JP2001251037A - Method for manufacturing circuit board - Google Patents

Method for manufacturing circuit board

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Publication number
JP2001251037A
JP2001251037A JP2000062448A JP2000062448A JP2001251037A JP 2001251037 A JP2001251037 A JP 2001251037A JP 2000062448 A JP2000062448 A JP 2000062448A JP 2000062448 A JP2000062448 A JP 2000062448A JP 2001251037 A JP2001251037 A JP 2001251037A
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JP
Japan
Prior art keywords
circuit
formed
metal plate
portion
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000062448A
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Japanese (ja)
Inventor
Daizo Baba
Naohito Fukuya
直仁 福家
大三 馬場
Original Assignee
Matsushita Electric Works Ltd
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd, 松下電工株式会社 filed Critical Matsushita Electric Works Ltd
Priority to JP2000062448A priority Critical patent/JP2001251037A/en
Publication of JP2001251037A publication Critical patent/JP2001251037A/en
Withdrawn legal-status Critical Current

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Abstract

(57) [Summary] [PROBLEMS] To reduce the thickness of a large-sized molded product when cutting a circuit board by cutting a large number of molded products because it is highly filled with inorganic filler, has good punching properties, and has excellent mechanical strength. And a method for manufacturing a circuit board having high thermal conductivity, which can easily increase the current. SOLUTION: A plurality of circuit portions 6 on which a circuit 7 is formed.
And a circuit metal plate 1 constituted by a frame portion 5 for partitioning between adjacent circuit portions 6, and an opening 9 formed at a position corresponding to the circuit portion 6 of the circuit metal plate 1, and formed between the openings 9. A frame plate with an opening 2 composed of a frame portion 5, a sheet-like formed material 3 in which a resin composition is formed into a sheet shape, and a metal plate 4 for heat radiation for forming a heat radiation plate 12 The circuit part 6 and the opening 9 of the frame plate 2 with openings are aligned and sequentially laminated to be integrally formed. A cutting process is performed on the molded body 16 where the circuit metal plate 1 and the frame portion 5 of the opening frame plate 2 are arranged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the manufacture of a circuit board which is formed from an insulating layer in which resin is filled with an inorganic filler and a metal plate on which a circuit is formed, and which facilitates high heat dissipation and large current. The present invention relates to a method, and particularly to a method for manufacturing a circuit board used in the field of power electronics.

[0002]

2. Description of the Related Art In recent years, semiconductors have become highly integrated with the demand for higher functionality and smaller size and thinner of electronic devices. In order to mount them at a high density, a circuit board on which these are mounted has high heat dissipation. There is a demand for easy design with emphasis on.

[0003] As such a circuit board having high heat dissipation,
A so-called printed circuit board made of a glass substrate epoxy resin laminate, a circuit board provided with heat-dissipating fins only at the mounting part of the heat-generating component, and a circuit composed of a copper plate directly connected to a ceramic substrate such as alumina or aluminum nitride. DB
There has been proposed a circuit board made of a C (direct bonding copper) board, a circuit board formed with a circuit formed on both sides or one side of a heat sink made of aluminum, copper, or the like via an insulating layer.

[0004] Of these, the radiation fins provided on the printed wiring board are too bulky to cope with the reduction in size and thickness of the electronic components. It is limited by characteristics such as mechanical strength and the like, and is limited to very small ones, and is limited to small modules.Therefore, an insulating layer is formed on both sides or one side of a heat sink made of aluminum, copper, etc. Thus, the heat radiation by the circuit board on which the circuit is formed is improved.

[0005]

However, the upper limit of the thickness of a copper foil used for forming a circuit is generally 105 μm.
If the thickness is larger than this, it becomes difficult to form a circuit by etching, and it has been impossible to meet the demand for a large current.

Further, in order to improve the production efficiency, a large-sized molded body composed of a heat sink, an insulating layer, and a circuit layer is manufactured, and the molded body is cut to cut out a plurality of circuit boards. When the method is adopted, the inorganic filler mixed to improve the thermal conductivity of the insulating layer acts as an abrasive for the cutting jig, and the cutting jig is quickly worn, When the jig needs to be replaced frequently, and when molding a large-sized molded product, it is difficult to control the thickness of the insulating layer. It was difficult to achieve.

Therefore, a thick lead frame on which a circuit is formed in advance and a heat sink are arranged in a mold, and the mold is heated to inject a thermoplastic resin filled with an inorganic filler. Although it has been proposed to form a circuit board having a circuit composed of a lead frame and an insulating layer composed of a thermoplastic resin, it is difficult to fill the thermoplastic resin with a high concentration of an inorganic filler, so that heat is radiated. It was difficult to improve the properties.

[0008] Further, as shown in FIG.
The B-staged sheet-shaped product 3 of the thermosetting resin filled with the inorganic filler and the lead frame 22 are laminated, and heated and pressed in a mold 23 to form the heat sink 12 and the insulating layer 10. And the circuit 7 are laminated and formed into a circuit board 1
7 is also proposed, but in this case, in order to avoid abrasion of the cutting jig due to cutting the insulating layer 10 made of the cured product of the sheet-like formed material 3,
Since the circuit boards 17 cannot be manufactured in multiple pieces and the circuit boards 17 must be manufactured one by one in the mold 23, the production efficiency is low.

The present invention has been made in order to solve the above-mentioned problems, and has good punching properties and excellent mechanical strength, etc., despite high loading of inorganic filler. Also, when cutting out a circuit board by taking a large number of molded products from a large area molded product, it is easy to reduce the thickness, furthermore, the current can be easily increased, and as a result, the cost can be reduced, and the high thermal conductivity is excellent. It is an object of the present invention to provide a method for manufacturing a circuit board.

[0010]

According to a first aspect of the present invention, there is provided a method of manufacturing a circuit board, wherein a plurality of circuit portions on which a circuit is formed and adjacent circuit portions are partitioned. A circuit metal plate 1 constituted by a frame 5
An opening frame plate 2 composed of an opening 9 formed at a position corresponding to the circuit portion 6 of the circuit metal plate 1 and a frame portion 8 formed so as to partition between the openings 9, and a sheet of resin composition. The formed sheet-like formation 3 and the heat-dissipating metal plate 4 for forming the heat-dissipating plate 12 are aligned with the circuit portion 6 of the circuit-forming metal plate 1 and the opening 9 of the frame plate 2 with openings. After laminating sequentially and integrally forming, a cutting process is performed at a position where the circuit metal plate 1 and the frame portions 5 and 8 of the opening frame plate 2 of the formed molded body 16 are arranged. Things.

The invention described in claim 2 is the first invention.
Resin varnish obtained by dispersing, in a solvent, a resin composition containing a thermosetting resin, a curing agent, a curing accelerator, and an inorganic filler, and having a content of the inorganic filler of 70 to 95% by mass, in addition to the configuration of Prepreg obtained by impregnating a non-woven fabric base material and drying is used as the sheet-like formed material 3.

Further, the invention described in claim 3 is the first invention.
Resin varnish obtained by dispersing, in a solvent, a resin composition containing a thermosetting resin, a curing agent, a curing accelerator, and an inorganic filler, and having a content of the inorganic filler of 70 to 95% by mass, in addition to the configuration of Is applied on a film and dried, and then a resin sheet obtained is used as the sheet-like formed material 3.

According to a fourth aspect of the present invention, in addition to the constitution of the second or third aspect, Al 2 O 3 ,
At least one selected from the group consisting of MgO, BN, AlN and SiO 2 is used.

According to a fifth aspect of the present invention, in addition to the constitution of any one of the first to fourth aspects, a coating layer 18 having heat resistance and releasability is mounted on the surface of the circuit metal plate 1. It is characterized by performing integral molding in the state.

According to a sixth aspect of the present invention, in addition to any one of the first to fifth aspects, the metal plate for circuit 1, the frame plate with an opening 2, and the metal plate for heat radiation 4 are made of copper, aluminum, Iron, an alloy containing at least one of these metals, a clad material made of a plurality of types of metal materials, and a material formed of at least one material selected from an alloy made of a plurality of types of metal materials. It is a feature.

According to a seventh aspect of the present invention, in addition to the configuration of any one of the first to sixth aspects, a support portion 30 for integrating the circuit 7 and the frame portion 5 is formed on a peripheral portion of the circuit portion 6. Circuit metal plate 1 having circuit 7 formed inside support portion 30
Before or after the molding of the molded body 16, a groove 32 (3) is formed at the boundary between the circuit 7 of the circuit metal plate 1 and the support 30.
3) The circuit board 1 cut out from the molded body 16 by recessing
7, wherein the support 30 is removed.

According to an eighth aspect of the present invention, in addition to the structure of any one of the first to seventh aspects, the heat radiating fin 19 is integrally formed as the heat radiating metal plate 4. Things.

According to a ninth aspect of the present invention, in addition to the configuration of any one of the first to eighth aspects, the circuit metal plate 1 is provided with a thick-walled circuit 7 formed in one circuit portion 6. It is characterized in that a member formed with a portion and a thin portion is used.

The invention described in claim 10 is the first invention.
In addition to any one of the above configurations, the frame plate with an opening 2 is formed of a synthetic resin plate or a synthetic resin composite substrate.

[0020]

Embodiments of the present invention will be described below.

As the thermosetting resin, an epoxy resin, a phenol resin, a cyanate resin, a polyimide resin, a thermosetting polyphenylene oxide resin (PPO resin), or the like can be used. Can be used. As these thermosetting resins, it is preferable to use a brominated resin or a phosphorous-modified resin because it can impart flame retardancy. Here, if a flame retardant is separately added without using the flame retarded resin, heat resistance and mechanical strength may be reduced. The amount of the thermosetting resin is preferably 5 to 30% by mass.

When an epoxy resin is used as the thermosetting resin, it is not particularly limited as long as it has at least two epoxy groups in one molecule. For example, a novolak represented by an o-cresol novolak type epoxy resin is used. Type epoxy resin, dicyclopentadiene type epoxy resin, bifunctional biphenyl type epoxy resin, bisphenol type epoxy resin, naphthalene type epoxy resin, trifunctional triphenylmethane type epoxy resin and the like.
These may be used alone or in combination of two or more.

Further, when molding the sheet-like formed material 3 in the present invention, if the melt viscosity is low, the pressure at the time of molding is not sufficiently transmitted, and voids may remain in the cured product.
Therefore, it is preferable to use a high molecular weight epoxy resin in combination as the resin composition. Specifically, bisphenol A
It is preferable to use a phenoxy resin which is a homopolymer of a type epoxy resin. Further, the weight average molecular weight of the phenoxy resin is 300 to achieve the above object.
The amount of the phenoxy resin used in combination is preferably 1 to 80% by mass based on the total amount of the thermosetting resin such as the epoxy resin, the curing agent, and the curing accelerator. More preferably, the weight average molecular weight is from 30,000 to 6
The phenoxy resin of 0000 is used in an amount of 3 to 20% by mass based on the total amount of the thermosetting resin.

As a curing agent for the epoxy resin, for example, a phenol novolak resin, a phenol aralkyl resin,
Cyclopentadiene, phenolic polymer, naphthalene-type phenolic resin, bisphenol A, bisphenol F
And phenolic resins having at least two phenolic hydroxyl groups in one molecule, such as bisphenols. Further, amine-based curing agents such as dicyandiamide, diaminodiphenylmethane, triethylenetetramine, and BF 3 -monoethylamine, imidazoles, and acid anhydride-based curing agents can also be used. These curing agents may be used alone or in combination of two or more. The total amount of the curing agent is usually compounded in an equivalent ratio of 0.3 to 1.5 with respect to the epoxy thermosetting resin.

As the curing accelerator, a commonly used curing accelerator can be used. For example, 1,8-diazabicyclo (5,4,0) -undecene-7,1,5
Cyclic amines such as -diazabicyclo (4,3,0) -nonene-5, imidazoles such as 2-methylimidazole, 2-phenylimidazole and 2-ethyl-4-methylimidazole, and organic phosphines such as triphenylphosphine. And the like. The amount of the curing accelerator is preferably in the range of 0.01 to 1% by mass.

Further, as the curing accelerator, the following formula (1)
Is reacted with a phenoxy compound (including a phenolic resin) having at least two phenolic hydroxyl groups in one molecule. Can be used. Examples of the phenol compound for the curing accelerator include bisphenols such as bisphenol A, bisphenol F and bisphenol E, trifunctional phenols such as tri (4-hydroxyphenyl) methane, and phenol novolak compounds (phenol novolak resins). .

[0027]

Embedded image

Among them, a phenol novolak compound (phenol novolak resin) represented by the following formula (2):
It is preferable that the softening temperature is 80 ° C. or less and
When the content of the nucleus (n = 1) is 45% by mass or more,
Phenol novolak compounds in which the content of nuclei or higher (n = 2 or higher) is 40% by mass or less are particularly preferred. When a phenol novolak compound having a softening temperature of higher than 80 ° C., a phenol novolak compound in which n = 1 is less than 45% by mass, or a phenol novolac compound in which n = 2 or more exceeds 40% by mass, T
The softening temperature of the reaction product (curing accelerator) with PPK becomes high, and it becomes difficult to dissolve in solvents such as acetone and methyl ethyl ketone, which is not practical. The lower the softening temperature of the phenol novolak compound of the present invention is, the more preferable it is. Therefore, the lower limit is not particularly set. However, those having a softening temperature of 50 ° C. are available. In the phenol novolak compound of the present invention, the higher the content of the trinuclear compound, the more preferable. Therefore, the upper limit is not particularly set. However, the available phenol novolac compound is 100% by mass or less. Furthermore, in the phenol novolak compound of the present invention, 4
The lower the number of nuclei, the better, so no lower limit is set.

[0029]

Embedded image

In producing the above-mentioned curing accelerator, TPPK is used in an amount of 50 parts by mass or less, preferably 100 parts by mass of the phenol compound.
TPPK is mixed at a ratio of 5 to 40 parts by mass with respect to parts by mass, and the phenol compound and TPPK are mixed in the reaction vessel at 160 parts by mass.
The phenol compound is reacted with TPPK by stirring for 1 to 5 hours while heating in the range of ~ 200 ° C. At the end of the reaction, TPPK is cloudy without being dissolved in the molten resin (phenol compound) in the early stage of stirring, but 1 to 5
During the time stirring, the whole becomes almost uniform and transparent. This point can be determined as the reaction end point. After completion of the reaction, a homogeneous resin melt is taken out of the reaction vessel and cooled to form a solid hardening accelerator master batch (mixture). When this reaction product is used as a curing catalyst (curing accelerator) of an epoxy resin and a curing agent that is a phenolic resin, the resin composition and the sheet-like product 3
In the step of drying the organic solvent in the preparation of the above, even if the drying temperature is 60 to 90 ° C., the B-stage does not progress rapidly, and the dried resin composition and the sheet-like formed material 3 have flexibility. And the cured resin composition and sheet-like formed material 3 can be cured in a short time.

For 100 parts by mass of the phenol compound, T
When the PPK is less than 5 parts by mass, productivity (reactivity) becomes poor, and when a curing agent other than the phenolic resin is used as the curing agent, the phenolic resin may be mixed more than necessary. . On the other hand, when TPPK exceeds 40 parts by mass with respect to 100 parts by mass of the phenol novolak compound, the softening temperature of the reactant increases significantly, and at the same time, the melt viscosity increases, and other components in the kneading operation at the time of preparing the resin composition. And it may be difficult to mix them uniformly.

As the inorganic filler, Al 2 O 3 , Mg
It is preferable to use at least one selected from O, BN, AlN, SiO 2 and the like. Since these inorganic fillers are excellent in thermal conductivity and have a degree of freedom in particle size distribution, it is easy to design a particle size for high filling. The amount of the inorganic filler is in the range of 70 to 95% by mass. If the amount is less than this range, it may be difficult to impart sufficient thermal conductivity to the cured product, or the moisture absorption of the cured product may increase and the coefficient of linear expansion may increase. If the amount exceeds this range, it may be difficult to uniformly mix the inorganic filler with the thermosetting resin. As the inorganic filler, a surface treatment is performed with a silane coupling agent such as γ-glycidoxypropyltrimethoxysilane, or a dispersant or the like is added to improve the dispersibility in the resin varnish. Is preferred.

A resin varnish in the form of a slurry can be obtained by dispersing the resin composition comprising the above components in a solvent. The resin varnish can be prepared by blending each of the above-mentioned components and a solvent, and mixing at room temperature with a kneader such as a planetary mixer.

Here, the solvent is desirably a low-boiling solvent, and in particular, by using it as a mixed solvent, the surface shape of the sheet-like product 3 formed by the resin varnish becomes good. As such a solvent, it is particularly preferable to use methyl ethyl ketone, acetone, or the like. On the other hand, the high-boiling point solvent is likely to remain without volatilizing sufficiently during drying, and may reduce the electrical insulation and mechanical strength of the cured product. Such a solvent is for imparting fluidity for the resin composition to be easily formed into a sheet shape or for being easily impregnated into the glass nonwoven fabric, and the viscosity of the prepared resin varnish is 5,000 to 50,000 mPa.
It is preferable to set the range to be s.

The resin varnish is prepared by mixing the above-described components and forming the sheet-like material 3 from such a resin varnish. The sheet-like material 3 can be formed as a resin sheet or a prepreg. .

When the sheet-like formed material 3 is formed as a resin sheet, a resin varnish is applied on a carrier film made of polyethylene terephthalate or the like to a uniform thickness using a comma coater or a doctor blade method or the like. The sheet-like product 3 is formed on a carrier film by heating and drying at 90 ° C. for 30 to 120 minutes to be semi-cured.

When the sheet-like formed material 3 is formed as a prepreg, it is obtained by impregnating the base material of the nonwoven fabric with a resin varnish and, for example, heating and drying at 100 to 150 ° C. for 5 to 30 minutes to be semi-cured. The prepreg obtained may be used as the sheet-like formed material 3. Here, as the nonwoven fabric substrate, inorganic fibers such as glass, alumina, and boron nitride, and organic fibers such as aramid, polyimide, polyester, polyarylate, and phenol can be used. It is preferable to use an inorganic fiber as the nonwoven fabric substrate in that the high thermal conductivity of the circuit board 17 can be further increased, and if an organic fiber is used, the punching workability of the molded body 16 can be further improved. This is preferable in that the circuit board 17 can be further reduced in weight.

The thickness of the sheet-like formed material 3 formed as described above is not particularly limited, but is 0.01 to 5 mm.
It is preferable that

As the metal plate 1 for a circuit, the insulating layers 1
A circuit plate 7 is formed by performing a cutting process such as punching on a metal plate that has been subjected to a surface roughening process in order to improve the adhesion with 0, etc., and furthermore, if necessary, soldering properties and wire bonding on the surface. It is possible to use one that has been subjected to a plating treatment such as nickel plating to improve the property.

As the circuit metal plate 1, one formed by imposing a plurality of circuit portions 6 on one metal plate can be used, and a plurality of circuit portions 6 on which a circuit 7 is formed can be used. And a frame portion 5 formed so as to partition adjacent circuit portions 6 from each other. The circuit 7 of the circuit section 6
Is constituted by a remaining portion of a metal formed by performing a punching process or the like on a metal plate. Here, a support portion 30 composed of a remaining portion of the metal is formed on the peripheral portion of the circuit portion 6, and the circuit 7 is supported by the frame portion 5 via the support portion 30. The shape of the support portion 30 is appropriately designed in accordance with the shape of the circuit 7 formed in the circuit portion 6, and the metal remains on the peripheral portion of the circuit portion 6 over the entire periphery as described later. By doing so, the circuit 7 may be formed so as to surround the entire circumference (FIG. 7C).
(See (d)) Alternatively, a plurality of support portions 30 may be partially formed in the peripheral portion by punching out the peripheral portion of the circuit portion 6 so as to partially leave the metal (FIG. 7). (A)
(See (b), (e) and (f)).

As will be described later, a thick portion and a thin portion are formed in the circuit 7 formed in one circuit portion 6, and the thickness of the circuit 7 formed in one circuit portion 6 is reduced. (See FIG. 8).

The frame plate 2 with openings is constituted by a plurality of openings 9 and a frame portion 8 formed so as to partition the openings 9. The opening 9 is formed at a position corresponding to the circuit portion 6 of the circuit metal plate 1 and has the same size and shape as the circuit portion 6. Therefore, the opening 9 and the frame portion 5 of the opening frame plate 2 are formed at positions corresponding to the circuit portion 6 and the frame portion 8 of the circuit metal plate 1, respectively.

The heat-dissipating metal plate 4 is formed in a flat plate shape.

The metal plate for circuit 1, the frame plate 2 with an opening, and the metal plate 4 for heat radiation are made of copper, aluminum, iron, an alloy containing at least one of these metals, a clad material made of plural kinds of metal materials, and It is preferable to form from at least one kind of material selected from alloys made of various kinds of metal materials.
In particular, it is necessary to design the material and thickness so as not to cause warpage of the substrate. However, the circuit metal plate 1 is preferably formed of a copper-based material such as copper or an alloy containing copper. The metal plate 4 for heat radiation and the frame plate 2 with an opening include
It is preferable to use aluminum for cost reduction and weight reduction, and to use iron if strength is given priority.

Further, as the frame plate 2 with an opening, a low rigidity member formed of a synthetic resin plate or a synthetic resin composite substrate can be used. Here, when a synthetic resin plate is used, a plate formed of a fluorine resin, a polyimide resin, a polyphenylene sulfide resin, or the like can be used. When a synthetic resin composite substrate is used, a plurality of prepregs impregnated and dried with a thermosetting resin are laminated on a substrate, and a metal foil such as a copper foil is arranged on the outermost layer as necessary, and heated and pressed. A laminate obtained by molding can be used. When using a woven or non-woven fabric of organic fibers as the base material,
The punching and separating characteristics of the opening frame plate 2 are improved, which is preferable. As the thermosetting resin, an epoxy resin, a polyimide resin, a phenol resin, a thermosetting PPO resin (polyphenylene oxide resin), an unsaturated polyethylene resin, or the like can be used.

The metal plate 1 for circuit, the frame plate 2 with an opening,
The thickness of the metal plate 4 for heat radiation is 0.018 mm to 5 mm.
mm.

In particular, the thickness of the circuit metal plate 1 should be 0.2 to 1 mm in order to allow a large current to flow and to simultaneously function as a primary heat spreader for a heat-generating component (power component). It is preferable that That is, the thickness of the circuit metal plate 1 is set to 0.2 to 1 mm.
Then, the circuit board 17 formed from the circuit metal plate 1
Circuit 7 has a sufficient current capacity to allow a large current to flow, and the heat capacity of the circuit 7 is improved.
The circuit 7 absorbs heat generated from a heat-generating component such as a power IC mounted on the circuit 7 to improve heat radiation efficiency.

The thickness of the opening frame plate 2 is 0.2 to 1 mm.
Is preferred. Further, the thickness of the metal plate 4 for heat radiation is preferably 1 to 5 mm because it needs to function as a final heat radiation plate 12 and a role of a reinforcing plate for preventing warpage.

The radiating metal plate 4 is provided with radiating fins 19.
May be integrally formed. That is, as shown in FIG. 2, a plurality of fins 20 are erected from one surface of the metal plate 4 for heat radiation opposite to the surface on which the insulating layer 10 is formed, so that the surface area of the metal plate 4 for heat radiation is increased. This improves the heat radiation efficiency. Usually, the heat dissipating fin 19 is screwed to the heat dissipating metal plate 4 via a heat conductive grease or a heat conductive sheet. The cost is high. Radiation fin 19
Is formed integrally with the metal plate 4 for heat radiation, such a problem is eliminated, and a circuit board 17 having extremely excellent heat radiation properties can be obtained.

Next, a method for manufacturing the circuit board 17 will be described. Here, the following examples shown in FIGS.
7 schematically illustrates the manufacturing method of No. 7.

As shown in FIG. 1, first, a heat-dissipating metal plate 4, a sheet-like formation 3, a frame plate 2 with an opening, a circuit metal plate 1
Are sequentially stacked one on top of the other to form a laminate 15. At this time, if necessary, a release film such as a copper foil or aluminum foil for coating, or a fluorine-based film or a polyethylene terephthalate film is disposed on the surface of the circuit metal plate 1. Here, as the sheet-like formation 3,
If necessary, a laminate of a plurality of sheets may be used.

A plate such as a stainless steel plate is disposed above and below the laminate 15, and a plurality of laminates 1 formed in the same manner.
5 is stacked in multiple stages via a plate.

In this state, the laminate 15 is placed between the hot plates, and a pressing force in the vertical direction which is the lamination direction is applied.
Heating is performed at the curing temperature of the sheet-like formed material 3 to perform direct pressure molding. The pressure at this time is preferably, for example, 0.5 to 10 MPa, the heating temperature is 150 to 180 ° C., and the molding time is preferably 5 to 180 minutes. In this case, it is preferable to perform molding under a reduced pressure atmosphere because voids are less likely to be mixed into the insulating layer 10 made of a cured product of the sheet-like formation 3 and reliability is improved. Depending on the type of resin used, it is preferable to perform after-curing by heat treatment for 2 to 6 hours as necessary. For example, when a phenolic resin curing agent is used as the curing agent,
After direct pressure molding by heating for 5 to 30 minutes at
It is preferable to perform after-curing by heating at 50 to 180 ° C. for 2 to 6 hours, and when using a dicyandiamide-based curing agent as a curing agent, the after-curing is performed by heating at 150 to 180 ° C. for 1 to 3 hours. It is preferred to do so.

In the heating direct pressure forming process, the sheet-like formed material 3 is once melted, softened and flows, and the softened resin flows into the openings 9 of the frame plate 2 with openings, and further flows into the metal plate 1 for circuit. Flows into the gap between the circuits 7 in the circuit portion 6 until the surface of the circuit metal plate 1 is substantially flush with the surface of the sheet-like formation 3. After the gap between the opening 9 and the circuit 7 of the circuit portion 6 is filled with the resin constituting the sheet-like formed material 3 and cured, the insulating layer 10 is formed, and the heat-dissipating metal plate 4, The opening frame plate 2 and the circuit metal plate 1 are laminated and formed, and the insulating layer 10 is formed in the gap between the opening 9 of the opening frame plate 2 and the circuit 7 of the circuit portion 6 of the circuit metal plate 1. A molded body 16 is obtained. At this time, most of the resin flows into the opening 9 from between the frame plate 2 with opening and the metal plate 4 for heat radiation, and the insulating layer 10 is formed in the frame plate 2 with opening and the metal plate 4 for heat radiation. Or only a small thickness.

In this heating and pressurizing process, the frame portion 8 of the frame plate 2 with an opening plays a role of a spacer. In the opening 9 of the frame plate 2, a gap equal to the thickness of the frame portion 8 (thickness of the frame plate 2 with an opening) is secured between the metal plate 4 for heat radiation and the metal plate 1 for circuit. The thickness of the insulating layer 10 to be performed is kept constant.

When a copper foil, an aluminum foil, a release film or the like for coating is used in the heating / pressing process, the sheet-like product 3 is heated during the heating / press forming of the laminate 15. Re-melted by pressure forming, metal plate for circuit 1
When the resin is filled between the circuits 7, the resin can be prevented from flowing out to the surface side of the circuit metal plate 1 and contaminating the circuit 7. The copper foil or the like for coating is peeled off from the molded body 16 after the heat and pressure molding. At this time, particularly when a copper foil or an aluminum foil is used, if the glossy surface is arranged on the circuit metal plate 1 side, the adhesion to the circuit metal plate 1 is improved and the circuit metal plate 1 is improved. 1 can be effectively prevented from flowing into the space between the copper foil 1 and the copper foil or the like, and the copper foil or the like can be easily peeled off after curing and molding.

As described above, the insulating layer 10 formed of the cured product of the sheet-like formed material 3 highly filled with the inorganic filler is
Excellent mechanical strength and its thermal expansion coefficient is 20ppm
/ ° C or less, and a thermal conductivity of 3 W / mK or more can be obtained. This can be said to be a cured product that is extremely excellent in so-called α-matching property between the semiconductor chip and the electronic component and is hardly thermally deformed. That is, the difference between the coefficient of thermal expansion α of the silicon chip of the electronic component mounted on the circuit board 17 and the coefficient of thermal expansion of the insulating layer 10 becomes small, and the accumulation of internal stress due to the heat history due to the soldering step and the like. And the occurrence of cracks can be prevented.

After the copper foil or the release film has been disposed after the heat-press molding of the laminate 15 as described above, the molded body 16 is obtained by removing the copper foil or the like. By forming a concave groove along the outer peripheral edge of the circuit portion 6 of the circuit metal plate 1 in the molded body 16, a groove portion 32 separating the support portion 30 and the circuit 7 is formed. In forming the groove portion 32, for example, a method of cutting the surface of the molded body 16 into a V-shaped cross section by moving the rotary blade along the surface of the molded body 16 on the circuit metal plate 1 side while rotating ( V-cut method) can be employed. This groove 32
Is formed to be substantially the same as the thickness of the support portion 30 (thickness of the circuit metal plate 1), and the support portion 30 is separated from the circuit 7.

The circuit board 17 can be cut out from the molded body 16 by cutting the molded body 16 thus formed so that the circuit portion 6 of the circuit board 17 is divided by the frame portion 5. In performing the cutting process on the molded body 16, the frame portion 5 is cut using a cutting jig such as a punching die having a cutting blade having a shape corresponding to the circuit board 17 cut out from the molded body 16. Punching can be performed on the portion where is disposed.

In cutting out the circuit board 17 from the molded body 16, first, a jig for cutting is applied along the frame portion 5 for separating the adjacent circuit portions 6, and the circuit metal plate 1 and the opening frame plate 2 are cut. The jig passes through the frame portions 5 and 8
The molded body 16 is cut so as to pierce the punching region 11 including the entire region of No. 8. At this time, one circuit portion 6 is disposed on the upper surface of each circuit board 17 cut out from the molded body 16, and a support portion 30 separated from the circuit 7 by a groove 32 is provided on an outer edge of the circuit portion 6. Is arranged.

At this time, if the opening frame plate 2 is made of a synthetic resin plate or a synthetic resin composite substrate as described above, it is possible to reduce the load required for cutting in the above cutting process. It can be easily cut.

Further, the supporting portion 30 remaining on each circuit board 17 is removed from the circuit board 17. At this time, the support portion 30 is pulled by hand or by using a jig such as a clamp to thereby attach the support portion 30 to the circuit board 1.
7, the support portion 30 is separated from the circuit 7 by the groove portion 32, so that the support portion 30 is easily removed. By removing the support portion 30 in this manner, a cutout portion 34 having a shape in which the support portion 30 is cut off is formed on the outer peripheral edge of the upper surface of the circuit board 17 at the position where the support portion 30 is arranged.

On the circuit board 17 thus obtained, the heat radiating plate 12 formed from the heat radiating metal plate 4 and the circuit 7 cut out from the circuit metal plate 1 are arranged at an interval. At the same time, the insulating layer 10 is formed from the space between the circuit 7 and the heat sink 12 to the space between the circuits 7. here,
Since the support portion 30 is removed, the circuit 7 does not appear on the end face of the circuit board 17, and the occurrence of an inadvertent short circuit between the circuit 7 and the heat sink 12 is reliably prevented. .

After the solder resist is printed and hardened on the circuit board 17 as required, the circuit board 17 is conveyed to a post-process such as a component mounting process.

In cutting out the circuit board 17 from the molded body 16 by cutting as described above, the jigs such as the cutting blade include the frame portion 5 of the metal plate for circuit 1 and the frame portion 8 of the frame plate 2 with openings. And the heat-dissipating metal plate 4, so that the opening frame plate 2
Except for passing through the insulating layer 10 slightly existing between the heat sink and the metal plate 4 for heat radiation, the cutting process is performed through the portion made of metal, and the insulating layer 10 is hardly cut. Therefore, abrasion due to the polishing effect of the inorganic filler in the insulating layer 10 caused by cutting the insulating layer 10 is suppressed, and the life of the cutting jig can be improved.

When the insulating layer 10 of the circuit board 17 is formed by injection molding of a thermoplastic resin filled with an inorganic filler as in the conventional case, the thickness of the insulating layer 10 is changed, When the thickness of the mold is changed, it is necessary to change the dimensions of the mold for molding, so that a new mold needs to be manufactured. In the present invention, the circuit board 17 is formed as described above. Since it is manufactured, the thickness of the insulating layer 10 can be easily changed only by changing the thickness of the frame plate 2 with openings. Also, the insulating layer 1
The design can be easily changed only by changing the thickness of the metal plate such as the heat-dissipating metal plate 4 and the circuit metal plate 1 as well as the thickness of 0.

According to the above method, it is possible to easily manufacture a substrate having high thermal conductivity and capable of flowing a large current.

When the circuit board 17 is manufactured as described above, as shown in FIG. 2, a coating layer 18 having heat resistance and releasability can be provided on one surface of the circuit metal plate 1 in advance. . It is preferable that the thickness of the coating layer 18 be 10 μm or more.

The coating layer 18 can be provided by a resin film made of polyethylene terephthalate, polyphenylene sulfide, or the like. In this case, the resin film is bonded to the surface of the circuit metal plate 1 with an acrylic adhesive or the like. By doing so, the coating layer 18 is provided, and the coating layer 18 can be easily peeled off from the circuit metal plate 1.

The coating layer 18 may be provided by a liquid resist coating. As the liquid resist, a resin-based liquid resist can be used, and a resin whose coating can be easily removed using an alkali solution or the like is preferable. For example, a photosensitive resin composition comprising an unsaturated polyester, an appropriate unsaturated monomer, a photopolymer, or the like; a urethane (meth) acrylate oligomer; a water-soluble cellulose resin; a photopolymerization initiator; a (meth) acrylate monomer; A photosensitive resin composition can be used. When the photosensitive resin composition is used as a liquid resist as described above, the coating layer 18 can be formed by applying the liquid resist to the surface of the circuit metal plate 1 and then curing by exposure. Can be easily removed with an alkaline solution such as a sodium hydroxide solution.

In the case where the coating layer 18 is provided as described above, when forming the laminate 15 by laminating the heat-dissipating metal plate 4, the sheet-like formed material 3, the opening frame plate 2 and the circuit metal plate 1. The coating layer 18 is arranged on the upper surface side opposite to the sheet-like formed material 3 so as to be exposed.

Then, in the process of molding the laminate 15 by heating and direct pressure molding to form a molded body 16, the sheet-like formed material 3 is once melted and softened and flows, and the softened resin is used as a frame plate with an opening. 2, the surface of the coating layer 18 provided on the circuit metal plate 1 is substantially the same as the surface of the sheet-like formation 3 in the gap between the circuits 7 in the circuit portion 6 of the circuit metal plate 1. It flows in until it is flush.

When removing the coating layer 18 from the molded body 16 obtained in this way, when the coating layer 18 is formed of a resin film, the coating layer 18 is peeled off and mechanically peeled off. Can be removed. When the coating layer 18 is formed of a liquid resist, it can be removed by dissolving the coating layer 18 with an alkaline solution or the like. Here, even when the resin softened during the molding of the molded body 16 reaches the surface of the coating layer 18 and is cured as it is to form burrs, the burrs of the resin cured product are removed together with the coating layer 18 into the molded body. Thus, it is possible to prevent the formation failure of the circuit 7 such that burrs adhere to the surface of the circuit metal plate 1.

The circuit board 17 obtained by subjecting the molded body 16 to a cutting process has a lower surface of the circuit 7 and a surface of the insulating layer 10 exposed between the circuits 7 than the surface of the circuit 7. The surface protrudes by the same dimension as the thickness of the coating layer 18. For this reason, the circuit 7 of the circuit board 17 is formed one step lower than the surface of the insulating layer 10, and a short circuit (bridge) between the circuits 7 due to solder or the like at the time of mounting electronic components on the circuit board 17 can be prevented. And
Further, the protruding portion of the insulating layer 10 between the circuits 7 serves as a barrier, which is advantageous in terms of insulation reliability. That is, the creepage distance between adjacent circuits 7 along the surface of the insulating layer 10 is increased by the protrusion of the insulating layer 10. As a result, sufficient electrical insulation between the circuits 7 can be ensured even if the intervals between the circuits 7 are formed narrower for miniaturization of the circuits 7. In order to ensure sufficient electrical insulation between the adjacent circuits 7, the protrusion size of the insulating layer 10 is preferably in the range of 10 to 1000 μm. If the protruding dimension is less than this range, it may be difficult to obtain sufficient electrical insulation. If the protruding dimension exceeds this range, the circuit 7 may be significantly recessed beyond the surface of the insulating layer 10, There is a possibility that a component mounting process such as printing and forming a solder resist on the surface of the circuit 7 may be affected.

In the above example, the circuit metal plate 1 is integrally formed with the opening frame plate 2, the sheet-like formation 3 and the heat dissipation metal plate 4 to form the molded body 16, and then the upper surface of the support portion 30 is formed. The groove 32 is formed on the upper surface of the boundary between the support 30 and the circuit 7 before the integral formation is performed, or the groove 32 is formed between the support 30 and the circuit 7. The groove 33 may be formed on the lower surface of the boundary.

In the example shown in FIG. 3, a groove 32 having a V-shaped cross section is previously formed on the upper surface of the boundary between the support portion 30 and the circuit 7 and the lower surface of the boundary between the support portion 30 and the circuit 7 is also formed on the lower surface. The V-shaped groove 33 is recessed. These grooves 32, 3
3 is formed so that the apexes at the bottom face each other while approaching vertically.

The circuit metal plate 1 thus formed
In the same manner as in the case shown in FIG. 1, the circuit board 17 is obtained by performing a punching process in the punching region 11 after lamination and integration.

One circuit section 6 is disposed on the upper surface of the circuit board 17, and a support section 30 is disposed on the outer edge of the circuit section 6.
Is slightly connected between the vertexes of the bottoms of the grooves 32 and 33.

Then, the supporting portion 30 is removed from each circuit board 17.
As in the case shown in FIG. 1, the removal is performed manually or by using a jig such as a clamp. At this time, the support 3
The groove 0 is easily removed because it is separated from the circuit 7 by the grooves 32 and 33 except for a portion that is slightly connected between the vertices at the bottoms of the grooves 32 and 33. By removing the support portion 30 in this manner, the circuit board 17 is removed.
A notch 34 having a shape in which the support portion 30 has been chipped is formed at the outer peripheral edge of the upper surface of the support member 30 at the position where the support portion 30 is disposed.

In the example shown in FIG. 4, a groove 32 having a V-shaped cross section is previously formed only on the upper surface of the boundary between the support portion 30 and the circuit 7.
Is recessed.

The circuit metal plate 1 thus formed
In the same manner as in the case shown in FIG. 1, the circuit board 17 is obtained by performing a punching process in the punching region 11 after lamination and integration.

One circuit section 6 is disposed on the upper surface of the circuit board 17, and a support section 30 is provided on the outer edge of the circuit section.
However, the support portion 30 is slightly connected to the circuit 7 at a portion below the vertex at the bottom of the groove portion 32.

The support portions 3 remaining on each circuit board 17
0 is removed manually as in the case shown in FIG. 1 or by using a jig such as a clamp. At this time, the support portion 30 is separated from the circuit 7 by the groove portion 32 except for a portion that is slightly connected below the vertex of the bottom portion of the groove portion 32, and thus is easily removed. By removing the support portion 30 in this manner, a cutout portion 34 having a shape in which the support portion 30 is cut off is formed on the outer peripheral edge of the upper surface of the circuit board 17 at the position where the support portion 30 is arranged.

In the example shown in FIG. 5, a groove 33 having a V-shaped cross section is previously formed only on the lower surface of the boundary between the support portion 30 and the circuit 7.
Is recessed.

The circuit metal plate 1 thus formed
In the same manner as in the case shown in FIG. 1, the circuit board 17 is obtained by performing a punching process in the punching region 11 after lamination and integration.

One circuit section 6 is arranged on the upper surface of the circuit board 17, and the groove 3 is formed on the outer edge of the circuit section 6.
A support 30 separated from the circuit 7 at 2 is arranged. At this time, the support portion 30 and the circuit 7 are slightly connected at a portion above the vertex at the bottom of the groove 33.

The support portions 3 remaining on each circuit board 17
0 is separated and removed manually as in the case shown in FIG. 1 or by using a jig such as a clamp. At this time, the support portion 30 is separated from the circuit 7 by the groove portion 33 except for a portion that is slightly connected at a portion above the vertex at the bottom of the groove portion 33, and thus is easily removed. By removing the support portion 30 in this manner,
At the outer peripheral edge of the upper surface of the circuit board 17, a cutout portion 34 having a shape in which the support portion 30 is chipped is formed at the position where the support portion 30 is arranged.

The circuit board 17 obtained as shown in FIG. 3 to FIG.
The circuit 7 is not exposed on the end face of the circuit board 17, and the occurrence of an inadvertent short circuit between the circuit 7 and the heat sink 14 is reliably prevented.

In the method of removing the support portions 30 from the circuit board 17 as described above, the grooves 32 and 33 are formed in the plurality of support portions 30 at once, so that the plurality of support portions 30 are formed.
Can be easily separated and removed. for that reason,
This is particularly effective when a large number of support portions 30 are formed in one circuit portion 6 and the circuit 7 formed in the circuit portion 6 is fine.

The above-described method shown in FIGS. 1 to 5 is adopted for the molded body 16 formed as shown in FIGS. 7A, 7B and 7C, 7D. Can be.

The structure of the molded body 16 shown in FIGS. 7A and 7B is the same as that of the molded body 16 shown in FIGS. A plurality of support portions 30 are partially formed by punching out the peripheral portion so as to partially leave the metal, and the peripheral portion is formed inside the peripheral portion. The plurality of circuits 7 and the frame section 5 around the circuit section 6 are integrated by a support section 30.

In such a molded body 16, grooves 32, 33 are formed in the circuit metal plate 1 before or after molding of the molded body 16 in a portion shown by a dashed line in the figure. Further, after the circuit board 17 is cut out from the molded body 16, the support portion 30 is removed from the circuit board 17.

The configuration of the molded body 16 shown in FIGS. 7C and 7D is such that a more complicated circuit is formed than in FIGS. 7A and 7B. Further, the support part 30 is a circuit part 6
Is formed so as to surround the entire periphery of the circuit 7 by allowing the metal to remain over the entire periphery at the periphery of the circuit 7, and the circuit 7 is integrated with the frame 5 via this support portion 30. .
In this way, a complicated circuit 7 can be easily formed on the circuit metal plate 1. As described above, even when the support portion 30 is formed over the entire periphery of the circuit portion 6, FIGS.
Similarly to the case shown in FIG. 1, grooves 32 and 33 are formed in the circuit metal plate 1 before or after the molded body 16 is formed at the portion indicated by the one-dot chain line in the figure. 1
After cutting out the circuit board 17 from 6, the support portion 30 can be removed from the circuit board 17.

On the other hand, in one circuit section 6, the circuit section 6
In the case where only a small number of support portions 30 are partially formed in the peripheral portion of the substrate and the circuit 7 formed in the circuit portion 6 is not fine, the groove portions 32 and 3 are formed with respect to the small number of support portions 30.
Rather than pulling and separating the support portions 30 after the formation of the support portions 3, the support portions 30 are removed from the circuit board 17 one by one by performing counterbore processing or the like on each of the support portions 30. If the method of (1) is adopted, the support portion 30 can be removed efficiently.

FIG. 6 shows an example of this, in which a circuit 7 having a small number and a simple shape is formed in one circuit portion 6 and a small number of support portions 3 are partially formed on the periphery of the circuit portion 6.
0 is formed in the groove 32,
By laminating and integrating the opening metal plate 2, the sheet-like formation 3, and the heat-dissipating metal plate 4 without forming 33,
Molded article 1 as shown in FIGS. 6 (a) and 7 (e) (f)
6 is obtained. The molded body 16 is subjected to a cutting process to remove the punched portion 11 to form a circuit board 17. Then, the support portion 30 is removed by subjecting the circuit board 17 to counterbore processing, and a cutout portion 34 is formed at the position of the support portion 30 at the outer edge of the upper surface of the circuit board 17.

In forming the circuit portion 6 on the circuit metal plate 1, as shown in FIG. 8, a thick portion and a thin portion are formed in a circuit 7 formed in one circuit portion 6. can do. In this case, desired electrical characteristics can be imparted to the circuit 7 by partially controlling the electrical characteristics of the circuit 7 such as electric resistance, allowable current, and electric capacity.

For example, in the case where a plurality of separated circuits 7 are formed in one circuit section 6, and the separated circuits 7 include a circuit having a narrow circuit width and a circuit having a wide circuit width. When the thickness of the circuit 7 is the same in all parts, the electric resistance increases in the part where the circuit width is small, and it is difficult to cope with an increase in current. Further, the circuit width of each of the plurality of separated circuits 7 may be changed to form a portion having a small circuit width and a portion having a large circuit width. In this case, the same problem occurs. On the other hand, if the circuit 7 is formed to have a large thickness in accordance with a portion where the circuit width is small, the cross-sectional area of the circuit 7 becomes too large in a portion where the circuit width is large, and the weight of the circuit 7 itself becomes excessive. On the other hand, as shown in FIG. 8, the circuit 7 having a large circuit width is formed to have a small thickness and the circuit 7 having a small circuit width is formed to have a large thickness. And the weight of the circuit 7 itself can be prevented from becoming excessive.

The circuit metal plate 1 in which the thick portion and the thin portion are formed in the circuit 7 of one circuit portion 6 in this manner.
Can be manufactured by using a metal plate having the same thickness as the thickest part of the circuit 7. In this case, the thickness of the circuit 7 can be made partially different by partially reducing the thickness by subjecting the metal plate to a polishing process, an etching process, or the like. Here, the circuit 7 is
In order to partially reduce the thickness of the metal plate, a resist pattern using an etching resist is formed on the back surface of the metal plate so that the portion where the circuit 7 is formed and the portion to be reduced in thickness is exposed. Is immersed in an etchant for an appropriate time to perform an etching treatment, further remove the etching resist, and then perform pattern alignment to punch out the circuit 7. As the etching resist, a film made of solder, a film of a resin composition, or the like can be used.

[0099]

The present invention will be described below in detail with reference to examples.

The following components were used as the components in Table 1.・ Coupling agent: γ-glycidoxypropyltrimethoxysilane ・ Dispersant: “A208F” manufactured by Daiichi Kogyo Pharmaceutical Co., Ltd. ・ MEK: Methyl ethyl ketone ・ DMF: Dimethylformamide ・ Cresol novolak resin: “ESCN195XL4” manufactured by Sumitomo Chemical Co., Ltd.・ Polyfunctional bisphenol A type epoxy resin: “VG3101” manufactured by Mitsui Chemicals, Inc. ・ Phenoxy resin: “YP5” manufactured by Toto Kasei Co., Ltd.
0 "-Brominated bisphenol type epoxy resin:" ESB400T "manufactured by Sumitomo Chemical Co., Ltd.-Phenol novolak resin:" Tamanol 752 "manufactured by Gunei Chemical Co., Ltd.-DICY: Dicyandiamide manufactured by Nippon Carbide Co., Ltd.-Curing accelerator a: Shikoku Chemicals, 2-ethyl-4-
Methyl imidazole (2E4MZ) Curing accelerator b: tetraphenylphosphonium tetraphenyl borate (TPPK) represented by the formula (1):
Reaction product with the phenol novolak resin represented by the formula (2) Here, the curing accelerator b is a tetraphenylphosphonium tetraphenyl borate (TP) represented by the formula (1)
PK) 25 parts by mass, the content of trinuclear (n = 1) is 70% by mass, and the content of binuclear (n = 0) is 10
Phenol novolak having a softening temperature of 63 ° C. in which the content of tetranuclear (n = 2) is 16% by mass and the content of pentanuclear or more (n = 3 or more) is 5% by mass. 80 parts by mass of the compound was placed in a 500 ml stainless beaker, and stirred in an 185 ° C. oil bath for 3 hours to obtain a uniform transparent brown reaction product (TPPK-A).

The heat-dissipating metal plate 4, sheet-like formed material 3, frame plate 2 with opening, and metal plate 1 for circuit used in each of the following examples and comparative examples have dimensions of 300 m in plan view.
The circuit portion 6 and the opening 9 were formed in dimensions of 45 mm × 75 mm at intervals of 20 mm unless otherwise specified.

Example 1 A slurry containing 70 wt% of alumina and having the composition shown in Table 1 was kneaded at room temperature by a planetary mixer. Add a solvent to this and add 700m
After adjusting the pressure to Pa · s, the glass non-woven fabric (Olivest Co., Ltd .; SAS type; 53 g / m 3 ; thickness 0.4 mm) was impregnated, and then dried in a drying oven at 90 ° C. for 1 hour (rate 0.03).
m / min) and dried to produce a B-stage prepreg having a thickness of 400 μm as a sheet-like product 3.

Using one sheet-form product 3,
Are laminated in this order on a metal plate 4 for heat radiation made of aluminum, a sheet-shaped product 3, a frame plate 2 made of aluminum and a circuit metal plate 1 made of copper, and a pressure 3 under a high vacuum of 66.7 hPa or less. The molded product 16 was obtained by performing heat and pressure molding at a temperature of 175 ° C. for 30 minutes, laminating and integrating, and further heating at 175 ° C. for 6 hours to perform after-curing.

A groove 32 having a V-shaped cross section was formed at the boundary between the supporting portion 30 of the molded body 16 and the circuit 7 and then punched to obtain a circuit board 17.

(Example 2) Table 1 containing 75 wt% of magnesium oxide in producing the sheet-like formed material 3
The sheet-like formed material 3 was laminated and used by using a slurry having a composition shown in FIG. Otherwise, the procedure of Example 1 was followed to obtain a circuit board 17.

(Example 3) A slurry containing 75 wt% of boron nitride and having the composition shown in Table 1 was used, and Example 1 was used.
In the same manner as in the above, a prepreg was produced as the sheet-like formed material 3.

The three sheet-like products 3 were laminated and used, and as shown in Table 1, the heat-dissipating metal plate 4 made of aluminum, on which the heat-radiating fins 19 were formed, the sheet-like product 3, and the opening made of the laminate plate A frame plate 2 and a copper circuit metal plate 1 made of copper are laminated in this order,
Under high vacuum of 66.7 hPa or less, pressure of 3.92MP
a, Heat-press molding was performed at a temperature of 175 ° C. for 30 minutes to perform lamination and integration, followed by heating at 175 ° C. for 6 hours to perform after-curing, thereby obtaining a molded body 16.

A groove 32 having a V-shaped cross section was formed at the boundary between the supporting portion 30 of the molded body 16 and the circuit 7 and then punched to obtain a circuit board 17.

Here, an aramid nonwoven copper-clad laminate obtained as follows was used as a laminate for forming the frame plate 2 with openings.

10 parts by mass of a cresol novolak type epoxy resin (“YDCN-220” manufactured by Toto Kasei) and a brominated bisphenol A type epoxy resin (“YD” manufactured by Toto Kasei)
B-500 "), an epoxy resin varnish was prepared by mixing 3 parts by mass, 0.2 parts by mass of benzyldimethylamine as a curing agent, and 50 parts by mass of methyl ethyl ketone as a solvent.

Then, a non-woven fabric made of aramid fiber ("Technola" manufactured by Teijin Limited) is used as a base material, and the base material is impregnated with the epoxy resin varnish described above.
For 10 minutes to obtain a prepreg. The resin amount of this prepreg was 70 parts by mass.

[0112] Ten prepregs were stacked, and a copper foil having a thickness of 35 µm was further stacked on both sides thereof.
The copper-clad laminate having a thickness of 1.0 mm was obtained by heating and pressing under the conditions of 4 MPa for 120 minutes.

(Example 4) 85 wt% of aluminum nitride
% Of the slurry having the composition shown in Table 1 was kneaded with a planetary mixer. A solvent was added to this to adjust the viscosity to 15000 mPa · s, and then applied to a 185 μm-thick release carrier film (made of polyethylene terephthalate) with a comma coater to a thickness of 400 μm.
The resin was passed through a drying oven at 90 ° C. for 1 hour (at a speed of 0.03 m / min) and dried to produce a B-stage resin sheet as a sheet-like product 3.

Using one sheet-form product 3,
The metal plate 4 for heat dissipation made of aluminum, the sheet-like formed material 3, the frame plate 2 with copper opening, and the metal plate 1 for circuit made of copper are laminated in this order, and under a high vacuum of 66.7 hPa or less, a pressure of 3.
The laminate was integrated by heating and pressing at 92 MPa and a temperature of 175 ° C. for 30 minutes, and then laminated and integrated, and further heated at 175 ° C. for 6 hours to perform after-curing, thereby obtaining a molded body 16.

A groove 32 having a V-shaped cross section was formed at the boundary between the support portion 30 of the molded body 16 and the circuit 7 and then punched to obtain a circuit board 17.

Example 5 A slurry shown in Table 1 containing 85 wt% of silica was kneaded with a planetary mixer, the viscosity was adjusted to 15,000 mPa · s by adding a solvent, and 400 μm on a PET film with a comma coater.
And dried as a sheet-like product 3 to produce a B-stage resin sheet.

[0117] One sheet-form product 3 was used.
The metal plate 4 for heat dissipation made of aluminum, the sheet-like formed material 3, the frame plate 2 with copper opening, and the metal plate 1 for circuit made of copper are laminated in this order, and under a high vacuum of 66.7 hPa or less, a pressure of 3.
The laminate was integrated by heating and pressing at 92 MPa and a temperature of 175 ° C. for 30 minutes, and then laminated and integrated.

A groove 32 having a V-shaped cross section was formed at the boundary between the support 30 of the molded body 16 and the circuit 7, and then punching was performed to obtain a circuit board 17.

Example 6 A slurry containing 95 wt% of alumina and having the composition shown in Table 1 was first kneaded at room temperature using a planetary mixer, and secondarily kneaded using a three-roll mill. It was prepared as a slurry of viscosity.
A solvent was added thereto to adjust the viscosity to 20,000 mPa · s, and a 185 μm-thick release carrier film (made of polyethylene terephthalate) was PET-coated with a comma coater.
After the film was applied to a thickness of 400 μm on the film, it was passed through a drying oven at 90 ° C. for 1 hour (at a speed of 0.03 m / min) and dried, and a B-stage resin sheet was formed as the sheet-like product 3.

[0120] Two sheets of the sheet-like formed material 3 were laminated and used, and a heat-dissipating metal plate 4 made of aluminum, a sheet-shaped formed material 3, a frame plate 2 made of aluminum and an iron 60 shown in Table 1 were used.
% -Nickel 40% Invar circuit metal plate 1 is laminated in this order, and the pressure is 4.9 under a high vacuum of 66.7 hPa or less.
The laminate was integrated by heating and pressing at 0 MPa and a temperature of 175 ° C. for 30 minutes, and was further subjected to after-curing by heating at 175 ° C. for 6 hours to obtain a molded body 16.

A groove 32 having a V-shaped cross section was formed at the boundary between the support portion 30 of the molded body 16 and the circuit 7 and then punched to obtain a circuit board 17.

Comparative Example 1 A slurry containing 85 wt% of alumina and having the composition shown in Table 1 was kneaded with a planetary mixer. A solvent was added to the mixture to increase the viscosity to 1000.
After adjusting to mPa · s, glass nonwoven fabric (Olivest Co., Ltd .; SAS type; 53 g / m 3 ; thickness 0.4 mm)
After that, the drying oven at 90 ° C was heated for 1 hour (at a speed of 0.0
(3 m / min) and dried to prepare a prepreg in a B-stage state having a thickness of 400 μm as a sheet-like product 3. Here, DMF which is a high boiling point solvent is used as a solvent in order to dissolve dicyandiamide used as a curing agent.

Using one sheet-form product 3,
, A heat-dissipating metal plate 4 made of aluminum, a sheet-like formed material 3, and a copper-made circuit metal plate 1 (copper foil) having a thickness of 105 μm are laminated in this order under a high vacuum of 66.7 hPa or less.
It was heated and pressed at a pressure of 3.92 MPa and a temperature of 175 ° C. for 2 hours, and was laminated and integrated to obtain a molded body 16.

A groove 32 having a V-shaped cross section was formed at the boundary between the support portion 30 of the molded body 16 and the circuit 7 and then punched to obtain a circuit board 17.

Comparative Example 2 Comparative Example 1 was conducted except that a copper circuit metal plate 1 (copper foil) having a thickness of 35 μm was used.
A circuit board 17 was obtained in the same manner as described above.

(Comparative Example 3) A circuit board 17 was obtained in the same manner as in Comparative Example 1, except that a prepreg in a B-stage state having a thickness of 400 µm was prepared as the sheet-like product 3.

(Evaluation Test) Measurement of Thermal Conductivity Measurement was performed by a steady plate comparison method. At this time, as a sample, an appropriate number of the sheet-like formations 3 used in each of the examples and comparative examples were laminated to a thickness of 800 μm,
The insulating layer 10 was formed as a single plate of 40 × 40 mm by integrating by heating and pressing, and the single plate was measured.

Evaluation of Permissible Current Since the permissible current is proportional to the circuit thickness, the permissible current was evaluated based on the circuit thickness, taking the case where the circuit thickness was 35 μm as 1.

Measurement of coefficient of thermal expansion The coefficient of thermal expansion between 40 ° C. and 175 ° C. was measured using a TMA measuring instrument, and each sample was evaluated by the coefficient of thermal expansion up to the glass transition temperature.

Withstand Voltage Measurement The circuit board 17 was manufactured by the method shown in each of the examples and comparative examples.
Formed in a disk shape having a diameter of 25 mm. In accordance with JIS K6901, a voltage is applied between the circuit 7 and the radiator plate 12 in oil to make the circuit board 17 500 V /
The voltage was raised in seconds, and the voltage at which dielectric breakdown occurred (breakdown voltage) was measured.

[0131]

[Table 1]

[0132]

As described above, the method of manufacturing a circuit board according to the first aspect of the present invention comprises a plurality of circuit portions on which circuits are formed and a frame portion formed so as to partition between adjacent circuit portions. A metal plate for a circuit configured, an opening formed in a portion corresponding to a circuit portion of the metal plate for a circuit, and a frame plate with an opening configured to partition between the openings,
A sheet-like formed product obtained by forming the resin composition into a sheet, and a heat-dissipating metal plate for forming a heat-dissipating plate are sequentially laminated by aligning the circuit portion of the circuit-forming metal plate with the opening of the opening frame plate. After integrally forming the metal plate for circuit, the circuit metal plate of the formed molded body and the frame portion of the frame plate with an opening are subjected to a cutting process to form a thick metal plate for circuit. The thickness of the circuit can be increased so that the current can be easily increased, and the frame portion of the opening frame plate serves as a spacer, so that even if the molded body is formed in a large area, the metal for the circuit can be formed. The gap between the plate and the metal plate for heat radiation can be kept constant, and the thickness of the insulating layer formed in this gap can be easily controlled. Jigs and the like hardly pass through the insulating layer. It is possible to suppress the wear of the jig due to the polishing effect of the filled inorganic filler, to prolong the life, and to efficiently produce a circuit board having high heat radiation. .

The invention described in claim 2 is the same as the invention described in claim 1.
Resin varnish obtained by dispersing, in a solvent, a resin composition containing a thermosetting resin, a curing agent, a curing accelerator, and an inorganic filler, and having a content of the inorganic filler of 70 to 95% by mass, in addition to the configuration of Since the prepreg obtained by impregnating the nonwoven fabric substrate and drying is used as a sheet-shaped product, the insulating layer of the circuit board can be formed with a sheet-shaped product highly filled with an inorganic filler, and the circuit can be formed. The heat radiation of the substrate can be improved.

The invention described in claim 3 is the first invention.
Resin varnish obtained by dispersing, in a solvent, a resin composition containing a thermosetting resin, a curing agent, a curing accelerator, and an inorganic filler, and having a content of the inorganic filler of 70 to 95% by mass, in addition to the configuration of Was used as a sheet-like product obtained by applying the resin onto a film and then drying, so that the insulating layer of the circuit board could be formed with a sheet-like product highly filled with an inorganic filler, Can improve the heat dissipation.

The invention according to claim 4 is characterized in that, in addition to the constitution of claim 2 or 3, Al 2 O 3 ,
Since at least one kind selected from MgO, BN, AlN and SiO 2 was used, these fillers have excellent thermal conductivity and can improve the heat radiation of the circuit board. It has flexibility and easy particle size design for high packing.

According to a fifth aspect of the present invention, in addition to the constitution of any one of the first to fourth aspects, the present invention is also applicable to the case where a coating layer having heat resistance and release properties is mounted on the surface of the circuit metal plate. In order to perform the integral molding, the burr of the resin cured product formed by curing the sheet-like formed material deformed in the heating and pressurizing step while wrapping around the coating layer is also removed when the coating layer is removed. Thus, it is possible to prevent burrs from adhering to the circuit and improve the circuit forming accuracy. Also, in the heat conductive substrate obtained as a result of removing the covering layer, the circuit and the surface of the insulating layer protruding from the circuit between the circuits are formed on the circuit forming surface, and between the adjacent circuits, The creepage distance along the surface of the insulating layer is increased by the amount of protrusion of the surface of the insulating layer, and even if the space between the circuits is narrowed for miniaturization of the circuit, the electrical insulation between adjacent circuits is improved. It can be secured.

According to a sixth aspect of the present invention, in addition to any one of the first to fifth aspects, the metal plate for circuit, the frame plate with openings, and the metal plate for heat radiation are made of copper, aluminum, iron,
Since an alloy containing at least one of these metals, a clad material made of a plurality of metal materials, and an alloy made of at least one material selected from an alloy made of a plurality of metal materials are used, heat dissipation is achieved. And a circuit board having excellent strength can be obtained.

According to a seventh aspect of the present invention, in addition to the configuration according to any one of the first to sixth aspects, a supporting portion for integrating the circuit and the frame portion is formed on a peripheral portion of the circuit portion. Using a circuit metal plate having a circuit formed inside the support portion, a groove was recessed at the boundary between the circuit and the support portion of the circuit metal plate before or after molding of the molded body, and cut out from the molded body. Since the supporting portion is removed from the circuit board, it is possible to prevent the heat radiating plate and the circuit from approaching each other at the end face of the circuit board and to secure insulation between the heat radiating plate and the circuit.

The invention according to claim 8 provides the heat radiation metal plate according to any one of claims 1 to 7,
Since the heat radiation fins are integrally formed, the heat radiation characteristics can be improved by being integrated without forming a gap between the heat radiation plate and the heat radiation fins.

According to a ninth aspect of the present invention, in addition to any one of the first to eighth aspects, the circuit metal plate further comprises:
Because a circuit formed in one circuit part is formed with a thick part and a thin part, a part with a narrower circuit width can be made thicker or a part with a wider circuit width can be formed. The circuit can be provided with desired electrical characteristics such as electric resistance, allowable current, and electric capacity, for example, by forming a thinner film.

The invention according to claim 10 is the first invention.
In addition to any one of the above-described configurations, the opening frame plate is formed of a synthetic resin plate or a synthetic resin composite substrate. When cutting is performed at a certain position, the load required for cutting can be reduced, and the cutting can be easily performed.

[Brief description of the drawings]

FIG. 1 shows an example of an embodiment of the present invention,
(A) to (e) are cross-sectional views.

FIG. 2 shows another example of the embodiment of the present invention,
(A)-(e) is sectional drawing.

FIG. 3 shows still another example of the embodiment of the present invention, and (a) to (e) are cross-sectional views.

FIG. 4 shows still another example of the embodiment of the present invention, and (a) to (e) are cross-sectional views.

5 shows still another example of the embodiment of the present invention, and (a) to (e) are cross-sectional views. FIG.

6 shows still another example of the embodiment of the present invention, wherein (a) to (c) are cross-sectional views, and (d) is a plan view of (c). FIG.

7 (a) and 7 (b) show examples of a molded article according to the present invention, and FIGS. 7 (c) and 7 (d) show other examples of a molded article according to the present invention.
(E) and (f) show still another example of the molded article of the present invention, wherein (a), (c) and (e) are plan views, and (b)
(D) and (f) are cross-sectional views.

8 (a) and 8 (b) show still another example of the molded article of the present invention, (c) and (d) show still another example of the molded article of the present invention, and (e) and (f) show the examples of the present invention. FIGS. 6A and 6B show still another example of a molded body, in which FIGS.
(D) and (f) are cross-sectional views.

FIG. 9 shows an example of the prior art, in which (a)
(B) is a sectional view, respectively.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 metal plate for circuit 2 frame plate with opening 3 sheet-shaped product 4 metal plate for heat radiation 5 frame 6 circuit 7 circuit 8 frame 9 opening 16 molded body 17 circuit board 18 coating layer 19 heat radiation fin 30 support 32 groove 33 groove

Claims (10)

[Claims]
1. A circuit metal plate constituted by a plurality of circuit portions on which circuits are formed and a frame portion formed so as to partition between adjacent circuit portions, and a circuit portion corresponding to the circuit portion of the circuit metal plate. An opening frame plate formed of an opening formed at a location and a frame portion formed so as to partition between the openings, a sheet-like formed product obtained by forming the resin composition into a sheet, and a heat sink for forming After the heat-dissipating metal plate and the circuit portion of the circuit-forming metal plate and the opening of the frame plate with openings are sequentially laminated and integrally molded, the formed molded product is provided with the circuit-forming metal plate and the opening. A method of manufacturing a circuit board, comprising cutting a portion of a frame plate where a frame portion is arranged.
2. A resin varnish obtained by dispersing a resin composition containing a thermosetting resin, a curing agent, a curing accelerator and an inorganic filler and having an inorganic filler content of 70 to 95% by mass in a solvent. The method for producing a circuit board according to claim 1, wherein a prepreg obtained by impregnating the nonwoven fabric substrate and drying is used as a sheet-shaped product.
3. A resin varnish obtained by dispersing a resin composition containing a thermosetting resin, a curing agent, a curing accelerator and an inorganic filler and having an inorganic filler content of 70 to 95% by mass in a solvent. The method for producing a circuit board according to claim 1, wherein a resin sheet obtained by applying the composition on a film and then drying is used as a sheet-like product.
4. As an inorganic filler, Al 2 O 3 , Mg
4. The method according to claim 2, wherein at least one selected from the group consisting of O, BN, AlN and SiO 2 is used.
3. The method for manufacturing a circuit board according to claim 1.
5. The circuit board according to claim 1, wherein the circuit board is formed integrally with a cover layer having heat resistance and releasability attached to the surface of the circuit metal plate. Manufacturing method.
6. A metal plate for a circuit, a frame plate with an opening, and a metal plate for heat radiation, copper, aluminum, iron, an alloy containing at least one of these metals, a clad material made of a plurality of kinds of metal materials, and a plurality of 6. The method for manufacturing a circuit board according to claim 1, wherein a material formed from at least one kind of material selected from alloys made of various kinds of metal materials is used.
7. A circuit metal plate in which a support portion for integrating a circuit and a frame portion is formed at a peripheral portion of a circuit portion and a circuit metal plate having a circuit formed inside the support portion is used, before or after forming a molded body. The groove according to any one of claims 1 to 6, wherein a groove is formed at a boundary between the circuit and the support portion of the circuit metal plate, and the support portion is removed from a circuit board cut out of the molded body. A method for manufacturing a circuit board.
8. The method for manufacturing a circuit board according to claim 1, wherein a heat radiating fin is integrally formed as the heat radiating metal plate.
9. The circuit metal plate according to claim 1, wherein a circuit formed in one circuit portion is formed with a thick portion and a thin portion. 3. The method for manufacturing a circuit board according to claim 1.
10. The method for manufacturing a circuit board according to claim 1, wherein the frame plate with an opening is formed of a synthetic resin plate or a synthetic resin composite substrate.
JP2000062448A 2000-03-07 2000-03-07 Method for manufacturing circuit board Withdrawn JP2001251037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000062448A JP2001251037A (en) 2000-03-07 2000-03-07 Method for manufacturing circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000062448A JP2001251037A (en) 2000-03-07 2000-03-07 Method for manufacturing circuit board

Publications (1)

Publication Number Publication Date
JP2001251037A true JP2001251037A (en) 2001-09-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000062448A Withdrawn JP2001251037A (en) 2000-03-07 2000-03-07 Method for manufacturing circuit board

Country Status (1)

Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003083940A1 (en) * 2002-03-29 2003-10-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing heat conductive substrate
JP2009033882A (en) * 2007-07-27 2009-02-12 Sanyo Electric Co Ltd Power supply device for vehicle
JP2011217604A (en) * 2011-06-14 2011-10-27 Sanyo Electric Co Ltd Power supply device for vehicle

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003083940A1 (en) * 2002-03-29 2003-10-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing heat conductive substrate
US7279365B2 (en) 2002-03-29 2007-10-09 Matsushita Electric Industrial Co., Ltd. Method of manufacturing heat conductive substrate
JP2009033882A (en) * 2007-07-27 2009-02-12 Sanyo Electric Co Ltd Power supply device for vehicle
JP2011217604A (en) * 2011-06-14 2011-10-27 Sanyo Electric Co Ltd Power supply device for vehicle

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