WO2021060148A1

WO2021060148A1 - Photosensitive transfer member, method for producing resin pattern, method for producing circuit wiring, and method for producing touch panel

Info

Publication number: WO2021060148A1
Application number: PCT/JP2020/035288
Authority: WO
Inventors: 佐藤　守正
Original assignee: 富士フイルム株式会社
Priority date: 2019-09-27
Filing date: 2020-09-17
Publication date: 2021-04-01
Also published as: JPWO2021060148A1; JP7340616B2; CN114450633A; TW202113484A; KR20220053615A

Abstract

The present invention addresses the problem of providing: a photosensitive transfer member having excellent laminating properties and being capable of suppressing the occurrence of blocking when a temporary support body and a thermoplastic resin layer are peeled off; a method for producing a resin pattern; a method for producing circuit wiring; and a method for producing a touch panel.　A photosensitive transfer member according to the present invention includes a temporary support body, a thermoplastic resin layer, a photosensitive resin layer, and a cover film, in the stated order, wherein: the thermoplastic resin layer has a Vicat softening point of 50°C to 120°C and a tensile modulus of 10 to 200 MPa; and the peeling strength between the temporary support body and the thermoplastic resin layer is greater than the peeling strength between the thermoplastic resin layer and the photosensitive resin layer.

Description

Photosensitive transfer member, resin pattern manufacturing method, circuit wiring manufacturing method, and touch panel manufacturing method

The present invention relates to a photosensitive transfer member, a method for manufacturing a resin pattern, a method for manufacturing a circuit wiring, and a method for manufacturing a touch panel.

In display devices equipped with a touch panel such as a capacitance type input device (organic electroluminescence (EL) display device, liquid crystal display device, etc.), the electrode pattern corresponding to the sensor of the visual recognition part, the peripheral wiring part, and the wiring of the take-out wiring part are wired. A conductive layer pattern such as is provided inside the touch panel.
Generally, in forming a patterned layer, the number of steps for obtaining a required pattern shape is small, so that a layer of a photosensitive resin composition provided on an arbitrary substrate using a photosensitive transfer member is used. On the other hand, a method of developing after exposure through a mask having a desired pattern is widely used.
For example, Patent Document 1 describes a pattern-forming material having a cushion layer containing a thermoplastic resin and a photosensitive layer in this order on a support ([Claim 1] [Claim 5]). As a pattern forming method using a pattern forming material, a method of exposing the photosensitive layer after peeling off the support is described ([Claim 15]).

JP-A-2007-178459

The present inventor examined a pattern forming method using the pattern forming material (photosensitive transfer member) described in Patent Document 1, and found that the laminate property was good, but the productivity (for example, developability). From this point of view, when a method of peeling the cushion layer (thermoplastic resin layer) together with the support (temporary support) was adopted before the development treatment, the temporary support and the thermoplastic resin layer were separated by the roll-to-roll method. It was clarified that there is a problem that blocking occurs when the laminated body is wound up and collected, which makes it impossible to carry the resin.

Therefore, the present invention provides a photosensitive transfer member, a resin pattern manufacturing method, a circuit wiring manufacturing method, and a touch panel, which are excellent in laminateability and can suppress the occurrence of blocking when the temporary support and the thermoplastic resin layer are peeled off. An object is to provide a manufacturing method.

As a result of diligent studies to achieve the above problems, the present inventor has a vicut softening point of the thermoplastic resin layer in the photosensitive transfer member having the temporary support, the thermoplastic resin layer, the photosensitive resin layer and the cover film in this order. And by adjusting the tensile elasticity to a specific range and making the peel strength between the temporary support and the thermoplastic resin layer larger than the peel strength between the thermoplastic resin layer and the photosensitive resin layer, the laminateability is excellent. , The present invention has been completed by finding that the occurrence of blocking can be suppressed when the temporary support and the thermoplastic resin layer are peeled off.
That is, the present inventor has found that the above problems can be achieved by the following configuration.

[1] A photosensitive transfer member having a temporary support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order.
The Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C., and the tensile elastic modulus is 10 to 200 MPa.
A photosensitive transfer member in which the peel strength between the temporary support and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer.
[2] The photosensitive transfer member according to [1], wherein the thickness of the thermoplastic resin layer is more than 2 μm and less than 20 μm.
[3] The photosensitive transfer member according to [1] or [2], wherein the temporary support has a thickness of 6 to 50 μm.
[4] The photosensitive transfer member according to any one of [1] to [3], wherein the haze of the temporary support is 0.5% or less.
[5] The photosensitive transfer member according to any one of [1] to [4], wherein the haze of the laminate of the temporary support and the thermoplastic resin layer is 0.9% or less.
[6] The photosensitive transfer member according to any one of [1] to [5], wherein the thermoplastic resin layer has a tensile elastic modulus of 50 to 200 MPa.
[7] Of the peel strength between each layer of the temporary support, the thermoplastic resin layer, the photosensitive resin layer and the cover film, the peel strength between the temporary support and the thermoplastic resin layer is the strongest, and the photosensitive resin layer and the cover The photosensitive transfer member according to any one of [1] to [6], which has the weakest peeling strength from a film.

[8] A method for producing a resin pattern in which a resin pattern is produced by roll-to-roll using the photosensitive transfer member according to any one of [1] to [7].
The peeling process of peeling the cover film from the photosensitive transfer member,
A bonding step in which the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled off is brought into contact with a substrate having a conductive layer and bonded.
The exposure process of pattern exposure of the photosensitive resin layer and
It has a developing step of developing the exposed photosensitive resin layer to form a resin pattern, in this order.
A method for producing a resin pattern, which comprises a step of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between a bonding step and an exposure step, or between an exposure step and a developing step.

[9] A method for manufacturing a circuit wiring for producing a circuit wiring by roll-to-roll using the photosensitive transfer member according to any one of [1] to [7].
The peeling process of peeling the cover film from the photosensitive transfer member,
A bonding step in which the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled off is brought into contact with a substrate having a conductive layer and bonded.
The exposure process of pattern exposure of the photosensitive resin layer and
A developing process that develops the exposed photosensitive resin layer to form a resin pattern,
A step of etching the conductive layer in the region where the resin pattern is not arranged is provided in this order.
A method for manufacturing a circuit wiring, comprising a step of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between a bonding step and an exposure step, or between an exposure step and a developing step.

[10] A method for manufacturing a touch panel, wherein the touch panel is manufactured by roll-to-roll using the photosensitive transfer member according to any one of [1] to [7].
The peeling process of peeling the cover film from the photosensitive transfer member,
A bonding step in which the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled off is brought into contact with a substrate having a conductive layer and bonded.
The exposure process of pattern exposure of the photosensitive resin layer and
A developing process that develops the exposed photosensitive resin layer to form a resin pattern,
A step of etching the conductive layer in the region where the resin pattern is not arranged is provided in this order.
A method for manufacturing a touch panel, comprising a step of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between a bonding step and an exposure step, or between an exposure step and a developing step.

According to the present invention, a photosensitive transfer member, a resin pattern manufacturing method, a circuit wiring manufacturing method, and a touch panel, which have excellent laminate properties and can suppress the occurrence of blocking when the temporary support and the thermoplastic resin layer are peeled off. A manufacturing method can be provided.

FIG. 1 is a schematic cross-sectional view showing an example of an embodiment of the photosensitive transfer member of the present invention. FIG. 2 is a schematic view showing the pattern A. FIG. 3 is a schematic view showing the pattern B.

Hereinafter, the present invention will be described in detail.
The description of the constituent elements described below may be based on a typical embodiment of the present invention, but the present invention is not limited to such an embodiment.
In the specification of the present application, the numerical range represented by using "-" means a range including the numerical values before and after "-" as the lower limit value and the upper limit value.
Further, in the present specification, as each component, a substance corresponding to each component may be used alone or in combination of two or more. Here, when two or more kinds of substances are used in combination for each component, the content of the component means the total content of the substances used in combination unless otherwise specified.
Further, in the present specification, "(meth) acrylic acid" means either or both of acrylic acid and methacrylic acid, and "(meth) acrylate" means either or both of acrylate and methacrylate. Represent.
Further, in the present specification, "exposure" includes not only exposure using light but also drawing using particle beams such as an electron beam and an ion beam, unless otherwise specified. Examples of the light used for exposure generally include the emission line spectrum of a mercury lamp, far ultraviolet rays typified by an excimer laser, extreme ultraviolet rays (EUV light), X-rays, and active rays (active energy rays) such as electron beams. ..

[Photosensitive transfer member]
The photosensitive transfer member of the present invention is a photosensitive transfer member having a temporary support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order.
Further, in the photosensitive transfer member of the present invention, the Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C., and the tensile elastic modulus is 10 to 200 MPa.
Further, in the photosensitive transfer member of the present invention, the peel strength between the temporary support and the thermoplastic resin layer is larger than the peel strength between the thermoplastic resin layer and the photosensitive resin layer.

Here, "the peel strength between the temporary support and the thermoplastic resin layer is larger than the peel strength between the thermoplastic resin layer and the photosensitive resin layer" means that the resin pattern using the photosensitive transfer material of the present invention is used. This is a regulation intended to peel off the thermoplastic resin layer together with the temporary support when the temporary support is peeled off before the development process.
Regarding the magnitude of the peeling strength, adhesive tape is attached to both sides of the test piece (5 cm width x 10 cm length) cut out from the photosensitive transfer material, and the non-temporary support side (cover film side) is fixed to a horizontal pedestal. After peeling the temporary support side in the horizontal direction, it can be confirmed by observing the peeling interface with an optical microscope or the like.

The photosensitive transfer member of the present invention having such a structure is excellent in laminateability and can suppress the occurrence of blocking when the temporary support and the thermoplastic resin layer are peeled off.
This is not clear in detail, but the present inventor speculates as follows.
That is, since the Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C., the photosensitive resin layer adjacent to the thermoplastic resin layer can follow the unevenness of the substrate when the photosensitive transfer member is laminated on the substrate. Therefore, it is considered that the laminate property is improved.
Further, the peel strength between the temporary support and the thermoplastic resin layer is larger than the peel strength between the thermoplastic resin layer and the photosensitive resin layer, and the tensile elastic modulus of the thermoplastic resin layer is 10 to 200 MPa. As a result, when the temporary support and the thermoplastic resin layer are peeled off at the same time, the thermoplastic resin layer becomes more self-supporting, and it is considered that the occurrence of blocking with the temporary support can be suppressed.

[Temporary support]
The temporary support included in the photosensitive transfer member of the present invention is a support that supports a photosensitive resin layer or a laminate containing a photosensitive resin layer and is removable.

The temporary support preferably has light transmission property from the viewpoint of enabling exposure of the photosensitive resin layer through the temporary support when pattern-exposing the photosensitive resin layer.
Here, "having light transmittance" means that the transmittance of light having a wavelength used for pattern exposure is 50% or more.
Further, from the viewpoint of improving the exposure sensitivity of the photosensitive resin layer, the temporary support preferably has a light transmittance of 60% or more, preferably 70% or more, at a wavelength (preferably a wavelength of 365 nm) used for pattern exposure. More preferably.
Further, as a method of measuring the transmittance, a method of measuring using MCPD Series manufactured by Otsuka Electronics Co., Ltd. can be mentioned.

Examples of the temporary support include a resin film and paper, and a resin film is preferable from the viewpoint of strength and flexibility.
Specific examples of the resin film include polyethylene terephthalate (PET) film, cellulose triacetate film, polystyrene film, polycarbonate film, polyethylene film, polypropylene film, and polyimide film. Of these, a biaxially stretched polyethylene terephthalate film is particularly preferable.
Further, the resin film may be a single layer or a laminated body having two or more layers.

The thickness of the temporary support is not particularly limited, and is considered from the viewpoints of strength as a support, flexibility required for bonding to a circuit wiring forming substrate, and light transmission required in the first exposure step. Therefore, it may be selected according to the material.
The thickness of the temporary support is preferably 5 to 300 μm, and more preferably 6 to 50 μm for the reason that it is easy to handle.
Here, the thickness of the temporary support can be obtained by obtaining the arithmetic mean value of the thickness of the temporary support measured at 10 randomly selected points in the cross-sectional observation image of the temporary support in the thickness direction. Let the value be the thickness of the temporary support. A cross-sectional observation image of the temporary support in the thickness direction can be obtained by using a scanning electron microscope (SEM). The thicknesses of the thermoplastic resin layer and the photosensitive resin layer, which will be described later, can also be measured by the same method as described above.

The haze of the temporary support is preferably 0.5% or less, more preferably 0.4% or less, for the reason that the resolution of the photosensitive transfer member is good.
Further, the haze of the temporary support is preferably 0.05% or more, more preferably 0.1% or more, from the viewpoint of transportability at the time of manufacturing the temporary support.
Here, the haze is a total light haze (%) conforming to JIS K 7136: 2000, and can be measured as a total light haze using a haze meter (device name: HZ-2, manufactured by Suga Test Instruments Co., Ltd.). ..

In the present invention, from the viewpoint of improving the adhesion to the thermoplastic resin layer described later, surface treatment such as glow discharge treatment, corona treatment, ultraviolet irradiation treatment, etc. on the surface of the temporary support; polyvinylidene chloride resin, An undercoat treatment such as styrene-butadiene rubber or gelatin may be applied.
In the present invention, when a temporary support that has been subjected to surface treatment or undercoating treatment is used, the provisions such as peel strength, thickness, and haze are intended for the temporary support after treatment.

Further, it is preferable that the film used as the temporary support has no deformation such as wrinkles or scratches.
From the viewpoint of pattern formation during pattern exposure via the temporary support and transparency of the temporary support, it is preferable that the number of fine particles, foreign substances, and defects contained in the temporary support is small. The number of the above fine particles and foreign matter and defect diameter 1μm is preferably 50/10 mm ² or less, more preferably 10/10 mm ² or less, further preferably 3/10 mm ² or less , 0 pieces / 10 mm ² is particularly preferable.

Preferred embodiments of the provisional support include, for example, paragraphs 0017 to 0018 of JP2014-085643), paragraphs 0019 to 0026 of JP2016-0273363, and paragraphs 0041 to International Publication No. 2012/081680. 0057, paragraphs 0029 to 0040 of WO 2018/179370, the contents of these publications are incorporated herein by reference.

[Thermoplastic resin layer]
The thermoplastic resin layer of the photosensitive transfer member of the present invention is a thermoplastic resin layer having a Vicat softening point of 50 to 120 ° C. and a tensile elastic modulus of 10 to 200 MPa.

Here, the Vicat softening point refers to a value measured by the following procedure.
(1) Test piece A test piece having a thermoplastic resin layer having a thickness of 3 to 4 mm formed on a PET film having a thickness of 10 to 100 μm is used. The thermoplastic resin layer may be formed on the test piece by any of a coating method, a melt extrusion method, and a method of heat-laminating a thin film a plurality of times to thicken the film.
(2) Measurement Measure according to the Viker Vicat method (polymer softening point measurement method by American material test method ASTMD1525).

The tensile elastic modulus refers to a value measured by the following procedure.
(1) Test piece A test piece having a thermoplastic resin layer having a thickness of 3 to 4 mm formed on a PET film having a thickness of 10 to 100 μm is used. The thermoplastic resin layer may be formed on the test piece by any of a coating method, a melt extrusion method, and a method of heat-laminating a thin film a plurality of times to thicken the film.
(2) Measurement Measure according to the tensile test by the American material test method ASTMD882.

In the present invention, the Vicat softening point of the thermoplastic resin layer is preferably 70 to 100 ° C. for the reason that the laminate property is improved.

Further, in the present invention, the tensile elastic modulus of the thermoplastic resin layer is preferably 50 to 200 MPa because the occurrence of blocking can be further suppressed when the temporary support and the thermoplastic resin layer are peeled off.

<Thermoplastic resin>
The thermoplastic resin layer preferably has a thermoplastic resin.
Specifically, as such a thermoplastic resin, for example,
Polyethylene and polyolefins such as polypropylene;
Copolymers of ethylene and vinyl acetate, and ethylene copolymers such as their saponified products;
Copolymers of ethylene and acrylic acid esters and their saponified products, polyvinyl chloride, and copolymers of vinyl chloride and vinyl acetate and saponized products thereof and other vinyl chloride copolymers;
Polyvinylidene chloride, vinylidene chloride copolymers, polystyrene, and styrene copolymers such as copolymers of styrene and (meth) acrylic acid esters and saponified products thereof;
Polyvinyltoluene and vinyltoluene copolymers such as a copolymer of vinyltoluene and (meth) acrylic acid ester and a saponified product thereof;
Poly (meth) acrylic acid ester and (meth) acrylic acid ester copolymer such as a copolymer of butyl (meth) acrylate and vinyl acetate;
Polyamide resins such as vinyl acetate copolymer nylon, copolymer nylon, N-alkoxymethylated nylon, N-dimethylaminoated nylon;
And so on.
Of these, polyolefins, ethylene copolymers, or vinyl chloride copolymers are preferable.

In the present invention, the dissolution characteristics of the thermoplastic resin described above may be sufficiently matched with the dissolution characteristics of the photosensitive resin layer described later, or the photosensitive resin layer described later may be soluble in a solvent in which the photosensitive resin layer is not dissolved at all. It may have characteristics.

The thermoplastic resin layer may contain one type of thermoplastic resin alone or may contain two or more types of thermoplastic resin.
The content of the thermoplastic resin is preferably 10% by mass or more and 99% by mass or less, and 20% by mass or more and 90% by mass or less, based on the total mass of the thermoplastic resin layer from the viewpoint of improving the laminate property. It is more preferable that it is 30% by mass or more and 80% by mass or less.

<Plasticizer>
The thermoplastic resin layer may contain a plasticizer compatible with the above-mentioned thermoplastic resin from the viewpoint of adjusting the bicut softening point. For example, even when a thermoplastic resin having a Vicat softening point of 120 ° C. or higher is used, the Vicat softening point of the thermoplastic resin layer is adjusted to 50 ° C. to 120 ° C. by adding a plasticizer compatible with the thermoplastic resin. can do.
The plasticizer is not particularly limited as long as it is a compound that is compatible with the thermoplastic resin and exhibits plasticity, but from the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, and is a polyalkylene glycol. More preferably, it is a compound. The alkyleneoxy group contained in the plasticizer is more preferably a polyethyleneoxy structure or a polypropyleneoxy structure.

The thermoplastic resin layer may contain one type of plasticizer alone, or may contain two or more types of plasticizer.
When the thermoplastic resin layer contains a plasticizer, the content of the plasticizer is 1% by mass to 70% by mass with respect to the total mass of the thermoplastic resin layer because the photosensitive transfer member is more excellent in laminating property at high speed. It is preferably by mass%, more preferably 5% by mass to 50% by mass.

<Other ingredients>
From the viewpoint of adjusting the adhesive force with the temporary support described above, the thermoplastic resin layer contains various polymers, supercooling substances, adhesion improvers and mold release agents within a range in which the substantial softening point does not exceed 80 ° C. It is possible to add.
Further, from the viewpoint of further preventing the occurrence of blocking with the temporary support described above, an organic or inorganic filler can be added.
Further, it has other components such as an acid-reactive dye or a base-reactive dye (hereinafter abbreviated as "dye B"), a photoacid generator or a photobase generator, a surfactant, and a sensitizer. May be good.

(Dye B)
The thermoplastic resin layer preferably has an acid-reactive dye or a base-reactive dye (dye B). Dye B represents a dye whose maximum absorption wavelength changes depending on an acid or a base. The dye B preferably has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development.
Here, "the maximum absorption wavelength of the dye changes depending on the acid or base" means that the dye in the color-developing state is decolorized from the acid or base, the dye in the decolorized state is colored by the acid or base, and the like. It may refer to any aspect of a mode in which a dye in a color-developing state is changed to a color-developing state of another hue by an acid or a base.
From the viewpoint of visibility and resolution of the exposed and non-exposed areas, the dye B is preferably a dye whose maximum absorption wavelength changes depending on the acid, and the dye B changes the maximum absorption wavelength depending on the acid. It is particularly preferable that the dye is used in combination with a photoacid generator described later.

As an example of the color-developing mechanism of the dye B in the present disclosure, an acid is generated by adding a photoacid generator or a photobase generator to the thermoplastic resin layer and exposing the dye B with an acid or a base generated from the photoacid generator or the like. Examples thereof include a mode in which a reactive dye or a base-reactive dye (for example, a leuco dye) develops a color.

The method for measuring the maximum absorption wavelength is to measure the transmission spectrum in the range of 400 nm to 780 nm using a spectrophotometer (device name: UV3100, manufactured by Shimadzu Corporation) at 25 ° C. in an atmospheric atmosphere. The wavelength at which the light intensity is minimized (maximum absorption wavelength) shall be measured.

Examples of the dye B include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, anthraquinone dyes, and the like, and have visibility of exposed and unexposed areas. From the viewpoint, leuco compounds are preferable.
Preferred embodiments of the dye B include those similar to the specific latent dyes described in paragraphs 0023 to 0039 of International Publication No. 2019/022089.
Specific examples of Dye B include Brilliant Green, Ethyl Violet, Methyl Green, Crystal Violet, Basic Fuxin, Methyl Violet 2B, Kinaldine Red, Rose Bengal, Metanyl Yellow, Timor Sulfophthalene, Xylenol Blue, Methyl Orange, and Para. Methyl Red, Congofred, Benzopurpurin 4B, α-naphthyl Red, Nile Blue 2B, Nile Blue A, Methyl Violet, Malakite Green, Parafuxin, Victoria Pure Blue-Naphthalene Sulfonate, Victoria Pure Blue BOH (Hodogaya Chemical Industry) (Made by Orient Chemical Industry Co., Ltd.), Oil Blue # 603 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Pink # 312 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red 5B (manufactured by Orient Chemical Industry Co., Ltd.), Oil Scarlet # 308 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red OG (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red RR (manufactured by Orient Chemical Industry Co., Ltd.), Oil Green # 502 (manufactured by Orient Chemical Industry Co., Ltd.) , Spiron Red BEH Special (manufactured by Hodoya Chemical Industry Co., Ltd.), m-cresol purple, cresol red, rhodamine B, rhodamine 6G, sulfolodamine B, auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino- 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-p-N, N-bis (hydroxyethyl) amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino- Dyes such as 5-pyrazolone, 1-β-naphthyl-4-p-diethylaminophenylimino-5-pyrazolone, p, p', p "-hexamethyltriaminotriphenylmethane (leucocrystal violet), Pergascript Blue SRB ( Leuco compounds such as (manufactured by Ciba Geigy) can be mentioned.

The dye B may be used alone or in combination of two or more.
When the thermoplastic resin layer contains the dye B, the content of the dye B is 0.01% by mass or more with respect to the total mass of the thermoplastic resin layer from the viewpoint of visibility of the exposed portion and the non-exposed portion. It is preferably 0.02% by mass to 6% by mass, and more preferably 0.02% by mass to 6% by mass.

(Photoacid generator or photobase generator)
The thermoplastic resin layer preferably contains a photoacid generator or a photobase generator in combination with the dye B for the reason of improving the visibility of the exposed portion and the non-exposed portion. A more preferred embodiment is one comprising an acid-reactive dye and a photoacid generator.

The photoacid generator or photobase generator used in the present disclosure is a compound capable of generating an acid or a base by irradiating with active rays such as ultraviolet rays, far ultraviolet rays, X-rays, and electron beams.
As the photoacid generator or photobase generator used in the present disclosure, a compound that is sensitive to active light having a wavelength of 300 nm or more, preferably a wavelength of 300 nm to 450 nm and generates an acid or a base is preferable, but the chemical structure thereof is Not limited. Further, a photoacid generator or a photobase generator that is not directly sensitive to active light having a wavelength of 300 nm or more is also a compound that is sensitive to active light having a wavelength of 300 nm or more and generates an acid or a base when used in combination with a sensitizer. If there is, it can be preferably used in combination with a sensitizer.

Examples of the photoacid generator include an ionic photoacid generator and a nonionic photoacid generator.
Examples of the ionic photoacid generator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, and quaternary ammonium salts. Of these, onium salt compounds are preferable, and triarylsulfonium salts and diaryliodonium salts are particularly preferable.
As the ionic photoacid generator, the ionic photoacid generator described in paragraphs 0114 to 0133 of JP-A-2014-085643 can also be preferably used.
Examples of the nonionic photoacid generator include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, oxime sulfonate compounds and the like. Specific examples of the trichloromethyl-s-triazines, the diazomethane compound and the imide sulfonate compound include the compounds described in paragraphs 0083 to 0088 of JP-A-2011-22149.
Among these, from the viewpoint of sensitivity, resolution, and adhesion, the photoacid generator is preferably an oxime sulfonate compound.

As the oxime sulfonate compound, those described in paragraphs 0084 to 0088 of International Publication No. 2018/179640 can be preferably used.

As the thermoplastic resin layer, one type of photoacid generator or photobase generator may be used alone, or two or more types may be used.

(Surfactant)
The thermoplastic resin layer preferably contains a surfactant from the viewpoint of thickness uniformity.
Examples of the surfactant include anionic, cationic, nonionic (nonionic) and amphoteric surfactants. Preferred surfactants are nonionic surfactants.
Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, polyoxyethylene glycol higher fatty acid diesters, silicone-based surfactants, and fluorine-based surfactants. Therefore, a fluorine-based surfactant can be preferably used.

Examples of the surfactant include the interfaces described in paragraphs 0120 to 0125 of International Publication No. 2018/179640, paragraphs 0017 of Japanese Patent No. 4502784, and paragraphs 0060 to 0071 of Japanese Patent Application Laid-Open No. 2009-237362. Activators can be used.
As a commercially available surfactant, for example, Megafuck F-552 or F-554 (all manufactured by DIC Corporation) can be used.
In addition, as one aspect of the surfactant, from the viewpoint of environmental suitability, PFOA (perfluorooctanoic acid) or PFOS (perfluorooctane sulfonic acid) is used instead of the compound having a linear perfluoroalkyl group having 7 or more carbon atoms. It is also preferable to use a surfactant using the alternative material of.
When the thermoplastic resin layer contains a surfactant, the content of the surfactant is preferably 0.001% by mass to 10% by mass, preferably 0.01% by mass, based on the total mass of the thermoplastic resin layer. More preferably, it is% to 3% by mass.
As the thermoplastic resin layer, one type of surfactant may be used alone, or two or more types may be used.

Further, the thermoplastic resin layer may contain other additives other than those described above. The other additives are not particularly limited, and known additives can be used.
Further, for a preferred embodiment of the thermoplastic resin layer, paragraphs 0189 to 0193 of JP-A-2014-085643 can also be referred to.

The thickness of the thermoplastic resin layer is preferably 1 μm or more for the reason that the laminate property is better. The upper limit is not particularly limited in terms of performance, but is preferably 100 μm or less, and more preferably 50 μm or less from the viewpoint of manufacturing suitability.
In the present invention, the thickness of the thermoplastic resin layer is preferably more than 2 μm and less than 20 μm for the reason that the laminate property is better and / or the pattern resolution power is better.

In the present invention, it is desirable that the thermoplastic resin layer is optically transparent.
Further, for the reason that a high-resolution image can be formed even when exposure is performed on the temporary support and the thermoplastic resin layer described above, a laminate of the temporary support and the thermoplastic resin layer described above is possible. The haze measured in the above state is preferably 0.9% or less, and more preferably 0.8% or less.
Here, the haze is a total light haze (%) conforming to JIS K 7136: 2000, and can be measured as a total light haze using a haze meter (device name: HZ-2, manufactured by Suga Test Instruments Co., Ltd.). ..

[Photosensitive resin layer]
The photosensitive transfer member of the present invention has a photosensitive resin layer.
In the present invention, the photosensitive resin layer is preferably provided in direct contact with the above-mentioned thermoplastic resin layer. That is, it is preferable that the photosensitive transfer member of the present invention does not have another layer (for example, a water-soluble resin layer) between the thermoplastic resin layer of the present invention and the photosensitive resin layer.

The photosensitive resin layer is not particularly limited, and a known photosensitive resin layer can be used, but a negative photosensitive resin layer is preferable because the laminating property at high speed is more excellent.
Here, the negative type photosensitive resin layer refers to a photosensitive resin layer whose solubility in a developing solution is reduced by exposure.

From the viewpoint of pattern forming property, the photosensitive resin layer preferably has a polymerizable compound, a polymer having an acid group, and a photopolymerization initiator.
As the photosensitive resin layer, for example, the photosensitive resin layer described in JP-A-2016-224162 may be used.

<Polymerizable compound>
The photosensitive resin layer preferably contains a polymerizable compound.
The polymerizable compound is a component that contributes to the photosensitivity (that is, photocurability) of the negative photosensitive resin layer and the strength of the cured film.
As the polymerizable compound, an ethylenically unsaturated compound is preferable, and a bifunctional or higher functional ethylenically unsaturated compound is more preferable.
Here, the ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups, and the bifunctional or higher functional ethylenically unsaturated compound has two ethylenically unsaturated groups in one molecule. It means a compound having the above.
As the ethylenically unsaturated group, a (meth) acryloyl group is more preferable.
As the ethylenically unsaturated compound, a (meth) acrylate compound is preferable.

The bifunctional ethylenically unsaturated compound is not particularly limited and may be appropriately selected from known compounds. Specifically, tricyclodecanedimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), tricyclodecanedimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,9 -Nonanediol diacrylate (A-NOD-N, manufactured by Shin Nakamura Chemical Industry Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin Nakamura Chemical Industry Co., Ltd.) and the like can be mentioned. ..
Further, as the bifunctional ethylenically unsaturated compound, a bifunctional ethylenically unsaturated compound having a bisphenol structure is also preferably used.
Examples of the bifunctional ethylenically unsaturated compound having a bisphenol structure include the compounds described in paragraphs 0072 to 0080 of JP-A-2016-224162.
Specific examples thereof include alkylene oxide-modified bisphenol A di (meth) acrylate, and include 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane and 2,2-bis (4- (methacryloxyethoxy) ethoxy). Preferable examples thereof include dimethacrylate (BPE-500, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), which is a polyethylene glycol in which an average of 5 mol of ethylene oxide is added to both ends of propoxy) phenyl) propane and bisphenol A.

The trifunctional or higher functional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds. For example, dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane tetra (meth) acrylate, isocyanul. Examples thereof include acid (meth) acrylate and (meth) acrylate compounds having a glycerintri (meth) acrylate skeleton.

Here, "(tri / tetra / penta / hexa) (meth) acrylate" is a concept including tri (meth) acrylate, tetra (meth) acrylate, penta (meth) acrylate, and hexa (meth) acrylate. , "(Tri / tetra) (meth) acrylate" is a concept that includes tri (meth) acrylate and tetra (meth) acrylate.

Examples of ethylenically unsaturated compounds include caprolactone-modified (meth) acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin Nakamura Chemical Industry Co., Ltd., etc.) and alkylene oxides. Modified (meth) acrylate compounds (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin Nakamura Chemical Industry Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel Ornex Co., Ltd., etc.), ethoxyl Glycerin triacrylate (A-GLY-9E, etc. manufactured by Shin Nakamura Chemical Industry Co., Ltd.), Aronix (registered trademark) TO-2349 (manufactured by Toa Synthetic Co., Ltd.), Aronix M-520 (manufactured by Toa Synthetic Co., Ltd.) , Aronix M-270 (manufactured by Toa Synthetic Co., Ltd.), Aronix M-510 (manufactured by Toa Synthetic Co., Ltd.), and the like.
As the ethylenically unsaturated compound, a urethane (meth) acrylate compound (preferably a trifunctional or higher functional urethane (meth) acrylate compound) can also be used. For example, 8UX-015A (manufactured by Taisei Fine Chemical Industry Co., Ltd.), UA- 32P (manufactured by Shin Nakamura Chemical Industry Co., Ltd.), UA-1100H (manufactured by Shin Nakamura Chemical Industry Co., Ltd.) and the like can be mentioned.
Further, as the ethylenically unsaturated compound, a polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 may be used.

The weight average molecular weight (Mw) of the polymerizable compound used in the present disclosure is preferably 200 to 3,000, more preferably 280 to 2,200, and even more preferably 300 to 2,200.

The polymerizable compound may be used alone or in combination of two or more.
When the photosensitive resin layer contains a polymerizable compound, the content of the polymerizable compound is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, based on the total mass of the photosensitive resin layer. It is preferable, and more preferably 20% by mass to 50% by mass.

<Polymer having an acid group>
The photosensitive resin layer preferably contains a polymer having an acid group.
A preferable form of the polymer having an acid group contained in the photosensitive resin layer is the same as the polymer having an acid group exemplified as the thermoplastic resin having the above-mentioned thermoplastic resin layer.

The photosensitive resin layer may contain one kind of polymer having an acid group alone, or may contain two or more kinds of polymers.
When the photosensitive resin layer contains a polymer having an acid group, the content of the polymer having an acid group is 10% by mass or more and 90% by mass with respect to the total mass of the photosensitive resin layer from the viewpoint of photosensitivity. It is preferably 20% by mass or more and 80% by mass or less, more preferably 30% by mass or more and 70% by mass or less.

<Photopolymerization initiator>
The photosensitive resin layer preferably contains a photopolymerization initiator.
The photopolymerization initiator receives active light such as ultraviolet rays and visible light to start the polymerization of the polymerizable compound.
The photopolymerization initiator is not particularly limited, and a known photopolymerization initiator can be used.
Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferable.
Further, as the photopolymerization initiator in the photosensitive resin layer, at least one selected from the group consisting of 2,4,5-triarylimidazole dimer and its derivative is selected from the viewpoint of photosensitivity and resolvability. It is preferable to include it.

Further, as the photopolymerization initiator, for example, the polymerization initiator described in paragraphs 0031 to 0042 of JP2011-0957116 and paragraphs 0064 to 0081 of JP2015-014783 may be used. ..

Commercially available photopolymerization initiators include 1- [4- (phenylthio)] -1,2-octanedione-2- (O-benzoyloxime) [trade name: IRGACURE (registered trademark) OXE-01, BASF, Inc. Made], 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] etanone-1- (O-acetyloxime) [trade name: IRGACURE (registered trademark) OXE-02, BASF], IRGACURE® OXE-03 (BASF), 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-Butanone [trade name: IRGACURE (registered trademark) 379EG, manufactured by BASF], 2-methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one [trade name: IRGACURE (registered trademark) 907, manufactured by BASF], 2-Hydroxy-1- {4- [4- (2-hydroxy-2-methylpropionyl) benzyl] phenyl} -2-methylpropan-1-one [Product name: IRGACURE (registered) Trademark) 127, manufactured by BASF], 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1 [trade name: IRGACURE (registered trademark) 369, manufactured by BASF], 2-hydroxy- 2-Methyl-1-phenylpropan-1-one [trade name: IRGACURE (registered trademark) 1173, manufactured by BASF], 1-hydroxycyclohexylphenylketone [trade name: IRGACURE (registered trademark) 184, manufactured by BASF], 2,2-Dimethoxy-1,2-diphenylethane-1-one [trade name: IRGACURE 651, manufactured by BASF], etc. Oxime ester-based [trade name: Lunar (registered trademark) 6, manufactured by DKSH Japan Co., Ltd. ] And so on.
Further, as the photopolymerization initiator, 2,4-bis (trichloromethyl) -6- (N, N-diethoxycarbonylmethylamino) -3-bromophenyl] -s-triazine and the like can also be used.

The photosensitive resin layer may contain one type of photopolymerization initiator alone, or may contain two or more types of photopolymerization initiators.
When the photosensitive resin layer contains a photopolymerization initiator, the content of the photopolymerization initiator is not particularly limited, but is preferably 0.1% by mass or more based on the total mass of the photosensitive resin layer. 5% by mass or more is more preferable, and 1.0% by mass or more is further preferable.
The content of the photopolymerization initiator is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.

<Other additives>
In addition to the above components, the photosensitive resin layer may contain known additives, if necessary.
As other additives, known ones can be used, and examples thereof include polymerization inhibitors, plasticizers, sensitizers, hydrogen donors, heterocyclic compounds, color formers, decolorants, solvents and the like.
As the polymerization inhibitor, for example, the thermal polymerization inhibitor described in paragraph 0018 of Japanese Patent No. 4502784 can be used. Among them, phenothiazine, phenothiazine or 4-methoxyphenol can be preferably used.
When the photosensitive resin layer contains a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01 to 3% by mass, preferably 0.01 to 1% by mass, based on the total mass of the photosensitive resin layer. More preferably, 0.01 to 0.8% by mass is further preferable.
Examples of the sensitizer include known sensitizers, dyes, pigments and the like.
Examples of the plasticizer and the heterocyclic compound include those described in paragraphs 097 to 0103 and 0111 to 0118 of International Publication No. 2018/179640.
As the color former, for example, the color former described in paragraph 0417 of JP-A-2007-178459 can be used, and leuco crystal violet, crystal violet lactone, Victoria pure blue-naphthalene sulfonate and the like are more preferably used. Be done.
When the photosensitive resin layer contains a color former, the content of the color former is 0.1 to 1 to the total mass of the photosensitive resin layer from the viewpoint of visibility and resolution of the exposed and non-exposed areas. It is preferably 10% by mass, more preferably 0.1 to 5% by mass, and particularly preferably 0.1 to 1% by mass.

Further, the photosensitive resin layer includes metal oxide particles, antioxidants, dispersants, acid growth agents, development accelerators, conductive fibers, colorants, thermal radical polymerization initiators, thermal acid generators, and ultraviolet absorbers. , Thickeners, cross-linking agents, and known additives such as organic or inorganic anti-precipitation agents can be further added.
Preferred embodiments of the other components are described in paragraphs 0165 to 0184 of JP2014-085643, respectively, and the contents of this publication are incorporated in the present specification.

The thickness of the photosensitive resin layer is preferably 0.5 to 20 μm, more preferably 0.8 to 15 μm, and even more preferably 1.0 to 10 μm from the viewpoint of pattern resolution.

[Cover film]
The photosensitive transfer member of the present invention has a cover film.
Examples of the cover film include a resin film and paper, and a resin film is particularly preferable from the viewpoint of strength, flexibility, and the like. Examples of the resin film include polyethylene film, polypropylene film, polyethylene terephthalate film, cellulose triacetate film, polystyrene film, polycarbonate film and the like. Of these, polyethylene film, polypropylene film, and polyethylene terephthalate film are preferable.

The thickness of the cover film is not particularly limited, and for example, one having a thickness of 1 μm to 2 mm is preferable.

[Other layers]
The photosensitive transfer member according to the present disclosure may have layers other than those described above (hereinafter, abbreviated as "other layers"). Examples of other layers include a contrast enhancement layer, an easily peelable layer, and a BARC layer.
Preferred embodiments of the contrast enhancement layer are described in paragraph 0134 of WO 2018/179640, the contents of which are incorporated herein by reference.

Here, with reference to FIG. 1, an example of the layer structure of the photosensitive transfer member of the present invention is schematically shown.
In the photosensitive transfer member 100 shown in FIG. 1, a temporary support 10, a thermoplastic resin layer 12, a photosensitive resin layer 14, and a cover film 16 are laminated in this order.

In the present invention, in the method for producing a resin pattern using the photosensitive transfer material of the present invention, when the temporary support is peeled off before the development step, the thermoplastic resin layer is also peeled off together with the temporary support. Of the above-mentioned peeling strengths between the temporary support, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, the peeling strength between the temporary support and the thermoplastic resin layer is the strongest. , It is preferable that the peeling strength between the photosensitive resin layer and the cover film is the weakest.

[Manufacturing method of photosensitive transfer member]
The method for producing the photosensitive transfer member of the present invention is not particularly limited, and a known production method can be used.
Specifically, a composition such as a thermoplastic resin composition is prepared by mixing the above-mentioned constituent components of each layer and a solvent, and the above composition is applied on a temporary support or a cover film to temporarily prepare the composition. A photosensitive transfer member having a support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order can be obtained.
Specifically, as a method for producing the photosensitive transfer member, a step of applying and drying the thermoplastic resin composition on the temporary support to form the thermoplastic resin layer, and applying the photosensitive resin composition on the thermoplastic resin layer. A method including a step of applying and drying the resin layer to form a photosensitive resin layer and a step of providing a cover film on the photosensitive resin layer can be mentioned.

Other methods for producing the photosensitive transfer member include a step of applying and drying the thermoplastic resin composition on the temporary support to form a thermoplastic resin layer, and applying the photosensitive resin composition on the cover film. The step of forming the photosensitive resin layer by drying and the laminate produced in both steps, that is, the temporary support with the thermoplastic resin layer and the cover film with the photosensitive resin layer are combined with the thermoplastic resin layer. Examples thereof include a method having a step of laminating so as to be in contact with the photosensitive resin layer.

Further, in the present invention, from the viewpoint of reducing the burden on the environment when forming the thermoplastic resin layer, a melt extrusion method is used on a temporary support instead of the conventional method of coating and drying using an organic solvent. It is preferable to provide it.

[Manufacturing method of resin pattern]
The method for producing a resin pattern of the present invention is a method for producing a resin pattern by roll-to-roll using the above-mentioned photosensitive transfer member of the present invention, and peels a cover film from the photosensitive transfer member. A peeling step (hereinafter, also referred to as “cover film peeling step”), a bonding step in which the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled is brought into contact with a substrate having a conductive layer and bonded to each other, and photosensitivity. It has an exposure step of pattern-exposing the sex resin layer and a development step of developing the exposed photosensitive resin layer to form a resin pattern in this order, and is between the bonding step and the exposure step, or is exposed. It is a manufacturing method including a step of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member (hereinafter, also referred to as a “simultaneous peeling step”) between a step and a developing step.

[Manufacturing method of circuit wiring]
The method for manufacturing a circuit wiring of the present invention is a method for manufacturing a circuit wiring for producing a circuit wiring by roll-to-roll using the above-described photosensitive transfer member of the present invention, and peels a cover film from the photosensitive transfer member. A peeling step (cover film peeling step), a bonding step in which the photosensitive resin layer in the photosensitive transfer member from which the cover film has been peeled is brought into contact with a substrate having a conductive layer and bonded, and a pattern exposure of the photosensitive resin layer is performed. An exposure step, a development step of developing the exposed photosensitive resin layer to form a resin pattern, and a step of etching a conductive layer in a region where the resin pattern is not arranged are provided in this order and applied. It is a manufacturing method having a step (simultaneous peeling step) of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between a joining step and an exposure step, or between an exposure step and a developing step. ..

Hereinafter, each process included in the resin pattern manufacturing method and the circuit wiring manufacturing method will be described, but first, the roll-to-roll method will be described.
The roll-to-roll method is a structure in which a substrate that can be wound and unwound is used as a substrate, and the substrate or the substrate is included before any of the steps included in the resin pattern manufacturing method or the circuit wiring manufacturing method. Includes a step of unwinding a body (also referred to as a "unwinding step") and a step of winding up a structure including a base material or a substrate (also referred to as a "winding step") after any of the steps. , A method in which at least one of the steps (preferably all steps) is carried out while transporting a base material or a structure including a substrate.
The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and a known method may be used in the manufacturing method to which the roll-to-roll method is applied.

[Cover film peeling process]
The peeling step of the resin pattern manufacturing method and the circuit wiring manufacturing method of the present invention is a step of peeling the cover film from the photosensitive transfer member.
The peeling method is not particularly limited and may be peeled by a known method. For example, the cover film peeling mechanism described in paragraphs [0161] to [0162] of JP-A-2010-072589 can be used.

[Lasting process]
The bonding step of the resin pattern manufacturing method and the circuit wiring manufacturing method of the present invention is a step of bringing the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled off into contact with a substrate having a conductive layer and bonding them. is there.
In the bonding step, it is preferable that the conductive layer and the surface of the photosensitive resin layer of the photosensitive transfer member on the opposite side of the thermoplastic resin layer are pressure-bonded so as to be in contact with each other. In the above aspect, the patterned photosensitive resin layer after exposure and development can be suitably used as an etching resist when etching the conductive layer.
The method of crimping the substrate and the photosensitive transfer member is not particularly limited, and a known transfer method and a laminating method can be used.
The bonding of the photosensitive transfer member to the substrate is performed by superimposing the surface of the photosensitive transfer member on the side opposite to the intermediate layer of the photosensitive resin layer on the substrate, pressurizing and heating with a roll or the like. Is preferable. For bonding, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator capable of further increasing productivity can be used.

The substrate having a conductive layer has a conductive layer on a base material such as glass, silicon, or a film, and an arbitrary layer may be formed if necessary.
Preferred embodiments of the substrate are described, for example, in paragraph 0140 of WO 2018/155193, the contents of which are incorporated herein.

As the base material of the substrate, a film base material is preferable from the viewpoint of manufacturing by a roll-to-roll method. Further, when the circuit wiring for the touch panel is manufactured by the roll-to-roll method, it is preferable that the base material is a sheet-like resin composition.

The conductive layer of the substrate is at least one selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer from the viewpoint of conductivity and fine wire forming property. It is preferably a layer of, more preferably a metal layer, and particularly preferably a copper layer or a silver layer.
Further, the base material may have one conductive layer or two or more conductive layers. When there are two or more conductive layers, it is preferable to have conductive layers made of different materials.
Preferred embodiments of the conductive layer are described, for example, in paragraph 0141 of WO 2018/155193, the contents of which are incorporated herein.

[Exposure process]
The exposure step included in the resin pattern manufacturing method and the circuit wiring manufacturing method of the present invention is a step of pattern-exposing the photosensitive resin layer.

The detailed arrangement and specific size of the pattern in the pattern exposure are not particularly limited. At least a part (preferably) of the pattern so as to improve the display quality of a display device (for example, a touch panel) provided with an input device having a circuit wiring manufactured by a circuit wiring manufacturing method and to reduce the area occupied by the take-out wiring. The electrode pattern and / or the portion of the take-out wiring of the touch panel) preferably includes a thin wire having a width of 20 μm or less, and more preferably contains a thin wire having a width of 10 μm or less.

Preferred embodiments of the light source, exposure amount, and exposure method used for exposure are described in, for example, paragraphs 0146 to 0147 of International Publication No. 2018/155193, and these contents are incorporated in the present specification.

[Development process]
The developing step of the resin pattern manufacturing method and the circuit wiring manufacturing method of the present invention is a step of developing an exposed photosensitive resin layer to form a resin pattern.

The exposed photosensitive resin layer in the developing step can be developed by using a developing solution.
The developing solution and developing method are not particularly limited as long as the non-image portion of the photosensitive resin layer can be removed, and a known developing solution and developing method can be used. Examples of the developer preferably used in the present disclosure include the developer described in paragraph 0194 of International Publication No. 2015/093271, and examples of the developing method preferably used include International Publication No. 2015/093271. The developing method described in paragraph 0195 of No. 0195 can be mentioned.

[Simultaneous peeling process]
The simultaneous peeling step of the resin pattern manufacturing method and the circuit wiring manufacturing method of the present invention is temporarily supported from the photosensitive transfer member between the bonding step and the exposure step, or between the exposure step and the developing step. This is a step of simultaneously peeling off the body and the thermoplastic resin layer.
As a peeling method, a method in which the temporary support and the thermoplastic resin layer are wound around a winding shaft in the form of a laminated body and recovered is preferable. For example, paragraphs [0161] to [0162] of JP2010-072589A. ], A mechanism similar to the cover film peeling mechanism described in] can be used.

[Post-exposure and post-bake]
In the method for producing a resin pattern and the method for producing a circuit wiring of the present invention, the resin pattern obtained by the above-mentioned developing step is exposed (hereinafter, also referred to as “post-exposure”) and / or heat-treated (hereinafter, “post-baked”). It may also have a step of).
When both the post-exposure step and the post-baking step are included, it is preferable to carry out the post-baking after the post-exposure.

[Etching process]
The etching step included in the method for manufacturing a circuit wiring of the present invention is a step of etching a conductive layer in a region where a resin pattern is not arranged.

In the etching step, the pattern formed from the photosensitive resin layer by the developing step is used as an etching resist, and the conductive layer is etched.
Examples of the etching treatment method include the methods described in paragraphs 0209 to 0210 of JP-A-2017-120435, the methods described in paragraphs 0048-paragraph 0054 of JP-A-2010-152155, and known plasma etching. A known method such as a dry etching method can be applied.

[Removal process]
In the circuit wiring manufacturing method of the present invention, it is preferable to perform a step of removing the resin pattern (hereinafter, abbreviated as "removal step").
The removing step is not particularly limited and can be performed as needed, but it is preferably performed after the etching step.
The method for removing the remaining photosensitive resin layer is not particularly limited, and examples thereof include a method for removing by chemical treatment, and it is particularly preferable to use a removing solution.
As a method for removing the photosensitive resin layer, a substrate having a photosensitive resin layer or the like is immersed in a removing solution being stirred at preferably at 30 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C. for 1 minute to 30 minutes. The method can be mentioned.

Examples of the removing liquid include inorganic alkaline components such as sodium hydroxide and potassium hydroxide, or organic alkalis such as primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salt compounds. Examples thereof include a removal solution in which the components are dissolved in water, dimethylsulfoxide, N-methylpyrrolidone, or a mixed solution thereof.
Further, the removing liquid may be used and removed by a spray method, a shower method, a paddle method or the like.

[Other processes]
The method for manufacturing a circuit wiring of the present invention may include any steps (other steps) other than those described above. For example, the step of reducing the visible light reflectance described in paragraph 0172 of International Publication No. 2019/022089, the step of forming a new conductive layer on the insulating film described in paragraph 0172 of International Publication No. 2019/022089, and the like. However, it is not limited to these steps.
Further, as an example of the exposure step, the developing step, and other steps in the present disclosure, the methods described in paragraphs 0035 to 0051 of JP-A-2006-023696 can be preferably used in the present disclosure.

The circuit wiring manufactured by the circuit wiring manufacturing method of the present invention can be applied to various devices. Examples of the device provided with the circuit wiring manufactured by the method for manufacturing the circuit wiring according to the present disclosure include an input device and the like, and a touch panel is preferable, and a capacitance type touch panel is more preferable. Further, the input device can be applied to a display device such as an organic EL display device and a liquid crystal display device.

[Manufacturing method of touch panel]
The method for manufacturing a touch panel of the present invention is a method for manufacturing a touch panel for manufacturing a touch panel by roll-to-roll using the above-mentioned photosensitive transfer member of the present invention, and is a peeling step of peeling a cover film from the photosensitive transfer member ( Cover film peeling step), a bonding step in which the photosensitive resin layer in the photosensitive transfer member from which the cover film has been peeled is brought into contact with a substrate having a conductive layer and bonded, and an exposure step in which the photosensitive resin layer is patterned and exposed. A development step of developing the exposed photosensitive resin layer to form a resin pattern and a step of etching a conductive layer in a region where the resin pattern is not arranged are provided in this order. It is a manufacturing method including a step (simultaneous peeling step) of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between an exposure step or between an exposure step and a developing step.

In the touch panel manufacturing method of the present invention, specific aspects of each step and embodiments such as the order in which each step is performed are as described in the above-mentioned "Circuit wiring manufacturing method", which is preferable. The aspect is also the same.
As the method for manufacturing the touch panel of the present invention, a known method for manufacturing the touch panel can be referred to except for the above.
Further, the method for manufacturing a touch panel of the present invention may include an arbitrary step (other steps) other than those described above.

An example of the mask pattern used in the touch panel manufacturing method of the present invention is shown in FIGS. 2 and 3.
In the pattern A shown in FIG. 2 and the pattern B shown in FIG. 3, SL and G are image portions (openings), and DL is a virtual representation of the alignment frame. In the method for manufacturing a touch panel according to the present disclosure, for example, by exposing the photosensitive resin layer through a mask having the pattern A shown in FIG. 2, a circuit wiring having the pattern A corresponding to SL and G is formed. Can manufacture touch panels.

The touch panel according to the present disclosure is a touch panel having at least the circuit wiring manufactured by the method for manufacturing the circuit wiring of the present invention.
Further, the touch panel according to the present disclosure preferably has at least a transparent substrate, electrodes, and an insulating layer or a protective layer.
Further, as the detection method in the touch panel according to the present disclosure, any known method such as a resistance film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method may be used. Above all, the capacitance method is preferable.
The touch panel type includes a so-called in-cell type (for example, those shown in FIGS. 5, 6, 7, and 8 of JP-A-2012-517501), a so-called on-cell type (for example, Japanese Patent Application Laid-Open No. 2013-168125). The one described in FIG. 19 of the publication, the one described in FIGS. 1 and 5 of Japanese Patent Application Laid-Open No. 2012-081022), OGS (One Glass Solution) type, TOR (Touch-on-Lens) type (for example, Japanese Patent Application Laid-Open No. 2012-on-Lens). (The one described in FIG. 2 of 2013-054727), other configurations (for example, the one shown in FIG. 6 of Japanese Patent Application Laid-Open No. 2013-164871), various out-selling types (so-called GG, G1, G2, GFF, GF2, GF1, G1F, etc.) and the like.
Examples of the touch panel according to the present disclosure include those described in paragraph 0229 of JP2017-120345A.

Hereinafter, the present invention will be described in more detail with reference to examples. The materials, amounts used, ratios, treatment contents, treatment procedures, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the gist of the present invention. Therefore, the scope of the present invention should not be construed as limiting by the examples shown below.
In the following, unless otherwise specified, "%" and "part" are based on mass.

[Synthesis of polymer A-1]
PGMEA (116.5 parts) was placed in a three-necked flask, and the temperature was raised to 90 ° C. in a nitrogen atmosphere. 90 parts of a solution containing St (52.0 parts), MMA (19.0 parts), MAA (29.0 parts), V-601 (4.0 parts), and PGMEA (116.5 parts). It was added dropwise to a three-necked flask solution maintained at ° C. ± 2 ° C. over 2 hours. After completion of the dropping, the mixture was stirred at 90 ° C. ± 2 ° C. for 2 hours to obtain polymer A-1 (solid content concentration 30.0%).
The abbreviations in the above synthesis examples represent the following compounds, respectively.
St: Styrene (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MAA: Methacrylic acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MMA: Methyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
PGMEA: Propylene glycol monomethyl ether acetate (manufactured by Showa Denko KK)
MEK: Methyl ethyl ketone (manufactured by Sankyo Chemical Co., Ltd.)
V-601: Dimethyl-2,2'-azobis (2-methylpropionate) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)

[Preparation of Photosensitive Resin Composition 1]
The following components were mixed to prepare the photosensitive resin composition 1. The unit of the amount of each component is a mass part.
Polymer A-1 (solid content concentration 30.0%): 21.87 parts D-2 (Aronix M270 (manufactured by Toa Synthetic Co., Ltd.)): 0.51 parts D-1 (NK ester BPE-500 (new) Nakamura Chemical Industries, Ltd.)): 4.85 parts C-2 (B-CIM, manufactured by THF): 0.89 parts C-3 (photoradical polymerization initiator (sensitizer), 4, 4' -Bis (diethylamino) benzophenone, manufactured by Tokyo Kasei Co., Ltd.): 0.05 parts Phenothiazine (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.): 0.025 parts 1-phenyl-3-pyrazolidone (Fujifilm Wako Pure Chemical Industries, Ltd.) (Manufactured by Co., Ltd.): 0.001 part B-2 (LCV, Leuco Crystal Violet, manufactured by Yamada Chemical Industries, Ltd.): 0.053 part E-1 (Megafuck F552 (manufactured by DIC Co., Ltd.)): 0. 02 parts Methyl ethyl ketone (MEK, manufactured by Sankyo Chemical Industries, Ltd.): 30.87 parts propylene glycol monomethyl ether acetate (PGMEA, manufactured by Showa Denko Corporation): 33.92 parts tetrahydrofuran (THF, manufactured by Mitsubishi Chemical Industries, Ltd.) : 6.93 copies

[Example 1]
A 16 μm-thick PET film (16KS40, manufactured by Toray Industries, Inc.) is used as a temporary support, and a coating liquid consisting of the following formulation H1 is applied onto the temporary support, dried, and thermoplastic with a dry film thickness of 5 μm. A resin layer was provided.
Next, the photosensitive resin composition 1 is applied onto the thermoplastic resin layer using a slit-shaped nozzle, and the photosensitive resin composition 1 is passed through a drying zone at 80 ° C. for 40 seconds to form a photosensitive resin layer having a thickness of 3 μm. Formed.
Next, a PET film (16KS40, manufactured by Toray Industries, Inc.) having a thickness of 16 μm was laminated on the photosensitive resin layer as a cover film to prepare a photosensitive transfer member, which was wound into a roll form.
<Prescription H1>
Ethylene vinyl acetate copolymer (Evaflex P1007, manufactured by Mitsui Dow Polychemical Co., Ltd.): 70 g
Toluene: 1000g

[Example 2]
A 16 μm thick PET film (16KS40, manufactured by Toray Co., Ltd.), using a high-frequency oscillator, with an output voltage of 100%, an output of 250 W, a wire electrode with a diameter of 1.2 mm, an electrode length of 240 mm, and a work electrode spacing of 1.5 mm. The corona discharge treatment was performed for 3 seconds under the above conditions, the surface was modified, and the film was used as a temporary support.
A 5 μm-thick thermoplastic resin layer made of an ethylene vinyl acetate copolymer (Evaflex P1007, manufactured by Mitsui Dow Polychemical Co., Ltd.) was formed on the temporary support by a melt extrusion method.
Next, the photosensitive resin layer and the cover film were formed in the same manner as in Example 1, and a photosensitive transfer member was prepared and wound into a roll form.

[Example 3]
A 16 μm-thick PET film (16KS40, manufactured by Toray Industries, Inc.) was used as a temporary support, and an ethylene methacrylate copolymer (Nucrel 4214C, manufactured by Mitsui Dow Polychemical Co., Ltd.) was subjected to a melt extrusion method on the temporary support. A thermoplastic resin layer having a thickness of 5 μm was provided.
Next, the photosensitive resin layer and the cover film were formed in the same manner as in Example 1, and a photosensitive transfer member was prepared and wound into a roll form.

[Example 4]
A thermoplastic resin layer having a thickness of 5 μm made of a polyethylene compound (kernel KF380, manufactured by Japan Polyethylene Corporation) was provided on a temporary support subjected to the same surface treatment as in Example 2 by a melt extrusion method.
Next, the photosensitive resin layer and the cover film were formed in the same manner as in Example 1, and a photosensitive transfer member was prepared and wound into a roll form.

[Example 5]
A photosensitive transfer member was prepared by the same method as in Example 1 except that the thickness of the thermoplastic resin layer was 2 μm, and the photosensitive transfer member was wound into a roll form.

[Example 6]
A photosensitive transfer member was prepared by the same method as in Example 2 except that the thickness of the thermoplastic resin layer was 10 μm, and the photosensitive transfer member was wound into a roll form.

[Example 7]
A photosensitive transfer member was prepared by the same method as in Example 2 except that the thickness of the thermoplastic resin layer was 20 μm, and the photosensitive transfer member was wound into a roll form.

[Example 8]
A 5 μm-thick thermoplastic resin made of an ethylene vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemical Co., Ltd.) on a temporary support subjected to the same surface treatment as in Example 2 by a melt extrusion method. A layer was provided.
Next, the photosensitive resin layer and the cover film were formed in the same manner as in Example 1, and a photosensitive transfer member was prepared and wound into a roll form.

[Example 9]
A 5 μm-thick thermoplastic resin made of an ethylene vinyl acetate copolymer (Evaflex EV450, manufactured by Mitsui Dow Polychemical Co., Ltd.) on a temporary support subjected to the same surface treatment as in Example 2 by a melt extrusion method. A layer was provided.
Next, the photosensitive resin layer and the cover film were formed in the same manner as in Example 1, and a photosensitive transfer member was prepared and wound into a roll form.

[Example 10]
A 16 μm-thick PET film (16KS40, manufactured by Toray Industries, Inc.) was used as a cover film, and the photosensitive resin composition 1 was applied onto the cover film using a slit-shaped nozzle, and a drying zone at 80 ° C. was applied for 40 seconds. To form a photosensitive resin layer having a thickness of 3 μm, a cover film with a photosensitive resin layer was prepared.
Next, a thickness made of an ethylene vinyl acetate copolymer (Evaflex P1007, manufactured by Mitsui Dow Polychemical Co., Ltd.) was subjected to a melt extrusion method on a temporary support surface-treated by the same method as in Example 2. A thermoplastic resin layer having a size of 5 μm was formed to prepare a temporary support with a thermoplastic resin layer.
Next, the cover film with the photosensitive resin layer and the temporary support with the thermoplastic resin layer are laminated so that the photosensitive resin layer and the thermoplastic resin layer are in contact with each other to prepare a photosensitive transfer member, which is wound up. It was made into a roll form.

[Example 11]
A 16 μm thick PET film (haze: 0.20%, manufactured by Fuji Film Co., Ltd.), using a high-frequency oscillator, with an output voltage of 100%, an output of 250 W, a wire electrode with a diameter of 1.2 mm, and an electrode length of 240 mm. The corona discharge treatment was performed for 3 seconds under the condition of 1.5 mm between the work electrodes, the surface was modified, and the work electrode was used as a temporary support.
A photosensitive transfer member was prepared by the same method as in Example 2 except that the temporary support was used, and the photosensitive transfer member was wound into a roll form.

[Example 12]
A photosensitive transfer member was prepared by the same method as in Example 1 except that the thickness of the thermoplastic resin layer was 0.8 μm, and the photosensitive transfer member was wound into a roll form.

[Example 13]
A 16 μm thick PET film (haze: 0.80%, manufactured by Fuji Film Co., Ltd.), using a high-frequency oscillator, with an output voltage of 100%, an output of 250 W, a wire electrode with a diameter of 1.2 mm, and an electrode length of 240 mm. The corona discharge treatment was performed for 3 seconds under the condition of 1.5 mm between the work electrodes, the surface was modified, and the work electrode was used as a temporary support.
A photosensitive transfer member was prepared by the same method as in Example 2 except that the temporary support was used, and the photosensitive transfer member was wound into a roll form.

[Comparative Example 1]
A thermoplastic resin layer having a thickness of 5 μm made of a polypropylene polymer (Wintech WFX4M, manufactured by Japan Polypropylene Corporation) was provided on a temporary support subjected to the same surface treatment as in Example 2 by a melt extrusion method.
Next, the photosensitive resin layer and the cover film were formed in the same manner as in Example 1, and a photosensitive transfer member was prepared and wound into a roll form.

[Comparative Example 2]
A 5 μm-thick thermoplastic resin made of an ethylene vinyl acetate copolymer (Evaflex EV150, manufactured by Mitsui Dow Polychemical Co., Ltd.) on a temporary support subjected to the same surface treatment as in Example 2 by a melt extrusion method. A layer was provided.
Next, the photosensitive resin layer and the cover film were formed in the same manner as in Example 1, and a photosensitive transfer member was prepared and wound into a roll form.

[Comparative Example 3]
A photosensitive transfer member was prepared by the same method as in Example 1 except that the thermoplastic resin layer was not provided, and the photosensitive transfer member was wound into a roll form.

[Peeling strength]
With respect to the photosensitive transfer members produced in Examples 1 to 13 and Comparative Examples 1 and 2, the peel strength between the layers of the temporary support, the thermoplastic resin layer, the photosensitive resin layer and the cover film was measured. It was confirmed that in each of No. 13 and Comparative Examples 1 and 2, the peel strength between the temporary support and the thermoplastic resin layer was the strongest, and the peel strength between the photosensitive resin layer and the cover film was the weakest.
Further, with respect to the photosensitive transfer member produced in Comparative Example 3 in which the thermoplastic resin layer was not provided, the peel strength between the layers of the temporary support, the photosensitive resin layer and the cover film was measured. It was confirmed that the peel strength from the resin layer was the strongest and the peel strength between the photosensitive resin layer and the cover film was the weakest.

[Vicat softening point and tensile modulus]
With respect to the thermoplastic resin layer contained in the produced photosensitive transfer member, the Vicat softening point and the tensile elastic modulus were measured by the above-mentioned method. These results are shown in Table 1 below.

[Haze]
With respect to the produced photosensitive transfer member, the haze was measured by the method described above for the temporary support and the laminated body in which the thermoplastic resin layer was provided on the temporary support. The results are shown in Table 1 below.

[Lamination]
After unwinding the produced photosensitive transfer member and peeling off the cover film, the speed is 2 m / min between heat rolls at a temperature of 100 ° C. so that the photosensitive resin layer is in contact with the glass substrate having a thickness of 0.7 mm. Thermocompression bonding was performed at a pressure of 0.8 MPa.
Next, it was observed with an optical microscope whether bubbles remained between the glass substrate and the photosensitive resin layer, and evaluated according to the following criteria. The results are shown in Table 1 below.
A: 100mm ^{Number of bubbles in 2} area 0 B: 100mm Number of bubbles in ² area 1 or more and 5 or less C: 100mm ^{Number of bubbles in 2} area 6 or more and 10 or less D: 100mm Within ^{2 area} Number of bubbles 11 or more and 50 or less E: 100 mm Number of bubbles 51 or more in ^{2 areas}

〔blocking〕
After unwinding the produced photosensitive transfer member and peeling off the cover film, a PET base having a thickness of 100 μm and a width of 500 mm is rolled-to-roll with respect to the support, and the pressure is 2 m / min between heat rolls at a temperature of 100 ° C. It was continuously thermocompression-bonded at 0.8 MPa, and wound into a roll in the form of a photosensitive resin layer, a thermoplastic resin layer, and a temporary support laminated on the support.
Then, the temporary support and the thermoplastic resin layer were simultaneously peeled off and transported at a speed of 2 m / min. At that time, the laminated body composed of the peeled temporary support and the thermoplastic resin layer was wound into a roll shape with a winding tension of 25N. The presence or absence of blocking was observed from the roll morphology at the time of winding 100 m, and evaluated according to the following criteria. The results are shown in Table 1 below. When blocking occurs, appearance abnormalities such as wrinkles and square windings occur.
A: No problem in appearance B: Tolerable level of wrinkles and square windings are seen, but there is no effect on transportation.
C: Stable transport is not possible due to wrinkles and square winding.

[Pattern resolution]
A copper layer having a thickness of 500 nm was provided on a glass plate having a thickness of 0.7 mm by a vapor deposition method, and a glass substrate with a copper layer was prepared.
After unwinding the produced photosensitive transfer member and peeling off the cover film, the copper layer and the photosensitive resin layer come into contact with each other under laminating conditions of a roll temperature of 100 ° C., a linear pressure of 0.8 MPa, and a linear velocity of 2.0 m / min. As described above, it was laminated on the glass substrate with a copper layer.
Next, using a photomask having various line width patterns (2 to 20 μm) of line / space = 1/1 ^{, exposure of 80 mJ / cm 2} was performed from the PET surface, and then the temporary support and the thermoplastic resin layer were exposed. Was peeled off and removed at the same time.
Next, shower development was carried out with a 1% sodium carbonate aqueous solution having a liquid temperature of 25 ° C., washing with water was carried out, and a predetermined pattern was formed on copper.
After that, the minimum line width with a space (using mask dimension values) was evaluated with an optical microscope. The results are shown in Table 1 below. In Comparative Examples 1 and 3, since the laminate property is inferior and a large number of bubbles are present, the pattern resolving power cannot be evaluated, and is indicated by "-" in Table 1 below.

From the results shown in Table 1 above, it was found that when the tensile elastic modulus of the thermoplastic resin layer was larger than 200 MPa, the laminate property was inferior (Comparative Example 1).
Further, it was found that when the tensile elastic modulus of the thermoplastic resin layer was smaller than 10 MPa, blocking occurred when the temporary support and the thermoplastic resin layer were peeled off (Comparative Example 2).
Further, it was found that the laminate property was inferior when the thermoplastic resin layer was not provided (Comparative Example 3).

On the other hand, when the Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C. and the tensile elastic modulus is 10 to 200 MPa, the laminateability is excellent and blocking occurs when the temporary support and the thermoplastic resin layer are peeled off. It was found that the occurrence of the above can be suppressed (Examples 1 to 13).
In particular, from the comparison of Examples 1 to 4, it was found that when the tensile elastic modulus of the thermoplastic resin layer is 50 to 200 MPa, the occurrence of blocking can be further suppressed when the temporary support and the thermoplastic resin layer are peeled off. It was.
Further, from the comparison of Examples 1, 2, 5 to 7 and 12, it was found that when the thickness of the thermoplastic resin layer is more than 2 μm and less than 20 μm, both excellent laminating property and excellent pattern resolving power can be achieved.

(Example 101)
On a 100 μm thick PET substrate, ITO is formed as a second conductive layer by sputtering to a thickness of 150 nm, and copper is formed as a first conductive layer by a vacuum deposition method to a thickness of 200 nm to form a circuit. A substrate for use was prepared and wound into a roll form.
Next, the photosensitive transfer member produced in Example 3 was unwound, the cover film was peeled off, and then laminated on the unwound copper layer of the circuit forming substrate so as to be in contact with the photosensitive resin layer, and once rolled. I rolled it up. Laminating was performed under the conditions of a linear pressure of 0.6 MPa, a linear velocity of 3.6 m / min, and a roll temperature of 100 ° C.
Next, the contact pattern was exposed using a photomask provided with the pattern A shown in FIG. 2, which had a structure in which the conductive layer pads were connected in one direction without peeling off the temporary support (first exposure step). It was wound into a roll. In the pattern A shown in FIG. 2, as described above, SL and G are openings, and DL is a virtual representation of the alignment frame. The solid line is a thin line of 70 μm or less.
Then, while simultaneously peeling off the temporary support and the thermoplastic resin layer, development was performed using 2.38% of an aqueous solution of tetramethylammonium hydroxide (TMAH) (first development step), and then washing with water was performed to perform the first development. A resist image having the pattern (a pattern that is the shape of the opening region of the pattern A) is formed. Finally, the film with the resist image and the temporary support with the peeled thermoplastic resin were wound into a roll.
Next, after etching the copper layer (first conductive layer) with a copper etching solution (Cu-02, manufactured by Kanto Chemical Co., Ltd.), the ITO layer (ITO-02, manufactured by Kanto Chemical Co., Ltd.) is used. By etching the second conductive layer), both the copper layer (first conductive layer) and the ITO layer (second conductive layer) are drawn in the first pattern (the shape of the opening region of the pattern A). A substrate was obtained (first etching step). Further, the remaining resist image was peeled off using a stripping solution (KP-301 manufactured by Kanto Chemical Co., Inc.). Finally, it was wound into a roll.
Next, the photosensitive transfer member produced in Example 3 was unwound, the cover film was peeled off, and then laminated. Laminating was performed under the conditions of a linear pressure of 0.6 MPa, a linear velocity of 3.6 m / min, and a roll temperature of 100 ° C.
Next, the temporary support was not peeled off, and the contact pattern was exposed using a photomask provided with the pattern B shown in FIG. 3 in an aligned state (second exposure step), and the temporary support was wound into a roll. In the pattern B shown in FIG. 3, as described above, G is an opening, and DL is a virtual representation of the alignment frame.
Next, the temporary support and the thermoplastic resin are peeled off at the same time, and development is performed using 2.38% of the TMAH aqueous solution (second development step), and then washing with water is performed to perform a second pattern (opening and pattern of pattern A). A resist image having a shape of the overlapping portion of the openings of B) was obtained.
Then, the copper layer was etched with Cu-02, and the remaining resist image was peeled off with a stripping solution (KP-301, manufactured by Kanto Chemical Co., Inc.) to obtain a circuit wiring board wound into a roll. ..
When the circuit of the obtained circuit wiring board was observed with a microscope, there was no peeling or chipping, and it was a high-definition and clean pattern.

(Formation of protective film pattern 1)
A protective film was formed on the circuit wiring board obtained above by the following method.
First, for the photosensitive resin layer, a photosensitive transfer member was prepared in the same manner as in Example 3 except that a photosensitive resin composition having the following formulation was used and the film thickness was set to 8 μm.
Next, the produced photosensitive transfer member was unwound, the cover film was peeled off, and then laminated so that the photosensitive resin layer and the circuit pattern were in contact with each other. Laminating was performed under the conditions of a linear pressure of 0.6 MPa, a linear velocity of 3.6 m / min, and a roll temperature of 100 ° C.
Next, the contact pattern was exposed using a photomask provided with a partially unexposed portion (contact hole) without peeling the temporary support.
Then, the temporary support and the thermoplastic resin layer were simultaneously peeled off, developed with 1.0% of an aqueous sodium carbonate solution having a liquid temperature of 30 ° C., and then washed with water to obtain a protective film pattern image.
Then, a heat treatment at 140 ° C. for 60 minutes was carried out to cure the heat, and a protective film was formed on the circuit board.
<Photosensitive resin composition>
41% by mass ethyl cellosolve solution of methacrylic acid / cyclohexyl acrylate / methyl methacrylate copolymer (monomer mass ratio = 20/25/55, mass average molecular weight 80,000): 51.0 parts by mass ・ Dipentaerythritol hexaacrylate: 10 .0 parts by mass, fluorine-based surfactant F176PF (manufactured by Dainippon Ink, Ltd.): 0.25 parts by mass, Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Co., Ltd.): 0.225 parts by mass, 2,4-bis (trichloromethyl)- 6- (N, N-diethoxycarbonylmethylamino) -3-bromophenyl] -s-triazine: 0.45 parts by mass, methyl ethyl ketone: 13.0 parts by mass

(Formation of protective film pattern 2)
A protective film was formed on the circuit wiring board obtained above by the following method.
First, for the photosensitive resin layer, a photosensitive transfer member was prepared in the same manner as in Example 3 except that a non-photosensitive resin composition having the following formulation was used and the film thickness was set to 8 μm.
Further, a portion where the non-photosensitive resin layer was not desired to be provided was cut out.
Then, the non-photosensitive resin layer was aligned so that the circuit pattern was in contact with the circuit pattern, and laminated. Laminating was performed under the conditions of a linear pressure of 0.6 MPa, a linear velocity of 3.6 m / min, and a roll temperature of 100 ° C.
Then, the temporary support and the thermoplastic resin were peeled off at the same time to obtain a protective film pattern image.
Further, heat treatment at 140 ° C. for 60 minutes was performed to heat cure, and a protective film was formed on the circuit board.
<Non-photosensitive resin composition>
41% by mass ethyl cellosolve solution of methacrylic acid / cyclohexyl acrylate / methyl methacrylate copolymer (monomer mass ratio = 20/25/55, mass average molecular weight 80,000): 51.0 parts by mass ・ Dipentaerythritol hexaacrylate: 10 .0 parts by mass ・ Fluorine-based surfactant F176PF (manufactured by Dainippon Ink): 0.25 parts by mass ・ Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Co., Ltd.): 0.225 parts by mass ・ Methyl ethyl ketone: 13.0 parts by mass

(Manufacturing of image display device (touch panel))
An image display device in which the circuit wiring board with a protective film described above is attached to a liquid crystal display element manufactured by the method described in JP-A-2009-047936, and a capacitance type input device is provided as a component by a known method. Was produced.

10: Temporary support 12: Thermoplastic resin layer 14: Photosensitive resin layer 16: Cover film 100: Photosensitive transfer member SL: Non-image part (exposed part)
G: Non-image area (exposure area)
DL: Alignment frame

Claims

A photosensitive transfer member having a temporary support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order.
The thermoplastic resin layer has a Vicat softening point of 50 to 120 ° C. and a tensile elastic modulus of 10 to 200 MPa.
A photosensitive transfer member in which the peel strength between the temporary support and the thermoplastic resin layer is larger than the peel strength between the thermoplastic resin layer and the photosensitive resin layer.
The photosensitive transfer member according to claim 1, wherein the thickness of the thermoplastic resin layer is more than 2 μm and less than 20 μm.
The photosensitive transfer member according to claim 1 or 2, wherein the temporary support has a thickness of 6 to 50 μm.
The photosensitive transfer member according to any one of claims 1 to 3, wherein the haze of the temporary support is 0.5% or less.
The photosensitive transfer member according to any one of claims 1 to 4, wherein the haze of the laminate of the temporary support and the thermoplastic resin layer is 0.9% or less.
The photosensitive transfer member according to any one of claims 1 to 5, wherein the thermoplastic resin layer has a tensile elastic modulus of 50 to 200 MPa.
Of the peel strength between the temporary support, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, the peel strength between the temporary support and the thermoplastic resin layer is the strongest, and the photosensitive The photosensitive transfer member according to any one of claims 1 to 6, wherein the peel strength between the resin layer and the cover film is the weakest.
A method for producing a resin pattern in which a resin pattern is produced by roll-to-roll using the photosensitive transfer member according to any one of claims 1 to 7.
A peeling step of peeling the cover film from the photosensitive transfer member, and
A bonding step in which the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled off is brought into contact with a substrate having a conductive layer and bonded.
An exposure step of pattern-exposing the photosensitive resin layer and
A developing step of developing the exposed photosensitive resin layer to form a resin pattern is provided in this order.
A resin pattern having a step of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between the bonding step and the exposure step, or between the exposure step and the developing step. Production method.
A method for manufacturing a circuit wiring for producing a circuit wiring by roll-to-roll using the photosensitive transfer member according to any one of claims 1 to 7.
A peeling step of peeling the cover film from the photosensitive transfer member, and
A bonding step in which the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled off is brought into contact with a substrate having a conductive layer and bonded.
An exposure step of pattern-exposing the photosensitive resin layer and
A developing step of developing the exposed photosensitive resin layer to form a resin pattern, and
A step of etching the conductive layer in a region where the resin pattern is not arranged is provided in this order.
A circuit wiring having a step of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between the bonding step and the exposure step, or between the exposure step and the developing step. Production method.
A method for manufacturing a touch panel, wherein the touch panel is manufactured by roll-to-roll using the photosensitive transfer member according to any one of claims 1 to 7.
A peeling step of peeling the cover film from the photosensitive transfer member, and
A bonding step in which the photosensitive resin layer of the photosensitive transfer member from which the cover film has been peeled off is brought into contact with a substrate having a conductive layer and bonded.
An exposure step of pattern-exposing the photosensitive resin layer and
A developing step of developing the exposed photosensitive resin layer to form a resin pattern, and
A step of etching the conductive layer in a region where the resin pattern is not arranged is provided in this order.
Manufacture of a touch panel having a step of simultaneously peeling a temporary support and a thermoplastic resin layer from a photosensitive transfer member between the bonding step and the exposure step, or between the exposure step and the developing step. Method.