WO2021035915A1 - 一种多层双面软硬结合板的制作方法及其制品 - Google Patents

一种多层双面软硬结合板的制作方法及其制品 Download PDF

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Publication number
WO2021035915A1
WO2021035915A1 PCT/CN2019/112800 CN2019112800W WO2021035915A1 WO 2021035915 A1 WO2021035915 A1 WO 2021035915A1 CN 2019112800 W CN2019112800 W CN 2019112800W WO 2021035915 A1 WO2021035915 A1 WO 2021035915A1
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film
material layer
frequency
cured
double
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PCT/CN2019/112800
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English (en)
French (fr)
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李龙凯
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李龙凯
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets

Definitions

  • the present invention relates to the field of circuit boards, in particular to a method for manufacturing a multilayer double-sided flexible and rigid combined board and its products.
  • the communication frequency is fully high-frequency, and high-speed and large-capacity applications are emerging one after another.
  • the network frequency has continued to increase.
  • the goal of the first phase is to increase the communication frequency to 6GHz by 2020
  • the goal of the second phase is to further increase to 30-60GHz after 2020.
  • the signal frequency of terminal antennas such as smart phones is constantly increasing, high frequency applications are increasing, and the demand for high speed and large capacity is increasing.
  • soft boards, as antennas and transmission lines in terminal equipment will also usher in technological upgrades.
  • the traditional soft board has a multilayer structure composed of copper foil, insulating base material, covering layer, etc., using copper foil as the conductor circuit material, PI film as the circuit insulating base material, PI film and epoxy resin adhesive as protection and isolation
  • the cover layer of the circuit is processed into a PI soft board through a certain process. Since the performance of the insulating base material determines the final physical and electrical properties of the soft board, in order to adapt to different application scenarios and different functions, the soft board needs to use base materials with various performance characteristics.
  • the most widely used soft board substrate is mainly polyimide (PI), but due to the large dielectric constant and loss factor of the PI substrate, high moisture absorption, and poor reliability, the PI soft board The high frequency transmission loss is serious and the structural characteristics are poor, and it has been unable to adapt to the current high frequency and high speed trend. Therefore, with the emergence of new 5G technology products, the signal transmission frequency and speed of existing circuit boards have been difficult to meet the requirements of 5G technology products.
  • PI polyimide
  • the copper ion migration phenomenon occurs between the circuit and the circuit when the precision circuit board is energized.
  • the circuit will burn, fire and explode due to the conduction collision between the circuit and the circuit, resulting in the circuit
  • the circuit on the board cannot work safely and normally.
  • the purpose of the present invention is to provide a method for manufacturing a multilayer double-sided flexible and rigid board and its products.
  • the manufacturing process of the circuit board is simplified and more convenient, and the production and processing efficiency is improved; the manufactured multilayer double-sided flexible
  • the hard-bonded board has high-frequency characteristics, that is, it has the performance of high-speed transmission of high-frequency signals. It can adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications. It is especially suitable for new 5G technology products.
  • the copper ion migration phenomenon when the power is connected in between has a good protection and resistance effect, and ensures the safe and normal operation of the circuit.
  • a manufacturing method of a multi-layer double-sided flexible and rigid board which is characterized in that it comprises the following steps:
  • step (3.2) Repeat step (3.1) to produce at least two sets of hard material layer structures;
  • At least one set of hard material layer structures are respectively hot-pressed on the upper and lower outermost circuits of the base film of the double-sided FPC flexible board;
  • a layer of solder resist ink layer is formed on the circuit of the hard material layer structure to obtain a multilayer double-sided flexible circuit board;
  • step (1), step (2) and step (3) have no sequence.
  • the hot pressing temperature is gradually increased from 50°C-100°C to 380°C-400°C, and it takes 80min-120min; then, Maintain the hot pressing temperature of 380°C-400°C for 60min-90min; finally, gradually reduce the temperature of the hot pressing temperature from 380°C-400°C to 50°C-100°C, which takes 30-60min; in the whole process, the hot pressing pressure is 400psi -500psi;
  • the hot pressing temperature is gradually increased from 50°C-100°C to 400°C-600°C, which takes 80min-120min; then, maintain 400°C- The hot pressing temperature of 600°C is 60min-90min; finally, the temperature of the hot pressing is gradually reduced from 400°C-600°C to 50°C-100°C, which takes 30-60min; in the whole process, the pressure of the hot pressing is 400psi-
  • step (2.2) specifically includes the following steps:
  • the single panel coated with the synthetic liquid high-frequency material layer is sent to the tunnel oven, and passes through the first-stage heating and baking zone and the second-stage heating in the tunnel oven at a speed of 0.5-20m/s.
  • the baking zone, three-stage heating baking zone, four-stage heating baking zone, five-stage heating baking zone and six-stage heating baking zone are baked in stages, and the synthetic liquid high-frequency material layer on the single panel becomes half Curing the high-frequency material layer; among them, the temperature range of the first heating baking zone is 60°C-100°C, the temperature range of the second heating baking zone is 100°C-200°C, and the temperature range of the third heating baking zone is 200 °C-300°C, the temperature range of the four-stage heating and baking zone is 300°C-400°C, the temperature range of the five-stage heating and baking zone is 400°C-500°C, and the temperature range of the six-stage heating and baking zone is 60°C- 100°C, and the length of each heating and baking zone is 2-6m.
  • the base film is any one of PI film, MPI film, LCP film, TFP film and PTFE film; in the step (2.1), The film is any one of PI film, MPI film, LCP film, TFP film and PTFE film.
  • the semi-cured high-frequency material layer is MPI film, LCP film, TFP film, PTFE film, LDK high-frequency functional glue, or LDK high-frequency functional glue and A mixture of anti-copper ion migration glue.
  • the LDK high-frequency functional glue is obtained by adding Teflon or LCP material to the AD glue
  • the anti-copper ion migration glue is obtained by adding a copper ion trapping agent to the AD glue, and then highly purified obtain.
  • the step (3.1) there is a cured functional material film on one surface of the glass fiber cloth and a half cured functional material film on the other surface, and the cured functional material film is a PI film , MPI film, LCP film, TFP film, PTFE film, anti-copper ion migration film, AD glue, LDK high frequency functional glue and anti-copper ion migration glue.
  • the semi-cured functional material film is PI film, MPI Film, LCP film, TFP film, PTFE film, anti-copper ion migration film, AD glue, LDK high frequency functional glue and anti-copper ion migration glue.
  • a colored filler is added to at least one of the semi-cured high-frequency material layer and the film.
  • the multilayer double-sided rigid-flex board produced by the above method is characterized in that it comprises a double-sided FPC flexible board, an upper soft material layer structure laminated on the surface of the double-sided FPC flexible board, and an upper soft material layer structure laminated on the upper surface of the double-sided FPC flexible board.
  • the double-sided FPC flexible board includes a base film, a first upper circuit layer disposed on the upper surface of the base film, and a first lower circuit layer disposed on the lower surface of the base film;
  • the upper soft material layer structure includes An upper semi-cured high-frequency material layer disposed on the upper surface of the first upper circuit layer, an upper film disposed on the upper surface of the upper semi-cured high-frequency material layer, and a second upper circuit layer disposed on the upper surface of the upper film;
  • the lower soft material layer structure includes a lower semi-cured high-frequency material layer disposed on the lower surface of the first lower circuit layer, a lower film disposed on the lower surface of the lower semi-cured high-frequency material layer, and a lower film disposed on the lower surface of the lower film.
  • the second lower circuit layer; the upper hard material layer structure includes an upper semi-cured functional material film disposed on the upper surface of the second upper circuit layer, an upper glass fiber cloth disposed on the upper surface of the upper semi-cured functional material film, and An upper solidified functional material film on the upper surface of the upper glass fiber cloth, and a third upper circuit layer disposed on the upper solidified functional material film;
  • the lower hard material layer structure includes a lower surface of the second lower circuit layer A lower semi-cured functional material film, a lower glass fiber cloth arranged on the lower surface of the lower semi-cured functional material film, a lower cured functional material film arranged on the lower surface of the lower glass fiber cloth, and a third set on the lower cured functional material film Lower circuit layer.
  • the base film is any one of PI film, MPI film, LCP film, TFP film and PTFE film
  • the upper film is PI film, MPI film, LCP film, TFP film and PTFE Any one of the films
  • the lower film is any one of PI film, MPI film, LCP film, TFP film and PTFE film.
  • the upper semi-cured high-frequency material layer is MPI film, LCP film, TFP film, PTFE film, LDK high-frequency functional glue, or a mixture of LDK high-frequency functional glue and anti-copper ion migration glue
  • the lower semi-cured high-frequency material layer is MPI film, LCP film, TFP film, PTFE film, LDK high-frequency functional glue, or a mixture of LDK high-frequency functional glue and anti-copper ion migration glue.
  • the upper semi-cured functional material film, upper cured functional material film, lower semi-cured functional material film and lower cured functional material film are all PI film, MPI film, LCP film, TFP film, PTFE film , Any one of anti-copper ion migration film, AD glue, LDK high frequency functional glue and anti-copper ion migration glue.
  • At least one of the upper semi-cured high-frequency material layer and the upper film is a colored layer
  • at least one of the lower semi-cured high-frequency material layer and the lower film is a colored layer
  • an upper solder resist ink layer is provided on the upper surface of the third upper circuit layer, and a lower solder resist ink layer is provided on the lower surface of the third lower circuit layer.
  • the double-sided FPC flexible board, the array of soft material layer structure and the array of hard material layer structure are first produced, and then the array of soft material layer structure and the array of hard material layer structure are hot pressed on the double-sided FPC flexible board.
  • the method of manufacturing multi-layer double-sided rigid-flex board, the circuit board manufacturing process is simplified and the manufacturing is more convenient, the circuit board manufacturing speed is accelerated, the production processing efficiency is improved, and the production cost is reduced.
  • the semi-cured high-frequency material layer is used to replace the traditional semi-cured AD glue.
  • the semi-cured high-frequency material layer can be MPI film, LCP film, TFP film, PTFE film or LTK high-frequency functional adhesive to make the soft
  • the layer structure of the high-quality material has high-frequency characteristics and can transmit high-frequency signals at high speed, that is, it has the functions of increasing signal transmission frequency and anti-magnetic interference.
  • the soft material layer structure is hot pressed to the double-sided FPC flexible board to prepare the multi-layer double-sided soft-hard combined board, which has high-frequency characteristics, can transmit high-frequency signals, and accelerate the transmission speed of high-frequency signals.
  • High-speed transmission of high-frequency signals, low power consumption and low transmission loss of high-frequency signals further improve the signal transmission performance of the circuit board, which can adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications, and is especially suitable for new 5G technology products.
  • the semi-cured high-frequency material layer is used to replace the traditional semi-cured AD glue.
  • the semi-cured high-frequency material layer can be a mixture of LDK high-frequency functional glue and anti-copper ion migration glue, that is, the semi-cured high-frequency material layer not only has The characteristics of transmitting high-frequency signals also have the function of anti-copper ion migration, so that the fabricated soft material layer structure not only has high-frequency characteristics, can transmit high-frequency signals at high speed, but also has the function of anti-copper ion migration. Then the soft material layer structure is hot pressed onto the double-sided FPC flexible board to prepare the multi-layer double-sided soft-hard combined board, which can effectively ensure that the circuit can work safely and effectively in the working state.
  • the equipment prevents the migration of copper ions between the lines during the energized use process, so as to prevent the occurrence of short circuit, combustion and fire caused by circuit conduction, battery explosion, and functional failure Wait for danger, so that the line plays a very good protective role.
  • the functional material film can also be MPI film, LCP film, TFP film, PTFE film, anti-copper ion migration film, LDK
  • MPI film MPI film
  • LCP film LCP film
  • TFP film TFP film
  • PTFE film anti-copper ion migration film
  • LDK low-density polyethylene
  • the use of MPI film, LCP film, TFP film, PTFE film and LDK high-frequency functional adhesive as the functional material film can make the functional material film, the prepared hard material layer structure and the final product soft-hard board have high frequency It can transmit high-frequency signals at a high speed; and the use of anti-copper ion migration film and anti-copper ion migration glue as the functional material film can make the functional material film, the prepared hard material layer structure and the final product soft and hard board have resistance
  • the characteristics of copper ion migration play a very good role in protection and protection of the circuit.
  • the multi-layer double-sided rigid-flex board produced is mainly composed of double-sided FPC flexible board, upper soft material layer structure, upper hard material layer structure, lower soft material layer structure and lower hard material Layer structure, therefore, the multilayer double-sided rigid-flex board not only has the characteristics of flexible circuit boards (soft boards) and rigid circuit boards, and can be used in some products with special requirements, and it has a certain degree of flexibility. Area, there is also a certain rigid area, which can save the internal space of the product, reduce the volume of the finished product, improve the performance of the product, and expand the application field; and it has high-frequency characteristics, that is, it has the function of high-speed transmission of high-frequency signals, which is especially suitable for new 5G technology products. At the same time, it has a good protection and resistance to the copper ion migration phenomenon between the circuit board and the circuit when the circuit is energized, and ensures the safe and normal operation of the circuit.
  • Figure 1 is an exploded view of the six-layer double-sided rigid-flex board in the present invention
  • Figure 2 is an overall cross-sectional view of the six-layer double-sided rigid-flex board in the present invention.
  • Figure 3 is an exploded view of the five-layer double-sided rigid-flex board in the present invention.
  • Figure 4 is an overall cross-sectional view of the five-layer double-sided rigid-flex board in the present invention.
  • Figure 5 is another overall cross-sectional view of the six-layer double-sided rigid-flex board in the present invention.
  • the embodiment of the present invention provides a method for manufacturing a multilayer double-sided rigid-flex board, which includes the following steps:
  • step (3.2) Repeat step (3.1) to produce at least two sets of hard material layer structures;
  • At least one set of hard material layer structures are respectively hot-pressed on the upper and lower outermost circuits of the base film of the double-sided FPC flexible board;
  • a layer of solder resist ink layer is formed on the circuit of the hard material layer structure to obtain a multilayer double-sided flexible circuit board;
  • step (1), step (2) and step (3) have no sequence.
  • a double-sided FPC flexible board an array of soft material layer structure and an array of hard material layer structure are first produced, and then the array of soft material layer structure and the array of hard material layer structure are hot pressed on the double-sided FPC flexible board.
  • the method of manufacturing multi-layer double-sided rigid-flex board, the production process of the circuit board is simplified and the production is more convenient, which can significantly improve the production and processing efficiency.
  • a soft material layer structure and a hard material layer structure are respectively hot pressed on the lower surface of the double-sided FPC flexible board to form a six-layer double-sided rigid-flex board.
  • the hot pressing temperature is gradually increased from 50°C-100°C to 380°C-400°C, which takes 80min-120min; then, maintain the temperature of 380°C-400°C
  • the hot pressing temperature is 60min-90min; finally, the hot pressing temperature is gradually reduced from 380°C-400°C to 50°C-100°C, which takes 30-60min; in the whole process, the hot pressing pressure is 400psi-500psi;
  • the step In (4.3) during hot pressing, first, gradually increase the hot pressing temperature from 50°C-100°C to 400°C-600°C, which takes 80min-120min; then, maintain the hot pressing temperature of 400°C-600°C for 60min -90min; Finally, the temperature of the hot pressing is gradually reduced from 400°C-600°C to 50°C-100°C, which takes 30-60min; in the whole process, the pressure of the hot pressing is 400psi-600psi.
  • the step (2.2) specifically includes the following steps:
  • the single panel coated with the synthetic liquid high-frequency material layer is sent to the tunnel oven, and passes through the first-stage heating and baking zone and the second-stage heating in the tunnel oven at a speed of 0.5-20m/s.
  • the baking zone, three-stage heating baking zone, four-stage heating baking zone, five-stage heating baking zone and six-stage heating baking zone are baked in stages, and the synthetic liquid high-frequency material layer on the single panel becomes half Curing the high-frequency material layer; among them, the temperature range of the first heating baking zone is 60°C-100°C, the temperature range of the second heating baking zone is 100°C-200°C, and the temperature range of the third heating baking zone is 200 °C-300°C, the temperature range of the four-stage heating and baking zone is 300°C-400°C, the temperature range of the five-stage heating and baking zone is 400°C-500°C, and the temperature range of the six-stage heating and baking zone is 60°C- 100°C, and the length of each heating and baking zone is 2-6m.
  • the base film is any one of PI film, MPI film, LCP film, TFP film and PTFE film; in the step (2.1), the film is PI film, Any one of MPI film, LCP film, TFP film and PTFE film.
  • the characteristics and advantages of PI film, MPI film, LCP film, TFP film and PTFE film are as follows:
  • PI film is a polyimide film (PolyimideFilm), which is a thin-film insulating material with good performance. It is made of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent through condensation polymerization. Casting film and then imidization. PI film has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance, and dielectric resistance. It can be used for a long time in the temperature range of -269°C ⁇ 280°C, and can reach a high temperature of 400°C in a short time. The glass transition temperatures are respectively 280°C (Upilex R), 385°C (Kapton) and above 500°C (Upilex S). The tensile strength is 200MPa at 20°C, and greater than 100MPa at 200°C. It is especially suitable for the base material of double-sided FPC flexible board and soft material layer structure.
  • PMDA pyromellitic dianhydride
  • MPI Modified PI
  • PI polyimide
  • MPI is a non-crystalline material, it has a wide operating temperature, is easy to operate under low-temperature laminating copper foil, and its surface can be easily combined with copper, and it is inexpensive.
  • the fluoride formula has been improved so that the MPI film can transmit high-frequency signals at 10-15 GHz.
  • the MPI film is used as the base material forming circuit of the double-sided FPC flexible board and the soft material layer structure. It is especially suitable for preparing flexible circuit boards to achieve high-speed and stable reception and transmission of information. Terminal applications such as 5G mobile phones, high-frequency signal transmission Field, autonomous driving, radar, cloud server and smart home, etc.
  • the use of MPI film as the substrate required for the molding circuit of this embodiment can not only improve the overall performance stability and dimensional stability of the circuit board, but also can transmit high-frequency signals and accelerate the transmission speed of high-frequency signals, thereby improving the circuit board
  • the signal transmission performance can adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications.
  • LCP film is Liquid Crystal Polymer, which is a new type of thermoplastic organic material, which generally exhibits liquid crystallinity in the molten state.
  • LCP film is a liquid crystal polymer film.
  • LCP film has high strength, high rigidity, high temperature resistance, thermal stability, bendability, dimensional stability, good electrical insulation and other properties. Compared with PI film, it has better properties. It is a kind of film material that is more excellent than PI film because of its water resistance. LCP film can realize high frequency and high speed soft board under the premise of ensuring high reliability.
  • the LCP film has the following excellent electrical characteristics:
  • the thermal expansion characteristic is very small, and it can be used as an ideal high-frequency packaging material.
  • LCP film as the substrate required for forming the circuit in this embodiment can not only improve the overall performance stability and dimensional stability of the circuit board, but also because the overall LCP film is smoother, the dielectric loss and conductor loss of the LCP film material are smaller, and it has Flexibility, airtightness, can transmit high-frequency signals, accelerate the transmission speed of high-frequency signals, improve the signal transmission performance of circuit boards, and adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications.
  • the LCP film has a good application prospect for manufacturing high-frequency devices, and is particularly suitable for new 5G technology products.
  • the LCP soft board made of the double-sided FPC flexible board and the base material of the soft material layer structure using the LCP film has better flexibility and can further improve the space utilization rate compared with the PI soft board.
  • Flexible electronics can make use of a smaller bending radius to be further thinner and lighter, so the pursuit of flexibility is also a manifestation of miniaturization.
  • the LCP soft board can withstand more bending times and a smaller bending radius than the traditional PI soft board, so the LCP soft board has better Flexible performance and product reliability.
  • the excellent flexibility allows the LCP soft board to freely design the shape, so as to make full use of the small space in the smart phone and further improve the space utilization efficiency.
  • LCP film as the base material can be made into miniaturized high-frequency and high-speed LCP soft boards.
  • TFP is a unique thermoplastic material. Compared with conventional PI materials, TFP has the following characteristics:
  • Low dielectric constant low Dk value, the Dk value is specifically 2.55; and the Dk value of conventional PI is 3.2; therefore, the signal propagation speed is fast, the thickness is thinner, the interval is closer, and the power processing capability is higher;
  • the use of TFP film as the base material required for the double-sided FPC flexible board and soft material layer structure forming circuit of this embodiment can not only improve the stability and dimensional stability of the overall performance of the circuit board, but also transmit high-frequency signals, and Speed up the transmission speed of high-frequency signals and improve the signal transmission performance of circuit boards, which can adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications.
  • PTFE Chinese name: Polytetrafluoroethylene, nicknames: Teflon, Teflon, Teflon, Teflon, Deflon.
  • Polytetrafluoroethylene (PTFE) has excellent dielectric properties, chemical resistance, heat resistance, flame retardancy, low dielectric constant and dielectric loss and small changes in the high frequency range. The main performance is as follows:
  • the use of PTFE film as the substrate required for the molded circuit of this embodiment can not only improve the stability and dimensional stability of the overall performance of the circuit board, but also transmit high-frequency signals, accelerate the transmission speed of high-frequency signals, and reduce power consumption.
  • High-frequency signal transmission loss and high-frequency signal transmission loss improve the signal transmission performance of circuit boards, can adapt to the current high-frequency and high-speed trend from wireless networks to terminal applications, and are especially suitable for new 5G technology products.
  • any one of the above-mentioned PI film, MPI film, LCP film, TFP film and PTFE film is particularly special It is suitable for flexible circuit boards, especially MPI film, LCP film, TFP film and PTFE film. It can not only improve the overall performance of double-sided FPC flexible board, soft material layer structure and final product rigid-flex board, but also has high-frequency characteristics. , Which can greatly speed up the transmission of high-frequency signals and realize high-speed transmission of high-frequency signals, which is especially suitable for new 5G technology products.
  • the semi-cured high-frequency material layer is MPI film, LCP film, TFP film, PTFE film, LDK high-frequency functional glue, or LDK high-frequency functional glue and anti-copper ion migration Gum mixture.
  • MPI film, LCP film, TFP film and PTFE film are all high-frequency film materials that can speed up signal transmission frequency and speed, transmit high-frequency signals, and improve the signal transmission performance of circuit boards, which can not only improve the overall flexible circuit board. Performance and high-frequency characteristics can greatly accelerate the transmission of high-frequency signals and realize high-speed transmission of high-frequency signals. It is especially suitable for new 5G technology products.
  • the LDK high-frequency functional adhesive As for the LDK high-frequency functional adhesive, it is obtained by adding Teflon or LCP material to the AD glue.
  • the LDK high-frequency functional adhesive can be realized by adding Teflon or LCP to the conventional AD glue, and its internal molecular distribution It is more compact, uniform, and does not consume energy, so that LDK high-frequency functional adhesive has the function of increasing signal transmission frequency and anti-magnetic interference to improve the signal transmission performance of the circuit board. Specifically, it can effectively improve the transmission of the circuit board in the working state.
  • the speed of instructions issued in the central area (chip) is quickly transmitted to various components, so that equipment (such as mobile phones, communication base station equipment) can operate quickly without sluggishness and crashes, so that the communication process of new 5G technology products is smooth as a whole .
  • the anti-copper ion migration glue it is obtained by adding reagents such as copper ion trapping agent to the AD glue, and then highly purified.
  • the liquid AD glue may be a conventional AD glue.
  • Inorganic ion exchangers such as IXE-700F, IXE-750, etc.
  • Inorganic ion exchangers have the ability to trap copper ions, which can prevent copper ions from migrating from line to line to the AD glue.
  • the copper ion trapping agent After adding the copper ion trapping agent, the copper ion trapping agent has no effect on the performance of the AD glue, but can improve the performance stability of the AD glue.
  • the conventional AD glue contains epoxy resin, tackifier, plasticizer and various fillers. After a high degree of purification process, the purity of the epoxy resin component in the AD glue can be improved, and the copper between the circuit and the circuit can be improved. The possibility of ion migration from AD glue is significantly reduced, and the purpose of anti-copper ion migration is achieved. Specifically, there is a certain gap between the two components in the conventional AD glue, and copper ions can migrate through the gap. After the concentration of the conventional AD glue is purified, the concentration of the other components decreases significantly, and the concentration of the other components decreases significantly. The gaps between other components are greatly reduced, thereby reducing the gaps available for the migration of copper ions, so as to achieve the purpose of resisting the migration of copper ions.
  • the anti-copper ion migration adhesive Since the anti-copper ion migration adhesive has the function of low particle material anti-copper ion migration, it can effectively ensure that the circuit can work safely and effectively in the working state, and there will be no ion migration phenomenon between the circuit and the circuit, and prevent the circuit and the circuit from appearing during the use of the equipment.
  • the conduction and collision between the lines cause the circuit short circuit, combustion, fire and explosion, etc., so the lines play a good role in protection and protection.
  • the semi-cured high-frequency material layer is a mixture of LDK high-frequency functional adhesive and anti-copper ion migration adhesive, it is only necessary to mix the LDK high-frequency functional adhesive and the anti-copper ion migration adhesive so that the semi-cured high-frequency material layer is simultaneously It has high-speed transmission of high-frequency signals and resistance to copper ion migration.
  • the cured functional material film is any one of PI film, MPI film, LCP film, TFP film, PTFE film, anti-copper ion migration film, AD glue, LDK high frequency functional glue and anti-copper ion migration glue.
  • the cured functional material film can also be MPI film, LCP film, TFP film, PTFE film, anti-copper ion migration film, LDK high-frequency functional glue and anti-copper ion migration glue.
  • cured functional material films have corresponding different functions, thereby imparting more functions to the cured functional material film.
  • MPI film, LCP film, TFP film, PTFE film and LDK high-frequency functional adhesive are used as the cured functional material film, which can make the cured functional material film have high-frequency characteristics and can transmit high-frequency signals at high speed; while adopting anti-copper ion
  • the migration film and the anti-copper ion migration adhesive are used as the cured functional material film, which can make the cured functional material film have the characteristics of anti-copper ion migration, and play a good protective and protective effect on the circuit.
  • the semi-cured functional material film is any one of PI film, MPI film, LCP film, TFP film, PTFE film, anti-copper ion migration film, AD glue, LDK high frequency functional glue and anti-copper ion migration glue.
  • the semi-cured functional material film can also be MPI film, LCP film, TFP film, PTFE film, anti-copper ion migration film, LDK high-frequency functional glue and anti-copper ion migration glue.
  • different types of semi-cured functional material films have corresponding different functions, thereby imparting more functions to the semi-cured functional material film.
  • the use of MPI film, LCP film, TFP film, PTFE film and LDK high-frequency functional adhesive as the semi-cured functional material film can make the semi-cured functional material film have high-frequency characteristics and can transmit high-frequency signals at high speed;
  • the copper ion migration film and the anti-copper ion migration adhesive are used as the semi-cured functional material film, which can make the semi-cured functional material film have the characteristics of anti-copper ion migration, and play a good protective and protective effect on the circuit.
  • a colored filler is added to at least one of the semi-cured high-frequency material layer and the film.
  • the colored filler may be carbide or other colored fillers.
  • Semi-cured high-frequency material layer specifically, MPI film, LCP film, TFP film, PTFE film, LDK high-frequency functional glue, or a mixture of LDK high-frequency functional glue and copper ion migration glue
  • film specifically, PI
  • the colored semi-cured high-frequency material layer and film have a shielding effect on the circuit, which can prevent the internal circuit from being exposed, prevent outsiders from seeing the internal circuit from the outside, and play the role of concealing and protecting the circuit on the circuit board. Impurities or flaws in the circuit board or circuit play the role of concealing.
  • the embodiment of the present invention also provides a multilayer double-sided rigid-flex board produced by implementing the above method, as shown in Figs. 1 and 2, comprising a double-sided FPC flexible board 1, laminated on the upper surface of the double-sided FPC flexible board 1.
  • An upper soft material layer structure 2 an upper hard material layer structure 3 laminated on the upper surface of the upper soft material layer structure 2, a lower soft material layer structure 4 laminated on the lower surface of the double-sided FPC flexible board 1, And a lower hard material layer structure 5 laminated on the lower surface of the lower soft material layer structure 4, wherein the double-sided FPC flexible board 1 includes a base film 11 and a first upper circuit layer disposed on the upper surface of the base film 11 12.
  • the upper soft material layer structure 2 includes an upper semi-cured high-frequency material layer 21 arranged on the upper surface of the first upper circuit layer 12, An upper film 22 on the upper surface of the upper semi-cured high-frequency material layer 21, and a second upper circuit layer 23 disposed on the upper surface of the upper film 22;
  • the lower soft material layer structure 4 includes a first lower circuit layer 13 a lower semi-cured high-frequency material layer 41 on the lower surface, a lower film 42 provided on the lower surface of the lower semi-cured high-frequency material layer 41, and a second lower circuit layer 43 provided on the lower surface of the lower film 42;
  • the upper hard The quality material layer structure 3 includes an upper semi-cured functional material film 31 disposed on the upper surface of the second upper circuit layer 23, an upper glass fiber cloth 32 disposed on the upper surface of the upper semi-cured functional material film 31, and an upper glass fiber cloth An upper solidified functional material film 33 on the upper surface of the cloth 32, and a third upper circuit layer 34 disposed on the
  • an upper soft material layer structure 2 and an upper hard material layer structure 3 are laminated on the upper surface of the double-sided FPC flexible board 1, and the lower surface of the double-sided FPC flexible board 1 is laminated on the lower surface.
  • the high-quality material layer structure 4 and the lower hard material layer structure 5 form a six-layer double-sided rigid-flex board.
  • the soft material layer structure only on one of the upper surface and the lower surface of the double-sided FPC flexible board 1, as shown in Figures 3 and 4, the double-sided FPC flexible board 1 is laminated on the upper surface of the soft material layer structure.
  • the base film 11 is any one of PI film, MPI film, LCP film, TFP film and PTFE film
  • the upper film 22 is PI film, MPI film, LCP film, TFP film and Any one of PTFE films
  • the lower film 42 is any one of PI film, MPI film, LCP film, TFP film, and PTFE film.
  • any one of PI film, MPI film, LCP film, TFP film and PTFE film as the base material of the double-sided FPC flexible board 1, the upper soft material layer structure 2 and the lower soft material layer structure 4 (
  • the base film 11, the upper film 22 and the lower film 42) are particularly suitable, especially MPI film, LCP film, TFP film and PTFE film, which can not only improve the double-sided FPC flexible board 1, the upper soft material layer structure 2 and the lower
  • the soft material layer structure 4 and the overall performance of the final product soft-hard board also have high-frequency characteristics, which can greatly accelerate the transmission of high-frequency signals and achieve high-speed transmission of high-frequency signals, which is especially suitable for new 5G technology products.
  • the upper semi-cured high-frequency material layer 21 is MPI film, LCP film, TFP film, PTFE film, LDK high-frequency functional glue, or a mixture of LDK high-frequency functional glue and anti-copper ion migration glue
  • the lower semi-cured high-frequency material layer 41 is MPI film, LCP film, TFP film, PTFE film, LDK high-frequency functional glue, or a mixture of LDK high-frequency functional glue and anti-copper ion migration glue.
  • MPI film, LCP film, TFP film, PTFE film and LDK high-frequency functional adhesive can speed up the signal transmission frequency and speed, transmit high-frequency signals, and improve the signal transmission performance of the circuit board, not only can improve the overall flexible circuit board Performance and high-frequency characteristics can greatly accelerate the transmission of high-frequency signals and realize high-speed transmission of high-frequency signals. It is especially suitable for new 5G technology products.
  • the mixture of LDK high-frequency functional glue and anti-copper ion migration glue has both high-speed transmission of high-frequency signals and anti-copper ion migration properties.
  • the upper semi-cured functional material film 31, the upper cured functional material film 33, the lower semi-cured functional material film 51 and the lower cured functional material film 53 are all PI film, MPI film, LCP film, TFP film. , PTFE film, anti-copper ion migration film, AD glue, LDK high-frequency functional glue and anti-copper ion migration glue.
  • the upper semi-cured functional material film 31, the upper cured functional material film 33, the lower semi-cured functional material film 51, and the lower cured functional material film 53 can be MPI film, LCP film, etc. in addition to the conventional PI film and AD glue.
  • any one of TFP film, PTFE film, anti-copper ion migration film, LDK high-frequency functional glue and anti-copper ion migration glue can be seen that different types of functional material films have corresponding different functions, which give The functional material film has more functions.
  • MPI film, LCP film, TFP film, PTFE film and LDK high-frequency functional adhesive are used as the above-mentioned four functional material films, which can make the functional material film have high-frequency characteristics and can transmit high-frequency signals at high speed; while using anti-copper
  • the ion migration film and the anti-copper ion migration glue are used as the above-mentioned four functional material films, which can make the functional material film have the characteristics of anti-copper ion migration and play a good protection and protection effect on the circuit.
  • At least one of the upper semi-cured high-frequency material layer 21 and the upper film 22 is a colored layer
  • at least one of the lower semi-cured high-frequency material layer 41 and the lower film 42 is a colored layer.
  • the colored layer can specifically be black, red, green, blue, colored, etc., and the colored layer plays a role of blocking, protecting, concealing internal circuits, etc.
  • an upper solder resist ink layer 35 is provided on the upper surface of the third upper circuit layer 34, and a lower solder resist ink layer 55 is provided on the lower surface of the third lower circuit layer 54.
  • the upper solder resist ink layer 35 and the lower solder resist ink layer 55 are both liquid semi-cured inks, and the color can be black, white or green.
  • the upper solder resist ink layer 35 and the lower solder resist ink layer 55 can be used as solder resist circuit protection layers. And to prevent oxidation, moisture absorption and corrosion in the exposed atmosphere of the circuit, and protect the circuit.
  • the upper solder resist ink layer 35 and the lower solder resist ink layer 55 are printed on the surface of the circuit, then exposed and developed at a high temperature of 150 degrees, and cured in one hour.
  • the multilayer double-sided rigid-flex board of this embodiment has both the characteristics of a flexible circuit board (soft board) and the characteristics of a rigid circuit board. It can be used in some products with special requirements, and it has a certain flexible area. There is also a certain rigid area, which can save the internal space of the product, reduce the volume of the finished product, improve the product performance, and expand the application field. Application areas such as: mobile phones, keypads and side keypads, computers and LCD screens, motherboards and displays, CD players, disk drives, NOTEBOOK, etc.

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Abstract

一种多层双面软硬结合板的制作方法及其制品，制作方法包括以下步骤：(1)制作双面FPC柔性板；(2)制作至少一组软质材料层结构；(3)制作至少两组硬质材料层结构；(4)在双面FPC柔性板上表面和/或下表面的线路上热压上至少一组软质材料层结构，在双面FPC柔性板的基膜上下方最外层线路上分别热压上至少一组硬质材料层结构，获得多层双面柔性线路板。该方法制作工序简化且制作更方便；制作出的多层双面软硬结合板具有高频特性，即具有高速传输高频信号的性能，特别适用于新型5G科技产品；对电路板上线路之间通电时的铜离子迁移现象具有很好的防护及抵抗作用，保证线路安全正常工作。

Description

一种多层双面软硬结合板的制作方法及其制品 技术领域
本发明涉及线路板领域，尤其涉及一种多层双面软硬结合板的制作方法及其制品。
背景技术
目前，从通信网络到终端应用，通信频率全面高频化，高速大容量应用层出不穷。近年来随着无线网络从4G向5G过渡，网络频率不断提升。根据相关资料中显示的5G发展路线图，未来通信频率将分两个阶段进行提升。第一阶段的目标是在2020年前将通信频率提升到6GHz，第二阶段的目标是在2020年后进一步提升到30-60GHz。在市场应用方面，智能手机等终端天线的信号频率不断提升，高频应用越来越多，高速大容量的需求也越来越多。为适应当前从无线网络到终端应用的高频高速趋势，软板作为终端设备中的天线和传输线，亦将迎来技术升级。
传统软板具有由铜箔、绝缘基材、覆盖层等构成的多层结构，使用铜箔作为导体电路材料，PI膜作为电路绝缘基材，PI膜和环氧树脂粘合剂作为保护和隔离电路的覆盖层，经过一定的制程加工成PI软板。由于绝缘基材的性能决定了软板最终的物理性能和电性能，为了适应不同应用场景和不同功能，软板需要采用各种性能特点的基材。目前应用较多的软板基材主要是聚酰亚胺(PI)，但是由于PI基材的介电常数和损耗因子较大、吸潮性较大、可靠性较差，因此PI软板的高频传输损耗严重、结构特性较差，已经无法适应当前的高频高速趋势。因此，随着新型5G科技产品的出现，现有线路板的信号传输频率与速度已经难以满足5G科技产品的要求。
同时，在传统多层双面软硬结合板制备工艺上，普遍存在工艺流程多，制作复杂，在线路板性能方面，耗电及信号传输损耗增大等问题。
同时，通常精密线路电路板在通电情况下线路与线路之间会出现铜离子迁移现象，在设备使用过程中，线路与线路之间会因为导通碰撞而造成电路燃烧起火爆炸等危险，导致电路板上的线路无法安全正常工作。
发明内容
针对上述不足，本发明的目的在于提供一种多层双面软硬结合板的制作方法及其制品，线路板制作工序简化且制作更方便，提高生产加工效率；制作出的多层双面软硬结合板具有高频特性，即具有高速传输高频信号的性能，可适应当前从无线网络到终端应用的高频高速趋势，特别适用于新型5G科技产品，同时对电路板上线路与线路之间通电时的铜离子迁移现象具有很好的防护及抵抗作用，保证线路安全正常工作。
本发明为达到上述目的所采用的技术方案是：
一种多层双面软硬结合板的制作方法，其特征在于，包括以下步骤：
(1)制作双面FPC柔性板：在基膜上下表面分别敷上一铜层，并在铜层上成型线路，获得双面FPC柔性板；
(2)制作至少一组软质材料层结构
(2.1)在薄膜一表面上敷上一铜层，形成单面板；
(2.2)在单面板的薄膜另一表面敷上一半固化高频材料层，获得至少一组软质材料层结构；
(3)制作至少两组硬质材料层结构
(3.1)在双面带功能材料膜的玻纤布一表面上敷上一铜层；
(3.2)重复步骤(3.1)，制作出至少两组硬质材料层结构；
(4)热压成型
(4.1)在双面FPC柔性板上表面和/或下表面的线路上热压上至少一组软质材料层结构，热压后，软质材料层结构上的半固化高频材料层与双面FPC柔性板上的线路结合于一体；
(4.2)在热压后的软质材料层结构的铜层上成型线路；
(4.3)在双面FPC柔性板的基膜上下方最外层线路上分别热压上至少一组硬质材料层结构；
(4.4)在热压后的硬质材料层结构的铜层上成型线路；
(4.5)在硬质材料层结构的线路上成型一层防焊油墨层，获得多层双面柔性线路板；
其中，步骤(1)、步骤(2)与步骤(3)没有先后顺序。
作为本发明的进一步改进，在所述步骤(4.1)中，在热压时，首先，将热压温度从50℃-100℃逐渐升高至380℃-400℃，用时80min-120min；然后，维持380℃-400℃的热压温度60min-90min；最后，将热压温度从380℃-400℃逐渐降温至50℃-100℃，用时30-60min；在整个过程中，热压压力为400psi-500psi；在所述步骤(4.3)中，在热压时，首先，将热压温度从50℃-100℃逐渐升高至400℃-600℃，用时80min-120min；然后，维持400℃-600℃的热压温度60min-90min；最后，将热压温度从400℃-600℃逐渐降温至50℃-100℃，用时30-60min；在整个过程中，热压压力为400psi-600psi。
作为本发明的进一步改进，所述步骤(2.2)具体包括以下步骤：
(2.2.1)将单面板放到涂布机上，在单面板的薄膜上涂覆上一层合成液态高频材料层；
(2.2.2)将涂覆有合成液态高频材料层的单面板送至隧道烤炉内，并以0.5-20m/s的速度依次经过隧道烤炉内的一段加热烘烤区、二段加热烘烤区、三段加热烘烤区、四段加热烘烤区、五段加热烘烤区与六段加热烘烤区进行分段烘烤，单面板上的合成液态高频材料层变为半固化高频材料层；其中，一段加热烘烤区的温度范围为60℃-100℃，二段加热烘烤区的温度范围为100℃-200℃，三段加热烘烤区的温度范围为200℃-300℃，四段加热烘烤区的温度范围为300℃-400℃，五段加热烘烤区的温度范围为400℃-500℃，六段加热烘烤区的温度范围为60℃-100℃，且每段加热烘烤区的长度均为2-6m。
作为本发明的进一步改进，在所述步骤(1)中，所述基膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种；在所述步骤(2.1)中，所述薄膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种。
作为本发明的进一步改进，在所述步骤(2.2)中，所述半固化高频材料层为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物。
作为本发明的进一步改进，所述LDK高频功能胶通过在AD胶中添加铁弗龙或LCP材料获得，所述抗铜离子迁移胶通过在AD胶中添加铜离子捕捉剂，然后再高度提纯获得。
作为本发明的进一步改进，在所述步骤(3.1)中，在玻纤布一表面上具有一固化功能材料膜，在另一表面上具有一半固化功能材料膜，该固化功能材料膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种，该半固化功能材料膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种。
作为本发明的进一步改进，在所述步骤(2.2)中，所述半固化高频材料层与薄膜中至少有一者中添加有有色填充剂。
实施上述方法制作出的多层双面软硬结合板，其特征在于，包括一双面FPC柔性板、层叠于双面FPC柔性板上表面的一上软质材料层结构、层叠于上软质材料层结构上表面的一上硬质材料层结构、层叠于双面FPC柔性板下表面的一下软质材料层结构、及层叠于下软质材料层结构下表面的一下硬质材料层结构，其中，该双面FPC柔性板包括一基膜、设置于基膜上表面的一第一上线路层、及设置于基膜下表面的一第一下线路层；该上软质材料层结构包括设置于第一上线路层上表面的一上半固化高频材料层、设置于上半固化高频材料层上表面的一上薄膜、及设置于上薄膜上表面的一第二上线路层；该下软质材料层结构包括设置于第一下线路层下表面的一下半固化高频材料层、设置于下半固化高频材料层下表面的一下薄膜、及设置于下薄膜下表面的一第二下线路层；该上硬质材料层结构包括设置于第二上线路层上表面的一上半固化功能材料膜、设置于上半固化功能材料膜上表面的一上玻纤布、设置于上玻纤布上表面的一上固化功能材料膜、及设置于上固化功能材料膜上的一第三上线路层；该下硬质材料层结构包括设置于第二下线路层下表面 的一下半固化功能材料膜、设置于下半固化功能材料膜下表面的一下玻纤布、设置于下玻纤布下表面的一下固化功能材料膜、及设置于下固化功能材料膜上的一第三下线路层。
作为本发明的进一步改进，所述基膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种，所述上薄膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种，所述下薄膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种。
作为本发明的进一步改进，所述上半固化高频材料层为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物，所述下半固化高频材料层为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物。
作为本发明的进一步改进，所述上半固化功能材料膜、上固化功能材料膜、下半固化功能材料膜与下固化功能材料膜均为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种。
作为本发明的进一步改进，所述上半固化高频材料层与上薄膜中至少有一者为有色层，所述下半固化高频材料层与下薄膜中至少有一者为有色层。
作为本发明的进一步改进，在所述第三上线路层上表面设置有一上防焊油墨层，在所述第三下线路层下表面设置有一下防焊油墨层。
本发明的有益效果为：
(1)采用先制作出双面FPC柔性板、数组软质材料层结构与数组硬质材料层结构，再将数组软质材料层结构与数组硬质材料层结构热压于双面FPC柔性板上的方式制作多层双面软硬结合板，线路板制作工序简化且制作更方便，加快线路板制作速度，提高生产加工效率，降低生产成本。
(2)采用MPI薄膜、LCP薄膜、TFP薄膜或PTFE薄膜代替传统的PI薄膜，作为双面FPC柔性板与软质材料层结构上成型线路的基材，都特别适合于柔性线路板，不但可提高双面FPC柔性板、软质材料层结构及最终产品软 硬结合板整体性能的稳定性与尺寸稳定性，而且具有高频特性，可传输高频信号、及加快高频信号的传输速度，实现高频信号的高速传输，耗电量及高频信号传输损耗低，提高线路板的信号传输性能，可适应当前从无线网络到终端应用的高频高速趋势，特别适用于新型5G科技产品。
(3)采用半固化高频材料层代替传统的半固化AD胶，半固化高频材料层具体可以为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜或LDK高频功能胶，使得制作出的软质材料层结构具有高频特性，可高速传输高频信号，即具有提高信号传输频率、及抗磁性干扰功能。则将软质材料层结构热压到双面FPC柔性板上所制备出的多层双面软硬结合板，具有高频特性，可传输高频信号、及加快高频信号的传输速度，实现高频信号的高速传输，耗电量及高频信号传输损耗低，进一步提高线路板的信号传输性能，可适应当前从无线网络到终端应用的高频高速趋势，特别适用于新型5G科技产品。
(4)采用半固化高频材料层代替传统的半固化AD胶，半固化高频材料层具体可以为LDK高频功能胶与抗铜离子迁移胶的混合物，即半固化高频材料层不但具有传输高频信号的特性，还具有抗铜离子迁移功能，使得制作出的软质材料层结构不但具有高频特性，可高速传输高频信号，还具有抗铜离子迁移功能。则将软质材料层结构热压到双面FPC柔性板上所制备出的多层双面软硬结合板，可有效保证线路板在工作状态中线路能够安全有效工作，在通电情况下线路与线路之间不会出现铜离子迁移现象，设备在通电使用过程中，防止出现线路与线路之间铜离子迁移现象，从而防止出现电路短路、电路导通引起的燃烧起火、电池爆炸、及功能失效等危险，从而线路起到很好的保护作用。
(5)在玻纤布表面具有功能材料膜，功能材料膜除了可以为常规的PI薄膜与AD胶外，还可以为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、LDK高频功能胶与抗铜离子迁移胶中的任意一种，不同种类的功能材料膜具有了相对应的不同功能，由此赋予了功能材料膜更多功能。具体的，采用MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜与LDK高频功能胶作为功能材料膜，可以使功能材料膜、制备出的硬质材料层结构及最终产品 软硬结合板具有高频特性，可高速传输高频信号；而采用抗铜离子迁移薄膜与抗铜离子迁移胶作为功能材料膜，可以使功能材料膜、制备出的硬质材料层结构及最终产品软硬结合板具有抗铜离子迁移的特性，对线路起到很好的防护及保护作用。
(6)制作出的多层双面软硬结合板，由于其主要由双面FPC柔性板、上软质材料层结构、上硬质材料层结构、下软质材料层结构与下硬质材料层结构组成，因此，多层双面软硬结合板不但具备柔性线路板(软板)的特性与硬性线路板的特性，可以用于一些有特殊要求的产品之中，既有一定的挠性区域，也有一定的刚性区域，可节省产品内部空间，减少成品体积，提高产品性能，扩大应用领域；而且具有高频特性，即具有高速传输高频信号的功能，特别适用于新型5G科技产品，同时对电路板上线路与线路之间通电时的铜离子迁移现象具有很好的防护及抵抗作用，保证线路安全正常工作。
上述是发明技术方案的概述，以下结合附图与具体实施方式，对本发明做进一步说明。
附图说明
图1为本发明中六层双面软硬结合板的分解图；
图2为本发明中六层双面软硬结合板的一整体剖面图；
图3为本发明中五层双面软硬结合板的分解图；
图4为本发明中五层双面软硬结合板的一整体剖面图；
图5为本发明中六层双面软硬结合板的另一整体剖面图。
具体实施方式
为更进一步阐述本发明为达到预定目的所采取的技术手段及功效，以下结合附图及较佳实施例，对本发明的具体实施方式详细说明。
本发明实施例提供一种多层双面软硬结合板的制作方法，包括以下步骤：
(1)制作双面FPC柔性板：在基膜上下表面分别敷上一铜层，并在铜层上成型线路，获得双面FPC柔性板；
(2)制作至少一组软质材料层结构
(2.1)在薄膜一表面上敷上一铜层，形成单面板；
(2.2)在单面板的薄膜另一表面敷上一半固化高频材料层，获得至少一组软质材料层结构；
(3)制作至少两组硬质材料层结构
(3.1)在双面带功能材料膜的玻纤布一表面上敷上一铜层；
(3.2)重复步骤(3.1)，制作出至少两组硬质材料层结构；
(4)热压成型
(4.1)在双面FPC柔性板上表面和/或下表面的线路上热压上至少一组软质材料层结构，热压后，软质材料层结构上的半固化高频材料层与双面FPC柔性板上的线路结合于一体；
(4.2)在热压后的软质材料层结构的铜层上成型线路；
(4.3)在双面FPC柔性板的基膜上下方最外层线路上分别热压上至少一组硬质材料层结构；
(4.4)在热压后的硬质材料层结构的铜层上成型线路；
(4.5)在硬质材料层结构的线路上成型一层防焊油墨层，获得多层双面柔性线路板；
其中，步骤(1)、步骤(2)与步骤(3)没有先后顺序。
本实施例采用先制作出双面FPC柔性板、数组软质材料层结构与数组硬质材料层结构，再将数组软质材料层结构与数组硬质材料层结构热压于双面FPC柔性板上的方式制作多层双面软硬结合板，线路板制作工序简化且制作更方便，可显著提高生产加工效率。如图1与图2所示，在双面FPC柔性板上下表面各热压上一软质材料层结构与一硬质材料层结构，形成六层双面软硬结合板。当然，还可以只在双面FPC柔性板上表面与下表面中的一个表面上热压软质材料层结构，如图3与图4所示，在双面FPC柔性板上表面上热压软质材料层结构，而在双面FPC柔性板下表面没有热压软质材料层结构，形成五层双面软硬结合板。
在所述步骤(4.1)中，在热压时，首先，将热压温度从50℃-100℃逐渐升高至380℃-400℃，用时80min-120min；然后，维持380℃-400℃的热压温度60min-90min；最后，将热压温度从380℃-400℃逐渐降温至50℃ -100℃，用时30-60min；在整个过程中，热压压力为400psi-500psi；在所述步骤(4.3)中，在热压时，首先，将热压温度从50℃-100℃逐渐升高至400℃-600℃，用时80min-120min；然后，维持400℃-600℃的热压温度60min-90min；最后，将热压温度从400℃-600℃逐渐降温至50℃-100℃，用时30-60min；在整个过程中，热压压力为400psi-600psi。
所述步骤(2.2)具体包括以下步骤：
(2.2.1)将单面板放到涂布机上，在单面板的薄膜上涂覆上一层合成液态高频材料层；
(2.2.2)将涂覆有合成液态高频材料层的单面板送至隧道烤炉内，并以0.5-20m/s的速度依次经过隧道烤炉内的一段加热烘烤区、二段加热烘烤区、三段加热烘烤区、四段加热烘烤区、五段加热烘烤区与六段加热烘烤区进行分段烘烤，单面板上的合成液态高频材料层变为半固化高频材料层；其中，一段加热烘烤区的温度范围为60℃-100℃，二段加热烘烤区的温度范围为100℃-200℃，三段加热烘烤区的温度范围为200℃-300℃，四段加热烘烤区的温度范围为300℃-400℃，五段加热烘烤区的温度范围为400℃-500℃，六段加热烘烤区的温度范围为60℃-100℃，且每段加热烘烤区的长度均为2-6m。
在所述步骤(1)中，所述基膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种；在所述步骤(2.1)中，所述薄膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种。具体的，PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜的特性与优点分别为：
PI薄膜为聚酰亚胺薄膜(PolyimideFilm)，是性能良好的薄膜类绝缘材料，由均苯四甲酸二酐(PMDA)和二胺基二苯醚(DDE)在强极性溶剂中经缩聚并流延成膜再经亚胺化而成。PI薄膜具有优良的耐高低温性、电气绝缘性、粘结性、耐辐射性、耐介质性，能在-269℃～280℃的温度范围内长期使用，短时可达到400℃的高温。玻璃化温度分别为280℃(Upilex R)、385℃(Kapton)和500℃以上(Upilex S)。20℃时拉伸强度为200MPa，200℃时大于100MPa。特别适宜用作双面FPC柔性板与软质材料层结构的基材。
MPI(Modified PI)为改性聚酰亚胺，即对聚酰亚胺(PI)的配方进行改进而成。MPI因为是非结晶性的材料，所以操作温度宽，在低温压合铜箔下易操作，表面能够与铜易结合，且价格便宜。具体为，改善了氟化物配方，因此MPI薄膜可传输10-15GHz的高频信号。采用MPI膜作为双面FPC柔性板与软质材料层结构的基材成型线路，特别适用于制备柔性线路板，达到高速、平稳接收及传送信息的目的，终端应用如5G手机、高频信号传输领域、自动驾驶、雷达、云服务器和智能家居等。
通过测速，MPI薄膜的技术指标为：
Figure PCTCN2019112800-appb-000001
由上述可知，MPI薄膜具有以下特性：
(1)低Dk值、低Df值；
(2)优异的耐热老化性；
(3)优异的尺寸稳定性；
(4)优良的耐化性。
因此，采用MPI薄膜作为本实施例成型线路所需基材，不但可提高线路板整体性能的稳定性与尺寸稳定性，而且可传输高频信号、及加快高频信号的传输速度，提高线路板的信号传输性能，可适应当前从无线网络到终端应用的高频高速趋势。
LCP全称为液晶高分子聚合物(Liquid Crystal Polymer)，是一种新型热塑性有机材料，在熔融态时一般呈现液晶性。LCP薄膜为液晶聚合物薄膜，LCP薄膜具备高强度、高刚性、耐高温、热稳定性、可弯折性、尺寸稳定性、良好的电绝缘性等性能，相较于PI薄膜，具备更好的耐水性，因此是一种比PI薄膜更优异的薄膜型材料。LCP薄膜可在保证较高可靠性的前提下实现高频高速软板。LCP薄膜具有以下优异的电学特征：
(1)在高达110GHz的全部射频范围几乎能保持恒定的介电常数，一致性好，介电常数Dk值具体为2.9；
(2)正切损耗非常小，仅为0.002，即使在110GHz时也只增加到0.0045，非常适合毫米波应用；
(3)热膨胀特性非常小，可作为理想的高频封装材料。
采用LCP薄膜作为本实施例成型线路所需基材，不但可提高线路板整体性能的稳定性与尺寸稳定性，而且由于LCP薄膜整体更平滑，LCP薄膜材料介质损耗与导体损耗更小，同时具备灵活性、密封性，可传输高频信号、及加快高频信号的传输速度，提高线路板的信号传输性能，可适应当前从无线网络到终端应用的高频高速趋势。
具体的，可有效提高线路板在工作状态中传达中心区域(芯片)下达指令的速度，快速的传递至各个部件，使设备(如手机、通讯基站设备)快速运作，而没有迟钝及死机卡死等现象出现，通讯过程整体流畅。因此，LCP薄膜具有很好的制造高频器件应用前景，特别适用于新型5G科技产品。
同时，采用LCP薄膜作为双面FPC柔性板与软质材料层结构的基材制成的LCP软板，具有更好的柔性性能，相比PI软板可进一步提高空间利用率。柔性电子可利用更小的弯折半径进一步轻薄化，因此对柔性的追求也是小型化的体现。以电阻变化大于10％为判断依据，同等实验条件下，LCP软板相比传统的PI软板可以耐受更多的弯折次数和更小的弯折半径，因此LCP软板具有更好的柔性性能和产品可靠性。优良的柔性性能使LCP软板可以自由设计形状，从而充分利用智能手机中的狭小空间，进一步提高空间利用效率。
因此，采用LCP薄膜作为基材可制成小型化的高频高速LCP软板。
TFP是一种独特的热塑性材料，相较于常规的PI材料，具有以下特性：
(1)低介电常数：低Dk值，Dk值具体为2.55；而常规PI的Dk值为3.2；因此，信号传播速度快，厚度更薄，间隔更紧密，功率处理能力更高；
(2)超低的材料损耗；
(3)超高温性能，可耐受300℃的高温；
(4)吸湿率相对较低。
因此，采用TFP薄膜作为本实施例双面FPC柔性板与软质材料层结构成型线路所需基材，不但可提高线路板整体性能的稳定性与尺寸稳定性，而且可传输高频信号、及加快高频信号的传输速度，提高线路板的信号传输性能，可适应当前从无线网络到终端应用的高频高速趋势。
PTFE，中文名：聚四氟乙烯，别称：特富龙、特氟龙、铁氟龙、陶氟隆、德氟隆。聚四氟乙烯(PTFE)具有优异的介电性能，耐化学腐蚀，耐热，阻燃，高频率范围内介电常数和介电损耗小且变化小。主要性能如下：
1、电气性能
(1)介电常数：2.1；
(2)介电损耗：5×10 -4；
(3)体积电阻：1018Ω·cm；
2、化学性能：耐酸碱、耐有机溶剂、抗氧化；
3、热稳定性：在-200℃～260℃温度范围内长期工作；
4、阻燃性：UL94V-0；
5、耐候性：户外20年以上不会有机械性能的明显损失。
因此，采用PTFE薄膜作为本实施例成型线路所需基材，不但可提高线路板整体性能的稳定性与尺寸稳定性，而且可传输高频信号、及加快高频信号的传输速度，降低耗电量及高频信号传输损耗，提高线路板的信号传输性能，可适应当前从无线网络到终端应用的高频高速趋势，特别适用于新型5G科技产品。
5G基站的集成化使得高频覆铜板的需求增长迅速，聚四氟乙烯作为5G高频高速覆铜板的主流高频基材之一，在5G时代将迎来巨大的市场增长。
由此可知，采用上述PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜五者中任意一者作为本实施例双面FPC柔性板与软质材料层结构成型线路所需基材，都特别适合于柔性线路板，特别是MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜，不但可以提高双面FPC柔性板、软质材料层结构及最终产品软硬结合板的整体性能，还具有高频特性，可大幅加快高频信号的传输，实现高频信号的高速传输，特别适用于新型5G科技产品。
具体的，在所述步骤(2.2)中，所述半固化高频材料层为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物。由上述可知，MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜均为可加快信号传输频率与速度，传输高频信号，提高线路板信号传输性能的高频薄膜材料，不但可以提高柔性线路板的整体性能，还具有高频特性，可大幅加快高频信号的传输，实现高频信号的高速传输，特别适用于新型5G科技产品。
而对于LDK高频功能胶，通过在AD胶中添加铁弗龙或LCP材料获得，该LDK高频功能胶可通过对常规AD胶进行添加铁弗龙或LCP等化学材料实现，其内部分子分布更紧密、均匀，且不消耗能量，使得LDK高频功能胶具有提高信号传输频率、及抗磁性干扰功能，以提高电路板的信号传输性能，具体的，可有效提高电路板在工作状态中传达中心区域(芯片)下达指令的速度，快速的传递至各个部件，使设备(如手机、通讯基站设备)快速运作，而没有迟钝及死机卡死等现象出现，使新型5G科技产品通讯过程整体流畅。
而对于抗铜离子迁移胶，通过在AD胶中添加铜离子捕捉剂等试剂，然后再高度提纯获得。具体的，液态AD胶可以为常规AD胶。铜离子捕捉剂可选用无机离子交换剂(例如，IXE-700F、IXE-750等)，无机离子交换剂具有捕获铜离子的能力，可防止铜离子从线路与线路之间迁移，往AD胶中添加铜离子捕捉剂后，铜离子捕捉剂对AD胶的性能无影响，反而可以提高AD胶的性能稳定性。常规的AD胶中含有环氧树脂、增粘剂、增塑剂与各种填料，通过高度提纯工艺后，可使AD胶中的环氧树脂成分的纯度提高，则线路与线路之间的铜离子从AD胶中迁移的可能性明显降低，起到抗铜离子迁移的目的。 具体的，常规AD胶中两两成分之间具有一定的间隙，铜离子可通过间隙发生迁移，而对常规AD胶进行提纯环氧树脂浓度提高后，别的成分浓度明显降低，环氧树脂与别的成分之间存在的间隙大幅减小，由此，可供铜离子迁移的间隙减小，从而达到抗铜离子迁移的目的。由于抗铜离子迁移胶具有低粒子材料抗铜离子迁移功能，可有效保证在工作状态中线路能够安全有效工作，线路与线路之间不会出现离子迁移现象，防止在设备使用过程中出现线路与线路之间导通碰撞造成电路短路及燃烧起火爆炸等危险，从而线路起到很好的防护及保护作用。
当所述半固化高频材料层为LDK高频功能胶与抗铜离子迁移胶的混合物时，只要将LDK高频功能胶与抗铜离子迁移胶混合即可，使得半固化高频材料层同时具有高速传输高频信号与抗铜离子迁移性能。
在所述步骤(3.1)中，在玻纤布一表面上具有一固化功能材料膜，在另一表面上具有一半固化功能材料膜。其中，该固化功能材料膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种。该固化功能材料膜除了可以为常规的PI薄膜与AD胶外，还可以为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、LDK高频功能胶与抗铜离子迁移胶中的任意一种，由上述可知，不同种类的固化功能材料膜具有了相对应的不同功能，由此赋予了固化功能材料膜更多功能。具体的，采用MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜与LDK高频功能胶作为固化功能材料膜，可以使固化功能材料膜具有高频特性，可高速传输高频信号；而采用抗铜离子迁移薄膜与抗铜离子迁移胶作为固化功能材料膜，可以使固化功能材料膜具有抗铜离子迁移的特性，对线路起到很好的防护及保护作用。同时，该半固化功能材料膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种。该半固化功能材料膜除了可以为常规的PI薄膜与AD胶外，还可以为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、LDK高频功能胶与抗铜离子迁移胶中的任意一种，由上述可知，不同种类的半固化功能材料膜具有了相对应的不同功能，由此 赋予了半固化功能材料膜更多功能。具体的，采用MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜与LDK高频功能胶作为半固化功能材料膜，可以使半固化功能材料膜具有高频特性，可高速传输高频信号；而采用抗铜离子迁移薄膜与抗铜离子迁移胶作为半固化功能材料膜，可以使半固化功能材料膜具有抗铜离子迁移的特性，对线路起到很好的防护及保护作用。
在所述步骤(2.2)中，所述半固化高频材料层与薄膜中至少有一者中添加有有色填充剂。具体的，有色填充剂可以为碳化物或其他有色填充剂。半固化高频材料层(具体可以为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物)与薄膜(具体可以为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种)中添加了有色填充剂之后，可呈现出相应的颜色，例如黑色、红色、绿色、蓝色、彩色等等。具有颜色的半固化高频材料层与薄膜对线路都具有遮挡作用，可防止内部线路暴露出来，防止外人从外部看到内部线路，起到隐蔽及保护线路板上线路的作用；同时，对于有杂质或瑕疵的线路板或线路，起到遮瑕的作用。
本发明实施例还提供了实施上述方法制作出的多层双面软硬结合板，如图1与图2所示，包括一双面FPC柔性板1、层叠于双面FPC柔性板1上表面的一上软质材料层结构2、层叠于上软质材料层结构2上表面的一上硬质材料层结构3、层叠于双面FPC柔性板1下表面的一下软质材料层结构4、及层叠于下软质材料层结构4下表面的一下硬质材料层结构5，其中，该双面FPC柔性板1包括一基膜11、设置于基膜11上表面的一第一上线路层12、及设置于基膜11下表面的一第一下线路层13；该上软质材料层结构2包括设置于第一上线路层12上表面的一上半固化高频材料层21、设置于上半固化高频材料层21上表面的一上薄膜22、及设置于上薄膜22上表面的一第二上线路层23；该下软质材料层结构4包括设置于第一下线路层13下表面的一下半固化高频材料层41、设置于下半固化高频材料层41下表面的一下薄膜42、及设置于下薄膜42下表面的一第二下线路层43；该上硬质材料层结构3包括设置于第二上线路层23上表面的一上半固化功能材料膜31、设置 于上半固化功能材料膜31上表面的一上玻纤布32、设置于上玻纤布32上表面的一上固化功能材料膜33、及设置于上固化功能材料膜33上的一第三上线路层34；该下硬质材料层结构5包括设置于第二下线路层43下表面的一下半固化功能材料膜51、设置于下半固化功能材料膜51下表面的一下玻纤布52、设置于下玻纤布52下表面的一下固化功能材料膜53、及设置于下固化功能材料膜53上的一第三下线路层54。
如图1与图2所示，在双面FPC柔性板1上表面层叠上一上软质材料层结构2与上硬质材料层结构3，在双面FPC柔性板1下表面层叠上一下软质材料层结构4与下硬质材料层结构5，形成六层双面软硬结合板。当然，还可以只在双面FPC柔性板1上表面与下表面中的一个表面上层叠软质材料层结构，如图3与图4所示，在双面FPC柔性板1上表面上层叠软质材料层结构，而在双面FPC柔性板下表面没有层叠软质材料层结构，形成五层双面软硬结合板。
在本实施例中，所述基膜11为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种，所述上薄膜22为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种，所述下薄膜42为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种。采用PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种作为双面FPC柔性板1、上软质材料层结构2与下软质材料层结构4上成型线路的基材(基膜11、上薄膜22与下薄膜42)，都特别适合，特别是MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜，不但可以提高双面FPC柔性板1、上软质材料层结构2与下软质材料层结构4及最终产品软硬结合板的整体性能，还具有高频特性，可大幅加快高频信号的传输，实现高频信号的高速传输，特别适用于新型5G科技产品。
在本实施例中，所述上半固化高频材料层21为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物，所述下半固化高频材料层41为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物。由上述可知，MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜与LDK高频功能胶均可 加快信号传输频率与速度，传输高频信号，提高线路板信号传输性能，不但可以提高柔性线路板的整体性能，还具有高频特性，可大幅加快高频信号的传输，实现高频信号的高速传输，特别适用于新型5G科技产品。而LDK高频功能胶与抗铜离子迁移胶的混合物同时具有高速传输高频信号与抗铜离子迁移性能。
在本实施例中，所述上半固化功能材料膜31、上固化功能材料膜33、下半固化功能材料膜51与下固化功能材料膜53均为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种。上半固化功能材料膜31、上固化功能材料膜33、下半固化功能材料膜51与下固化功能材料膜53除了可以为常规的PI薄膜与AD胶外，还可以为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、LDK高频功能胶与抗铜离子迁移胶中的任意一种，由上述可知，不同种类的功能材料膜具有了相对应的不同功能，由此赋予了功能材料膜更多功能。具体的，采用MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜与LDK高频功能胶作为上述四种功能材料膜，可以使功能材料膜具有高频特性，可高速传输高频信号；而采用抗铜离子迁移薄膜与抗铜离子迁移胶作为上述四种功能材料膜，可以使功能材料膜具有抗铜离子迁移的特性，对线路起到很好的防护及保护作用。
所述上半固化高频材料层21与上薄膜22中至少有一者为有色层，所述下半固化高频材料层41与下薄膜42中至少有一者为有色层。有色层具体可以为黑色、红色、绿色、蓝色、彩色等等，有色层对内部线路起到遮挡、保护、遮瑕等作用。
如图5所示，在所述第三上线路层34上表面设置有一上防焊油墨层35，在所述第三下线路层54下表面设置有一下防焊油墨层55。上防焊油墨层35与下防焊油墨层55均为液态半固化油墨，颜色可以为黑色、白色或绿色，上防焊油墨层35与下防焊油墨层55可作为防焊线路保护层，并防止线路外露大气中被氧化及吸湿、腐蚀，对线路进行保护。本实施例上防焊油墨层35与下防焊油墨层55是印刷在线路的表面，然后曝光显影后高温150度，一个 小时固化成型。
本实施例多层双面软硬结合板，同时具备柔性线路板(软板)的特性与硬性线路板的特性，可以用于一些有特殊要求的产品之中，既有一定的挠性区域，也有一定的刚性区域，可节省产品内部空间，减少成品体积，提高产品性能，扩大应用领域。应用领域例如：移动电话、按键板与侧按键板、电脑与液晶荧幕、主板与显示屏、CD随身听、磁碟机、NOTEBOOK等等。
以上所述，仅是本发明的较佳实施例而已，并非对本发明的技术范围作任何限制，故采用与本发明上述实施例相同或近似的技术特征，而得到的其他结构，均在本发明的保护范围之内。

Claims (14)

  1. 一种多层双面软硬结合板的制作方法，其特征在于，包括以下步骤：
    (1)制作双面FPC柔性板：在基膜上下表面分别敷上一铜层，并在铜层上成型线路，获得双面FPC柔性板；
    (2)制作至少一组软质材料层结构
    (2.1)在薄膜一表面上敷上一铜层，形成单面板；
    (2.2)在单面板的薄膜另一表面敷上一半固化高频材料层，获得至少一组软质材料层结构；
    (3)制作至少两组硬质材料层结构
    (3.1)在双面带功能材料膜的玻纤布一表面上敷上一铜层；
    (3.2)重复步骤(3.1)，制作出至少两组硬质材料层结构；
    (4)热压成型
    (4.1)在双面FPC柔性板上表面和/或下表面的线路上热压上至少一组软质材料层结构，热压后，软质材料层结构上的半固化高频材料层与双面FPC柔性板上的线路结合于一体；
    (4.2)在热压后的软质材料层结构的铜层上成型线路；
    (4.3)在双面FPC柔性板的基膜上下方最外层线路上分别热压上至少一组硬质材料层结构；
    (4.4)在热压后的硬质材料层结构的铜层上成型线路；
    (4.5)在硬质材料层结构的线路上成型一层防焊油墨层，获得多层双面柔性线路板；
    其中，步骤(1)、步骤(2)与步骤(3)没有先后顺序。
  2. 根据权利要求1所述的多层双面软硬结合板的制作方法，其特征在于，在所述步骤(4.1)中，在热压时，首先，将热压温度从50℃-100℃逐渐升高至380℃-400℃，用时80min-120min；然后，维持380℃-400℃的热压温度60min-90min；最后，将热压温度从380℃-400℃逐渐降温至50℃-100℃，用时30-60min；在整个过程中，热压压力为400psi-500psi；在所述步骤(4.3) 中，在热压时，首先，将热压温度从50℃-100℃逐渐升高至400℃-600℃，用时80min-120min；然后，维持400℃-600℃的热压温度60min-90min；最后，将热压温度从400℃-600℃逐渐降温至50℃-100℃，用时30-60min；在整个过程中，热压压力为400psi-600psi。
  3. 根据权利要求1所述的多层双面软硬结合板的制作方法，其特征在于，所述步骤(2.2)具体包括以下步骤：
    (2.2.1)将单面板放到涂布机上，在单面板的薄膜上涂覆上一层合成液态高频材料层；
    (2.2.2)将涂覆有合成液态高频材料层的单面板送至隧道烤炉内，并以0.5-20m/s的速度依次经过隧道烤炉内的一段加热烘烤区、二段加热烘烤区、三段加热烘烤区、四段加热烘烤区、五段加热烘烤区与六段加热烘烤区进行分段烘烤，单面板上的合成液态高频材料层变为半固化高频材料层；其中，一段加热烘烤区的温度范围为60℃-100℃，二段加热烘烤区的温度范围为100℃-200℃，三段加热烘烤区的温度范围为200℃-300℃，四段加热烘烤区的温度范围为300℃-400℃，五段加热烘烤区的温度范围为400℃-500℃，六段加热烘烤区的温度范围为60℃-100℃，且每段加热烘烤区的长度均为2-6m。
  4. 根据权利要求1所述的多层双面软硬结合板的制作方法，其特征在于，在所述步骤(1)中，所述基膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种；在所述步骤(2.1)中，所述薄膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种。
  5. 根据权利要求1所述的多层双面软硬结合板的制作方法，其特征在于，在所述步骤(2.2)中，所述半固化高频材料层为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物。
  6. 根据权利要求5所述的多层双面软硬结合板的制作方法，其特征在于，所述LDK高频功能胶通过在AD胶中添加铁弗龙或LCP材料获得，所述抗铜离子迁移胶通过在AD胶中添加铜离子捕捉剂，然后再高度提纯获得。
  7. 根据权利要求1所述的多层双面软硬结合板的制作方法，其特征在于，在所述步骤(3.1)中，在玻纤布一表面上具有一固化功能材料膜，在另一表面上具有一半固化功能材料膜，该固化功能材料膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种，该半固化功能材料膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种。
  8. 根据权利要求1所述的多层双面软硬结合板的制作方法，其特征在于，在所述步骤(2.2)中，所述半固化高频材料层与薄膜中至少有一者中添加有有色填充剂。
  9. 实施权利要求1至8中任一所述方法制作出的多层双面软硬结合板，其特征在于，包括一双面FPC柔性板、层叠于双面FPC柔性板上表面的一上软质材料层结构、层叠于上软质材料层结构上表面的一上硬质材料层结构、层叠于双面FPC柔性板下表面的一下软质材料层结构、及层叠于下软质材料层结构下表面的一下硬质材料层结构，其中，该双面FPC柔性板包括一基膜、设置于基膜上表面的一第一上线路层、及设置于基膜下表面的一第一下线路层；该上软质材料层结构包括设置于第一上线路层上表面的一上半固化高频材料层、设置于上半固化高频材料层上表面的一上薄膜、及设置于上薄膜上表面的一第二上线路层；该下软质材料层结构包括设置于第一下线路层下表面的一下半固化高频材料层、设置于下半固化高频材料层下表面的一下薄膜、及设置于下薄膜下表面的一第二下线路层；该上硬质材料层结构包括设置于第二上线路层上表面的一上半固化功能材料膜、设置于上半固化功能材料膜上表面的一上玻纤布、设置于上玻纤布上表面的一上固化功能材料膜、及设置于上固化功能材料膜上的一第三上线路层；该下硬质材料层结构包括设置于第二下线路层下表面的一下半固化功能材料膜、设置于下半固化功能材料膜下表面的一下玻纤布、设置于下玻纤布下表面的一下固化功能材料膜、及设置于下固化功能材料膜上的一第三下线路层。
  10. 根据权利要求9所述的多层双面软硬结合板，其特征在于，所述基膜 为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种，所述上薄膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种，所述下薄膜为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜与PTFE薄膜中的任意一种。
  11. 根据权利要求9所述的多层双面软硬结合板，其特征在于，所述上半固化高频材料层为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物，所述下半固化高频材料层为MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、LDK高频功能胶、或LDK高频功能胶与抗铜离子迁移胶的混合物。
  12. 根据权利要求9所述的多层双面软硬结合板，其特征在于，所述上半固化功能材料膜、上固化功能材料膜、下半固化功能材料膜与下固化功能材料膜均为PI薄膜、MPI薄膜、LCP薄膜、TFP薄膜、PTFE薄膜、抗铜离子迁移薄膜、AD胶、LDK高频功能胶与抗铜离子迁移胶中的任意一种。
  13. 根据权利要求9所述的多层双面软硬结合板，其特征在于，所述上半固化高频材料层与上薄膜中至少有一者为有色层，所述下半固化高频材料层与下薄膜中至少有一者为有色层。
  14. 根据权利要求9所述的多层双面软硬结合板，其特征在于，在所述第三上线路层上表面设置有一上防焊油墨层，在所述第三下线路层下表面设置有一下防焊油墨层。
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