WO2021008592A1

WO2021008592A1 - Circuit board assembly, manufacturing method for circuit board assembly, and electronic device

Info

Publication number: WO2021008592A1
Application number: PCT/CN2020/102484
Authority: WO
Inventors: 徐晨凯
Original assignee: 华为技术有限公司
Priority date: 2019-07-18
Filing date: 2020-07-16
Publication date: 2021-01-21
Also published as: CN112243314A

Abstract

Provided are a circuit board assembly, a manufacturing method for a circuit board assembly, and an electronic device, so as to improve the heat dissipation performance of a circuit board assembly. The circuit board assembly comprises a first circuit board, a frame board, a second circuit board, a first electronic device, a second electronic device, and heat conducting glue, wherein the first circuit board, the frame board, and the second circuit board are sequentially arranged in a stacked manner, the first circuit board is provided with a first surface, the second circuit board is provided with a second surface, the frame board is fixedly connected to the first surface and the second surface so as to form a containing cavity, and the containing cavity is provided with a glue feeding port and a glue discharging port; the first electronic device is arranged on the first surface and located in the containing cavity; the second electronic device is arranged on the second surface and located in the containing cavity; and the heat conducting glue fills the containing cavity from the glue feeding port and is used for wrapping the first electronic device and the second electronic device.

Description

Circuit board assembly, manufacturing method of circuit board assembly and electronic equipment

Cross references to related applications

This application claims the priority of a Chinese patent application filed with the Chinese Patent Office on July 18, 2019, the application number is 201910649585. 2, and the application title is "a circuit board assembly, a method for manufacturing a circuit board assembly, and electronic equipment", all of which The content is incorporated in this application by reference.

Technical field

This application relates to the technical field of electronic equipment, and in particular to a circuit board assembly, a manufacturing method of the circuit board assembly, and electronic equipment.

Background technique

The length and width of the circuit board assembly of the sandwich structure are relatively small, so it is often used in portable electronic devices such as mobile phones to provide a larger installation space for the battery or other functional modules of the electronic device. Generally, this circuit board assembly includes a main board, a frame board, and a module board that are stacked, wherein the frame board is respectively fixedly connected to the first surface of the main board and the second surface of the module board, thereby forming a relatively closed receiving cavity. The first surface of the main board and the second surface of the module board are respectively provided with at least one electronic device located in the containing cavity. The disadvantage of the prior art lies in the fact that the layout density of the electronic devices per unit area of the sandwich structure circuit board assembly is larger, and the heat generated is also larger, and the accommodating cavity is relatively closed, so the heat is not easy to dissipate, resulting in the circuit The heat dissipation performance of the board assembly is poor.

Summary of the invention

The present application provides a circuit board assembly, a manufacturing method of the circuit board assembly, and electronic equipment to improve the heat dissipation performance of the circuit board assembly.

In a first aspect, the present application provides a circuit board assembly, which includes a first circuit board, a frame board, and a second circuit board, which are stacked in sequence to form a sandwich structure. When specifically set up, the first circuit board includes a first surface, and the second circuit board includes a second surface. The two sides of the frame board are respectively fixedly connected to the first surface and the second surface, so that the first circuit board and the second circuit board A accommodating cavity delimited by the frame plate is formed between. The circuit board assembly further includes a first electronic device arranged on the first surface, and a second electronic device arranged on the second surface, and both the first electronic device and the second electronic device are located in the above-mentioned containing cavity. Since the heat generated by the first electronic device and the second electronic device during operation will continue to be dissipated into the accommodating cavity, in order to enable the heat in the accommodating cavity to be dissipated to the outside as soon as possible, it is also filled with thermally conductive glue that can accelerate the heat transfer efficiency. When filling, the accommodating cavity has a glue inlet and a glue outlet. The thermally conductive glue can be poured into the accommodating cavity from the glue inlet. The pouring process can continue until the thermally conductive glue overflows at the glue outlet to ensure that the cavity has been completely filled with the thermally conductive glue. filling.

In the circuit board assembly provided by the embodiments of the present application, after the first circuit board, the frame board, and the second circuit board are assembled to form the accommodating cavity, the thermally conductive glue is poured into the accommodating cavity through the glue inlet, so that the thermally conductive glue can be contained in the cavity. The cavity is completely filled, so that the heat generated by the first electronic device and the second electronic device can be dissipated to the outside through the first circuit board, the frame board and the second circuit board together, thereby increasing the heat dissipation area and improving the heat dissipation efficiency , Thereby improving the heat dissipation performance of the circuit board assembly.

Among them, the specific opening positions of the glue inlet and the glue outlet can be flexibly set according to the structure of each component of the circuit board assembly. For example, in a specific embodiment, both the glue inlet and the glue outlet can be opened on the second circuit. On boards, this solution is suitable for situations where the layout space on the first circuit board is relatively tight, but the layout space on the second circuit board is relatively sufficient, and in specific settings, the opening positions of the glue inlet and the glue outlet should avoid the first circuit board. Second electronic device on two surfaces.

In addition, the electronic devices in the vicinity of the glue inlet and the glue outlet are more susceptible to the overflow of the thermally conductive glue. If there are non-adhesive devices in these electronic devices, they will be damaged under the influence of the thermally conductive glue. Therefore, the above-mentioned embodiment is also applicable to the situation where the adhesive prohibition device is provided on the third surface of the first circuit board, and the adhesive prohibition device is not provided near the glue inlet and the glue outlet on the fourth surface of the second circuit board. Wherein, the third surface of the first circuit board is the surface opposite to the first surface, and the fourth surface of the second circuit board is the surface opposite to the second surface.

In another specific embodiment, the glue inlet is opened on the second circuit board, and the glue outlet is opened on the side wall of the frame board. This solution is also applicable to the tight layout space on the first circuit board, or the first circuit board. The third surface of the circuit board is provided with a situation where adhesive devices are prohibited, and during specific installation, the opening position of the adhesive inlet should avoid the second electronic device on the second surface.

When pouring the thermally conductive glue into the containing cavity, in order to facilitate the operation, the glue inlet is usually set up, even if the second circuit board is located above the first circuit board, at this time, in order to avoid the injected thermally conductive glue in the containing cavity Before being completely filled, the glue discharge port is discharged, and the glue discharge port can be opened on the side wall of the frame board close to the end of the second circuit board.

In another specific embodiment, both the glue inlet and the glue outlet can be opened on the first circuit board. This solution is suitable for the tight layout space on the second circuit board, but the layout space on the first circuit board In a relatively sufficient situation, and in specific settings, the opening positions of the glue inlet and the glue outlet should avoid the first electronic device on the first surface.

Similarly, the above solution is also applicable to the case where the adhesive prohibition device is provided on the fourth surface, and the adhesive prohibition device is not provided in the vicinity of the glue inlet and the glue outlet on the third surface.

In another specific embodiment, the glue inlet is opened on the second circuit board, and the glue outlet is opened on the side wall of the frame board. This solution is also applicable to the tight layout space on the second circuit board or the second circuit board. The fourth surface of the circuit board is provided with a situation where adhesive devices are prohibited, and in specific settings, the opening position of the adhesive inlet should avoid the first electronic device on the first surface.

When the frame board is fixedly connected to the first circuit board, the corresponding side of the frame board and the first surface of the first circuit board can be welded by solder balls. Of course, the frame board and the second circuit board can also be fixed by soldering.

In the second aspect, the present application also provides a method for manufacturing a circuit board assembly. The method may specifically include the following steps:

Disposing the first electronic device on the first surface of the first circuit board;

Disposing the second electronic device on the second surface of the second circuit board, and opening the glue inlet and the glue outlet on the area of the second circuit board avoiding the second electronic device;

Fix one side of the frame board to the first surface of the first circuit board, and position the first electronic device in the area framed by the frame board;

The second surface of the second circuit board is fixed to the other side of the frame board, and the second electronic device, the glue inlet and the glue outlet are located in the area framed by the frame board. In this way, the first circuit board and the frame The board and the second circuit board are stacked in sequence to form a relatively closed cavity;

Pouring thermally conductive glue into the containing cavity from the glue inlet until the thermally conductive glue overflows from the glue discharging hole.

With the circuit board assembly manufactured by the above method, the heat generated by the first electronic device and the second electronic device can be transferred to the first circuit board, the frame board and the second circuit board through the thermally conductive adhesive, so that the heat dissipation area can be increased. Improve the heat dissipation efficiency, thereby improving the heat dissipation performance of the circuit board assembly.

In the third aspect, this application also provides an electronic device, which includes the circuit board assembly in any possible implementation of the first aspect. Since the soldering yield and heat dissipation performance of the circuit board components are improved, the quality of the electronic equipment is better.

Description of the drawings

FIG. 1 is a schematic diagram of the structure of a circuit board assembly in the prior art;

2 is a schematic diagram of the structure of a circuit board assembly according to an embodiment of the application;

3 is a schematic structural diagram of a circuit board assembly according to another embodiment of the application;

4 is a schematic structural diagram of a circuit board assembly according to another embodiment of the application;

FIG. 5 is a schematic structural diagram of a circuit board assembly according to another embodiment of the application.

Detailed ways

In order to make the objectives, technical solutions, and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

At present, the circuit board assembly of the sandwich structure generally adopts the method of applying thermally conductive glue in the containing cavity to dissipate heat. As shown in FIG. 1, the existing circuit board assembly is manufactured. Welding and fixing on one side surface of the main board 02, and applying thermally conductive glue 04 on the surface of the first electronic device 03 in the framed area of the frame board 01 on the side surface, and then welding and fixing the module board 05 to the other side of the frame board 01 On one side, a relatively closed accommodating cavity 06 is formed, so that the second electronic device 07 located in the accommodating cavity 06 on the module board 05 can conduct thermal contact with the first electronic device 03 through the thermally conductive glue 04, so that the heat is larger. The heat emitted by the second electronic device 07 is transferred to the first electronic device 03 through the thermal conductive adhesive 04, and then the first electronic device 03 is radiated outward through the main board 02. However, with this heat dissipation method, on the one hand, when the first electronic device 03 and the second electronic device 07 both generate more heat, the heat dissipation effect is not obvious, and because the dispensing range of the thermally conductive glue 04 is limited, the heat dissipation efficiency is relatively On the other hand, the glue dispensing process is completed before the module board 05 and the frame board 01 are welded. During the glue dispensing process, the exposed solder joints may be polluted by the thermal conductive glue 04, which affects the welding yield. Based on this, the embodiments of the present application provide a circuit board assembly. The glue dispensing process of the circuit board assembly is performed after the assembly of each layer structure is completed, eliminating the risk of contaminating the solder joints. At the same time, the thermal conductive glue can be implemented in the containing cavity It is completely filled, so the heat dissipation efficiency can be improved, thereby improving the heat dissipation performance of the circuit board assembly.

The circuit board assembly provided in the embodiments of the present application can be applied to an electronic device, and the electronic device can be a common terminal such as a mobile phone, a tablet computer, or a notebook computer in the prior art. Referring first to FIG. 2, the circuit board assembly provided by the embodiment of the present application includes a first circuit board 10, a frame board 20, and a second circuit board 30. The first circuit board 10 and the second circuit board 30 may be main boards, respectively. And the module board, when specifically set up, the first circuit board 10, the frame board 20 and the second circuit board 30 are stacked in sequence to form a sandwich structure.

It should be noted that the lamination in the embodiments of the present application refers to two components at least partially overlapping, that is, the vertical projection of one component on the placement surface of the other component and the other component on its placement surface. The vertical projections overlap at least partially, and when the two components are set, they can be of the same size or inconsistent in size, and the two components can be partially overlapped or completely overlapped.

Please continue to refer to FIG. 2, the first circuit board 10 has a first surface 11 fixedly connected to one end of the frame board 20. The first surface 11 includes a first area 12 framed by the frame board 20. The first electronic device 13 is arranged inside; the second circuit board 30 has a second surface 31 fixedly connected to the other side of the frame board 20. The second surface 31 includes a second area 32 framed by the frame board 20. The second electronic device 33 is arranged in the second area 32. It can be understood that the positions of the first area 12 and the second area 32 are opposite. In the embodiment of the present application, the first electronic device 13 may be a baseband chip, and the second electronic device 33 may be a radio frequency chip. Of course, the first electronic device 13 may also be a radio frequency chip. In this case, the second electronic device 33 It can be a baseband chip, which is not specifically limited in this application.

It should be noted that when the first circuit board 10 is a main board and the second circuit board 30 is a module board, the size of the first circuit board 10 is often larger than the size of the second circuit board 30. At this time, the first circuit board 10 The first surface 11 may also include a third area 14 outside the first area 12 framed by the frame plate 20. In some embodiments of the present application, other electronic devices may also be provided in the third area 14, or in the third area 14 The third surface 15 on the circuit board 10 opposite to the first surface 11, and the fourth surface 34 on the second circuit board 30 opposite to the second surface 31 are provided with other electronic devices to maximize the improvement of the first circuit board 10. And the utilization of the second circuit board 30.

When the frame board 20 is fixedly connected to the first circuit board 10 and the second circuit board 30, the two sides of the frame board 20 can be welded to the first surface 11 and the second surface 31 by solder balls, respectively, so that the first circuit A relatively closed accommodating cavity 40 delimited by the frame plate 20 is formed between the board 10 and the second circuit board 30, and the aforementioned first electronic device 13 and the second electronic device 33 are located in the accommodating cavity 40.

Since the first electronic device 13 and the second electronic device 33 will continue to dissipate heat into the accommodating cavity 40 during operation, in order to enable the heat to be dissipated from the accommodating cavity 40 as soon as possible, in the embodiment of the present application, the accommodating cavity 40 is still It is filled with thermally conductive glue 50. When specifically filled, the containing cavity 40 has a glue inlet 41 and a glue outlet 42. The thermally conductive glue 50 is poured into the containing cavity 40 from the glue inlet 41. The process of pouring the thermally conductive glue 50 can continue until the discharge There is a slight overflow of the thermal conductive glue 50 in the glue port 42, which can ensure that the cavity 40 is completely filled with the thermal conductive glue 50, and the first electronic device 13 and the second electronic device 33 are wrapped by the thermal conductive glue 50, so that the first electronic device 13 is removed In addition to direct contact with the first circuit board 10, thermally conductive contact with the second circuit board 30 and the frame board 20 can also be generated through the thermally conductive adhesive 50, and the second electronic device 33 can also be in direct contact with the second circuit board 30 through The thermal conductive glue 50 also makes thermal contact with the first circuit board 10 and the frame board 20, so the heat generated by the first electronic device 13 and the second electronic device 33 during operation can be transferred to the first circuit board 10 and the frame board. 20 and the second circuit board 30, and further dissipate heat to the outside through the first circuit board 10, the frame board 20 and the second circuit board 30, thereby increasing the heat dissipation area and improving the heat dissipation efficiency. In addition, the thermally conductive glue 50 is poured into the accommodating cavity 40 from the glue inlet 41. The first circuit board 10, the frame board 20 and the second circuit board 30 have already been welded before the thermally conductive glue 50 is poured. Therefore, the solder joints can be eliminated. The risk of contamination of the thermally conductive adhesive 50 increases the welding yield.

The specific opening positions of the glue inlet 41 and the glue outlet 42 can be flexibly set according to the structure of each component in the circuit board assembly, which is not limited in this application. For example, in an embodiment of the present application, referring to FIG. 2, when the layout space in the first area 12 of the first circuit board 10 is relatively tight, while the layout space in the second area 32 of the second circuit board 30 is relatively sufficient. In the case that the glue inlet 41 and the glue outlet 42 can be respectively opened on the second circuit board 30, it is understandable that the opening positions of the glue inlet 41 and the glue outlet 42 should avoid the second circuit board 30 in specific settings. The second electronic device 33 on the surface 31. Of course, in some possible embodiments, when the fourth surface 34 of the second circuit board 30 is also provided with other electronic devices, the opening positions of the glue inlet 41 and the glue outlet 42 should avoid the second surface at the same time. 31 and the electronic devices provided on the fourth surface 34.

In the above embodiment, when pouring the thermally conductive glue 50 into the accommodating cavity 40, in order to facilitate the operation, the glue inlet 41 should be arranged upward, that is, the second circuit board 30 should be located above the first circuit board 10. Since the glue inlet 41 and the glue outlet 42 are both opened on the second circuit board 30, the level of the two is the same, which can reduce the thermal conductivity glue 50 before the cavity 40 is completely filled by the glue Risk of overflow of port 42.

In addition, when the thermal conductive glue 50 is poured into the accommodating cavity 40, a trace amount of thermal conductive glue 50 will inevitably overflow from the glue inlet 41 and the glue outlet 42, and the overflowing thermal glue 50 may flow to the glue inlet 41 or discharge. At the electronic device near the glue port 42, if the electronic device near the glue inlet 41 or the glue outlet 42 is a glue-forbidden device, then these devices are easily contaminated by the thermally conductive glue 50 and damaged. In other words, if the third surface 15 of the first circuit board 10 or the fourth surface 34 of the second circuit board 30 is provided with a large number of glue-prohibiting devices, it is not appropriate to open the glue inlet 41 or the glue outlet 42 on the A circuit board 10 or a second circuit board 30. Therefore, the embodiment shown in FIG. 2 is also applicable to the case where the third surface 15 is provided with a glue prohibiting device, and the fourth surface 34 is not provided with a glue prohibiting device in the vicinity of the glue inlet 41 and the glue outlet 42.

3, in another embodiment of the present application, the glue inlet 41 can also be opened on the second circuit board 30, and the glue outlet 42 can be opened on the side wall 21 of the frame board 20, specifically During installation, the opening position of the glue inlet 41 should avoid the second electronic device 33 on the second surface 31. In addition, when the fourth surface 34 of the second circuit board 30 is also provided with other electronic devices, the glue inlet 41 The position should avoid the electronic devices on the second surface 31 and the fourth surface 34 at the same time. This embodiment is also applicable to a situation where the layout space in the first area 12 of the first circuit board 10 is relatively tight, or the third surface 15 of the first circuit board 10 is provided with a device for prohibiting glue.

In the above embodiment, when pouring the thermally conductive adhesive 50 into the accommodating cavity 40, in order to facilitate the operation, the plastic inlet 40 should be arranged upward, that is, the second circuit board 30 is located above the first circuit board 10. After 50 is poured into the containing cavity 40, it will first be collected on the first circuit board 10 under the action of gravity. In order to avoid the injected thermally conductive glue 50 from being discharged from the glue outlet 42 before the containing cavity 40 is completely filled In this embodiment, the opening position of the glue discharge opening 42 can be made as high as possible, that is, the glue discharge opening 42 can be opened on the side wall 21 of the frame board 20 close to the end of the second circuit board 30. The level of the glue port 42 is practically the same as the level of the glue inlet 41, so the risk of the thermally conductive glue 50 overflowing from the glue outlet 42 before the cavity 40 is completely filled can be reduced.

It should be noted that when the glue outlet 42 is opened on the side wall 21 of the frame board 20 close to the end of the second circuit board 30, the position of the glue outlet 42 on the side wall 21 of the frame board 20 is not actually the same as that of the second circuit board. The circuit board 30 is connected, which requires a relatively high connection strength between the frame board 20 and other connection positions of the second circuit board 30 to improve the structural reliability of the circuit board assembly.

4 is a schematic structural diagram of a circuit board assembly according to another embodiment of the present application. In this embodiment, the glue inlet 41 and the glue outlet 42 of the containing cavity 40 are respectively opened on the first circuit board 10, so this implementation The example is applicable to a situation where the layout space in the second area 32 of the second circuit board 30 is relatively tight, but the layout space in the first area 12 of the first circuit board 10 is relatively sufficient. During the specific setting, the opening positions of the glue inlet 41 and the glue outlet 42 should avoid the first electronic device 13 on the first surface 11. Of course, in some possible embodiments, when the third surface 15 of the first circuit board 10 is also provided with other electronic devices, the opening positions of the glue inlet 41 and the glue outlet 42 should avoid the first surface 11 at the same time. And the electronic devices provided on the third surface 15.

In the above embodiment, when pouring the thermally conductive glue 50 into the containing cavity 40, for ease of operation, the glue inlet 41 should be arranged upward, that is, the first circuit board 10 should be positioned above the second circuit board 30. Since the glue inlet 41 and the glue outlet 42 are both opened on the first circuit board 10, the level of the two is the same, which can reduce the thermal conductivity glue 50 before the cavity 40 is completely filled by the glue Risk of overflow of port 42.

In order to prevent the electronic devices near the glue inlet 41 and the glue outlet 42 from being contaminated and damaged by the spilled thermally conductive glue 50, the electronic devices installed near the glue inlet 41 and the glue outlet 42 on the third surface 15 should not contain the prohibition of sticking. Glue device, that is, the embodiment shown in FIG. 4 is also applicable to the fourth surface 34 provided with a glue prohibition device, and the third surface 15 is not provided with glue prohibition device in the vicinity of the glue inlet 41 and the glue discharge port 42 The condition of the device.

Referring to FIG. 5, FIG. 5 is a schematic structural diagram of a circuit board assembly according to another embodiment of this application. In this embodiment, the glue inlet 41 is opened on the first circuit board 10, and the glue outlet 42 is opened on the frame board. On the side wall 21 of the 20, and in the specific setting, the opening position of the glue inlet 41 should avoid the first electronic device 13 on the first surface 11. In particular, when the third surface 15 of the first circuit board 10 is also provided with other electronic devices, the position of the glue inlet 41 should avoid the electronic devices provided on the first surface 11 and the third surface 15 at the same time. This embodiment is also applicable to a situation where the layout of the second area 32 of the second circuit board 30 is relatively tight, or the fourth surface 34 of the second circuit board 30 is provided with an adhesive prohibiting device.

Similarly, in the above embodiment, in order to prevent the injected thermally conductive glue 50 from being discharged from the glue outlet 42 before the accommodating cavity 40 is completely filled, in this embodiment, the glue outlet 42 may be opened in the frame plate 20 The side wall 21 is close to one end of the first circuit board 10. At this time, the level of the glue outlet 42 is closer to the level of the glue inlet 41. Therefore, it can be reduced that the thermally conductive glue 50 is removed before the cavity 40 is completely filled. Risk of overflow of the glue outlet 42.

When the glue outlet 42 is opened on the side wall 21 of the frame board 20 close to the end of the first circuit board 10, the position where the glue outlet 42 is opened on the side wall 21 of the frame board 20 is not actually connected to the first circuit board 10. Therefore, it is necessary to ensure that the connection strength between the frame board 20 and other connection positions of the first circuit board 10 is relatively high, so as to improve the structural reliability of the circuit board assembly.

It is understandable that in other embodiments of the present application, the glue inlet and the glue outlet can also be opened on the side wall of the frame plate, or the glue inlet can be opened on the side wall of the frame plate, so that the glue can be discharged. The port is opened on the first circuit board or the second circuit board. It is worth noting that when the glue inlet is opened on the side wall of the frame plate, the opening position of the glue inlet can be slightly away from the end of the side wall of the frame plate, so as to make the cross-sectional shape of the glue inlet as circular as possible. It is convenient for the glue filling operation of the glue filling machine.

In summary, in the circuit board assembly provided by the embodiments of the present application, the thermal conductive glue can be poured into the receiving cavity through the glue inlet after the welding of the first circuit board, the frame board and the second circuit board is completed, so that the solder joints can be excluded from heat conduction The risk of glue contamination improves the welding yield; and the use of glue can ensure that the cavity can be completely filled with thermally conductive glue, and the heat generated by the first electronic device and the second electronic device can pass through the first circuit board together , The frame board and the second circuit board are scattered to the outside, thereby increasing the heat dissipation area, improving the heat dissipation efficiency, and further improving the heat dissipation performance of the circuit board assembly.

The embodiment of the present application also provides a method for manufacturing a circuit board assembly. Taking the manufacturing of the circuit board assembly shown in FIG. 2 as an example, the method may include the following steps:

Step 1: Place the first electronic device 13 on the first surface 11 of the first circuit board 10, where the first electronic device 13 can be a baseband chip, and when specifically set up, the baseband chip can be connected to the first circuit board via a metal wire 10 electrical connection;

Step 2: The second electronic device 33 is arranged on the second surface 31 of the second circuit board 30, and other required electronic devices can be arranged on the fourth surface 34 of the second circuit board 30, wherein the second electronic device 33 Specifically, it can be a radio frequency chip. When specifically set up, the radio frequency chip and other electronic devices can be electrically connected to the second circuit board 30 through metal wires; then, a plastic inlet 41 is opened on the second circuit board 30 in an area avoiding these electronic devices. And the glue outlet 42;

Step 3: Fix one side of the frame board 20 on the first surface 11 of the first circuit board 10, and position the first electronic device 13 in the area framed by the frame board 20 on the first surface 11. The board 20 and the first circuit board 10 can be fixed by welding;

Step 4: Fix the second surface 31 of the second circuit board 30 on the other side of the frame board 20, and make the second electronic device 33, the glue inlet 41 and the glue outlet 42 located on the second surface of the frame board 20 In the area framed by 31, during specific installation, the second circuit board 30 and the frame board 20 can also be fixed by welding; in this way, the first circuit board 10, the frame board 20, and the second circuit board 30 are stacked in sequence to form了 a relatively closed cavity 40;

Step 5: Pour the thermally conductive glue 50 into the containing cavity 40 from the glue inlet 41 until the thermally conductive glue overflows from the glue outlet 42 to ensure that the containing cavity 40 is completely filled.

It should be understood that the above steps are described by taking the glue inlet 41 and the glue outlet 42 both opened on the second circuit board 30 as an example. In other implementations, the glue inlet 41 and the glue outlet 42 can also be arranged as needed. The glue ports 42 are all opened on the first circuit board 10, or the glue inlet 41 is opened on the second circuit board 30 or the first circuit board 10, and the glue outlet 42 is opened on the frame board 20. Repeat.

In the circuit board assembly manufactured by the above method, after the welding of the first circuit board 10, the frame board 20 and the second circuit board 30 is completed, the thermal conductive glue 50 can be poured into the containing cavity 40 through the pre-opened glue inlet 41. Therefore, the risk of contamination of the solder joints by the thermal conductive adhesive 50 can be eliminated, and the welding yield can be improved; at the same time, the heat generated by the first electronic device 13 and the second electronic device 33 can be transferred to the first circuit board 10, through the thermal conductive adhesive 50, The frame board 20 and the second circuit board 30 can increase the heat dissipation area, improve the heat dissipation efficiency, and further improve the heat dissipation performance of the circuit board assembly.

This application also provides an electronic device, which may be a common terminal such as a mobile phone, a tablet computer, or a notebook computer in the prior art. The electronic device includes the circuit board assembly in any of the above embodiments. Since the soldering yield and heat dissipation performance of the circuit board assembly are improved, the quality of the electronic device is better.

The above are only specific implementations of this application, but the scope of protection of this application is not limited to this. Anyone familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in this application, and they should all cover Within the protection scope of this application. Therefore, the protection scope of this application shall be subject to the protection scope of the claims.

Claims

A circuit board assembly, which is characterized in that it comprises a first circuit board, a frame board, a second circuit board, a first electronic device, a second electronic device and a thermal conductive glue, wherein:

The first circuit board, the frame board, and the second circuit board are stacked in sequence, the first circuit board has a first surface, the second circuit board has a second surface, and the frame board is connected to The first surface and the second surface are fixedly connected to form an accommodating cavity, and the accommodating cavity has a glue inlet and a glue outlet;

The first electronic device is arranged on the first surface and located in the containing cavity;

The second electronic device is arranged on the second surface and located in the containing cavity;

The thermal conductive glue is filled into the accommodating cavity through the glue inlet for wrapping the first electronic device and the second electronic device.
3. The circuit board assembly of claim 1, wherein the glue inlet and the glue outlet are respectively opened on the second circuit board in an area avoiding the second electronic device.
The circuit board assembly according to claim 1, wherein the glue inlet is opened on the second circuit board in an area avoiding the second electronic device, and the glue outlet is opened on the frame The side wall of the board.
3. The circuit board assembly of claim 3, wherein the glue discharging opening is opened on an end of the side wall of the frame board close to the second circuit board.
5. The circuit board assembly of claim 1, wherein the glue inlet and the glue outlet are respectively opened on the first circuit board in an area avoiding the first electronic device.
The circuit board assembly of claim 1, wherein the glue inlet is opened in an area on the first circuit board that avoids the first electronic device, and the glue outlet is opened in the frame The side wall of the board.
3. The circuit board assembly of claim 1, wherein the glue-discharging port is opened on an end of the side wall of the frame board close to the first circuit board.
8. The circuit board assembly according to any one of claims 1 to 7, wherein the frame board is fixed to the first surface by welding; and/or the frame board is fixed to the second surface by welding.
A method for manufacturing a circuit board assembly, characterized in that it comprises:

Disposing the first electronic device on the first surface of the first circuit board;

Disposing the second electronic device on the second surface of the second circuit board, and opening the glue inlet and the glue outlet on the area of the second circuit board avoiding the second electronic device;

Fixing one side of the frame board to the first surface of the first circuit board, and positioning the first electronic device in an area framed by the frame board;

Fixing the second surface of the second circuit board to the other side of the frame board, and positioning the second electronic device and the glue inlet and the glue outlet in the area defined by the frame board;

The glue inlet is poured into the containing cavity formed by the superposition of the first circuit board, the frame board and the second circuit board with thermally conductive glue until the thermally conductive glue overflows from the glue outlet.
An electronic device, characterized by comprising the circuit board assembly according to any one of claims 1-8.