WO2021036201A1 - 背接触太阳能电池组件生产方法及背接触太阳能电池组件 - Google Patents
背接触太阳能电池组件生产方法及背接触太阳能电池组件 Download PDFInfo
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- WO2021036201A1 WO2021036201A1 PCT/CN2020/074297 CN2020074297W WO2021036201A1 WO 2021036201 A1 WO2021036201 A1 WO 2021036201A1 CN 2020074297 W CN2020074297 W CN 2020074297W WO 2021036201 A1 WO2021036201 A1 WO 2021036201A1
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Definitions
- This application relates to the field of solar photovoltaic technology, and in particular to a method for producing a back-contact solar cell module, a back-contact solar cell module, a computer program, and a computer-readable medium.
- the back-contact solar cell module has no busbar line on the front side, the positive and negative electrodes are both arranged on the back of the battery, which reduces shading, effectively increases the short circuit of the battery, improves the energy conversion efficiency of the module, and has a wide application prospect.
- the production method of back-contact solar cell modules is mainly as follows: conductive glue is set between the back-contact solar cell and the metal circuit board. During the lamination process, the back-contact solar cell and the metal circuit board are electrically connected and connected through the conductive glue. Bonding.
- the back-contact solar cell sheet and the metal circuit board are electrically connected and bonded by conductive glue.
- the electrical connection is unreliable and the yield rate is low.
- This application provides a back contact solar cell module, a back contact solar cell module production method, a computer program, and a computer readable medium, aiming to solve the problem of unreliable electrical connection of the back contact solar cell module and low yield rate. problem.
- a method for producing a back-contact solar cell module including:
- a first stacking piece is provided; the first stacking piece includes a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece has several A first conductive site; the first stacking member further includes a conductive boss formed on the first conductive site of the first piece;
- a second stack is provided; the second stack includes a second sheet; the second sheet is the other of the metal circuit board and the back contact solar cell sheet; the second sheet
- the surface of the piece has a number of second conductive sites; the outer periphery of the first conductive site or the outer periphery of the second conductive site is provided with adhesive insulating spacers;
- the first stacking piece and the second stacking piece are stacked and laminated, so that the conductive boss abuts on the second conductive site, and the adhesive insulating spacer Bonding the first piece and the second piece together.
- the material of the adhesive insulating spacer is an insulating adhesive material; the insulating adhesive material includes a liquid adhesive and an inert filler; and the inert filler includes silica particles.
- the silica particles are fumed silica particles.
- the liquid binder includes: siloxane; the mass ratio of the inert filler to the liquid binder is 7:3 to 3:7.
- the first stack is obtained through the following steps:
- a conductive material is printed on the first conductive site of the first piece to form the conductive boss.
- the method before the stacking and laminating the first stacking piece and the second stacking piece, the method further includes:
- the adhesive insulating spacer is printed and formed; or, on the periphery of the second conductive site of the second piece, the Bond insulating spacers.
- the thickness of the adhesive insulating spacer is 1 to 100 microns.
- the method before the stacking and laminating the first stacking piece and the second stacking piece, the method further includes:
- the method before the printing a conductive material on the first conductive site of the first piece to form the conductive boss, the method further includes:
- the packaging material and the cover material are sequentially stacked on the first side of the first sheet; the first side is opposite to the side of the first sheet with the first conductive site;
- the printing a conductive material on the first conductive site of the first piece to form the conductive boss includes:
- the packaging material and the cover material are used as a printing support substrate, and a conductive material is printed on the first conductive site of the first piece to form a conductive boss.
- a back contact solar cell module including: a first stacking member and a second stacking member;
- the first stack includes a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece has a number of first conductive sites;
- the first stacking member further includes a conductive boss formed on the first conductive site of the first sheet member;
- the second stacking piece includes a second piece; the second piece is the other of the metal circuit board and the back contact solar cell piece; the surface of the second piece has a plurality of second pieces Conductive site; the periphery of the first conductive site or the periphery of the second conductive site is provided with an adhesive insulating spacer;
- the first stacking piece and the second stacking piece are laminated and laminated together, and the conductive boss abuts on the second conductive site; the first piece and the second The pieces are bonded together by the bonding insulating spacer.
- a computer program including computer readable code, when the computer readable code runs on a computing processing device, causing the computing processing device to execute any of the foregoing Back contact solar cell module production method.
- a first stack is provided; the first stack includes a first piece; the first piece is one of a metal circuit board or a back contact solar cell; the first The surface of the sheet member has a plurality of first conductive sites; the first stacking member further includes conductive bosses formed on the first conductive sites of the first sheet member; a second stacking member is provided; The second stacking piece includes a second piece; the second piece is the other of the metal circuit board and the back contact solar cell piece; the surface of the second piece has a plurality of second pieces Conductive site; the periphery of the first conductive site or the periphery of the second conductive site is provided with an adhesive insulating spacer; the first stacking member and the second stacking member are stacked and combined Lamination, so that the conductive boss abuts on the second conductive site, and the adhesive insulating spacer is used to bond the first piece and the second piece together.
- the electrical connection and bonding between the metal circuit board and the back-contact solar cell are realized by the conductive adhesive.
- the above-mentioned electrical connection is mainly in the lamination process, the conductive adhesive and the metal circuit board The fusion is realized with the conductive sites on the back contact solar cell sheet, so that the reliability of the electrical connection is low and the yield rate is low.
- the first stacking member includes a conductive boss formed on the first conductive site of the first sheet member, an adhesive insulating spacer is provided on the periphery of the first conductive site or the second conductive site, and a metal circuit
- the electrical connection between the panel and the back contact solar cell is mainly realized by stacking the first stacking piece and the second stacking piece, and the conductive boss abuts on the second conductive site of the second piece, basically without The fusion can realize a stable electrical connection, which improves the reliability of the electrical connection and the yield rate.
- the conductive boss and the second conductive site can be pressed tighter, and the reliability of the electrical connection and the yield rate are further improved.
- Fig. 1 shows a flow chart of the production method of a back contact solar cell module in an embodiment of the present application
- Fig. 2 shows a schematic structural diagram of a back-contact solar cell in an embodiment of the present application
- FIG. 3 shows a schematic diagram of the structure of an electrode in an embodiment of the present application
- FIG. 4 shows a schematic structural diagram of a doped diffusion region in an embodiment of the present application
- FIG. 5 shows a schematic structural diagram of a bonded insulating spacer in an embodiment of the present application
- Fig. 6 shows a schematic structural diagram of another bonded insulating spacer in an embodiment of the present application
- Fig. 7 shows a schematic structural diagram of a back-contact solar cell module in an embodiment of the present application
- Fig. 8 shows a flow chart of another method for producing a back-contact solar cell module in an embodiment of the present application
- FIG. 9 shows a schematic structural view of stacking packaging materials on the first side of the first sheet in an embodiment of the present application.
- FIG. 10 shows a schematic diagram of a structure in which conductive bosses are printed and formed on the first conductive sites of the back-contact solar cell in an embodiment of the present application
- Fig. 11 schematically shows a block diagram of a computing processing device for executing the method according to the present application
- Fig. 12 schematically shows a storage unit for holding or carrying program codes for implementing the method according to the present application.
- FIG. 1 shows a flow chart of a production method of a back contact solar cell module in an embodiment of the present application.
- Step 101 Provide a first stacking piece; the first stacking piece includes a first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; The surface has a plurality of first conductive sites; the first stacking member further includes conductive bosses formed on the first conductive sites of the first sheet member.
- the first stacking member includes a first sheet member.
- the first piece is one of a metal circuit board or a back contact solar cell piece.
- the first piece may be a metal circuit board.
- the first piece may be a back contact solar cell piece.
- the number of back-contact solar cells is not specifically limited, and each back-contact solar cell may have substantially the same current characteristics or voltage characteristics. Specifically, it is set according to the needs of the back contact solar cell module.
- the back-contact solar cell sheet may be a solar cell sheet with no busbars on the front side, and both the positive electrode and the negative electrode are arranged on the back side.
- the back contact solar cell sheet may be an IBC battery, MWT battery, EWT battery, or the like.
- FIG. 2 shows a schematic structural diagram of a back-contact solar cell in an embodiment of the present application.
- 1 can be a silicon substrate
- 2 can be a doped diffusion region
- 3 can be an electrode.
- 11 may be a surface that receives light, that is, 11 is the front surface of the silicon substrate 1.
- 12 may be the back surface of the silicon substrate 1.
- the doped diffusion region 2 and the electrode 3 are arranged on the back of the silicon substrate 1 in sequence.
- FIG. 3 shows a schematic structural diagram of an electrode in an embodiment of the present application.
- the electrode 3 may include a negative fine grid line 31, a positive fine grid line 32, a negative connection electrode 33 and a positive connection electrode 34.
- the positive electrode connection electrode 34 is electrically connected to the positive electrode thin grid line 32
- the negative electrode connection electrode 33 is electrically connected to the negative electrode thin grid line 31.
- the positive electrode fine grid lines 32 and the negative electrode fine grid lines 31 may be segmented fine grid lines or continuous fine grid lines.
- the positive electrode connection electrode 34 can be connected to all or part of the positive electrode fine grid lines 32 in the same row or the same column
- the negative electrode connection electrode 33 can be connected to all or part of the negative electrode fine grid lines 31 in the same row or column.
- the anode fine gate line 32 may be in electrical contact with the P-type doped diffusion region
- the anode fine gate line 31 may be in electrical contact with the N-type doped diffusion region.
- FIG. 4 shows a schematic structural diagram of a doped diffusion region in an embodiment of the present application.
- the doped diffusion region 2 may include a P-type doped diffusion region 21 and an N-type doped diffusion region 22.
- the P-type doped diffusion region 21 and the N-type doped diffusion region 22 may be alternately arranged.
- the function of the metal circuit board is to collect the current of the back contact with the solar cell.
- the metal circuit board may be a metal circuit board with isolation formed by a patterning process.
- the patterning treatment may be to remove a part of the metal circuit board by means of laser, chemical etching or mechanical cutting to form a void, and the width of the void may be greater than 50 microns, such as 200 microns or greater.
- the isolated part of the metal circuit board is used for subsequent connection with the P-type doped diffusion region of the back contact solar cell.
- the other part isolated from the metal circuit board is used for subsequent connection with the N-type doped diffusion region of the back contact solar cell.
- the material of the metal circuit board may be at least one of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, tungsten, and alloys thereof.
- the material of the metal circuit board may be at least one element of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, and tungsten.
- the material of the metal circuit board may be an alloy of at least two combinations of copper, silver, aluminum, nickel, magnesium, iron, titanium, molybdenum, and tungsten.
- the material of the metal circuit board may be a combination of at least one element and at least one alloy.
- the surface of the first piece has a number of first conductive sites.
- the above-mentioned first conductive site is mainly used for collecting or deriving current.
- the first conductive site may be: an electrode that back-contacts the back-light surface of the solar cell sheet or an electrode to be connected point or the like.
- the first conductive site may be: a negative fine grid line and a positive fine grid line that back-contact the backlight surface of the solar cell.
- the first conductive site may be: a negative electrode connecting electrode, a positive electrode connecting electrode, etc., back contacting the backlight surface of the solar cell.
- the first conductive site may be a position on the surface of the metal circuit board that is electrically connected to the electrode of the back contacting solar cell.
- the first conductive site may be a point on the surface of the metal circuit board that is electrically connected to the negative fine grid line and the positive fine grid line back contacting the backlight surface of the solar cell.
- the first conductive site may be a point on the surface of the metal circuit board that is electrically connected to the negative electrode connecting electrode, the positive electrode connecting electrode, etc., which are back in contact with the backlight surface of the solar cell.
- the first stacking member further includes a conductive boss formed on the first conductive site of the first sheet member.
- the main function of the conductive boss is to electrically connect the first conductive site on the first piece and the second conductive site on the second piece to collect or derive current.
- the height of the conductive boss is set to be able to electrically connect the first conductive site and the second conductive site well. In the embodiment of the present application, the height of the conductive boss is not specifically limited.
- the material of the conductive boss may be at least one of solder paste, tin paste, isotropic conductive glue, anisotropic conductive glue, conductive ink, and conductive paste.
- the shape of the conductive boss may be a circle or a rectangle.
- the conductive boss may include: a conductive boss contacting the positive electrode of the back-contact solar cell and a conductive boss contacting the negative electrode of the back-contact solar cell.
- the conductive boss may include: a conductive boss contacting the positive fine grid line of the back-contacting solar cell sheet and a conductive boss contacting the negative electrode fine grid line of the back-contacting solar cell sheet.
- the conductive bumps may include: conductive bumps in contact with the P-type doped diffusion region of the back-contact solar cell and conductive bumps in contact with the N-type doped diffusion region of the back-contact solar cell.
- the number of conductive protrusions may be the same as or different from the number of first conductive sites.
- the number of conductive bumps corresponding to a single back contact solar cell sheet can be 20-5000.
- the number of conductive protrusions corresponding to the entire back-contact solar cell module can be 1,000 to 50,000.
- the above-mentioned number of conductive bumps is beneficial to the collection and conduction of current. In the embodiments of the present application, this is not specifically limited.
- the single back-contact solar cell sheet may include 20-5000 conductive bumps.
- Step 102 providing a second stacking piece; the second stacking piece includes a second piece; the second piece is the other of the metal circuit board and the back contact solar cell piece;
- the surface of the second piece has a plurality of second conductive sites; the periphery of the first conductive site or the periphery of the second conductive site is provided with adhesive insulating spacers.
- the second piece may be a metal circuit board or a back contact solar cell piece other than the first piece.
- the second piece may be a back contact solar cell piece.
- the first piece is a back contact solar cell piece.
- the second piece may be a metal circuit board.
- the surface of the second piece has a number of second conductive sites.
- the above-mentioned second conductive site is mainly used for collecting or deriving current.
- the second conductive site may be an electrode that back-contacts the backlight surface of the solar cell or a point to be connected to the electrode.
- the second conductive site may be: a negative fine grid line and a positive fine grid line that back-contact the backlight surface of the solar cell sheet.
- the second conductive site may be: a negative electrode connecting electrode, a positive electrode connecting electrode, etc., back contacting the backlight surface of the solar cell.
- the second conductive site may be a position on the surface of the metal circuit board that is electrically connected to the electrode of the back contacting solar cell.
- the second conductive site may be a point on the surface of the metal circuit board that is electrically connected to the negative fine grid line and the positive fine grid line that are back in contact with the backlight surface of the solar cell.
- the second conductive site may be a point on the surface of the metal circuit board that is electrically connected to the negative electrode connecting electrode, the positive electrode connecting electrode, etc., which are back in contact with the backlight surface of the solar cell sheet.
- an adhesive insulating spacer is arranged on the periphery of the first conductive site on the first piece, or an adhesive insulating spacer is arranged on the periphery of the second conductive site on the second piece, which is Adhesive insulating spacers are arranged on the periphery of the conductive sites, which are not specifically limited.
- the function of the adhesive insulating spacer can be mainly to isolate each conductive boss and avoid short circuit of each conductive boss; at the same time, the first piece and the second piece are bonded during the lamination process. In some cases, it provides certain thermal conductivity, hydrophobic properties, etc. In the embodiments of the present application, this is not specifically limited.
- the number of adhesive insulating spacers can be equal to the number of conductive bosses that are subsequently buckled with it.
- the shape of the inner ring of the adhesive insulating spacer ring can be matched with the shape of the conductive boss that is subsequently buckled with it. In the embodiments of the present application, this is not specifically limited.
- the thickness of the bonded insulating spacer can be 1 to 100 microns.
- the use of polyolefins to form a thickness of 150 microns or more not only reduces the thickness of the back contact solar cell module, but at the same time, the adhesive insulating spacer of this thickness is bonded during the subsequent lamination process. Reliability is good, and it has good thermal conductivity, hydrophobic properties, etc.
- the material for bonding the insulating spacer is an insulating adhesive material.
- the insulating adhesive material may include a liquid adhesive and an inert filler.
- the above-mentioned inert filler includes silica particles.
- the adhesive insulating spacer of the above-mentioned material not only has low cost, but also has good adhesive performance and good thermal conductivity.
- the above-mentioned insulating adhesive material may include a liquid adhesive and an inert filler.
- the inert filler may include silica particles.
- the use of silica particles not only has low cost, but also has good bonding performance of the insulating adhesive material and good thermal conductivity, which will help reduce the production cost of back-contact solar cell modules and improve bonding reliability and heat conduction. Sex and so on.
- the reliability of adhesion can be further improved.
- the silica particles are fumed silica particles.
- fumed silica particles are smaller, have good dispersibility, are not prone to precipitation, can provide better bonding performance, and have a lower cost, and also have better thermal conductivity.
- the fumed silica particles have good hydrophobicity, which can greatly reduce or prevent moisture from remaining in the manufacturing process of the back-contact solar cell module, and improve the reliability of the back-contact solar cell module.
- the above-mentioned inert filler may also include at least one of alumina particles, talc powder, and boron nitride particles.
- the above-mentioned materials can further reduce the production cost of back-contact solar cell modules, and improve bonding reliability and thermal conductivity.
- the liquid adhesive is mainly used for bonding.
- the liquid adhesive includes: siloxane.
- siloxane can make the printed adhesive insulating spacers more dense, increase the hydrophobicity of the adhesive insulating spacers, and reduce or prevent moisture from contacting the back of the solar cell module to a greater extent. Residues in the process improve the reliability of back-contact solar cell modules.
- the mass ratio of the inert filler to the liquid binder is 7:3 to 3:7.
- the adhesive insulating spacer formed in this way has lower cost, better adhesive reliability, thermal conductivity, hydrophobicity, etc.
- the mass ratio of the inert filler to the liquid binder in the insulating adhesive material is 6:4.
- the liquid binder further includes at least one of an organic solvent, a resin, a curing agent, a coloring agent, a wetting agent, and a dispersing agent.
- the organic solvent may be: 1,4-butanediol diglycidyl ether, dibutyl phthalate, and the like.
- the resin may be a thermosetting resin, a thermoplastic resin, or the like.
- the thermosetting resin may be: unsaturated polyester, vinyl ester, epoxy, phenolic, bismaleimide (BMI), polyimide resin, and the like.
- the thermoplastic resin may be: polypropylene (PP), polycarbonate (PC), nylon (NYLON), polyether ether ketone (PEEK), polyether sulfone (PES), and the like.
- the dispersant can be used to improve the dispersion performance of the insulating adhesive material, make the performance uniform, and improve the fluidity.
- the curing agent can improve the anti-sagging performance, and improve the shaping of the bonded insulating spacer after printing.
- the colorant can make the insulating adhesive material have a specific color, which is convenient for subsequent identification and inspection. In the embodiments of the present application, this is not specifically limited.
- the material formula of the above-mentioned adhesive insulating spacer can be: 50% silica particles, 10% siloxane, 30% 1,4-butanediol diglycidyl ether, 10% Of vinyl esters.
- the material formula of the above-mentioned adhesive insulating spacer can be: 50% silica particles, 9% siloxane, 20% 1,4-butanediol diglycidyl ether, 11 % Dibutyl phthalate, 10% polyether ether ketone.
- the insulating and adhesive spacers are also composed of insulating adhesive materials, etc., so that the adhesion performance of the first piece and the second piece is better.
- FIG. 5 shows a schematic structural diagram of a bonded insulating spacer in an embodiment of the present application.
- 42 may be an inner ring for bonding an insulating spacer, and other positions other than the inner ring 42 may be made of insulating adhesive materials or the like.
- the space between each adhesive insulating spacer is empty, and no insulating adhesive material or the like is provided. Furthermore, fewer insulating adhesive materials are used, and production costs are lower.
- FIG. 6 shows a schematic structural diagram of another bonded insulating spacer in an embodiment of the present application.
- the 40 selected by the dashed rectangle can be an adhesive insulating spacer.
- 42 can be the inner ring of the bonded insulating spacer.
- step 101 and step 102 can be performed at the same time. Alternatively, step 101 is performed first and then step 102 is performed, or step 102 is performed first and then step 101 is performed. In the embodiments of the present application, this is not specifically limited.
- both the above-mentioned first stacking member and the second stacking member may further include: packaging material and cover material.
- the packaging material and the cover material may be sequentially arranged on the side of the first piece or the second piece away from the conductive site.
- the packaging material may include a sealing material such as EVA or polyolefin, and the cover material may be a tempered glass cover or a polymer cover such as TPT, TPE, KPE, KPK, KPC or KPF.
- the packaging material and the cover material can be hot pressed or bonded. It should be noted that both the packaging material and the cover material located on the light-receiving side of the first sheet or the second sheet may have good light permeability.
- Step 103 stacking and laminating the first stacking piece and the second stacking piece, so that the conductive boss abuts on the second conductive site, and the bonding
- the insulating spacer bonds the first piece and the second piece together.
- the second stack and the first stack are stacked and laminated, and the conductive boss abuts on the second conductive site to achieve electrical contact between the conductive boss and the second piece.
- the bonding insulating spacer bonds the first piece and the second piece together.
- the side where the conductive bosses of the first piece are provided is attached to the side of the second piece that has the second conductive sites, so that the conductive bosses abut on the second conductive sites, thereby realizing the first
- the piece is in electrical contact with the second piece.
- the first conductive site is in electrical contact with the conductive bump, and the conductive bump abuts on the second conductive site to achieve electrical contact between the first conductive site and the second conductive site, thereby achieving current collection and conduction.
- the role of the pass is
- the first stack and the second stack are stacked and laminated, and the insulating spacer is bonded to cross-link and bond the first sheet and the second sheet during the lamination process, and the first sheet and the second sheet are bonded together.
- the pieces are bonded together to obtain a back contact solar cell module.
- the above-mentioned bonding insulating spacer is used for bonding the first piece and the second piece during the lamination process.
- the conductive boss is abutted on the second conductive site to realize the electrical connection between the metal circuit board and the back contact solar cell.
- the conductive adhesive is fused with the conductive sites on the metal circuit board and the back contact solar cell to realize the electrical connection between the metal circuit board and the back contact solar cell, and the reliability of the electrical connection is low. In terms of low yield.
- the conductive boss abuts on the second conductive site of the second piece to realize the electrical connection between the metal circuit board and the back contact solar cell, and realizes stable electrical connection without fusion, which improves the electrical connection. Reliability and yield rate.
- the conductive boss and the second conductive site can be pressed tighter, and the reliability of the electrical connection and the yield rate are further improved.
- FIG. 7 shows a schematic structural diagram of a back contact solar cell module in an embodiment of the present application.
- 10 can be a front cover material
- 20 can be a front encapsulation material, such as light-permeable EVA or POE
- 30 can be a back contact solar cell
- 40 can be an adhesive insulating spacer
- 41 can be The conductive boss
- 42 may be an inner ring for bonding insulating spacers
- 50 may be a metal circuit board
- 60 may be a rear packaging material
- 70 may be a rear cover material.
- the front cover material 10 may be the back contacting the side of the solar cell module to receive light
- the rear cover material 70 may be the back contacting the side of the solar cell module backlight.
- the front cover material 10 and the front packaging material 20 may have good light transmittance.
- the electrical connection and bonding between the metal circuit board and the back-contact solar cell are realized through conductive glue.
- the above-mentioned electrical connection is mainly in the lamination process.
- the conductive glue is fused with the conductive sites on the metal circuit board and the back contact solar cell sheet, so that the reliability of the electrical connection is low and the yield is low.
- the first stacking member includes conductive bumps formed on the first conductive site of the first sheet member, and the electrical connection between the metal circuit board and the back contact solar cell is mainly through the first stacking member and The second stacking member is stacked, and the conductive boss abuts on the second conductive site of the second sheet member, so that stable electrical connection can be realized without fusion, and the reliability of electrical connection and the yield rate are improved.
- the conductive boss and the second conductive site can be pressed tighter, and the reliability of the electrical connection and the yield rate are further improved.
- FIG. 8 shows a flow chart of another method for producing a back contact solar cell module in an embodiment of the present application.
- Step 201 providing the first piece; the first piece is one of a metal circuit board or a back contact solar cell piece; the surface of the first piece has a number of first conductive sites; the first piece A stacking member further includes a conductive boss formed on the first conductive site of the first sheet member.
- step 201 the first piece, the first conductive site, the conductive boss, the adhesive insulating spacer, etc. can be referred to the specific description of the foregoing step 101, and will not be repeated here in order to avoid repetition.
- the method may further include: sequentially stacking the packaging material and the cover material on the first side of the first piece; The side of the first piece with the first conductive site is opposite.
- the first side of the first sheet is the opposite side of the first sheet with the first conductive site.
- the first side may be the side of the first piece opposite to receiving light.
- the first conductive site is located on the side of the metal circuit board opposite to receiving light
- the first side may be the side of the metal circuit board opposite to the backlight.
- the packaging material can be stacked on the first side of the first piece first, and then the cover material can be stacked.
- FIG. 9 shows a schematic structural view of a packaging material stacked on a first side of a first sheet in an embodiment of the present application.
- the first piece may be a back contact solar cell piece 30. Since the packaging material is located on the back side of the solar cell sheet that is opposite to receiving light, the packaging material may be the front packaging material 20.
- Step 202 Print a conductive material on the first conductive site of the first piece to form the conductive boss.
- a printing screen corresponding to the first conductive site can be produced before step 202 described above.
- the conductive protrusions can be formed by printing conductive materials on the first conductive sites of the first sheet by means of screen printing or inkjet printing to obtain the first stack.
- the above-mentioned printing can be full-page printing to improve production efficiency.
- the first piece is a metal circuit board
- a conductive material is printed on the first conductive site of the metal circuit board to form a conductive boss.
- the first conductive site of the back-contact solar cell sheet is printed and conductive to form a conductive boss.
- it can be printed on the entire page, and printed conductive bumps on 100 first conductive sites of back-contact solar cells at one time, instead of separately on the first conductive sites of each back-contact solar cell. Print conductive to form conductive bumps to improve production efficiency.
- a printing screen with spacers corresponding to the first conductive sites can be produced before step 202 described above.
- the insulating adhesive material can be printed by means of screen printing or inkjet printing on the periphery of the first conductive site on the first sheet through the printing screen to form an adhesive insulating spacer.
- an adhesive insulating spacer is provided on the periphery of the first conductive member, then a conductive material may be printed on the first conductive site of the first piece to form a conductive boss. Then, an adhesive insulating spacer is formed by printing on the periphery of the first conductive site of the first piece. Or, it is possible to print and form an adhesive insulating spacer on the periphery of the first conductive site of the first piece. Then, a conductive material is printed on the first conductive site of the first piece to form a conductive boss. In the embodiments of the present application, this is not specifically limited.
- the first printed parts can be dried to make them have a certain surface dryness and hardness, and they will not stick to the screen and be crushed. It can avoid defects such as collapse of the first printed part and spread to the surrounding area during the second printing to form short circuit, pollution and other defects.
- the conductive boss can be dried before printing the adhesive insulating spacer. If the insulating spacers are printed and bonded first, the conductive bumps can be dried before the conductive bumps are printed.
- the printing support substrate may be heated or the conductive boss, or the adhesive insulating spacer may be locally heated or irradiated for drying or pre-curing.
- the heating temperature may be 50-100°C, and the heating time may be 10-300 seconds. In the embodiments of the present application, this is not specifically limited.
- an adhesive insulating spacer is arranged on the periphery of the first conductive member, a conductive material is printed on the first conductive site of the first piece to form a conductive boss, and on the first piece of The periphery of a conductive site is printed to form an adhesive insulating spacer.
- the conductive boss and the adhesive insulating spacer are printed on the same piece, and the adhesive insulating spacer is arranged around the conductive boss at the same time of printing, and the subsequent buckling operation is not required, and the operation is simple.
- the printing on the periphery of the first conductive site on the first piece forms an adhesive insulating spacer, which can usually be obtained by one-time printing without laser opening one by one, and the production efficiency is high; Adhesive insulating spacers are printed around, eliminating the need for openings to remove the insulating adhesive material, reducing costs; at the same time, there is no need for laser ablation of the opening, reducing damage to the insulating adhesive material, and improving insulation reliability and bonding Reliability etc.
- the above step 202 may include: using the packaging material and the cover material as a printing support substrate, and printing a conductive material on the first conductive site of the first piece , Forming the conductive boss.
- the laminated packaging material and the cover material may be used as a printing support substrate, and a conductive material may be printed on the first conductive site of the first piece to form a conductive boss. Furthermore, after the conductive bosses are printed, the above-mentioned laminated encapsulation material and cover material may not be removed, thereby reducing the number of steps and improving the production efficiency of the back-contact solar cell module.
- the first conductive outer periphery is provided with an adhesive insulating spacer
- the laminated packaging material and cover material can be used as the printing support substrate, and the conductive material can be printed on the first conductive site of the first piece to form a conductive boss.
- an adhesive insulating spacer is printed on the periphery of the first conductive site of the first piece.
- FIG. 10 shows a schematic diagram of a structure in which conductive bumps are printed and formed on the first conductive sites of the back-contact solar cell in an embodiment of the present application.
- the conductive bump 41 includes a conductive bump that is in electrical contact with the P-type doped diffusion region 21 and a conductive bump that is in electrical contact with the N-type doped diffusion region 22.
- Step 203 providing a second stacking piece; the second stacking piece includes a second piece; the second piece is the other of the metal circuit board and the back contact solar cell piece;
- the surface of the second piece has a plurality of second conductive sites; the periphery of the first conductive site or the periphery of the second conductive site is provided with adhesive insulating spacers.
- the foregoing step 203 can refer to the related description of the foregoing step 102. It should be noted that the formation of the second conductive site can refer to the foregoing formation process of the first conductive site. At the same time, if adhesive insulating spacers are arranged on the periphery of the second conductive sites, a printing screen with spacers corresponding to the second conductive sites can be produced. It is possible to use the printing screen, screen printing or inkjet printing on the second sheet to print an insulating adhesive material, etc., to form an adhesive insulating spacer to obtain the second stack. It is equivalent to reserve the inner ring for subsequent buckling with the conductive boss during the printing process.
- the inner ring for subsequent buckling with the conductive boss is reserved, and there is no need to open the holes one by one in the subsequent process, and the production efficiency is high; on the other hand, the subsequent use is reserved during the printing process.
- the inner ring buckled with the conductive boss there is no printed insulating adhesive material directly on the inner ring, and no opening is required to remove the insulating adhesive material, which reduces the cost.
- there is no need for laser ablation of the opening which reduces the damage to the insulating bonding material, which is beneficial to improve the insulation reliability and bonding reliability.
- steps 201 to 202 may be performed simultaneously with step 203, or may be performed sequentially, and the execution order is not specifically limited.
- Step 204 spraying flux on the surface of the conductive boss.
- the conductive boss by spraying flux on the surface of the conductive boss, the conductive boss can be in good pressure contact with the second conductive site of the second piece during the subsequent lamination and curing, and there will be no poor contact, etc. Defects to improve the conductivity of back-contact solar cell modules.
- Step 205 stacking and laminating the first stacking piece and the second stacking piece, so that the conductive boss abuts on the second conductive site, and the bonding
- the insulating spacer bonds the first piece and the second piece together.
- the step 205 may refer to the description of the above step 103, and in order to avoid repetition, it will not be repeated here.
- the electrical connection and bonding between the metal circuit board and the back-contact solar cell are realized through conductive glue.
- the above-mentioned electrical connection is mainly in the lamination process.
- the conductive glue is fused with the conductive sites on the metal circuit board and the back contact solar cell sheet, so that the reliability of the electrical connection is low and the yield is low.
- the first stacking member includes conductive bumps formed on the first conductive site of the first sheet member, and the electrical connection between the metal circuit board and the back contact solar cell is mainly through the first stacking member and The second stacking member is stacked, and the conductive boss abuts on the second conductive site of the second sheet member, so that stable electrical connection can be realized without fusion, and the reliability of electrical connection and the yield rate are improved.
- the conductive boss and the second conductive site can be pressed tighter, which further improves the reliability of the electrical connection and the yield rate.
- both the conductive boss and the adhesive insulating spacer are formed by printing, the process is simple, and the production efficiency is high. If the conductive boss and the adhesive insulating spacer are printed on the same piece, the adhesive insulating spacer is arranged around the conductive boss at the same time of printing, and the subsequent buckling operation is not required, and the operation is simple.
- the adhesive insulating spacer is formed by printing on the periphery of the first conductive site on the first piece, it can usually be obtained by one-time printing, without laser opening one by one, and the production efficiency is high; and the conductive convexity during the printing process Adhesive insulating spacers are printed around the table, and the insulating adhesive material is removed without openings, which reduces the cost; at the same time, laser ablation of the opening is not required, which reduces the damage to the insulating adhesive material, which is beneficial to improve insulation reliability Bonding reliability, etc.
- a back-contact solar cell module is also provided.
- the back-contact solar cell module may include: a first stacking member and a second stacking member.
- the first stack includes a first sheet.
- the first piece is one of the metal circuit board 50 or the back contact solar cell piece 30.
- the surface of the first piece has a plurality of first conductive sites, and the first stacking piece further includes conductive bosses 41 formed on the first conductive sites of the first piece.
- the second stack includes a second sheet.
- the second piece is the other of the metal circuit board 50 and the back contact solar cell piece 30 except the first piece.
- the surface of the second piece has a number of second conductive sites.
- An adhesive insulating spacer 40 is provided on the periphery of the first conductive site, or an adhesive insulating spacer 40 is provided on the outer periphery of the second conductive site.
- the first stack and the second stack are stacked and laminated together, and the conductive boss 41 abuts on the second conductive site.
- the first piece and the second piece are bonded together by bonding insulating spacers 40.
- the back-contact solar cell module can refer to the related records of the aforementioned production method of the back-contact solar cell module, and can achieve the same technical effect. In order to avoid repetition, it will not be repeated here.
- the device embodiments described above are merely illustrative, where the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in One place, or it can be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the objectives of the solutions of the embodiments. Those of ordinary skill in the art can understand and implement without creative work.
- the various component embodiments of the present application may be implemented by hardware, or by software modules running on one or more processors, or by a combination of them.
- a microprocessor or a digital signal processor (DSP) may be used in practice to implement some or all of the functions of some or all of the components in the computing processing device according to the embodiments of the present application.
- This application can also be implemented as a device or device program (for example, a computer program and a computer program product) for executing part or all of the methods described herein.
- Such a program for realizing the present application may be stored on a computer-readable medium, or may have the form of one or more signals.
- Such a signal can be downloaded from an Internet website, or provided on a carrier signal, or provided in any other form.
- FIG. 11 shows a computing processing device that can implement the method according to the present application.
- the computing processing device traditionally includes a processor 1010 and a computer program product in the form of a memory 1020 or a computer readable medium.
- the memory 1020 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read Only Memory), EPROM, hard disk, or ROM.
- the memory 1020 has a storage space 1030 for executing the program code 1031 of any method step in the above method.
- the storage space 1030 for program codes may include various program codes 1031 respectively used to implement various steps in the above method. These program codes can be read from or written into one or more computer program products.
- These computer program products include program code carriers such as hard disks, compact disks (CDs), memory cards, or floppy disks.
- Such a computer program product is usually a portable or fixed storage unit as described with reference to FIG. 12.
- the storage unit may have storage segments, storage spaces, etc. arranged similarly to the memory 1020 in the computing processing device of FIG. 11.
- the program code can be compressed in an appropriate form, for example.
- the storage unit includes computer-readable codes 1031', that is, codes that can be read by, for example, a processor such as 1010. These codes, when run by a computing processing device, cause the computing processing device to execute the method described above. The various steps.
- any reference signs placed between parentheses should not be constructed as a limitation to the claims.
- the word “comprising” does not exclude the presence of elements or steps not listed in the claims.
- the word “a” or “an” preceding an element does not exclude the presence of multiple such elements.
- the application can be realized by means of hardware including several different elements and by means of a suitably programmed computer. In the unit claims that list several devices, several of these devices may be embodied in the same hardware item.
- the use of the words first, second, and third, etc. do not indicate any order. These words can be interpreted as names.
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Abstract
Description
Claims (13)
- 一种背接触太阳能电池组件生产方法,其特征在于,包括:提供第一叠放件;所述第一叠放件包括第一片件;所述第一片件为金属电路板或背接触太阳能电池片中的一个;所述第一片件的表面具有若干第一导电位点;所述第一叠放件还包括形成在所述第一片件的所述第一导电位点上的导电凸台;提供第二叠放件;所述第二叠放件包括第二片件;所述第二片件为所述金属电路板和所述背接触太阳能电池片中的另一个;所述第二片件的表面具有若干第二导电位点;所述第一导电位点的外围或所述第二导电位点的外围设置有粘接绝缘隔圈;将所述第一叠放件以及所述第二叠放件叠放并层压,以使所述导电凸台抵接在所述第二导电位点上,并使所述粘接绝缘隔圈将所述第一片件与所述第二片件粘接在一起。
- 根据权利要求1所述的方法,其特征在于,所述粘接绝缘隔圈的材质为绝缘粘接材料;所述绝缘粘接材料包括液体粘结剂和惰性填料;所述惰性填料包括二氧化硅颗粒。
- 根据权利要求2所述的方法,其特征在于,所述二氧化硅颗粒为气相二氧化硅颗粒。
- 根据权利要求2或3所述的方法,其特征在于,所述液体粘结剂,包括:硅氧烷;所述惰性填料与所述液体粘结剂的质量比例为:7:3至3:7。
- 根据权利要求1至4中任一所述的方法,其特征在于,所述第一叠放件通过如下步骤获得:提供所述第一片件;在所述第一片件的所述第一导电位点上印刷导电材料,形成所述导电凸台。
- 根据权利要求1至5中任一所述的方法,其特征在于,所述将所述第一叠放件以及所述第二叠放件叠放并层压之前,所述方法还包括:在所述第一片件的所述第一导电位点外围,印刷形成所述粘接绝缘隔圈;或,在所述第二片件的所述第二导电位点外围,印刷形成所述粘接绝缘隔圈。
- 根据权利要求1至6中任一所述的方法,其特征在于,所述粘接绝缘隔圈的厚度为:1至100微米。
- 根据权利要求1至7中任一所述的方法,其特征在于,所述将所述第一叠放件以及所述第二叠放件叠放并层压之前,所述方法还包括:在所述导电凸台的表面喷涂助焊剂。
- 根据权利要求1至8中任一所述的方法,其特征在于,相邻的所述粘接绝缘隔圈之间具有间隙。
- 根据权利要求5所述的方法,其特征在于,所述在所述第一片件的所述第一导电位点上印刷导电材料,形成所述导电凸台之前,所述方法还包括:在所述第一片件的第一侧依次叠放封装材料和盖板材料;所述第一侧与所述第一片件具有第一导电位点的一侧相反;所述在所述第一片件的所述第一导电位点上印刷导电材料,形成所述导电凸台的步骤,包括:以所述封装材料和盖板材料为印刷支持基板,在所述第一片件的所述第一导电位点上印刷导电材料,形成所述导电凸台。
- 一种背接触太阳能电池组件,其特征在于,包括:第一叠放件、以及第二叠放件;所述第一叠放件包括第一片件;所述第一片件为金属电路板或背接触太阳能电池片中的一个;所述第一片件的表面具有若干第一导电位点;所述第一叠放件还包括形成在所述第一片件的所述第一导电位点上的导电凸台;所述第二叠放件包括第二片件;所述第二片件为所述金属电路板和所述背接触太阳能电池片中的另一个;所述第二片件的表面具有若干第二导电位点;所述第一导电位点的外围或所述第二导电位点的外围设置有粘接绝缘隔圈;所述第一叠放件和所述第二叠放件层叠并层压在一起,所述导电凸台抵接在所述第二导电位点上;所述第一片件与所述第二片件通过所述粘接绝缘隔圈粘接在一起。
- 一种计算机程序,包括计算机可读代码,当所述计算机可读代码在计算处理设备上运行时,导致所述计算处理设备执行根据权利要求1-10中的任一个所述的背接触太阳能电池组件生产方法。
- 一种计算机可读介质,其中存储了如权利要求12所述的计算机程序。
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