WO2021043007A1 - 物料加工路径选择方法及装置 - Google Patents

物料加工路径选择方法及装置 Download PDF

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Publication number
WO2021043007A1
WO2021043007A1 PCT/CN2020/110409 CN2020110409W WO2021043007A1 WO 2021043007 A1 WO2021043007 A1 WO 2021043007A1 CN 2020110409 W CN2020110409 W CN 2020110409W WO 2021043007 A1 WO2021043007 A1 WO 2021043007A1
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path
material processing
current
candidate material
bottleneck
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PCT/CN2020/110409
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English (en)
French (fr)
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崔琳
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北京北方华创微电子装备有限公司
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Publication of WO2021043007A1 publication Critical patent/WO2021043007A1/zh
Priority to US17/687,388 priority Critical patent/US11703839B2/en

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • G06Q10/063—Operations research, analysis or management
    • G06Q10/0631—Resource planning, allocation, distributing or scheduling for enterprises or organisations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
    • G06Q50/04—Manufacturing
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32252—Scheduling production, machining, job shop
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45026—Circuit board, pcb
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber

Definitions

  • This application relates to the field of semiconductors, in particular to methods and devices for selecting material processing paths.
  • the embodiment of the present application provides a method and device for selecting a material processing path.
  • an embodiment of the present application provides a method for selecting a material processing path, and the method includes:
  • the bottleneck process tank is the most frequently used process tank among all process tanks, wherein the use frequency of the process tank is equal to the total process time of all materials that need to be transferred to the process tank divided by Based on the quantity of all materials that need to be transferred to the process tank;
  • the selecting the candidate material processing path with the largest utilization rate of the bottleneck process slot among the multiple candidate material processing paths as the optimal material processing path includes:
  • the candidate material processing path is used as the target material processing path.
  • the process tank for determining the bottleneck includes:
  • Calculate the frequency of use of each process tank in all process tanks including: iteratively perform the update operation until it is determined that each process tank needs to be transferred to all the materials in the process tank.
  • the total process time and the need to be transferred to The quantity of all materials in the process tank, the total process time of all materials that need to be transferred to the process tank divided by the number of all materials that need to be transferred to the process tank, Obtain the frequency of use of the process tank; wherein, the update operation includes: judging whether the traversal of all the materials to be conveyed is finished, and the traversal of all the materials to be conveyed is to sequentially visit each of the materials to be conveyed.
  • the current total process time of the process tank is determined as the total process time of all materials that need to be transferred to the process tank, and the current process time of the process tank
  • the quantity of materials is determined as the quantity of all materials that need to be transferred to the process tank; if the traversal has not ended, the next material of the most recently visited material is used as the current material to determine whether the current material is It needs to be transferred to the process slot for processing; if it is, the process time required for the current material to be processed in the process slot is added to the current total process time of the process slot to obtain the next update operation.
  • the bottleneck process slot utilization rate is calculated, and the bottleneck process slot utilization rate in the multiple candidate material processing paths is selected.
  • the candidate material processing path with the highest rate as the target material processing path includes:
  • the busy time length of the bottleneck process slot in the candidate material processing path is divided by the processing time length of the candidate material processing path to obtain the The bottleneck process slot utilization rate of the candidate material processing path;
  • the path calculation operation includes:
  • the current optimal path is determined as the target material processing path, and the optimal path is the path with the largest utilization rate of the current bottleneck process slot;
  • the next candidate material processing path of the newly visited candidate material processing path is taken as the current path; judge whether the bottleneck process slot utilization rate of the current path is greater than the current bottleneck process slot Utilization maximum value; if it is, the bottleneck process tank utilization rate of the current path is taken as the current bottleneck process tank utilization maximum value when the next path calculation operation is performed, and the current path is taken as the current path when the next path calculation operation is performed.
  • the path length of the current path is taken as the shortest time length of the current path when the next path calculation operation is executed, where the path length of the current path is the processing time of the current path; if not, the current path is judged Whether the utilization rate of the bottleneck process tank is equal to the maximum utilization rate of the current bottleneck process tank, if the utilization rate of the bottleneck process tank of the current path is not equal to the maximum utilization rate of the current bottleneck process tank, return to judge the traversal of all candidate material processing paths Whether to end the step, if the current path’s bottleneck process tank utilization is equal to the current bottleneck process tank utilization maximum, then determine whether the current path’s path length is less than the current path’s shortest time length, if the current path’s path length is greater than Equal to the shortest time of the current path, return to the step of judging whether the traversal of all candidate material processing paths is over.
  • the bottleneck process slot utilization rate of the current path is taken as the next The maximum value of the current bottleneck process slot utilization rate when a path calculation operation is executed, the current path is taken as the current optimal path when the next path calculation operation is executed, and the path length of the current path is taken as the current path when the next path calculation operation is executed.
  • the shortest path length is the longest path length.
  • the calculation to obtain a plurality of candidate material processing paths includes:
  • the processing-related information of the material indicates all the process slots to which the material needs to be transferred and the transfer sequence;
  • an embodiment of the present application provides a material processing path selection device, which includes:
  • the first calculation unit is configured to calculate multiple candidate material processing paths
  • the determining unit is configured to determine the bottleneck process tank, the bottleneck process tank is the most frequently used process tank among all the process tanks, wherein the use frequency of each process tank is equal to the need to be transferred to the process tank The total process time of all materials divided by the quantity of all materials that need to be transferred to the process tank;
  • the second calculation unit is configured to calculate the bottleneck process slot utilization rate for each candidate material processing path in the multiple candidate material processing paths, and select the bottleneck process slot utilization rate in the multiple candidate material processing paths
  • the candidate material processing path with the highest rate is used as the target material processing path, wherein the bottleneck process slot utilization rate is equal to the busy time of the bottleneck process slot in the current candidate material processing path divided by the processing time of the candidate material processing path.
  • the second calculation unit is further configured to:
  • the determining unit is further configured to:
  • Calculate the frequency of use of each process tank in all process tanks including: iteratively perform the update operation until it is determined that each process tank needs to be transferred to all the materials in the process tank.
  • the total process time and the need to be transferred to The quantity of all materials in the process tank, the total process time of all materials that need to be transferred to the process tank divided by the number of all materials that need to be transferred to the process tank, Obtain the frequency of use of the process tank; wherein, the update operation includes: judging whether the traversal of all the materials to be conveyed is finished, and the traversal of all the materials to be conveyed is to sequentially visit each of the materials to be conveyed.
  • the current total process time of the process tank is determined as the total process time of all materials that need to be transferred to the process tank, and the current process time of the process tank
  • the quantity of materials is determined as the quantity of all materials that need to be transferred to the process tank; if the traversal has not ended, the next material of the most recently visited material is used as the current material to determine whether the current material is It needs to be transferred to the process slot for processing; if it is, the process time required for the current material to be processed in the process slot is added to the current total process time of the process slot to obtain the next update operation.
  • the second calculation unit is further configured to:
  • the busy time length of the bottleneck process slot in the candidate material processing path is divided by the processing time length of the candidate material processing path to obtain the bottleneck process slot of the candidate material processing path Utilization
  • the path calculation operation includes:
  • the current optimal path is determined as the target material processing path, and the optimal path is the path with the largest utilization rate of the current bottleneck process slot;
  • the next candidate material processing path of the newly visited candidate material processing path is taken as the current path; judge whether the bottleneck process slot utilization rate of the current path is greater than the current bottleneck process slot Utilization maximum value; if it is, the bottleneck process tank utilization rate of the current path is taken as the current bottleneck process tank utilization maximum value when the next path calculation operation is performed, and the current path is taken as the current path when the next path calculation operation is performed.
  • the path length of the current path is taken as the shortest time length of the current path when the next path calculation operation is executed, where the path length of the current path is the processing time of the current path; if not, the current path is judged Whether the utilization rate of the bottleneck process tank is equal to the maximum utilization rate of the current bottleneck process tank, if the utilization rate of the bottleneck process tank of the current path is not equal to the maximum utilization rate of the current bottleneck process tank, return to judge the traversal of all candidate material processing paths Whether to end the step, if the current path’s bottleneck process tank utilization is equal to the current bottleneck process tank utilization maximum, then determine whether the current path’s path length is less than the current path’s shortest time length, if the current path’s path length is greater than Equal to the shortest time length of the current path, then return to the step of judging whether the traversal of all candidate material processing paths has ended.
  • the bottleneck process slot utilization rate of the current path is taken as the next step.
  • the maximum value of the current bottleneck process slot utilization rate when a path calculation operation is executed the current path is taken as the current optimal path when the next path calculation operation is executed, and the path length of the current path is taken as the current path when the next path calculation operation is executed.
  • the shortest path length The maximum value of the current bottleneck process slot utilization rate when a path calculation operation is executed.
  • the first calculation unit is further configured to:
  • the processing-related information of the material indicates all the process slots to which the material needs to be transferred and the transfer sequence;
  • FIG. 1 shows a flowchart of a method for selecting a material processing path provided by an embodiment of the present application
  • Figure 2 shows a flow chart for calculating the frequency of use of a process tank.
  • Figure 3 shows a schematic flow chart of calculating the processing path of the target material
  • Fig. 4 shows a schematic structural diagram of the material processing path selection device provided by the embodiment of the present application.
  • Fig. 1 shows a flow chart of a method for selecting a material processing path provided by an embodiment of the present application.
  • the method includes the following steps:
  • Step 101 Calculate multiple candidate material processing paths.
  • each flower basket may include a predetermined number of wafers, for example, each flower basket includes 25 wafers.
  • the materials in this application are not limited to flower baskets.
  • the material processing path is used to describe for each flower basket in a plurality of flower baskets, at which time it should be transferred to which process slot, and after the flower basket is transferred to the process slot, processing the flower basket The time required for the wafer, etc.
  • it can be based on the time required for each flower basket to be transferred from one process slot to another process slot, and after each flower basket is transferred to the process slot, processing the wafers in the flower basket Calculate all possible transfer sequences of multiple flower baskets and all possible starting moments for each flower basket to be transferred from one process slot to another process slot, etc., so as to calculate all candidate material processing paths.
  • the transfer process of multiple flower baskets is: the multiple flower baskets all start from the basket transfer position, and after each reaches all the process slots that should be transferred to, they are all transferred again It is transferred back to the transfer position of the flower basket.
  • the flower baskets need to be transferred to all the process slots that need to be transferred to, and the wafers in the flower baskets are subjected to cleaning-related processing in the transferred process slots.
  • the calculation of multiple candidate material processing paths includes: determining the processing related information of each material in all the materials to be transferred, and the processing related information of the material indicates all the process slots to which the material needs to be transferred and the transfer Sequence: Based on the processing related information of each material, multiple candidate material processing paths are calculated.
  • Step 102 Determine the bottleneck process tank.
  • the bottleneck process tank may be referred to as a bottleneck resource.
  • the bottleneck process tank is the most frequently used process tank.
  • the frequency of use of the process tank is the total process time of all materials that need to be transferred to the process tank divided by the number of all materials that need to be transferred to the process tank.
  • the process tank can be called Tank.
  • the frequency of use f is defined:
  • the total process time length of all flower baskets that need to be transferred to the process tank may be: the sum of the process time lengths in the process tank for each flower basket that needs to be transferred to the process tank .
  • the process time of a flower basket that needs to be transferred to the process slot in the process slot can be: from the start time of processing all the wafers in the flower basket in the process slot to the time when all the wafers in the flower basket are processed in the process slot. The length of time elapsed in the process slot at the end of the processing of all wafers in the flower basket.
  • determining the bottleneck process tank includes: calculating the usage frequency of each process tank in all the process tanks, including:
  • the current total process time of the process tank is determined as the total process time of all materials that need to be transferred to the process tank, and the current material quantity of the process tank is determined as the total process time of all materials in the process tank. The quantity of all materials that need to be transferred to the process tank;
  • the next material of the latest visited material is used as the current material to determine whether the current material needs to be transferred to the process slot for processing; if so, the current material is processed in the process slot
  • the process time required for processing is added to the current total process time of the process slot to obtain the current total process time of the process slot when the next update operation is performed, and the current material quantity of the process slot is increased by 1, to get
  • the next update operation is performed, the current material quantity of the process slot, if not, return to the step of judging whether the traversal of all the materials to be transferred has ended.
  • the total process time of all materials that need to be transferred to the process tank in the process tank is each flower basket that needs to be transferred to the process tank in the process tank The sum of the duration of the process.
  • the quantity of all materials that need to be transferred to the process tank is the quantity of all materials that need to be transferred to the process tank.
  • the frequency of use of the process tank can be calculated by performing an update operation iteratively.
  • the current total process time of the process tank is determined as the total process time of all materials that need to be transferred to the process tank, and the current material quantity of the process tank is determined as the total process time of all materials in the process tank. After the process tank needs to be transferred to the quantity of all materials in the process tank, no update operation is performed.
  • the process tank with the highest use frequency among all the process tanks is determined as the bottleneck process tank.
  • FIG. 2 shows a flowchart for calculating the frequency of use of a process tank.
  • step 201 it is judged whether the traversal of all materials to be transferred is completed.
  • the traversal of all the materials to be transferred is to sequentially visit each of the materials to be transferred. If the traversal is completed, step 205 is executed, and if the traversal is not completed, step 202 is executed.
  • step 202 it is judged whether the current material needs to be transferred to the process slot for processing.
  • the current material is the next material of the most recently visited material. If yes, go to step 203. If not, return to step 201.
  • Step 203 Calculate the sum of the current process time of the process slot.
  • the process time required for processing the current material in the process tank is added to the current total process time of the process tank to obtain the current total process time of the process tank when step 203 is executed again, that is, the total process time length.
  • Step 204 Add 1 to the current material quantity of the process tank. Add 1 to the current material quantity of the process tank to obtain the current material quantity of the process tank when step 204 is executed next time.
  • Step 205 Determine the current total process time of the process tank as the total process time of all materials that need to be transferred to the process tank, and determine the current quantity of materials in the process tank as the process tank The quantity of all materials that need to be transferred to the process tank.
  • the total process time of all materials that need to be transferred to the process tank can be divided by the number of all materials that need to be transferred to the process tank to obtain the frequency of use of the process tank.
  • Step 103 For each candidate material processing path in the multiple candidate material processing paths, calculate the bottleneck process slot utilization rate, and select the candidate material processing path with the largest bottleneck process slot utilization rate among the multiple candidate material processing paths as the target material processing path.
  • the processing time length of the candidate material processing path may be: the time required when the candidate material processing path is used to complete the processing of all flower baskets.
  • the processing of multiple flower baskets is as follows: when the wafers in the flower basket are cleaned using a trough cleaning equipment, the multiple flower baskets all start from the basket transfer position, and each reaches all the process slots to which they should be transferred. It is again transferred back to the basket transfer position.
  • the processing time of the candidate material processing path is the time required to complete the processing of these flower baskets.
  • the busy duration of the bottleneck process slot corresponding to the candidate material processing path may be: the bottleneck process slot is in the processing of wafers in the flower basket when the candidate material processing path is used to complete the processing of all flower baskets.
  • the cumulative duration of the state may be: the bottleneck process slot is in the processing of wafers in the flower basket when the candidate material processing path is used to complete the processing of all flower baskets.
  • the bottleneck process slot utilization rate is calculated, and the candidate material processing path with the largest bottleneck process slot utilization rate among the multiple candidate material processing paths is selected as The target material processing path includes:
  • path calculation operations include:
  • the current optimal path is determined as the aforementioned target material processing path, and the optimal path is the path with the highest utilization rate of the current bottleneck process slot;
  • the next candidate material processing path of the newly visited candidate material processing path is taken as the current path; judge whether the bottleneck process slot utilization rate of the current path is greater than the current bottleneck process slot Utilization maximum value; if it is, the bottleneck process tank utilization rate of the current path is taken as the current bottleneck process tank utilization maximum value when the next path calculation operation is performed, and the current path is taken as the current path when the next path calculation operation is performed.
  • the path length of the current path is taken as the shortest time length of the current path when the next path calculation operation is executed, where the path length of the current path is the processing time of the current path; if not, the current path is judged Whether the utilization rate of the bottleneck process tank is equal to the maximum utilization rate of the current bottleneck process tank, if the utilization rate of the bottleneck process tank of the current path is not equal to the maximum utilization rate of the current bottleneck process tank, return to judge the traversal of all candidate material processing paths Whether to end the step, if the current path’s bottleneck process tank utilization is equal to the current bottleneck process tank utilization maximum, then determine whether the current path’s path length is less than the current path’s shortest time length, if the current path’s path length is greater than Equal to the shortest time length of the current path, then return to the step of judging whether the traversal of all candidate material processing paths has ended.
  • the bottleneck process slot utilization rate of the current path is taken as the next step.
  • the maximum value of the current bottleneck process slot utilization rate when a path calculation operation is executed the current path is taken as the current optimal path when the next path calculation operation is executed, and the path length of the current path is taken as the current path when the next path calculation operation is executed.
  • the shortest path length The maximum value of the current bottleneck process slot utilization rate when a path calculation operation is executed.
  • FIG. 3 shows a schematic flow chart of calculating the processing path of the target material.
  • the bottleneck process slot utilization rate of each candidate material processing path is traversed.
  • each candidate material processing path is visited.
  • the currently visited candidate material processing path can be called the current path.
  • the processing duration of the current path can be referred to as the duration of the current path.
  • the bottleneck process slot utilization rate of the first candidate material processing path is taken as the current bottleneck process slot utilization maximum, and the processing time of the first candidate material processing path is taken as the current The shortest path length.
  • the utilization rate of the bottleneck process slot of the current path is compared with the maximum utilization rate of the current bottleneck process slot.
  • the utilization rate of the bottleneck process tank of the current path is greater than the maximum utilization rate of the current bottleneck process tank, the utilization rate of the bottleneck process tank of the current path is regarded as the maximum utilization rate of the bottleneck process tank, and the current path is regarded as the current optimal path.
  • the current path duration is regarded as the shortest duration of the current path.
  • the utilization rate of the bottleneck process tank of the current path is not greater than the maximum utilization rate of the current bottleneck process tank, continue to determine whether the utilization rate of the bottleneck process tank of the current path is equal to the maximum utilization rate of the current bottleneck process tank. If the utilization rate of the bottleneck process tank of the current path is not equal to the maximum utilization rate of the current bottleneck process tank, that is, the utilization rate of the bottleneck process tank of the current path is less than the maximum utilization rate of the current bottleneck process tank, then the next candidate material processing path is accessed.
  • the utilization rate of the bottleneck process slot of the current path is equal to the maximum utilization rate of the current bottleneck process tank, continue to determine whether the current path duration of the current path is less than the shortest path duration, and if the current path duration of the current path is not less than the shortest path duration, visit The next candidate material processing path. If the current path length of the current path is less than the shortest path length, the bottleneck process slot utilization rate of the current path is taken as the current bottleneck process tank utilization maximum value, the current path is taken as the current optimal path, and the current path length is taken as the current path. The shortest path length.
  • the bottleneck process grooves of all candidate material processing paths can be used The rate is sorted from high to low.
  • the candidate material processing path with the largest utilization rate of the bottleneck process slot among the multiple candidate material processing paths can be used as the target material processing path.
  • the target material processing path when the target material processing path is selected from a plurality of candidate material processing paths based on the bottleneck process slot utilization rate of each candidate material processing path, when the bottleneck process slot utilization rate of the candidate material processing path is the largest When the number is multiple, the candidate material processing path with the shortest processing time among the multiple candidate material processing paths with the largest bottleneck process slot utilization rate can be determined, and the candidate material processing path with the shortest processing time can be used as the target material processing path.
  • each flower basket of the multiple flower baskets can be transferred to all the process slots to be transferred to according to the target material processing path, thereby completing the processing of each material process.
  • the processing of multiple flower baskets is as follows: when the wafers in the flower basket are cleaned using a trough cleaning equipment, the multiple flower baskets all start from the basket transfer position, and each reaches all the process slots to which they should be transferred. It is again transferred back to the basket transfer position. According to the target material processing path, each flower basket in the multiple flower baskets can be transferred to all the process slots that should be sent to, thereby completing the processing process of each flower basket in the multiple flower baskets.
  • FIG. 4 shows a schematic structural diagram of a material processing path selection device provided by an embodiment of the present application.
  • the specific implementation manner of the operation performed by each unit in the material processing path selection device may be the specific implementation manner of the corresponding operation described in the above-mentioned reference method embodiment.
  • the material processing path selection device As shown in FIG. 4, the material processing path selection device provided in this embodiment is installed on an electronic device.
  • the material processing path selection device includes: a first calculation unit 401, a determination unit 402, and a second calculation unit 403.
  • the first calculation unit 401 is configured to calculate multiple candidate material processing paths
  • the determining unit 402 is configured to determine the bottleneck process tank, which is the most frequently used process tank among all the process tanks, wherein the use frequency of the process tank is equal to the process of all materials that need to be transferred to the process tank Divide the total time by the quantity of all materials that need to be transferred to the process tank;
  • the second calculation unit 403 is configured to calculate the bottleneck process slot utilization rate of each candidate material processing path, and select the candidate material processing path with the largest bottleneck process slot utilization rate among the multiple candidate material processing paths as the target material processing path, where the bottleneck The process slot utilization rate is equal to the busy time length of the bottleneck process slot in the current candidate material processing path divided by the processing time length of the candidate material processing path.
  • the second calculation unit 403 is further configured to:
  • the candidate material processing path with the shortest processing time among the candidate material processing paths with the largest bottleneck process slot utilization rate is selected as the candidate material processing path The target material processing path.
  • the determining unit 402 is further configured to:
  • Calculate the frequency of use of each process tank in all process tanks including: iteratively perform the update operation until it is determined that each process tank needs to be transferred to all the materials in the process tank.
  • the total process time and the need to be transferred to The quantity of all materials in the process tank, the total process time of all materials that need to be transferred to the process tank divided by the number of all materials that need to be transferred to the process tank, Obtain the usage frequency of the process tank; among them, the above update operation includes: judging whether the traversal of all the materials to be transferred is finished, the above traversal of all the materials to be transferred is to sequentially visit each of the materials to be transferred ; If the above traversal ends, the current total process time of the process tank is determined as the total process time of all materials that need to be transferred to the process tank, and the current material quantity of the process tank is determined It is the quantity of all materials that need to be transferred to the process tank; if the above traversal is not completed, the next material of the latest visited material is used as the current material to determine whether the current
  • the second calculation unit 403 is further configured to:
  • For each candidate material processing path divide the busy time of the bottleneck process slot in the candidate material processing path by the processing time of the candidate material processing path to obtain the bottleneck process slot utilization rate of the candidate material processing path;
  • the above path calculation operations include:
  • the above-mentioned traversal of all candidate material processing paths is to sequentially visit each candidate material processing path in all candidate material processing paths;
  • the current optimal path is determined as the above-mentioned target material processing path, and the above-mentioned optimal path is the path with the highest utilization rate of the current bottleneck process slot;
  • the next candidate material processing path of the newly visited candidate material processing path is taken as the current path; judge whether the bottleneck process slot utilization rate of the current path is greater than the current bottleneck process slot Utilization maximum value; if it is, the bottleneck process tank utilization rate of the current path is taken as the current bottleneck process tank utilization maximum value when the next path calculation operation is performed, and the current path is taken as the current path when the next path calculation operation is performed.
  • the path length of the current path is taken as the shortest time length of the current path when the next path calculation operation is executed, where the path length of the current path is the processing time of the current path; if not, the current path is judged Whether the utilization rate of the bottleneck process tank is equal to the maximum utilization rate of the current bottleneck process tank, if the utilization rate of the bottleneck process tank of the current path is not equal to the maximum utilization rate of the current bottleneck process tank, return to judge the traversal of all candidate material processing paths Whether to end the step, if the current path’s bottleneck process tank utilization is equal to the current bottleneck process tank utilization maximum, then determine whether the current path’s path length is less than the current path’s shortest time length, if the current path’s path length is greater than Equal to the shortest time length of the current path, then return to the step of judging whether the traversal of all candidate material processing paths has ended.
  • the bottleneck process slot utilization rate of the current path is taken as the next step.
  • the maximum value of the current bottleneck process slot utilization rate when a path calculation operation is executed the current path is taken as the current optimal path when the next path calculation operation is executed, and the path length of the current path is taken as the current path when the next path calculation operation is executed.
  • the shortest path length The maximum value of the current bottleneck process slot utilization rate when a path calculation operation is executed.
  • the first calculation unit 401 is further configured to:
  • the processing-related information of the material indicates all the process slots to which the material needs to be transferred and the transfer sequence;
  • This application also provides an electronic device, which may be configured with one or more processors; a memory, used to store one or more programs, and one or more programs may include those used to execute the description in the above-mentioned embodiments. Instructions for the operation. When one or more programs are executed by one or more processors, the one or more processors are caused to execute the instructions of the operations described in the foregoing embodiments.
  • the present application also provides a computer-readable medium.
  • the computer-readable medium may be included in the electronic device; or it may exist alone and is not assembled into the electronic device.
  • the foregoing computer-readable medium carries one or more programs, and when the one or more programs are executed by an electronic device, the electronic device is caused to perform the operations described in the foregoing embodiment.
  • the computer-readable medium described in this application may be a computer-readable signal medium or a computer-readable storage medium, or any combination of the two.
  • the computer-readable storage medium may include, but is not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or a combination of any of the above, for example. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections with one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable removable Programmable read only memory (EPROM or flash memory), optical fiber, portable compact disk read only memory (CD-ROM), optical storage device, magnetic storage device, or any suitable combination of the above.
  • the computer-readable storage medium may be any tangible medium that includes or stores a program, and the program may be used by or in combination with a message execution system, apparatus, or device.
  • a computer-readable signal medium may include a data signal propagated in a baseband or as a part of a carrier wave, and a computer-readable program code is carried therein. This propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the foregoing.
  • the computer-readable signal medium may also be any computer-readable medium other than the computer-readable storage medium, and the computer-readable medium may send, propagate, or transmit the program for use by or in combination with the message execution system, apparatus, or device .
  • the program code included on the computer-readable medium can be transmitted by any suitable medium, including but not limited to: wireless, wire, optical cable, RF, etc., or any suitable combination of the above.
  • each block in the flowchart or block diagram may represent a module, program segment, or part of the code, and the module, program segment, or part of the code includes one or more for realizing the specified logical function Executable message.
  • the functions marked in the block may also occur in a different order from the order marked in the drawings. For example, two blocks shown in succession can actually be executed substantially in parallel, and they can sometimes be executed in the reverse order, depending on the functions involved.
  • each block in the block diagram and/or flowchart, and the combination of the blocks in the block diagram and/or flowchart can be implemented by a dedicated hardware-based system that performs the specified functions or operations Or it can be realized by a combination of dedicated hardware and computer messages.

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Abstract

一种物料加工路径选择方法及装置，方法包括：计算得出多个候选物料加工路径（101）；确定瓶颈工艺槽（102），瓶颈工艺槽为所有工艺槽中使用频度最高的工艺槽；对于多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择多个候选物料加工路径中瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径（103）。在对多个物料进行加工的过程中进行路由控制时，同时考虑加工时长和瓶颈工艺槽即瓶颈资源的利用率来计算出目标物料加工路径。从而，在较短时长内完成对所有物料的加工过程，同时，充分利用瓶颈资源，提升加工设备的产能。

Description

物料加工路径选择方法及装置 技术领域
本申请涉及半导体领域，具体涉及物料加工路径选择方法及装置。
背景技术
在半导体元件的生产过程中的诸如清洗、刻蚀、常压化学气相淀积(Atmospheric Pressure Physical Vapor Deposition，简称APCVD)等多个环节，均涉及利用加工设备同时对多个物料的连续加工。如何安排多个物料的传送顺序，以及各个工艺槽(Tank)中每个工艺位置开始进行工艺的时长是提升加工设备产率的最为关键的因素。安排多个物料的传送顺序、工艺槽(Tank)中每个工艺位置开始进行工艺的时长可以称之为物料的路由控制。
发明内容
本申请实施例提供了物料加工路径选择方法及装置。
第一方面，本申请实施例提供了物料加工路径选择方法，该方法包括：
计算得出多个候选物料加工路径；
确定瓶颈工艺槽，所述瓶颈工艺槽为所有工艺槽中使用频度最高的工艺槽，其中，所述工艺槽的使用频度等于需要被传送至该工艺槽中的所有物料的工艺总时长除以需要被传送至该工艺槽中的所有物料的数量；
对于所述多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径，其中，所述瓶颈工艺槽利用率等于所述瓶颈工艺槽在当前候选物料加工路径中的忙碌时长除以该候选物料加工路径的加工时长。
在一些实施例中，所述选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为最优物料加工路径，包括：
当多个所述候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径的数量为多个时，选择多个瓶颈工艺槽利用率最大的候选物料加工路径中所述加工时长最短的候选物料加工路径作为所述目标物料加工路径。
在一些实施例中，所述确定瓶颈工艺槽包括：
计算所有工艺槽中的每一个工艺槽的使用频度，包括：迭代地执行更新操作，直至确定每一个工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长和需要被传送至该工艺槽中的所有物料的数量，将该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长除以该工艺槽的需要被传送至该工艺槽中的所有物料的数量，得到该工艺槽的使用频度；其中，所述更新操作包括：判断对所有待传送的物料的遍历是否结束，所述对所有待传送的物料的遍历为依次访问所有待传送的物料中的每一个物料；若所述遍历结束，则将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量；若所述遍历未结束，则将最新访问过的物料的下一个物料作为当前的物料，判断当前的物料是否需要被传送至该工艺槽中进行加工；若是，则将当前的物料在该工艺槽中进行加工所需的工艺时长与该工艺槽的当前的工艺总时长相加，得到在下一次执行更新操作时该工艺槽的当前的工艺总时长，以及将该工艺槽的当前的物料数量加1，得到在下一次执行更新操作时该工艺槽的当前的物料数量，若否，则返回判断对所有待传送的物料的遍历是否结束的步骤；
确定所有工艺槽中的使用频度最高的工艺槽为所述瓶颈工艺槽。
在一些实施例中，所述对于所述多个候选物料加工路径中的每一个候选 物料加工路径，计算其瓶颈工艺槽利用率，选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径包括：
对于所述多个候选物料加工路径中的每一个候选物料加工路径，将所述瓶颈工艺槽在所述候选物料加工路径中的忙碌时长除以所述候选物料加工路径的加工时长，得到所述候选物料加工路径的瓶颈工艺槽利用率；
迭代地执行路径计算操作，直到确定出目标物料加工路径；
其中，所述路径计算操作包括：
判断对所有候选物料加工路径的遍历是否结束，所述对所有候选物料加工路径的遍历为依次访问所有候选物料加工路径中的每一个候选物料加工路径；
若对所有候选物料加工路径的遍历结束，则将当前的最优路径确定为所述目标物料加工路径，所述最优路径为当前瓶颈工艺槽利用率最大的路径；
若对所有候选物料加工路径的遍历未结束，将最新访问过的候选物料加工路径的下一个候选物料加工路径作为当前的路径；判断当前的路径的瓶颈工艺槽利用率是否大于当前的瓶颈工艺槽利用率最大值；若是，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长，其中，当前的路径的路径时长为当前的路径的加工时长；若否，则判断当前的路径的瓶颈工艺槽利用率是否等于当前的瓶颈工艺槽利用率最大值，若当前的路径的瓶颈工艺槽利用率不等于当前的瓶颈工艺槽利用率最大值，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的瓶颈工艺槽利用率等于当前的瓶颈工艺槽利用率最大值，则判断当前的路径的路径时长是否小于当前的路径最短时长，若当前的路径的路径时长 大于等于当前的路径最短时长，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的路径时长小于当前的路径最短时长，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长。
在一些实施例中，所述计算得出多个候选物料加工路径包括：
确定所有待传送的物料中的每一个物料的加工关联信息，物料的加工关联信息指示物料需要被传送至的所有工艺槽以及传送顺序；
基于每一个物料的加工关联信息，计算得出多个候选物料加工路径。第二方面，本申请实施例提供了物料加工路径选择装置，该装置包括：
第一计算单元，被配置为计算得出多个候选物料加工路径；
确定单元，被配置为确定瓶颈工艺槽，所述瓶颈工艺槽为所有工艺槽中使用频度最高的工艺槽，其中，每个所述工艺槽的使用频度等于需要被传送至该工艺槽中的所有物料的工艺总时长除以需要被传送至该工艺槽中的所有物料的数量；
第二计算单元，被配置为对于所述多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径，其中，所述瓶颈工艺槽利用率等于所述瓶颈工艺槽在当前候选物料加工路径中的忙碌时长除以该候选物料加工路径的加工时长。
在一些实施例中，第二计算单元进一步被配置为：
当所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径的数量为多个时，选择多个瓶颈工艺槽利用率最大的候选物料加工路径中所述加工时长最短的候选物料加工路径作为所述目标物料加工路 径。
在一些实施例中，确定单元进一步被配置为：
计算所有工艺槽中的每一个工艺槽的使用频度，包括：迭代地执行更新操作，直至确定每一个工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长和需要被传送至该工艺槽中的所有物料的数量，将该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长除以该工艺槽的需要被传送至该工艺槽中的所有物料的数量，得到该工艺槽的使用频度；其中，所述更新操作包括：判断对所有待传送的物料的遍历是否结束，所述对所有待传送的物料的遍历为依次访问所有待传送的物料中的每一个物料；若所述遍历结束，则将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量；若所述遍历未结束，则将最新访问过的物料的下一个物料作为当前的物料，判断当前的物料是否需要被传送至该工艺槽中进行加工；若是，则将当前的物料在该工艺槽中进行加工所需的工艺时长与该工艺槽的当前的工艺总时长相加，得到在下一次执行更新操作时该工艺槽的当前的工艺总时长，以及将该工艺槽的当前的物料数量加1，得到在下一次执行更新操作时该工艺槽的当前的物料数量，若否，则返回判断对所有待传送的物料的遍历是否结束的步骤；
确定所有工艺槽中的使用频度最高的工艺槽为所述瓶颈工艺槽。
在一些实施例中，第二计算单元进一步被配置为：
对于每一个所述候选物料加工路径，将所述瓶颈工艺槽在所述候选物料加工路径中的忙碌时长除以所述候选物料加工路径的加工时长，得到所述候选物料加工路径的瓶颈工艺槽利用率；
迭代地执行路径计算操作，直到确定出目标物料加工路径；
其中，所述路径计算操作包括：
判断对所有候选物料加工路径的遍历是否结束，所述对所有候选物料加工路径的遍历为依次访问所有候选物料加工路径中的每一个候选物料加工路径；
若对所有候选物料加工路径的遍历结束，则将当前的最优路径确定为所述目标物料加工路径，所述最优路径为当前瓶颈工艺槽利用率最大的路径；
若对所有候选物料加工路径的遍历未结束，将最新访问过的候选物料加工路径的下一个候选物料加工路径作为当前的路径；判断当前的路径的瓶颈工艺槽利用率是否大于当前的瓶颈工艺槽利用率最大值；若是，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长，其中，当前的路径的路径时长为当前的路径的加工时长；若否，则判断当前的路径的瓶颈工艺槽利用率是否等于当前的瓶颈工艺槽利用率最大值，若当前的路径的瓶颈工艺槽利用率不等于当前的瓶颈工艺槽利用率最大值，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的瓶颈工艺槽利用率等于当前的瓶颈工艺槽利用率最大值，则判断当前的路径的路径时长是否小于当前的路径最短时长，若当前的路径的路径时长大于等于当前的路径最短时长，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的路径时长小于当前的路径最短时长，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长。
在一些实施例中，第一计算单元进一步被配置为：
确定所有待传送的物料中的每一个物料的加工关联信息，物料的加工关 联信息指示物料需要被传送至的所有工艺槽以及传送顺序；
基于每一个物料的加工关联信息，计算得出多个候选物料加工路径。
本申请实施例提供的物料加工路径选择方法及装置，至少具有以下优点：
在对多个物料进行加工的过程中进行路由控制时，同时考虑加工时长和瓶颈工艺槽即瓶颈资源的利用率来计算出目标物料加工路径，按照计算出的目标物料加工路径，将多个物料中的每一个物料传送至所有应被传送至的工艺槽，完成每一个物料的加工过程。从而，在较短时长内完成对所有物料的加工过程，同时，充分利用瓶颈资源，提升加工设备的产能。
附图说明
通过阅读参照以下附图所作的对非限制性实施例所作的详细描述，本申请的其它特征、目的和优点将会变得更明显：
图1示出了本申请实施例提供的物料加工路径选择方法的流程图；
图2示出了计算一个工艺槽的使用频度的流程图。
图3示出了计算目标物料加工路径的流程示意图；
图4示出了本申请实施例提供的物料加工路径选择装置的一个结构示意图。
具体实施方式
下面结合附图和实施例对本申请作进一步的详细说明。可以理解的是，此处所描述的具体实施例仅仅用于解释相关发明，而非对该发明的限定。另外还需要说明的是，为了便于描述，附图中仅示出了与有关发明相关的部分。
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本申请。
请参考图1，其示出了本申请实施例提供的物料加工路径选择方法的流 程图。该方法包括以下步骤：
步骤101，计算得出多个候选物料加工路径。
在本申请实施例中，以装载了晶圆的花篮(cassette)作为物料进行说明。每一个花篮中可以包括预设数量个晶圆，例如，每一个花篮中包括25个晶圆。当然，本申请中的物料并不限于花篮。
在本申请实施例中，物料加工路径用于描述对于多个花篮中的每一个花篮，在哪个时刻应该被传送到哪个工艺槽，以及在花篮被传送至工艺槽中之后，处理该花篮中的晶圆所需的时长等。
在本申请实施例中，可以根据每一个花篮从一个工艺槽被传送到另一个工艺槽所需的时长，以及在每一个花篮被传送至工艺槽中之后，处理该花篮中的晶圆所需的时长等，计算多个花篮所有可能的传送顺序、每一个花篮从一个工艺槽被传送到另一个工艺槽的所有可能的起始时刻等，从而，计算出所有候选物料加工路径。
例如，当利用槽式清洗设备对花篮中的晶圆进行清洗时，多个花篮的传输过程为：多个花篮均从花篮传输位置开始，各自到达应该被传送至的所有工艺槽之后，均再次被传送回花篮传输位置。对于多个花篮中的每一个花篮，需要将花篮传送至所有需要被传送至的工艺槽，在被传送至的工艺槽中对花篮中的晶圆进行与清洗相关的处理。
在一些实施例中，计算得出多个候选物料加工路径包括：确定所有待传送的物料中的每一个物料的加工关联信息，物料的加工关联信息指示物料需要被传送至的所有工艺槽以及传送顺序；基于每一个物料的加工关联信息，计算得出多个候选物料加工路径。
在本申请实施例中，可以根据物料(以花篮为例)需要被传送至的所有工艺槽以及传送顺序，计算每一个花篮从一个工艺槽被传送到另一个工艺槽所需的时长，以及在每一个花篮被传送至的工艺槽中之后，处理花篮中的晶 圆所需的时长等，计算每一个花篮从一个工艺槽被传送到另一个工艺槽的所有可能的起始时刻，换言之，计算出每一个花篮从哪个时刻起被从一个工艺槽传送到另一个工艺槽，从而，计算出所有候选物料加工路径。
步骤102，确定瓶颈工艺槽。
在本申请实施例中，瓶颈工艺槽可以称之为瓶颈资源。瓶颈工艺槽为使用频度最高的工艺槽。工艺槽的使用频度为需要被传送至工艺槽中的所有物料的工艺总时长除以需要被传送至工艺槽中的所有物料的数量。
在本申请实施例中，工艺槽可以称之为Tank，对于每一个Tank，定义使用频度f：
f＝需要被传送至Tank中的所有花篮的工艺总时长/需要被传送至Tank中的所有花篮的数量。
在本申请实施例中，对于每一个工艺槽，需要被传送至工艺槽中的所有花篮的工艺总时长可以为：每一个需要被传送至工艺槽中的花篮在工艺槽中的工艺时长之和。
对于每一个工艺槽，一个需要被传送至工艺槽中的花篮在该工艺槽中的工艺时长可以为：从在该工艺槽中对该花篮中的所有晶圆进行加工的起始时刻到在该工艺槽中完成对该花篮中的所有晶圆的加工的终止时刻所经历的时长。
在一些实施例中，确定瓶颈工艺槽包括：计算所有工艺槽中的每一个工艺槽的使用频度，包括：
迭代地执行更新操作，直至确定每一个工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长和需要被传送至该工艺槽中的所有物料的数量；
将该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长除以该工艺槽的需要被传送至该工艺槽中的所有物料的数量，得到该工艺槽的使用频度；
确定所有工艺槽中的使用频度最高的工艺槽为瓶颈工艺槽。
进一步地，上述更新操作具体包括：
判断对所有待传送的物料的遍历是否结束，对所有待传送的物料的遍历为依次访问所有待传送的物料中的每一个物料；
若遍历结束，则将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量；
若遍历未结束，则将最新访问过的物料的下一个物料作为当前的物料，判断当前的物料是否需要被传送至该工艺槽中进行加工；若是，则将当前的物料在该工艺槽中进行加工所需的工艺时长与该工艺槽的当前的工艺总时长相加，得到在下一次执行更新操作时该工艺槽的当前的工艺总时长，以及将该工艺槽的当前的物料数量加1，得到在下一次执行更新操作时该工艺槽的当前的物料数量，若否，则返回判断对所有待传送的物料的遍历是否结束的步骤。
在本申请实施例中，对于任意一个工艺槽，该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长为每一个需要被传送至该工艺槽中的花篮在该工艺槽中的工艺时长之和。对于任意一个工艺槽，该工艺槽的需要被传送至该工艺槽中的所有物料的数量为需要被传送至该工艺槽中的所有物料的数量。
在本申请实施例中，对于所有工艺槽中的每一个工艺槽，均可以通过迭代的执行更新操作来计算工艺槽的使用频度。
若遍历结束，在将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量之后，不再执行更新操作。
换言之，当计算一个工艺槽的使用频度时，迭代地执行更新操作直至该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长和计算出需要被传送至该工艺槽中的所有物料的数量，停止执行更新操作。
在本申请实施例中，在计算出工艺槽中的每一个工艺槽的使用频度之后，确定所有工艺槽中的使用频度最高的工艺槽为瓶颈工艺槽。
请参考图2，其示出了计算一个工艺槽的使用频度的流程图。
步骤201，判断所有待传送的物料物料是否遍历结束。对所有待传送的物料的遍历为依次访问所有待传送的物料中的每一个物料。若遍历结束，执行步骤205，若遍历未结束，执行步骤202。
步骤202，判断当前的物料是否需要被传送至该工艺槽中进行加工。当前的物料为最新访问过的物料的下一个物料。若是，执行步骤203。若否，返回到步骤201。
步骤203，计算该工艺槽的当前的工艺时长总和。
将当前的物料在该工艺槽中进行加工所需的工艺时长与该工艺槽的当前的工艺总时长相加，得到再次执行执行步骤203时该工艺槽的当前的工艺总时长即工艺时长总和。
步骤204，将该工艺槽的当前的物料数量加1。将该工艺槽的当前的物料数量加1，得到在下一次执行步骤204时该工艺槽的当前的物料数量。
步骤205，将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量。可以将该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长除以该工艺槽的需要被传送至该工艺槽中的所有物料的数量，得到该工艺槽的使用频度。
步骤103，对于多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择多个候选物料加工路径中瓶颈工艺槽利用率 最大的候选物料加工路径作为目标物料加工路径。
在本申请实施例中，对于每一个候选物料加工路径，候选物料加工路径的瓶颈工艺槽利用率为瓶颈工艺槽的对应于候选物料加工路径的忙碌时长除以候选物料加工路径的加工时长，即候选物料加工路径的瓶颈工艺槽利用率＝瓶颈工艺槽的对应于候选物料加工路径的忙碌时长/候选物料加工路径的加工时长。
在本申请实施例中，候选物料加工路径的加工时长可以为：在采用候选物料加工路径完成所有花篮的加工过程的情况下所需的时长。
例如，多个花篮的加工过程为：当对利用槽式清洗设备对花篮中的晶圆进行清洗时，多个花篮均从花篮传输位置开始，各自到达应该被传送至的所有工艺槽之后，均再次被传送回花篮传输位置。候选物料加工路径的加工时长为完成这些花篮的加工过程所需的时长。
在本申请实施例中，瓶颈工艺槽的对应于候选物料加工路径的忙碌时长可以为：在采用候选物料加工路径完成所有花篮的加工过程的情况下瓶颈工艺槽处于对花篮中的晶圆的加工状态的累计的时长。
在一些实施例中，对于多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择多个候选物料加工路径中瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径包括：
对于多个候选物料加工路径中的每一个候选物料加工路径，将瓶颈工艺槽在该候选物料加工路径中的忙碌时长除以该候选物料加工路径的加工时长，得到该候选物料加工路径的瓶颈工艺槽利用率；
迭代地执行路径计算操作，直到确定出目标物料加工路径；
其中，路径计算操作包括：
判断对所有候选物料加工路径的遍历是否结束，对所有候选物料加工路径的遍历为依次访问所有候选物料加工路径中的每一个候选物料加工路径；
若对所有候选物料加工路径的遍历结束，则将当前的最优路径确定为上述目标物料加工路径，该最优路径为当前瓶颈工艺槽利用率最大的路径；
若对所有候选物料加工路径的遍历未结束，将最新访问过的候选物料加工路径的下一个候选物料加工路径作为当前的路径；判断当前的路径的瓶颈工艺槽利用率是否大于当前的瓶颈工艺槽利用率最大值；若是，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长，其中，当前的路径的路径时长为当前的路径的加工时长；若否，则判断当前的路径的瓶颈工艺槽利用率是否等于当前的瓶颈工艺槽利用率最大值，若当前的路径的瓶颈工艺槽利用率不等于当前的瓶颈工艺槽利用率最大值，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的瓶颈工艺槽利用率等于当前的瓶颈工艺槽利用率最大值，则判断当前的路径的路径时长是否小于当前的路径最短时长，若当前的路径的路径时长大于等于当前的路径最短时长，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的路径时长小于当前的路径最短时长，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长。
请参考图3，其示出了计算目标物料加工路径的流程示意图。
在计算目标物料加工路径时，遍历每一个候选物料加工路径的瓶颈工艺槽利用率，在遍历过程中，会访问每一个候选物料加工路径。当前访问到的候选物料加工路径可以称之为当前路径。当前路径的加工时长可以称之为当前路径时长。
当访问到第一个候选物料加工路径时，将第一个候选物料加工路径的瓶颈工艺槽利用率作为当前的瓶颈工艺槽利用率最大值，将第一个候选物料加工路径的加工时长作为当前的路径最短时长。
在访问完第一个候选物料加工路径之后，每一次访问到一个候选物料加工路径时，将当前路径的瓶颈工艺槽利用率与当前的瓶颈工艺槽利用率最大值进行比较。
若当前路径的瓶颈工艺槽利用率大于当前的瓶颈工艺槽利用率最大值，则将当前路径的瓶颈工艺槽利用率作为当前的瓶颈工艺槽利用率最大值，将当前路径作为当前的最优路径，将当前路径时长作为当前的路径最短时长。
若当前路径的瓶颈工艺槽利用率不大于当前的瓶颈工艺槽利用率最大值，则继续判断当前路径的瓶颈工艺槽利用率是否等于当前的瓶颈工艺槽利用率最大值。若当前路径的瓶颈工艺槽利用率不等于当前的瓶颈工艺槽利用率最大值，即当前路径的瓶颈工艺槽利用率小于当前的瓶颈工艺槽利用率最大值，则访问下一个候选物料加工路径。若当前路径的瓶颈工艺槽利用率等于当前的瓶颈工艺槽利用率最大值，则继续判断当前路径的当前路径时长是否小于路径最短时长，若当前路径的当前路径时长不小于路径最短时长，则访问下一个候选物料加工路径。若当前路径的当前路径时长小于路径最短时长，则将当前路径的瓶颈工艺槽利用率作为当前的瓶颈工艺槽利用率最大值，将当前路径作为当前的最优路径，将当前路径时长作为当前的路径最短时长。
在本申请实施例中，当基于每一个候选物料加工路径的瓶颈工艺槽利用率，从多个候选物料加工路径中选取出目标物料加工路径时，可以对所有候选物料加工路径的瓶颈工艺槽利用率由高到低进行排序。可以将多个候选物料加工路径中的瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径。
在一些实施例中，当基于每一个候选物料加工路径的瓶颈工艺槽利用 率，从多个候选物料加工路径中选取出目标物料加工路径时，当瓶颈工艺槽利用率最大的候选物料加工路径的数量为多个时，可以确定瓶颈工艺槽利用率最大的多个候选物料加工路径中的加工时长最短的候选物料加工路径，将该加工时长最短的候选物料加工路径作为目标物料加工路径。
在本申请实施例中，在确定目标物料加工路径之后，可以按照目标物料加工路径，将多个花篮中的每一个花篮传送至所有应被传送至的工艺槽，从而，完成每一个物料的加工过程。
例如，多个花篮的加工过程为：当对利用槽式清洗设备对花篮中的晶圆进行清洗时，多个花篮均从花篮传输位置开始，各自到达应该被传送至的所有工艺槽之后，均再次被传送回花篮传输位置。可以按照目标物料加工路径，将多个花篮中的每一个花篮传送至所有应被传送至的工艺槽，从而，完成多个花篮中的每一个花篮的加工过程。
请参考图4，其示出了本申请实施例提供的物料加工路径选择装置的结构示意图。物料加工路径选择装置中的各个单元执行的操作的具体实现方式可以上述参考方法实施例中描述的相应的操作的具体实现方式。
如图4所示，本实施例的提供的物料加工路径选择装置安装于电子设备上，物料加工路径选择装置包括：第一计算单元401，确定单元402，第二计算单元403。
第一计算单元401被配置为计算得出多个候选物料加工路径；
确定单元402被配置为确定瓶颈工艺槽，该瓶颈工艺槽为所有工艺槽中使用频度最高的工艺槽，其中，工艺槽的使用频度等于需要被传送至该工艺槽中的所有物料的工艺总时长除以需要被传送至该工艺槽中的所有物料的数量；
第二计算单元403被配置为计算每一个候选物料加工路径的瓶颈工艺槽利用率，选择多个候选物料加工路径中瓶颈工艺槽利用率最大的候选物料加 工路径作为目标物料加工路径，其中，瓶颈工艺槽利用率等于瓶颈工艺槽在当前候选物料加工路径中的忙碌时长除以该候选物料加工路径的加工时长。
在一些实施例中，第二计算单元403进一步被配置为：
当多个候选物料加工路径中瓶颈工艺槽利用率最大的候选物料加工路径的数量为多个时，选择多个瓶颈工艺槽利用率最大的候选物料加工路径中加工时长最短的候选物料加工路径作为目标物料加工路径。
在一些实施例中，确定单元402进一步被配置为：
计算所有工艺槽中的每一个工艺槽的使用频度，包括：迭代地执行更新操作，直至确定每一个工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长和需要被传送至该工艺槽中的所有物料的数量，将该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长除以该工艺槽的需要被传送至该工艺槽中的所有物料的数量，得到该工艺槽的使用频度；其中，上述更新操作包括：判断对所有待传送的物料的遍历是否结束，上述对所有待传送的物料的遍历为依次访问所有待传送的物料中的每一个物料；若上述遍历结束，则将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量；若上述遍历未结束，则将最新访问过的物料的下一个物料作为当前的物料，判断当前的物料是否需要被传送至该工艺槽中进行加工；若是，则将当前的物料在该工艺槽中进行加工所需的工艺时长与该工艺槽的当前的工艺总时长相加，得到在下一次执行更新操作时该工艺槽的当前的工艺总时长，以及将该工艺槽的当前的物料数量加1，得到在下一次执行更新操作时该工艺槽的当前的物料数量，若否，则返回判断对所有待传送的物料的遍历是否结束的步骤；
确定所有工艺槽中的使用频度最高的工艺槽为瓶颈工艺槽。
在一些实施例中，第二计算单元403进一步被配置为：
对于每一个候选物料加工路径，将瓶颈工艺槽在候选物料加工路径中的忙碌时长除以候选物料加工路径的加工时长，得到候选物料加工路径的瓶颈工艺槽利用率；
迭代地执行路径计算操作，直到确定出目标物料加工路径；
其中，上述路径计算操作包括：
判断对所有候选物料加工路径的遍历是否结束，上述对所有候选物料加工路径的遍历为依次访问所有候选物料加工路径中的每一个候选物料加工路径；
若对所有候选物料加工路径的遍历结束，则将当前的最优路径确定为上述目标物料加工路径，上述最优路径为当前瓶颈工艺槽利用率最大的路径；
若对所有候选物料加工路径的遍历未结束，将最新访问过的候选物料加工路径的下一个候选物料加工路径作为当前的路径；判断当前的路径的瓶颈工艺槽利用率是否大于当前的瓶颈工艺槽利用率最大值；若是，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长，其中，当前的路径的路径时长为当前的路径的加工时长；若否，则判断当前的路径的瓶颈工艺槽利用率是否等于当前的瓶颈工艺槽利用率最大值，若当前的路径的瓶颈工艺槽利用率不等于当前的瓶颈工艺槽利用率最大值，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的瓶颈工艺槽利用率等于当前的瓶颈工艺槽利用率最大值，则判断当前的路径的路径时长是否小于当前的路径最短时长，若当前的路径的路径时长大于等于当前的路径最短时长，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的路径时长小于当前的路径最短时长，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈 工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长。
在一些实施例中，第一计算单元401进一步被配置为：
确定所有待传送的物料中的每一个物料的加工关联信息，物料的加工关联信息指示物料需要被传送至的所有工艺槽以及传送顺序；
基于每一个物料的加工关联信息，计算得出多个候选物料加工路径。
本申请还提供了一种电子设备，该电子设备可以配置有一个或多个处理器；存储器，用于存储一个或多个程序，一个或多个程序中可以包括用以执行上述实施例中描述的操作的指令。当一个或多个程序被一个或多个处理器执行时，使得一个或多个处理器执行上述实施例中描述的操作的指令。
本申请还提供了一种计算机可读介质，该计算机可读介质可以是电子设备中所包括的；也可以是单独存在，未装配入电子设备中。上述计算机可读介质承载有一个或者多个程序，当一个或者多个程序被电子设备执行时，使得电子设备执行上述实施例中描述的操作。
需要说明的是，本申请所述的计算机可读介质可以是计算机可读信号介质或者计算机可读存储介质或者是上述两者的任意组合。计算机可读存储介质例如可以包括但不限于电、磁、光、电磁、红外线、或半导体的系统、装置或器件，或者任意以上的组合。计算机可读存储介质的更具体的例子可以包括但不限于：具有一个或多个导线的电连接、便携式计算机磁盘、硬盘、随机访问存储器(RAM)、只读存储器(ROM)、可擦式可编程只读存储器(EPROM或闪存)、光纤、便携式紧凑磁盘只读存储器(CD-ROM)、光存储器件、磁存储器件、或者上述的任意合适的组合。在本申请中，计算机可读存储介质可以是任何包括或存储程序的有形介质，该程序可以被消息执行系统、装置或者器件使用或者与其结合使用。而在本申请中，计算机可读的 信号介质可以包括在基带中或者作为载波一部分传播的数据信号，其中承载了计算机可读的程序代码。这种传播的数据信号可以采用多方面形式，包括但不限于电磁信号、光信号或上述的任意合适的组合。计算机可读的信号介质还可以是计算机可读存储介质以外的任何计算机可读介质，该计算机可读介质可以发送、传播或者传输用于由消息执行系统、装置或者器件使用或者与其结合使用的程序。计算机可读介质上包括的程序代码可以用任何适当的介质传输，包括但不限于：无线、电线、光缆、RF等等，或者上述的任意合适的组合。
附图中的流程图和框图，图示了按照本申请各种实施例的系统、方法和计算机程序产品的可能实现的体系架构、功能和操作。在这点上，流程图或框图中的每个方框可以代表一个模块、程序段、或代码的一部分，该模块、程序段、或代码的一部分包括一个或多个用于实现规定的逻辑功能的可执行消息。也应当注意，在有些作为替换的实现中，方框中所标注的功能也可以以不同于附图中所标注的顺序发生。例如，两个接连地表示的方框实际上可以基本并行地执行，它们有时也可以按相反的顺序执行，这依所涉及的功能而定。也要注意的是，框图和/或流程图中的每个方框、以及框图和/或流程图中的方框的组合，可以用执行规定的功能或操作的专用的基于硬件的系统来实现，或者可以用专用硬件与计算机消息的组合来实现。
以上描述仅为本申请的较佳实施例以及对所运用技术原理的说明。本领域技术人员应当理解，本申请中所涉及的发明范围，并不限于上述技术特征的特定组合而成的技术实施例，同时也应涵盖在不脱离所述发明构思的情况下，由上述技术特征或其等同特征进行任意组合而形成的其它技术实施例。例如上述特征与本申请中公开的(但不限于)具有类似功能的技术特征进行互相替换而形成的技术实施例。

Claims (10)

  1. 一种物料加工路径选择方法，其特征在于，所述方法包括：
    计算得出多个候选物料加工路径；
    确定瓶颈工艺槽，所述瓶颈工艺槽为所有工艺槽中使用频度最高的工艺槽，其中，所述工艺槽的使用频度等于需要被传送至该工艺槽中的所有物料的工艺总时长除以需要被传送至该工艺槽中的所有物料的数量；
    对于所述多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径，其中，所述瓶颈工艺槽利用率等于所述瓶颈工艺槽在当前候选物料加工路径中的忙碌时长除以该候选物料加工路径的加工时长。
  2. 根据权利要求1所述的方法，其特征在于，所述选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为最优物料加工路径，包括：
    当所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径的数量为多个时，选择多个瓶颈工艺槽利用率最大的候选物料加工路径中所述加工时长最短的候选物料加工路径作为所述目标物料加工路径。
  3. 根据权利要求2所述的方法，其特征在于，所述确定瓶颈工艺槽包括：
    计算所有工艺槽中的每一个工艺槽的使用频度，包括：迭代地执行更新操作，直至确定每一个工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长和需要被传送至该工艺槽中的所有物料的数量，将该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长除以该工艺槽的需要被传送至 该工艺槽中的所有物料的数量，得到该工艺槽的使用频度；其中，所述更新操作包括：判断对所有待传送的物料的遍历是否结束，所述对所有待传送的物料的遍历为依次访问所有待传送的物料中的每一个物料；若所述遍历结束，则将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量；若所述遍历未结束，则将最新访问过的物料的下一个物料作为当前的物料，判断当前的物料是否需要被传送至该工艺槽中进行加工；若是，则将当前的物料在该工艺槽中进行加工所需的工艺时长与该工艺槽的当前的工艺总时长相加，得到在下一次执行更新操作时该工艺槽的当前的工艺总时长，以及将该工艺槽的当前的物料数量加1，得到在下一次执行更新操作时该工艺槽的当前的物料数量，若否，则返回判断对所有待传送的物料的遍历是否结束的步骤；
    确定所有工艺槽中的使用频度最高的工艺槽为所述瓶颈工艺槽。
  4. 根据权利要求3所述的方法，其特征在于，所述对于所述多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径包括：
    对于所述多个候选物料加工路径中的每一个候选物料加工路径，将所述瓶颈工艺槽在所述候选物料加工路径中的忙碌时长除以所述候选物料加工路径的加工时长，得到所述候选物料加工路径的瓶颈工艺槽利用率；
    迭代地执行路径计算操作，直到确定出目标物料加工路径；
    其中，所述路径计算操作包括：
    判断对所有候选物料加工路径的遍历是否结束，所述对所有候选物料加工路径的遍历为依次访问所有候选物料加工路径中的每一个候选物料加工路径；
    若对所有候选物料加工路径的遍历结束，则将当前的最优路径确定为所述目标物料加工路径，所述最优路径为当前瓶颈工艺槽利用率最大的路径；
    若对所有候选物料加工路径的遍历未结束，将最新访问过的候选物料加工路径的下一个候选物料加工路径作为当前的路径；判断当前的路径的瓶颈工艺槽利用率是否大于当前的瓶颈工艺槽利用率最大值；若是，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长，其中，当前的路径的路径时长为当前的路径的加工时长；若否，则判断当前的路径的瓶颈工艺槽利用率是否等于当前的瓶颈工艺槽利用率最大值，若当前的路径的瓶颈工艺槽利用率不等于当前的瓶颈工艺槽利用率最大值，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的瓶颈工艺槽利用率等于当前的瓶颈工艺槽利用率最大值，则判断当前的路径的路径时长是否小于当前的路径最短时长，若当前的路径的路径时长大于等于当前的路径最短时长，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的路径时长小于当前的路径最短时长，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长。
  5. 根据权利要求4所述的方法，所述计算得出多个候选物料加工路径包括：
    确定所有待传送的物料中的每一个物料的加工关联信息，物料的加工关联信息指示物料需要被传送至的所有工艺槽以及传送顺序；
    基于每一个物料的加工关联信息，计算得出多个候选物料加工路径。
  6. 一种物料加工路径选择装置，其特征在于，所述装置包括：
    第一计算单元，被配置为计算得出多个候选物料加工路径；
    确定单元，被配置为确定瓶颈工艺槽，所述瓶颈工艺槽为所有工艺槽中使用频度最高的工艺槽，其中，每个所述工艺槽的使用频度等于需要被传送至该工艺槽中的所有物料的工艺总时长除以需要被传送至该工艺槽中的所有物料的数量；
    第二计算单元，被配置为对于所述多个候选物料加工路径中的每一个候选物料加工路径，计算其瓶颈工艺槽利用率，选择所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径作为目标物料加工路径，其中，所述瓶颈工艺槽利用率等于所述瓶颈工艺槽在当前候选物料加工路径中的忙碌时长除以该候选物料加工路径的加工时长。
  7. 根据权利要求6所述的装置，其特征在于，所述第二计算单元进一步被配置为：
    当所述多个候选物料加工路径中所述瓶颈工艺槽利用率最大的候选物料加工路径的数量为多个时，选择多个瓶颈工艺槽利用率最大的候选物料加工路径中所述加工时长最短的候选物料加工路径作为所述目标物料加工路径。
  8. 根据权利要求7所述的装置，其特征在于，所述确定单元进一步被配置为：
    计算所有工艺槽中的每一个工艺槽的使用频度，包括：迭代地执行更新操作，直至确定每一个工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长和需要被传送至该工艺槽中的所有物料的数量，将该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长除以该工艺槽的需要被传送至该工艺槽中的所有物料的数量，得到该工艺槽的使用频度；其中，所述更新 操作包括：判断对所有待传送的物料的遍历是否结束，所述对所有待传送的物料的遍历为依次访问所有待传送的物料中的每一个物料；若所述遍历结束，则将该工艺槽的当前的工艺总时长确定为该工艺槽的需要被传送至该工艺槽中的所有物料的工艺总时长，以及将该工艺槽的当前的物料数量确定为该工艺槽的需要被传送至该工艺槽中的所有物料的数量；若所述遍历未结束，则将最新访问过的物料的下一个物料作为当前的物料，判断当前的物料是否需要被传送至该工艺槽中进行加工；若是，则将当前的物料在该工艺槽中进行加工所需的工艺时长与该工艺槽的当前的工艺总时长相加，得到在下一次执行更新操作时该工艺槽的当前的工艺总时长，以及将该工艺槽的当前的物料数量加1，得到在下一次执行更新操作时该工艺槽的当前的物料数量，若否，则返回判断对所有待传送的物料的遍历是否结束的步骤；
    确定所有工艺槽中的使用频度最高的工艺槽为所述瓶颈工艺槽。
  9. 根据权利要求8所述的装置，其特征在于，所述第二计算单元进一步被配置为：
    对于所述多个候选物料加工路径中的每一个候选物料加工路径，将所述瓶颈工艺槽在所述候选物料加工路径中的忙碌时长除以所述候选物料加工路径的加工时长，得到所述候选物料加工路径的瓶颈工艺槽利用率；
    迭代地执行路径计算操作，直到确定出目标物料加工路径；
    其中，所述路径计算操作包括：
    判断对所有候选物料加工路径的遍历是否结束，所述对所有候选物料加工路径的遍历为依次访问所有候选物料加工路径中的每一个候选物料加工路径；
    若对所有候选物料加工路径的遍历结束，则将当前的最优路径确定为所述目标物料加工路径，所述最优路径为当前瓶颈工艺槽利用率最大的路径；
    若对所有候选物料加工路径的遍历未结束，将最新访问过的候选物料加工路径的下一个候选物料加工路径作为当前的路径；判断当前的路径的瓶颈工艺槽利用率是否大于当前的瓶颈工艺槽利用率最大值；若是，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长，其中，当前的路径的路径时长为当前的路径的加工时长；若否，则判断当前的路径的瓶颈工艺槽利用率是否等于当前的瓶颈工艺槽利用率最大值，若当前的路径的瓶颈工艺槽利用率不等于当前的瓶颈工艺槽利用率最大值，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的瓶颈工艺槽利用率等于当前的瓶颈工艺槽利用率最大值，则判断当前的路径的路径时长是否小于当前的路径最短时长，若当前的路径的路径时长大于等于当前的路径最短时长，则返回判断对所有候选物料加工路径的遍历是否结束的步骤，若当前的路径的路径时长小于当前的路径最短时长，则将当前的路径的瓶颈工艺槽利用率作为下一次路径计算操作执行时当前的瓶颈工艺槽利用率最大值，将当前的路径作为下一次路径计算操作执行时当前的最优路径，将当前的路径的路径时长作为下一次路径计算操作执行时当前的路径最短时长。
  10. 根据权利要求9所述的装置，其特征在于，所述第一计算单元进一步被配置为：
    确定所有待传送的物料中的每一个物料的加工关联信息，物料的加工关联信息指示物料需要被传送至的所有工艺槽以及传送顺序；
    基于每一个物料的加工关联信息，计算得出多个候选物料加工路径。
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