WO2021040309A1

WO2021040309A1 - Photomask, method for manufacturing same, and method for manufacturing display device using same

Info

Publication number: WO2021040309A1
Application number: PCT/KR2020/011003
Authority: WO
Inventors: 심우영; 백상윤; 장기석; 정순신; 문정민
Original assignee: 엘지디스플레이 주식회사; 연세대학교 산학협력단
Priority date: 2019-08-23
Filing date: 2020-08-19
Publication date: 2021-03-04
Also published as: KR20210023567A

Abstract

Embodiments of the present specification relate to a photomask, a method for manufacturing same, and a method for manufacturing a display device using same and, more specifically, to a photomask comprising: a base layer having a recessed portion located on one side thereof; and a pattern layer filling the recessed portion and having one surface exposed, wherein the maximum depth of the recessed portion and the maximum thickness of the pattern layer correspond to each other, and thus, the photomask can expose a photoresist while in close contact with the photoresist and form a pattern having a fine line width even when a light source having a relatively long wavelength is used.

Description

Photomask, manufacturing method thereof, and manufacturing method of display device using same

The present specification relates to a photomask, and more particularly, to provide a photomask capable of forming a pattern layer having a narrow line width even with light having a long wavelength, a method of manufacturing the same, and a method of manufacturing a display device using the same.

With the development of the information society, the development of high-definition and high-resolution display devices is required. Such a display device includes at least one substrate, and a plurality of fine patterns are disposed on the substrate. In order to form such a fine pattern, a patterning process using photolithography may be performed.

One or more photomasks may be used in the photolithography process. In the field of photolithography using a photomask, problems such as suppression of resolution due to diffraction are known.

In order to form a fine pattern, a light source with a short wavelength capable of suppressing diffraction may be used, but in order to use a light source with a short wavelength, it is necessary to replace the existing production facility with a production facility capable of using a light source with a short wavelength. However, replacement of production equipment can incur enormous costs. Accordingly, the inventors of the present specification invented a photomask capable of forming a fine pattern without changing production equipment, a method for manufacturing the same, and a method for manufacturing a display device using the same.

The problems to be solved according to the embodiments of the present specification to be described below are not limited to the problems mentioned above, and other problems that are not mentioned will be clearly understood by those skilled in the art from the following description.

A photomask according to an exemplary embodiment of the present specification includes a flexible substrate layer and a pattern layer.

The above-described base layer may be a flexible base layer in which a concave portion is located on one surface. The above-described pattern layer may fill the above-described concave portion, and one surface may be exposed.

The maximum depth of the above-described concave portion and the maximum thickness of the above-described pattern layer may correspond to each other.

The above-described photomask may include a contact surface divided into a pattern region in which one surface of the above-described pattern layer is exposed and a substrate region in which the above-described flexible substrate layer is exposed.

The above-described pattern layer may fill the above-described concave portion to planarize the above-described contact surface.

Each of the above-described pattern region and the above-described substrate region may have a planar shape.

The above-described contact surface may have a planar shape.

The above-described pattern region and the above-described substrate region may be located on the same plane.

The above-described flexible substrate layer may have a transmittance of 80% to 99% for light having a wavelength of 10 nm to 600 nm.

The above-described pattern layer may have a transmittance of 0% to 10% for light having a wavelength of 10 nm to 600 nm.

The above-described flexible substrate layer may include polydimethylsiloxane.

The pattern layer described above may include chromium.

A photomask manufacturing method according to an embodiment of the present specification includes forming a pattern layer protruding on a substrate, forming a flexible substrate layer positioned on the above-described substrate and covering the above-described pattern layer, and the above It may include the step of peeling one flexible substrate layer from the above-described substrate.

Forming the protruding pattern layer on the above-described substrate includes forming a photoresist layer on the above-described substrate, patterning the above-described photoresist layer, and patterning the above-described patterned photoresist layer. It may include depositing a layer and stripping the photoresist layer described above.

The step of peeling the above-described flexible substrate layer may be a step of peeling the protruding pattern layer and the above-described flexible substrate layer formed on the above-described substrate.

A method of manufacturing a display device according to an exemplary embodiment of the present specification may include exposing the above-described photoresist layer in a state in which the pattern layer of the above-described photomask is in contact with a photoresist layer positioned on a substrate. .

According to the embodiments of the present specification, since the photomask includes a flexible substrate layer having a concave portion on one surface and a pattern layer filling the above-described concave portion, it is possible to contact along the surface of the photoresist layer, so that a short wavelength light source is not used. There is an effect of realizing a fine pattern by contact printing.

In addition, according to the embodiments of the present specification, the method of manufacturing a photomask has an effect of manufacturing a photomask capable of implementing a fine pattern by contact printing since it can contact along the surface of the photoresist layer.

In addition, according to the exemplary embodiments of the present specification, the method of manufacturing a display device has an effect of manufacturing a display device having a fine pattern by exposing the photoresist layer in a state in which the above-described photomask is in contact with the photoresist layer. have.

1 is a schematic cross-sectional view of a photomask according to an embodiment.

2 is a schematic plan view of a photomask according to an exemplary embodiment.

3 to 8 are schematic diagrams for explaining a method of manufacturing a photomask according to an exemplary embodiment.

9 is a schematic diagram illustrating a method of manufacturing a display device according to an exemplary embodiment.

10 is a schematic diagram illustrating a method of manufacturing a display device according to a comparative example.

11 is data for explaining a method of manufacturing a display device according to a comparative example.

12 to 14 are data on fine patterns implemented with a photomask according to an embodiment.

15 is data showing formation of a fine pattern using a photomask according to an embodiment on a rough surface of a substrate and a surface having defects.

16 and 17 are data for a reflective display manufactured using a photomask according to an embodiment.

Advantages and features of the present specification, and a method of achieving them will become apparent with reference to the embodiments described below in detail together with the accompanying drawings. However, the present specification is not limited to the embodiments disclosed below, but will be implemented in various different forms. It is provided to fully inform the scope of the invention to those who have it, and this specification is only defined by the scope of the claims.

The shape, size, ratio, angle, number, etc. disclosed in the drawings for explaining the embodiments of the present specification are exemplary, and the present specification is not limited to the illustrated matters. The same reference numerals refer to the same elements throughout the specification. In addition, in describing the present specification, when it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present specification, the detailed description thereof will be omitted. When "include", "have", "consists of" and the like mentioned in the present specification are used, other parts may be added unless "only" is used. In the case of expressing the constituent elements in the singular, it includes the case of including the plural unless specifically stated otherwise.

In interpreting the constituent elements, it is interpreted as including an error range even if there is no explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as "on the top", "upper of the", "lower of the", and "the side of the", "right" Alternatively, one or more other parts may be located between the two parts unless "direct" is used.

In the case of a description of a temporal relationship, for example, "after", "following", "after", "before", etc., when a temporal predecessor relationship is described, "right" or "directly" It may also include non-contiguous cases unless "is used.

Each of the features of the various embodiments of the present specification can be partially or entirely combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be independently implemented with respect to each other or can be implemented together in an association relationship. May be.

Hereinafter, various embodiments of the present specification will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional view of a photomask according to an embodiment of the present specification.

Referring to FIG. 1, a photomask 100 according to an exemplary embodiment fills a flexible substrate layer 110 and a concave portion 111 in which a concave portion 111 is positioned on one surface, and a pattern layer having one surface exposed ( 120).

The flexible substrate layer 110 may include a flexible material. Since the photomask 100 includes the flexible substrate layer 110, the photomask 100 can contact the photoresist layer without a gap, thereby preventing a reduction in resolution due to diffraction in the exposure process of the photoresist layer. .

The flexible substrate layer 110 may have excellent light transmittance. The flexible substrate layer 110 may have a transmittance of 80% to 99% for light having a wavelength of 10 nm to 600 nm, for example. When the flexible substrate layer 110 has excellent light transmittance, a light source having a small output may be used.

The flexible substrate layer 110 is a flexible material, and may include, for example, polydimethylsiloxane (PDMS). When polydimethylsiloxane (PDMS) is used as the material of the flexible substrate layer 110, it is possible to provide a photomask suitable for contact printing due to excellent transparency and excellent flexibility.

The flexible substrate layer 110 has a concave portion 111 positioned on one surface thereof. Since the concave portion 111 is positioned on one surface of the flexible substrate layer 110, the pattern layer 120 may be embedded in the flexible substrate layer 110.

The pattern layer 120 fills the concave portion 111, and one surface is exposed. Referring to FIG. 1, while the pattern layer 120 is inserted into the flexible substrate layer 110, one surface of the pattern layer 120 may be exposed on the one surface of the photomask.

The pattern layer 120 has light blocking properties and may block a part of the light irradiated to the photomask 100. For example, the pattern layer 120 may have a transmittance of 0% to 10% for light having a wavelength of 10 nm to 600 nm.

The pattern layer 120 may include metal. For example, the pattern layer 120 may include chromium. When chromium is used as the material for the pattern layer 120, the processability is excellent, and the light-shielding pattern layer can be easily formed.

The photomask 100 may include a contact surface 130 in contact with the photoresist.

The maximum depth d of the concave portion 111 and the maximum thickness t of the pattern layer 120 correspond to each other. That the maximum depth d of the concave portion 111 and the maximum thickness t of the pattern layer 120 correspond to each other means that the maximum depth d of the concave portion 111 and the maximum thickness of the pattern layer 120 ( It can mean that t) is substantially the same.

The maximum depth d of the concave portion 111 may mean a degree in which the concave portion 111 is maximally depressed in the thickness direction of the photomask 100. The maximum depth d of the concave portion 111 may be, for example, a difference between a minimum value and a maximum value of a thickness between one surface of the flexible substrate layer 110 on which the concave portion 111 is formed and the opposite surface. .

The maximum depth d of the concave portion 111 is, for example, the maximum depth of the concave portion 111 measured in a direction perpendicular to the contact surface 130 from the contact surface 130 when the contact surface 130 has a planar shape It can mean (d).

The maximum thickness t of the pattern layer 120 may mean a maximum value of the thickness measured in the thickness direction of the photomask 100 of the pattern layer 120 filling the concave portion 111.

The maximum thickness t of the pattern layer 120 is, for example, the maximum thickness of the pattern layer 120 measured in a direction perpendicular to the contact surface 130 from the contact surface 130 when the contact surface 130 has a flat shape. It can mean (t).

When a plurality of concave portions 111 are located on one side of the pattern layer 120, the maximum depth (d) of the concave portion 111 and the maximum thickness (t) of the pattern layer 120 are measured at each concave portion. It may mean the depth of the concave portion 111 and the thickness of the pattern layer 120.

The maximum depth (d) of the concave portion 111 and the maximum thickness (t) of the pattern layer 120 correspond to each other, so that the pattern layer 120 can fill the concave portion 111 to the contact surface 130 of the photomask. I can. Accordingly, when the contact surface 130 of the photomask 100 contacts the photoresist, the gap between the edge portion of the pattern layer 120 and the photoresist can be minimized. When the gap between the edge portion of the pattern layer 120 and the photoresist is minimized, light diffracts while passing through the edge portion of the pattern layer 120 to reduce resolution.

The pattern layer 120 may fill the concave portion 111 to planarize the contact surface 130. That is, the pattern layer 120 may fill the concave portion 111 so that there is no step difference between the pattern layer 120 and the flexible substrate layer 110 on the contact surface 130.

Referring to FIG. 2, the contact surface 130 may be divided into a pattern region 131 in which one surface of the pattern layer 120 is exposed and a substrate region 132 in which the flexible substrate layer 110 is exposed. Accordingly, when the contact surface 130 contacts the photoresist, the pattern region 131 and the substrate region 132 constituting the contact surface 130 contact the photoresist, and one surface of the pattern layer 120 is in contact with the photoresist. I can contact you. When the photomask 100 has the above-described structure, since the gap between the pattern layer 120 and the photoresist can be minimized, a reduction in resolution due to diffraction can be effectively suppressed.

The pattern region 131 and the substrate region 132 may each have a planar shape. That is, one exposed surface of the pattern layer 120 may have a planar shape, and the flexible substrate exposed because the pattern layer 120 is not located on one surface where the concave portion 111 of the flexible substrate layer 110 is located. A portion of the layer 110 may also have a planar shape. In addition, the contact surface 130 may also have a planar shape. Since the contact surface 130 of the photomask 100 is in a planar shape, the gap between the pattern layer 120 and the photoresist is minimized when the contact surface 130 contacts the photoresist, thereby suppressing deterioration of resolution due to diffraction. have.

The pattern region 131 and the substrate region 132 may be located on the same plane. That is, there may be no step difference between the pattern layer 120 and the flexible substrate layer 110 on the contact surface 130. When the pattern region 131 and the substrate region 132 are located on the same plane, the load of the photomask is minimized while minimizing the gap between the photoresist and the pattern layer 120 when the photomask 100 contacts the photoresist. Since it may be dispersed in the flexible substrate layer 110, damage to the pattern layer 120 due to contact between the photoresist and the pattern layer 120 may be prevented.

3 to 8 are diagrams illustrating a method of manufacturing a photomask according to an exemplary embodiment.

In describing the present embodiment, descriptions of components that are the same as or corresponding to the previous embodiment will be omitted. Hereinafter, a method of manufacturing a photomask according to an embodiment of the present invention will be described with reference to this.

A photomask manufacturing method according to an exemplary embodiment of the present specification includes the steps of forming the pattern layer 120 protruding on the substrate 140, and the protruding pattern layer 120 positioned on the substrate 140 and described above. ) Forming the flexible substrate layer 110 covering the ), and peeling the above-described flexible substrate layer 110 from the above-described substrate 140.

3 is a view showing that the pattern layer 120 protruding on the substrate 140 is formed. The type of the substrate 140 is not particularly limited, for example, a silicon layer (Si), a silicon oxide layer (SiO ₂ ), and a nickel (Ni) layer sequentially stacked as a sacrificial layer may be used.

Forming the pattern layer 120 protruding on the substrate 140 includes, for example, forming a photoresist layer 150 on the substrate 140 and patterning the photoresist layer 150. The steps may include depositing the pattern layer 120 on the patterned photoresist layer 150 and stripping the photoresist layer 150.

4 is a view showing that a photoresist layer 150 is formed on the substrate 140. The type of the photoresist layer 150 is not particularly limited, but, for example, polymethylmethacrylate (PMMA) may be used. A method of forming the photoresist layer 150 on the substrate 140 may be, for example, a method of coating a photoresist composition on the substrate 140.

5 is a diagram illustrating a patterned photoresist layer 150 formed on the substrate 140. A method of patterning the photoresist layer 150 may be, for example, e-beam lithography.

6 is a diagram illustrating that the pattern layer 120 is deposited on the patterned photoresist layer 150. The deposition method of the pattern layer 120 may be, for example, a chemical vapor deposition method such as a thermal evaporation method, a plasma vapor deposition method, an atmospheric vapor deposition method, a low pressure vapor deposition method, or a physical vapor deposition method such as a thermal evaporation method, an electron beam evaporation method, or sputtering.

The step of stripping the photoresist layer 150 may be performed in a step in which the pattern layer 120 is deposited on the patterned photoresist layer 150 shown in FIG. 6. When the photoresist layer 150 is stripped in the step shown in FIG. 6, the pattern layer 120 disposed on the photoresist layer 150 is also removed, and The protruding pattern layer 120 may be formed.

7 is a view showing that a flexible base layer 110 is formed on the substrate 140 and covers the protruding pattern layer 120. The flexible substrate layer 110 may be formed, for example, by a method of photocuring or thermosetting after coating the composition. When the flexible substrate layer 110 is formed while the pattern layer 120 protruding on the substrate 140 is formed, the aforementioned concave portion may be formed on one surface of the substrate layer 110.

FIG. 8 is a diagram illustrating peeling of the flexible substrate layer 110 from the substrate 140. The step of peeling the flexible substrate layer 110 may be a step of peeling the protruding pattern layer 120 formed on the substrate 140 together with the flexible substrate layer 110.

For example, if the substrate layer 110 is peeled after applying and curing a polydimethylsiloxane (PDMS) composition on the substrate 140 and the pattern layer 120, the pattern layer 120 is peeled off from the substrate 140 Can be. By peeling off the base layer 110, the photomask according to the above-described embodiment may be manufactured.

9 is a diagram for describing a method of manufacturing a display device according to an exemplary embodiment of the present specification.

In describing the present embodiment, descriptions of components that are the same as or corresponding to the previous embodiment will be omitted. Hereinafter, a method of manufacturing a display device according to an exemplary embodiment of the present invention will be described with reference to this.

Referring to FIG. 9, in a method of manufacturing a display device according to an exemplary embodiment of the present specification, a photoresist layer 151 disposed on a substrate 141 is in contact with the pattern layer 120 of the photomask described above. And exposing the photoresist layer 151 to light.

The substrate 141 is a substrate on which a pattern is to be formed by a photolithography process, and its type is not particularly limited as long as it is used in the field of a display device.

The photoresist layer 151 is a photosensitive layer used to form a pattern by a photolithography process, and its type is not particularly limited as long as it is used in the field of a display device.

Referring to FIG. 9, the pattern layer 120 directly contacts the photoresist layer 151. In addition, the flexible substrate layer 110 may also directly contact the photoresist layer 151.

When the above-described photomask is used, since there is no gap between the pattern layer 120 and the photoresist layer 151, it is possible to prevent a decrease in resolution due to the gap between the pattern layer 120 and the photoresist layer 151. have.

10 is a diagram illustrating a method of manufacturing a display device according to a comparative example. In a method of manufacturing a display device according to the comparative example, the photoresist layer 151 is spaced apart from the photoresist layer 151 on the substrate 141 with a specific gap S. ) Can be performed.

For example, when the photomask 200 is a flat and stiff material, for example, a fine metal mask, the photomask 200 is brought into contact with the photomask 200 and the photoresist layer 151. In order to prevent damage to ), the photomask 200 may be disposed with a specific gap S.

In another example, when a mask having a protruding pattern layer formed on a substrate is used, damage to the pattern layer may be applied when the protruding pattern layer contacts the photoresist layer, thus preventing damage to the photomask by contact. In order to do so, a photomask may be disposed with a specific gap.

If there is a gap S between the photomask 200 and the photoresist layer 151, there may be a problem that light passing through the photomask 200 is not blocked by the photomask 200 due to diffraction. . For example, even though the pattern layer is formed to have a specific line width R, a fine pattern having the line width R may not be formed by a photolithography process.

11 is a data for explaining that the resolution of the photolithography process decreases due to the diffraction of light when the photoresist layer is exposed with a photomask disposed with a specific gap (S) as shown in FIG. 10 to be.

Referring to FIG. 11, the photolithography process shown in FIG. 10 is intended to be irradiated with light as indicated by a dotted line, but the photomask 200 is spaced apart from the photoresist layer 151 by a specific gap S. It can be seen that the light was irradiated as indicated by a solid line as a result of proceeding the process in the state of being turned on.

In the case of the method of manufacturing a display device according to an exemplary embodiment of the present specification, since the photoresist layer can be exposed while the pattern layer of the photomask is in contact with the photoresist, deterioration of resolution can be effectively prevented.

12 is data for explaining fine patterns that can be formed when using a photomask according to an exemplary embodiment of the present specification.

12 is a view of forming a resolution test pattern (USAF Resolving Power Test Target 1951) using a light source having a wavelength of 400 nm to 500 nm and a photomask according to an embodiment of the present specification. A protruding pattern layer 120 was formed on the substrate 140, and plan photographs thereof are shown in b and e. Using the pattern layer 120 protruding on the above-described substrate 140, a photomask including the flexible substrate layer 110 and the pattern layer 120 was manufactured, and plan photographs are shown in c and f. I got it. A patterned photoresist layer 151 was formed on the substrate 141 by using the above-described photomask, and plan photographs thereof are shown in d and g. Referring to FIG. 12, a photoresist layer 151 having a line width of 51 nm, which is about 1/10 of a wavelength, using a light source of 400 nm to 500 nm rather than a short wavelength such as DUV (Deep UV) or EUV (Extreme UV). It can be seen that this was formed.

Referring to FIG. 12, it can be seen that the line width of the patterned layer 120 of the photomask is effectively reflected in the line width of the patterned photoresist layer 151 formed using the photomask, as can be seen through i.

13 is data for explaining fine patterns that can be formed when using a photomask according to embodiments of the present specification.

13 illustrates a line pattern and a dot pattern formed by using a photomask and a light source having a wavelength of 400 nm to 500 nm according to exemplary embodiments of the present specification. As can be seen from FIG. 13, when the photomask according to the embodiments of the present specification is used, a line having a line width of 60 nm and 160 nm is a light source of 400 nm to 500 nm, not a short wavelength such as Deep UV (DUV) or Extreme UV (EUV). Patterns and dot patterns can be formed.

14 is data showing that a pattern is formed on a curved surface rather than a flat surface using a photomask according to an exemplary embodiment of the present specification.

A PET substrate was placed on a structure having a radius of curvature of 250 nm, and a photomask according to an embodiment of the present specification was exposed using a light source having a wavelength of 400 nm to 500 nm. Referring to FIG. 13, it can be seen that even when exposure is performed on a substrate having a curvature, a pattern having a line width of 38 nm is formed. The photomask according to an embodiment of the present specification includes a flexible substrate layer in which a concave portion is located and a pattern layer that fills the concave portion, and the maximum depth of the concave portion and the maximum thickness of the pattern layer correspond to each other. The contact surface of the photomask may be in close contact with a substrate having a curvature, and thus, a reduction in resolution due to diffraction may be prevented, and thus a fine pattern may be formed even on a substrate having a curvature.

15 is a data showing that a pattern is formed on a rough surface of a substrate and a surface having defects by using a photomask according to an exemplary embodiment of the present specification.

A rough surface was formed using leaves (a). The surface of the leaf is rougher than the plastic substrate and has defects, so it is difficult to implement a pattern when using a conventional photolithography process.

A pattern was formed on a rough surface formed using leaves using a photomask according to an embodiment of the present specification (b, c, d, e, f, g). As a result of using the photomask according to the exemplary embodiment of the present specification, it can be seen that the pattern is successfully formed even though the surface of the leaf is rough.

In addition, patterns were formed in areas with defects such as curl, step, and kink (k, l, m).

Therefore, when the photomask according to the embodiments of the present specification is used, since the photomask can adhere closely along the surface shape of the photoresist layer, a fine pattern can be formed even on a rough surface or a defective area.

16 is data for a reflective display manufactured using a photomask according to an exemplary embodiment of the present specification.

An image was implemented on the substrate using a plasmonic nano pattern with a size of 0.96 mm in width and 1.2 mm in height (b). Patterning was performed on a silver (Ag) substrate using a photomask according to an embodiment of the present specification, and plasmonic nanopatterns having different sizes were formed in portions requiring different colors (c to k).

When the photomask according to the embodiment of the present specification is used, plasmonic nano-patterns of various sizes can be formed, and thus a reflective display can be implemented by using a resonance phenomenon of light reflected from a nano-sized pattern.

17 is data for a reflective display manufactured using a photomask according to an exemplary embodiment of the present specification.

When the photomask according to the embodiment of the present specification is used, a reflective display having various colors can be manufactured by forming a plasmonic nano pattern. Since the implemented color can be changed according to the type of metal substrate and the thickness of the photoresist, even if the same photomask is used, the type of the metal substrate and the thickness of the photoresist can be changed to manufacture a reflective display in which various colors are implemented. I can.

Although the embodiments of the present specification have been described in more detail with reference to the accompanying drawings, the present specification is not necessarily limited to these embodiments, and various modifications may be made without departing from the spirit of the present specification. . Accordingly, the embodiments disclosed in the present specification are not intended to limit the technical idea of the present specification, but to describe, and the scope of the technical idea of the present specification is not limited by these exemplary embodiments. Therefore, it should be understood that the embodiments described above are illustrative and non-limiting in all respects. The scope of protection of the present specification should be construed by the claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present specification.

[Explanation of code]

100: photomask

110: base layer

111: recess

120: pattern layer

130: contact surface

131: pattern area

132: substrate area

140: substrate

150: photoresist layer

CROSS-REFERENCE TO RELATED APPLICATIONCROSS-REFERENCE TO RELATED APPLICATION

This patent application claims priority in accordance with Article 119(a) of the U.S. Patent Law (35 USC § 119(a)) with respect to Patent Application No. 10-2019-0103926 filed in Korea on August 23, 2019. All contents are incorporated into this patent application by reference. In addition, if this patent application claims priority for countries other than the United States for the same reason as above, all the contents are incorporated into this patent application as references.

Claims

A flexible substrate layer in which a concave portion is located on one side; And

Filling the concave portion, including a pattern layer exposed on one side,

A photomask in which a maximum depth of the concave portion and a maximum thickness of the pattern layer correspond to each other.
The method of claim 1,

A photomask comprising a contact surface divided into a pattern region in which one surface of the pattern layer is exposed and a substrate region in which the flexible substrate layer is exposed.
The method of claim 2,

The pattern layer is a photomask for flattening the contact surface by filling the concave portion.
The method of claim 2,

The pattern area and the substrate area are each planar photomask.
The method of claim 2,

The contact surface is a planar photomask.
The method of claim 2,

The pattern region and the substrate region are a photomask positioned on the same plane.
The method of claim 1,

The flexible substrate layer is a photomask having a transmittance of 80% to 99% for light having a wavelength of 10 nm to 600 nm.
The method of claim 1,

The pattern layer is a photomask having a transmittance of 0% to 10% for light having a wavelength of 10 nm to 600 nm.
The method of claim 1,

The flexible substrate layer is a photomask comprising polydimethylsiloxane.
The method of claim 1,

The pattern layer is a photomask containing chromium.
Forming a pattern layer protruding on the substrate;

Forming a flexible substrate layer on the substrate and covering the protruding pattern layer; And

A photomask manufacturing method comprising the step of peeling the flexible substrate layer from the substrate.
The method of claim 11,

Forming the pattern layer protruding on the substrate,

Forming a photoresist layer on the substrate;

Patterning the photoresist layer;

Depositing a pattern layer on the patterned photoresist layer; And

A photomask manufacturing method comprising the step of stripping the photoresist layer.
The method of claim 11,

The step of peeling the flexible substrate layer is a step of peeling the protruding pattern layer and the flexible substrate layer formed on the substrate.
A method of manufacturing a display device comprising the step of exposing the photoresist layer in a state in which the pattern layer of the photomask of claim 1 is in contact with the photoresist layer positioned on a substrate.