WO2021068539A1

WO2021068539A1 - Inspection device and method for micro light-emitting diode

Info

Publication number: WO2021068539A1
Application number: PCT/CN2020/095334
Authority: WO
Inventors: 夏继业
Original assignee: 成都辰显光电有限公司
Priority date: 2019-10-12
Filing date: 2020-06-10
Publication date: 2021-04-15
Also published as: CN112649711A; CN112649711B; KR20220045052A

Abstract

An inspection device and method for a micro light-emitting diode (20). The inspection device is used for inspecting the micro light-emitting diode (20) provided on an original substrate (10). The bottom part of the micro light-emitting diode (20) away from the original substrate (10) comprises an electrode area and a non-electrode area (23). The electrode area is provided with a first contact (21) and a second contract (22). The inspection device comprises: an inspection substrate (30) and an inspection circuit. A bonding layer (40) is provided on the inspection substrate (30). The bonding layer (40) is used for bonding with the original substrate (10) during a test. The inspection circuit comprises an electrode set provided on the bonding layer (40). The electrode set comprises a first electrode (50) and a second electrode (60). The first electrode (50) is used for contacting the first contact (21) of the micro light-emitting diode (20) during the test. The second electrode (60) is used for contacting the second contact (22) of the micro light-emitting diode (20) during the test. The inspection device and method for the micro light-emitting diode (20) reduce the difficulty of repairing a micro light-emitting diode display.

Description

Detection device and method of micro light emitting diode

Technical field

The present disclosure relates to the field of display technology, and in particular to a detection device and method for micro-light emitting diodes.

Background technique

A micro-light-emitting diode display is a display that integrates a high-density and small-size LED array on a primitive substrate to realize image display; it is widely used because of its high quality, thin body, and low energy consumption. The mainstream in the installation.

In the manufacturing process of micro-light-emitting diode displays, it is usually necessary to grow multiple micro-light-emitting diodes on the original substrate (such as sapphire substrate) by molecular epitaxy. These micro-light-emitting diodes can form a Micro-LED array; The peeling technology peels off the micro light emitting diode from the original substrate, and uses the transfer head to transfer the micro light emitting diode to a predetermined position on the receiving substrate, and binds with the receiving substrate.

However, the micro-light-emitting diode is prone to breakage when it is peeled from the original substrate. Therefore, the brightness of the micro-light-emitting diode display needs to be tested after the production is completed. Once the micro-light-emitting diode display is found to be poor, the micro-light-emitting diode needs to be repaired; The LED display manufacturing process has been completed, which increases the difficulty of repairing the micro LED display.

Summary of the invention

The embodiments of the present disclosure provide a detection device and method for micro-light-emitting diodes, which can reduce the difficulty of repairing micro-light-emitting diode displays.

In order to achieve the foregoing objectives, the embodiments of the present disclosure adopt the following technical solutions:

One aspect of the embodiments of the present disclosure provides a detection device for micro-light-emitting diodes, which is used to detect micro-light-emitting diodes arranged on an original substrate. The bottom of the micro-light-emitting diodes away from the original substrate includes electrode regions and non-electrodes. Area, the electrode area is provided with a first contact and a second contact; the detection device includes: a detection substrate and a detection circuit, wherein: the detection substrate is provided with an adhesive layer, and the adhesive layer is used for During testing, it is bonded with the non-electrode area of the micro light-emitting diode; the detection circuit includes an electrode group arranged on the bonding layer, the electrode group includes a first electrode and a second electrode, the first electrode It is used to contact the first contact of the micro light emitting diode during testing, and the second electrode is used to contact the second contact of the micro light emitting diode during testing.

In one embodiment, the adhesive layer is a flexible adhesive layer, and the first electrode and the second electrode are both flexible electrodes; the micro light-emitting diode is embedded in the flexible adhesive layer during testing, The first contact is embedded in the first electrode, and the second contact is embedded in the second electrode.

In one embodiment, a recessed area is provided in the adhesive layer, and the first electrode and the second electrode are provided in the recessed area.

In one embodiment, the detection circuit includes a plurality of electrode groups, and each electrode group includes a strip-shaped first electrode and a strip-shaped second electrode that are arranged in parallel and opposite to each other; and each first electrode in the plurality of electrode groups The electrodes are parallel to each other, and the second electrodes in the plurality of electrode groups are parallel to each other.

In one embodiment, the first electrode and the second electrode are distributed in staggered intervals.

In one embodiment, the second electrode input part and the first electrode input part are disposed on both sides of the adhesive layer opposite to the first electrode input part.

In one embodiment, the detection device further includes a first electrode input part located at the first end of each of the first electrodes and connected to the first end of each of the first electrodes, and located at each of the second electrodes. The first end of the electrode and a second electrode input part connected to the first end of each second electrode; the second electrode input part is opposite to the first electrode input part.

In one embodiment, the first electrode and the second electrode are metal traces with elasticity.

In one embodiment, the first electrode and the second electrode are made of metal-type carbon nanotube films.

In one embodiment, the first electrode is a P electrode (Positive Electrode, positive electrode), and the second electrode is an N electrode (Negative Electrode, negative electrode).

In one embodiment, the first electrode or the second electrode is formed of a flexible metal trace or a metal carbon nanotube film.

In one embodiment, the binding force between the non-electrode area on one side of the micro light emitting diode and the adhesive layer is less than the binding force between the other side of the micro light emitting diode and the transfer head.

In one embodiment, the detection substrate is a rigid substrate.

In one embodiment, the adhesive layer is an acrylic bonding adhesive layer.

In one embodiment, the detection circuit is arranged on a side of the adhesive layer away from the detection substrate.

Another aspect of the embodiments of the present disclosure provides a method for detecting micro-light-emitting diodes, which includes the following steps: placing an original substrate provided with micro-light-emitting diodes above the bonding layer of the detection substrate, and the second part of the micro-light-emitting diodes A contact is arranged opposite to the first electrode arranged on the adhesive layer, and the second contact of the micro light emitting diode is arranged opposite to the second electrode arranged on the adhesive layer; pressing down the original A substrate, the first contact is in contact with the first electrode, the second contact is in contact with the second electrode, and the non-electrode area of the micro light emitting diode is bonded to the adhesive layer; peeling The original substrate separates the original substrate from the micro light-emitting diode; applies a detection voltage to the first electrode and the second electrode, and observes the light-emitting brightness of the micro light-emitting diode.

In one embodiment, the detection method of the micro-light-emitting diode further includes: in the process of applying a detection voltage to the first electrode and the second electrode for detection, using a photodetector to detect the micro-light-emitting diode The luminous brightness is detected, and a distribution map of the defective micro-LEDs is generated; based on the above-mentioned distribution of the defective micro-LEDs, the transfer head is used to transfer the qualified micro-LEDs.

Compared with related technologies, the detection device and method for micro-light-emitting diodes provided by the embodiments of the present disclosure have the following advantages:

The micro-light-emitting diode detection device and method provided by the present disclosure include a detection substrate, and an adhesive layer is provided on the detection substrate, and the first electrode and the second electrode are provided on the adhesive layer, and the first contact of the micro-light-emitting diode The dot can be electrically connected to the first electrode, and the second contact of the micro light emitting diode can be electrically connected to the second electrode. After the non-electrode area where the micro light emitting diode is provided is bonded to the adhesive layer, the original substrate and the micro The light-emitting diode is peeled off, a detection voltage is applied to the first electrode and the second electrode, and the light-emitting brightness of the micro light-emitting diode is observed.

The micro-light-emitting diode detection device and method provided in the present disclosure use the above-mentioned detection device to detect the micro-light-emitting diode before the micro-light-emitting diode is transferred to the receiving substrate, and use the transfer head to transfer the qualified micro-light-emitting diode to the receiving substrate and bind it. Therefore, it is possible to avoid transferring the poorly displayed micro-light-emitting diodes to the receiving substrate, and reduce the difficulty of repairing the micro-light-emitting diode display.

In addition to the above-described technical problems that the present disclosure solves, the technical features that constitute the technical solutions, and the beneficial effects brought by the technical features of these technical solutions, the detection device and method for micro-light-emitting diodes provided by the present disclosure can solve Other technical issues, other technical features included in the technical solution, and beneficial effects brought about by these technical features will be described in further detail in the specific implementation.

Description of the drawings

FIG. 1 is a schematic diagram of a micro light-emitting diode generated on an original substrate in the related art;

FIG. 2 is a first structural schematic diagram of a micro light emitting diode detection device provided by an embodiment of the disclosure;

FIG. 3 is a second structural schematic diagram of a micro-light emitting diode detection device provided by an embodiment of the disclosure;

4 is a schematic diagram of the connection between the micro light emitting diode and the detection circuit provided by the embodiment of the disclosure;

FIG. 5 is a schematic diagram of the steps of a detection method of a micro light emitting diode provided by an embodiment of the disclosure.

Detailed ways

In order to make the above objectives, features and advantages of the present disclosure more obvious and understandable, the technical solutions in the embodiments of the present disclosure will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all the embodiments.

As shown in FIG. 1, in the related art, the original substrate 10 can be a sapphire substrate, a silicon substrate, a silicon carbide substrate or a gallium nitride substrate. The original substrate 10 is provided with a micro light emitting diode 20, or the original substrate 10 is provided with multiple One micro light emitting diode 20; for example, a plurality of micro light emitting diodes 20 may be provided on a sapphire substrate, and the plurality of micro light emitting diodes 20 may form a Micro-LED array. In order to facilitate the transfer of the manufactured plurality of micro light emitting diodes 20 to the receiving substrate, the plurality of micro light emitting diodes 20 may be divided or divided into a plurality of regions, which is convenient for flexible transfer.

Wherein, the micro light emitting diode 20 is provided with an electrode area and a non-electrode area 23 at the bottom away from the original substrate 10, and the electrode area includes a first contact 21 and a second contact 22, the first contact 21 and the second contact 22 The manufacturing material can be one or a combination of metals such as nickel, molybdenum, aluminum, gold, platinum, and titanium; the micro-light-emitting diode 20 is bound with the receiving substrate to form a micro-light-emitting diode display, which is useful for the finished micro-light-emitting diode display. It needs to be tested. Once the micro-light-emitting diode is found to be poorly displayed, the micro-light-emitting diode needs to be repaired; but at this time the manufacturing process of the micro-light-emitting diode display has been completed, which increases the difficulty of detection of the micro-light-emitting diode display.

As shown in Figures 2, 3 and 4, the micro-light-emitting diode detection device provided by the embodiment of the present disclosure is used to detect the micro-light-emitting diode 20 arranged on the original substrate 10; the micro-light-emitting diode detection device includes a detection substrate 30 and a detection circuit, wherein the detection substrate 30 is a hard substrate and can be manufactured by using a glass substrate. In order to ensure that the first contact 21, the second contact 22 and the non-electrode area 23 of the micro light emitting diode are stably connected to the detection substrate 30, the detection substrate 30 is provided with an adhesive layer on its side surface facing the original substrate 10 40. An acrylic bonding adhesive layer can be provided on the glass substrate; for example, polymethyl methacrylate resin is used as a temporary bonding adhesive to be provided on the surface of the glass substrate, and the detection circuit is provided on the adhesive layer 40 away from the detection One side of the substrate.

The detection circuit includes at least one set of electrode groups, and each set of electrode groups includes a first electrode 50 and a second electrode 60. The first electrode 50 and the second electrode 60 may be detection points arranged on the adhesive layer 40, and The first contact 21 of the micro light-emitting diode 20 is connected to a detection point, the second contact 22 is connected to another detection point, and detection is applied to the detection points connected by the first contact 21 and the second contact 22 Voltage, can detect the light-emitting brightness of light-emitting diodes.

Since a plurality of micro light emitting diodes 20 are provided on the original substrate 10, and the plurality of micro light emitting diodes 20 are distributed on the original substrate 10 in an array; in order to realize that the plurality of micro light emitting diodes 20 can be detected at one time, each electrode group can be The first electrode 50 and the second electrode 60 are arranged in parallel and opposite to each other, and the first electrode 50 and the second electrode 60 are both elongated electrodes. The first electrode 50 and the second electrode 60 can be arranged at intervals of rows or columns. On the detection substrate 30. According to the distribution of the multiple micro-light-emitting diodes 20 on the original substrate 10, multiple electrode groups can be provided on the detection substrate 30. The first electrodes 50 in the multiple electrode groups are arranged parallel to each other, and the second electrode group in the multiple electrode groups The electrodes 60 are arranged parallel to each other.

For example, a plurality of first electrodes 50 may be distributed on the adhesive layer 40 in rows, and at the same time, a plurality of second electrodes 60 may also be distributed on the adhesive layer 40 in rows; and the first electrodes 50 and the second electrodes 60 are staggered The interval distribution, the interval between the first electrode 50 and the second electrode 60 can be adjusted according to the interval between the first contact 21 and the second contact 22. In addition, the plurality of first electrodes 50 may also be distributed in columns, and the plurality of second electrodes 60 may also be distributed in columns.

When the micro light emitting diode 20 needs to be inspected, the original substrate provided with the micro light emitting diode is first moved above the detection substrate, and the first contact 21 is connected to the first electrode 50, and the second contact 22 is connected to On the second electrode 60, and the non-electrode area 23 of the micro light emitting diode 20 (including the area between the first contact 21 and the second contact 22) is bonded on the adhesive layer 40; then the first electrode 50 and A detection voltage is applied to one end of the second electrode 60 to observe the light-emitting brightness of the micro-light-emitting diode and determine whether it is damaged. If the brightness of the micro-light-emitting diode is normal, the transfer head can be moved to the receiving substrate for further production, which can avoid poor display. The micro light emitting diode is transferred to the receiving substrate, which reduces the difficulty of repairing the micro light emitting display.

On the basis of the above embodiment, the adhesive layer 40 is a flexible adhesive layer, and the first electrode 50 and the second electrode 60 are both flexible electrodes; the micro light emitting diode 20 is embedded in the flexible adhesive layer 40 during the test, and the first touch The dot 21 is embedded in the first electrode 50 and the second contact 22 is embedded in the second electrode 60.

Specifically, the first electrode 50 and the second electrode 60 described above are formed on the surface of the adhesive layer 40 away from the detection substrate 30, and the first electrode 50 and the second electrode 60 may both be flexible electrodes, that is, the first electrode 50 and the second electrode The second electrode 60 has a certain deformability. Since the adhesive layer 40 is a flexible adhesive layer, when the first contact 21 and the second contact 22 are pressed against the adhesive layer 40, the first electrode 50 and the second electrode 60 can follow the first contact 21 and the second contact. The two contacts 22 are recessed toward the inside of the adhesive layer 40, so that the first contact 21 and the second contact 22 are in contact with the first electrode 50 and the second electrode 60, respectively. In addition, as the first contact 21 and the second contact 22 are trapped in the adhesive layer 40, the non-electrode area 23 at the bottom of the original substrate 10 can be adhered to the adhesive layer 40, so that the micro light-emitting diode 20 can be bonded to the adhesive layer 40. The diode 20 is stably connected to the adhesive layer 40 to enhance the stability of the electrical connection between the first electrode 50 and the first contact 21 and the second electrode 60 and the second contact 22.

In one embodiment, a recessed area may be provided on the adhesive layer 40 according to the size of the contact provided by the micro light emitting diode 20, the first electrode 50 and the second electrode 60 are provided in the recessed area, and the first contact The point 21 and the second contact 22 are respectively embedded in the recessed area, so that the first contact 21 is in contact with the first electrode 50 and the second contact 22 is in contact with the second electrode 60. The first contact 21 and the second contact 22 are to be embedded in the recessed area, and the non-electrode area 23 of the micro light emitting diode can be bonded on the surface of the adhesive layer 40. In the preferred solution of the present embodiment, the flexible first electrode 50 and the second electrode 60 are arranged on the flexible adhesive layer 40, which can facilitate the connection of the contacts of the micro light emitting diode 20 of different shapes, so that the micro light emitting diode 20 can be connected. It is firmly connected to the detection substrate 30, so that there is good conductivity between the two, and the stability of the micro-light-emitting diode detection device can be improved.

On the basis of the foregoing embodiment, the first ends of the plurality of first electrodes 50 may be gathered on one side of the adhesive layer 40 to form the first electrode input portion 51, and the second ends of the first electrodes 50 may extend to the opposite side The first end of the second electrode 60 can be gathered on one side of the adhesive layer 40 and form a second electrode input portion 61, the second end of the second electrode 60 extends toward the first electrode input portion 51, and the first electrode input The portion 51 and the second electrode input portion 61 are respectively located on both sides of the adhesive layer 40 to facilitate the application of a detection voltage to each first electrode 50 and each second electrode 60.

In this embodiment, the adhesive layer 40 is provided with elastic metal traces to form the first electrode 50 and the second electrode 60. Specifically, the adhesive layer 40 is laid on the bottom surface of the entire detection substrate 30 facing the original substrate 10. The adhesive layer 40 has a certain thickness and is made of adhesive glue with certain fluidity, which can be deformed under the action of external force; When the first contact 21 and the second contact 22 are connected to the detection substrate 30, a certain pressure is applied to the original substrate 10 where the first contact 21 and the second contact 22 are located, and the first contact 21, the second contact 22 When the contact 22 is pressed against the first electrode 50 and the second electrode 60, the first electrode 50 and the second electrode 60 are recessed into the adhesive layer 40, so that the first contact 21 is connected to the first electrode 50, and the second contact The dot 22 is connected to the second electrode 60, and the non-electrode area 23 provided on the bottom of the micro light emitting diode 20 away from the original substrate 10 is bonded to the adhesive layer 40.

The first electrode 50 and the second electrode 60 have a certain degree of elongation, and can be made of a metal material with good ductility, such as aluminum, copper, etc.; multiple metal traces can be arranged laterally along the surface of the bonding layer 40, and A plurality of metal traces are arranged at intervals, and the plurality of metal traces form the first electrode 50 and the second electrode 60, wherein one end of a part of the plurality of metal traces is integrated into the first electrode input portion 51, and the other end extends in the lateral direction; One end of a part of the plurality of metal wires away from the first electrode input portion 51 is integrated into the second electrode input portion 61, and the other end extends toward the first electrode input portion 51.

The above-mentioned first electrode 50 is a P electrode, and the second electrode 60 is an N electrode. A P electrode input terminal and an N electrode input terminal are formed on both sides of the adhesive layer 40, which can be applied to the P electrode input terminal and the N electrode input terminal. The detection voltage can be transmitted to the first contact 21 and the second contact 22 of the micro light emitting diode 20 through the first electrode 50 and the second electrode 60 respectively, and the micro light emitting diode 20 can be detected.

In this embodiment, a metal-type carbon nanotube film may also be provided on the bonding layer 40 to form the first electrode 50 and the second electrode 60. Specifically, a metal-type carbon nanotube film is formed on the bottom surface of the bonding layer 40 close to the micro light emitting diode 20 by chemical deposition, and then etching is performed to form the

first electrodes

50 and 50 which are distributed on the bonding layer 40. The second electrode 60, and the first electrode input portion 51 is formed on one side of the adhesive layer 40, so that multiple first electrodes 50 can be connected to the first electrode input portion 51; similarly, on the other side of the adhesive layer 40 A second electrode input portion 61 is formed on the side, and one end of a plurality of second electrodes 60 can be connected to the second electrode input portion 61.

In this embodiment, the bonding force between the non-electrode area 23 on one side of the micro light emitting diode 20 and the adhesive layer 40 is smaller than the bonding force between the other side of the micro light emitting diode 20 and the transfer head. Specifically, after the micro light emitting diode 20 is connected to the detection substrate 30 and the detection is completed, the micro light emitting diode 20 that has passed the detection can be transferred to a predetermined position of the receiving substrate using a transfer head and bound, and the micro light emitting diode 20 needs to be connected to the detection substrate 30 is separated, so that the bonding force (adhesive force) formed between the non-electrode area 23 of the micro light emitting diode 20 and the adhesive layer 40 is smaller than that formed between the side of the micro light emitting diode 20 away from the contact and the transfer head. The adsorption force applies an external force to the transfer head to separate the micro light emitting diode 20 from the adhesive layer 40, so that the micro light emitting diode 20 is adsorbed on the transfer head and transferred, for example, to a receiving substrate.

As shown in FIG. 5, based on the above-mentioned embodiments, the present disclosure also provides a method for detecting micro light-emitting diodes, which includes the following steps:

Step a, the original substrate provided with the micro-light-emitting diode 20 is placed above the adhesive layer 40 of the detection substrate 30, and the first contact 21 of the micro-light-emitting diode 20 is in direct contact with the first electrode 50 provided on the adhesive layer 40. In the opposite arrangement, the second contact 22 of the micro light emitting diode 20 and the second electrode 60 arranged on the adhesive layer 40 are arranged directly opposite. Specifically, when the micro-light-emitting diode detection device is used to detect the micro-light-emitting diode 20 formed on the original substrate 10, the original substrate 10 is first moved above the detection substrate 30, and the detection substrate 30 is provided with an adhesive layer 40, And the first electrode 50 and the second electrode 60 are distributed on the adhesive layer 40, so that the first contact 21 and the first electrode 50 of the micro light emitting diode 20 are arranged directly opposite to each other, and the second contact 22 and the second electrode 60 are directly opposite to each other. Set up.

Step b, press down the original substrate 10 to make the first contact 21 contact the first electrode 50, the second contact 22 contact the second electrode 60, and the non-electrode area 23 of the micro light emitting diode 20 is bonded to the adhesive layer 40 . Specifically, after the first contact 21 and the second contact 22 are aligned with the first electrode 50 and the second electrode 60, respectively, the original substrate 10 is pressed down so that the first contact 21 and the first electrode 50 are in contact with each other and are electrically connected. The second contact 22 is in contact with the second electrode 60 and is electrically connected. At the same time, the non-electrode area 23 of the micro light emitting diode 20 away from the bottom of the original substrate 10 is bonded to the adhesive layer 40, which can make the micro light emitting The diode 20 is fixed on the adhesive layer 40 to prevent the micro-light-emitting diode 20 from being damaged due to the weak connection between the micro-light-emitting diode 20 and the adhesive layer 40 when the original substrate 10 and the micro-light-emitting diode 20 are peeled off.

Step c: peeling off the original substrate 10 to separate the original substrate 10 from the micro light emitting diode 20; specifically, the original substrate 10 and the micro light emitting diode 20 are peeled off using a laser peeling technique to separate the original substrate 10 from the micro light emitting diode 20. Since the damage of the micro light emitting diode 20 is mainly generated during the peeling process of the original substrate 10 and the micro light emitting diode 20, the present embodiment detects the micro light emitting diode 20 after peeling, which can improve the accuracy of detecting the micro light emitting diode 20.

In step d, a detection voltage is applied to the first electrode 50 and the second electrode 60, and the light-emitting brightness of the micro light-emitting diode 20 is observed. Specifically, the light-emitting brightness of the micro light-emitting diode 20 after peeling is detected, and the detection voltage can be applied to the first electrode input portion 51 and the second electrode input portion 61 located on both sides of the adhesive layer 40 to observe the micro light-emitting diode 20 If it is qualified, the transfer head is used to transfer to a predetermined position of the receiving substrate, and the micro-LED 20 and the receiving substrate are bound to make a micro-LED display.

On the basis of the above embodiment, in order to improve the repair efficiency of the micro light emitting diode 20 and the transfer efficiency of the micro light emitting diode 20, in this embodiment, in the process of applying a detection voltage to the first electrode 50 and the second electrode 60 for detection , The photodetector can be used to detect the optical performance of each micro-light-emitting diode 20 and record the distribution map of the poor micro-light-emitting diode; the transfer head uses the distribution map of the above-mentioned poor micro-light-emitting diode 20 to perform the inspection on the qualified micro-light-emitting diode 20 Transfer.

Specifically, in the process of judging the light-emitting brightness of the micro-light-emitting diode 20, there is a certain judgment error by simply relying on the inspector to identify whether it is bright or not or the normal light-emitting intensity. For the micro-light-emitting diode 20 with less damage, It is impossible to make an intuitive judgment based on the above phenomenon. Therefore, it is necessary to use a photodetector to detect the micro light emitting diode 20, and use the detected light wavelength and other optical properties to determine the damage degree of the micro light emitting diode 20 and record it.

In order to facilitate the repair of the damaged micro-light-emitting diodes 20 and the transfer of the qualified micro-light-emitting diodes 20, the distribution map of the defective micro-light-emitting diodes 20 can be made using the above-mentioned inspection records, and the corresponding degree of damage should be indicated; The distribution map of the light-emitting diodes 20 reasonably divides the corresponding areas, and the transfer head is used to transfer the defined micro-light-emitting diode 20 array, which improves the transfer efficiency of the micro-light-emitting diode 20. In addition, the inspector judges whether it needs to be repaired according to the damage degree of the micro light emitting diode 20, so as to save repair costs and improve repair efficiency.

The detection method of micro-light-emitting diodes provided by the embodiments of the present disclosure uses the above-mentioned detection device for detection before the micro-light-emitting diodes are transferred to the receiving substrate, and the transfer head is used to transfer qualified micro-light-emitting diodes to the receiving substrate and bind, which can be effective Avoid transferring poorly displayed micro-light-emitting diodes to the receiving substrate, and reduce the difficulty of repairing the micro-light-emitting display.

Claims

A detection device for micro-light-emitting diodes is used to detect micro-light-emitting diodes arranged on an original substrate. The bottom of the micro-light-emitting diodes away from the original substrate includes an electrode area and a non-electrode area, and the electrode area is provided with The first contact and the second contact; wherein, the detection device includes:

A detection substrate, wherein an adhesive layer is provided on the detection substrate, and the adhesive layer is used for bonding with the non-electrode area of the micro light-emitting diode during testing;

A detection circuit, the detection circuit includes an electrode group disposed on the adhesive layer, the electrode group includes a first electrode and a second electrode, and the first electrode is used to interact with the first electrode of the micro light-emitting diode during testing. A contact contact, and the second electrode is used to contact the second contact of the micro light-emitting diode during testing.
The detection device according to claim 1, wherein the adhesive layer is a flexible adhesive layer, and the first electrode and the second electrode are both flexible electrodes.
The detection device according to claim 1, wherein, during testing, the micro light emitting diode is embedded in the flexible adhesive layer, the first contact is embedded in the first electrode, and the second contact is The dots are embedded in the second electrode.
The detection device according to claim 1, wherein a recessed area is provided in the adhesive layer, and the first electrode and the second electrode are provided in the recessed area.
The detection device according to claim 1, wherein the detection circuit comprises a plurality of electrode groups, each electrode group comprises a strip-shaped first electrode and a strip-shaped second electrode arranged in parallel and opposite to each other;

In addition, the first electrodes in the plurality of electrode groups are parallel to each other, and the second electrodes in the plurality of electrode groups are parallel to each other.
The detection device according to claim 5, wherein the first electrode and the second electrode are distributed alternately and spaced apart.
7. The detection device according to claim 6, wherein the detection device further comprises a first electrode input part located at the first end of each of the first electrodes and connected to the first end of each of the first electrodes, and A second electrode input part located at the first end of each of the second electrodes and connected to the first end of each of the second electrodes;

The second electrode input part is arranged opposite to the first electrode input part.
7. The detection device according to claim 7, wherein the second electrode input portion and the first electrode input portion are disposed on both sides of the adhesive layer opposite to the first electrode input portion.
The detection device according to claim 1, wherein the first electrode and the second electrode are metal wires with elasticity.
The detection device according to claim 1, wherein the first electrode and the second electrode are made of a metal-type carbon nanotube film.
The detection device according to claim 1, wherein the first electrode is a positive electrode, and the second electrode is a negative electrode.
The detection device according to claim 1, wherein the first electrode or the second electrode is formed of a flexible metal trace or a metal carbon nanotube film.
The detection device according to claim 1, wherein the bonding force between the non-electrode area on one side of the micro light emitting diode and the adhesive layer is smaller than that between the other side of the micro light emitting diode and the transfer head. The binding power.
The detection device according to claim 1, wherein the detection substrate is a rigid substrate.
The detection device according to claim 1, wherein the adhesive layer is an acrylic bonding adhesive layer.
The detection device according to claim 1, wherein the detection circuit is provided on a side of the adhesive layer away from the detection substrate.
A method for detecting micro-light-emitting diodes includes the following steps:

The original substrate provided with the micro-light-emitting diode is placed above the bonding layer of the detection substrate, and the first contact of the micro-light-emitting diode and the first electrode provided on the bonding layer are arranged directly opposite to each other. The second contact of the light emitting diode and the second electrode arranged on the adhesive layer are arranged directly opposite;

The original substrate is pressed down, the first contact is in contact with the first electrode, the second contact is in contact with the second electrode, and the non-electrode area of the micro light-emitting diode is adhered to the adhesive layer. Knot

Peeling off the original substrate to separate the original substrate from the micro light emitting diode;

A detection voltage is applied to the first electrode and the second electrode, and the light-emitting brightness of the micro light-emitting diode is observed.
The detection method according to claim 17, wherein the detection method of the micro light-emitting diode further comprises:

In the process of applying a detection voltage to the first electrode and the second electrode for detection, a photodetector is used to detect the light-emitting brightness of the micro light-emitting diode, and a distribution map of the bad micro light-emitting diode is generated;

Based on the above-mentioned distribution map of the defective micro-light-emitting diodes, the transfer head is used to transfer the qualified micro-light-emitting diodes.