WO2021093516A1 - 具插接埠的发热件用复合散热装置及具该装置的散热器 - Google Patents

具插接埠的发热件用复合散热装置及具该装置的散热器 Download PDF

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Publication number
WO2021093516A1
WO2021093516A1 PCT/CN2020/121758 CN2020121758W WO2021093516A1 WO 2021093516 A1 WO2021093516 A1 WO 2021093516A1 CN 2020121758 W CN2020121758 W CN 2020121758W WO 2021093516 A1 WO2021093516 A1 WO 2021093516A1
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Prior art keywords
heat
heat dissipation
dissipation device
composite
thermal pad
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PCT/CN2020/121758
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English (en)
French (fr)
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杨之逸
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承奕科技股份有限公司
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Publication of WO2021093516A1 publication Critical patent/WO2021093516A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials

Definitions

  • the invention relates to a composite heat dissipation device for heating elements and a radiator equipped with the device, in particular to a composite heat dissipation device for heating elements and a radiator equipped with the device.
  • a computer central processing unit 72 using a traditional radiator 7 is taken as an example.
  • This radiator 7 is made of a metal material with high thermal conductivity and low cost, such as extruded aluminum, the radiator 7 and the central processing unit 72
  • the contact surface is usually polished to provide good thermal contact. Even so, there will still be an air gap that cannot be distinguished by the naked eye, which needlessly increase the thermal resistance; to avoid the thermal resistance caused by the air gap, it is generally used between the radiator and the computer.
  • a layer of viscous heat dissipation paste 74 is applied, and pressure is applied to fill the tiny gaps between the two and improve the thermal contact between the two.
  • the heat from the central processing unit 72 After the heat from the central processing unit 72 is conducted into the radiator through the heat dissipation paste, it will be conducted away from the central processing unit 72 through the structure of the radiator. In order to increase the contact area between the end of the radiator and the air, it will be kept away from the polished surface of the radiator.
  • a plurality of fins 76 are arranged on the side to expand the surface area of heat exchange; in order to solve the above-mentioned problem of increased heat per unit area, current electronic devices often add fans 78 at the corresponding fins 76 to further increase heat dissipation by forced convection Improve the heat dissipation rate.
  • the foamed copper mainly uses the melt foaming method or the powder sintering method, and the production cost continues to be high, making the product expensive; on the other hand, the bubbles may not always be connected to the outside, even if they are connected, Because the channels are bent, the ventilation effect may not be as expected; the most serious, if the air exists in the gap, it will form a huge thermal resistance, resulting in poor thermal contact; the above various unfavorable factors lead to the foamed copper radiator The heat dissipation efficiency and market acceptance are not high.
  • a composite heat dissipation device for heating elements with a simple structure and a plug-in port which aims to achieve the following objectives: (1) Easy to plug into a heating element (2) It can greatly reduce the manufacturing cost; (3) It can ensure a good thermal connection with the heating element, so that the heat emitted by the heating element can quickly dissipate, thereby protecting the heating element from The temperature is too high and malfunctions.
  • the present invention also hopes to provide a heat sink with a composite heat dissipation device for heating elements with a plug-in port. With the assistance of the composite heat dissipation device, the passive heat dissipation performance of the heat sink is greatly improved; the structure is simple and the manufacturing cost is economical. Has good market competitiveness.
  • the present invention provides a heat sink with a composite heat dissipation device for a heat generating element with a plug-in port, which is connected to a heat generating element to absorb heat generated by the heat generating element.
  • the heat sink includes: a standard The heat dissipation device has a predetermined operating temperature and has a heat absorption surface for absorbing the heat energy emitted by the heating element; a composite heat dissipation device for plugging into the standard heat dissipation device to dissipate the heat energy of the standard heat dissipation device.
  • the heat dissipation device includes: a flexible metal heat dissipation body with multiple through holes, including at least one plug port for plugging into the standard heat dissipation device; and at least one thermal pad, at least partially filling the through hole closing the plug port, and The thermal pad has a thermal softening temperature not higher than the predetermined operating temperature; and a heat dissipation coupling device is arranged on the heat absorption surface of the standard heat dissipation device for thermally connecting the radiator and the heating element.
  • the composite heat dissipation device for the heat generating element with the plug-in port in the heat sink can also be used alone for plugging into a heat generating element.
  • the heat generating element has a predetermined operating temperature.
  • the composite heat dissipation device includes: a multi-through hole
  • the flexible metal heat dissipating body includes at least one plug-in port for plugging into the heating element; and at least one heat-conducting pad at least partially filling and closing the through hole of the plug-in port, and the aforementioned heat-conducting pad has a heat-conducting pad not higher than the predetermined value.
  • the heating softening temperature of the operating temperature is not higher than the predetermined value.
  • the thermal pad of the present invention has a thermal softening temperature that is not higher than the predetermined operating temperature, so that when the standard heat sink reaches the predetermined operating temperature, the thermal pad melts and flows out under the action of gravity. At least partially fill the through holes that close the plug ports, thereby ensuring good thermal contact between the flexible metal heat dissipating body with multiple through holes and the standard heat dissipating device, and heat dissipation is provided on the heat absorbing surface of the standard heat dissipating device
  • the combination device thermally connects the above-mentioned radiator and the above-mentioned heating element to improve the thermal contact and ventilation of the radiator to improve the heat dissipation efficiency; and this kind of composite structure is simple, easy to manufacture, and the installation process is simple and reliable, and there is no tight fit. It is difficult to plug and unplug, especially with low-cost competitive advantages and beneficial to market promotion.
  • FIG. 1 is a schematic diagram of a first preferred embodiment of the present invention, which is used to illustrate the structure of a composite heat dissipation device for a heating element with a plug-in port and a heat sink with the device according to the present invention.
  • FIG. 2 is a front view of the composite heat dissipation device in the first preferred embodiment of the present invention, and is used to illustrate the structure of the composite heat dissipation device.
  • FIG 3 is a side view of the composite heat dissipation device of the first preferred embodiment of the present invention, for explaining the structure of the composite heat dissipation device for heating elements with plug-in ports and the heat sink with the device according to the present invention.
  • FIG. 4 is a top view of the composite heat dissipation device of the first preferred embodiment of the present invention, and is used to illustrate the distribution position of the composite heat dissipation device of the present invention in the heat sink.
  • FIG. 5 is a schematic diagram of a second preferred embodiment of the present invention, which is used to illustrate the structure of the composite heat dissipation device.
  • FIG. 6 is a schematic cross-sectional view of a second preferred embodiment of the present invention, for explaining the structure of the composite heat sink for heating elements with plug-in ports of the present invention.
  • FIG. 7 is a schematic diagram of a third preferred embodiment of the present invention, which is used to illustrate the structure of a composite heat dissipation device for a heating element with a plug-in port of the present invention.
  • Figure 8 is a schematic diagram of the structure of a common radiator.
  • 23 and 76 are fins; 4 are heat dissipation devices;
  • 32, 32’32 is a flexible metal heat dissipation body with multiple through holes; 78 is a fan;
  • 321 is the through hole; D is the height.
  • the heat sink 1 includes a standard heat dissipation device 2, a plurality of composite heat dissipation devices 3, and a heat dissipation coupling device 4 for thermally coupling to a heat dissipation device.
  • Heating element 5 is, for example, the central processing unit of a personal computer.
  • the standard heat dissipation device 2 is a common extruded aluminum chevron-shaped fin heat exhaust, and the heat dissipation combined device 4 is an example It is a liquid gold heat-dissipating paste;
  • the composite heat-dissipating device 3 has a multi-through-hole flexible metal heat-dissipating body 32, for example, a copper wire mesh formed by bending, and a thermal pad 34 enclosed in the multi-through-hole flexible metal heat-dissipating body 32 In this embodiment, it is illustrated as a silica gel thermal pad.
  • the copper wire mesh is braided by copper wires, it has densely distributed through holes 321, which can allow the surrounding air to circulate quickly, and the thermal conductivity of the copper wires is quite high. As long as the heat energy is introduced, it can be quickly conducted and distributed.
  • the lower part of the standard heat sink 2 is defined as a base 22, and the side adjacent to the base 22 and the central processing unit is called a heat-absorbing surface 221.
  • the heat-dissipating combined device 4 is used to fill the gap between the two.
  • the gap between the two is in thermal contact with the heating element 5, wherein a portion of the base 22 opposite to the heat absorbing surface 221 is formed with a fin portion 23.
  • the fin portion 23 is formed with multiple pieces of equal height D Fins.
  • the copper wire mesh is repeatedly bent into a multi-layer structure longer than the height D of the fins, and the part of the same length as the height D constitutes a plug port 323 for plugging into the above-mentioned standard heat sink 2.
  • the copper wire mesh has Flexibility and elasticity, it can produce part of the elastic restoring force and part of the two adjacent fins, even during the insertion process, the operator can push a little to make the laminated copper wire mesh more squeeze into the fin
  • the fins are spaced a little apart to form wrinkles to provide greater friction to make the two more closely fit and not easy to loosen, and cause heat conduction contact with the base 22 and the fin 23;
  • the composite heat dissipation device 3 is arranged in the above standard heat dissipation device 2
  • the distribution mode in the fin portion 23 of the fin portion 23 is, for example, a checkerboard mode, leaving a gap between two adjacent composite heat dissipation devices 3 to generate a difference in high and low temperature to induce an additional natural convection heat dissipation effect.
  • the above-mentioned composite heat dissipation device 3 is inserted into the space of all the fins.
  • the copper wire mesh is in the range of the insertion port 323, for example, a plurality of thermal conductive pads 34 are sandwiched therebetween. Since the central processing unit of a general computer mostly operates at about 30 to 70 degrees Celsius, it generally does not easily reach above 80 degrees Celsius. Therefore, the heat-absorbing surface of the standard heat sink 2 is generally defined as below 70 degrees Celsius. In this embodiment, a temperature lower than 70 degrees Celsius is used as the critical temperature. For example, 65 degrees Celsius is defined as the predetermined operating temperature of the standard heat dissipation device 2. Therefore, a silica gel thermal pad that starts to be softened by heating at 55 degrees Celsius is used as this The thermal pad 34 in the embodiment.
  • the part of the copper wire mesh with the thermal pad is inserted between the fins as a socket.
  • the contact is only a slight contact, and only a small part is a real thermal contact, making the insertion impossible. Strong force is required, and the operation process is very easy; and because the thermal softening temperature of the thermal pad 34 is not higher than the above-mentioned operating temperature, when the standard heat sink 2 reaches or exceeds its predetermined operating temperature, the thermal pad 34 is gradually softened by heating and passes through The through hole 321 seeps out of the outer surface 324 of the plug port 323, and gradually fills the gap between the outer surface 324 of the plug port 323 and the fins of the standard heat sink 2.
  • the thermal pad 34 will gradually fill The gap between the plug-in port 323 and the standard heat sink 2 allows the plug-in port 323 to maintain good thermal contact with the base and fins through the softening and reflow of the thermal pad 34.
  • the softened thermal pad 34 is at least more than half of the height D of the fin.
  • the heat energy emitted by the heating element 5 during operation is passed through the standard heat dissipation device 2, and part of it is dissipated by the fins of the standard heat dissipation device 2 as in the prior art; however, the thermal pad 34 can effectively fill the plug-in port and the standard heat dissipation device 2.
  • the gap of the heat sink 2 makes the absorbed heat more effectively transferred to the copper wire mesh.
  • the through holes 321 of the copper wire mesh are connected to each other and connected to the space outside the standard heat sink 2, so it can be in contact with the surrounding air in a large area ,
  • the nearby air is heated by the copper wire mesh with a high temperature of more than 60 degrees Celsius, and the volume expands and the density decreases, thereby forming an upward airflow to escape, and attracting the air from the side to flow in and again with the copper wire mesh exposed above the thermal pad 34 Thermal contact.
  • the composite heat dissipation device of the present invention itself can cause the effect of air convection and heat dissipation.
  • the multi-through-hole flexible metal heat dissipating body 32 of the present invention is formed by folding a copper wire mesh, the thermally conductive pad sandwiched therebetween is also a mature product, and the overall cost is quite economical. Furthermore, traditionally, it is only a thermal pad between the heat source and the radiator. In this case, it is converted to overflow from the flexible metal heat dissipation body with multiple through holes, thereby filling the heat dissipation of the flexible metal with multiple through holes.
  • the tool in the gap between the body and the heat source not only provides good thermal contact, and can even be used as a fixing device for fixing the multi-hole flexible metal heat dissipation body, so that the friction between the multi-hole flexible metal heat dissipation body and the fin is large Increased and difficult to be pulled out, thereby stabilizing the plug-in port.
  • the composite heat dissipation device of the present invention does not have to be matched with a standard heat dissipation device, and can be used alone.
  • the second preferred embodiment is shown in FIG. 5, in which the similarities with the previous embodiment will not be repeated, and only the differences will be described.
  • the heat source 5' is, for example, a motor for an electric vehicle. As the motor itself runs, it will generate high heat and cause a temperature rise of, for example, Baidu Celsius. In order to avoid damage to the insulation of the control circuit, the operating temperature must be effective. control. Therefore, in this embodiment, the composite heat sink for the heating element with the plug-in port is directly used as a complete heat sink.
  • a plurality of adjacent grooves are directly integrally formed on the housing to form a fin structure similar to the previous embodiment.
  • the multi-through-hole flexible metal heat dissipation body 32 of the composite heat dissipation device 3' ' for example, the waste steel wire produced by drilling the steel plate with a drill press is kneaded into a mass, so there are many through holes.
  • the thermal pad 34' is heated and melted thermally conductive silicone grease in advance, and then the front end of the steel wire ball is soaked in it, and the thermally conductive silicone grease is adhered to the front end of the steel wire ball to cool, thus forming the plug-in port 323'.
  • FIG. 6 is a schematic cross-sectional view of A-A' in FIG. 5.
  • the installer inserts the plug port of the composite heat sink 3'into the above-mentioned groove and plugs it tightly, and activates the motor.
  • the temperature rise exceeds its pre-determined operating temperature, such as 70 degrees Celsius
  • the thermally conductive silicone grease at the plug-in port not only fills the through holes in the steel wire mass, but also forms a good thermal contact of the thermally conductive silicone grease to the steel wire mass, and also seeps out.
  • the outer surface 324' of the insertion port 323' fills the groove, forming a good thermal contact between the thermal conductive silicone grease and the motor housing.
  • the multi-hole flexible metal heat dissipation body 32' adopts waste recycling, the cost is reduced, and the installation operation does not require strong pushing, and the combination is stable and reliable during use, and there is no need for active heat dissipation, and there is no need to worry about active heat dissipation. Poor heat dissipation when the device is damaged, or even damage to the circuit insulation, may cause the vehicle to catch fire.
  • the heat dissipation effect of the present invention is better.
  • the composite heat dissipation device disclosed in the present invention has a simple structure and low cost, it can be used as a consumable replacement due to dust clogging the through hole at any time when it is applied in areas such as electric vehicle motors or car lights that require routine maintenance. Good marketability.
  • the third preferred embodiment of the present invention is similar to the previous embodiments and will not be repeated. Due to the continuous advancement of LED die technology, the driving current of high-brightness LED die can be greatly increased from the previous 0.25 ampere. Above 2 amps, the heat generation will increase sharply. If it cannot be cooled quickly, the temperature of the operating environment will gradually increase, which will affect the luminous intensity and service life.
  • the heating element 5" is used as the light source of the street lamp by punching LED dies onto an aluminum metal substrate, and the aluminum metal substrate is combined with a standard heat sink 2" on the side facing away from the LED die.
  • the surface of the metal substrate is oxidized to generate an insulating aluminum oxide layer for layout circuits and the above-mentioned LED dies.
  • the heating element plus the standard heat dissipation device is referred to as the heat source.
  • the multi-through hole flexible metal heat dissipation body 32" of the composite heat dissipation device 3" is, for example, a copper wire cotton mass composed of thin copper wires, and heat conduction
  • the pad 34" is wrapped inside the multi-through-hole flexible metal heat dissipation body 32", and the insertion port 323" in the above-mentioned multi-through-hole flexible metal heat dissipation body 32" at least partially embeds a rigid heat-conducting member 325 ", the aforementioned rigid heat-conducting element 325" is, for example, a copper hollow heat pipe which has a higher thermal conductivity than the aforementioned thermal pad 34"; in this embodiment, the composite heat sink 3" is flexible by the insertion port 323" Because the operating environment of
  • the pressing method and the thermal contact method of each composite heat dissipation device and the heating element or the heat dissipation fin can be mutually changed, which does not hinder the implementation of the present invention.
  • the composite heat dissipation device disclosed by the present invention has a simple structure and a relatively economical cost; the installation process is simple, and the combination after installation is stable and reliable; in particular, the heat conduction combination has a good effect, which can effectively ensure the heat dissipation capacity; and the flexible metal with multiple through holes is greatly expanded
  • the contact area between the heat dissipation body and the surrounding air causes convection of the surrounding air, which significantly improves the heat dissipation effect and achieves all the above-mentioned purposes.

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Abstract

本发明公开了一种具有具插接埠的发热件用复合散热装置的散热器，供热连结于一发热件，该散热器包含：一标准散热装置，包括一个导热连结上述发热件的吸热面，以及一个远离前述吸热面的散热鳍片部，该标准散热装置具有一个预定操作温度；以及一复合散热装置，供插接至上述标准散热装置的上述鳍片部，该复合散热装置包含：一多通孔的挠性金属散热本体，包括至少一个供插接至上述鳍片部的插接埠；以及至少一导热垫，至少部分填充封闭上述插接埠的通孔，以及上述导热垫具有一个不高于上述预定操作温度的受热软化温度。

Description

具插接埠的发热件用复合散热装置及具该装置的散热器 技术领域
本发明涉及一种发热件用复合散热装置及具该装置的散热器，尤其是一种具发热件用复合散热装置及具该装置的散热器。
背景技术
随着工业技术的进展，许多传统的电器产品的发热问题也急遽增大，例如传统省电灯泡仅略有发热，完全可以自行被动散热，并不需要使用主动散热装置例如风扇或液冷装置来散热；当应用的范围进步到传统的集成电路组件，例如计算机的中央处理单元，消耗功率就已超过100W，散热装置不仅是标准配备而且引发散热装置产业的技术竞争，相关厂商甚至定期举办散热装置竞赛吸引专业以及业余人士投入散热技术的开发。
然而，更新的技术进展也让产品的发热问题更为严重，单纯以照明技术而言，近年来LED灯泡类的商品已全面取代省电灯泡成为主要的照明设备，每颗晶粒的驱动电流也由0.25A提高到2.0A左右，亮度提高的同时也伴随发热量大增的问题，尤其像是路灯一类的灯具，装设在户外，不仅应用的条件相当严酷，夏天日晒而冬天严寒，如果要采用主动式散热，更担心一旦散热装置故障时，会牵累灯具导致过热损坏。类似的高温问题，也会出现在电动车辆的电池和马达，一旦散热失灵，甚至会造成人身安全的危害。
此外，由于半导体技术的持续发展，集成电路的线宽不断缩窄，集积度不断提高，使得集成电路组件的单位面积发热问题日趋严重，计算机中央处理单元的消耗功率大幅上升，如图8所示，是以采用传统散热器7的计算机中央处理单元72为例，此种散热器7是以高导热系数又低成本的金属材料制成，例如挤型铝，散热器7与中央处理单元72接触的表面通常会进行抛光，以期能提供良好导热接触，即使 如此，仍然会产生肉眼无法分辨的空气隙，无谓地提高热阻；为避免空气缝隙所造成的热阻，一般在散热器与计算机中央处理单元之间，会涂布一层具有黏滞性的散热膏74，经由施加压力迫紧，以填补两者之间的细微缝隙、改善两者的导热接触。
来自中央处理单元72的热能，经由散热膏传导进入散热器后，会循散热器的结构传导至远离中央处理单元72处，为增加散热器末端与空气的接触面积，会在散热器远离抛光表面侧设置复数个鳍片部76，藉以扩大热交换的表面积；为解决上述单位面积发热增高的问题，现行电子装置还常会在对应鳍片部76处加装风扇78，由强制对流的主动散热进一步提升散热速率。
另一方面，在半导体制程中，无论是光源或加工机具，都有散热问题需要解决，但半导体加工时必须限制在无尘环境，主动式的散热则是尽量避免，才不会因为气流或漏水等副作用带来不必要的问题。因此，关于如何将高效率的被动式散热装置结合在LED灯具或其他发热件上，就成为散热设计的重点。
然而，一方面泡沫铜主要是采用熔体发泡法或是粉体烧结法，制作成本持续居高不下，使该产品价格昂贵；另方面气泡部分不一定都导通至外部，即使导通，因为通道多所弯折，通风效果也可能不如预期；最严重的，空气存在于间隙中，就会形成莫大的热阻，导致热接触性不佳；以上种种不利因素导致该发泡铜散热器的散热效率和市场接受度都不高。
因此，如何因应不断推陈出新的工业应用以及各种产业的此消彼涨，利用材料的导热特性开发出合适的散热装置，而且同步提供组装和使用的便利性，并且确保良好的导热接触，让发热源所发的热能可以用被动式的结构有效导出，一直是此技术领域里不断需要被克服的问题。
发明内容
针对现有技术的上述不足，根据本发明的实施例，希望提供一种结构简单的具插接埠的发热件用复合散热装置，旨在实现如下目的：(1)供简便插接至一发热件，提升使用便利性；(2)大幅降低制造成本；(3)可确保与发热件之间的良好导热连 接，使得上述发热件发出的热能快速地逸散，藉此保护该发热件不因温度过高而故障。此外，本发明还希望提供一种具有具插接埠的发热件用复合散热装置的散热器，藉由复合散热装置的辅助，让散热器的被动散热性能大幅提升；结构简单且制造成本经济，具有良好市场竞争力。
根据实施例，本发明提供的一种具有具插接埠的发热件用复合散热装置的散热器，供热连结于一发热件以将该发热件发出的热能吸收，该散热器包含：一标准散热装置，具有一个预定操作温度，且具有一吸热面供吸收上述发热件发出的热能；一复合散热装置，供插接至上述标准散热装置而将上述标准散热装置的热能逸散，该复合散热装置包含：一多通孔的挠性金属散热本体，包括至少一个供插接至上述标准散热装置的插接端口；以及至少一导热垫，至少部分填充封闭上述插接埠的通孔，以及上述导热垫具有一个不高于上述预定操作温度的受热软化温度；以及一散热结合装置，设置在上述标准散热装置的上述吸热面，供将上述散热器与上述发热件热连结。
上述散热器中的具插接埠的发热件用复合散热装置，亦可单独使用，供插接至一发热件，前述发热件具有一个预定操作温度，该复合散热装置包含：一多通孔的挠性金属散热本体，包括至少一个供插接至上述发热件的插接埠；以及至少一导热垫，至少部分填充封闭上述插接埠的通孔，以及前述导热垫具有一个不高于上述预定操作温度的受热软化温度。
相对于现有技术，由于本发明的导热垫具有一个不高于上述预定操作温度的受热软化温度，使得当标准散热装置达到上述预定操作温度时，上述导热垫即熔化并受重力作用而流出并至少部分填充封闭上述插接埠的通孔，藉此确保上述多通孔的挠性金属散热本体与上述标准散热装置的热接触良好，并藉由设置在上述标准散热装置的吸热面的散热结合装置，将上述散热器与上述发热件热连结，达到改善散热器的热接触与通风以提高散热效率的功效；而此种复合结构简单、易于制造，并且安装过程简易可靠，没有紧配合的插拔困难，尤其具有低成本的竞争优势而有益于 市场推广。
附图说明
图1为本发明第一较佳实施例的示意图，用于说明本发明具插接埠的发热件用复合散热装置及具该装置的散热器的结构。
图2为本发明第一较佳实施例中的复合散热装置的正视图，用于说明复合散热装置的结构。
图3为本发明第一较佳实施例复合散热装置的侧视图，用于说明本发明具插接埠的发热件用复合散热装置及具该装置的散热器的结构。
图4为本发明第一较佳实施例复合散热装置的俯视图，用于说明本发明复合散热装置在散热器中的分布位置。
图5为本发明第二较佳实施例的示意图，用于说明本复合散热装置的结构。
图6为本发明第二较佳实施例的剖面示意图，用于说明本发明具插接埠的发热件用复合散热装置的结构。
图7为本发明第三较佳实施例的示意图，用于说明本发明具插接埠的发热件用复合散热装置的结构。
图8为常见的散热器的结构示意图。
其中：
1、7为散热器；                         323、323’、323〞为插接埠；
2、2〞为标准散热装置；                 324、324’为外表面；
22为基部；                             325〞为刚性导热件；
221为吸热面；                          34、34’、34〞为导热垫；
23、76为鳍片部；                       4为散热结合装置；
                                       5、5’、5〞为发热件；
                                       72为中央处理单元；
3、3’、3〞为复合散热装置；            74为散热膏；
32、32’32”为多通孔挠性金属散热本体； 78为风扇；
321为通孔；                         D为高度。
具体实施方式
下面结合附图和具体实施例，进一步阐述本发明。这些实施例应理解为仅用于说明本发明而不用于限制本发明的保护范围。在阅读了本发明记载的内容之后，本领域技术人员可以对本发明作各种改动或修改，这些等效变化和修改同样落入本发明权利要求所限定的范围。
第一较佳实施例
请同时参照图1至图4，本发明提供的第一较佳实施例中，散热器1包含一个标准散热装置2、多个复合散热装置3和一个散热结合装置4，用来导热结合至一发热件5；其中，发热件5例如是个人计算机的中央处理器，在本实施例中，标准散热装置2是常见挤型铝制的山字形鳍片热排，而散热结合装置4则例释为液金散热膏；复合散热装置3具有一多通孔挠性金属散热本体32例如是反折成形的铜丝网，以及被包围在上述多通孔挠性金属散热本体32中的导热垫34，在本实施例中是例释为硅胶导热垫。铜丝网因为是铜丝编织而成，具有密布的通孔321，可供周边空气快速流通，而且铜丝的导热系数相当高，只要热能被导入，就可以迅速被传导分布开。
在本实施例中，为便于说明起见，标准散热装置2下方被定义为一基部22，基部22与中央处理器紧邻侧则称为吸热面221，藉由上述散热结合装置4填补两者之间的缝隙而与发热件5导热接触，其中，基部22相反于吸热面221的部分形成有一个鳍片部23，鳍片部23在本实施例中是形成有多片具有相等高度D的鳍片。铜丝网被反复弯折成为比鳍片高度D更长的多层结构，其中与高度D等长的部分构成一个供插接至上述标准散热装置2的插接端口323，由于铜丝网具有可挠性与弹性，可产生部分弹性回复力而部分顶抵上述两个相邻鳍片，甚至在插入的过程中，操作人员可以稍微推挤，让迭层的铜丝网更多挤入鳍片间隔一点而形成皱褶提供更大摩擦力使得两者之间更加紧密配合不易松脱，并造成与基部22和鳍片部23的部分导 热接触；复合散热装置3设置在上述标准散热装置2的鳍片部23中的分布方式例如是棋盘格方式，在相邻两个复合散热装置3之间留下空档而产生高低温差，以引发额外的自然对流散热效果，当然本发明的领域里具有通常知识的技艺人士都可理解在其他实施例中上述复合散热装置3是插满所有鳍片部的空间。
铜丝网在插接端口323的范围，夹置有例如多片导热垫34。由于一般计算机的中央处理器多是在摄氏30度到70度左右操作，一般不会轻易到达摄氏80度以上，因此标准散热装置2的吸热面一般会界定在例如摄氏70度以下，而在本实施例中，采用一个低于摄氏70度的温度作为临界，定义例如摄氏65度作为标准散热装置2的预定操作温度，因此采用从例如摄氏55度就会开始受热软化的硅胶导热垫作为本实施例中的导热垫34。
在开始装设时，铜丝网夹置有导热垫的部分被插接进入鳍片之间作为插接埠，此时的接触仅只是略微接触，只有少部分是真正导热接触，使得插接不需强力，操作过程非常容易；而由于导热垫34的受热软化温度不高于上述的操作温度，因此当标准散热装置2达到或超过其预定的操作温度时，导热垫34逐步受热软化，并经由上述通孔321渗出上述插接端口323的外表面324，逐渐填补插接端口323外表面324和上述标准散热装置2的鳍片间隙，在反复的使用计算机后，导热垫34将会逐渐填满插接端口323和标准散热装置2的间隙，使得插接端口323经由导热垫34的软化与再流动，保持与基部和鳍片的良好导热接触，在本实施例中，软化后的导热垫34至少达到鳍片高度D的一半以上。
本实施例中，发热件5运作时发出的热能经由标准散热装置2，一部份跟先前技术一样是由标准散热装置2的鳍片发散；但由于导热垫34可以有效填补插接端口和标准散热装置2的间隙，使得吸收的热能更可以有效传递至铜丝网，铜丝网的通孔321又是互相连通并连通到标准散热装置2外部的空间，因此可以大面积地接触到周边空气，近处空气被摄氏60余度高温的铜丝网所加热，体积膨胀而密度降低，从而形成上升气流逸散，并吸引侧方的空气流入而再度与暴露在导热垫34上 方的铜丝网导热接触。即使没有设置主动的鼓风装置，但因为周边空气可以顺利补充受热上升的气流，使得本发明的复合散热装置本身就可以造成空气对流散热的效果。
由于本发明的多通孔挠性金属散热本体32是由铜丝网折迭而成，所夹置的导热垫也是成熟产品，整体造价相当经济。更进一步，传统上仅是介于发热源和散热器之间的导热垫，在本案中转换成为从多通孔的挠性金属散热本体中向外溢出，从而填补多通孔的挠性金属散热本体与发热源间空隙的工具，不仅提供良好导热接触，甚至因而可以作为固定多通孔的挠性金属散热本体的固定装置，让多通孔的挠性金属散热本体与鳍片间摩擦力大增而不易被拔出，藉此稳固插接埠。
第二较佳实施例
当然，如熟悉本技术领域人士所能轻易理解，本发明的复合散热装置不一定要配合标准散热装置，亦可单独运用。第二较佳实施例如图5所示，其中与前一实施例相同之处不再赘述，仅就差异的部分进行说明。在本实施例中，热源5’例如是一电动车用马达，由于马达本身运转就会发高热造成例如摄氏百度的温升，为避免对控制电路的绝缘等功效造成破坏，操作温度必须被有效控制。因此在本实施例中，是直接将具插接埠的发热件用复合散热装置作为完整散热器运用。本实施例中的马达，外壳上直接一体成形有多个相邻凹槽形成类似前一实施例的鳍片结构，在本实施例中复合散热装置3’的多通孔挠性金属散热本体32’，更是采用例如钻床对钢板进行钻孔作业产生的废弃钢丝，彼此揉合成团，因此其中的通孔甚多。在本实施例中的导热垫34’，则是事先加热融化的导热硅脂，然后将前述钢丝团前端浸泡其中，让导热硅脂黏着在钢丝团前端冷却，就此形成插接端口323’。
请继续参照图6，图6是图5的A-A’剖面示意图，在本实施例中，安装人员将复合散热装置3’的插接埠插入上述凹槽后稍微塞紧，并且开动马达造成温升，超过其预订的操作温度例如摄氏70度时，插接端口处的导热硅脂不仅填满钢丝团中的通孔，构成导热硅脂对钢丝团的良好导热接触，并且也渗出上述插接端口323’ 的外表面324’而填满凹槽，构成导热硅脂和马达外壳之间的良好导热接触。由于多通孔挠性金属散热本体32’是采用废料回收，成本更为降低，而安装操作中不需要强力推挤，且使用时的结合稳固可靠，不需要主动式散热，也不担心主动散热装置损坏时的散热不良、甚至电路绝缘损坏、车辆因而起火的风险。
当然，如熟悉本技术领域人士所能轻易理解，即使上述复合散热装置不是位于空气中，而是被浸泡于例如水流或其他散热用的流体之中，由于多通孔的挠性金属散热本体本身形成有众多通孔，都能让散热流体达成良好的导热接触，并且因为流体受热温度改变而降低密度，从而达成自发性地热对流。此外，即使本案所揭露的复合散热装置可以独立完成散热功效而不需要结合主动式鼓风装置，但并非局限不可以跟主动式散热装置结合，熟悉本技术领域人士可以自行添加主动式鼓风装置而使本发明的散热效果更佳。尤其因为本发明所揭露的复合散热装置结构简单而造价低廉，在例如电动车马达或车灯等例行需保养的领域中应用时，随时可以因灰尘堵塞通孔而作为耗材替换，从而具有绝佳的市场性。
第三较佳实施例
请参照图7，本发明第三较佳实施例与前述实施例相同之处不再赘述，由于LED晶粒的技术不断进步，高亮度LED晶粒的驱动电流已经可以从以往的0.25安培大幅提升到2安培以上，因此发热量也随之暴增，若无法迅速冷却，操作环境温度会逐步升高而影响发光强度及使用寿命。在本实施例中，发热件5〞是将LED晶粒打件至铝质金属基板上作为路灯的光源，而铝质金属基板背对LED晶粒侧则结合有标准散热装置2〞，铝质金属基板的表面氧化而生成绝缘的氧化铝层，供布局电路及上述LED晶粒设置。为便于说明起见，在此将发热件加上标准散热装置称为热源，复合散热装置3〞的多通孔挠性金属散热本体32〞例如是细铜丝组成的铜丝棉团，且而导热垫34〞则是被包覆在多通孔挠性金属散热本体32〞内部，且上述多通孔挠性金属散热本体32〞中的插接端口323〞至少部分包埋了一刚性导热件325〞，前述刚性导热件325〞例如是一铜质中空热导管其具有高于上述导热垫34〞的导热 系数；在本实施例中，复合散热装置3〞是藉由插接端口323〞的挠性而插塞在标准散热装置2〞中，由于路灯所在的操作环境相当恶劣，藉由本发明的被动式散热，可以将热源保持在预定操作温度范围内，避免因为主动散热损坏而使LED劣化，确保路灯的使用寿命。
以上所述实施例中，每一种复合散热装置和发热件或散热鳍片的顶抵方式、热接触方式皆可相互变换，均无碍于本发明实施。由本发明所揭露的复合散热装置结构简单，造价相当经济；安装过程简便，且安装后的结合稳固可靠；尤其导热结合的效果良好，可以有效确保散热能力；加以大幅扩大多通孔的挠性金属散热本体和周边空气接触面积，并且造成周边空气对流，明显提升散热效果，达成所有上述目的。

Claims (10)

  1. 一种具有具插接埠的发热件用复合散热装置的散热器，供热连结于一发热件，其特征是，该散热器包含：
    一标准散热装置，包括一个导热连结上述发热件的吸热面，以及一个远离前述吸热面的散热鳍片部，该标准散热装置具有一个预定操作温度；以及
    一复合散热装置，供插接至上述标准散热装置的上述鳍片部，该复合散热装置包含：
    一多通孔的挠性金属散热本体，包括至少一个供插接至上述鳍片部的插接埠；以及
    至少一导热垫，至少部分填充封闭上述插接埠的通孔，以及上述导热垫具有一个不高于上述预定操作温度的受热软化温度。
  2. 如权利要求1所述的散热器，其特征是，上述标准散热装置进一步包括一个具有上述吸热面，且和上述鳍片部一体成形的金属材质的基部。
  3. 如权利要求1所述的散热器，其特征是，上述插接埠具有一个外表面，以及上述导热垫至少部分位于上述外表面内侧，使得当上述标准散热装置到达上述操作温度时，上述导热垫至少部分受热软化经由上述通孔渗出上述外表面，藉此填补上述外表面和上述鳍片部的间隙。
  4. 如权利要求1、2或3所述的散热器，其特征是，上述多通孔的挠性金属散热本体是折迭的多层金属丝网。
  5. 如权利要求4所述的散热器，其特征是，上述导热垫被上述多层金属丝网夹置在上述插接埠处。
  6. 一种具插接埠的发热件用复合散热装置，供插接至上述发热件，上述发热件具有一个预定操作温度，其特征是，该复合散热装置包含：
    一多通孔的挠性金属散热本体，包括至少一个供插接至上述发热件的插接埠；以及
    至少一导热垫，至少部分填充封闭上述插接埠的通孔，以及前述导热垫具有一个不高于上述预定操作温度的受热软化温度。
  7. 如权利要求6所述的发热件用复合散热装置，其特征是，进一步包括至少部分包埋于上述插接埠的刚性导热件，前述刚性导热件具有高于上述导热垫的导热系数。
  8. 如权利要求6所述的发热件用复合散热装置，其特征是，上述插接埠具有一个外表面，以及上述导热垫至少部分位于上述外表面内侧，使得当上述热源到达上述操作温度时，上述导热垫至少部分受热软化经由上述通孔渗出上述外表面，藉此填补上述外表面和上述发热件的间隙。
  9. 如权利要求6、7或8所述的发热件用复合散热装置，其特征是，上述多通孔的挠性金属散热本体是金属丝团。
  10. 如权利要求9所述的发热件用复合散热装置，其特征是，上述导热垫是被包覆在上述金属丝团内部。
PCT/CN2020/121758 2019-11-14 2020-10-19 具插接埠的发热件用复合散热装置及具该装置的散热器 WO2021093516A1 (zh)

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5282507A (en) * 1991-07-08 1994-02-01 Yazaki Corporation Heat exchange system
CN101386050A (zh) * 2007-09-13 2009-03-18 沈嘉辉 散热模组的加工方法及装置
CN105119167A (zh) * 2015-09-08 2015-12-02 泰州市姜堰奥威机械有限公司 一种电气箱空调
CN106714518A (zh) * 2017-01-04 2017-05-24 北京中安科创科技发展有限公司 一种宽温热控装置
CN106931382A (zh) * 2017-03-29 2017-07-07 华南理工大学 一种用于led车灯的散热元件及其制备方法
CN108758580A (zh) * 2018-05-05 2018-11-06 刘康 一种用于照明设备和电脑的散热装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7147367B2 (en) * 2002-06-11 2006-12-12 Saint-Gobain Performance Plastics Corporation Thermal interface material with low melting alloy
JP2012521657A (ja) * 2009-03-25 2012-09-13 ヒューレット−パッカード デベロップメント カンパニー エル．ピー． グリッドヒートシンク
JP7098954B2 (ja) * 2018-02-21 2022-07-12 三菱マテリアル株式会社 ヒートシンク

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5282507A (en) * 1991-07-08 1994-02-01 Yazaki Corporation Heat exchange system
CN101386050A (zh) * 2007-09-13 2009-03-18 沈嘉辉 散热模组的加工方法及装置
CN105119167A (zh) * 2015-09-08 2015-12-02 泰州市姜堰奥威机械有限公司 一种电气箱空调
CN106714518A (zh) * 2017-01-04 2017-05-24 北京中安科创科技发展有限公司 一种宽温热控装置
CN106931382A (zh) * 2017-03-29 2017-07-07 华南理工大学 一种用于led车灯的散热元件及其制备方法
CN108758580A (zh) * 2018-05-05 2018-11-06 刘康 一种用于照明设备和电脑的散热装置

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