WO2020258364A1 - Microfiltre et dispositif acoustique - Google Patents

Microfiltre et dispositif acoustique Download PDF

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Publication number
WO2020258364A1
WO2020258364A1 PCT/CN2019/094777 CN2019094777W WO2020258364A1 WO 2020258364 A1 WO2020258364 A1 WO 2020258364A1 CN 2019094777 W CN2019094777 W CN 2019094777W WO 2020258364 A1 WO2020258364 A1 WO 2020258364A1
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WO
WIPO (PCT)
Prior art keywords
metal film
film
layer
substrate
micro filter
Prior art date
Application number
PCT/CN2019/094777
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English (en)
Chinese (zh)
Inventor
林育菁
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潍坊歌尔微电子有限公司
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Publication date
Application filed by 潍坊歌尔微电子有限公司 filed Critical 潍坊歌尔微电子有限公司
Publication of WO2020258364A1 publication Critical patent/WO2020258364A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D46/00—Filters or filtering processes specially modified for separating dispersed particles from gases or vapours
    • B01D46/54—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms
    • B01D46/543—Particle separators, e.g. dust precipitators, using ultra-fine filter sheets or diaphragms using membranes
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H04R1/083—Special constructions of mouthpieces

Definitions

  • the present invention relates to a micro filter, which can be a micro filter suitable for acoustic equipment to filter dust particles or/and water and other substances that are not expected to enter the interior of the acoustic equipment.
  • Portable computing devices such as notebook computers and tablet computers are ubiquitous, and portable communication devices such as smart phones are also ubiquitous. However, these devices do not have enough space to accommodate relatively large microphones or speakers. As a result, microphones and speakers have become more compact and reduced in size. In addition, the microphones and speakers in these portable settings usually need to be close to the relevant acoustic input or output ports of the terminal, so that particles and water can easily enter the microphones and speakers and cause the failure of these acoustic devices.
  • Filter membranes are sometimes deployed in previous equipment to prevent certain types of debris from entering the components. Unfortunately, these filters tend to adversely affect the operation of the microphone. For example, when using these previous methods, the performance of the microphone can sometimes be significantly reduced. Due to performance degradation, microphone customers often choose not to use such microphones in their applications.
  • An object of the present invention is to provide a new technical solution for the micro filter.
  • a micro filter including a substrate with a back cavity, and a metal film arranged on the substrate and suspended on the back cavity; and the outer surface of the metal film is coated with Non-stick layer; the adhesion between the non-stick layer and the particles is lower than the adhesion between the metal film and the particles; the metal film and the non-stick layer have arranged through holes.
  • the non-stick layer is a siloxane compound coating or a fluoropolymer coating.
  • the non-stick layer is a Teflon coating.
  • the coating is provided with two layers, which are respectively located on opposite sides of the metal thin film.
  • the metal film is configured to have compressive stress; the non-stick layer is configured to have tensile stress; or, the metal film is configured to have tensile stress; the non-stick layer is configured to have compressive stress. stress;
  • the metal thin film and non-stick layer are configured to reduce the stress of the entire film layer.
  • the stress of the film layer is between -300 MPa and 300 MPa.
  • the metal thin film is made of metallic glass.
  • the substrate is made of polymer material, metal, silicon or SiO2.
  • an acoustic device including the above-mentioned micro filter.
  • the acoustic device is a microphone module or a microphone chip.
  • the problem of particles sticking to the metal film with through holes after long-term use can be avoided, thereby ensuring the sensitivity of the sensor.
  • Fig. 1 is a cross-sectional view of the first embodiment of the microfilter of the present invention.
  • Fig. 2 is a cross-sectional view of a second embodiment of the microfilter of the present invention.
  • Fig. 3 is a cross-sectional view (with through holes) of the second embodiment of the microfilter of the present invention.
  • Fig. 4 is a cross-sectional view of a third embodiment of the microfilter of the present invention.
  • Fig. 5 is a cross-sectional view from another perspective in the third embodiment of the microfilter of the present invention.
  • Fig. 6 is a cross-sectional view of a fourth embodiment of the microfilter of the present invention.
  • the invention provides a micro filter and an acoustic device using the micro filter.
  • the acoustic device can be, for example, a microphone chip or a microphone module.
  • the micro-filter is provided on the microphone chip; when the acoustic device is a microphone module, the micro-filter can be provided at the sound hole of the housing in the module.
  • the acoustic device may also be other types of acoustic transducers, and the types are not described in detail here.
  • the micro filter provided by the present invention includes a substrate and a film layer arranged on the substrate.
  • the substrate has a hollow back cavity structure, the edge of the film layer is connected to the substrate, and the middle area of the film layer is suspended above the back cavity, so that the film layer forms a cantilever bridge structure.
  • Figure 1 shows a schematic structural diagram of an embodiment of the microfilter of the present invention.
  • the metal thin film 6 a is disposed on the substrate 5 and suspended above the hollow back cavity 7 of the substrate 5.
  • the metal film 6a may be an amorphous metal film, such as metallic glass.
  • the substrate 5 can be made of polymer material, metal, silicon or SiO 2 .
  • the outer surface of the metal film 6a is coated with a non-stick layer 6b.
  • the adhesion between the non-stick layer 6b and the particles is lower than the adhesion between the metal film 6a and the particles; the metal film 6a and the non-stick layer 6b have arranged through holes (not shown in the view).
  • the non-stick layer 6b is a silicone compound coating or a fluoropolymer coating.
  • the non-stick layer 6b is a Teflon coating. Teflon has high temperature characteristics and low friction coefficient.
  • the non-stick layer By providing a non-stick layer on the metal film, the problem of particles sticking to the metal film with through holes after long-term use can be avoided, thereby ensuring the sensitivity of the sensor.
  • the non-stick layer also has an anti-corrosion function, which improves the service life of the micro filter.
  • the metal film 6a is configured to have compressive stress; the non-stick layer 6b is configured to have tensile stress; the metal film 6a and the non-stick layer 6b are composited together to reduce the overall film stress.
  • the metal thin film 6a is configured to have tensile stress, and the non-stick layer 6b is configured to have compressive stress.
  • the specific principle is the same as the embodiment shown in FIG. 5 and FIG. 6, and will not be described in detail here.
  • the stress of the film layers combined together is controlled between -300 MPa (compressive stress) and 300 MPa (tensile stress).
  • the stress of the composite film layers is controlled between 0 and 300 MPa (tensile stress).
  • Fig. 2 shows a schematic structural diagram of another embodiment of the microfilter of the present invention.
  • the film layer on the substrate 50 includes a three-layer film that is suspended on the hollow back cavity 70 of the substrate 50.
  • the three-layer film includes a metal film 60a with compressive stress and two non-stick layers 60b with tensile stress.
  • the metal film 60a is located between the two non-stick layers 60b, and the three layers are compounded together.
  • the non-stick layer 60b with tensile stress on both sides is used to offset the compressive stress of the metal film in the middle; conversely, the metal film 60a with compressive stress in the middle will also offset the compressive stress of the non-stick layer 60b on both sides. No more details.
  • non-stick layers 60b are provided on both sides of the metal film 60a, which can avoid or reduce particle adsorption of the metal film 60a and ensure the performance of the micro filter.
  • the metal film 60a and the non-stick layer 60b have arranged through holes. Referring to FIG. 3, the periphery of the through holes are covered by the non-stick layer 60b.
  • Fig. 4 and Fig. 5 show schematic structural diagrams of one embodiment of the microfilter of the present invention.
  • the film layer 2 is connected above the substrate 1 and is suspended on the hollow back cavity 3 of the substrate 1.
  • the membrane layer 2 has through holes 4 arranged for air flow.
  • the substrate 1 can be made of metal, silicon or SiO 2 , and a hollow back cavity 3 can be formed in a manner well known to those skilled in the art. For example, it is formed by etching and other processes, which will not be described in detail here.
  • the film layer 2 can be a non-metallic film, such as polyimide material, SiO 2 , SiN, etc.
  • the film layer 2 can also be a metal thin film, such as a crystalline thin film containing Cr, Al, Ti, or Cu as an example.
  • an amorphous metal film such as metallic glass.
  • Amorphous metal thin films can be formed by extreme cooling, physical vapor deposition, electroplating, pulsed laser deposition, solid-state reaction, ion radiation or mechanical alloying. These forming methods belong to the common knowledge of those skilled in the art and will not be described here. Specific instructions.
  • metallic glass Since metallic glass has irregular atomic arrangement and no specific slip surface, it has higher strength than crystalline metal and has excellent fatigue properties and elastic deformation to resist deformation.
  • the modulus of elasticity of metallic glass is about one-third that of crystalline metal, but its tensile strength is three times that of it.
  • the strength of Mg alloy is 300MPa
  • the strength of Mg-based metallic glass is 800MPa
  • the strength of FeCoBSiNb metallic glass is 4400MPa
  • the strength of SUS304 stainless steel is 1400MPa.
  • the use of metallic glass as the membrane layer of the micro filter can increase the open porosity of the membrane layer on the basis of ensuring the strength of the membrane layer, and can make the thickness of the membrane layer thinner, making the permeation treatment easier and more effective.
  • a smaller through hole is formed to avoid the acoustic resistance caused by the larger hole depth after the traditional thick film is opened.
  • the inner diameter of the through hole 4 on the film layer 2 may be 1 nm to 100 ⁇ m.
  • the inner diameter of the through hole 4 on the film layer 2 may be 5 nm to 10 ⁇ m.
  • the thickness of the film layer 2 is 5 nm to 5 ⁇ m.
  • the thickness of the film layer 2 is 20 nm to 1000 nm.
  • metallic glass is an amorphous material, it is isotropic and uniform. In addition, there are substantially no defects caused by polycrystalline structures such as grain boundaries and segregation, and the size effect is small. Therefore, when designing the micro filter, it is not necessary to consider the changes in physical properties due to anisotropy and size, which is beneficial to the design of the structure of the micro filter. In addition, since metallic glass is an alloy composed of multiple elements, the range of material selection in the design of microfilters is widened, and higher performance PB chips can be designed and manufactured.
  • the metallic glass may contain multiple transition metal elements, and may optionally contain one or more non-metal elements.
  • the metallic glass containing transition metal elements can have Sc, Y, La, Al, Ti, Zr, Hf, V, Nb, Ta, Cr, Mo, W, Mn, Tc, Re, Fe, Ru, Os, Co, Rh At least one of, Ir, Ni, Pd, Pt, Cu, Ag, Au, Zn, Cd and Hg.
  • any suitable transition metal element or their combination can be used.
  • Any suitable non-metallic elements or their combination can be used.
  • non-metal elements can be F, Cl, Br, I, At, O, S, Se, Te, Po, N, P, As, Sb, Bi, C, Si, Ge, Sn, Pb and B. any type.
  • the glass transition temperature Tg of the metallic glass is 150°C or higher.
  • the glass transition temperature Tg of the metallic glass is 250° C. or higher.
  • the membrane layer 2 can be provided with one layer, or two, three or more layers.
  • the film layer includes a first film 2a and a second film 2b that are compounded together.
  • the first diaphragm 2a has tensile stress
  • the second diaphragm 2b has compressive stress.
  • the first diaphragm 2a and the second diaphragm 2b can be made of the same material or different materials.
  • the first diaphragm 2a and the second diaphragm 2b can be selected from a crystalline metal film, an amorphous metal film or a non-metal film.
  • at least one film in the film layer 2 is made of an amorphous metal film.
  • the membrane can show various internal stresses, from stretching to compression, depending on the film deposition conditions and deposition thickness.
  • the internal stress of the diaphragm can greatly change the properties of the diaphragm, such as mechanical properties. Therefore, the tensile stress membrane and the compressive stress membrane are combined together to eliminate the internal stress of the membrane and adjust it to the desired stress range.
  • the stress of the film layer 2 is controlled between -300 MPa (compressive stress) and 300 MPa (tensile stress).
  • the stress of the film layer 2 is controlled between 0 and 300 MPa (tensile stress). Controlling the film layer 2 at a lower tensile stress allows the film layer 2 to be in a tensioned state and maintain its own shape, which is beneficial to the flatness of the film 2 on the substrate 1 for optical automatic monitoring.
  • the second diaphragm 2b is disposed adjacent to the substrate 1 relative to the first diaphragm 2a.
  • the second diaphragm 2b with compressive stress is arranged on the side adjacent to the substrate 1, and the compressive stress of the second diaphragm 2b is offset by the first diaphragm 2a with tensile stress.
  • the first diaphragm 2a is disposed adjacent to the substrate 1 relative to the second diaphragm 2b.
  • the first diaphragm 2a with tensile stress is arranged on the side adjacent to the substrate 1, and the second diaphragm 2b with compressive stress offsets the tensile stress of the first diaphragm 2a; and because the first diaphragm 2a itself has tensile stress Therefore, problems such as separation of the first diaphragm 2a from the substrate 1 can be further avoided.
  • Fig. 6 shows a schematic structural diagram of another embodiment of the microfilter of the present invention.
  • the film layer on the substrate 10 includes a three-layer film, and the three-layer film is suspended on the hollow back cavity 30 of the substrate 10.
  • the three-layer diaphragm includes a first diaphragm 20a with tensile stress and two second diaphragms 20b with compressive stress.
  • the first diaphragm 20a is located between the two second diaphragms 20b, and the three diaphragms are combined together.
  • the second diaphragm with compressive stress on both sides offsets the tensile stress of the first diaphragm in the middle; conversely, the first diaphragm with tensile stress in the middle also offsets the compressive stress of the second diaphragms on both sides , I will not elaborate here.
  • the three-layer diaphragm structure of the film layer may also include two first diaphragms 20a with tensile stress and one second diaphragm 20b with compressive stress.
  • the second diaphragm 20b is located between the two layers of first diaphragm 20a.
  • the first film and the second film in the film layer may be provided with multiple layers, such as four, five or more layers.
  • the first diaphragm and the second diaphragm are arranged to be spaced apart from each other.
  • the substrate is made of a photosensitive polymer material, and the shape of the substrate is formed through exposure and polymerization processes.
  • the substrate may be epoxy resin or polyimide resin.
  • epoxy resin and polyimide resin are selected as dry film or liquid type.
  • the substrate is made of photosensitive polymer, for example, epoxy-based negative photoresist or photosensitive polyimide can be used, which makes the manufacturing process easy.
  • SU-8 is a commonly used epoxy-based negative photoresist. Negative refers to the photoresist in which the part exposed to UV becomes cross-linked, while the remaining part remains soluble and can be washed off during development.
  • Polyimide is a polymer of imide monomers. Polyimide has high heat resistance and has many applications in processes requiring strong and durable organic materials. Polyimide can be used like photoresist, for example, "positive” and “negative” types of photoresist polyimide.
  • the micro filter can be manufactured on the wafer at the same time. For example, when manufacturing a micro filter, you can first form a film layer on the substrate by deposition, etching and other processes, and then bond the photopolymer as the base by laminating, and then form the film by exposure and polymerization. The base of the back cavity finally separates the film from the substrate.
  • the metal film or polyimide film is carried on the base of the photosensitive material, and the film is supported by the base.
  • the micro filter can be made small.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)

Abstract

Un microfiltre et un dispositif acoustique, comprenant un substrat qui est pourvu d'une cavité arrière, et un film métallique disposé sur le substrat et suspendu sur la cavité arrière ; la surface externe du film métallique est revêtue d'une couche antiadhésive ; le degré d'adhésivité entre la couche antiadhésive et les particules est inférieur au degré d'adhésivité entre le film métallique et les particules ; le film métallique et la couche antiadhésive sont pourvus de trous traversants répartis sont divulgués. Selon un mode de réalisation de la présente invention, au moyen de la fourniture d'une couche antiadhésive sur le film métallique, le problème selon lequel des particules utilisées pendant une longue période de temps adhèrent au le film métallique pourvu de trous traversants peut être évité, ce qui permet d'assurer la sensibilité d'un capteur.
PCT/CN2019/094777 2019-06-28 2019-07-05 Microfiltre et dispositif acoustique WO2020258364A1 (fr)

Applications Claiming Priority (2)

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CN201910577035.4A CN110351618A (zh) 2019-06-28 2019-06-28 一种微型过滤器及声学设备
CN201910577035.4 2019-06-28

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WO2020258364A1 true WO2020258364A1 (fr) 2020-12-30

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CN110809207B (zh) * 2019-10-31 2020-12-08 潍坊歌尔微电子有限公司 微型过滤器及mems传感器组件
CN110972046A (zh) * 2019-12-31 2020-04-07 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111050258A (zh) * 2019-12-31 2020-04-21 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN110944275A (zh) * 2019-12-31 2020-03-31 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN111131984A (zh) * 2019-12-31 2020-05-08 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备
CN110958550A (zh) * 2019-12-31 2020-04-03 歌尔股份有限公司 防尘结构、麦克风封装结构以及电子设备

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US20060018487A1 (en) * 1999-10-28 2006-01-26 Clive Smith Transducer for sensing body sounds
CN109379684A (zh) * 2018-10-09 2019-02-22 歌尔股份有限公司 麦克风和电子设备

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CN109379684A (zh) * 2018-10-09 2019-02-22 歌尔股份有限公司 麦克风和电子设备

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