WO2021081776A1 - 超声波指纹模组及其制作方法和电子设备 - Google Patents

超声波指纹模组及其制作方法和电子设备 Download PDF

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Publication number
WO2021081776A1
WO2021081776A1 PCT/CN2019/114125 CN2019114125W WO2021081776A1 WO 2021081776 A1 WO2021081776 A1 WO 2021081776A1 CN 2019114125 W CN2019114125 W CN 2019114125W WO 2021081776 A1 WO2021081776 A1 WO 2021081776A1
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Prior art keywords
reflective layer
ultrasonic
layer
fingerprint module
ultrasonic fingerprint
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PCT/CN2019/114125
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English (en)
French (fr)
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刘宣宣
朱晃亿
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南昌欧菲生物识别技术有限公司
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Priority to PCT/CN2019/114125 priority Critical patent/WO2021081776A1/zh
Publication of WO2021081776A1 publication Critical patent/WO2021081776A1/zh

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F18/00Pattern recognition

Definitions

  • the invention relates to the technical field of fingerprint identification, in particular to an ultrasonic fingerprint module, a manufacturing method thereof, and electronic equipment.
  • the ultrasonic fingerprint module recognizes the user's fingerprint by comparing the ultrasonic signal reflected from the user's fingerprint valley area and the ultrasonic signal reflected from the user's fingerprint ridge area.
  • the ultrasonic fingerprint module easily transmits ultrasonic signals, the strength of the ultrasonic signal acquired by the ultrasonic fingerprint module is reduced, and the difference between the ultrasonic signal in the valley area and the ultrasonic signal in the ridge area, which is difficult to distinguish, reduces the efficiency of fingerprint recognition. .
  • the purpose of this application is to provide an ultrasonic fingerprint module that improves the efficiency of fingerprint recognition, a manufacturing method thereof, and electronic equipment.
  • the ultrasonic fingerprint module includes an ultrasonic detection layer and a reflection layer
  • the ultrasonic detection layer has an ultrasonic receiving surface
  • the reflection layer is disposed on the ultrasonic detection layer away from the ultrasonic detection layer.
  • the reflective layer is used to reflect the ultrasonic waves emitted from the ultrasonic detection layer
  • the reflective layer contains a defoaming agent
  • the defoaming agent is used to eliminate the reflection layer in the manufacturing process
  • the bubbles in the reflective layer are eliminated, and the bubbles in the reflective layer are eliminated by the defoaming agent, so that the surface roughness of the reflective layer is effectively reduced, and the reflective layer's resistance to ultrasonic signals is guaranteed.
  • the uniform reflection improves the fingerprint recognition efficiency of the ultrasonic fingerprint module.
  • the defoaming agent is a combination of modified dimethylsilane and polyoxypropylene oxide ethylene glyceryl ether, so that there are no bubbles in the reflective layer, and the fingerprint recognition efficiency of the ultrasonic fingerprint module is increased.
  • the mass ratio of the modified dimethylsilane in the reflective layer is 0.8% to 2.0%.
  • the mass ratio of the modified dimethylsilane in the reflective layer is 1.5%, so that there are no bubbles in the reflective layer, and the fingerprint recognition performance of the ultrasonic fingerprint module is improved.
  • the weight ratio of the polyoxypropylene oxide ethylene glycerol ether in the reflective layer is 0.2% to 1.0%, which ensures that there are no bubbles in the reflective layer and reduces the production cost of the ultrasonic fingerprint module.
  • the mass ratio of the polyoxypropylene oxide ethylene glycerol ether in the reflective layer is 0.5%, so that there are no bubbles in the reflective layer and improve the fingerprint recognition performance of the ultrasonic fingerprint module.
  • the reflective layer contains carbon powder and a resin material, and the carbon powder is mixed into the gaps between molecules in the resin material, so that the surface roughness of the reflective layer is reduced.
  • the average particle size of the carbon powder particles is 0.8 ⁇ m to 2 ⁇ m, and further is 1.0 ⁇ m, so that the roughness of the reflective layer can be further reduced to a range of 0.41 Rz/ ⁇ m to 0.82 Rz/ ⁇ m.
  • the ultrasonic detection layer includes a substrate layer, a pixel electrode layer, a piezoelectric layer, and a conductive electrode stacked in sequence, and the reflective layer is provided on a side of the conductive electrode away from the piezoelectric layer, so that the ultrasonic wave
  • the fingerprint module is slim, which is convenient for the ultrasonic fingerprint module to be applied to the display screen of an electronic device.
  • the ultrasonic detection layer includes two or more layers of the conductive electrodes, which facilitates the formation of the ultrasonic detection layer and increases the signal conduction performance of the ultrasonic detection layer.
  • the conductive electrode has a thickness of 10 to 30 microns
  • the piezoelectric layer has a thickness of 5 to 15 microns
  • the substrate layer has a thickness of 80 to 100 microns, which reduces the ultrasonic fingerprint pattern.
  • the production cost guarantees the surface roughness of the reflective layer.
  • the thickness of the reflective layer is 5 to 30 microns, so that the surface roughness of the reflective layer is effectively reduced, and the clarity of the fingerprint image acquired by the ultrasonic fingerprint module is effectively improved.
  • the thickness of the reflective layer is 20 to 30 microns, so that the surface roughness of the reflective layer is further reduced, and the clarity of the fingerprint image acquired by the ultrasonic fingerprint module is further improved.
  • the thickness of the reflective layer is 25 microns, so that the surface roughness of the reflective layer is further reduced, and the SNR value and LPMM value of the ultrasonic fingerprint module are more excellent.
  • This application also provides a method for manufacturing an ultrasonic fingerprint module, wherein:
  • the manufacturing method of the ultrasonic fingerprint module includes the steps:
  • the ultrasonic detection layer having an ultrasonic receiving surface and a bottom surface of the detection layer disposed opposite to the ultrasonic receiving surface;
  • a reflective layer is formed.
  • the reflective layer covers the ultrasonic receiving surface of the ultrasonic detection layer.
  • the bubbles of the reflective layer effectively reduce the surface roughness of the reflective layer, ensure the uniform reflection of the ultrasonic signal by the reflective layer, and improve the fingerprint recognition efficiency of the ultrasonic fingerprint module.
  • the liquid molding material further contains carbon powder particles, a resin material, and a leveling agent.
  • the resin material, carbon powder particles, leveling agent, and defoaming agent are mixed and stirred to form the liquid molding material, so that the reflection There are no bubbles in the layer, and the surface roughness of the reflective layer is effectively reduced, and the reflection efficiency of the reflective layer to ultrasonic signals is improved.
  • the present application also provides an electronic device, wherein the electronic device includes the above-mentioned ultrasonic fingerprint module, so that the electronic device can meet diversified fingerprint identification requirements and improve fingerprint identification efficiency.
  • FIG. 1 is a schematic diagram of an ultrasonic fingerprint module provided by an embodiment of the present application
  • FIG. 2 is another schematic diagram of an ultrasonic fingerprint module provided by an embodiment of the present application.
  • FIG. 3 is another schematic diagram of an ultrasonic fingerprint module provided by an embodiment of the present application.
  • FIG. 4 is a schematic flowchart of a method for manufacturing an ultrasonic fingerprint module provided by an embodiment of the present application
  • FIG. 5 is a schematic diagram of a display screen assembly provided by an embodiment of the present application.
  • FIG. 6 is another schematic diagram of a display screen assembly provided by an embodiment of the present application.
  • FIG. 7 is a schematic diagram of a display screen assembly provided by another embodiment of the present application.
  • FIG. 8 is another schematic diagram of a display screen assembly provided by another embodiment of the present application.
  • FIG. 9 is a schematic diagram of a display screen assembly provided by another embodiment of the present application.
  • FIG. 10 is a schematic diagram of a display screen assembly provided by another embodiment of the present application.
  • FIG. 11 is a schematic cross-sectional view of an electronic device provided by an embodiment of the present application.
  • the present invention provides an ultrasonic fingerprint module 100.
  • the ultrasonic fingerprint module 100 includes an ultrasonic detection layer 10 and a reflective layer 20.
  • the ultrasonic detection layer 10 has an ultrasonic receiving surface 11, and the reflective layer 20 is formed on the side of the ultrasonic detection layer 10 away from the ultrasonic receiving surface 11, and the reflective layer 20 can block ultrasonic waves from exiting from the side away from the ultrasonic detection layer 10, and can be conducted from the ultrasonic detection layer 10 The incoming ultrasonic signal is reflected to the ultrasonic detection layer 10.
  • the ultrasonic fingerprint module 100 can use ultrasonic signals to detect user fingerprints, thereby identifying user fingerprint images.
  • the ultrasonic fingerprint module 100 can be applied to electronic devices, which can be devices such as mobile phones, tablets, notebook computers, media players, etc., or financial terminal devices such as automated teller machines (ATM).
  • ATM automated teller machines
  • the reflective layer 20 can resist and reflect the ultrasonic signal, so that the ultrasonic signal received by the ultrasonic detection layer 10 can be strengthened, and the ultrasonic detection layer 10 is more sensitive to ultrasonic waves.
  • the signal receiving efficiency improves the efficiency of fingerprint recognition.
  • the ultrasonic detection layer 10 can send an ultrasonic signal, and can sense an ultrasonic signal, so as to recognize a user's fingerprint.
  • the ultrasonic detection layer 10 can emit a first ultrasonic signal 01 toward the side away from the reflection layer 20 and a second ultrasonic signal 02 toward the reflection layer 20.
  • the ultrasonic fingerprint module 100 When the ultrasonic fingerprint module 100 is applied to an electronic device, when a user's finger is close to the side of the ultrasonic fingerprint module 100 away from the reflective layer 20, the first ultrasonic signal 01 is emitted toward the user's fingerprint, and the The second ultrasonic signal 02 is resisted by the reflection layer 20 and reflected back toward the ultrasonic detection layer 10 to form a third ultrasonic signal 03.
  • the third ultrasonic signal 03 is also emitted toward the user's fingerprint. After the third ultrasonic signal 03 and the first ultrasonic signal 01 form resonance, they are jointly transmitted toward the user's fingerprint.
  • the ultrasonic detection layer 10 receives ultrasonic detection signals through the ultrasonic receiving surface 11 to obtain a user's fingerprint image. Since user fingerprints have wave areas and valley areas, and the wave areas and valley areas have different reflectivity to the initial ultrasonic signal, the ultrasonic detection signal reflected by the user's fingerprint has wave signals that can reflect the wave area and valley signals that can reflect the valley area. The wave signal is compared with the valley signal, and the difference data between the wave signal and the valley signal is acquired and then processed to obtain the user's fingerprint image.
  • the ultrasonic detection layer 10 roughly forms a fingerprint recognition area in the area covered by the ultrasonic fingerprint module 100.
  • the ultrasonic fingerprint module 100 uses a large-area ultrasonic detection layer 10, so that the fingerprint identification area of the ultrasonic fingerprint module 100 may have a length of 30 mm and a width of 20 mm.
  • the ultrasonic fingerprint module 100 has a larger fingerprint recognition area than current fingerprint modules with a smaller fingerprint recognition area, and can be applied to large-area fingerprint unlocking scenes, and can realize blind fingerprint unlocking and facilitate the use of fingerprints. Unlock control of electronic device program startup, etc.
  • the ultrasonic fingerprint module 100 is more suitable for full-screen mobile phones to meet the needs of large-area fingerprint recognition.
  • the length of the fingerprint recognition area of the ultrasonic fingerprint module 100 may also be 40 mm or more than 40 mm, and the width dimension may be 30 mm or more than 30 mm.
  • the reflective layer 20 may adopt a printing process, a vacuum evaporation process, or a spray coating. Processes and other large-area processing techniques can be formed on the fingerprint detection layer 10 to prevent bubbles from being generated at the interface between the reflective layer 20 and the fingerprint detection layer 10, and to avoid uneven ultrasonic reflection efficiency due to bubbles, thereby ensuring the effective fingerprint recognition Sex.
  • the reflective layer 20 may be insulating ink. The reflective layer 20 is in contact with the air on the side away from the ultrasonic detection layer, and the interface between the reflective layer 20 and the air forms an ultrasonic reflective surface.
  • the acoustic impedance of the reflective layer 20 is different from that of air, and the difference is greater , So that the interface between the reflective layer 20 and the air has a higher ultrasonic reflectivity.
  • the acoustic impedance of the reflective layer 20 is proportional to the elastic modulus, so the greater the elastic modulus of the reflective layer 20 is, the greater the acoustic impedance of the reflective layer 20 is.
  • the elastic modulus of the reflective layer 20 is approximately equal to that of the plastic film, so that the reflective layer 20 has a good shielding effect on ultrasonic signals, and the reflective layer 20 is in contact with the air.
  • the interface has good reflection efficiency for ultrasonic waves.
  • the reflective layer 20 resists and reflects the ultrasonic signal emitted by the ultrasonic detection layer 10, so that the ultrasonic wave received by the user's fingerprint is strengthened, so that the ultrasonic detection layer 10 receives the ultrasonic wave reflected from the user's fingerprint and enhances the ultrasonic wave.
  • the recognition efficiency of the layer 10 is detected.
  • the reflective layer 20 also has a protective function with the ultrasonic detection layer 10 to ensure the safety of the ultrasonic detection layer 10.
  • the reflective layer 20 also has the performance of resisting ultrasonic waves conducted from the outside air, realizing resistance to ultrasonic signals in the external environment, preventing environmental ultrasonic waves from interfering with the ultrasonic detection layer 10 identifying the ultrasonic signals reflected from the user’s fingerprints, ensuring all The ultrasonic detection layer 10 recognizes the accuracy of the user's fingerprint.
  • the reflective layer 20 is provided with a resin material, for example, the reflective layer 20 is provided with any one or a combination of acrylic resin, polyester resin, isocyanate resin, phenolic resin, and epoxy resin. . As a preferred embodiment, the reflective layer 20 is provided with epoxy resin material.
  • the reflective layer 20 is insulated by a resin material to ensure that the reflective layer 20 can provide insulation and protection to the ultrasonic detection layer, and the cured resin material has an elastic modulus similar to that of a plastic sheet to ensure The reflective layer 20 has approximately the same ultrasonic reflection efficiency as the plastic sheet.
  • the reflective layer 20 of multiple different materials can be formed on multiple sets of fingerprint detection layers 10 through a screen printing process to obtain multiple sets of samples of the ultrasonic fingerprint detection module 100.
  • SNR SIGNAL NOISE RATIO
  • the material for the reflective layer 20 with the best average SNR is selected.
  • the SNR value can be tested with an ultrasonic fingerprint testing instrument.
  • a first group of samples of the ultrasonic fingerprint module 100 is provided, and the reflective layer 20 of the group of samples is made of acrylic resin.
  • a second set of samples of the ultrasonic fingerprint module 100 is provided, and the reflective layer 20 of this set of samples is made of polyester resin.
  • a third set of samples of the ultrasonic fingerprint module 100 is provided, and the reflective layer 20 of the samples of this set uses a mixed resin of acrylic resin, isocyanate resin and polyester resin.
  • a fourth group of samples of the ultrasonic fingerprint module 100 is provided, and the reflective layer 20 of this group of samples is made of phenolic resin.
  • a fifth group of samples of the ultrasonic fingerprint module 100 is provided.
  • the reflective layer 20 of the group of samples uses epoxy resin 1, and epoxy resin 1 may be a conventional epoxy resin.
  • a sixth group of samples of the ultrasonic fingerprint module 100 is provided.
  • the reflective layer 20 of this group of samples uses epoxy resin 2.
  • the specifications of the epoxy resin 2 and the epoxy resin 1 are different, and the CAS number of the epoxy resin 2 is 38891 -59-7.
  • the average SNR values of the first, second, third, fourth, fifth, and sixth groups of samples were 8.10, 3.77, 7.38, 8.54, 8.89, 10.33, respectively.
  • the SNR values of the samples in the first group were 8.10, 8.75, 8.85, 7.48, 7.45, 7.89, 8.16, respectively.
  • the SNR values of the samples in the second group were 3.77, 3.89, 3.87, 3.22, 3.93, 4.08, 3.61, respectively.
  • the SNR values of the samples in the third group were 7.38, 8.18, 7.09, 7.75, 7.39, 6.84, and 7.02, respectively.
  • the SNR values of the samples in the fourth group were 8.54, 8.65, 9.01, 8.76, 7.68, 8.68, 8.46, respectively.
  • the SNR values of the samples in the fifth group were 8.89, 8.89, 8.33, 8.07, 9.69, 8.94, 9.40, respectively.
  • the SNR values of the samples in the sixth group were 10.33, 9.63, 10.47, 10.99, 10.56, 10.03, 10.32, respectively.
  • the average SNR values of the first, second, third, fourth, fifth, and sixth groups of samples are 8.10, 3.77, 7.38, 8.54, 8.89, and 10.33, respectively.
  • the reflective layer 20 of the sixth group of ultrasonic fingerprint module 100 samples uses epoxy resin 2, which has the best average SNR. Therefore, epoxy resin 2 is selected as the material of the reflective layer 20 to make the ultrasonic fingerprint module
  • the fingerprint recognition efficiency of group 100 is better.
  • the difference between epoxy resin 1 and epoxy resin 2 lies in different specifications. Specifically, the CAS number of the epoxy resin 2 is 38891-59-7.
  • the ultrasonic detection layer 10 has a detection layer bottom surface 12 opposite to the ultrasonic receiving surface 11, and the reflective layer 20 is formed on the detection layer bottom surface 12 through a printing process.
  • the reflective layer 20 may be formed on the bottom surface 12 of the detection layer through a TFT (Thin Film Transistor) printing process.
  • the reflective layer 20 can be formed by a printing process, so that the reflective layer 20 can be formed in a large area.
  • a plurality of the ultrasonic fingerprint modules 100 are formed by printing at a time, and the ultrasonic fingerprint modules 100 are obtained in batches after cutting, which improves production effectiveness.
  • a large-area ultrasonic detection layer 10 is first formed, and then a large-area reflective layer 20 is printed and formed on the large-area ultrasonic detection layer 10, and then the large-area ultrasonic detection layer 10 and the large-area reflective layer 20 are combined together Cut to form a plurality of ultrasonic fingerprint modules 100 to realize rapid mass production of ultrasonic fingerprint modules 100, reduce production costs, and improve efficiency.
  • the reflective layer 20 adds carbon powder particles to the resin material, so that the reflective layer 20 presents a black appearance effect.
  • the resin material and carbon powder are mixed to form a liquid ink, and then the liquid ink is formed on the ultrasonic fingerprint detection layer 10 through a screen printing process and cured to form the reflective layer 20.
  • the elastic modulus of the reflective layer 20 is determined according to the ultrasonic frequency emitted by the ultrasonic detection layer 10, so that the elastic modulus of the reflective layer 20 matches the ultrasonic frequency.
  • the reflective layer 20 can resist and reflect ultrasonic signals, so that the fingerprint recognition efficiency of the ultrasonic fingerprint module 100 is improved.
  • the reflective layer 20 contains black carbon powder, the reflective layer 20 presents a black visual effect, so that the reflective layer 20 can block the transmission of visible light, that is, the reflective layer 20 can perform the ultrasonic fingerprint detection layer 10 Covering makes the appearance defects of the ultrasonic fingerprint detection layer 10 invisible, and improves the appearance performance of the ultrasonic fingerprint module 100.
  • the reflective layer 20 can be formed by printing a layer structure with a liquid printing material and then being formed by a curing process. Specifically, first, a liquid resin material and a black carbon powder material mixed with the liquid resin material are provided. Then, the liquid resin material mixed with black carbon powder material is printed and molded on the bottom surface 12 of the ultrasonic detection layer 10 by a printing device.
  • the liquid reflective layer 20 in a layered structure is cured to obtain a solid reflective layer 20.
  • the reflective layer 20 may also be composed of insulating glue and white carbon powder mixed with insulating glue, or red carbon powder, or green carbon powder.
  • the reflective layer 20 may also be made of other materials with the ability to shield ultrasonic waves mixed with colored particles.
  • the reflective layer 20 may also be a transparent layer, so as to facilitate the integration of the ultrasonic fingerprint module 100 into the display screen and ensure the display effect of the display screen.
  • the carbon powder particles in the reflective layer 20 can fill the gaps between the resin particles and the particles in the resin material, so that the surface roughness of the reflective layer 20 is reduced, so that the surface of the reflective layer 20 smooth.
  • the reflective layer 20 has a first surface 201 away from the fingerprint detection layer 10.
  • the first surface 201 is in contact with air.
  • the first surface 201 is smoothly arranged, and the roughness of the first surface 201 is 0.2 Rz/ ⁇ m to 6.0 Rz/ ⁇ m.
  • the roughness of the first surface 201 may be 0.41Rz/ ⁇ m, or 0.68Rz/ ⁇ m, or 4.76Rz/ ⁇ m, or 5.25Rz/ ⁇ m.
  • the reflective layer 20 has a second surface 202 opposite to the first surface 201.
  • the second surface 202 is attached to the fingerprint detection layer 10.
  • the second surface 202 is smoothly arranged, and the roughness of the second surface is 0.2 Rz/ ⁇ m to 6.0 Rz/ ⁇ m.
  • the roughness of the first surface 201 may be 0.41Rz/ ⁇ m, or 0.68Rz/ ⁇ m, or 4.76Rz/ ⁇ m, or 5.25Rz/ ⁇ m.
  • the reflection direction of the ultrasonic waves on the first surface 201 tends to be approximately the same, so that the ultrasonic interference signal received by the ultrasonic detection layer 10 is smaller, and the fingerprint recognition clarity of the ultrasonic fingerprint module 100 is improved.
  • the smaller the roughness of the second surface 202 is the less likely it is for ultrasonic waves to be diffusely reflected when passing through the second surface 202, which improves the fingerprint recognition efficiency of the ultrasonic fingerprint module 100.
  • the first surface 201 forms a diffuse reflection of ultrasonic waves
  • the second surface 202 easily causes a diffuse reflection of ultrasonic waves. Therefore, by setting the average particle size of the carbon powder particles in the reflective layer 20 and the ratio of the carbon powder particles in the reflective layer 20, the roughness of the first surface 201 and the second surface 202 can be improved. The roughness.
  • the average particle size of the carbon powder particles in the reflective layer 20 is 0.5 ⁇ m to 5 ⁇ m.
  • the average particle size of the carbon powder particles in the reflective layer 20 is 0.5 microns, the roughness of the reflective layer 20 can be minimized, but the OD value of the ultrasonic fingerprint module 100 is not optimal.
  • the average particle size of the carbon powder particles in the reflective layer 20 is 5 microns, the OD value of the ultrasonic fingerprint module 100 is relatively excellent, but the roughness of the reflective layer 20 is not optimal.
  • the average particle size of the carbon powder particles in the reflective layer 20 is 0.8 ⁇ m to 2 ⁇ m, and further is 1.0 ⁇ m.
  • the average particle size of the carbon powder particles of the reflective layer 20 is 0.8 micrometers, the roughness of the reflective layer 20 can be approximate to the minimum value, and the OD value of the ultrasonic fingerprint module 100 meets the performance requirements.
  • the average particle size of the carbon powder particles of the reflective layer 20 is 2 microns, the OD value of the ultrasonic fingerprint module 100 is relatively excellent, and the roughness of the reflective layer 20 can also be relatively reduced.
  • the average particle size of the carbon powder particles of the reflective layer 20 is 1 micron, the roughness of the reflective layer 20 can be close to the minimum value, and the OD value and SNR value of the ultrasonic fingerprint module 100 Both can be more excellent.
  • the average particle size of the carbon powder particles in the reflective layer 20 can also be approximately 1 micron, the roughness of the reflective layer 20 can be similar to the minimum value, and the OD and SNR values of the ultrasonic fingerprint module 100 are also Can be more excellent.
  • the mass proportion of the carbon powder particles in the reflective layer 20 is 2.5%-15%.
  • the mass ratio of the carbon powder particles in the reflective layer 20 is 2.5%, the roughness of the reflective layer 20 can be minimized, but the OD value of the ultrasonic fingerprint module 100 is not optimal.
  • the mass ratio of the carbon powder particles in the reflective layer 20 is 15%, the OD value of the ultrasonic fingerprint module 100 is higher, but the roughness of the reflective layer 20 is not the smallest.
  • the mass proportion of the carbon powder particles in the reflective layer is 3.0%-10%, and further is 5%.
  • the mass ratio of the carbon powder particles in the reflective layer 20 is 3.0%, the roughness of the reflective layer 20 can be similar to the minimum value, and the OD value of the ultrasonic fingerprint module 100 Meet performance requirements.
  • the mass ratio of the carbon powder particles in the reflective layer 20 is 10%, the OD value of the ultrasonic fingerprint module 100 meets the requirements, and the roughness of the reflective layer 20 can also be relatively reduced.
  • the mass ratio of the carbon powder particles in the reflective layer 20 is 5%, the roughness of the reflective layer 20 can be close to the minimum value, and the OD of the ultrasonic fingerprint module 100 Both the value and the SNR value can be excellent.
  • the mass ratio of the carbon powder particles in the reflective layer 20 can be approximately 5%, the roughness of the reflective layer 20 can be similar to the minimum value, and the OD value and SNR value of the ultrasonic fingerprint module 100 can also be compared. Excellent.
  • a leveling agent is added during the preparation process of the reflective layer 20 to utilize the surface defoaming, surface leveling control and surface leveling properties of the leveling agent to effectively reduce the surface roughness of the reflective layer 20. That is, the reflective layer 20 also contains a leveling agent, which is used to improve the leveling of the reflective layer formed during the manufacturing process and finally.
  • the mass percentage of the leveling agent in the reflective layer 20 may be 0.2% to 1.5%. When the mass ratio of the leveling agent in the reflective layer is 0.2%, the surface leveling of the reflective layer 20 can be effectively improved, and the surface roughness of the reflective layer 20 can be reduced initially.
  • the leveling agent includes a fluorocarbon-based leveling agent to ensure the wettability of the substrate and the anti-crater ability of the reflective layer.
  • the fluorocarbon-based leveling agent is a fluorocarbon organically modified siloxane.
  • the leveling agent further includes a polyether siloxane copolymer. That is, the leveling agent is a mixture of fluorocarbon organically modified siloxane and polyether siloxane copolymer.
  • the mass percentage of the fluorocarbon organo-modified siloxane in the reflective layer 20 may be 0.1% to 0.75%, and the mass percentage of the polyether siloxane copolymer in the reflective layer 20 may be 0.1 % ⁇ 0.75%.
  • the mass percentage of the fluorocarbon organosiloxane in the reflective layer 20 is 0.1%, and the mass percentage of the polyethersiloxane copolymer in the reflective layer 20 is 0.1%, that is, the leveling
  • the mass ratio of the agent in the reflective layer 20 is 0.2%, which can initially reduce the surface roughness of the reflective layer 20, and the fluorocarbon organosiloxane and the polyether siloxane copolymer are effectively complementary, so that the The surface stability of the reflective layer 20 can be further improved.
  • the mass percentage of the fluorocarbon organosiloxane in the reflective layer 20 is 0.75%, and the mass percentage of the polyethersiloxane copolymer in the reflective layer 20 is 0.75%, that is, the The mass ratio of the leveling agent in the reflective layer 20 is 1.5%, the surface roughness of the reflective layer 20 is greatly reduced, and the SNR value and OD value of the ultrasonic fingerprint module 100 are also effectively improved.
  • the mass ratio of the fluorocarbon organo-modified siloxane in the reflective layer is 0.2% to 0.6%%, and further is 0.5%.
  • the mass ratio of the polyether siloxane copolymer is 0.2% to 0.6%, and further is 0.5%, the leveling agent has the best control over the surface stability of the reflective layer 20, so that the The roughness of the reflective layer 20 can be greatly reduced, and the SNR value and OD value of the ultrasonic fingerprint module can be further increased.
  • the reflective layer 20 has good leveling properties, a smooth surface, and the surface roughness can be controlled to be less than ⁇ 0.5 Rz/ ⁇ m, and the fingerprint recognition efficiency of the ultrasonic fingerprint module 100 is improved.
  • the reflective layer 20 is provided with an average particle size of 50% of the particle size distribution of carbon powder particles of 5 ⁇ m.
  • the carbon powder in the reflective layer 20 accounts for 15% by mass.
  • the leveling agent in the reflective layer 20 adopts fluorocarbon organically modified siloxane.
  • the mass percentage of the leveling agent in the reflective layer 20 is 0.2%.
  • a roughness tester is used to perform a roughness test on the reflective layer 20 of the ultrasonic fingerprint module 100 in this embodiment, and the test result is that the roughness of the reflective layer 20 is 5.25 Rz/ ⁇ m.
  • the ultrasonic fingerprint function tester is used to test the SNR value of the ultrasonic fingerprint module 100 in this embodiment, and the SNR value is 9.45.
  • An optical density meter is used to test the OD (optical density, optical density) value of the ultrasonic fingerprint module 100 in this embodiment, and the OD value is 6.1.
  • a second embodiment is provided, which is different from the first embodiment in that the mass ratio of carbon powder in the reflective layer 20 is reduced.
  • the average particle size of 50% of the particle size distribution of the carbon powder particles in the reflective layer 20 is 5 ⁇ m.
  • the carbon powder in the reflective layer 20 accounts for 10% by mass.
  • the leveling agent in the reflective layer 20 adopts fluorocarbon organically modified siloxane.
  • the mass percentage of the leveling agent in the reflective layer 20 is 0.2%.
  • the roughness of the reflective layer 20 is 5.04 Rz/ ⁇ m.
  • the SNR value of the ultrasonic fingerprint module 100 is 9.52.
  • the OD value of the ultrasonic fingerprint module 100 is 5.3. It can be seen that reducing the proportion of carbon powder in the reflective layer 20 can reduce the surface roughness of the reflective layer 20.
  • the third embodiment is provided.
  • the difference from the second embodiment is that the mass ratio of the carbon powder in the reflective layer 20 is continuously reduced.
  • the average particle size of 50% of the particle size distribution of the carbon powder particles in the reflective layer 20 is 5 ⁇ m.
  • the carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the leveling agent in the reflective layer 20 adopts fluorocarbon organically modified siloxane.
  • the mass percentage of the leveling agent in the reflective layer 20 is 0.2%.
  • the roughness of the reflective layer 20 is 4.76 Rz/ ⁇ m.
  • the SNR value of the ultrasonic fingerprint module 100 is 9.65.
  • the OD value of the ultrasonic fingerprint module 100 is 4.6. It can be seen that reducing the proportion of carbon powder in the reflective layer 20 can reduce the surface roughness of the reflective layer 20 and increase the SNR value of the ultrasonic fingerprint module 100, but it will also reduce the ultrasonic fingerprint model.
  • the OD value of group 100 is reducing the proportion of carbon powder in the reflective layer 20
  • the fourth embodiment is provided.
  • the difference from the third embodiment is that the proportion of the carbon powder in the reflective layer 20 is continuously reduced.
  • the average particle size of 50% of the particle size distribution of the carbon powder particles in the reflective layer 20 is 5 ⁇ m.
  • the carbon powder in the reflective layer 20 accounts for 2.5% by mass.
  • the leveling agent in the reflective layer 20 adopts fluorocarbon organically modified siloxane.
  • the mass percentage of the leveling agent in the reflective layer 20 is 0.2%.
  • the roughness of the reflective layer 20 is 4.42 Rz/ ⁇ m.
  • the SNR value of the ultrasonic fingerprint module 100 is 9.7.
  • the OD value of the ultrasonic fingerprint module 100 is 3.7. It can be seen that when the proportion of the carbon powder in the reflective layer 20 is reduced to 2.5%, the OD value of the ultrasonic fingerprint module 100 is also reduced to 3.7, and the ultrasonic fingerprint module 100 does not meet the requirements for good performance.
  • a fifth embodiment is provided, which is different from the fourth embodiment in that the average particle size of the carbon powder in the reflective layer 20 is reduced.
  • the average particle size of 50% of the particle size distribution of the carbon powder particles of the reflective layer 20 is 0.5 ⁇ m.
  • the average particle size of 100% of the particle size distribution of the carbon powder particles of the reflective layer 20 is less than 1 ⁇ m.
  • the carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the leveling agent in the reflective layer 20 adopts fluorocarbon organically modified siloxane.
  • the mass percentage of the leveling agent in the reflective layer 20 is 0.2%.
  • the roughness of the reflective layer 20 is 0.82 Rz/ ⁇ m.
  • the SNR value of the ultrasonic fingerprint module 100 is 10.25.
  • the OD value of the ultrasonic fingerprint module 100 is 4.3.
  • the surface roughness of the reflective layer 20 can be significantly reduced, and the SNR value of the ultrasonic fingerprint module 100 can be ensured to be high, and the ultrasonic The OD value of the fingerprint module 100 also meets the requirements of good performance, that is, the performance of the ultrasonic fingerprint module 100 is significantly improved.
  • a sixth embodiment is provided, which is different from the fifth embodiment in that the proportion of the leveling agent in the reflective layer 20 is increased.
  • the average particle size of 50% of the particle size distribution of the carbon powder particles of the reflective layer 20 is 0.5 ⁇ m.
  • the average particle size of 100% of the particle size distribution of the carbon powder particles of the reflective layer 20 is less than 1 ⁇ m.
  • the carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the leveling agent in the reflective layer 20 adopts fluorocarbon organically modified siloxane.
  • the mass percentage of the leveling agent in the reflective layer 20 is 0.7%.
  • the roughness of the reflective layer 20 is 0.68 Rz/ ⁇ m.
  • the SNR value of the ultrasonic fingerprint module 100 is 10.35.
  • the OD value of the ultrasonic fingerprint module 100 is 4.4.
  • the mass proportion of the leveling agent in the reflective layer 20 increases, the surface roughness of the reflective layer 20 will also decrease, and the SNR value of the ultrasonic fingerprint module 100 will increase.
  • the OD value of the ultrasonic fingerprint module 100 will also increase.
  • a seventh embodiment is provided.
  • the leveling agent in the reflective layer 20 is a mixture of two different types of leveling agents. Specifically, the average particle size of 50% of the carbon powder particle size distribution of the reflective layer 20 is 0.5 ⁇ m. The average particle size of 100% of the particle size distribution of the carbon powder particles of the reflective layer 20 is less than 1 ⁇ m. The carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the leveling agent in the reflective layer 20 is a mixed leveling agent of fluorocarbon organically modified siloxane and polyether siloxane copolymer. The mass ratio of the fluorocarbon organically modified siloxane in the reflective layer 20 is 0.5%.
  • the mass ratio of the polyether siloxane copolymer in the reflective layer 20 is 0.5%.
  • the roughness of the reflective layer 20 is 0.41 Rz/ ⁇ m.
  • the SNR value of the ultrasonic fingerprint module 100 is 10.55.
  • the OD value of the ultrasonic fingerprint module 100 is 4.3. It can be seen that the fluorocarbon organo-modified siloxane is a fluorocarbon leveling agent, which has good substrate wettability and strong anti-cratering ability, but this leveling agent is easy to stabilize the foam and the foam is difficult to disappear.
  • the polyether siloxane copolymer and the fluorocarbon siloxane have good complementarity, and the surface state of the polyether siloxane copolymer is Strong control ability, good surface leveling, and a certain defoaming effect.
  • Polyether siloxane copolymer and fluorocarbon siloxane are added to the molding material of the reflective layer 20, and the leveling property is good, the surface is smooth, and the surface roughness of the reflective layer 20 can be controlled to be less than 0.5 Rz / ⁇ m.
  • the ultrasonic acoustic impedance of the bubbles is very small, which causes the ultrasonic signal to penetrate and reflect through the bubbles.
  • the signal strength is greatly attenuated or even not, that is, the ultrasonic detection layer 10 is in contact with the reflective layer.
  • the signal reception intensity of the position corresponding to the bubble in 20 is obviously different from that of other areas, which causes the acquired fingerprint image to be noisy, that is, the acquired fingerprint image is not clear. Therefore, by improving the bubbles of the reflective layer 20, the clarity of the fingerprint image obtained by the ultrasonic fingerprint module 100 can be improved.
  • a defoaming agent is added to the molding material of the reflective layer 20 to utilize the defoaming performance of the defoaming agent, so that the number of bubbles in the reflective layer 20 is reduced. That is, the reflective layer 20 also contains a defoaming agent, which is used to eliminate bubbles in the manufacturing process of the reflective layer and eliminate bubbles in the finally formed reflective layer.
  • the defoaming agent may be modified dimethyl silane, and the defoaming agent may also be polyoxypropylene oxide ethylene glycerol ether.
  • the defoaming agent may be a mixture of modified dimethylsilane and polyoxypropylene oxide ethylene glycerol ether.
  • the mass proportion of the modified dimethylsilane may be 0.8% to 2.0%, and the mass proportion of the polyoxypropylene oxide ethylene glycerol ether may be 0.2% to 1.0%.
  • the reflective layer 20 has no bubbles, and the ultrasonic fingerprint Module production costs are reduced.
  • the reflective layer 20 is provided with a defoamer. Specifically, the carbon powder in the reflective layer 20 accounts for 15% by mass.
  • the defoaming agent in the reflective layer 20 is modified dimethyl silane.
  • the mass ratio of the defoamer in the reflective layer 20 is 0.5%.
  • the molding material of the reflective layer 20 is mixed with a defoamer and there are a lot of bubbles. After the molding material of the reflective layer 20 is stirred and printed on the fingerprint detection layer 10 by a screen printing process, the reflective layer 20 There are still a lot of bubbles.
  • the OD value of the ultrasonic fingerprint module 100 is 6.1.
  • a ninth embodiment is provided.
  • the difference from the eighth embodiment is that the mass proportion of the carbon powder in the reflective layer 20 is reduced, and the mass proportion of the antifoaming agent in the reflective layer 20 is increased.
  • the carbon powder in the reflective layer 20 accounts for 10% by mass.
  • the defoaming agent in the reflective layer 20 is modified dimethyl silane.
  • the mass ratio of the defoamer in the reflective layer 20 is 0.8%.
  • the molding material of the reflective layer 20 is mixed with a defoamer and there are a few bubbles after stirring. After the molding material of the reflective layer 20 is stirred and printed on the fingerprint detection layer 10 by a screen printing process, the reflective layer 20 There are still a few bubbles.
  • the OD value of the ultrasonic fingerprint module 100 is 5.3.
  • the bubble content in the reflective layer 20 can be improved.
  • a tenth embodiment is provided.
  • the difference from the ninth embodiment is that the proportion of the carbon powder in the reflective layer 20 is continuously reduced, and the proportion of the defoamer in the reflective layer 20 is continuously increased.
  • the carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the defoaming agent in the reflective layer 20 is modified dimethyl silane.
  • the mass proportion of the defoamer in the reflective layer 20 is 1.5%.
  • the molding material of the reflective layer 20 is mixed with a defoamer and there are very few bubbles after stirring. After the molding material of the reflective layer 20 is stirred and printed on the fingerprint detection layer 10 by a screen printing process, the reflective layer 20 There are still very few bubbles.
  • the OD value of the ultrasonic fingerprint module 100 is 4.6.
  • the bubble content in the reflective layer 20 can be significantly improved, but at the same time, the content of bubbles in the reflective layer 20 can be significantly reduced.
  • the OD value of the ultrasonic fingerprint module 100 is likely to cause the performance of the ultrasonic fingerprint module 100 to decrease.
  • An eleventh embodiment is provided.
  • the difference from the tenth embodiment is that the mass proportion of carbon powder in the reflective layer 20 continues to decrease, and the mass proportion of defoamer in the reflective layer 20 continues to increase.
  • the carbon powder in the reflective layer 20 accounts for 2.5% by mass.
  • the defoaming agent in the reflective layer 20 is modified dimethyl silane.
  • the mass proportion of the defoamer in the reflective layer 20 is 2.0%.
  • the molding material of the reflective layer 20 is mixed with a defoamer and there are very few bubbles after stirring. After the molding material of the reflective layer 20 is stirred and printed on the fingerprint detection layer 10 by a screen printing process, the reflective layer 20 There are still very few bubbles.
  • the OD value of the ultrasonic fingerprint module 100 is 3.7.
  • the reflective layer 20 When the mass ratio of the defoaming agent in the reflective layer 20 is 2.0%, the reflective layer 20 obviously has shrinkage holes. It can be seen that when the mass proportion of the defoamer in the reflective layer 20 is greater than 2.0%, the reflective layer 20 cannot meet the requirements of use.
  • the mass proportion of carbon powder in the reflective layer 20 is greater than or equal to 5%, and the mass proportion of the defoamer in the reflective layer 20 is increased to approximately 1.5%, so that the OD value of the ultrasonic fingerprint module 100 can meet The minimum requirement, but it is still unable to ensure that the reflective layer 20 is free of bubbles.
  • a twelfth embodiment is provided.
  • the defoaming agent in the reflective layer 20 contains two different types of defoaming agents.
  • the carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the defoaming agent in the reflective layer 20 is a mixture of modified dimethylsilane and polyoxypropylene oxide ethylene glycerol ether.
  • the mass ratio of modified dimethylsilane in the reflective layer 20 is 1.5%.
  • the mass ratio of polyoxypropylene oxide ethylene glycerol ether in the reflective layer 20 is 0.2%.
  • the molding material of the reflective layer 20 is mixed with a defoamer and there is no air bubbles.
  • the OD value of the ultrasonic fingerprint module 100 is 4.5. It can be seen that the antifoaming agent in the reflective layer 20 contains modified dimethylsilane and polyoxypropylene oxide ethylene glyceryl ether, which can significantly improve the bubble content of the reflective layer 20 during the preparation process, and the ultrasonic fingerprint The OD value of the module 100 also meets the performance requirements, but there are still very few bubbles in the finally formed reflective layer 20.
  • a thirteenth embodiment is provided, which is different from the twelfth embodiment in that the mass proportion of polyoxypropylene oxide ethylene glycerol ether in the molding material of the reflective layer 20 is increased.
  • the carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the defoaming agent in the reflective layer 20 is a mixture of modified dimethylsilane and polyoxypropylene oxide ethylene glycerol ether.
  • the mass ratio of modified dimethylsilane in the reflective layer 20 is 1.5%.
  • the mass ratio of polyoxypropylene oxide ethylene glycerol ether in the reflective layer 20 is 0.5%. That is, the mass proportion of the defoamer in the reflective layer 20 is 2.0%.
  • the molding material of the reflective layer 20 is mixed with a defoaming agent without bubbles. After the molding material of the reflective layer 20 is stirred and formed on the fingerprint detection layer 10 by a screen printing process, the reflective layer 20 has no bubbles. bubble.
  • the OD value of the ultrasonic fingerprint module 100 is 4.6.
  • the defoaming agent in the reflective layer 20 contains modified dimethylsilane and polyoxypropylene oxide ethylene glyceryl ether, and after increasing the mass proportion of polyoxypropylene oxide ethylene glyceryl ether, the reflective layer can be made There is no air bubbles in the preparation process of 20, and the finally formed reflective layer 20 has no air bubbles, and the OD value of the ultrasonic fingerprint module 100 also meets the performance requirements, so that the performance of the ultrasonic fingerprint module 100 is significantly improved.
  • a fourteenth embodiment is provided.
  • the difference from the thirteenth embodiment is that the mass proportion of polyoxypropylene oxide ethylene glyceryl ether in the reflective layer 20 is continuously increased.
  • the carbon powder in the reflective layer 20 accounts for 5% by mass.
  • the defoaming agent in the reflective layer 20 is a mixture of modified dimethylsilane and polyoxypropylene oxide ethylene glycerol ether.
  • the mass ratio of modified dimethylsilane in the reflective layer 20 is 1.5%.
  • the mass ratio of polyoxypropylene oxide ethylene glycerol ether in the reflective layer 20 is 1.0%.
  • the molding material of the reflective layer 20 is mixed with a defoaming agent without bubbles. After the molding material of the reflective layer 20 is stirred and formed on the fingerprint detection layer 10 by a screen printing process, the reflective layer 20 has no bubbles. bubble.
  • the OD value of the ultrasonic fingerprint module 100 is 4.6.
  • the ultrasonic detection layer 10 includes a substrate layer 13, a plurality of pixel electrodes 14, a piezoelectric layer 15 and a conductive electrode 16, and the plurality of pixel electrodes 14 are arranged in an array on the substrate.
  • Layer 13 the piezoelectric layer 15 covers the plurality of pixel electrodes 14, the conductive electrode 16 is laminated on the side of the piezoelectric layer 15 away from the plurality of pixel electrodes 14, and the reflective layer 20 is printed on The conductive electrode 16 is away from the side of the piezoelectric layer 15.
  • the substrate layer 13 may be made of glass or polyimide film material.
  • the base material layer 13 has lower cost and better light transmittance, which facilitates the integration of the ultrasonic fingerprint module 100 in the display screen of an electronic device.
  • the ultrasonic fingerprint module 100 with better light transmittance will not block the display image of the display screen 90, and at the same time the ultrasonic fingerprint module integrated in the display screen 90 100 can keep the overall color of the display screen 90 consistent and improve the appearance performance of the display screen 90.
  • a plurality of the pixel electrodes 14 may be formed on the substrate layer 13 through a TFT printing process, and are arranged in an array.
  • the material of the pixel electrode 14 is any one of indium tin oxide (ITO), nano silver wire (Agnanowire), metal mesh, carbon nanotube, and graphene (Graphene).
  • the pixel electrode 14 made of the above-mentioned materials has good toughness and light transmittance. Therefore, the ultrasonic fingerprint module 100 made of the pixel electrode 14 has better toughness and light transmittance.
  • the light transmittance of the pixel electrode 14 is greater than 90%, so that the ultrasonic fingerprint module 100 made of the pixel electrode 14 has better light transmittance.
  • the pixel electrodes 14 can be used to receive electrical signals.
  • Each pixel electrode 14 can determine a position of the ultrasonic fingerprint module 100 according to the received electrical signals.
  • the density of the pixel electrodes 14 on the substrate layer 13 It is positively correlated with the fingerprint collection accuracy of the ultrasonic fingerprint module 100.
  • the denseness of the array arrangement of the plurality of pixel electrodes 14 ensures the accuracy of the fingerprint image of the object to be detected by the ultrasonic sensor.
  • the ultrasonic receiving surface 11 is arranged on the side of the piezoelectric layer 15 facing the base layer 13.
  • the piezoelectric layer 15 is laminated on the base layer 13 and covers the plurality of pixel electrodes 14.
  • the piezoelectric layer 15 is a sheet structure made of piezoelectric material.
  • the shape of the piezoelectric layer 15 matches the shape of the substrate layer 13.
  • the material of the piezoelectric layer 15 is polyvinylidene fluoride (PVDF). Since polyvinylidene fluoride has good toughness and light transmittance, the piezoelectric layer 15 has good flexibility and light transmittance, which ensures the flexibility and light transmittance of the ultrasonic fingerprint module 100.
  • the piezoelectric layer 15 can generate ultrasonic waves under the action of a high-frequency voltage (for example, a voltage with a frequency greater than 20KHZ). After the piezoelectric layer 15 receives the ultrasonic waves reflected by the object to be detected, the piezoelectric layer 15 generates an electrical signal (or piezoelectric signal) under the action of the ultrasonic wave, and the object to be detected may be a finger, a test template, or the like.
  • a high-frequency voltage for example, a voltage with a frequency greater than 20KHZ
  • the conductive electrode 16 is an overall layered structure made of conductive material.
  • the shape of the conductive electrode 16 matches the shape of the piezoelectric layer 15.
  • the material of the conductive electrode 16 may be a silver material.
  • the conductive electrode 16 can be formed after solidification of the silver paste.
  • the light transmittance of the conductive electrode 16 is greater than 90%.
  • a high-frequency voltage can be applied to the piezoelectric layer 15, so that the piezoelectric layer 15 generates an ultrasonic signal, so that the ultrasonic signal can be used to detect a user's fingerprint.
  • the conductive electrode 16 and the pixel electrode 14 can also receive electrical signals generated by the piezoelectric layer 15.
  • the bottom surface 12 of the detection layer is disposed on the side of the conductive electrode 16 away from the piezoelectric layer 15.
  • the reflective layer 20 covers the conductive electrode 16 to prevent the conductive electrode 16 from being oxidized.
  • the reflective layer 20 can also cover the appearance defects on the conductive electrode 16.
  • the conductive electrode 16 has a thickness of 10 to 30 microns
  • the piezoelectric layer 15 has a thickness of 5 to 15 microns
  • the substrate layer 13 has a thickness of 80 to 100 microns.
  • the thickness of the reflective layer 20 is 7 ⁇ m to 30 ⁇ m. Utilizing the slim performance of the ultrasonic fingerprint module 100 facilitates the integration of the ultrasonic fingerprint module 100 into the display screen of an electronic device.
  • the reflective layer 20 is printed and formed on the fingerprint detection layer 10, that is, the reflective layer 20 is printed and formed on the conductive electrode 16.
  • the surface roughness of the conductive electrode 16 affects the roughness of the first surface 201 of the reflective layer 20.
  • the reflective layer 20 of different thickness was formed on a glass base layer with a small surface roughness, and the surface roughness of the reflective layer 20 after the forming was measured. It was found that the surface roughness of the reflective layer 20 after the forming was affected by the thickness of the reflective layer 20. The impact is not big.
  • a reflective layer 20 with a film thickness of 5 ⁇ m, 10 ⁇ m, 15 ⁇ m, 20 ⁇ m, 25 ⁇ m, 30 ⁇ m is formed on the glass base layer, and the surface roughness of the reflective layer 20 after molding is 0.375Rz/ ⁇ m, 0.355Rz/ ⁇ m, respectively. , 0.335Rz/ ⁇ m, 0.315Rz/ ⁇ m, 0.316Rz/ ⁇ m, 0.322Rz/ ⁇ m.
  • a plurality of reflective layers 20 of different thicknesses are respectively formed on a plurality of fingerprint detection layers 10, and finally a plurality of the ultrasonic fingerprint modules 100 are obtained, and the surface of the reflective layer 20 of the ultrasonic fingerprint module 100 is obtained.
  • the roughness is measured, and it is found that the thicker the thickness of the reflective layer 20, the smaller the surface roughness of the reflective layer 20, and when the thickness of the reflective layer 20 is approximately 25 ⁇ m, the surface roughness of the reflective layer 20 It does not decrease as the thickness of the reflective layer 20 decreases, that is, the surface roughness of the reflective layer 20 tends to stabilize and no longer decreases.
  • the surface roughness of the six fingerprint detection layers 10 facing the reflective layer 20 is between 3.5 Rz/ ⁇ m and 4.5 Rz/ ⁇ m.
  • the thickness of the base layer 13 is 90 ⁇ m
  • the thickness of the piezoelectric layer 15 is 9 ⁇ m
  • the thickness of the conductive electrode 16 is 15-18 ⁇ m.
  • Six reflective layers 20 with film thicknesses of 5 ⁇ m, 10 ⁇ m, 15 ⁇ m, 20 ⁇ m, 25 ⁇ m, and 30 ⁇ m are respectively formed on the six fingerprint detection layers 10, and the surface roughness of the six reflective layers 20 after forming is detected to be 1.712 Rz.
  • the thickness of the reflective layer 20 is 20 ⁇ m-30 ⁇ m, the surface roughness of the reflective layer 20 of the ultrasonic fingerprint module 100 is relatively small, and the performance of the ultrasonic fingerprint module 100 is excellent.
  • the reflective layer 20 is provided with a multilayer sub-reflective layer 22, and the multilayer sub-reflective layer 22 is arranged in a reflective layered order.
  • the reflective layer 20 is formed through multiple printing steps, and each printing step forms each sub-reflective layer 22. After each sub-reflective layer 22 is cured and formed, another sub-reflective layer 22 is formed.
  • the thickness of each of the sub-reflective layers 22 can be set the same.
  • this application provides a method for manufacturing an ultrasonic fingerprint module.
  • the manufacturing method includes the steps:
  • the base layer 13 is molded.
  • the substrate layer 13 may be made of glass or polyimide film material.
  • the base material layer 13 has good mechanical strength to facilitate the formation of other structural components on the base material layer 13, and to facilitate the solid connection of the ultrasonic fingerprint film 100 with the housing of the electronic device or the back of the display screen of the electronic device .
  • the length and width dimensions of the substrate layer 13 can be manufactured according to the required length and width design dimensions of the ultrasonic fingerprint module 100, so that the length and width dimensions of the manufactured ultrasonic fingerprint module 100 meet the specification requirements.
  • the pixel electrode layer is composed of a plurality of pixel electrodes 14.
  • the length and width dimensions of the pixel electrode layer are approximately the same as the length and width dimensions of the base layer 13.
  • the plurality of pixel electrodes 14 of the pixel electrode layer may be formed on the substrate layer 13 through a TFT printing process.
  • the material of the pixel electrode 14 is any one of indium tin oxide (ITO), nano silver wire (Agnanowire), metal mesh, carbon nanotube, and graphene (Graphene).
  • ITO indium tin oxide
  • nano silver wire Agnanowire
  • metal mesh metal mesh
  • carbon nanotube carbon nanotube
  • graphene graphene
  • a piezoelectric layer 15 is formed on the pixel electrode layer.
  • the length and width dimensions of the piezoelectric layer 15 are approximately the same as the length and width dimensions of the pixel electrode layer.
  • the piezoelectric layer 15 covers the plurality of pixel electrodes 14.
  • the piezoelectric layer 15 is a sheet structure made of piezoelectric material.
  • the shape of the piezoelectric layer 15 matches the shape of the base layer 13.
  • the material of the piezoelectric layer 15 is polyvinylidene fluoride (PVDF). Since polyvinylidene fluoride has good toughness and light transmittance, the piezoelectric layer 15 has good flexibility and light transmittance, which ensures the flexibility and light transmittance of the ultrasonic fingerprint module 100.
  • a conductive electrode 16 is formed on the piezoelectric layer 15.
  • the length and width dimensions of the conductive electrode 16 are the same as the length and width dimensions of the pixel electrode layer, so as to realize the matching between the conductive electrode 16 and the pixel electrode layer.
  • the conductive electrode 16 may be formed on the piezoelectric layer 15 by a screen printing process.
  • the conductive electrode 16 is an integral layered structure made of conductive material.
  • the shape of the conductive electrode 16 matches the shape of the piezoelectric layer 15.
  • the material of the conductive electrode 16 may be a silver material.
  • the conductive electrode 16 can be formed after solidification of the silver paste.
  • Two or more layers of the conductive electrode 16 can be formed on the piezoelectric layer 15 so that the surface roughness of the conductive electrode 16 of the outermost layer away from the piezoelectric layer 15 is smaller, that is, the surface roughness of the conductive electrode 16 of the outermost layer is smaller.
  • the bottom surface of the detection layer of the ultrasonic detection layer 10 is smoother.
  • the liquid molding material further contains a resin material and carbon powder particles.
  • the resin material may be any one of acrylic resin, polyester resin, isocyanate resin, phenolic resin, epoxy resin, or A variety of combined resin materials.
  • the liquid molding material is formed by mixing and stirring epoxy resin and carbon powder particles.
  • the liquid molding material may be ink.
  • the liquid molding material also contains a leveling agent. That is, epoxy resin, carbon powder particles, defoamer, and leveling agent are mixed and stirred to form the liquid molding material.
  • the liquid molding material containing a defoamer can effectively reduce the number of bubbles in the reflective layer 20 and improve the reflection efficiency of the reflective layer 20 to ultrasonic waves.
  • the defoaming agent may be modified dimethyl silane, or polyoxypropylene oxide ethylene glyceryl ether, or a mixed defoaming agent of modified dimethyl silane and polyoxypropylene oxide ethylene glyceryl ether.
  • the mass ratio of the defoamer in the reflective layer 20 is 1.0%-3.0%. As a preferred embodiment, the mass proportion of the defoamer in the reflective layer 20 is 1.5% to 2.5%.
  • the defoaming agent accounts for 1.5% of the reflective layer 20 by mass
  • a smaller amount of bubbles can exist in the liquid molding material after stirring, and the reflective layer formed after the liquid molding material is cured 20 also has a small amount of bubbles, and the ultrasonic fingerprint module 100 meets the requirements of fingerprint identification.
  • the mass ratio of the defoamer in the reflective layer 20 is 2.5%
  • the bubbles in the stirred liquid molding material can be effectively eliminated, and the reflective layer 20 formed after the liquid molding material is solidified can also contain no bubbles.
  • the ultrasonic fingerprint module 100 with the reflective layer 20 has excellent performance and high fingerprint recognition efficiency.
  • the liquid molding material containing a leveling agent can effectively reduce the surface roughness of the reflective layer 20 and improve the reflection efficiency of the reflective layer 20 to ultrasonic waves.
  • the leveling agent may be a fluorocarbon organic modified siloxane, or a polyether siloxane copolymer, or a mixed leveling agent of a fluorocarbon organic modified siloxane and a polyether siloxane copolymer.
  • the mass percentage of the leveling agent in the reflective layer 20 is 0.2% to 1.5%. As a preferred embodiment, the mass percentage of the leveling agent in the reflective layer 20 is 0.5% to 1.0%.
  • the surface of the reflective layer 20 formed after the liquid molding material is cured is smooth, and the surface roughness of the reflective layer 20 can be controlled at 0.6 Rz/ ⁇ m.
  • the mass percentage of the leveling agent is 1.0%, the surface roughness of the reflective layer 20 formed after the liquid molding material is cured can be controlled to 0.4Rz/ ⁇ m, so that the ultrasonic fingerprint module 100 has an ultrasonic recognition efficiency Effectively improve.
  • the surface of the outermost conductive electrode 16 away from the piezoelectric layer 15 forms the bottom surface of the detection layer of the ultrasonic detection layer 10.
  • the liquid forming material may be formed on the conductive electrode 16 through a process such as vacuum evaporation, screen printing, spraying, or sputtering.
  • the length and width dimensions of the substrate layer 13 can be processed according to at least n times the required length and width design dimensions of the ultrasonic fingerprint module 100 to facilitate the placement on the substrate layer 13
  • the piezoelectric layer 15, the conductive electrode 16 and the reflective layer 20 are formed in sequence with a large area, a plurality of ultrasonic fingerprint modules 100 can be obtained in batches through cutting processing.
  • the pixel electrode layer 15, the piezoelectric layer 15, the conductive electrode 16, and the reflective layer 20 can be processed and shaped according to a plurality of preset ultrasonic fingerprint module 100 array layout areas, so as to reduce the batch acquisition of multiple ultrasonic fingerprint modules 100. Production costs.
  • the present application also provides a display screen assembly 200, the display screen assembly 200 includes a display screen 210 and the ultrasonic fingerprint module 100.
  • the display screen 210 has an outer surface 211 facing the user, the ultrasonic fingerprint module 100 is fixed in or under the screen of the display screen 210, and the reflective layer 20 is farther away from the outer surface than the ultrasonic detection layer 10 Surface 211.
  • the reflective layer 20 of the ultrasonic fingerprint module 100 is impermeable to visible light.
  • the ultrasonic fingerprint module 100 is fixed under the screen of the display screen 210, and the reflective layer 20 blocks the display light of the display screen 210 from exiting from the side away from the outer surface 211.
  • the display screen 210 is provided with an organic electroluminescent layer 212, and the ultrasonic detection layer 10 is laminated on the side of the organic electroluminescent layer 212 away from the outer surface 211.
  • the display screen 210 is provided with a glass cover 213.
  • the outer surface 211 is disposed on the glass cover plate 213.
  • the organic electroluminescent layer 212 is attached to the glass cover plate 213.
  • the base layer 13 of the ultrasonic detection layer 10 is attached to the organic electroluminescence layer 212.
  • the base layer 13 may constitute the base layer of the organic electroluminescent layer 212.
  • the substrate layer 13 may be attached to the organic electroluminescent layer 212 via a glue layer.
  • the display 210 is an OLED (Organic Light-Emitting Diode, organic light emitting diode) display 210. Utilizing the opaque performance of the reflective layer 20 of the ultrasonic fingerprint module 100, the reflective layer 20 can form the back plate of the display screen 210, which facilitates the display of images on the display screen 210.
  • the display screen 210 may be a flexible display screen.
  • the ultrasonic fingerprint module 100 can be bent and deformed with the display screen 210.
  • the ultrasonic detection layer 10 The piezoelectric layer 15 emits a first ultrasonic signal 01 toward the outer surface 211 and a second ultrasonic signal 02 toward the reflective layer 20.
  • the second ultrasonic signal 02 is reflected by the interface between the reflective layer 20 and the air to form a third ultrasonic signal 03.
  • the third ultrasonic signal 03 is also emitted toward the outer surface 211.
  • the third ultrasonic signal 03 and the first ultrasonic signal 01 can form a resonance, and are jointly emitted toward the outer surface 211 to enhance fingerprint recognition efficiency.
  • the thickness of the reflective layer 20 in the six display screen assemblies 200 is different from each other. Compare the SNR value of the ultrasonic fingerprint module 100 in the six display screen assemblies 200 and the acquired fingerprint image Resolution (LPMM) value. For example, the thickness of the reflective layer 20 in the six display screen assemblies 200 is 5 ⁇ m, 10 ⁇ m, 15 ⁇ m, 20 ⁇ m, 25 ⁇ m, and 30 ⁇ m, respectively, and the SNR values of the ultrasonic fingerprint module 100 in the six display screen assemblies 200 are tested.
  • the fingerprint image resolution (LPMM) values obtained by the ultrasonic fingerprint module 100 in the six display components 200 are 3.23, 3.32, 3.421, 3.594, 3.593, respectively , 3.6. It can be seen that when the thickness of the reflective layer 20 is 25 ⁇ m, the performance of the ultrasonic fingerprint module 100 of the display screen assembly 200 is better. That is, as a preferred embodiment, the thickness of the reflective layer 20 of the ultrasonic fingerprint module 100 can be set to 20 ⁇ m-30 ⁇ m.
  • FIGS. 6 and 7. In another embodiment, it is roughly the same as the embodiment shown in FIG. 6, except that the display screen 210 is provided with a liquid crystal panel 214 and a backlight module 215.
  • the backlight module 215 includes a backlight light guide plate 216 attached to the liquid crystal panel 214 and a backlight source 217 fixed to the side of the backlight light guide plate 216.
  • the ultrasonic detection layer 10 is attached to the backlight light guide plate 216 away from the liquid crystal Panel 214 side.
  • the liquid crystal panel 214 is attached to the glass cover 213.
  • the substrate layer 13 is attached to the backlight light guide plate 216.
  • the base layer 13 may constitute the base layer of the backlight light guide plate 216.
  • the reflective layer 20 can form the back plate of the backlight module 215, so that the liquid crystal panel 214 can capture the light of the backlight module 215, thereby realizing image display.
  • the backlight module 215 further includes a package bottom plate 218, which encapsulates the backlight source 217 and the backlight light guide plate 216, and the ultrasonic fingerprint module 100 It is fixed between the backlight light guide plate 216 and the package bottom plate 218.
  • the packaging bottom plate 218 protects the ultrasonic fingerprint module 100, and the packaging bottom plate 218 also encapsulates the backlight source 217 to prevent the backlight source 217 from leaking light.
  • the package bottom plate 218 may be a bendable metal plate. There is an assembly gap between the package bottom plate 218 and the ultrasonic fingerprint module 100 to increase the ultrasonic blocking rate of the reflective layer 20 and ensure the effectiveness of the ultrasonic fingerprint module 100 in identifying fingerprints.
  • the ultrasonic fingerprint module 100 can be embedded in the display screen 210, and the ultrasonic fingerprint module 100 is located In the non-display area of the display screen 210.
  • the glass cover plate 213 has a non-transparent area 2131.
  • the non-transmissive area 2131 of the glass cover 213 is composed of a reflective layer attached to the glass.
  • the non-transparent area 2131 of the glass cover 213 covers the ultrasonic fingerprint module 100 to ensure the appearance performance of the display screen 210 assembly 200.
  • the ultrasonic fingerprint module 100 is arranged in the non-display area of the display 210 assembly 200 to prevent the reflective layer 20 of the ultrasonic fingerprint module 100 from blocking the display light, so as to ensure the display area of the display 210 assembly 200 The display effect. There is a gap between the reflective layer 20 of the ultrasonic fingerprint module 100 and other layer structures of the display 210 assembly 200 to ensure that the reflective layer 20 blocks ultrasonic waves and ensures the fingerprint of the ultrasonic fingerprint module 100 Identify effectiveness.
  • FIG. 9 in another embodiment, it is substantially the same as the embodiment shown in FIG. 6, except that the display screen 210 is provided with a substrate 2101 attached to the organic electroluminescent layer 212, and the ultrasonic
  • the detection layer 10 includes a plurality of pixel electrodes 14, a piezoelectric layer 15 and a conductive electrode 16.
  • the plurality of pixel electrodes 14 are arranged in an array on the side of the substrate 2101 away from the glass cover plate 213, and the piezoelectric layer 15 Covering the plurality of pixel electrodes 14, the conductive electrode 16 is laminated on the side of the piezoelectric layer 15 away from the plurality of pixel electrodes 14, and the reflective layer 20 is printed and molded on the conductive electrode 16 away from the pressure One side of the electric layer 15.
  • the ultrasonic fingerprint module 100 is attached to the substrate 2101 of the display screen 210.
  • the display screen 210 is provided with the substrate 2101 of the liquid crystal panel 214, and the plurality of pixel electrodes 14 of the ultrasonic fingerprint module 100 can be formed on the substrate 2101 of the liquid crystal panel 214.
  • the present application also provides an electronic device 300, the electronic device 300 includes the display screen assembly 200, and the electronic device 300 further includes a back cover 310 and a main board 320.
  • the display screen 210 is covered with the rear cover 310.
  • the main board 320 is fixed between the back cover 310 and the display screen 210, and the main board 320 is electrically connected to the display screen 210 and the ultrasonic fingerprint module 100.
  • the main board 320 can receive the electrical signal of the ultrasonic fingerprint module 100 to identify the user's fingerprint image. It is understandable that the ultrasonic fingerprint module 100 can receive the fingerprint detection signal detected by the user's fingerprint, and the fingerprint detection signal detected by the user's fingerprint may be the initial detection signal transmitted by the ultrasonic fingerprint module 100.
  • the user's fingerprint may also be the initial detection signal transmitted by an external ultrasonic signal source to the user's fingerprint.
  • the electronic device 300 may be a mobile phone, a tablet computer, a notebook computer, a media player, etc., or a financial terminal device such as an automated teller machine (ATM).
  • ATM automated teller machine
  • the electronic device 300 disposes the ultrasonic fingerprint module 100 in the display screen 210, so that the electronic device 300 can meet the requirements of diversified fingerprint identification and improve the efficiency of fingerprint identification.

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Abstract

一种超声波指纹模(100)组及其制作方法和电子设备,所述超声波指纹模(100)组包括超声波检测层(10)和反射层(20),所述超声波检测层(10)具有超声波接收面(11),所述反射层(20)设置于所述超声波检测层(10)远离所述超声波接收面(11)的一面,所述反射层(20)用于对从所述超声波检测层(10)射出的超声波进行反射,所述反射层(20)含有消泡剂,所述消泡剂用以消除所述反射层(20)在制作过程中的气泡,以及消除最终形成的反射层(20)的气泡,通过所述消泡剂消除所述反射层(20)的气泡,使得所述反射层(20)的表面粗糙度有效降低,保证了所述反射层(20)对超声波信号的均匀反射,使得所述超声波指纹模组(100)的指纹识别效率提高。

Description

超声波指纹模组及其制作方法和电子设备 技术领域
本发明涉及指纹识别技术领域,尤其涉及一种超声波指纹模组及其制作方法和电子设备。
背景技术
目前超声波指纹模组通过从用户指纹谷区域反射回的超声波信号和从用户指纹脊区域反射回的超声波信号进行比对,来识别用户指纹。然而,在超声波指纹模组容易透过超声波信号的情况下,导致超声波指纹模组获取的超声波信号强度减小,难以区分的谷区域的超声波信号与脊区域的超声波信号差异,降低了指纹识别效率。
发明内容
本申请的目的在于提供一种提高指纹识别效率的超声波指纹模组及其制作方法和电子设备。
本申请提供了一种超声波指纹模组,其中,所述超声波指纹模组包括超声波检测层和反射层,所述超声波检测层具有超声波接收面,所述反射层设置于所述超声波检测层远离所述超声波接收面的一面,所述反射层用于对从所述超声波检测层射出的超声波进行反射,所述反射层含有消泡剂,所述消泡剂用以消除所述反射层在制作过程中的气泡,以及消除最终形成的反射层的气泡,通过所述消泡剂消除所述反射层的气泡,使得所述反射层的表面粗糙度有效降低,保证了所述反射层对超声波信号的均匀反射,使得所述超声波指纹模组的指纹识别效率提高。
其中,所述消泡剂为改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚的组合,使得所述反射层内无气泡,增大所述超声波指纹模组的指纹识别效率。
其中,所述改性二甲基硅烷在所述反射层的质量占比为0.8%~2.0%,。
其中,所述改性二甲基硅烷在所述反射层的质量占比为1.5%,以使得所 述反射层内无气泡,并提高所述超声波指纹模组的指纹识别性能。
其中,所述聚氧丙烯氧化乙烯甘油醚在所述反射层的质量占比为0.2%~1.0%,保证所述反射层内无气泡,且降低超声指纹模组的生产成本。
其中,所述聚氧丙烯氧化乙烯甘油醚在所述反射层的质量占比为0.5%,以使得所述反射层内无气泡,并提高所述超声波指纹模组的指纹识别性能。
其中,所述反射层含有碳粉和树脂材料,所述碳粉混入所述树脂材料中分子间的间隙,使得所述反射层的表面粗糙度降低。
其中,所述碳粉颗粒的平均粒径为0.8微米至2微米,更进一步地为1.0微米,使得所述反射层的粗糙度可进一步减小至0.41Rz/μm~0.82Rz/μm的范围。
其中,所述超声波检测层包括依次层叠设置的基材层、像素电极层、压电层和导电极,所述反射层设置于所述导电极远离所述压电层的一面,使得所述超声波指纹模组纤薄,方便所述超声波指纹模组应用于电子设备的显示屏中。
其中,所述超声波检测层包括两层或两层以上的所述导电极,方便成型所述超声波检测层,并且增加所述超声波检测层的信号导通性能。
其中,所述导电极的厚度为10微米至30微米,所述压电层的厚度为5微米至15微米,所述基材层的厚度为80微米至100微米,减小所述超声波指纹模生产成本,保证所述反射层的表面粗糙度。
其中,所述反射层的厚度为5微米至30微米,使得所述反射层的表面粗糙度有效降低,且所述超声波指纹模组获取的指纹图像清晰度有效改善。
其中,所述反射层的厚度为20微米至30微米,使得所述反射层的表面粗糙度进一步减小,所述超声波指纹模组获取的指纹图像清晰度进一步提高。
其中,所述反射层的厚度为25微米,使得所述反射层的表面粗糙度进一步地减小,并且所述超声波指纹模组的SNR值以及LPMM值更为优异。
本申请还提供了一种超声波指纹模组的制作方法,其中,
所述超声波指纹模组的制作方法包括步骤:
提供超声检测层,所述超声波检测层具有超声波接收面和相对所述超声波接收面设置的检测层底面;
提供含有消泡剂的液态成型材料,所述消泡剂用以消除所述液态成型材料的气泡;
将所述液态成型材料铺设于所述检测层底面上,待所述液态成型材料固化后形成反射层,所述反射层覆盖所述超声波检测层的超声波接收面,通过所述消泡剂消除所述反射层的气泡,使得所述反射层的表面粗糙度有效降低,保证了所述反射层对超声波信号的均匀反射,使得所述超声波指纹模组的指纹识别效率提高。
其中,所述液态成型材料还含有碳粉颗粒、树脂材料和流平剂,所述树脂材料、碳粉颗粒、流平剂和消泡剂混合搅拌后形成所述液态成型材料,使得所述反射层内无气泡,并且有效降低所述反射层的表面粗糙度,提高所述反射层对超声波信号的反射效率。
本申请还提供了一种电子设备,其中,所述电子设备包括上述的超声波指纹模组,使得所述电子设备可以满足多样化指纹识别要求,提高指纹识别效率。
附图说明
为了更清楚地说明本发明的技术方案,下面将对实施方式中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施方式,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1是本申请实施例提供的超声波指纹模组的示意图;
图2是本申请实施例提供的超声波指纹模组的另一示意图;
图3是本申请实施例提供的超声波指纹模组的另一示意图;
图4是本申请实施例提供的超声波指纹模组的制作方法的流程示意图;
图5是本申请实施例提供的显示屏组件的示意图;
图6是本申请实施例提供的显示屏组件的另一示意图;
图7是本申请另一实施例提供的显示屏组件的示意图;
图8是本申请另一实施例提供的显示屏组件的另一示意图;
图9是本申请另一实施例提供的显示屏组件的示意图;
图10是本申请另一实施例提供的显示屏组件的示意图;
图11是本申请实施例提供的电子设备的截面示意图。
具体实施方式
下面将结合本发明实施方式中的附图,对本发明实施方式中的技术方案进行清楚、完整地描述。
请参阅图1,本发明提供了一种超声波指纹模组100,所述超声波指纹模组100包括超声波检测层10和反射层20,所述超声波检测层10具有超声波接收面11,所述反射层20成型于所述超声波检测层10远离所述超声波接收面11的一面,所述反射层20可阻挡超声波从远离所述超声波检测层10的一面出射,并且可将从所述超声波检测层10传导过来的超声波信号反射至所述超声波检测层10。
可以理解的是,所述超声波指纹模组100可以利用超声波信号检测用户指纹,从而识别用户指纹图像。所述超声波指纹模组100可以应用于电子设备中,该电子设备可以是手机、平板电脑、笔记本电脑、媒体播放器等设备,也可以是自动柜员机(Automated Teller Machine,ATM)等金融终端设备。
通过在超声波指纹模组100的超声波检测层10上设置反射层20,利用反射层20可抵挡并反射超声波信号,使得超声波检测层10能够接收到的超声波信号加强,提高了超声波检测层10对超声波信号接收效率,提高了指纹识别效率。
本实施方式中,所述超声波检测层10可发送超声波信号,并可感应超声波信号,以实现识别用户指纹。所述超声波检测层10可朝远离所述反射层20一侧发射第一超声波信号01,以及朝所述反射层20发射第二超声波信号02。在所述超声波指纹模组100应用于电子设备中,当用户手指靠近于所述超声波指纹模组100背离所述反射层20一侧,所述第一超声波信号01朝向用户指纹发射,所述第二超声波信号02经所述反射层20抵挡并朝向所述超声波检测层10反射回形成第三超声波信号03。第三超声波信号03也是朝向用户指纹发射。所述第三超声波信号03与所述第一超声波信号01可形成共振后,共同朝向用户指纹发射。
可以理解的是,用户指纹接收到共振后的超声波信号后将超声波信号反 射回所述超声波检测层10,使得超声波检测层10感应到的指纹检测信号增强。所述超声波检测层10经所述超声波接收面11接收超声波检测信号,获取用户指纹图像。由于用户指纹存在波区域和谷区域,波区域和谷区域对超声波初始信号的反射率不同,经用户指纹反射的超声波检测信号存在可以反映波区域的波信号和可以反映谷区域的谷信号。将波信号与谷信号比对,通过获取波信号与谷信号的差异数据后进行处理,从而获取用户指纹图像。
本实施方式中,所述超声波检测层10在所述超声波指纹模组100所覆盖的区域大致形成指纹识别区域。所述超声波指纹模组100采用大面积的超声波检测层10,使得所述超声波指纹模组100的指纹识别区域的长度尺寸可以是30mm、宽度尺寸可以是20mm。所述超声波指纹模组100相较于目前具有较小指纹识别面积的指纹模组具有更大的指纹识别面积,可以适用于大面积的指纹解锁场景,以及可实现指纹盲解锁,以及方便利用指纹解锁控制电子设备程序启动等。例如所述超声波指纹模组100更加适用于全面屏手机中,满足大面积指纹识别需求。当然,在其他实施方式中,所述超声波指纹模组100的指纹识别区域的长度还可以是40mm或大于40mm、宽度尺寸可以是30mm或大于30mm。
本实施方式中,由于所述指纹识别模组100的指纹识别区域增大,导致所述指纹检测层10的面积增大,所述反射层20可以采用印刷工艺、或真空蒸镀工艺、或喷涂工艺等可大面积加工工艺成型于所述指纹检测层10上,以避免反射层20与指纹检测层10的交界面产生气泡,避免因气泡导致超声波反射效率不均匀,从而保证了指纹识别的有效性。所述反射层20可以是绝缘油墨。所述反射层20远离所述超声波检测层一面与空气接触,反射层20与空气的交界面形成超声波反射面,利用所述反射层20的声阻抗与空气的声阻抗存在差异,且差异越大,使得所述反射层20与空气的交界面对超声波反射率越高。而所述反射层20的声阻抗与弹性模量成正比,故所述反射层20的弹性模量越大,使得所述反射层20的声阻抗越大。本实施例通过设置所述反射层20的弹性模量与塑胶胶片的弹性模量大致相当,使得所述反射层20对超声波信号具有良好的屏蔽效果,以及使得所述反射层20与空气接触的交界面对超声波有良好的反射效率。所述反射层20对所述超声波检测层10发出 的超声波信号进行抵挡并反射,使得用户指纹接收到的超声波加强,使得所述超声波检测层10接收到从用户指纹反射回的超声波加强,提高超声波检测层10的识别效率。所述反射层20还具有与所述超声波检测层10进行防护的作用,保证所述超声波检测层10的安全性。所述反射层20还具有对从外部空气传导过来的超声波抵挡的性能,实现外界环境的超声波信号进行抵挡,防止环境超声波干扰所述超声波检测层10识别从用户指纹反射回的超声波信号,保证所述超声波检测层10识别用户指纹的精确性。
可以理解的是,所述反射层20设有树脂材料,例如所述反射层20设有丙烯酸树脂、聚酯类树脂、异氰酸酯树脂、酚氧树脂、环氧树脂的任意一种或多种组合材料。作为一种优选实施方式,所述反射层20设有环氧树脂材料。所述反射层20利用树脂材料具有绝缘性,以保证所述反射层20可以对所述超声波检测层进行绝缘防护的作用,以及利用固化的树脂材料具有与塑胶片相似的弹性模量,以保证所述反射层20具有与塑胶片大致相同的超声波反射效率。
在选用所述反射层20的用材过程中,可以将多种不同材质的反射层20经丝网印刷工艺成型于多组指纹检测层10上,以获得多组超声波指纹检测模组100的样品。通过对多组超声波指纹检测模组100的样品进行SNR(SIGNAL NOISE RATIO,信噪比)值检测,以获取多组超声波指纹检测模组100的样品SNR平均值,进而对多组SNR平均值比较后选出SNR平均值最优的反射层20用材。所述SNR值可以采用超声波指纹测试仪器测试。
具体的,提供第一组超声指纹模组100样品,该组样品的反射层20采用丙烯酸树脂。提供第二组超声波指纹模组100样品,该组样品的反射层20采用聚酯类树脂。提供第三组超声波指纹模组100样品,该组样品的反射层20采用丙烯酸树脂、异氰酸酯树脂和聚酯类树脂的混合树脂。提供第四组超声波指纹模组100样品,该组样品的反射层20采用酚氧树脂。提供第五组超声波指纹模组100样品,该组样品的反射层20采用环氧树脂1,环氧树脂1可以是常规环氧树脂。提供第六组超声波指纹模组100样品,该组样品的反射层20采用环氧树脂2,所述环氧树脂2与环氧树脂1的规格不同,所述环氧树脂2的CAS编号为38891-59-7。第一、第二、第三、第四、第五、第六组 样品的SNR平均值分别为8.10、3.77、7.38、8.54、8.89、10.33。第一组内样品的SNR值分别为8.10、8.75、8.85、7.48、7.45、7.89、8.16。第二组内样品的SNR值分别为3.77、3.89、3.87、3.22、3.93、4.08、3.61。第三组内样品的SNR值分别为7.38、8.18、7.09、7.75、7.39、6.84、7.02。第四组内样品的SNR值分别为8.54、8.65、9.01、8.76、7.68、8.68、8.46。第五组内样品的SNR值分别为8.89、8.89、8.33、8.07、9.69、8.94、9.40。第六组内样品的SNR值分别为10.33、9.63、10.47、10.99、10.56、10.03、10.32。进而得到,第一、第二、第三、第四、第五、第六组样品的SNR平均值分别为8.10、3.77、7.38、8.54、8.89、10.33。可见,第六组超声波指纹模组100样品的反射层20采用环氧树脂2,其SNR平均值最好,故选用环氧树脂2作为所述反射层20的用材,可以使得所述超声波指纹模组100的指纹识别效率较优。其中,环氧树脂1与环氧树脂2的区别在于规格不同。具体的,所述环氧树脂2的CAS编号为38891-59-7。
所述超声波检测层10具有与所述超声波接收面11相对的检测层底面12,所述反射层20经印刷工艺成型于所述检测层底面12。所述反射层20可以经TFT(Thin Film Transistor,薄膜晶体管)印刷工艺成型于所述检测层底面12。利用所述反射层20可以经印刷工艺成型,使得所述反射层20可以大面积成型,一次印刷成型多个所述超声波指纹模组100,并经裁剪后批量获得超声波指纹模组100,提高生产效率。具体的,首先成型大面积的超声波检测层10,然后在大面积的超声波检测层10上印刷成型大面积的反射层20,然后将大面积的超声波检测层10和大面积的反射层20一并裁剪形成多个超声波指纹模组100,实现超声波指纹模组100快速批量生产,降低生产成本,提高效率。
进一步地,所述反射层20通过向树脂材料中添加碳粉颗粒,以使所述反射层20呈现黑色外观效果。
本实施方式中,将树脂材料和碳粉混合后形成液态油墨,然后将液态的油墨经丝网印刷工艺成型于所述超声波指纹检测层10固化后形成所述反射层20。所述反射层20的弹性模量根据所述超声波检测层10所发出的超声波频率决定,以使得反射层20的弹性模量与超声波频率相匹配。通过设置所述反射层20的弹性模量,使得所述反射层20可以抵挡并反射超声波信号,以实 现所述超声波指纹模组100的指纹识别效率提高。所述反射层20由于含有黑色碳粉,所述反射层20呈现黑色外观视觉效果,使得所述反射层20可阻挡可见光透过,即所述反射层20可对所述超声波指纹检测层10进行掩盖,使得所述超声波指纹检测层10的外观缺陷不可见,提高超声波指纹模组100的外观性能。所述反射层20可由液态的印刷材料印刷成型层结构后再经固化工艺成型。具体的,首先,提供液态的树脂材料和混入液态树脂材料的黑色碳粉材料。然后,将混有黑色碳粉材料的液态树脂材料经印刷设备印刷成型于所述超声波检测层10的检测层底面12上。最后,将液态的呈层状结构的反射层20进行固化,以获得固态的反射层20。当然,在其他实施方式中,所述反射层20也可以是由绝缘胶和混入绝缘胶的白色碳粉、或红色碳粉、或绿色碳粉构成。所述反射层20也可以是由其他具有屏蔽超声波性能的材料混入有色颗粒构成。当然,在其他实施方式中,所述反射层20也可以是透明层,以方便所述超声波指纹模组100集成于显示屏中,保证显示屏的显示效果。
本实施方式中,所述反射层20中的碳粉颗粒可以填充树脂材料中树脂颗粒与颗粒之间的间隙,从而使得所述反射层20的表面粗糙度降低,使得所述反射层20的表面光滑。
具体的,所述反射层20具有远离所述指纹检测层10的第一表面201。所述第一表面201与空气接触。所述第一表面201光滑设置,所述第一表面201的粗糙度为0.2Rz/μm~6.0Rz/μm。例如,所述第一表面201的粗糙度可以是0.41Rz/μm、或0.68Rz/μm、或4.76Rz/μm、或5.25Rz/μm。所述反射层20具有与所述第一表面201相对的第二表面202。所述第二表面202与所述指纹检测层10贴合。所述第二表面202光滑设置,所述第二表面的粗糙度为0.2Rz/μm~6.0Rz/μm。例如,所述第一表面201的粗糙度可以是0.41Rz/μm、或0.68Rz/μm、或4.76Rz/μm、或5.25Rz/μm。所述第一表面201的粗糙度越小,使得所述第一表面201凹凸不平的程度越小,即所述第一表面越光滑,超声波在所述第一表面201的越不容易产生漫反射,超声波在所述第一表面201的反射方向约趋于一致,使得所述超声波检测层10接收到的超声波干扰信号越小,提高了所述超声波指纹模组100的指纹识别清晰度。同理,所述第二表面202的粗糙度越小,超声波在经过所述第二表面202越不易漫 反射,提高了所述超声波指纹模组100的指纹识别效率。
可以理解的是,所述反射层20中碳粉颗粒的平均粒径越大越容易导致所述反射层20的第一表面201的粗糙度增大和第二表面202的粗糙度增大,越容易造成所述第一表面201对超声波形成漫反射,以及容易造成所述第二表面202对超声波形成漫反射。因此,通过设置所述反射层20中碳粉颗粒的平均粒径大小以及设置所述反射层20中碳粉颗粒的比例,可以改善所述第一表面201的粗糙度和所述第二表面202的粗糙度。
本实施方式中,所述反射层20中碳粉颗粒的平均粒径为0.5微米至5微米。当所述反射层20中的碳粉颗粒的平均粒径为0.5微米时,所述反射层20的粗糙度可以降至最低,但所述超声波指纹模组100的OD值并非最佳。当所述反射层20中碳粉颗粒的平均粒径为5微米时,所述超声波指纹模组100的OD值较为优异,但所述反射层20的粗糙度并非最佳。作为一种较优的实施方式,所述反射层20中的碳粉颗粒平均粒径为0.8微米至2微米,更进一步地为1.0微米。可以理解是,所述反射层20的碳粉颗粒平均粒径为0.8微米时,所述反射层20的粗糙度可以与最小值近似,且所述超声波指纹模组100的OD值满足性能要求。所述反射层20的碳粉颗粒平均粒径为2微米时,所述超声波指纹模组100的OD值较为优异,且所述反射层20的粗糙度也可以较为减小。更进一步地,所述反射层20的碳粉颗粒平均粒径为1微米时,所述反射层20的粗糙度可以达到与最小值近似,且所述超声波指纹模组100的OD值及SNR值均可以较为优异。当然,所述反射层20中的碳粉颗粒的平均粒径也可以为近似1微米,所述反射层20的粗糙度可以与最小值近似,且超声波指纹模组100的OD值及SNR值也可以较为优异。
本实施方式中,所述碳粉颗粒在所述反射层20的质量占比为2.5%~15%。当所述碳粉颗粒在所述反射层20中的质量占比为2.5%时,所述反射层20的粗糙度可以降至最低,但所述超声波指纹模组100的OD值并非最佳。当所述碳粉颗粒在所述反射层20的质量占比为15%时,所述超声波指纹模组100的OD值较高,但所述反射层20的粗糙度并非最小。作为一种较优的实施方式,所述碳粉颗粒在所述反射层的质量占比为3.0%~10%,更进一步地为5%。可以理解是,所述碳粉颗粒在所述反射层20中的质量占比为3.0%时,所述反 射层20的粗糙度可以与最小值近似,且所述超声波指纹模组100的OD值满足性能要求。所述碳粉颗粒在所述反射层20中的质量占比为10%时,所述超声波指纹模组100的OD值满足要求,且所述反射层20的粗糙度也可以较为减小。更进一步地,所述碳粉颗粒在所述反射层20中的质量占比为5%时,所述反射层20的粗糙度可以达到与最小值近似,且所述超声波指纹模组100的OD值及SNR值均可以较为优异。当然,所述反射层20中碳粉颗粒的质量占比可以为近似5%,所述反射层20的粗糙度可以与最小值近似,且超声波指纹模组100的OD值及SNR值也可以较为优异。
为了进一步改善所述第一表面201的粗糙度和所述第二表面202的粗糙度。所述反射层20制备过程中加入有流平剂,以利用流平剂的表面消泡、表面平整控制及表面流平性较好的性能,使得所述反射层20的表面粗糙度有效降低。即所述反射层20还含有流平剂,所述流平剂用以提高在制作过程中及最终形成的反射层的流平性。所述流平剂在所述反射层20的质量占比可以是0.2%~1.5%。当所述流平剂在所述反射层的质量占比为0.2%时,所述反射层20的表面流平性可以有效改善,初步实现降低所述反射层20的表面粗糙度。在所述流平剂的种类单一的情况下,当所述流平剂在所述反射层的质量占比为1.5%时,所述反射层20的表面稳定性可以有效提高,进而使得所述反射层20的表面粗糙度可以有效降低,但所述超声波指纹模组100的OD值并非较佳,即所述反射层20的表面粗糙度与流平剂在所述反射层20的质量占比成正关系,而所述超声波指纹模组100的OD值与流平剂在所述反射层20的质量占比成负关系。所述流平剂包括氟碳化合物类流平剂,以保证所述反射层的基材润湿性和防缩孔能力。所述氟碳化合物类流平剂为氟碳有机改性硅氧烷。作为一种较优的实施方式,所述流平剂还包括聚醚硅氧烷共聚物。即所述流平剂为氟碳有机改性硅氧烷和聚醚硅氧烷共聚物的混合物。所述氟碳有机改性硅氧烷在所述反射层20的质量占比可以是0.1%~0.75%,所述聚醚硅氧烷共聚物在所述反射层20的质量占比可以是0.1%~0.75%。所述氟碳有机硅氧烷在所述反射层20的质量占比为0.1%,所述聚醚硅氧烷共聚物在所述反射层20的质量占比为0.1%,即所述流平剂在所述反射层20的质量占比为0.2%,可以初步降低所述反射层20的表面粗糙度,且所述氟碳有机硅氧烷与 聚醚硅氧烷共聚物有效互补,使得所述反射层20的表面稳定性可以进一步提高。所述所述氟碳有机硅氧烷在所述反射层20的质量占比为0.75%,所述聚醚硅氧烷共聚物在所述反射层20的质量占比为0.75%,即所述流平剂在所述反射层20的质量占比为1.5%,所述反射层20的表面粗糙度极大减小,并且所述超声波指纹模组100的SNR值和OD值也有效提高。
优选地,所述氟碳有机改性硅氧烷在所述反射层的质量占比为0.2%~0.6%%,更进一步地为0.5%。所述聚醚硅氧烷共聚物的质量占比为0.2%~0.6%,更进一步地为0.5%时,所述流平剂对所述反射层20的表面稳定性控制力最佳,使得所述反射层20的粗糙度可以极大减小,且使得所述超声波指纹模组的SNR值和OD值可以进一步增大。可以理解的是,聚醚硅氧烷共聚物与氟碳硅氧烷之间有较好的互补性,聚醚硅氧烷共聚物表面状态控制能力强,表面流平性好,同时有一定消泡效果。所述反射层20的流平性较好,表面光滑,表面粗糙度可控制在小于<0.5Rz/μm,所述超声波指纹模组100的指纹识别效率提高。
提供第一实施例,所述反射层20中设置碳粉颗粒的粒度分布50%的平均粒径为5μm。所述反射层20中碳粉质量占比为15%。所述反射层20中流平剂采用氟碳有机改性硅氧烷。所述反射层20中流平剂质量占比为0.2%。利用粗糙度测试仪对本实施例中的超声波指纹模组100的反射层20进行粗糙度测试,测试结果为所述反射层20的粗糙度为5.25Rz/μm。采用超声波指纹功能测试仪对本实施例中的超声波指纹模组100进行SNR值测试,获得SNR值为9.45。采用光学密度仪对本实施例中的超声波指纹模组100的OD(optical density,光密度)值测试,获得OD值为6.1。
提供第二实施例,与第一实施例不同的是,降低所述反射层20中的碳粉质量比例。所述反射层20中设置碳粉颗粒的粒度分布50%的平均粒径为5μm。所述反射层20中碳粉质量占比为10%。所述反射层20中流平剂采用氟碳有机改性硅氧烷。所述反射层20中流平剂质量占比为0.2%。所述反射层20的粗糙度为5.04Rz/μm。所述超声波指纹模组100的SNR值为9.52。所述超声波指纹模组100的OD值为5.3。可见,降低所述反射层20的碳粉比例,可降低所述反射层20的表面粗糙度。
可以理解的是,当所述超声波指纹模组100的OD值大于4时,所述超声波指纹模组100的性能较为良好。
提供第三实施例,与第二实施例不同的是,继续降低所述反射层20中的碳粉质量比例。所述反射层20中设置碳粉颗粒的粒度分布50%的平均粒径为5μm。所述反射层20中碳粉质量占比为5%。所述反射层20中流平剂采用氟碳有机改性硅氧烷。所述反射层20中流平剂质量占比为0.2%。所述反射层20的粗糙度为4.76Rz/μm。所述超声波指纹模组100的SNR值为9.65。所述超声波指纹模组100的OD值为4.6。可见,降低所述反射层20中碳粉质量占比,虽然可降低所述反射层20的表面粗糙度,并且提高所述超声波指纹模组100的SNR值,但是也会降低所述超声波指纹模组100的OD值。
提供第四实施例,与第三实施例不同的是,继续降低所述反射层20中的碳粉质量占比。所述反射层20中设置碳粉颗粒的粒度分布50%的平均粒径为5μm。所述反射层20中碳粉质量占比为2.5%。所述反射层20中流平剂采用氟碳有机改性硅氧烷。所述反射层20中流平剂质量占比为0.2%。所述反射层20的粗糙度为4.42Rz/μm。所述超声波指纹模组100的SNR值为9.7。所述超声波指纹模组100的OD值为3.7。可见,当所述反射层20中碳粉质量占比降低至2.5%时,所述超声波指纹模组100的OD值也降低至3.7,超声波指纹模组100已经不满足良好性能要求。
提供第五实施例,与第四实施例不同的是,将所述反射层20的中碳粉的平均粒径减小。所述反射层20的碳粉颗粒的粒度分布50%的平均粒径为0.5μm。所述反射层20的碳粉颗粒的粒度分布100%的平均粒径小于1μm。所述反射层20中碳粉质量占比为5%。所述反射层20中流平剂采用氟碳有机改性硅氧烷。所述反射层20中流平剂质量占比为0.2%。所述反射层20的粗糙度为0.82Rz/μm。所述超声波指纹模组100的SNR值为10.25。所述超声波指纹模组100的OD值为4.3。可见,当所述反射层20中碳粉平均粒径减小,可明显降低所述反射层20的表面粗糙度,且可以保证所述超声波指纹模组100的SNR值较高,以及所述超声波指纹模组100的OD值也满足良好性能要求,即所述超声波指纹模组100的性能有明显改善。
提供第六实施例,与第五实施例不同的是,增加所述反射层20中的流平 剂比例。所述反射层20的碳粉颗粒的粒度分布50%的平均粒径为0.5μm。所述反射层20的碳粉颗粒的粒度分布100%的平均粒径小于1μm。所述反射层20中碳粉质量占比为5%。所述反射层20中流平剂采用氟碳有机改性硅氧烷。所述反射层20中流平剂质量占比为0.7%。所述反射层20的粗糙度为0.68Rz/μm。所述超声波指纹模组100的SNR值为10.35。所述超声波指纹模组100的OD值为4.4。可见,当所述反射层20中流平剂质量占比增大,所述反射层20的表面粗糙度也会减小,所述超声波指纹模组100的SNR值会增大。所述超声波指纹模组100的OD值也会增大。
提供第七实施例,与第六实施例不同的是,所述反射层20中的流平剂为混合两种不同型号的流平剂。具体的,所述反射层20的碳粉颗粒粒度分布50%的平均粒径为0.5μm。所述反射层20的碳粉颗粒的粒度分布100%的平均粒径小于1μm。所述反射层20中碳粉质量占比为5%。所述反射层20中流平剂采用氟碳有机改性硅氧烷和聚醚硅氧烷共聚物的混合流平剂。所述反射层20中氟碳有机改性硅氧烷的质量占比为0.5%。所述反射层20中聚醚硅氧烷共聚物的质量占比为0.5%。所述反射层20的粗糙度为0.41Rz/μm。所述超声波指纹模组100的SNR值为10.55。所述超声波指纹模组100的OD值为4.3。可见,氟碳有机改性硅氧烷属于氟碳化合物类流平剂,具有良好的基材润湿性和防缩孔能力强,但此流平剂容易稳泡,起泡难消失。经过在所述反射层20的成型材料中添加各种流平剂,发现聚醚硅氧烷共聚物与氟碳硅氧烷之间有较好的互补性,聚醚硅氧烷共聚物表面状态控制能力强,表面流平性好,同时有一定消泡效果。所述反射层20的成型材料中加入了聚醚硅氧烷共聚物与氟碳硅氧烷后流平性较好,表面光滑,且所述反射层20的表面粗糙度可控制在小于0.5Rz/μm。
可以理解的是,若所述反射层20存在气泡,则因气泡的超声波声阻抗非常小,导致超声波信号穿透、反射经过气泡时信号强度大大衰减甚至没有,即超声波检测层10在与反射层20中气泡所对应的位置信号接收强度与其他区域有明显差别,造成获取的指纹图像有噪点,即获取的指纹图像不清晰。因此,通过改善所述反射层20气泡,可以改善所述超声波指纹模组100获取指纹图像清晰度。
为了进一步减少所述反射层20中的气泡数量。所述反射层20的成型材料中加入有消泡剂,以利用消泡剂的消泡性能,使得所述反射层20气泡数量降低。即所述反射层20还含有消泡剂,所述消泡剂用以消除所述反射层在制作过程中的气泡,以及消除最终形成的反射层的气泡。所述消泡剂可以是改性二甲基硅烷,所述消泡剂还可以是聚氧丙烯氧化乙烯甘油醚。作为一种较优的实施方式,所述消泡剂可以是改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚的混合物。所述改性二甲基硅烷的质量占比可以是0.8%~2.0%,所述聚氧丙烯氧化乙烯甘油醚的质量占比可以是0.2%~1.0%。当所述氟碳有机改性硅氧烷的质量占比为1.5%,所述聚醚硅氧烷共聚物的质量占比为0.5%时,所述反射层20无气泡,且所述超声波指纹模组制作成本降低。
提供第八实施例,所述反射层20设置有消泡剂。具体的,所述反射层20中碳粉质量占比为15%。所述反射层20中消泡剂为改性二甲基硅烷。所述反射层20中消泡剂的质量占比为0.5%。所述反射层20的成型材料加入了消泡剂搅拌后存在大量气泡,将所述反射层20搅拌后的成型材料经网印工艺印刷成型于所述指纹检测层10后,所述反射层20仍存在大量气泡。所述超声波指纹模组100的OD值为6.1。
提供第九实施例,与第八实施例不同的是,将所述反射层20的碳粉质量占比降低,并提高所述反射层20中消泡剂的质量占比。具体的,所述反射层20中碳粉质量占比为10%。所述反射层20中消泡剂为改性二甲基硅烷。所述反射层20中消泡剂的质量占比为0.8%。所述反射层20的成型材料加入了消泡剂搅拌后存在少量气泡,将所述反射层20搅拌后的成型材料经网印工艺印刷成型于所述指纹检测层10后,所述反射层20仍存在少量气泡。所述超声波指纹模组100的OD值为5.3。可见,所述反射层20中碳粉质量占比越高,所述反射层20在制备过程中越容易产生气泡。而通过降低所述反射层20中的碳粉质量占比,以及提高所述反射层20中消泡剂的质量占比,可以改善反射层20中的气泡含量。
提供第十实施例,与第九实施例不同的是,将所述反射层20中碳粉质量占比继续降低,并继续提高所述反射层20中消泡剂质量占比。具体的,所述反射层20中碳粉质量占比为5%。所述反射层20中消泡剂为改性二甲基硅 烷。所述反射层20中消泡剂的质量占比为1.5%。所述反射层20的成型材料加入了消泡剂搅拌后存在极少量气泡,将所述反射层20搅拌后的成型材料经网印工艺印刷成型于所述指纹检测层10后,所述反射层20仍极存在少量气泡。所述超声波指纹模组100的OD值为4.6。可见,通过降低所述反射层20中的碳粉占比,以及提高所述反射层20中消泡剂的质量占比,可以明显改善反射层20中的气泡含量,但同时也会明显降低所述超声波指纹模组100的OD值,容易导致超声波指纹模组100的性能降低。
提供第十一实施例,与第十实施例不同的是,所述反射层20中碳粉质量占比继续降低,并继续提高所述反射层20中消泡剂的质量占比。具体的,所述反射层20中碳粉的质量占比为2.5%。所述反射层20中消泡剂为改性二甲基硅烷。所述反射层20中消泡剂的质量占比为2.0%。所述反射层20的成型材料加入了消泡剂搅拌后存在极少量气泡,将所述反射层20搅拌后的成型材料经网印工艺印刷成型于所述指纹检测层10后,所述反射层20仍极存在少量气泡。所述超声波指纹模组100的OD值为3.7。所述反射层20中消泡剂的质量占比为2.0%的情况下,所述反射层20明显出现缩孔。可见,所述反射层20中消泡剂的质量占比大于2.0%的情况下所述反射层20无法满足使用要求。反射层20中碳粉的质量占比大于或等于5%,所述反射层20中消泡剂的质量占比增大至大致在1.5%,才能使得所述超声波指纹模组100的OD值满足最低要求,但是仍无法确保所述反射层20无气泡。
提供第十二实施例,与第十一实施例不同的是,所述反射层20中消泡剂包含了两种不同型号的消泡剂。具体的,所述反射层20中碳粉质量占比为5%。所述反射层20中消泡剂为改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚的混合。所述反射层20中改性二甲基硅烷的质量占比为1.5%。所述反射层20中聚氧丙烯氧化乙烯甘油醚的质量占比为0.2%。所述反射层20的成型材料加入了消泡剂搅拌后无气泡,将所述反射层20搅拌后的成型材料经网印工艺印刷成型于所述指纹检测层10后,所述反射层20仍存在极少量气泡。所述超声波指纹模组100的OD值为4.5。可见,通过所述反射层20中消泡剂包含了改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚,可以使得所述反射层20在制备过程中气泡含量明显改善,且所述超声波指纹模组100的OD值也满足性能 要求,但最终成型的所述反射层20中仍存在极少量气泡。
提供第十三实施例,与第十二实施例不同的是,增加所述反射层20的成型材料中聚氧丙烯氧化乙烯甘油醚的质量占比。具体的,所述反射层20中碳粉质量占比为5%。所述反射层20中消泡剂为改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚的混合。所述反射层20中改性二甲基硅烷的质量占比为1.5%。所述反射层20中聚氧丙烯氧化乙烯甘油醚的质量占比为0.5%。即所述反射层20中的消泡剂质量占比为2.0%。所述反射层20的成型材料加入了消泡剂搅拌后无气泡,将所述反射层20搅拌后的成型材料经网印工艺印刷成型于所述指纹检测层10后,所述反射层20无气泡。所述超声波指纹模组100的OD值为4.6。可见,通过所述反射层20中消泡剂包含了改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚,且提高聚氧丙烯氧化乙烯甘油醚的质量占比后,可以使得所述反射层20在制备过程中无气泡,最终成型的所述反射层20无气泡,所述超声波指纹模组100的OD值也满足性能要求,使得所述超声波指纹模组100的性能明显改善。
提供第十四实施例,与第十三实施例不同的是,继续增加所述反射层20中聚氧丙烯氧化乙烯甘油醚的质量占比。具体的,所述反射层20中碳粉质量占比为5%。所述反射层20中消泡剂为改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚的混合。所述反射层20中改性二甲基硅烷的质量占比为1.5%。所述反射层20中聚氧丙烯氧化乙烯甘油醚的质量占比为1.0%。所述反射层20的成型材料加入了消泡剂搅拌后无气泡,将所述反射层20搅拌后的成型材料经网印工艺印刷成型于所述指纹检测层10后,所述反射层20无气泡。所述超声波指纹模组100的OD值为4.6。
进一步地,请参阅图2,所述超声波检测层10包括基材层13、多个像素电极14、压电层15和导电极16,所述多个像素电极14阵列排布于所述基材层13,所述压电层15覆盖所述多个像素电极14,所述导电极16层叠于所述压电层15远离所述多个像素电极14的一面,所述反射层20印刷成型于所述导电极16远离所述压电层15的一面。
本实施方式中,所述基材层13可以由玻璃或聚酰亚胺薄膜材料制成。所述基材层13的成本较低、透光性较好,方便所述超声波指纹模组100集成于 电子设备的显示屏中。当所述超声波指纹模组100集成在显示屏内时,具有较好的透光性的超声波指纹模组100不会遮挡显示屏90的显示图像,同时集成在显示屏90内的超声波指纹模组100能够保持显示屏90的整体颜色一致而提高显示屏90的外观性能。
本实施方式中,多个所述像素电极14可以经TFT印刷工艺成型于所述基材层13上,并且呈阵列分布。所述像素电极14的材料为氧化铟锡(Indium tin oxide,ITO)、纳米银线(Agnanowire)、金属网格(metal mesh)、纳米碳管以及石墨烯(Graphene)中的任意一种,由上述材料制成的像素电极14具有较好的韧性及透光性。使得由所述像素电极14制成的超声波指纹模组100具有较好的韧性及透光性。所述像素电极14的透光率大于90%,使该像素电极14制成的超声波指纹模组100具有较好的透光性。所述像素电极14可用于接收电信号,每个像素电极14能够根据接收到的电信号确定所述超声波指纹模组100的一个位置,所述像素电极14在所述基材层13上的密度与所述超声波指纹模组100的指纹采集精度正相关。所述多个像素电极14的阵列排布的密集性,保证了所述超声波传感器检测到待检测物的指纹影像精确性。
本实施方式中,所述超声波接收面11设置于所述压电层15朝向所述基材层13一侧。所述压电层15层叠在所述基材层13上并覆盖所述多个像素电极14。所述压电层15为压电材料制成的片状结构。所述压电层15的形状与所述基材层13的形状相匹配。所述压电层15的材料为聚偏氟乙烯(Polyvinylidene fluoride,PVDF)。由于聚偏氟乙烯具有较好的韧性及透光性,使得所述压电层15具有较好的柔韧性及透光性,保证了所述超声波指纹模组100的柔韧性及透光性。所述压电层15在高频电压(例如:频率大于20KHZ的电压)作用下能够产生超声波。所述压电层15接收到待检测物反射的超声波后,所述压电层15在超声波作用下会产生电信号(或压电信号),待检测物可以为手指、测试模板等。
本实施方式中,所述导电极16为导电材料制成的整体的层状结构。所述导电极16的形状与所述压电层15的形状相匹配。所述导电极16的材质可以是银材料。所述导电极16可以经银浆固化后成型。所述导电极16的透光率大于90%。所述导电极16与所述像素电极14通高频电压后能够给所述压电 层15施加高频电压,从而使所述压电层15产生超声波信号,以方便利用超声波信号检测用户指纹。所述导电极16与所述像素电极14还能够接收所述压电层15产生的电信号。所述检测层底面12设置于所述导电极16远离所述压电层15的一面。所述反射层20对所述导电极16覆盖,可防止所述导电极16氧化。所述反射层20还可以遮盖所述导电极16上的外观缺陷。
本实施方式中,所述导电极16的厚度为10微米至30微米,所述压电层15的厚度为5微米至15微米,所述基材层13的厚度为80微米至100微米。所述反射层20的厚度为7微米至30微米。利用所述超声波指纹模组100的纤薄性能,方便所述超声波指纹模组100集成于电子设备的显示屏中。
可以理解的是,所述反射层20印刷成型于所述指纹检测层10上,即所述反射层20印刷成型于所述导电极16上。所述导电极16的表面粗糙度对所述反射层20的第一表面201的粗糙度存在影响。
经过测试将不同厚度的反射层20成型于表面粗糙度较小的玻璃基层上,并测量成型后的反射层20的表面粗糙度,发现成型后的反射层20表面粗糙度受反射层20的厚度影响并不大。例如,在玻璃基层上分别成型膜厚为5μm、10μm、15μm、20μm、25μm、30μm的反射层20,成型后的所述反射层20的表面粗糙度分别为0.375Rz/μm、0.355Rz/μm、0.335Rz/μm、0.315Rz/μm、0.316Rz/μm、0.322Rz/μm。
经过测试,将多个不同厚度的反射层20分别成型于多个指纹检测层10上,并最终获取多个所述超声波指纹模组100,对所述超声波指纹模组100的反射层20的表面粗糙度进行测量,发现所述反射层20的厚度越厚,所述反射层20的表面粗糙度越小,且所述反射层20的厚度大致为25μm时,所述反射层20的表面粗糙度不随所述反射层20的厚度减小而减小,即所述反射层20的表面粗糙度趋于稳定不再减小。
在一个实施例中,设置六个所述指纹检测层10朝向所述反射层20的表面粗糙度在3.5Rz/μm~4.5Rz/μm。六个所述指纹检测层10中基材层13的厚度为90μm、压电层15的厚度为9μm、导电极16的厚度为15~18μm。六个指纹检测层10上分别成型膜厚为5μm、10μm、15μm、20μm、25μm、30μm的六个反射层20,成型后的六个所述反射层20的表面粗糙度经检 测分别为1.712Rz/μm、1.06Rz/μm、0.72Rz/μm、0.527Rz/μm、0.309Rz/μm、0.324Rz/μm。显然,所述反射层20的厚度在20μm~30μm时,所述超声波指纹模组100的反射层20的表面粗糙度较小,所述超声波指纹模组100的性能优异。
在另一个实施例中,如图3所示,所述反射层20设有多层子反射层22,多层子反射层22依次反射层叠设置。
本实施方式中,所述反射层20经多道印刷步骤成型,每一道印刷步骤形成每一所述子反射层22。每一所述子反射层22固化形成后,再形成另一所述子反射层22。每一所述子反射层22的厚度可以相同设置。通过对每一所述子反射层22的表面粗糙度进行精确控制,可以使得所述反射层20最终成型后表面粗糙度更加优异,以保证所述超声波指纹模组100的性能优异。
请参阅图4,本申请提供一种超声波指纹模组制作方法,该制作方法包括步骤:
101:提供超声波检测层10。
本实施方式中,首先,成型基材层13。所述基材层13可以是玻璃或聚酰亚胺薄膜材料制成。所述基材层13具有较好的机械强度,以方便所述基材层13上成型其他结构部件,以及方便所述超声波指纹膜100与电子设备的壳体或电子设备的显示屏背部稳固连接。所述基材层13的长宽尺寸可以按照所需的超声波指纹模组100的长宽设计尺寸进行制作,以使得所制作的超声波指纹模组100的长宽尺寸满足规格要求。
然后,在所述基材层13上成型像素电极层。所述像素电极层由多个像素电极14构成。所述像素电极层的长宽尺寸与所述基材层13的长宽尺寸大致相同。所述像素电极层的多个像素电极14可以经TFT印刷工艺成型于所述基材层13上。所述像素电极14的材料为氧化铟锡(Indium tin oxide,ITO)、纳米银线(Agnanowire)、金属网格(metal mesh)、纳米碳管以及石墨烯(Graphene)中的任意一种,由上述材料制成的像素电极14具有较好的韧性及透光性。
再然后,在所述像素电极层上成型压电层15。所述压电层15的长宽尺寸大致与所述像素电极层的长宽尺寸相同。所述压电层15覆盖所述多个像素电极14。所述压电层15为压电材料制成的片状结构。所述压电层15的形状与 所述基材层13的形状相匹配。所述压电层15的材料为聚偏氟乙烯(Polyvinylidene fluoride,PVDF)。由于聚偏氟乙烯具有较好的韧性及透光性,使得所述压电层15具有较好的柔韧性及透光性,保证了所述超声波指纹模组100的柔韧性及透光性。
再然后,在所述压电层15上成型导电极16。所述导电极16的长宽尺寸与所述像素电极层的长宽尺寸相同,以实现所述导电极16与所述像素电极层匹配。所述导电极16可以是丝网印刷工艺成型于所述压电层15上。所述导电极16为导电材料制成的整体的层状结构。所述导电极16的形状与所述压电层15的形状相匹配。所述导电极16的材质可以是银材料。所述导电极16可以经银浆固化后成型。所述压电层15上可以成型两层或两层以上的所述导电极16,以使得最外层的所述导电极16远离所述压电层15的表面粗糙度更小,即使得所述超声波检测层10的检测层底面更加光滑。
102:提供含有消泡剂的液态成型材料。
本实施方式中,所述液态成型材料还含有树脂材料和碳粉颗粒,所述树脂材料可以是丙烯酸树脂、聚酯类树脂、异氰酸酯树脂、酚氧树脂、环氧树脂的任意一种树脂材料或多种组合树脂材料。作为一种较优实施方式,所述液态成型材料由环氧树脂和碳粉颗粒混合搅拌后形成。所述液态成型材料可以是油墨。
更进一步地,所述液态成型材料中还含有流平剂。即将环氧树脂、碳粉颗粒、消泡剂、流平剂混合搅拌后形成所述液态成型材料。
通过液态成型材料含有消泡剂可以有效减少所述反射层20的气泡数量,提高所述反射层20对超声波的反射效率。所述消泡剂可以是改性二甲基硅烷、或聚氧丙烯氧化乙烯甘油醚,或者是改性二甲基硅烷与聚氧丙烯氧化乙烯甘油醚的混合消泡剂。所述消泡剂在所述反射层20的质量占比为1.0%~3.0%。作为一种较优实施方式,所述消泡剂在所述反射层20的质量占比在1.5%~2.5%。当所述消泡剂在所述反射层20的质量占比在1.5%,使得所述液态成型材料在搅拌后可以存在较少量气泡,并且使得所述液态成型材料固化后所形成的反射层20也具有较少量气泡,所述超声波指纹模组100满足指纹识别需求。当所述消泡剂在所述反射层20的质量占比为2.5%可以有效消除搅 拌后的液态成型材料中气泡,并且可以使得液态成型材料固化后形成的反射层20也不含气泡,设有该反射层20的超声波指纹模组100性能优异,指纹识别效率高。
通过液态成型材料含有流平剂可以有效降低所述反射层20的表面粗糙度,提高所述反射层20对超声波的反射效率。所述流平剂可以是氟碳有机改性硅氧烷、或聚醚硅氧烷共聚物,或者是氟碳有机改性硅氧烷与聚醚硅氧烷共聚物的混合流平剂。所述流平剂在所述反射层20的质量占比为0.2%~1.5%。作为一种较优实施方式,所述流平剂在所述反射层20的质量占比在0.5%~1.0%。当所述流平剂在所述反射层20的质量占比在0.5%时,所述液态成型材料固化后所形成的反射层20表面光滑,所述反射层20的表面粗糙度可以控制在0.6Rz/μm。当所述流平剂的质量占比在1.0%时,所述液态成型材料固化后所形成的反射层20表面粗糙度可控制在0.4Rz/μm,使得所述超声波指纹模组100超声波识别效率有效提高。
103:将所述液态成型材料铺设于所述超声波检测层10的检测层底面,待所述液态成型材料固化后形成反射层20,所述反射层20覆盖所述超声波检测层10的超声波接收面。
本实施方式中,最外层的所述导电极16远离所述压电层15的表面形成所述超声波检测层10的检测层底面。所述液态成型材料可以是经真空蒸镀、或丝网印刷、或喷涂、或溅射等工艺成型于所述导电极16上。
在另一个实施例中,所述基材层13的长宽尺寸可以是按照至少n倍于所需的超声波指纹模组100的长宽设计尺寸进行加工,以方便在所述基材层13上依次成型大面积的所述像素电极层14、压电层15、导电极16和反射层20后,通过裁切加工可以批量获得多个超声波指纹模组100。像素电极层15、压电层15、导电极16和反射层20可以按照多个预设的超声波指纹模组100阵列排布区域进行加工成型,以减小批量获取多个超声波指纹模组100的制作成本。
请参阅图4,本申请还提供一种显示屏组件200,所述显示屏组件200包括显示屏210和所述超声波指纹模组100。所述显示屏210具有朝向用户的外表面211,所述超声波指纹模组100固定于所述显示屏210的屏内或屏下,所 述反射层20相对所述超声波检测层10远离所述外表面211。
请参阅图5,在一个实施例中,所述超声波指纹模组100的反射层20对可见光不可透过。所述超声波指纹模组100固定于所述显示屏210的屏下,所述反射层20阻挡所述显示屏210的显示光线从远离所述外表面211的一面出射。
具体的,所述显示屏210设有有机电致发光层212,所述超声波检测层10层叠于所述有机电致发光层212远离外表面211的一面。所述显示屏210设有玻璃盖板213。所述外表面211设置于所述玻璃盖板213。所述有机电致发光层212贴合于所述玻璃盖板213。所述超声波检测层10的基材层13贴合于所述有机电致发光层212。所述基材层13可以构成所述有机电致发光层212的基层。所述基材层13可以是经胶水层贴合于所述有机电致发光层212。所述显示屏210为OLED(Organic Light-Emitting Diode,有机发光二极管)显示屏210。利用所述超声波指纹模组100的反射层20不透光性能,使得所述反射层20可以形成所述显示屏210的背板,方便所述显示屏210显示图像。所述显示屏210可以是柔性显示屏。所述超声波指纹模组100可随所述显示屏210弯曲形变。
可以理解的是,通过设置所述指纹检测层10贴合所述反射层20的一面至所述外表面211的距离,以及设置所述超声波检测层10发射超声波频率,所述超声波检测层10的压电层15朝所述外表面211发射第一超声波信号01,并朝所述反射层20发射第二超声波信号02。所述第二超声波信号02经所述反射层20与空气接触的交界面反射形成第三超声波信号03。第三超声波信号03也是朝向所述外表面211发射。所述第三超声波信号03与所述第一超声波信号01可形成共振,并共同朝向所述外表面211发射,以增强指纹识别效率。
经测试,提供六个显示屏组件200,六个显示屏组件200中反射层20的厚度互不相同,比较六个所述显示屏组件200中超声波指纹模组100的SNR值和获取的指纹图像分辨率(LPMM)值。例如,提供六个所述显示屏组件200中反射层20的厚度分别为5μm、10μm、15μm、20μm、25μm、30μm,经测试六个所述显示屏组件200中超声波指纹模组100的SNR值分别为4.571、4.9、5.308、5.859、6.105、5.72,六个所述显示屏组件200中超声 波指纹模组100所获取的指纹图像分辨率(LPMM)值分别为3.23、3.32、3.421、3.594、3.593、3.6。可见,所述反射层20的厚度为25μm时,所述显示屏组件200的超声波指纹模组100的性能较优异。即作为一种较优实施方式,可以将所述超声波指纹模组100的反射层20厚度设置为20μm~30μm。
请参阅图6和图7,在另一个实施例中,与图6所示实施例大致相同,不同的是,所述显示屏210设有液晶面板214和背光模组215,所述背光模组215包括贴合于所述液晶面板214的背光导光板216和固定于所述背光导光板216侧边的背光源217,所述超声波检测层10贴合于所述背光导光板216远离所述液晶面板214一面。所述液晶面板214贴合于所述玻璃盖板213。所述基材层13贴合于所述背光导光板216。所述基材层13可以构成所述背光导光板216的基层。由于所述反射层20的不可透光性,使得所述反射层20可以构成所述背光模组215的背板,使得所述液晶面板214获取所述背光模组215的光线,进而实现显示图像。为了增加所述背光模组215的结构稳固性,所述背光模组215还包括封装底板218,所述封装底板218对所述背光源217和背光导光板216封装,所述超声波指纹模组100固定于所述背光导光板216和所述封装底板218之间。所述封装底板218对所述超声波指纹模组100进行防护,所述封装底板218还对所述背光源217进行封装,以防止所述背光源217漏光。所述封装底板218可以是可弯折金属板件。所述封装底板218与所述超声波指纹模组100之间存在装配间隙,以增加所述反射层20的超声波阻挡率,保证所述超声波指纹模组100识别指纹的有效性。
请参阅图8,在另一个实施例中,与图5所示实施例大致相同,不同的是,所述超声波指纹模组100可嵌入所述显示屏210内,所述超声波指纹模组100位于所述显示屏210的非显示区域内。具体的,所述玻璃盖板213具有非透光区域2131。所述玻璃盖板213的非透光区域2131由附设于玻璃的反射层构成。所述玻璃盖板213的非透光区域2131对所述超声波指纹模组100进行遮盖,以保证所述显示屏210组件200的外观性能。利用所述超声波指纹模组100设置于所述显示屏210组件200的非显示区域,避免所述超声波指纹模组100的反射层20阻挡显示光线,以保证所述显示屏210组件200的显示区域的显示效果。所述超声波指纹模组100的反射层20与所述显示屏210组件200 的其他层结构之间存在间隙,以保证所述反射层20对超声波阻挡效率,保证所述超声波指纹模组100的指纹识别有效性。
请参阅图9,在另一个实施例中,与图6所示实施例大致相同,不同的是,所述显示屏210设有贴合所述有机电致发光层212的基板2101,所述超声波检测层10包括多个像素电极14、压电层15和导电极16,所述多个像素电极14阵列排布于所述基板2101远离所述玻璃盖板213的一面,所述压电层15覆盖所述多个像素电极14,所述导电极16层叠于所述压电层15远离所述多个像素电极14的一面,所述反射层20印刷成型于所述导电极16远离所述压电层15的一面。即所述超声波指纹模组100附设于所述显示屏210的基板2101上。当然,在其他实施方式中,所述显示屏210设有液晶面板214的基板2101,所述超声波指纹模组100的多个像素电极14可成型于液晶面板214的基板2101上。
请参阅图10,本申请还提供一种电子设备300,所述电子设备300包括所述显示屏组件200,所述电子设备300还包括后盖310和主板320。所述显示屏210与所述后盖310相盖合。所述主板320固定于所述后盖310和所述显示屏210之间,所述主板320电连接所述显示屏210和所述超声波指纹模组100。所述主板320可接收所述超声波指纹模组100的电信号,以识别用户指纹图像。可以理解的是,所述超声波指纹模组100可接收经用户指纹检测的指纹检测信号,所述经用户指纹检测的指纹检测信号可以是由所述超声波指纹模组100发射的初始检测信号传导至用户指纹,也可以是由外部超声波信号源发射的初始检测信号传导至用户指纹。所述电子设备300可以是手机、平板电脑、笔记本电脑、媒体播放器等设备,也可以是自动柜员机(Automated Teller Machine,ATM)等金融终端设备。所述电子设备300通过将所述超声波指纹模组100设置于所述显示屏210内,使得所述电子设备300可以满足多样化指纹识别要求,提高指纹识别效率。
可以理解的是,本实施方式中任何具有保护意义的具体数值并不局限于以上所提供的具体数值,其他与本实施方式中所提供的具体数值相近似的数值同样在本申请实施方式的保护范围内。
以上所述是本发明的优选实施方式,应当指出,对于本技术领域的普通 技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也视为本发明的保护范围。

Claims (20)

  1. 一种超声波指纹模组,其特征在于,所述超声波指纹模组包括超声波检测层和反射层,所述超声波检测层具有超声波接收面,所述反射层设置于所述超声波检测层远离所述超声波接收面的一面,所述反射层用于对从所述超声波检测层射出的超声波进行反射,所述反射层含有消泡剂,所述消泡剂用以消除所述反射层在制作过程中的气泡,以及消除最终形成的反射层的气泡。
  2. 根据权利要求1所述的超声波指纹模组,其特征在于,所述消泡剂为改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚的组合。
  3. 根据权利要求2所述的超声波指纹模组,其特征在于,所述改性二甲基硅烷在所述反射层的质量占比为0.8%~2.0%。
  4. 根据权利要求3所述的超声波指纹模组,其特征在于,所述改性二甲基硅烷在所述反射层的质量占比为1.5%。
  5. 根据权利要求2所述的超声波指纹模组,其特征在于,所述聚氧丙烯氧化乙烯甘油醚在所述反射层的质量占比为0.2%~1.0%。
  6. 根据权利要求5所述的超声波指纹模组,其特征在于,所述聚氧丙烯氧化乙烯甘油醚在所述反射层的质量占比为0.5%。
  7. 根据权利要求1~6任意一项所述的超声波指纹模组,其特征在于,所述反射层含有碳粉和树脂材料,所述碳粉混入所述树脂材料中分子间的间隙。
  8. 根据权利要求1~6任意一项所述的超声波指纹模组,其特征在于,所述碳粉颗粒的平均粒径为0.8微米至2微米。
  9. 根据权利要求1~6任意一项所述的超声波指纹模组,其特征在于,所述超声波检测层包括依次层叠设置的基材层、像素电极层、压电层和导电极,所述反射层设置于所述导电极远离所述压电层的一面。
  10. 根据权利要求9所述的超声波指纹模组,其特征在于,所述超声波检测层包括两层或两层以上的所述导电极。
  11. 根据权利要求9所述的超声波指纹模组,其特征在于,所述导电极的厚度为10微米至30微米,所述压电层的厚度为5微米至15微米,所述基材层的厚度为80微米至100微米。
  12. 根据权利要求1~6任意一项所述的超声波指纹模组,其特征在于,所 述反射层的厚度为5微米至30微米。
  13. 根据权利要求12所述的超声波指纹模组,其特征在于,所述反射层的厚度为20微米至30微米。
  14. 根据权利要求13所述的超声波指纹模组,其特征在于,所述反射层的厚度为25微米。
  15. 一种超声波指纹模组的制作方法,其特征在于,所述超声波指纹模组的制作方法包括步骤:
    提供超声检测层,所述超声波检测层具有超声波接收面和相对所述超声波接收面设置的检测层底面;
    提供含有消泡剂的液态成型材料,所述消泡剂用以消除所述液态成型材料的气泡;
    将所述液态成型材料铺设于所述检测层底面上,待所述液态成型材料固化后形成反射层,所述反射层覆盖所述超声波检测层的超声波接收面。
  16. 根据权利要求15所述的超声波指纹模组的制作方法,其特征在于,所述液态成型材料还含有碳粉颗粒、树脂材料和流平剂,所述树脂材料、碳粉颗粒、流平剂和消泡剂混合搅拌后形成所述液态成型材料。
  17. 根据权利要求25所述的超声波指纹模组,其特征在于,所述消泡剂为改性二甲基硅烷和聚氧丙烯氧化乙烯甘油醚的组合。
  18. 根据权利要求17所述的超声波指纹模组,其特征在于,所述改性二甲基硅烷在所述反射层的质量占比为0.8%~2.0%。
  19. 根据权利要求18所述的超声波指纹模组,其特征在于,所述改性二甲基硅烷在所述反射层的质量占比为1.5%。
  20. 一种电子设备,其特征在于,所述电子设备包括权利要求1~14任意一项所述的超声波指纹模组。
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