WO2021097734A1 - Method for transferring led chip - Google Patents

Method for transferring led chip Download PDF

Info

Publication number
WO2021097734A1
WO2021097734A1 PCT/CN2019/119808 CN2019119808W WO2021097734A1 WO 2021097734 A1 WO2021097734 A1 WO 2021097734A1 CN 2019119808 W CN2019119808 W CN 2019119808W WO 2021097734 A1 WO2021097734 A1 WO 2021097734A1
Authority
WO
WIPO (PCT)
Prior art keywords
carrier board
carrier
led die
board
viscous substance
Prior art date
Application number
PCT/CN2019/119808
Other languages
French (fr)
Chinese (zh)
Inventor
洪温振
许时渊
Original Assignee
重庆康佳光电技术研究院有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 重庆康佳光电技术研究院有限公司 filed Critical 重庆康佳光电技术研究院有限公司
Priority to PCT/CN2019/119808 priority Critical patent/WO2021097734A1/en
Priority to CN201980002746.7A priority patent/CN110998824A/en
Publication of WO2021097734A1 publication Critical patent/WO2021097734A1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Definitions

  • the invention relates to the field of LEDs, in particular to a method for transferring LED crystal grains.
  • Micro-LED Micro Light Emitting Diode
  • OLED Organic Light Emitting Diode
  • Micro-LED technology the LED structure design is thinned, miniaturized, and arrayed, and its size is only about 1-10 ⁇ m.
  • the biggest advantage of Micro-LED comes from the micron-level pitch, each pixel (pixel) can be addressed and controlled and single-point driven to emit light, long life, and a wide range of applications.
  • the bottleneck restricting the development of Micro-LED display technology mainly includes massive transfer technology. Mass transfer technology, that is, how to transfer a large number of micro-scale Micro-LED dies to a large-size transfer board, is an important technology for the mass production of Micro-LED products.
  • the purpose of the present invention is to provide an LED die transfer method, which aims to solve the problem that the existing LED die transfer method is very time-consuming, extremely low in efficiency, and does not meet the benefits of modern industrial manufacturing. .
  • a method for transferring LED crystal grains which comprises the following steps:
  • first R carrier board with red LED dies on the surface a first G carrier board with green LED dies on the surface, and a first B carrier board with blue LED dies on the surface, the first R The carrier board and the red LED die, the first G carrier board and the green LED die, and the first B carrier board and the blue LED die are all bonded by a first viscous substance;
  • the blue LED die of the carrier is covered with a second C carrier, between the second A carrier and the red LED die, between the second B carrier and the green LED die, and between the second carrier A and the green LED die.
  • the second C carrier board and the blue LED die are both bonded by a second viscous substance, and the viscosity of the second viscous substance is less than the viscosity of the first viscous substance;
  • the first viscous substance is irradiated with a laser to make the red LED die on the first R carrier board, the green LED on the first G carrier board, and the blue LED on the first B carrier board Die off
  • the red LED dies, green LED dies, and blue LED dies that have fallen off are cross-transferred to the second A carrier board, the second B carrier board, and the second C carrier board, so that the second The A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with the red LED die, the green LED die, and the blue LED die.
  • the LED die transfer method wherein the laser irradiates the first viscous material to make the red LED die on the first R carrier and the green light on the first G carrier
  • the laser irradiation time is 10ns-60s.
  • the LED die transfer method wherein the laser irradiates the first viscous material to make the red LED die on the first R carrier and the green light on the first G carrier
  • the laser irradiation power is 10mw-500w.
  • the LED die transfer method wherein the falling off the red LED die, the green LED die, and the blue LED die are cross-transferred to the second A carrier board and the second B carrier board And the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with the red LED die, the green LED die, and the blue LED die
  • the steps include:
  • the LED die transfer method wherein the falling off the red LED die, the green LED die, and the blue LED die are cross-transferred to the second A carrier board and the second B carrier board And the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with the red LED die, the green LED die, and the blue LED die
  • the steps include:
  • the laser is injected into the first viscous substance located at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board.
  • the red LED die, the green LED die, and the blue LED die on the third position on the first B carrier board fall off and are correspondingly bonded to the second A carrier board and the second B carrier Board and the third position of the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are simultaneously distributed with the red LED dies, green LED dies, and Blue LED dies; the first position, the second position, and the third position are arranged in a cycle in turn.
  • the first viscous substance is one of polydimethylsiloxane, organosilicone adhesive or epoxy resin.
  • the second viscous substance is one of polydimethylsiloxane, organosilicone adhesive or epoxy resin.
  • the LED die transfer method wherein, when the first viscous substance and the second viscous substance are the same substance, the concentration of the first viscous substance and the second viscous substance is adjusted to make the first viscous substance
  • the viscosity of a viscous substance is greater than the viscosity of the second viscous substance.
  • the LED crystal grain transfer method wherein the epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, aliphatic epoxy resin, cyanuric acid One of epoxy resin or hydantoin epoxy resin.
  • the LED die transfer method wherein the first R carrier board, the first G carrier board, the first B carrier board, the second A carrier board, the second B carrier board, and the second C carrier board are all Level the carrier board.
  • the present invention uses the concept of substrate staggered transfer, which can avoid interference during the transfer process, realize the simultaneous transfer of red, green and blue LED dies, and at the same time make the LED die design arrangement more compact, and increase the number of wafers on the wafer.
  • the number of particles is reduced, and the manufacturing cost is reduced; and the LED crystal particle transfer method provided by the present invention has high efficiency, which is in line with the benefits of modern industrial manufacturing.
  • FIG. 1 is a flowchart of a preferred embodiment of a method for transferring LED die of the present invention.
  • Figure 2 is a schematic diagram of the structure of the raised carrier.
  • Fig. 3 is a schematic diagram of the operation of step S31 of the present invention.
  • Fig. 4 is a schematic diagram of the operation of step S32 of the present invention.
  • Fig. 5 is a schematic diagram of the operation of step S33 of the present invention.
  • Fig. 6 is a schematic diagram of the operation of step S34 of the present invention.
  • FIG. 7 is a schematic diagram of the operation of step S35 of the present invention.
  • the present invention provides a method for transferring LED crystal grains.
  • the present invention will be described in further detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.
  • an embodiment of the present invention provides an LED die transfer method, as shown in FIG. 1, which includes the steps:
  • S10 Provide a first R carrier board with red LED dies on the surface, a first G carrier board with green LED dies on the surface, and a first B carrier board with blue LED dies on the surface. Between the R carrier board and the red LED die, between the first G carrier board and the green LED die, and between the first B carrier board and the blue LED die, the first adhesive material is used to stick Knot
  • laser irradiation and stripping are used to make the red LED die combined on the first R carrier board, the green LED die on the first G carrier board, and the first B carrier board.
  • the blue LED die falls off, and the fallen off red LED die, green LED die, and blue LED die are staggered and transferred to the second A carrier board, the second B carrier board, and the second C carrier board Above, so that the second A carrier board, the second B carrier board, and the second C carrier board are simultaneously distributed with red LED dies, green LED dies, and blue LED dies.
  • the LED die transfer method provided in this embodiment can effectively avoid the interference phenomenon during the transfer process, and realize the simultaneous transfer of the red, green and blue LED dies to the same carrier board.
  • the existing process is usually to set the red LED die on the second R carrier board and the green light on the second G carrier board.
  • the LED dies and the blue LED dies arranged on the second B'carrier are transferred to the backlight panel, the second R carrier and the red LED dies, the second G carrier and the
  • the green LED die and the second B'carrier board and the blue LED die are all bonded by a second viscous substance, that is, the prior art requires three transfer steps to complete the transfer of the RGB die To the backlight panel.
  • the laser irradiation stripping combined with the die staggered transfer method makes the second A carrier board, the second B'carrier board, and the second C carrier board all have red LED dies, green LED dies, and Blue LED dies, which allows the RGB dies to be transferred to the backlight panel by only one transfer step in this embodiment. Therefore, the LED die transfer method provided in this embodiment is more efficient and conforms to modern industrial manufacturing. Benefits.
  • the second R carrier board, the second G carrier board, and the second B'carrier board used in the traditional LED die transfer process are all raised carrier boards provided with bump structures, and are similar to each other.
  • the spacing between adjacent bumps needs to be consistent with the pixel spacing on the backlight panel.
  • This traditional raised carrier has a complicated manufacturing process and high cost, and the LED dies on the raised carrier have a fixed pitch.
  • the first R carrier board, the first G carrier board, the first B carrier board, the second A carrier board, the second B carrier board, and the second C carrier board used in this embodiment are all without protrusions. As shown in Figs.
  • this embodiment uses a flat carrier with laser irradiation and peeling method, so that the LED dies on the flat carrier do not need to follow the pixels on the backlight panel.
  • the LED dies on the carrier board of the flat structure can be arranged closely, which increases the utilization rate of the carrier board and effectively reduces the manufacturing cost.
  • the step S30 is to irradiate the first viscous substance with laser light to make the red LED die and the green light on the first R carrier board, the first G carrier board, and the first B carrier board.
  • the LED die and the blue LED die fall off, and are cross-transferred to the second A carrier board, the second B carrier board, and the second C carrier board, so that the second A carrier board, the second B carrier board, and Red LED dies, green LED dies and blue LED dies are distributed on the second C carrier board at the same time, which specifically include:
  • the laser is injected into the first viscous substance at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the The red LED die, green LED die, and blue LED die on the first position on the first R carrier board, the first G carrier board, and the first B carrier board fall off, and are correspondingly bonded to the second A carrier Board, the second B carrier board, and the second C carrier board at the first position;
  • the second carrier A is covered on the first carrier B so that the first carrier B contains a plurality of red LED dies and a plurality of blue LED dies.
  • the The number of the blue LED die on the first B carrier is twice the number of the red LED die;
  • the second B carrier is covered on the first R carrier so that the first R carrier
  • the above includes a plurality of green LED dies and a plurality of red LED dies.
  • the number of the red LED dies on the first R carrier board is twice the number of the green LED dies ;
  • the first G carrier board The number of the green LED dies is twice the number of the green LED dies.
  • the laser is injected into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the laser is located on the first R carrier board,
  • the red LED die, the green LED die, and the blue LED die on the second position on the first G carrier board and the first B carrier board fall off and are correspondingly bonded to the second B carrier board and the second C carrier Board and the second position of the second A carrier board.
  • the second A carrier board is covered on the first G carrier board, so that the first G carrier board includes the same number of red LEDs arranged cyclically from the first position to the third position.
  • the die, the blue LED die and the green LED die cover the second B carrier board on the first B carrier board, so that the first B carrier board includes the same number from the first position to the first position Green LED dies, red LED dies, and blue LED dies are cyclically arranged in three positions, covering the second C carrier board on the first R carrier board so that the first R carrier board It includes the same number of blue LED dies, green LED dies, and red LED dies that are arranged cyclically from the first position to the third position.
  • the laser is injected into the first viscous substance located at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first R carrier board, The red LED die, the green LED die and the blue LED die on the third position on the first G carrier board and the first B carrier board fall off and are correspondingly bonded to the second C carrier board and the second carrier board.
  • the second C carrier board is pasted with the same number of blue LED dies and green LED crystals that are arranged cyclically from the first position to the third position.
  • the second A carrier board is pasted with the same number of red LED dies, blue LED dies, and green LED dies that are arranged cyclically from the first position to the third position, so that The same number of green LED dies, red LED dies and blue LED dies are affixed to the second B carrier board and are arranged cyclically from the first position to the third position.
  • the laser irradiation power is 10mw-500w
  • the laser irradiation time is 10ns-60s.
  • irradiating the first viscous substance with a laser can make the viscosity between the first R carrier board and the red LED die, the viscosity between the first G carrier board and the green LED die, and The viscosity between the first B carrier board and the blue LED die is significantly reduced, so that the red LED dies on the first R carrier board, the first G carrier board, and the first B carrier board, The green LED die and the blue LED die fall off, and are correspondingly bonded to the corresponding positions of the second A carrier board, the second B carrier board, and the second C carrier board.
  • red LED dies, blue LED dies, and green LED dies can be distributed on the second carrier A, carrier B, and carrier C at the same time;
  • the R, G, and B three-color LED dies evenly distributed on the A carrier board, the second B carrier board, and the second C carrier board can be directly applied to the terminal module.
  • the step S30 is to irradiate the first viscous substance with laser light to make the red LED dies and the green LEDs respectively on the first R carrier board, the first G carrier board, and the first B carrier board.
  • the light LED die and the blue LED die fall off, and are cross-transferred to the second A carrier board, the second B carrier board, and the second C carrier board, so that the second A carrier board and the second B carrier board And the second C carrier board are simultaneously distributed with red LED dies, green LED dies and blue LED dies, which specifically include:
  • the second A carrier board prepared in this embodiment includes red LED dies, green LED dies, and blue LED dies that are sequentially cyclically arranged from the first position to the third position;
  • the second carrier B includes green LED dies, blue LED dies, and red LED dies that are cyclically arranged from the first position to the third position;
  • the second C carrier manufactured in this embodiment includes The blue LED dies, the red LED dies and the green LED dies are arranged cyclically in sequence from the first position to the third position.
  • the first viscous substance is one of polydimethylsiloxane, silicone adhesive or epoxy resin, but it is not limited thereto.
  • the second viscous substance is one of polydimethylsiloxane, silicone adhesive or epoxy resin, but is not limited thereto.
  • first viscous substance and the second viscous substance when the first viscous substance and the second viscous substance are different substances, a substance with a lower viscosity is selected as the first viscous substance, and a substance with a higher viscosity is selected as the second viscous substance;
  • first viscous substance and the second viscous substance are the same substance, by adjusting the concentration of the first viscous substance and the second viscous substance, the viscosity of the first viscous substance is greater than that of the second viscous substance .
  • the epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin, cyanuric epoxy resin or sea It is a kind of epoxy resin, but it is not limited to this.
  • the present invention uses the concept of substrate staggered transfer to avoid interference during the transfer process, realize the simultaneous transfer of red, green and blue LED dies, and at the same time enable the LED dies to be arranged more closely and increase the number of wafers.
  • the number of upper crystal grains reduces the manufacturing cost; and the LED crystal grain transfer method provided by the present invention has higher efficiency, which is in line with the benefits of modern industrial manufacturing.

Abstract

Provided is a method for transferring an LED chip, comprising the steps: using laser irradiation to cause LEDs adhered to a first carrier board to fall off, while at the same time, using the concept of substrate staggered transfer, transferring the fallen LEDs to a second carrier board in a staggered manner such that a red LED chip, a green LED chip, and a blue LED chip are evenly distributed on a second carrier board. The LED chip transfer method can effectively prevent the phenomenon of interference during the transfer process, achieving the simultaneous transfer of red, green, and blue LED chips to the same carrier board while also enabling LED chip design arrangement to be more compact, increasing the number of chips on the wafer, reducing manufacturing costs, and increasing efficiency, in line with the benefits of modern industrial manufacturing.

Description

一种LED晶粒转移方法Method for transferring LED crystal grains 技术领域Technical field
本发明涉及LED领域，尤其涉及一种LED晶粒转移方法。The invention relates to the field of LEDs, in particular to a method for transferring LED crystal grains.
背景技术Background technique
Micro-LED(微型发光二极管)是新一代显示技术，比现有的OLED(有机发光二极管)技术亮度更高、发光效率更好、但功耗更低。Micro-LED技术，将LED结构设计进行薄膜化、微小化、阵列化，其尺寸仅在1-10μm等级左右。Micro-LED最大的优势来自于微米等级的间距，每一点像素(pixel)都能定址控制及单点驱动发光、寿命长、应用范畴广。但限制Micro-LED显示技术发展的瓶颈主要包括巨量转移技术。巨量转移技术即如何将大量微小尺度的Micro-LED晶粒转移到大尺寸的转移板上，是Micro-LED产品量产化的重要技术。Micro-LED (Micro Light Emitting Diode) is a new generation of display technology, which has higher brightness, better luminous efficiency, and lower power consumption than the existing OLED (Organic Light Emitting Diode) technology. Micro-LED technology, the LED structure design is thinned, miniaturized, and arrayed, and its size is only about 1-10μm. The biggest advantage of Micro-LED comes from the micron-level pitch, each pixel (pixel) can be addressed and controlled and single-point driven to emit light, long life, and a wide range of applications. But the bottleneck restricting the development of Micro-LED display technology mainly includes massive transfer technology. Mass transfer technology, that is, how to transfer a large number of micro-scale Micro-LED dies to a large-size transfer board, is an important technology for the mass production of Micro-LED products.
现有技术在实现RGB LED排列时，是将在不同外延片上不同颜色的LED晶粒逐一设置在电路板上。现有的LED晶粒逐个转移方式非常耗时，效率极低，不符合现代工业制造的效益。In the prior art, when RGB LEDs are arranged, LED dies of different colors on different epitaxial wafers are arranged on the circuit board one by one. The existing method of transferring LED dies one by one is very time-consuming, extremely low in efficiency, and does not meet the benefits of modern industrial manufacturing.
因此，现有技术还有待于改进。Therefore, the existing technology needs to be improved.
发明内容Summary of the invention
鉴于上述现有技术的不足，本发明的目的在于提供一种LED晶粒转移方法，旨在解决现有LED晶粒逐个转移方式非常耗时，效率极低，不符合现代工业制造的效益的问题。In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an LED die transfer method, which aims to solve the problem that the existing LED die transfer method is very time-consuming, extremely low in efficiency, and does not meet the benefits of modern industrial manufacturing. .
本发明的技术方案如下：The technical scheme of the present invention is as follows:
一种LED晶粒转移方法，其中，包括步骤：A method for transferring LED crystal grains, which comprises the following steps:
提供表面设置有红光LED晶粒的第一R载板，表面设置有绿光LED晶粒的第一G载板，表面设置有蓝光LED晶粒的第一B载板，所述第一R载板与红光LED晶粒之间、 所述第一G载板与绿光LED晶粒之间以及所述第一B载板与蓝光LED晶粒之间均通过第一粘性物质粘结；Provide a first R carrier board with red LED dies on the surface, a first G carrier board with green LED dies on the surface, and a first B carrier board with blue LED dies on the surface, the first R The carrier board and the red LED die, the first G carrier board and the green LED die, and the first B carrier board and the blue LED die are all bonded by a first viscous substance;
在所述第一R载板的红光LED晶粒上覆盖第二A载板，在所述第一G载板的绿光LED晶粒上覆盖第二B载板，在所述第一B载板的蓝光LED晶粒上覆盖第二C载板，所述第二A载板与红光LED晶粒之间、所述第二B载板与绿光LED晶粒之间以及所述第二C载板与蓝光LED晶粒之间均通过第二粘性物质粘结，所述第二粘性物质的粘度小于所述第一粘性物质的粘度；Cover the second A carrier board on the red LED die of the first R carrier board, and cover the second B carrier board on the green LED die of the first G carrier board. The blue LED die of the carrier is covered with a second C carrier, between the second A carrier and the red LED die, between the second B carrier and the green LED die, and between the second carrier A and the green LED die. The second C carrier board and the blue LED die are both bonded by a second viscous substance, and the viscosity of the second viscous substance is less than the viscosity of the first viscous substance;
通过激光照射所述第一粘性物质使位于所述第一R载板上的红光LED晶粒、所述第一G载板上的绿光LED以及所述第一B载板上的蓝光LED晶粒脱落；The first viscous substance is irradiated with a laser to make the red LED die on the first R carrier board, the green LED on the first G carrier board, and the blue LED on the first B carrier board Die off
将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒。The red LED dies, green LED dies, and blue LED dies that have fallen off are cross-transferred to the second A carrier board, the second B carrier board, and the second C carrier board, so that the second The A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with the red LED die, the green LED die, and the blue LED die.
所述的LED晶粒转移方法，其中，所述通过激光照射所述第一粘性物质使位于所述第一R载板上的红光LED晶粒、所述第一G载板上的绿光LED以及所述第一B载板上的蓝光LED晶粒脱落的步骤中，激光照射时间为10ns-60s。The LED die transfer method, wherein the laser irradiates the first viscous material to make the red LED die on the first R carrier and the green light on the first G carrier In the step of falling off the LED and the blue LED die on the first B carrier board, the laser irradiation time is 10ns-60s.
所述的LED晶粒转移方法，其中，所述通过激光照射所述第一粘性物质使位于所述第一R载板上的红光LED晶粒、所述第一G载板上的绿光LED以及所述第一B载板上的蓝光LED晶粒脱落的步骤中，激光照射功率为10mw-500w。The LED die transfer method, wherein the laser irradiates the first viscous material to make the red LED die on the first R carrier and the green light on the first G carrier In the step of falling off the LED and the blue LED die on the first B carrier board, the laser irradiation power is 10mw-500w.
所述的LED晶粒转移方法，其中，所述将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒的步骤包括：The LED die transfer method, wherein the falling off the red LED die, the green LED die, and the blue LED die are cross-transferred to the second A carrier board and the second B carrier board And the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with the red LED die, the green LED die, and the blue LED die The steps include:
将激光射入位于所述第一R载板、第一G载板以及第一B载板上第一位置的所述第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第一位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二A载板、第二B载板以及第二C载板的第一位置上；Inject the laser into the first viscous substance located at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the first position on the first B carrier board fall off, and are correspondingly bonded to the second A carrier board, the second B carrier board, and On the first position of the second C carrier board;
将所述第二A载板覆盖在所述第一B载板上，将所述第二B载板覆盖在所述第一R载板上，将所述第二C载板覆盖在所述第一G载板上；Cover the second A carrier board on the first B carrier board, cover the second B carrier board on the first R carrier board, and cover the second C carrier board on the The first G carrier board;
将激光射入位于所述第一R载板、第一G载板以及第一B载板上第二位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第二位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二B载板、第二C载板以及第二A载板的第二位置上；Inject the laser into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board so that the first R carrier board, the first G carrier board, and the The red LED die, the green LED die and the blue LED die on the second position on the first B carrier board fall off, and are correspondingly bonded to the second B carrier board, the second C carrier board, and the second carrier board. On the second position of A carrier board;
将所述第二A载板覆盖在所述第一G载板上，将所述第二B载板覆盖在所述第一B载板上，将所述第二C载板覆盖在所述第一R载板上；Cover the second carrier A on the first G carrier, cover the second B carrier on the first B carrier, and cover the second C carrier on the The first R carrier board;
将激光射入位于所述第一R载板、第一G载板以及第一B载板上第三位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第三位置上的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二C载板、第二A载板以及第二B载板的第三位置上，使得所述第二C载板、第二A载板以及第二B载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒；所述第一位置、第二位置以及第三位置依次循环排列。Inject the laser into the first viscous substance at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first R carrier board, the first G carrier board, and the The red LED die, the green LED die, and the blue LED die on the third position on the first B carrier board fall off, and are correspondingly bonded to the second C carrier board, the second A carrier board, and On the third position of the second B carrier board, the second C carrier board, the second A carrier board, and the second B carrier board are all simultaneously distributed with red LED dies, green LED dies, and blue LED crystals. Grains; the first position, the second position and the third position are arranged cyclically in turn.
所述的LED晶粒转移方法，其中，所述将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒的步骤包括：The LED die transfer method, wherein the falling off the red LED die, the green LED die, and the blue LED die are cross-transferred to the second A carrier board and the second B carrier board And the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with the red LED die, the green LED die, and the blue LED die The steps include:
将激光射入位于所述第一R载板、第一G载板以及第一B载板上第一位置的所述第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第一位置上的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二A载板、第二B载板以及第二C载板的第一位置上；Inject the laser into the first viscous substance located at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the first position on the first B carrier board fall off and are correspondingly bonded to the second A carrier board and the second B carrier Board and the first position of the second C carrier board;
将所述第二A载板覆盖在所述第一G载板上，将所述第二B载板覆盖在所述第一B载板上，将所述第二C载板覆盖在所述第一R载板上；Cover the second carrier A on the first G carrier, cover the second B carrier on the first B carrier, and cover the second C carrier on the The first R carrier board;
将激光射入位于所述第一R载板、第一G载板以及第一B载板上第二位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第二位置上的所述 红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二C载板、第二A载板以及第二B载板的第二位置上；Inject the laser into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board so that the first R carrier board, the first G carrier board, and the The red LED die, the green LED die, and the blue LED die on the second position on the first B carrier board fall off, and are correspondingly bonded to the second C carrier board, the second A carrier board, and On the second position of the second B carrier board;
将所述第二A载板覆盖在所述第一B载板上，将所述第二B载板覆盖在所述第一R载板上，将所述第二C载板覆盖在所述第一G载板上；Cover the second A carrier board on the first B carrier board, cover the second B carrier board on the first R carrier board, and cover the second C carrier board on the The first G carrier board;
将激光射入位于所述第一R载板、第一G载板以及第一B载板上第三位置的所述第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第三位置上的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二A载板、第二B载板以及第二C载板的第三位置上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒；所述第一位置、第二位置以及第三位置依次循环排列。The laser is injected into the first viscous substance located at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the third position on the first B carrier board fall off and are correspondingly bonded to the second A carrier board and the second B carrier Board and the third position of the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are simultaneously distributed with the red LED dies, green LED dies, and Blue LED dies; the first position, the second position, and the third position are arranged in a cycle in turn.
所述的LED晶粒转移方法，其中，所述第一粘性物质为聚二甲基硅氧烷、有机硅胶黏剂或环氧树脂中的一种。In the method for transferring LED crystal grains, the first viscous substance is one of polydimethylsiloxane, organosilicone adhesive or epoxy resin.
所述的LED晶粒转移方法，其中，所述第二粘性物质为聚二甲基硅氧烷、有机硅胶黏剂或环氧树脂中的一种。In the method for transferring LED crystal grains, the second viscous substance is one of polydimethylsiloxane, organosilicone adhesive or epoxy resin.
所述的LED晶粒转移方法，其中，当所述第一粘性物质和第二粘性物质为同一种物质时，则通过调整所述第一粘性物质和第二粘性物质的浓度，使所述第一粘性物质的粘度大于所述第二粘性物质的粘度。The LED die transfer method, wherein, when the first viscous substance and the second viscous substance are the same substance, the concentration of the first viscous substance and the second viscous substance is adjusted to make the first viscous substance The viscosity of a viscous substance is greater than the viscosity of the second viscous substance.
所述的LED晶粒转移方法，其中，所述环氧树脂为双酚A型环氧树脂、双酚F型环氧树脂、脂环族环氧树脂、脂肪族环氧树脂、三聚氰酸环氧树脂或海因环氧树脂中的一种。The LED crystal grain transfer method, wherein the epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, aliphatic epoxy resin, cyanuric acid One of epoxy resin or hydantoin epoxy resin.
所述的LED晶粒转移方法，其中，所述第一R载板、第一G载板、第一B载板、第二A载板、第二B载板、第二C载板均为平整载板。The LED die transfer method, wherein the first R carrier board, the first G carrier board, the first B carrier board, the second A carrier board, the second B carrier board, and the second C carrier board are all Level the carrier board.
有益效果：本发明利用基板交错转移的概念，可避免转移制程时干涉现象，实现同时转移红绿蓝三种LED晶粒，同时也可使LED晶粒设计排列更为紧密，增加晶圆上晶粒数量，降低制造成本；并且本发明提供的LED晶粒转移方法效率较高，符合现代工业制造的效益。Beneficial effects: The present invention uses the concept of substrate staggered transfer, which can avoid interference during the transfer process, realize the simultaneous transfer of red, green and blue LED dies, and at the same time make the LED die design arrangement more compact, and increase the number of wafers on the wafer. The number of particles is reduced, and the manufacturing cost is reduced; and the LED crystal particle transfer method provided by the present invention has high efficiency, which is in line with the benefits of modern industrial manufacturing.
附图说明Description of the drawings
图1为本发明一种LED晶粒转移方法较佳实施例的流程图。FIG. 1 is a flowchart of a preferred embodiment of a method for transferring LED die of the present invention.
图2为凸起载板的结构示意图。Figure 2 is a schematic diagram of the structure of the raised carrier.
图3为本发明步骤S31的操作示意图。Fig. 3 is a schematic diagram of the operation of step S31 of the present invention.
图4为本发明步骤S32的操作示意图。Fig. 4 is a schematic diagram of the operation of step S32 of the present invention.
图5为本发明步骤S33的操作示意图。Fig. 5 is a schematic diagram of the operation of step S33 of the present invention.
图6为本发明步骤S34的操作示意图。Fig. 6 is a schematic diagram of the operation of step S34 of the present invention.
图7为本发明步骤S35的操作示意图。FIG. 7 is a schematic diagram of the operation of step S35 of the present invention.
具体实施方式Detailed ways
本发明提供一种LED晶粒转移方法，为使本发明的目的、技术方案及效果更加清楚、明确，以下对本发明进一步详细说明。应当理解，此处所描述的具体实施例仅仅用以解释本发明，并不用于限定本发明。The present invention provides a method for transferring LED crystal grains. In order to make the objectives, technical solutions and effects of the present invention clearer and clearer, the present invention will be described in further detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, but not to limit the present invention.
现有技术在实现RGB LED排列时，是将在不同外延片上不同颜色的LED晶粒逐一设置在电路板上，这种转移方式在容易产生干涉，且非常耗时，效率极低，不符合现代工业制造的效益。When realizing the arrangement of RGB LEDs in the prior art, LED dies of different colors on different epitaxial wafers are arranged on the circuit board one by one. This transfer method is prone to interference, is very time-consuming, has extremely low efficiency, and is not in line with modern times. The benefits of industrial manufacturing.
基于现有LED晶粒转移所存在的问题，本发明实施例提供一种LED晶粒转移方法，如图1所示，其包括步骤：Based on the existing problems of LED die transfer, an embodiment of the present invention provides an LED die transfer method, as shown in FIG. 1, which includes the steps:
S10、提供表面设置有红光LED晶粒的第一R载板，表面设置有绿光LED晶粒的第一G载板，表面设置有蓝光LED晶粒的第一B载板，所述第一R载板与红光LED晶粒之间、所述第一G载板与绿光LED晶粒之间以及所述第一B载板与蓝光LED晶粒之间均通过第一粘性物质粘结；S10. Provide a first R carrier board with red LED dies on the surface, a first G carrier board with green LED dies on the surface, and a first B carrier board with blue LED dies on the surface. Between the R carrier board and the red LED die, between the first G carrier board and the green LED die, and between the first B carrier board and the blue LED die, the first adhesive material is used to stick Knot
S20、在所述第一R载板的红光LED晶粒上覆盖第二A载板，在所述第一G载板的绿光LED晶粒上覆盖第二B载板，在所述第一B载板的蓝光LED晶粒上覆盖第二C载板，所述第二A载板与红光LED晶粒之间、所述第二B载板与绿光LED晶粒之间以及所述第二C载板与蓝光LED晶粒之间均通过第二粘性物质粘结，所述第二粘性物质 的粘度小于所述第一粘性物质的粘度；S20. Cover the second A carrier board on the red LED die of the first R carrier board, and cover the second B carrier board on the green LED die of the first G carrier board. A second carrier C is covered on the blue LED die of a carrier B, between the second carrier A and the red LED die, between the second carrier B and the green LED die, and all The second C carrier board and the blue LED die are both bonded by a second viscous substance, and the viscosity of the second viscous substance is less than that of the first viscous substance;
S30、通过激光照射所述第一粘性物质，使位于所述第一R载板上的红光LED晶粒、位于所述第一G载板上的绿光LED晶粒以及位于所述第一B载板上的蓝光LED晶粒脱落；S30. Irradiate the first viscous substance with a laser so that the red LED die on the first R carrier board, the green LED die on the first G carrier board, and the The blue LED die on the B carrier board falls off;
S40、将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒。S40. Cross-transfer the fallen off red LED dies, green LED dies, and blue LED dies to the second A carrier board, the second B carrier board, and the second C carrier board, so that the The second A carrier board, the second B carrier board and the second C carrier board are all simultaneously distributed with red LED dies, green LED dies and blue LED dies.
本实施例采用激光照射剥离的方式使结合在所述第一R载板上的红光LED晶粒、所述第一G载板上的绿光LED晶粒以及所述第一B载板上的蓝光LED晶粒发生脱落，并将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交错转移至第二A载板、第二B载板以及第二C载板上，从而使所述第二A载板、第二B载板以及第二C载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒。本实施例提供的LED晶粒转移方法可有效避免转移制程时的干涉现象，实现同时将红绿蓝三种LED晶粒转移至同一载板上。In this embodiment, laser irradiation and stripping are used to make the red LED die combined on the first R carrier board, the green LED die on the first G carrier board, and the first B carrier board The blue LED die falls off, and the fallen off red LED die, green LED die, and blue LED die are staggered and transferred to the second A carrier board, the second B carrier board, and the second C carrier board Above, so that the second A carrier board, the second B carrier board, and the second C carrier board are simultaneously distributed with red LED dies, green LED dies, and blue LED dies. The LED die transfer method provided in this embodiment can effectively avoid the interference phenomenon during the transfer process, and realize the simultaneous transfer of the red, green and blue LED dies to the same carrier board.
当需要将三种不同颜色的LED晶粒转移至背光面板上时，现有工艺通常是将设置在第二R载板上的红光LED晶粒，设置在第二G载板上的绿光LED晶粒以及设置在第二B’载板上的蓝光LED晶粒分别转移至背光面板上，所述第二R载板与所述红光LED晶粒、所述第二G载板与所述绿光LED晶粒以及所述第二B’载板与所述蓝光LED晶粒均通过第二粘性物质粘结，也就是说，现有技术需要经过三次转移步骤才能完成将RGB晶粒转移至背光面板上。而本实施例通过激光照射剥离结合晶粒交错转移的方式，使得第二A载板、第二B’载板以及第二C载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒，这使得本实施例只需通过一次转移步骤便可实现将RGB晶粒转移至背光面板上，因此，本实施例提供的LED晶粒转移方法效率较高，符合现代工业制造的效益。When three different colors of LED dies need to be transferred to the backlight panel, the existing process is usually to set the red LED die on the second R carrier board and the green light on the second G carrier board. The LED dies and the blue LED dies arranged on the second B'carrier are transferred to the backlight panel, the second R carrier and the red LED dies, the second G carrier and the The green LED die and the second B'carrier board and the blue LED die are all bonded by a second viscous substance, that is, the prior art requires three transfer steps to complete the transfer of the RGB die To the backlight panel. In this embodiment, the laser irradiation stripping combined with the die staggered transfer method makes the second A carrier board, the second B'carrier board, and the second C carrier board all have red LED dies, green LED dies, and Blue LED dies, which allows the RGB dies to be transferred to the backlight panel by only one transfer step in this embodiment. Therefore, the LED die transfer method provided in this embodiment is more efficient and conforms to modern industrial manufacturing. Benefits.
如图2所示，传统LED晶粒转移工艺所使用的所述第二R载板、第二G载板以及第二B’载板均为设置有凸块结构的凸起载板，且相邻凸块之间的间距需要符合背光面板 上的像素间距，这种传统的凸起载板制作工艺复杂，成本较高，且所述凸起载板上的LED晶粒间距固定。而本实施例采用的所述所述第一R载板、第一G载板、第一B载板、第二A载板、第二B载板、第二C载板均为不含凸起结构的平整载板，如图3-图7所示，本实施例使用平整载板搭配激光照射剥离的方法，可以使得所述平整载板上的LED晶粒不需要按照背光面板上的像素间距排列设置，所述平整结构的载板上的LED晶粒可以紧密排列，增加载板的利用率，有效降低制造成本。As shown in FIG. 2, the second R carrier board, the second G carrier board, and the second B'carrier board used in the traditional LED die transfer process are all raised carrier boards provided with bump structures, and are similar to each other. The spacing between adjacent bumps needs to be consistent with the pixel spacing on the backlight panel. This traditional raised carrier has a complicated manufacturing process and high cost, and the LED dies on the raised carrier have a fixed pitch. However, the first R carrier board, the first G carrier board, the first B carrier board, the second A carrier board, the second B carrier board, and the second C carrier board used in this embodiment are all without protrusions. As shown in Figs. 3-7, this embodiment uses a flat carrier with laser irradiation and peeling method, so that the LED dies on the flat carrier do not need to follow the pixels on the backlight panel. The LED dies on the carrier board of the flat structure can be arranged closely, which increases the utilization rate of the carrier board and effectively reduces the manufacturing cost.
在一些实施方式中，所述步骤S30、通过激光照射第一粘性物质使分别位于所述第一R载板、第一G载板以及第一B载板上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒，具体包括：In some embodiments, the step S30 is to irradiate the first viscous substance with laser light to make the red LED die and the green light on the first R carrier board, the first G carrier board, and the first B carrier board. The LED die and the blue LED die fall off, and are cross-transferred to the second A carrier board, the second B carrier board, and the second C carrier board, so that the second A carrier board, the second B carrier board, and Red LED dies, green LED dies and blue LED dies are distributed on the second C carrier board at the same time, which specifically include:
S31、将激光射入位于所述第一R载板、第一G载板以及第一B载板上第一位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第一位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二A载板、第二B载板以及第二C载板的第一位置上；S31. Inject the laser into the first viscous substance located at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the first position on the first B carrier board fall off, and are correspondingly bonded to the second A carrier board, the second B carrier board, and the second carrier board. On the first position of the C carrier board;
S32、将所述第二A载板覆盖在第一B载板上，将所述第二B载板覆盖在第一R载板上，将所述第二C载板覆盖在第一G载板上；S32. Cover the second carrier A on the first carrier B, cover the second carrier B on the first carrier R, and cover the second carrier C on the first G carrier. On board
S33、将激光射入位于所述第一R载板、第一G载板以及第一B载板上第二位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第二位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二B载板、第二C载板以及第二A载板的第二位置上；S33. Inject the laser into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die and the blue LED die on the second position on the first B carrier board fall off, and are correspondingly bonded to the second B carrier board, the second C carrier board, and the second carrier board. On the second position of A carrier board;
S34、将所述第二A载板覆盖在第一G载板上，将所述第二B载板覆盖在第一B载板上，将所述第二C载板转移至第一覆盖在第一R载板上；S34. Cover the second carrier A on the first carrier G, cover the second carrier B on the first carrier B, and transfer the second carrier C to the first carrier. The first R carrier board;
S35、将激光射入位于所述第一R载板、第一G载板以及第一B载板上第三位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第三位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二C载板、 第二A载板以及第二B载板的第三位置上，使得所述第二C载板、第二A载板以及第二B载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒；所述第一位置、第二位置以及第三位置依次循环排列。S35. Inject the laser into the first viscous substance located at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance located on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the third position on the first B carrier board fall off and are correspondingly bonded to the second C carrier board, the second A carrier board, and the second carrier board. On the third position of the B carrier board, the second C carrier board, the second A carrier board, and the second B carrier board are all simultaneously distributed with red LED dies, green LED dies and blue LED dies; The first position, the second position, and the third position are sequentially and cyclically arranged.
在本实施例中，如图3所示，将激光射入位于所述第一R载板、第一G载板以及第一B载板上第一位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第一位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二A载板、第二B载板以及第二C载板的第一位置上；In this embodiment, as shown in FIG. 3, the laser is injected into the first viscous substance at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the The red LED die, green LED die, and blue LED die on the first position on the first R carrier board, the first G carrier board, and the first B carrier board fall off, and are correspondingly bonded to the second A carrier Board, the second B carrier board, and the second C carrier board at the first position;
如图4所示，将所述第二A载板覆盖在第一B载板上，使第一B载板上包含多个红光LED晶粒和多个蓝光LED晶粒，此时所述第一B载板上的所述蓝光LED晶粒数量为所述红光LED晶粒数量的两倍；将所述第二B载板覆盖在第一R载板上，使第一R载板上包括多个绿光LED晶粒和多个红光LED晶粒，此时所述第一R载板上的所述红光LED晶粒的数量为所述绿光LED晶粒数量的两倍；将所述第二C载板覆盖在第一G载板上，使第一G载板上包括多个蓝光LED晶粒多个绿光LED晶粒，此时所述第一G载板上的所述绿光LED晶粒数量为所述绿光LED晶粒数量的两倍。As shown in Figure 4, the second carrier A is covered on the first carrier B so that the first carrier B contains a plurality of red LED dies and a plurality of blue LED dies. At this time, the The number of the blue LED die on the first B carrier is twice the number of the red LED die; the second B carrier is covered on the first R carrier so that the first R carrier The above includes a plurality of green LED dies and a plurality of red LED dies. At this time, the number of the red LED dies on the first R carrier board is twice the number of the green LED dies ; Cover the second C carrier board on the first G carrier board so that the first G carrier board includes a plurality of blue LED dies and a plurality of green LED dies. At this time, the first G carrier board The number of the green LED dies is twice the number of the green LED dies.
如图5所示，将激光射入位于所述第一R载板、第一G载板以及第一B载板上第二位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第二位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二B载板、第二C载板以及第二A载板的第二位置上。As shown in FIG. 5, the laser is injected into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the laser is located on the first R carrier board, The red LED die, the green LED die, and the blue LED die on the second position on the first G carrier board and the first B carrier board fall off and are correspondingly bonded to the second B carrier board and the second C carrier Board and the second position of the second A carrier board.
如图6所示，将所述第二A载板覆盖在第一G载板上，使第一G载板上包括同等数量并从第一位置至第三位置依次循环排布的红光LED晶粒、蓝光LED晶粒以及绿光LED晶粒，将所述第二B载板覆盖在第一B载板上，使所述第一B载板上包括同等数量并从第一位置至第三位置依次循环排布的绿光LED晶粒、红光LED晶粒以及蓝光LED晶粒，将所述第二C载板覆盖在第一R载板上，使所述第一R载板上包括同等数量并从第一位置至第三位置依次循环排布的蓝光LED晶粒、绿光LED晶粒以及红光LED晶粒。As shown in FIG. 6, the second A carrier board is covered on the first G carrier board, so that the first G carrier board includes the same number of red LEDs arranged cyclically from the first position to the third position. The die, the blue LED die and the green LED die cover the second B carrier board on the first B carrier board, so that the first B carrier board includes the same number from the first position to the first position Green LED dies, red LED dies, and blue LED dies are cyclically arranged in three positions, covering the second C carrier board on the first R carrier board so that the first R carrier board It includes the same number of blue LED dies, green LED dies, and red LED dies that are arranged cyclically from the first position to the third position.
如图7所示，将激光射入位于所述第一R载板、第一G载板以及第一B载板上第 三位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第三位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二C载板、第二A载板以及第二B载板的第三位置上，使得所述第二C载板粘贴有相同数量且从第一位置至第三位置依次循环排布的蓝光LED晶粒、绿光LED晶粒以及红光LED晶粒，使得第二A载板粘贴有相同数量且从第一位置至第三位置依次循环排布的红光LED晶粒、蓝光LED晶粒以及绿光LED晶粒，使得第二B载板上粘贴有相同数量且从第一位置至第三位置依次循环排布的绿光LED晶粒、红光LED晶粒以及蓝光LED晶粒。As shown in Figure 7, the laser is injected into the first viscous substance located at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first R carrier board, The red LED die, the green LED die and the blue LED die on the third position on the first G carrier board and the first B carrier board fall off and are correspondingly bonded to the second C carrier board and the second carrier board. On the third position of the A carrier board and the second B carrier board, the second C carrier board is pasted with the same number of blue LED dies and green LED crystals that are arranged cyclically from the first position to the third position. And red LED dies, so that the second A carrier board is pasted with the same number of red LED dies, blue LED dies, and green LED dies that are arranged cyclically from the first position to the third position, so that The same number of green LED dies, red LED dies and blue LED dies are affixed to the second B carrier board and are arranged cyclically from the first position to the third position.
本实施例中，所述激光照射功率为10mw-500w，所述激光照射时间为10ns-60s。本实施例通过激光照射所述第一粘性物质可使得所述第一R载板与红光LED晶粒之间的粘度、所述第一G载板与绿光LED晶粒之间的粘度以及所述第一B载板与蓝光LED晶粒之间的粘度明显下降，从而便于使位于所述第一R载板、第一G载板以及第一B载板上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒发生脱落，并对应粘结在第二A载板、第二B载板以及第二C载板的相应位置上。In this embodiment, the laser irradiation power is 10mw-500w, and the laser irradiation time is 10ns-60s. In this embodiment, irradiating the first viscous substance with a laser can make the viscosity between the first R carrier board and the red LED die, the viscosity between the first G carrier board and the green LED die, and The viscosity between the first B carrier board and the blue LED die is significantly reduced, so that the red LED dies on the first R carrier board, the first G carrier board, and the first B carrier board, The green LED die and the blue LED die fall off, and are correspondingly bonded to the corresponding positions of the second A carrier board, the second B carrier board, and the second C carrier board.
通过本实施例的转移步骤可使得第二A载板、第二B载板以及第二C载板上同时分布有红色LED晶粒、蓝色LED晶粒以及绿色LED晶粒；所述第二A载板、第二B载板以及第二C载板上均匀分布的R、G、B三色LED晶粒可直接应用在终端模块上。Through the transfer step of this embodiment, red LED dies, blue LED dies, and green LED dies can be distributed on the second carrier A, carrier B, and carrier C at the same time; The R, G, and B three-color LED dies evenly distributed on the A carrier board, the second B carrier board, and the second C carrier board can be directly applied to the terminal module.
在另一些实施方式中，所述步骤S30、通过激光照射第一粘性物质使分别位于所述第一R载板、第一G载板以及第一B载板上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒，具体包括：In other embodiments, the step S30 is to irradiate the first viscous substance with laser light to make the red LED dies and the green LEDs respectively on the first R carrier board, the first G carrier board, and the first B carrier board. The light LED die and the blue LED die fall off, and are cross-transferred to the second A carrier board, the second B carrier board, and the second C carrier board, so that the second A carrier board and the second B carrier board And the second C carrier board are simultaneously distributed with red LED dies, green LED dies and blue LED dies, which specifically include:
S311、将激光射入位于所述第一R载板、第一G载板以及第一B载板上第一位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第一位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二A载板、第二B载板以及第二C载板的第一位置上；S311. Inject the laser into the first viscous substance located at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance located on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the first position on the first B carrier board fall off, and are correspondingly bonded to the second A carrier board, the second B carrier board, and the second carrier board. On the first position of the C carrier board;
S312、将所述第二A载板覆盖在第一G载板上，将所述第二B载板覆盖在第一B载板上，将所述第二C载板覆盖在第一R载板上；S312. Cover the second carrier A on the first G carrier, cover the second B carrier on the first B carrier, and cover the second C carrier on the first R carrier. On board
S313、将激光射入位于所述第一R载板、第一G载板以及第一B载板上第二位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第二位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二C载板、第二A载板以及第二B载板的第二位置上；S313. Inject the laser into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance located on the first R carrier board, the first G carrier board The red LED die, the green LED die and the blue LED die on the second position on the first B carrier board fall off, and are correspondingly bonded to the second C carrier board, the second A carrier board, and the second carrier board. On the second position of the B carrier board;
S314、将所述第二A载板覆盖在第一B载板上，将所述第二B载板覆盖在第一R载板上，将所述第二C载板转移至第一覆盖在第一G载板上；S314. Cover the second A carrier board on the first B carrier board, cover the second B carrier board on the first R carrier board, and transfer the second C carrier board to the first carrier board. The first G carrier board;
S315、将激光射入位于所述第一R载板、第一G载板以及第一B载板上第三位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第三位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在第二A载板、第二B载板以及第二C载板的第三位置上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒；所述第一位置、第二位置以及第三位置依次循环排列。S315. Inject the laser into the first viscous substance located at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance located on the first R carrier board, the first G carrier board The red LED die, the green LED die and the blue LED die on the third position on the first B carrier board fall off, and are correspondingly bonded to the second A carrier board, the second B carrier board, and the second carrier board. On the third position of the C carrier board, the second A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with red LED dies, green LED dies and blue LED dies; The first position, the second position, and the third position are sequentially and cyclically arranged.
本实施例制得的第二A载板上包括从第一位置至第三位置依次循环排布的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒；本实施例制得的第二B载板上包括从第一位置至第三位置依次循环排布的绿光LED晶粒、蓝光LED晶粒以及红光LED晶粒；本实施例制得的第二C载板上包括从第一位置至第三位置依次循环排布的蓝光LED晶粒、红光LED晶粒以及绿光LED晶粒。The second A carrier board prepared in this embodiment includes red LED dies, green LED dies, and blue LED dies that are sequentially cyclically arranged from the first position to the third position; The second carrier B includes green LED dies, blue LED dies, and red LED dies that are cyclically arranged from the first position to the third position; the second C carrier manufactured in this embodiment includes The blue LED dies, the red LED dies and the green LED dies are arranged cyclically in sequence from the first position to the third position.
在一些实施方式中，所述第一粘性物质为聚二甲基硅氧烷、有机硅胶黏剂或环氧树脂中的一种，但不限于此。In some embodiments, the first viscous substance is one of polydimethylsiloxane, silicone adhesive or epoxy resin, but it is not limited thereto.
在一些实施方式中，所述第二粘性物质为聚二甲基硅氧烷、有机硅胶黏剂或环氧树脂中的一种，但不限于此。In some embodiments, the second viscous substance is one of polydimethylsiloxane, silicone adhesive or epoxy resin, but is not limited thereto.
在一些实施方式中，当所述第一粘性物质和第二粘性物质为不同物质时，则选择粘度较低的物质作为第一粘性物质，粘度较高的物质作为第二粘性物质；当所述第一粘性物质和第二粘性物质为同一种物质时，则通过调整所述第一粘性物质和第二粘性物质的 浓度，使所述第一粘性物质的粘度大于所述第二粘性物质的粘度。In some embodiments, when the first viscous substance and the second viscous substance are different substances, a substance with a lower viscosity is selected as the first viscous substance, and a substance with a higher viscosity is selected as the second viscous substance; When the first viscous substance and the second viscous substance are the same substance, by adjusting the concentration of the first viscous substance and the second viscous substance, the viscosity of the first viscous substance is greater than that of the second viscous substance .
在一些实施方式中，所述环氧树脂为双酚A型环氧树脂、双酚F型环氧树脂、脂环族环氧树脂、脂肪族环氧树脂、三聚氰酸环氧树脂或海因环氧树脂中的一种，但不限于此。In some embodiments, the epoxy resin is bisphenol A epoxy resin, bisphenol F epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin, cyanuric epoxy resin or sea It is a kind of epoxy resin, but it is not limited to this.
综上所述，本发明利用基板交错转移的概念，可避免转移制程时干涉现象，实现同时转移红绿蓝三种LED晶粒，同时也可使LED晶粒设计排列更为紧密，增加晶圆上晶粒数量，降低制造成本；并且本发明提供的LED晶粒转移方法效率较高，符合现代工业制造的效益。In summary, the present invention uses the concept of substrate staggered transfer to avoid interference during the transfer process, realize the simultaneous transfer of red, green and blue LED dies, and at the same time enable the LED dies to be arranged more closely and increase the number of wafers. The number of upper crystal grains reduces the manufacturing cost; and the LED crystal grain transfer method provided by the present invention has higher efficiency, which is in line with the benefits of modern industrial manufacturing.
应当理解的是，本发明的应用不限于上述的举例，对本领域普通技术人员来说，可以根据上述说明加以改进或变换，所有这些改进和变换都应属于本发明所附权利要求的保护范围。It should be understood that the application of the present invention is not limited to the above examples. For those of ordinary skill in the art, improvements or changes can be made based on the above description, and all these improvements and changes should fall within the protection scope of the appended claims of the present invention.

Claims (10)

  1. 一种LED晶粒转移方法，其特征在于，包括步骤：A method for transferring LED crystal grains, which is characterized in that it comprises the following steps:
    提供表面设置有红光LED晶粒的第一R载板，表面设置有绿光LED晶粒的第一G载板，表面设置有蓝光LED晶粒的第一B载板，所述第一R载板与红光LED晶粒之间、所述第一G载板与绿光LED晶粒之间以及所述第一B载板与蓝光LED晶粒之间均通过第一粘性物质粘结；Provide a first R carrier board with red LED dies on the surface, a first G carrier board with green LED dies on the surface, and a first B carrier board with blue LED dies on the surface, the first R The carrier board and the red LED die, the first G carrier board and the green LED die, and the first B carrier board and the blue LED die are all bonded by a first viscous substance;
    在所述第一R载板的红光LED晶粒上覆盖第二A载板，在所述第一G载板的绿光LED晶粒上覆盖第二B载板，在所述第一B载板的蓝光LED晶粒上覆盖第二C载板，所述第二A载板与红光LED晶粒之间、所述第二B载板与绿光LED晶粒之间以及所述第二C载板与蓝光LED晶粒之间均通过第二粘性物质粘结，所述第二粘性物质的粘度小于所述第一粘性物质的粘度；Cover the second A carrier board on the red LED die of the first R carrier board, and cover the second B carrier board on the green LED die of the first G carrier board. The blue LED die of the carrier is covered with a second C carrier, between the second A carrier and the red LED die, between the second B carrier and the green LED die, and between the second carrier A and the green LED die. The second C carrier board and the blue LED die are both bonded by a second viscous substance, and the viscosity of the second viscous substance is less than the viscosity of the first viscous substance;
    通过激光照射所述第一粘性物质使位于所述第一R载板上的红光LED晶粒、所述第一G载板上的绿光LED以及所述第一B载板上的蓝光LED晶粒脱落；The first viscous substance is irradiated with a laser to make the red LED die on the first R carrier board, the green LED on the first G carrier board, and the blue LED on the first B carrier board Die off
    将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒。The red LED dies, green LED dies, and blue LED dies that have fallen off are cross-transferred to the second A carrier board, the second B carrier board, and the second C carrier board, so that the second The A carrier board, the second B carrier board, and the second C carrier board are all simultaneously distributed with the red LED die, the green LED die, and the blue LED die.
  2. 根据权利要求1所述的LED晶粒转移方法，其特征在于，所述通过激光照射所述第一粘性物质使位于所述第一R载板上的红光LED晶粒、所述第一G载板上的绿光LED以及所述第一B载板上的蓝光LED晶粒脱落的步骤中，激光照射时间为10ns-60s。The method of claim 1, wherein the first viscous material is irradiated with a laser to make the red LED die on the first R carrier, the first G In the step of falling off the green LED on the carrier board and the blue LED die on the first B carrier board, the laser irradiation time is 10ns-60s.
  3. 根据权利要求1所述的LED晶粒转移方法，其特征在于，所述通过激光照射所述第一粘性物质使位于所述第一R载板上的红光LED晶粒、所述第一G载板上的绿光LED以及所述第一B载板上的蓝光LED晶粒脱落的步骤中，激光照射功率为10mw-500w。The method of claim 1, wherein the first viscous material is irradiated with a laser to make the red LED die on the first R carrier, the first G In the step of falling off the green LED on the carrier board and the blue LED die on the first B carrier board, the laser irradiation power is 10mw-500w.
  4. 根据权利要求1所述的LED晶粒转移方法，其特征在于，所述将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒的步骤包括：The LED die transfer method according to claim 1, wherein the red LED die, the green LED die, and the blue LED die that have fallen off are cross-transferred to the second A carrier board , The second B carrier board and the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are simultaneously distributed with the red LED die and the green LED die And the steps of the blue LED die include:
    将激光射入位于所述第一R载板、第一G载板以及第一B载板上第一位置的所述第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第一位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二A载板、第二B载板以及第二C载板的第一位置上；Inject the laser into the first viscous substance located at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the first position on the first B carrier board fall off, and are correspondingly bonded to the second A carrier board, the second B carrier board, and On the first position of the second C carrier board;
    将所述第二A载板覆盖在所述第一B载板上，将所述第二B载板覆盖在所述第一R载板上，将所述第二C载板覆盖在所述第一G载板上；Cover the second A carrier board on the first B carrier board, cover the second B carrier board on the first R carrier board, and cover the second C carrier board on the The first G carrier board;
    将激光射入位于所述第一R载板、第一G载板以及第一B载板上第二位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第二位置上的红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二B载板、第二C载板以及第二A载板的第二位置上；Inject the laser into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board so that the first R carrier board, the first G carrier board, and the The red LED die, the green LED die and the blue LED die on the second position on the first B carrier board fall off, and are correspondingly bonded to the second B carrier board, the second C carrier board, and the second carrier board. On the second position of A carrier board;
    将所述第二A载板覆盖在所述第一G载板上，将所述第二B载板覆盖在所述第一B载板上，将所述第二C载板覆盖在所述第一R载板上；Cover the second carrier A on the first G carrier, cover the second B carrier on the first B carrier, and cover the second C carrier on the The first R carrier board;
    将激光射入位于所述第一R载板、第一G载板以及第一B载板上第三位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第三位置上的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二C载板、第二A载板以及第二B载板的第三位置上，使得所述第二C载板、第二A载板以及第二B载板上均同时分布有红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒；所述第一位置、第二位置以及第三位置依次循环排列。Inject the laser into the first viscous substance at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first R carrier board, the first G carrier board, and the The red LED die, the green LED die, and the blue LED die on the third position on the first B carrier board fall off, and are correspondingly bonded to the second C carrier board, the second A carrier board, and On the third position of the second B carrier board, the second C carrier board, the second A carrier board, and the second B carrier board are all simultaneously distributed with red LED dies, green LED dies, and blue LED crystals. Grains; the first position, the second position and the third position are arranged cyclically in turn.
  5. 根据权利要求1所述的LED晶粒转移方法，其特征在于，所述将脱落的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒交叉转移至所述第二A载板、第二B载板以及第二C载板上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒的步骤包括：The LED die transfer method according to claim 1, wherein the red LED die, the green LED die, and the blue LED die that have fallen off are cross-transferred to the second A carrier board , The second B carrier board and the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are simultaneously distributed with the red LED die and the green LED die And the steps of the blue LED die include:
    将激光射入位于所述第一R载板、第一G载板以及第一B载板上第一位置的所述第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第一位置上的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二A载板、第二B载板以及第二C载板的第一位置上；Inject the laser into the first viscous substance located at the first position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the first position on the first B carrier board fall off and are correspondingly bonded to the second A carrier board and the second B carrier Board and the first position of the second C carrier board;
    将所述第二A载板覆盖在所述第一G载板上，将所述第二B载板覆盖在所述第一B载板上，将所述第二C载板覆盖在所述第一R载板上；Cover the second carrier A on the first G carrier, cover the second B carrier on the first B carrier, and cover the second C carrier on the The first R carrier board;
    将激光射入位于所述第一R载板、第一G载板以及第一B载板上第二位置的第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第二位置上的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二C载板、第二A载板以及第二B载板的第二位置上；Inject the laser into the first viscous substance located at the second position on the first R carrier board, the first G carrier board, and the first B carrier board so that the first R carrier board, the first G carrier board, and the The red LED die, the green LED die, and the blue LED die on the second position on the first B carrier board fall off, and are correspondingly bonded to the second C carrier board, the second A carrier board, and On the second position of the second B carrier board;
    将所述第二A载板覆盖在所述第一B载板上，将所述第二B载板覆盖在所述第一R载板上，将所述第二C载板覆盖在所述第一G载板上；Cover the second A carrier board on the first B carrier board, cover the second B carrier board on the first R carrier board, and cover the second C carrier board on the The first G carrier board;
    将激光射入位于所述第一R载板、第一G载板以及第一B载板上第三位置的所述第一粘性物质，使位于所述第一R载板、第一G载板以及第一B载板上第三位置上的所述红光LED晶粒、绿光LED晶粒以及蓝光LED晶粒脱落，并对应粘结在所述第二A载板、第二B载板以及第二C载板的第三位置上，使得所述第二A载板、第二B载板以及第二C载板上均同时分布有所述红色LED晶粒、绿色LED晶粒以及蓝色LED晶粒；所述第一位置、第二位置以及第三位置依次循环排列。The laser is injected into the first viscous substance located at the third position on the first R carrier board, the first G carrier board, and the first B carrier board, so that the first viscous substance on the first R carrier board, the first G carrier board The red LED die, the green LED die, and the blue LED die on the third position on the first B carrier board fall off and are correspondingly bonded to the second A carrier board and the second B carrier Board and the third position of the second C carrier board, so that the second A carrier board, the second B carrier board, and the second C carrier board are simultaneously distributed with the red LED dies, green LED dies, and Blue LED dies; the first position, the second position, and the third position are arranged in a cycle in turn.
  6. 根据权利要求1所述的LED晶粒转移方法，其特征在于，所述第一粘性物质为聚二甲基硅氧烷、有机硅胶黏剂或环氧树脂中的一种。The LED die transfer method according to claim 1, wherein the first viscous substance is one of polydimethylsiloxane, silicone adhesive or epoxy resin.
  7. 根据权利要求1所述的LED晶粒转移方法，其特征在于，所述第二粘性物质为聚二甲基硅氧烷、有机硅胶黏剂或环氧树脂中的一种。The LED die transfer method according to claim 1, wherein the second viscous substance is one of polydimethylsiloxane, silicone adhesive or epoxy resin.
  8. 根据权利要求1所述的LED晶粒转移方法，其特征在于，当所述第一粘性物质和第二粘性物质为同一种物质时，则通过调整所述第一粘性物质和第二粘性物质的浓度，使所述第一粘性物质的粘度大于所述第二粘性物质的粘度。The LED die transfer method according to claim 1, wherein when the first viscous substance and the second viscous substance are the same substance, the difference between the first viscous substance and the second viscous substance is adjusted. The concentration is such that the viscosity of the first viscous substance is greater than the viscosity of the second viscous substance.
  9. 根据权利要求6-7任一所述LED晶粒转移方法，其特征在于，所述环氧树脂为双酚A型环氧树脂、双酚F型环氧树脂、脂环族环氧树脂、脂肪族环氧树脂、三聚氰酸环氧树脂或海因环氧树脂中的一种。The method for transferring LED crystal grains according to any one of claims 6-7, wherein the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy resin, alicyclic epoxy resin, fatty acid One of group epoxy resin, cyanuric acid epoxy resin or hydantoin epoxy resin.
  10. 根据权利要求1所述LED晶粒转移方法，其特征在于，所述第一R载板、第一G载板、第一B载板、第二A载板、第二B载板、第二C载板均为平整载板。The LED die transfer method according to claim 1, wherein the first R carrier board, the first G carrier board, the first B carrier board, the second A carrier board, the second B carrier board, and the second carrier board C carrier boards are flat carrier boards.
PCT/CN2019/119808 2019-11-21 2019-11-21 Method for transferring led chip WO2021097734A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2019/119808 WO2021097734A1 (en) 2019-11-21 2019-11-21 Method for transferring led chip
CN201980002746.7A CN110998824A (en) 2019-11-21 2019-11-21 LED crystal grain transfer method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2019/119808 WO2021097734A1 (en) 2019-11-21 2019-11-21 Method for transferring led chip

Publications (1)

Publication Number Publication Date
WO2021097734A1 true WO2021097734A1 (en) 2021-05-27

Family

ID=70080464

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2019/119808 WO2021097734A1 (en) 2019-11-21 2019-11-21 Method for transferring led chip

Country Status (2)

Country Link
CN (1) CN110998824A (en)
WO (1) WO2021097734A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113555303A (en) * 2020-04-23 2021-10-26 华为机器有限公司 LED chip transfer system and transfer method thereof
WO2021226945A1 (en) 2020-05-14 2021-11-18 重庆康佳光电技术研究院有限公司 Transfer method and display device
CN112967981B (en) * 2020-08-31 2022-05-13 重庆康佳光电技术研究院有限公司 Chip transfer head and manufacturing method thereof, die bonder and chip transfer method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107017319A (en) * 2017-05-23 2017-08-04 深圳市华星光电技术有限公司 The preparation method of colored micro- LED array substrate
US20180351030A1 (en) * 2017-05-31 2018-12-06 Oculus Vr, Llc Fluidic pick-up head for small semiconductor devices
CN109496351A (en) * 2017-06-09 2019-03-19 歌尔股份有限公司 Micro- light emitting diode matrix transfer method, manufacturing method and display device
CN109599354A (en) * 2018-12-07 2019-04-09 广东工业大学 A kind of structure and method of the transfer of Micro-LED flood tide
CN110100306A (en) * 2016-11-11 2019-08-06 Qmat股份有限公司 Micro- light emitting diode (LED) is manufactured by layer transfer
US20190295992A1 (en) * 2018-03-22 2019-09-26 Intel Corporation Micro light-emitting diode display fabrication and assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110100306A (en) * 2016-11-11 2019-08-06 Qmat股份有限公司 Micro- light emitting diode (LED) is manufactured by layer transfer
CN107017319A (en) * 2017-05-23 2017-08-04 深圳市华星光电技术有限公司 The preparation method of colored micro- LED array substrate
US20180351030A1 (en) * 2017-05-31 2018-12-06 Oculus Vr, Llc Fluidic pick-up head for small semiconductor devices
CN109496351A (en) * 2017-06-09 2019-03-19 歌尔股份有限公司 Micro- light emitting diode matrix transfer method, manufacturing method and display device
US20190295992A1 (en) * 2018-03-22 2019-09-26 Intel Corporation Micro light-emitting diode display fabrication and assembly
CN109599354A (en) * 2018-12-07 2019-04-09 广东工业大学 A kind of structure and method of the transfer of Micro-LED flood tide

Also Published As

Publication number Publication date
CN110998824A (en) 2020-04-10

Similar Documents

Publication Publication Date Title
WO2021097734A1 (en) Method for transferring led chip
EP2237326B1 (en) Light-emitting device and display device including the same
WO2022022044A1 (en) Led chip packaging module, and display screen and manufacturing method therefor
CN103779375A (en) Full color LED display panel, manufacturing method of full color LED display panel and displayer
CN105206642A (en) Super-high-density LED display device and manufacturing method thereof
US11462523B2 (en) Display module having LED packages including connection substrate
KR102238284B1 (en) LED Pixel Package including Active Pixel IC and Method Thereof
CN102751424A (en) Light emitting device module and method of manufacturing the same
US20210343572A1 (en) Method for Transferring Massive Light Emitting Diodes and Display Back Plate Assembly
US11450652B2 (en) Display module manufactured by micro LED transferring method
CN104167485A (en) Self-supported LED array light source structure
CN106373951A (en) RGB full-color light source, full-color luminescent device and display device
CN110364423A (en) A kind of COB display module die-bonding method
US20070194691A1 (en) Light emitting diode package structure having high light extraction efficiency and method of manufacturing the same
CN103972222A (en) LED (light-emitting diode) light source packaging method, LED light source packaging structure and light source module
CN105810796A (en) Quantum-dot material glass plate and fabrication method thereof
KR20190091923A (en) LED Transfer device and transferring method using the same
CN205104491U (en) VHD LED display device
CN103972221A (en) LED (light-emitting diode) light source packaging structure and method
CN107591469A (en) A kind of method for packing emitting led based on five faces of CSP encapsulating structures
KR20190025305A (en) LED Light emitting unit and LED display device using the same
CN113782553A (en) Mass transfer Micro LED module, display screen and manufacturing method
CN108877663A (en) Display screen and its manufacturing method and display structure
CN113130458A (en) Light-emitting unit, backlight structure, display panel and manufacturing method of light-emitting source
TWI783724B (en) Display panel

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19953083

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 19953083

Country of ref document: EP

Kind code of ref document: A1