WO2021081799A1 - Procédé de fabrication d'un matériau de dissipation de chaleur composite solide-liquide en nid d'abeilles pour dissipation de chaleur d'unité centrale - Google Patents

Procédé de fabrication d'un matériau de dissipation de chaleur composite solide-liquide en nid d'abeilles pour dissipation de chaleur d'unité centrale Download PDF

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Publication number
WO2021081799A1
WO2021081799A1 PCT/CN2019/114312 CN2019114312W WO2021081799A1 WO 2021081799 A1 WO2021081799 A1 WO 2021081799A1 CN 2019114312 W CN2019114312 W CN 2019114312W WO 2021081799 A1 WO2021081799 A1 WO 2021081799A1
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WO
WIPO (PCT)
Prior art keywords
heat dissipation
parts
pressure
heat
dissipation material
Prior art date
Application number
PCT/CN2019/114312
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English (en)
Chinese (zh)
Inventor
张敬敏
Original Assignee
追信数字科技有限公司
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Filing date
Publication date
Application filed by 追信数字科技有限公司 filed Critical 追信数字科技有限公司
Publication of WO2021081799A1 publication Critical patent/WO2021081799A1/fr
Priority to ZA2021/06093A priority Critical patent/ZA202106093B/en
Priority to ZA2021/06094A priority patent/ZA202106094B/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/22—Vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F210/00—Copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond
    • C08F210/02—Ethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18—Monomers containing fluorine
    • C08F214/20—Vinyl fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F218/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid or of a haloformic acid
    • C08F218/02—Esters of monocarboxylic acids
    • C08F218/04—Vinyl esters
    • C08F218/08—Vinyl acetate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/12—Esters of monohydric alcohols or phenols
    • C08F220/14—Methyl esters, e.g. methyl (meth)acrylate

Definitions

  • the invention relates to the technical field of heat dissipation materials for electrical devices, in particular to a method for manufacturing a honeycomb solid-liquid composite heat dissipation material for CPU heat dissipation.
  • the CPU radiator in the prior art can be divided into three types: air cooling, heat pipe, and water cooling according to its heat dissipation mode.
  • the air-cooled radiator is the most common type of radiator. It includes a cooling fan and a heat sink generally made of aluminum. The principle is to transfer the heat generated by the CPU to the heat sink, and then take the heat away through the fan. .
  • the heat pipe radiator is a heat transfer element with extremely high thermal conductivity. It transfers heat through the evaporation and condensation of the liquid in the fully enclosed vacuum tube. Most of these fans are "air-cooled + heat pipe", with both air-cooling and heat pipe advantages, with extremely high heat dissipation.
  • the water-cooled radiator uses liquid to forcefully circulate under the drive of the pump to take away the heat of the radiator. Compared with air-cooling, it has the advantages of quietness, stable cooling, and less dependence on the environment.
  • any type of radiator on the market uses only one or two heat transfer methods, namely contact heat transfer and heat convection mechanisms. At the same time, it has a more complex structure and higher material cost, which restricts high performance.
  • the bottom end of all radiators is applied with silicone grease to complete the complete contact between the heat dissipation material and the CPU, but the silicone grease itself has a general heat transfer performance, and it will become dry and aging as the working time at high temperatures is prolonged. , Affect the overall heat dissipation performance.
  • the invention aims to provide a method for manufacturing a honeycomb solid-liquid composite heat dissipation material for CPU heat dissipation that does not require adhesives, has large specific surface area, fast heat dissipation, coexistence of multiple heat dissipation methods, weather resistance, oxidation resistance, and dry crack resistance.
  • the present invention adopts the following technical solution: a method for manufacturing a honeycomb solid-liquid composite heat dissipation material for CPU heat dissipation, including the following steps:
  • 2Tooling preparation prepare the bottom to be uniformly densely arranged with a hole diameter of 0.3mm-0.5mm according to a grid gap of 1mm-1.5mm, the ejection angle is 60° to the bottom surface, and the ejection angle is distributed clockwise along the tangential direction of the circumference of the air hole.
  • Cylindrical glass heating vessel with vent
  • step 2 Put the mixture A obtained in step 1 into a stainless steel autoclave, evacuated and filled with nitrogen, increase the pressure to 3.5MPa-3.8MPa, heat to 55°C-60°C, and stir at 120rpm/min-150rpm/min Stir continuously at a rate to obtain the pool to be reacted;
  • step 2 Put the reaction medium obtained in step 1 into a stainless steel autoclave, vacuumize and fill with nitrogen, increase the pressure to 3.5MPa-3.8MPa, heat to 55°C-60°C, and stir at 120rpm/min-150rpm/min Stir continuously at a rate to obtain a ready-to-use solution;
  • step 2 Mechanically cut the component A obtained in step 2) in step 3 into particles with a particle size of 1mm-2mm to obtain particles A;
  • step 4 Machining the rough heat-dissipating material block obtained in step 3 into a shape with the bottom part compatible with the upper surface of the CPU and the top part compatible with the cooling fan to obtain a prefabricated composite heat-dissipating material;
  • step 5 The prefabricated composite heat dissipation material obtained in step 4 is heated to 120°C-130°C, and then sufficient ethanol is used to rinse the surface of the heated heat dissipation material, and the attached ethanol is evaporated to obtain the required composite heat dissipation material.
  • a honeycomb solid-liquid composite heat dissipation material for CPU heat dissipation consist of two parts: the base part is 55 parts by weight of P(VDF-TrFE) copolymer with honeycomb multi-channel through holes inside- 80 parts, the filler part is a blend of three components, including 15-20 parts of polymethyl methacrylate, 25-35 parts of ethylene-vinyl acetate, and 15-25 parts of graphite powder, cured inside the base part .
  • the present invention has the following advantages: (1) The present invention adopts a material structure completely different from the prior art, and uses a high temperature resistant polymer P (VDF-TrFE) copolymer with certain piezoelectric properties as the matrix, which is filled with part Graphite powder to improve the overall heat transfer performance, part of polymethyl methacrylate with a softening point of about 80°C, and a larger amount of ethylene-vinyl acetate (EVA) with a melting point of about 60°C.
  • VDF-TrFE high temperature resistant polymer P
  • EVA ethylene-vinyl acetate
  • the present invention uses conventional contact transfer In addition to heat and thermal convection, there are heat absorption during solid liquefaction, convective heat transfer after solid liquefaction, and part of the thermal transfer function brought by the piezoelectric material [P(VDF-TrFE) has better piezoelectric properties] (therefore this
  • the invention can also add wires on both sides of the heat sink to be combined with the chassis design for power supply of decorative light-emitting diodes). Of course, the invention only talks about contact heat transfer performance, which is significantly lower than that of aluminum heat sinks.
  • the present invention has transparent organic polymers. Therefore, the present invention is light-transmissive and can disperse part of the heat through thermal radiation.
  • the present invention eliminates the internal stress obtained during rapid cooling of the present invention and makes the structure of the present invention more stable.
  • the opening in the substrate P is removed by liquefying part of the filler.
  • Low melting point substances polymethyl methacrylate, EVA
  • graphite powder which are easy to fall off on the outside, and finally, in this way, the rough structure of the complex airway surface is obtained, which greatly increases the cost.
  • Invented specific surface area (4)
  • the present invention is a complex swirling path formed by the gas ejected at an oblique angle of 60° and naturally escapes upward in the viscous liquid.
  • the present invention can obtain non-flammable P(VDF-TrFE) fluid with extremely high viscosity after being liquefied by using an open flame to melt the bottom (you only need to heat it slightly), and then it can be self-adhesive on the surface of the CPU without setting in the middle. Additional glue, therefore, higher heat transfer efficiency, longer service life, and better reliability. Therefore, the present invention has the characteristics of no adhesive, large specific surface area, fast heat dissipation, coexistence of multiple heat dissipation methods, weather resistance, oxidation resistance, and anti-dry cracking.
  • 1Pre-preparation prepare 480g of vinylidene fluoride, 320g of trifluoroethylene, 270g of methyl methacrylate, 160g of vinyl acetate, 280g of ethylene, 2g of azobisisobutyronitrile initiator, 220g of graphite powder, and 1.4g of Guer gum; Prepare a cylinder with vent holes arranged at the bottom according to a grid gap of 1mm-1.5mm evenly and closely arranged with a diameter of 0.3mm-0.5mm, the ejection angle is 60° to the bottom surface, and the ejection angle is distributed clockwise along the tangential direction of the circumference of the vent hole. Shaped glass heating vessel;
  • component A 6Mechanically cut component A into particles with a particle size of 1mm-2mm to obtain particle A; put component B into a cylindrical glass heating vessel and heat it to completely melt to obtain molten pool B; put particle A into molten pool B After mixing thoroughly, stop heating and open the air jet hole at the bottom of the cylindrical glass heating vessel, and continue to spray nitrogen gas at a pressure of 3MPa-4MPa until the molten pool is completely cooled to obtain a block of crude heat-dissipating material;
  • This embodiment has multiple heat dissipation mechanisms, low cost, low noise, and has two solid-liquid conversion temperature control lines of 50°C-60°C and 80°C-90°C, and has good reliability, the same below.
  • Example 2 The whole is the same as Example 1, the difference is: 1Pre-preparation: prepare vinylidene fluoride 500g, trifluoroethylene 300g, methyl methacrylate 250g, vinyl acetate 150g, ethylene 250g, azobisisobutyronitrile initiator 1.5g, 200g graphite powder, 1g Gul gum; prepare the bottom to be uniformly densely arranged with a grid gap of 1mm-1.5mm with a diameter of 0.3mm-0.5mm, the spray angle is 60° to the bottom surface, and the spray angle is along the circumference of the pore Cylindrical glass heating vessel with vent holes distributed clockwise in the tangential direction; 20.5g of azobisisobutyronitrile initiator is mixed with all methyl methacrylate, vinyl acetate and graphite powder and stirred evenly to obtain mixture A , Put the mixture A into a stainless steel autoclave, vacuumize and fill with nitrogen, increase the pressure to 3.5MPa, heat to 55°C-60°C, and continue stirring
  • Example 3 The whole is the same as Example 1, the difference is: 1Pre-preparation: prepare 400g vinylidene fluoride, 400g trifluoroethylene, 300g methyl methacrylate, 180g vinyl acetate, 300g ethylene, and azobisiso Nitrile initiator 2.5g, graphite powder 250g, Guer gum 2g; prepare the bottom to be uniformly densely arranged with a grid gap of 1mm-1.5mm with a diameter of 0.3mm-0.5mm, the spray angle is 60° to the bottom surface, and the spray angle Cylindrical glass heating vessel with vent holes distributed clockwise along the tangential direction of the circumference of the vent hole; 2 Mix 0.7g of azobisisobutyronitrile initiator with all methyl methacrylate, vinyl acetate, and graphite powder and stir evenly , To obtain the mixture A, and then put the mixture A into the stainless steel autoclave, evacuated and filled with nitrogen, increase the pressure to 3.8 MPa, heat to 55 °C-60 °C,
  • the invention has the characteristics of no adhesive, large specific surface area, fast heat dissipation, coexistence of multiple heat dissipation modes, weather resistance, oxidation resistance and dry crack resistance.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Moulding By Coating Moulds (AREA)

Abstract

L'invention concerne un matériau de dissipation de chaleur composite solide-liquide en nid d'abeilles pour dissipation de chaleur d'unité centrale et son procédé de fabrication. Le matériau de dissipation de chaleur est constitué de deux parties : une partie matrice qui est composée de 55 à 80 parties en poids d'un copolymère de P(VDF-TrFE) dont l'intérieur présente une pluralité de trous traversants en nid d'abeilles ; et une partie de charge qui est durcie à l'intérieur de la partie matrice et est un mélange de trois composants, comprenant 15 à 20 parties de polyméthacrylate de méthyle, 25 à 35 parties d'éthylène-acétate de vinyle et 15 à 25 parties de poudre de graphite. La présente invention ne nécessite pas d'adhésifs, et présente une grande surface spécifique, une dissipation de chaleur rapide, des procédés de dissipation de chaleur multiples simultanés, une résistance aux intempéries, une résistance à l'oxydation et une résistance à la fissuration à sec.
PCT/CN2019/114312 2019-10-29 2019-10-30 Procédé de fabrication d'un matériau de dissipation de chaleur composite solide-liquide en nid d'abeilles pour dissipation de chaleur d'unité centrale WO2021081799A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ZA2021/06093A ZA202106093B (en) 2019-10-29 2021-08-24 Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation
ZA2021/06094A ZA202106094B (en) 2019-10-29 2021-08-24 Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911040560.9A CN110684142A (zh) 2019-10-29 2019-10-29 一种用于cpu散热的蜂窝状固液复合散热材料的制造方法
CN201911040560.9 2019-10-29

Publications (1)

Publication Number Publication Date
WO2021081799A1 true WO2021081799A1 (fr) 2021-05-06

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CN (1) CN110684142A (fr)
WO (1) WO2021081799A1 (fr)
ZA (2) ZA202106094B (fr)

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WO2014204245A2 (fr) * 2013-06-19 2014-12-24 주식회사 아모그린텍 Feuille isolante hybride et équipement électronique doté de cette dernière
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CN107760278A (zh) * 2016-08-22 2018-03-06 杜邦公司 用作热界面材料的组合物

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Publication number Priority date Publication date Assignee Title
CN102181168A (zh) * 2011-03-08 2011-09-14 东莞华科电子有限公司 聚合物基复合材料及其制造方法
CN103113668A (zh) * 2013-01-07 2013-05-22 安邦电气集团有限公司 一种高分子基导电复合材料及釆用该复合材料制备自限温伴热电缆的方法
WO2014204245A2 (fr) * 2013-06-19 2014-12-24 주식회사 아모그린텍 Feuille isolante hybride et équipement électronique doté de cette dernière
CN105367961A (zh) * 2015-12-04 2016-03-02 太仓苏晟电气技术科技有限公司 一种剥皮机底座
CN105755307A (zh) * 2016-03-21 2016-07-13 中南大学 一种蜂窝状结构增强复合材料及制备方法
CN107760278A (zh) * 2016-08-22 2018-03-06 杜邦公司 用作热界面材料的组合物

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Publication number Publication date
CN110684142A (zh) 2020-01-14
ZA202106094B (en) 2021-10-27
ZA202106093B (en) 2021-10-27

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