KR20220053615A - A photosensitive transfer member, a method for manufacturing a resin pattern, a method for manufacturing circuit wiring, and a method for manufacturing a touch panel - Google Patents

Abstract

An object of the present invention is to provide a photosensitive transfer member that is excellent in laminating properties and can suppress the occurrence of blocking at the time of peeling of a support body and a thermoplastic resin layer, a method for manufacturing a resin pattern, a method for manufacturing circuit wiring, and a touch panel. To provide a manufacturing method.
The photosensitive transfer member of the present invention is a photosensitive transfer member having a support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order, comprising:
The Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C, and the tensile modulus is 10 to 200 MPa,
The peeling strength of a support body and a thermoplastic resin layer is larger than the peeling strength of a thermoplastic resin layer and a photosensitive resin layer.

Description

A photosensitive transfer member, a method for manufacturing a resin pattern, a method for manufacturing circuit wiring, and a method for manufacturing a touch panel

The present invention relates to a photosensitive transfer member, a method for manufacturing a resin pattern, a method for manufacturing circuit wiring, and a method for manufacturing a touch panel.

In display devices (such as an organic electroluminescence (EL) display device and a liquid crystal display device) provided with a touch panel such as a capacitive input device, an electrode pattern corresponding to a sensor of a visual part, and a peripheral wiring part And conductive layer patterns, such as wiring of an extraction wiring part, are provided inside the touch panel.

In general, in the formation of a patterned layer, since the number of steps for obtaining a required pattern shape is small, a mask having a desired pattern with respect to a layer of the photosensitive resin composition provided on an arbitrary substrate using the photosensitive transfer member A method of developing after exposure through a light source is widely used.

For example, in Patent Document 1, a pattern forming material having a cushion layer containing a thermoplastic resin and a photosensitive layer in this order on a support is described ([Claim 1] and [Claim 5]), and this pattern forming material As a method of forming a pattern using , there is described a method of exposing the photosensitive layer after peeling the support ([Claim 15]).

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-178459

As a result of the present inventor examining the pattern forming method using the pattern forming material (photosensitive transfer member) described in patent document 1, although lamination property was favorable, from a viewpoint of productivity (for example, developability, etc.), it develops As a result of adopting the method of peeling the cushion layer (thermoplastic resin layer) together with the support (branch support) before performing Blocking occurred and it was clarified that there was a problem in which conveyance was impossible.

Therefore, the present invention provides a photosensitive transfer member that is excellent in laminating properties and can suppress the occurrence of blocking at the time of peeling of a support body and a thermoplastic resin layer, a method for manufacturing a resin pattern, a method for manufacturing circuit wiring, and a touch panel. An object is to provide a manufacturing method.

As a result of intensive studies to achieve the above object, the present inventors have specified the Vicat softening point and tensile modulus of the thermoplastic resin layer in the photosensitive transfer member having a branch support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order. By adjusting to the range of and making the peeling strength of the support body and the thermoplastic resin layer larger than the peeling strength of the thermoplastic resin layer and the photosensitive resin layer, the lamination property is excellent, and blocking of the support body and the thermoplastic resin layer is It found that generation|occurrence|production could be suppressed, and completed this invention.

That is, this inventor discovered that the said subject could be achieved with the following structures.

[One]

A photosensitive transfer member having a support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order, comprising:

The Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C, and the tensile modulus is 10 to 200 MPa,

The photosensitive transfer member, wherein the peel strength between the supporting body and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer.

[2]

The photosensitive transfer member according to [1], wherein the thickness of the thermoplastic resin layer is more than 2 µm and less than 20 µm.

[3]

The photosensitive transfer member according to [1] or [2], wherein the support has a thickness of 6 to 50 µm.

[4]

The photosensitive transfer member according to any one of [1] to [3], wherein the haze of the branch support is 0.5% or less.

[5]

The photosensitive transfer member according to any one of [1] to [4], wherein a haze of the laminate of the supporting body and the thermoplastic resin layer is 0.9% or less.

[6]

The photosensitive transfer member according to any one of [1] to [5], wherein the thermoplastic resin layer has a tensile modulus of elasticity of 50 to 200 MPa.

[7]

Among the peel strengths between each layer of the support body, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, the peel strength between the support body and the thermoplastic resin layer is the strongest, and the peel strength between the photosensitive resin layer and the cover film is the weakest, [ The photosensitive transfer member according to any one of 1] to [6].

[8]

A method for producing a resin pattern in which a resin pattern is produced in a roll-to-roll manner using the photosensitive transfer member according to any one of [1] to [7], the method comprising:

a peeling step of peeling the cover film from the photosensitive transfer member;

The bonding process of making the photosensitive resin layer in the photosensitive transfer member which peeled the cover film contact with the board|substrate which has a conductive layer, and bonding together;

an exposure step of pattern exposing the photosensitive resin layer;

Developing the exposed photosensitive resin layer to form a resin pattern in this order,

The manufacturing method of the resin pattern which has a process of simultaneously peeling a support body and a thermoplastic resin layer from a photosensitive transfer member between a bonding process and an exposure process, or between an exposure process and an image development process.

[9]

A method for manufacturing circuit wiring in which the circuit wiring is produced by a roll-to-roll using the photosensitive transfer member according to any one of [1] to [7], the method comprising:

a peeling step of peeling the cover film from the photosensitive transfer member;

The bonding process of making the photosensitive resin layer in the photosensitive transfer member which peeled the cover film contact with the board|substrate which has a conductive layer, and bonding together;

an exposure step of pattern exposing the photosensitive resin layer;

A developing process of developing the exposed photosensitive resin layer to form a resin pattern;

A step of etching the conductive layer in the region where the resin pattern is not arranged, in this order,

The manufacturing method of circuit wiring which has a process of simultaneously peeling a support body and a thermoplastic resin layer from a photosensitive transfer member between a bonding process and an exposure process, or between an exposure process and an image development process.

[10]

A method for manufacturing a touch panel in which a touch panel is manufactured by a roll-to-roll using the photosensitive transfer member according to any one of [1] to [7], the method comprising:

a peeling step of peeling the cover film from the photosensitive transfer member;

The bonding process of making the photosensitive resin layer in the photosensitive transfer member which peeled the cover film contact with the board|substrate which has a conductive layer, and bonding together;

an exposure step of pattern exposing the photosensitive resin layer;

A developing process of developing the exposed photosensitive resin layer to form a resin pattern;

A step of etching the conductive layer in the region where the resin pattern is not arranged, in this order,

The manufacturing method of the touchscreen which has the process of peeling a support body and a thermoplastic resin layer simultaneously from a photosensitive transfer member between a bonding process and an exposure process, or between an exposure process and an image development process.

ADVANTAGE OF THE INVENTION According to this invention, the photosensitive transfer member which is excellent in lamination property and can suppress generation|occurrence|production of blocking at the time of peeling of a support body and a thermoplastic resin layer, the manufacturing method of a resin pattern, manufacturing method of a circuit wiring, and manufacturing of a touch panel method can be provided.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic sectional drawing which shows an example of embodiment of the photosensitive transfer member of this invention.
Fig. 2 is a schematic diagram showing the pattern A.
3 : is a schematic diagram which shows the pattern B.

Hereinafter, the present invention will be described in detail.

Although description of the structural requirements described below may be made based on the typical embodiment of this invention, this invention is not limited to such an embodiment.

In addition, in this specification, the numerical range shown using "-" means the range which includes the numerical value described before and after "-" as a lower limit and an upper limit.

In addition, in this specification, each component may use the substance corresponding to each component individually by 1 type, and may use 2 or more types together. Here, when using together 2 or more types of substances with respect to each component, content with respect to the component refers to content of the sum total of the substances used together, unless there is a special explanation.

In addition, in this specification, "(meth)acrylic acid" represents either or both of acrylic acid and methacrylic acid, and "(meth)acrylate" represents any one or both of acrylate and methacrylate. .

In addition, in this specification, unless otherwise indicated, "exposure" includes not only exposure using light but also drawing using particle beams, such as an electron beam and an ion beam. As light used for exposure, active rays (active energy rays), such as a bright-line spectrum of a mercury vapor lamp, and the deep ultraviolet, extreme ultraviolet (EUV light), X-ray, and electron beam, generally represented by an excimer laser are mentioned generally.

[Photosensitive Transfer Member]

The photosensitive transfer member of the present invention is a photosensitive transfer member having a support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order.

Moreover, in the photosensitive transfer member of this invention, the Vicat softening point of a thermoplastic resin layer is 50-120 degreeC, and its tensile elasticity modulus is 10-200 MPa.

Further, in the photosensitive transfer member of the present invention, the peel strength between the supporting body and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer.

Here, "the peel strength of the branch support and the thermoplastic resin layer is greater than the peel strength of the thermoplastic resin layer and the photosensitive resin layer" means that, in the method for producing a resin pattern using the photosensitive transfer material of the present invention, etc., When peeling a member, it is a prescription|regulation which intended that a thermoplastic resin layer also peels with a branch body.

In addition, the relationship between the peel strength and the small size was determined by affixing an adhesive tape on both surfaces of a test piece cut out from the photosensitive transfer material (5 cm width × 10 cm length), and fixing the non-supporting member side (cover film side) to a horizontal pedestal, the supporting body side After peeling in the horizontal direction, it can be confirmed by observing the peeling interface with an optical microscope or the like.

The photosensitive transfer member of the present invention having such a structure is excellent in laminating properties and can suppress the occurrence of blocking during peeling of the supporting body and the thermoplastic resin layer.

Although this is not clear in detail, this inventor guesses as follows.

That is, since the Vicat softening point of the thermoplastic resin layer is 50 to 120°C, when the photosensitive transfer member is laminated to the substrate, the photosensitive resin layer adjacent to the thermoplastic resin layer can follow the unevenness of the substrate. I think the sex has improved.

Moreover, when the peeling strength of a support body and a thermoplastic resin layer is larger than the peeling strength of a thermoplastic resin layer and a photosensitive resin layer, and the tensile modulus of elasticity of a thermoplastic resin layer is 10-200 MPa, a support body and a thermoplastic resin layer are peeled simultaneously. Since the independence of a thermoplastic resin layer became high at the time of carrying out, it is thought that generation|occurrence|production of blocking with a support body was suppressed.

[branch support]

The support body which the photosensitive transfer member of this invention has is a support body which supports the laminated body containing the photosensitive resin layer or the photosensitive resin layer, and can peel further.

When a support body carries out pattern exposure of the photosensitive resin layer, it is preferable to have light transmittance from a viewpoint from which exposure of the photosensitive resin layer via a branch support body becomes possible.

Here, "having light transmittance" means that the transmittance of light of a wavelength used for pattern exposure is 50% or more.

In addition, from the viewpoint of improving the exposure sensitivity of the photosensitive resin layer, the support body preferably has a transmittance of light of a wavelength (preferably a wavelength of 365 nm) used for pattern exposure of 60% or more, and more preferably 70% or more.

Moreover, as a measuring method of transmittance|permeability, the method of measuring using Otsuka Electronics Co., Ltd. product MCPD Series is mentioned.

As a support body, a resin film, paper, etc. are mentioned, for example, From a viewpoint, such as intensity|strength and flexibility, a resin film is preferable.

Specific examples of the resin film include a polyethylene terephthalate (PET) film, a cellulose triacetate film, a polystyrene film, a polycarbonate film, a polyethylene film, a polypropylene film, and a polyimide film. Among them, a biaxially stretched polyethylene terephthalate film is particularly preferable.

Moreover, single layer may be sufficient as a resin film, and the laminated body of two or more layers may be sufficient as it.

The thickness of the supporting body is not particularly limited, and may be selected according to the material from the viewpoint of strength as a support, flexibility required for bonding with a substrate for circuit wiring formation, and light transmittance required in the first exposure step. .

It is preferable that it is 5-300 micrometers, and, as for the thickness of a branch support body, it is more preferable that it is 6-50 micrometers from the reason excellent in handling easiness.

Here, the thickness of a support body is the cross-sectional observation image of the thickness direction of a support body, WHEREIN: Let the value obtained by calculating|requiring the arithmetic mean value of the thickness of the support body measured at 10 randomly selected places be the thickness of a support body. The cross-sectional observation image of the thickness direction of a support body can be obtained using a scanning electron microscope (SEM). In addition, it can measure by the method similar to the above also about the thickness of the thermoplastic resin layer and photosensitive resin layer mentioned later.

Since the resolution of the photosensitive transfer member becomes favorable, it is preferable that it is 0.5 % or less, and, as for the haze of a support body, it is more preferable that it is 0.4 or less.

Moreover, it is preferable that it is 0.05 % or more from a viewpoint of the transport property at the time of carrying out manufacture, and, as for the haze of a support body, it is more preferable that it is 0.1 % or more.

Here, a haze is a total light haze (%) based on JISK7136:2000, and can measure as an electric haze using a haze meter (device name: HZ-2, Suga Shikenki Co., Ltd. product).

In this invention, from a viewpoint of improving the adhesive force with the thermoplastic resin layer mentioned later, on the surface of a support body, For example, surface treatment, such as a glow discharge treatment, a corona treatment, an ultraviolet irradiation treatment; You may perform an undercoat process of polyvinylidene chloride resin, styrene butadiene rubber, gelatin, etc.

In addition, in this invention, when using the support body which gave the surface treatment or undercoating, regulations, such as peeling strength, thickness, a haze, make object the support body after a process.

Moreover, it is preferable that the film used as a support body does not have deformation|transformation, such as a wrinkle, a flaw, etc.

It is preferable that there are few microparticles|fine-particles, a foreign material, and the number of defects contained in the pattern formation at the time of the pattern exposure via a support body, and a viewpoint of transparency of a support body. The number of microparticles, foreign substances or defects having a diameter of 1 μm or more is preferably 50 pieces/10 mm ² or less, more preferably 10 pieces/10 mm ² or less, still more preferably 3 pieces/10 mm ² or less, and 0 pieces/10 mm ² or less. It is particularly preferred.

As a preferable aspect of a branch body, Paragraph 0017 - Paragraph 0018 of Unexamined-Japanese-Patent No. 2014-085643 - Paragraph 0019 of Unexamined-Japanese-Patent No. 2016-027363 Paragraph 0019 - 0026 of Unexamined-Japanese-Patent No. 2012/081680 Paragraph 0041 - 0057, Paragraphs 0029 to 0040 of International Publication No. 2018/179370 are described, and the content of these publications is incorporated herein by reference.

[Thermoplastic resin layer]

The thermoplastic resin layer of the photosensitive transfer member of the present invention is a thermoplastic resin layer having a Vicat softening point of 50 to 120°C and a tensile modulus of 10 to 200 MPa.

Here, the Vicat softening point means the value measured by the following procedure.

(1) Specimen

A test piece in which a thermoplastic resin layer having a thickness of 3 to 4 mm is formed on a PET film having a thickness of 10 to 100 µm is used. In addition, the formation of the thermoplastic resin layer in a test piece may be any of a coating method, a melt-extrusion method, and the method of thermally laminating a thin film several times to make it into a thick film.

(2) measurement

It is measured by a method according to the Vicker Vicat method (a polymer softening point measurement method according to ASTMD 1525, the American material test method).

In addition, tensile elastic modulus means the value measured by the following procedure.

(1) Specimen

A test piece in which a thermoplastic resin layer having a thickness of 3 to 4 mm is formed on a PET film having a thickness of 10 to 100 µm is used. In addition, the formation of the thermoplastic resin layer in a test piece may be any of a coating method, a melt-extrusion method, and the method of thermally laminating a thin film several times to make it into a thick film.

(2) measurement

It is measured by a method according to the tensile test according to ASTMD 882 of the American material test method ASTMD.

In this invention, it is preferable that the Vicat softening point of a thermoplastic resin layer is 70-100 degreeC from the reason that lamination property becomes more favorable.

Moreover, in this invention, since generation|occurrence|production of blocking can be suppressed more at the time of peeling of a support body and a thermoplastic resin layer, it is preferable that the tensile elasticity modulus of a thermoplastic resin layer is 50-200 MPa.

<Thermoplastic resin>

It is preferable that a thermoplastic resin layer has a thermoplastic resin.

As such a thermoplastic resin, specifically, for example,

Polyolefins, such as polyethylene and a polypropylene;

Ethylene copolymers, such as a copolymer of ethylene and vinyl acetate, and its saponified product;

vinyl chloride copolymers such as copolymers of ethylene and acrylic acid esters and their saponified products, polyvinyl chloride, and vinyl chloride and vinyl acetate copolymers and saponified products;

styrene copolymers such as polyvinylidene chloride, vinylidene chloride copolymer, polystyrene, and copolymers of styrene and (meth)acrylic acid ester and saponified products thereof;

vinyltoluene copolymers such as polyvinyltoluene, a copolymer of vinyltoluene and (meth)acrylic acid ester, and a saponified product thereof;

(meth)acrylic acid ester copolymers, such as poly(meth)acrylic acid ester and a copolymer of (meth)acrylic acid butyl and vinyl acetate;

polyamide resins such as vinyl acetate copolymer nylon, copolymer nylon, N-alkoxymethylated nylon, and N-dimethylaminated nylon;

and the like.

Among these, a polyolefin, an ethylene copolymer, or a vinyl chloride copolymer is preferable.

In the present invention, the dissolution characteristics of the above-described thermoplastic resin may be sufficiently matched to the dissolution characteristics of the photosensitive resin layer to be described later, and may have a dissolution property soluble in a solvent in which the photosensitive resin layer to be described later is not dissolved at all.

The thermoplastic resin layer may contain a thermoplastic resin individually by 1 type, and may contain 2 or more types.

The content of the thermoplastic resin is preferably 10% by mass or more and 99% by mass or less, more preferably 20% by mass or more and 90% by mass or less, with respect to the total mass of the thermoplastic resin layer, from the viewpoint of better laminating properties, It is more preferable that they are 30 mass % or more and 80 mass % or less.

<Plasticizer>

The thermoplastic resin layer may contain the plasticizer compatible with the thermoplastic resin mentioned above from a viewpoint of adjusting a Vicat softening point. For example, even when a thermoplastic resin having a Vicat softening point of 120°C or higher is used, a plasticizer compatible with the thermoplastic resin can be added to adjust the Vicat softening point of the thermoplastic resin layer to 50°C to 120°C.

The plasticizer is not particularly limited as long as it is a compound that is compatible with the thermoplastic resin and expresses plasticity. From the viewpoint of imparting plasticity, the plasticizer preferably has an alkyleneoxy group in the molecule, and more preferably a polyalkylene glycol compound. . As for the alkyleneoxy group contained in a plasticizer, it is more preferable that it is a polyethyleneoxy structure or a polypropyleneoxy structure.

The thermoplastic resin layer may contain a plasticizer individually by 1 type, and may contain 2 or more types.

When the thermoplastic resin layer contains a plasticizer, the content of the plasticizer is preferably from 1% by mass to 70% by mass based on the total mass of the thermoplastic resin layer from the viewpoint of more excellent laminating properties at high speed of the photosensitive transfer member. And, it is more preferable that they are 5 mass % - 50 mass %.

<Other ingredients>

In the thermoplastic resin layer, from the viewpoint of controlling the adhesion with the above-mentioned support body, it is possible to add various polymers or supercooling substances, adhesion improvers and mold release agents in a range where the actual softening point does not exceed 80 ° C.

Moreover, an organic or inorganic filler can also be added from a viewpoint of more preventing generation|occurrence|production of the blocking with the support body mentioned above.

Moreover, you may have other components, such as an acid-reactive dye or a base-reactive dye (it abbreviates to "dye B" hereafter), a photo-acid generator or photobase generator, surfactant, and a sensitizer.

(Pigment B)

It is preferable that a thermoplastic resin layer has an acid-reactive dye or a base-reactive dye (dye B). The dye B represents a dye whose maximum absorption wavelength changes with an acid or a base. The dye B preferably has a maximum absorption wavelength of 450 nm or more in a wavelength range of 400 nm to 780 nm at the time of color development.

Here, the expression "the maximum absorption wavelength of a dye changes with an acid or a base" means that the dye in the color development state is decolorized by an acid or base, the dye in the color loss state develops color by the acid or base, It may refer to any aspect of the aspect in which the pigment|dye in a color development state changes to the color development state of another color with an acid or a base.

From the viewpoint of visibility and resolution of the exposed portion and the non-exposed portion, the dye B is preferably a dye whose maximum absorption wavelength changes with an acid, and the dye B is a dye whose maximum absorption wavelength changes with an acid, Moreover, the aspect which uses together the photo-acid generator mentioned later is especially preferable.

As an example of the color development mechanism of the dye B in the present disclosure, a photo-acid generator or a photo base generator is added to the thermoplastic resin layer, and after exposure, an acid or base generated from the photo-acid generator, etc., an acid-reactive dye; Or the aspect etc. which a base-reactive dye (for example, leuco dye) develops color are mentioned.

The measurement method of the maximum absorption wavelength is in an atmospheric atmosphere, using a spectrophotometer (device name: UV3100, manufactured by Shimadzu Corporation) at 25° C., and measuring the transmission spectrum in the range of 400 nm to 780 nm, and measuring the light intensity It is assumed that the minimum wavelength (maximum absorption wavelength) is measured.

Examples of the dye B include a leuco compound, a diarylmethane dye, an oxazine dye, a xanthene dye, an iminonaphthoquinone dye, an azomethine dye, an anthraquinone dye, etc., and From a viewpoint of the visibility of an unexposed part, a leuco compound is preferable.

About the preferable aspect of the pigment|dye B, the thing similar to the specific latent pigment|dye of Paragraph 0023 of International Publication No. 2019/022089 - Paragraph 0039 is mentioned.

Specific examples of the pigment B include brilliant green, ethyl violet, methyl green, crystal violet, basic fuchsin, methyl violet 2B, quinaldine red, rose bengal, methanyl yellow, thymolsulfophthalein, xylenol blue, methyl orange, Paramethyl Red, Congo Red, Benzofurpurine 4B, α-Naphthyl Red, Nile Blue 2B, Nile Blue A, Methyl Violet, Malachite Green, Parafuxine, Victoria Pure Blue-Naphthalenesulfonate, Victoria Pure Blue BOH (Hodogaya) Made by Kagaku Kogyo Co., Ltd.), Oil Blue #603 (Orient Chemical Co., Ltd.), Oil Pink #312 (Orient Chemical Co., Ltd.), Oil Red 5B (Orient Chemical Co., Ltd.) ), Oil Scarlet #308 (Orient Chemical Co., Ltd.), Oil Red OG (Orient Chemical Co., Ltd.), Oil Red RR (Orient Chemical Co., Ltd.), Oil Green # 502 (manufactured by Orient Chemical Co., Ltd.), Spyron Red BEH Special (manufactured by Hodogaya Chemical Co., Ltd.), m-cresol purple, cresol red, rhodamine B, rhodamine 6G, sulforodamine B, Oramine, 4-p-diethylaminophenyliminonaphthoquinone, 2-carboxyanilino-4-p-diethylaminophenyliminonaphthoquinone, 2-carboxystearylamino-4-p-N,N-bis ( Hydroxyethyl) amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4-p-diethylaminophenylimino-5-pyrazolone, 1-β-naphthyl-4-p-diethylamino Dyes such as phenylimino-5-pyrazolone, and leuco compounds such as p,p',p''-hexamethyltriaminotriphenylmethane (leuco crystal violet) and Pergascript Blue SRB (manufactured by Ciba Geigs) can

The dye B may be used individually by 1 type, and may use 2 or more types.

When the thermoplastic resin layer contains the dye B, it is preferable that content of the dye B is 0.01 mass % or more with respect to the total mass of a thermoplastic resin layer from a viewpoint of the visibility of an exposed part and a non-exposed part, 0.02 mass % - 6 It is more preferable that it is mass %.

(photoacid generator or photobase generator)

Since the thermoplastic resin layer improves the visibility of an exposed part and a non-exposed part, it is preferable to use together with the pigment|dye B, and to contain a photo-acid generator or a photobase generator. A more preferable aspect is an aspect containing an acid-reactive dye and a photo-acid generator.

The photoacid generator or photobase generator used in the present disclosure is a compound capable of generating an acid or a base by irradiation with actinic rays such as ultraviolet rays, far ultraviolet rays, X-rays, or electron beams.

As the photoacid generator or photobase generator used in the present disclosure, a compound that responds to actinic light having a wavelength of 300 nm or more, preferably 300 nm to 450 nm to generate an acid or a base is preferable, but its chemical structure is not limited. does not In addition, even for photoacid generators or photobase generators that do not directly respond to actinic rays having a wavelength of 300 nm or more, if it is a compound that responds to actinic rays having a wavelength of 300 nm or more and generates an acid or a base by using in combination with a sensitizer, it is combined with a sensitizer Therefore, it can be preferably used.

As a photo-acid generator, an ionic photo-acid generator and a nonionic photo-acid generator are mentioned.

As an example of an ionic photo-acid generator, onium salt compounds, such as diaryl iodonium salts and triaryl sulfonium salts, quaternary ammonium salts, etc. are mentioned. Among these, onium salt compounds are preferable, and triarylsulfonium salts and diaryliodonium salts are particularly preferable.

As an ionic photo-acid generator, the ionic photo-acid generator of Paragraph 0114 of Unexamined-Japanese-Patent No. 2014-085643 - Paragraph 0133 can also be used preferably.

Examples of the nonionic photoacid generator include trichloromethyl-s-triazines, diazomethane compounds, imide sulfonate compounds, and oxime sulfonate compounds. As a specific example of trichloromethyl-s-triazines, a diazomethane compound, and an imide sulfonate compound, the compound of Paragraph 0083 - Paragraph 0088 of Unexamined-Japanese-Patent No. 2011-221494 can be illustrated.

Among these, it is preferable that a photo-acid generator is an oxime sulfonate compound from a viewpoint of a sensitivity, resolution, and adhesiveness.

As an oxime sulfonate compound, the thing of Paragraph 0084 of International Publication No. 2018/179640 - Paragraph 0088 can be used suitably.

A thermoplastic resin layer may use a photo-acid generator or a photobase generator individually by 1 type, and may use 2 or more types.

(Surfactants)

It is preferable that a thermoplastic resin layer contains surfactant from a viewpoint of thickness uniformity.

As surfactant, anionic, cationic, nonionic (nonionic), and amphoteric surfactant are mentioned, for example. Preferred surfactants are nonionic surfactants.

Examples of the nonionic surfactant include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkylphenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone surfactants, and fluorine surfactants. Surfactants can be used preferably.

As surfactant, Paragraph 0120 - Paragraph 0125 of International Publication No. 2018/179640, Paragraph 0017 of Unexamined-Japanese-Patent No. 4502784, Paragraph 0060 - Paragraph 0071 of Unexamined-Japanese-Patent No. 2009-237362 are surfactant, for example. is available.

Moreover, as a commercial item of surfactant, Megapac F-552 or F-554 (above, DIC Co., Ltd. product) can be used, for example.

Further, as an aspect of the surfactant, PFOA (perfluorooctanoic acid) or PFOS (perfluorooctanesulfonic acid) instead of a compound having a linear perfluoroalkyl group having 7 or more carbon atoms from the viewpoint of environmental suitability It is also preferable to use a surfactant using an alternative material of

When the thermoplastic resin layer contains a surfactant, the content of the surfactant is preferably 0.001% by mass to 10% by mass, more preferably 0.01% by mass to 3% by mass relative to the total mass of the thermoplastic resin layer. .

A thermoplastic resin layer may use surfactant individually by 1 type, and may use 2 or more types.

Moreover, you may contain other additives other than what was mentioned above in a thermoplastic resin layer. There is no restriction|limiting in particular as another additive, A well-known additive can be used.

In addition, about the preferable aspect of a thermoplastic resin layer, Paragraph 0189 of Unexamined-Japanese-Patent No. 2014-085643 - Paragraph 0193 can also be referred.

It is preferable that the thickness of a thermoplastic resin layer is 1 micrometer or more from the reason that lamination property becomes more favorable. Moreover, about an upper limit, although there is no limit in particular in performance, it is preferable that it is 100 micrometers or less from manufacturing aptitude, and it is more preferable that it is 50 micrometers or less.

In this invention, it is preferable that the thickness of a thermoplastic resin layer is more than 2 micrometers and less than 20 micrometers from the reason that lamination property becomes more favorable and/or the reason that pattern resolution becomes more favorable.

In the present invention, the thermoplastic resin layer is preferably optically transparent.

In addition, from the reason that high-resolution image formation is possible even when exposing through the above-mentioned support body and thermoplastic resin layer, the haze measured in the laminated state of the above-described branch support body and the thermoplastic resin layer is 0.9% It is preferable that it is less than or equal to, and it is more preferable that it is 0.8 % or less.

Here, a haze is a total light haze (%) based on JISK7136:2000, and can measure as an electric haze using a haze meter (device name: HZ-2, Suga Shikenki Co., Ltd. product).

[Photosensitive resin layer]

The photosensitive transfer member of the present invention has a photosensitive resin layer.

In this invention, it is preferable that the photosensitive resin layer directly contact|connects the above-mentioned thermoplastic resin layer, and is provided. That is, it is preferable that the photosensitive transfer member of the present invention does not include another layer (eg, a water-soluble resin layer) between the thermoplastic resin layer and the photosensitive resin layer of the present invention.

The photosensitive resin layer does not have a restriction|limiting in particular, Although a well-known photosensitive resin layer can be used, It is preferable that it is a negative photosensitive resin layer at the point which is more excellent in lamination property in high speed.

Here, a negative photosensitive resin layer means the photosensitive resin layer in which the solubility with respect to a developing solution falls by exposure.

It is preferable that the photosensitive resin layer has a polymeric compound, the polymer which has an acidic radical, and a photoinitiator from a viewpoint of pattern formation.

As a photosensitive resin layer, you may use the photosensitive resin layer of Unexamined-Japanese-Patent No. 2016-224162, for example.

<Polymerizable compound>

It is preferable that the photosensitive resin layer contains a polymeric compound.

A polymeric compound is a component which contributes to the photosensitivity (namely, photocurability) of a negative photosensitive resin layer, and the intensity|strength of a cured film.

As a polymeric compound, an ethylenically unsaturated compound is preferable, and it is more preferable that it is a bifunctional or more than functional ethylenically unsaturated compound.

Here, the ethylenically unsaturated compound is a compound having one or more ethylenically unsaturated groups, and the bifunctional or higher ethylenically unsaturated compound means a compound having two or more ethylenically unsaturated groups in one molecule.

As an ethylenically unsaturated group, a (meth)acryloyl group is more preferable.

As an ethylenically unsaturated compound, a (meth)acrylate compound is preferable.

There is no restriction|limiting in particular as a bifunctional ethylenically unsaturated compound, It can select suitably from well-known compounds. Specifically, tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin-Nakamura Chemical Co., Ltd.), tricyclodecane dimethanol dimethacrylate (DCP, Shin-Nakamura Chemical Co., Ltd.) product), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.), 1,6-hexanediol diacrylate (A-HD-N, Shin-Nakamura Chemical High School Co., Ltd.) etc. are mentioned.

Moreover, as a bifunctional ethylenically unsaturated compound, the bifunctional ethylenically unsaturated compound which has a bisphenol structure is also used suitably.

As a bifunctional ethylenically unsaturated compound which has a bisphenol structure, the compound of Paragraph 0072 - Paragraph 0080 of Unexamined-Japanese-Patent No. 2016-224162 is mentioned.

Specific examples thereof include alkylene oxide-modified bisphenol A di(meth)acrylate, and 2,2-bis(4-(methacryloxydiethoxy)phenyl)propane, 2,2-bis(4). -(methacryloxyethoxypropoxy)phenyl)propane and bisphenol A dimethacrylate of polyethylene glycol (BPE-500, Shin-Nakamura Chemical Co., Ltd.) Note) agent) etc. are mentioned preferably.

There is no restriction|limiting in particular as a trifunctional or more than trifunctional ethylenically unsaturated compound, It can select suitably from well-known compounds. For example, dipentaerythritol (tri / tetra / penta / hexa) (meth) acrylate, pentaerythritol (tri / tetra) (meth) acrylate, trimethylol propane tri (meth) acrylate, di The (meth)acrylate compound of trimethylol propane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, glycerol tri(meth)acrylate skeleton, etc. are mentioned.

Here, "(tri/tetra/penta/hexa)(meth)acrylate" refers to tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate, and hexa(meth)acrylate. It is a concept that includes, and "(tri/tetra)(meth)acrylate" is a concept that includes tri(meth)acrylate and tetra(meth)acrylate.

Examples of the ethylenically unsaturated compound include caprolactone-modified (meth)acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., A-9300-1CL manufactured by Shin-Nakamura Chemical Co., Ltd.), alkyl Lenoxide-modified (meth)acrylate compound (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM-35E, A-9300 manufactured by Shin-Nakamura Chemical Co., Ltd., EBECRYL (registered trademark) manufactured by Daicel Allnex Co., Ltd. 135, etc.), ethoxylated glycerin triacrylate (Shin-Nakamura Chemical Co., Ltd. A-GLY-9E, etc.), Aronix (registered trademark) TO-2349 (manufactured by Toagosei Co., Ltd.), Aronix M- 520 (manufactured by Toagosei Co., Ltd.), Aronix M-270 (manufactured by Toagosei Co., Ltd.), or Aronix M-510 (manufactured by Toagosei Co., Ltd.), and the like.

As the ethylenically unsaturated compound, a urethane (meth) acrylate compound (preferably a trifunctional or higher urethane (meth) acrylate compound) can also be used, for example, 8UX-015A (Taise Fine Chemical ( Co., Ltd.), UA-32P (made by Shin-Nakamura Chemical Co., Ltd.), UA-1100H (made by Shin-Nakamura Chemical Co., Ltd.), etc. are mentioned.

Moreover, as an ethylenically unsaturated compound, you may use the polymeric compound which has an acidic radical of Paragraph 0025 - Paragraph 0030 of Unexamined-Japanese-Patent No. 2004-239942.

As a weight average molecular weight (Mw) of the polymeric compound used for this indication, 200-3,000 are preferable, 280-2,200 are more preferable, 300-2,200 are still more preferable.

A polymeric compound may be used individually by 1 type, and may use 2 or more types together.

When the photosensitive resin layer contains a polymerizable compound, the content of the polymerizable compound is preferably 10 mass% to 70 mass%, more preferably 20 mass% to 60 mass%, with respect to the total mass of the photosensitive resin layer, , 20 mass % - 50 mass % are more preferable.

<Polymer having an acid group>

It is preferable that the photosensitive resin layer contains the polymer which has an acidic radical.

As for the preferable aspect of the polymer which has an acidic radical contained in the photosensitive resin layer, the thing similar to the polymer which has an acidic radical illustrated as a thermoplastic resin which the above-mentioned thermoplastic resin layer has is mentioned.

The photosensitive resin layer may contain the polymer which has an acidic radical by 1 type individually, and may contain 2 or more types.

When the photosensitive resin layer contains the polymer which has an acidic radical, it is preferable that content of the polymer which has an acidic radical is 10 mass % or more and 90 mass % or less with respect to the total mass of the photosensitive resin layer from a photosensitive viewpoint, 20 mass % It is more preferable that they are 80 mass % or more, and it is more preferable that they are 30 mass % or more and 70 mass % or less.

<Photoinitiator>

It is preferable that the photosensitive resin layer contains a photoinitiator.

A photoinitiator receives actinic rays, such as an ultraviolet-ray and visible light, and starts superposition|polymerization of a polymeric compound.

There is no restriction|limiting in particular as a photoinitiator, A well-known photoinitiator can be used.

As a photoinitiator, a photoradical polymerization initiator and a photocationic polymerization initiator are mentioned, It is preferable that it is a photoradical polymerization initiator.

Moreover, it is preferable to contain at least 1 sort(s) selected from the group which consists of 2,4,5- triaryl imidazole dimer and its derivative(s) from a viewpoint of photosensitivity and resolution as a photoinitiator in the photosensitive resin layer. .

Moreover, as a photoinitiator, you may use the polymerization initiator of Paragraph 0031 - 0042 of Unexamined-Japanese-Patent No. 2011-095716, and Paragraph 0064 - 0081 of Unexamined-Japanese-Patent No. 2015-014783, for example.

As a commercial item of a photoinitiator, 1-[4-(phenylthio)]-1,2-octanedione-2-(O-benzoyl oxime) [brand name: IRGACURE (trademark) OXE-01, BASF company make] , 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone-1-(O-acetyloxime) [trade name: IRGACURE (registered trademark) OXE-02, BASF Corporation], IRGACURE (registered trademark) OXE-03 (manufactured by BASF), 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]- 1-Butanone [trade name: IRGACURE (registered trademark) 379EG, manufactured by BASF], 2-methyl-1-(4-methylthiophenyl)-2-morpholinopropan-1-one [trade name: IRGACURE (registered trademark) ) 907, manufactured by BASF], 2-hydroxy-1-{4-[4-(2-hydroxy-2-methylpropionyl)benzyl]phenyl}-2-methylpropan-1-one [brand name: IRGACURE ( Registered trademark) 127, manufactured by BASF], 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)butanone-1 [trade name: IRGACURE (registered trademark) 369, manufactured by BASF], 2-hyde Roxy-2-methyl-1-phenylpropan-1-one [trade name: IRGACURE (registered trademark) 1173, manufactured by BASF], 1-hydroxycyclohexylphenyl ketone [trade name: IRGACURE (registered trademark) 184, manufactured by BASF]; 2,2-dimethoxy-1,2-diphenylethan-1-one [brand name: IRGACURE 651, manufactured by BASF], etc., oxime ester-based [brand name: Lunar (registered trademark) 6, manufactured by DKSH Japan Co., Ltd.] ] and the like.

As the photopolymerization initiator, 2,4-bis(trichloromethyl)-6-(N,N-diethoxycarbonylmethylamino)-3-bromophenyl]-s-triazine or the like can also be used.

The photosensitive resin layer may contain the photoinitiator individually by 1 type, and may contain 2 or more types.

When the photosensitive resin layer contains a photoinitiator, content of a photoinitiator is although there is no restriction|limiting in particular, With respect to the total mass of the photosensitive resin layer, 0.1 mass % or more is preferable, 0.5 mass % or more is more preferable, 1.0 mass % or more is more preferable.

Moreover, 10 mass % or less is preferable with respect to the total mass of the photosensitive resin layer, and, as for content of a photoinitiator, 5 mass % or less is more preferable.

<Other additives>

The photosensitive resin layer may contain a well-known additive as needed other than the said component.

As another additive, a well-known thing can be used, For example, a polymerization inhibitor, a plasticizer, a sensitizer, a hydrogen donor, a heterocyclic compound, a color developing agent, a coloring agent, a solvent, etc. are mentioned.

As a polymerization inhibitor, the thermal polymerization inhibitor of Paragraph 0018 of Unexamined-Japanese-Patent No. 4502784 can be used, for example. Among them, phenothiazine, phenoxazine or 4-methoxyphenol can be suitably used.

When the photosensitive resin layer contains a polymerization inhibitor, 0.01-3 mass % is preferable with respect to the total mass of the photosensitive resin layer, as for content of a polymerization inhibitor, 0.01-1 mass % is more preferable, 0.01-0.8 Mass % is more preferable.

As a sensitizer, a well-known sensitizer, dye, a pigment, etc. are mentioned.

Examples of the plasticizer and the heterocyclic compound include those described in paragraphs 0097 to 0103 and 0111 to 0118 of International Publication No. 2018/179640.

As the color developer, for example, the color developer described in Paragraph 0417 of Unexamined Patent Application Publication No. 2007-178459 can be used, and Leuco Crystal Violet, Crystal Violet Lactone, Victoria Pure Blue-naphthalenesulfonate, etc. are more preferably used.

When the photosensitive resin layer contains a coloring agent, it is preferable that content of a coloring agent is 0.1-10 mass % with respect to the total mass of the photosensitive resin layer from a viewpoint of the visibility and resolution of an exposed part and a non-exposed part, 0.1-5 It is more preferable that it is mass %, and it is especially preferable that it is 0.1-1 mass %.

In addition, in the photosensitive resin layer, metal oxide particles, antioxidants, dispersants, acid growth agents, development accelerators, conductive fibers, colorants, thermal radical polymerization initiators, thermal acid generators, ultraviolet absorbers, thickeners, crosslinking agents, and organic or inorganic Well-known additives, such as a precipitation inhibitor, can be added further.

Paragraph 0165 of Unexamined-Japanese-Patent No. 2014-085643 - Paragraph 0184 have description about the preferable aspect of another component, respectively, The content of this publication is integrated in this specification.

From a viewpoint of pattern resolving power, 0.5-20 micrometers is preferable, as for the thickness of the photosensitive resin layer, 0.8-15 micrometers is more preferable, and its 1.0-10 micrometers are still more preferable.

[Cover Film]

The photosensitive transfer member of the present invention has a cover film.

As a cover film, a resin film, paper, etc. are mentioned, From viewpoints, such as intensity|strength and flexibility, a resin film is especially preferable. As a resin film, a polyethylene film, a polypropylene film, a polyethylene terephthalate film, a cellulose triacetate film, a polystyrene film, a polycarbonate film, etc. are mentioned. Especially, a polyethylene film, a polypropylene film, and a polyethylene terephthalate film are preferable.

The thickness of a cover film is not specifically limited, For example, the thing of 1 micrometer - 2 mm is mentioned preferably.

[Other floors]

The photosensitive transfer member according to the present disclosure may have layers other than those described above (hereinafter, abbreviated as "other layers"). Examples of the other layers include a contrast enhancement layer, an easily peelable layer, and a BARC layer.

Paragraph 0134 of International Publication No. 2018/179640 describes a preferred aspect of the contrast enhancement layer, the content of which is incorporated herein by reference.

Here, with reference to FIG. 1, an example of the layer structure of the photosensitive transfer member of this invention is schematically shown.

In the photosensitive transfer member 100 shown in FIG. 1 , a supporting body 10 , a thermoplastic resin layer 12 , a photosensitive resin layer 14 , and a cover film 16 are laminated in this order.

In the present invention, in the method for producing a resin pattern using the photosensitive transfer material of the present invention, when peeling the support body before the developing step, since it is easier to peel the thermoplastic resin layer together with the support body, Among the peeling strengths between the respective layers of the supporting body, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, the peeling strength between the supporting body and the thermoplastic resin layer is the strongest and the peeling strength between the photosensitive resin layer and the cover film is the weakest.

[Method for manufacturing photosensitive transfer member]

There is no restriction|limiting in particular in the manufacturing method of the photosensitive transfer member of this invention, A well-known manufacturing method can be used.

Specifically, by mixing the components and solvent of each layer described above to prepare a composition such as a thermoplastic resin composition, and applying the composition on a support or cover film, the support, the thermoplastic resin layer, and the photosensitive water A photosensitive transfer member having a base layer and a cover film in this order can be obtained.

Specifically, as a method for manufacturing the photosensitive transfer member, a step of coating and drying a thermoplastic resin composition on a support to form a thermoplastic resin layer, and coating and drying the photosensitive resin composition on a thermoplastic resin layer to form a photosensitive resin layer The process of doing and the method of having a process of providing a cover film on the said photosensitive resin layer are mentioned.

As another method of manufacturing the photosensitive transfer member, a step of coating and drying a thermoplastic resin composition on a support to form a thermoplastic resin layer, and coating and drying the photosensitive resin composition on a cover film to form a photosensitive resin layer A method having a step and a step of bonding the laminate produced in both steps, that is, a supporting body with a thermoplastic resin layer, and a cover film with a photosensitive resin layer, so that the thermoplastic resin layer and the photosensitive resin layer are in contact with each other; there is.

In addition, in the present invention, when forming the thermoplastic resin layer, from the viewpoint of reducing the load on the environment, it is not a method by coating drying using a conventional organic solvent, but a melt extrusion method on a branch support. it is preferable

[Method for producing resin pattern]

The method for producing a resin pattern of the present invention is a method for producing a resin pattern in which a resin pattern is produced by a roll-to-roll using the photosensitive transfer member of the present invention described above, and a peeling step of peeling a cover film from the photosensitive transfer member (hereinafter referred to as a peeling process) , also referred to as a "cover film peeling step"), a bonding step of bonding the photosensitive resin layer in the photosensitive transfer member from which the cover film has been peeled into contact with a substrate having a conductive layer, and bonding the photosensitive resin layer to pattern exposure An exposure step and a developing step of developing the exposed photosensitive resin layer to form a resin pattern are in this order, and between the bonding step and the exposure step, or between the exposure step and the developing step, from the photosensitive transfer member to the supporting body and a step of simultaneously peeling the thermoplastic resin layer (hereinafter also referred to as a “simultaneous peeling step”).

[Method for manufacturing circuit wiring]

The manufacturing method of circuit wiring of this invention is a manufacturing method of circuit wiring which manufactures circuit wiring by roll-to-roll using the photosensitive transfer member of this invention mentioned above, It is a peeling process of peeling a cover film from a photosensitive transfer member (cover). film peeling step), a bonding step of bonding the photosensitive resin layer in the photosensitive transfer member from which the cover film has been peeled off in contact with a substrate having a conductive layer, and an exposure step of pattern exposing the photosensitive resin layer, and the exposed photosensitivity A developing step of developing the resin layer to form a resin pattern, and a step of etching the conductive layer in a region where the resin pattern is not arranged are in this order, and between the bonding step and the exposure step, or between the exposure step and the It is a manufacturing method which has a process (simultaneous peeling process) of simultaneously peeling a support body and a thermoplastic resin layer from a photosensitive transfer member between image development processes.

Hereinafter, although each process included in the manufacturing method of a resin pattern and the manufacturing method of circuit wiring is demonstrated, a roll-to-roll system is demonstrated first.

The roll-to-roll method uses a substrate that can be wound and unwound as a substrate, and unwinds the substrate or a structure including the substrate before any one of the steps included in the method for manufacturing a resin pattern or manufacturing method for circuit wiring. A step (also referred to as a “unwinding step”) and a step (also referred to as a “winding step”) of winding up a structure including a substrate or a substrate after any one step are included, and at least one step (preferably refers to a method in which all steps) are performed while conveying a structure including a base material or a substrate.

It does not restrict|limit especially as the unwinding method in an unwinding process, and the winding-up method in a winding-up process, In the manufacturing method to which a roll-to-roll system is applied, a well-known method may be used.

[Cover Film Peeling Process]

The peeling process which the manufacturing method of the resin pattern of this invention and the manufacturing method of circuit wiring have is a process of peeling a cover film from a photosensitive transfer member.

There is no restriction|limiting in particular as a peeling method, What is necessary is just to peel by a well-known method. For example, the cover film peeling mechanism of Paragraph [0161] - [0162] of Unexamined-Japanese-Patent No. 2010-072589, etc. can be used.

[bonding process]

The bonding process of the manufacturing method of the resin pattern of this invention and the manufacturing method of circuit wiring is a process of making the photosensitive resin layer in the photosensitive transfer member which peeled the cover film contact with the board|substrate which has a conductive layer, and bonding it together.

In the said bonding process, it is preferable to press-bond so that the said conductive layer and the surface on the opposite side to the thermoplastic resin layer of the photosensitive resin layer which the said photosensitive transfer member has may contact. If it is the said aspect, the pattern-formed photosensitive resin layer after exposure and image development can be used suitably as an etching resist at the time of etching a conductive layer.

There is no restriction|limiting in particular as a method of crimping|bonding the said board|substrate and the said photosensitive transfer member, A well-known transfer method and a lamination method can be used.

The bonding of the photosensitive transfer member to the substrate is preferably performed by superimposing the surface on the opposite side to the intermediate layer of the photosensitive resin layer of the photosensitive transfer member on the substrate, pressing and heating with a roll or the like. Well-known laminators, such as a laminator, a vacuum laminator, and the auto cut laminator which can improve productivity more, can be used for bonding.

The board|substrate which has a conductive layer has a conductive layer on base materials, such as glass, silicone, and a film, and arbitrary layers may be formed as needed.

As a preferable aspect of a board|substrate, Paragraph 0140 of International Publication No. 2018/155193 has description, for example, This content is integrated in this specification.

As a base material of a board|substrate, a film base material is preferable from a viewpoint of manufacturing by a roll-to-roll system. Moreover, when manufacturing the circuit wiring for touch panels by a roll-to-roll system, it is preferable that a base material is a sheet-like resin composition.

The conductive layer of the substrate is at least one layer selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer from the viewpoint of conductivity and fine wire formation. It is preferable, and it is more preferable that it is a metal layer, It is especially preferable that it is a copper layer or a silver layer.

Moreover, you may have one conductive layer on a base material, and may have it two or more layers. When there are two or more conductive layers, it is preferable to have conductive layers of different materials.

As a preferable aspect of a conductive layer, Paragraph 0141 of International Publication No. 2018/155193 has description, for example, This content is integrated in this specification.

[Exposure process]

The exposure process which the manufacturing method of the resin pattern of this invention and the manufacturing method of circuit wiring have is a process of carrying out pattern exposure of the photosensitive resin layer.

The detailed arrangement and specific size of the pattern in the pattern exposure are not particularly limited. At least a part (preferably) of the pattern so that the display quality of a display device (for example, a touch panel) provided with an input device having circuit wiring manufactured by the circuit wiring manufacturing method is improved and the area occupied by the extraction wiring is small. Preferably, the electrode pattern of the touch panel and/or the portion of the lead-out wiring) preferably includes a thin wire having a width of 20 μm or less, and more preferably includes a thin wire having a width of 10 μm or less.

As a preferable aspect of the light source used for exposure, exposure amount, and exposure method, Paragraph 0146 of International Publication No. 2018/155193 - Paragraph 0147 is described, for example, These content is integrated in this specification.

[developing process]

The developing process which the manufacturing method of the resin pattern of this invention and the manufacturing method of circuit wiring have is a process of developing the exposed photosensitive resin layer, and forming a resin pattern.

Development of the exposed said photosensitive resin layer in the said image development process can be performed using a developing solution.

There is no restriction|limiting in particular as a developing solution and a developing method, as long as the non-image part of the photosensitive resin layer can be removed, A well-known developing solution and developing method can be used. As a developing solution used suitably in this indication, the developing solution of Paragraph 0194 of International Publication No. 2015/093271 is mentioned, for example, As a developing method used suitably, For example, International Publication No. 2015 The developing method described in Paragraph 0195 of /093271 is mentioned.

[Simultaneous peeling process]

The simultaneous peeling process which the manufacturing method of the resin pattern of this invention and the manufacturing method of circuit wiring has is between a bonding process and an exposure process, or between an exposure process and a developing process, from a photosensitive transfer member to a support body and a thermoplastic resin layer. It is a process of peeling at the same time.

As a peeling method, the method of winding up and collect|recovering a branch support body and a thermoplastic resin layer on the winding-up shaft in the form of a laminated body is preferable, For example, Paragraph [0161] of Unexamined-Japanese-Patent No. 2010-072589 - [0162] The mechanism etc. similar to the cover film peeling mechanism can be used.

[Post exposure and post-baking]

In the resin pattern manufacturing method and circuit wiring manufacturing method of this invention, the resin pattern obtained by the said image development process is exposed (hereinafter also referred to as "post-exposure") and/or heat treatment (hereinafter, "post-bake"). Also called.) may have a process of

When both the process of post-exposure and the process of post-baking are included, it is preferable to post-bake after post-exposure.

[Etching process]

The etching process which the manufacturing method of the circuit wiring of this invention has is a process of etching the conductive layer in the area|region where the resin pattern is not arrange|positioned.

In the said etching process, the said conductive layer is etched using the pattern formed in the said photosensitive resin layer by the said developing process as an etching resist.

As a method of an etching process, the method described in Paragraph 0209 - Paragraph 0210 of Unexamined-Japanese-Patent No. 2017-120435 - Paragraph 0048 - Paragraph 0054 of Unexamined-Japanese-Patent No. 2010-152155 The method described in Paragraph 0054 etc., Well-known dry etching, such as plasma etching A well-known method, such as a method, can be applied.

[removal process]

In the method for manufacturing circuit wiring of the present invention, it is preferable to perform a step of removing the resin pattern (hereinafter, abbreviated as "removing step").

There is no restriction|limiting in particular in a removal process, Although it can perform as needed, it is preferable to perform after an etching process.

Although there is no restriction|limiting in particular as a method of removing the photosensitive resin layer which remains, The method of removing by chemical|medical treatment is mentioned, Especially preferably, using a removal liquid is mentioned.

As a method for removing the photosensitive resin layer, a method of immersing a substrate having a photosensitive resin layer or the like in the removal solution being stirred at preferably 30° C. to 80° C., more preferably at 50° C. to 80° C. for 1 minute to 30 minutes is exemplified. there is.

As the removal liquid, for example, an inorganic alkali component such as sodium hydroxide or potassium hydroxide, or an organic alkali component such as a primary amine compound, a secondary amine compound, a tertiary amine compound, or a quaternary ammonium salt compound; and a removal solution dissolved in water, dimethyl sulfoxide, N-methylpyrrolidone, or a mixed solution thereof.

Moreover, you may remove by the spray method, the shower method, the puddle method, etc. using a removal liquid.

[Other processes]

The manufacturing method of the circuit wiring of this invention may include arbitrary processes (other processes) other than what was mentioned above. For example, a step of lowering the visible light turn emissivity described in Paragraph 0172 of International Publication No. 2019/022089, a step of forming a new conductive layer on the insulating film described in Paragraph 0172 of International Publication No. 2019/022089, etc. are mentioned. However, it is not limited to these processes.

Moreover, as an example of the exposure process in this indication, the image development process, and another process, Paragraph 0035 - Paragraph 0051 of Unexamined-Japanese-Patent No. 2006-023696 - Paragraph 0051 can be used suitably also in this indication.

The circuit wiring manufactured by the manufacturing method of the circuit wiring of this invention is applicable to various apparatuses. As an apparatus provided with circuit wiring manufactured by the manufacturing method of circuit wiring which concerns on this indication, an input device etc. are mentioned, for example, It is preferable that it is a touch panel, and it is more preferable that it is a capacitive touch panel. . Moreover, the said input device is applicable to display apparatuses, such as an organic electroluminescent display device and a liquid crystal display device.

[Method of manufacturing touch panel]

The method for manufacturing a touch panel of the present invention is a method for manufacturing a touch panel in which a touch panel is manufactured in a roll-to-roll manner using the photosensitive transfer member of the present invention described above, and a peeling step of peeling a cover film from the photosensitive transfer member (cover film peeling step), a bonding step of bonding the photosensitive resin layer in the photosensitive transfer member from which the cover film has been peeled off in contact with a substrate having a conductive layer, and an exposure step of pattern exposing the photosensitive resin layer, and the exposed photosensitivity A developing step of developing the resin layer to form a resin pattern, and a step of etching the conductive layer in a region where the resin pattern is not arranged are in this order, and between the bonding step and the exposure step, or between the exposure step and the It is a manufacturing method which has a process (simultaneous peeling process) of simultaneously peeling a support body and a thermoplastic resin layer from a photosensitive transfer member between image development processes.

Specific aspects of each step in the method for manufacturing a touch panel of the present invention, and embodiments such as a procedure for performing each step are as described in the section of “Method for Manufacturing Circuit Wiring” above, and preferred The aspect is also the same.

For the manufacturing method of the touch panel of this invention, other than what was mentioned above, a well-known manufacturing method of a touch panel can be referred.

Moreover, the manufacturing method of the touchscreen of this invention may include arbitrary processes (other processes) other than what was mentioned above.

An example of the pattern of the mask used in the manufacturing method of the touchscreen of this invention is shown in FIG.2 and FIG.3.

In the pattern A shown in FIG. 2 and the pattern B shown in FIG. 3, SL and G are image parts (opening part), and DL shows the frame of alignment virtually. In the method for manufacturing a touch panel according to the present disclosure, for example, by exposing the photosensitive resin layer through a mask having the pattern A shown in FIG. 2 , the touch panel in which the circuit wiring having the pattern A corresponding to SL and G is formed. can be manufactured.

The touch panel which concerns on this indication is a touch panel which has at least the circuit wiring manufactured by the manufacturing method of the circuit wiring of this invention.

Moreover, it is preferable that the touchscreen which concerns on this indication has at least a transparent substrate, an electrode, and an insulating layer or a protective layer.

Moreover, as a detection method in the touch panel which concerns on this indication, any of well-known methods, such as a resistive film method, a capacitive method, an ultrasonic method, an electromagnetic induction method, and an optical method, may be sufficient. Among them, the electrostatic capacitive method is preferable.

As a touch panel type, what is called an in-cell type (For example, the thing described in FIG. 5, FIG. 6, FIG. 7, and FIG. 8 of Unexamined-Japanese-Patent No. 2012-517051), a so-called on-cell type (for example, JP Patent Publication) The thing described in FIG. 19 of Unexamined-Japanese-Patent No. 2013-168125, the thing described in FIG. 1 or FIG. 5 of Unexamined-Japanese-Patent No. 2012-089102), OGS(One Glass Solution) type, TOL(Touch-on-Lens) type (for example, , the thing described in FIG. 2 of Unexamined-Japanese-Patent No. 2013-054727), other structures (For example, the thing described in FIG. 6 of Unexamined-Japanese-Patent No. 2013-164871), various outsell type (so-called, GG, G1 G2) , GFF, GF2, GF1, G1F, etc.).

As a touchscreen which concerns on this indication, the thing of Paragraph 0229 of Unexamined-Japanese-Patent No. 2017-120345 is mentioned, for example.

Example

Hereinafter, the present invention will be described in more detail by way of Examples. Materials, amounts of use, ratios, processing contents, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Accordingly, the scope of the present invention should not be construed as being limited by the Examples shown below.

In addition, in the following, unless otherwise indicated, "%" and "part" are based on mass.

[Synthesis of Polymer A-1]

PGMEA (116.5 parts) was put into a three-necked flask, and it heated up at 90 degreeC in nitrogen atmosphere. St (52.0 parts), MMA (19.0 parts), MAA (29.0 parts), V-601 (4.0 parts), and a solution in which PGMEA (116.5 parts) were added was maintained at 90°C ± 2°C in a 3-neck flask solution It was dripped over 2 hours. Polymer A-1 (solid content concentration 30.0%) was obtained by stirring at 90 degreeC ± 2 degreeC after completion|finish of dripping for 2 hours.

In addition, the abbreviation in the said synthesis example shows the following compounds, respectively.

St: Styrene (manufactured by Fujifilm Wako Junyaku Co., Ltd.)

MAA: methacrylic acid (manufactured by Fujifilm Wako Junyaku Co., Ltd.)

MMA: methyl methacrylate (manufactured by Fujifilm Wako Junyaku Co., Ltd.)

PGMEA: propylene glycol monomethyl ether acetate (manufactured by Showa Denko Co., Ltd.)

MEK: methyl ethyl ketone (manufactured by Sankyo Chemical Co., Ltd.)

V-601: Dimethyl-2,2'-azobis(2-methylpropionate) (manufactured by Fujifilm Wako Junyaku Co., Ltd.)

[Preparation of the photosensitive resin composition 1]

The following components were mixed and the photosensitive resin composition 1 was prepared. In addition, the unit of the quantity of each component is a mass part.

Polymer A-1 (solid content concentration 30.0%): 21.87 parts

D-2 (Aronix M270 (manufactured by Toagosei Co., Ltd.)): 0.51 parts

D-1 (NK Ester BPE-500 (manufactured by Shin-Nakamura Chemical High School)): 4.85 copies

C-2 (B-CIM, manufactured by Hampford): 0.89 copies

C-3 (photoradical polymerization initiator (sensitizer), 4,4'-bis(diethylamino)benzophenone, manufactured by Tokyo Kasei Co., Ltd.): 0.05 part

Phenothiazine (manufactured by Fujifilm Wako Junyaku Co., Ltd.): 0.025 parts

1-phenyl-3-pyrazolidone (manufactured by Fujifilm Wako Junyaku Co., Ltd.): 0.001 parts

B-2 (LCV, Ryuko Crystal Violet, manufactured by Yamada Chemical High School Co., Ltd.): 0.053 copies

E-1 (Megapac F552 (manufactured by DIC Co., Ltd.)): 0.02 parts

Methyl ethyl ketone (MEK, manufactured by Sankyo Chemical Co., Ltd.): 30.87 parts

Propylene glycol monomethyl ether acetate (PGMEA, manufactured by Showa Denko Co., Ltd.): 33.92 parts

Tetrahydrofuran (THF, manufactured by Mitsubishi Chemical Co., Ltd.): 6.93 parts

[Example 1]

Using a PET film (16KS40, manufactured by Toray Corporation) having a thickness of 16 μm as a support, a coating solution composed of the following formula H1 is applied on the support, and dried to provide a thermoplastic resin layer having a dry film thickness of 5 μm did.

Next, on the said thermoplastic resin layer, using the slit-shaped nozzle, the photosensitive resin composition 1 was apply|coated, the 80 degreeC drying zone was made to pass over 40 seconds, and the 3 micrometers-thick photosensitive resin layer was formed.

Next, on the photosensitive resin layer, as a cover film, a PET film (16KS40, manufactured by Toray Corporation) having a thickness of 16 µm was laminated to prepare a photosensitive transfer member, and wound to form a roll.

<Prescription H1>

Ethylene vinyl acetate copolymer (Evaflex P1007, manufactured by Mitsui Dow Polychemical Co., Ltd.): 70 g

Toluene: 1000g

[Example 2]

On a 16 μm thick PET film (16KS40, manufactured by Toray Corporation), using a high-frequency oscillator, an output voltage of 100%, an output of 250 W, a wire electrode with a diameter of 1.2 mm, an electrode length of 240 mm, and 1.5 mm between the work electrodes for 3 seconds Corona discharge treatment was performed, surface modification was performed, and it was used as a support body.

On the support body, the thermoplastic resin layer with a thickness of 5 micrometers which consists of an ethylene-vinyl acetate copolymer (Evaflex P1007, Mitsui Dow Polychemical Co., Ltd. make) was formed by the melt-extrusion method.

Next, formation of the photosensitive resin layer and the cover film was performed by the method similar to Example 1, the photosensitive transfer member was produced, it wound up, and it was set as the roll form.

[Example 3]

Using a 16 μm-thick PET film (16KS40, manufactured by Toray Corporation) as a support, on this support, by melt extrusion, an ethylene methacrylic acid copolymer (Nucrel 4214C, manufactured by Mitsui Dow Polychemicals), the thickness A thermoplastic resin layer of 5 µm was provided.

Next, formation of the photosensitive resin layer and the cover film was performed by the method similar to Example 1, the photosensitive transfer member was produced, it wound up, and it was set as the roll form.

[Example 4]

On the support body subjected to the same surface treatment as in Example 2, a thermoplastic resin layer with a thickness of 5 μm made of a polyethylene compound (Kernel KF380, manufactured by Nippon Polyethylene Corporation) was prepared by a melt extrusion method.

Next, formation of the photosensitive resin layer and the cover film was performed by the method similar to Example 1, the photosensitive transfer member was produced, it wound up, and it was set as the roll form.

[Example 5]

In the same manner as in Example 1, except that the thickness of the thermoplastic resin layer was 2 µm, a photosensitive transfer member was produced and wound up to form a roll.

[Example 6]

In the same manner as in Example 2, except that the thickness of the thermoplastic resin layer was 10 µm, a photosensitive transfer member was produced and wound up to form a roll.

[Example 7]

In the same manner as in Example 2, except that the thickness of the thermoplastic resin layer was set to 20 µm, a photosensitive transfer member was produced and wound up to form a roll.

[Example 8]

On the support body subjected to the same surface treatment as in Example 2, a thermoplastic resin layer with a thickness of 5 μm made of an ethylene-vinyl acetate copolymer (Evaflex EV550, manufactured by Mitsui Dow Polychemicals) was prepared by a melt extrusion method.

Next, formation of the photosensitive resin layer and the cover film was performed by the method similar to Example 1, the photosensitive transfer member was produced, it wound up, and it was set as the roll form.

[Example 9]

On the support body subjected to the same surface treatment as in Example 2, a thermoplastic resin layer with a thickness of 5 μm made of an ethylene-vinyl acetate copolymer (Evaflex EV450, manufactured by Mitsui Dow Polychemicals) was prepared by melt extrusion.

Next, formation of the photosensitive resin layer and the cover film was performed by the method similar to Example 1, the photosensitive transfer member was produced, it wound up, and it was set as the roll form.

[Example 10]

A PET film (16KS40, manufactured by Toray Corporation) having a thickness of 16 μm is used as a cover film, and the photosensitive resin composition 1 is applied on the cover film using a slit-like nozzle, and passed through a drying zone at 80° C. for 40 seconds. , a 3 µm-thick photosensitive resin layer was formed to prepare a cover film with a photosensitive resin layer.

Next, in the same manner as in Example 2, a thermoplastic resin layer with a thickness of 5 μm, made of an ethylene-vinyl acetate copolymer (Evaflex P1007, manufactured by Mitsui Dow Polychemical Co., Ltd.), on the surface-treated branch support by melt extrusion. It formed and produced the support body with a thermoplastic resin layer.

Next, the photosensitive transfer member was produced by laminating the cover film with the photosensitive resin layer and the supporting body with the thermoplastic resin layer so that the photosensitive resin layer and the thermoplastic resin layer were in contact, and wound up to form a roll.

[Example 11]

On a 16 μm thick PET film (haze: 0.20%, manufactured by Fujifilm), using a high-frequency oscillator, an output voltage of 100%, an output of 250 W, a wire electrode with a diameter of 1.2 mm, an electrode length of 240 mm, and 1.5 mm between work electrodes The corona discharge treatment was performed for 3 second under conditions, the surface modification was performed, and it used as a support body.

A photosensitive transfer member was produced in the same manner as in Example 2 except for using the support, and was wound up to form a roll.

[Example 12]

In the same manner as in Example 1, except that the thickness of the thermoplastic resin layer was 0.8 µm, a photosensitive transfer member was produced and wound up to form a roll.

[Example 13]

On a 16 μm thick PET film (haze: 0.80%, manufactured by Fujifilm), using a high-frequency oscillator, an output voltage of 100%, an output of 250 W, a wire electrode with a diameter of 1.2 mm, an electrode length of 240 mm, 1.5 mm between work electrodes The corona discharge treatment was performed for 3 second under conditions, the surface modification was performed, and it used as a support body.

A photosensitive transfer member was produced in the same manner as in Example 2 except for using the support, and was wound up to form a roll.

[Comparative Example 1]

On the support body subjected to the same surface treatment as in Example 2, a thermoplastic resin layer with a thickness of 5 μm made of a polypropylene polymer (Wintech WFX4M, manufactured by Nippon Polypro Corporation) was provided by a melt extrusion method.

Next, formation of the photosensitive resin layer and the cover film was performed by the method similar to Example 1, the photosensitive transfer member was produced, it wound up, and it was set as the roll form.

[Comparative Example 2]

On the support body subjected to the same surface treatment as in Example 2, a thermoplastic resin layer with a thickness of 5 μm made of an ethylene-vinyl acetate copolymer (Evaflex EV150, manufactured by Mitsui Dow Polychemicals) was prepared by a melt extrusion method.

Next, formation of the photosensitive resin layer and the cover film was performed by the method similar to Example 1, the photosensitive transfer member was produced, it wound up, and it was set as the roll form.

[Comparative Example 3]

In the same manner as in Example 1, except that the thermoplastic resin layer was not provided, a photosensitive transfer member was produced and wound up to form a roll.

[Peel strength]

For the photosensitive transfer members produced in Examples 1 to 13 and Comparative Examples 1 to 2, the measurement result of the peel strength between each layer of the supporting body, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, Examples 1 to 13 and comparison Also in any of Examples 1-2, the peeling strength of a support body and a thermoplastic resin layer was the strongest, and it has confirmed that the peeling strength of a photosensitive resin layer and a cover film is the weakest.

In addition, as a result of measuring the peel strength between the respective layers of the supporting body, the photosensitive resin layer and the cover film for the photosensitive transfer member produced in Comparative Example 3 in which the thermoplastic resin layer was not provided, the peel strength between the supporting member and the photosensitive resin layer was measured. was the strongest, and the peel strength between the photosensitive resin layer and the cover film was the weakest.

[Vicat softening point and tensile modulus]

About the thermoplastic resin layer which the produced photosensitive transfer member has, the Vicat softening point and the tensile modulus of elasticity were measured by the method mentioned above. These results are shown in Table 1 below.

[Heize]

About the produced photosensitive transfer member, the haze was measured by the method mentioned above about the support body and the laminated body which provided the thermoplastic resin layer on the support body. The results are shown in Table 1 below.

[Lamination characteristics]

After unwinding the produced photosensitive transfer member and peeling a cover film, on the glass substrate of thickness 0.7mm, between the heat rolls with a temperature of 100 degreeC, between heat rolls at a speed of 2 m/min and a pressure of 0.8 MPa, so that the photosensitive resin layer may contact|connect it pressed

Then, whether a bubble did not remain|survive between a glass substrate and the photosensitive resin layer was observed with the optical microscope, and the following reference|standard evaluated. The results are shown in Table 1 below.

A: 0 number of bubbles in an area of 100 mm ²

B: 1 or more and 5 or less of the number of bubbles in an area of 100 mm ²

C: Number of bubbles 6 or more and 10 or less within an area of 100 mm ²

D: Number of bubbles 11 or more and 50 or less in an area of 100 mm ²

E: 51 or more bubbles in an area of 100 mm ²

〔blocking〕

After unwinding the produced photosensitive transfer member and peeling the cover film, a PET base having a thickness of 100 μm and a width of 500 mm was applied to a support in a roll-to-roll manner between heat rolls at a temperature of 100° C. at a speed of 2 m/min and a pressure of 0.8 MPa. It was thermocompression-bonded, and it wound up in roll shape in the form laminated|stacked by the photosensitive resin layer, a thermoplastic resin layer, and a support body on a support body.

Then, conveying was performed at the speed|rate of 2 m/min, peeling a support body and a thermoplastic resin layer simultaneously. In that case, the laminated body which consists of the peeled branch support body and a thermoplastic resin layer was wound up, and it wound up in the shape of a roll by the tension of 25N. The presence or absence of blocking was observed from the roll form at the time of winding up 100 m, and the following reference|standard evaluated. The results are shown in Table 1 below. In addition, when blocking occurs, appearance abnormalities such as wrinkles and corner curls occur.

A: Absolutely no problem in appearance

B: An acceptable level of wrinkles and corner curls are seen, but conveyance is not affected.

C: Stable conveyance is impossible due to the occurrence of wrinkles and curled corners.

[Pattern Resolution]

On a 0.7 mm-thick glass plate, the 500-nm-thick copper layer was provided by the vapor deposition method, and the glass substrate with a copper layer was prepared.

After unwinding the produced photosensitive transfer member and peeling the cover film, under the lamination conditions of a roll temperature of 100 degreeC, a linear pressure of 0.8 MPa, and a linear speed of 2.0 m/min, the said copper layer is attached so that a copper layer and the photosensitive resin layer may contact. Laminated on a glass substrate.

Next, using a photomask having various line width patterns (2 to 20 μm) of line/space = 1/1, exposure of 80 mJ/cm ² is performed from the PET surface, and then the support and the thermoplastic resin layer are simultaneously peeled off Removed.

Subsequently, shower development was performed with a 1% aqueous sodium carbonate solution at a liquid temperature of 25°C, washed with water, and a predetermined pattern was formed on copper.

Thereafter, the minimum line width in which the space was formed (using the mask dimension numerical value) was evaluated with an optical microscope. The results are shown in Table 1 below. Moreover, about Comparative Examples 1 and 3, lamination property is inferior, and since a lot of bubbles exist, pattern resolution cannot be evaluated, and it describes with "-" in following Table 1.

[Table 1]

From the result shown in said Table 1, when the tensile elasticity modulus of a thermoplastic resin layer was larger than 200 MPa, it turned out that lamination property is inferior (comparative example 1).

Moreover, when the tensile modulus of elasticity of a thermoplastic resin layer was smaller than 10 MPa, it turned out that blocking generate|occur|produces at the time of peeling of a branch support body and a thermoplastic resin layer (comparative example 2).

Moreover, when a thermoplastic resin layer is not provided, it turned out that lamination property is inferior (comparative example 3).

On the other hand, if the Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C., and the tensile modulus is 10 to 200 MPa, the lamination property is excellent, and the occurrence of blocking during peeling of the supporting body and the thermoplastic resin layer can be suppressed. It was found that possible (Examples 1 to 13).

In particular, from the comparison of Examples 1-4, it turned out that the generation|occurrence|production of blocking can be suppressed more that the tensile elasticity modulus of a thermoplastic resin layer was 50-200 MPa at the time of peeling of a support body and a thermoplastic resin layer.

Moreover, from the comparison of Examples 1, 2, 5-7, and 12, it turned out that the outstanding lamination property and the outstanding pattern resolution can make compatible that the thickness of a thermoplastic resin layer was more than 2 micrometers and less than 20 micrometers.

(Example 101)

On a 100 μm thick PET substrate, ITO as a second conductive layer is deposited to a thickness of 150 nm by sputtering, and copper is deposited as a first conductive layer on it to a thickness of 200 nm by vacuum deposition by vacuum deposition. made in roll form.

Next, the photosensitive transfer member produced in Example 3 is unwound, the cover film is peeled, and the copper layer of the unwound circuit formation substrate is laminated so as to be in contact with the photosensitive resin layer, and is once wound onto a roll. got drunk In addition, lamination was performed on condition of the linear pressure of 0.6 MPa, the linear speed of 3.6 m/min, and the roll temperature of 100 degreeC.

Then, without peeling off the support, the contact pattern was exposed (first exposure step) using a photomask provided with the pattern A shown in FIG. 2 having a configuration in which the conductive layer pads were connected in one direction, and wound up on a roll. In addition, as for the pattern A shown in FIG. 2, as mentioned above, SL and G are an opening part, and DL shows the frame of alignment virtually. In addition, the solid line part was made into the thin wire of 70 micrometers or less.

Thereafter, while simultaneously peeling the supporting body and the thermoplastic resin layer, development using 2.38% of an aqueous solution of tetramethylammonium hydroxide (TMAH) was performed (first development step), and then washed with water to perform a first pattern (opening of pattern A). A resist image having a shape (pattern, which is the shape of the region) was formed. Finally, the film with a resist image and the peeled supporting body with a thermoplastic resin were wound up in roll shape.

Next, after etching the copper layer (first conductive layer) using a copper etching solution (Cu-02, manufactured by Kanto Chemical Co., Ltd.), the ITO layer (2nd) using an ITO etching solution (ITO-02, manufactured by Kanto Chemical Company) By etching the conductive layer), a substrate in which both the copper layer (first conductive layer) and the ITO layer (second conductive layer) were drawn in the first pattern (pattern that is the shape of the opening region of pattern A) was obtained (first etching) fair). Further, the remaining resist image was peeled off using a stripper (KP-301 manufactured by Kanto Chemical Co., Ltd.). Finally, it wound up on a roll.

Next, the photosensitive transfer member produced in Example 3 was unwound, and after peeling a cover film, it laminated|stacked. In addition, lamination was performed on condition of the linear pressure of 0.6 MPa, the linear speed of 3.6 m/min, and the roll temperature of 100 degreeC.

Next, without peeling off a support body, in the state which matched the alignment, the contact pattern exposure was carried out using the photomask which provided the pattern B shown in FIG. 3 (2nd exposure process), and it wound up in roll shape. In addition, as for the pattern B shown in FIG. 3, as mentioned above, G is an opening part, DL shows the frame of alignment virtually.

Next, the supporting body and the thermoplastic resin are peeled off simultaneously, and development is performed using 2.38% of an aqueous TMAH solution (second developing step), and then washed with water to perform a second pattern (the portion where the opening in pattern A and the opening in pattern B overlap). A resist image having the shape of the pattern of ) was obtained.

Then, the copper layer was etched using Cu-02, the resist image which remained was peeled using the stripper (KP-301, Kanto Chemical company make), and the circuit wiring board wound up in roll shape was obtained.

As a result of observing the circuit of the obtained circuit wiring board under a microscope, there was no peeling, damage, etc., and it was a high-definition neat pattern.

(Formation of protective film pattern 1)

A protective film was formed on the circuit wiring board obtained above by the following method.

First, with respect to the photosensitive resin layer, a photosensitive transfer member was produced in the same manner as in Example 3 using the photosensitive resin composition having the following formulation, except that the film thickness was 8 µm.

Next, after unwinding the produced photosensitive transfer member and peeling a cover film, it laminated|stacked so that the photosensitive resin layer and a circuit pattern might contact. In addition, lamination was performed on condition of the linear pressure of 0.6 MPa, the linear speed of 3.6 m/min, and the roll temperature of 100 degreeC.

Then, the contact pattern exposure was carried out using the photomask which provided the unexposed part (contact hole) in part, without peeling a branch support body.

Then, the support body and the thermoplastic resin layer were peeled simultaneously, and development using 1.0% of sodium carbonate aqueous solution at a liquid temperature of 30 degreeC was performed, and water washing was performed after that, and the protective film pattern image was obtained.

Then, heat treatment was performed at 140 degreeC for 60 minutes, it thermosetted, and the protective film was formed on the circuit board.

<Photosensitive resin composition>

- 41 mass % ethyl cellosolve solution of methacrylic acid / cyclohexyl acrylate / methyl methacrylate copolymer (monomer mass ratio = 20/25/55, mass average molecular weight 80,000): 51.0 mass parts

Dipentaerythritol hexaacrylate: 10.0 parts by mass

· Fluorine surfactant F176PF (made by Dai Nippon Ink): 0.25 parts by mass

・Victoria Pure Blue BOH (manufactured by Hodogaya Chemical): 0.225 parts by mass

2,4-bis(trichloromethyl)-6-(N,N-diethoxycarbonylmethylamino)-3-bromophenyl]-s-triazine: 0.45 parts by mass

· Methyl ethyl ketone: 13.0 parts by mass

(Formation of protective film pattern 2)

A protective film was formed on the circuit wiring board obtained above by the following method.

First, with respect to the photosensitive resin layer, a photosensitive transfer member was produced in the same manner as in Example 3 using a non-photosensitive resin composition having the following formulation and having a film thickness of 8 µm.

Moreover, the part which does not want to provide a non-photosensitive resin layer was cut out.

Then, alignment was performed and lamination was performed so that a non-photosensitive resin layer and a circuit pattern might contact. In addition, lamination was performed on condition of the linear pressure of 0.6 MPa, the linear speed of 3.6 m/min, and the roll temperature of 100 degreeC.

Then, the supporting body and the thermoplastic resin were peeled off simultaneously, and the protective film pattern image was obtained.

Furthermore, it heat-processed by 140 degreeC and 60 minutes, it thermosetted, and the protective film was formed on the circuit board.

<Non-photosensitive resin composition>

- 41 mass % ethyl cellosolve solution of methacrylic acid / cyclohexyl acrylate / methyl methacrylate copolymer (monomer mass ratio = 20/25/55, mass average molecular weight 80,000): 51.0 mass parts

Dipentaerythritol hexaacrylate: 10.0 parts by mass

· Fluorine surfactant F176PF (made by Dai Nippon Ink): 0.25 parts by mass

・Victoria Pure Blue BOH (manufactured by Hodogaya Chemical): 0.225 parts by mass

· Methyl ethyl ketone: 13.0 parts by mass

(Manufacture of image display device (touch panel))

The circuit wiring board with a protective film mentioned above was bonded to the liquid crystal display element manufactured by the method of Unexamined-Japanese-Patent No. 2009-047936, and the image display apparatus provided with the capacitance-type input device as a component is produced by a well-known method. did.

10: branches
12: thermoplastic resin layer
14: photosensitive resin layer
16: cover film
100: photosensitive transfer member
SL: Non-image area (exposed area)
G: Non-image area (exposed area)
DL: Frame of Alignment Fit

Claims (10)

A photosensitive transfer member having a support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order, comprising:
The Vicat softening point of the thermoplastic resin layer is 50 to 120 ° C, and the tensile modulus is 10 to 200 MPa,
The photosensitive transfer member, wherein the peel strength between the support and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer. The method according to claim 1,
The thickness of the said thermoplastic resin layer is more than 2 micrometers and less than 20 micrometers, The photosensitive transfer member. The method according to claim 1 or 2,
The thickness of the support is 6 to 50 µm, the photosensitive transfer member. 4. The method according to any one of claims 1 to 3,
The photosensitive transfer member, wherein the haze of the support is 0.5% or less. 5. The method according to any one of claims 1 to 4,
The photosensitive transfer member, wherein a haze of the laminate of the supporting member and the thermoplastic resin layer is 0.9% or less. 6. The method according to any one of claims 1 to 5,
The photosensitive transfer member, wherein the thermoplastic resin layer has a tensile modulus of elasticity of 50 to 200 MPa. 7. The method according to any one of claims 1 to 6,
Among the peel strengths between the respective layers of the support, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, the peel strength between the support and the thermoplastic resin layer is the strongest, and the peel strength between the photosensitive resin layer and the cover film is the weakest, photosensitive transfer member. A method for producing a resin pattern in which a resin pattern is produced in a roll-to-roll manner using the photosensitive transfer member according to any one of claims 1 to 7, the method comprising:
a peeling step of peeling the cover film from the photosensitive transfer member;
The bonding process of making the photosensitive resin layer in the photosensitive transfer member which peeled the cover film contact with the board|substrate which has a conductive layer, and bonding it;
an exposure step of pattern exposing the photosensitive resin layer;
Developing the exposed photosensitive resin layer to form a resin pattern in this order,
The manufacturing method of the resin pattern which has a process of simultaneously peeling a support body and a thermoplastic resin layer from the photosensitive transfer member between the said bonding process and the said exposure process, or between the said exposure process and the said image development process. A method for manufacturing circuit wiring, comprising: using the photosensitive transfer member according to any one of claims 1 to 7 to produce circuit wiring in a roll-to-roll manner,
a peeling step of peeling the cover film from the photosensitive transfer member;
The bonding process of making the photosensitive resin layer in the photosensitive transfer member which peeled the cover film contact with the board|substrate which has a conductive layer, and bonding it;
an exposure step of pattern exposing the photosensitive resin layer;
a developing process of developing the exposed photosensitive resin layer to form a resin pattern;
a step of etching the conductive layer in a region where the resin pattern is not disposed in this order;
The manufacturing method of circuit wiring which has a process of simultaneously peeling a support body and a thermoplastic resin layer from the photosensitive transfer member between the said bonding process and the said exposure process, or between the said exposure process and the said image development process. A method for producing a touch panel, comprising: using the photosensitive transfer member according to any one of claims 1 to 7 to produce a touch panel in a roll-to-roll manner,
a peeling step of peeling the cover film from the photosensitive transfer member;
The bonding process of making the photosensitive resin layer in the photosensitive transfer member which peeled the cover film contact with the board|substrate which has a conductive layer, and bonding it;
an exposure step of pattern exposing the photosensitive resin layer;
a developing process of developing the exposed photosensitive resin layer to form a resin pattern;
A step of etching the conductive layer in a region where the resin pattern is not arranged, in this order,
Between the said bonding process and the said exposure process, or between the said exposure process and the said image development process, it has the process of peeling a support body and a thermoplastic resin layer simultaneously from the photosensitive transfer member, The manufacturing method of a touchscreen.

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