chip LED chip from the substrate
  • the lateral extension limits the light-emitting angle of the flip-chip LED chip, and is easy to be bent and placed in the gap of the terminal device, which is not easy to be broken and at the same time facilitates the realization of a more continuous side-emitting effect; and, the embodiment of the present disclosure provides
  • the terminal device obtains improved light transmittance due to the use of such LED side-emitting light strips, thereby achieving a better display effect, and obtaining an improved device integration, thereby achieving a thinner and lighter body .

Abstract

一种LED灯带基板、LED灯带以及终端设备，该LED灯带基板包括：主体区（110）和半岛区（120）；半岛区（120）沿主体区（110）边缘间隔设置并且半岛区（120）可弯折以与主体区（110）形成预定角度（θ），半岛区（120）配置成设置LED倒装晶片（150）；主体区（110）设置有用于连接LED倒装晶片（150）的电路。该LED灯带基板可有效使得LED倒装晶片（150）所发射的光从LED灯带基板的侧旁发出，对于形成LED侧发光灯带而言，这样的LED灯带基板的结构简单且易实现，显著地有利于LED侧发光灯带的普适性应用。

Description

LED灯带基板、LED灯带以及终端设备
相关申请的交叉引用
本公开要求于2019年11月18日提交中国专利局的申请号为CN201911125257.9、名称为“LED灯带基板、LED灯带以及终端设备”的中国专利申请的优先权，并且要求于2019年11月18日提交中国专利局的申请号为CN201921987307.X、名称为“LED侧发光灯带以及终端设备”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及电子电器技术领域，特别涉及一种LED灯带基板、LED灯带以及终端设备。
背景技术
在现有技术中，由于受到灯带基板本身的限制，常见的侧发光灯带主要有以下几种：使用LED贴片灯珠作为光源的侧发光灯带，将常规灯带用硅胶套包裹造型而形成的侧发光灯带，或者在常规LED灯带的贴片灯珠上覆盖光学透镜并通过光学透镜改变灯珠的出光角度而封装成的侧发光灯带。这些现有技术的侧发光灯带存在体积较大并且发光率较低的缺陷。
发明内容
有鉴于此，本公开的示例性实施例的目的包括，例如，提供经改进的LED灯带基板、LED灯带以及终端设备，以克服现有技术中的LED侧发光灯带体积大且发光率低的缺陷。
为了实现上述目的，本公开的示例性实施例提供了下述技术方案：
本公开的示例性实施例提供了一种LED灯带基板，包括主体区和半岛区。半岛区沿主体区边缘间隔设置并且半岛区可弯折以与主体区形成预定角度；半岛区用于设置LED倒装晶片；并且，主体区设置有用于连接LED倒装晶片的电路。
可选地，半岛区包括晶片放置区、以及设置在主体区与晶片放置区之间的弯折区；晶片放置区用于设置LED倒装晶片；并且，弯折区的宽度小于晶片放置区的宽度。
可选地，弯折区的在横向方向上宽度最窄的第一部段处的宽度小于晶片放置区的在横向方向上宽度最窄的第二部段处的宽度。简言之，弯折区的沿横向方向的最窄宽度小于晶片放置区的沿横向方向的最窄宽度。
可选地，两个相邻的弯折区之间的边缘或部分边缘构成的形状为圆弧形。
可选地，在晶片放置区中用于放置LED倒装晶片的两侧设置有遮光反射部，用于 调整LED倒装晶片的出光角度；遮光反射部的延伸方向垂直于晶片放置区的延伸方向。
可选地，预定角度为半岛区与主体区之间的夹角的角度，预定角度大于0度且小于180度；在夹角侧，即在在主体区的与该夹角相关的一侧与半岛区的与该夹角相关的一侧之间，设置有填充定型部，用于支撑固定半岛区和主体区；填充定型部在用于设置LED倒装晶片的表面侧的相反侧。
可选地，各半岛区的间距可以为1mm-5mm，例如可选地为1.8mm-2.5mm，长度为1.5mm-5mm。
本公开的示例性实施例还提供了一种LED灯带，其包括LED灯带基板和设置在半岛区上的LED倒装晶片。
可选地，LED倒装晶片上包裹有荧光胶。
本公开示例性实施例还提供了一种终端设备，其包括上述的LED灯带。
可选地，终端设备包括灯箱。
本公开的示例性实施例提供的LED灯带基板有助于实现整体体积轻薄且成本较低的LED侧发光灯带，适用于内部安装结构空间狭小且存在弯折区域的终端设备。本公开的示例性实施例提供的LED灯带可有效使得LED倒装晶片所发射的光从LED灯带基板的侧旁发出，并且如此构造的LED侧发光灯带的结构简单易实现。此外，本公开的示例性实施例提供的LED灯带尤其便于弯折镶嵌于终端设备的缝隙，不易折损同时利于实现较为连续的侧发光效果，以满足终端设备的发光需求，提高终端设备的照明显示效果。
本公开的示例性实施例还提供了另一种LED侧发光灯带，其包括：基板、设于基板上的第一围坝以及多个倒装LED晶片。各倒装LED晶片设置在距一基板边缘预定距离的位置；第一围坝相对于倒装LED晶片设置在更靠近基板内侧的位置。
可选地，上述基板边缘位于与上述基板内侧相反的基板外侧处；或者，基板内侧为LED基板的没有设置LED倒装晶片的一侧。
可选地，该另一种LED侧发光灯带还包括包裹倒装LED晶片的荧光胶。
可选地，该另一种LED侧发光灯带还包括第二围坝。第二围坝可以至少部分地设置于荧光胶上方。作为示例，第二围坝可以部分地设置于荧光胶上，并且部分地设置于第一围坝上，也即，第二围坝的远离基板边缘的侧部或一侧至少部分地与第一围坝相连。
可选地，第二围坝靠近基板边缘的一侧延伸至与基板边缘齐平的位置。
可选地，LED侧发光灯带的厚度为1mm-5mm，特别地1mm-3mm。
可选地，各倒装LED晶片之间的间距为1mm-5mm，特别地为1.5mm-2.2mm。
可选地，基板为柔性基板。
可选地，荧光胶连续设置在基板上并覆盖每一个倒装LED晶片。
本公开的示例性实施例还提供了另一种终端设备诸如灯箱，其包括上述的另一种LED侧发光灯带。
与现有的LED侧发光灯带相比，本公开的示例性实施例提供的该另一种LED侧发光灯带可有效使得倒装LED晶片的出光方向从基板的侧向延伸，对倒装LED晶片的出光角度起到限定作用，防止其发出的光过于扩散。另外，本公开的示例性实施例提供的该另一种LED侧发光灯带的整体体积更加轻薄，成本更低，能够满足内部安装空间较为狭小的终端设备对光源的需求。
此外，本公开示例性实施例提供的终端设备诸如灯箱中可安装上述的另一种LED侧发光灯带，以用作光源。LED侧发光灯带可安装在设备内部的侧旁或者间隙或者存在弯折的安装结构中，以为屏幕提供光源。终端设备由于对这样的LED灯带的使用而获得经提高的光的通透率，进而实现了更好的显示效果，并且获得经提高的设备的集成度，进而实现更加轻薄的机身。
附图说明
图1示出了本公开实施例提供的LED灯带基板的正视图；
图2示出了本公开实施例提供的LED灯带基板弯折后的侧视图；
图3示出了本公开实施例提供的LED灯带基板的另一正视图；
图4A和图4B示出了本公开实施例提供的LED灯带基板弯折后的另一侧视图；
图5A、图5B和图5C示出本公开实施例提供的LED灯带基板弯折后的又一侧视图；
图6出了本公开实施例提供的LED灯带的示意图；
图7示出了本公开实施例提供的另一种LED侧发光灯带的第一结构示意图；
图8示出了本公开实施例提供的另一种LED侧发光灯带的第二结构示意图；
图9示出了本公开实施例提供的另一种LED侧发光灯带的第三结构示意图；
图10示出了本公开实施例提供的另一种LED侧发光灯带的第四结构示意图；
图11示出了本公开实施例提供的另一种LED侧发光灯带的第五结构示意图；
图12示出了现有技术侧发光灯带的结构示意图。
具体实施方式
在下文中，将更全面地描述本公开的各种实施例。本公开可具有各种实施例，并且可在其中做出调整和改变。然而，应理解：不存在将本公开保护范围限于在此公开的特定实施例的意图，而是应将本公开理解为涵盖落入本公开的各种实施例的精神和范围内的所有 调整、等同物和/或可选方案。
在下文中，可在本公开的各种实施例中使用的术语“包括”或“可包括”指示所公开的功能、操作或元件的存在，并且不限制一个或更多个功能、操作或元件的增加。此外，如在本公开的各种实施例中所使用，术语“包括”、“具有”及其同源词仅意在表示特定特征、数字、步骤、操作、元件、组件或前述项的组合，并且不应被理解为首先排除一个或更多个其它特征、数字、步骤、操作、元件、组件或前述项的组合的存在或增加一个或更多个特征、数字、步骤、操作、元件、组件或前述项的组合的可能性。
在本公开的各种实施例中，表述“A或/和B中的至少一个”包括同时列出的文字的任何组合或所有组合。例如，表述“A或B”或“A或/和B中的至少一个”可包括A、可包括B或可包括A和B二者。
在本公开的各种实施例中使用的表述(诸如“第一”、“第二”等)可修饰在各种实施例中的各种组成元件，不过可不限制相应组成元件。例如，以上表述并不限制元件的顺序和/或重要性。以上表述仅用于将一个元件与其它元件区别开的目的。例如，第一用户装置和第二用户装置指示不同用户装置，尽管二者都是用户装置。例如，在不脱离本公开的各种实施例的范围的情况下，第一元件可被称为第二元件，同样地，第二元件也可被称为第一元件。
应注意到：如果描述将一个组成元件“连接”到另一组成元件，则可将第一组成元件直接连接到第二组成元件，并且可在第一组成元件和第二组成元件之间“连接”第三组成元件。相反地，当将一个组成元件“直接连接”到另一组成元件时，可理解为在第一组成元件和第二组成元件之间不存在第三组成元件。
在本公开的各种实施例中使用的术语仅用于描述特定实施例的目的并且并非意在限制本公开的各种实施例。除非另有限定，否则在这里使用的所有术语(包括技术术语和科学术语)具有与本公开的各种实施例所属领域普通技术人员通常理解的含义相同的含义。术语(诸如在一般使用的词典中限定的术语)将被解释为具有与在相关技术领域中的语境含义相同的含义并且将不被解释为具有理想化的含义或过于正式的含义，除非在本公开的各种实施例中被清楚地限定。
参见图1和图2，本公开的实施例提供了一种LED灯带基板，包括主体区110和半岛区120。半岛区120可以沿主体区110的至少一个边缘例如图1中所示的一横向边缘间隔地设置，并且半岛区120可被弯折成与主体区110成预定角度。半岛区120可以用于设置LED倒装晶片。主体区110可以设置有用于连接LED倒装晶片的电路。
主体区110可以是LED灯带基板上的设置有连接LED倒装晶片的电路的一基板面。半岛区120可以是沿主体区110的边缘间隔设置的、可用于设置LED倒装晶片的小块基板 面。半岛区120的延纵向方向的长度x通常小于主体区110的延纵向方向的长度y，如图1所示，例如半岛区的长度可以为约1.5mm-3mm，大致占主体区110的长度y的1/8-1/3。
在本公开的实施例中，半岛区120可被弯折以与主体区110形成预定角度θ，如图2所示，从而当在LED灯带基板上的半岛区120处设置LED倒装晶片150时，LED倒装晶片150的光可从LED灯带基板的横向方向发出形成侧发光，并且可防止LED倒装晶片150的光相对于主体区110的正面朝上发散。
在本公开的实施例中，半岛区120可以沿主体区110的边缘等间距地设置或不等间距地设置，优选是等间距设置。例如，相邻的半岛区120之间的间距可为1mm-5mm，进一步可选地为1.8mm-2.5mm。
在本公开实施例提供的LED灯带基板中，用于连接LED倒装晶片的电路包括倒装LED晶片所连接电源的正极190、负极200，如图3所示。电源的大小例如可以为24V。可选地，该电路还可以包括限流电阻210。
本公开实施例提供的LED灯带基板有利于形成侧发光的LED灯带。例如，当将基于该LED灯带基板的灯带镶嵌在终端设备中时，能够免于添加额外的用于将LED所发射的光引导成从基板侧向发出的器件，这使得灯带的设计得以简化并且因此轻薄化，从而降低了制造成本及使用成本。
此外，常规的灯带基板由于边缘侧是平整的而导致其不易被弯折卷曲，并且当必须被弯折卷曲时这样的灯带基板会存在棱角且容易被折断，不利于安装在空间狭小且有弯折的设备终端中。与此相比，本公开实施例提供的LED灯带基板由于半岛区120是间隔设置在主体区110的边缘的，即，相邻的半岛区120之间存在空隙，使得当其被弯折卷曲时可形成一定弧度，例如可卷曲成弧形或圆形，能保证弯折卷曲后的边缘保持平滑，不易被折断。
也就是说，本公开实施例提供的LED灯带基板可有效使得LED倒装晶片发射的光从LED灯带基板的侧向发散，即向基板的横向方向发出；并且，本公开实施例提供的LED灯带基板有助于实现整体体积轻薄、成本较低的LED侧发光灯带，适用于内部安装结构的空间狭小且存在弯折区域的终端设备；并且此外，本公开实施例提供的LED灯带基板便于弯折以镶嵌于终端设备的缝隙，不易折损，利于实现较为连续的侧发光效果，从而满足终端设备的不同发光需求，提高终端设备的照明显示效果。
再参见图1，在本公开的实施例中，半岛区120可以包括晶片放置区130、以及设置在主体区110与晶片放置区130之间的弯折区140。晶片放置区130可以用于设置LED倒装晶片。弯折区140的横向宽度i可以小于晶片放置区130的横向宽度j，如图1所示。可选地，宽度i为对应于弯折区的在横向方向上宽度最窄的部段处的宽度，并且宽度j对应于晶片放置区的在横向方向上宽度最窄的部段处的宽度。
在本公开实施例提供的LED灯带基板中，弯折区140的宽度i设计成小于晶片放置区130的宽度j，使得半岛区便于弯折定型，从而可有效实现侧发光的LED灯带，并且当基于本实施例的LED灯带基板的侧发光的LED灯带镶嵌在终端设备中，可省去添加额外的用于将光导向基板侧向方向的器件，使得灯带更加轻薄，降低了成本。
在本公开的实施例中，相邻的弯折区140之间的边缘或部分边缘所构成的形状可以为弧形或圆弧形。
在本公开实施例提供的LED灯带基板中，相邻的弯折区140之间的边缘形状优选为圆弧形，以便于半岛区120弯折成与主体区110成预定角度。同时，这样的弯折区在被弯折时不易被折断，保证弯折后的边缘平滑。
本公开实施例的LED灯带基板能够通过在半岛区120上设置LED倒装晶片形成侧发光的LED灯带，这样的LED灯带的结构轻薄、简单且易实现。基于本公开实施例的LED灯带基板的LED灯带可安装在内部空间较为狭小的终端设备中如安装在隙缝中。本公开实施例提供的LED灯带减轻了受内部安装结构限制的局限性，能够满足大部分的终端设备的不同发光需求。
参见图4A、图4B和图1，在本公开的实施例中，在晶片放置区130中、在用于放置LED倒装晶片150的两侧可以设置有一个或多个遮光反射部160，用于调整LED倒装晶片150的出光角度。遮光反射部160的延伸方向可以垂直于晶片放置区130的延伸方向，以使得遮光反射部160能够连续地设置于晶片放置区130，防止LED倒装晶片150漏光，从而提高侧发光型LED灯带的出光率，其中，晶片放置区130的延伸方向即半岛区120从主体区110整体地突出的方向。
遮光反射部160可以为由遮光反射材料构成的结构，如由围坝胶构成，其可用于对LED倒装晶片150的出光角度进行限定。遮光反射部160的高度可以高于LED倒装晶片150的高度，并且，可以通过调整遮光反射部160的高度形状而获得所期望的出光角度和聚光效果。
作为示例，可以看到，图4B中示出的遮光反射部160的高度低于图4A中示出的遮光反射部160的高度。若假设图4B中的LED倒装晶片150的出光角度约为120°，那么图4A中的LED倒装晶片150的出光角度则小于图4B的出光角度，例如约为90°。
在本公开实施例提供的LED灯带基板中，在晶片放置区130中、在用于放置LED倒装晶片150的部位的周向侧部设置有至少一个遮光反射部160，由此，能够对LED倒装晶片的出光角度起到限定作用，从而对本公开实施例中的侧发光型LED灯带的出光率产生显著的积极效应。
参见图1并参见图5A、图5B和图5C，在本公开的实施例中，预定角度θ为半岛区120 与主体区110之间的夹角的角度。
在本公开实施例提供的LED灯带基板中，预定角度θ可根据实际需求而弯折成大于0度且小于180度的任何角度，以便于实现灯带的期望的侧发光效果。典型地，预设角度θ优选为60～120度，更优选为80～110度，并且通常可以设置为90度。
在本公开实施例中，在主体区110的与该夹角θ相关的一侧与被弯折的半岛区120的与该夹角θ相关的一侧之间，如图5A至5C中所示，可以设置有填充定型部170，以用于支撑固定半岛区120和主体区110。填充定型部170可以设置在半岛区120的用于安装LED倒装晶片150的表面侧的相反侧，以对LED灯带基板起到定型作用。填充定型部170可由硅胶套或者其他材料填充定型得到。
在本公开的实施例中，相邻半岛区的间距可以为1.8mm-2.5mm但不限于此，例如在某些实施方式中，相邻半岛区的间距可以处于更大的范围诸如1mm-5mm内，长度可以为1.5mm-5mm。
对于本公开实施例提供的LED灯带基板，各半岛区的长度通常不宜过长，且各半岛区的间距不宜过宽，因为过长或过宽容易导致在被弯折卷曲时边缘出现棱角，进而导致基板容易被折断。因此，半岛区的间距例如可以为1.8mm-2.5mm，如可以为1.8mm、2mm或者2.5mm，较优地为2mm，并且长度例如可以为1.5mm、2mm、3mm、4mm或者5mm，较优地为3mm。
本公开实施例提供的LED灯带基板便于弯折卷曲，并且当由其形成的侧发光灯带安装在终端设备的弯曲的缝隙中时，在能够保证有足够的面积将LED倒装晶片的光承接给终端设备以满足出光率的同时，还能够实现连续的侧发光效果，满足了针对设备的不同造型的发光需求。进一步地，本公开实施例提供的LED灯带基板体积轻薄、成本较低。
参见图6，本公开实施例还提供了一种LED灯带，包括LED灯带基板和设置在半岛区120上的LED倒装晶片150。
需要说明的是，本实施例中的LED灯带基板与上述各实施例所述的LED灯带基板的限定相同，在此不再赘述。
在本公开实施例提供的LED灯带中，各LED倒装晶片150设置于各半岛区120的同一侧面，在半岛区120被弯折后，半岛区120的设有LED倒装晶片150的侧面与主体区110的一对应侧面形成预定角度。或者，如图2所示，较优选地，与设有LED倒装晶片150的侧面相对的另一侧面与主体区110的一对应侧面形成预定角度θ。
本公开实施例提供的LED灯带可容易地使得由LED倒装晶片150发射的光从LED灯带基板的侧旁发出。此外，LED灯带的整体体积轻薄成本较低，当镶嵌在终端设备中时，可省去添加额外的用于将光导向基板侧旁发出的器件，从而，适用于内部安装结构空间狭 小且存在弯折区域的终端设备。
再返回参见图2，在LED倒装晶片150上可选地包裹有荧光胶180。
对于本公开实施例提供的LED灯带，荧光胶180可以对LED倒装晶片150起到发光颜色调节以及保护的作用。进一步地，荧光胶180还可起到透镜作用，能够增大LED倒装晶片的出光角度，提高灯带侧向的出光率。
在本公开的实施例中，如图4A和图4B所示，荧光胶180包裹LED倒装晶片150，再在LED倒装晶片150的两侧设置遮光反射部160。
在本公开的实施例中，LED倒装晶片可根据实际的发光需求而使用不同颜色的倒装LED晶片。进一步地，也可以使用CSP封装的LED倒装晶片，CSP封装是指晶片尺寸封装，晶片表面包裹有荧光胶，其内核晶片面积与包裹的荧光胶的面积比例为1:1.1。
本公开实施例还提供了一种终端设备，其包括上述的LED灯带。
需要说明的是，本实施例中的终端设备所包括的LED灯带与上述各实施例所述的LED灯带的限定相同，在此不再赘述。
在本公开实施例提供的终端设备诸如灯箱中，LED灯带可安装在设备内部的侧旁或者间隙或者存在弯折的安装结构中，以为屏幕提供光源。终端设备由于对这样的LED灯带的使用而获得经提高的光的通透率，进而实现了更好的显示效果，并且获得经提高的设备的集成度，进而实现更加轻薄的机身。
参见图7和图8，本公开实施例还提供了另一种LED侧发光灯带，包括基板310、设于基板310上的第一围坝330以及多个倒装LED晶片320(这样的倒装LED晶片尺寸较小，可在大电流下使用，同时散热和抗静电能力较强，可提高灯带的使用寿命)。
各倒装LED晶片320可以设置在距离基板边缘340预定距离的位置；第一围坝330可以相对于倒装LED晶片320设置在更靠近基板310内侧的位置。
为了使得在基板310上的倒装LED晶片320所发射的光从基板310侧旁发出，需要减小用于光从基板310的正面且朝上发出的出光角度，增强倒装LED晶片320在基板310侧向发光的出光率，从而实现侧发光。
倒装LED晶片320可以沿基板边缘340排列设置，并且倒装LED晶片320与基板边缘之间的预设距离可根据基板310的宽度大小而定，例如可以为零，或者可以为基板宽度的1/8至1/3之间，以在保证倒装LED晶片320较为靠近基板边缘340的同时在与基板边缘340之间预留适当位置，便于后续对灯带的封装处理，而不影响灯带的正常发光。
如图8，第一围坝330相对于倒装LED晶片320设置在更靠近基板310内侧的位置，即设置在与基板边缘340所在的一侧相反的另一侧。第一围坝330可采用具有遮光和反射效果的材料，例如围坝胶，从而可对倒装LED晶片320发射的光起到遮挡和反射作用，以 使得倒装LED晶片320发射的光汇聚在指定范围内，有效保证侧向的出光率。
第一围坝330的高度可以高于倒装LED晶片320的高度，且可通过调整第一围坝330的高度及形状等来调整倒装LED晶片320的侧向出光角度。
本公开实施例提供的LED侧发光灯带可有效使得倒装LED晶片320的出光方向朝向基板侧旁延伸，对倒装LED晶片320的出光角度起到限定作用，防止其发出的光过于扩散从而降低侧向出光率的情况发生。同时，本公开实施例提供的LED侧发光灯带整体体积更加轻薄，成本较低，能够满足内部安装空间较为狭小的终端设备如灯箱、柜台对光源的需求。
参见图8，在本公开的实施例中，LED侧发光灯带还可以包括包裹倒装LED晶片320的荧光胶350。
可以在对倒装LED晶片320包裹荧光胶350之后，在荧光胶350的一侧设置第一围坝330。
在本公开实施例提供的LED侧发光灯带中，包裹在倒装LED晶片320上的荧光胶350可以为混合了适合比例的荧光粉的荧光硅胶，用以保护倒装LED晶片320并调节发光颜色。
参见图9，在本公开的的实施例中，LED侧发光灯带还可以包括第二围坝360。
可选地，第二围坝360设于荧光胶350上方，第二围坝360远离基板边缘的一侧与第一围坝130相连。
为了能够限定倒装LED晶片320的侧向出光角度，让其所发射的光汇聚在出光角度所覆盖的方向，可增加第二围坝360以减小倒装LED晶片320的从基板310的正面起且朝向方的出光面，从而提高其侧向出光率。例如，可通过调节第一围坝330以及第二围坝360的形状和大小等，从而调整倒装LED晶片320的侧向出光角度。
在本公开实施例提供的LED侧发光灯带中，可将第一围坝330与第二围坝360相连，从而可根据不同内部安装结构，为终端设备提供具有不同出光角度的侧发光灯带。此外，这样的设计还可提高侧向出光率，以及减小因狭小空间导致的局限性，进而满足终端设备的不同发光需求。
参照图10，本公开实施例提供的第二围坝360的靠近基板边缘的一侧还可以延伸至与基板边缘齐平的位置。
本公开实施例提供的LED侧发光灯带采用相连的第一围坝330和第二围坝360且第二围坝360延伸至与基板边缘齐平，这可防止光过于发散以及漏光的情况发生，有效增强了侧发光的效果，使得倒装LED晶片320发出的光汇聚从而较为完整地从基板310的一侧发出。本公开实施例提供的LED侧发光灯带可通过侧发光的方式为内部安装空间狭小的终端设备提供光源，降低光的损耗，提高光的通透性，同时能够避免不需要光照的区域受到光 照的干扰。
本公开实施例提供的LED侧发光灯带的厚度可以为1mm-5mm，特别地为1mm-3mm，例如1mm、2mm或3mm，特别地为1.5mm。这样的LED侧发光灯带在实现侧发光效果的同时，还能使灯带的厚度从整体上更加轻薄，以能够更好的满足内部安装空间较窄的终端设备，例如可便于镶嵌在内部的缝隙中，节约内部空间。
在现有技术中，由于现有的侧发光灯带的主要光源是贴片LED灯珠，而LED贴片灯珠的体积较大，对排布间距有高要求，因此通常而言每一米的灯带可安装的灯珠数量在60-180之间。与之相比，本公开实施例提供的LED侧发光灯带采用的是体积较小的倒装LED晶片，相邻的倒装LED晶片之间的间距可为1mm-5mm，特别地为1.5mm-2.2mm，例如1.5mm、1.8mm、2mm或2.2mm，由此使得能够较为密集地在基板上进行排布，每一米的灯带可安装的倒装LED晶片的数量能达到如500颗，显著地有助于实现连续无光斑的发光效果。
在本公开实施例提供的LED侧发光灯带中，基板可以为柔性基板，其可以根据安装空间的结构调整安装位置而不易折损灯带，从而便于安装在空间狭小且具有弯折结构的终端设备中，以满足不同终端设备的发光需求。
在本公开实施例提供的LED侧发光灯带中，荧光胶可连续地设置在各个倒装LED晶片上。这样的设计便于快速地在基板上为每一倒装LED晶片覆盖荧光胶。
在本公开实施例提供的LED侧发光灯带中，第一围坝和第二围坝可分别连续地进行涂覆，从而可使得倒装LED晶片侧向出光，防止光过于扩散和漏光现象的发生，有效减少光从基板正面且朝向上方的发光面积，提高其侧向出光率。
在本公开实施例提供的LED侧发光灯带中，第一围坝和第二围坝可利用围坝胶构成，其围坝胶的主要成分可以为具有遮光和反射光线的效果硅胶，但不仅限于硅胶，而是能够起到遮光和反射效果的任何其他材料均可。
参见图11，本公开实施例提供的LED侧发光灯带还可以包括与倒装LED晶片连接的电源的正极520、负极510，电源的电压大小例如可以为24V。此外，LED侧发光灯带还可以包括限流电阻530。
在本公开实施例提供的LED侧发光灯带中，其基板上还可以包括固晶区域，其上对应设有倒装LED晶片。在本公开实施例中，在将倒装LED晶片设置在固晶区域后，在倒装LED晶片上涂覆荧光胶层，然后在与倒装LED晶片靠近基板边缘的一侧相反的另一侧设置第一围坝(第一围坝设于荧光胶的一侧)，以及在荧光胶上方设置第二围坝。
目前，现有的大部分侧发光灯带有如下三种：
第一种，其光源主要是贴片LED灯珠，贴片LED灯珠采用碗杯610形式，发光角度 一般在120度左右，如图12所示，其具有一定的体积，难以密集贴装以实现连续发光无光斑的效果。
第二种，其使用硅胶套包裹常规的正面发光的灯带，实现外观上的侧发光，但是由于硅胶套需要完全包裹LED灯带，导致成本升高且体积偏大，且由于表面硅胶挡光，实际发光率较低。
第三种，其发光光源也是贴片LED灯珠，此种灯带在每个贴片LED灯珠表面设置有一个带侧开口的透镜，通过透镜反射LED正面发出的光，让其从透镜侧面发出，以此实现灯带的侧面发光效果，此成品体积较大，成本较高，且无法实现连续发光效果。
与现有的LED侧发光灯带相比，本公开实施例提供的LED侧发光灯带可有效使得倒装LED晶片的出光方向从基板的侧向延伸，对倒装LED晶片的出光角度起到限定作用，防止其发出的光过于扩散。另外，本公开的LED侧发光灯带整体体积更加轻薄，成本较低，能够满足内部安装空间较为狭小的终端设备对光源的需求。
本公开实施例还提供了一种终端设备，其包括上述的LED侧发光灯带。
需要说明的是，本实施例中的终端设备所包括的LED侧发光灯带与上述各实施例的LED侧发光灯带所述的限定相同，在此不再赘述。
在本公开实施例提供的终端设备诸如灯箱中，LED灯带可安装在设备内部的侧旁或者间隙或者存在弯折的安装结构中，以为屏幕提供光源。终端设备由于对这样的LED灯带的使用而获得经提高的光的通透率，进而实现了更好的显示效果，并且获得经提高的设备的集成度，进而实现更加轻薄的机身。本领域技术人员可以理解附图只是一个优选实施场景的示意图，附图中的模块或流程并不一定是实施本公开实施例所必须的。
本领域技术人员可以理解实施场景中的装置中的模块可以按照实施场景描述进行分布于实施场景的装置中，也可以进行相应变化位于不同于本实施场景的一个或多个装置中。上述实施场景的模块可以合并为一个模块，也可以进一步拆分成多个子模块。
上述本公开序号仅仅为了描述，不代表实施场景的优劣。以上公开的仅为本公开的几个具体实施场景，但是，本公开并非局限于此，任何本领域的技术人员能思之的变化都应落入本公开的保护范围。
工业实用性
本公开实施例提供的LED灯带基板促进实现整体体积轻薄且成本较低的LED侧发光灯带；本公开实施例提供的LED侧发光灯带可有效使得倒装LED晶片的出光方向从基板的侧向延伸，对倒装LED晶片的出光角度起到限定作用，并且便于弯折地置于终端设备的缝隙，不易折损同时利于实现较为连续的侧发光效果；以及，本公开实施例提供的终端设备由于对这样的LED侧发光灯带的使用而获得经提高的光的通透率，进而实现 了更好的显示效果，并且获得经提高的设备的集成度，进而实现更加轻薄的机身。

Claims (20)

  1. 一种LED灯带基板，其特征在于，包括主体区和半岛区；
    所述半岛区沿所述主体区边缘间隔设置并且所述半岛区能弯折以与所述主体区形成预定角度，所述半岛区配置成设置LED倒装晶片；
    所述主体区设置有配置成连接所述LED倒装晶片的电路。
  2. 根据权利要求1所述的LED灯带基板，其特征在于，所述半岛区包括晶片放置区、以及设置在所述主体区与所述晶片放置区之间的弯折区；
    所述晶片放置区配置成设置所述LED倒装晶片；以及
    所述弯折区的宽度小于所述晶片放置区的宽度。
  3. 根据权利要求2所述的LED灯带基板，其特征在于，所述弯折区的在横向方向上宽度最窄的第一部段处的宽度小于所述晶片放置区的在所述横向方向上宽度最窄的第二部段处的宽度。
  4. 根据权利要求2所述的LED灯带基板，其特征在于，两个相邻的弯折区之间的边缘或部分边缘所构成的形状为圆弧形。
  5. 根据权利要求2所述的LED灯带基板，其特征在于，在所述晶片放置区中，在所述LED倒装晶片的两侧设置有遮光反射部，用于调整所述LED倒装晶片的出光角度；并且
    所述遮光反射部的延伸方向垂直于所述晶片放置区的延伸方向。
  6. 根据权利要求1所述的LED灯带基板，其特征在于，所述预定角度为所述半岛区与所述主体区之间的夹角的角度，所述预定角度大于0度且小于180度；
    在所述主体区的与所述夹角相关的一侧与所述半岛区的与所述夹角相关的一侧之间设置有填充定型部，用于支撑固定所述半岛区和所述主体区；
    所述填充定型部位于与所述半岛区的配置成设置所述LED倒装晶片的表面侧相反的一侧。
  7. 根据权利要求1所述的LED灯带基板，其特征在于，相邻的所述半岛区沿横向方向的间距为1mm-5mm，特别地为1.8mm-2.5mm，并且所述半岛区沿纵向方向的长度为1.5mm-5mm。
  8. 一种LED灯带，其特征在于，所述LED灯带包括权利要求1-7中任一项所述的LED灯带基板和设置在所述LED灯带基板的所述半岛区上的LED倒装晶片。
  9. 根据权利要求8所述的LED灯带，其特征在于，在所述LED倒装晶片上包裹有荧光胶。
  10. 一种终端设备，其特征在于，所述终端设备包括权利要求8或9所述的LED灯带。
  11. 一种LED侧发光灯带，其特征在于，所述LED侧发光灯带包括：基板、设于所述基板上的第一围坝以及多个倒装LED晶片；
    各所述倒装LED晶片设置在距离基板边缘预定距离的位置；所述第一围坝相对于所述倒装LED晶片设置在更靠近所述基板内侧的位置。
  12. 根据权利要求11所述的LED侧发光灯带，其特征在于，所述基板边缘位于与所述基板内侧相反的基板外侧处；或者，所述基板内侧为所述LED基板的没有设置所述LED倒装晶片的一侧。
  13. 根据权利要求11所述的LED侧发光灯带，其特征在于，所述LED侧发光灯带还包括包裹所述倒装LED晶片的荧光胶。
  14. 根据权利要求13所述的LED侧发光灯带，其特征在于，所述LED侧发光灯带还包括第二围坝，所述第二围坝至少部分地设置于所述荧光胶上方。
  15. 根据权利要求14所述的LED侧发光灯带，其特征在于，所述第二围坝部分地设置于所述荧光胶上方，并且所述第二围坝的远离所述基板边缘的侧部至少部分地与所述第一围坝相连。
  16. 根据权利要求14或15所述的LED侧发光灯带，其特征在于，所述第二围坝的靠近所述基板边缘的侧部延伸成与所述基板边缘齐平。
  17. 根据权利要求11所述的LED侧发光灯带，其特征在于，所述LED侧发光灯带的厚度为1mm-5mm，特别地为1mm-3mm。
  18. 根据权利要求11所述的LED侧发光灯带，其特征在于，相邻的所述倒装LED晶片之间的间距为1mm-5mm，特别地为1.5mm-2.2mm。
  19. 根据权利要求13所述的LED侧发光灯带，其特征在于，所述荧光胶连续地设置在所述基板上并覆盖每一个所述倒装LED晶片。
  20. 一种终端设备，其特征在于，所述终端设备包括权利要求11至19中任一项所述的LED侧发光灯带。
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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203656837U (zh) * 2013-12-31 2014-06-18 广州市权友照明灯具有限公司 一种可折叠柔性线路板及一种可弯折led灯管
US20150188011A1 (en) * 2013-12-30 2015-07-02 Iljin Led Co., Ltd. Side-emitting type nitride semiconductor light emitting chip and nitride semiconductor light emitting device having the same
CN204857783U (zh) * 2015-04-09 2015-12-09 江西省晶瑞光电有限公司 一种侧面发光的led
CN205229608U (zh) * 2015-11-04 2016-05-11 Tcl显示科技（惠州）有限公司 液晶显示模组的主柔性线路板及液晶显示模组
CN109442252A (zh) * 2018-11-20 2019-03-08 深圳市蓝菲光电科技有限公司 一种侧发光led灯带
CN109854982A (zh) * 2017-11-30 2019-06-07 王定锋 一种侧发光的led灯带及其制作方法
CN109973851A (zh) * 2019-04-24 2019-07-05 深圳市欣上科技有限公司 双层线路大角度发光led软灯带及发光产品
CN209340936U (zh) * 2019-03-25 2019-09-03 中山市虹宇光电科技有限公司 一种侧面发光灯带
CN210429878U (zh) * 2019-11-18 2020-04-28 深圳市欣上科技有限公司 Led灯带基板、led灯带以及终端设备

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4077170B2 (ja) * 2000-09-21 2008-04-16 シャープ株式会社 半導体発光装置
US7736044B2 (en) * 2006-05-26 2010-06-15 Avago Technologies General Ip (Singapore) Pte. Ltd. Indirect lighting device for light guide illumination
TWI352179B (en) * 2008-11-20 2011-11-11 Everlight Electronics Co Ltd Light module
JP5396215B2 (ja) * 2009-09-24 2014-01-22 スタンレー電気株式会社 半導体発光装置の製造方法、半導体発光装置および液晶表示装置
WO2015064883A1 (en) * 2013-11-01 2015-05-07 Seoul Semiconductor Co., Ltd. Light source module and backlight unit having the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150188011A1 (en) * 2013-12-30 2015-07-02 Iljin Led Co., Ltd. Side-emitting type nitride semiconductor light emitting chip and nitride semiconductor light emitting device having the same
CN203656837U (zh) * 2013-12-31 2014-06-18 广州市权友照明灯具有限公司 一种可折叠柔性线路板及一种可弯折led灯管
CN204857783U (zh) * 2015-04-09 2015-12-09 江西省晶瑞光电有限公司 一种侧面发光的led
CN205229608U (zh) * 2015-11-04 2016-05-11 Tcl显示科技（惠州）有限公司 液晶显示模组的主柔性线路板及液晶显示模组
CN109854982A (zh) * 2017-11-30 2019-06-07 王定锋 一种侧发光的led灯带及其制作方法
CN109442252A (zh) * 2018-11-20 2019-03-08 深圳市蓝菲光电科技有限公司 一种侧发光led灯带
CN209340936U (zh) * 2019-03-25 2019-09-03 中山市虹宇光电科技有限公司 一种侧面发光灯带
CN109973851A (zh) * 2019-04-24 2019-07-05 深圳市欣上科技有限公司 双层线路大角度发光led软灯带及发光产品
CN210429878U (zh) * 2019-11-18 2020-04-28 深圳市欣上科技有限公司 Led灯带基板、led灯带以及终端设备

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