WO2021078038A1 - Antenna, antenna encapsulating method and terminal - Google Patents

Abstract

The present application provides an antenna, antenna encapsulating method and a terminal. The antenna includes: a first glass substrate, a first antenna layer, a second antenna layer, a first encapsulation layer, a second encapsulation layer, and a first metal connecting pillar; the first glass substrate includes a first surface and a second surface that are opposed to each other, the first antenna layer is provided on the first surface, the second antenna layer is provided on the second surface, the first encapsulation layer covers the first surface and the first antenna layer, the second encapsulation layer covers the second surface and the second antenna layer; a first accommodating groove is provided in the first glass substrate, an insulator is provided in the first accommodating groove, the first metal connecting pillar is provided in the insulator, and the two ends of the first metal connecting pillar are respectively connected with the first antenna layer and the second antenna layer. In the antenna, antenna encapsulating method, and terminal provided in the present application, glass is used as the antenna medium, which has low dielectric loss and good antenna performance.

Description

Antenna, antenna packaging method and terminal

This application claims the priority of the Chinese patent application filed with the Chinese Patent Office on October 22, 2019, the application number is 201911007437.7, and the application name is "antenna, antenna packaging method and terminal", the entire content of which is incorporated into this application by reference .

Technical field

This application relates to the field of packaging and the technical field of communication equipment, and in particular to an antenna, an antenna packaging method, and a terminal.

Background technique

With the advent of the era of high-speed communications such as 5G and virtual reality, there are more and more applications and designs of millimeter wave antennas. Since the wavelength of the millimeter wave frequency band is extremely small and the sensitivity to processing errors is very high, a high-precision process is required to manufacture the millimeter wave antenna, such as an antenna in package (AIP).

The packaged built-in antenna includes an antenna and a radio frequency chip. The antenna includes an upper antenna layer, a lower reference ground layer, and a feeder connecting the upper antenna layer. The feeder is connected to the radio frequency chip, and the radio frequency chip has other ports and modules connected to it. In addition, among the above-mentioned packaged built-in antennas, wafer-level packaging technology is generally used to design packaged built-in antennas, using thick encapsulating plastic as the antenna medium, and using the rewiring layer as the interconnection layer, which can reduce the interconnection scale and loss, and compress the interconnection space. .

However, the use of plastic packaging material as the antenna medium has high dielectric loss, which affects the antenna gain.

Summary of the invention

The embodiments of the present application provide an antenna, an antenna packaging method, and a terminal. Glass is used as the antenna medium, which has low dielectric loss and good antenna performance.

In a first aspect, an embodiment of the present application provides an antenna, including a first glass substrate, a first antenna layer, a second antenna layer, a first encapsulation layer, a second encapsulation layer, and a first metal connecting post; wherein, the first glass substrate The substrate includes a first surface and a second surface that are opposed to each other. The first antenna layer is disposed on the first surface, the second antenna layer is disposed on the second surface, the first encapsulation layer covers the first surface and the first antenna layer, and the second encapsulation The layer covers the second surface and the second antenna layer; the first accommodating groove is provided in the first glass substrate, an insulator is provided in the first accommodating groove, the first metal connecting column is arranged in the insulator, and the first metal connecting column The two ends of are respectively connected to the first antenna layer and the second antenna layer.

In the first aspect of the present application, the first glass substrate is used as the antenna medium, and the first glass substrate is made of glass. Compared with the plastic molding compound as the medium, the dielectric loss of the first glass substrate is lower and the antenna The high gain can effectively reduce the package volume. In addition, the antenna metal layers on the upper and lower surfaces of the first glass substrate are connected by metal connection posts, and an insulator is filled between the metal connection posts and the glass, which can avoid direct contact between the metal connection posts and the glass, and can prevent the glass from cracking when the temperature changes. In addition, the slot on the first glass substrate is decoupled from the design of the metal connecting column. The diameter of the metal connecting column and the position adjustment within a certain range do not require the cooperation of glass manufacturers, which can greatly shorten the development cycle of antenna design and repeat glass proofing the cost of.

In the above embodiment, the antenna further includes: a radio frequency chip electrically connected to the first antenna layer. The RF chip is used to connect the antenna on the one hand, and connect to the external circuit board on the other hand.

In a possible implementation, the radio frequency chip is disposed on the surface of the first antenna layer away from the first glass substrate.

In another possible implementation manner, a second accommodating groove is provided in the first glass substrate, and the radio frequency chip is located in the second accommodating groove.

With this design, the radio frequency chip can be built into the glass substrate, reducing the overall volume of the antenna.

In the above embodiment, the antenna further includes a second metal connection post and a third encapsulation layer; the second metal connection post is arranged on the surface of the first antenna layer away from the first glass substrate, and the third encapsulation layer covers the radio frequency chip and the second metal Connecting the pillars, and the end of the second metal connecting pillar is exposed on the surface of the third packaging layer away from the first glass substrate.

In this design, the radio frequency chip is protected by the third encapsulation layer, and the radio frequency chip and the first antenna layer are connected to the outside through the second metal connecting column.

In the above embodiment, the antenna further includes solder ball bumps, the solder ball bumps are arranged on the surface of the third packaging layer away from the first glass substrate, and the solder ball bumps are connected to the second metal connecting pillars through the metal ball pads.

With such a design, the connection between the antenna and the circuit board can be realized by using the solder ball bumps.

In the above-mentioned embodiment, the antenna further includes a blocking member, and the blocking member is arranged in the third encapsulation layer and is electrically connected to the first antenna layer.

Such a design can reduce electromagnetic interference by blocking the container.

In a possible implementation manner, a first rewiring layer is provided on the first antenna layer. By arranging the first rewiring layer on the first antenna layer, the interconnection of the metal layers of the multi-layer antenna can be realized, and the efficiency and performance of the antenna can be improved.

In a possible implementation, the antenna further includes a second glass substrate, a third antenna layer, and a fourth encapsulation layer; the second glass substrate is disposed on the surface of the second antenna layer away from the first glass substrate, and the third antenna layer It is arranged on the surface of the second glass substrate away from the first glass substrate, and the fourth encapsulation layer covers the surface of the second glass substrate away from the first glass substrate and the third antenna layer.

In this design, the double-layer thick glass is set as the antenna medium in the antenna, which can further reduce the dielectric loss and improve the gain performance of the antenna.

In a possible implementation manner, a second rewiring layer is provided on the second antenna layer. By arranging the second rewiring layer on the second antenna layer, the interconnection of the metal layers of the multi-layer antenna can be realized, and the efficiency and performance of the antenna can be improved.

In a possible implementation, the thickness of the second rewiring layer is 3 μm-10 μm. Such a design can make the thickness of the second rewiring layer small, reduce the scale and loss of the antenna interconnection, compress the interconnection space, and expand the flexibility of antenna design.

In a possible embodiment, the thickness of the first glass substrate and the second glass substrate is 150 μm-800 μm. Such a design can ensure low dielectric loss of the glass substrate, reduce the thickness of the antenna, and reduce the packaging volume; on the other hand, it can ensure that the first glass substrate and the second glass substrate have high mechanical strength, and the risk of failure is low.

In a possible implementation manner, a conductive via is provided in the insulator, and the conductive via is connected to the first metal connecting post and the first antenna layer. With such a design, the electrical connection between the first metal connecting pillar and the first antenna layer is realized through the conductive via.

In a second aspect, an embodiment of the present application provides an antenna packaging method, including the following steps:

A supporting base and a first glass substrate are provided, wherein a separation layer is provided on the supporting base, and a first containing groove is provided in the first glass substrate;

Forming a first antenna layer on the separation layer, and forming a first metal connecting pillar on the first antenna layer;

Forming a first encapsulation layer covering the first antenna layer, and one end of the first metal connecting pillar away from the separation layer is exposed outside the first encapsulation layer;

Bonding the first glass substrate to the separation layer, placing the first metal connecting column in the first accommodating groove, and filling the first accommodating groove with an insulating material to form an insulator;

Forming a second antenna layer on the surface of the first glass substrate away from the support base, and forming a second encapsulation layer covering the second antenna layer, the second antenna layer and the first metal connecting post are electrically connected;

Peel off the separation layer and the supporting substrate.

The antenna packaging method provided by the embodiments of the present application uses the first glass substrate as the antenna medium, and the first glass substrate is made of glass. Compared with the plastic packaging material as the medium, the first glass substrate has low dielectric loss and high antenna gain. , Can effectively reduce the package volume. In addition, the antenna metal layers on the upper and lower surfaces of the first glass substrate are connected by metal connection posts, and an insulator is filled between the metal connection posts and the glass, which can prevent the metal connection posts from directly contacting the glass and prevent the glass from cracking when the temperature changes. Furthermore, the slot on the first glass substrate is decoupled from the design of the metal connecting column. The diameter of the metal connecting column and the position adjustment within a certain range do not require the cooperation of glass manufacturers, which can greatly shorten the development cycle of antenna design and repeat glass. The cost of proofing.

In a possible embodiment, after the step of peeling off the separation layer and the supporting substrate, the antenna packaging method further includes: bonding the radio frequency chip, the radio frequency chip and the first antenna layer on the surface of the first antenna layer away from the first glass substrate Electric connection.

In a possible implementation manner, after the step of bonding the radio frequency chip on the surface of the first antenna layer away from the first glass substrate, the antenna packaging method further includes: on the surface of the first antenna layer away from the first glass substrate A second metal connecting pillar is formed; a third packaging layer covering the radio frequency chip is formed, and an end of the second metal connecting pillar away from the first glass substrate is exposed outside the third packaging layer.

In a possible implementation, after the step of bonding the radio frequency chip on the surface of the first antenna layer away from the first glass substrate, the antenna packaging method further includes:

Forming or attaching a blocking container on the surface of the first antenna layer away from the first glass substrate;

A third encapsulation layer covering the blocking container and the surface of the first antenna layer away from the first glass substrate is formed.

In a possible implementation manner, the antenna packaging method further includes: forming a metal ball pad on the third packaging layer, the metal ball pad and the second metal connecting post are electrically connected, and a solder ball bump is formed on the metal ball pad.

In another possible embodiment, after the first antenna layer is formed on the separation layer, the antenna packaging method further includes: connecting a radio frequency chip on the first antenna layer; after the step of providing the first glass substrate, the antenna packaging method It also includes: opening a second accommodating groove on the first glass substrate; the step of bonding the first glass substrate to the separation layer includes: placing the radio frequency chip in the second accommodating groove, and filling the second accommodating groove with an insulating material Two accommodating grooves to form an insulator.

In a possible implementation, the antenna packaging method further includes: providing a second glass substrate; adhering the second glass substrate to the second packaging layer; forming on the surface of the second glass substrate away from the first glass substrate The third antenna layer, and a fourth encapsulation layer covering the third antenna layer is formed.

In a third aspect, an embodiment of the present application provides an antenna packaging method, including the following steps: providing a first glass substrate and a second glass substrate; opening a first accommodating groove in the first glass substrate; forming on the second glass substrate The second antenna layer and the first metal connecting post located on the second antenna layer, and a second packaging layer covering the second antenna layer is formed; bonding the first glass substrate to the second glass substrate, the first metal connecting post Inserted in the first accommodating groove; filling the first accommodating groove with an insulating material to form an insulator; forming a first antenna layer on the surface of the first glass substrate away from the second glass substrate, and forming a covering layer The first encapsulation layer; a third antenna layer is formed on the surface of the second glass substrate away from the first glass substrate, and a fourth encapsulation layer covering the third antenna layer is formed.

In the foregoing embodiment, the antenna packaging method further includes: forming a connection radio frequency chip on a surface of the first antenna layer away from the first glass substrate.

In the above embodiment, the antenna packaging method further includes: forming a second metal connecting post on the surface of the first antenna layer away from the first glass substrate; forming a surface that covers the radio frequency chip and the first antenna layer away from the first glass substrate. The third encapsulation layer and the end of the second metal connecting pillar away from the first glass substrate is exposed outside the third encapsulation layer.

In the above embodiment, the antenna packaging method further includes: forming a metal ball pad on the third packaging layer, and the metal ball pad is electrically connected to the second metal connecting post; and forming a solder ball bump on the metal ball pad.

The antenna packaging method provided by the embodiments of the present application uses the first glass substrate and the second glass substrate as the antenna medium. Compared with the use of a plastic molding compound as the medium, the dielectric loss is low, the antenna gain is high, and the packaging volume can be effectively reduced. The design of double-layer glass substrate and three-layer antenna metal layer can improve the gain and bandwidth of the antenna. In addition, the antenna metal layers on the upper and lower surfaces of the first glass substrate are connected by the first metal connecting pillars, and an insulator is filled between the first metal connecting pillars and the first glass substrate to avoid direct contact between the first metal connecting pillars and the first glass substrate. , Can prevent the first glass substrate from cracking when the temperature changes. In addition, the design of the first accommodating groove on the first glass substrate and the first metal connecting column is decoupled, and the diameter of the first metal connecting column and the position adjustment within a certain range do not require the cooperation of the glass manufacturer, which can greatly shorten the antenna design. The development cycle and the cost of repeated glass proofing.

In a fourth aspect, an embodiment of the present application provides a terminal, including: a circuit board and the above antenna, and the antenna is connected to the circuit board.

Description of the drawings

FIG. 1 is a schematic structural diagram of an antenna provided in Embodiment 1 of the present application;

FIG. 2 is a schematic diagram of the corresponding structure of forming a first antenna layer, a first metal connecting pillar, and a first encapsulation layer on the separation layer;

FIG. 3 is a schematic diagram of the structure corresponding to the opening of the first accommodating groove on the first glass substrate;

4 is a schematic diagram of a structure corresponding to bonding the first glass substrate and the separation layer and filling the insulator in the first containing groove;

FIG. 5 is a schematic diagram of a structure corresponding to the second antenna layer and the second encapsulation layer formed on the first glass substrate;

FIG. 6 is a schematic diagram of the corresponding structure of bonding a radio frequency chip on the first antenna layer after the separation layer is peeled off;

FIG. 7 is a schematic diagram of a structure corresponding to bonding a radio frequency chip on the first antenna layer and opening a second accommodating groove on the first glass substrate;

FIG. 8 is a schematic diagram of the structure corresponding to the built-in radio frequency chip in the first glass substrate;

FIG. 9 is a schematic diagram showing the structure corresponding to the formation of the second metal connecting column and the connecting resistance container member;

FIG. 10 is a schematic diagram of the structure of forming a third packaging layer and solder ball bumps;

FIG. 11 is a schematic structural diagram of an antenna provided in Embodiment 2 of the present application;

12 is a schematic diagram of the structure of forming a second antenna layer, a first metal connecting pillar and a second packaging layer on a second glass substrate;

FIG. 13 is a schematic structural diagram of a schematic diagram of a structure corresponding to a first glass substrate and a second glass substrate that are bonded together, filled with an insulator in the first accommodating groove, and slotted at the corresponding position of the first metal connecting column;

14 is a schematic diagram of the corresponding structure of forming the first antenna layer, the first encapsulation layer, the third antenna layer, and the fourth encapsulation layer;

FIG. 15 is a schematic diagram of a structure corresponding to forming a second metal connecting pillar and bonding a radio frequency chip.

Description of reference signs:

11-first glass substrate; 111-first accommodating groove; 112-insulator; 113-second accommodating groove; 114-conductive via; 12-first antenna layer; 13-second antenna layer; 14-th One encapsulation layer; 15-second encapsulation layer; 16-first metal connection pillar; 17-radio frequency chip; 18-second metal connection pillar; 19-third encapsulation layer; 20-solder bump; 21-metal ball Mat; 22-resistance container; 23-second glass substrate; 24-third antenna layer; 25-fourth encapsulation layer; 26-support base; 27-separation layer.

Detailed ways

The antenna, antenna packaging method, and terminal provided in the present application will be described below with reference to the accompanying drawings and specific embodiments.

Example one

Fig. 1 is a structural schematic diagram 1 of the antenna provided in the first embodiment of the present application. Referring to Fig. 1, the antenna provided in the first embodiment of the present application includes a first glass substrate 11, a first antenna layer 12, a second antenna layer 13, and a second antenna layer. An encapsulation layer 14, a second encapsulation layer 15 and a first metal connecting pillar 16.

Wherein, the first glass substrate 11 is a plate-shaped structure made of glass, the first glass substrate 11 includes a first surface and a second surface that are opposed to each other, and the first surface is the lower surface of the first glass substrate 11 shown in FIG. 1 , The second surface is the upper surface of the first glass substrate 11 shown in FIG. 1. As the antenna medium, the first glass substrate 11 has a thickness of 150 μm-800 μm, which can reduce the thickness of the medium compared to using a plastic molding compound as the antenna medium.

In this embodiment, the first glass substrate 11 is used as the antenna medium, which can reduce the dielectric loss and improve the antenna performance compared with the use of a plastic molding compound as the antenna medium. Compared with plastic packaging materials, the glass substrate has high mechanical strength, low warpage, low difficulty in packaging and subsequent board processing, and low failure risk.

The first antenna layer 12 is disposed on the first surface of the first glass substrate 11, and the second antenna layer 13 is disposed on the second surface of the first glass substrate 11. Both the first antenna layer 12 and the second antenna layer 13 are metal wiring layers, and their materials may include one or a combination of two or more of copper, nickel, aluminum, gold, silver, and titanium. The first antenna layer 12 and the second antenna layer 13 can be arranged in various patterns according to the performance requirements of the antenna.

In a possible implementation manner, both the first antenna layer 12 and the second antenna layer 13 may be provided with a rewiring layer, and the thickness of the rewiring layer is 3 μm-10 μm. The re-wiring layer can realize high-density wiring, reduce the scale and loss of antenna interconnection, compress the interconnection space, and expand the flexibility of antenna design.

In the above embodiment, the first encapsulation layer 14 covers the first surface and the first antenna layer 12, and the second encapsulation layer 15 covers the second surface and the second antenna layer 13. The first encapsulation layer 14 and the second encapsulation layer 15 may include one of epoxy resin, silica gel, and polyimide PI, which protect the first antenna layer 12 and the second antenna layer 13 respectively.

A first accommodating groove 111 is provided in the first glass substrate 11, and the first accommodating groove 111 is a through hole penetrating the thickness direction of the first glass substrate 11. The first metal connecting column 16 is disposed in the first accommodating groove 111, and both ends of the first metal connecting column 16 are connected to the first antenna layer 12 and the second antenna layer 13 respectively; the material of the first metal connecting column 16 includes At least one of gold, silver, copper, and aluminum. In a possible implementation manner, the material of the first metal connecting post is the same as the material of the first antenna layer 12 and the second antenna layer 13. An insulator 112 made of an insulating material is provided in the first accommodating groove 111. The insulator 112 is used to isolate the first metal connecting column 112 from the first glass substrate 11 to prevent the side surface of the first metal connecting column 112 from contacting the first glass substrate 11 , To prevent the heat generated by the first metal connecting pillar 112 from being directly transferred to the first glass substrate 11.

It should be noted that in the related art, when a glass substrate is used as the antenna medium, a hole can be directly opened in the set area of the glass substrate and a metal layer is plated in the hole as a metal connecting post to connect the two sides of the glass substrate. The antenna layer, however, due to the direct contact between the electroplated metal layer and the glass substrate, the opening positions are prone to quality risks such as glass cracking and metal residue. In addition, it is necessary to perform drilling and electroplating process at the glass manufacturer in advance, and then transport it to the packaging manufacturer for packaging processing. If the structure of the antenna needs to be adjusted, the packaging manufacturer needs to re-order glass raw materials from the glass manufacturer, resulting in a complex supply chain and production cycle long.

In this embodiment, the first accommodating groove 111 is opened on the first glass substrate, the insulator 112 is filled in the first accommodating groove 111, and the first metal connecting column 16 is arranged in the insulator 112, thereby avoiding the A metal connecting column 16 directly contacts the wall surface of the first accommodating groove 111, and the quality risks of glass cracking and metal residues are not prone to occur. In addition, the process can be carried out directly by the packaging manufacturer, and there is no need to reorder glass raw materials when adjusting the antenna structure, thereby saving the production cycle.

The antenna shown in Figure 1 above can be manufactured by the following manufacturing methods:

First, a support substrate 26 is provided, and a separation layer 27 is provided on the support substrate 26.

As an example, the supporting base 26 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate. Among them, the use of a glass substrate as the supporting base 26 has the advantages of low cost, easy formation of a separation layer on the surface, and reduction of the difficulty of the subsequent peeling process. As an example, the separation layer 27 includes one of an adhesive tape and a polymer layer. The polymer layer can be coated on the surface of the support substrate 26 by a spin coating process, and then cured and molded by an ultraviolet curing or thermal curing process.

Referring to FIG. 2, next, the first antenna layer 12 is formed on the separation layer 27, and the first metal connecting pillar 16 is formed on the first antenna layer 12. A metal layer can be formed on the separation layer 27 by using a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process or an electroless plating process. The metal layer can be etched to form the patterned first antenna layer 12 and the second antenna layer. A metal connecting post 16, wherein the lower end of the first metal connecting post 16 is connected to the first antenna layer 12.

Next, a first encapsulation layer 14 covering the first antenna layer 12 is formed, and an end of the first metal connecting pillar 16 away from the separation layer 27 is exposed outside the first encapsulation layer 14. Among them, the first encapsulation layer 14 can be formed by compression molding, transfer molding, liquid sealing, vacuum lamination, spin coating, and other processes.

Referring to FIG. 3, next, a first glass substrate 11 is provided, and a first accommodating groove 111 is provided in the first glass substrate 11. Wherein, the position of the first accommodating groove 111 corresponds to the position of the first metal connecting pillar 16. The thickness of the first glass substrate 11 is related to the antenna structure. The first accommodating groove 111 may be a through hole directly opened on the first glass substrate 11, or a blind hole may be opened on the first glass substrate 11 first, and then the A glass substrate 11 is ground and thinned until the bottom of the blind hole is exposed to form a through hole. The first accommodating groove 111 may be formed by etching or laser processing, and the diameter of the first accommodating groove 111 is larger than the diameter of the first metal connecting pillar 16.

Referring to FIG. 4, next, the first glass substrate 11 is bonded to the separation layer 27, the first metal connecting column 16 is placed in the first accommodating groove 111, and the first accommodating groove 111 is filled with an insulating material. The insulator 112 is formed. The insulating material can be one of epoxy resin, silica gel, and polyimide PI. After the insulating material is filled in the first accommodating groove 111, it can isolate the first metal connecting column 16 and the first accommodating groove 111. The inner wall surface prevents the first metal connecting column 16 from affecting the mechanical properties of the first glass substrate 11.

In another possible embodiment, the first metal connecting pillar 16 may also be formed by opening holes in the insulator 112 and electroplating after forming the insulator 112. In this case, the insulator 112 is an epoxy resin that is convenient for processing and opening holes. And other materials.

Referring to FIG. 5, next, a second antenna layer 13 is formed on the surface of the first glass substrate 11 away from the supporting base 26, and a second encapsulation layer 15 covering the second antenna layer 13 is formed. It is electrically connected to the first metal connecting pillar 16. Wherein, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process or an electroless plating process can be used to form a metal layer on the surface of the first glass substrate 11, and the metal layer can be etched to form a patterned second Two antenna layer 13. The second encapsulation layer 15 can be formed by compression molding, transfer molding, liquid sealing, vacuum lamination, spin coating, and other processes.

In a possible implementation, the first glass substrate 11 and the insulator 112 are ground and thinned, so that the end of the first metal connecting pillar 16 is exposed on the surface of the insulator 112, so that the second antenna layer 13 is exposed to the surface of the insulator 112. The first metal connecting post 16 on the surface of the insulator 112 is directly connected.

In another possible implementation manner, multiple vias may also be provided on the insulator 112. When the second antenna layer 13 is formed, the vias are filled with metal materials to form conductive vias, and the second antenna layer 13 passes through the conductive vias. Connect with the first metal connecting pillar 16.

Finally, the separation layer 27 and the supporting substrate 26 are peeled off. Wherein, the separation layer 27 may be a light-to-heat conversion layer, which can be converted into heat by laser light, so that the separation layer 27 and the supporting substrate 26 are separated from the first antenna layer 12 to form an antenna as shown in FIG. 1.

It should be noted that the antenna provided in this embodiment can be connected to the circuit board by brushing solder paste, and can be connected to an external radio frequency chip through the circuit board to realize the antenna function.

The radio frequency chip can also be directly arranged in the antenna. FIG. 6 is a schematic diagram showing the structure of bonding the radio frequency chip on the first antenna layer after the separation layer is peeled off. Referring to FIG. 6, in a possible implementation manner, this embodiment provides The antenna further includes a radio frequency chip 17 electrically connected to the first antenna layer 12, and the radio frequency chip 17 is disposed on a surface of the first antenna layer 12 away from the first glass substrate 11. The radio frequency chip 17 is electrically connected to the first antenna layer 12 on the one hand, and is connected to the circuit board on the other hand.

The specific manufacturing method of the antenna structure provided in FIG. 6 is that after the step of peeling off the separation layer 27 and the supporting base 26, bonding the radio frequency chip 17, the radio frequency chip 17 and the surface of the first antenna layer 12 away from the first glass substrate 11 The first antenna layer 12 is electrically connected.

FIG. 7 is a schematic diagram of the structure corresponding to bonding a radio frequency chip on the first antenna layer and opening a second accommodating groove on the first glass substrate, and FIG. 8 is a schematic diagram of the structure corresponding to embedding the radio frequency chip in the first glass substrate, refer to FIG. 7 As shown in FIG. 8, in another possible implementation manner, a second accommodating groove 113 is provided in the first glass substrate 11, and the radio frequency chip 17 is located in the second accommodating groove 113. The radio frequency chip 17 is built into the first glass substrate 11 to further reduce the overall thickness of the antenna structure.

Wherein, the manufacturing method of embedding the radio frequency chip 17 in the first glass substrate 11 is as follows: on the basis of FIG. 2, after forming the first antenna layer 12 on the separation layer 27, the radio frequency chip is then connected to the first antenna layer 12 17; On the basis of Figure 3, after the step of providing the first glass substrate 11, a second accommodating groove 113 is opened on the first glass substrate 11; as shown in Figure 7, the first glass substrate 11 is bonded to When the separation layer 27 is on, the radio frequency chip 17 is placed in the second accommodating groove 113, and the second accommodating groove 113 is filled with an insulating material to form an insulator 112.

9 is a schematic diagram of the structure corresponding to the formation of the second metal connecting post and the connection resistance container member. FIG. 10 is a schematic diagram of the structure of forming the third encapsulation layer and solder ball bumps. Refer to FIG. 9 and FIG. 10, on the basis of FIG. 6 Above, in this embodiment, the antenna further includes a third encapsulation layer 19. The third encapsulation layer 19 covers the radio frequency chip 17, and the third encapsulation layer 19 may include one of epoxy resin, silica gel, and polyimide PI to protect the radio frequency chip 17.

Among them, at the same time, after covering the third encapsulation layer 19, in order to make the first antenna layer 12 and the radio frequency chip 17 connect to the external circuit board, in this embodiment, a second metal connection is provided on the first antenna layer 12.柱18。 Post 18. The second metal connecting post 18 is disposed on the surface of the first antenna layer 12 away from the first glass substrate 11, and the material of the second metal connecting post 18 includes one of gold, silver, copper, and aluminum. The end of the second metal connection post 18 is exposed outside the third encapsulation layer 19, or a conductive via may be provided on the third encapsulation layer 19 so that the second metal connection post 18 can communicate with the external circuit board.

In order to ensure the reliability of the connection between the antenna and the circuit board, in this embodiment, the antenna further includes solder ball bumps 20. The solder ball bumps 20 are arranged on the surface of the third packaging layer 19 away from the first glass substrate 11 and are soldered. The ball bump 20 is connected to the second metal connecting pillar 18 through the metal ball pad 21. The solder bump 20 includes one of tin solder, silver solder, and gold-tin alloy solder.

In this embodiment, the antenna further includes a containment member 22 which is disposed in the third encapsulation layer 19 and is electrically connected to the first antenna layer 12. The resistance container 22 can play a role in reducing interference. It should be noted that a filter circuit can be added between the first antenna layer 12 and the connection line of the radio frequency chip 17, and the filter circuit and the resistance container 22 together can reduce interference. , The role of improving antenna performance.

In the above embodiment, on the basis of FIG. 6, the method for forming the second metal connecting pillar 18, the blocking container 22, the third encapsulation layer 19, and the solder ball bumps 20 can be as follows: first, on the first antenna layer 12 A second metal connecting column 18 and a blocking container 22 are formed on the surface of the first glass substrate 11; then, a third encapsulation layer 19 covering the radio frequency chip 17, the second metal connecting column 18 and the blocking container 22 is formed. The end of the two metal connecting pillars 18 away from the first glass substrate 11 is exposed outside the third packaging layer 19; then, a metal ball pad 21 is formed on the third packaging layer 19, and the metal ball pad 21 is electrically connected to the second metal connecting pillar 18 ; Finally, a solder ball bump 20 is formed on the metal ball pad 21.

The antenna provided in the first embodiment of the present application is provided with a first glass substrate as the antenna medium. Compared with the use of a plastic molding compound as the medium, the first glass substrate made of glass has low dielectric loss and high antenna gain, which can effectively reduce the package volume. In addition, the antenna metal layers on the upper and lower surfaces of the first glass substrate are connected by the first metal connecting pillars, and an insulator is filled between the first metal connecting pillars and the first glass substrate to avoid direct contact between the first metal connecting pillars and the first glass substrate. , Can prevent the first glass substrate from cracking when the temperature changes. In addition, the slot on the first glass substrate is decoupled from the design of the first metal connecting column, and the adjustment of the diameter of the first metal connecting column and the position of the first accommodating groove in the first glass substrate does not require the cooperation of the glass manufacturer. It can greatly shorten the development cycle of antenna design and the cost of repeated glass substrate proofing.

Example two

FIG. 11 is a schematic structural diagram of the antenna provided in the second embodiment of the present application. Referring to FIG. 11, the antenna provided in the second embodiment of the present application includes: a first glass substrate 11, a first antenna layer 12, a second antenna layer 13, and a second antenna layer. An encapsulation layer 14, a second encapsulation layer 15, a first metal connection pillar 16, a radio frequency chip 17, a second metal connection pillar 18, a third encapsulation layer 19, a solder bump 20, a second glass substrate 23, and a third antenna Layer 24 and fourth encapsulation layer 25.

Wherein, the first glass substrate 11 and the second glass substrate 23 are both plate-shaped structures made of glass, and the first glass substrate 11 includes a first surface and a second surface that are arranged oppositely, and the first surface is shown in FIG. 11 The lower surface of the first glass substrate 11 and the second surface are the upper surface of the first glass substrate 11 shown in FIG. 11. The first glass substrate 11 and the second glass substrate 23 are used as the antenna medium and have a thickness of 150 μm-800 μm, which can reduce the thickness of the medium compared to using a plastic molding compound as the antenna medium.

In this embodiment, the first glass substrate 11 and the second glass substrate 23 are used as the antenna medium. Compared with the use of a plastic molding compound as the antenna medium, the dielectric loss can be reduced and the antenna performance can be improved. Compared with plastic packaging materials, the glass substrate has high mechanical strength, low warpage, low difficulty in packaging and subsequent board processing, and low failure risk.

The first antenna layer 12 is disposed on the first surface of the first glass substrate 11, the second antenna layer 13 is disposed on the second surface of the first glass substrate 11, and the third antenna layer 24 is disposed on the second glass substrate 23 away from the first surface. On the surface of the glass substrate 11. The first antenna layer 12, the second antenna layer 13 and the third antenna layer 24 are all metal wiring layers, and their materials may include one or a combination of two or more of copper, nickel, aluminum, gold, silver, and titanium, and It can be set into various patterns according to the performance requirements of the antenna.

In a possible implementation manner, the first antenna layer 12, the second antenna layer 13 and the third antenna layer 24 may all be provided with a rewiring layer, and the thickness of the rewiring layer is 3 μm-10 μm. The rewiring layer can realize high-density wiring, reduce the scale and loss of antenna interconnection, compress the interconnection space, and expand the flexibility of antenna design.

Wherein, the first encapsulation layer 14 covers the first surface and the first antenna layer 12, the second encapsulation layer 15 covers the second surface and the second antenna layer 13, and the fourth encapsulation layer 25 covers the second glass substrate 23 away from the first glass. The surface of the substrate 11 and the third antenna layer 24. The first encapsulation layer 14, the second encapsulation layer 15 and the fourth encapsulation layer 25 may all include one of epoxy resin, silicone rubber, and polyimide PI to protect the first antenna layer 12 and the second antenna layer, respectively. 13 and the role of the third antenna layer 24.

A first accommodating groove 111 is provided in the first glass substrate 11, an insulator 112 is provided in the first accommodating groove 111, the first metal connecting column 16 is provided in the insulator 112, and two ends of the first metal connecting column 16 are respectively It is connected to the first antenna layer 12 and the second antenna layer 13. The material of the first metal connecting column 16 includes one of gold, silver, copper, and aluminum, and is arranged in the first accommodating groove 111. Both ends of the first metal connecting column 16 are connected to the first antenna layer 12 and the first antenna layer 12 and the second antenna layer. The two antenna layers 13 are connected. The first accommodating groove 111 is a through hole penetrating the thickness direction of the first glass substrate 11, and an insulator 112 made of insulating material is provided in the first accommodating groove 111. The insulator 112 is used to isolate the first metal connecting pillar 112 from the first metal connecting pillar 112. The glass substrate 11 prevents the side surface of the first metal connecting column 112 from contacting the first glass substrate 11, and prevents the first metal connecting column 112 from affecting the mechanical properties of the first glass substrate 11.

In this embodiment, the radio frequency chip 17 is disposed on the surface of the first antenna layer 12 away from the first glass substrate 11 and is electrically connected to the first antenna layer 12. The radio frequency chip 17 is electrically connected to the first antenna layer 12 on the one hand, and is connected to the circuit board on the other hand.

In addition, the second metal connecting pillar 18 is disposed on the surface of the first antenna layer 12 away from the first glass substrate 11, the third packaging layer 19 covers the radio frequency chip 17 and the second metal connecting pillar 18, and the third packaging layer 19 is far away The end of the second metal connection pillar 18 is exposed on the surface of the first glass substrate 11.

The solder ball bumps 20 are disposed on the surface of the third packaging layer 19 away from the first glass substrate 11, and the solder ball bumps 20 are connected to the second metal connecting pillars 18 through the metal ball pads 21.

In a possible implementation manner, the antenna structure provided in FIG. 11 may be manufactured by the following manufacturing method:

On the basis of the antenna manufacturing method described in the first embodiment, a second glass substrate 23 is provided; the second glass substrate 23 is bonded to the second encapsulation layer 15; the second glass substrate 23 is far away from the first glass substrate 11 A third antenna layer 24 is formed on the surface, and a fourth encapsulation layer 25 covering the third antenna layer 24 is formed.

In another possible implementation manner, the antenna structure provided in FIG. 11 can be manufactured using the following steps:

First, the first glass substrate 11 and the second glass substrate 23 are provided.

Referring to FIG. 12, next, a second antenna layer 13 and a first metal connecting post 16 located on the second antenna layer 13 can be formed on the second glass substrate 23, and a second antenna layer 13 covering the second antenna layer 13 can be formed. Encapsulation layer 15. Wherein, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process or an electroless plating process can be used to form a metal layer on the second glass substrate 23, and the metal layer can be etched to form a patterned second antenna The layer 13 and the first metal connection pillar 16. The second encapsulation layer 15 can be formed by compression molding, transfer molding, liquid sealing, vacuum lamination, spin coating, and other processes.

Then, a first accommodating groove 111 may be opened in the first glass substrate 11, wherein the position of the first accommodating groove 111 corresponds to the position of the first metal connecting pillar 16. The first accommodating groove 111 may be a through hole directly opened on the first glass substrate 11, or a blind hole may be opened on the first glass substrate 11 first, and then the first glass substrate 11 may be ground and thinned until the blind hole is exposed At the bottom, a through hole is formed.

Referring to FIG. 13, in the next step, the first glass substrate 11 can be bonded to the second glass substrate 23, the first metal connecting column 16 is inserted into the first accommodating groove 111; and the insulating material is used to fill the first accommodating groove 111. A accommodating groove 111 is formed to form an insulator 112.

The insulating material may be one of epoxy resin, silica gel, and polyimide PI. After the insulating material is filled in the first accommodating groove 111, it can isolate the first metal connecting column 16 and the inside of the first accommodating groove 111. The wall surface prevents the first metal connecting pillar 16 from affecting the mechanical properties of the first glass substrate 11.

In another possible embodiment, the first metal connecting pillar 16 may also be formed by opening holes in the insulator 112 and electroplating after forming the insulator 112. In this case, the insulator 112 is an epoxy resin that is convenient for processing and opening holes. And other materials.

Referring to FIG. 14, next, the first antenna layer 12 may be formed on the surface of the first glass substrate 11 away from the second glass substrate 23, and the first encapsulation layer 14 covering the first antenna layer 12 may be formed; A third antenna layer 24 is formed on the surface of the two glass substrates 23 away from the first glass substrate 11, and a fourth encapsulation layer 25 covering the third antenna layer 24 is formed.

Wherein, a chemical vapor deposition process, an evaporation process, a sputtering process, an electroplating process or an electroless plating process can be used to form a metal layer on the surface of the first glass substrate 11, and the metal layer can be etched to form a patterned second One antenna layer 12. Similarly, the third antenna layer 24 may be formed on the surface of the second glass substrate 23. Both the first encapsulation layer 14 and the fourth encapsulation layer 25 can be formed by compression molding, transfer molding, liquid sealing, vacuum lamination, spin coating, etc., to protect the first antenna layer 12 and the third antenna, respectively The role of layer 24.

In order to realize the connection between the second antenna layer 13 and the first metal connection post 14, after the insulator 112 is formed, the first glass substrate 11 and the insulator 112 can be ground and thinned, so that the end of the first metal connection post 16 is exposed. The surface of the insulator 112 is directly connected to the second antenna layer 13 and the first metal connecting post 16 exposed on the surface of the insulator 112. Alternatively, after the insulator 112 is formed, multiple vias may be provided on the insulator 112. When the second antenna layer 13 is formed, the vias are filled with a metal material to form a conductive via 114, and the second antenna layer 13 passes through the conductive via 114. Connect with the first metal connecting pillar 16. Referring to FIG. 15, next, a connecting radio frequency chip 17 may be formed on the surface of the first antenna layer 12 away from the first glass substrate 11, and formed on the surface of the first antenna layer 12 away from the first glass substrate 11. The second metal connecting column 18 forms a third encapsulation layer 19 covering the radio frequency chip 17 and the surface of the first antenna layer 12 away from the first glass substrate 11, and the end of the second metal connecting column 18 away from the first glass substrate 11 is exposed Outside the third encapsulation layer 19.

Wherein, the third encapsulation layer 19 may include one of epoxy resin, silica gel, and polyimide PI, which plays a role of protecting the radio frequency chip 17. At the same time, after covering the third encapsulation layer 19, in order to enable the first antenna layer 12 and the radio frequency chip 17 to be connected to the external circuit board, in this embodiment, a second metal connecting post 18 is provided on the first antenna layer 12. The material of the second metal connecting pillar 18 includes one of gold, silver, copper, and aluminum. The end of the second metal connection post 18 is exposed outside the third encapsulation layer 19, or a conductive via may be provided on the third encapsulation layer 19 so that the second metal connection post 18 can communicate with the external circuit board.

Finally, referring to FIG. 11, a metal ball pad 21 may be formed on the third packaging layer 19, and the metal ball pad 21 and the second metal connecting pillar 18 may be electrically connected; and a solder ball bump 20 may be formed on the metal ball pad 21.

The antenna provided in the second embodiment of the present application is provided with the first glass substrate and the second glass substrate as the antenna medium. Compared with the use of a plastic molding compound as the medium, the antenna has low dielectric loss and high antenna gain, which can effectively reduce the package volume. An insulator is filled between the first metal connecting column and the first glass substrate, which can prevent the first metal connecting column from directly contacting the first glass substrate, and can prevent the first glass substrate from cracking when the temperature changes. In addition, the slot on the first glass substrate is decoupled from the design of the first metal connecting column, and the adjustment of the diameter of the first metal connecting column and the position of the first accommodating groove in the first glass substrate does not require the cooperation of the glass manufacturer. It can greatly shorten the development cycle of antenna design and the cost of repeated glass substrate proofing.

Example three

The third embodiment of the present application provides a terminal, which includes a circuit board and the antenna provided in the first or second embodiment above, and the antenna is connected to the circuit board. Among them, the terminal devices involved in the third embodiment of the present application may include electronic devices such as mobile phones, watches, tablet computers, personal digital assistants (PDAs), point of sales (POS), and in-vehicle computers.

The terminal provided in the third embodiment of the present application includes the antenna provided in the above-mentioned embodiment 1 or the second embodiment, and therefore also has the advantages described in the above-mentioned embodiment 1 or the second embodiment. For details, please refer to the relevant description above, which will not be omitted here. Go into details.

The embodiments or implementations in the specification of this application are described in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be referred to each other.

In the description of the specification of the present application, the description with reference to the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" etc. means to combine The specific features, structures, materials, or characteristics described in the embodiments or examples are included in at least one embodiment or example in the present application. In this specification, the schematic representation of the above-mentioned terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions described in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present application. range.

Claims (26)

1. An antenna, characterized by comprising: a first glass substrate, a first antenna layer, a second antenna layer, a first packaging layer, a second packaging layer, and a first metal connecting column;

   The first glass substrate includes a first surface and a second surface that are opposed to each other. The first antenna layer is disposed on the first surface, the second antenna layer is disposed on the second surface, and the first An encapsulation layer covers the first surface and the first antenna layer, and the second encapsulation layer covers the second surface and the second antenna layer;

   A first accommodating groove is provided in the first glass substrate, an insulator is provided in the first accommodating groove, the first metal connecting column is arranged in the insulator, and the first metal connecting column is The two ends are respectively connected to the first antenna layer and the second antenna layer.
2. The antenna according to claim 1, wherein the antenna further comprises: a radio frequency chip electrically connected to the first antenna layer.
3. The antenna according to claim 2, wherein the radio frequency chip is disposed on a surface of the first antenna layer away from the first glass substrate.
4. The antenna according to claim 2, wherein a second accommodating groove is provided in the first glass substrate, and the radio frequency chip is located in the second accommodating groove.
5. The antenna according to claim 3, wherein the antenna further comprises a second metal connecting post and a third encapsulation layer;

   The second metal connecting pillar is disposed on the surface of the first antenna layer away from the first glass substrate, the third packaging layer covers the radio frequency chip and the second metal connecting pillar, and the first antenna layer The end of the second metal connecting pillar is exposed on the surface of the three encapsulation layer away from the first glass substrate.
6. The antenna according to claim 5, wherein the antenna further comprises a solder ball bump, the solder ball bump is provided on a surface of the third packaging layer away from the first glass substrate, and The solder ball bumps are connected to the second metal connecting pillars through metal ball pads.
7. The antenna according to claim 6, wherein the antenna further comprises a blocking member, the blocking member is disposed in the third encapsulation layer and is electrically connected to the first antenna layer.
8. The antenna according to claim 1, wherein a first rewiring layer is provided on the first antenna layer.
9. The antenna according to any one of claims 1-8, wherein the antenna further comprises a second glass substrate, a third antenna layer, and a fourth encapsulation layer;

   The second glass substrate is disposed on a surface of the second antenna layer away from the first glass substrate, and the third antenna layer is disposed on a surface of the second glass substrate away from the first glass substrate The fourth encapsulation layer covers the surface of the second glass substrate away from the first glass substrate and the third antenna layer.
10. The antenna according to claim 9, wherein a second rewiring layer is provided on the second antenna layer.
11. The antenna according to claim 10, wherein the thickness of the second rewiring layer is 3 μm-10 μm.
12. The antenna according to claim 9, wherein the thickness of the first glass substrate and the second glass substrate is 150 μm-800 μm.
13. The antenna according to claim 1, wherein a conductive via is provided in the insulator, and the conductive via is connected to the first metal connecting post and the first antenna layer.
14. A terminal, characterized by comprising: a circuit board and the antenna according to any one of claims 1-13, and the antenna is connected to the circuit board.
15. An antenna packaging method, characterized in that it comprises the following steps:

    Providing a supporting substrate, the supporting substrate is provided with a separation layer;

    Forming a first antenna layer on the separation layer, and forming a first metal connecting pillar on the first antenna layer;

    Forming a first encapsulation layer covering the first antenna layer, and one end of the first metal connecting pillar away from the separation layer is exposed outside the first encapsulation layer;

    Providing a first glass substrate, and a first accommodating groove is provided in the first glass substrate;

    Bonding the first glass substrate to the separation layer, placing the first metal connecting column in the first accommodating groove, and filling the first accommodating groove with an insulating material to form an insulator;

    A second antenna layer is formed on the surface of the first glass substrate away from the support base, and a second encapsulation layer covering the second antenna layer is formed, and the second antenna layer is connected to the first metal Column electrical connection;

    The separation layer and the supporting substrate are peeled off.
16. The antenna packaging method according to claim 15, wherein after the step of peeling off the separation layer and the supporting substrate, the antenna packaging method further comprises:

    A radio frequency chip is bonded to a surface of the first antenna layer away from the first glass substrate, and the radio frequency chip is electrically connected to the first antenna layer.
17. The antenna packaging method of claim 16, wherein after the step of bonding a radio frequency chip on a surface of the first antenna layer away from the first glass substrate, the antenna packaging method further comprises:

    Forming a second metal connecting pillar on the surface of the first antenna layer away from the first glass substrate;

    A third packaging layer covering the radio frequency chip is formed, and an end of the second metal connecting pillar away from the first glass substrate is exposed outside the third packaging layer.
18. 18. The antenna packaging method of claim 17, wherein after the step of bonding a radio frequency chip on a surface of the first antenna layer away from the first glass substrate, the antenna packaging method further comprises:

    Forming or attaching a blocking container on the surface of the first antenna layer away from the first glass substrate;

    A third encapsulation layer covering the blocking container member and the surface of the first antenna layer away from the first glass substrate is formed.
19. The antenna packaging method according to claim 17 or 18, wherein the antenna packaging method further comprises:

    Forming a metal ball pad on the third packaging layer, and the metal ball pad is electrically connected to the second metal connecting post;

    A solder ball bump is formed on the metal ball pad.
20. The antenna packaging method according to claim 15, wherein after the first antenna layer is formed on the separation layer, the antenna packaging method further comprises: connecting a radio frequency chip on the first antenna layer;

    After the step of providing the first glass substrate, the antenna packaging method further includes: opening a second accommodating groove on the first glass substrate;

    The step of bonding the first glass substrate on the separation layer includes: placing the radio frequency chip in the second accommodating groove, and filling the second accommodating groove with an insulating material to form The insulator.
21. The antenna packaging method of claim 15, wherein the antenna packaging method further comprises:

    Provide a second glass substrate;

    Bonding the second glass substrate to the second packaging layer;

    A third antenna layer is formed on the surface of the second glass substrate away from the first glass substrate, and a fourth encapsulation layer covering the third antenna layer is formed.
22. An antenna packaging method, characterized in that it comprises the following steps:

    Provide a first glass substrate and a second glass substrate;

    Opening a first accommodating groove in the first glass substrate;

    Forming a second antenna layer and a first metal connecting post on the second antenna layer on the second glass substrate, and forming a second encapsulation layer covering the second antenna layer;

    Bonding the first glass substrate to the second glass substrate, and inserting the first metal connecting column into the first accommodating groove;

    Filling the first accommodating groove with an insulating material to form an insulator;

    Forming a first antenna layer on the surface of the first glass substrate away from the second glass substrate, and forming a first encapsulation layer covering the first antenna layer;

    A third antenna layer is formed on the surface of the second glass substrate away from the first glass substrate, and a fourth encapsulation layer covering the third antenna layer is formed.
23. The packaging method of claim 22, wherein the antenna packaging method further comprises:

    A connection radio frequency chip is formed on the surface of the first antenna layer away from the first glass substrate.
24. The packaging method of claim 23, wherein the antenna packaging method further comprises:

    Forming a second metal connecting pillar on the surface of the first antenna layer away from the first glass substrate;

    A third encapsulation layer covering the radio frequency chip and the surface of the first antenna layer away from the first glass substrate is formed, and an end of the second metal connecting column away from the first glass substrate is exposed to the Outside the third encapsulation layer.
25. The antenna packaging method of claim 24, wherein the antenna packaging method further comprises: forming a metal ball pad on the third packaging layer, and the metal ball pad and the second metal connecting post are electrically connected to each other. connection;

    A solder ball bump is formed on the metal ball pad.
26. A program product, characterized in that the program product includes a computer program, the computer program is stored in a readable storage medium, and at least one processor of a communication device can read the computer program from the readable storage medium The execution of the computer program by the at least one processor causes the communication device to implement the method according to any one of claims 15-21 or the method according to any one of claims 22-25.

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