WO2021033429A1

WO2021033429A1 - Photosensitive transfer member, method for producing resin pattern, method for producing circuit wiring, and method for producing touch panel

Info

Publication number: WO2021033429A1
Application number: PCT/JP2020/025462
Authority: WO
Inventors: 一真両角; 隆志有冨; 藤本　進二
Original assignee: 富士フイルム株式会社
Priority date: 2019-08-20
Filing date: 2020-06-29
Publication date: 2021-02-25
Also published as: CN113994262A; JP7312258B2; JPWO2021033429A1

Abstract

The present invention addresses the problem of providing a photosensitive transfer member that has excellent resolution and laminateability at high speeds, a method for producing a resin pattern, a method for producing circuit wiring, and a method for producing a touch panel. The photosensitive transfer member has a temporary support body, an intermediate layer, and a photosensitive resin layer, in that order. The intermediate layer has a thermoplastic resin layer, the thickness of the photosensitive resin layer is less than 5 μｍ, and the total thickness of the temporary support body and the intermediate layer is 35 μｍ or less.

Description

Photosensitive transfer member, resin pattern manufacturing method, circuit wiring manufacturing method, and touch panel manufacturing method

The present invention relates to a photosensitive transfer member, a resin pattern manufacturing method, a circuit wiring manufacturing method, and a touch panel manufacturing method.

In display devices equipped with a touch panel such as a capacitance type input device (organic electroluminescence (EL) display device, liquid crystal display device, etc.), the electrode pattern corresponding to the sensor of the visual recognition part, the peripheral wiring part, and the wiring of the extraction wiring part are wired. A conductive layer pattern such as is provided inside the touch panel.
Generally, in forming a patterned layer, the number of steps for obtaining the required pattern shape is small, so that a layer of a photosensitive resin composition provided on an arbitrary substrate using a photosensitive transfer member is used. On the other hand, a method of developing after exposure through a mask having a desired pattern is widely used.
For example, Patent Document 1 discloses a pattern-forming material having a cushion layer and a photosensitive resin layer in this order on a support.
Further, Patent Document 2 discloses a photosensitive resin laminate having an intermediate layer having a layer thickness of 0.1 μm or more and 10 μm or less and a photosensitive resin layer in this order on the support film.

JP-A-2007-178459 International Publication No. 2007/125992

As a result of examining the photosensitive transfer member described in Patent Document 1, the present inventors have clarified that there is room for improvement in resolution, particularly in order to form a high-resolution pattern of 10 μm or less. did.
Further, in the field of dry film, a method of producing by roll-to-roll is known, and in recent years, in order to improve productivity, a dry film capable of high-speed lamination has been demanded.
As a result of examining the photosensitive transfer member described in Patent Document 2, the present inventors have clarified that there is a problem in laminating property at high speed.

Therefore, it is an object of the present invention to provide a photosensitive transfer member having excellent resolution and high-speed laminating property, a method for manufacturing a resin pattern, a method for manufacturing a circuit wiring, and a method for manufacturing a touch panel.

As a result of diligent studies to achieve the above problems, the present inventors have a temporary support, an intermediate layer including at least a thermoplastic resin layer, and a photosensitive resin layer in this order, and the thickness of the photosensitive resin layer is high. The present invention has been completed by finding that a photosensitive transfer member in which the total thickness of the temporary support and the intermediate layer is adjusted to a predetermined range is excellent in resolution and high-speed lamination.
That is, the present inventors have found that the above-mentioned problems can be achieved by the following configurations.

[1] A photosensitive transfer member having a temporary support, an intermediate layer, and a photosensitive resin layer in this order.
The intermediate layer has a thermoplastic resin layer and
A photosensitive transfer member having a thickness of the photosensitive resin layer of less than 5 μm and a total thickness of the temporary support and the intermediate layer of 35 μm or less.
[2] The intermediate layer described above further has a water-soluble resin layer.
The photosensitive transfer member according to [1], wherein the water-soluble resin layer is located between the thermoplastic resin layer and the photosensitive resin layer.
[3] The photosensitive transfer member according to [1] or [2], wherein the thickness of the thermoplastic resin layer is 10 μm or less.
[4] Any one of [1] to [3], wherein the ratio of the total thickness of the temporary support and the intermediate layer to the thickness of the photosensitive resin layer is 6.0 to 12.0. The photosensitive transfer member according to 1.
[5] The photosensitive transfer member according to any one of [1] to [4], wherein the glass transition temperature of the thermoplastic resin contained in the thermoplastic resin layer is 100 ° C. or lower.
[6] The photosensitive transfer member according to any one of [1] to [5], wherein the thermoplastic resin layer has a plasticizer.
[7] The photosensitive transfer member according to any one of [1] to [6], wherein the viscosity of the thermoplastic resin layer is lower than the viscosity of the photosensitive resin layer at 70 ° C.
[8] The photosensitive transfer member according to any one of [1] to [7], wherein the temporary support has a thickness of 25 μm or less.
[9] The photosensitive transfer member according to any one of [1] to [8], wherein the haze of the temporary support is 0.5 or less.
[10] The temporary support has a particle-containing layer on a surface opposite to the intermediate layer.
The photosensitive transfer member according to any one of [1] to [9], wherein the average particle size of the particles contained in the particle-containing layer is 30 to 600 nm.
[11] The photosensitive transfer member according to any one of [1] to [10], wherein the photosensitive resin layer is a negative type photosensitive resin layer.
[12] The surface of the photosensitive transfer member according to any one of [1] to [11] opposite to the intermediate layer of the photosensitive resin layer is brought into contact with a substrate having a conductive layer and bonded. Process and
The process of pattern exposure of the photosensitive resin layer and
A method for producing a resin pattern, which comprises a step of developing the exposed photosensitive resin layer to form a resin pattern, and the process of forming the resin pattern in this order.
[13] The surface of the photosensitive transfer member according to any one of [1] to [11] opposite to the intermediate layer of the photosensitive resin layer is brought into contact with a substrate having a conductive layer and bonded. Process and
The process of pattern exposure of the photosensitive resin layer and
The step of developing the exposed photosensitive resin layer to form a resin pattern, and
A method for manufacturing a circuit wiring including a step of etching a substrate in a region where the resin pattern is not arranged, and a step of etching the substrate in this order.
[14] The surface of the photosensitive transfer member according to any one of [1] to [11] opposite to the intermediate layer of the photosensitive resin layer is brought into contact with a substrate having a conductive layer and bonded. Process and
The process of pattern exposure of the photosensitive resin layer and
The process of developing the exposed photosensitive resin layer to form a resin pattern, and
A method for manufacturing a touch panel, which includes a step of etching the substrate in a region where the resin pattern is not arranged, and a step of etching the substrate in this order.

According to the present invention, it is possible to provide a photosensitive transfer member having excellent resolution and high-speed laminating property, a method for manufacturing a resin pattern, a method for manufacturing a circuit wiring, and a method for manufacturing a touch panel.

FIG. 1 is a schematic cross-sectional view showing an example of an embodiment of the photosensitive transfer member of the present invention. FIG. 2 is a schematic view showing the pattern A. FIG. 3 is a schematic view showing the pattern B.

Hereinafter, the present invention will be described in detail.
The description of the constituent elements described below may be based on typical embodiments of the present invention, but the present invention is not limited to such embodiments.
In the specification of the present application, the numerical range represented by using "-" means a range including the numerical values before and after "-" as the lower limit value and the upper limit value.
Further, in the present specification, as each component, a substance corresponding to each component may be used alone or in combination of two or more. Here, when two or more kinds of substances are used in combination for each component, the content of the component refers to the total content of the substances used in combination unless otherwise specified.
Further, in the present specification, "exposure" includes not only exposure using light but also drawing using particle beams such as an electron beam and an ion beam, unless otherwise specified. Examples of the light used for exposure generally include the emission line spectrum of a mercury lamp, far ultraviolet rays typified by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and active rays (active energy rays) such as electron beams. ..

[Photosensitive transfer member]
The photosensitive transfer member of the present invention has a temporary support, an intermediate layer, and a photosensitive resin layer in this order.
Here, the intermediate layer represents all the layers between the temporary support and the photosensitive resin layer, and the photosensitive transfer member of the present invention has at least a thermoplastic resin layer.
Further, in the photosensitive transfer member of the present invention, the thickness of the photosensitive resin layer is less than 5 μm, and the total thickness of the temporary support and the intermediate layer is 35 μm or less.

The photosensitive transfer member of the present invention having such a structure has good resolution and high-speed laminating property.
This is not clear in detail, but the present inventors speculate as follows.
In a thin film having a photosensitive resin layer of less than 5 μm, when the photosensitive transfer member is laminated on the substrate at high speed, a pattern disorder may occur by biting air bubbles generated between the photosensitive transfer member and the substrate. However, by using a photosensitive transfer member having a temporary support, a thermoplastic resin layer, and a photosensitive resin layer in this order, it becomes possible to reduce foaming when the photosensitive transfer member is laminated on a substrate, and the photosensitive transfer member becomes photosensitive. Since the resin layer can follow the substrate, it is considered that the laminateability at high speed can be improved.
In the present disclosure, the high-speed laminating property is preferably a laminating condition at a linear speed of 2.0 m / min or more, and more preferably a laminating condition at a linear speed of 4.0 m / min or more. ..
Further, by setting the thickness of the photosensitive resin layer to less than 5 μm, development proceeds rapidly even if the pattern is fine, and the pattern can be formed with excellent resolution without collapsing or connecting. It is considered possible.
Further, by setting the total thickness of the temporary support and the intermediate layer to 35 μm or less, it is possible to suppress the diffraction of light generated at the distance from the mask to the photosensitive resin layer during pattern exposure, and the pattern can be formed. It is considered that high-resolution pattern formation becomes possible without blurring.

[Temporary support]
The photosensitive transfer member of the present invention has a temporary support.
The temporary support is a removable support.
The temporary support used in the present disclosure preferably has light transmittance from the viewpoint of being able to expose the photosensitive resin layer through the temporary support when the photosensitive resin layer is exposed to a pattern.
Having light transmittance means that the transmittance of the main wavelength of light used for pattern exposure is 50% or more, and the transmittance of the main wavelength of light used for pattern exposure is from the viewpoint of improving exposure sensitivity. Therefore, 60% or more is preferable, and 70% or more is more preferable. Examples of the method for measuring the transmittance include a method of measuring using MCPD Series manufactured by Otsuka Electronics Co., Ltd.
Examples of the temporary support include a glass substrate, a resin film, paper, and the like, and a resin film is particularly preferable from the viewpoint of strength, flexibility, and the like. Examples of the resin film include polyethylene terephthalate film, cellulose triacetate film, polystyrene film, polycarbonate film, polyimide film and the like. Of these, a biaxially stretched polyethylene terephthalate film is particularly preferable.

The thickness of the temporary support is preferably 25 μm or less, and more preferably 20 μm or less, for the reason that the resolution of the photosensitive transfer member is further improved. As the lower limit, from the viewpoint of transportability and supportability, 5 μm or more is preferable, and 10 μm or more is more preferable.
The thickness of the temporary support can be measured by the following method.
In the cross-sectional observation image in the thickness direction of the temporary support, the arithmetic mean value of the thickness of the temporary support measured at 10 randomly selected points is obtained, and the obtained value is defined as the thickness of the temporary support. A cross-sectional observation image of the temporary support in the thickness direction can be obtained by using a scanning electron microscope (SEM).

The haze of the temporary support is preferably 0.5 or less, more preferably 0.4 or less, and more preferably 0.3 or less, for the reason that the resolution of the photosensitive transfer member is further improved. Is even more preferable. The lower limit is not particularly limited, but may be more than 0.0.
The haze of the temporary support can be measured as a total light haze using a haze meter (device name: NDH2000, manufactured by Nippon Denshoku Kogyo Co., Ltd.).

The temporary support preferably has a particle-containing layer on the surface opposite to the intermediate layer. The average particle size of the particles contained in the particle-containing layer is preferably 30 to 600 nm, more preferably 30 to 200 nm, and even more preferably 40 to 100 nm. When the average particle size of the particles contained in the particle-containing layer is 30 nm or more, the laminating property of the photosensitive transfer member at high speed is further improved, and the average particle size of the particles contained in the particle-containing layer is 600 nm or less. , The resolution of the photosensitive transfer member is more excellent.

The average particle size of the particles contained in the particle-containing layer can be measured by the following method.
In the cross-sectional observation image of the temporary support in the thickness direction, the layer containing particles is specified as the particle-containing layer.
Next, using a transmission electron microscope (TEM), arbitrary five points on the cross section of the particle-containing layer were photographed under the conditions of a magnification of 20000 times and an acceleration voltage of 100 kV to obtain cross-sectional photographs. The diameters of all the particles in the obtained cross-sectional photographs were measured, and the average value (arithmetic mean particle size) was obtained and used as the average particle size of the particles. Obviously large aggregates (foreign matter, dust, etc.) are not counted.

Examples of the particles contained in the particle-containing layer include inorganic particles and organic particles.
Examples of the inorganic particles include silicon oxide (silica) particles, titanium oxide (titania) particles, zirconium oxide (zirconia) particles, magnesium oxide (magnesia) particles, aluminum oxide (alumina) particles, and the like. Among them, silica particles. Is particularly preferable.
Examples of the organic particles include acrylic resin particles, polyester particles, polyurethane particles, polycarbonate particles, polyolefin particles, polystyrene particles and the like.

The particle-containing layer may contain the particles alone or may contain two or more of the particles.
The content of the particles in the particle-containing layer is preferably 0.01% by mass to 20% by mass, preferably from the viewpoint of easy control of surface roughness and suppression of wrinkles during transportation. It is more preferably 1% by mass to 10% by mass, and particularly preferably 0.5% by mass to 5% by mass.
Further, the particles in the particle-containing layer may be present inside the particle-containing layer, or a part of the particles may be exposed on the surface of the particle-containing layer. For example, when the particle-containing layer is provided on the surface of the temporary support opposite to the intermediate layer, the particles may be exposed on the surface of the temporary support on the opposite side.

The material other than the particles contained in the particle-containing layer is not particularly limited, and for example, the same material as the material of the temporary support described above can be included. The particle-containing layer preferably contains a resin, and particularly preferably an acrylic resin. The particle-containing layer may contain one type of resin alone or two or more types of resin.

The thickness of the particle-containing layer is preferably 5 to 300 nm, more preferably 10 to 100 nm, and particularly preferably 30 to 70 nm, because the resolution of the photosensitive transfer member and the laminating property at high speed are further improved. The particle-containing layer may be one layer or two layers. When the number of particle-containing layers is two or more, the preferable thickness of the particle-containing layer is a preferable thickness for each of the particle-containing layers.
The thickness of the particle-containing layer can be measured by the same method as the thickness of the temporary support described above.

Examples of commercially available products of the temporary support having the particle-containing layer include Lumirer (registered trademark; the same applies hereinafter) 12QS62, Lumirer 16KS40, 16FB40 (all manufactured by Toray Industries, Inc.) and the like.

Further, it is preferable that the film used as the temporary support has no deformation such as wrinkles or scratches.
From the viewpoint of pattern formation during pattern exposure via the temporary support and transparency of the temporary support, it is preferable that the number of fine particles, foreign substances, and defects contained in the temporary support is small. The number of the above fine particles and foreign matter and defect diameter 1μm is preferably 50/10 mm ² or less, more preferably 10/10 mm ² or less, further preferably 3/10 mm ² or less , 0 pieces / 10 mm ² is particularly preferable.

Preferred embodiments of the provisional support include, for example, paragraphs 0017 to 0018 of JP2014-85643, paragraphs 0019 to 0026 of JP2016-27363, and paragraphs 0041 to 0057 of International Publication No. 2012/081680. , International Publication No. 2018/179370, paragraphs 0029 to 0040, the contents of these publications are incorporated herein by reference.

[Middle layer]
The photosensitive transfer member of the present invention has an intermediate layer including at least a thermoplastic resin layer between the temporary support and the photosensitive resin layer.
The thickness of the intermediate layer may be set so that the total thickness of the temporary support and the intermediate layer is 35 μm or less, but the developing speed of the photosensitive transfer member is excellent and the resolution is excellent. For the reason of further improvement, 20 μm or less is preferable, 15 μm or less is more preferable, and 10 μm or less is further preferable. As the lower limit, 2 μm or more is preferable, and 4 μm or more is more preferable, because the photosensitive transfer member has better laminating property at high speed.

In the present invention, as described above, the total thickness of the temporary support and the intermediate layer may be 35 μm or less, but 34 μm or less is preferable, and 32 μm or less is more preferable. As the lower limit, 10 μm or more is preferable because the laminating property of the photosensitive transfer member at high speed is further improved.

In the present invention, the total thickness of the temporary support and the intermediate layer (hereinafter, "thickness B") with respect to the thickness of the photosensitive resin layer (hereinafter, abbreviated as "thickness A") described later. The ratio (thickness B / thickness A) (abbreviated) is preferably 6.0 to 12.0, preferably 7.0 to 11 for the reason that the resolution of the photosensitive transfer member is further improved. It is more preferably .5, and even more preferably 8.0 to 10.5.
The thickness of the intermediate layer and the photosensitive resin layer can be measured by the same method as the thickness of the temporary support described above.

<Thermoplastic resin layer>
As described above, the intermediate layer has at least a thermoplastic resin layer.
The thermoplastic resin layer preferably does not have photosensitivity, and preferably does not have a photopolymerization initiator.

(Thermoplastic resin)
The thermoplastic resin layer preferably has a thermoplastic resin.
The thermoplastic resin is not particularly limited as long as it is a resin that is plasticized by heat, and for example, acrylic resin, polystyrene resin, styrene-acrylic copolymer, polyurethane resin, polyvinyl alcohol, polyvinylformal, polyamide resin, polyester resin, polyamide. Examples thereof include resins, epoxy resins, polyacetal resins, polyhydroxystyrene resins, polyimide resins, polybenzoxazole resins, polysiloxane resins, polyethyleneimines, polyallylamines, and polyalkylene glycols. Above all, from the viewpoint of developability and transferability, the thermoplastic resin is preferably an acrylic resin.
Here, the acrylic resin is selected from the group consisting of a structural unit formed of (meth) acrylic acid, a structural unit formed of (meth) acrylic acid ester, and a structural unit formed of (meth) acrylic acid amide. It refers to a resin having at least one structural unit, and the content of the structural unit is preferably 50% by mass or more with respect to the total mass of the resin.

The thermoplastic resin preferably contains a polymer having an acid group for the reason that the developing speed is good.
Examples of the acid group include a carboxy group, a sulfo group, a phosphoric acid group, a phosphonic acid group and the like, and among them, the carboxy group is preferably used.
The polymer having an acid group as a thermoplastic resin preferably has an acid value of 60 mgKOH / g or more, and is a carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more, for the reason that the development speed is good. More preferred.
The carboxy group-containing acrylic resin having an acid value of 60 mgKOH / g or more is not particularly limited, and can be appropriately selected from known resins and used. For example, among the polymers described in paragraphs 0025 of JP2011-95716A, carboxy group-containing acrylic resins having an acid value of 60 mgKOH / g or more, and the polymers described in paragraphs 0033 to 0052 of JP2010-237589A. Among the binder polymers described in paragraphs 0053 to 0068 of JP-A-2016-224162, carboxy group-containing acrylic resins having an acid value of 60 mgKOH / g or more, and carboxy group-containing acrylic resins having an acid value of 60 mgKOH / g or more. Preferred.
The copolymerization ratio of the monomer having a carboxy group in the carboxy group-containing acrylic resin is preferably 5% by mass to 50% by mass, and 10% by mass to 40% by mass, based on the total mass of the acrylic resin. Is more preferable, and 12% by mass to 30% by mass is further preferable.

From the viewpoint of alkali developability, the acid value of the thermoplastic resin is preferably 60 mgKOH / g to 200 mgKOH / g, and more preferably 60 mgKOH / g to 180 mgKOH / g.
Here, the acid value is the mass [mg] of potassium hydroxide required to neutralize 1 g of the sample, and the unit is described as mgKOH / g in the present specification. The acid value can be calculated, for example, from the average content of acid groups in the compound.

The weight average molecular weight of the thermoplastic resin is preferably 2,000 or more, more preferably 10,000 to 100,000, and even more preferably 20,000 to 70,000.
Here, the weight average molecular weight (Mw) is determined by a gel permeation chromatography (GPC) analyzer using columns of TSKgel GMHxL, TSKgel G4000HxL, and TSKgel G2000HxL (all of which are trade names manufactured by Toso Co., Ltd.). Tetrahydrofuran), a molecular weight converted by detecting with a differential refractometer and using polystyrene as a standard substance.

The thermoplastic resin layer may contain one type of thermoplastic resin alone, or may contain two or more types of thermoplastic resin.
The content of the thermoplastic resin is preferably 10% by mass or more and 99% by mass or less with respect to the total mass of the thermoplastic resin layer from the viewpoint of further improving the resolution and the laminating property at high speed. It is more preferably mass% or more and 90 mass% or less, and further preferably 30 mass% or more and 80 mass% or less.

The glass transition temperature (Tg) of the thermoplastic resin contained in the thermoplastic resin layer is preferably 100 ° C. or lower because the photosensitive transfer member is more excellent in laminating property at high speed.
The method for measuring the glass transition temperature is as follows.
Specifically, it can be carried out according to the measurement method described in JIS K 7121 (1987). As the glass transition temperature in the present disclosure, the extrapolated glass transition start temperature (hereinafter, may be referred to as Tig) is used.
The method for measuring the glass transition temperature will be described more specifically.
When determining the glass transition temperature, after holding the device at a temperature about 50 ° C. lower than the expected Tg of the polymer until the apparatus stabilizes, the heating rate is 20 ° C./min, which is about 30 ° C. than the temperature at which the glass transition is completed. Heat to a high temperature and have the DTA or DSC curve drawn.
The extra glass transition start temperature (Tig), that is, the glass transition temperature Tg in the present specification is a straight line extending the baseline on the low temperature side of the DTA curve or DSC curve to the high temperature side, and the stepwise change portion of the glass transition. It is calculated as the temperature at the intersection with the tangent line drawn at the point where the slope of the curve is maximized. A differential scanning calorimeter (DSC6200, manufactured by Seiko Instruments, Inc.) was used as the analyzer.
The lower limit of the glass transition temperature of the thermoplastic resin is preferably 40 ° C. or higher because it suppresses a phenomenon in which the resin composition exudes from the end face of the roll when it is wound and stored in a roll shape, that is, so-called edge fusion.

(Plasticizer)
The thermoplastic resin layer preferably has a plasticizer because the photosensitive transfer member is more excellent in laminating property at high speed.
The plasticizer preferably has a smaller molecular weight or weight average molecular weight than the thermoplastic resin.
The molecular weight of the plasticizer is preferably 200 to 2,000.
The plasticizer is not particularly limited as long as it is a compound that is compatible with the thermoplastic resin and exhibits plasticity, but from the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, and is a polyalkylene glycol. More preferably, it is a compound. The alkyleneoxy group contained in the plasticizer is more preferably a polyethyleneoxy structure or a polypropyleneoxy structure.

Further, the plasticizer preferably contains a (meth) acrylate compound, and the thermoplastic resin is an acrylic resin from the viewpoint of compatibility, resolution and adhesion to a substrate, and the plasticizer is described above. More preferably, the agent contains a (meth) acrylate compound.
As used herein, "(meth) acrylate" represents acrylate or methacrylate, and "(meth) acrylic" represents acrylic or methacrylic.
As the (meth) acrylate compound used as the plasticizing agent, a (meth) acrylate compound contained in the polymerizable compound in the photosensitive resin layer described later is preferably mentioned, and has a polyfunctional (meth) acrylate compound and an acid group ( A meta) acrylate compound, a urethane (meth) acrylate compound and the like can also be preferably used.
In particular, from the viewpoint of storage stability, it is preferable that both the thermoplastic resin layer and the photosensitive resin layer contain the same (meth) acrylate compound. By containing the same (meth) acrylate compound in both the thermoplastic resin layer and the photosensitive resin layer, diffusion of components between layers is suppressed and storage stability is improved.
When the (meth) acrylate compound is contained as the plasticizer, it is preferable that the (meth) acrylate compound does not polymerize in the thermoplastic resin layer even in the exposed portion after exposure from the viewpoint of resolution.

The thermoplastic resin layer may contain one type of plasticizer alone, or may contain two or more types of plasticizer.
When the thermoplastic resin layer contains a plasticizer, the content of the plasticizer is 1% by mass to 70% by mass with respect to the total mass of the thermoplastic resin layer because the photosensitive transfer member is more excellent in laminating property at high speed. It is preferably by mass%, more preferably 5% by mass to 50% by mass.

(Other ingredients)
In addition to the thermoplastic resin and the plasticizer, the thermoplastic resin layer includes an acid-reactive dye or a base-reactive dye (hereinafter abbreviated as “dye B”), a photoacid generator or a photobase generator, a surfactant, and the like. It may have other components such as a sensitizer, a polymerization inhibitor, and a rust preventive.

(Dye B)
The thermoplastic resin layer preferably has an acid-reactive dye or a base-reactive dye (dye B). Dye B represents a dye whose maximum absorption wavelength changes depending on an acid or a base. The dye B preferably has a maximum absorption wavelength of 450 nm or more in the wavelength range of 400 nm to 780 nm at the time of color development.
Here, "the maximum absorption wavelength of the dye changes depending on the acid or base" means that the dye in the color-developing state is decolorized from the acid or base, and the dye in the decolorized state is colored by the acid or base. It may refer to any aspect of a mode in which a dye in a color-developing state is changed to a color-developing state of another hue by an acid or a base.
From the viewpoint of visibility and resolution of the exposed and unexposed areas, the dye B is preferably a dye whose maximum absorption wavelength is changed by an acid, and the dye B is changed by an acid. It is particularly preferable that the dye is used in combination with a photoacid generator described later.

As an example of the color-developing mechanism of the dye B in the present disclosure, an acid is generated by adding a photoacid generator or a photobase generator to the thermoplastic resin layer and exposing the dye B with an acid or base generated from the photoacid generator or the like. Examples thereof include a mode in which a reactive dye or a base-reactive dye (for example, a leuco dye) develops a color.

The method for measuring the maximum absorption wavelength is to measure the transmission spectrum in the range of 400 nm to 780 nm using a spectrophotometer (device name: UV3100, manufactured by Shimadzu Corporation) at 25 ° C. in an atmospheric atmosphere. The wavelength at which the light intensity is minimized (maximum absorption wavelength) shall be measured.

Examples of the dye B include leuco compounds, diarylmethane dyes, oxazine dyes, xanthene dyes, iminonaphthoquinone dyes, azomethine dyes, anthraquinone dyes, and the like, and have visibility of exposed and unexposed areas. From the viewpoint, leuco compounds are preferable.
Preferred embodiments of the dye B include those similar to the specific latent dyes described in paragraphs 0023 to 0039 of International Publication No. 2019/022089.
Specific examples of Dye B include Brilliant Green, Ethyl Violet, Methyl Green, Crystal Violet, Basic Fuxin, Methyl Violet 2B, Kinaldine Red, Rose Bengal, Metanyl Yellow, Timor Sulfophthalene, Xylenol Blue, Methyl Orange, and Para. Methyl Red, Congofred, Benzopurpurin 4B, α-Naftil Red, Nile Blue 2B, Nile Blue A, Methyl Violet, Malakite Green, Parafuxin, Victoria Pure Blue-Naphthalene Sulfonate, Victoria Pure Blue BOH (Hodogaya Chemical Industry) (Made by Orient Chemical Industry Co., Ltd.), Oil Blue # 603 (Made by Orient Chemical Industry Co., Ltd.), Oil Pink # 312 (Made by Orient Chemical Industry Co., Ltd.), Oil Red 5B (Made by Orient Chemical Industry Co., Ltd.), Oil Scarlet # 308 (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red OG (manufactured by Orient Chemical Industry Co., Ltd.), Oil Red RR (manufactured by Orient Chemical Industry Co., Ltd.), Oil Green # 502 (manufactured by Orient Chemical Industry Co., Ltd.) , Spiron Red BEH Special (manufactured by Hodoya Chemical Industry Co., Ltd.), m-cresol purple, cresol red, rhodamine B, rhodamine 6G, sulfolodamine B, auramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino- 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-p-N, N-bis (hydroxyethyl) amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino- Dyes such as 5-pyrazolone, 1-β-naphthyl-4-p-diethylaminophenylimino-5-pyrazolone, p, p', p "-hexamethyltriaminotriphenylmethane (leucocrystal violet), Pergascript Blue SRB ( Leuco compounds such as (manufactured by Ciba Geigy) can be mentioned.

The dye B may be used alone or in combination of two or more.
When the thermoplastic resin layer contains the dye B, the content of the dye B is 0.01% by mass or more with respect to the total mass of the thermoplastic resin layer from the viewpoint of visibility of the exposed portion and the non-exposed portion. It is preferable, and it is more preferable that it is 0.02% by mass to 6% by mass.

(Photoacid generator or photobase generator)
The thermoplastic resin layer preferably contains a photoacid generator or a photobase generator in combination with the dye B for the reason of improving the visibility of the exposed portion and the non-exposed portion. A more preferred embodiment is one comprising an acid-reactive dye and a photoacid generator.

The photoacid generator or photobase generator used in the present disclosure is a compound capable of generating an acid or a base by irradiating with active rays such as ultraviolet rays, far ultraviolet rays, X-rays, and electron beams.
As the photoacid generator or photobase generator used in the present disclosure, a compound that is sensitive to active light having a wavelength of 300 nm or more, preferably a wavelength of 300 nm to 450 nm and generates an acid or a base is preferable, but the chemical structure thereof is Not limited. Further, a photoacid generator or a photobase generator that is not directly sensitive to active light having a wavelength of 300 nm or more is also a compound that is sensitive to active light having a wavelength of 300 nm or more and generates an acid or a base when used in combination with a sensitizer. If there is, it can be preferably used in combination with a sensitizer.

Examples of the photoacid generator include an ionic photoacid generator and a nonionic photoacid generator.
Examples of the ionic photoacid generator include onium salt compounds such as diaryliodonium salts and triarylsulfonium salts, and quaternary ammonium salts. Of these, onium salt compounds are preferable, and triarylsulfonium salts and diaryliodonium salts are particularly preferable.
As the ionic photoacid generator, the ionic photoacid generator described in paragraphs 0114 to 0133 of JP-A-2014-85643 can also be preferably used.
Examples of the nonionic photoacid generator include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, oxime sulfonate compounds and the like. Specific examples of the trichloromethyl-s-triazines, the diazomethane compound and the imide sulfonate compound include the compounds described in paragraphs 0083 to 0088 of JP2011-221494.
Among these, from the viewpoint of sensitivity, resolution, and adhesion, the photoacid generator is preferably an oxime sulfonate compound.

As the oxime sulfonate compound, those described in paragraphs 0084 to 0088 of International Publication No. 2018/179640 can be preferably used.

As the thermoplastic resin layer, one type of photoacid generator or photobase generator may be used alone, or two or more types may be used.

(Surfactant)
The thermoplastic resin layer preferably contains a surfactant from the viewpoint of thickness uniformity.
Examples of the surfactant include anionic, cationic, nonionic (nonionic) and amphoteric surfactants. Preferred surfactants are nonionic surfactants.
Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, polyoxyethylene glycol higher fatty acid diesters, silicone-based surfactants, and fluorine-based surfactants. Therefore, a fluorine-based surfactant can be preferably used.

Examples of the surfactant include the interfaces described in paragraphs 0120 to 0125 of International Publication No. 2018/179640, paragraphs 0017 of Japanese Patent No. 4502784, and paragraphs 0060 to 0071 of Japanese Patent Application Laid-Open No. 2009-237362. Activators can be used.
Further, as a commercially available product of the surfactant, for example, Megafuck F-552 or F-554 (all manufactured by DIC Corporation) can be used.
When the thermoplastic resin layer contains a surfactant, the content of the surfactant is preferably 0.001% by mass to 10% by mass, preferably 0.01% by mass, based on the total mass of the thermoplastic resin layer. More preferably, it is% to 3% by mass.
As the thermoplastic resin layer, one type of surfactant may be used alone, or two or more types may be used.

Further, the thermoplastic resin layer may contain other additives other than those described above. The other additives are not particularly limited, and known additives can be used.
Further, for a preferred embodiment of the thermoplastic resin layer, paragraphs 0189 to 0193 of JP-A-2014-85643 can also be referred to.

The thickness of the thermoplastic resin layer is preferably 18 μm or less, more preferably 15 μm or less, and more preferably 10 μm or less, for the reason that the developing speed of the photosensitive transfer member is excellent and the resolution is further improved. It is more preferably present, and particularly preferably 6 μm or less. If the thermoplastic resin layer is too thick, it takes a long time to develop, so that a residue may remain between the formed patterns and the resolution may be deteriorated. The lower limit is preferably 0.5 μm or more because the photosensitive transfer member is more excellent in laminating property at high speed.
The thickness of the thermoplastic resin layer can be measured by the same method as the thickness of the temporary support described above.

At 70 ° C., the viscosity of the thermoplastic resin layer is preferably lower than the viscosity of the photosensitive resin layer described above. When the viscosity of the thermoplastic resin layer is lower than the viscosity of the photosensitive resin layer at 70 ° C., the thermoplastic resin layer is deformed without being deformed and can follow the substrate, so that the resolution is high. And better laminating properties at high speeds.
For the viscosity of the thermoplastic resin layer at 70 ° C. and the viscosity of the photosensitive resin layer described later, values measured by the following method using a rheometer are adopted.
First, the thermoplastic resin layer or the photosensitive resin layer is taken out as a sample from the photosensitive transfer member.
Next, the sample is placed on the Peltier plate, and the Gap of the 20 mmf parallel plate and the Peltier plate is set to 0.25 to 0.40 mm. After the sample is melted or softened at 90 ° C ± 5 ° C, it is cooled to 50 ° C at a temperature lowering rate of 5 ° C / min, and in Gap constant mode, the temperature is 50 to 100 ° C, the temperature rise rate is 5 ° C / min, the frequency is 1 Hz, and distortion. The temperature of the sample is raised under the condition of 0.5%, and the viscosity is measured.
The ratio (viscosity A / viscosity C) of the viscosity of the thermoplastic resin layer (hereinafter abbreviated as "viscosity C") to the viscosity of the photosensitive resin layer (hereinafter abbreviated as "viscosity A") is preferably 1 or more. 1 to 10 is more preferable, and 1 to 5 is even more preferable.

<Water-soluble resin layer>
In the present invention, it is preferable that the intermediate layer has a water-soluble resin layer, and the thermoplastic resin layer and the photosensitive resin layer are photosensitive for the reason of suppressing the mixing of the thermoplastic resin layer and the photosensitive resin layer. It is more preferable to have a water-soluble resin layer between the resin layer and the resin layer.

The water-soluble resin layer preferably contains a water-soluble resin.
Here, water-soluble means that the solubility in 100 g of water having a pH of 7.0 at 22 ° C. is 0.1 g or more.
Examples of the water-soluble resin include polyvinyl alcohol-based resins, polyvinylpyrrolidone-based resins, cellulose-based resins, acrylamide-based resins, polyethylene oxide-based resins, gelatin, vinyl ether-based resins, polyamide resins, and resins such as copolymers thereof. Can be configured using.
From the viewpoint of suppressing the mixing of the components of the thermoplastic resin layer and the water-soluble resin layer described later when producing the photosensitive transfer member, the water-soluble resin is a thermoplastic resin contained in the thermoplastic resin layer. It is preferably a different resin.
Among them, the water-soluble resin preferably contains polyvinyl alcohol, and particularly preferably contains polyvinyl alcohol and polyvinylpyrrolidone, from the viewpoint of oxygen blocking property and suppressing component mixing with adjacent layers. ..
The water-soluble resin layer may contain the above-mentioned resin alone or in combination of two or more.

The content of the water-soluble resin in the water-soluble resin layer is not particularly limited, but is 60 mass with respect to the total mass of the water-soluble resin layer from the viewpoint of oxygen blocking property and suppressing component mixing with the adjacent layer. It is preferably% to 100% by mass, more preferably 80% by mass to 100% by mass, and particularly preferably 90% by mass to 100% by mass.
Additives such as a surfactant may be added to the water-soluble resin layer, if necessary.

The thickness of the water-soluble resin layer may be set so that the total thickness of the temporary support and the intermediate layer is 35 μm or less, but the laminating property at high speed is further improved. It is preferably 5 μm or less, and more preferably 3 μm or less. The lower limit is not particularly limited, but is preferably 0.1 μm or more.
The thickness of the water-soluble resin layer can be measured by the same method as the thickness of the temporary support described above.

[Photosensitive resin layer]
The photosensitive transfer member of the present invention has a photosensitive resin layer.
The thickness of the photosensitive resin layer may be less than 5 μm, but 4 μm or less is preferable, and 3 μm or less is more preferable, because the developing speed of the photosensitive transfer member is excellent and the resolution is further improved. The lower limit is not particularly limited, but may be 0.1 μm or more.

The photosensitive resin layer is not particularly limited, and a known photosensitive resin layer can be used, but a negative photosensitive resin layer is preferable because the laminating property at high speed is more excellent.
Here, the negative type photosensitive resin layer refers to a photosensitive resin layer whose solubility in a developing solution is reduced by exposure.

From the viewpoint of pattern forming property, the photosensitive resin layer preferably has a polymerizable compound, a polymer having an acid group, and a photopolymerization initiator.
As the photosensitive resin layer, for example, the photosensitive resin layer described in JP-A-2016-224162 may be used.

(Polymerizable compound)
The photosensitive resin layer preferably contains a polymerizable compound.
The polymerizable compound is a component that contributes to the photosensitivity (that is, photocurability) of the negative photosensitive resin layer and the strength of the cured film.
As the polymerizable compound, an ethylenically unsaturated compound is preferable, and a bifunctional or higher functional ethylenically unsaturated compound is more preferable.
Here, the ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups, and the bifunctional or higher functional ethylenically unsaturated compound has two ethylenically unsaturated groups in one molecule. It means a compound having the above.
As the ethylenically unsaturated group, a (meth) acryloyl group is more preferable.
As the ethylenically unsaturated compound, a (meth) acrylate compound is preferable.

The bifunctional ethylenically unsaturated compound is not particularly limited and may be appropriately selected from known compounds. Specifically, tricyclodecanedimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), tricyclodecanedimethanol dimethacrylate (DCP, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,9 -Nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and the like can be mentioned. ..
Further, as the bifunctional ethylenically unsaturated compound, a bifunctional ethylenically unsaturated compound having a bisphenol structure is also preferably used.
Examples of the bifunctional ethylenically unsaturated compound having a bisphenol structure include the compounds described in paragraphs 0072 to 0080 of JP-A-2016-224162.
Specific examples thereof include alkylene oxide-modified bisphenol A di (meth) acrylate, and include 2,2-bis (4- (methacryloxydiethoxy) phenyl) propane and 2,2-bis (4- (methacryloxyethoxy) ethoxy). Preferable examples thereof include dimethacrylate (BPE-500, manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) of polyethylene glycol in which an average of 5 mol of ethylene oxide is added to both ends of propoxy) phenyl) propane and bisphenol A.

The trifunctional or higher functional ethylenically unsaturated compound is not particularly limited and can be appropriately selected from known compounds. For example, dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, trimethylolpropane tri (meth) acrylate, dimethylolpropane tetra (meth) acrylate, isocyanul. Examples thereof include acid (meth) acrylate and (meth) acrylate compounds having a glycerin tri (meth) acrylate skeleton.

Here, "(tri / tetra / penta / hexa) (meth) acrylate" is a concept including tri (meth) acrylate, tetra (meth) acrylate, penta (meth) acrylate, and hexa (meth) acrylate. , "(Tri / tetra) (meth) acrylate" is a concept that includes tri (meth) acrylate and tetra (meth) acrylate.

Examples of ethylenically unsaturated compounds include caprolactone-modified (meth) acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin Nakamura Chemical Industry Co., Ltd., etc.) and alkylene oxides. Modified (meth) acrylate compounds (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin Nakamura Chemical Industry Co., Ltd., EBECRYL (registered trademark) 135 manufactured by Daicel Ornex Co., Ltd., etc.), ethoxyl Glycerin triacrylate (A-GLY-9E manufactured by Shin Nakamura Chemical Industry Co., Ltd.), Aronix (registered trademark) TO-2349 (manufactured by Toa Synthetic Co., Ltd.), Aronix M-520 (manufactured by Toa Synthetic Co., Ltd.) , Aronix M-270 (manufactured by Toa Synthetic Co., Ltd.), Aronix M-510 (manufactured by Toa Synthetic Co., Ltd.), and the like.
As the ethylenically unsaturated compound, a urethane (meth) acrylate compound (preferably a trifunctional or higher functional urethane (meth) acrylate compound) can also be used. For example, 8UX-015A (manufactured by Taisei Fine Chemical Industry Co., Ltd.), UA- Examples thereof include 32P (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) and UA-1100H (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.).
Further, as the ethylenically unsaturated compound, a polymerizable compound having an acid group described in paragraphs 0025 to 0030 of JP-A-2004-239942 may be used.

The weight average molecular weight (Mw) of the polymerizable compound used in the present disclosure is preferably 200 to 3,000, more preferably 280 to 2,200, and even more preferably 300 to 2,200.

The polymerizable compound may be used alone or in combination of two or more.
When the photosensitive resin layer contains a polymerizable compound, the content of the polymerizable compound is preferably 10% by mass to 70% by mass, more preferably 20% by mass to 60% by mass, based on the total mass of the photosensitive resin layer. It is preferable, and more preferably 20% by mass to 50% by mass.

(Polymer having an acid group)
The photosensitive resin layer preferably contains a polymer having an acid group.
A preferred form of the polymer having an acid group contained in the photosensitive resin layer is the same as the polymer having an acid group exemplified as the thermoplastic resin having the above-mentioned thermoplastic resin layer.

The photosensitive resin layer may contain one kind of polymer having an acid group alone, or may contain two or more kinds of polymers.
When the photosensitive resin layer contains a polymer having an acid group, the content of the polymer having an acid group is 10% by mass or more and 90% by mass with respect to the total mass of the photosensitive resin layer from the viewpoint of photosensitivity. It is preferably 20% by mass or more, more preferably 80% by mass or less, and further preferably 30% by mass or more and 70% by mass or less.

(Photopolymerization initiator)
The photosensitive resin layer preferably contains a photopolymerization initiator.
The photopolymerization initiator receives active light such as ultraviolet rays and visible light to start the polymerization of the polymerizable compound.
The photopolymerization initiator is not particularly limited, and a known photopolymerization initiator can be used.
Examples of the photopolymerization initiator include a photoradical polymerization initiator and a photocationic polymerization initiator, and a photoradical polymerization initiator is preferable.
Further, as the photopolymerization initiator in the photosensitive resin layer, at least one selected from the group consisting of 2,4,5-triarylimidazole dimer and its derivative is selected from the viewpoint of photosensitivity and resolvability. It is preferable to include it.

Further, as the photopolymerization initiator, for example, the polymerization initiators described in paragraphs 0031 to 0042 of JP2011-95716A and paragraphs 0064 to 0081 of JP2015-014783 may be used. ..

Commercially available photopolymerization initiators include 1- [4- (phenylthio)] -1,2-octanedione-2- (O-benzoyloxime) [trade name: IRGACURE (registered trademark) OXE-01, BASF). Made], 1- [9-ethyl-6- (2-methylbenzoyl) -9H-carbazole-3-yl] etanone-1- (O-acetyloxime) [trade name: IRGACURE (registered trademark) OXE-02, BASF], 2- (dimethylamino) -2-[(4-methylphenyl) methyl] -1- [4- (4-morpholinyl) phenyl] -1-butanone [trade name: IRGACURE (registered trademark) 379EG , BASF], 2-Methyl-1- (4-methylthiophenyl) -2-morpholinopropane-1-one [trade name: IRGACURE (registered trademark) 907, BASF], 2-hydroxy-1- {4- [4- (2-Hydroxy-2-methylpropionyl) benzyl] phenyl} -2-methylpropan-1-one [trade name: IRGACURE (registered trademark) 127, manufactured by BASF], 2-benzyl-2 -Dimethylamino-1- (4-morpholinophenyl) butanone-1 [trade name: IRGACURE (registered trademark) 369, manufactured by BASF], 2-hydroxy-2-methyl-1-phenylpropan-1-one [commodity] Name: IRGACURE (registered trademark) 1173, manufactured by BASF], 1-hydroxycyclohexylphenylketone [trade name: IRGACURE (registered trademark) 184, manufactured by BASF], 2,2-dimethoxy-1,2-diphenylethane-1 -On [trade name: IRGACURE 651, manufactured by BASF] and the like, oxime ester-based [trade name: Lunar (registered trademark) 6, manufactured by DKSH Japan Co., Ltd.] and the like can be mentioned.

The photosensitive resin layer may contain one type of photopolymerization initiator alone, or may contain two or more types of photopolymerization initiators.
When the photosensitive resin layer contains a photopolymerization initiator, the content of the photopolymerization initiator is not particularly limited, but is preferably 0.1% by mass or more based on the total mass of the photosensitive resin layer. 5% by mass or more is more preferable, and 1.0% by mass or more is further preferable.
The content of the photopolymerization initiator is preferably 10% by mass or less, more preferably 5% by mass or less, based on the total mass of the photosensitive resin layer.

(Other additives)
In addition to the above components, the photosensitive resin layer may contain known additives, if necessary.
As other additives, known ones can be used, and examples thereof include polymerization inhibitors, plasticizers, sensitizers, hydrogen donors, heterocyclic compounds, color formers, decolorants, solvents and the like.
As the polymerization inhibitor, for example, the thermal polymerization inhibitor described in paragraph 0018 of Japanese Patent No. 4502784 can be used. Among them, phenothiazine, phenothiazine or 4-methoxyphenol can be preferably used.
When the photosensitive resin layer contains a polymerization inhibitor, the content of the polymerization inhibitor is preferably 0.01% by mass to 3% by mass, preferably 0.01% by mass or more, based on the total mass of the photosensitive resin layer. 1% by mass is more preferable, and 0.01% by mass to 0.8% by mass is further preferable.
Examples of the sensitizer include known sensitizers, dyes, pigments and the like.
Examples of the plasticizer and the heterocyclic compound include those described in paragraphs 097 to 0103 and 0111 to 0118 of International Publication No. 2018/179640.
As the color former, for example, the color former described in paragraph 0417 of JP-A-2007-178459 can be used, and leuco crystal violet, crystal violet lactone, Victoria pure blue-naphthalene sulfonate and the like are more preferably used. Be done.
When the photosensitive resin layer contains a coloring agent, the content of the coloring agent is 0.1 mass with respect to the total mass of the photosensitive resin layer from the viewpoint of visibility and resolution of the exposed portion and the non-exposed portion. It is preferably% to 10% by mass, more preferably 0.1% by mass to 5% by mass, and particularly preferably 0.1% by mass to 1% by mass.

In addition, the photosensitive resin layer in the present disclosure includes metal oxide particles, antioxidants, dispersants, acid growth agents, development accelerators, conductive fibers, colorants, thermal radical polymerization initiators, thermal acid generators, etc. Further known additives such as UV absorbers, thickeners, crosslinkers, and organic or inorganic anti-precipitation agents can be added.
Preferred embodiments of other components are described in paragraphs 0165 to 0184 of JP2014-85643, respectively, and the contents of this publication are incorporated in the present specification.

[Cover film]
The photosensitive transfer member according to the present disclosure preferably has a cover film on the surface opposite to the intermediate layer of the photosensitive resin layer of the photosensitive transfer member.
Examples of the cover film include a resin film and paper, and a resin film is particularly preferable from the viewpoint of strength, flexibility, and the like. Examples of the resin film include polyethylene film, polypropylene film, polyethylene terephthalate film, cellulose triacetate film, polystyrene film, polycarbonate film and the like. Of these, polyethylene film, polypropylene film, and polyethylene terephthalate film are preferable.

The thickness of the cover film is not particularly limited, and for example, one having a thickness of 1 μm to 2 mm is preferable.

[Other layers]
The photosensitive transfer member according to the present disclosure may have layers other than those described above (hereinafter, abbreviated as "other layers"). Examples of other layers include a contrast enhancement layer, an easily peelable layer, a BARC layer (lower layer antireflection film), and the like.
Preferred embodiments of the contrast enhancement layer are described in paragraph 0134 of WO 2018/179640, the contents of which are incorporated herein.

Here, with reference to FIG. 1, an example of the layer structure of the photosensitive transfer member according to the present disclosure is schematically shown.
In the photosensitive transfer member 100 shown in FIG. 1, a temporary support 10, a thermoplastic resin layer 12, a water-soluble resin layer 14, a photosensitive resin layer 16, and a cover film 18 are laminated in this order.
In FIG. 1, the intermediate layer 15 is a layer composed of a thermoplastic resin layer 12 and a water-soluble resin layer 14.

[Manufacturing method of photosensitive transfer member]
The method for producing the photosensitive transfer member of the present invention is not particularly limited, and a known production method can be used.
Specifically, a composition such as a thermoplastic resin composition is prepared by mixing the above-mentioned constituent components of each layer and a solvent, and the above composition is applied on a temporary support or a cover film to temporarily prepare the composition. It is possible to obtain a photosensitive transfer member having a support, an intermediate layer having at least a thermoplastic resin layer, and a photosensitive resin layer in this order.
Among them, as a method for producing a photosensitive transfer member according to the present disclosure, a step of applying a thermoplastic resin composition on a temporary support and drying it to form a thermoplastic resin layer, and a water-soluble resin composition being used as a thermoplastic resin layer. A method including a step of applying and drying on the water-soluble resin layer to form a water-soluble resin layer and a step of applying and drying the photosensitive resin composition on the water-soluble resin layer to form a photosensitive resin layer are preferably mentioned.
Further, the method for manufacturing a photosensitive transfer member according to the present disclosure preferably further includes a step of providing a cover film on the photosensitive resin layer after the step of forming the photosensitive resin layer.

[Manufacturing method of resin pattern]
The method for producing the resin pattern of the present invention is not particularly limited as long as it is the method for producing the resin pattern using the photosensitive transfer member according to the present disclosure, but the method is not particularly limited to that of the intermediate layer of the photosensitive resin layer of the photosensitive transfer member. Is a step of bringing the surface on the opposite side into contact with a substrate having a conductive layer and bonding them (hereinafter, abbreviated as "bonding step") and a step of pattern-exposing the photosensitive resin layer (hereinafter, "exposure step"). (Abbreviated as) and a step of developing the exposed photosensitive resin layer to form a resin pattern (hereinafter, abbreviated as “development step”) are preferably included in this order.
When the photosensitive transfer member has a cover film, the surface opposite to the intermediate layer of the photosensitive resin layer means the surface of the photosensitive resin layer exposed when the cover film is peeled off. Further, for example, when the BARC layer is provided between the photosensitive resin layer and the cover film, the surface on the side opposite to the intermediate layer of the photosensitive resin layer is the BARC layer exposed when the cover film is peeled off. It refers to the surface.

[Manufacturing method of circuit wiring]
The method for manufacturing the circuit wiring of the present invention may be any method using the photosensitive transfer member according to the present disclosure, but the surface of the photosensitive transfer member on the side opposite to the intermediate layer of the photosensitive resin layer is a conductive layer. A step of bonding the photosensitive resin layer to the substrate having the above, a step of pattern-exposing the photosensitive resin layer in the bonded photosensitive transfer member, and a step of developing the pattern-exposed photosensitive resin layer to form a resin pattern. It is preferable to include a step of etching the substrate in a region where the resin pattern is not arranged (hereinafter, abbreviated as "etching step") in this order.

[Lasting process]
In the method for manufacturing a resin pattern according to the present disclosure or the method for manufacturing a circuit wiring according to the present disclosure, the surface of the photosensitive transfer member opposite to the intermediate layer of the photosensitive resin layer is formed on a substrate having a conductive layer. It is preferable to include a step of contacting and bonding (bonding step).
In the bonding step, it is preferable that the conductive layer and the surface of the photosensitive transfer member on the opposite side of the intermediate layer of the photosensitive resin layer are pressure-bonded so as to be in contact with each other. In the above aspect, the patterned photosensitive resin layer after exposure and development can be suitably used as an etching resist when etching the conductive layer.
The method of crimping the substrate and the photosensitive transfer member is not particularly limited, and a known transfer method and a laminating method can be used.
The bonding of the photosensitive transfer member to the substrate is performed by superimposing the surface of the photosensitive transfer member on the side opposite to the intermediate layer of the photosensitive resin layer on the substrate, pressurizing and heating with a roll or the like. Is preferable. For bonding, known laminators such as a laminator, a vacuum laminator, and an auto-cut laminator capable of further increasing productivity can be used.
The circuit wiring manufacturing method according to the present disclosure is preferably performed by a roll-to-roll method. Therefore, the base material constituting the substrate is preferably a resin film.
The roll-to-roll method will be described below.
The roll-to-roll method uses a substrate that can be wound and unwound as a substrate, and unwinds the substrate or a structure including the substrate before any of the steps included in the circuit wiring manufacturing method. A step of winding up a structure including a base material or a substrate (also referred to as a “winding step”) after any of the steps (also referred to as “unwinding step”), and at least one of the steps. (Preferably, all steps) refers to a method in which a base material or a structure including a substrate is transported.
The unwinding method in the unwinding step and the winding method in the winding step are not particularly limited, and a known method may be used in the manufacturing method to which the roll-to-roll method is applied.

The substrate used in the present disclosure is preferably a substrate having a conductive layer, and more preferably a substrate having a conductive layer on the surface of the base material.
The substrate has a conductive layer on a base material such as glass, silicon, or a film, and any layer may be formed if necessary.
Preferred embodiments of the substrate are described, for example, in paragraph 0140 of WO 2018/155193, the contents of which are incorporated herein.

The substrate having a conductive layer on the substrate is preferably a film substrate from the viewpoint of performing the bonding step by a roll-to-roll method. In the circuit wiring manufacturing method according to the present disclosure, when the circuit wiring is for a touch panel, it is particularly preferable that the base material is a sheet-like resin composition.

The conductive layer of the substrate is at least one selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer from the viewpoint of conductivity and fine wire forming property. It is preferably a layer of, more preferably a metal layer, and particularly preferably a copper layer or a silver layer.
Further, the base material may have one conductive layer or two or more conductive layers. When there are two or more conductive layers, it is preferable to have conductive layers made of different materials.
Preferred embodiments of the conductive layer are described, for example, in paragraph 0141 of WO 2018/155193, the contents of which are incorporated herein.

[Exposure process]
The method for manufacturing a resin pattern according to the present disclosure or the method for manufacturing a circuit wiring according to the present disclosure preferably includes a step (exposure step) of pattern-exposing the photosensitive resin layer after the bonding step.

In the present disclosure, the detailed arrangement and specific size of the pattern are not particularly limited. Since it is desired to improve the display quality of a display device (for example, a touch panel) provided with an input device having a circuit wiring manufactured by the circuit wiring manufacturing method according to the present disclosure, and to make the area occupied by the take-out wiring as small as possible, the pattern At least a part (particularly the electrode pattern of the touch panel and the portion of the take-out wiring) is preferably a fine wire of 20 μm or less, and more preferably 10 μm or less.

Preferred embodiments of the light source, exposure amount and exposure method used for exposure are described in, for example, paragraphs 0146 to 0147 of International Publication No. 2018/155193, and these contents are incorporated in the present specification.

[Development process]
The method for manufacturing a resin pattern according to the present disclosure, or the method for manufacturing a circuit wiring according to the present disclosure, is a step of developing the exposed photosensitive resin layer to form a resin pattern after the exposure step (development step). ) Is preferably included.
When the photosensitive transfer member has a water-soluble resin layer, the thermoplastic resin layer and the water-soluble resin layer in the non-exposed portion are also removed together with the photosensitive resin layer in the non-exposed portion in the developing step. Further, in the developing step, the thermoplastic resin layer and the water-soluble resin layer of the exposed portion may also be removed in a form of being dissolved or dispersed in the developing solution.

The exposed photosensitive resin layer in the developing step can be developed by using a developing solution.
The developing solution and developing method are not particularly limited as long as the non-image portion of the photosensitive resin layer can be removed, and a known developing solution and developing method can be used. Examples of the developer preferably used in the present disclosure include the developer described in paragraph 0194 of International Publication No. 2015/093271, and examples of the developing method preferably used include International Publication No. 2015/093271. The developing method described in paragraph 0195 of the issue can be mentioned.

[Etching process]
The circuit wiring manufacturing method according to the present disclosure preferably includes a step (etching step) of etching a substrate in a region where the resin pattern is not arranged.

In the etching step, the pattern formed from the photosensitive resin layer by the developing step is used as an etching resist, and the conductive layer is etched.
Examples of the etching treatment method include the methods described in paragraphs 0209 to 0210 of JP-A-2017-120435, the methods described in paragraphs 0048-paragraph 0054 of JP-A-2010-152155, and known plasma etching. A known method such as a method by dry etching can be applied.

[Removal process]
In the circuit wiring manufacturing method according to the present disclosure, it is preferable to perform a step of removing the resin pattern (hereinafter, abbreviated as "removal step").
The removing step is not particularly limited and can be performed as needed, but it is preferably performed after the etching step.
The method for removing the remaining photosensitive resin layer is not particularly limited, and examples thereof include a method for removing by chemical treatment, and it is particularly preferable to use a removing solution.
As a method for removing the photosensitive resin layer, a substrate having a photosensitive resin layer or the like is immersed in a removing solution being stirred at preferably at 30 ° C. to 80 ° C., more preferably 50 ° C. to 80 ° C. for 1 minute to 30 minutes. The method can be mentioned.

Examples of the removing liquid include inorganic alkaline components such as sodium hydroxide and potassium hydroxide, or organic alkalis such as primary amine compounds, secondary amine compounds, tertiary amine compounds, and quaternary ammonium salt compounds. Examples thereof include a removal solution in which the components are dissolved in water, dimethylsulfoxide, N-methylpyrrolidone, or a mixed solution thereof.
Further, the removing liquid may be used and removed by a spray method, a shower method, a paddle method or the like.

[Other processes]
The circuit wiring manufacturing method according to the present disclosure may include any steps (other steps) other than those described above. For example, when the photosensitive transfer member has a cover film, a step of peeling off the cover film of the photosensitive transfer member, a step of reducing the visible light reflectance according to paragraph 0172 of International Publication No. 2019/22089, Examples thereof include a step of forming a new conductive layer on the insulating film described in paragraph 0172 of International Publication No. 2019/22089, but the steps are not limited to these steps.
Further, as an example of the exposure step, the developing step, and other steps in the present disclosure, the methods described in paragraphs 0035 to 0051 of JP-A-2006-23696 can be preferably used in the present disclosure.

The circuit wiring manufactured by the circuit wiring manufacturing method according to the present disclosure can be applied to various devices. Examples of the device provided with the circuit wiring manufactured by the method for manufacturing the circuit wiring according to the present disclosure include an input device and the like, and a touch panel is preferable, and a capacitance type touch panel is more preferable. Further, the input device can be applied to a display device such as an organic EL display device and a liquid crystal display device.

[Manufacturing method of touch panel]
The method for manufacturing the touch panel of the present invention may be any method using the photosensitive transfer member according to the present disclosure, but the surface of the photosensitive transfer member on the side opposite to the intermediate layer of the photosensitive resin layer is formed by forming a conductive layer. A bonding step (bonding step) of contacting and bonding with the substrate to be held, a step of pattern-exposing the photosensitive resin layer (exposure step), and developing the exposed photosensitive resin layer to form a resin pattern. It is preferable to include the step of performing the process (development step) and the step of etching the substrate in the region where the resin pattern is not arranged (etching step) in this order.

In the touch panel manufacturing method according to the present disclosure, specific aspects of each step and embodiments such as the order in which each step is performed are as described in the above-mentioned "Circuit wiring manufacturing method" section. The same applies to the preferred embodiment.
As the method for manufacturing the touch panel according to the present disclosure, a known method for manufacturing the touch panel can be referred to except for the above.
In addition, the touch panel manufacturing method according to the present disclosure may include an arbitrary step (other steps) other than those described above.

2 and 3 show an example of a mask pattern used in the touch panel manufacturing method according to the present disclosure.
In the pattern A shown in FIG. 2 and the pattern B shown in FIG. 3, SL and G are image portions (openings), and DL is a virtual representation of the alignment frame. In the method for manufacturing a touch panel according to the present disclosure, for example, by exposing the photosensitive resin layer through a mask having the pattern A shown in FIG. 2, a circuit wiring having the pattern A corresponding to SL and G is formed. Can manufacture touch panels.

The touch panel according to the present disclosure is a touch panel having at least the circuit wiring manufactured by the method for manufacturing the circuit wiring according to the present disclosure. Further, the touch panel according to the present disclosure preferably has at least a transparent substrate, electrodes, and an insulating layer or a protective layer.
As the detection method in the touch panel according to the present disclosure, any known method such as a resistive film method, a capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method may be used. Above all, the capacitance method is preferable.
The touch panel type includes a so-called in-cell type (for example, those described in FIGS. 5, 6, 7, and 8 of JP-A-2012-517501), a so-called on-cell type (for example, Japanese Patent Application Laid-Open No. 2013-168125). The one described in FIG. 19 of the publication, the one described in FIGS. 1 and 5 of Japanese Patent Application Laid-Open No. 2012-89102), OGS (One Glass Solution) type, TOR (Touch-on-Lens) type (for example, Japanese Patent Application Laid-Open No. (The one described in FIG. 2 of 2013-54727), other configurations (for example, the one shown in FIG. 6 of Japanese Patent Application Laid-Open No. 2013-164871), various out-selling types (so-called GG, G1, G2, GFF, GF2, GF1, G1F, etc.) and the like.
Examples of the touch panel according to the present disclosure include those described in paragraph 0229 of JP2017-120345A.

Hereinafter, the present invention will be described in more detail with reference to examples. The materials, amounts used, ratios, treatment contents, treatment procedures, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the gist of the present invention. Therefore, the scope of the present invention should not be construed as limiting by the examples shown below.

<Making a temporary support>
(Manufacturing Example 1)
A temporary support was prepared by the following method.

[Preparation of Particle-Containing Layer Forming Composition 1]
Each component was mixed with the formulation shown below to obtain a particle-containing layer forming composition 1. After preparing the particle-containing layer forming composition 1, the film is filtered through a 6 μm filter (F20, manufactured by Mare Filter Systems Co., Ltd.), and subsequently, a membrane is used using a 2x6 radial flow superphobic (manufactured by Polypore Co., Ltd.). I degassed.

-Acrylic polymer (AS-563A, manufactured by Daisel Finechem Co., Ltd., solid content 27.5% by mass) 167 parts-Nonion-based surfactant (Naroacty CL95, manufactured by Sanyo Kasei Kogyo Co., Ltd., solid content 100% by mass) 0.7 parts ・ Anionic surfactant (Lapisol A-90, manufactured by Nichiyu Co., Ltd., diluted with water to 1% by mass of solid content) 114.4 parts ・ Carnauba wax dispersion (Cerozole 524, Chukyo Oil & Fat Co., Ltd.) ), Solid content 30% by mass) 7 parts ・ Carbodiimide compound (Carbodilite V-02-L2, manufactured by Nisshinbo Co., Ltd., diluted with water to 10% by mass solid content) 20.9 parts ・ Matting agent (Snowtex XL, Made by Nissan Chemical Co., Ltd., solid content 40% by mass, average particle size 50 nm) 2.8 parts, water 690.2 parts

[Extrusion molding]
Pellets of polyethylene terephthalate using the citrate chelated organic titanium complex described in Japanese Patent No. 5575671 as a polymerization catalyst are dried to a water content of 50 ppm or less, and then charged into a hopper of a uniaxial kneading extruder having a diameter of 30 mm and 280. Melted at ° C and extruded. This melt was passed through a filter (pore diameter 3 μm) and then extruded from a die onto a cooling roll at 25 ° C. to obtain an unstretched film. The extruded melt was brought into close contact with the cooling roll by using an electrostatic application method.

[Stretching, coating]
The unstretched film extruded onto the cooling roll by the above method and solidified was sequentially biaxially stretched by the following method to obtain a temporary support having a polyester film having a thickness of 25 μm and a particle-containing layer having a thickness of 40 nm.

(A) Longitudinal stretching An unstretched film was passed between two pairs of nip rolls having different peripheral speeds and stretched in the longitudinal direction (conveying direction). The preheating temperature was 75 ° C., the stretching temperature was 90 ° C., the stretching ratio was 3.4 times, and the stretching speed was 1300% / sec.

(B) Coating The particle-containing layer forming composition 1 was coated on one side of the vertically stretched film with a bar coater so as to have a thickness of 40 nm after film formation.

(C) Transverse stretching The film subjected to the above longitudinal stretching and coating was laterally stretched under the following conditions using a tenter.
-Transverse stretching conditions-
Preheating temperature: 110 ° C
Stretching temperature: 120 ° C
Stretching ratio: 4.2 times Stretching speed: 50% / sec

[Heat fixation, heat relaxation]
Subsequently, the biaxially stretched film after the longitudinal stretching and the transverse stretching were completed was heat-fixed under the following conditions. Further, after heat fixing, the tenter width was reduced and heat was relaxed under the following conditions.
-Heat fixing conditions-
Heat fixing temperature: 227 ° C
Heat fixing time: 6 seconds-Heat relaxation conditions-
Heat relaxation temperature: 190 ° C
Heat relaxation rate: 4%

〔Winding〕
After heat fixing and heat relaxation, both ends were trimmed, extruded (knurled) at the ends with a width of 10 mm, and then wound at a tension of 40 kg / m. The width was 1.5 m and the winding length was 6300 m. The obtained film roll was used as a temporary support of Production Example 1.
The haze of the obtained temporary support was 0.2. The haze was measured as a total light haze using a haze meter (NDH2000 manufactured by Nippon Denshoku Kogyo Co., Ltd.).
The heat shrinkage rate due to heating at 150 ° C. for 30 minutes is 1.0% on the MD (Machine Direction) side and on the TD (Transverse Direction) side on the film surface. It was 0.2%.
The film thickness of the particle-containing layer was 40 nm as measured from a cross-sectional TEM photograph. The average particle size of the particles contained in the particle-containing layer was measured by the above method using an HT-7700 type transmission electron microscope (TEM) manufactured by Hitachi High-Technologies Corporation, and found to be 50 nm.

(Manufacturing Example 2)
A temporary support of Production Example 2 was obtained in the same manner as in Production Example 1 except that the stretch ratio of Production Example 1 was changed and the thickness of the polyester film after film formation was changed from 25 μm to 28 μm.

(Manufacturing Example 3)
Except for increasing the amount of the matting agent in the particle-containing layer forming composition 1 and adjusting the bar when applying the particle-containing layer forming composition 1 to change the thickness of the particle-containing layer after film formation from 40 nm to 50 nm. A temporary support of Production Example 3 was obtained in the same manner as in Production Example 1.

(Manufacturing Example 4)
A temporary support of Production Example 4 was obtained in the same manner as in Production Example 1 except that the stretch ratio of Production Example 1 was changed and the thickness of the polyester film after film formation was changed from 25 μm to 20 μm.

(Manufacturing Example 5)
A temporary support of Production Example 5 was obtained in the same manner as in Production Example 1 except that the stretch ratio of Production Example 1 was changed and the thickness of the polyester film after film formation was changed from 25 μm to 35 μm.

(Manufacturing Example 6)
A temporary support of Production Example 6 was obtained in the same manner as in Production Example 1 except that the stretch ratio of Production Example 1 was changed and the thickness of the polyester film after film formation was changed from 25 μm to 16 μm.

<Manufacturing of polymer>
In the following synthesis examples, the following abbreviations represent the following compounds, respectively.
St: Styrene (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MAA: Methacrylic acid (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
MMA: Methyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
BzMA: Benzyl methacrylate (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)
AA: Acrylic acid (manufactured by Tokyo Kasei Co., Ltd.)
PGMEA: Propylene glycol monomethyl ether acetate (manufactured by Showa Denko KK)
MEK: Methyl ethyl ketone (manufactured by Sankyo Chemical Co., Ltd.)
V-601: Dimethyl-2,2'-azobis (2-methylpropionate) (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)

<Synthesis of polymer A-1>
PGMEA (116.5 parts) was placed in a three-necked flask, and the temperature was raised to 90 ° C. in a nitrogen atmosphere. 90 parts of a solution containing St (52.0 parts), MMA (19.0 parts), MAA (29.0 parts), V-601 (4.0 parts), and PGMEA (116.5 parts). The solution was added dropwise to a three-necked flask solution maintained at ° C. ± 2 ° C. over 2 hours. After completion of the dropping, the mixture was stirred at 90 ° C. ± 2 ° C. for 2 hours to obtain polymer A-1 (solid content concentration 30.0%).

<Synthesis of polymer A-2>
The types of monomers and the like were changed as shown in Table 1 below, and other conditions were synthesized in the same manner as in the polymer A-1. The solid content concentration of the polymer A-2 was 30% by mass.
The unit of the amount of the monomer in Table 1 is mass%.

<Preparation of Photosensitive Resin Composition 1>
The following components were mixed to prepare the photosensitive resin composition 1. The unit of the amount of each component is a mass part.
Polymer A-1 (solid content concentration 30.0%): 21.87 parts B-2: LCV (Leuko Crystal Violet, manufactured by Yamada Chemical Industry Co., Ltd., dye that develops color by radicals): 0.053 parts C- 2: B-CIM (photoradical polymerization initiator, 2- (2-chlorophenyl) -4,5-diphenylimidazole dimer, manufactured by Hampford): 0.89 parts C-3: EAB-F (photoradical polymerization) Initiator (sensitizer), 4,4'-bis (diethylamino) benzophenone, manufactured by Tokyo Kasei Co., Ltd.): 0.05 parts D-1: NK ester BPE-500 (ethoxylated bisphenol A dimethacrylate, Shin-Nakamura) Chemical Industry Co., Ltd.): 4.85 parts D-2: Aronix M-270 (polypropylene glycol diacrylate, manufactured by Toa Synthetic Co., Ltd.): 0.51 parts Phenothiazine (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) : 0.025 part 1-Phenyl-3-pyrazolidone (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.): 0.001 part E-1 (Megafuck F552 (manufactured by DIC Co., Ltd.)): 0.02 part Methyl ethyl ketone (manufactured by DIC Co., Ltd.) Sankyo Chemical Co., Ltd.): 30.87 parts PGMEA (Showa Denko Co., Ltd.): 33.92 parts tetrahydrofuran (Mitsubishi Chemical Co., Ltd.): 6.93 parts

The prepared photosensitive resin composition 1 is applied to the temporary support prepared in Production Example 1 so as to have a width of 1.0 m and a thickness of 3.0 μm using a slit-shaped nozzle, and a drying zone at 80 ° C. is formed. It was passed over 40 seconds to obtain a photosensitive resin layer. The viscosity of the obtained photosensitive resin layer at 70 ° C. was measured and found to be 36000 Pa · s. Viscosity was measured by the method described above. As an apparatus, a rheometer DHR-2 manufactured by TA Instruments Japan Co., Ltd. was used.

<Preparation of Photosensitive Resin Composition 2>
The following components were mixed to prepare the photosensitive resin composition 1. The unit of the amount of each component is a mass part.
Polymer A-1 (solid content concentration 30.0%): 25.2 parts B-2: LCV (Leuco Crystal Violet, manufactured by Yamada Chemical Industries, Ltd., dye that develops color by radicals): 0.06 parts C- 2: B-CIM (photoradical polymerization initiator, 2- (2-chlorophenyl) -4,5-diphenylimidazole dimer, manufactured by Hampford): 1.03 parts C-3: EAB-F (photoradical polymerization) Initiator (sensitizer), 4,4'-bis (diethylamino) benzophenone, manufactured by Tokyo Kasei Co., Ltd.): 0.045 parts C-4 (N-phenylcarbamoylmethyl-N-carboxymethylaniline (Fujifilm sum) Kojunyaku Co., Ltd.)): 0.02 parts D-1: NK ester BPE-500 (ethoxyylated bisphenol A dimethacrylate, manufactured by Shin-Nakamura Chemical Industries, Ltd.): 5.61 parts D-2: Aronix M -270 (Polypropylene glycol diacrylate, manufactured by Toa Synthetic Co., Ltd.): 0.58 parts F-1 (Phenothiazine (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.)): 0.040 parts F-2 (CBT-1 (CBT-1) Johoku Kagaku Co., Ltd.): 0.015 parts 4-Hydroxymethyl-4-methyl-1-phenyl-3-pyrazolidone (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.): 0.002 parts E-1 (Megafuck) F552 (manufactured by DIC Co., Ltd.)): 0.048 parts Methyl ethyl ketone (manufactured by Sankyo Chemical Co., Ltd.): 43.8 parts PGMEA (manufactured by Showa Denko Co., Ltd.): 19.7 parts MFG (Nippon Embroidery Co., Ltd.) Made): 3.89 copies

The prepared photosensitive resin composition 2 is applied to the temporary support prepared in Production Example 1 so as to have a width of 1.0 m and a thickness of 2.0 μm using a slit-shaped nozzle, and a drying zone at 80 ° C. is formed. It was passed over 40 seconds to obtain a photosensitive resin layer. The viscosity of the obtained photosensitive resin layer at 70 ° C. was measured and found to be 37,000 Pa · s.

<Preparation of water-soluble resin composition 1>
The following components were mixed to prepare a water-soluble resin composition. The unit of the amount of each component is a mass part.
Ion-exchanged water: 38.12 parts Methanol (manufactured by Mitsubishi Gas Chemical Company, Inc.): 57.17 parts Clarepovar PVA-205 (polyvinyl alcohol, manufactured by Kuraray Co., Ltd.): 3.22 parts Polyvinylpyrrolidone K-30 (Japan) Catalyst Co., Ltd.): 1.49 parts Megafuck F-444 (fluorine-based surfactant, manufactured by DIC Co., Ltd.): 0.0015 parts

<Preparation of water-soluble resin composition 2>
The following components were mixed to prepare a water-soluble resin composition. The unit of the amount of each component is a mass part.
Ion-exchanged water: 38.12 parts Methanol (manufactured by Mitsubishi Gas Chemical Company, Inc.): 57.17 parts Clarepovar 4-88LA (polyvinyl alcohol, manufactured by Kuraray Co., Ltd.): 3.22 parts Polyvinylpyrrolidone K-30 (Japan) Catalyst Co., Ltd.): 1.49 parts Megafuck F-444 (fluorine-based surfactant, manufactured by DIC Co., Ltd.): 0.0035 parts

<Preparation of Thermoplastic Resin Compositions 1 to 7>
The following components were mixed by parts by mass shown in Table 2 below to prepare a thermoplastic resin composition.

In Table 2, the abbreviations represent the following compounds, respectively.
B-1: Compound with the structure shown below (dye that develops color with acid)

C-1: Compound having the structure shown below (photoacid generator, compound described in paragraph 0227 of JP2013-47765A, synthesized according to the method described in paragraph 0227).

C-2: A compound having the structure shown below (photoacid generator, synthesized according to the method described in paragraph 0210 of JP-A-2014-197155).

D-3: NK ester A-DCP (tricyclodecanedimethanol diacrylate, manufactured by Shin Nakamura Chemical Industry Co., Ltd.)
D-4: 8UX-015A (polyfunctional urethane acrylate compound, manufactured by Taisei Fine Chemicals Co., Ltd.)
D-5: Aronix TO-2349 (polyfunctional acrylate compound having a carboxy group, manufactured by Toagosei Co., Ltd.)
E-1: Mega Fvck F552 (manufactured by DIC Corporation)

The prepared thermoplastic resin composition 1 is applied to the temporary support prepared in Production Example 1 so as to have a width of 1.0 m and a thickness of 3.0 μm using a slit-shaped nozzle, and a drying zone at 80 ° C. is formed. It was passed over 40 seconds to obtain a thermoplastic resin layer 1. Thermoplastic resin layers 2 to 7 were obtained in the same manner as in the thermoplastic resin layer 1 except that the thermoplastic resin composition 1 was changed to the thermoplastic resin compositions 2 to 7. The dynamic viscoelasticity of the obtained thermoplastic resin layers 1 to 7 was measured by the same method as that of the photosensitive resin layer described above. The melt viscosity was measured by the method described above.

(Example 1)
<Manufacturing of photosensitive transfer member>
The temporary support produced in Production Example 1 is prepared.
Next, the thermoplastic composition 1 was applied to the surface of the temporary support on the side opposite to the particle-containing layer using a slit-shaped nozzle so that the coating width was 1.0 m and the thickness was 4 μm, and the temperature was 80 ° C. A thermoplastic resin layer was formed by passing through the drying zone of the above for 40 seconds.
Then, the water-soluble resin composition is applied onto the thermoplastic resin layer using a slit-shaped nozzle so that the coating width is 1.0 m and the thickness is 1.1 μm, and a drying zone at 80 ° C. is applied for 40 seconds. A water-soluble resin layer was formed by passing through the resin layer.
Further, the photosensitive resin composition 1 is applied onto the water-soluble resin layer so that the coating width is 1.0 m and the thickness is 3.0 μm using a slit-shaped nozzle, and a drying zone at 80 ° C. is 40. It was passed over a second to form a negative photosensitive resin layer.
Next, a PET film (manufactured by Toray Industries, Inc., Lumirror 16KS40) was pressure-bonded onto the negative-type photosensitive resin layer as a cover film to prepare a photosensitive transfer member, which was wound into a roll form.

<Resolution evaluation>
A copper layer having a thickness of 200 nm was provided on a polyethylene terephthalate (PET) film having a thickness of 100 μm by a sputtering method, and a PET substrate with a copper layer was prepared.
After unwinding the produced photosensitive transfer member, it was laminated on the PET substrate with a copper layer under laminating conditions of a roll temperature of 100 ° C., a linear pressure of 1.0 MPa, and a linear velocity of 4.0 m / min. After exposure with an ultra-high pressure mercury lamp via a line-and-space pattern mask (duty ratio 1: 1, line width 1 μm to 20 μm, gradually changing every 1 μm) without peeling the temporary support, the temporary support is peeled off. And developed. Development was carried out by shower development for 30 seconds using a 1.0% sodium carbonate aqueous solution at 25 ° C.
When a 20 μm line-and-space pattern was formed by the above method, the residue in the space portion was observed with a scanning electron microscope (SEM), and when exposed at an exposure amount such that the resist line width was 20 μm, the resist pattern was peeled off and peeled off. The minimum line width that can be resolved without residue was evaluated as the resolution. The higher the score, the better the resolution, preferably 3 or more.

5: Resolution is less than 5 μm 4: Resolution is 5 μm or more and less than 7 μm 3: Resolution is 7 μm or more and less than 9 μm 2: Resolution is 9 μm or more and less than 11 μm 1: Resolution is 11 μm or more

<Development speed evaluation>
After unwinding the produced photosensitive transfer member, it was laminated on the PET substrate with a copper layer under laminating conditions of a roll temperature of 100 ° C., a linear pressure of 1.0 MPa, and a linear velocity of 4.0 m / min. The temporary support was peeled off and shower-developed using a 1.0% sodium carbonate aqueous solution at 25 ° C. The time required for the photosensitive transfer member to completely dissolve was measured and evaluated. The higher the score, the better the development speed, preferably 3 or more.
Completely dissolved within 5:10 seconds 4: Completely dissolved within 10 seconds, but completely dissolved within 15 seconds 3: Completely dissolved within 15 seconds, but within 20 seconds Completely dissolved 2: It takes more than 20 seconds to completely dissolve, but it is completely dissolved within 30 seconds, but it cannot be completely dissolved in 1:30 seconds.

<Evaluation of laminateability at high speed>
After unwinding the produced photosensitive transfer member, it was laminated on the PET substrate with a copper layer under laminating conditions of a roll temperature of 90 ° C., a linear pressure of 1.0 MPa, and a linear velocity of 4.0 m / min.
This substrate was observed visually and with an optical microscope and evaluated as follows. The higher the score, the better the laminate property, and it is preferable that the score is 3 or more.
〔Evaluation criteria〕
5: No lami bubbles are seen on the PET substrate, and there is no problem with visual flatness.
4: Slight lami bubbles can be seen on the PET substrate, but there is no problem because the bubbles disappear when autoclaved under condition I (30 ° C, 0.5 MPa, 2 hours).
3: Slight lami bubbles are seen on the PET substrate, and the bubbles do not disappear even if the autoclave treatment is performed in the above treatment I, but the bubbles are formed when the autoclave treatment is performed under the condition II (50 ° C., 0.5 MPa, 2 hours). There is no problem because it disappears.
2: Lami bubbles are observed on the PET substrate, and the bubbles do not disappear even after autoclaving under the above condition II (50 ° C., 0.5 MPa, 2 hours).
1: Lami bubbles are observed on the entire surface of the PET substrate, and the bubbles do not disappear even after autoclaving under the above condition II (50 ° C., 0.5 MPa, 2 hours).
In addition, the Lami bubble means that the bubble is mixed between the photosensitive transfer member and the PET substrate with a copper layer.

(Examples 2 to 14 and Comparative Examples 1 to 6)
Example 2 in the same manner as in Example 1 except that the temporary support, the thermoplastic resin composition, the water-soluble resin composition, the photosensitive resin composition, and the thickness of each layer were changed as shown in Table 3. The photosensitive transfer members of No. 14 and Comparative Examples 1 to 6 were prepared and evaluated, respectively. The evaluation results are summarized in Table 3.

As shown in Table 3 above, it was found that the photosensitive transfer member having no thermoplastic resin layer was inferior in resolution and laminating property at high speed (Comparative Examples 1 and 6).
Further, it was found that the photosensitive transfer member having a photosensitive resin layer thickness of 5 μm or more was inferior in resolution (Comparative Examples 2 and 5).
Further, it was found that the photosensitive transfer member having a total thickness of the temporary support and the intermediate layer exceeding 35 μm was inferior in resolution (Comparative Examples 3 and 4).
On the other hand, the temporary support, the intermediate layer including at least the thermoplastic resin layer, and the photosensitive resin layer are provided in this order, the thickness of the photosensitive resin layer is less than 5 μm, and the temporary support and the intermediate layer It was found that the photosensitive transfer members having a total thickness of 35 μm or less are excellent in both resolution and high-speed lamination (Examples 1 to 14).

In particular, it was found that the photosensitive transfer member in which the glass transition temperature of the thermoplastic resin contained in the thermoplastic resin layer was 100 ° C. or lower was superior in resolution (Examples 1 and 5 to 6).
Further, it was found that the photosensitive transfer member having a viscosity of the thermoplastic resin layer at 70 ° C. lower than the viscosity of the photosensitive resin layer was further excellent in laminating property at high speed (Examples 1 and 5 to 6). ).
Further, it was found that the photosensitive transfer member having the haze of the temporary support of 0.5 or less had even better resolution (Example 1, Example 4 and Example 9).

(Example 101)
On a 100 μm thick PET substrate, ITO was formed into a film with a thickness of 150 nm by sputtering as a second conductive layer, and copper was formed into a film with a thickness of 200 nm as a conductive layer of the first layer by a vacuum deposition method. As a circuit forming substrate.
The photosensitive transfer member obtained in Example 1 was peeled off from the cover film on the copper layer and bonded to the substrate under the following laminating conditions to obtain a laminated body.
The obtained laminate was exposed to a contact pattern using a photomask provided with pattern A shown in FIG. 2, which had a structure in which conductive layer pads were connected in one direction without peeling off the temporary support. For the exposure, a high-pressure mercury lamp having i-line (365 nm) as the main exposure wavelength was used.
Then, the temporary support was peeled off, developed, and washed with water to obtain pattern A.
Next, the copper layer is etched with a copper etching solution (Cu-02 manufactured by Kanto Chemical Co., Ltd.), and then the ITO layer is etched with an ITO etching solution (ITO-02 manufactured by Kanto Chemical Co., Ltd.). , Copper and ITO were both drawn in pattern A to obtain a substrate.
Next, the photosensitive transfer member obtained in Example 1 was peeled off from the cover film and reattached on the remaining resist (cured negative photosensitive layer) under the following laminating conditions.
In the aligned state, the temporary support is not peeled off, and the pattern is exposed using a photomask provided with the pattern B shown in FIG. 3, after which the temporary support is peeled off, developed, and washed with water to obtain the pattern B. Obtained.
Next, the copper wiring was etched with Cu-02, and the remaining cured negative photosensitive layer was peeled off with a stripping solution (KP-301 manufactured by Kanto Chemical Co., Ltd.) to obtain a circuit wiring board.
When the obtained circuit wiring board was observed with a microscope, there was no peeling or chipping, and the pattern was clean.
<Laminating conditions>
・ Laminate roll temperature: 100 ℃
・ Linear pressure: 0.8MPa
-Line speed: 3.0 m / min.

10: Temporary support 12: Thermoplastic resin layer 14: Water-soluble resin layer 15: Intermediate layer 16: Photosensitive resin layer 18: Cover film 100: Photosensitive transfer member SL: Image part (exposure part)
G: Image section (exposure section)
DL: Alignment frame

Claims

A photosensitive transfer member having a temporary support, an intermediate layer, and a photosensitive resin layer in this order.
The intermediate layer has a thermoplastic resin layer and
A photosensitive transfer member having a thickness of the photosensitive resin layer of less than 5 μm and a total thickness of the temporary support and the intermediate layer of 35 μm or less.
The intermediate layer further has a water-soluble resin layer.
The photosensitive transfer member according to claim 1, wherein the water-soluble resin layer is located between the thermoplastic resin layer and the photosensitive resin layer.
The photosensitive transfer member according to claim 1 or 2, wherein the thickness of the thermoplastic resin layer is 10 μm or less.
The photosensitive according to any one of claims 1 to 3, wherein the ratio of the total thickness of the temporary support and the intermediate layer to the thickness of the photosensitive resin layer is 6.0 to 12.0. Sex transfer member.
The photosensitive transfer member according to any one of claims 1 to 4, wherein the glass transition temperature of the thermoplastic resin contained in the thermoplastic resin layer is 100 ° C. or less.
The photosensitive transfer member according to any one of claims 1 to 5, wherein the thermoplastic resin layer has a plasticizer.
The photosensitive transfer member according to any one of claims 1 to 6, wherein the viscosity of the thermoplastic resin layer is lower than the viscosity of the photosensitive resin layer at 70 ° C.
The photosensitive transfer member according to any one of claims 1 to 7, wherein the temporary support has a thickness of 25 μm or less.
The photosensitive transfer member according to any one of claims 1 to 8, wherein the haze of the temporary support is 0.5 or less.
The temporary support has a particle-containing layer on a surface opposite to the intermediate layer.
The photosensitive transfer member according to any one of claims 1 to 9, wherein the average particle size of the particles contained in the particle-containing layer is 30 to 600 nm.
The photosensitive transfer member according to any one of claims 1 to 10, wherein the photosensitive resin layer is a negative type photosensitive resin layer.
A step of bringing the surface of the photosensitive transfer member according to any one of claims 1 to 11 opposite to the intermediate layer of the photosensitive resin layer into contact with a substrate having a conductive layer and bonding them together.
The process of pattern exposure of the photosensitive resin layer and
A method for producing a resin pattern, which comprises a step of developing the exposed photosensitive resin layer to form a resin pattern, and the process of forming the resin pattern in this order.
A step of bringing the surface of the photosensitive transfer member according to any one of claims 1 to 11 opposite to the intermediate layer of the photosensitive resin layer into contact with a substrate having a conductive layer and bonding them together.
The process of pattern exposure of the photosensitive resin layer and
A step of developing the exposed photosensitive resin layer to form a resin pattern, and
A method for manufacturing a circuit wiring including a step of etching the substrate in a region where the resin pattern is not arranged, and a step of etching the substrate in this order.
A step of bringing the surface of the photosensitive transfer member according to any one of claims 1 to 11 opposite to the intermediate layer of the photosensitive resin layer into contact with a substrate having a conductive layer and bonding them together.
The process of pattern exposure of the photosensitive resin layer and
A step of developing the exposed photosensitive resin layer to form a resin pattern, and
A method for manufacturing a touch panel, comprising the step of etching the substrate in a region where the resin pattern is not arranged, and the step of etching the substrate in this order.