WO2021056722A1 - 导电膜及其制作方法 - Google Patents

导电膜及其制作方法 Download PDF

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WO2021056722A1
WO2021056722A1 PCT/CN2019/117129 CN2019117129W WO2021056722A1 WO 2021056722 A1 WO2021056722 A1 WO 2021056722A1 CN 2019117129 W CN2019117129 W CN 2019117129W WO 2021056722 A1 WO2021056722 A1 WO 2021056722A1
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layer
seed layer
conductive
pattern groove
liquid
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PCT/CN2019/117129
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English (en)
French (fr)
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基亮亮
周小红
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苏州维业达触控科技有限公司
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Publication of WO2021056722A1 publication Critical patent/WO2021056722A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • the invention relates to the technical field of conductive films, in particular to a conductive film and a manufacturing method thereof.
  • Touch screens are very popular and common as a new type of input device, and the demand for conductive films that are indispensable as touch screens is also increasing.
  • the existing conductive film is prepared by scraping the conductive paste, and the purity of the conductive paste is low, so the resistance is high, so that the conductivity of the conductive film is poor, thereby affecting the sensitivity of the conductive film.
  • the upper surface of the conductive film prepared by the knife coating method is uneven and needs to be wiped to ensure the flatness of the upper surface so that the resistance of the conductive film is consistent throughout, and the conductivity of the conductive film is consistent.
  • the purpose of the present invention is to provide a conductive film with a simple method and a manufacturing method thereof.
  • the present invention provides a method for manufacturing a conductive film.
  • the method includes:
  • Curing forming a pattern groove on the cured adhesive layer, and forming a seed layer under the bottom of the pattern groove;
  • a conductive liquid is used to prepare a conductive layer in the pattern groove.
  • the step of transferring the seed layer liquid to the protrusions first control the surface of the mold with the protrusions to be parallel to the liquid surface of the seed layer liquid Then, the micro-contact method is used to make the protrusions come into contact with the seed layer liquid, and then the mold is controlled to rise and stand still, and the seed layer liquid aggregates into a spherical shape.
  • electroforming or electroless plating is used to grow a conductive material on the seed layer in the pattern groove, and the conductive material is formed after solidification.
  • the conductive layer in the step of preparing a conductive layer in the pattern groove: electroforming or electroless plating is used to grow a conductive material on the seed layer in the pattern groove, and the conductive material is formed after solidification. The conductive layer.
  • the thickness of the cured adhesive layer is 0.5-25um
  • the width of the pattern groove is 1-20um
  • the depth is 0.1-15um.
  • the seed layer liquid is a stannous chloride sensitizing liquid
  • the conductive liquid is a silver ammonia solution
  • the present invention also provides a conductive film, comprising a substrate, a cured adhesive layer provided on the surface of the substrate with patterned grooves, and a seed layer and a conductive layer arranged from bottom to top.
  • the conductive layer is provided on the pattern.
  • the seed layer is arranged below the bottom of the pattern groove, and the seed layer is arranged below the bottom of the pattern groove before the solidified adhesive layer is formed.
  • the surface of the bottom of the pattern groove has a depression, and the seed layer is disposed in the depression.
  • the concave surface is a spherical surface.
  • the thickness of the cured adhesive layer is 0.5-25um
  • the width of the pattern groove is 1-20um
  • the depth is 0.1-15um.
  • the material of the seed layer is stannous chloride, and the material of the conductive layer is silver.
  • the method for manufacturing a conductive film provided by the present invention transfers the seed layer liquid to the protrusions, forms patterned grooves on the cured adhesive layer, and forms a seed layer under the bottom of the patterned grooves, thereby making conductive
  • the conductive layer prepared by the liquid in the pattern groove has lower resistance than the conductive layer prepared by knife coating, thereby making the conductive film of the conductive film better.
  • FIG. 1 is a flow chart of steps of a method for manufacturing a conductive film according to an embodiment of the present invention
  • FIG. 2 is a process flow diagram of a method for manufacturing a conductive film according to an embodiment of the present invention
  • FIG. 3 is a schematic diagram of the structure of a conductive film according to an embodiment of the present invention.
  • the seed layer liquid and the seed layer belong to the liquid-solid state of the same substance, so the same label is used.
  • the present invention provides a method for manufacturing a conductive film, the method includes:
  • S1 Provide a substrate 1 and apply a layer of cured adhesive on the substrate 1 to form a cured adhesive layer 2;
  • the substrate 1 is made of high-transparency glass or high-molecular polyester (PET or PC or PMMA).
  • step S3 the seed layer liquid 3 is transferred to the top surface of the protrusion 51 of the mold 5 using a micro-contact method. Specifically, first, the side surface of the mold 5 with the protrusions 51 is controlled to be downward and parallel to the liquid surface of the seed layer liquid 3 to be contacted. Then control the surface of the protrusion 51 on the mold 5 to contact the liquid 3 having the seed layer. Then the mold 5 is controlled to rise and stand still, so that the seed layer liquid 3 is transferred to the surface of the protrusion 51 of the mold 5; the seed layer liquid 3 on the protrusion 51 condenses into a non-planar surface under the action of gravity and fluid force.
  • the seed layer liquid 3 is controlled to aggregate into a spherical shape according to the viscosity of the seed layer liquid 3.
  • the seed layer liquid 3 may be a stannous chloride sensitizing liquid; it is convenient for subsequent operations of the conductive layer 4.
  • step S4 when the mold 5 with the seed layer liquid 3 is imprinted on the cured adhesive layer 2, a pattern groove 21 is formed on the cured adhesive layer 2, and the seed layer liquid 3 is placed under the bottom of the pattern groove 21 A recess 23 is formed, wherein the seed layer liquid 3 is located in the recess 23.
  • the shape of the seed layer liquid 3 is related to its own viscosity and the viscosity of the cured adhesive.
  • the shape of the seed layer liquid 3 does not change, that is, the shape at this time is consistent with the shape after being transferred to the mold 5; when the viscosity of the seed layer liquid 3 is less than the viscosity of the cured adhesive, the seed layer Liquid 3 will deform, and the specific deformation amount is proportional to the difference in viscosity between the two, that is, the greater the difference, the greater the deformation. Therefore, controlling the viscosity of the seed layer liquid 3 can control the shape of the seed layer 3. It should be noted that regardless of the viscosity of the seed layer liquid 3, the upper surface of the formed seed layer 3 is flat and smooth, so that the resistance of the conductive layer 4 is consistent throughout.
  • step S7 the conductive liquid is grown on the seed layer 3 by electroforming or electroless plating, and the conductive layer 4 is formed on the seed layer 3 after curing.
  • the conductive liquid is a silver ammonia solution, and the conductive layer 4 made of silver is obtained.
  • the conductive film provided in the embodiment of the present invention includes a substrate 1, a cured adhesive layer 2 provided on the surface of the substrate 1 with patterned grooves 21, and a seed layer 3 and a conductive layer 4 arranged from bottom to top.
  • the conductive layer 4 is arranged in the pattern groove 21, the seed layer 3 is arranged under the bottom of the pattern groove 21, and the seed layer 3 is arranged under the bottom of the pattern groove 21 before the curing glue layer 2 is formed.
  • the transparency of the substrate 1 is high.
  • the thickness of the cured adhesive layer 2 is 0.5-25um.
  • the width of the pattern groove 21 is 1-20um, and the depth is 0.1-15um.
  • a depression 23 is also provided in the cured adhesive layer 2, and the depression 23 is arranged below the bottom of the pattern groove 21; the seed layer 3 is embedded in the depression 23, and the surface of the seed layer 3 in contact with the bottom of the pattern groove 21 is flat ( This surface overlaps or partially overlaps the bottom of the pattern groove 21, and the partial overlap means that the bottom of the pattern groove includes the entire upper surface of the seed layer), and the other side surface opposite to the surface is non-planar.
  • the non-planar surface of the seed layer 3 is spherical; the surface of the seed layer 3 in contact with the conductive layer 4 is flat and smooth.
  • the thickness of the conductive layer 4 is much larger than the thickness of the seed layer 3. It is beneficial to increase the conductivity of the conductive layer 4.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

一种导电膜的制作方法，包括：在衬底（1）上涂布一层固化胶，形成固化胶层（2）（S1）；提供一具有凸起（51）的模具（5）（S2）；将种子层液体转移到凸起（51）上（S3）；利用模具（5）压印固化胶层（2）（S4）；固化，形成图形凹槽（21），以及在图形凹槽（21）底部的下方形成种子层（3）（S5）；脱模（S6）；在图形凹槽（21）内制备导电层（4）（S7）。还公开了一种导电膜，包括衬底（1）、设置在衬底（1）表面具有图形凹槽（21）的固化胶层（2），以及种子层（3）和导电层（4），导电层（4）设置在图形凹槽（21）内，种子层（3）设置在图形凹槽（21）底部的下方，种子层（3）在固化胶层（2）形成前设置在图形凹槽（21）底部的下方。通过将种子层液体转移到凸起（51）上，在固化胶层（2）上形成图形凹槽（21），以及在图形凹槽（21）底部下方形成种子层（3），从而使得在图形凹槽（21）内制备的导电层（4）相对于刮涂制备的导电层电阻更低，进而使得导电膜的导电性能更佳。

Description

导电膜及其制作方法
本申请要求了申请日为2019年9月24日，申请号为201910907779.8的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及导电膜技术领域，特别是涉及一种导电膜及其制作方法。
背景技术
手机和平板电脑等越来越多的电子装置都采用触摸式屏幕，触摸屏作为一种新型的输入设备已十分流行和普遍，而作为触摸屏必不可少的导电膜需求量也越来越大。
现有导电膜将导电浆料采用刮涂方式制备，而导电浆料纯度较低，因而电阻较高，从而使得导电膜的导电性较差，进而影响导电膜的灵敏度。同时，刮涂方式制备的导电膜的上表面不平整，需擦拭，以保证上表面的平整从而使导电膜各处的电阻一致，进而使导电膜各处的导电性一致。
前面的叙述在于提供一般的背景信息，并不一定构成现有技术。
发明内容
本发明的目的在于提供一种方法简单的导电膜及其制作方法。
本发明提供一种导电膜的制作方法，该方法包括：
提供一衬底，在所述衬底上涂布一层固化胶，形成固化胶层；
提供一具有凸起的模具；
将种子层液体转移到所述凸起上；
利用具有所述种子层液体的模具压印所述固化胶层；
固化，在所述固化胶层形成图形凹槽，以及在所述图形凹槽底部的下方形成种子层；
脱模，所述模具分别与所述固化胶层和所述种子层分离；
使用导电液在所述图形凹槽内制备导电层。
在其中一实施例中，在所述将种子层液体转移到所述凸起上的步骤中：先控制所述模具具有所述凸起的一侧表面与具有所述种子层液体的液面平行，再采用微接触法使所述凸起与所述种子层液体接触，然后再控制所述模具上升静置，所述种子层液体凝聚呈球形。
在其中一实施例中，在所述图形凹槽内制备导电层的步骤中：在所述图形凹槽内采用电铸或化学镀的方式将导电材料生长在所述种子层上，固化后形成所述导电层。
在其中一实施例中，所述固化胶层的厚度为0.5～25um，所述图形凹槽的宽度为1～20um，深度为0.1～15um。
在其中一实施例中，所述种子层液体为氯化亚锡敏化液，所述导电液为银氨溶液。
本发明还提供一种导电膜，包括衬底、设置在所述衬底表面具有图形凹槽的固化胶层，以及由下向上设置的种子层和导电层，所述导电层设置在所述图形凹槽内，所述种子层设置在所述图形凹槽底部的下方，所述种子层在所述固化胶层形成前设置在所述图形凹槽底部的下方。
在其中一实施例中，所述图形凹槽底部的表面具有凹陷，所述凹陷内设置所述种子层。
在其中一实施例中，所述凹陷表面呈球形面。
在其中一实施例中，所述固化胶层的厚度为0.5～25um，所述图形凹槽的宽度为1～20um，深度为0.1～15um。
在其中一实施例中，所述种子层的材质为氯化亚锡，所述导电层的材质为银。
本发明提供的导电膜的制作方法，通过将种子层液体转移到所述凸起上，在所述固化胶层形成图形凹槽，以及在所述图形凹槽底部下方形成种子层，从而使得导电液在所述图形凹槽内制备的导电层相对于刮涂制备的导电层电 阻更低，进而使得导电膜的导电性能更佳。
附图说明
图1为本发明实施例导电膜的制作方法的步骤流程图；
图2为本发明实施例导电膜的制作方法的工艺流程图；
图3为本发明实施例导电膜的结构示意图。
具体实施方式
下面结合附图和实施例，对本发明的具体实施方式作进一步详细描述。以下实施例用于说明本发明，但不用来限制本发明的范围。其中，种子层液体和种子层属于同种物质的液固两种状态，因此采用同一标号。
请参图1和图2，本发明提供一种导电膜的制作方法，该方法包括：
S1：提供一衬底1，在衬底1上涂布一层固化胶，形成固化胶层2；
S2：提供一具有凸起51的模具5；
S3：将种子层液体3转移到凸起51上；
S4：利用具有种子层液体3的模具5压印固化胶层2；
S5：固化，在固化胶层2形成图形凹槽21，以及在图形凹槽21底部下方形成种子层3；
S6：脱模，模具5分别与固化胶层2和种子层3分离；
S7：使用导电液在所述图形凹槽21内制备导电层4。
在步骤S1中，衬底1采用透明度较高的玻璃、高分子聚酯(PET或PC或PMMA)。
在步骤S3中，采用微接触法将种子层液体3转移到模具5凸起51的顶部表面。具体地，先控制模具5具有凸起51的一侧表面向下，且与需要接触的种子层液体3的液体面平行。再控制模具5上凸起51的表面与具有种子层液体3接触。然后再控制模具5上升静置，如此便将种子层液体3转移到模 具5凸起51的表面上；凸起51上的种子层液体3在重力和流体力的作用下凝聚成非平面。
具体地，根据种子层液体3的黏度控制种子层液体3凝聚呈球形。
在本实施例中，种子层液体3可以为氯化亚锡敏化液；便于后续导电层4的操作。
在步骤S4中，将具有种子层液体3的模具5压印在固化胶层2上时，在固化胶层2上形成图形凹槽21，以及由种子层液体3在图形凹槽21底部的下方形成凹陷23，其中，种子层液体3位于凹陷23内。种子层液体3的形状与自身黏度及固化胶黏度有关。当种子层液体3黏度大于固化胶黏度时，种子层液体3形状不变，即，此时形状与转移到模具5上后的形状一致；当种子层液体3黏度小于固化胶黏度时，种子层液体3会发生形变，具体形变量与二者之间黏度差值呈正比，即，差值越大，形变越大。因此，控制种子层液体3的黏度就能控制种子层3的形状。需要说明的是，无论种子层液体3的黏度如何，所形成的种子层3的上表面均平整光滑，从而使导电层4各处电阻一致。
在步骤S7中，将导电液采用电铸或化学镀的方式在种子层3上生长，固化后在种子层3上形成导电层4。具体地，导电液为银氨溶液，得到材料为银的导电层4。
请参图3，本发明实施例中提供的导电膜，包括衬底1、设置在衬底1表面具有图形凹槽21的固化胶层2，以及由下向上设置的种子层3和导电层4。导电层4设置在图形凹槽21内，种子层3设置在图形凹槽21底部的下方，种子层3在固化胶层2形成前设置在图形凹槽21底部的下方。
衬底1的透明度高。固化胶层2的厚度为0.5～25um。图形凹槽21的宽度为1～20um，深度为0.1～15um。
在固化胶层2内还设有凹陷23，凹陷23设置在图形凹槽21底部的下方；种子层3嵌设在凹陷23内，且种子层3与图形凹槽21底部接触的表面呈平 面(此表面与图形凹槽21底部重叠或部分重叠，所述部分重叠是指图形凹槽底部包括种子层的全部上表面)，与该表面相对的另一侧表面呈非平面。
在本实施例中，种子层3非平面的表面呈球形面；种子层3与导电层4接触的表面平整光滑。
导电层4的厚度远大于种子层3和厚度。有利于导电层4导电性的提高。
在附图中，为了清晰起见，会夸大层和区域的尺寸和相对尺寸。应当理解的是，当元件例如层、区域或基板被称作“形成在”、“设置在”或“位于”另一元件上时，该元件可以直接设置在所述另一元件上，或者也可以存在中间元件。相反，当元件被称作“直接形成在”或“直接设置在”另一元件上时，不存在中间元件。
在本文中，术语“上”、“下”、“前”、“后”、“左”、“右”、“顶”、“底”、“内”、“外”、“竖直”、“水平”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了表达技术方案的清楚及描述方便，因此不能理解为对本发明的限制。
在本文中，除非另有说明，“多个”、“若干”的含义是两个或两个以上。
在本文中，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，除了包含所列的那些要素，而且还可包含没有明确列出的其他要素。
以上所述，仅为本发明的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应以所述权利要求的保护范围为准。

Claims (10)

  1. 一种导电膜的制作方法，其特征在于，该方法包括：
    提供一衬底，在所述衬底上涂布一层固化胶，形成固化胶层；
    提供一具有凸起的模具；
    将种子层液体转移到所述凸起上；
    利用具有所述种子层液体的模具压印所述固化胶层；
    固化，在所述固化胶层上形成图形凹槽，以及在所述图形凹槽底部的下方形成种子层；
    脱模，所述模具分别与所述固化胶层和所述种子层分离；
    使用导电液在所述图形凹槽内制备导电层。
  2. 如权利要求1所述的导电膜的制作方法，其特征在于，在所述将种子层液体转移到所述凸起上的步骤中：先控制所述模具具有所述凸起的一侧表面与具有所述种子层液体的液面平行，再采用微接触法使所述凸起与所述种子层液体接触，然后再控制所述模具上升静置，所述种子层液体凝聚呈球形。
  3. 如权利要求1所述的导电膜的制作方法，其特征在于，在所述图形凹槽内制备导电层的步骤中：在所述图形凹槽内采用电铸或化学镀的方式将导电材料生长在所述种子层上，固化后形成所述导电层。
  4. 如权利要求1所述的导电膜的制作方法，其特征在于，所述固化胶层的厚度为0.5～25um，所述图形凹槽的宽度为1～20um，深度为0.1～15um。
  5. 如权利要求1所述的导电膜的制作方法，其特征在于，所述种子层液体为氯化亚锡敏化液，所述导电液为银氨溶液。
  6. 一种导电膜，其特征在于，包括衬底、设置在所述衬底表面具有图形凹槽的固化胶层，以及由下向上设置的种子层和导电层，所述导电层设置在所述图形凹槽内，所述种子层设置在所述图形凹槽底部的下方，所述种子层在所述固化胶层形成前设置在所述图形凹槽底部的下方。
  7. 如权利要求6所述的导电膜，其特征在于，所述图形凹槽底部的表面具有凹陷，所述凹陷内设置所述种子层。
  8. 如权利要求7所述的导电膜，其特征在于，所述凹陷表面呈球形面。
  9. 如权利要求6所述的导电膜，其特征在于，所述固化胶层的厚度为0.5～25um，所述图形凹槽的宽度为1～20um，深度为0.1～15um。
  10. 如权利要求6所述的导电膜，其特征在于，所述种子层的材质为氯化亚锡，所述导电层的材质为银。
PCT/CN2019/117129 2019-09-24 2019-11-11 导电膜及其制作方法 WO2021056722A1 (zh)

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