WO2021036044A1 - 发光面板、发光面板的制备方法及显示装置 - Google Patents

发光面板、发光面板的制备方法及显示装置 Download PDF

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Publication number
WO2021036044A1
WO2021036044A1 PCT/CN2019/120487 CN2019120487W WO2021036044A1 WO 2021036044 A1 WO2021036044 A1 WO 2021036044A1 CN 2019120487 W CN2019120487 W CN 2019120487W WO 2021036044 A1 WO2021036044 A1 WO 2021036044A1
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Prior art keywords
light
flexible layer
substrate
emitting panel
emitting
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Ceased
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PCT/CN2019/120487
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English (en)
French (fr)
Inventor
杨汉宁
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US16/768,885 priority Critical patent/US20210408430A1/en
Publication of WO2021036044A1 publication Critical patent/WO2021036044A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/88—Dummy elements, i.e. elements having non-functional features
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637—Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652—Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8793—Arrangements for polarized light emission
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • This application relates to the field of display technology, and in particular to a light-emitting panel, a method for manufacturing the light-emitting panel, and a display device.
  • OLEDs organic light emitting diodes
  • the neutral layer of the light-emitting panel is usually not in the matrix or the light-emitting layer when the light-emitting panel is bent. Therefore, the matrix layer or the light-emitting layer is susceptible to mechanical damage during continuous bending, resulting in poor display. Moreover, since the flexible layer under the matrix layer has a high Young's modulus, it is also prone to mechanical damage or wrinkles during the bending process, resulting in poor display of the light-emitting panel.
  • the embodiments of the present application provide a light-emitting panel and a display device, which can reduce mechanical damage or wrinkles between layers of the light-emitting panel during the bending process, and improve the yield of the light-emitting panel.
  • an embodiment of the present application provides a light emitting panel, including:
  • the substrate, the flexible layer, the light-emitting device and the cover plate are stacked in sequence from bottom to top; among them,
  • a rough structure is provided on one side of the flexible layer opposite to the substrate, and the rough structure includes a plurality of arranged recesses.
  • the distribution of the recesses on the flexible layer is 10 4 to 10 8 per square centimeter, and the first opening length of the recesses in the horizontal direction is 1
  • the length of the second opening in the vertical direction is between 100 nanometers and 5000 nanometers.
  • the cross-sectional shape of the recessed portion is any one of an arc shape, a circular shape, a square shape, and a trapezoid shape.
  • a touch panel and a polarizer are further provided between the light emitting device and the cover plate, and the polarizer is provided on the touch panel.
  • an embodiment of the present application also provides a method for manufacturing a light-emitting panel, including:
  • a substrate is attached to the bottom of the flexible layer, and a touch panel, a polarizer and a cover are laminated and attached to the light-emitting device in order to form the light-emitting panel.
  • the step of forming a flexible layer on the substrate, and the bottom of the flexible layer including nanoparticles includes:
  • a solution doped with nanoparticles is coated on the substrate, and the solution is cured to form the flexible layer with nanoparticles at the bottom.
  • a substrate is attached to the bottom of the flexible layer, and a touch panel, a polarizer and a cover plate are sequentially laminated and attached on the light-emitting device to Before the step of forming the light-emitting panel, the method further includes:
  • the bottom of the flexible layer is cleaned to remove the nanoparticles.
  • the cross-sectional shape of the carbide is any one of arc, circle, square, and trapezoid.
  • an embodiment of the present application further provides a display device, including: a housing and a light-emitting panel, the light-emitting panel is disposed on the housing, and the light-emitting panel includes:
  • the substrate, the flexible layer, the light-emitting device and the cover plate are stacked in sequence from bottom to top; among them,
  • a rough structure is provided on one side of the flexible layer opposite to the substrate, and the rough structure includes a plurality of arranged recesses.
  • the distribution of the concave portion on the flexible layer per square centimeter of 10 4 to 10 8, and the opening length of the first recessed portion in the horizontal direction is 1
  • the length of the second opening in the vertical direction is between 100 nanometers and 5000 nanometers.
  • the cross-sectional shape of the recessed portion is any one of an arc, a circle, a square, and a trapezoid.
  • a touch panel and a polarizer are further provided between the light emitting device and the cover plate, and the polarizer is provided on the touch panel.
  • An embodiment of the present application also provides a light emitting panel, including:
  • the substrate, the flexible layer, the light-emitting device and the cover plate are stacked in sequence from bottom to top; among them,
  • a rough structure is provided on one side of the flexible layer opposite to the substrate, and the rough structure includes a plurality of depressed portions arranged, wherein there is an interval between adjacent depressed portions in the plurality of depressed portions, and the A touch panel and a polarizer are also arranged between the light emitting device and the cover plate, and the polarizer is arranged on the touch panel.
  • the light-emitting panel provided by the embodiments of the present application includes: a substrate, a flexible layer, a light-emitting device, and a cover plate stacked from bottom to top; wherein a rough structure is provided on a side of the flexible layer opposite to the substrate, and The rough structure includes a plurality of arranged recesses, which can reduce mechanical damage or wrinkles between layers of the light-emitting panel during the bending process, and improve the yield of the light-emitting panel.
  • FIG. 1 is a schematic structural diagram of a display device provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first structure of a light-emitting panel provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of a first structure of a flexible layer in a light-emitting panel provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of the second structure of the flexible layer in the light emitting panel provided by the embodiment of the application.
  • FIG. 5 is a schematic diagram of a second structure of a light-emitting panel provided by an embodiment of the application.
  • FIG. 6 is a schematic flowchart of a method for manufacturing a light-emitting panel provided by an embodiment of the application.
  • the neutral layer of the light-emitting panel is usually not in the matrix or the light-emitting layer when the light-emitting panel is bent. Therefore, the matrix layer or the light-emitting layer is susceptible to mechanical damage during continuous bending, resulting in poor display. Moreover, since the flexible layer under the matrix layer has a high Young's modulus, it is also prone to mechanical damage or wrinkles during the bending process, resulting in poor display of the light-emitting panel.
  • An embodiment of the present application provides a display device, including: a housing and a light-emitting panel, the light-emitting panel is disposed on the housing, and the light-emitting panel includes:
  • the substrate, the flexible layer, the light-emitting device and the cover plate are stacked in sequence from bottom to top; among them,
  • a rough structure is provided on one side of the flexible layer opposite to the substrate, and the rough structure includes a plurality of arranged recesses.
  • the distribution of the recess on the flexible layer per square centimeter of 10 4 to 10 8 and the first opening length in the horizontal direction of the concave portion is 1 nm to 5000 nm, in a vertical
  • the length of the second opening in the direction is 100 nanometers to 5000 nanometers.
  • the cross-sectional shape of the recessed portion is any one of arc, circle, square and trapezoid.
  • a touch panel and a polarizer are further arranged between the light emitting device and the cover plate, and the polarizer is arranged on the touch panel.
  • FIG. 1 is a schematic structural diagram of a display device 1000 according to an embodiment of the application.
  • the display device 100 may include a light emitting panel 100, a control circuit 200, and a housing 300. It should be noted that the display device 1000 shown in FIG. 1 is not limited to the above content, and may also include other devices, such as a camera, an antenna structure, a pattern unlocking module, and the like.
  • the light-emitting panel 100 is disposed on the housing 200.
  • the light-emitting panel 100 may be fixed to the housing 200, and the light-emitting panel 100 and the housing 300 form a closed space to accommodate the control circuit 200 and other devices.
  • the housing 300 may be made of a flexible material, such as a plastic housing or a silicone housing.
  • control circuit 200 is installed in the housing 300, the control circuit 200 may be the main board of the display device 1000, and the control circuit 200 may be integrated with a battery, an antenna structure, a microphone, a speaker, a headphone interface, a universal serial bus interface, One, two or more of functional components such as camera, distance sensor, ambient light sensor, receiver, and processor.
  • the light-emitting panel 100 is installed in the housing 300, and at the same time, the light-emitting panel 100 is electrically connected to the control circuit 200 to form the display surface of the display device 1000.
  • the light emitting panel 100 may include a display area and a non-display area.
  • the display area can be used to display the screen of the display device 1000 or for the user to perform touch manipulation.
  • This non-display area can be used to set various functional components.
  • An embodiment of the present application also provides a light emitting panel, including:
  • the substrate, the flexible layer, the light-emitting device and the cover plate are stacked in sequence from bottom to top; among them,
  • a rough structure is provided on one side of the flexible layer opposite to the substrate, and the rough structure includes a plurality of arranged recesses.
  • the distribution of the depressed portion on the flexible layer is 10 4 to 10 8 per square centimeter
  • the first opening length of the depressed portion in the horizontal direction is 1 nanometer to 5000 nanometers in the vertical direction.
  • the length of the second opening on the upper side is 100 nanometers to 5000 nanometers.
  • the cross-sectional shape of the recessed portion is any one of arc, circle, square and trapezoid.
  • a touch panel and a polarizer are further arranged between the light emitting device and the cover plate, and the polarizer is arranged on the touch panel.
  • FIG. 2 is a schematic diagram of a first structure of a light-emitting panel provided by an embodiment of the application
  • FIG. 3 is a schematic diagram of a first structure of a flexible layer in the light-emitting panel provided by an embodiment of the application. 100 includes:
  • the substrate 10, the flexible layer 20, the light emitting device 30 and the cover plate 40 are stacked in sequence from bottom to top; among them,
  • a rough structure 201 is provided on a side of the flexible layer 20 opposite to the substrate 10, and the rough structure 201 includes a plurality of recesses 2011 arranged.
  • the light-emitting device 30 is used to generate light, so that the light-emitting panel 100 generates a picture.
  • the light-emitting device 30 here may include a thin film transistor (TFT) and an organic light-emitting diode (OLED), not shown in the figure. show.
  • TFT thin film transistor
  • OLED organic light-emitting diode
  • the flexible layer 20 is generally composed of a polyimide (PI) organic polymer material, which has a certain degree of bendability.
  • PI polyimide
  • a touch panel 50 and a polarizer 60 are further arranged between the light emitting device 30 and the cover plate 40, and the polarizer 60 is arranged on the touch panel 50.
  • the touch panel 50 is used to realize the touch function of the light-emitting panel 100, and it can be adhered to the light-emitting device 30 through a transparent optical adhesive (OCA).
  • OCA transparent optical adhesive
  • the polarizer 60 is used to transmit polarized light to the light-emitting device 30. Light for imaging.
  • FIG. 4 is a schematic diagram of a second structure of a flexible layer in a light-emitting panel provided by an embodiment of the application.
  • the distribution of the recesses 2011 on the flexible layer 20 is 10 4 to 10 8 per square centimeter
  • the first opening length W1 in the horizontal direction of the depressed portion is 1 nanometer to 5000 nanometers
  • the second opening length H1 in the vertical direction is 100 nanometers to 5000 nanometers .
  • first opening length W1 and the second aperitif length H1 of each recessed portion 2011 may be different, and the interval between adjacent recessed portions 2011 may also be different.
  • FIG. 5 is a schematic diagram of a second structure of a light-emitting panel provided by an embodiment of the application, and the cross-sectional shape of the recessed portion 2011 is any of arc, circle, square, and trapezoid. One kind.
  • the light-emitting panel 100 provided by the embodiment of the present application includes: a substrate 10, a flexible layer 20, a light-emitting device 30, and a cover plate 40 stacked from bottom to top; wherein, the flexible layer 20 is opposite to the substrate 10
  • a rough structure 201 is provided on the side, and the rough structure 201 includes a plurality of recesses 2011 arranged.
  • An embodiment of the present application also provides a method for manufacturing a light-emitting panel, including:
  • a substrate is attached to the bottom of the flexible layer, and a touch panel, a polarizer and a cover are laminated and attached to the light-emitting device in order to form the light-emitting panel.
  • the step of forming a flexible layer on the substrate and including nanoparticles at the bottom of the flexible layer includes:
  • a solution doped with nanoparticles is coated on the substrate, and the solution is cured to form the flexible layer with nanoparticles at the bottom.
  • the method before the step of laminating a substrate on the bottom of the flexible layer, and laminating and laminating a touch panel, a polarizer and a cover plate on the light-emitting device in order to form the light-emitting panel, the method further includes :
  • the bottom of the flexible layer is cleaned to remove the nanoparticles.
  • the cross-sectional shape of the carbide is any one of arc, circle, square and trapezoid.
  • FIG. 6 is a schematic flowchart of a method for manufacturing a light-emitting panel provided by an embodiment of the application.
  • the embodiment of the present application also provides a method for manufacturing a light-emitting panel, which is used to prepare the light-emitting panel as described above, including:
  • Step 110 Provide a substrate
  • the substrate here is generally a glass substrate.
  • Step 120 forming a flexible layer on the substrate, and the bottom of the flexible layer includes nanoparticles
  • the step of forming a flexible layer on the substrate includes: coating a solution doped with nanoparticles on the substrate, and curing the solution to form the flexible layer with nanoparticles at the bottom.
  • the general method of forming the flexible layer is to coat the flexible solution on the substrate, and then perform ultraviolet curing (UV curing), and in order to dope the bottom of the flexible layer with nanoparticles, it can be mixed in the flexible solution. Miscellaneous nanoparticles, the nanoparticles will sink to the bottom of the flexible solution, and then UV curing is carried out to place the nanoparticles on the bottom of the flexible layer.
  • UV curing ultraviolet curing
  • the diameter of the nano-particles here is generally 1 nanometer to 2000 nanometers, and it may include a circle, a square, a triangle, a trapezoid, etc.
  • the material includes materials such as gold, silver, and aluminum, which are not limited here.
  • Step 130 forming a light emitting device on the flexible layer
  • Step 140 Perform laser irradiation on the substrate to generate carbides at the bottom of the flexible layer surrounding the nanoparticles, and peel off the carbides and the substrate to form a rough structure on one side of the flexible layer ;
  • the incident light irradiated by the laser irradiates the surface of the metal nanoparticle
  • the free electrons on the surface of the nanoparticle and the incident electromagnetic wave oscillate coherently at the same frequency to generate an electromagnetic surface wave. Due to the above-mentioned strong collective oscillation, the energy of the incident light is effectively coupled to the surface of the nanoparticle within a wavelength range.
  • the interaction between incident light and surface electrons and the ohmic loss of metal nanoparticles can convert the energy of incident light into heat energy and distribute it around the nanoparticles, that is, nanoparticles of specific shapes and sizes have a stronger effect under the irradiation of specific wavelengths of light.
  • the resonance wavelength that produces the thermal effect is related to the material, size, shape and other parameters of the nanoparticle, and the specific resonance wavelength can be selected by changing the above parameters.
  • the laser when the laser is irradiated, the laser penetrates the substrate and irradiates to the bottom of the flexible layer, and the nanoparticles at the bottom interact with the laser to generate a thermal effect, thereby carbonizing the flexible material around the nanoparticles to generate carbides.
  • the interaction between the bottom of the flexible layer and the substrate van der Waals force, etc. is also destroyed accordingly to achieve laser lift-off of the carbide and the substrate.
  • the cross-sectional shape of the carbide is any one of an arc, a circle, a square, and a trapezoid.
  • the bottom of the flexible layer is cleaned to remove the remaining nanoparticles to form a recess.
  • step 150 a substrate is attached to the bottom of the flexible layer, and a touch panel, a polarizer and a cover are laminated and attached to the light-emitting device in order to form the light-emitting panel.
  • An embodiment of the present application also provides a light emitting panel, including:
  • the substrate, the flexible layer, the light-emitting device and the cover plate are stacked in sequence from bottom to top; among them,
  • a rough structure is provided on one side of the flexible layer opposite to the substrate, and the rough structure includes a plurality of depressed portions arranged, wherein there is an interval between adjacent depressed portions in the plurality of depressed portions, and the A touch panel and a polarizer are also arranged between the light emitting device and the cover plate, and the polarizer is arranged on the touch panel.
  • the method for manufacturing a light-emitting panel includes: providing a substrate; forming a flexible layer on the substrate, and the bottom of the flexible layer includes nanoparticles; forming a light-emitting device on the flexible layer;
  • the substrate is irradiated with a laser to generate carbides at the bottom of the flexible layer surrounding the nanoparticles, and the carbides and the substrate are peeled off to form a rough structure on one side of the flexible layer;
  • a substrate is attached to the bottom of the layer, and a touch panel, a polarizer and a cover are laminated and attached to the light-emitting device in order to form the light-emitting panel.

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Abstract

一种发光面板（100）、发光面板（100）的制备方法及显示装置（1000），发光面板（100）包括：从下至上依次层叠设置的基底（10）、柔性层（20）、发光器件（30）及盖板（40）；其中，在所述柔性层（20）相对于所述基底（10）的一侧设置有粗糙结构（201），所述粗糙结构（201）包括排列的多个凹陷部（2011），可以降低发光面板（100）在弯折过程中的层间的力学损伤或褶皱，提高发光面板（100）的良率。

Description

发光面板、发光面板的制备方法及显示装置 技术领域
本申请涉及显示技术领域，具体涉及一种发光面板、发光面板的制备方法及显示装置。
背景技术
近年来，随着有机发光二极管(organic light emitting diode,OLED)具有自发光、低能耗、宽视角、色彩丰富、快速响应及可制备柔性屏等诸多优异特性的特点，引起了科研界和产业界极大的兴趣，被认为是极具潜力的下一代显示技术。
相关技术中，由于不同膜的力学特性不同，发光面板在弯折时的中性层通常不在矩阵或发光层，故在连续弯折中矩阵层或发光层易受到力学损伤进而导致显示不良。且由于矩阵层下方的柔性层具有很高的杨氏模量，其在弯折过程中也容易发生力学损伤或褶皱，进而导致发光面板出现显示不良。
因此，现有技术存在缺陷，急需改进。
技术问题
本申请实施例提供一种发光面板及显示装置，可以降低发光面板在弯折过程中的层间的力学损伤或褶皱，提高发光面板的良率。
技术解决方案
第一方面，本申请实施例提供一种发光面板，包括：
从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部。
在本申请所述的发光面板中，所述多个凹陷部中相邻凹陷部之间存在间隔。
在本申请所述的发光面板中，所述凹陷部在所述柔性层上的分布为每平方厘米10 4～10 8个，且所述凹陷部的在水平方向上的第一开口长度为1纳米～5000纳米，在竖直方向上的第二开口长度为100纳米～5000纳米。
在本申请所述的发光面板中，所述凹陷部的截面形状为弧形、圆 形、方形及梯形中任一种。
在本申请所述的发光面板中，在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
第二方面，本申请实施例还提供一种发光面板的制备方法，包括：
提供一基板；
在所述基板上形成柔性层，所述柔性层的底部包括有纳米粒子；
在所述柔性层上形成发光器件；
对所述基板进行激光照射，以使围绕所述纳米粒子的柔性层的底部生成碳化物，并剥离所述碳化物及所述基板，以在所述柔性层的一侧形成粗糙结构；
在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板。
在本申请所述的发光面板的制备方法中，所述在所述基板形成柔性层，所述柔性层的底部包括有纳米粒子的步骤，包括：
在所述基板上涂布掺杂有纳米粒子的溶液，固化所述溶液，以形成底部包括有纳米粒子的所述柔性层。
在本申请所述的发光面板的制备方法中，所述在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板的步骤之前，还包括：
对所述柔性层的底部进行清洗，以清除所述纳米粒子。
在本申请所述的发光面板的制备方法中，所述碳化物的截面形状为弧形、圆形、方形及梯形中任一种。
第三方面，本申请实施例还提供一种显示装置，包括：壳体以及发光面板，所述发光面板设置在所述壳体上，所述发光面板包括：
从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部。
在本申请所述的显示装置中，所述多个凹陷部中相邻凹陷部之间存在间隔。
在本申请所述的显示装置中，所述凹陷部在所述柔性层上的分布为每平方厘米10 4～10 8个，且所述凹陷部的在水平方向上的第一开口长度为1纳米～5000纳米，在竖直方向上的第二开口长度为100纳米～5000纳米。
在本申请所述的显示装置中，所述凹陷部的截面形状为弧形、圆形、方形及梯形中任一种。
在本申请所述的显示装置中，在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
本申请实施例还提供一种发光面板，包括：
从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部，其中所述多个凹陷部中相邻凹陷部之间存在间隔，在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
有益效果
本申请实施例提供的发光面板包括：从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部，可以降低发光面板在弯折过程中的层间的力学损伤或褶皱，提高发光面板的良率。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的显示装置的结构示意图。
图2为本申请实施例提供的发光面板的第一种结构示意图。
图3为本申请实施例提供的发光面板中柔性层的第一种结构示意图。
图4为本申请实施例提供的发光面板中柔性层的第二种结构示意图。
图5为本申请实施例提供的发光面板的第二种结构示意图。
图6为本申请实施例提供的发光面板的制备方法的流程示意图。
本发明的实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
现有技术中，由于不同膜的力学特性不同，发光面板在弯折时的中性层通常不在矩阵或发光层，故在连续弯折中矩阵层或发光层易受到力学损伤进而导致显示不良。且由于矩阵层下方的柔性层层具有很高的杨氏模量，其在弯折过程中也容易发生力学损伤或褶皱，进而导致发光面板出现显示不良。
本申请实施例提供一种显示装置，包括：壳体以及发光面板，所述发光面板设置在所述壳体上，所述发光面板包括：
从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部。
其中，所述多个凹陷部中相邻凹陷部之间存在间隔。
其中，所述凹陷部在所述柔性层上的分布为每平方厘米10 4～10 8个，且所述凹陷部的在水平方向上的第一开口长度为1纳米～5000纳米，在竖直方向上的第二开口长度为100纳米～5000纳米。
其中，所述凹陷部的截面形状为弧形、圆形、方形及梯形中任一种。
其中，在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
请参阅图1，图1为本申请实施例提供的显示装置1000的结构 示意图。该显示装置100可以包括发光面板100、控制电路200、以及壳体300。需要说明的是，图1所示的显示装置1000并不限于以上内容，其还可以包括其他器件，比如还可以包括摄像头、天线结构、纹解锁模块等。
其中，发光面板100设置于壳体200上。
在一些实施例中，发光面板100可以固定到壳体200上，发光面板100和壳体300形成密闭空间，以容纳控制电路200等器件。
在一些实施例中，壳体300可以为由柔性材料制成，比如为塑胶壳体或者硅胶壳体等。
其中，该控制电路200安装在壳体300中，该控制电路200可以为显示装置1000的主板，控制电路200上可以集成有电池、天线结构、麦克风、扬声器、耳机接口、通用串行总线接口、摄像头、距离传感器、环境光传感器、受话器以及处理器等功能组件中的一个、两个或多个。
其中，该发光面板100安装在壳体300中，同时，该发光面板100电连接至控制电路200上，以形成显示装置1000的显示面。该发光面板100可以包括显示区域和非显示区域。该显示区域可以用来显示显示装置1000的画面或者供用户进行触摸操控等。该非显示区域可用于设置各种功能组件。
本申请实施例还提供一种发光面板，包括：
从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部。
其中，所述多个凹陷部中相邻凹陷部之间存在间隔。
其中，所述凹陷部在所述柔性层上的分布为每平方厘米10 4～10 8，且所述凹陷部的在水平方向上的第一开口长度为1纳米～5000纳米，在竖直方向上的第二开口长度为100纳米～5000纳米。
其中，所述凹陷部的截面形状为弧形、圆形、方形及梯形中任一种。
其中，在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
请参阅图2及图3，图2为本申请实施例提供的发光面板的第一种结构示意图，图3为本申请实施例提供的发光面板中柔性层的第一种结构示意图，该发光面板100包括：
从下至上依次层叠设置的基底10、柔性层20、发光器件30及盖板40；其中，
在所述柔性层20相对于所述基底10的一侧设置有粗糙结构201，所述粗糙结构201包括排列的多个凹陷部2011。
可以理解，如图3所示，当对所述发光面板100弯折时，柔性层20受到弯折力的影响进行弯折，凹陷部2011两侧的柔性材料向凹陷部2011内部填充，即凹陷部2011会导致柔性层20压缩应力减小，柔性层20的压缩应力减小会使得发光面板100在弯折时的应力中性面调整至发光器件30或向上的其他层上。
发光器件30用于产生光亮，使得发光面板100产生画面，这里的发光器件30可以包括薄膜晶体管(Thin Film Transistor，TFT)及有机发光二级管(Organic Light-Emitting Diode，OLED)，图中未示出。
柔性层20一般由聚酰亚胺(Polyimide，PI)有机高分子材料组成，其具有一定的可弯折性。
在所述发光器件30与所述盖板40之间还设置有触控面板50及偏光片60，所述偏光片60设置在所述触控面板50上。触控面板50用于实现发光面板100的触控功能，其可以通过透明光学胶(OCA)粘接在所述发光器件30上，偏光片60用于透过偏振光，对发光器件30发出的光进行成像。
在一些实施例中，所述多个凹陷部2011中相邻凹陷部2011之间存在间隔，用于承载所述基底10。
可以理解，为了使柔性层20在基底10上不会弯曲或倾倒，相邻的凹陷部2011之间存在有间隔，以使通过间隔将柔性层20支撑在所 述基底10上。
请参阅图1及图4，图4为本申请实施例提供的发光面板中柔性层的第二种结构示意图，在一些实施例中，所述凹陷部2011在所述柔性层20上的分布为每平方厘米10 4～10 8个，且所述凹陷部的在水平方向上的第一开口长度W1为1纳米～5000纳米，在竖直方向上的第二开口长度H1为100纳米～5000纳米。
其中，每一凹陷部2011的第一开口长度W1及第二开酒长度H1可以不相同，且相邻凹陷部2011之间的间隔也可不等。
在一些实施例中，如图5所示，图5为本申请实施例提供的发光面板的第二种结构示意图，所述凹陷部2011的截面形状为弧形、圆形、方形及梯形中任一种。
本申请实施例提供的发光面板100，包括：从下至上依次层叠设置的基底10、柔性层20、发光器件30及盖板40；其中，在所述柔性层20相对于所述基底10的一侧设置有粗糙结构201，所述粗糙结构201包括排列的多个凹陷部2011。通过改变弯折时应力中性面的位置从而降低发光面板100在弯折过程中的层间的力学损伤或褶皱，提高发光面板100的良率。
本申请实施例还提供一种发光面板的制备方法，包括：
提供一基板；
在所述基板上形成柔性层，所述柔性层的底部包括有纳米粒子；
在所述柔性层上形成发光器件；
对所述基板进行激光照射，以使围绕所述纳米粒子的柔性层的底部生成碳化物，并剥离所述碳化物及所述基板，以在所述柔性层的一侧形成粗糙结构；
在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板。
其中，所述在所述基板形成柔性层，所述柔性层的底部包括有纳米粒子的步骤，包括：
在所述基板上涂布掺杂有纳米粒子的溶液，固化所述溶液，以形 成底部包括有纳米粒子的所述柔性层。
其中，所述在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板的步骤之前，还包括：
对所述柔性层的底部进行清洗，以清除所述纳米粒子。
其中，所述碳化物的截面形状为弧形、圆形、方形及梯形中任一种。
请参阅图6，图6为本申请实施例提供的发光面板的制备方法的流程示意图。本申请实施例还提供一种发光面板的制备方法，用于制备如上所述的发光面板，包括：
步骤110、提供一基板；
这里的基板一般为玻璃基板。
步骤120、在所述基板上形成柔性层，所述柔性层的底部包括有纳米粒子；
具体的，这里在所述基板上形成柔性层的步骤包括：在所述基板上涂布掺杂有纳米粒子的溶液，固化所述溶液，以形成底部包括有纳米粒子的所述柔性层。
可以理解，柔性层一般的形成方式是在基板进行柔性溶液的涂布，再进行紫外光固化(UV固化)，而为了在形成后的柔性层底部掺杂有纳米粒子，可以在柔性溶液中掺杂纳米粒子，纳米粒子会沉至柔性溶液的底部，这时再进行UV固化，即可将所述纳米粒子设置在所述柔性层的底部。
这里的纳米粒子的直径一般在1纳米～2000纳米，其可以包括圆形、方形、三角形、梯形等，材质包括金、银及铝等材料，这里不做限定。
步骤130、在所述柔性层上形成发光器件；
步骤140、对所述基板进行激光照射，以使围绕所述纳米粒子的柔性层的底部生成碳化物，并剥离所述碳化物及所述基板，以在所述柔性层的一侧形成粗糙结构；
具体的，当激光照射的入射光照射到金属纳米粒子表面时，纳米粒子表面的自由电子与入射的电磁波发生同频率的相干振荡进而产生的一种电磁表面波。由于上述强烈地集体振荡，入射光的能量被有效地耦合到纳米粒子表面一个波长范围内。且入射光与表面电子的相互作用及金属纳米粒子的欧姆损耗可将入射光的能量转化为热能并分布在纳米粒子周围，即特定形状和尺寸的纳米粒子在特定波长的光照射下具有较强的热效应。且产生热效应的共振波长与纳米粒子的材料、尺寸、形状等参数相关，可通过改变上述参数选择特定的共振波长。
由于纳米粒子的热效应，当进行激光照射时，激光穿过基板照射到所述柔性层的底部，底部的纳米粒子与激光相互作用产生热效应进而使纳米粒子四周的柔性材料碳化，生成碳化物。此时柔性层的底部与基板的相互作用(范德瓦尔斯力等)也相应地被破坏进而实现对所述碳化物及所述基板的激光剥离。
在一些实施例中，所述碳化物的截面形状为弧形、圆形、方形及梯形中任一种。
当对所述碳化物及所述基板的激光剥离后，对柔性层的底部进行清洗去除残留的纳米粒子，以形成凹陷部。
步骤150、在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板。
本申请实施例还提供一种发光面板，包括：
从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部，其中所述多个凹陷部中相邻凹陷部之间存在间隔，在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
本申请实施例提供的发光面板的制备方法，包括：提供一基板；在所述基板上形成柔性层，所述柔性层的底部包括有纳米粒子；在所述柔性层上形成发光器件；对所述基板进行激光照射，以使围绕所述 纳米粒子的柔性层的底部生成碳化物，并剥离所述碳化物及所述基板，以在所述柔性层的一侧形成粗糙结构；在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板。通过改变弯折时应力中性面的位置从而降低发光面板在弯折过程中的层间的力学损伤或褶皱，提高发光面板的良率。
以上对本申请实施例所提供的一种发光面板、发光面板的制备方法及显示装置进行了详细介绍，本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请的技术方案及其核心思想；本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或者替换，并不使相应技术方案的本质脱离本申请各实施例的技术方案的范围。

Claims (15)

  1. 一种发光面板，其包括：
    从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
    在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部。
  2. 根据权利要求1所述的发光面板，其中所述多个凹陷部中相邻凹陷部之间存在间隔。
  3. 根据权利要求2所述的发光面板，其中所述凹陷部在所述柔性层上的分布为每平方厘米10 4～10 8个，且所述凹陷部的在水平方向上的第一开口长度为1纳米～5000纳米，在竖直方向上的第二开口长度为100纳米～5000纳米。
  4. 根据权利要求2所述的发光面板，其中所述凹陷部的截面形状为弧形、圆形、方形及梯形中任一种。
  5. 根据权利要求1所述的发光面板，其中在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
  6. 一种发光面板的制备方法，其包括：
    提供一基板；
    在所述基板上形成柔性层，所述柔性层的底部包括有纳米粒子；
    在所述柔性层上形成发光器件；
    对所述基板进行激光照射，以使围绕所述纳米粒子的柔性层的底部生成碳化物，并剥离所述碳化物及所述基板，以在所述柔性层的一侧形成粗糙结构；
    在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板。
  7. 根据权利要求6所述的发光面板的制备方法，其中所述在所述基板形成柔性层，所述柔性层的底部包括有纳米粒子的步骤，包括：
    在所述基板上涂布掺杂有纳米粒子的溶液，固化所述溶液，以形 成底部包括有纳米粒子的所述柔性层。
  8. 根据权利要求6所述的发光面板的制备方法，其中所述在所述柔性层的底部上贴合一基底，并在所述发光器件上依次层叠贴合触控面板、偏光片及盖板，以形成所述发光面板的步骤之前，还包括：
    对所述柔性层的底部进行清洗，以清除所述纳米粒子。
  9. 根据权利要求6所述的发光面板的制备方法，其中所述碳化物的截面形状为弧形、圆形、方形及梯形中任一种。
  10. 一种显示装置，其包括壳体以及发光面板，所述发光面板设置在所述壳体上，所述发光面板包括：
    从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
    在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部。
  11. 根据权利要求10所述的显示装置，其中所述多个凹陷部中相邻凹陷部之间存在间隔。
  12. 根据权利要求11所述的显示装置，其中所述凹陷部在所述柔性层上的分布为每平方厘米10 4～10 8个，且所述凹陷部的在水平方向上的第一开口长度为1纳米～5000纳米，在竖直方向上的第二开口长度为100纳米～5000纳米。
  13. 根据权利要求11所述的显示装置，其中所述凹陷部的截面形状为弧形、圆形、方形及梯形中任一种。
  14. 根据权利要求10所述的显示装置，其中在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
  15. 一种发光面板，其包括：
    从下至上依次层叠设置的基底、柔性层、发光器件及盖板；其中，
    在所述柔性层相对于所述基底的一侧设置有粗糙结构，所述粗糙结构包括排列的多个凹陷部，其中所述多个凹陷部中相邻凹陷部之间存在间隔，在所述发光器件与所述盖板之间还设置有触控面板及偏光片，所述偏光片设置在所述触控面板上。
PCT/CN2019/120487 2019-08-27 2019-11-25 发光面板、发光面板的制备方法及显示装置 Ceased WO2021036044A1 (zh)

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