WO2021032229A1 - Boîtier pour composants émetteurs de chaleur - Google Patents

Boîtier pour composants émetteurs de chaleur Download PDF

Info

Publication number
WO2021032229A1
WO2021032229A1 PCT/DE2019/100741 DE2019100741W WO2021032229A1 WO 2021032229 A1 WO2021032229 A1 WO 2021032229A1 DE 2019100741 W DE2019100741 W DE 2019100741W WO 2021032229 A1 WO2021032229 A1 WO 2021032229A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
heat
ceiling
thermal
plug
Prior art date
Application number
PCT/DE2019/100741
Other languages
German (de)
English (en)
Inventor
Lea Kelbsch
Aaron Kelbsch
Original Assignee
Lea Kelbsch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lea Kelbsch filed Critical Lea Kelbsch
Priority to PCT/DE2019/100741 priority Critical patent/WO2021032229A1/fr
Publication of WO2021032229A1 publication Critical patent/WO2021032229A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores

Definitions

  • the invention relates to a housing for heat-emitting components with the characteristics of the preamble of claim 1.
  • Components in particular mean electrical, electronic and / or semiconductor components and components, assemblies, systems and / or units assembled with them.
  • the Ge housing is particularly intended for computers and can also be used, for example, for audio and / or video electronics. Other uses are possible.
  • the object of the invention is to propose a housing that allows good dissipation of heat from heat-emitting components that are arranged in the housing. This object is achieved by the features of claim 1.
  • the invention provides for heat dissipation from components that are arranged in the housing by means of a heat pipe (“heat pipe”).
  • a heat pipe has a heating zone, in which a heat transfer medium is evaporated by supplying heat, and a cooling zone in which the heat transfer medium condenses by releasing heat.
  • the heat carrier flows in liquid form from the cooling zone to the heating zone and in gaseous form from the heating zone back to the cooling zone.
  • the heat pipe has a preferably flexible, double-walled pipe or or a double-walled hose or several, preferably flexible pipes or hoses through which the heat transfer medium can flow from the heating zone to the cooling zone and separately from the cooling zone to the heating zone .
  • the heat-emitting component is brought into thermally conductive contact with the heating zone and the cooling zone is brought into thermally conductive contact with a wall, ceiling or floor of the housing, from where the heat is dissipated further.
  • the heat pipe is preferably flexible and can then also be regarded as a heat hose in order to be able to lay it easily from the heat-emitting component to the wall, ceiling or floor of the housing. In this way, heat can be dissipated specifically and effectively from a heat-emitting component.
  • the housing according to the invention has a thermal coupling for a thermal plug on an inside of the wall and / or the ceiling and / or the bottom of the housing, into which a thermal plug of the heat pipe can be inserted in a thermally conductive manner.
  • the thermal coupling and the thermal plug form a thermally conductive plug connection. This means that the thermal plug inserted into the thermal coupling is in heat-conducting contact with the thermal coupling.
  • the housing has the thermal plug and the heat pipe has the appropriate thermal coupling.
  • Heat that the heat pipe dissipates from the heat-emitting component is transferred to the wall, ceiling or floor of the housing according to the invention via the heat-conducting plug connection with the thermal plug inserted into the thermal coupling, which, respectively, serves as a cooling surface that the heat to the outside air surrounding the housing releases to the outside.
  • an outside of the wall, the ceiling and / or the floor can have cooling fins, for example.
  • the wall, ceiling and / or floor can have a fan on its outside that generates an air flow that increases the heat dissipation from the wall, ceiling and / or floor to the outside air surrounding the housing.
  • the subject of the invention is the housing with the thermal coupling or the thermal plug on the inside of the wall and / or the ceiling and / or the Bo dens and / or the housing with the heat pipe, its thermal plug or thermal coupling in the thermal coupling or the thermal plug on the inside side of the wall and / or the ceiling and / or the bottom of the housing is plugged or plugged.
  • walls, but also the ceiling and / or the bottom of the housing can have one or more grooves on their inside for plugging in, pushing in or other type of insertion of an edge of a circuit board on which the one or more heat-emitting and possibly other components are arranged or have the inside of the housing.
  • One embodiment of the inven tion provides that one, more or all of the slots for circuit boards on the inside of the wall, the ceiling and / or the bottom of the housing are designed as Thermokupp treatment, into which the thermal plug of the heat pipe can be plugged in a thermally conductive manner.
  • the wall, the ceiling and / or the bottom of the housing can have one or more of the plug-in groove penetrating, for example cylindri cal blind holes or through holes, which / which forms the Thermokupp development of the wall, the ceiling and / or the floor.
  • the plug-in groove penetrating for example cylindri cal blind holes or through holes, which / which forms the Thermokupp development of the wall, the ceiling and / or the floor.
  • the slots for the boards have a circular or W-shaped slot cross-section so that a cylindrical thermal plug with the same diameter or a small oversize in the longitudinal direction of the slots can be inserted into the slots and then in good is thermally conductive contact with the slots.
  • the plug-in grooves can have one or more recesses or the like between their ends in order to be able to plug the thermal plug into the plug-in grooves.
  • the ceiling and / or the floor of the housing which has the thermal coupling on its inside, provides a design of the invention from a thermal coupling on the outside of the wall, the ceiling or the floor, in the a thermally conductive plug of another heat pipe can be plugged in to dissipate the heat to the outside.
  • the thermal plug can also be provided here on the outside of the wall, ceiling or floor of the housing and the thermal coupling on the heat pipe.
  • a preferred embodiment of the invention provides that a wall and / or the ceiling of the housing has an input unit and / or an output unit.
  • Such an input unit can be a keyboard and such an output unit can be a screen.
  • One embodiment of the invention provides a touchscreen as the input and output unit, which is arranged on or in the wall and / or ceiling of the housing. The output unit is visible from the outside of the hous ses and the input unit is accessible from the outside of the housing for inputs. On the inside, the input unit and / or the output unit is accessible for electrical connection to, or vice versa, the electrical, electronic and similar components.
  • the housing is modularly composed of walls, a ceiling and a floor. Designs with only one tubular wall are also possible.
  • the housing is cuboid and has a ceiling that is congruent with a floor and two opposite, identical walls. This means that many different sized housings can be put together with just a few different walls, ceilings and floors.
  • the walls, the ceiling and the floor of the housing can be made of sheet metal or general metal.
  • One embodiment provides that one, several or all Walls and / or the ceiling and / or the bottom of the housing made of plastic be available.
  • the plastic can be solid or foamed.
  • Plastic has the advantage that it is light, cheap and electrically insulating, with electrically conductive plastics not being excluded.
  • Figure 1 is a view of a housing according to the invention from the front without a front wall;
  • FIG. 2 a heat pipe
  • FIG. 3 shows an enlarged cutout of a side wall of the housing from FIG. 1 in a perspective illustration
  • FIG. 4 shows a view of an outside of the front wall of the housing from FIG.
  • the housing 1 is intended for the installation of electronic and other components, assemblies, components and the like of a computer.
  • Components, assemblies, components and the like of audio and / or video systems and generally any components, assemblies, components and other elements can also be installed.
  • the housing 1 is cuboid, it is modularly composed of a ceiling 2, a floor 3 of the same shape and size and four walls 4, 5, 6, of which two side walls 4 are identical.
  • a front wall 5 of the housing 1 is omitted in FIG. 1 so that built-in components of the housing 1 can be seen.
  • FIG. 4 shows the front wall 5 from the outside or an outer side of the front wall 5.
  • the modular structure of the housing 1 from composite walls 4, 5, 6, ceiling 2 and floor 3 is not mandatory for the invention.
  • the cuboid shape is not mandatory for the invention; For example, a tubular Ge housing with a tubular wall with a ceiling and a floor or a horizontally arranged tube as a wall is possible (not shown).
  • the heat pipe 8 is a double-walled, flexible pipe with thermal plugs 9 at its ends.
  • the thermal plugs 9 are cylindrical tubular caps made of a thermally highly conductive material, such as copper, which close the ends of the flexible tube.
  • the heat pipe 8 contains a heat carrier which evaporates when heat is supplied and condenses when heat is released.
  • this thermal plug 9 forms a heating zone of the heat pipe 8, in which the heat transfer medium evaporates and as steam or gaseous form through an outer pipe or an inner pipe of the heat pipe 8 to the thermal plug 9 at the other end of the heat pipe 8 flows.
  • the heat is withdrawn or dissipated again, so that the heat carrier condenses and as a liquid through the inner pipe or the outer tube of the heat pipe 8 flows back to the thermal plug 9 forming the heating zone at one end of the heat pipe 8.
  • the walls 4, 5, 6 of the housing 1 have thermal couplings 10 which, in the exemplary embodiment, are designed as blind holes that are attached to the walls 4, 5, 6 and are attached to the inside of the walls 4, 5, 6 Inserting the thermal plug 9 of the heat pipes 8 are open.
  • the blind or through-holes forming the thermal couplings 10 have the same diameter as the thermal plugs 9 of the heat pipe 8 or are undersized, so that the circumferential surfaces of the thermal couplings 10 and the thermal plugs 9 inserted into them lie against one another over their entire surface and a good heat-conducting contact between the thermal couplings 10 and the thermal plug 9 consists.
  • thermal plugs 9 of heat pipes 8 can also be inserted from the outside to dissipate heat, as shown in FIG. 1 on the top left and right.
  • Blind or through holes as thermal couplings 10 or otherwise designed thermal couplings 10 on the outside of the walls 4, 5, 6 can also be provided at other locations than the thermal couplings 10 on the inside.
  • the top 2 and / or the bottom 3 of the housing 1 can have thermal couplings on their insides and / or their outsides (not shown).
  • the walls 4, 5, 6 of the housing 1 form heat sinks, they have cooling fins 11 on their outer sides, but this is not essential for the invention.
  • a fan 12 is arranged on the outside of a side wall 4, which generates an air flow that sweeps over the outside of the side wall 4 and dissipates heat.
  • the walls 4, 5, 6 of the housing 1 have plug-in grooves 13 for inserting or pushing in boards 14 on which the electronic and other components and components are arranged. As can be seen in FIG. 3, the plug-in grooves 13 have a circular or W-shaped groove cross-section, a groove opening being as wide as the board 14 is thick.
  • a diameter of the plug-in grooves 13 is as large as a diameter of the thermal plug 9 or is undersized, so that the plug-in grooves 13 for the circuit boards 14 also form thermal couplings 15 into which the thermal plugs 9 of the heat pipes 8 can be plugged in good heat-conducting contact are.
  • the walls 4, 5, 6 have recesses 16 on their inner sides, which interrupt the plug-in grooves 13 and the space for plugging the thermal plug 9 in the plug-in grooves 13 as thermal couplings 15 offer (Figure 3).
  • the inner sides of the ceiling 2 and / or the bottom 3 of the housing 1 can also have such plug-in grooves 13 (not shown).
  • power supply units 18 are arranged on a circuit board 14 for a power supply of the electronic components with various DC voltages.
  • the power supply units 17 also have thermal couplings 17 for dissipating heat with heat pipes 8.
  • the front wall 5 of the housing 1 shown in FIG. 4 has a recess which is rectangular in the exemplary embodiment and in which a touchscreen 19 is arranged as an input and output unit 20. It is also possible that the ceiling 2 of the hous ses 1 has a cutout for a touchscreen 19 or another input and / or output unit 20 (not shown).
  • the ceiling 2, the floor 3 and the walls 4, 5, 6 of the housing 1 consist of a plastic which can be solid or foamed. Walls 4, 5, 6, ceiling 2 and / or floor 3 made of metal, in particular made of sheet metal or another material, are possible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

Selon l'invention, un boîtier (1) pour un ordinateur présente une conception modulaire, des thermocouples (10, 15) pour une insertion thermoconductrice de connecteurs thermiques (9) de caloducs (8) étant prévus sur les faces internes des parois (4) pour dissiper la chaleur des composants émetteurs de chaleur (7).
PCT/DE2019/100741 2019-08-19 2019-08-19 Boîtier pour composants émetteurs de chaleur WO2021032229A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/DE2019/100741 WO2021032229A1 (fr) 2019-08-19 2019-08-19 Boîtier pour composants émetteurs de chaleur

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2019/100741 WO2021032229A1 (fr) 2019-08-19 2019-08-19 Boîtier pour composants émetteurs de chaleur

Publications (1)

Publication Number Publication Date
WO2021032229A1 true WO2021032229A1 (fr) 2021-02-25

Family

ID=68109074

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2019/100741 WO2021032229A1 (fr) 2019-08-19 2019-08-19 Boîtier pour composants émetteurs de chaleur

Country Status (1)

Country Link
WO (1) WO2021032229A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20306971U1 (de) * 2003-05-05 2003-06-18 Woehr Richard Gmbh Lüfterloses modular aufgebautes Gehäusesystem für Computer, Steuerungen, Mess- und Bedien- und Anzeigesysteme mit Mehrschichtenkühlsystem
US20060146496A1 (en) * 2005-01-06 2006-07-06 The Boeing Company Cooling apparatus, system, and associated method
DE102012102719A1 (de) * 2012-03-29 2013-10-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlsystem für ein elektrisches System
EP2858464A1 (fr) * 2013-10-03 2015-04-08 ABB Oy Appareil électrique
US20150208551A1 (en) * 2012-08-20 2015-07-23 Adc Technologies Inc. Apparatuses for Transmitting Heat Between a Rail of Rack Mounted Equipment and a Channel of a Cooling Rack Enclosure, And Related Components, Systems, and Methods
US20170038155A1 (en) * 2015-08-03 2017-02-09 Teledyne Instruments, Inc. Underwater thermal connector assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20306971U1 (de) * 2003-05-05 2003-06-18 Woehr Richard Gmbh Lüfterloses modular aufgebautes Gehäusesystem für Computer, Steuerungen, Mess- und Bedien- und Anzeigesysteme mit Mehrschichtenkühlsystem
US20060146496A1 (en) * 2005-01-06 2006-07-06 The Boeing Company Cooling apparatus, system, and associated method
DE102012102719A1 (de) * 2012-03-29 2013-10-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kühlsystem für ein elektrisches System
US20150208551A1 (en) * 2012-08-20 2015-07-23 Adc Technologies Inc. Apparatuses for Transmitting Heat Between a Rail of Rack Mounted Equipment and a Channel of a Cooling Rack Enclosure, And Related Components, Systems, and Methods
EP2858464A1 (fr) * 2013-10-03 2015-04-08 ABB Oy Appareil électrique
US20170038155A1 (en) * 2015-08-03 2017-02-09 Teledyne Instruments, Inc. Underwater thermal connector assembly

Similar Documents

Publication Publication Date Title
DE102006041788B4 (de) Luftfahrzeug-Elektronikkühleinrichtung für ein Luftfahrzeug mit einem Flüssigkeitskühlsystem
EP1517603A1 (fr) Dispositif de réfroidissement pour composants électroniques ou électriques
EP2305016B1 (fr) Système de calculateur de signaux d'avion doté d'une pluralité d'unités modulaires de calculateur de signaux
DE102010054281B4 (de) Elektronisches Gerät mit einem Gehäuse, in dem Wärme erzeugende Komponenten angeordnet sind
EP3485509B1 (fr) Dispositif de refroidissement pour des équipements électroniques ou électriques disposés à l'intérieur d'un boîtier fermé
WO2021032229A1 (fr) Boîtier pour composants émetteurs de chaleur
DE102014012826A1 (de) Modulare Baugruppe
DE102016102832A1 (de) Gerät mit einem eine Leistungselektronik umfassenden Leistungsteil und einem dieses umgebenden Gehäuse, insbesondere Schweißgerät, und Gehäuse für ein Schweißgerät
DE102018127928A1 (de) Wärmetransporteinheit
DE102016119095B4 (de) Computersystem
DE102005035387A1 (de) Kühlkörper für ein in einen Einschubplatz in einer Rechenanlage einsteckbares Modul
DE102006011118B4 (de) Anordnung zum Kühlen eines elektrischen Büro- oder Haushaltsgerätes
DE102010051603A1 (de) Kühlsystem für eine Recheneinrichtung mit Wärmespeicher und Verfahren zum Kühlen einer solchen
DE20317869U1 (de) Kühlsystem als Mehrschichtenkühlkörper mit Wärmeleitrohr und Kamineffekt
DE102012106192B4 (de) Computersystem und Gehäuse für ein Computersystem
DE102010009761A1 (de) Kühlwand-Racksystem
WO2021121688A1 (fr) Dispositif de refroidissement pour refroidir une pluralité de composants électroniques émetteurs de chaleur disposés sur un circuit imprimé, et système comprenant le dispositif de refroidissement
DE202005015312U1 (de) Netzteil
DE102010009762A1 (de) Verdampfungskühlkörper
DE10311526A1 (de) Modulares Gehäusesystem für lüfterlose Display-Computer mit Wärmerohr und mit direktem im Gehäuse integriertem Mehrschichtenkühlsystem
DE102021104413A1 (de) Vorrichtung zur Verabreichung von medizinischer Flüssigkeit sowie System mit solcher Vorrichtung und Haltevorrichtung
DE20315034U1 (de) Montagefreundliches Gehäuse für geräuschlose Computer
DE102022202730A1 (de) Röntgenhochspannungsgenerator mit einem oszillierendem Wärmerohr
DE10316967A1 (de) Grundplatine mit optimal angeordnetem Prozessor zur Prozessorkühlung mit Wärmeleitrohr
DE102013112256B3 (de) Kühlkörper zur Kühlung einer wärmeerzeugenden Komponente eines Computersystems sowie Computersystem

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 19780141

Country of ref document: EP

Kind code of ref document: A1

122 Ep: pct application non-entry in european phase

Ref document number: 19780141

Country of ref document: EP

Kind code of ref document: A1