WO2021022600A1

WO2021022600A1 - Chip on film group, display module and bonding method for chip on film group

Info

Publication number: WO2021022600A1
Application number: PCT/CN2019/104212
Authority: WO
Inventors: 李文芳
Original assignee: 深圳市华星光电技术有限公司
Priority date: 2019-08-06
Filing date: 2019-09-03
Publication date: 2021-02-11
Also published as: CN110579915A

Abstract

Provided are a chip on film (COF) group, a display module and a bonding method for the COF group. The COF group comprises multiple COFs, the multiple COFs are laminated, and connection terminals on each of the COFs are exposed to connect to external signals, multiple connection terminals arranged in a row are provided on each of the COFs, and multiple connection terminals on the multiple COFs are arranged in multiple rows, so that the spacing between two adjacent connection terminals on a COF can be increased, thereby preventing the connection terminals on the COF from being short-circuited due to spacing being too narrow, and preventing poor bonding of the COF.

Description

Chip-on-chip film group, display module and bonding method of chip-on film group

Technical field

The present invention relates to the field of display technology, in particular to a bonding method of a chip-on-chip film group, a display module, and a chip-on-chip film group.

Background technique

Thin Film Transistor (TFT) is a current liquid crystal display device (Liquid Crystal Display, LCD) and active matrix organic light-emitting display device (Active Matrix Organic Light-Emitting Diode, AMOLED) is the main driving element, directly related to the display performance of the flat panel display device.

Most of the liquid crystal displays on the market are backlit liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is based on the thin film transistor array substrate (Thin Film Transistor Array Substrate, TFT Array Substrate) and the color filter (Color Filter, CF) The liquid crystal molecules are filled between the substrates, and the pixel voltage and the common voltage are applied to the two substrates. The electric field formed between the pixel voltage and the common voltage controls the rotation direction of the liquid crystal molecules to reduce the backlight module The light is transmitted out to produce a picture.

OLED devices usually include: a substrate, an anode provided on the substrate, a hole injection layer provided on the anode, a hole transport layer provided on the hole injection layer, a light emitting layer provided on the hole transport layer, An electron transport layer on the light-emitting layer, an electron injection layer provided on the electron transport layer, and a cathode provided on the electron injection layer. The light-emitting principle of OLED devices is that semiconductor materials and organic light-emitting materials are driven by an electric field to cause light emission through carrier injection and recombination. Specifically, OLED devices usually use indium tin oxide (ITO) electrodes and metal electrodes as the anode and cathode of the device, respectively. Under a certain voltage drive, electrons and holes are injected from the cathode and anode to the electron transport layer and hole transport layer, respectively. , Electrons and holes migrate to the light-emitting layer through the electron transport layer and the hole transport layer respectively, and meet in the light-emitting layer to form excitons and excite light-emitting molecules, the latter emit visible light through radiation relaxation.

At present, due to market trends, mass consumers demand higher and higher refresh rates and resolutions for TV sizes. The higher the refresh rate, the more chip-on-chip (COF) required, but due to size limitations, the greater the number of COFs. , The width of the corresponding COF will also become smaller. For example, a display with a resolution of 8K and a refresh rate of 120HZ adopts a 1G1D architecture (1G1D architecture means that a gate line corresponds to a row of sub-pixels, and a data line corresponds to a column of sub-pixels). Cause the problem of insufficient charging. To solve the problem of insufficient charging, a display with 8K resolution and 120HZ refresh rate needs to be made into HG2D architecture (HG2D architecture means that one gate line is connected to two rows of sub-pixels, and two data lines are connected to one. Column sub-pixels), this requires 48 COFs with 960 channels. Due to the width of the liquid crystal panel, the prior art COF bonding method will make the COF golden finger pitch very small. Even if the two-in-one (2 in 1) 1920 channel COF gold finger has a small line width, it will cause poor bonding.

technical problem

The object of the present invention is to provide a chip-on-chip film assembly, which can prevent the connection terminals on the chip-on-chip film from being short-circuited due to the narrow pitch and avoid poor bonding of the chip-on-chip film.

The object of the present invention is also to provide a display module, which can prevent the connection terminals on the flip chip film from being short-circuited due to the narrow pitch, and avoid poor bonding of the flip chip film.

The object of the present invention is also to provide a bonding method of the chip on film group, which can prevent the connection terminals on the chip on film from being short-circuited due to the narrow pitch, and avoid poor bonding of the chip on film.

Technical solutions

In order to achieve the above objective, the present invention provides a chip-on-chip film set, including: a plurality of chip-on-chip films; the plurality of chip-on-chip films are stacked and exposed to connect the external connection terminals on each of the chip-on-chip films. signal.

Each chip on film is provided with multiple connection terminals arranged in a row; the multiple connection terminals of the multiple chip on films are arranged in multiple rows.

The number of the chip on film is two, and the two chip on film are stacked so that the two rows of connection terminals respectively located on the two chip on film are arranged in two rows.

The plurality of chip-on-chip films are stacked so that the plurality of rows of connection terminals respectively located on the plurality of chip-on films are arranged alternately.

The multiple connection terminals located in the same row on each chip on film are parallel to each other; the distance between every two adjacent connection terminals of each chip on film is the same.

The overall shape of the stack of the chip-on-chip film group is rectangular; the shape of each of the chip-on-chip films is an "L" shape.

Each chip on film includes a first part and a second part vertically connected to the first part;

At least one first part of the chip on film overlaps and covers the first part of the other chip on film, and the edge of the second part of the chip on film is flush after the overlap.

The multiple connection terminals are located on the first part of the chip on film; each chip on the film is also provided with a driving chip on the second part.

The present invention also provides a display module including: a display panel and a plurality of the above-mentioned flip-chip film groups arranged on the display panel.

The present invention also provides a bonding method of the flip chip film group, which includes the following steps:

Step S1, bonding a plurality of connection terminals of a chip-on-chip film in the plurality of chip-on-chip film groups as described above to the display panel;

Step S2, Step S1 is repeated until the multiple connection terminals of the multiple chip on film groups in all the chip on film groups are bonded to the display panel.

Beneficial effect

The beneficial effects of the present invention: the chip-on-chip film set of the present invention includes a plurality of chip-on-chip films; the plurality of chip-on-chip films overlap and expose the connection terminals on each of the chip-on films to connect external signals, each The chip on film is provided with a plurality of connection terminals arranged in a row; the plurality of connection terminals of the plurality of chip on film are arranged in multiple rows, which can increase the distance between two adjacent connection terminals on a chip on film , To prevent the connection terminals on the flip chip film from being short-circuited due to the narrow pitch, and avoid poor bonding of the flip chip film. The display module of the present invention can prevent the connection terminals on the flip chip film from being short-circuited due to the narrow spacing, and avoid poor bonding of the flip chip film. The bonding method of the chip-on-chip film assembly of the present invention can prevent the connection terminals on the chip-on-chip film from being short-circuited due to the narrow spacing, and avoid poor bonding of the chip-on-chip film.

Description of the drawings

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention. However, the accompanying drawings are only provided for reference and illustration and are not used to limit the present invention.

In the attached picture,

FIG. 1 is a schematic diagram of the structure of the flip chip film group of the present invention;

2 and 3 are schematic diagrams of a chip on film of the chip on film group of the present invention;

4 is a schematic diagram of the structure of the display module of the present invention;

FIG. 5 is a flowchart of the bonding method of the flip chip film group of the present invention.

Embodiments of the invention

In order to further explain the technical means adopted by the present invention and its effects, the following describes in detail the preferred embodiments of the present invention and the accompanying drawings.

1 to 3, the present invention provides a chip on film set, including: a plurality of chip on film 20; the plurality of chip on film 20 is stacked and exposed on each of the chip on film 20 The terminal 211 is connected to connect an external signal.

Specifically, each chip on film 20 is provided with a plurality of connection terminals 211 arranged in a row; the plurality of connection terminals 211 of the plurality of chip on film 20 are arranged in multiple rows.

It should be noted that a plurality of flip-chip films in the set of flip-chip films of the present invention are stacked and exposed the connection terminals on each of the flip-chip films to connect to external signals, and the plurality of flip-chip films 20 are provided with A plurality of connection terminals 211 arranged in a row, and the plurality of connection terminals 211 of the plurality of chip on film 20 are arranged in multiple rows, which is equivalent to replacing one chip on film with one chip on film group in the prior art. That is, the connection terminals distributed in one row in the prior art are replaced with the connection terminals arranged in multiple rows, which can increase the distance between two adjacent connection terminals 211 on the flip chip film 20 to prevent The connection terminals 211 are short-circuited due to the narrow pitch, which prevents poor bonding of the chip on film 20.

Specifically, please refer to FIG. 1. In the preferred embodiment of the present invention, the number of the chip on film 20 is two, and the two chip on film 20 are superimposed so that the two on the chip The two rows of connection terminals 211 are arranged in two rows. Of course, the number of the chip on film 20 of the present invention can also be three, four, or five, etc. Correspondingly, there are multiple connection terminals 211 of the three chip on film 20 It is arranged in three rows, and the multiple connection terminals 211 of the four chip on film 20 are arranged in four rows, and the present invention is not limited herein.

Specifically, the plurality of chip-on-chip films 20 are stacked so that the multiple rows of connection terminals 211 respectively located on the plurality of chip-on-films 20 are arranged alternately, which can further add two adjacent connection terminals on one chip-on-chip 20 The spacing between 211.

Specifically, the multiple connection terminals 211 in the same row on each chip on film 20 are parallel to each other; the distance between every two adjacent connection terminals 211 of each chip on film 20 is the same.

2 and 3, the overall shape of the multiple chip on film 20 after being stacked is rectangular; the shape of each of the chip on film 20 is an "L" shape;

Each chip on film 20 includes a first portion 212 and a second portion 213 vertically connected to the first portion 212;

At least one first part 212 of the chip on film 20 covers the first part 212 of the other chip on film 20, and the edge of the second part 213 after being stacked is flush with the chip on film 20. The "L"-shaped chip on film 20 together form a rectangular chip on film group.

For example, when two chip on film 20 are stacked, the length of the first portion 212 of the chip on film 20 located below of the two chip on film 20 may be greater than or equal to the first portion 212 of the chip on film 20 located above. length;

The width of the first portion 212 of the chip on film 20 located below of the two chip on film 20 may be greater than the width of the first portion 212 of the chip on film 20 located above;

The length and width of the second portion 213 of the chip on film 20 located below of the two chip on film 20 may be equal to the length and width of the second portion 213 of the chip on film 20 located above, respectively.

Specifically, the multiple connection terminals 211 are located on the first part 212 of the chip on film 20; each chip on film 20 is further provided with a driving chip 30 on the second part 213.

Please refer to FIG. 4, based on the above-mentioned chip-on-chip film group, the present invention also provides a display module, including: a display panel 10 and a plurality of the above-mentioned chip-on-chip film groups 11 provided on the display panel 10.

Specifically, the display panel 10 includes a TFT array substrate 101 and a CF substrate 102 disposed oppositely; the TFT array substrate 101 includes an outer lead bonding (OLB) terminal bonded to the flip chip group 11 111; the multiple connection terminals 211 of each of the multiple chip on film groups 11 are bonded to the external pin binding ends 111.

Specifically, the driving circuit of the display panel 10 is of HG2D architecture, that is, the display panel 10 includes a plurality of sub-pixels distributed in an array, a plurality of data lines extending in a vertical direction, and a plurality of gates extending in a horizontal direction. Line; each gate line is connected to two rows of sub-pixels, and every two data lines is connected to a column of sub-pixels.

Referring to FIG. 5, based on the above-mentioned chip-on-chip film group, the present invention also provides a method for bonding the chip-on-chip film group, which includes the following steps:

Step S1, bonding the multiple connection terminals 211 of one chip on film 20 in the multiple chip on film groups 11 described above to the display panel 10;

Step S2, step S1 is repeated until the multiple connection terminals 211 of the multiple chip on film 20 in all the chip on film groups 11 are bonded to the display panel 10.

It should be noted that the plurality of chip-on-chip films 20 in the chip-on-chip film group of the present invention are each provided with a plurality of connection terminals 211 arranged in a row, and the plurality of connection terminals 211 of the plurality of chip-on films 20 are multi- The row arrangement is equivalent to replacing one chip-on-chip film group in the prior art with a chip-on-chip film group, that is, replacing the connection terminals arranged in a row in the prior art with connection terminals arranged in multiple rows, and one can be added. The distance between two adjacent connection terminals 211 on the chip on film 20. During the bonding process, the connection terminals 211 of the chip on film 20 are sequentially bonded to the display panel 10 to prevent the chip on film 20 from being bonded. The connecting terminals 211 on the upper side are short-circuited due to the narrow spacing, which prevents poor bonding of the chip on film 20.

In summary, the chip-on-chip film set of the present invention includes a plurality of chip-on-chip films; the plurality of chip-on-chip films are stacked and exposed to the connecting terminals on each of the chip-on-films to connect external signals. A plurality of connection terminals arranged in a row are provided on the chip-on-chip film; the plurality of connection terminals of the plurality of chip-on-chip films are arranged in multiple rows, which can increase the distance between two adjacent connection terminals on one chip-on-chip film, Prevent the connection terminals on the flip chip film from causing short circuits due to the narrow pitch, and avoid poor bonding of the chip flip film. The display module of the present invention can prevent the connection terminals on the flip chip film from being short-circuited due to the narrow spacing, and avoid poor bonding of the flip chip film. The bonding method of the chip-on-chip film assembly of the present invention can prevent the connection terminals on the chip-on-chip film from being short-circuited due to the narrow spacing, and avoid poor bonding of the chip-on-chip film.

As mentioned above, for those of ordinary skill in the art, various other corresponding changes and modifications can be made according to the technical solutions and technical ideas of the present invention, and all these changes and modifications shall fall within the protection scope of the claims of the present invention. .

Claims

A chip-on-chip film set includes: a plurality of chip-on-chip films; the plurality of chip-on-chip films are stacked and exposed to connect an external signal to a connection terminal on each of the chip-on-chip films.
3. The chip-on-chip group of claim 1, wherein each chip-on-film is provided with a plurality of connection terminals arranged in a row; the plurality of connection terminals of the plurality of chip-on-chip films are arranged in a plurality of rows.
3. The chip-on-chip film set of claim 2, wherein the number of the chip-on-chip films is two, and the two chip-on-chip films are superimposed so that two rows of connection terminals respectively located on the two chip-on films Arranged in two rows.
3. The chip-on-chip film set of claim 2, wherein the plurality of chip-on-chip films are stacked so that the plurality of rows of connection terminals respectively located on the plurality of chip-on films are alternately arranged.
3. The chip-on-chip film assembly of claim 1, wherein a plurality of connection terminals in the same row on each chip-on-chip film are parallel to each other; and the distance between every two adjacent connection terminals of each chip-on-chip film is the same.
3. The chip-on-chip film assembly of claim 1, wherein the overall shape of the plurality of chip-on-chip films after stacking is rectangular; each of the chip-on-chip films has an "L" shape.
7. The chip on film group of claim 6, wherein each chip on film comprises a first part and a second part vertically connected to the first part;

At least one first part of the chip on film covers the first part of the other chip on film, and the edge of the second part of the chip on film is flush after being stacked.
8. The chip-on-chip film assembly of claim 7, wherein the plurality of connection terminals are located on the first part of the chip-on-chip film; each of the flip-chip films is further provided with a driving chip located on the second part.
A display module includes: a display panel and a plurality of flip-chip film groups arranged on the display panel;

The chip-on-chip film group includes: a plurality of chip-on-chip films; the plurality of chip-on-chip films are stacked and exposed to a connection terminal on each of the chip-on-chip films to connect to external signals.
9. The display module of claim 9, wherein each of the flip chip films is provided with a plurality of connection terminals arranged in a row; the plurality of connection terminals of the plurality of flip chip films are arranged in a plurality of rows.
The display module of claim 10, wherein the number of the flip chip films is two, and the two flip chip films are superimposed so that the two rows of connecting terminals respectively located on the two flip chip films appear Arranged in two rows.
10. The display module of claim 10, wherein the plurality of flip chip films are stacked so that the plurality of rows of connection terminals respectively located on the plurality of flip chip films are alternately arranged.
9. The display module as claimed in claim 9, wherein the multiple connection terminals located in the same row on each chip on film are parallel to each other; and the distance between every two adjacent connection terminals of each chip on film is the same.
9. The display module of claim 9, wherein the overall shape of the plurality of chip-on-chip films after being stacked is rectangular; the shape of each of the chip-on-chip films is an "L" shape.
15. The display module of claim 14, wherein each chip on film comprises a first part and a second part vertically connected to the first part;

At least one first part of the chip on film covers the first part of the other chip on film, and the edge of the second part of the chip on film is flush after being stacked.
15. The display module of claim 15, wherein the plurality of connection terminals are located on the first part of the flip chip film; each of the flip chip films is further provided with a driving chip located on the second part.
A method for bonding a chip-on-chip film group, wherein the chip-on-chip film group includes: a plurality of chip-on-chip films; and the plurality of chip-on-chip films are stacked and exposed to the connecting terminals on each of the chip-on-chip films To connect external signals;

The bonding method of the chip on film group includes the following steps:

Step S1, bonding a plurality of connection terminals of a chip on film in a plurality of chip on film groups to the display panel;

Step S2, Step S1 is repeated until the multiple connection terminals of the multiple chip on film groups in all the chip on film groups are bonded to the display panel.
17. The method for bonding a chip-on-chip group as claimed in claim 17, wherein each chip-on-film is provided with a plurality of connection terminals arranged in a row; the plurality of connection terminals of the plurality of chip-on-films are arranged in a plurality of rows Arrangement.
The method for bonding the chip-on-chip film set of claim 18, wherein the number of the chip-on-chip film is two, and the two chip-on-chip films are superimposed such that the The two rows of connecting terminals are arranged in two rows.
21. The method for bonding a chip-on-chip film group according to claim 18, wherein the plurality of chip-on-chip films are stacked such that a plurality of rows of connection terminals respectively located on the plurality of chip-on films are arranged in a staggered manner.