WO2021056704A1 - 具有大拉伸性的一体化柔性基底与柔性电路及其制造方法 - Google Patents

具有大拉伸性的一体化柔性基底与柔性电路及其制造方法 Download PDF

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WO2021056704A1
WO2021056704A1 PCT/CN2019/116446 CN2019116446W WO2021056704A1 WO 2021056704 A1 WO2021056704 A1 WO 2021056704A1 CN 2019116446 W CN2019116446 W CN 2019116446W WO 2021056704 A1 WO2021056704 A1 WO 2021056704A1
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flexible
substrate
elastic modulus
integrated
flexible substrate
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PCT/CN2019/116446
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English (en)
French (fr)
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刘冉
林荣赞
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清华大学
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

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  • the invention relates to an integrated flexible substrate with large stretchability, a corresponding flexible circuit and a manufacturing method thereof, and belongs to the technical field of flexible electronics.
  • Flexible electronic technology is an emerging electronic technology. With this technology, electronic devices can be fabricated on a flexible substrate to achieve portability, bending, and stretching. It is expected to be widely used in information and medical fields. At this stage, the preparation and performance improvement of a single flexible electronic component has been rapidly developed, but the overall performance of the flexible circuit that integrates rigid components and flexible components has not been well improved at the system level, which greatly limits flexibility Further development of electronic technology applications.
  • strain isolation is an effective strategy, when a method that can achieve the effect of strain isolation is adopted, in addition to protecting the rigid components, it is also necessary to take into account the process complexity of the operation and the overall tensile stability, and it cannot bring new Hidden problems.
  • the prior art 1 discloses a method of applying an island bridge structure and liquid encapsulation, which can realize the encapsulation of an overall flexible electronic system.
  • the island bridge structure ensures the reliability of rigid components, and combined with the liquid encapsulation method, gives the overall circuit better bending and tensile properties. But it is precisely because of the use of liquid that not only increases the difficulty of the process in actual situations, but also has the problem of liquid leakage and volatilization.
  • the prior art 2 (Applied Physics Letters 2013, 102, 131904) discloses a method of applying an embedded rigid substrate to achieve strain isolation. Through this method, although the stretching of the flexible base will not cause damage to the components on the rigid base, there is no firm connection between the flexible base and the rigid base, which causes the flexible base to be easily separated from the embedded rigid base. The entire device fails due to accidental deformation.
  • the prior art 3 discloses a method of applying a modified substrate to isolate the strain introduced by the stretching of the flexible circuit, so as to improve the reliability of the flexible circuit.
  • the modified substrate of the manufactured flexible circuit is an integral structure, and the elastic modulus of the unmodified area in the modified substrate is smaller than the elastic modulus of the modified area, thereby achieving strain isolation.
  • the above-mentioned method uses a modified film method to modify the substrate, and its manufacturing accuracy will be limited.
  • the modified substrate obtained by the modification method has only two regions with different elastic modulus, which lacks expandability and is not conducive to more abundant applications.
  • the current system-level manufacturing methods and performance of flexible circuits still have the problems of high process complexity, overall stretchability and poor reliability. Therefore, it is particularly necessary to develop a flexible circuit manufacturing method with a simpler process, good device stretchability, and high reliability.
  • the present invention provides an integrated flexible substrate with large stretchability and a corresponding flexible circuit, as well as a manufacturing method of the flexible circuit, and a combination of different materials is prepared by optimizing the manufacturing process.
  • the integrated flexible substrate and the corresponding flexible circuit are prepared on this basis, which improves the reliability and stretchability of the overall flexible circuit.
  • the technical solution of the present invention is as follows.
  • the substrate is composed of two or more flexible materials with different elastic modulus.
  • the area formed by the flexible material with a higher elastic modulus carries rigid electronic components and has a higher elastic modulus.
  • the area formed by the low-flexibility material carries flexible electronic components.
  • the integrated flexible substrate provided by the present invention can carry various electronic components, and can protect the rigid electronic components when subjected to the overall stretching and deformation, solve the compatibility problem of the rigid electronic components and the flexible electronic components in the flexible circuit, and realize the overall flexibility The stretchability and stability of the circuit.
  • the difference in elastic modulus between a flexible material with a higher elastic modulus and a flexible material with a lower elastic modulus is more than 5 times.
  • the substrate is composed of a combination of silicone or polyurethane elastomer.
  • the high elastic modulus material of the substrate is PDMS, and the low elastic modulus material is Ecoflex.
  • the substrate is composed of two or more flexible materials with different elastic moduli in one or more dimensions of length, width, and height.
  • flexible materials with different elastic moduli are connected and fixed by one or more of chemical methods and physical methods, preferably by chemical methods.
  • the substrate is formed by one or more methods of additive manufacturing, printing, and pouring to achieve patterned preparation and then solidified, preferably by additive manufacturing to achieve patterned preparation and then solidified.
  • the integrated flexible circuit with large stretchability includes a component layer and an encapsulation layer.
  • the component layer is formed by the integrated flexible substrate provided by the present invention to carry electronic components.
  • the element layer is composed of a single-layer element and an insulating layer together or a multi-layer element and an insulating layer together.
  • the encapsulation layer is composed of one polymer, or is formed by splicing and combining multiple polymers.
  • the manufacturing method of the above-mentioned integrated flexible circuit includes the following steps:
  • An encapsulation layer is patterned on the component layer.
  • the patterning in step (2) is achieved by one or more methods of additive manufacturing, printing, and pouring, and the curing is achieved by one or more of solvent volatilization, thermal curing, and ultraviolet curing. A variety of methods to achieve.
  • the present invention has the following advantages and outstanding technical effects:
  • a flexible substrate composed of a variety of materials with different elastic modulus provides strain isolation for protecting rigid components while maintaining the flexibility and stretchability of the overall flexible circuit;
  • the substrate of integrated manufacturing and integrated structure improves the stability and reliability of the overall device
  • the method is scalable and can be adapted to the packaging requirements of different flexible circuit systems.
  • Fig. 1 is a flow chart of a method for manufacturing an integrated flexible circuit with large stretchability provided by the present invention.
  • Fig. 2 is a flowchart of step S12 in a preferred additive manufacturing embodiment of the present invention.
  • Fig. 3 is a flow chart of the additive manufacturing of step S13 of an element layer with a single-layer element using conductive silver paste as a wire in the present invention.
  • Fig. 4 is a schematic diagram of an integrated flexible substrate with large stretchability provided by the present invention.
  • the first embodiment of the present invention provides an integrated flexible substrate with large stretchability.
  • the substrate is composed of materials with different elastic moduli and has an integrated structure.
  • the type and quantity of materials used in the flexible substrate there are no special restrictions on the type and quantity of materials used in the flexible substrate, as long as the materials are in a liquid state before being formed, can be solidified and formed and can be spliced and combined together.
  • the material used for the flexible substrate of the present invention may typically be a flexible material including silicone and polyurethane elastomer.
  • the number of materials used in the flexible substrate of the present invention is two or more than two, typically two.
  • the area with high elastic modulus basically does not deform, so it provides strain isolation and is responsible for protecting rigid components; while the area with low elastic modulus bears most of the deformation and provides excellent tensile properties.
  • the present invention does not limit the elastic modulus of different materials used in the flexible substrate and the degree of difference in elastic modulus.
  • 100 kPa can be used as the dividing line, 100 kPa or less is a low elastic modulus, and 100 kPa or more is a high elastic modulus. If the elastic modulus of different materials selected are too close, the effect of strain isolation will be worse.
  • the difference of elastic modulus can be selected to be 5 times or more.
  • the present invention has no particular limitation on the combination of the materials used in the flexible substrate, which can be spliced and combined in the same plane, or can be superimposed in the thickness direction.
  • different materials need to be patterned, and the area where different materials can contact each other is small. If the connection method is not strong enough, there may be a problem of easy separation between each other, but In this way, a thinner flexible substrate can be obtained.
  • Superimposed in the thickness direction the contact area between each other will be larger, but the thickness of the overall flexible substrate will be increased.
  • the appropriate combination can be selected according to actual application requirements.
  • the present invention has no limitation on the patterned structure in the flexible substrate, and may be connected to each other and/or spaced apart from each other.
  • the present invention does not limit the connection between different materials used in the flexible substrate, and may be a physical method and/or a chemical method. It is preferably a chemical method, which can treat the surface of the material or rely on cross-linking between different materials to achieve connection and fixation.
  • the present invention has no limitation on the patterned preparation method of the flexible substrate, which can be additive manufacturing, printing, pouring or a combination thereof. It is preferably additive manufacturing, which is conducive to the preparation of structures with higher complexity through higher degree of automation.
  • the present invention has no limitation on the curing method of the material used in the flexible substrate, which can be solvent volatilization, thermal curing, ultraviolet curing, or a combination thereof.
  • the curing method of the material used in the flexible substrate which can be solvent volatilization, thermal curing, ultraviolet curing, or a combination thereof.
  • different curing schemes are used to speed up the curing speed and improve the preparation efficiency.
  • the second embodiment of the present invention provides a method for manufacturing an integrated flexible circuit with large stretchability.
  • the steps are shown in FIG. 1, and the method includes steps S11 to S14.
  • step S11 polymer solutions with different elastic moduli are configured.
  • the invention has no limitation on the material type and solution viscosity of the polymer.
  • the material is preferably silicone or polyurethane elastomer.
  • the viscosity of the polymer solution can be adjusted according to different processing techniques. In the additive manufacturing process, the preferred viscosity range is 10-10000 mPa ⁇ s, more preferably 500-8000 mPa ⁇ s.
  • step S12 the configured polymer solution is sequentially patterned and cured to obtain an integrated flexible substrate.
  • the patterned shape of the polymer is determined according to the components to be mounted and the circuit pattern.
  • the area shape of the higher elastic modulus material is determined by the size, shape and placement of the rigid element.
  • the area shape of the lower elastic modulus material is mainly determined by the shape of the overall circuit.
  • the patterned structures and shapes of materials with different elastic moduli in the flexible substrate may be connected to each other and/or spaced apart from each other.
  • the present invention has no limitation on the graphical preparation method of the polymer solution, which can be additive manufacturing, printing, pouring or a combination thereof. Considering the complexity of the graphics and the simplicity of the process operation, additive manufacturing is preferred.
  • Fig. 2 is a flowchart of step S12 in a preferred additive manufacturing implementation, including steps S111 to S114.
  • step S121 drawing software is used to design the shape of each material area according to device requirements.
  • step S122 the image is converted into G-code instructions that can be recognized by the additive manufacturing machine.
  • step S123 the configured polymer solutions are respectively loaded into the additive manufacturing machine, and appropriate printing parameters are selected, such as the inner diameter of the needle, the size of the air pressure, and the temperature of the bottom plate.
  • step S124 the additive manufacturing machine is automatically controlled to print according to a preset pattern.
  • the present invention has no limitation on the curing method of the material used in the flexible substrate, which can be solvent volatilization, thermal curing, ultraviolet curing, or a combination thereof.
  • the curing method of the material used in the flexible substrate which can be solvent volatilization, thermal curing, ultraviolet curing, or a combination thereof.
  • different curing schemes are used to speed up the curing speed and improve the preparation efficiency.
  • the heating temperature can be controlled to speed up the curing process and reduce the diffusion of the polymer solution, which is beneficial to the more accurate and stable shape characteristics after the patterning, and the accuracy of the patterning is improved.
  • the present invention has no limitation on the range of heating temperature, and suitable heating temperature can be selected according to different materials and manufacturing parameters. Taking into account the safety of operation and the compatibility of subsequent processes, the heating temperature should not exceed 300°C in general, and the temperature range of 40 to 80°C is preferred.
  • the present invention does not limit the integration scheme of the flexible substrate, and different materials can be connected and fixed by physical methods and/or chemical methods. Preferably, it is a chemical method. It is more preferable to rely on cross-linking between different materials to achieve connection and fixation. In a more preferred solution, there is no need to add additional reagent materials or additional processing steps. It is enough to directly complete the patterning of different polymers in sequence, but it is required that different polymer materials need to be in direct contact, and all the materials must be in direct contact. Before the material is patterned, the patterned material cannot be completely cured.
  • step S13 the rigid element is placed on the substrate in the high elastic modulus area, and the flexible element, such as a stretchable wire, is placed on the substrate in the low elastic modulus area to complete the preparation of the element layer.
  • the present invention has no limitation on the types of stretchable elements, which typically can be patterned metal wires or wires made of stretchable materials.
  • the pattern of the metal wire can be snake-shaped, horseshoe-shaped, spiral-shaped, and so on.
  • a stretchable material with suitable properties can be selected according to actual needs, for example, a composite material made of a blend of conductive particles and an elastomer material.
  • the present invention does not limit the composition of the element layer, and the element layer may be composed of a single-layer element or a multi-layer element and an insulating layer together.
  • FIG. 3 is a flow chart of additive manufacturing of step S13 of an element layer with a single-layer element using conductive silver paste as a wire, including steps S131 to S136.
  • step S131 the trajectory of the wire is designed with drawing software.
  • step S132 the trajectory is converted into a G-code instruction that can be recognized by the additive manufacturing machine.
  • step S133 the conductive silver paste is loaded into the additive manufacturing machine, and appropriate printing parameters are selected, such as the inner diameter of the needle, the air pressure, and the temperature of the bottom plate.
  • step S134 the additive manufacturing machine is automatically controlled to print according to the preset trajectory
  • step S135 the components are placed on the corresponding positions of the high elastic modulus area of the integrated flexible substrate, and the pins of the components should be in contact with the aforementioned wires.
  • step S136 the bottom plate is heated to completely volatilize the solvent in the conductive silver paste and improve the conductivity.
  • step S14 an encapsulation layer is patterned on the element layer.
  • the present invention does not limit the composition of the encapsulation layer.
  • the encapsulation layer can be formed by splicing and combining one polymer or multiple polymers, and the polymer material is silica gel or polyurethane elastomer. Taking into account the overall tensile properties of the device, the elastic modulus of the material used in the encapsulation layer cannot be higher than the elastic modulus of the material in the corresponding area of the flexible substrate.
  • the preparation of the encapsulation layer can be completed according to step S121 to step S124.
  • Example 1 Preparation of an integrated flexible substrate with large stretchability
  • the flexible substrate used is composed of two kinds of silica gel, wherein the high elastic modulus material is PDMS, and the low elastic modulus material is Ecoflex.
  • the patterned preparation process used is additive manufacturing. The specific implementation process is as follows:
  • the stretchable wire used is conductive silver paste.
  • the encapsulation layer material used is Ecoflex.
  • the wire should be located in the low elastic modulus area and extend to the component pins in the high elastic modulus area;

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Abstract

具有大拉伸性的一体化柔性基底与柔性电路及其制造方法，属于柔性电子技术领域。通过制备由多种具有不同弹性模量的材料组成的一体化柔性基底，然后将刚性元件置于高弹性模量区域（101）的基底上，将柔性元件置于低弹性模量区域（102）的基底上，再对其封装，得到柔性电路。可以达到应变隔离的效果，满足对刚性元件保护的要求，提高了整体器件的稳定性和可靠性，实现柔性电路的柔性和拉伸性。

Description

具有大拉伸性的一体化柔性基底与柔性电路及其制造方法 技术领域
本发明涉及一种具有大拉伸性的一体化柔性基底与相应柔性电路及其制造方法，属于柔性电子技术领域。
背景技术
柔性电子技术是一种新兴电子技术，利用这种技术，可以将电子器件制作在柔性的基底上，实现便携、弯折和拉伸等性能，有望被广泛应用于信息和医疗等领域。现阶段，单个柔性电子元件的制备和性能提高已经得到了快速的发展，而集成了刚性元件和柔性元件的柔性电路在系统层面的整体性能却一直没有得到很好的提升，这大大限制了柔性电子技术应用的进一步发展。
从柔性电路的研究来看，最为常见的策略是通过应变隔离策略对刚性元件进行保护，来满足集成了刚性元件的柔性电路在拉伸性和稳定性方面的要求。尽管应变隔离是一个有效的策略，但在采取可以达到应变隔离效果的方法时，除了需要保护刚性元件，还需要兼顾到操作的工艺复杂度和整体的拉伸稳定性，并且不能带来新的问题隐患。
现有技术1(Science 2014,344,70)公开了一种应用岛桥结构和液体封装的方法，可以实现整体柔性电子系统的封装。岛桥结构确保了刚性元件的可靠性，并结合液体封装的方法，赋予了整体电路较好的弯折和拉伸性能。但正是由于使用了液体，在实际情况中不仅仅增加了工艺难度，还会存在液体泄漏和挥发的问题。
现有技术2(Applied Physics Letters 2013,102,131904)公开了一种应用嵌入刚性基板的方法，来实现应变隔离。通过这样的方法，虽然柔性基底的拉伸不会对刚性基板上的元件造成破坏，但是柔性基底与刚性基板之间没有形成牢固的连接，导致柔性基底容易与内嵌的刚性基板脱离，从而使得整个器件发生意外形变而失效。
现有技术3(CN108682665B)公开了一种应用改性衬底的方法来隔离柔性电路拉伸所引入的应变，以提高柔性电路的可靠性。所制造的柔性电路的改性后的基底为一体结构，且改性后的基底中未改性区域的弹性模量小于改性区域的弹性模量，从而实现应变隔离。上述方法由于采用改性膜的方法对基底进行改性，其制造精度会受到限制。而且，通过改性方法得到的改性基底只有两种不同弹性模量的区域，缺乏扩展性，不利于更加丰富的应用。
因此，目前在柔性电路的系统层面的制造方法和性能上，仍然存在工艺复杂度高、整体拉伸性和可靠性差的问题。因而，开发一种工艺更简单、器件拉伸性好、可靠性高的柔性电 路制造方法显得尤为必要。
发明内容
为解决现有技术存在的上述问题，本发明提供一种具有大拉伸性的一体化柔性基底与相应柔性电路，以及柔性电路的制造方法，通过优化制造工艺制备出由不同材料组合而成的一体化柔性基底，并在此基础上制备相应柔性电路，提高了整体柔性电路的可靠性和拉伸性。为了实现上述目的，本发明的技术方案如下。
具有大拉伸性的一体化柔性基底，所述基底由两种以上具有不同弹性模量的柔性材料组合而成，弹性模量较高的柔性材料形成的区域承载刚性电子元件，弹性模量较低的柔性材料形成的区域承载柔性电子元件。本发明提供的一体化柔性基底可以承载各种电子元件，并能够在经受整体拉伸变形时对刚性电子元件进行保护，解决柔性电路中刚性电子元件与柔性电子元件的兼容性问题，实现整体柔性电路的拉伸性和稳定性。
在一些具体实施方案中，弹性模量较高的柔性材料与弹性模量较低的柔性材料的弹性模量差异为5倍以上。
在一些具体实施方案中，所述基底由硅胶或聚氨酯弹性体组合而成。
在一些具体实施方案中，所述基底的高弹性模量材料为PDMS，低弹性模量材料为Ecoflex。
在一些具体实施方案中，所述基底由两种以上具有不同弹性模量的柔性材料在长度、宽度、高度中的一个或多个维度拼接组合而成。
在一些具体实施方案中，具有不同弹性模量的柔性材料通过化学方法、物理方法中的一种或多种连接固定，优选通过化学方法连接固定。
在一些具体实施方案中，所述基底通过增材制造、印刷、浇筑中的一种或多种方法实现图形化制备后固化而成，优选通过增材制造实现图形化制备后固化而成。
具有大拉伸性的一体化柔性电路，包括元件层和封装层，元件层由本发明提供的一体化柔性基底承载电子元件形成。
在一些具体实施方案中，所述元件层由单层元件与绝缘层一并组成或多层元件与绝缘层一并组成。
在一些具体实施方案中，所述封装层由一种聚合物构成，或者由多种聚合物拼接组合而成。
上述一体化柔性电路的制造方法，包括如下步骤：
(1)配置两种以上具有不同弹性模量的聚合物溶液；
(2)将配置好的聚合物溶液依次图形化并固化，得到一体化柔性基底；
(3)将刚性电子元件置于基底较高弹性模量区域，将柔性电子元件置于基底较低弹性模量区域，完成元件层的制备；
(4)在元件层上层图形化制备一层封装层。
在一些具体实施方案中，步骤(2)所述图形化通过增材制造、印刷、浇筑中的一种或多种方法实现，所述固化通过溶剂挥发、热固化、紫外固化中的一种或多种方法实现。
本发明与现有技术相比，具有以下优点及突出性的技术效果：
1)多种不同弹性模量的材料组成的柔性基底，在为保护刚性元件提供应变隔离的同时，维持了整体柔性电路的柔性和拉伸性；
2)一体化制造和一体化结构的基底，提高了整体器件的稳定性和可靠性；
3)简易快速的工艺方案，提高了柔性电路制备效率的同时也确保了制造的精度。
4)方法具有可扩展性，可适用不同柔性电路系统的封装需求。
附图说明
图1是本发明提供的具有大拉伸性的一体化柔性电路的制备方法的流程图。
图2是本发明优选的增材制造实施方式中步骤S12的流程图。
图3是本发明中使用导电银浆作为导线的具有单层元件的元件层的步骤S13的增材制造流程图。
图4是本发明提供的具有大拉伸性的一体化柔性基底的示意图。
附图标记：101-高弹性模量区域；102-低弹性模量区域。
具体实施方式
为使本发明的目的、技术方案和优点更加清楚明白，下面将结合附图对本发明做进一步详细说明。
<第一实施方式>
本发明的第一实施方式提供了一种具有大拉伸性的一体化柔性基底，所述基底由具有不同弹性模量的材料组合而成，具有一体化结构。
本发明对柔性基底中所使用的材料种类和材料数量没有特别限制，只要是材料成型前为液态，可以实现固化成型并能相互之间拼接组合在一起即可。
不受限制的，本发明中的柔性基底所使用的材料典型地可以为包括硅胶和聚氨酯弹性体在内的柔性材料。
不受限制的，本发明中的柔性基底所使用的材料数量为两种或两种以上，典型地可以为两种。在柔性基底整体受到拉伸时，只需要两种在弹性模量上具有差异的材料即可同时实现柔性基底的拉伸性和可靠性。高弹性模量的区域基本不发生形变，因而提供了应变隔离，负 责保护刚性元件；而低弹性模量的区域承载了绝大部分形变，提供优异的拉伸性能。
本发明对柔性基底中所使用的不同材料的弹性模量和弹性模量上的差异程度没有限制。通常，可以以100kPa为分界线，100kPa以下为低弹性模量，100kPa以上为高弹性模量。若选取的不同材料的弹性模量过于接近，则会导致应变隔离的效果变差，一般可以选取弹性模量差异为5倍及以上。
本发明对柔性基底中所使用的材料的组合方式没有特别限制，可以在同一平面内进行拼接组合，也可以在厚度方向上叠加。在同一平面内进行拼接组合，则需要对不同的材料都进行图形化，且不同材料之间可以相互接触的面积较小，若连接方式不够牢靠，则可能存在相互之间容易分离的问题，但是这种方式可以得到较薄的柔性基底。在厚度方向上叠加，相互之间的接触面积会更大，但是增加了整体柔性基底的厚度。可以根据实际应用要求来选择合适的组合方式。
本发明对柔性基底中的图形化结构没有限制，可以是相互连接和/或相互间隔的。
本发明对柔性基底中所使用的不同材料之间的连接方式没有限制，可以为物理方法和/或化学方法。优选为化学方法，可以对材料表面进行处理或者依靠不同材料之间相互发生交联实现连接固定。
本发明对柔性基底的图形化制备方法没有限制，可以为增材制造、印刷、浇筑或它们的组合。优选为增材制造，有利于通过更高的自动化程度操作来实现更高复杂度的结构的制备。
本发明对柔性基底中所使用的材料的固化方式没有限制，可以是溶剂挥发、热固化、紫外固化或它们的组合。针对不同的材料，使用不同的固化方案，加快固化速度，提高制备效率。
<第二实施方式>
本发明的第二实施方式提供了一种具有大拉伸性的一体化柔性电路的制作方法，其步骤如图1所示，该方法包括步骤S11至S14。
在步骤S11中，配置具有不同弹性模量的聚合物溶液。
本发明对聚合物的材料种类和溶液粘度没有限制。材料优选为硅胶或者聚氨酯弹性体。聚合物溶液的粘度是可以依据不同的加工工艺来调整的。在增材制造加工工艺中，优选的粘度范围为10-10000mPa·s，更优选为500-8000mPa·s。
在步骤S12中，将配置好的聚合物溶液依次图形化并固化，得到一个一体化的柔性基底。
在本发明中，聚合物的图形化形状是根据待安装的元件和电路图形来确定的。较高弹性模量材料的区域形状由刚性元件的尺寸大小、形状和放置的位置来确定的。较低弹性模量材料的区域形状是主要是由整体电路的外形来确定的。因而，柔性基底中不同弹性模量的材料 的图形化结构和形状可以是相互连接和/或相互间隔的。
本发明对聚合物溶液的图形化制备方法没有限制，可以为增材制造、印刷、浇筑或它们的组合。考虑到图形的复杂程度以及工艺操作的简便性，优选为增材制造。
图2为优选的增材制造实施方式中步骤S12的流程图，包括步骤S111至S114。
在步骤S121中，按器件需求，用制图软件设计出各材料区域的外形。
在步骤S122中，将图像转换为增材制造机器可以识别的G-code指令。
在步骤S123中，将配置好的聚合物溶液分别装载到增材制造机器中，选取合适的打印参数，如针头内径、气压大小、底板温度等。
在步骤S124中，自动控制增材制造机器，按预设图形打印。
本发明对柔性基底中所使用的材料的固化方式没有限制，可以是溶剂挥发、热固化、紫外固化或它们的组合。针对不同的材料，使用不同的固化方案，加快固化速度，提高制备效率。
在本发明的制备过程中，可通过控制加热温度，来加快固化进程，减弱聚合物溶液的扩散，从而有利于图形化后的外形特征更加准确、稳定，提高图形化的精度。
本发明对加热温度的范围没有限制，可以依据不同的材料和制造参数来选择合适的加热温度。考虑到操作的安全性以及对后续工艺的兼容性，一般情况下的加热温度不应超过300℃，以40到80℃的温度范围为优。
本发明对柔性基底的一体化方案没有限制，不同材料之间可以以物理方法和/或化学方法进行连接固定。优选为化学方法。更优选为依靠不同材料之间相互发生交联实现连接固定。在更优选方案中，不需要添加额外的试剂材料，也不需要额外的处理步骤，直接依次完成不同聚合物的图形化即可，但是要求不同聚合物材料之间需要直接接触，并且在完成所有材料的图形化之前，已图形化的材料不能完全固化。
在步骤S13中，将刚性元件置于高弹性模量区域的基底上，并将柔性元件，如可拉伸导线等，置于低弹性模量区域的基底上，完成元件层的制备。
本发明对可拉伸元件的种类没有限制，典型地可以为图形化金属导线或可拉伸材料做成的导线。金属导线的图形可以是蛇形、马蹄形、螺旋形等。可按实际需求选择具有合适性能的可拉伸材料，例如是由导电颗粒与弹性体材料共混而成的复合材料。
本发明对元件层的组成没有限制，所述元件层可由单层元件或多层元件和绝缘层一并组成。
图3是使用导电银浆作为导线的具有单层元件的元件层的步骤S13的增材制造流程图，包括步骤S131至S136。
在步骤S131中，用制图软件设计出导线的轨迹。
在步骤S132中，将轨迹转换为增材制造机器可以识别的G-code指令。
在步骤S133中，将导电银浆载到增材制造机器中，选取合适的打印参数，如针头内径、气压大小、底板温度等。
在步骤S134中，自动控制增材制造机器，按预设轨迹打印
在步骤S135中，在一体化柔性基底的高弹性模量区域的相应位置上放上元器件，元器件引脚要与前述导线接触。
在步骤S136中，底板加热，使导电银浆中的溶剂完全挥发，提高导电性。
在步骤S14中，在元件层上层图形化制备一层封装层。
本发明对封装层的组成没有限制，所述封装层可由一种聚合物或多种聚合物拼接组合而成，聚合物材料为硅胶或聚氨酯弹性体。考虑到器件的整体拉伸性能，封装层所用材料的弹性模量不能高于柔性基底相应区域的材料的弹性模量。
封装层的制备可按步骤S121至步骤S124完成。
为了更好的理解本发明，下面结合实施例对本发明做进一步的详细说明。然而，本发明保护范围不局限于实施例所表达的范围。
下述实施例中所述实验方法，如无特殊说明，均为常规方法；所述试剂和材料，如无特殊说明，均可从商业途径获得。
实施例1：制备具有大拉伸性的一体化柔性基底
所用柔性基底由两种硅胶组成，其中高弹性模量材料为PDMS，低弹性模量材料为Ecoflex。所用图形化制备工艺为增材制造。具体实施过程如下：
1.通过制图软件画出柔性基底中各个区域的外形，各个区域之间相互接触；
2.将图像转换为增材制造机器可以识别的G-code指令；
3.将PDMS的主剂和固化剂按10比1的质量比混匀，抽真空以消除气泡；
4.将混匀好的PDMS装载到增材制造机器的针筒中，所用针头内径为0.34mm，气压为30psi，底板温度为70℃，按预设图形在底板上打印出PDMS区域；
5.将Ecoflex的A组分和B组分按1比1的质量比混匀，抽真空以消除气泡；
6.将混匀好的Ecoflex装载到增材制造机器的针筒中，所用针头内径为0.34mm，气压为30psi，底板温度为50℃，按预设图形在底板上打印出Ecoflex区域；
7.继续在50℃下加热半小时，使柔性基底完全固化。
实施例2：制备具有大拉伸性的一体化柔性电路
所用可拉伸导线为导电银浆。所用封装层材料为Ecoflex。
1.通过制图软件画出导线的轨迹和封装层的外形，导线应位于低弹性模量区域，并延伸到高弹性模量区域的元器件引脚处；
2.将图像转换为增材制造机器可以识别的G-code指令；
3.将导电银浆装载到增材制造机器的针筒中，所用针头内径为0.09mm，气压为30psi，按预设图形打印出导线；
4.在上述制好的一体化柔性基底的高弹性模量区域的相应位置上放上元器件，元器件引脚与导线接触；
5.在80℃下加热半小时，使导电银浆中的溶剂完全挥发，提高导电性；
6.将Ecoflex的A组分和B组分按1比1的质量比混匀，抽真空以消除气泡；
7.将混匀好的Ecoflex装载到增材制造机器的针筒中，所用针头内径为0.34mm，气压为30psi，底板温度为50℃，按预设图形在上述完成的器件上打印出Ecoflex封装层；
8.继续在50℃下加热半小时，使柔性电路完全固化。

Claims (14)

  1. 具有大拉伸性的一体化柔性基底，其特征在于，所述基底由两种以上具有不同弹性模量的柔性材料组合而成，弹性模量较高的柔性材料形成的区域承载刚性电子元件，弹性模量较低的柔性材料形成的区域承载柔性电子元件。
  2. 根据权利要求1所述的一体化柔性基底，其特征在于，弹性模量较高的柔性材料与弹性模量较低的柔性材料的弹性模量差异为5倍以上。
  3. 根据权利要求1所述的一体化柔性基底，其特征在于，所述基底由硅胶或聚氨酯弹性体组合而成。
  4. 根据权利要求1所述的一体化柔性基底，其特征在于，所述基底的高弹性模量材料为PDMS，低弹性模量材料为Ecoflex。
  5. 根据权利要求1所述的一体化柔性基底，其特征在于，所述基底由两种以上具有不同弹性模量的柔性材料在长度、宽度、高度中的一个或多个维度拼接组合而成。
  6. 根据权利要求1所述的一体化柔性基底，其特征在于，具有不同弹性模量的柔性材料通过化学方法、物理方法中的一种或多种连接固定。
  7. 根据权利要求1所述的一体化柔性基底，其特征在于，具有不同弹性模量的柔性材料通过化学方法连接固定。
  8. 根据权利要求1所述的一体化柔性基底，其特征在于，所述基底通过增材制造、印刷、浇筑中的一种或多种方法实现图形化制备后固化而成。
  9. 根据权利要求1所述的一体化柔性基底，其特征在于，所述基底通过增材制造实现图形化制备后固化而成。
  10. 具有大拉伸性的一体化柔性电路，包括元件层和封装层，其特征在于，元件层由权利要求1-9任一权利要求所述的一体化柔性基底承载电子元件形成。
  11. 根据权利要求10所述的一体化柔性电路，其特征在于，所述元件层由单层元件与绝缘层一并组成或多层元件与绝缘层一并组成。
  12. 根据权利要求10所述的一体化柔性电路，其特征在于，所述封装层由一种聚合物构成，或者由多种聚合物拼接组合而成。
  13. 根据权利要求10-12所述的一体化柔性电路的制造方法，其特征在于，包括如下步骤：
    (1)配置两种以上具有不同弹性模量的聚合物溶液；
    (2)将配置好的聚合物溶液依次图形化并固化，得到一体化柔性基底；
    (3)将刚性电子元件置于基底较高弹性模量区域，将柔性电子元件置于基底较低弹性模量区域，完成元件层的制备；
    (4)在元件层上层图形化制备一层封装层。
  14. 根据权利要求13所述的制造方法，其特征在于，步骤(2)所述图形化通过增材制造、印刷、浇筑中的一种或多种方法实现，所述固化通过溶剂挥发、热固化、紫外固化中的一种或多种方法实现。
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