WO2021082055A1 - Procédé de fabrication d'ensemble capteur mems et ensemble capteur mems fabriqué par le procédé - Google Patents

Procédé de fabrication d'ensemble capteur mems et ensemble capteur mems fabriqué par le procédé Download PDF

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Publication number
WO2021082055A1
WO2021082055A1 PCT/CN2019/116570 CN2019116570W WO2021082055A1 WO 2021082055 A1 WO2021082055 A1 WO 2021082055A1 CN 2019116570 W CN2019116570 W CN 2019116570W WO 2021082055 A1 WO2021082055 A1 WO 2021082055A1
Authority
WO
WIPO (PCT)
Prior art keywords
filter membrane
mems sensor
heat
sensor assembly
adhesive layer
Prior art date
Application number
PCT/CN2019/116570
Other languages
English (en)
Chinese (zh)
Inventor
游振江
林育菁
Original Assignee
潍坊歌尔微电子有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2021082055A1 publication Critical patent/WO2021082055A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00158—Diaphragms, membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/54—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
    • B01D46/543—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present disclosure mainly relates to a method for manufacturing a MEMS sensor component, and a MEMS sensor component manufactured by the method.
  • a particle filter is deployed in some MEMS sensor components, which prevents certain types of debris from entering the MEMS sensor.
  • a screen made of fine metal wires, or a porous structure formed of a silicon substrate with multiple through holes is often used as a dustproof film in a particle filter.
  • the nano dustproof film is easily damaged by conventional mechanical transfer and peeling processes during its manufacturing process. Therefore, there is an urgent need for a MEMS sensor assembly manufacturing method that can transfer and peel the film without damaging the film.
  • An object of the present disclosure is to provide a new technical solution for a method of manufacturing a MEMS sensor assembly.
  • a method of manufacturing a MEMS sensor assembly comprising: providing a filter membrane, including coating a buffer material on a side of a substrate covered with a heat-releasing adhesive layer so as to Forming a buffer layer on the heat-releasing adhesive layer, depositing a filter film material on the buffer layer to form a filter film, heating the substrate so that the buffer layer and the filter film are bonded together in a heat release The agent layer is pushed away from the substrate and the buffer layer is removed from the filter membrane.
  • the method further includes providing a MEMS sensor with an opening and capable of sensing through the opening.
  • the method also includes bonding the filter membrane to the MEMS sensor such that the filter membrane covers the opening.
  • the heat-releasing adhesive layer is composed of polymer microcapsules that are expanded by heat.
  • heating the substrate so that the buffer layer and the filter film are pushed away from the substrate under the action of the heat release adhesive layer includes: heating the substrate to cause the The polymer microcapsules expand together, so that the surface of the heat-releasing adhesive layer becomes uneven.
  • the buffer material is photoresist.
  • the filter membrane material is an amorphous metal material.
  • the amorphous metal material is metallic glass.
  • the filter membrane has a thickness of 5 nm to 5 ⁇ m.
  • the filter membrane has a thickness of 20 nm to 1000 nm.
  • a MEMS sensor assembly which is manufactured using the method according to the first aspect of the present disclosure.
  • the MEMS sensor component is used in a microphone module or a microphone chip.
  • the method according to the present disclosure can protect the nano-film from damage due to the conventional mechanical transfer process, thereby greatly improving the yield rate.
  • Fig. 1 schematically shows an embodiment of the method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B), Fig. 1(C) and Fig. 1(D) sequentially show the filter The various steps in the film manufacturing process.
  • the present disclosure provides a method for manufacturing a MEMS sensor component and a MEMS sensor component manufactured by the method.
  • the MEMS sensor component can be used in acoustic equipment, for example, in a microphone chip or a microphone module.
  • the MEMS sensor assembly can also be used in other types of equipment, which will not be described in detail here.
  • Fig. 1 schematically shows an embodiment of a method for manufacturing a MEMS sensor assembly according to the present disclosure, in which Fig. 1(A), Fig. 1(B), Fig. 1(C) and Fig. 1(D) are shown in sequence The various steps in the membrane manufacturing process are described.
  • a buffer material is coated on the side of the substrate 100 covered with the heat-releasing adhesive layer 106 to form the buffer layer 102 on the heat-releasing adhesive layer 106.
  • the heat-releasing adhesive layer 106 may be composed of polymer microcapsules expanded by heat.
  • the buffer material may be a photoresist, so that it can be easily removed by common means such as light.
  • a filter membrane material is deposited on the buffer layer 102 to form a filter membrane 104.
  • the filter membrane material may be an amorphous metal material.
  • the filter membrane material is metallic glass.
  • Various metallic glass materials can be selected according to the manufacturing method and required performance.
  • the filter membrane 104 has a thickness of 5 nm to 5 ⁇ m, preferably 20 nm to 1000 nm.
  • metallic glass is isotropic and uniform, there are basically no defects such as grain boundaries and segregation caused by polycrystalline structure, and its size effect is small. Therefore, when designing the micro filter, it is not necessary to consider the changes in physical properties due to anisotropy and size, which facilitates the structural design of the micro filter. In addition, because metallic glass is an alloy composed of multiple elements, the range of material selection in the design of a micro filter is widened, and a higher performance micro filter can be designed and manufactured.
  • the substrate 100 may be heated by means of, for example, a heat source 108.
  • the heat is conducted to the heat release adhesive layer 106.
  • This causes the polymer microcapsules on the heat-releasing adhesive layer 106 to simultaneously expand together, so that the surface of the heat-releasing adhesive layer 106 becomes uneven, thereby causing the adhesive force of the heat-releasing adhesive layer 106 to disappear. Due to the disappearance of the adhesive force and the expansion of the polymer microcapsules, the buffer layer 102 to be adhered and the filter membrane 104 formed thereon are pushed away (away from) the substrate 100 at the same time, and will not be physically damaged in the process.
  • the buffer layer 102 has been removed to form the final product filter membrane 104.
  • the filter membrane manufacturing process shown in Figures (A) to (D) eliminates the direct physical interaction between the substrate 100 and the filter membrane 104, which is common in traditional mechanical transfer and peeling processes. Therefore, the risk of physical damage to the filter membrane 104 during the manufacturing process is greatly reduced.
  • the filter membrane provided in the manner shown in FIGS. 1(A) to (D) may be bonded to a MEMS sensor (not shown), thereby forming a MEMS sensor assembly.
  • the MEMS sensor has an opening, and the object to be measured can be contacted through the opening for sensing.
  • the process of providing the MEMS sensor is well known to those skilled in the art, and will not be repeated here.
  • Combining the filter membrane to the MEMS sensor can include making the filter membrane cover the opening of the sensor, so that the filter membrane can play a filtering role, and prevent particles, water and other debris from entering the MEMS sensor assembly without affecting the sensor's sensing function. in.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Micromachines (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un ensemble capteur de système microélectromécanique (MEMS) comprenant les étapes consistant à : utiliser une membrane filtrante (104), comprenant le revêtement d'un matériau tampon sur une surface d'un substrat (100) où une couche d'adhésif thermodécollable (106) est recouverte pour former une couche tampon (102) sur la couche d'adhésif thermodécollable (106), et déposer un matériau de membrane filtrante sur la couche tampon (102) pour former la membrane filtrante (104) ; chauffer le substrat (100) de sorte que la couche tampon (102) et la membrane filtrante (104) ensemble soient poussées à l'opposé du substrat (100) sous l'action de la couche d'adhésif thermodécollable (106) ; retirer la couche tampon (102) de la membrane filtrante (104) ; fournir un capteur MEMS ayant une ouverture et capable de détecter au moyen de l'ouverture ; et lier la membrane filtrante (104) au capteur MEMS de telle sorte que la membrane filtrante (104) recouvre l'ouverture. Le procédé réduit le risque de détérioration physique de la membrane filtrante (104) dans un procédé de fabrication.
PCT/CN2019/116570 2019-10-31 2019-11-08 Procédé de fabrication d'ensemble capteur mems et ensemble capteur mems fabriqué par le procédé WO2021082055A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911056438.0A CN110775940B (zh) 2019-10-31 2019-10-31 Mems传感器组件制造方法、以及以该法制造的mems传感器组件
CN201911056438.0 2019-10-31

Publications (1)

Publication Number Publication Date
WO2021082055A1 true WO2021082055A1 (fr) 2021-05-06

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CN (1) CN110775940B (fr)
WO (1) WO2021082055A1 (fr)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106744664A (zh) * 2016-11-22 2017-05-31 歌尔股份有限公司 在mems传感器上形成过滤网的方法以及mems传感器
CN107105378A (zh) * 2017-06-05 2017-08-29 歌尔股份有限公司 Mems芯片、麦克风及制作方法与封装方法
CN107615364A (zh) * 2015-05-27 2018-01-19 夏普株式会社 显示面板的制造方法
WO2018064804A1 (fr) * 2016-10-08 2018-04-12 Goertek. Inc Dispositif mems et appareil électronique
CN109890748A (zh) * 2017-06-09 2019-06-14 歌尔股份有限公司 Mems麦克风、其制造方法以及电子设备
CN110191409A (zh) * 2019-05-23 2019-08-30 深圳市伊声声学科技有限公司 一种防水透气膜的制造方法
CN110267173A (zh) * 2019-06-28 2019-09-20 歌尔股份有限公司 一种微型过滤器及声学设备

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JPS5669835A (en) * 1979-11-09 1981-06-11 Japan Electronic Ind Dev Assoc<Jeida> Method for forming thin film pattern
JP4712264B2 (ja) * 1999-12-08 2011-06-29 バクスター・インターナショナル・インコーポレイテッド 微小多孔性フィルター膜、微小多孔性フィルター膜を作製するための方法、および微小多孔性フィルター膜を使用する分離器
US20080102648A1 (en) * 2006-11-01 2008-05-01 Taiwan Semiconductor Manufacturing Company, Ltd. Method and System For Making Photo-Resist Patterns
CN105051137A (zh) * 2013-03-15 2015-11-11 日东电工株式会社 粘合片

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107615364A (zh) * 2015-05-27 2018-01-19 夏普株式会社 显示面板的制造方法
WO2018064804A1 (fr) * 2016-10-08 2018-04-12 Goertek. Inc Dispositif mems et appareil électronique
CN106744664A (zh) * 2016-11-22 2017-05-31 歌尔股份有限公司 在mems传感器上形成过滤网的方法以及mems传感器
CN107105378A (zh) * 2017-06-05 2017-08-29 歌尔股份有限公司 Mems芯片、麦克风及制作方法与封装方法
CN109890748A (zh) * 2017-06-09 2019-06-14 歌尔股份有限公司 Mems麦克风、其制造方法以及电子设备
CN110191409A (zh) * 2019-05-23 2019-08-30 深圳市伊声声学科技有限公司 一种防水透气膜的制造方法
CN110267173A (zh) * 2019-06-28 2019-09-20 歌尔股份有限公司 一种微型过滤器及声学设备

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CN110775940B (zh) 2023-08-15

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