WO2021042348A1 - 用于逆变系统的散热器和集成散热器的逆变模块 - Google Patents

用于逆变系统的散热器和集成散热器的逆变模块 Download PDF

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Publication number
WO2021042348A1
WO2021042348A1 PCT/CN2019/104621 CN2019104621W WO2021042348A1 WO 2021042348 A1 WO2021042348 A1 WO 2021042348A1 CN 2019104621 W CN2019104621 W CN 2019104621W WO 2021042348 A1 WO2021042348 A1 WO 2021042348A1
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Prior art keywords
bracket
contact area
igbt
busbar
radiator
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PCT/CN2019/104621
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English (en)
French (fr)
Inventor
王超
王荣偲
张小林
Original Assignee
舍弗勒技术股份两合公司
王超
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Application filed by 舍弗勒技术股份两合公司, 王超 filed Critical 舍弗勒技术股份两合公司
Priority to PCT/CN2019/104621 priority Critical patent/WO2021042348A1/zh
Publication of WO2021042348A1 publication Critical patent/WO2021042348A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to the field of vehicle technology, and particularly to a radiator for an inverter system and an inverter module integrating the radiator.
  • the inverter system is often used in the drive system of a vehicle, and its function is to convert direct current into alternating current.
  • IGBT Insulated Gate Bipolar Transistor; insulated gate bipolar transistor
  • capacitors and busbars are the three main heat sources.
  • a radiator is usually provided separately in the vehicle to help the inverter system to dissipate heat.
  • an existing radiator 2' has a flat plate shape and has a radiator body 21', a cooling liquid inlet 211', and a cooling liquid outlet 212'.
  • the radiator main body 21' has a cooling liquid cavity containing the cooling liquid.
  • the cooling liquid enters the radiator main body 21' from the cooling liquid inlet 211', passes through the cooling liquid cavity and flows out from the cooling liquid outlet 212', thereby taking away the absorbed heat .
  • the radiator body 21' has a cooling surface, the cooling surface is flat, and the IGBT and the capacitor are in contact with the cooling surface and transfer heat.
  • the heat sink 2' can only be used to cool the IGBTs and capacitors arranged in the same plane, and cannot be used to cool the busbars.
  • the flat-plate radiator 2 requires a large installation space and has poor space adaptability.
  • the purpose of the present invention is to overcome or at least alleviate the above-mentioned shortcomings of the prior art, and to provide a heat sink that can dissipate heat for IGBT, capacitor and busbar at the same time, and an inverter module integrating the heat sink.
  • a radiator for an inverter system which includes a bracket defining a cooling liquid cavity for accommodating cooling liquid, the radiator having a contact area, and the contact area includes:
  • An IGBT contact area where the IGBT contact area is used to contact the heat dissipation surface of the IGBT
  • a capacitor contact area for contacting the heat dissipation surface of the capacitor for contacting the heat dissipation surface of the capacitor
  • busbar contact area where the busbar contact area is used to contact the heat dissipation surface of the busbar
  • the IGBT contact area and the capacitor contact area are located on opposite sides of the cooling fluid cavity, and the busbar contact area is located in the arrangement direction of the IGBT contact area and the capacitor contact area. The side of the connection.
  • At least one of the IGBT contact area and the capacitor contact area includes an opening of the cooling liquid cavity, so that at least one of the IGBT and the capacitor can interact with the cooling fluid. Liquid contact and heat transfer.
  • the bracket has a bracket body and a bracket wing, the coolant cavity is defined by the bracket body, the bracket wing extends from the bracket body, the IGBT contact area and the bracket At least one of the capacitor contact areas is formed by the mounting surface of the bracket body, and the busbar contact area is formed by the mounting surface of the bracket wing.
  • the IGBT contact area includes an opening of the coolant cavity, and the capacitor contact area is formed by the mounting surface of the bracket body.
  • the bracket body and the bracket wings are formed in a plate shape, the bracket wings protrude from the side of the bracket body, and the mounting surface of the bracket body is formed as the bracket The main plane of the body, and the mounting surface of the bracket wing is formed as the main plane of the bracket wing.
  • the bracket body includes an annular groove arranged around the opening of the coolant cavity for accommodating a sealing ring, and the sealing ring is used to form a seal between the bracket body and the IGBT And prevent the cooling liquid from leaking from the cooling liquid cavity.
  • bracket wings extend parallel to the bracket body.
  • the radiator further includes an electromagnetic shielding bracket connected to the bracket, and opposite sides of the electromagnetic shielding bracket have a first installation space and a second installation The first installation space and the second installation space are separated by the electromagnetic shielding bracket so that there is no electromagnetic interference between each other, the first installation space is used to install the IGBT drive board, and the second installation The space is used to install a control board that transmits execution signals to the IGBT.
  • the bracket includes a bracket body and a bracket leg, the cooling fluid cavity is defined by the bracket body, and the bracket leg extends from the bracket body and forms an accommodation space with the bracket body, The accommodating space is used for accommodating one of the IGBT and the capacitor.
  • the bracket leg has a mounting part for mounting with an external device.
  • An inverter module integrated with a radiator includes a radiator used in an inverter system, and also includes an IGBT, a capacitor and a bus bar installed on the radiator.
  • the IGBT, the capacitor, and the bus bar each have a body and an ear, and the IGBT, the capacitor, and the bus bar are in contact with the heat sink through their respective bodies, and The electrical connection is made through the respective ears.
  • the heat dissipation surface of the busbar for contact with the contact area of the busbar is coated with a thermally conductive material.
  • the radiator further includes a busbar fixing block, the busbar fixing block is installed on the bracket, and the busbar fixing block and the bracket define a plurality of fixed spaces arranged at intervals The number of the busbars is multiple, and the multiple busbars are installed in the fixed space so as to be integral with the busbar fixing block.
  • the radiator has a compact structure, good space adaptability, and can simultaneously dissipate IGBTs, capacitors and busbars.
  • the radiator, IGBT, capacitor, and busbar are integrated to form an inverter module with integrated radiator.
  • the inverter module has both the heat dissipation function and the inverter function, and has high added value.
  • Fig. 1 shows a perspective view of a known radiator used in an inverter system.
  • Fig. 2 shows a perspective view of a radiator for an inverter system according to an embodiment of the present invention, in order to clearly show the cooling liquid cavity, the electromagnetic shielding bracket is omitted.
  • Fig. 3 shows a perspective view of the inverter module with integrated heat sink according to an embodiment of the present invention.
  • the electromagnetic shielding bracket is removed.
  • FIG. 4 shows a perspective view of the inverter module with integrated heat sink of FIG. 3 from another perspective.
  • Fig. 5 shows a perspective view of the inverter module with integrated heat sink in Fig. 3, in which capacitors, bus bars and electromagnetic shielding brackets are removed.
  • Fig. 6 shows a perspective view of the inverter module with integrated heat sink in Fig. 3, in which the busbar and the electromagnetic shielding bracket are removed.
  • FIG. 7 shows a perspective view of the inverter module with integrated heat sink in FIG. 6 from another perspective.
  • Fig. 8 shows a cross-sectional view of the inverter module with integrated heat sink in Fig. 7, showing the heat transfer path of the capacitor.
  • the present disclosure provides a radiator 2 for an inverter system and an inverter module 1 integrating the radiator 2.
  • the radiator 2 includes a bracket 22, a cooling liquid cavity 21 and an electromagnetic shielding bracket 23.
  • the cooling liquid cavity 21 is used for accommodating the cooling liquid, and the bracket 22 defines the cooling liquid cavity 21.
  • the inverter module 1 includes the above-mentioned radiator 2 and an IGBT 3, a capacitor 4 and a busbar 5 mounted on the radiator 2.
  • the busbar 5 includes a DC busbar 52 and an AC busbar 51.
  • the DC busbar 52 is electrically connected to the capacitor 4, the capacitor 4 is electrically connected to the IGBT 3, and the IGBT 3 is electrically connected to the AC busbar 51, so that the DC power is input to the inverter system through the DC busbar 52, and the AC power passes through the AC busbar 51. Change system output.
  • the bracket 22 may include a bracket body 220, bracket wings 221 and bracket feet 222.
  • the bracket body 220 may be formed in a plate shape so as to have two main planes, and the two main planes are arranged along the first direction A (see FIG. 8).
  • the cooling liquid cavity 21 may be defined by the bracket body 220.
  • the bracket body 220 may be formed in a rectangular plate shape, and the inlet 211 and the outlet 212 of the cooling liquid cavity 21 may be arranged along the length direction of the bracket body 220 so that the cooling liquid flows along the length direction of the bracket body 220.
  • the bracket legs 222 extend from the bracket body 220, for example, can extend from the bracket body 220 along the first direction A, that is, extend perpendicular to the main plane of the bracket body 220, so that the bracket 22 has a substantially U-shape.
  • the bracket feet 222 and the bracket body 220 define an accommodation space located on one side of a main plane of the bracket body 220, and the accommodation space may be used to accommodate, for example, the capacitor 4 (detailed later).
  • the bracket foot 222 may have a mounting portion 2220 for mounting with an external device.
  • the mounting portion 2220 may have, for example, a bolt hole 222a to be bolted to the external device. In this way, the radiator 2 can be easily mounted on the bracket via the bracket foot 222. External device.
  • the bracket wing 221 may be formed in a plate shape so as to have two main planes.
  • the bracket wings 221 may extend from the side of the bracket body 220, for example, may extend from the bracket body 220 in a second direction perpendicular to the first direction A, that is, the two main planes of the bracket wings 221 and the bracket body 220
  • the two main planes are arranged in the same direction, and the bracket wings 221 are parallel to the bracket body 220.
  • the cooling liquid cavity 21 has a flow blocking groove 213 and a flow guiding groove 214.
  • the flow blocking groove 213 includes two flow blocking grooves 213 on the inlet side and the outlet side of the cooling liquid chamber 21.
  • the flow blocking groove 213 is roughly Extend perpendicular to the direction of coolant flow.
  • the diversion groove 214 extends between the two baffle grooves 213 and communicates with the two baffle grooves 213, and the diversion groove 214 extends along the arrangement direction of the inlet 211 and the outlet 212 of the cooling liquid cavity.
  • the cross-sectional shape of the baffle groove 213 is roughly V-shaped.
  • the coolant entering from the inlet 211 can flow into the baffle 214 along the inclined groove wall of the baffle groove 213 on the inlet side, and along the baffle 214 and the baffle on the outlet side.
  • the inclined groove wall of the flow groove 213 flows into the choke groove 213 on the outlet side, and flows out of the cooling liquid cavity 21 from the outlet 212.
  • the choke 213 can delay the cooling liquid from leaving the cooling liquid cavity 21, thereby obtaining a better cooling effect.
  • the heat sink 2 has a contact area, and the contact area is in contact with the IGBT 3, the capacitor 4 and the bus bar 5 so as to conduct heat transfer with them.
  • the contact area includes an IGBT contact area in contact with the IGBT 3, a capacitor contact area in contact with the capacitor 4, and a bus bar contact area in contact with the bus bar 5.
  • the IGBT contact area and the capacitor contact area may be located on both sides of the bracket 22 in the first direction A, such as the two main plane sides of the bracket body 220.
  • the busbar contact area may be located on the side of the wire connecting the IGBT contact area and the capacitor contact area in the arrangement direction.
  • the heat sink 2 provides a plurality of contact areas, and the support body 220 forms a laminated structure with the IGBT contact area, the capacitor contact area and the busbar contact area. Therefore, the radiator 2 has a compact structure, has good space adaptability, and can simultaneously dissipate the IGBT 3, the capacitor 4, and the busbar 5 at the same time.
  • the contact area can be formed by the mounting surface of the bracket 22 or the cavity wall of the coolant cavity. That is, the mounting surface of the bracket 22 can be connected with the IGBT 3, the capacitor 4, and the busbar 5 to transfer heat while waiting for the heat dissipation components to contact.
  • the cooling fluid directly contacts the parts to be dissipated to transfer heat.
  • mounting surface of the bracket 22 refers to the contactable and installable surface of the bracket 22.
  • the mounting surface forming the IGBT contact area may be a main plane of the bracket body 220, that is, the IGBT contact area is located on a main plane side of the bracket body 220.
  • the cooling liquid cavity 21 is missing on the one main plane side of the bracket body 220, so that when the IGBT 3 is mounted on the bracket 22 and the heat dissipation surface is in contact with the IGBT contact area, the heat dissipation surface directly contacts the cooling liquid to transfer heat. In this way, the efficiency of heat transfer is higher.
  • the area of the cavity wall of the cooling liquid cavity 21 on the main plane side is relatively large, and the parts to be dissipated can be in contact with the cooling liquid with a relatively large area.
  • An O-shaped sealing ring 9 can also be installed between the IGBT 3 and the above-mentioned one main plane of the bracket body 220, and the sealing ring 9 is arranged around the opening of the cooling liquid cavity 21 located on the main plane to prevent leakage of the cooling liquid.
  • the mounting surface forming the capacitor contact area may be another main plane of the bracket body 220, that is, the capacitor contact area is located on the other main plane side of the bracket body 220.
  • the heat dissipation surface contacts the main plane of the bracket body 220 to transfer heat.
  • the capacitor 4 transfers heat to the bracket body 220, and the heat received by the bracket body 220 from the capacitor 4 is further taken away by the coolant.
  • Arranging the capacitor contact area and the IGBT contact area on the main plane side of the bracket body 220 can improve the heat dissipation efficiency.
  • the IGBT 3 has an IGBT body and ears 4a, 51a.
  • the IGBT body has a heat dissipation surface in contact with the heat sink 2 and is bolted to the bracket body 220.
  • the ears 4a, 51a extend from the IGBT body. It is also used to electrically connect the capacitor 4 and the AC busbar.
  • the capacitor 4 has a capacitor body, a connecting portion 41 and ear portions 3 a and 52 a.
  • the capacitor body has a heat dissipation surface contacting the heat sink 2 and is bolted to the bracket body 220.
  • the connecting portion 41 extends from the capacitor body and extends along the first direction A toward the IGBT 3, and the connecting portion 41 crosses the bracket body 220 on the side of the bracket body 220.
  • the ear parts 3a, 52a extend from the connection part 41 for electrical connection with the IGBT 3 and the DC busbar.
  • the ear part 4a of the IGBT 3 is in contact with the ear part 3a of the capacitor 4, so that the IGBT 3 and the capacitor 4 are electrically connected through the circuits in the respective ear parts 4a, 3a.
  • the ear part 4a of the IGBT 3 and the ear part 3a of the capacitor 4 may be connected together by, for example, bolts.
  • the mounting surface forming the busbar contact area can be a main plane of the bracket wing 221, that is, the busbar contact area is located on a main plane side of the bracket wing 221, the IGBT contact area and the capacitor contact area The side of the line in the arrangement direction.
  • the busbar contact area is arranged on the side of the IGBT contact area and the capacitor contact area, especially on the same side, which can effectively alleviate the electromagnetic interference between the busbar contact area and the IGBT contact area and the capacitor contact area, thus the inverter module 1 Has better electromagnetic compatibility.
  • the busbar 5 may extend along the direction in which the bracket wings 221 extend, that is, extend perpendicular to the length direction of the bracket body 220.
  • the busbar 5 includes a plurality of busbars 5 arranged at intervals, for example, three AC busbars 51 and two DC busbars 52 arranged at intervals.
  • the plurality of bus bars 5 may be arranged perpendicular to the extension direction of the bracket wing 221, that is, arranged along the length direction of the bracket body 220.
  • the busbar 5 is provided with ears 513a and 524a at its ends in the extending direction.
  • the ears 513a of the AC busbar 51 are electrically connected to the ears 51a of the IGBT 3, and the ears 524a of the DC busbar 52 are connected to the ears of the capacitor 4.
  • the section 52a is electrically connected.
  • the ears 513a of the busbar 5 and the ears 51a of the IGBT 3 can be connected together by, for example, bolts, and the ears 524a of the busbar 5 and the ears 52a of the capacitor 4 can be connected together by, for example, bolts.
  • the radiator 2 may further include a busbar fixing block 8, which is made of an insulating material such as plastic, for example, and is formed as an elongated body extending along the arrangement direction of the plurality of busbars 5.
  • the busbar fixing block 8 may have a plurality of recesses, so that when the busbar fixing block 8 is installed on the bracket wing 221, a fixing space is formed between the busbar fixing block 8 and the bracket wing 221.
  • the busbars 5 are installed in the fixed space, so that the plurality of busbars 5 and the busbar fixing blocks 8 form a whole busbar module.
  • the busbar fixing block 8 may also have a threaded hole, so that the entire busbar module can be mounted on the bracket wing 221 by means of, for example, bolt connection.
  • a heat-conducting material may be provided on the heat dissipation surface of the busbar 5 in contact with the bracket wing 221, so as to improve the heat transfer efficiency between the busbar 5 and the heat sink 2.
  • the electromagnetic shielding bracket 23 is installed on a main plane side of the bracket body 220, for example, is installed on a main plane side of the bracket body 220 at a position corresponding to the coolant cavity 21.
  • four mounting posts 230 may be arranged around the coolant cavity 21, each of which has a threaded hole, and the electromagnetic shielding bracket 23 is mounted on the mounting post 230 by means of bolt connection, for example.
  • the heat sink 2 has a first installation space on one side of the electromagnetic shielding bracket 23 in the first direction A, and a second installation space on the other side of the electromagnetic shielding bracket 23 in the first direction A, and the first installation space
  • the second installation space and the second installation space are separated by the electromagnetic shield bracket 23 so that there is almost no electromagnetic interference between each other.
  • IGBT 3 and IGBT drive board 32 are installed in the first installation space, and control board 6 is installed in the second installation space.
  • the control board 6 is used to receive external control signals and transmit execution signals to the IGBT drive board 32.
  • the IGBT drive board 32 receives control.
  • the signal of the board 6 also drives the IGBT3.
  • the control board 6 and the IGBT drive board 32 are electrically connected.
  • the control board 6 and the IGBT drive board 32 are connected by wires, and the wires pass on the side of the electromagnetic shielding bracket 23.
  • the electromagnetic shielding bracket 23 can alleviate the electromagnetic interference between the control board 6 and the IGBT drive board 32.
  • the mounting surfaces forming the IGBT contact area and the capacitor contact area are both the main plane of the bracket body 220, and the mounting surface forming the busbar contact area is the main plane of the bracket wing 221, so that the IGBT contact area and the capacitor are in contact with each other.
  • the heat dissipation area between the contact area and the busbar contact area and the component to be dissipated is large, which can improve the heat dissipation efficiency.
  • the bracket 22 may be made of a thermally conductive material such as aluminum alloy.
  • the heat dissipation effect of the radiator 2 in this embodiment is verified by experiments: when the coolant temperature is 65 degrees Celsius, the coolant flow rate is 8L/min, and the power loss of the IGBT 3 is 2640W, the thermal resistance of the radiator 2 is 0.011 K/W, the maximum temperature rise of IGBT 3 is about 30 degrees Celsius.
  • the temperature rise of the inverter module 1 with the radiator 2 provided in this embodiment is relatively low.
  • the present disclosure integrates the radiator 2 with the IGBT 3, the capacitor 4 and the busbar 5 to form an inverter module 1 of the integrated radiator 2.
  • the inverter module 1 has both the heat dissipation function and the inverter function, and has high added value .
  • connection structure between the IGBT 3, the capacitor 4 and the busbar 5 and the radiator 2 can be reasonably designed, and the IGBT 3 and the capacitor 4 can be exchanged reasonably. And the position of busbar 5.
  • the cooling liquid cavity 21 may have a special cavity wall, so that heat is transferred through the cavity wall in contact with the components to be dissipated, that is, the IGBT contact area, the capacitor contact area and the busbar contact area are all provided by the bracket 22 It is formed so that all three of the IGBT 3, the capacitor 4 and the busbar 5 are in contact with the bracket and transfer heat.
  • the ears 51a, 4a of the IGBT 3, the ears 3a, 52a of the capacitor 4, and the ears 513a, 524a of the busbar 5 may also be connected by other methods, such as resistance welding.
  • glue may be applied around the opening of the coolant cavity 21 to seal the IGBT 3 and the bracket body 220.

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Abstract

一种用于逆变系统的散热器（2），其包括支架（22），所述支架（22）限定用于容纳冷却液的冷却液腔（21），所述散热器（2）具有接触区，所述接触区包括：IGBT接触区，所述IGBT接触区用于与IGBT（3）的散热表面接触；电容器接触区，所述电容器接触区用于与电容器（4）的散热表面接触；以及母排接触区，所述母排接触区用于与母排（5）的散热表面接触；所述IGBT接触区和所述电容器接触区位于所述冷却液腔（21）的相反的两侧，所述母排接触区位于所述IGBT接触区和所述电容器接触区在二者的排布方向上的连线的侧方。散热器（2）具有紧凑的结构，空间适应性较好，并能够同时对IGBT（3）、电容器（4）和母排（5）进行散热。

Description

用于逆变系统的散热器和集成散热器的逆变模块 技术领域
本发明涉及车辆技术领域，且特别地涉及一种用于逆变系统的散热器和集成散热器的逆变模块。
背景技术
逆变系统常用于车辆的驱动系统，其作用是将直流电转换成交流电。在逆变系统中，IGBT(Insulated Gate Bipolar Transistor；绝缘栅双极型晶体管)、电容器和母排是三个主要的发热源。在车辆中通常单独地设置散热器以帮助逆变系统散热。
如图1所示，一种现有的散热器2’为平板状，其具有散热器主体21’、冷却液入口211’和冷却液出口212’。散热器主体21’具有容纳冷却液的冷却液腔，冷却液从冷却液入口211’进入散热器主体21’，穿过冷却液腔并从冷却液出口212’流出，从而将吸收的热量带走。散热器主体21’具有冷却表面，冷却表面为平面，IGBT和电容器与该冷却表面接触并传递热量。
上述方案具有以下缺点：
第一，散热器2’仅能够用于冷却在同一平面内布置的IGBT和电容器，不能用于冷却母排。
第二，平板状的散热器2’需要较大的安装空间，空间适应性较差。
发明内容
本发明的目的在于克服或至少减轻上述现有技术存在的不足，提供一种可以同时为IGBT、电容器和母排三者散热的散热器，以及集成该散热器的逆变模块。
提供一种用于逆变系统的散热器，其包括支架，所述支架限定用于容纳冷却液的冷却液腔，所述散热器具有接触区，所述接触区包括：
IGBT接触区，所述IGBT接触区用于与IGBT的散热表面接触；
电容器接触区，所述电容器接触区用于与电容器的散热表面接触；以及
母排接触区，所述母排接触区用于与母排的散热表面接触；
所述IGBT接触区和所述电容器接触区位于所述冷却液腔的相反的两侧，所述母排接触区位于所述IGBT接触区和所述电容器接触区在二者的排布方向上的连线的侧方。
在至少一个实施方式中，所述IGBT接触区和所述电容器接触区中的至少一者包括所述冷却液腔的开口，从而所述IGBT和所述电容器中的至少一者能够与所述冷却液接触而传热。
在至少一个实施方式中，所述支架具有支架本体和支架翼部，所述冷却液腔由所述支架本体限定，所述支架翼部从所述支架本体伸出，所述IGBT接触区和所述电容器接触区中的至少一者由所述支架本体的安装面形成，所述母排接触区由所述支架翼部的安装面形成。
在至少一个实施方式中，所述IGBT接触区包括所述冷却液腔的开口，所述电容器接触区由所述支架本体的安装面形成。
在至少一个实施方式中，所述支架本体和所述支架翼部形成为板状，所述支架翼部从所述支架本体的侧方伸出，所述支架本体的安装面形成为所述支架本体的主平面，所述支架翼部的安装面形成为所述支架翼部的主平面。
在至少一个实施方式中，所述支架本体包括围绕所述冷却液腔的开口设置的用于容纳密封圈的环形槽，所述密封圈用于在所述支架本体和所述IGBT之间形成密封而防止所述冷却液从所述冷却液腔漏出。
在至少一个实施方式中，所述支架翼部与所述支架本体平行延伸。
在至少一个实施方式中，所述散热器还包括电磁屏蔽托架，所述电磁屏蔽托架连接于所述支架，所述电磁屏蔽托架的相反的两侧具有第一安装空间和第二安装空间，所述第一安装空间和所述第二安装空间由所述电磁屏蔽托架隔离从而彼此之间不具有电磁干扰，所述第一安装空间用于安装IGBT驱动板，所述第二安装空间用于安装向所述IGBT传输执行信号的控制板。
在至少一个实施方式中，所述支架包括支架本体和支架腿，所述冷却液腔由所述支架本体限定，所述支架腿从所述支架本体伸出并与所述支架本体形成容纳空间，所述容纳空间用于容纳所述IGBT和所述电容器中的一者。
在至少一个实施方式中，所述支架腿具有安装部，所述安装部用于与外部装置安装。
一种集成散热器的逆变模块，包括用于逆变系统的散热器，还包括安装于所述散热器的IGBT、电容器和母排。
在至少一个实施方式中，所述IGBT、所述电容器和所述母排均具有本体和耳部，所述IGBT、所述电容器和所述母排通过各自的本体与所述散热器接触，并通过各自的耳部而电连接。
在至少一个实施方式中，所述母排用于与所述母排接触区接触的散热表面涂有导热材料。
在至少一个实施方式中，所述散热器还包括母排固定块，所述母排固定块安装于所述支架，所述母排固定块和所述支架限定出间隔排布的多个固定空间，所述母排的数量为多个，多个所述母排安装于所述固定空间从而与所述母排固定块形成为整体。
本公开提供的技术方案至少能够获得以下有益效果：
散热器具有紧凑的结构，空间适应性较好，并能够同时对IGBT、电容器和母排进行散热。
将散热器和IGBT、电容器、母排集成一体，形成集成散热器的逆变模块，该逆变模块兼具散热功能和逆变器功能，具有较高的附加价值。
附图说明
图1示出了一种已知的用于逆变系统的散热器的立体图。
图2示出了根据本发明的一个实施方式的用于逆变系统的散热器的立体图，为了清楚显示冷却液腔而省去了电磁屏蔽托架。
图3示出了根据本发明的一个实施方式的集成散热器的逆变模块的一个视角的立体图，为了清楚显示IGBT从而去除了电磁屏蔽托架。
图4示出了图3的集成散热器的逆变模块的另一视角的立体图。
图5示出了图3中的集成散热器的逆变模块的立体图，其中去除了电容器、母排和电磁屏蔽托架。
图6示出了图3中的集成散热器的逆变模块的立体图，其中去除了母排和电磁屏蔽托架。
图7示出了图6中的集成散热器的逆变模块的另一视角的立体图。
图8示出了图7中的集成散热器的逆变模块的剖视图，示出电容器的热量传递路径。
附图标记说明：
2’散热器、21’散热器主体、211’冷却液入口、212’冷却液出口；
1逆变模块；
2散热器、21冷却液腔、211入口、212出口、213阻流槽、214导流槽、22支架、220支架本体、221支架翼部、222支架脚、2220安装部、222a螺栓孔、23电磁屏蔽托架、230安装柱；
3 IGBT、32 IGBT驱动板、4电容器、41连接部、5母排、51交流母排、52直流母排、6控制板、3a、51a、52a、4a、513a、524a耳部、8母 排固定块、9密封圈；
A第一方向。
具体实施方式
下面参照附图描述本发明的示例性实施方式。
如图2至图4所示，本公开提供一种用于逆变系统的散热器2和集成散热器2的逆变模块1。散热器2包括支架22、冷却液腔21和电磁屏蔽托架23，冷却液腔21用于容纳冷却液，支架22限定冷却液腔21。逆变模块1包括上述散热器2和安装于散热器2的IGBT 3、电容器4和母排5。母排5包括直流母排52和交流母排51。直流母排52与电容器4电连接、电容器4与IGBT 3电连接，IGBT 3与交流母排51电连接，从而直流电通过直流母排52被输入到逆变系统，交流电通过交流母排51从逆变系统输出。
支架22可以包括支架本体220、支架翼部221和支架脚222。支架本体220可以形成为板状，从而具有两个主平面，两个主平面沿第一方向A(参见图8)排布。冷却液腔21可以由支架本体220限定。支架本体220可以形成为长方形板状，冷却液腔21的入口211和出口212可以沿支架本体220的长度方向排布，从而冷却液沿支架本体220的长度方向流动。
支架脚222从支架本体220伸出，例如可以沿第一方向A从支架本体220伸出，即垂直于支架本体220的主平面伸出，从而支架22具有大致U形。支架脚222可以有两个，两个支架脚222分别位于板状的支架本体220的两端，例如在长度方向上的两端。支架脚222和支架本体220限定出位于支架本体220的一个主平面的一侧的容纳空间，该容纳空间可以用于容纳例如电容器4(后文详述)。
支架脚222可以具有安装部2220，安装部2220用于与外部装置安装，安 装部2220例如可以具有螺栓孔222a，从而与外部装置螺栓连接，这样，散热器2可以通过支架脚222方便地安装于外部装置。
支架翼部221可以形成为板状，从而具有两个主平面。支架翼部221可以从支架本体220的侧方伸出，例如可以沿与第一方向A垂直的第二方向从支架本体220伸出，即支架翼部221的两个主平面与支架本体220的两个主平面沿相同的方向排布，支架翼部221与支架本体220平行。
如图2所示，冷却液腔21具有阻流槽213和导流槽214，阻流槽213包括位于冷却液腔21的入口侧和出口侧的两个阻流槽213，阻流槽213大致垂直于冷却液流动的方向延伸。导流槽214在两个阻流槽213之间延伸并连通两个阻流槽213，导流槽214沿冷却液腔的入口211和出口212的排布方向延伸。
阻流槽213的截面形状大致为V形，从入口211进入的冷却液能够沿入口侧的阻流槽213的倾斜的槽壁流入导流槽214，并沿导流槽214和出口侧的阻流槽213的倾斜的槽壁流入出口侧的阻流槽213，并从出口212流出冷却液腔21。
阻流槽213能够使冷却液延迟离开冷却液腔21，从而获得更好的冷却效果。
散热器2具有接触区，接触区与IGBT 3、电容器4和母排5接触从而与它们进行热传递。接触区包括与IGBT 3接触的IGBT接触区、与电容器4接触的电容器接触区和与母排5接触的母排接触区。
如图3和图4所示，IGBT接触区和电容器接触区可以位于支架22在第一方向A上的两侧，例如支架本体220的两个主平面侧。母排接触区可以位于IGBT接触区和电容器接触区在排布方向上的连线的侧方。
散热器2提供多个接触区，并且支架本体220与IGBT接触区、电容器接触区和母排接触区形成叠层结构。从而，散热器2具有紧凑的结构，空间适 应性较好，并能够同时对IGBT 3、电容器4和母排5进行散热。
接触区可以由支架22的安装面形成，也可以由冷却液腔的腔壁形成，即可以通过支架22的安装面与IGBT 3、电容器4、母排5等待散热部件接触而传递热量，也可以通过冷却液直接与待散热部件接触而传递热量。
应当理解，支架22的安装面是指支架22的可接触和可安装的面。
如图2和图5所示，形成IGBT接触区的安装面可以为支架本体220的一个主平面，即IGBT接触区位于支架本体220的一个主平面侧。冷却液腔21在支架本体220的上述一个主平面侧的腔壁缺失，从而当IGBT 3安装于支架22并以散热表面与IGBT接触区接触时，该散热表面直接与冷却液接触而传递热量，这样热量传递的效率更高。
冷却液腔21在主平面侧的腔壁的面积较大，待散热部件能够以较大的面积与冷却液接触。
在IGBT 3与支架本体220的上述一个主平面之间还可以安装O形的密封圈9，密封圈9围绕冷却液腔21的位于该主平面的开口设置从而防止冷却液泄露。
如图6所示，形成电容器接触区的安装面可以为支架本体220的另一个主平面，即电容器接触区位于支架本体220的另一个主平面侧。当电容器4安装于支架22并以散热表面与电容器接触区接触时，该散热表面与支架本体220的主平面接触从而传递热量。
如图8所示，电容器4将热量传递至支架本体220，支架本体220从电容器4接收的热量进一步由冷却液带走。
将电容器接触区和IGBT接触区设置于支架本体220的主平面侧，能够提高散热效率。
如图3、图7所示，IGBT 3具有IGBT本体和耳部4a、51a，IGBT本体具 有与散热器2接触的散热表面并螺栓连接于支架本体220，耳部4a、51a从IGBT本体伸出并用于与电容器4和交流母排电连接。
电容器4具有电容器本体、连接部41和耳部3a、52a，电容器本体具有与散热器2接触的散热表面并螺栓连接于支架本体220。连接部41从电容器本体伸出并沿第一方向A向IGBT 3延伸，连接部41在支架本体220的侧方越过支架本体220。耳部3a、52a从连接部41伸出，以用于与IGBT 3和直流母排电连接。
IGBT 3的耳部4a和电容器4的耳部3a接触，从而IGBT 3和电容器4通过各自的耳部4a、3a内的电路电连通。IGBT 3的耳部4a和电容器4的耳部3a可以通过例如螺栓连接在一起。
继续参考图3和图4，形成母排接触区的安装面可以为支架翼部221的一个主平面，即母排接触区位于支架翼部221的一个主平面侧、IGBT接触区和电容器接触区在排布方向上的连线的侧方。
母排接触区在IGBT接触区和电容器接触区的侧方、特别是同一侧设置，这能够有效地缓解母排接触区与IGBT接触区和电容器接触区之间的电磁干扰，从而逆变模块1具有更好的电磁兼容性。
母排5可以沿支架翼部221伸出的方向延伸，即垂直于支架本体220的长度方向延伸。母排5包括间隔排布的多个母排5，例如间隔排布的三个交流母排51和两个直流母排52。
多个母排5可以垂直于支架翼部221的伸出方向排布，即沿支架本体220的长度方向排布。母排5在其延伸方向上的端部设置有耳部513a、524a，交流母排51的耳部513a与IGBT 3的耳部51a电连接，直流母排52的耳部524a与电容器4的耳部52a电连接。母排5的耳部513a与IGBT 3的耳部51a可以通过例如螺栓连接在一起，母排5的耳部524a和电容器4的耳部52a可以通过例如螺栓连接在一起。
散热器2还可以包括母排固定块8，母排固定块8例如由塑料等绝缘材料制成，并形成为沿多个母排5的排布方向延伸的长条体。母排固定块8可以具有多个凹部，从而当母排固定块8安装于支架翼部221时，母排固定块8与支架翼部221之间形成固定空间。
母排5在固定空间内安装，从而多个母排5与母排固定块8形成母排模块整体。母排固定块8还可以具有螺纹孔，从而母排模块整体可以通过例如螺栓连接的方式安装于支架翼部221。
在母排5与支架翼部221接触的散热表面上可以具有导热材料，从而提高母排5与散热器2之间的热传导效率。
电磁屏蔽托架23安装于支架本体220的一个主平面侧，例如对应于冷却液腔21的位置安装于支架本体220的一个主平面侧。在冷却液腔21的周围可以设置例如四个安装柱230，每个安装柱230具有螺纹孔，电磁屏蔽托架23通过例如螺栓连接的方式安装于安装柱230。
散热器2在电磁屏蔽托架23在第一方向A上的一侧具有第一安装空间，在电磁屏蔽托架23在第一方向A上的另一侧具有第二安装空间，第一安装空间和第二安装空间受电磁屏蔽托架23分隔从而在彼此之间几乎不存在电磁干扰。
第一安装空间安装有IGBT 3和IGBT驱动板32，第二安装空间安装有控制板6，控制板6用于接收外部的控制信号并向IGBT驱动板32传递执行信号，IGBT驱动板32接收控制板6的信号并驱动IGBT 3。控制板6和IGBT驱动板32电连接，例如控制板6和IGBT驱动板32通过电线连接，电线在电磁屏蔽托架23的侧方通过。
电磁屏蔽托架23能够缓解控制板6和IGBT驱动板32之间的电磁干扰。
在本实施方式中，形成IGBT接触区和电容器接触区的安装面均为支架 本体220的主平面，形成母排接触区的安装面为支架翼部221的主平面，这样IGBT接触区、电容器接触区和母排接触区与待散热部件之间的散热面积较大，能够提高散热效率。
在本实施方式中，支架22可以由铝合金等导热材料制成。
对本实施方式中的散热器2的散热效果进行实验验证：在冷却液温度为65摄氏度、冷却液流速为8L/min、IGBT 3的功率损耗为2640W的情况下，散热器2的热阻为0.011K/W，IGBT 3的最大温升大约为30摄氏度。具有本实施方式提供的散热器2的逆变模块1的温升较低。
本公开将散热器2和IGBT 3、电容器4和母排5集成一体，形成集成散热器2的逆变模块1，逆变模块1兼具散热功能和逆变器功能，具有较高的附加价值。
当然，本发明不限于上述实施方式，本领域技术人员在本发明的教导下可以对本发明的上述实施方式做出各种变型，而不脱离本发明的范围。
例如，在不违背逆变系统使用原理的前提下，基于上述构思，可以合理的设计IGBT 3、电容器4和母排5与散热器2之间的连接结构，并合理地交换IGBT 3、电容器4和母排5的位置。
在其他实施方式中，冷却液腔21可以具有专门的腔壁，从而通过该腔壁与待散热部件接触而传热，即IGBT接触区、电容器接触区和母排接触区三者均由支架22形成，从而IGBT 3、电容器4和母排5中三者均与支架接触并传热。
在其他实施方式中，IGBT 3的耳部51a、4a、电容器4的耳部3a、52a和母排5的耳部513a、524a还可以通过其他方式，例如电阻焊的方式连接在一起。
在其他实施方式中，可以围绕冷却液腔21的开口涂胶从而密封IGBT 3 和支架本体220。

Claims (14)

  1. 一种用于逆变系统的散热器，其包括支架(22)，所述支架(22)限定用于容纳冷却液的冷却液腔(21)，所述散热器(2)具有接触区，所述接触区包括：
    IGBT接触区，所述IGBT接触区用于与IGBT(3)的散热表面接触；
    电容器接触区，所述电容器接触区用于与电容器(4)的散热表面接触；以及
    母排接触区，所述母排接触区用于与母排(5)的散热表面接触；
    所述IGBT接触区和所述电容器接触区位于所述冷却液腔(21)的相反的两侧，所述母排接触区位于所述IGBT接触区和所述电容器接触区在二者的排布方向上的连线的侧方。
  2. 根据权利要求1所述的用于逆变系统的散热器，其特征在于，所述IGBT接触区和所述电容器接触区中的至少一者包括所述冷却液腔(21)的开口，从而所述IGBT和所述电容器中的至少一者能够与所述冷却液接触而传热。
  3. 根据权利要求1所述的用于逆变系统的散热器，其特征在于，所述支架(22)具有支架本体(220)和支架翼部(221)，所述冷却液腔(21)由所述支架本体(220)限定，所述支架翼部(221)从所述支架本体(220)伸出，所述IGBT接触区和所述电容器接触区中的至少一者由所述支架本体(220)的安装面形成，所述母排接触区由所述支架翼部(221)的安装面形成。
  4. 根据权利要求3所述的用于逆变系统的散热器，其特征在于，所述IGBT接触区包括所述冷却液腔(21)的开口，所述电容器接触区由所述支架本体(220)的安装面形成。
  5. 根据权利要求3所述的用于逆变系统的散热器，其特征在于，所述支 架本体(220)和所述支架翼部(221)形成为板状，所述支架翼部(221)从所述支架本体(220)的侧方伸出，所述支架本体(220)的安装面形成为所述支架本体(220)的主平面，所述支架翼部(221)的安装面形成为所述支架翼部(221)的主平面。
  6. 根据权利要求4所述的用于逆变系统的散热器，其特征在于，所述支架本体(220)包括围绕所述冷却液腔(21)的开口设置的用于容纳密封圈(9)的环形槽，所述密封圈(9)用于在所述支架本体(220)和所述IGBT(3)之间形成密封而防止所述冷却液从所述冷却液腔(21)漏出。
  7. 根据权利要求5所述的用于逆变系统的散热器(2)，其特征在于，所述支架翼部(221)与所述支架本体(220)平行延伸。
  8. 根据权利要求1所述的用于逆变系统的散热器(2)，其特征在于，所述散热器(2)还包括电磁屏蔽托架(23)，所述电磁屏蔽托架(23)连接于所述支架(22)，所述电磁屏蔽托架(23)的相反的两侧具有第一安装空间和第二安装空间，所述第一安装空间和所述第二安装空间由所述电磁屏蔽托架(23)隔离从而彼此之间不具有电磁干扰，所述第一安装空间用于安装IGBT驱动板(32)，所述第二安装空间用于安装向所述IGBT(3)传输执行信号的控制板(6)。
  9. 根据权利要求1所述的用于逆变系统的散热器，其特征在于，所述支架(22)包括支架本体(220)和支架腿(222)，所述冷却液腔(21)由所述支架本体(220)限定，所述支架腿(222)从所述支架本体(220)伸出并与所述支架本体(220)形成容纳空间，所述容纳空间用于容纳所述IGBT(3)和所述电容器(4)中的一者。
  10. 根据权利要求9所述的用于逆变系统的散热器，其特征在于，所述支架腿(222)具有安装部(2220)，所述安装部(2220)用于与外部装置安 装。
  11. 一种集成散热器的逆变模块，包括根据权利要求1至10中任一项所述的用于逆变系统的散热器(2)，还包括安装于所述散热器(2)的IGBT(3)、电容器(4)和母排(5)。
  12. 根据权利要求11所述的集成散热器的逆变模块，其特征在于，所述IGBT(3)、所述电容器(4)和所述母排(5)均具有本体和耳部(3a、4a、51a、52a、513a、524a)，所述IGBT(3)、所述电容器(4)和所述母排(5)通过各自的本体与所述散热器(2)接触，并通过各自的耳部(3a、4a、51a、52a)而电连接。
  13. 根据权利要求11所述的集成散热器的逆变模块，其特征在于，所述母排(5)用于与所述母排接触区接触的散热表面涂有导热材料。
  14. 根据权利要求11所述的集成散热器的逆变模块，其特征在于，所述散热器(2)还包括母排固定块(8)，所述母排固定块(8)安装于所述支架(22)，所述母排固定块(8)和所述支架(22)限定出间隔排布的多个固定空间，所述母排(5)的数量为多个，多个所述母排(5)安装于所述固定空间从而与所述母排固定块(8)形成为整体。
PCT/CN2019/104621 2019-09-06 2019-09-06 用于逆变系统的散热器和集成散热器的逆变模块 WO2021042348A1 (zh)

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