ZA202106093B - Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation - Google Patents

Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation

Info

Publication number
ZA202106093B
ZA202106093B ZA2021/06093A ZA202106093A ZA202106093B ZA 202106093 B ZA202106093 B ZA 202106093B ZA 2021/06093 A ZA2021/06093 A ZA 2021/06093A ZA 202106093 A ZA202106093 A ZA 202106093A ZA 202106093 B ZA202106093 B ZA 202106093B
Authority
ZA
South Africa
Prior art keywords
heat dissipation
manufacturing
liquid composite
cpu
honeycomb solid
Prior art date
Application number
ZA2021/06093A
Inventor
jing min Zhang
Original Assignee
Chuxin Digital Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chuxin Digital Tech Co Ltd filed Critical Chuxin Digital Tech Co Ltd
Publication of ZA202106093B publication Critical patent/ZA202106093B/en

Links

ZA2021/06093A 2019-10-29 2021-08-24 Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation ZA202106093B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201911040560.9A CN110684142A (en) 2019-10-29 2019-10-29 Manufacturing method of honeycomb solid-liquid composite heat dissipation material for CPU heat dissipation
PCT/CN2019/114312 WO2021081799A1 (en) 2019-10-29 2019-10-30 Method of manufacturing honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation

Publications (1)

Publication Number Publication Date
ZA202106093B true ZA202106093B (en) 2021-10-27

Family

ID=69114696

Family Applications (2)

Application Number Title Priority Date Filing Date
ZA2021/06094A ZA202106094B (en) 2019-10-29 2021-08-24 Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation
ZA2021/06093A ZA202106093B (en) 2019-10-29 2021-08-24 Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation

Family Applications Before (1)

Application Number Title Priority Date Filing Date
ZA2021/06094A ZA202106094B (en) 2019-10-29 2021-08-24 Manufacturing method of copper-tourmaline composite heat dissipation material for cpu heat dissipation

Country Status (3)

Country Link
CN (1) CN110684142A (en)
WO (1) WO2021081799A1 (en)
ZA (2) ZA202106094B (en)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2624123B1 (en) * 1987-12-08 1990-04-06 Atochem PIEZOELECTRIC COPOLYMERS OF VINYLIDENE FLUORIDE AND TRIFLUOROETHYLENE
DE102004026608A1 (en) * 2004-06-01 2005-12-22 Wacker Polymer Systems Gmbh & Co. Kg Non-blocking solid resins of vinyl ester copolymers
US20100316821A1 (en) * 2009-06-12 2010-12-16 Sunny General International Co., Ltd. Multi-layer films, sheets, and hollow articles with thermal management function for uses as casings of secondary batteries and supercapacitors, and sleeves of secondary battery and supercapacitor packs
CN101735374B (en) * 2009-12-15 2011-11-09 上海三爱富新材料股份有限公司 Preparation method of vinylidene fluoride copolymer resin
CN102181168B (en) * 2011-03-08 2014-01-22 东莞华科电子有限公司 Polymer matrix composite material and production method of polymer matrix composite material
CN103113668A (en) * 2013-01-07 2013-05-22 安邦电气集团有限公司 Polymer matrix conductive composite material and method for preparing temperature self-limiting heat tracing cable from same
WO2014204245A2 (en) * 2013-06-19 2014-12-24 주식회사 아모그린텍 Hybrid insulation sheet and electronic equipment comprising same
CN104789194B (en) * 2014-01-20 2018-11-13 广州贝特缪斯能源科技有限公司 A kind of energy-storage composite material and its manufacturing method
CN105367961A (en) * 2015-12-04 2016-03-02 太仓苏晟电气技术科技有限公司 Peeling machine base
CN105755307B (en) * 2016-03-21 2017-12-26 中南大学 A kind of alveolate texture enhancing composite and preparation method
CN107760278A (en) * 2016-08-22 2018-03-06 杜邦公司 Composition as thermal interfacial material
CN107585321B (en) * 2017-08-02 2020-06-30 东南大学 Bias plate
CN108251072B (en) * 2018-03-05 2020-08-25 北京科技大学 Preparation method of liquid metal composite phase-change material
CN108461463A (en) * 2018-04-02 2018-08-28 丹阳中谷新材料技术有限公司 A kind of graphene composite film applied to cpu chip

Also Published As

Publication number Publication date
CN110684142A (en) 2020-01-14
ZA202106094B (en) 2021-10-27
WO2021081799A1 (en) 2021-05-06

Similar Documents

Publication Publication Date Title
SG10201602892UA (en) Reusable thermoplastic thermal interface materials and methods for establishing thermal joints between heat sources and heat dissipating/removal structures
EP3360848A4 (en) Negative thermal expansion material and composite material including same
EP3352198A4 (en) SiC COMPOSITE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
ZA201705902B (en) Method for continuous preparation of high bulk density methionine crystal
EP3485215A4 (en) System and method for maintaining efficiency of a heat sink
IL254192A0 (en) Diazadienyl compound, raw material for forming thin film, method for producing thin film, and diazadiene compound
EP3312225A4 (en) Nano-carbon composite material and method for producing same
EP3662992A4 (en) Method for mixing heat dissipation material components
EP3121299A4 (en) Aluminum alloy fin material for heat exchanger, method for manufacturing same, and heat exchanger
PL3359326T3 (en) Aluminium compounds material for use in thermal fluxless joining method and method for producing the same
EP2994279A4 (en) Method and apparatus for the manufacturing of composite material
EP3275852A4 (en) Ceramic honeycomb structure and method for producing same
EP3553041A4 (en) Preparation method for ceramic composite material, ceramic composite material, and wavelength converter
FR3047988B1 (en) METHOD FOR MANUFACTURING A PIECE OF CERAMIC MATRIX COMPOSITE MATERIAL
EP2735391A4 (en) Composite material for heat dissipating substrate, and method for manufacturing composite material for heat dissipating substrate
HK1252910A1 (en) Casting compound and process for the production of gelatin products
EP3315573A4 (en) Heat dissipation material adhering composition, heat dissipation material having adhesive, inlay substrate, and method for manufacturing same
SG10202110320VA (en) Apparatus for the thermal curing of a lens-forming material
IL263665B (en) Vanadium compound, raw material for forming thin film, and method for manufacturing thin film
EP3741726A4 (en) Negative thermal expansion material and method for manufacturing same
ZA202106093B (en) Manufacturing method of honeycomb solid-liquid composite heat dissipation material for cpu heat dissipation
EP3466908A4 (en) Ceramic matrix composite material component and method for producing same
EP3351648A4 (en) Aluminum alloy fin material for heat exchanger, method for manufacturing same, heat exchanger using said aluminum alloy fin material and method for manufacturing same
IL265374A (en) Composite material with increase thermal conductivity and method for manufacture thereof
FR2986177B1 (en) METHOD FOR DRAPING THE FORM OF COMPOSITE MATERIALS AND MATERIAL ADAPTED THEREFOR