CN109768032B - Antenna packaging structure and packaging method - Google Patents
Antenna packaging structure and packaging method Download PDFInfo
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- CN109768032B CN109768032B CN201910160726.4A CN201910160726A CN109768032B CN 109768032 B CN109768032 B CN 109768032B CN 201910160726 A CN201910160726 A CN 201910160726A CN 109768032 B CN109768032 B CN 109768032B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 89
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
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- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 claims description 4
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Abstract
The application provides an antenna packaging structure and a packaging method, wherein the packaging structure comprises a rewiring layer, a first metal wire feeding column and a first packaging layer, and the first metal wire feeding column, a polymer isolation layer, a second metal wire feeding column, a second packaging layer, an antenna metal layer, an antenna circuit chip and a metal bump are coated, wherein the polymer isolation layer is divided into a plurality of block areas. According to the antenna packaging structure and the packaging method, the large-area polymer isolation layer (such as polyimide PI) is divided into a plurality of areas, so that the stress of the polymer isolation layer can be effectively released, the transmission concentration of the stress can be blocked, and the deformation or bending caused by the mismatch of the thermal expansion coefficients between the polymer isolation layer and other materials (such as a packaging layer) can be greatly reduced.
Description
Technical Field
The application belongs to the field of semiconductor packaging, and particularly relates to a packaging structure and a packaging method of an antenna.
Background
As technology advances, various high-tech electronic products have been developed to facilitate life of people, including various electronic devices such as: notebook computers, cell phones, tablet computers (PADs), etc.
With the popularity of such high-tech electronic products and the increasing demand of people, in addition to the greatly increased functions and applications configured in such high-tech products, the function of wireless communication is increased in particular to match the mobile demands of people. Thus, people can use the high-tech electronic products at any place or any time through the high-tech electronic devices with the wireless communication function. Therefore, the flexibility and convenience of the use of the high-tech electronic products are greatly improved, and people are not limited in a fixed area, the limit of the use range is broken, and the application of the electronic products is really convenient for the life of people.
Generally, existing antenna structures generally include dipole antennas, monopole antennas, patch antennas, inverted-F antennas, meander antennas, inverted-L antennas, loop antennas, helical antennas, spring antennas, and the like.
In the existing antenna packaging method, due to the fact that the thermal expansion coefficients of the packaging materials are not matched, deformation or overlarge bending of the packaging materials is easy to occur, and therefore quality of a packaging structure is affected.
Disclosure of Invention
In view of the above drawbacks of the prior art, an object of the present application is to provide an antenna packaging structure and a packaging method, which are used for solving the problem that deformation or excessive bending easily occurs in the antenna packaging process in the prior art.
To achieve the above and other related objects, the present application provides a package structure of an antenna, the package structure comprising: a rewiring layer comprising a first face and an opposing second face; a first metal feed-through stud formed on the rewiring layer; the first packaging layer is used for coating the first metal wire feeding column, and the top surface of the first packaging layer is exposed out of the first metal wire feeding column; a polymer isolation layer formed on the first encapsulation layer, and divided into a plurality of block areas; a second metal feed post formed on the polymer isolation layer, the second metal feed post being connected to the first metal feed post; the second packaging layer is used for coating the second metal wire feeding post, and the top surface of the second packaging layer is exposed out of the second metal wire feeding post; the antenna metal layer is formed on the second packaging layer and is connected with the second metal feeder post; an antenna circuit chip combined with the first surface of the rewiring layer and electrically connected with the antenna metal layer through the rewiring layer and the first metal feed-line posts and the second metal feed-line posts; and the metal bump is formed on the first surface of the rewiring layer so as to realize the electrical extraction of the rewiring layer.
Optionally, the polymeric isolation layer comprises polyimide.
Optionally, the polymer isolation layer is divided into a plurality of block areas by a dividing channel, and the dividing channel is located between two adjacent antenna units.
Optionally, the polymer isolation layer is formed with an opening, the opening is filled with a metal plug, the metal plug is connected with the first metal feeder pillar, and the second metal feeder pillar is formed on the metal plug.
Optionally, the material of the first and second metal feed posts comprises one of Au, ag, cu, al.
Optionally, the materials of the first packaging layer and the second packaging layer include one of polyimide, silica gel and epoxy resin.
Optionally, the antenna circuit chip includes one or two of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.
Optionally, the metal bump includes one of tin solder, silver solder and gold-tin alloy solder.
The application also provides an antenna packaging method, which comprises the following steps: 1) Providing a support substrate, and forming a separation layer on the support substrate; 2) Forming a rewiring layer on the separation layer, the rewiring layer comprising a first face connected with the separation layer and an opposite second face; 3) Forming a first metal feed-through stud on a second side of the rewiring layer; 4) Packaging the first metal wire feeding column by adopting a first packaging layer, and thinning the first packaging layer so that the top surface of the first metal wire feeding column is exposed out of the first packaging layer; 5) Forming a polymer isolation layer on the surface of the first packaging layer, and dividing the polymer isolation layer into a plurality of block areas so as to release the stress of the polymer isolation layer; 6) Forming a second metal feeder pillar on the polymer isolation layer, wherein the second metal feeder pillar is connected with the first metal feeder pillar; 7) Packaging the second metal wire feeding column by adopting a second packaging layer, and thinning the second packaging layer so that the top surface of the second metal wire feeding column is exposed out of the second packaging layer; 8) Forming an antenna metal layer on the second packaging layer, wherein the antenna metal layer is connected with the second metal feeder post; 9) Stripping the rewiring layer and the support substrate based on the separation layer to expose a first face of the rewiring layer; 10 Providing an antenna circuit chip, and bonding the antenna circuit chip to the first surface of the rewiring layer, so that the antenna circuit chip is electrically connected with the antenna metal layer through the rewiring layer and the metal feed posts; and 11) forming metal bumps on the first surface of the rewiring layer to realize electrical extraction of the rewiring layer.
Optionally, the polymeric isolation layer comprises polyimide.
Optionally, step 5) employs an exposure process and a development process to divide the polymer isolation layer into a plurality of block regions.
Optionally, a dividing channel dividing the polymer isolation layer into a plurality of block areas is located between two adjacent antenna units.
Optionally, step 6) further includes forming an opening in the polymer isolation layer, the opening exposing the first metal feed-through stud, and filling a metal plug in the opening, the second metal feed-through stud being formed on the metal plug.
Optionally, the support base comprises one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
Optionally, the separation layer includes a light-heat conversion layer, and step 6) irradiates the light-heat conversion layer with a laser to separate the light-heat conversion layer from the encapsulation layer and the support substrate, thereby peeling the rewiring layer and the support substrate.
Optionally, the material of the first and second metal feed posts comprises one of Au, ag, cu, al.
Optionally, the packaging method in step 4) and step 7) includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the materials of the first packaging layer and the second packaging layer include one of polyimide, silica gel and epoxy resin.
Optionally, the metal bump includes one of tin solder, silver solder and gold-tin alloy solder.
Optionally, the antenna circuit chip includes one or two of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.
As described above, the packaging structure and the packaging method of the antenna of the present application have the following beneficial effects:
according to the antenna packaging structure and the packaging method, the large-area polymer isolation layer (such as polyimide PI) is divided into a plurality of areas, so that the stress of the polymer isolation layer can be effectively released, the transmission concentration of the stress can be blocked, and the deformation or bending caused by the mismatch of the thermal expansion coefficients between the polymer isolation layer and other materials (such as a packaging layer) can be greatly reduced.
Drawings
Fig. 1 to 15 are schematic structural views showing steps of a packaging method of an antenna according to the present application, wherein fig. 15 is a schematic structural view showing a packaging structure of an antenna according to the present application.
Description of element reference numerals
101. Support substrate
102. Separating layer
20. Rewiring layer
201. Dielectric layer
203. Metal interconnect layer
301. Seed layer
302. First metal feeder pillar
303. First encapsulation layer
304. Polymer barrier layer
305. Dividing road
306. Metal plug
307. Second metal feed-through post
308. Second packaging layer
309. Antenna metal layer
401. Antenna circuit chip
501. Metal bump
Detailed Description
Other advantages and effects of the present application will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present application with reference to specific examples. The application may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present application.
As described in detail in the embodiments of the present application, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present application. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of the present application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings rather than the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
Please refer to fig. 1-15. It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present application by way of illustration, and only the components related to the present application are shown in the drawings rather than the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
As shown in fig. 1 to 15, the present embodiment provides a method for manufacturing a fan-out package structure, in particular, a method for manufacturing a wafer-level fan-out package structure, the method includes the steps of:
as shown in fig. 1, step 1) is first performed, a support substrate 101 is provided, and a separation layer 102 is formed on the support substrate 101.
As an example, the support base 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate. In this embodiment, the supporting substrate 101 is a glass substrate, which has low cost, is easy to form the separation layer 102 on the surface of the glass substrate, and can reduce the difficulty of the subsequent stripping process.
As an example, the separation layer 102 includes a light-heat conversion Layer (LTHC), which is formed on the support substrate 101 by a spin coating process and then cured and molded by a curing process. The light-to-heat conversion Layer (LTHC) has stable performance, smoother surface, and is beneficial to subsequent fabrication of the rewiring layer 20, and the difficulty of stripping is low in the subsequent stripping process.
As shown in fig. 2 to 3, step 2) is then performed to form a re-wiring layer 20 on the separation layer 102, wherein the re-wiring layer 20 includes a first surface connected to the separation layer 102 and an opposite second surface, and the re-wiring layer 203 includes a metal interconnection layer and a dielectric layer 201.
Step 1-2) fabricating the rewiring layer 20 comprises the steps of:
as shown in fig. 2, step a) is performed, and a chemical vapor deposition process or a physical vapor deposition process is used to form a first dielectric layer on the surface of the separation layer 102, where the material of the first dielectric layer includes one or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.
Preferably, the material of the first dielectric layer is PI (polyimide), so as to further reduce the process difficulty and the process cost.
As shown in fig. 3, step b) is performed, a patterned seed layer 301 is formed on the surface of the first dielectric layer by using a sputtering process, and a first metal interconnection layer is formed on the patterned seed layer 301, where the material of the first metal interconnection layer includes one or more of copper, aluminum, nickel, gold, silver, and titanium.
As shown in fig. 3, step c) is performed, and a second dielectric layer is formed on the surface of the patterned first metal interconnection layer by using a chemical vapor deposition process or a physical vapor deposition process, and the second dielectric layer is etched to form a second dielectric layer with patterned through holes. The material of the second dielectric layer comprises one or more than two of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass and fluorine-containing glass.
Preferably, the material of the second dielectric layer is PI (polyimide), so as to further reduce the process difficulty and the process cost.
As shown in fig. 3, step d) is performed, a conductive plug is filled in the patterned via hole, then a second metal layer is formed on the surface of the second dielectric layer by adopting a sputtering process, and the patterned second metal interconnection layer 203 is formed by etching the metal layer. The material of the second metal interconnection layer comprises one or more than two of copper, aluminum, nickel, gold, silver and titanium.
Next, the above steps c) to d) may be repeated to form the re-wiring layer 20 having a multi-layered stacked structure to realize different wiring functions.
As shown in fig. 4, step 3) is performed, a patterned seed layer 301 is formed on the second surface of the rewiring layer 20, and a first metal feeding stud 302 is formed on the seed layer 301 by electroplating or electroless plating, where the first metal feeding stud 302 is electrically connected to the rewiring layer 20.
The radial width of the first metal feed post 302 is between 100 micrometers and 1000 micrometers, for example, the radial width of the first metal feed post 302 can be 200 micrometers, 500 micrometers, 800 micrometers, etc., and the antenna metal feed post is formed by adopting an electroplating or chemical plating mode, so that the metal feed post with a large diameter can be obtained, the structural strength of the metal feed post is improved, the process deviation is reduced, the feed loss is reduced, and the efficiency and the performance of the antenna are improved.
The material of the seed layer 301 includes one of Ti, tiN, ta, taN and the material of the first metal feed-through stud 302 includes one of Au, ag, cu, al. For example, the seed layer 301 may be Ti, the first metal feed-through stud 302 may be Cu, and the seed layer 301 may effectively improve the efficiency and performance of electroplating or electroless plating of the metal feed-through stud, and may effectively enhance the bonding strength between the metal feed-through stud and the rewiring layer 20.
As shown in fig. 5 to 6, step 4) is performed, in which the first metal feed-through stud 302 is encapsulated by an encapsulation layer, and the encapsulation layer is thinned, so that the top surface of the first metal feed-through stud 302 is exposed from the encapsulation layer.
As an example, the method of encapsulating the first metal feed-line stud 302 with an encapsulation layer includes one of compression molding, transfer molding, liquid seal molding, vacuum lamination, and spin coating, and the material of the encapsulation layer includes one of polyimide, silicone, and epoxy. In this embodiment, the material of the encapsulation layer is silica gel.
As shown in fig. 7 to 9, step 5) is performed to form a polymer isolation layer 304 on the surface of the first encapsulation layer 303, and divide the polymer isolation layer 304 into a plurality of block areas to release the stress of the polymer isolation layer 304.
In this embodiment, the polymer isolation layer 304 includes polyimide, and the polymer isolation layer 304 may be divided into a plurality of block areas by using an exposure process and a development process. The polymer isolation layer 304 is divided into a plurality of blocks by using an exposure process and a development process, which can effectively improve the accuracy of dividing the blocks and avoid the damage of the polymer isolation layer 304 caused by mechanical division.
The polymer isolation layer 304 is divided into a plurality of block areas by the dividing channel 305, and the dividing channel 305 is located between two adjacent antenna units, so that the continuity of the polymer isolation layer 304 in the antenna units can be ensured, and the performance of the antenna units is not affected.
According to the antenna packaging method, the large-area polymer isolation layer 304 (such as polyimide PI) is divided into a plurality of areas, so that the stress of the polymer isolation layer 304 can be effectively released, the transmission concentration of the stress can be blocked, and the deformation or bending caused by the mismatch of the thermal expansion coefficients between the polymer isolation layer 304 and other materials (such as packaging layers) can be greatly reduced.
As shown in fig. 10, step 6) is performed, and a second metal pillar 307 is formed on the polymer isolation layer 304, wherein the second metal pillar 307 is connected to the first metal pillar 302.
For example, the material of the second metal feed-through post 307 includes one of Au, ag, cu, al.
In this embodiment, the polymer isolation layer 304 is formed with an opening, the opening is filled with a metal plug 306, the metal plug 306 is connected to the first metal feed-through stud 302, and the second metal feed-through stud 307 is formed on the metal plug 306 by electroplating or electroless plating. It should be noted that, the openings may be formed in the same process step as the streets 305 through an exposure process and a development process, so as to save process steps and reduce process cost.
As shown in fig. 11, step 7) is performed, the second metal wire feeding columns 307 are encapsulated by using a second encapsulation layer 308, and the second encapsulation layer 308 is thinned, so that the top surfaces of the second metal wire feeding columns 307 are exposed out of the second encapsulation layer 308;
as an example, the method of packaging the second metal feed-line stud 307 with an encapsulation layer includes one of compression molding, transfer molding, liquid seal molding, vacuum lamination, and spin coating, and the material of the encapsulation layer includes one of polyimide, silicone, and epoxy. In this embodiment, the material of the second encapsulation layer 308 is silica gel.
As shown in fig. 12, step 8) is performed, and an antenna metal layer 309 is formed on the surface of the second encapsulation layer 308, where the antenna metal layer 309 is connected to the second metal feed-line stud 307.
The antenna metal layer 309 may be formed using, for example, a deposition process and an etching process, or a metal lift-off process (lift-off), etc.
As shown in fig. 13, step 9) is performed next, and the rewiring layer 20 and the support substrate 101 are peeled off based on the separation layer 102, exposing the first surface of the rewiring layer 20.
Specifically, the separation layer 102 includes a light-heat conversion layer, which is irradiated with laser light here to separate the light-heat conversion layer from the rewiring layer 20 and the support substrate 101, thereby peeling the rewiring layer 20 and the support substrate 101.
As shown in fig. 14, step 10) is performed, an antenna circuit chip 401 is provided, and the antenna circuit chip 401 is bonded to the first surface of the rewiring layer 20, so that the antenna circuit chip 401 is electrically connected to the antenna metal layer 309 through the rewiring layer 20 and the first metal feed stud 302 and the second metal feed stud 307. For example, the antenna circuit chip 401 may be bonded to the first surface of the rewiring layer 20 by a soldering process or a ball mounting process, so that the antenna circuit chip 401 is electrically connected to the rewiring layer 20.
For example, the antenna circuit chip 401 includes one or both of an active component including one of a power management circuit, a transmitting circuit, and a receiving circuit, and a passive component including one of a resistor, a capacitor, and an inductor.
As shown in fig. 15, step 8) is finally performed, and a metal bump 501 is formed on the first surface of the rewiring layer 20, so as to implement the electrical extraction of the rewiring layer 20.
As shown in fig. 15, the present embodiment further provides a package structure of an antenna, the package structure including: a rewiring layer 20, the rewiring layer 20 comprising a first face and an opposing second face; a first metal feed-through stud 302 formed on the rewiring layer 20; a first encapsulation layer 303, which encapsulates the first metal pillar 302, and the top surface of which exposes the first metal pillar 302; a polymer isolation layer 304 formed on the first encapsulation layer 303, and the polymer isolation layer 304 is divided into a plurality of block regions; a second metal feed-through stud 307 formed on the polymer isolation layer 304, the second metal feed-through stud 307 being connected to the first metal feed-through stud 302; a second encapsulation layer 308, which encapsulates the second metal wire post 307, and the top surface of which exposes the second metal wire post 307; an antenna metal layer 309 formed on the second encapsulation layer 308, wherein the antenna metal layer 309 is connected to the second metal feed-through post 307; an antenna circuit chip 401 bonded to the first surface of the rewiring layer 20 and electrically connected to the antenna metal layer 309 through the rewiring layer 20 and the first and second metal feed-through posts 307; and a metal bump 501 formed on the first surface of the re-wiring layer 20 to realize electrical extraction of the re-wiring layer 20. According to the antenna packaging structure, the large-area polymer isolation layer 304 (such as polyimide PI) is divided into a plurality of areas, so that the stress of the polymer isolation layer 304 can be effectively released, the transmission concentration of the stress can be blocked, and the deformation or bending caused by the mismatch of the thermal expansion coefficients between the polymer isolation layer 304 and other materials (such as packaging layers) can be greatly reduced.
By way of example, the polymer isolation layer 304 comprises polyimide. The polymer isolation layer 304 is divided into a plurality of block areas by the dividing channel 305, and the dividing channel 305 is located between two adjacent antenna units. The polymer isolation layer 304 is formed with an opening, the opening is filled with a metal plug 306, the metal plug 306 is connected with the first metal feed-through post 302, and the second metal feed-through post 307 is formed on the metal plug 306.
As an example, the material of the first metal feed post 302 and the second metal feed post 307 includes one of Au, ag, cu, al. The materials of the first encapsulation layer 303 and the second encapsulation layer 308 include one of polyimide, silica gel and epoxy resin. The metal bump 501 includes one of tin solder, silver solder and gold-tin alloy solder.
As an example, the antenna circuit chip 401 includes one or two of an active component including one of a power management circuit, a transmitting circuit, and a receiving circuit, and a passive component including one of a resistor, a capacitor, and an inductor.
As described above, the packaging structure and the packaging method of the antenna of the present application have the following beneficial effects:
according to the antenna packaging structure and the packaging method, the large-area polymer isolation layer 304 (such as polyimide PI) is divided into a plurality of areas, so that the stress of the polymer isolation layer 304 can be effectively released, the transmission concentration of the stress can be blocked, and the deformation or bending caused by the mismatch of thermal expansion coefficients between the polymer isolation layer 304 and other materials (such as packaging layers) can be greatly reduced.
The above embodiments are merely illustrative of the principles of the present application and its effectiveness, and are not intended to limit the application. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the application. Accordingly, it is intended that all equivalent modifications and variations of the application be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (18)
1. An antenna package structure, the package structure comprising:
a rewiring layer comprising a first face and an opposing second face;
a first metal feed-through stud formed on the rewiring layer;
the first packaging layer is used for coating the first metal wire feeding column, and the top surface of the first packaging layer is exposed out of the first metal wire feeding column;
a polymer isolation layer formed on the first encapsulation layer, and divided into a plurality of block areas;
a second metal feed post formed on the polymer isolation layer, the second metal feed post being connected to the first metal feed post;
the second packaging layer is used for coating the second metal wire feeding post, and the top surface of the second packaging layer is exposed out of the second metal wire feeding post;
the antenna metal layer is formed on the second packaging layer and is connected with the second metal feeder post;
an antenna circuit chip combined with the first surface of the rewiring layer and electrically connected with the antenna metal layer through the rewiring layer and the first metal feed-line posts and the second metal feed-line posts; and
and the metal bump is formed on the first surface of the rewiring layer so as to realize the electrical extraction of the rewiring layer.
2. The antenna package according to claim 1, wherein: the polymeric barrier layer comprises polyimide.
3. The antenna package according to claim 1, wherein: the polymer isolation layer is divided into a plurality of block areas by dividing channels, and the dividing channels are positioned between two adjacent antenna units.
4. The antenna package according to claim 1, wherein: the polymer isolation layer is provided with an opening, a metal plug is filled in the opening, the metal plug is connected with the first metal feeder pillar, and the second metal feeder pillar is formed on the metal plug.
5. The antenna package according to claim 1, wherein: the material of the first and second metal feed posts comprises one of Au, ag, cu, al.
6. The antenna package according to claim 1, wherein: the materials of the first packaging layer and the second packaging layer comprise one of polyimide, silica gel and epoxy resin.
7. The antenna package of claim 1, wherein: the antenna circuit chip comprises one or two of an active component and a passive component, wherein the active component comprises one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component comprises one of a resistor, a capacitor and an inductor.
8. The antenna package according to claim 1, wherein: the metal bump comprises one of tin solder, silver solder and gold-tin alloy solder.
9. A method of packaging an antenna, the method comprising the steps of:
1) Providing a support substrate, and forming a separation layer on the support substrate;
2) Forming a rewiring layer on the separation layer, the rewiring layer comprising a first face connected with the separation layer and an opposite second face;
3) Forming a first metal feed-through stud on a second side of the rewiring layer;
4) Packaging the first metal wire feeding column by adopting a first packaging layer, and thinning the first packaging layer so that the top surface of the first metal wire feeding column is exposed out of the first packaging layer;
5) Forming a polymer isolation layer on the surface of the first packaging layer, and dividing the polymer isolation layer into a plurality of block areas so as to release the stress of the polymer isolation layer;
6) Forming a second metal feeder pillar on the polymer isolation layer, wherein the second metal feeder pillar is connected with the first metal feeder pillar;
7) Packaging the second metal wire feeding column by adopting a second packaging layer, and thinning the second packaging layer so that the top surface of the second metal wire feeding column is exposed out of the second packaging layer;
8) Forming an antenna metal layer on the second packaging layer, wherein the antenna metal layer is connected with the second metal feeder post;
9) Stripping the rewiring layer and the support substrate based on the separation layer to expose a first face of the rewiring layer;
10 Providing an antenna circuit chip, and bonding the antenna circuit chip to the first surface of the rewiring layer, so that the antenna circuit chip is electrically connected with the antenna metal layer through the rewiring layer and the metal feed posts; and
11 Metal bumps are formed on the first surface of the rewiring layer so as to realize electrical extraction of the rewiring layer.
10. The method of packaging an antenna of claim 9, wherein: the polymeric barrier layer comprises polyimide.
11. The method of packaging an antenna of claim 10, wherein: and 5) dividing the polymer isolation layer into a plurality of block areas by adopting an exposure process and a development process.
12. The method of packaging an antenna of claim 10, wherein: the dividing channel for dividing the polymer isolation layer into a plurality of block areas is positioned between two adjacent antenna units.
13. The method of packaging an antenna of claim 9, wherein: step 6) further includes the steps of forming an opening in the polymer isolation layer, the opening exposing the first metal feed-through stud, and filling a metal plug in the opening, the second metal feed-through stud being formed on the metal plug.
14. The method of packaging an antenna of claim 9, wherein: the support base includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
15. The method of packaging an antenna of claim 9, wherein: the separation layer comprises a light-heat conversion layer, and step 6) the light-heat conversion layer is irradiated by laser so as to separate the light-heat conversion layer from the packaging layer and the support substrate, and then the rewiring layer and the support substrate are peeled off.
16. The method of packaging an antenna of claim 9, wherein: the material of the first and second metal feed posts comprises one of Au, ag, cu, al.
17. The method of packaging an antenna of claim 9, wherein: the packaging method in step 4) and step 7) includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the materials of the first packaging layer and the second packaging layer include one of polyimide, silica gel and epoxy resin.
18. The method of packaging an antenna of claim 9, wherein: the antenna circuit chip comprises one or two of an active component and a passive component, wherein the active component comprises one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component comprises one of a resistor, a capacitor and an inductor.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943568A (en) * | 2013-01-21 | 2014-07-23 | 三星电子株式会社 | Methods Of Fabricating Semiconductor Device Using Nitridation Of Isolation Layers |
| CN108417982A (en) * | 2018-05-09 | 2018-08-17 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and packaging method of antenna |
| CN108511400A (en) * | 2018-03-16 | 2018-09-07 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and packaging method of antenna |
| CN209328892U (en) * | 2019-03-04 | 2019-08-30 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure of antenna |
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| US8988299B2 (en) * | 2011-02-17 | 2015-03-24 | International Business Machines Corporation | Integrated antenna for RFIC package applications |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103943568A (en) * | 2013-01-21 | 2014-07-23 | 三星电子株式会社 | Methods Of Fabricating Semiconductor Device Using Nitridation Of Isolation Layers |
| CN108511400A (en) * | 2018-03-16 | 2018-09-07 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and packaging method of antenna |
| CN108417982A (en) * | 2018-05-09 | 2018-08-17 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure and packaging method of antenna |
| CN209328892U (en) * | 2019-03-04 | 2019-08-30 | 中芯长电半导体（江阴）有限公司 | The encapsulating structure of antenna |
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