WO2021093568A1

WO2021093568A1 - Ceramic substrate and led light source

Info

Publication number: WO2021093568A1
Application number: PCT/CN2020/123812
Authority: WO
Inventors: 李扬林; 李乾
Original assignee: 深圳市绎立锐光科技开发有限公司
Priority date: 2019-11-12
Filing date: 2020-10-27
Publication date: 2021-05-20
Also published as: CN211295145U

Abstract

The utility model provides a ceramic substrate and an LED light source. The ceramic substrate comprises a first ceramic substrate and a second ceramic substrate; the first ceramic substrate comprises a central area and an edge area surrounding the central area; the central area of the first ceramic substrate is provided with a first via hole; the first via hole is filled with a first conductive material; a central circuit layer is provided on the side of the central area away from the second ceramic substrate; an edge circuit layer is provided on the side of the edge area away from the second ceramic substrate; a conductive pad is provided on the side of the second ceramic substrate away from the first ceramic substrate; a conductive circuit electrically connected to the conductive pad is also provided on the second ceramic substrate; the edge circuit layer is electrically connected to the conductive circuit on a side face of the first ceramic substrate or the second ceramic substrate; and the central circuit layer is electrically connected to the conductive circuit by means of the first conductive material. Compared with related technologies, the circuit layout of the ceramic substrate of the present invention is simple, and the LED light source of the present invention can produce a good lighting effect.

Description

Ceramic substrate and LED light source

Technical field

The utility model relates to the field of lighting, in particular to a ceramic substrate and an LED light source.

Background technique

At present, ceramic substrates have the advantages of high mechanical strength, good insulation, high thermal conductivity and good thermal matching with semiconductor materials. Therefore, ceramic substrates are widely used in the packaging of electronic components that require high heat dissipation performance. .

In the related art, the ceramic substrate includes a base portion, a circuit layer provided on one side of the base portion, and a conductive pad provided on the other side of the base portion, and the circuit layer is connected to the conductive pad; In practical applications, a plurality of electronic components are respectively soldered to the circuit layer.

However, in the ceramic substrate of the related art, if multiple electronic components need to be driven separately, as the number and density of electronic components increase, the complexity of the circuit layout of the ceramic substrate also increases. This increase limits the design of ceramic substrates.

Therefore, it is necessary to provide a new ceramic substrate to solve the above technical problems.

Utility model content

The purpose of the utility model is to provide a ceramic substrate and an LED light source. The circuit layout of the ceramic substrate is simple. When the ceramic substrate is applied to the LED light source of the utility model, the reliability of the LED light source is high.

In order to achieve the above object, the present invention provides a ceramic substrate, which includes a first ceramic substrate and a second ceramic substrate stacked on the first ceramic substrate; the first ceramic substrate includes a central area and surrounding the central area The central area of the first ceramic substrate is provided with a first via hole penetrating therethrough, the first via hole is filled with a first conductive material, and the central area is far away from the second ceramic substrate One side of the second ceramic substrate is provided with a central circuit layer, the side of the edge region away from the second ceramic base is provided with an edge circuit layer; the second ceramic substrate is provided with a conductive pad on the side away from the first ceramic base , The second ceramic substrate is further provided with a conductive circuit electrically connected to the conductive pad, and the edge circuit layer is electrically connected to the conductive circuit on the side surface of the first ceramic substrate or the second ceramic substrate. Connected, the central circuit layer is electrically connected to the conductive circuit through the first conductive material.

Preferably, the conductive circuit includes a first circuit layer and a second circuit layer; the second circuit layer is arranged on the side surface of the second ceramic base; the first circuit layer is sandwiched between the first ceramic base and Between the second ceramic substrates and electrically connected to the central circuit layer through the first conductive material, the second circuit layer includes a first part and a second part, and the first part connects the edge circuit layer It is electrically connected to the conductive pad, and the second part electrically connects the first circuit layer to the conductive pad.

Preferably, the four side surfaces of the second ceramic base are provided with the second circuit layer.

Preferably, the second ceramic substrate is provided with a second via hole penetrating therethrough, and the second via hole is filled with a second conductive material; the conductive circuit includes a first circuit layer and a second circuit layer, The first circuit layer is disposed on a side of the second ceramic base away from the first ceramic base, and one end of the first circuit layer is electrically connected to the conductive pad, and the other end is sequentially passed through the second conductive pad. Material and the first conductive material are electrically connected to the central circuit layer; the second circuit layer is disposed on the side surface of the second ceramic substrate, and opposite ends of the second circuit layer are respectively connected to the edge circuit The layer is electrically connected to the conductive pad.

Preferably, a side of the second ceramic base away from the first ceramic base is further provided with a thermally conductive pad, and the thermally conductive pad is spaced apart from the conductive pad.

Preferably, the first ceramic base and the second ceramic base are formed into an integrated structure through a sintering molding process.

The utility model also provides an LED light source, which comprises a plurality of LED chips for emitting light and the ceramic substrate of the utility model, and the plurality of LED chips are arranged and fixed on the first ceramic substrate away from the second ceramic substrate. One side of the ceramic substrate; a part of the plurality of LED chips is arranged in the central area and electrically connected to the central circuit layer, and the other part is arranged in the edge area and electrically connected to the edge circuit layer.

Preferably, the ceramic substrate further includes a third ceramic substrate stacked on a side of the first ceramic substrate away from the second ceramic substrate and having a receiving space, the receiving space penetrating through the third ceramic substrate, A plurality of the LED chips are located in the accommodating space.

Preferably, the inner side surface of the third ceramic base is arranged obliquely, the inner side and the top surface of the first ceramic base form a certain included angle, and the included angle is greater than 90° and less than 180°.

Preferably, the orthographic projection of the accommodating space on the first ceramic substrate is any one of a square, a circle, or an ellipse.

Compared with the related art, in the ceramic substrate of the present invention, the first ceramic base includes a central area and an edge area surrounding the central area, and the central area of the first ceramic base is provided with a first penetrating through it. A via hole, the first via hole is filled with a first conductive material, a center circuit layer is provided on the side of the central area away from the second ceramic base, and the edge area is away from the second ceramic base An edge circuit layer is provided on one side of the second ceramic substrate; a conductive pad is provided on the side of the second ceramic substrate away from the first ceramic substrate, and an electrical connection electrically connected to the conductive pad is also provided on the second ceramic substrate. Conductive circuit, the edge circuit layer is electrically connected to the conductive circuit on the side of the first ceramic substrate or the second ceramic substrate, and the center circuit layer is electrically connected to the conductive circuit through the first conductive material Connection, the circuit structure avoids complicated wiring, and makes the circuit layout of the ceramic substrate simple.

Description of the drawings

In order to more clearly explain the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings needed in the description of the embodiments. Obviously, the drawings in the following description are only some implementations of the present utility model. For example, for those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings, among which:

Figure 1 is a schematic diagram of the structure of the ceramic substrate of the present invention;

Figure 2 is a schematic structural diagram of the first embodiment of the LED light source of the present invention;

Figure 3 is a top view of Figure 2;

Figure 4 is a top view of the second embodiment of the LED light source of the present invention;

Fig. 5 is a schematic structural diagram of the first embodiment of the LED light source of the present invention;

Figure 6 is a top view of Figure 5;

FIG. 7 is another structural diagram of the first embodiment of the LED light source of the present invention;

Fig. 8 is a top view of Fig. 7.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, not all of them. Examples. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present utility model.

Please refer to FIG. 1, the present invention provides a ceramic substrate 100, which includes a first ceramic substrate 1 and a second ceramic substrate 2 stacked on the first ceramic substrate 1.

It should be noted that the ceramic substrate 100 is mostly used in the field of packaging electronic components that require high heat dissipation performance. In order to ensure the heat dissipation performance of the ceramic substrate 100, the first ceramic substrate 1 and the second ceramic substrate 2 serve as the main parts of the ceramic substrate 100, which are made by sintering a high thermal conductivity ceramic material.

As an optional embodiment, the first ceramic substrate 1 and the second ceramic substrate 2 are both at least one of aluminum oxide (Al2O3), aluminum nitride (AlN) and silicon carbide (SiC) In the actual production process, the raw materials used to make the first ceramic base 1 and the second ceramic base 2 are specifically selected according to requirements.

In the preferred solution of this alternative embodiment, both the first ceramic substrate 1 and the second ceramic substrate 2 are made of three materials: aluminum oxide (Al2O3), aluminum nitride (AlN), and silicon carbide (SiC). The integral structure is made by sintering molding process. The following describes the process of the sintering molding process:

First, in a temperature environment of 1200°C to 1600°C, the mixture of three materials of aluminum oxide (Al2O3), aluminum nitride (AlN) and silicon carbide (SiC) is sintered and made into a green embryo.

Then, the multi-layer green embryos are laminated, and the multi-layer green embryos are sintered to form the first ceramic substrate 1 or the second ceramic substrate 2 in a temperature environment of 1200°C-2000°C; wherein "Multi-layered green embryo" refers to a green embryo with more than two layers, and the thickness of the first ceramic substrate 1 and the second ceramic substrate 2 made is 0.1 mm to 1 mm; preferably, the thickness of the first ceramic substrate 1 and the second ceramic substrate 2 are 0.1 mm to 1 mm; In this step, hot isostatic pressing can be used to eliminate the gaps between the multi-layer green embryos and achieve integral molding, so that the integrity of the first ceramic substrate 1 and the second ceramic substrate 2 is stronger and more reliable. High performance, thereby effectively improving the mechanical strength.

Finally, the first ceramic substrate 1 and the second ceramic substrate 2 are laminated, and the first ceramic substrate 1 and the second ceramic substrate 2 are sintered in a temperature environment of 1200°C-2000°C The ceramic substrate 100 is made; the ceramic substrate 100 has the advantages of high mechanical strength, good insulation, high thermal conductivity, and good thermal matching with semiconductor materials.

Of course, the molding process and materials of the first ceramic base and the second ceramic base are not limited to this. For example, the first ceramic base and the second ceramic base are made by a composite molding process of multiple layers of high thermal conductivity ceramic materials, and the first ceramic It is also feasible to sinter the base body and the second ceramic base body to form a ceramic substrate.

It is worth mentioning that the materials, manufacturing processes and dimensions of the first ceramic substrate and the second ceramic substrate are described above. The specific structure of the first ceramic substrate 1 and the second ceramic substrate 2 will be combined with the conductive structure of the ceramic substrate 100 below. 3Expand description:

Specifically, the first ceramic base 1 includes a central area 11 and an edge area 12 surrounding the central area. The central area 11 of the first ceramic base 1 is provided with a first through hole penetrating therethrough. A via hole is filled with a first conductive material 110, a central circuit layer 31 is provided on the side of the central area 11 away from the second ceramic base 2, and the edge area 12 is away from a side of the second ceramic base 2. An edge circuit layer 32 is provided on the side; a conductive pad 33 is provided on the side of the second ceramic base 2 away from the first ceramic base 1, and the second ceramic base 2 is also provided with the conductive pad 33 electrically connected conductive lines 34, the edge circuit layer 32 is electrically connected to the conductive lines 34 on the side of the first ceramic base 1 or the second ceramic base 2, and the center circuit layer 31 passes through the The first conductive material 110 is electrically connected to the conductive circuit 34. The central circuit layer 31, the edge circuit layer 32, the conductive pad 33 and the conductive circuit 34 share the conductive structure 3 of the ceramic substrate 100.

In practical applications, one part of the electronic components can be arranged on the central circuit layer 31 and form an electrical connection, and the other part can be arranged on the edge circuit layer 32 and form an electrical connection, because the central circuit layer 31 and the central circuit layer 31 are electrically connected. The electrical connection links of the edge circuit layer 32 are independent of each other, which provides conditions for separately driving each electronic component in a single path.

In this embodiment, the conductive circuit 34 includes a first circuit layer 341 and a second circuit layer 342; the first circuit layer 341 is sandwiched between the first ceramic substrate 1 and the second ceramic substrate 2. And is electrically connected to the first conductive material 110; the second circuit layer 342 is disposed on the side surface of the second ceramic base 2 and includes a first part 3421 and a second part 3422. The first part 3421 is connected to the The second portions 3422 are alternately arranged at intervals; the first portion 3421 electrically connects the edge circuit layer 32 with the conductive pad 33, and the second portion 3422 connects the first circuit layer 341 with the conductive pad. The disk 33 is electrically connected.

In the above structure, the central circuit layer 31 is led out to the side through the first conductive material 110 and the first circuit layer 341 in sequence, and finally is electrically connected to the conductive pad 33 through the second portion 3422. The edge circuit layer 32 is directly electrically connected to the conductive pad 33 on the side through the first part 3421. This structural design avoids the formation of complex circuits on the surface of the ceramic substrate 100 where electronic components are installed. The structure makes the circuit layout simple, solves the problem of difficult circuit structure layout when the number of electronic components are large and densely distributed, and releases the circuit structure design of the ceramic substrate 100.

It should be noted that the second circuit layer serves as the side circuit of the ceramic substrate, and the number of the second circuit layer is directly related to the number of electronic components provided on the ceramic substrate. In order to further increase the number of electronic components, As a better solution, for example, the second circuit layer 342 is provided on all four sides of the second ceramic substrate 2, and the four sides provide more space for the second circuit layer 342. Effectively increase the number of the second circuit layer 342, so that more electronic components are electrically connected to the conductive pad 33 through the second circuit layer 342, and more are provided for the ceramic substrate 100. Electronic components provide conditions; at the same time, because the second ceramic substrate 2 has sufficient space for installation, a plurality of the first portion 3421 and the second portion 3422 can be evenly distributed on the second ceramic substrate 2 So that the first portion 3421 of the second circuit layer 342 is electrically connected to the edge circuit layer 32 on the four sides of the first ceramic substrate 1 or the second ceramic substrate 2, and the second circuit layer 342 is electrically connected to the edge circuit layer 32. The portion 3422 is electrically connected to the central circuit layer 31 through the first circuit layer on the four sides of the first ceramic substrate or the second ceramic substrate, avoiding the problem of too compact arrangement of the second circuit layer 342, thereby making the circuit structure The layout is more reasonable, and the circuit structure is further simplified.

It should be pointed out here that the forming process of the first via hole and the first conductive material 110 is specifically: after the first ceramic substrate 1 is made by sintering the multilayer green embryo, the first ceramic substrate 1 is sintered. Before the base 1 and the second ceramic base 2 are sintered and molded, the first ceramic base 1 needs to be drilled and the first via hole is formed; after the first via is formed, go to the first via hole. A via hole is filled with the first conductive material 110; preferably, the aperture of the first via hole is 0.1 mm to 1 mm.

Further, the first conductive material 110 has excellent electrical conductivity and good thermal conductivity, and it may be, but not limited to, at least one of copper (Cu), silver (Ag), and gold (Au). The first conductive material 110 electrically connects the metal circuit located inside the ceramic substrate 100 with the external circuit.

Of course, the way of connecting the conductive circuit and the conductive pad is not limited to this. As another optional implementation (not shown), a second via hole is provided on the second ceramic substrate, and the second The via hole is filled with a second conductive material; the conductive circuit includes a first circuit layer and a second circuit layer, and the first circuit layer is disposed on a side of the second ceramic base away from the first ceramic base, And one end of the first circuit layer is electrically connected to the conductive pad, and the other end is electrically connected to the center circuit layer through a second conductive material and the first conductive material in turn; the second circuit layer is disposed at The side surface of the second ceramic substrate and the opposite ends of the second circuit layer are electrically connected to the edge circuit layer and the conductive pad, respectively.

The forming process of the second via hole is the same as the above-mentioned forming process of the first via hole, and the material and formation of the second conductive material are the same as the material and forming principle of the first conductive material, which will not be repeated here.

More preferably, in order to enhance the heat dissipation performance of the ceramic substrate 100, as an optional embodiment, the second ceramic base 2 is further provided with a thermally conductive pad 4, and the thermally conductive pad 4 transfers the internal heat to the heat. The sink conduction effectively dissipates the heat, so that the heat dissipation performance of the ceramic substrate 100 is stronger.

The thermally conductive pad 4 is arranged on the side of the second ceramic substrate 2 away from the first ceramic substrate 1, and the thermally conductive pad 4 is spaced apart from the conductive pad 33, so that the ceramic substrate 100 is electrically conductive. The separation from heat conduction improves the working stability of the ceramic substrate 100 and provides conditions for the ceramic substrate 100 to maintain normal operation under long-term load conditions.

It is worth mentioning that the central circuit layer 31, the edge circuit layer 32, the conductive pad 33, the second circuit layer 342, and the thermal conductive pad 4 all have excellent electrical conductivity and good thermal conductivity. The metal can be but not limited to one of copper (Cu), silver (Ag), nickel (Ni), platinum (Pt) and gold (Au).

Since the central circuit layer 31, the edge circuit layer 32, the conductive pad 33, the second circuit layer 342, and the thermal conductive pad 4 are provided on the outer surface of the ceramic substrate 100, in order to avoid sintering The process causes damage to the three, and the forming process of the three is performed after the first ceramic base 1 and the second ceramic base 2 are laminated and sintered.

As an optional embodiment, the central circuit layer 31 and the edge circuit are respectively formed on the first ceramic substrate 1 through one of the circuit manufacturing processes of printing, sputtering, electroplating, and electroless plating. Layer 32, and the conductive pad 33, the second circuit layer 342, and the thermal conductive pad 4 are formed on the second ceramic substrate 2 respectively.

Further, the thickness of the central circuit layer 31, the edge circuit layer 32, the conductive pad 33, the second circuit layer 342, and the thermal conductive pad 4 are all 0.1 mm to 1.0 mm; Yes, the central circuit layer 31, the edge circuit layer 32, the conductive pad 33, the second circuit layer 342, and the thermal conductive pad 4 may be a single-layer metal structure or a multilayer metal structure The specific size and specific structure of the stacked structure are determined according to the actual circuit design requirements.

The first circuit layer 341 is made of metal with excellent electrical conductivity, good thermal conductivity and high temperature resistance. The metal can be but not limited to one of tungsten (W), molybdenum (Mo), and manganese (Mn).

Since the first circuit layer 341 is disposed between the first ceramic base 1 and the second ceramic base 2, the formation process of the first circuit layer 341 needs to be between the first ceramic base 1 and the second ceramic base 2. The second ceramic base body 2 is laminated and sintered before being formed.

As an optional implementation manner, the first circuit layer 341 is formed on the second ceramic substrate 2 through a stencil printing process.

Further, the thickness of the first circuit layer 341 is 10 micrometers to 200 micrometers.

Please refer to FIG. 2, the present invention also provides an LED light source 200, which includes a plurality of LED chips 5 for emitting light and the ceramic substrate 100 of the present invention; the structure of the LED chip 5 is not However, it may be, but is not limited to, any one of a flip chip, a vertical chip, or a horizontal chip. For example, in this embodiment, the LED chip 5 is a flip chip.

Further, a plurality of the LED chips 5 are arranged on the side of the first ceramic base 1 away from the second ceramic base 2, and a part of the plurality of the LED chips 5 is arranged at the center of the first ceramic base 1. The area 11 serves as the central chip 51, which is electrically connected to the central circuit layer 31, and the other part is arranged in the edge area 12 of the first ceramic substrate 1 and serves as the edge chip 52. The edge chip 52 is connected to the The edge circuit layer 32 is electrically connected.

It should be noted that the number of the center chip 51 and the edge chip 52 is not limited, and can be specifically set according to actual design requirements. The following two optional implementations are listed, but not only Limited to the following two types:

Implementation mode one

As an optional implementation manner, please refer to FIG. 3, the number of the center chip 51 is four, and the number of the edge chip 52 is eight.

More preferably, since the LED chip 5 is mounted on the outer surface of the first ceramic substrate 1, the ceramic substrate 100 often needs to be equipped with a protective device to protect the LED chip 5 and adjust the LED chip 5 The light angle.

It should be noted that the protection device and the ceramic substrate 100 may be a separate structure independent of each other, or may be an integrally formed structure.

For example, in this embodiment, the protection device and the ceramic substrate 100 are formed as an integral structure; specifically, by adding a third ceramic substrate with a receiving space, the receiving space penetrates the third ceramic substrate. The third ceramic base is stacked on the side of the first ceramic base 1 away from the second ceramic base 2.

In the above structure, a plurality of the LED chips 5 are located in the accommodating space, that is, the third ceramic substrate encloses the LED chips 5 to avoid damage to the LED chips 5 due to external force collisions during installation and use. The LED chip 5 effectively protects the LED chip 5.

It is worth mentioning that the third ceramic base body and the first ceramic base body 1 and the second ceramic base body 2 are molded into an integrated structure through a sintering molding process, so that the fixing of the third ceramic base body is more reliable. It is not easy to fall off, thereby further improving the reliability of the ceramic substrate 100 and better protecting the LED chip 5.

Further, the inner side surface of the third ceramic base body is arranged obliquely, and the inner side surface and the top surface of the first ceramic base body form a certain included angle α, and the included angle α is greater than 90° and less than 180°. In practical applications, the light output angle of the LED chip 5 can be adjusted by adjusting the angle of the included angle α.

Furthermore, it should be noted that the structure of the third ceramic substrate is not limited, and the orthographic projection of the receiving space of the third ceramic substrate on the first ceramic substrate can be any of a square, a circle, or an ellipse. One kind. Here are two specific examples, but they are not limited to this:

As one of the alternatives in this embodiment, as shown in FIGS. 5-6, the orthographic projection of the receiving space 60a of the third ceramic base 6a on the first ceramic base 1 is circular, and the center chip and the edge The chip is located in the accommodating space 60a, and the light-emitting angle of the LED chip is controlled by the circular inner surface of the third ceramic substrate.

As another alternative in this embodiment, as shown in FIGS. 7-8, the orthographic projection of the receiving space 60b of the third ceramic substrate 6b on the first ceramic substrate 1 is square, and the center chip 51 and the edge The chip 52 is located in the accommodating space 60b, and the light-emitting angle of the LED chip is controlled by the square inner surface of the third ceramic substrate.

Of course, the principle of the third ceramic substrate in other structural forms is the same, so it will not be repeated here.

Implementation mode two

As another optional implementation manner, please refer to FIG. 4, the number of the center chip 51' is one, and the number of the edge chips 52' is six, and they are respectively arranged around the center chip 51'.

Of course, in the second embodiment, a protection device for the LED chip can also be added according to actual use. For example, if a third ceramic substrate is added, the connection relationship of the third ceramic substrate and the principle of protection are the same as those in the first embodiment. , I won’t repeat it here. By adding a third ceramic substrate, the center chip 51' and the edge chip 52' can be effectively protected, and the light output angle of the center chip 51' and the edge chip 52' can be adjusted through the third ceramic substrate.

Compared with the related art, in the ceramic substrate of the present invention, the first ceramic base includes a central area and an edge area surrounding the central area, and the central area of the first ceramic base is provided with a first penetrating through it. A via hole, the first via hole is filled with a first conductive material, a center circuit layer is provided on the side of the central area away from the second ceramic base, and the edge area is away from the second ceramic base An edge circuit layer is provided on one side of the second ceramic substrate; a conductive pad is provided on the side of the second ceramic substrate away from the first ceramic substrate, and an electrical connection electrically connected to the conductive pad is also provided on the second ceramic substrate. Conductive circuit, the edge circuit layer is electrically connected to the conductive circuit on the side of the first ceramic substrate or the second ceramic substrate, and the center circuit layer is electrically connected to the conductive circuit through the first conductive material Connection, the circuit structure avoids complicated wiring, and makes the circuit layout of the ceramic substrate simple. The LED light source of the present invention includes a plurality of LED chips and the ceramic substrate of the present invention. The plurality of LED chips are arranged and fixed on the side of the first ceramic base away from the second ceramic base. The ceramic substrate has excellent heat dissipation performance, so that the LED light source can quickly dissipate heat, thereby improving the reliability of the LED light source.

The above are only the embodiments of the present utility model. It should be pointed out here that for those of ordinary skill in the art, improvements can be made without departing from the inventive concept of the present utility model, but these all belong to The scope of protection of the utility model.

Claims

A ceramic substrate, wherein the ceramic substrate includes a first ceramic base and a second ceramic base stacked on the first ceramic base; the first ceramic base includes a central area and an edge surrounding the central area Area, the central area of the first ceramic base is provided with a first through hole penetrating therethrough, the first through hole is filled with a first conductive material, and the central area is far away from a portion of the second ceramic base A central circuit layer is provided on the side, an edge circuit layer is provided on the side of the edge region away from the second ceramic base; a conductive pad is provided on the side of the second ceramic base away from the first ceramic base, so The second ceramic substrate is further provided with a conductive circuit electrically connected to the conductive pad, and the edge circuit layer is electrically connected to the conductive circuit on the side surface of the first ceramic substrate or the second ceramic substrate, The central circuit layer is electrically connected to the conductive circuit through the first conductive material.
The ceramic substrate according to claim 1, wherein the conductive circuit comprises a first circuit layer and a second circuit layer; the first circuit layer is sandwiched between the first ceramic base and the second ceramic Between the substrates and electrically connected to the central circuit layer through the first conductive material, the second circuit layer is disposed on the side of the second ceramic substrate; the second circuit layer includes a first part and a second part The first part electrically connects the edge circuit layer and the conductive pad, and the second part electrically connects the first circuit layer and the conductive pad.
The ceramic substrate according to claim 2, wherein the second circuit layer is provided on all four sides of the second ceramic base.
The ceramic substrate according to claim 1, wherein the second ceramic substrate is provided with a second via hole penetrating therethrough, and the second via hole is filled with a second conductive material; the conductive circuit It includes a first circuit layer and a second circuit layer. The first circuit layer is disposed on the side of the second ceramic base away from the first ceramic base, and one end of the first circuit layer is welded to the conductive The disc is electrically connected, and the other end is electrically connected to the central circuit layer through the second conductive material and the first conductive material in turn; the second circuit layer is arranged on the side of the second ceramic substrate, and the second circuit The opposite ends of the layer are respectively electrically connected with the edge circuit layer and the conductive pad.
The ceramic substrate according to any one of claims 1-4, wherein a thermally conductive pad is further provided on a side of the second ceramic base away from the first ceramic base, and the thermally conductive pad is connected to the The conductive pads are arranged at intervals.
The ceramic substrate according to claim 5, wherein the first ceramic base and the second ceramic base are formed into an integrated structure through a sintering molding process.
An LED light source, comprising a plurality of LED chips for emitting light, characterized in that the LED light source further comprises the ceramic substrate according to any one of claims 1-6, and a plurality of the LED chips are arranged on the One side of the first ceramic substrate away from the second ceramic substrate; a part of the plurality of LED chips is arranged in the central area and electrically connected to the central circuit layer, and the other part is arranged in the edge area and connected to the central circuit layer. The edge circuit layer is electrically connected.
The ceramic substrate according to claim 7, wherein the ceramic substrate further comprises a third ceramic substrate stacked on a side of the first ceramic substrate away from the second ceramic substrate and having a receiving space, so The accommodating space penetrates the third ceramic substrate, and a plurality of the LED chips are located in the accommodating space.
8. The ceramic substrate according to claim 8, wherein the inner side of the third ceramic base is obliquely arranged, the inner side and the top surface of the first ceramic base form a certain included angle, and the included angle is greater than 90° And less than 180°.
8. The ceramic substrate according to claim 8, wherein the orthographic projection of the containing space on the first ceramic substrate is any one of a square, a circle, or an ellipse.