WO2021051469A1 - Semiconductor laser - Google Patents

Semiconductor laser Download PDF

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Publication number
WO2021051469A1
WO2021051469A1 PCT/CN2019/112282 CN2019112282W WO2021051469A1 WO 2021051469 A1 WO2021051469 A1 WO 2021051469A1 CN 2019112282 W CN2019112282 W CN 2019112282W WO 2021051469 A1 WO2021051469 A1 WO 2021051469A1
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WO
WIPO (PCT)
Prior art keywords
light
collimating lens
incident
semiconductor laser
axis collimating
Prior art date
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PCT/CN2019/112282
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French (fr)
Chinese (zh)
Inventor
周少丰
刘鹏
陈丕新
Original Assignee
深圳市星汉激光科技股份有限公司
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Publication of WO2021051469A1 publication Critical patent/WO2021051469A1/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4012Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0905Dividing and/or superposing multiple light beams
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0916Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0916Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers
    • G02B27/0922Adapting the beam shape of a semiconductor light source such as a laser diode or an LED, e.g. for efficiently coupling into optical fibers the semiconductor light source comprising an array of light emitters
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/095Refractive optical elements
    • G02B27/0955Lenses
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938Using specific optical elements
    • G02B27/0977Reflective elements
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/005Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping
    • H01S5/0071Optical components external to the laser cavity, specially adapted therefor, e.g. for homogenisation or merging of the beams or for manipulating laser pulses, e.g. pulse shaping for beam steering, e.g. using a mirror outside the cavity to change the beam direction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00Semiconductor lasers
    • H01S5/40Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4075Beam steering

Definitions

  • the embodiment of the present invention relates to the field of laser technology, in particular, to a semiconductor laser.
  • the embodiment of the present invention aims to provide a semiconductor laser, which can solve the technical problem that the coupling arrangement of multiple light sources in the prior art is unreasonable, resulting in poor quality of the emitted beam.
  • a semiconductor laser including:
  • a light beam coupling structure includes a phase retarder and a polarization coupler, the polarization coupler includes a first incident direction and a second incident direction, and the phase retarder is located in the first incident direction;
  • the light-emitting unit comprising a laser chip, a fast-axis collimating lens and a slow-axis collimating lens, the emitted light beam of the laser chip passes through the fast-axis collimating lens and the slow-axis collimating lens in sequence , And incident to the beam coupling structure, wherein a part of the emitted light beam of the light emitting unit enters the polarization coupler along the first incident direction after passing through the phase retarder, and another part of the light emitting unit The outgoing light beam is incident on the polarization coupler along the second incident direction.
  • the first incident direction and the second incident direction are respectively provided with the same number of emitted light beams of the light emitting unit.
  • the semiconductor laser further includes a first reflector, and the light beam emitted by the laser chip passes through the fast-axis collimator lens and the slow-axis collimator lens in sequence, and is incident on the first reflector, After changing the direction of the light path, it is incident on the light beam coupling structure.
  • the light output unit includes a beam combining mirror, a plurality of the laser chips, a plurality of the fast axis collimating lenses corresponding to the plurality of laser chips, and a plurality of slow axis collimators.
  • Lens and a plurality of said first reflecting mirrors the emitted light beam of each said laser chip passes through one said fast-axis collimating lens, one said slow-axis collimating lens and one said first reflecting mirror in turn, and is incident
  • the beam combining mirror the emitted light beams of a plurality of the laser chips are combined on the beam combining mirror, and after changing the direction of the light path, they are incident on the beam coupling structure.
  • the semiconductor laser further includes an output fiber
  • the beam coupling structure further includes a focusing lens
  • the output beam of the polarization coupler is focused by the focusing lens and coupled to the input end of the output fiber.
  • the semiconductor laser further includes a package base that fixedly couples and encapsulates the beam coupling structure, the at least two light emitting units, and the input end of the output fiber to form a package structure .
  • the package base includes a base and a plurality of bosses, and the plurality of bosses are arranged on the base, and each of the first reflecting mirrors is correspondingly arranged on one of the bosses.
  • a plurality of the bosses are distributed stepwise.
  • one said boss is provided with one said laser chip, one fast-axis collimating lens, one slow-axis collimating lens and one first reflecting mirror.
  • the positions between the fast-axis collimating lens and the slow-axis collimating lens are mutually adjustable.
  • the polarization coupler includes a first incident direction and a second incident direction, the phase retarder is located in the first incident direction, and a part of the After passing through the phase retarder, the emitted light beam from the light emitting unit is incident on the polarization coupler along the first incident direction, and another part of the emitted light beam from the light emitting unit is incident on the polarization coupler along the second incident direction.
  • Polarization coupler is located in the first incident direction and a second incident direction
  • the phase retarder is located in the first incident direction, and a part of the After passing through the phase retarder, the emitted light beam from the light emitting unit is incident on the polarization coupler along the first incident direction, and another part of the emitted light beam from the light emitting unit is incident on the polarization coupler along the second incident direction.
  • the output light beams of the light output unit are respectively subjected to beam shaping processing in the fast axis direction and the slow axis direction to make the output light beams of the light output unit closely arranged, and the output lights of at least two light output units are respectively along the
  • the first incident direction and the second incident direction are incident on the polarization coupler, and the light beam is further polarized-coupled, thereby improving the quality of the output light beam of the polarization coupler, the energy density of the output light spot is high, and the light output effect is good .
  • Fig. 1 is a schematic structural diagram of a semiconductor laser provided by one embodiment of the present invention.
  • FIG. 2 is a schematic diagram of a light emitting unit provided by another embodiment of the present invention.
  • Fig. 3 is a perspective view of the light emitting unit shown in Fig. 1;
  • Fig. 4 is a view of the beam coupling structure shown in Fig. 1;
  • Fig. 5 is a light emitting effect diagram shown in Fig. 1.
  • an embodiment of the present invention provides a semiconductor laser 100.
  • the semiconductor laser 100 includes at least two light emitting units 10, a beam coupling structure 20 and an output fiber 30.
  • the light emitting unit 10 is used to emit a light beam
  • the beam coupling structure 20 is used to couple the light beam and inject the light beam into the input end of the output fiber 30, and the output fiber 30 is used to guide the light beam And it emits, and the beam can be applied to the target object.
  • the semiconductor laser 100 further includes a packaging base 40, which fixedly couples and encapsulates at least two of the light emitting unit 10, the beam coupling structure 20, and the input end of the output fiber 30 Integral to form a package body structure.
  • At least two of the light emitting units 10 are arranged side by side, and the emitted light between the at least two light emitting units 10 does not interfere with each other.
  • two different incident directions of the light beam coupling structure 20 are respectively provided with the same number of output light beams of the light output unit 10.
  • two light-emitting units 10 are respectively provided in two different incident directions of the light beam coupling structure 20, and are located at the side of the light beam coupling structure 20.
  • the two light emitting units 10 in the same incident direction are arranged side by side, and the emitted lights between the two light emitting units 10 do not interfere with each other.
  • two light-emitting units 10 are respectively provided on opposite sides of the light beam coupling structure 20, and the two light-emitting units 10 located on the same side of the light beam coupling structure 20 They are arranged side by side, that is, the four light emitting units 10 are distributed in a rectangular shape.
  • three light emitting units 10 are provided in the same incident direction of the beam coupling structure 20. It is understandable that, based on actual requirements, those skilled in the art can set the light emitting unit 10 to be more than one, not limited to the number shown in FIGS. 1 and 2.
  • the light emitting unit 10 includes a laser chip 11, a fast axis collimating lens 12 and a slow axis collimating lens 13.
  • the laser chip 11 is used to be excited to emit a laser beam when it is in an electrical conduction state.
  • the light beam emitted by the laser chip 11 passes through the fast-axis collimating lens 12 and the slow-axis collimating lens 13 in sequence, and enters the beam coupling structure 20.
  • the positions between the fast-axis collimating lens 12 and the slow-axis collimating lens 13 are interchangeable, for example, the light beam emitted by the laser chip 11 passes through the slow-axis collimating lens in sequence 13 and the fast-axis collimating lens 12, and are incident on the beam coupling structure 20.
  • the emitted light beam of the laser chip 11 passes through the fast-axis collimator lens 12 and the slow-axis collimator lens 13, respectively, for beam shaping processing.
  • the function of the fast-axis collimator lens 12 is Part of the light energy in the beam is concentrated in the fast axis direction, and another part of the light energy in the beam is concentrated in the slow axis direction under the action of the slow-axis collimating lens 13, so that the energy of the beam is spatially
  • the layout is closer.
  • the light emitting unit 10 further includes a first reflecting mirror 14.
  • the light beam emitted by the laser chip 11 passes through the fast-axis collimator lens 12 and the slow-axis collimator lens 13 in sequence, and is incident on the first mirror 14, where it is reflected Under the action of the mirror 14, the direction of the light path is changed and incident on the light beam coupling structure 20.
  • the light emitting unit 10 includes a beam combining mirror 15, a plurality of the laser chips 11, and a plurality of the fast axis collimating lenses 12 corresponding to the plurality of laser chips 11, respectively.
  • One of the first reflecting mirror 14 forms an optical path structure, and the emitted light beam of each of the laser chips 11 sequentially passes through one of the fast-axis collimating lens 12, one of the slow-axis collimating lens 13, and one of the The first mirror 14 is incident on the beam combining mirror 15.
  • the emitted light beams of the multiple laser chips 11 are combined on the beam combining mirror 15 and the direction of the light path is changed to be incident on the light beam coupling structure 20.
  • the package base 40 includes a substrate 42 and a plurality of bosses 41.
  • a plurality of the bosses 41 are disposed on the substrate 42.
  • the plurality of bosses 41 are distributed in a stepped manner.
  • the base 42 is used to support and fix a plurality of the bosses 41.
  • a plurality of the bosses 41 are arranged along a straight line and distributed in a stepped shape; the plurality of bosses 41 and the base 42 are integrally formed and arranged.
  • the beam combining mirror 15 is disposed on the base, and is used for receiving and reflecting a plurality of light beams respectively reflected by the plurality of first mirrors 14.
  • Each of the first mirrors 14 is correspondingly disposed on one of the bosses 41, so that the multiple light beams reflected by the multiple first mirrors 14 do not interfere with each other, and the multiple light beams pass through After changing the direction of the light path, it is incident on the beam combining mirror 15.
  • one boss 41 is provided with one laser chip 11, one fast-axis collimating lens 12, one slow-axis collimating lens 13 and one first reflecting mirror 14.
  • the beam coupling structure 20 includes a polarization coupler 21, a phase retarder 22, a second mirror 23, and a focusing lens 24.
  • the polarization coupler 21 includes a first incident direction 211 and a first incident direction 211. Two incident directions 212, wherein the directions of the first incident direction 211 and the second incident direction 212 are different.
  • the phase retarder 22 is located in the first incident direction 211, the second mirror 23 is located in the second incident direction 212, and the focusing lens 24 is located in the exit direction of the polarization coupler 21.
  • the phase retarder 22 is a half-wave plate.
  • At least two of the output light beams of the light output unit 10 are incident on the beam coupling structure 20, and a part of the output light beams of the light output unit 10 are incident on the phase retarder 22 along the first incident direction 211.
  • the polarization coupler 21 another part of the emitted light beam of the light output unit 10 changes the optical path direction by the second reflector 23, and then enters the polarization coupler 21 along the second incident direction 212.
  • the light beam is coupled and incident to the focusing lens 24 under the polarization coupling effect of the polarization coupler 21, and the light beam after being focused by the focusing lens 24 is coupled and incident to the input end of the output fiber 30, thereby forming a completed optical path system.
  • FIG. 5 is a light-emitting effect diagram of the semiconductor laser 100, which shows a light spot 50 emitted by the focusing lens 24.
  • the light spot 50 is correspondingly divided into a first area 51 and a second area 52, wherein the first area 51 and the second area 52 respectively correspond to light beams in two different incident directions of the polarization coupler 21 That is, taking the first region 51 as an example, the emitted light beams of the two light emitting units 10 are incident on the phase retarder 22, and then enter the polarization coupler along the first incident direction 211 21. After the light beam is coupled by the polarization coupler 21, it is focused by the focusing lens, thereby forming a polarized light beam 511 in the diagram of the light spot 50.
  • the two different incident directions (the first incident direction 211 and the second incident direction 212) of the polarization coupler 21 are respectively provided with the same number of the light emitting units 10, and the light emitting units 10
  • the light beam emitted by the unit 10 is incident on the polarization coupler 21 under the beam shaping process of the fast-axis collimator lens 12 and the slow-axis collimator lens 13, and under the action of the polarization coupler 21, the polarization is coupled, Outgoing polarized light beam 511, the energy of the light beam is more tightly distributed in the fast axis direction and the slow axis direction, that is, the outgoing lights of the multiple laser chips 11 are arranged tightly, so that the polarized light beam 511 is arranged tightly in all directions
  • the technical effect of the area of the light spot 50 makes the energy density of the light spot 50 high.
  • the polarization coupler 21 includes a first incident direction 211 and a second incident direction 212, the phase retarder 22 is located in the first incident direction 211, and a part of the light-emitting After passing through the phase retarder 22, the emitted light beam of the unit 10 enters the polarization coupler 21 along the first incident direction 211, and another part of the emitted light beam of the light emitting unit 10 enters the second incident direction 212 To the polarization coupler 21.
  • the output light beams of the light output unit 10 are respectively subjected to beam shaping processing in the fast axis direction and the slow axis direction so that the output light beams of the light output unit 10 are closely arranged, and the output lights of at least two light output units are respectively arranged.
  • the light is incident to the polarization coupler 21 along the first incident direction 211 and the second incident direction 212, and the light beam is further polarized coupled, thereby improving the quality of the output light beam of the polarization coupler 21, and the output light spot 50
  • the energy density is high, and the light output effect is good.

Abstract

A semiconductor laser (100), belonging to the technical field of lasers. The semiconductor laser (100) comprises: a light beam coupling structure (20), the light beam coupling structure (20) comprising a phase retarder (22) and a polarization coupler (21), the polarization coupler (21) comprising a first incident direction (211) and a second incident direction (212), and the phase retarder (22) being located in the first incident direction (211); and at least two light emission units (10), each light emission unit (10) comprising a laser chip (11), a fast-axis collimating lens (12) and a slow-axis collimating lens (13), and emergent light beams of the laser chip (11) successively passing through the fast-axis collimating lens (12) and the slow-axis collimating lens (13) and entering the light beam coupling structure (20). Light beam shaping is performed on emergent light beams of the light emission units (10) in a fast-axis direction and a slow-axis direction respectively, and the at least two light emission units (10) enter the polarization coupler (21) in the first incident direction (211) and the second incident direction (212) respectively, thereby improving the quality of emergent light beams of the polarization coupler (21).

Description

半导体激光器A semiconductor laser
本申请要求于2019年09月18日提交中国专利局,申请号为2019108823546,发明名称为“半导体激光器”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent application filed with the Chinese Patent Office on September 18, 2019, the application number is 2019108823546, and the invention title is "semiconductor laser", the entire content of which is incorporated into this application by reference.
技术领域Technical field
本发明实施例涉及激光技术领域,具体地,涉及一种半导体激光器。The embodiment of the present invention relates to the field of laser technology, in particular, to a semiconductor laser.
背景技术Background technique
随着科学技术的进步,市场对光纤耦合半导体激光器的功率、光束质量和亮度的要求越来越高。目前,可通过耦合多个激光源,以达到提高半导体激光器的光束亮度的技术目的。With the advancement of science and technology, the market has higher and higher requirements for the power, beam quality and brightness of fiber-coupled semiconductor lasers. At present, multiple laser sources can be coupled to achieve the technical purpose of improving the beam brightness of semiconductor lasers.
然而,耦合多个数量的激光源,会使得整体设备的体积增大,并且激光源的耦合排布不合理,会导致出射光束质量差,光斑面积大,光斑的能量密度低等现象。However, coupling multiple numbers of laser sources will increase the volume of the overall device, and the unreasonable coupling arrangement of the laser sources will result in poor quality of the emitted beam, large spot area, and low energy density of the spot.
发明内容Summary of the invention
本发明实施例旨在提出一种半导体激光器,可解决现有技术中多个光源的耦合排布不合理,导致出射光束质量差的技术问题。The embodiment of the present invention aims to provide a semiconductor laser, which can solve the technical problem that the coupling arrangement of multiple light sources in the prior art is unreasonable, resulting in poor quality of the emitted beam.
本发明实施例采用以下技术方案:The embodiments of the present invention adopt the following technical solutions:
一种半导体激光器,包括:A semiconductor laser, including:
光束耦合结构,所述光束耦合结构包括相位延迟片和偏振耦合器,所述偏振耦合器包括第一入射方向和第二入射方向,所述相位延迟片位于所述第一入射方向;A light beam coupling structure, the light beam coupling structure includes a phase retarder and a polarization coupler, the polarization coupler includes a first incident direction and a second incident direction, and the phase retarder is located in the first incident direction;
至少两个出光单元,所述出光单元包括激光芯片、快轴准直透镜和慢轴准直透镜,所述激光芯片的出射光束依次经过所述快轴准直透镜和所述慢轴准直透镜,并入射至所述光束耦合结构,其中,一部分所述出光单元的出射光束经所述相位延迟片后,沿所述第一入射方向入射至所 述偏振耦合器,另一部分所述出光单元的出射光束沿所述第二入射方向入射至所述偏振耦合器。At least two light-emitting units, the light-emitting unit comprising a laser chip, a fast-axis collimating lens and a slow-axis collimating lens, the emitted light beam of the laser chip passes through the fast-axis collimating lens and the slow-axis collimating lens in sequence , And incident to the beam coupling structure, wherein a part of the emitted light beam of the light emitting unit enters the polarization coupler along the first incident direction after passing through the phase retarder, and another part of the light emitting unit The outgoing light beam is incident on the polarization coupler along the second incident direction.
可选地,所述第一入射方向和所述第二入射方向分别对应设置有相同数量的所述出光单元的出射光束。Optionally, the first incident direction and the second incident direction are respectively provided with the same number of emitted light beams of the light emitting unit.
可选地,所述半导体激光器还包括第一反射镜,所述激光芯片发射的光束依次经过所述快轴准直透镜和所述慢轴准直透镜,并入射至所述第一反射镜,改变光路方向后,入射至所述光束耦合结构。Optionally, the semiconductor laser further includes a first reflector, and the light beam emitted by the laser chip passes through the fast-axis collimator lens and the slow-axis collimator lens in sequence, and is incident on the first reflector, After changing the direction of the light path, it is incident on the light beam coupling structure.
可选地,所述出光单元包括有合束反射镜、多个所述激光芯片以及与多个所述激光芯片分别一一对应的多个所述快轴准直透镜、多个慢轴准直透镜和多个所述第一反射镜,每一所述激光芯片的发射光束依次经过一个所述快轴准直透镜、一个所述慢轴准直透镜和一个所述第一反射镜,并入射至所述合束反射镜,其中多个所述激光芯片的发射光束在所述合束反射镜上合并,改变光路方向后,入射至所述光束耦合结构。Optionally, the light output unit includes a beam combining mirror, a plurality of the laser chips, a plurality of the fast axis collimating lenses corresponding to the plurality of laser chips, and a plurality of slow axis collimators. Lens and a plurality of said first reflecting mirrors, the emitted light beam of each said laser chip passes through one said fast-axis collimating lens, one said slow-axis collimating lens and one said first reflecting mirror in turn, and is incident To the beam combining mirror, the emitted light beams of a plurality of the laser chips are combined on the beam combining mirror, and after changing the direction of the light path, they are incident on the beam coupling structure.
可选地,所述半导体激光器还包括输出光纤,所述光束耦合结构还包括聚焦透镜,所述偏振耦合器的出射光束经所述聚焦透镜聚焦,并耦合入射至所述输出光纤的输入端。Optionally, the semiconductor laser further includes an output fiber, the beam coupling structure further includes a focusing lens, and the output beam of the polarization coupler is focused by the focusing lens and coupled to the input end of the output fiber.
可选地,所述半导体激光器还包括封装基体,所述封装基体将所述光束耦合结构、所述至少两个出光单元和所述输出光纤的输入端固定耦合封装于一体,以构成封装体结构。Optionally, the semiconductor laser further includes a package base that fixedly couples and encapsulates the beam coupling structure, the at least two light emitting units, and the input end of the output fiber to form a package structure .
可选地,所述封装基体包括基底和多个凸台,多个所述凸台设置于所述基座,其中每一个所述第一反射镜对应设置于一个所述凸台。Optionally, the package base includes a base and a plurality of bosses, and the plurality of bosses are arranged on the base, and each of the first reflecting mirrors is correspondingly arranged on one of the bosses.
可选地,多个所述凸台是呈阶梯状分布。Optionally, a plurality of the bosses are distributed stepwise.
可选地,一个所述凸台设置有一个所述激光芯片、一个快轴准直透镜、一个慢轴准直透镜和一个第一反射镜。Optionally, one said boss is provided with one said laser chip, one fast-axis collimating lens, one slow-axis collimating lens and one first reflecting mirror.
可选地,所述快轴准直透镜和所述慢轴准直透镜之间的位置是相互可调的。Optionally, the positions between the fast-axis collimating lens and the slow-axis collimating lens are mutually adjustable.
与现有技术相比较,在本实施例的所述半导体激光器中,所述偏振耦合器包括第一入射方向和第二入射方向,所述相位延迟片位于所述第一入射方向,一部分所述出光单元的出射光束经所述相位延迟片后,沿 所述第一入射方向入射至所述偏振耦合器,另一部分所述出光单元的出射光束沿所述第二入射方向入射至所述所述偏振耦合器。即,所述出光单元的出射光束分别在快轴方向和慢轴方向进行光束整形处理以使所述出光单元的出射光束排布紧密,并且至少两个所述出光单元的出射光分别沿所述第一入射方向和所述第二入射方向入射至所述偏振耦合器,光束进一步地进行偏振耦合,从而提高所述偏振耦合器的出射光束的质量,出射光光斑的能量密度高,出光效果好。Compared with the prior art, in the semiconductor laser of this embodiment, the polarization coupler includes a first incident direction and a second incident direction, the phase retarder is located in the first incident direction, and a part of the After passing through the phase retarder, the emitted light beam from the light emitting unit is incident on the polarization coupler along the first incident direction, and another part of the emitted light beam from the light emitting unit is incident on the polarization coupler along the second incident direction. Polarization coupler. That is, the output light beams of the light output unit are respectively subjected to beam shaping processing in the fast axis direction and the slow axis direction to make the output light beams of the light output unit closely arranged, and the output lights of at least two light output units are respectively along the The first incident direction and the second incident direction are incident on the polarization coupler, and the light beam is further polarized-coupled, thereby improving the quality of the output light beam of the polarization coupler, the energy density of the output light spot is high, and the light output effect is good .
附图说明Description of the drawings
一个或多个实施例通过与之对应的附图中的图片进行示例性说明,这些示例性说明并不构成对实施例的限定,附图中具有相同参考数字标号的元件表示为类似的元件,除非有特别申明,附图中的图不构成比例限制。One or more embodiments are exemplified by the pictures in the corresponding drawings. These exemplified descriptions do not constitute a limitation on the embodiments. The elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the attached drawings do not constitute a scale limitation.
图1是本发明其中一实施例提供的一种半导体激光器的结构示意图;Fig. 1 is a schematic structural diagram of a semiconductor laser provided by one embodiment of the present invention;
图2是本发明另一实施例提供的一种出光单元的示意图;2 is a schematic diagram of a light emitting unit provided by another embodiment of the present invention;
图3是图1所示的出光单元的一个视角图;Fig. 3 is a perspective view of the light emitting unit shown in Fig. 1;
图4是图1所示的光束耦合结构的一个视角图;Fig. 4 is a view of the beam coupling structure shown in Fig. 1;
图5是图1所示的出光效果图。Fig. 5 is a light emitting effect diagram shown in Fig. 1.
具体实施方式detailed description
为了便于理解本发明,下面结合附图和具体实施例,对本发明进行更详细的说明。需要说明的是,当元件被表述“固定于”另一个元件,它可以直接在另一个元件上、或者其间可以存在一个或多个居中的元件。当一个元件被表述“连接”另一个元件,它可以是直接连接到另一个元件、或者其间可以存在一个或多个居中的元件。本说明书所使用的术语“上”、“下”、“内”、“外”、“垂直的”、“水平的”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有 特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性。In order to facilitate the understanding of the present invention, the present invention will be described in more detail below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is expressed as being "fixed to" another element, it may be directly on the other element, or there may be one or more elements in between. When an element is said to be "connected" to another element, it can be directly connected to the other element, or there may be one or more intervening elements in between. The terms "upper", "lower", "inner", "outer", "vertical", "horizontal", etc. used in this specification indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance.
除非另有定义,本说明书所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的,不是用于限制本发明。本说明书所使用的术语“和/或”包括一个或多个相关的所列项目的任意的和所有的组合。Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the description of the present invention are only for the purpose of describing specific embodiments, and are not used to limit the present invention. The term "and/or" used in this specification includes any and all combinations of one or more related listed items.
此外,下面所描述的本发明不同实施例中所涉及的技术特征只要彼此之间未构成冲突就可以相互结合。In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.
请参阅图1,本发明实施例提出一种半导体激光器100,所述半导体激光器100包括至少两个出光单元10、光束耦合结构20和输出光纤30。所述出光单元10用于发射光束,所述光束耦合结构20用于将光束进行耦合处理,并将光束耦合射入至所述输出光纤30的输入端,所述输出光纤30用于将光束引导并出射,并可将光束作用于目标物体。在本实施例中,所述半导体激光器100还包括封装基体40,所述封装基体40将至少两个所述出光单元10、所述光束耦合结构20和所述输出光纤30的输入端固定耦合封装于一体,以构成封装体结构。Please refer to FIG. 1, an embodiment of the present invention provides a semiconductor laser 100. The semiconductor laser 100 includes at least two light emitting units 10, a beam coupling structure 20 and an output fiber 30. The light emitting unit 10 is used to emit a light beam, and the beam coupling structure 20 is used to couple the light beam and inject the light beam into the input end of the output fiber 30, and the output fiber 30 is used to guide the light beam And it emits, and the beam can be applied to the target object. In this embodiment, the semiconductor laser 100 further includes a packaging base 40, which fixedly couples and encapsulates at least two of the light emitting unit 10, the beam coupling structure 20, and the input end of the output fiber 30 Integral to form a package body structure.
至少两个所述出光单元10排列设置,且至少两个所述出光单元10之间的出射光互不干拢。例如在所述光束耦合结构20的两个不同入射方向分别设置有相同数量的所述出光单元10的出射光束。在本实施例中,以四个所述出光单元10为例,在所述光束耦合结构20的两个不同入射方向分别设置有两个所述出光单元10,并且位于所述光束耦合结构20的同一个入射方向的两个所述出光单元10并列横着设置,且两个所述出光单元10之间的出射光互不干拢。可选地,在空间布局上,在所述光束耦合结构20的相对两侧分别设置有两个所述出光单元10,且位于所述光束耦合结构20的同一侧的两个所述出光单元10是并列横着设置,即四个所述出光单元10是呈矩形分布。At least two of the light emitting units 10 are arranged side by side, and the emitted light between the at least two light emitting units 10 does not interfere with each other. For example, two different incident directions of the light beam coupling structure 20 are respectively provided with the same number of output light beams of the light output unit 10. In this embodiment, taking the four light-emitting units 10 as an example, two light-emitting units 10 are respectively provided in two different incident directions of the light beam coupling structure 20, and are located at the side of the light beam coupling structure 20. The two light emitting units 10 in the same incident direction are arranged side by side, and the emitted lights between the two light emitting units 10 do not interfere with each other. Optionally, in terms of spatial layout, two light-emitting units 10 are respectively provided on opposite sides of the light beam coupling structure 20, and the two light-emitting units 10 located on the same side of the light beam coupling structure 20 They are arranged side by side, that is, the four light emitting units 10 are distributed in a rectangular shape.
请参阅图2,在另一些实施例中,所述光束耦合结构20的同一个入 射方向设置有三个所述出光单元10。可以理解地是,基于实际需求,本领域技术人员可将所述出光单元10设置为多个,而不仅限于图1、图2所示的个数。Please refer to FIG. 2. In other embodiments, three light emitting units 10 are provided in the same incident direction of the beam coupling structure 20. It is understandable that, based on actual requirements, those skilled in the art can set the light emitting unit 10 to be more than one, not limited to the number shown in FIGS. 1 and 2.
请一并参阅图1、3,所述出光单元10包括激光芯片11、快轴准直透镜12和慢轴准直透镜13。所述激光芯片11用于在通电导通状态时,受激而发射激光束。所述激光芯片11出射的光束依次经过所述快轴准直透镜12和慢轴准直透镜13,并入射至所述光束耦合结构20。可以理解地是,所述快轴准直透镜12和所述慢轴准直透镜13之间的位置是可互相调换的,例如所述激光芯片11出射的光束依次经过所述慢轴准直透镜13和所述快轴准直透镜12,并入射至所述光束耦合结构20。在本实施例中,所述激光芯片11的出射光束分别经所述快轴准直透镜12和所述慢轴准直透镜13,进行光束整形处理,在所述快轴准直透镜12的作用下使得光束中的一部分光能在快轴方向上集中,且在所述慢轴准直透镜13的作用下使得光束中的另一部分光能在慢轴方向上集中,从而使光束的能量在空间布局更紧密。Please refer to FIGS. 1 and 3 together. The light emitting unit 10 includes a laser chip 11, a fast axis collimating lens 12 and a slow axis collimating lens 13. The laser chip 11 is used to be excited to emit a laser beam when it is in an electrical conduction state. The light beam emitted by the laser chip 11 passes through the fast-axis collimating lens 12 and the slow-axis collimating lens 13 in sequence, and enters the beam coupling structure 20. It is understandable that the positions between the fast-axis collimating lens 12 and the slow-axis collimating lens 13 are interchangeable, for example, the light beam emitted by the laser chip 11 passes through the slow-axis collimating lens in sequence 13 and the fast-axis collimating lens 12, and are incident on the beam coupling structure 20. In this embodiment, the emitted light beam of the laser chip 11 passes through the fast-axis collimator lens 12 and the slow-axis collimator lens 13, respectively, for beam shaping processing. The function of the fast-axis collimator lens 12 is Part of the light energy in the beam is concentrated in the fast axis direction, and another part of the light energy in the beam is concentrated in the slow axis direction under the action of the slow-axis collimating lens 13, so that the energy of the beam is spatially The layout is closer.
具体地,所述出光单元10还包括第一反射镜14。在本实施例中,所述激光芯片11发射光束依次经过所述快轴准直透镜12和所述慢轴准直透镜13,并入射至所述第一反射镜14,在所述第一反射镜14的作用下,改变光路方向并入射至所述光束耦合结构20。Specifically, the light emitting unit 10 further includes a first reflecting mirror 14. In this embodiment, the light beam emitted by the laser chip 11 passes through the fast-axis collimator lens 12 and the slow-axis collimator lens 13 in sequence, and is incident on the first mirror 14, where it is reflected Under the action of the mirror 14, the direction of the light path is changed and incident on the light beam coupling structure 20.
在本实施例中,所述出光单元10包括有合束反射镜15、多个所述激光芯片11以及与多个所述激光芯片11分别一一对应的多个所述快轴准直透镜12、多个慢轴准直透镜13和多个所述第一反射镜14,即每一个所述激光芯片11对应着一个所述快轴准直透镜12、一个所述慢轴准直透镜13和一个所述第一反射镜14,并构成一个光路结构,每一所述激光芯片11的发射光束依次经过一个所述快轴准直透镜12、一个所述慢轴准直透镜13和一个所述第一反射镜14,并入射至所述合束反射镜15。其中多个所述激光芯片11的发射光束在所述合束反射镜15上合并,并改变光路方向以入射至所述光束耦合结构20。In this embodiment, the light emitting unit 10 includes a beam combining mirror 15, a plurality of the laser chips 11, and a plurality of the fast axis collimating lenses 12 corresponding to the plurality of laser chips 11, respectively. , A plurality of slow-axis collimating lenses 13 and a plurality of the first reflecting mirrors 14, that is, each of the laser chips 11 corresponds to a fast-axis collimating lens 12, a slow-axis collimating lens 13, and One of the first reflecting mirror 14 forms an optical path structure, and the emitted light beam of each of the laser chips 11 sequentially passes through one of the fast-axis collimating lens 12, one of the slow-axis collimating lens 13, and one of the The first mirror 14 is incident on the beam combining mirror 15. The emitted light beams of the multiple laser chips 11 are combined on the beam combining mirror 15 and the direction of the light path is changed to be incident on the light beam coupling structure 20.
可以理解地是,本领域技术人员可根据实际需要在所述出光单元10 中设置有固定数值的所述激光芯片11,通过固定数值个数的所述激光芯片11发射的光束作为光源,入射至所述光束耦合结构20。It is understandable that a person skilled in the art can set the laser chip 11 with a fixed value in the light emitting unit 10 according to actual needs, and the light beam emitted by the laser chip 11 with a fixed value is used as a light source to be incident on The beam coupling structure 20.
如图3所示,所述封装基体40包括基底42和多个凸台41,多个所述凸台41设置于所述基底42上,多个所述凸台41呈阶梯状分布,其中所述基底42用于支撑固定多个所述凸台41。可选地,多个所述凸台41沿直线设置,且呈阶梯状分布;多个所述凸台41与所述基底42一体成型设置。所述合束反射镜15设置于所述基座,用于接收并反射分别经多个所述第一反射镜14反射的多个光束。每一个所述第一反射镜14对应设置于一个所述凸台41上,从而使得分别经多个所述第一反射镜14反射的多个光束之间互不干拢,且多个光束经改变光路方向后入射至所述合束反射镜15。可选地,一个所述凸台41设置有一个所述激光芯片11、一个快轴准直透镜12、一个慢轴准直透镜13和一个第一反射镜14。As shown in FIG. 3, the package base 40 includes a substrate 42 and a plurality of bosses 41. A plurality of the bosses 41 are disposed on the substrate 42. The plurality of bosses 41 are distributed in a stepped manner. The base 42 is used to support and fix a plurality of the bosses 41. Optionally, a plurality of the bosses 41 are arranged along a straight line and distributed in a stepped shape; the plurality of bosses 41 and the base 42 are integrally formed and arranged. The beam combining mirror 15 is disposed on the base, and is used for receiving and reflecting a plurality of light beams respectively reflected by the plurality of first mirrors 14. Each of the first mirrors 14 is correspondingly disposed on one of the bosses 41, so that the multiple light beams reflected by the multiple first mirrors 14 do not interfere with each other, and the multiple light beams pass through After changing the direction of the light path, it is incident on the beam combining mirror 15. Optionally, one boss 41 is provided with one laser chip 11, one fast-axis collimating lens 12, one slow-axis collimating lens 13 and one first reflecting mirror 14.
请一并参阅图1、4,所述光束耦合结构20包括偏振耦合器21、相位延迟片22、第二反射镜23和聚焦透镜24,所述偏振耦合器21包括第一入射方向211和第二入射方向212,其中所述第一入射方向211和所述第二入射方向212的方向不同。所述相位延迟片22位于所述第一入射方向211,所述第二反射镜23位于所述第二入射方向212,所述聚焦透镜24位于所述偏振耦合器21的出射方向。可选地,所述相位延迟片22是半波片。Please refer to FIGS. 1 and 4 together. The beam coupling structure 20 includes a polarization coupler 21, a phase retarder 22, a second mirror 23, and a focusing lens 24. The polarization coupler 21 includes a first incident direction 211 and a first incident direction 211. Two incident directions 212, wherein the directions of the first incident direction 211 and the second incident direction 212 are different. The phase retarder 22 is located in the first incident direction 211, the second mirror 23 is located in the second incident direction 212, and the focusing lens 24 is located in the exit direction of the polarization coupler 21. Optionally, the phase retarder 22 is a half-wave plate.
至少两个所述出光单元10的出射光束入射至所述光束耦合结构20,其中一部分所述出光单元10的出射光束入射至所述相位延迟片22后,沿所述第一入射方向211入射至所述偏振耦合器21,另一部分所述出光单元10的出射光束经所述第二反射镜23改变光路方向后,沿所述第二入射方向212入射至所述偏振耦合器21。光束在所述偏振耦合器21的偏振耦合作用下,耦合入射至所述聚焦透镜24,经所述聚焦透镜24聚焦后的光束耦合入射至所述输出光纤30的输入端,从而形成完成的光路系统。At least two of the output light beams of the light output unit 10 are incident on the beam coupling structure 20, and a part of the output light beams of the light output unit 10 are incident on the phase retarder 22 along the first incident direction 211. In the polarization coupler 21, another part of the emitted light beam of the light output unit 10 changes the optical path direction by the second reflector 23, and then enters the polarization coupler 21 along the second incident direction 212. The light beam is coupled and incident to the focusing lens 24 under the polarization coupling effect of the polarization coupler 21, and the light beam after being focused by the focusing lens 24 is coupled and incident to the input end of the output fiber 30, thereby forming a completed optical path system.
在本实施例中,两个所述出光单元10的出射光束入射至所述相位 延迟片22后,沿所述第一入射方向211入射至所述偏振耦合器21,另外两个所述出光单元10的出射光束经所述第二反射镜23改变光路方向后,沿所述第二入射方向212入射至所述偏振耦合器21。请参阅图5,图5是所述半导体激光器100的出光效果图,其中示出了经所述聚焦透镜24射出的光斑50。所述光斑50对应划分为第一区域51和第二区域52,其中在所述第一区域51和所述第二区域52分别对应着所述偏振耦合器21的两个不同入射方向上的光束,即:以所述第一区域51为例,两个所述出光单元10的出射光束入射至所述相位延迟片22后,再入沿所述第一入射方向211入射至所述偏振耦合器21,光束经所述偏振耦合器21耦合之后,再经所述聚集透镜聚焦,从而在所述光斑50图示中形成偏振光束511。In this embodiment, after the exit light beams of the two light exit units 10 enter the phase retarder 22, they enter the polarization coupler 21 along the first incident direction 211, and the other two light exit units After changing the direction of the light path by the second reflecting mirror 23, the outgoing light beam 10 enters the polarization coupler 21 along the second incident direction 212. Please refer to FIG. 5. FIG. 5 is a light-emitting effect diagram of the semiconductor laser 100, which shows a light spot 50 emitted by the focusing lens 24. The light spot 50 is correspondingly divided into a first area 51 and a second area 52, wherein the first area 51 and the second area 52 respectively correspond to light beams in two different incident directions of the polarization coupler 21 That is, taking the first region 51 as an example, the emitted light beams of the two light emitting units 10 are incident on the phase retarder 22, and then enter the polarization coupler along the first incident direction 211 21. After the light beam is coupled by the polarization coupler 21, it is focused by the focusing lens, thereby forming a polarized light beam 511 in the diagram of the light spot 50.
在本实施例中,所述偏振耦合器21的两个不同入射方向(所述第一入射方向211和所述第二入射方向212)分别设置有相同数量的所述出光单元10,所述出光单元10发射的光束在所述快轴准直透镜12、慢轴准直透镜13的光束整形处理下,入射至所述偏振耦合器21,在所述偏振耦合器21的作用下,偏振耦合,出射偏振光束511,光束的能量在快轴方向和慢轴方向的分布更紧密,即多个所述激光芯片11的出射光排布紧密,从而达到将所述偏振光束511紧密地排布于所述光斑50区域的技术效果,使得所述光斑50的能量密度高。In this embodiment, the two different incident directions (the first incident direction 211 and the second incident direction 212) of the polarization coupler 21 are respectively provided with the same number of the light emitting units 10, and the light emitting units 10 The light beam emitted by the unit 10 is incident on the polarization coupler 21 under the beam shaping process of the fast-axis collimator lens 12 and the slow-axis collimator lens 13, and under the action of the polarization coupler 21, the polarization is coupled, Outgoing polarized light beam 511, the energy of the light beam is more tightly distributed in the fast axis direction and the slow axis direction, that is, the outgoing lights of the multiple laser chips 11 are arranged tightly, so that the polarized light beam 511 is arranged tightly in all directions The technical effect of the area of the light spot 50 makes the energy density of the light spot 50 high.
综上,本申请技术方案包括但不限于以下优点:In summary, the technical solution of this application includes but is not limited to the following advantages:
在本实施例的所述半导体激光器100中,所述偏振耦合器21包括第一入射方向211和第二入射方向212,所述相位延迟片22位于所述第一入射方向211,一部分所述出光单元10的出射光束经所述相位延迟片22后,沿所述第一入射方向211入射至所述偏振耦合器21,另一部分所述出光单元10的出射光束沿所述第二入射方向212入射至所述所述偏振耦合器21。即,所述出光单元10的出射光束分别在快轴方向和慢轴方向进行光束整形处理以使所述出光单元10的出射光束排布紧密,并且至少两个所述光出单元的出射光分别沿所述第一入射方向211和所述第二入射方向212入射至所述偏振耦合器21,光束进一步地进行偏振 耦合,从而提高所述偏振耦合器21的出射光束的质量,出射光光斑50的能量密度高,出光效果好。In the semiconductor laser 100 of this embodiment, the polarization coupler 21 includes a first incident direction 211 and a second incident direction 212, the phase retarder 22 is located in the first incident direction 211, and a part of the light-emitting After passing through the phase retarder 22, the emitted light beam of the unit 10 enters the polarization coupler 21 along the first incident direction 211, and another part of the emitted light beam of the light emitting unit 10 enters the second incident direction 212 To the polarization coupler 21. That is, the output light beams of the light output unit 10 are respectively subjected to beam shaping processing in the fast axis direction and the slow axis direction so that the output light beams of the light output unit 10 are closely arranged, and the output lights of at least two light output units are respectively arranged. The light is incident to the polarization coupler 21 along the first incident direction 211 and the second incident direction 212, and the light beam is further polarized coupled, thereby improving the quality of the output light beam of the polarization coupler 21, and the output light spot 50 The energy density is high, and the light output effect is good.
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;在本发明的思路下,以上实施例或者不同实施例中的技术特征之间也可以进行组合,步骤可以以任意顺序实现,并存在如上所述的本发明的不同方面的许多其它变化,为了简明,它们没有在细节中提供;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; under the idea of the present invention, the technical features of the above embodiments or different embodiments can also be combined. The steps can be implemented in any order, and there are many other variations of the different aspects of the present invention as described above. For the sake of brevity, they are not provided in the details; although the present invention has been described in detail with reference to the foregoing embodiments, it is common in the art The skilled person should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or equivalently replace some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the implementations of the present invention. Examples of the scope of technical solutions.

Claims (10)

  1. 一种半导体激光器,其特征在于,包括:A semiconductor laser, characterized in that it comprises:
    光束耦合结构,所述光束耦合结构包括相位延迟片和偏振耦合器,所述偏振耦合器包括第一入射方向和第二入射方向,所述相位延迟片位于所述第一入射方向;A light beam coupling structure, the light beam coupling structure includes a phase retarder and a polarization coupler, the polarization coupler includes a first incident direction and a second incident direction, and the phase retarder is located in the first incident direction;
    至少两个出光单元,所述出光单元包括激光芯片、快轴准直透镜和慢轴准直透镜,所述激光芯片的出射光束依次经过所述快轴准直透镜和所述慢轴准直透镜,并入射至所述光束耦合结构,其中,一部分所述出光单元的出射光束经所述相位延迟片后,沿所述第一入射方向入射至所述偏振耦合器,另一部分所述出光单元的出射光束沿所述第二入射方向入射至所述偏振耦合器。At least two light-emitting units, the light-emitting unit comprising a laser chip, a fast-axis collimating lens and a slow-axis collimating lens, the emitted light beam of the laser chip passes through the fast-axis collimating lens and the slow-axis collimating lens in sequence , And incident to the beam coupling structure, wherein a part of the emitted light beam of the light emitting unit enters the polarization coupler along the first incident direction after passing through the phase retarder, and another part of the light emitting unit The outgoing light beam is incident on the polarization coupler along the second incident direction.
  2. 根据权利要求1所述的半导体激光器,其特征在于,所述第一入射方向和所述第二入射方向分别对应设置有相同数量的所述出光单元的出射光束。4. The semiconductor laser according to claim 1, wherein the first incident direction and the second incident direction are respectively provided with the same number of emitted light beams of the light emitting unit.
  3. 根据权利要求1所述的半导体激光器,其特征在于,所述半导体激光器还包括第一反射镜,所述激光芯片发射的光束依次经过所述快轴准直透镜和所述慢轴准直透镜,并入射至所述第一反射镜,改变光路方向后,入射至所述光束耦合结构。The semiconductor laser according to claim 1, wherein the semiconductor laser further comprises a first mirror, and the light beam emitted by the laser chip passes through the fast-axis collimating lens and the slow-axis collimating lens in sequence, It is incident on the first reflecting mirror, and after changing the direction of the light path, it is incident on the beam coupling structure.
  4. 根据权利要求3所述的半导体激光器,其特征在于,所述出光单元包括有合束反射镜、多个所述激光芯片以及与多个所述激光芯片分别一一对应的多个所述快轴准直透镜、多个慢轴准直透镜和多个所述第一反射镜,每一所述激光芯片的发射光束依次经过一个所述快轴准直透镜、一个所述慢轴准直透镜和一个所述第一反射镜,并入射至所述合束反射镜,其中多个所述激光芯片的发射光束在所述合束反射镜上合并,改变光路方向后,入射至所述光束耦合结构。The semiconductor laser according to claim 3, wherein the light emitting unit includes a beam combining mirror, a plurality of the laser chips, and a plurality of the fast axis corresponding to the plurality of laser chips respectively. A collimating lens, a plurality of slow-axis collimating lenses, and a plurality of the first reflecting mirrors, the emitted light beam of each laser chip passes through one of the fast-axis collimating lens, one of the slow-axis collimating lens, and One of the first mirrors is incident on the beam combining mirror, wherein the emitted light beams of a plurality of the laser chips are combined on the beam combining mirror, and after changing the direction of the light path, they are incident on the beam coupling structure .
  5. 根据权利要求4所述的半导体激光器,其特征在于,所述半导体激光器还包括输出光纤,所述光束耦合结构还包括聚焦透镜,所述偏振耦合器的出射光束经所述聚焦透镜聚焦,并耦合入射至所述输出光纤 的输入端。The semiconductor laser according to claim 4, wherein the semiconductor laser further comprises an output fiber, the beam coupling structure further comprises a focusing lens, and the output beam of the polarization coupler is focused by the focusing lens and coupled Incident to the input end of the output fiber.
  6. 根据权利要求5所述的半导体激光器,其特征在于,所述半导体激光器还包括封装基体,所述封装基体将所述光束耦合结构、所述至少两个出光单元和所述输出光纤的输入端固定耦合封装于一体,以构成封装体结构。The semiconductor laser according to claim 5, wherein the semiconductor laser further comprises a packaging base that fixes the beam coupling structure, the at least two light-emitting units, and the input end of the output fiber The coupling and packaging are integrated to form a package body structure.
  7. 根据权利要求6所述的半导体激光器,其特征在于,所述封装基体包括基底和多个凸台,多个所述凸台设置于所述基底,其中每一个所述第一反射镜对应设置于一个所述凸台。7. The semiconductor laser according to claim 6, wherein the package substrate comprises a substrate and a plurality of bosses, the plurality of bosses are disposed on the substrate, and each of the first mirrors is correspondingly disposed on the substrate. One said boss.
  8. 根据权利要求7所述的半导体激光器,其特征在于,多个所述凸台是呈阶梯状分布。7. The semiconductor laser according to claim 7, wherein a plurality of the bosses are distributed in a stepped manner.
  9. 根据权利要求7所述的半导体激光器,其特征在于,一个所述凸台设置有一个所述激光芯片、一个快轴准直透镜、一个慢轴准直透镜和一个第一反射镜。7. The semiconductor laser according to claim 7, wherein one said boss is provided with one said laser chip, one fast-axis collimating lens, one slow-axis collimating lens and one first mirror.
  10. 根据权利要求1所述的半导体激光器,其特征在于,所述快轴准直透镜和所述慢轴准直透镜之间的位置是相互可调的。The semiconductor laser according to claim 1, wherein the positions between the fast-axis collimating lens and the slow-axis collimating lens are mutually adjustable.
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102020118421B4 (en) 2020-07-13 2023-08-03 Focuslight Technologies Inc. laser device
CN112134142B (en) * 2020-11-24 2021-03-09 度亘激光技术(苏州)有限公司 Manufacturing method of semiconductor structure, semiconductor structure and semiconductor device
CN114545716A (en) * 2020-11-26 2022-05-27 青岛海信激光显示股份有限公司 Laser and projection apparatus
CN114006269A (en) * 2021-12-29 2022-02-01 深圳市星汉激光科技股份有限公司 Direct output system of high-power semiconductor laser and polarization beam combining structure thereof
CN115021822B (en) * 2022-05-12 2023-09-12 昂纳科技(深圳)集团股份有限公司 Optical transmission system

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202383362U (en) * 2011-11-22 2012-08-15 北京凯普林光电科技有限公司 Polarization rotation device and laser polarization beam combiner system
US20130287058A1 (en) * 2010-03-05 2013-10-31 TeraDiode, Inc. System and Method for Wavelength Beam Combination on a Single Laser Emitter
CN103944068A (en) * 2014-05-09 2014-07-23 西安炬光科技有限公司 Beam combining device for high-power semiconductor laser
CN104007558A (en) * 2014-05-07 2014-08-27 武汉锐科光纤激光器技术有限责任公司 Semiconductor laser polarization beam combining device and coupling method
CN105048288A (en) * 2015-08-25 2015-11-11 深圳市创鑫激光股份有限公司 Laser
CN106785898A (en) * 2017-02-20 2017-05-31 广东工业大学 A kind of semiconductor laser fiber coupling system
CN109346917A (en) * 2018-12-05 2019-02-15 中国电子科技集团公司第五十三研究所 A kind of conjunction beam system based on quantum cascade laser

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130287058A1 (en) * 2010-03-05 2013-10-31 TeraDiode, Inc. System and Method for Wavelength Beam Combination on a Single Laser Emitter
CN202383362U (en) * 2011-11-22 2012-08-15 北京凯普林光电科技有限公司 Polarization rotation device and laser polarization beam combiner system
CN104007558A (en) * 2014-05-07 2014-08-27 武汉锐科光纤激光器技术有限责任公司 Semiconductor laser polarization beam combining device and coupling method
CN103944068A (en) * 2014-05-09 2014-07-23 西安炬光科技有限公司 Beam combining device for high-power semiconductor laser
CN105048288A (en) * 2015-08-25 2015-11-11 深圳市创鑫激光股份有限公司 Laser
CN106785898A (en) * 2017-02-20 2017-05-31 广东工业大学 A kind of semiconductor laser fiber coupling system
CN109346917A (en) * 2018-12-05 2019-02-15 中国电子科技集团公司第五十三研究所 A kind of conjunction beam system based on quantum cascade laser

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