WO2021035672A1 - 成像装置及非移动终端 - Google Patents

成像装置及非移动终端 Download PDF

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Publication number
WO2021035672A1
WO2021035672A1 PCT/CN2019/103610 CN2019103610W WO2021035672A1 WO 2021035672 A1 WO2021035672 A1 WO 2021035672A1 CN 2019103610 W CN2019103610 W CN 2019103610W WO 2021035672 A1 WO2021035672 A1 WO 2021035672A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
imaging device
camera
housing
connection area
Prior art date
Application number
PCT/CN2019/103610
Other languages
English (en)
French (fr)
Inventor
阎小霞
曾媛媛
Original Assignee
深圳市汇顶科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市汇顶科技股份有限公司 filed Critical 深圳市汇顶科技股份有限公司
Priority to CN201980004349.3A priority Critical patent/CN111742542B/zh
Priority to PCT/CN2019/103610 priority patent/WO2021035672A1/zh
Priority to CN202020225825.4U priority patent/CN211209787U/zh
Publication of WO2021035672A1 publication Critical patent/WO2021035672A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/51—Housings
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Definitions

  • This application relates to the technical field of imaging devices, and in particular to an imaging device and a non-mobile terminal.
  • the imaging device has been used in fields such as mobile phones, tablets, smart homes, and the Internet of Things.
  • the imaging device can be used to identify user information.
  • the imaging device includes components such as a housing and a camera, and the drive chip of each component is located in the inner cavity of the housing.
  • the imaging device includes a plurality of components, more drive chips are required.
  • the purpose of this application is to provide an imaging device and a non-mobile terminal, which can save a circuit board, thereby simplifying the circuit and its layout, and saving installation space inside the housing .
  • An embodiment of the application provides an imaging device, which includes:
  • a first camera where the first camera is installed on the housing and used to collect information
  • a lighting component the lighting component is mounted on the housing
  • the first circuit board is mounted on the housing
  • the first camera and the lighting component are both connected to the first circuit board.
  • the first camera includes a first chip, and the first chip is used to collect information
  • the first chip is arranged on the first circuit board, and the lighting component is driven by the first chip.
  • the imaging device further includes a main circuit board, and the main circuit board is installed in the housing;
  • the first circuit board is connected to the main circuit board.
  • the first circuit board includes a first connection area, a second connection area, and a third connection area;
  • the first connection area is connected to the lighting component, the second connection area is connected to the first camera, and the third connection area is connected to the main circuit board;
  • the third connection area extends from the second connection area.
  • the first connection area and the second connection area have a height difference, and the first connection area and the second connection area are connected by a bending area ;
  • the first connection area is perpendicular to the bending area
  • the second connection area is perpendicular to the bending area.
  • the imaging device further includes a dot matrix projector and a second circuit board;
  • the dot matrix projector is installed on the housing, and the dot matrix projector is connected to the main circuit board through the second circuit board;
  • the dot matrix projector has a second chip, and the second chip is arranged on the main circuit board and used to drive the dot matrix projector.
  • the imaging device further includes a distance sensor and a third circuit board;
  • the distance sensor is installed on the housing, and the distance sensor is connected to the main circuit board through the third circuit board.
  • the imaging device further includes a second camera and a fourth circuit board;
  • the second camera is installed on the housing, and the second camera is connected to the fourth circuit board;
  • the fourth circuit board is connected to the main circuit board, or the fourth circuit board is connected to an external circuit of the imaging device.
  • the lighting component is a flood lighting component.
  • the floodlighting component can emit light
  • the second camera can receive the light emitted by the floodlighting component
  • the dot matrix projector can emit light, and the first camera can receive the light emitted by the dot matrix projector;
  • the dot matrix projector and the flood lighting component work alternately.
  • the second camera, the distance sensor, and the lighting component are located between the first camera and the dot matrix projector.
  • the first camera has a first centerline
  • the dot matrix projector has a second centerline
  • the distance D between the first centerline and the second centerline is 25mm-50mm.
  • a reinforcing plate is connected to the connector; and/or,
  • a reinforcing plate is arranged between the first camera and the first circuit board, a reinforcing plate is arranged between the lighting component and the first circuit board, and the dot matrix projector is connected to the second circuit board.
  • a reinforcing plate is arranged between the circuit boards, a reinforcing plate is arranged between the distance sensor and the third circuit board, and a reinforcing plate is arranged between the second camera and the fourth circuit board.
  • the imaging device further includes a heat dissipation portion, and the heat dissipation portion is located in an inner cavity of the housing.
  • the imaging device further includes a buffer part, and the buffer part is located between the housing and the main circuit board.
  • the housing includes a main body and a bottom plate, and the main body is fixedly connected to the bottom plate;
  • the main body part is provided with a plurality of mounting holes, and the first camera, the lighting component, the dot matrix projector, the distance sensor and the second camera are mounted on the corresponding mounting holes.
  • the housing further includes a shading plate, and the shading plate is arranged outside the main body.
  • an embodiment of the present application also provides a non-mobile terminal, including a mounting bracket and an imaging device, the imaging device is fixed to the mounting bracket, and the imaging device is the above-mentioned imaging device.
  • the housing of the imaging device is provided with a connecting hole, and the connecting hole is used to install the imaging device on the mounting bracket.
  • the imaging device since the lighting component does not require a complicated driving chip, and the first camera and the lighting component in the imaging device are connected to the same circuit board (first circuit board), the imaging device in the present application can save circuits Board, thereby simplifying the circuit and its layout, and saving installation space inside the housing, and at the same time, the imaging device can also save costs.
  • FIG. 1 is a schematic structural diagram of an imaging device provided by this application in a specific embodiment
  • FIG. 2 is a schematic diagram of another view of the structure of the imaging device shown in FIG. 1;
  • Figure 3 is an exploded view of the imaging device shown in Figure 1;
  • Fig. 4 is an exploded view of the imaging device in Fig. 1 from another perspective;
  • FIG. 5 is a top view of the imaging device in FIG. 1 with a fourth circuit board and an external circuit board removed;
  • FIG. 6 is a schematic structural diagram of the imaging device in FIG. 1 with the housing removed;
  • FIG. 7 is a schematic structural diagram of the device shown in FIG. 6 from another perspective
  • Figure 8 is a front view of the device shown in Figure 6;
  • FIG. 9 is a schematic structural diagram of the connection of the first camera and the lighting component in the device shown in FIG.
  • FIG. 10 is a schematic structural diagram of the connection between the dot matrix projector and the second circuit board in the device shown in FIG. 6;
  • FIG. 11 is a schematic diagram of the structure of the connection between the distance sensor and the third circuit board in the device shown in FIG.
  • Figure 12 is a bottom view of the device shown in Figure 5;
  • Figure 13 is a cross-sectional view taken along the line A-A of Figure 12;
  • Figure 14 is a cross-sectional view taken along line B-B of Figure 12;
  • FIG. 15 is a schematic diagram of the structure of the housing in the imaging device shown in FIG. 1;
  • FIG. 16 is a schematic diagram of the structure of the main body part of the housing shown in FIG. 15;
  • Figure 17 is a top view of the main body of the housing shown in Figure 16;
  • FIG. 18 is a schematic diagram of the structure of the bottom plate in the housing shown in FIG. 15.
  • Figure 1 is a schematic structural diagram of the imaging device provided by this application in a specific embodiment
  • Figure 2 is a schematic structural diagram from another perspective of Figure 1
  • Figure 3 is an exploded view of Figure 1 Figure
  • Figure 4 is an exploded view of the imaging device in Figure 1 from another perspective
  • Figure 5 is a top view of the imaging device in Figure 1 with the fourth circuit board and external circuit board removed
  • Figure 6 is the imaging device in Figure 1 with the shell removed
  • Fig. 7 is a schematic structural diagram from another perspective of Fig. 6
  • Fig. 8 is a front view of Fig. 6
  • Fig. 9 is a schematic structural diagram of the connection between the first camera and the lighting component in Fig. 6
  • FIG. 10 is a schematic diagram of the connection between the first camera and the lighting component in Fig. 6
  • Figure 11 is a schematic diagram showing the connection between the distance sensor and the third circuit board in Figure 6
  • Figure 12 is a bottom view of Figure 5
  • Figure 13 is a cross-sectional view taken along the line AA in Figure 12
  • Figure 12 is a cross-sectional view taken along the line BB in FIG. 12
  • FIG. 15 is a schematic structural diagram of the housing in FIG. 1
  • FIG. 16 is a schematic structural diagram of the main body in FIG. 15
  • FIG. 17 is a plan view of FIG. 16; The structure diagram.
  • the embodiment of the present application provides an imaging device, which is particularly suitable for use in non-mobile terminals, where the non-mobile terminal is not a terminal that cannot be moved at all, but a terminal that does not need to be moved during use, such as door locks, access control,
  • the imaging device is relatively fixedly installed in a certain place, and the imaging target may be anyone, and mobile terminals such as mobile phones only image the mobile phone users themselves most of the time.
  • the imaging device is fixedly installed at a certain position, the distance from the ground is basically fixed. The difference from the mobile terminal installation includes that the entire imaging device cannot be raised or lowered to adjust the imaging field of view during imaging.
  • the imaging device installed can be moved to a suitable height and horizontal distance by the user during use to obtain the desired imaging area or range. Therefore, the imaging device in this type of mobile terminal
  • the design considerations for the angle of view are different from the requirements for the angle of view of an imaging device installed in a fixed position.
  • the imaging device includes a housing 1 with an inner cavity 14, and the housing 1 is used to place or install electronic devices such as circuit boards.
  • the imaging device also includes a first camera 2, a lighting component 3, and a first circuit board 21.
  • the first camera 2 is mounted on the housing 1 and used for collecting information
  • the lighting component 3 is mounted on the housing 1 and used To provide supplementary light.
  • the first circuit board 21 is located in the inner cavity 14 of the housing 1, and the above-mentioned first camera 2 and the lighting component 3 are both connected to the first circuit board 21.
  • the first camera 2 and the lighting component 3 in the imaging device are connected to the same circuit board (first circuit board 21), that is, the first The camera 2 is driven by the first circuit board 21, and the lighting component 3 is powered by the first circuit board 21. Therefore, compared with the prior art, the lighting component 3 and the first camera 2 are respectively connected to two independent circuit boards.
  • the imaging device can save the circuit board, thereby simplifying the circuit and its layout, and saving the installation space inside the housing 1.
  • the first circuit board 21 has a first chip
  • the first camera 2 includes a first chip
  • the lighting component 3 is driven by the first chip.
  • the data acquisition chip of the first camera 2 and the driving chip of the lighting component 3 are the first chips arranged or integrated on the first circuit board 21, thereby simplifying the circuit layout of the first circuit board 21.
  • the data acquisition circuit of the first camera and the driving circuit of the lighting component 3 are integrated in the first chip.
  • the imaging device also includes a main circuit board 7, which is installed in the inner cavity 14 of the casing 1, and the main circuit board 7 is also connected to an external circuit board 9, which extends out of the casing 1.
  • the inner cavity 14 is used to connect with the external control device of the imaging device, so as to realize the communication between the main circuit board 7 and the external control device through the external circuit board 9.
  • the main circuit board 7 is provided with a plurality of electronic devices 12, and the electronic devices 12 may include capacitors, resistors, and the like.
  • the main circuit board is a relatively rigid PCB board, and the external circuit board 9 may be a flexible circuit board.
  • the external control device may be the main control device of the terminal device.
  • the above-mentioned first circuit board 21 is connected to the main circuit board 7 so as to realize data transmission and communication between the first camera 2 and the main circuit board 7.
  • the first circuit board 21 and the main circuit board 7 are connected through a first connector 22.
  • the first connector 22 includes a first male connector 221 and a first female connector 222.
  • the first male connector One of the connector 221 and the first female connector 222 is connected to the main circuit board 7, the other is connected to the first circuit board 21, and the first male connector 221 and the first female connector 222 are plugged into each other, thereby The communication between the first circuit board 21 and the main circuit board 7 is realized.
  • the first circuit board 21 includes a first connection area 211, a second connection area 212, a third connection area 213, and a bending area 214.
  • the first connection area 211 is used to connect to the lighting component 3
  • the lighting component 3 is arranged in the area where the first connection area 211 is located
  • the second connection area 212 is used to connect with the first camera 2, or it can be said that the first camera 2 is arranged in the area where the second connection area 212 is located
  • the third connection area 213 extends from the second connection area 212 and extends below the main circuit board 7.
  • the first male connector 212 is provided in the third connection area 213 and is used to connect to the main circuit board 7, thereby The first camera 2, the lighting component 3 and the main circuit board 7 are connected through the first circuit board 21. At the same time, since the bottom of the lighting component 3 and the base of the first camera 2 have a distance in the height direction Z, the above-mentioned first connection area 212 and the second connection area 213 have a distance in the height direction Z. It is connected by the bending area 214.
  • the housing 1 is provided with mounting holes, and the first camera 2 and the lighting component 3 are mounted in the corresponding mounting holes, and along the height direction Z, each The mounting holes are flush. Therefore, the position where the first camera 2 and the lighting component 3 are connected to the housing 1 needs to be flush, and the dimensions of the first camera 2 and the lighting component 3 in the height direction Z are different. Therefore, in order to achieve the first The position where the camera 2 and the lighting component 3 are connected to the housing 1 is level, and the connection area between the two and the first circuit board 21 has a height difference in the height direction Z, that is, in the first circuit board 21, the first connection area 211 and the second The second connection area 212 has a height difference along the height direction Z. Based on this, the two need to be connected by the bending area 213, so as to realize the connection between the first connection area 211 and the second connection area 212 while ensuring that the two have a predetermined Set the height difference.
  • the first connection area 211 and the second connection area 212 are both perpendicular to the height direction Z (maintain Horizontal), meanwhile, the bending area 213 is parallel to the height direction Z, that is, the first connecting area 211 is perpendicular to the bending area 213, and the second connecting area 212 is perpendicular to the bending area 213.
  • the first connection area 211 is approximately perpendicular to the bending area 213, and the second connection area 212 is approximately perpendicular to the bending area 213, as long as the installation positions of the first camera 2 and the lighting component 3 and the housing 1 can be realized. Just flush.
  • the imaging device further includes a dot matrix projector 4 and a second circuit board 41, wherein the dot matrix projector 4 is installed in the housing 1, and the second circuit board 41 is located in the housing. In the cavity 14 of 1, the dot matrix projector 4 is connected to the second circuit board 41.
  • the dot matrix projector 4 is the transmitting end, and the first camera 2 is the receiving end.
  • the above-mentioned lighting component 3 may be a flood lighting component that can emit infrared flood light and illuminate the imaging target.
  • the flood lighting component As a high-brightness diffused light source, it can be understood that the lighting component herein may be a light-emitting component that emits uniform infrared light.
  • the dot-matrix projector 4 can emit speckle light signals, and the dot-matrix projector 4 and the floodlighting component work alternately, and they share the same sensor.
  • the first camera 2 (which may be an infrared light image sensor) can target the imaging target
  • the reflected flood light or speckle light signal is used for detection and imaging.
  • the second circuit board 41 is connected to the main circuit board 7 through a second connector 42, which includes a second male connector 421 and a second female connector 422, the second male connector One of the 421 and the second female connector 422 is connected to the main circuit board 7, the other is connected to the second circuit board 41, and the second male connector 421 and the second female connector 422 are plugged into each other to realize Communication between the second circuit board 41 and the main circuit board 7.
  • a second connector 42 which includes a second male connector 421 and a second female connector 422, the second male connector One of the 421 and the second female connector 422 is connected to the main circuit board 7, the other is connected to the second circuit board 41, and the second male connector 421 and the second female connector 422 are plugged into each other to realize Communication between the second circuit board 41 and the main circuit board 7.
  • the second circuit board 41 includes a fourth connection area 411 and a fifth connection area 412, wherein the fourth connection area 411 is located above the main circuit board 7 and is connected to the dot matrix projector 4
  • the fifth connection area 412 extends downward to below the main circuit board 7, and the second male connector 421 is disposed in the fifth connection area 412, so that the fifth connection area 412 is connected to the main circuit board 7.
  • the dot matrix projector 4 is connected to a second chip, the second chip is used to drive the dot matrix projector 4, and the second chip is soldered to the main circuit board 7.
  • the imaging device further includes a distance sensor 5 and a third circuit board 51.
  • the distance sensor 5 is used to detect the distance, and the distance sensor 5 is installed in the housing 1, and the distance sensor 5
  • the third circuit board 51 is connected to the main circuit board 7, and the third circuit board 51 and the main circuit board 7 are connected through a third connector 52.
  • the third connector 52 includes a third male connector 521 and a third male connector 521.
  • the third circuit board 51 includes a sixth connection area 511 and a seventh connection area 512.
  • the sixth connection area 511 is located above the main circuit board 7 and is connected to the distance sensor 5.
  • the connection area 512 extends downward to below the main circuit board 7, and the third male connector 521 is disposed in the seventh connection area 512, so that the seventh connection area 512 is connected to the main circuit board 7.
  • the imaging device may include the aforementioned dot matrix transmitter 4, the first camera 2, the distance sensor 5, and the lighting component 3.
  • the dot matrix projector 4 of the imaging device serves as the transmitting end, and the first The camera 2 is the receiving end, and the two cooperate to obtain the user's information; the distance sensor 5 is used to obtain the user's distance information; the lighting component 3 is used to provide supplementary light for the imaging device, or the floodlight 3 can be combined with the first The camera 2 cooperates to complete imaging in certain scenes, such as at night, to obtain a 2D image of the user's face through the cooperation of the two.
  • the lighting component 3 may be an infrared light emitter to emit infrared flood light.
  • the imaging device can collect and image user information.
  • the first camera 2 may be an infrared camera, and the infrared camera can be used for 3D imaging, so that the imaging device can recognize 3D images.
  • the dot matrix transmitter 4, the first camera 2, the distance sensor 5 and the lighting component 3 are all connected to the main circuit board 7.
  • the imaging device may further include a second camera 6 and a fourth circuit board 61, the second camera 6 is mounted on the housing 1, the second camera 6 and the fourth circuit board 61
  • the second camera 6 is a visible light camera, and the visible light camera is used for 2D imaging. Therefore, when the imaging device includes the second camera 6, it can be used not only for 3D imaging, but also for 2D imaging.
  • the second camera 6 can be powered by the main circuit board 7, that is, the fourth circuit board 61 is connected to the main circuit board 7, or the second camera 6 can also be powered by the external power supply of the imaging device, that is, the fourth The circuit board 61 is electrically connected to an external power source.
  • the fourth circuit board 61 of the second camera 6 extends out of the inner cavity 14 of the housing 1 and is electrically connected to an external power source. At this time, the second camera 6 does not need to be connected to the main circuit board. 7 is connected, so that the installation space of the main circuit board 7 is not occupied, and the circuit layout of the main circuit board 7 does not need to be changed.
  • the first circuit board 21, the second circuit board 41, the third circuit board 51, and the external circuit board 9 may all be flexible circuit boards, and the main circuit board 7 may be a printed circuit board.
  • the circuit board can be made of rigid material.
  • the imaging device integrates the functions of 2D imaging and 3D imaging, thereby improving the user experience of the imaging device and increasing the accuracy of recognition, and the 3D recognition is not limited to the front of the human face. Applicable to all angles, even if the user's face is covered by hair or the user's posture changes, it can still be accurately identified.
  • the second camera 61, the distance sensor 5, and the lighting component 3 are located between the first camera 2 and the dot projector 4, that is, the transmitting end of the imaging device (dot projector 4)
  • the receiving end (the first camera 2) is located at both ends of the above five components.
  • the positions of the second camera 61, the distance sensor 5 and the lighting component 3 can be exchanged.
  • the lighting component 3 and the first The camera 2 is connected to the same circuit board. Therefore, when the lighting component 3 is close to the first camera 2, the area of the first circuit board 21 can be reduced.
  • the arrangement direction of the above five components is defined as the length direction X of the imaging device.
  • the first camera 2 has a first centerline
  • the dot matrix projector 4 has a second centerline.
  • the distance D between the first centerline and the second centerline is 25mm-50mm.
  • the dot matrix projector 4 and the first camera 2 are optical elements, and the light emitted by the dot matrix projector 4 gradually spreads outward in the direction away from the dot matrix projector 4, and the light received by the first camera 2 is along the distance away from the first camera.
  • the direction of a camera 2 gradually spreads outward. In order to ensure that the first camera 2 can receive light, the light emitted by the dot matrix projector 4 and the received light of the first camera 2 must overlap.
  • the overall length of the imaging device is larger, and it occupies a larger space, which is not conducive to weight reduction and miniaturization.
  • the distance between the first centerline and the second centerline can be set reasonably in consideration of the above two factors.
  • the distance between the first centerline and the second centerline of the imaging device can be 25mm-50mm, it can ensure that the imaging device has a higher resolution and recognition range, and can also avoid The distance between the center line and the second center line is too large, resulting in an excessively large overall size of the imaging device. Therefore, the imaging device has the advantages of resolution draft, large recognition range, and small size.
  • the distance D between the first center line and the second center line may be 35 mm, 40 mm, 45 mm, or the like.
  • the imaging device further includes a reinforcing plate 8, wherein, as shown in FIG. 9, a reinforcing plate 8 is provided between the second connection area 212 of the first circuit board 21 and the first camera 2, and /Or, a reinforcing plate 8 is provided on the side of the second connection area 212 away from the first camera 21; a reinforcing plate 8 is provided between the first connection area 211 of the first circuit board 21 and the lighting component 3, and/or ,
  • the first connection area 211 is provided with a reinforcement plate 8 on the side away from the lighting component 3;
  • the third connection area 213 of the first circuit board 21 is provided with a reinforcement plate 8, and the reinforcement plate 8 is provided far away from the first circuit board.
  • One end of the connector 22 (for example, the first male connector 221), so that the first circuit board 21, the first camera 2, the lighting component 3, and the first connector 22 are reinforced by a plurality of reinforcing plates 8.
  • a reinforcing plate 8 is provided between the fourth connection area 411 of the second circuit board 41 and the dot matrix projector 4, and/or, one end of the fourth connection area 411 away from the dot matrix projector 4 A reinforcement plate 8 is provided; the fifth connection area 412 of the second circuit board 41 is provided with a reinforcement plate 8, and the reinforcement plate 8 is provided in the fifth connection area 412 away from the second connector 22 (for example, the second male One end of the connector 421), so that the second circuit board 41, the dot matrix projector 4, and the second connector 42 are reinforced by a plurality of reinforcing plates 8.
  • a reinforcing plate 8 is provided between the sixth connection area 511 of the third circuit board 51 and the distance sensor 5, and/or, the end of the sixth connection area 511 away from the distance sensor 5 is provided with a reinforcement plate.
  • the imaging device further includes a heat dissipation portion 71 for conducting heat generated in the inner cavity 14 of the casing 1 to the outside of the casing 1.
  • the first camera 2, the lighting component 3, the dot projector 4, the distance sensor 5, and the second camera 6 are all connected with a first heat dissipation unit, specifically, a first heat dissipation unit disposed at the bottom of the first camera 2
  • the portion 23 is taken as an example.
  • the first heat dissipation portion 23 can be made of copper foil, graphite, heat dissipation silicon wafer, etc., and the first heat dissipation portion 23 is in contact with the housing 1 to achieve heat dissipation.
  • a second heat dissipation portion 71 is provided between the bottom of the main circuit board 7 and the bottom of the housing 1, that is, a second heat sink 71 is provided at positions corresponding to the first connector 22, the second connector 42, and the third connector 52.
  • the heat dissipation portion 71 is provided with a second heat dissipation portion 71 at a position corresponding to each chip of the main circuit board 7.
  • the imaging device further includes a buffer portion 135, which is disposed between the main circuit board 7 and the bottom (bottom plate 13) of the housing 1, and is used to buffer the stress of various components of the imaging device.
  • 135 can be made of cushion foam and other materials.
  • the housing 1 includes a main body 11 and a bottom plate 13, wherein the main body 11 and the bottom plate 13 are connected by a connecting piece 15, which may be a bolt or the like After the main body 11 is connected to the bottom plate 13, it encloses the inner cavity 14 of the housing 1.
  • the main body 11 includes a supporting plate 111 and a side plate 112.
  • the supporting plate 111 is disposed opposite to the bottom plate 13, and the supporting plate 111 is provided with a first mounting hole 111a and a second mounting hole 111a.
  • the first camera 2 is installed in the first mounting hole 111a, and the base of the first camera 2 is fixedly installed in the first mounting hole 111a, the lens barrel extends out of the housing 1, and the base is connected to the first mounting hole 111a.
  • the hole 111a is adapted to be larger than the size of the lens barrel;
  • the above-mentioned lighting component 3 is installed in the second mounting hole 111b, and the second mounting hole 111b is adapted to the base of the lighting component 3, and the base of the lighting component 3 is fixedly mounted on the second mounting hole 111b.
  • Two mounting holes 111b, and the light-filling part extends out of the housing 1.
  • the size of the illuminating part is smaller than the size of the base part; the dot matrix projector 4 is installed in the third mounting hole 111c, the base of the dot matrix projector 4 It is fixedly installed in the third installation hole 111c, and the emitting part extends out of the housing 1.
  • the third installation hole 111c is matched with the base of the dot matrix projector 4; the distance sensor 5 is installed in the fourth installation hole 111d, The base of the distance sensor 5 is fixedly installed in the fourth mounting hole 111d, and the sensor part protrudes out of the housing 1.
  • the base is matched with the fourth mounting hole 111d; the second camera 6 is installed in the fifth mounting hole 111f.
  • the base of the second camera 6 is fixedly mounted on the fifth mounting hole 111f, the lens barrel protrudes out of the housing 1, and the base is matched with the fifth mounting hole 111f.
  • the mounting of each component can be realized.
  • the second mounting hole 111b, the fourth mounting hole 111d, and the fifth mounting hole 111f are located in the first
  • the distance D between the mounting hole 111a and the third mounting hole 111c, and the center of the first mounting hole 111a and the center of the third mounting hole 111c along the length direction X is 25mm-50mm.
  • the housing 1 also includes a light-shielding plate 12 that covers the outside of the support plate 111 of the main body 11 and is fixedly connected to the main body 11.
  • the light-shielding plate 12 is provided with a plurality of through holes 121, the above-mentioned five The component protrudes out of the housing 1 through the through hole 121.
  • the light-shielding plate 12 is made of light-shielding material, which is used to prevent external light from entering and play a role in protecting various optical elements.
  • the main body portion 11 further includes a side plate 112 connected to the outer periphery of the supporting plate 111, and the bottom plate 13 is fixed to the side plate 112 so as to form a shell by the bottom plate 13, the supporting plate 111 and the side plate 112.
  • the side of the housing 1 is provided with a first through hole 16 and a second through hole 17, wherein the first through hole 16 is located on the side of the second through hole 17 close to the support plate 111, and the first through hole 16 is used for
  • the fourth circuit board 62 protrudes from the inner cavity 14 of the housing 1, and the second through hole 17 is used to connect the circuit board 9 to protrude from the inner cavity 14 of the housing 1.
  • the side plate 112 is provided with a third notch 112c and a fourth notch 112d
  • the bottom plate 13 has a third flange 134 extending toward the main body portion 11, wherein the side plate 112 is fixedly connected to the bottom plate 13
  • the third notch 112c and the third flange 134 of the bottom plate 13 enclose the second through hole 17, and the fourth notch 112d and the bottom plate 13 enclose the first through hole 16.
  • the bottom plate 13 has a first flange 132, a second flange 133, and a third flange 134 extending in the direction of the main body portion 11.
  • the side plate 112 is correspondingly opened There are a first notch 112a and a second notch 112b.
  • the first flange 132 is located in the first notch 112a, and the two fit together, and the second flange 133 is located in the second There is a gap 112b, and the two are compatible.
  • the bottom plate 13 is provided with a first connecting hole 131, and the first connecting hole 131 is used to be fixedly connected with the main body 11 through a connecting piece 15.
  • the first connecting hole 131 may be a thread hole.
  • the main body portion 11 further includes a mounting portion 113 which is provided with a second connecting hole 113a, and the second connecting hole 113a is used to connect the imaging device with a non-mobile terminal.
  • the second connecting hole 113a may be a threaded hole, so that the imaging device can be threadedly connected to a non-mobile terminal.
  • the mounting portion 113 is provided with three second connecting holes 113a, and the three second connecting holes 113a are distributed in a triangle shape, thereby improving the connection between the imaging device and the non-mobile terminal. reliability.
  • the imaging device when the imaging device is connected to a non-mobile terminal, only the main body 11 is connected to the non-mobile device, and the bottom plate 13 is not connected to the non-mobile device, thereby reducing accumulated assembly errors and improving installation accuracy.
  • the mounting portion 113 is a structure with a certain thickness along the height direction Z, thereby improving the strength and rigidity of the mounting portion 113 after the second connecting hole 113a is provided, and improving the reliability of the connection between the imaging device and the non-mobile terminal.
  • an embodiment of the present application also provides a non-mobile terminal, including a mounting bracket and an imaging device, the imaging device is fixed to the mounting bracket, wherein the imaging device is the imaging device described in any of the above embodiments.
  • the imaging device can be mounted on a mounting bracket of a non-mobile terminal through the above-mentioned second connection hole 113a.

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Abstract

一种成像装置及非移动终端，成像装置用于非移动终端，成像装置包括：壳体（1）；第一摄像头（2），第一摄像头（2）安装于壳体（1），并用于采集信息；照明部件（3），照明部件（3）安装于壳体（1），并用于提供补光；第一电路板（21），安装于壳体（1）；其中，第一摄像头（2）与照明部件（3）均与第一电路板（21）连接。在成像装置中，由于照明部件（3）仅需连接供电电路即可，无需复杂的驱动芯片，因此，将成像装置中的第一摄像头（2）与照明部件（3）连接于同一电路板、即第一电路板（21），能够节省电路板，从而简化电路及其布局，并节省壳体（1）内部的安装空间，具有节省成本的优势。

Description

成像装置及非移动终端 技术领域
本申请涉及成像装置技术领域，尤其涉及一种成像装置及非移动终端。
背景技术
成像装置已应用于手机、平板、智能家居和物联网等领域，该成像装置能够用于识别用户的信息。其中，该成像装置包括壳体和摄像头等元器件，各元器件的驱动芯片位于壳体的内腔，当该成像装置包括多个元器件时，所需的驱动芯片也较多。
现有技术中，壳体内部各元器件的驱动芯片较多，结构较复杂。
申请内容
鉴于背景技术中存在的问题，本申请的目的在提供一种成像装置及非移动终端，该成像装置及非移动终端能够节省电路板，从而简化电路及其布局，并节省壳体内部的安装空间。
本申请实施例提供一种成像装置，所述成像装置包括：
壳体；
第一摄像头，所述第一摄像头安装于所述壳体，并用于采集信息；
照明部件，所述照明部件安装于所述壳体；
第一电路板，安装于所述壳体；
其中，所述第一摄像头与所述照明部件均与所述第一电路板连接。
在一种可能的设计中，所述第一摄像头包括第一芯片，所述第一芯片用于采集信息；
所述第一芯片设置于所述第一电路板，且所述照明部件通过所述第一芯片驱动。
在一种可能的设计中，所述成像装置还包括主电路板，所述主电路板安装于所述壳体内；
所述第一电路板与所述主电路板连接。
在一种可能的设计中，所述第一电路板包括第一连接区域、第二连接区域和第三连接区域；
所述第一连接区域与所述照明部件连接，所述第二连接区域与所述第一摄像头连接，所述第三连接区域与所述主电路板连接；
所述第三连接区域自所述第二连接区域延伸出。
在一种可能的设计中，沿高度方向，所述第一连接区域与所述第二连接区域具有高度差，且所述第一连接区域与所述第二连接区域之间通过弯折区域连接；
所述第一连接区域与所述弯折区域垂直，所述第二连接区域与所述弯折区域垂直。
在一种可能的设计中，所述成像装置还包括点阵投射器和第二电路板；
所述点阵投射器安装于所述壳体，所述点阵投射器通过所述第二电路板与所述主电路板连接；
所述点阵投射器具有第二芯片，所述第二芯片设置于所述主电路板，并用于驱动所述点阵投射器。
在一种可能的设计中，所述成像装置还包括距离传感器和第三电路板；
所述距离传感器安装于所述壳体，所述距离传感器通过所述第三电路板与所述主电路板连接。
在一种可能的设计中，所述成像装置还包括第二摄像头和第四电路板；
所述第二摄像头安装于所述壳体，且所述第二摄像头与所述第四电路板连接；
所述第四电路板与所述主电路板连接，或者，所述第四电路板与所述成像装置的外部电路连接。
在一种可能的设计中，所述照明部件为泛光照明部件。
在一种可能的设计中，所述泛光照明部件能够发出光线，所述第二摄像头能够接收所述泛光照明部件发出的光线。
在一种可能的设计中，所述点阵投射器能够发出光线，所述第一摄像头能够接收所述点阵投射器发出的光线；
所述点阵投射器与所述泛光照明部件交替工作。
在一种可能的设计中，所述第二摄像头、所述距离传感器和所述照明部件位于所述第一摄像头与所述点阵投射器之间。
在一种可能的设计中，所述第一摄像头具有第一中心线，所述点阵投射器具有第二中心线；
沿长度方向，所述第一中心线与所述第二中心线之间的距离D为25mm～50mm。
在一种可能的设计中，所述第一电路板与所述主电路板之间、所述第二电路板与所述主电路板之间、所述第三电路板与所述主电路板之间均通过连接器连接。
在一种可能的设计中，所述连接器连接有补强板；和/或，
所述第一摄像头与所述第一电路板之间设置有补强板，所述照明部件与所述第一电路板之间设置有补强板，所述点阵投射器与所述第二电路板之间设置有补强板，所述距离传感器与所述第三电路板之间设置有补强板，所述第二摄像头与所述第四电路板之间设置有补强板。
在一种可能的设计中，所述成像装置还包括散热部，所述散热部位于所述壳体的内腔。
在一种可能的设计中，所述成像装置还包括缓冲部，所述缓冲部位于所述壳体与所述主电路板之间。
在一种可能的设计中，所述壳体包括主体部和底板，所述主体部与所述底板固定连接；
所述主体部开设有多个安装孔，所述第一摄像头、所述照明部件、所述点阵投射器、所述距离传感器及所述第二摄像头安装于对应的所述安装孔。
在一种可能的设计中，所述壳体还包括遮光板，所述遮光板设置于所述主体部的外侧。
同时，本申请实施例还提供一种非移动终端，包括安装支架和成像装置，所述成像装置固定于所述安装支架，所述成像装置为以上所述的成像装置。
在一种可能的设计中，所述成像装置的壳体设置有连接孔，所述连接孔用于将所述成像装置安装于所述安装支架。
在该成像装置中，由于照明部件无需复杂的驱动芯片，将该成像装置中的第一摄像头与照明部件连接于同一电路板(第一电路板)，因此，本申请 中的成像装置能够节省电路板，从而简化电路及其布局，并节省壳体内部的安装空间，同时，该成像装置还能够节省成本。
应当理解的是，以上的一般描述和后文的细节描述仅是示例性的，并不能限制本申请。
附图说明
图1为本申请所提供成像装置在一种具体实施例中的结构示意图；
图2为图1所示成像装置的另一视角的结构示意图；
图3为图1所示成像装置的爆炸图；
图4为图1中的成像装置另一视角的爆炸图；
图5为图1中的成像装置去掉第四电路板与外接电路板的俯视图；
图6为图1中的成像装置去掉壳体的结构示意图；
图7为图6所示装置的另一视角的结构示意图；
图8为图6所示装置的正视图；
图9为图6所示装置中第一摄像头与照明部件连接的结构示意图；
图10为图6所示装置中点阵投射器与第二电路板连接的结构示意图；
图11为图6所示装置中距离传感器与第三电路板连接的结构示意图；
图12为图5所示装置的仰视图；
图13为图12的A-A向剖视图；
图14为图12的B-B向剖视图；
图15为图1所示成像装置中壳体的结构示意图；
图16为图15所示壳体中主体部的结构示意图；
图17为图16所示壳体的主体部的俯视图；
图18为图15所示壳体中底板的结构示意图。
附图标记：
1-壳体；
11-主体部；
111-支撑板；
111a-第一安装孔；
111b-第二安装孔；
111c-第三安装孔；
111d-第四安装孔；
111f-第五安装孔；
112-侧板；
112a-第一缺口；
112b-第二缺口；
112c-第三缺口；
112d-第四缺口；
113-安装部；
113a-第二连接孔；
12-遮光板；
121-过孔；
13-底板；
131-第一连接孔；
132-第一翻边；
133-第二翻边；
134-第三翻边；
135-缓冲部；
14-内腔；
15-连接件；
16-第一通孔；
17-第二通孔；
2-第一摄像头；
21-第一电路板；
211-第一连接区域；
212-第二连接区域；
213-第三连接区域；
214-弯折区域；
22-第一连接器；
221-第一公连接器；
222-第一母连接器；
23-第一散热部；
3-照明部件；
4-点阵投射器；
41-第二电路板；
411-第四连接区域；
412-第五连接区域；
42-第二连接器；
421-第二公连接器；
422-第二母连接器；
5-距离传感器；
51-第三电路板；
511-第六连接区域；
512-第七连接区域；
52-第三连接器；
521-第三公连接器；
522-第三母连接器；
6-第二摄像头；
61-第四电路板；
7-主电路板；
71-第二散热部；
72-电子器件；
8-补强板；
9-外接电路板。
此处的附图被并入说明书中并构成本说明书的一部分，示出了符合本申请的实施例，并与说明书一起用于解释本申请的原理。
具体实施方式
为了更好的理解本申请的技术方案，下面结合附图对本申请实施例进行详细描述。
应当明确，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其它实施例，都属于本申请保护的范围。
在本申请实施例中使用的术语是仅仅出于描述特定实施例的目的，而非旨在限制本申请。在本申请实施例和所附权利要求书中所使用的单数形式的“一种”、“所述”和“该”也旨在包括多数形式，除非上下文清楚地表示其他含义。
应当理解，本文中使用的术语“和/或”仅仅是一种描述关联对象的关联关系，表示可以存在三种关系，例如，A和/或B，可以表示：单独存在A，同时存在A和B，单独存在B这三种情况。另外，本文中字符“/”，一般表示前后关联对象是一种“或”的关系。
需要注意的是，本申请实施例所描述的“上”、“下”、“左”、“右”等方位词是以附图所示的角度来进行描述的，不应理解为对本申请实施例的限定。此外，在上下文中，还需要理解的是，当提到一个元件连接在另一个元件“上”或者“下”时，其不仅能够直接连接在另一个元件“上”或者“下”，也可以通过中间元件间接连接在另一个元件“上”或者“下”。
请参考附图1～18，其中，图1为本申请所提供成像装置在一种具体实施例中的结构示意图；图2为图1的另一视角的结构示意图；图3为图1的爆炸图；图4为图1中的成像装置另一视角的爆炸图；图5为图1中的成像装置去掉第四电路板与外接电路板的俯视图；图6为图1中的成像装置去掉壳体的结构示意图；图7为图6的另一视角的结构示意图；图8为图6的正视图；图9为图6中第一摄像头与照明部件连接的结构示意图；图10为图6中点阵投射器与第二电路板连接的结构示意图；图11为图6中距离传感器与第三电路板连接的结构示意图；图12为图5的仰视图；图13为图12的A-A向剖视图；图14为图12的B-B向剖视图；图15为图1中壳体的结构示意图；图16为图15中主体部的结构示意图；图17为图16的俯视图；图18为图15中底板的结构示意图。
本申请实施例提供一种成像装置，该成像装置尤其适合用于非移动终端，其中，该非移动终端并非完全不能移动的终端，而是在使用时无需移动的终端，例如门锁、门禁、物联网及智能家居等领域，也就是说成像装置是相对固定的安装在某个场所，针对的成像目标可能是任意人，而非手机这类移动终端大部分时间只针对手机用户本人成像。成像装置固定安装到某个位置，其与地面的距离基本上就固定了，与安装在移动终端不同的一点包括在成像的时候整个成像装置无法被举高、放低来调整成像视场。比如对于手机这类移动终端而言，其安装的成像装置可以在使用的时候被用户移动到合适的高度和水平距离来取得想要的成像区域或范围，因此在这类移动终端中的成像装置对视场角的设计考量，与安装在固定位置的成像装置对视场角的要求是不一样的。如图1～4所示，该成像装置包括壳体1，该壳体1具有内腔14，壳体1用于放置或安装、承载电路板等电子器件。
同时，该成像装置还包括第一摄像头2、照明部件3和第一电路板21，其中，该第一摄像头2安装于壳体1，并用于采集信息，照明部件3安装于壳体1，并用于提供补光。第一电路板21位于壳体1的内腔14，且上述第一摄像头2与照明部件3均与该第一电路板21连接。
在该成像装置中，由于照明部件3工作时无需复杂的驱动芯片，因此，将该成像装置中的第一摄像头2与照明部件3连接于同一电路板(第一电路板21)，即第一摄像头2通过第一电路板21驱动，照明部件3通过第一电路板21供电，因此，与现有技术中照明部件3与第一摄像头2分别连接独立的两个电路板相比，本申请中的成像装置能够节省电路板，从而简化电路及其布局，并节省壳体1内部的安装空间。
具体地，该第一电路板21具有第一芯片，第一摄像头2包括第一芯片，并通过第一芯片采集信息，例如图像信息，且该照明部件3通过第一芯片驱动。在一个实施例中，第一摄像头2的数据采集芯片与照明部件3的驱动芯片为设置或集成于第一电路板21的第一芯片，从而简化第一电路板21的电路布局。或者，第一摄像头的数据采集电路与照明部件3的驱动电路集成于第一芯片。
同时，该成像装置还包括主电路板7，该主电路板7安装于壳体1的内腔14，该主电路板7还连接有外接电路板9，该外接电路板9伸出壳体1的 内腔14，并用于与该成像装置的外部控制装置连接，从而通过该外接电路板9实现主电路板7与外部控制装置的通讯。该主电路板7设置有多个电子器件12，该电子器件12可包括电容电阻等。在一个实施例中，主电路板是较为刚性的PCB板，外接电路板9可以是柔性电路板。外部控制装置可以是终端设备的主控装置，比如对于智能门锁来说，除了可以包含本发明所描述的3D成像装置以外，可能还有指纹开锁模块、NFC开锁模块、蓝牙通讯模块等各种功能装置，以及对这些功能装置进行管理的主控装置。
其中，上述第一电路板21与主电路板7连接，从而实现第一摄像头2与主电路板7之间的数据传输、通讯。具体地，该第一电路板21与主电路板7之间通过第一连接器22连接，该第一连接器22包括第一公连接器221和第一母连接器222，该第一公连接器221和第一母连接器222中，一者连接于主电路板7，另一者连接于第一电路板21，且第一公连接器221与第一母连接器222相互插接，从而实现第一电路板21与主电路板7之间的通讯。
其中，如图8所示，该第一电路板21包括第一连接区域211、第二连接区域212、第三连接区域213和弯折区域214，该第一连接区域211用于与照明部件3连接，也可以说照明部件3设置在第一连接区域211所在区域；第二连接区域212用于与第一摄像头2连接，也可以说第一摄像头2设置在第二连接区域212所在区域；第三连接区域213从第二连接区域212延伸出，并伸入至主电路板7的下方，上述第一公连接器212设置于该第三连接区域213，并用于与主电路板7连接，从而通过该第一电路板21连接第一摄像头2、照明部件3和主电路板7。同时，由于照明部件3的底部与第一摄像头2的基座之间沿高度方向Z具有距离，因此，上述第一连接区域212与第二连接区域213沿高度方向Z具有距离，二者之间通过弯折区域214连接。
本实施例中，如图1和图16所示，该成像装置中，壳体1开设有安装孔，上述第一摄像头2和照明部件3安装于对应的安装孔，且沿高度方向Z，各安装孔平齐，因此，该第一摄像头2和照明部件3与壳体1连接的位置需平齐，而第一摄像头2与照明部件3沿高度方向Z的尺寸不同，因此，为了实现第一摄像头2与照明部件3与壳体1连接的位置平齐，二者与第一电路板21的连接区域沿高度方向Z具有高度差，即第一电路板21中，第一连接区域211与第二连接区域212沿高度方向Z具有高度差，基于此，二者之间需 通过弯折区域213连接，从而在实现第一连接区域211与第二连接区域212连接的同时，保证二者具有预设的高度差。
其中，如图8所示，为了保证第一摄像头2与照明部件3位于同一高度，该第一电路板21中，该第一连接区域211与第二连接区域212均垂直于高度方向Z(保持水平)，同时，该弯折区域213与高度方向Z平行，即第一连接区域211与弯折区域213垂直，第二连接区域212与弯折区域213垂直。需要说明的是，上述第一连接区域211与弯折区域213大致垂直，第二连接区域212与弯折区域213大致垂直，只要能够实现第一摄像头2和照明部件3与壳体1的安装位置平齐即可。
进一步地，如图1～4所示，该成像装置还包括点阵投射器4和第二电路板41，其中，该点阵投射器4安装于壳体1，第二电路板41位于壳体1的内腔14，该点阵投射器4与第二电路板41连接。对于该成像装置来说，该点阵投射器4为发射端，第一摄像头2为接收端。
在一种具体实施例中，上述照明部件3可为泛光照明部件，该泛光照明部件能够发射红外泛光，并照射成像目标，与普通的闪光灯等照明部件相比，该泛光照明部件为高亮度的扩散光源，可以理解，本文中照明部件可以是发出均匀红外光的发光部件。。该点阵投射器4能够发射散斑光信号，且该点阵投射器4与泛光照明部件交替工作，二者共用同一传感器。
工作时，当该泛光照明部件发射红外泛光照射成像目标，或者点阵投射器4发射散斑光信号到成像目标的时候，第一摄像头2(可以是红外光图像传感器)可以对成像目标反射回来的泛光或散斑光信号进行检测成像。
同时，该第二电路板41与主电路板7之间通过第二连接器42连接，该第二连接器42包括第二公连接器421与第二母连接器422，该第二公连接器421与第二母连接器422中，一者连接于主电路板7，另一者连接于第二电路板41，且第二公连接器421与第二母连接器422相互插接，从而实现第二电路板41与主电路板7之间的通讯。
其中，如图10所示，该第二电路板41包括第四连接区域411与第五连接区域412，其中，该第四连接区域411位于主电路板7的上方，并与点阵投射器4连接，第五连接区域412向下延伸至主电路板7下方，且上述第二 公连接器421设于该第五连接区域412，从而使得该第五连接区域412与主电路板7连接。
该点阵投射器4连接到第二芯片，该第二芯片用于驱动点阵投射器4，且该第二芯片焊接于主电路板7。
更进一步地，如图1～4所示，该成像装置还包括距离传感器5和第三电路板51，该距离传感器5用于检测距离，且该距离传感器5安装于壳体1，距离传感器5通过第三电路板51与主电路板7连接，且该第三电路板51与主电路板7之间通过第三连接器52连接，该第三连接器52包括第三公连接器521与第三母连接器522，且第三公连接器521与第三母连接器522中，一者设置于主电路板7，另一者设置于第三电路板51，且第三公连接器521与第三母连接器522插接，从而实现第三电路板51与主电路板7之间的通讯。
其中，如图11所示，该第三电路板51包括第六连接区域511和第七连接区域512，该第六连接区域511位于主电路板7的上方，并与距离传感器5连接，第七连接区域512向下延伸至主电路板7的下方，且上述第三公连接器521设置于该第七连接区域512，从而使得该第七连接区域512与主电路板7连接。
在一种可能的设计中，该成像装置可包括上述点阵发射器4、第一摄像头2、距离传感器5和照明部件3，其中，该成像装置的点阵投射器4作为发射端，第一摄像头2为接收端，两者配合从而获取用户的信息；距离传感器5用于获取用户的距离信息；照明部件3用于为该成像装置提供补光，或者说泛光照明件3可以与第一摄像头2在某些场景下配合完成成像，比如在夜间的时候，可以通过这两者配合获得用户面部2D图像。在一个实施例中，照明部件3可以是红外光发射器，用以发射红外泛光。
通过上述各部件，该成像装置能够实现对用户信息的采集并成像。其中，该第一摄像头2可为红外摄像头，该红外摄像头能够用于3D成像，从而使得该成像装置能够识别3D图像。且上述点阵发射器4、第一摄像头2、距离传感器5和照明部件3均与主电路板7连接。
在另一种可能的设计中，该成像装置还可包括第二摄像头6和第四电路板61，该第二摄像头6安装于所述壳体1，该第二摄像头6与第四电路板61 连接，该第二摄像头6为可见光摄像头，该可见光摄像头用于2D成像，因此，该成像装置包括该第二摄像头6时，不仅可用于3D成像，还可用于2D成像。
其中，该第二摄像头6可通过主电路板7供电，即该第四电路板61与主电路板7连接，或者，该第二摄像头6也可通过成像装置的外部电源供电，即该第四电路板61与外部电源电连接。
图2所示的实施例中，该第二摄像头6的第四电路板61伸出壳体1的内腔14，并与外部电源电连接，此时，该第二摄像头6无需与主电路板7连接，从而不占用主电路板7的安装空间，也无需改变主电路板7的电路布局。
具体地，上述各电路板中，第一电路板21、第二电路板41、第三电路板51及外接电路板9均可为柔性电路板，主电路板7可为印刷电路板，该印刷电路板可以是刚性材料制得。
本实施例中，增设第二摄像头6后，该成像装置集成2D成像和3D成像的功能，从而改善成像装置的用户体验，并提高识别的准确率，且3D识别不局限于人脸正面，能够适用于各个角度，即使用户面部有头发遮挡或者用户姿态变化时仍然可以准确识别。
以上各实施例中，如图5所示，第二摄像头61、距离传感器5和照明部件3位于第一摄像头2与点阵投射器4之间，即该成像装置的发射端(点阵投射器4)与接收端(第一摄像头2)位于上述五个部件的两端，同时，第二摄像头61、距离传感器5和照明部件3之间的位置可交换，但是，由于照明部件3与第一摄像头2连接于同一电路板，因此，照明部件3紧邻第一摄像头2时，能够减小第一电路板21的面积。
该成像装置中，上述五个部件的布置方向定义为该成像装置的长度方向X。第一摄像头2具有第一中心线，点阵投射器4具有第二中心线，沿长度方向X，该第一中心线与第二中心线之间的距离D为25mm～50mm。
上述点阵投射器4与第一摄像头2均为光学元件，且该点阵投射器4发出的光线沿远离点阵投射器4的方向逐渐向外扩散，第一摄像头2接收的光线沿远离第一摄像头2的方向逐渐向外扩散，为了保证第一摄像头2能够接收到光线，该点阵投射器4的发射光与第一摄像头2的接收光需存在重叠的部分。可以理解，上述第一中心线与第二中心线之间的距离越大，点阵投射器4与第一摄像头2的光线重叠位置与成像装置之间的距离越远，即该成像 装置在用户处于较远距离时即可识别，具有分辨能力高、识别范围大的优点。但是，当第一中心线与第二中心线之间的距离越大时，该成像装置的整体长度较大，占用空间较大，且不利于轻量化和小型化。
基于此，可综合考虑上述两方面的因素合理设置第一中心线与第二中心线之间的距离。本实施例中，该成像装置的第一中心线与第二中心线之间的距离可为25mm～50mm时，能够在保证成像装置具有较高的分辨率和识别范围，还能够避免因第一中心线与第二中心线之间的距离过大导致的成像装置整体尺寸过大。因此，该成像装置具有分辨率稿、识别范围大、外形尺寸小等优点。
具体地，第一中心线和第二中心线之间的距离D可为35mm、40mm、45mm等。
以上各实施例中，该成像装置还包括补强板8，其中，如图9所示，第一电路板21的第二连接区域212与第一摄像头2之间设置有补强板8，和/或，第二连接区域212远离第一摄像头21的一侧设置有补强板8；第一电路板21的第一连接区域211与照明部件3之间设置有补强板8，和/或，第一连接区域211远离照明部件3的一侧设置有补强板8；该第一电路板21的第三连接区域213设置有补强板8，且该补强板8设置于远离第一连接器22(例如第一公连接器221)的一端，从而通过多个补强板8对第一电路板21、第一摄像头2、照明部件3以及第一连接器22进行加强。
如图10所示，该第二电路板41的第四连接区域411与点阵投射器4之间设置有补强板8，和/或，第四连接区域411远离点阵投射器4的一端设置有补强板8；该第二电路板41的第五连接区域412设置有补强板8，且该补强板8设置于第五连接区域412远离第二连接器22(例如第二公连接器421)的一端，从而通过多个补强板8对第二电路板41、点阵投射器4及第二连接器42进行加强。
如图11所示，该第三电路板51的第六连接区域511与距离传感器5之间设置有补强板8，和/或，第六连接区域511远离距离传感器5的一端设置有补强板8；该第三电路板51的第七连接区域512设置有补强板8，且该补强板8设置于第七连接区域512远离第三连接器52(例如第三公连接器521) 的一端，从而通过多个补强板8对距离传感器5、第三电路板51及第三连接器52进行加强。
另一方面，该成像装置还包括散热部71，用于将壳体1内腔14产生的热量传导至壳体1外侧。
具体地，上述第一摄像头2、照明部件3、点阵投射器4、距离传感器5及第二摄像头6均连接有第一散热部，具体地，以设置于第一摄像头2底部的第一散热部23为例，该第一散热部23可为铜箔、石墨、散热硅片等材质，且该第一散热部23与壳体1接触，从而实现散热。同时，主电路板7的底部与壳体1的底部之间设置有第二散热部71，即与第一连接器22、第二连接器42、第三连接器52对应的位置设置有第二散热部71，且与主电路板7的各芯片对应的位置设置有第二散热部71。
另外，该成像装置还包括缓冲部135，该缓冲部135设置于主电路板7与壳体1的底部(底板13)之间，用于缓冲成像装置各部件的受力，其中，该缓冲部135可为缓冲泡棉等材质。
以上各实施例中，如图3和图4所示，该壳体1包括主体部11和底板13，其中，该主体部11与底板13通过连接件15连接，该连接件15可为螺栓等结构，且主体部11与底板13连接后，围成壳体1的内腔14。
具体地，如图15～17所示，该主体部11包括支撑板111和侧板112，其中，该支撑板111与底板13相对设置，且支撑板111开设有第一安装孔111a、第二安装孔111b、第三安装孔111c、第四安装孔111d和第五安装孔111f，其中，上述五个安装孔沿长度方向X分布，且各安装孔的中心沿长度方向X。
其中，上述第一摄像头2安装于第一安装孔111a，且第一摄像头2的底座固定安装于该第一安装孔111a，镜筒伸出壳体1的外侧，且该底座的与第一安装孔111a相适配，并大于镜筒的尺寸；上述照明部件3安装于第二安装孔111b，第二安装孔111b与照明部件3的底座相适配，照明部件3的底座固定安装于该第二安装孔111b，且补光部分伸出壳体1的外侧，该照明部分的尺寸小于底座部分的尺寸；上述点阵投射器4安装于第三安装孔111c，该点阵投射器4的底座固定安装于该第三安装孔111c，发射部分伸出壳体1的外侧，该第三安装孔111c与点阵投射器4的底座相适配；上述距离传感器5安装于第四安装孔111d，距离传感器5的底座固定安装于该第四安装孔111d， 传感器部分伸出壳体1的外侧，该底座与第四安装孔111d相适配；第二摄像头6安装于第五安装孔111f，该第二摄像头6的底座固定安装于该第五安装孔111f，镜筒伸出壳体1的外侧，且该底座与第五安装孔111f相适配。
本实施例中，通过在主体部11的支撑板111开设多个安装孔，能够实现各部件的安装，同时，上述第二安装孔111b、第四安装孔111d与第五安装孔111f位于第一安装孔111a与第三安装孔111c之间，且第一安装孔111a的中心与第三安装孔111c的中心沿长度方向X的距离D为25mm～50mm。
同时，该壳体1还包括遮光板12，该遮光板12覆盖于主体部11的支撑板111外侧，并与主体部11固定连接，该遮光板12开设有多个过孔121，上述五个部件通过该过孔121伸出壳体1的外侧。该遮光板12为遮光材料制成，用于防止外部的光线进入，起到保护各光学元件的作用。
更具体地，该主体部11还包括侧板112，该侧板112连接于支撑板111的外周，且底板13固定于侧板112，从而通过底板13、支撑板111与侧板112围成壳体1的内腔14。该壳体1的侧部开设有第一通孔16和第二通孔17，其中，第一通孔16位于第二通孔17靠近支撑板111的一侧，该第一通孔16用于第四电路板62从壳体1的内腔14伸出，第二通孔17用于外接电路板9从壳体1的内腔14伸出。
其中，如图16所示，该侧板112开设有第三缺口112c和第四缺口112d，底板13具有朝向主体部11延伸的第三翻边134，其中，侧板112与底板13固定连接后，该第三缺口112c与底板13的第三翻边134围成上述第二通孔17，第四缺口112d与底板13围成上述第一通孔16。
在一种可能的设计中，如图18所示，该底板13具有朝向主体部11的方向延伸的第一翻边132和第二翻边133和第三翻边134，该侧板112对应开设有第一缺口112a和第二缺口112b，其中，底板13与主体部11固定连接时，该第一翻边132位于第一缺口112a，且二者相适配，第二翻边133位于第二缺口112b，且二者相适配。
同时，如图18所示，该底板13开设有第一连接孔131，该第一连接孔131用于与主体部11通过连接件15固定连接，具体地，该第一连接孔131可为螺纹孔。
另外，如图16所示，该主体部11还包括安装部113，该安装部113开设有第二连接孔113a，该第二连接孔113a用于将该成像装置与非移动终端连接。且该第二连接孔113a具体可为螺纹孔，从而使得该成像装置能够与非移动终端螺纹连接。
具体地，如图16所示的实施例中，该安装部113设置有三个第二连接孔113a，且三个第二连接孔113a呈三角形分布，从而提高成像装置与非移动终端之间的连接可靠性。
同时，需要说明的是，该成像装置与非移动终端连接时，仅主体部11与非移动设备连接，底板13不与非移动设备连接，从而能够减小累计组装误差，提高安装精度。
其中，该安装部113为沿高度方向Z具有一定厚度的结构，从而提高该安装部113设置第二连接孔113a后的强度和刚度，并提高该成像装置与非移动终端连接的可靠性。
另外，本申请实施例还提供一种非移动终端，包括安装支架和成像装置，该成像装置固定于安装支架，其中，该成像装置为以上任一实施例中所述的成像装置。
该成像装置中，通过上述第二连接孔113a，能够将该成像装置安装于非移动终端的安装支架。
以上所述仅为本申请的优选实施例而已，并不用于限制本申请，对于本领域的技术人员来说，本申请可以有各种更改和变化。凡在本申请的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本申请的保护范围之内。

Claims (21)

  1. 一种成像装置，其特征在于，所述成像装置包括：
    壳体；
    第一摄像头，所述第一摄像头安装于所述壳体，并用于采集信息；
    照明部件，所述照明部件安装于所述壳体；
    第一电路板，安装于所述壳体；
    其中，所述第一摄像头与所述照明部件均与所述第一电路板连接。
  2. 根据权利要求1所述的成像装置，其特征在于，所述第一摄像头包括第一芯片，所述第一芯片用于采集信息；
    所述第一芯片设置于所述第一电路板，且所述照明部件通过所述第一芯片驱动。
  3. 根据权利要求1所述的成像装置，其特征在于，所述成像装置还包括主电路板，所述主电路板安装于所述壳体内；
    所述第一电路板与所述主电路板连接。
  4. 根据权利要求3所述的成像装置，其特征在于，所述第一电路板包括第一连接区域、第二连接区域和第三连接区域；
    所述第一连接区域与所述照明部件连接，所述第二连接区域与所述第一摄像头连接，所述第三连接区域与所述主电路板连接；
    所述第三连接区域自所述第二连接区域延伸出。
  5. 根据权利要求4所述的成像装置，其特征在于，沿高度方向(Z)，所述第一连接区域与所述第二连接区域具有高度差，且所述第一连接区域与所述第二连接区域之间通过弯折区域连接；
    所述第一连接区域与所述弯折区域垂直，所述第二连接区域与所述弯折区域垂直。
  6. 根据权利要求3所述的成像装置，其特征在于，所述成像装置还包括点阵投射器和第二电路板；
    所述点阵投射器安装于所述壳体，所述点阵投射器通过所述第二电路板与所述主电路板连接；
    所述点阵投射器具有第二芯片，所述第二芯片设置于所述主电路板，并用于驱动所述点阵投射器。
  7. 根据权利要求6所述的成像装置，其特征在于，所述成像装置还包括距离传感器和第三电路板；
    所述距离传感器安装于所述壳体，所述距离传感器通过所述第三电路板与所述主电路板连接。
  8. 根据权利要求7所述的成像装置，其特征在于，所述成像装置还包括第二摄像头和第四电路板；
    所述第二摄像头安装于所述壳体，且所述第二摄像头与所述第四电路板连接；
    所述第四电路板与所述主电路板连接，或者，所述第四电路板与所述成像装置的外部电路连接。
  9. 根据权利要求8所述的成像装置，其特征在于，所述照明部件为泛光照明部件。
  10. 根据权利要求9所述的成像装置，其特征在于，所述泛光照明部件能够发出光线，所述第二摄像头能够接收所述泛光照明部件发出的光线。
  11. 根据权利要求9所述的成像装置，其特征在于，所述点阵投射器能够发出光线，所述第一摄像头能够接收所述点阵投射器发出的光线；
    所述点阵投射器与所述泛光照明部件交替工作。
  12. 根据权利要求8所述的成像装置，其特征在于，所述第二摄像头、所述距离传感器和所述照明部件位于所述第一摄像头与所述点阵投射器之间。
  13. 根据权利要求12所述的成像装置，其特征在于，所述第一摄像头具有第一中心线，所述点阵投射器具有第二中心线；
    沿长度方向(X)，所述第一中心线与所述第二中心线之间的距离D为25mm～50mm。
  14. 根据权利要求8所述的成像装置，其特征在于，所述第一电路板与所述主电路板之间、所述第二电路板与所述主电路板之间、所述第三电路板与所述主电路板之间均通过连接器连接。
  15. 根据权利要求14所述的成像装置，其特征在于，所述连接器连接有补强板；和/或，
    所述第一摄像头与所述第一电路板之间设置有补强板，所述照明部件与所述第一电路板之间设置有补强板，所述点阵投射器与所述第二电路板之间设置有补强板，所述距离传感器与所述第三电路板之间设置有补强板，所述第二摄像头与所述第四电路板之间设置有补强板。
  16. 根据权利要求1～15中任一项所述的成像装置，其特征在于，所述成像装置还包括散热部，所述散热部位于所述壳体的内腔。
  17. 根据权利要求3～15中任一项所述的成像装置，其特征在于，所述成像装置还包括缓冲部，所述缓冲部位于所述壳体与所述主电路板之间。
  18. 根据权利要求8～15中任一项所述的成像装置，其特征在于，所述壳体包括主体部和底板，所述主体部与所述底板固定连接；
    所述主体部开设有多个安装孔，所述第一摄像头、所述照明部件、所述点阵投射器、所述距离传感器及所述第二摄像头安装于对应的所述安装孔。
  19. 根据权利要求18所述的成像装置，其特征在于，所述壳体还包括遮光板，所述遮光板设置于所述主体部的外侧。
  20. 一种非移动终端，包括安装支架和成像装置，所述成像装置固定于所述安装支架，其特征在于，所述成像装置为权利要求1～19中任一项所述的成像装置。
  21. 根据权利要求20所述的非移动终端，其特征在于，所述成像装置的壳体设置有连接孔，所述连接孔用于将所述成像装置安装于所述安装支架。
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