WO2021078303A1 - 透镜模块 - Google Patents

透镜模块 Download PDF

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Publication number
WO2021078303A1
WO2021078303A1 PCT/CN2020/123754 CN2020123754W WO2021078303A1 WO 2021078303 A1 WO2021078303 A1 WO 2021078303A1 CN 2020123754 W CN2020123754 W CN 2020123754W WO 2021078303 A1 WO2021078303 A1 WO 2021078303A1
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WO
WIPO (PCT)
Prior art keywords
substrate
lens unit
adhesive
support member
lens
Prior art date
Application number
PCT/CN2020/123754
Other languages
English (en)
French (fr)
Inventor
张明军
李道光
张志胜
Original Assignee
秀尔半导体(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 秀尔半导体(深圳)有限公司 filed Critical 秀尔半导体(深圳)有限公司
Priority to EP20878134.4A priority Critical patent/EP4050668A4/en
Priority to US17/771,767 priority patent/US20220376149A1/en
Publication of WO2021078303A1 publication Critical patent/WO2021078303A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • the present invention relates to a lens module including an adhesive, and in particular to a lens module for preventing the adhesive or lens from detaching from a substrate.
  • LEDs light emitting diodes
  • LEDs light emitting diodes
  • light-emitting diodes have many advantages.
  • light-emitting diodes have directivity of light, can realize multiple color control, and are superior in adjusting the amount of light according to the amount of voltage and current changes.
  • a light emitting diode is a semiconductor light emitting device that emits light through a potential difference when electrons and holes are recombined in a P-N semiconductor junction structure by an applied current.
  • Light-emitting devices using such light-emitting diodes have the advantages of being environmentally friendly, low voltage, long life, and low price.
  • the lens is adhered to the upper end of the light emitting diode package through an adhesive or an adhesive sheet.
  • an adhesive when the adhesive is hardened, the arrangement position of the optical lens may be shifted due to the flow of the adhesive.
  • the adhesive and the adhesive sheet include organic adhesive materials such as acrylic and epoxy. The temperature change from high temperature to low temperature and low temperature to high temperature will reduce the adhesive properties of the above-mentioned adhesive material. Therefore, there may be a problem that the optical lens is detached from the light emitting diode package.
  • the object of the present invention is to provide a lens module for preventing the adhesive or lens from detaching from the substrate.
  • the lens module may include: a substrate having a plurality of light-emitting regions; a light-emitting element provided in each of the plurality of light-emitting regions to emit light; and a lens unit provided on the substrate to cover the A light-emitting element; an adhesive part contacting the substrate and the lens unit to fix the substrate and the lens unit; and a supporting member provided in the adhesive part and mounted on the substrate, wherein
  • the support member may include an extension portion for increasing the contact area between the support member and the adhesive portion, and a bonding portion connected to the lens unit.
  • the supporting member may be configured as a metal sheet, and may also include a bonding bracket supporting the bonding portion and a pad mounted on the substrate.
  • a hole may be provided in the extension part.
  • the extension portion may be configured to have a length in which the ratio of the length of the support member in contact with the substrate is a preset first ratio, or the extension portion may be configured to have a The ratio of the thickness of the bonding portion is the length of the preset second ratio.
  • the joint bracket may have elasticity that deforms when an external force is applied along the Z axis direction perpendicular to the substrate, and the shape of the joint bracket may be deformed so that the joint part and The end portion of the lens unit is fastened, and if the joint part and the lens unit are fastened thereafter, the deformed form of the joint holder is restored.
  • the shape of the joint holder may be configured to correspond to the shape of the end portion of the lens unit, or the length of the joint holder may have a ratio to the thickness of the end portion of the lens unit Is the length of the preset third ratio.
  • the joint portion may have elasticity that deforms when an external force is applied along the Z-axis direction perpendicular to the substrate, and the shape of the joint portion may be deformed so that the supporting member is fixed.
  • the lens unit if the lens unit is fixed thereafter, the form of the bonding portion is restored.
  • the shape of the bonding portion may be configured to correspond to the shape of the end portion of the lens unit, or the distance between the bonding portion and the substrate may be configured to be the same as that of the lens unit.
  • the ratio of the thickness of the end is the preset fourth ratio.
  • the lens module may include a plurality of different types of support members determined in consideration of the shapes of the substrate, the lens unit, and the adhesive portion.
  • the plurality of supporting members may further include at least two of the following supporting members: a first supporting member including a first extension having a first length and containing a hole; and a second The support member includes a second extension having the first length and does not include a hole; a third support member includes a third extension having a second length shorter than the first length and including a hole; and a fourth The supporting member includes a fourth extension part having the second length and not including the hole.
  • An embodiment of the present application can prevent the adhesive contained in the lens module from detaching from the substrate.
  • Another embodiment of the present application can prevent the lens unit included in the lens module from being detached from the substrate.
  • FIG. 1 is a perspective view illustrating a lens module according to an embodiment of the present application.
  • Fig. 2 is an exploded perspective view of the lens module of Fig. 1.
  • FIG 3 is a cross-sectional view illustrating a process in which the lens module according to the embodiment of the present application includes an adhesive part.
  • FIGS. 4a to 4c are cross-sectional views illustrating an embodiment in which the lens module of the present application includes a supporting member.
  • FIG. 5a to 5c are cross-sectional views showing another embodiment in which the lens module of the present application includes a supporting member.
  • Fig. 6 is a perspective view showing a supporting member according to the first embodiment of the present application.
  • Fig. 7 is a perspective view simultaneously illustrating a supporting member and a substrate according to the first embodiment of the present application.
  • Fig. 8 is a front view illustrating the shape of the supporting member mounted on the substrate according to the first embodiment of the present application.
  • Fig. 9 is a side view illustrating the shape of the supporting member mounted on the substrate according to the first embodiment of the present application.
  • 10a to 10c are side views illustrating the process of connecting the support member and the lens unit according to the first embodiment of the present application.
  • Fig. 11 is a perspective view showing a supporting member according to a second embodiment of the present application.
  • Fig. 12 is a perspective view illustrating a supporting member according to a third embodiment of the present application.
  • Fig. 13a is a perspective view simultaneously illustrating a supporting member and a substrate according to a third embodiment of the present application.
  • Fig. 13b is a front view illustrating a supporting member according to the third embodiment of the present application.
  • Fig. 13c is a side view illustrating the supporting member according to the third embodiment of the present application.
  • FIG. 14 is a front view illustrating the shape of the supporting member mounted on the substrate according to the third embodiment of the present application.
  • FIG. 15 is a side view illustrating the shape of the supporting member mounted on the substrate according to the third embodiment of the present application.
  • 16a to 16c are side views illustrating the process of connecting the support member and the lens unit according to the third embodiment of the present application.
  • Fig. 17 is a perspective view showing a supporting member according to a fourth embodiment of the present application.
  • 18a to 18d are diagrams illustrating a process of designing a lens module according to an embodiment of the present application.
  • 19a to 19c are cross-sectional views showing an embodiment in which a supporting member is realized on a substrate of the present application.
  • Lens module 10 Substrate
  • Adhesive part 50 Fastening parts
  • 60, 60a, 60b, 60c, 70 support member 61a, 61b, 61c: extension
  • FIG. 1 is a perspective view illustrating a lens module according to an embodiment of the present application
  • FIG. 2 is an exploded perspective view of the lens module in FIG. 1.
  • the lens module 100 includes a substrate 10, a light emitting element 20, a lens unit 30, an adhesive part 40 and a fastening member 50.
  • the substrate 10 is provided for mounting one or more light-emitting elements 20 on its upper portion.
  • the substrate 10 is provided with a light-emitting area where the light-emitting element 20 is mounted to emit light, and more than one light-emitting element 20 may be provided in each light-emitting area.
  • a plurality of light-emitting areas may be provided on the upper surface of the substrate 10, and accordingly, the size and light quantity of the lens module 100 can be determined.
  • the light-emitting areas may be arranged in a 2 ⁇ 2 row and column shape.
  • the substrate 10 may be provided in various shapes.
  • the substrate 10 may be provided as a plate shape that is quadrangular and has a predetermined height when viewed on a plane.
  • the shape of the substrate 10 is not limited to this, and may be provided as an ellipse or a circle.
  • the substrate 10 is provided with wiring and terminal portions for supplying power to the light-emitting element 20.
  • the substrate 10 may be a printed circuit substrate.
  • the type of the substrate 10 is not limited to this, and may be configured in various materials and various forms.
  • the substrate 10 may be made of a material with a high thermal conductivity.
  • the substrate 10 may include metals such as copper, iron, nickel, chromium, aluminum, silver, gold, titanium, and alloys of these.
  • the substrate 10 may include a non-conductive material such as ceramic, polymer resin, glass, or a composite material of these (for example, a composite resin or a mixed material of a composite resin and a conductive material).
  • the light emitting element 20 can emit light toward the upper part of the substrate 10.
  • the light emitting element 20 may emit light in a radial pattern on the surface of the substrate 10.
  • the light emitting element 20 can emit light uniformly and isotropically for all angles.
  • the direction in which the light emitting element 20 according to the embodiment of the present application emits light is not limited to this.
  • the light emission direction of the light emitting element 20 may be limited to a partial angle, and in this case, the light may be emitted anisotropically in a predetermined direction. Therefore, when light having directivity in a predetermined direction is required, the light emitting element 20 that emits light anisotropically can be used to easily achieve light emission in a specific direction.
  • the light-emitting element 20 may be implemented as a light-emitting diode chip. Although not shown, the light-emitting element 20 may include a light-emitting structure and an electrode part.
  • the light emitting structure may include a first semiconductor layer, an active layer, and a second semiconductor layer that are sequentially provided.
  • the first semiconductor layer is a semiconductor layer doped with a first conductivity type dopant.
  • the first conductivity type dopant may be an n-type dopant.
  • the first conductivity type dopant may be Si, Ge, Se, Te, or C.
  • the first semiconductor layer may include a nitride-based semiconductor material.
  • the first semiconductor layer may be formed of a semiconductor material having a composition formula of In x Al y Ga 1-xy N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x+y ⁇ 1).
  • the active layer is provided on the first semiconductor layer and corresponds to the light-emitting layer.
  • the active layer combines the electrons (or holes) injected through the first conductivity type semiconductor layer and the holes (or electrons) injected through the second semiconductor layer to each other.
  • the band gap (Band Gap) is poor and the layer that emits light.
  • the active layer can emit at least one peak wavelength of ultraviolet, blue, green, and red.
  • the active layer may be realized as a compound semiconductor.
  • the active layer may be implemented as at least one of compound semiconductors of Group 3-5 or Group 2-6, and may have In x Al y Ga 1-xy N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x+y ⁇ 1) composition formula material arrangement.
  • the second semiconductor layer is provided on the active layer.
  • the second semiconductor layer is a semiconductor layer of a second conductivity type dopant having a polarity opposite to that of the first conductivity type dopant.
  • the second conductive type dopant may be a p-type dopant, for example, the second conductive type dopant may include Mg, Zn, Ca, Sr, Ba, and the like.
  • the second semiconductor layer may include a nitride-based semiconductor material.
  • the second semiconductor layer may be formed of a semiconductor material having a composition formula of In x Al y Ga 1-xy N (0 ⁇ x ⁇ 1, 0 ⁇ y ⁇ 1, 0 ⁇ x+y ⁇ 1).
  • a cathode and an anode connected to the first semiconductor layer and the second semiconductor layer are respectively provided on the first semiconductor layer and the second semiconductor layer, and the cathode and anode are connected to the wiring or terminal portion of the substrate 10, So that it can receive power.
  • the lens module 100 includes a lens unit 30 covering the light-emitting element 20.
  • the lens unit 30 can be applied as an optical element that simply transmits the light emitted from the light-emitting element 20 or guides it in a predetermined direction while protecting the light-emitting element 20.
  • the lens unit 30 may be provided to have various shapes when viewed from a plane.
  • the lens unit 30 may be provided in a rectangular shape.
  • the shape of the lens unit 30 is not limited to this, and may also be provided in other polygonal or elliptical shapes.
  • the lens unit 30 may correspond to the shape of the light-emitting area on the substrate 10 where the light-emitting element 20 is located, and may include at least a part of a lens portion 30a configured as a curved surface and an upper surface provided around the lens portion 30a and having a surface parallel to the substrate 10 The flat portion 30b.
  • each lens unit 30 includes four lens portions 30a.
  • the lens unit 30 may include various numbers of lens portions according to design specifications. 30a.
  • the lens portion 30a may have an elliptical spherical shape protruding in the upper direction.
  • the flat portion 30b may be provided around the lens portion 30a in a plate shape that is substantially parallel to the surface of the substrate 10.
  • the shape of the lens portion 30a is not limited to this, and it may be provided in other forms depending on the light emission efficiency, the light emission direction, and the like.
  • the upper surface of the flat portion 30b may be provided to be substantially parallel to the upper surface of the substrate 10.
  • the surface of the flat portion 30b may be provided with a part parallel to the upper surface of the substrate 10 and a part inclined to the upper surface of the substrate 10 to be easily combined with other constituent elements.
  • the lens portion 30a and the flat portion 30b may be formed as an integral body that cannot be separated.
  • the lens portion 30a can be provided with various materials satisfying the above-mentioned functions, and the material thereof is not limited.
  • the lens portion 30a may be made of quartz or a polymer organic material.
  • the polymer glass material since the wavelength of absorption/transmission differs according to the type of monomer, the molding method, and the conditions, it can be selected in consideration of the wavelength emitted from the light-emitting element 20.
  • PMMA poly(methyl methacrylate)
  • PVA polyvinylalcohol
  • PP polypropylene
  • PE low-density polyethylene
  • PC polycarbonate
  • organic polymers hardly absorb ultraviolet rays, but organic polymers such as polyester fibers can absorb ultraviolet rays.
  • the lens module 100 includes an adhesive part 40 for fixing the lens unit 30 to the substrate 10.
  • the adhesive part 40 may be implemented in a sealing glue or plastic type.
  • the adhesive part 40 may include acrylic-based adhesives, silicon-based adhesives, urethane-based adhesives, polyvinyl butyral adhesives (PMB), ethylene-vinyl acetate adhesives (EVA ), at least one of polyvinyl ether, saturated amorphous polyester, and melamine resin.
  • PMB polyvinyl butyral adhesives
  • EVA ethylene-vinyl acetate adhesives
  • the adhesive part 40 may be plastic, and may include: at least one of ABS, PC, PMMA, PA, TPU, TPE, PBT, PET, PP, PVC, and POM.
  • the lens module 100 includes a fastening member 50 that connects the substrate 10 and the adhesive part 40.
  • screws can be tightened in the fastening member 50 to firmly connect the substrate 10 and the adhesive portion 40.
  • tightening the screws in the fastening component 50 refers to fixing the lens module 100 to a designated lamp.
  • the substrate 10 and the adhesive part 40 can also be firmly connected indirectly.
  • FIG 3 is a cross-sectional view illustrating a process in which the lens module according to the embodiment of the present application includes an adhesive part.
  • the lens module 100 includes a lens portion 31 having an elliptical spherical shape protruding in the upper direction, a lens unit 30 including the lens portion 31, and a substrate 10.
  • the adhesive part 40 may be arranged to be in contact with the substrate 10 and the lens unit 30 in order to fix the lens unit 30 on the substrate 10, respectively.
  • the present invention relates to a technique for fixing a lens to a substrate (such as a PCB) using glue in the case of generating a lens module.
  • the adhesive force between the adhesive and the substrate can be determined by the adhesive force between the adhesive and the substrate. It is determined by the contact area or roughness of the contact surface.
  • the adhesive may be detached from the substrate.
  • it is recommended to put the adhesive inside the adhesive Contains methods for supporting components.
  • the supporting member may be formed as a metal sheet, and the metal sheet may increase the contact area between the adhesive and the substrate.
  • the metal sheet acts as a skeleton inside the adhesive, which can prevent the adhesive from detaching structurally.
  • the surface of the metal sheet may have a roughness above a predetermined value.
  • the adhesive force between the adhesive and the substrate may not be sufficient, so that the lens may be detached from the substrate.
  • a metal sheet may be included in the adhesive.
  • a part of the configuration of the metal sheet may have elasticity, and one end of the metal sheet may be in contact with the lens.
  • a force in the Z-axis direction is applied to the end of the partially constituted lens contacting the metal sheet, so that the lens can be fixed and the lens can be prevented from being detached from the substrate.
  • FIGS. 4a to 4c are cross-sectional views illustrating an embodiment in which the lens module of the present application includes a supporting member.
  • the lens module includes a substrate 10, a light-emitting element 20 on the substrate 10, a lens unit 30 covering the light-emitting element 20, and adhered to the substrate 10 and the lens unit 30 and firmly connected the substrate 10 and the lens unit 30 ⁇ 40 ⁇ The adhesive part 40.
  • the substrate 10 and the lens unit 30 are fixed by the adhesive force of the adhesive part 40, and the lens module may be waterproofed.
  • the adhesive force between the substrate 10 and the adhesive portion 40 may decrease.
  • the adhesive force between the substrate 10 and the adhesive portion 40 is reduced.
  • the waterproof performance of the lens module may also be affected.
  • the support member 60 in the adhesion portion 40 as shown in FIG. 4c.
  • the supporting member 60 may be a metal sheet, and the metal sheet may be implemented to increase the contact area between the adhesive part 40 and the substrate 10 or increase roughness.
  • the metal sheet acts as a skeleton inside the adhesive, which can prevent the adhesive from detaching structurally. According to this, the support member 60 can prevent the adhesive portion 40 from being detached from the substrate 10.
  • the support member 60 may be mounted on the substrate 10 in a surface mount technology (SMT: Surface Mount Technology) process.
  • the supporting member 60 may be implemented in various shapes in order to prevent loosening or peeling of the adhesive portion 40 on the substrate 10.
  • the shape of the support member 60 shown in FIG. 4c is only a form for solving the technical problems of the present application.
  • the technical idea of the present application is not limited to the shape of the support member 60 illustrated in FIG. 4c.
  • the support member 60 can be implemented In many forms.
  • the supporting member 60 is not limited to a metal sheet, and may also be implemented as another substance that can consolidate the connection between the adhesive portion 40 and the substrate 10.
  • FIG. 5a to 5c are cross-sectional views showing another embodiment in which the lens module of the present application includes a supporting member.
  • the lens module includes a substrate 10, a light-emitting element 20 on the substrate 10, a lens unit 30 covering the light-emitting element 20, and adhered to the substrate 10 and the lens unit 30 and firmly connected the substrate 10 and the lens unit 30 ⁇ 40 ⁇
  • the adhesive part 40 The adhesive part 40.
  • the lens unit 30 can be fixed by the pressure of the adhesive part 40.
  • the present invention proposes a solution to include a supporting member 60 in the adhesive portion 40 as shown in FIG. 5c.
  • the support member 60 may be mounted on the substrate 10 in a surface mount technology (SMT: Surface Mount Technology) process.
  • SMT Surface Mount Technology
  • the supporting member 60 may be implemented in various shapes in order to prevent the lens unit 30 from loosening or peeling off the substrate 10.
  • the shape of the supporting member 60 shown in FIG. 5c is only a form for solving the technical problems of the present application.
  • the technical purpose of the present application is not limited to the shape of the supporting member 60 shown in FIG. 5c.
  • the supporting member 60 can be implemented as Various forms.
  • the supporting member 60 may be implemented as a metal sheet, and the supporting member 60 may be implemented to contact one end of the lens unit 30 and apply pressure to one end of the lens unit 30 in the Z-axis direction, thereby fixing the lens unit 30. According to this, it is possible to prevent the lens unit 30 from being separated from the substrate 10.
  • the supporting member 60 is not limited to a metal sheet, and may also be implemented as another substance that can consolidate the connection between the lens unit 30 and the substrate 10.
  • FIG. 6 is a perspective view showing a supporting member according to the first embodiment of the present application
  • FIG. 7 is a perspective view showing the supporting member and a substrate at the same time according to the first embodiment of the present application.
  • the supporting member 60a may be realized as a metal sheet.
  • the support member 60a may include an extension part 61a, a joint bracket 62a, a joint part 63a, and a pad 64a.
  • the extension 61a may be called a hump
  • the joint bracket 62a may be called a clip holder
  • the joint 63a may be called a clip.
  • the extension portion 61a may be set to maximize the contact area of the support member 60a included in the lens module and the adhesive portion 40. According to the embodiment, the extension portion 61a may be implemented such that the contact area of the support member 60a and the adhesive portion 40 becomes a predetermined area or more.
  • the extension portion 61a may be implemented to include a hole.
  • the glue is inserted into the hole in the extension 61a, so that the contact area between the support member 60a and the glue can be increased.
  • the bonding bracket 62a is a structure that supports the bonding portion 63a, and the bonding portion 63a can be used for connecting the lens unit included in the lens module and the support member 60a.
  • the pad 64 a of the support member 60 a is located on the pad area 11 on the substrate 10 so that the support member 60 a can be installed on the substrate 10.
  • FIG. 8 is a front view illustrating the shape of the support member mounted on the substrate according to the first embodiment of the present application
  • FIG. 9 is a side view illustrating the shape of the support member mounted on the substrate according to the first embodiment of the present application view.
  • the supporting member 60 a may be included in the adhesive part 40 and mounted on the substrate 10.
  • the supporting member 60a may be implemented in various forms, so that the adhesive portion 40 and the substrate 10 are firmly connected.
  • the pad 64a of the supporting member 60a may be fixed on the pad area 11 on the substrate 10 by an SMT process.
  • the length A of the extension 61 a of the support member 60 a may be realized to be longer than the length B of the main body of the support member 60 a contacting the substrate 10.
  • the length A of the extension portion 61a is realized to be greater than the length B of the main body of the support member 60a, there is an effect that the support can be improved by increasing the roughness of the contact surface between the support member 60a and the adhesive portion.
  • the adhesion between the component 60a and the adhesive part is realized to be greater than the length B of the main body of the support member 60a.
  • the length A of the extension part 61 a may be realized to be greater than the thickness C of the adhesive part 40.
  • the length A of the extension portion 61 a is realized to be greater than the thickness C of the adhesive portion 40, there may be an effect of increasing the supporting force of the supporting member 60 a of the adhesive portion 40.
  • the support member 60a may be fastened by the joint portion 63a and the end of the lens unit 30 realized in the support member 60a.
  • the process of fastening the support member 60a to the end of the lens unit 30 is specifically illustrated in FIGS. 10a to 10c.
  • 10a to 10c are side views illustrating the process of connecting the support member and the lens unit according to the first embodiment of the present application.
  • the joint bracket 62a supporting the joint portion 63a in the supporting member 60a may have elasticity, and may be formed to receive a force in the Z-axis direction. According to the embodiment, the shape and size of the joint bracket 62a of the supporting member 60a can be adjusted according to the shape and size of the end of the lens unit 30.
  • the form of the fastening hole of the joint bracket 62a may be formed to correspond to the end of the lens unit 30 to be fastened.
  • the size of the fastening hole of the joint bracket 62a may be formed to correspond to the thickness of the end of the lens unit 30 to be fastened.
  • the size of the fastening hole of the bonding bracket 62a is formed to a size corresponding to the thickness of the end portion of the lens unit 30 to be fastened, there is an end portion where the bonding portion 63a can be more easily fastened to the lens unit 30 Effect.
  • Fig. 11 is a perspective view showing a supporting member according to a second embodiment of the present application.
  • the supporting member 60b may be realized as a metal sheet.
  • the support member 60b may include an extension part 61b, a joint bracket 62b, a joint part 63b, and a pad 62b.
  • the extension portion 61b according to the second embodiment of the present application may be implemented as a preset length to increase the contact area between the support member 60b included in the lens module and the adhesive portion 40.
  • the extension 61b in the support member 60b according to the second embodiment of the present application shown in FIG. Hole since the extension portion 61b does not include a hole, there is an effect that the process of manufacturing the support member 60b can be simplified.
  • the supporting member 60b according to the second embodiment of the present application does not have a hole in the extension portion 61b, it has an effect that the supporting member 60b can be manufactured more easily.
  • the extension portion 61b is not provided with a hole, when the extension portion 61b is realized such that the roughness of the end surface of the extension portion 61b and the adhesive portion is greater than the preset critical value, there is an effect as follows: The frictional force between the extension part 61b and the adhesion part, and the support part 60b can support the adhesion part more firmly.
  • Fig. 12 is a perspective view illustrating a supporting member according to a third embodiment of the present application.
  • Fig. 13a is a perspective view simultaneously illustrating a support member and a substrate according to a third embodiment of the present application
  • Fig. 13b is a front view illustrating a support member according to the third embodiment of the present application
  • Fig. 13c is a third embodiment according to the present application.
  • the supporting member 60c may be realized as a metal sheet.
  • the support member 60c may include an extension part 61c, a joint bracket 62c, a joint part 63c, and a pad 64c.
  • the supporting member 60c according to the third embodiment of the present application is not realized with a long length of the extension portion 61c, so it can also be arranged in a small area in the lens module.
  • the support member 60a according to the first embodiment of the present application and the support member 60b according to the second embodiment implement longer extensions to increase the contact area between the support member and the bonding portion.
  • the supporting member 60c has the feature of forming a narrower width extension 61c, so that the supporting member can be realized in the bonding portion even when the width of the bonding portion or the substrate is narrow.
  • the support member 60c When the support member 60c is provided with the narrow-width extension 61c, there is an effect that the support member 60c can be easily provided even in the edge portion of the substrate to which the adhesive portion is adhered.
  • mounting the support member 60c having the narrow-width extension 61c in the lens module has the effect of increasing the light emitting function of the lens module.
  • the length of the extension 61c may be set to a preset ratio with respect to the width of the substrate.
  • the length of the extension part may be set to a preset ratio with respect to the thickness of the adhesive part.
  • the extension part 61c may be implemented to include a hole. In this case, since the adhesive part is inserted into the hole in the extension part 61c, the contact area between the support member 60c and the adhesive part can be increased.
  • the pad 64 c of the supporting member 60 c may be configured to be located on the pad area 11 on the substrate 10.
  • the pad 64c of the support member 60c is mounted on the pad area 11 on the substrate 10, and the support member 60c may be connected to the substrate 10.
  • the bonding portion 63c of the supporting member 60c may be configured to fix the lens unit included in the lens module.
  • the engaging portion 63c of the supporting member 60c may be fastened to the end of the lens unit, and the supporting member 60c may be connected with the lens unit.
  • FIG. 14 is a front view illustrating the shape of the support member mounted on the substrate according to the third embodiment of the present application
  • FIG. 15 is a side view illustrating the shape of the support member mounted on the substrate according to the third embodiment of the present application view.
  • the supporting member 60 c may be included in the adhesive part 40 and may be installed on the substrate 10.
  • the support member 60c may be implemented in various forms to firmly connect the adhesive part 40 and the substrate 10.
  • the pad 64c of the supporting member 60c may be fixed on the pad area 11 on the substrate 10 by an SMT process.
  • the length A'of the extension 61c of the support member 60c can be realized in a manner that the length B'of the main body of the support member 60c contacting the substrate 10 is shorter in a predetermined ratio.
  • the length A'of the extension portion 61c is realized to be shorter than the length B'of the main body of the support member 60c, by implementing the extension portion 61c in a curved form, the contact area between the support member 60c and the adhesive portion 40 can be increased. The effect of improving the adhesive force of the support member 60c and the adhesive portion 40.
  • the length A'of the extension portion 61c is realized to be shorter than the length B'of the main body of the support member 60c, by implementing the extension portion 61c in a curved form, the roughness between the support member 60c and the adhesive portion 40 can be increased. Thereby, there is an effect that the adhesive force of the support member 60c and the adhesive part 40 can be improved.
  • the length A'of the extension portion 61c may be formed to be shorter in a preset ratio with respect to the thickness C'of the adhesive portion 40.
  • the supporting member 60c can firmly fix the lens unit 30 by using the engaging portion 63c implemented in the supporting member 60c.
  • the process of firmly fixing the lens unit 30 by the supporting member 60c is specifically illustrated in FIGS. 16a to 16c.
  • 16a to 16c are side views illustrating the process of connecting the support member and the lens unit according to the third embodiment of the present application.
  • the engaging portion 63c of the support member 60c may be realized to have elasticity and receive force in the Z-axis direction.
  • the shape and size of the bonding portion 63c of the support member 60c can be adjusted according to the shape and size of the end of the lens unit 30.
  • the shape of the bonding portion 63c may be formed to correspond to the end portion of the lens unit 30 for fixing.
  • the height of the bonding portion 63c (that is, the distance from the substrate 10 to the bonding portion 63c) may be set to a predetermined ratio with respect to the thickness of the end portion of the lens unit 30 to be fixed.
  • the joining portion 63c of the supporting member 60c is fastened to the end of the lens unit 30, the joining portion 63c can be restored to its original form.
  • Fig. 17 is a perspective view showing a supporting member according to a fourth embodiment of the present application.
  • the support member according to the fourth embodiment of the present application may be realized as a metal sheet. Similar to the support member according to the third embodiment of the present application, the support member according to the fourth embodiment of the present application may include an extension part, a joint bracket, a joint part, and a pad.
  • the extension part in the support member according to the fourth embodiment of the present application shown in FIG. 17 is implemented to not include a hole.
  • the extension portion does not include a hole, there is an effect of simplifying the process of manufacturing the support member.
  • the support member according to the fourth embodiment of the present application does not have a hole in the extension portion, it has an effect that the support member can be manufactured more easily.
  • the extension part when the extension part is realized that the roughness of the end surface of the extension part and the adhesive part is above the preset critical value, it has the following effect: increase the extension part and the adhesion The friction force between the parts, and the support member can support the adhesive part more firmly.
  • the supporting members according to the first embodiment to the fourth embodiment are illustrated in this application and the description is focused on them, the technical idea of the present invention is not limited to this.
  • the mounting The supporting member in the lens module can be implemented in other forms than the first embodiment to the fourth embodiment.
  • the support member may be implemented as an extension part in a more curved form.
  • the supporting member may be provided with a plurality of holes in the extension part, and may be provided with at least one hole in the pad.
  • 18a to 18d are diagrams illustrating a process of designing a lens module according to an embodiment of the present application.
  • a plurality of light-emitting elements 20 and a plurality of supporting members 60 may be mounted on the substrate 10 in the SMT process.
  • the plurality of supporting members 60 may be any one of the supporting members according to the first embodiment to the fourth embodiment of the present application.
  • FIG. 18a illustrates an example in which 12 support members 60 are mounted on the substrate
  • the technical idea of the present invention is not limited to this, and various numbers of support members 60 can be mounted on the substrate 10 in the SMT process.
  • the lens unit 30 may be located on the substrate 10 on which the plurality of light emitting elements 20 and the plurality of support members 60 are mounted. In this case, at least one end of the lens unit 30 may be fixed by a joint part or a joint bracket included in each of the plurality of supporting members 60. That is, the lens unit 30 can be firmly connected to the substrate 10 via the plurality of supporting members 60 mounted on the substrate 10.
  • a preset special mold can be used to fill the adhesive part 40 in the lens module connected to the substrate 10 and the lens unit 30.
  • the adhesive part 40 may be composed of a sealing adhesive or plastic.
  • the lens module including the supporting member according to the embodiment of the present application can be completed.
  • 19a to 19c are cross-sectional views showing an embodiment in which a supporting member is realized on a substrate of the present application.
  • the adhesive part 40-1 on the substrate 10 may be implemented as a plastic type. Wherein, by virtue of the friction between the substrate 10 and the adhesive portion 40-1, the substrate 10 and the adhesive portion 40-1 can be firmly connected to each other.
  • the present invention proposes a solution to include a supporting member 70 in the substrate 10 as shown in FIG. 19c.
  • the support member 70 may be implemented in the form of a countersunk hole. If the plastic-type adhesive part 40-1 is filled in the cone hole, the adhesive part 40-1 can be prevented from being separated from the substrate 10.
  • the shape of the support member 70 shown in FIG. 19c is only a form for solving the technical problems of the present application.
  • the technical idea of the present application is not limited to the shape of the support member 70 shown in FIG. 19c, and the support member 70 can be implemented as Various forms.

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  • Engineering & Computer Science (AREA)
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  • General Physics & Mathematics (AREA)
  • Lens Barrels (AREA)
  • Led Device Packages (AREA)

Abstract

一种透镜模块，可以包括：基板（10），具有多个发光区域；发光元件（20），提供于多个发光区域而发出光；透镜单元（30），提供于基板上而覆盖发光元件；粘合部（40），接触于基板以及透镜单元（30），从而固定基板以及透镜单元；以及支撑部件（60），提供于粘合部内，并且安装于基板上。支撑部件可以包括用于增加支撑部件和粘合部之间的接触面积的延伸部以及连接于透镜单元的接合部。

Description

透镜模块 技术领域
本发明涉及一种包括粘合剂的透镜模块，具体地涉及一种用于防止粘合剂或透镜从基板脱离的透镜模块。
背景技术
发光二极管(LED：light emitting diode)相比于现有的光源具有很多优点。发光二极管与现有的光源相比，具有光的方向性，并且能够实现多种颜色的控制，并且在随着电压电流变化量而调节光量方面较为优秀。
发光二极管是当借由施加的电流而在P-N半导体接合结构中电子和空穴再结合时借由电位差而发出光的半导体发光装置。利用此种发光二极管的发光装置具有亲环境、低电压、寿命长以及低价格等的优点。
通常，透镜通过粘合剂或粘合片粘附于发光二极管封装件上端。从而，在使用粘合剂的情况下，当粘合剂硬化时，由于粘合剂的流动可能使光学透镜的排列位置偏移。并且，粘合剂以及粘合片包括亚克力、环氧等等的有机类的粘合物质。高温至低温以及低温至高温的温度变化会导致上述粘合物质的粘合特性降低。因此，可能发生光学透镜从发光二极管封装件脱离的问题点。
发明内容
本发明的目的是提供一种用于防止粘合剂或透镜从基板脱离的透镜模块。
根据本申请的一实施例的透镜模块可以包括：基板，具有多个发光区域；发光元件，提供于各个所述多个发光区域而发出光；透镜单元，提供于所述基板上而覆盖所述发光元件；粘合部，接触于所述基板以及所述透镜单元，从而固定所述基板以及所述透镜单元；以及支撑部件，提供于所述粘合部内，并且安装于所述基板上，其中，所述支撑部件可以包括用于增加所述支撑部件和所述粘合部之间的接触面积的延伸部以及连接于所述透镜单元的接合部。
本申请的一实施例中，所述支撑部件可构成为金属片(metal sheet)，并 且还可包括支撑所述接合部的接合支架以及安装于所述基板上的垫。
本申请的一实施例中，可以在所述延伸部提供孔(hole)。
本申请的一实施例中，所述延伸部可以构成为具有与所述支撑部件接触于所述基板的长度的比例为预设的第一比例的长度，或者所述延伸部可以构成为具有与所述粘合部的厚度的比例为预设的第二比例的长度。
本申请的一实施例中，所述接合支架可以具有当被施加沿垂直于所述基板的Z轴方向的外部力时形态变形的弹性，所述接合支架的形态可以变形使得所述接合部和所述透镜单元的端部紧固，而若此后所述接合部和所述透镜单元紧固，则变形的所述接合支架的形态复原。
本申请的一实施例中，所述接合支架的形态可以构成为与所述透镜单元的端部的形态对应，或者所述接合支架的长度可以具有与所述透镜单元的端部的厚度的比例为预设的第三比例的长度。
本申请的一实施例中，所述接合部可以具有当被施加沿垂直于所述基板的Z轴方向的外部力时形态变形的弹性，所述接合部的形态可以变形使得所述支撑部件固定所述透镜单元，而若此后所述透镜单元被固定，则所述接合部的形态复原。
本申请的一实施例中，所述接合部的形态可以构成为与所述透镜单元的端部的形态对应，或者所述接合部和所述基板之间的距离可以构成为与所述透镜单元的端部的厚度的比例为预设的第四比例。
本申请的一实施例中，所述透镜模块可以包括考虑所述基板、所述透镜单元以及所述粘合部的形态而决定的彼此不同类型的多个支撑部件。
本申请的一实施例中，所述多个支撑部件可以还包括如下支撑部件中的至少两个：第一支撑部件，包括具有第一长度且包含孔(hole)的第一延伸部；第二支撑部件，包括具有所述第一长度且不包含孔的第二延伸部；第三支撑部件，包括具有比所述第一长度短的第二长度且包含孔的第三延伸部；以及第四支撑部件，包括具有所述第二长度且不包含所述孔的第四延伸部。
本申请的一实施例可以防止包含在透镜模块的粘合剂从基板脱离。
本申请的另一实施例可以防止包含在透镜模块的透镜单元从基板脱离。
附图说明
图1是图示根据本申请的实施例的透镜模块的立体图。
图2是图1的透镜模块的分解立体图。
图3是图示根据本申请的实施例的透镜模块包含粘合部的过程的剖面图。
图4a至图4c是图示本申请的透镜模块包含支撑部件的一实施例的剖面图。
图5a至图5c是示出本申请的透镜模块包含支撑部件的另一实施例的剖面图。
图6是示出根据本申请的第一实施例的支撑部件的立体图。
图7是同时图示根据本申请的第一实施例的支撑部件和基板的立体图。
图8是图示根据本申请的第一实施例的支撑部件安装于基板上的形状的正视图。
图9是图示根据本申请的第一实施例的支撑部件安装于基板上的形状的侧视图。
图10a至图10c是图示根据本申请的第一实施例的支撑部件与透镜单元连接的过程的侧视图。
图11是示出根据本申请的第二实施例的支撑部件的立体图。
图12是图示根据本申请的第三实施例的支撑部件的立体图。
图13a是同时图示根据本申请的第三实施例的支撑部件和基板的立体图。
图13b是图示根据本申请的第三实施例的支撑部件的正视图。
图13c是图示根据本申请的第三实施例的支撑部件的侧视图。
图14是图示根据本申请的第三实施例的支撑部件安装于基板上的形状的正视图。
图15是图示根据本申请的第三实施例的支撑部件安装于基板上的形状的侧视图。
图16a至图16c是图示根据本申请的第三实施例的支撑部件与透镜单元连接的过程的侧视图。
图17是示出根据本申请的第四实施例的支撑部件的立体图。
图18a至图18d是图示根据本申请的实施例设计透镜模块的过程的图。
图19a至19c是示出在本申请的基板实现支撑部件的实施例的剖面图。
符号说明：
100：透镜模块                  10：基板
20：发光元件                   30：透镜单元
40、40-1：粘合部                   50：紧固部件
60、60a、60b、60c、70：支撑部件    61a、61b、61c：延伸部
62a、62b、62c：接合支架            63a、63b、63c：接合部
64a、64b、64c：垫
具体实施方式
本发明可以进行多样的变更，并且可以具有多种形态，以下将特定实施例示出于附图中并在本文中进行详细说明。然而，这并非欲将本发明限定于特定的公开形态，应该理解为包括本发明的思想及技术范围中所包含的全部变更、等同物乃至替代物。
以下，参照附图，对本发明的优选实施例进行更详细的说明。
图1是图示根据本申请的实施例的透镜模块的立体图，图2是图1的透镜模块的分解立体图。
参照图1以及图2，根据本申请的实施例的透镜模块100包括基板10、发光元件20、透镜单元30、粘合部40以及紧固部件50。
基板10为了在其上部贴装一个以上的发光元件20而提供。在基板10提供有贴装发光元件20而发出光的发光区域，并且在每个发光区域可提供有1个以上的发光元件20。
本申请的实施例中，在基板10的上表面可提供有多个发光区域，据此，可以决定透镜模块100的尺寸及光量。例如，发光区域可排列为2×2的行列形状。然而，这仅是示意性的，发光区域可以排列为如3×4、2×6等的多种形态。
基板10可以以多种形状被提供。例如，基板10可以提供为，在平面上观察时是四边形且具有预定高度的板状。然而，基板10的形状并非局限于此，也可以提供为椭圆形或圆形。
在基板10提供有用于向发光元件20供应电源的布线以及端子部。本申请的一实施例中，基板10可以是印刷电路基板。然而，基板10的种类并非局限于此，可以构成为多种材料和多种形态。
例如，基板10的至少一部分可以由导热系数较高的材料构成。例如，基板10可以包括如铜、铁、镍、铬、铝、银、金、钛以及这些的合金等的金属。或者，基板10可以包括如陶瓷、高分子树脂、玻璃或这些的复合材料(例如， 复合树脂或复合树脂与导电材料的混合材料)的非导电性材料。
本申请的一实施例中，发光元件20可以朝基板10的上部方向发出光。例如，发光元件20可以在基板10面上以放射状发出光。在此情况下，发光元件20可以对全角度均匀地各向同性地发出光。然而，根据本申请的实施例的发光元件20发出光的方向并不局限于此。例如，发光元件20的光发出方向可局限于部分角度以内，在此情况下，沿预定方向可以各向异性地发出光。从而，在需要朝预定方向具有指向性的光的情况下，利用各向异性地发出光的发光元件20，从而可以容易地实现朝特定方向的发光。
本申请的一实施例中，发光元件20可以实现为发光二极管芯片。虽然未图示，然而发光元件20可以包括发光结构体以及电极部。
发光结构体可包括依次提供的第一半导体层、活性层以及第二半导体层。
第一半导体层是掺杂有第一导电型掺杂剂的半导体层。第一导电型掺杂剂可以是n型掺杂剂。第一导电型掺杂剂可以是Si、Ge、Se、Te或C。本申请的一实施例中，第一半导体层可以包括氮化物基半导体材料。例如，第一半导体层可以利用具有In xAl yGa 1-x-yN(0≤x≤1，0≤y≤1，0≤x+y≤1)的组成式的半导体材材料构成。活性层提供于第一半导体层上，且相当于发光层。
活性层是使通过第一导电型半导体层而注入的电子(或空穴)与通过第二半导体层而注入的空穴(或电子)彼此结合，从而借由根据活性层的形成物质的能带(Energy Band)的带隙(Band Gap)差而发出光的层。活性层可以发出紫外线、蓝色、绿色以及红色中的至少一个峰值波长。活性层可以实现为化合物半导体。作为示例，活性层可以实现为3族-5族或2族-6族的化合物半导体中的至少一个，并且以具有In xAl yGa 1-x-yN(0≤x≤1，0≤y≤1，0≤x+y≤1)的组成式的材料布置。
第二半导体层提供于活性层上。第二半导体层是具有与第一导电型掺杂剂相反的极性的第二导电型掺杂剂的半导体层。第二导电型掺杂剂可以是p型掺杂剂，例如，第二导电型掺杂剂可以包括Mg、Zn、Ca、Sr、Ba等。本申请的一实施例中，第二半导体层可以包括氮化物基半导体材料。第二半导体层可以利用具有In xAl yGa 1-x-yN(0≤x≤1，0≤y≤1，0≤x+y≤1)的组成式的半导体材料构成。
本申请的一实施例中，第一半导体层和第二半导体层上分别提供有连接于第一半导体层以及第二半导体层的阴极和阳极，阴极和阳极连接于基板10 的布线或端子部，从而可以接收电源。
参照图1以及图2，透镜模块100包括覆盖发光元件20的透镜单元30。透镜单元30在保护发光元件20的同时，可以应用为单纯地将从发光元件20发出的光透过或朝预定方向引导的光学要素。
透镜单元30可提供为，从平面上观察时具有多种形状。例如，透镜单元30可提供为矩形。然而，透镜单元30的形状并不局限于此，也可以提供为其他多边形或椭圆形等。
透镜单元30可以与发光元件20所在的基板10上的发光区域的形状对应，并可以包括至少一部分构成为曲面的透镜部30a和提供于透镜部30a的周围且具有与基板10面平行的上表面的扁平部30b。
图1及图2中，图示了每个透镜单元30包含4个透镜部30a的情形，然而本发明的技术思想并不局限于此，透镜单元30可以根据设计规格包含多种数量的透镜部30a。
透镜部30a可以具有朝上部方向突出的椭圆球形状。扁平部30b可以以相对于基板10的表面大致平行的板状提供于透镜部30a的周围。然而，透镜部30a的形状并非局限于此，此外，根据光射出效率以及光射出方向等，可以以其他形态提供。
并且，扁平部30b的上表面可以提供为大致平行于基板10的上表面。然而，这仅是示意性的，扁平部30b的表面可提供为一部分平行于基板10的上表面，一部分倾斜于基板10的上表面，以容易地结合于其他构成要素。本申请的一实施例中，透镜部30a和扁平部30b可以形成为无法分离的一体。
透镜部30a可以以满足上述功能的多种材料提供，而且其材料不受限制。例如，透镜部30a可以由石英或高分子有机材料构成。其中，对于高分子玻璃材质而言，由于吸收/透射的波长根据单体的类型、成型方法、条件而不同，从而可以考虑从发光元件20发出的波长而选择。例如，如聚(甲基丙烯酸甲酯)(PMMA：poly(methylmethacrylate))、聚乙烯醇(PVA：polyvinylalcohol)、聚丙烯(PP：polypropylene)、低密度聚乙烯(PE：polyethylene)、聚碳酸酯(PC：polycarbonate)的有机高分子几乎不吸收紫外线，然而如聚酯纤维(polyester)的有机高分子可以吸收紫外线。
参照图1及图2，透镜模块100包括用于将透镜单元30固定于基板10的粘合部40。粘合部40可以以密封粘合剂(sealing glue)或塑料类型实现。
例如，粘合部40可以包括亚克力类粘合剂、硅类粘合剂、尿烷类粘合剂、聚乙烯醇缩丁醛粘合剂(PMB)、乙烯-乙酸乙烯酯粘合剂(EVA)、聚乙烯醚、饱和无定形聚酯以及三聚氰胺树脂中的至少一个。
例如，粘合部40可以为塑料，可以包括：ABS、PC、PMMA、,PA、TPU、TPE、PBT、PET、PP、PVC、POM中的至少一种。
参照图1以及图2，透镜模块100包括将基板10和粘合部40连接的紧固部件50。本申请的一实施例中，可以在紧固部件50内拧紧螺丝而将基板10和粘合部40牢固地连接。例如，在紧固部件50内拧紧螺丝是指将透镜模块100固定到指定的灯具上面，当然也可以间接地将基板10和粘合部40牢固地连接。
图3是图示根据本申请的实施例的透镜模块包含粘合部的过程的剖面图。
参照图1至图3，透镜模块100包括具有朝上部方向突出的椭圆球形状的透镜部31、包含透镜部31的透镜单元30、基板10。
粘合部40可以为了将透镜单元30固定于基板10上而与基板10以及透镜单元30分别接触而布置。
本发明涉及在生成透镜模块的情形下，利用粘合剂(glue)将透镜固定于基板(例如PCB)的技术，粘合剂和基板之间的粘合力可以由粘合剂和基板之间的接触区域(contact area)或接触表面的粗糙度(roughness)而决定。
例如，在粘合剂和基板之间的接触面积较小的情况下，粘合剂可能从基板脱离，本发明中为了提高粘合剂和基板之间的粘合力而建议在粘合剂内部包含支撑部件的方法。
其中，支撑部件可以构成为金属片(metal sheet)，金属片可以增加粘合剂和基板之间的接触区域。同时，金属片在粘合剂内部起到了骨架的作用，结构上可以防止粘合剂脱离。为了增加粘合力，金属片的表面可以具有预定数值以上的粗糙度(roughness)。
并且，在粘合剂的厚度较薄的情况下，由于粘合剂和基板之间的粘合力并不充分，从而透镜可能从基板脱离。在此情况下，为了提高粘合剂和基板之间的粘合力，也可以在粘合剂内部包含金属片。
根据实施例，金属片的部分构成可以具有弹性，并且金属片的一端部可以接触于透镜。根据实施例，针对接触于金属片的部分构成的透镜端部施加沿Z轴方向的力，从而可以固定透镜并且可以防止透镜从基板脱离。
图4a至图4c是图示本申请的透镜模块包含支撑部件的一实施例的剖面图。
参照图1至图4a，透镜模块包括基板10、位于基板10上的发光元件20、覆盖发光元件20的透镜单元30以及粘合于基板10和透镜单元30并牢固地连接基板10和透镜单元30的粘合部40。
根据实施例，粘合部40固化后基板10和透镜单元30借由粘合部40的粘合力而固定，并且透镜模块可以将被防水处理。
如图4b所示，若基板10和粘合部40的接触面积减少，则基板10和粘合部40之间的粘合力可能减少。尤其，在基板10的边缘，基板10和粘合部40之间的粘合力减少的可能性较高。
若粘合部40和基板10之间的粘合力减少而使粘合部40从基板10上脱离(或剥离)，则对透镜模块的防水性能也可能造成影响。
在此情况下，为了防止粘合部40从基板10脱离的情况(或者剥离的情况)，本发明中建议如图4c所示地在粘合部40内包含支撑部件60的方案。支撑部件60可以是金属片，并且金属片可实现为增加粘合部40和基板10之间的接触面积或增加粗糙度。同时，金属片在粘合剂内部起到了骨架的作用，结构上可以防止粘合剂脱离。据此，支撑部件60可以防止粘合部40从基板10脱离。
在此情况下，支撑部件60可以在表面贴装(SMT：Surface Mount Tech nology)工序中安装于基板10上。支撑部件60为了防止粘合部40在基板10松动或剥离可以实现为多种形状。
图4c所示的支撑部件60的形状仅是用于解决本申请的技术问题的一形态，本申请的技术思想并不局限于图4c所图示的支撑部件60的形状，支撑部件60可以实现为多种形态。
并且，支撑部件60并不仅局限于金属片(metal sheet)，也可以实现为能够巩固粘合部40和基板10的连接的其他物质。
图5a至图5c是示出本申请的透镜模块包含支撑部件的另一实施例的剖面图。
参照图1至图5a，透镜模块包括基板10、位于基板10上的发光元件20、覆盖发光元件20的透镜单元30以及粘合于基板10和透镜单元30并牢固地连接基板10和透镜单元30的粘合部40。其中，透镜单元30可以借由粘合 部40的压力而固定。
图5b中，在外部的力(external force)沿弱化透镜单元30和基板10的连接的方向施加的情况下，透镜单元30的部分接触面从基板10脱离，从而在透镜单元30和基板10之间可能会发生间隙(Gap)。此情况下，由于透镜单元30和粘合部40的接触面积减少，从而可能使透镜单元30和粘合部40之间的粘合力减少。
如图5b所示，为了防止透镜单元30从基板10脱离的情况，本发明中建议如图5c所示地在粘合部40内包含支撑部件60的方案。
在此情况下，支撑部件60可以在表面贴装(SMT：Surface Mount Tech nology)工序中安装于基板10上。支撑部件60为了防止透镜单元30在基板10松动或剥离可以实现为多种形状。
图5c所示的支撑部件60的形状仅是用于解决本申请的技术问题的一形态，本申请的技术宗旨并不局限于图5c所示的支撑部件60的形状，支撑部件60可以实现为多种形态。
支撑部件60可实现为金属片(metal sheet)，支撑部件60可以实现为接触于透镜单元30的一端部并朝Z轴方向对透镜单元30的一端部施加压力，从而固定透镜单元30。据此，可以防止透镜单元30从基板10脱离。
并且，支撑部件60并不仅局限于金属片(metal sheet)，也可以实现为能够巩固透镜单元30和基板10的连接的其他物质。
图6是示出根据本申请的第一实施例的支撑部件的立体图，图7是同时图示根据本申请的第一实施例的支撑部件和基板的立体图。
参照图6，根据本申请的第一实施例的支撑部件60a可实现为金属片。支撑部件60a可以包括延伸部61a、接合支架62a、接合部63a以及垫(pad)64a。延伸部61a可被称为隆起(hump)，接合支架62a可被称为夹子支架(clip holder)，接合部63a可被称为夹子(clip)。
根据实施例，延伸部61a可设定为使包含于透镜模块的支撑部件60a和粘合部40的接触面积最大化。根据实施例，延伸部61a可实现为使支撑部件60a和粘合部40的接触面积成为预设面积以上。
并且，为了增加支撑部件60a和粘合部的接触面积，延伸部61a可以实现为包含孔(hole)。在此情况下，粘合部(glue)插入于延伸部61a内的孔内，从而可以使支撑部件60a和粘合部的接触面积增加。
接合支架62a是支撑接合部63a的构成，接合部63a可以为了连接包含于透镜模块的透镜单元和支撑部件60a而使用。
参照图6及图7，支撑部件60a的垫64a位于基板10上的垫区域11上，从而支撑部件60a可以安装于基板10上。
图8是图示根据本申请的第一实施例的支撑部件安装于基板上的形状的正视图，图9是图示根据本申请的第一实施例的支撑部件安装于基板上的形状的侧视图。
参照图6至图8，支撑部件60a可以包含于粘合部40内并安装于基板10上。支撑部件60a可以实现为多种形态，从而使粘合部40和基板10牢固地连接。
支撑部件60a的垫64a可以借由SMT工序固定于基板10上的垫区域11上。
根据实施例，支撑部件60a的延伸部61a的长度A可以实现为比接触于基板10的支撑部件60a的主体的长度B长。
在延伸部61a的长度A实现为大于支撑部件60a的主体的长度B的情况下，具有如下效果：通过增加支撑部件60a和粘合部的接触面积，从而可以提高支撑部件60a和粘合部的粘合力。
并且，在延伸部61a的长度A实现为大于支撑部件60a的主体的长度B的情况下，具有如下效果：通过增加支撑部件60a和粘合部之间的接触面的粗糙度，从而可以提高支撑部件60a和粘合部的粘合力。
根据实施例，延伸部61a的长度A可实现为大于粘合部40的厚度C。
在延伸部61a的长度A实现为大于粘合部40的厚度C的情况下，可具有增加针对粘合部40的支撑部件60a的支撑力的效果。
参照图6至图9，支撑部件60a可以通过在支撑部件60a内实现的接合部63a和透镜单元30的端部紧固。支撑部件60a与透镜单元30的端部紧固的过程具体地图示在图10a至10c中。
图10a至图10c是图示根据本申请的第一实施例的支撑部件与透镜单元连接的过程的侧视图。
参照图6至图10a，在支撑部件60a支撑接合部63a的接合支架62a可以具有弹性，并且可形成为沿Z轴方向受力。根据实施例，支撑部件60a的接合支架62a的形态以及尺寸可以根据透镜单元30的端部的形态以及尺寸而调 整。
在支撑接合部63a的接合支架62a具有弹性的情况下，具有如下效果：可以更加容易地将接合部63a紧固到透镜单元30的端部，并且可以减少紧固时所需的力。
并且，在支撑部件60a的接合支架62a的形态以及尺寸根据透镜单元30的端部的形态以及尺寸而调整的情况下，具有如下效果：可以减少将接合部63a紧固到透镜单元30的端部所需的力，并且可以减少工序中的电力消耗。
根据实施例，接合支架62a的紧固孔的形态可形成为对应于将紧固的透镜单元30的端部。根据实施例，接合支架62a的紧固孔的尺寸可形成为对应于将紧固的透镜单元30的端部的厚度。
在接合支架62a的紧固孔的尺寸形成为与将紧固的透镜单元30的端部的厚度相应的尺寸的情况下，具有可以更加容易地将接合部63a紧固到透镜单元30的端部的效果。
参照图6至图10b，若施加使支撑部件60a的接合部63a紧固到透镜单元30的端部的沿Z轴方向的外部力，则具有弹性的接合支架62a的形态可以变形。
参照图6至图10c，若支撑部件60a的接合部63a和透镜单元30的端部紧固，则接合支架62a可以恢复至原形态。
图11是示出根据本申请的第二实施例的支撑部件的立体图。
参照图11，根据本申请的第二实施例的支撑部件60b可实现为金属片。支撑部件60b可包括延伸部61b、接合支架62b、接合部63b以及垫62b。
根据本申请的第二实施例的延伸部61b可实现为预设长度，以增加包含于透镜模块的支撑部件60b和粘合部40的接触面积。
然而，与如6所示的根据本申请的第一实施例的支撑部件60a不同地，图11所示的根据本申请的第二实施例的支撑部件60b内的延伸部61b可以实现为不包含孔(hole)。在此情况下，由于延伸部61b并不包含孔，从而具有可以更加简化制造支撑部件60b的工序的效果。
根据本申请的第二实施例的支撑部件60b由于在延伸部61b内并不具备孔，从而具有可以更加容易地制造支撑部件60b的效果。并且，虽然延伸部61b内并未具备孔，然而在延伸部61b实现为延伸部61b与粘合部所接触的端面的粗糙度为预设的临界值以上的情况下，具有如下效果：可以增加延伸 部61b和粘合部之间的摩擦力，并且支撑部60b可以更加巩固地支撑粘合部。
图12是图示根据本申请的第三实施例的支撑部件的立体图。图13a是同时图示根据本申请的第三实施例的支撑部件和基板的立体图，图13b是图示根据本申请的第三实施例的支撑部件的正视图，图13c是根据本申请的第三实施例的支撑部件的侧视图。
参照图12及图13a，根据本申请的第三实施例的支撑部件60c可实现为金属片。支撑部件60c可包括延伸部61c、接合支架62c、接合部63c以及垫64c。
根据本申请的第三实施例的支撑部件60c由于延伸部61c的长度并未较长地实现，从而也可以在透镜模块内的小面积内设置。
根据本申请的第一实施例的支撑部件60a以及根据第二实施例的支撑部件60b较长地实现延伸部以增加支撑部件和粘合部的接触面积，相反，根据本申请的第三实施例的支撑部件60c具有构成较窄宽度的延伸部61c的特征，从而即使在粘合部或基板的宽度较窄的情况下也可以在粘合部内实现支撑部件。
在支撑部件60c具备窄宽度的延伸部61c的情况下，具有即使在粘合有粘合部的基板的边缘(edge)部分也可以容易地设置支撑部件60c的效果。并且，在透镜模块具备较大的透镜单元的情况下，将具备窄宽度的延伸部61c的支撑部件60c安装于透镜模块内，从而具有可以增大透镜模块的光射出功能的效果。
并且，通过在透镜模块内安装具备窄宽度的延伸部61c的多个支撑部件60c，从而具有相比于其他类型的支撑部件可以确保更大的支撑力的效果。
根据实施例，延伸部61c的长度可以设定为相对于基板的宽度为预设比例。根据另一实施例，延伸部的长度可以设定为相对于粘合部的厚度为预设比例。
然而，为了增加支撑部件60c和粘合部的接触面积，延伸部61c可以实现为包含孔。在此情况下，由于粘合部插入至延伸部61c内的孔内，从而可以增加支撑部件60c和粘合部的接触面积。
参照图12至图13b，支撑部件60c的垫64c可以构成为位于基板10上的垫区域11上。支撑部件60c的垫64c安装于基板10上的垫区域11，并且支撑部件60c可以与基板10连接。
参照图12至图13c，支撑部件60c的接合部63c可构成为固定包含于透镜模块内的透镜单元。支撑部件60c的接合部63c可以紧固于透镜单元的端部，并且支撑部件60c可以与透镜单元连接。
图14是图示根据本申请的第三实施例的支撑部件安装于基板上的形状的正视图，图15是图示根据本申请的第三实施例的支撑部件安装于基板上的形状的侧视图。
参照图12至图14，支撑部件60c可以包含于粘合部40内并可以安装于基板10上。支撑部件60c可以实现为多种形态以牢固地连接粘合部40和基板10。
支撑部件60c的垫64c可以借由SMT工序固定于基板10上的垫区域11上。
根据实施例，支撑部件60c的延伸部61c的长度A’可以以相对于接触于基板10的支撑部件60c的主体的长度B’为预设比例的方式较短地实现。
即使延伸部61c的长度A’实现为比支撑部件60c的主体的长度B’短，通过使延伸部61c实现为弯曲的形态，可以增加支撑部件60c和粘合部40的接触面积，从而具有可以提升支撑部件60c和粘合部40的粘合力的效果。
并且，即使延伸部61c的长度A’实现为比支撑部件60c的主体的长度B’短，通过将延伸部61c实现为弯曲的形态，可以增加支撑部件60c和粘合部40之间的粗糙度，从而具有可以提升支撑部件60c和粘合部40的粘合力的效果。
根据实施例，延伸部61c的长度A’可以较短地形成为相对于粘合部40的厚度C’为预设比例。
即使延伸部61c的长度A’实现为比粘合部40的厚度C’短，通过将延伸部61c实现为弯曲的形态，从而具有可以增加针对粘合部的支撑部件60c的支撑力的效果。
参照图12至图15，支撑部件60c可以利用在支撑部件60c内实现的接合部63c牢固地固定透镜单元30。支撑部件60c牢固地固定透镜单元30的过程具体地图示在图16a至16c中。
图16a至图16c是图示根据本申请的第三实施例的支撑部件与透镜单元连接的过程的侧视图。
参照图12至图16a，支撑部件60c的接合部63c可以实现为具有弹性并 且沿Z轴方向受力。支撑部件60c的接合部63c的形态以及尺寸可以根据透镜单元30的端部的形态及尺寸而调整。
例如，接合部63c的形态可形成为与用于固定的透镜单元30的端部对应。例如，接合部63c的高度(即，从基板10至接合部63c之间的距离)可以设定为相对于被固定的透镜单元30的端部的厚度为预设比例。
参照图12至图16b，若为使支撑部件60c的接合部63c与透镜单元30的端部紧固而施加沿Z轴方向的外部力，则具有弹性的接合部63c的形态可以变形。
参照图12至图16c，若支撑部件60c的接合部63c与透镜单元30的端部紧固，则接合部63c可以恢复至原形态。
图17是示出根据本申请的第四实施例的支撑部件的立体图。
参照图17，根据本申请的第四实施例的支撑部件可实现为金属片。与根据本申请的第三实施例的支撑部件类似地，根据本申请的第四实施例的支撑部件可以包括延伸部、接合支架、接合部以及垫。
然而，与图12所示的根据本申请的第三实施例的支撑部件不同地，图17所示的根据本申请的第四实施例的支撑部件内的延伸部实现为并不包含孔。在此情况下，由于延伸部并不包含孔，从而具有使制造支撑部件的工序更加简化的效果。
根据本申请的第四实施例的支撑部件由于在延伸部内不具备孔，从而具有可以更加容易地制造支撑部件的效果。并且，虽然在延伸部内不具备孔，然而在延伸部实现为延伸部与粘合部所接触的端面的粗糙度在预设的临界值以上的情况下，具有如下效果：增加延伸部与粘合部之间的摩擦力，并且支撑部件可以更牢固地支撑粘合部。
虽然本申请中图示根据第一实施例至第四实施例的支撑部件并重点对此进行说明，然而本发明的技术思想并不局限于此，为了防止粘合剂或透镜从基板脱离，安装于透镜模块内的支撑部件可实现为除第一实施例至第四实施例以外的其他形态。
例如，支撑部件为了增加与粘合部的接触面积可实现为更加弯曲的形态的延伸部。例如，支撑部件在延伸部内可具备多个孔，并且在垫内也可具备至少一个孔。
图18a至图18d是图示根据本申请的实施例设计透镜模块的过程的图。
参照图1至图18a，SMT工序中可在基板10上安装多个发光元件20和多个支撑部件60。其中，多个支撑部件60可以分别是根据本申请的第一实施例至第四实施例的支撑部件中的任意一个支撑部件。
虽然图18a中图示了基板上安装有12个支撑部件60的示例，然而本发明的技术思想并不局限于此，而且在SMT工序中可在基板10上安装多种数量的支撑部件60。
参照图1至图18b，透镜单元30可以位于安装有多个发光元件20和多个支撑部件60的基板10上。在此情况下，透镜单元30的至少一个端部可以借由包含在各个多个支撑部件60的接合部或接合支架而固定。即，透镜单元30可以借由安装于基板10上的多个支撑部件60与基板10牢固地连接。
参照图1至图18d，可以利用预设的特殊模具在基板10和透镜单元30所连接的透镜模块内填充粘合部40。其中，粘合部40可以由密封粘合剂或塑料构成。
参照图1至图18d，若在透镜模块内填充的粘合部40凝固(或固化)，即可完成包含根据本申请的实施例的支撑部件的透镜模块。
图19a至19c是示出在本申请的基板实现支撑部件的实施例的剖面图。
参照图1至图19a，位于基板10上的粘合部40-1可以实现为塑料类型。其中，借由基板10和粘合部40-1之间的摩擦力，从而可以使基板10和粘合部40-1可以彼此牢固地连接。
然而，在图19b中，在基板10的表面光滑而使基板10和粘合部40-1之间的粘合力变小的情况下，粘合部40-1从基板10分离，从而可能在粘合部40-1的一部分和基板10之间产生间隙(Gap)。
为了解决塑料类型的粘合部40-1从基板10分离的问题，本发明中建议如图19c所示地在基板10包含支撑部件70的方案。支撑部件70可以实现为锥坑孔(countersunk hole)的形态，若在锥坑孔内填充塑料类型的粘合部40-1，则可以防止粘合部40-1从基板10分离。
图19c所示的支撑部件70的形状仅是用于解决本申请的技术问题的一形态，本申请的技术思想并不局限于图19c所示的支撑部件70的形状，支撑部件70可以实现为多种形态。
以上，虽然参照本发明的优选实施例进行了说明，但是可以理解为只要是对相关技术领域熟悉的从业人员或者在相关技术领域具备通常知识的人， 就可以理解能够在不脱离权利要求书中记载的本发明的思想及技术领域的范围内对本发明进行多种修改及变更。
因此，本发明的技术范围应仅通过权利要求书的范围决定，而不被说明书的详细说明中所记载的内容所限定。

Claims (10)

  1. 一种透镜模块，其特征在于，包括：
    基板，具有多个发光区域；
    发光元件，提供于各个所述多个发光区域上而发出光；
    透镜单元，提供于所述基板上而覆盖所述发光元件；
    粘合部，接触于所述基板以及所述透镜单元，从而固定所述基板以及所述透镜单元；以及
    支撑部件，提供于所述粘合部内，并且安装于所述基板上，
    其中，所述支撑部件包括用于增加所述支撑部件和所述粘合部之间的接触面积的延伸部以及连接于所述透镜单元的接合部。
  2. 如权利要求1所述的透镜模块，其特征在于，
    所述支撑部件构成为金属片，并且还包括支撑所述接合部的接合支架以及安装于所述基板上的垫。
  3. 如权利要求1所述的透镜模块，其特征在于，
    所述延伸部提供有孔。
  4. 如权利要求1所述的透镜模块，其特征在于，
    所述延伸部构成为具有与所述支撑部件接触于所述基板的长度的比例为预设的第一比例的长度，或者
    所述延伸部构成为具有与所述粘合部的厚度的比例为预设的第二比例的长度。
  5. 如权利要求2所述的透镜模块，其特征在于，
    所述接合支架具有当被施加沿垂直于所述基板的Z轴方向的外部力时形态变形的弹性，
    所述接合支架的形态变形使得所述接合部和所述透镜单元的端部紧固，而若此后所述接合部和所述透镜单元紧固，则变形的所述接合支架的形态复原。
  6. 如权利要求5所述的透镜模块，其特征在于，
    所述接合支架的形态构成为与所述透镜单元的端部的形态对应，或者
    所述接合支架的长度具有与所述透镜单元的端部的厚度的比例为预设的第三比例的长度。
  7. 如权利要求1所述的透镜模块，其特征在于，
    所述接合部具有当被施加沿垂直于所述基板的Z轴方向的外部力时形态变形的弹性，
    所述接合部的形态变形使得所述支撑部件固定所述透镜单元，而若此后所述透镜单元被固定，则所述接合部的形态复原。
  8. 如权利要求7所述的透镜模块，其特征在于，
    所述接合部的形态构成为与所述透镜单元的端部的形态对应，或者
    所述接合部和所述基板之间的距离构成为与所述透镜单元的端部的厚度的比例为预设的第四比例。
  9. 如权利要求1所述的透镜模块，其特征在于，
    包括考虑所述基板、所述透镜单元以及所述粘合部的形态而决定的彼此不同类型的多个支撑部件。
  10. 如权利要求9所述的透镜模块，其特征在于，
    所述多个支撑部件包括如下支撑部件中的至少两个：
    第一支撑部件，包括具有第一长度且包含孔的第一延伸部；
    第二支撑部件，包括具有所述第一长度且不包含孔的第二延伸部；
    第三支撑部件，包括具有比所述第一长度短的第二长度且包含孔的第三延伸部；以及
    第四支撑部件，包括具有所述第二长度且不包含所述孔的第四延伸部。
PCT/CN2020/123754 2019-10-25 2020-10-26 透镜模块 WO2021078303A1 (zh)

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