CN109688696A - Circuit board arrangement, the manufacture craft of circuit board arrangement and electronic equipment - Google Patents
Circuit board arrangement, the manufacture craft of circuit board arrangement and electronic equipment Download PDFInfo
- Publication number
- CN109688696A CN109688696A CN201910008835.4A CN201910008835A CN109688696A CN 109688696 A CN109688696 A CN 109688696A CN 201910008835 A CN201910008835 A CN 201910008835A CN 109688696 A CN109688696 A CN 109688696A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electronic device
- heat dissipation
- perforation
- supporting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention discloses a kind of circuit board arrangement, including first circuit board, second circuit board and heat dissipation supporting layer, the plate face of the first circuit board towards the second circuit board is equipped with the first electronic device, the plate face of the second circuit board towards the first circuit board is provided with the second electronic device, the heat dissipation supporting layer is arranged between the first circuit board and the second circuit board, and first electronic device and second electronic device are embedded in the heat dissipation supporting layer.Invention additionally discloses a kind of production method of circuit board arrangement and electronic equipments.Above scheme, which is able to solve current board structure of circuit, has that heat dissipation performance is poor.
Description
Technical field
The present invention relates to a kind of circuit board arrangement, the manufacture craft of circuit board arrangement and electronic equipments.
Background technique
With the promotion of user demand, the function of electronic equipment is more and more, and the direct performance that increases of function is electronics
The electronic device of integration of equipments is more and more, but the enclosure interior space of electronic equipment increases there is no corresponding, or even does not have
It changes.In such cases, how in a limited space in integrate more electronic devices be designer research and development emphasis.
The electronic device of electronic equipment is largely integrated on the intracorporal circuit board of shell, empty in order to solve to lay on circuit board
Between insufficient problem, current electronic equipment uses Multi-layer circuit board structure, and at least two-tier circuit sheetpile stacks, adjacent
It is supported between two-tier circuit plate by frame plate, such board structure of circuit can make full use of the sky of the thickness direction of electronic equipment
Between, achieve the purpose that provide more installation sites.
Although the hardened structure of foregoing circuit is able to achieve the integrated installation of more electronic devices, but electronic device distribution is closeer,
And then the local temperature rise that will lead to electronic equipment is very fast, eventually results in the performance decline of electronic equipment.As it can be seen that above structure
Board structure of circuit has that heat dissipation effect is poor.
Summary of the invention
The present invention discloses a kind of circuit board arrangement, and with the board structure of circuit that solves current stack design, there are heat dissipation performances
Poor problem.
To solve the above-mentioned problems, the present invention adopts the following technical solutions:
A kind of circuit board arrangement, including first circuit board, second circuit board and heat dissipation supporting layer, the first circuit board court
The first electronic device, plate of the second circuit board towards the first circuit board are installed to the plate face of the second circuit board
Face is provided with the second electronic device, and the heat dissipation supporting layer is arranged between the first circuit board and the second circuit board,
First electronic device and second electronic device are embedded in the heat dissipation supporting layer.
A kind of manufacture craft of circuit board arrangement, comprising:
First electronic device and the second electricity are installed respectively in two opposite plate faces of first circuit board and second circuit board
Sub- device；
It is supported between the first circuit board and the second circuit board using supporting block, so that first circuit
Filling space is formed between plate and the second circuit board, first electronic device and second electronic device are located at described
It fills in space；
Heat sink material is filled into the filling space to form heat dissipation supporting layer；
Dismantle the supporting block.
A kind of electronic equipment, including circuit board arrangement described above.
The technical solution adopted by the present invention can reach it is following the utility model has the advantages that
In circuit board arrangement disclosed by the invention, heat dissipation supporting layer is arranged between first circuit board and second circuit board,
And then can be realized first circuit board and be connected with the stacking of second circuit board, the first electronic device and the second electronic device can bury
It is located between heat dissipation supporting layer, to can also be radiated by heat dissipation supporting layer.Compared to the heap for realizing circuit board using frame plate
For folded, circuit board arrangement disclosed by the invention substitutes frame plate by heat dissipation supporting layer and realizes support, and heat dissipation supporting layer has
The ability of heat dissipation, therefore it is closeer due to stacking preferably to solve electronic device, the local temperature rise of caused electronic equipment compared with
Fast problem.It will be apparent that be able to solve current circuit board arrangement heat dissipation performance poor for circuit board arrangement disclosed by the invention
Problem.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes a part of the invention, this hair
Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of circuit board arrangement disclosed by the embodiments of the present invention；
Fig. 2 is the production process schematic diagram of circuit board arrangement disclosed by the embodiments of the present invention；
The schematic diagram of supporting block is arranged in Fig. 3 between first circuit board and second circuit board；
Fig. 4 is the structural schematic diagram of setting heat dissipation supporting layer in structure shown in Fig. 3；
Fig. 5 is the flow diagram of the conductive part of setting electrical connection first circuit board and second circuit board in the present embodiment.
Description of symbols:
100- first circuit board；200- second circuit board, 300- heat dissipation supporting layer, the first electronic device of 400-, 500- the
Two electronic devices, 600- conductive part, 700- supporting block, 800- third electronic device, 900 the 4th electronic devices.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with the specific embodiment of the invention and
Technical solution of the present invention is clearly and completely described in corresponding attached drawing.Obviously, described embodiment is only the present invention one
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
Below in conjunction with attached drawing, technical solution disclosed in each embodiment that the present invention will be described in detail.
Referring to FIG. 1, the embodiment of the present invention discloses a kind of circuit board arrangement, disclosed circuit board arrangement includes the first electricity
Road plate 100, second circuit board 200 and heat dissipation supporting layer 300.
First circuit board 100 and second circuit board 200 are for installing electronic device, in the present embodiment, first circuit board 100
Electronic device can be installed with the plate face of the two sides of second circuit board 200.
In the present embodiment, the plate face of first circuit board 100 towards second circuit board 200 is equipped with the first electronic device 400,
The plate face of second circuit board 200 towards first circuit board 100 is equipped with the second electronic device 500.Certainly, first circuit board 100
Third electronic device 800 can be installed away from the plate face of second circuit board 200, second circuit board 200 deviates from first circuit board
100 plate face can be equipped with the 4th electronic device 900.
Heat dissipation supporting layer 300 is formed by heat sink material, has certain intensity, and then can play the role of support, really
It protects first circuit board 100 and the relative position of second circuit board 200 does not change.The setting of supporting layer 300 radiate in the first electricity
Between road plate 100 and second circuit board 200, and then second circuit board 200 can be supported in the plate face of first circuit board 100.
First electronic device 400 and the second electronic device 500 are embedded in heat dissipation supporting layer 300.In the process of work, the first electricity
The heat that sub- device 400, the second electronic device 500, first circuit board 100 and second circuit board 200 generate can be supported by heat dissipation
Layer 300 removes.
In circuit board arrangement disclosed by the embodiments of the present invention, heat dissipation supporting layer 300 is arranged in first circuit board 100 and second
Between circuit board 200, and then it can be realized first circuit board 100 and be connected with the stacking of second circuit board 200, the first electronic device
400 and second electronic device 500 can be embedded in heat dissipation supporting layer 300 between, to can also be dissipated by heat dissipation supporting layer 300
Heat.For the stacking for realizing circuit board using frame plate, circuit board arrangement disclosed by the embodiments of the present invention passes through heat dissipation
Supporting layer 300 substitutes frame plate and realizes support, and heat dissipation supporting layer 300 has the ability of heat dissipation, therefore can preferably solve electricity
Sub- device is due to stacking closeer, the very fast problem of the local temperature rise of caused electronic equipment.It will be apparent that electricity disclosed in the present embodiment
Road panel assembly is able to solve the poor problem of current circuit board arrangement heat dissipation performance.
For frame plate, the heat dissipation formation of supporting layer 300 is relatively easy to, therefore cost is relatively low.In preferred scheme,
Heat dissipation supporting layer 300 is formed after usually being solidified by heat sink material, and in such cases, there is no frame plates to put down for heat dissipation supporting layer 300
Whole degree problem more rambunctious, can preferably improve the yield of circuit board arrangement.
Heat dissipation supporting layer 300 has heat sink material to be formed, and heat dissipation supporting layer 300 can be able to be silicone resin with epoxy resin layer
Layer, can also be the heat dissipating layer made of other heat sink materials certainly, and the present embodiment does not limit specific kind of heat dissipation supporting layer 300
Class.
First electronic device 400 and second is installed respectively in the plate face opposite with second circuit board 200 of first circuit board 100
Electronic device 500.First electronic device 400 and the second electronic device 500 can realize installation using multi-party distribution mode.It is preferred that
Scheme in, can have space between two adjacent the first electronic devices 400, the second electronic device 500 can be with space
It is oppositely arranged.In such cases, the first electronic device 400 and the second electronic device 500 are in the state being staggered, and then can drop
Low mutual interference.Under normal conditions, the equal more than one of quantity of the first electronic device 400 and the second electronic device 500, it is above-mentioned
In distribution mode, space, each second electronic device can be set between two the first electronic devices 400 of arbitrary neighborhood
500 are oppositely arranged with a space.By the way of above-mentioned distribution, the first electronic device 400 and the second electronics device are enabled to
Part 500 is easier to accomplish in the stacking direction not influenced by mutual height, and then enables to first circuit board 100 and second
The distance between circuit board 200 shortens, so as to reduce the integral stacked thickness of circuit board arrangement.
Certainly, the first electronic device 400 and the second electronic device 500 are perpendicular to first circuit board 100 or second circuit
The sum of the size of board direction of plate 200 can also be equal to, less than or equal to the thickness value of heat dissipation supporting layer 300.Preferred side
In case, the first electronic device 400 and the second electronic device 500 are in the plate perpendicular to first circuit board 100 or second circuit board 200
The sum of the size in face direction can be greater than the thickness value of heat dissipation supporting layer 300, and in such cases, the second electronic device 500 can be with
It extends within opposite space, and then enables to the stack thickness of circuit board arrangement thinner.It will be apparent that the circuit of such structure
Panel assembly is conducive to electronic equipment and designs towards thinner direction.Certainly, the stack thickness of circuit board arrangement is smaller, the first circuit
Signal transmission distance between plate 100 and second circuit board 200 is shorter, and then can be reduced the loss in signals transmission, reaches
To better signal transmission effect.
In the present embodiment, it can be electrically connected between first circuit board 100 and second circuit board 200, it can also be without electricity
Connection only realizes that physics stacks to provide installation site for electronic device.
Under normal conditions, it needs to be electrically connected between first circuit board 100 and second circuit board 200, and then is easier to realize
Whole circuit board device uniformly connects electricity.Based on this, in preferred scheme, circuit board arrangement disclosed in the present embodiment can also be wrapped
Conductive part 600 is included, one end of conductive part 600 is electrically connected with first circuit board 100, and the other end of conductive part 600 passes through heat dissipation branch
It supports layer 300 and is electrically connected with second circuit board 200.In the present embodiment, conductive part 600 can be in heat dissipation 300 formation of supporting layer
Preceding realization installation can also install after heat dissipation supporting layer 300 is formed.
In preferred scheme, in first circuit board 100 and second circuit board 200, at least one offers the first perforation, dissipates
Hot supporting layer 300 offers the second perforation with the first perforation perforation, and conductive part 600 is mounted on the first perforation and the second perforation
In, and then realize being electrically connected between first circuit board 100 and second circuit board 200.In the present embodiment, conductive part 600 can be with
For the conducting resinl being filled in the first perforation and the second perforation, or the metal being fixed in the first perforation and the second perforation
Stick, such as copper rod, aluminium bar.
In preferred scheme, first circuit board 100 and second circuit board 200 can offer the first perforation, Jin Erneng
It is enough to realize the effect for more neatly installing conductive part 600.
Based on circuit board arrangement disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of production of circuit board arrangement
Technique, referring to FIG. 2, disclosed manufacture craft includes:
S101, first electronics device is installed respectively in two opposite plate faces of first circuit board 100 and second circuit board 200
Part 400 and the second electronic device 500.
Certainly, this step can also install third in the plate face that first circuit board 100 deviates from second circuit board 200 simultaneously
Electronic device 800 can also install the 4th electronics device in the plate face that second circuit board 200 deviates from first circuit board 100 simultaneously
Part 900.
S102, it is supported between first circuit board 100 and second circuit board 200 using supporting block 700.
The purpose of this step is, first circuit board 100 is isolated with second circuit board 200 in advance using supporting block 700
It opens, so that filling space is formed between first circuit board 100 and second circuit board 200, the first electronic device 400 and the second electricity
Sub- device 500 is located in filling space, as shown in Figure 3.
S103, heat sink material is filled into filling space to form heat dissipation supporting layer 300.
Heat dissipation supporting layer 300 is formed in usual the present embodiment using the heat sink material solidified after capable of being cooled, thus shape
At support construction, as shown in Figure 4.
S104, disassembly supporting block 700.
Circuit board arrangement shown in FIG. 1 is formed after supporting block 700 is dismantled.
The advantages of circuit board arrangement formed by the manufacture craft, can refer to the beneficial effect description of device part above i.e.
Can, details are not described herein.
It as described above, can be in the circuit board arrangement being fabricated to, between first circuit board 100 and second circuit board 200
Electrical connection.The cooperation that is electrically connected between first circuit board 100 and second circuit board 200 can be in heat dissipation 300 forming of supporting layer
Preceding formation can also be formed after the forming of heat dissipation supporting layer 300.
Can also include: setting electrical connection first circuit board 100 based on this, in preferred scheme, after step S103 with
The conductive part 600 of second circuit board 200.
Referring to FIG. 3, the conductive part 600 of setting electrical connection first circuit board 100 and second circuit board 200, may include:
S201, the first perforation is opened up at least one of first circuit board 100 and second circuit board 200.
S202, the second perforation is opened up on heat dissipation supporting layer 300, the second perforation is penetrated through with the first perforation.
S203, conductive part 600 is set in the space that the first perforation is formed through with the second perforation, so that conductive part 600
It is electrically connected first circuit board 100 and second circuit board 200.
In step S203, conductive part 600 can be the conductive rod being assembled in the first perforation and the second perforation, such as copper
Stick, aluminium bar etc..It is of course also possible to fill conductive material into the first perforation and the second perforation, formed after conductive material solidification
Conductive part 600, as shown in Figure 1.
The electrically connecting position of first circuit board 100 and second circuit board 200 can be pre-designed, and then facilitate subsequent beat
Hole operation.In preferred scheme, the first perforation is opened up at least one of first circuit board 100 and second circuit board 200
Before, further includes: pad is set at least one of first circuit board 100 or second circuit board 200 are upper, using pad as beating
Hole site.Operator can carry out punch operation in pad locations during punching.
Based on circuit board arrangement disclosed by the embodiments of the present invention, the embodiment of the present invention discloses a kind of electronic equipment, disclosed
Electronic equipment include circuit board arrangement described in foregoing embodiments.
Electronic equipment disclosed by the embodiments of the present invention can be mobile phone, tablet computer, game machine, E-book reader, intelligence
Electronic equipments, the embodiment of the present invention such as energy wrist-watch, automatic navigator do not limit the specific type of electronic equipment.
Emphasis describes the difference between each embodiment, difference between each embodiment in foregoing embodiments of the present invention
As long as optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, then no longer superfluous at this
It states.
The above description is only an embodiment of the present invention, is not intended to restrict the invention.For those skilled in the art
For, the invention may be variously modified and varied.All any modifications made within the spirit and principles of the present invention are equal
Replacement, improvement etc., should be included within scope of the presently claimed invention.
Claims (11)
1. a kind of circuit board arrangement, which is characterized in that including first circuit board, second circuit board and heat dissipation supporting layer, described the
The plate face of one circuit board towards the second circuit board is equipped with the first electronic device, and the second circuit board is towards described first
The plate face of circuit board is provided with the second electronic device, and the heat dissipation supporting layer setting is in the first circuit board and second electricity
Between the plate of road, first electronic device and second electronic device are embedded in the heat dissipation supporting layer.
2. circuit board arrangement according to claim 1, which is characterized in that the heat dissipation supporting layer be epoxy resin layer or
Silicone layer.
3. circuit board arrangement according to claim 1, which is characterized in that between first electronic device of adjacent two
With space, second electronic device is oppositely arranged with the space.
4. circuit board arrangement according to claim 3, which is characterized in that first electronic device and second electronics
Device is greater than the heat dissipation supporting layer in the sum of the size of board direction perpendicular to the first circuit board or second circuit board
Thickness number.
5. circuit board arrangement according to claim 1, which is characterized in that the circuit board arrangement further includes conductive part, institute
The one end for stating conductive part is electrically connected with the first circuit board, the other end of the conductive part pass through the heat dissipation supporting layer and
It is electrically connected with the second circuit board.
6. circuit board arrangement according to claim 5, which is characterized in that the first circuit board and the second circuit board
In, at least one offers the first perforation, and the heat dissipation supporting layer offers the second perforation with the first perforation perforation, institute
Conductive part is stated to be mounted in first perforation and second perforation.
7. circuit board arrangement according to claim 6, which is characterized in that the conductive part is metal bar.
8. a kind of manufacture craft of circuit board arrangement characterized by comprising
The first electronic device and the second electronics device are installed respectively in two opposite plate faces of first circuit board and second circuit board
Part；
Be supported between the first circuit board and the second circuit board using supporting block so that the first circuit board with
Filling space is formed between the second circuit board, first electronic device and second electronic device are located at the filling
In space；
Heat sink material is filled into the filling space to form heat dissipation supporting layer；
Dismantle the supporting block.
9. manufacture craft according to claim 8, which is characterized in that filling space filling heat sink material to be formed
After heat dissipation supporting layer, further includes:
The first perforation is opened up at least one of the first circuit board and the second circuit board；
The second perforation is opened up on the heat dissipation supporting layer, second perforation is penetrated through with first perforation；
Conductive part is set in the space that first perforation is formed through with second perforation, so that the conductive part is electric
Connect the first circuit board and the second circuit board.
10. manufacture craft according to claim 9, which is characterized in that in the first circuit board and the second circuit
Before opening up the first perforation at least one of plate, further includes:
In the upper setting pad of at least one of the first circuit board or the second circuit board, using the pad as punching
Position.
11. a kind of electronic equipment, which is characterized in that including circuit board arrangement of any of claims 1-7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008835.4A CN109688696A (en) | 2019-01-04 | 2019-01-04 | Circuit board arrangement, the manufacture craft of circuit board arrangement and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910008835.4A CN109688696A (en) | 2019-01-04 | 2019-01-04 | Circuit board arrangement, the manufacture craft of circuit board arrangement and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109688696A true CN109688696A (en) | 2019-04-26 |
Family
ID=66192521
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910008835.4A Pending CN109688696A (en) | 2019-01-04 | 2019-01-04 | Circuit board arrangement, the manufacture craft of circuit board arrangement and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109688696A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112243314A (en) * | 2019-07-18 | 2021-01-19 | 华为技术有限公司 | Circuit board assembly, manufacturing method of circuit board assembly and electronic equipment |
| CN113727516A (en) * | 2021-08-27 | 2021-11-30 | Oppo广东移动通信有限公司 | Circuit board packaging structure and method thereof, and electronic equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01236692A (en) * | 1988-03-17 | 1989-09-21 | Matsushita Electric Ind Co Ltd | Manufacture of hybrid circuit board |
| JPH02163989A (en) * | 1988-12-16 | 1990-06-25 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
| JPH04137660A (en) * | 1990-09-28 | 1992-05-12 | Toshiba Lighting & Technol Corp | Electronic circuit device |
| JPH0590448A (en) * | 1991-09-27 | 1993-04-09 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
| CN1098588A (en) * | 1993-06-25 | 1995-02-08 | 富士电机株式会社 | The metallic printed board of multilayer and the module of moulding thereof |
-
2019
- 2019-01-04 CN CN201910008835.4A patent/CN109688696A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01236692A (en) * | 1988-03-17 | 1989-09-21 | Matsushita Electric Ind Co Ltd | Manufacture of hybrid circuit board |
| JPH02163989A (en) * | 1988-12-16 | 1990-06-25 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
| JPH04137660A (en) * | 1990-09-28 | 1992-05-12 | Toshiba Lighting & Technol Corp | Electronic circuit device |
| JPH0590448A (en) * | 1991-09-27 | 1993-04-09 | Sanyo Electric Co Ltd | Hybrid integrated circuit |
| CN1098588A (en) * | 1993-06-25 | 1995-02-08 | 富士电机株式会社 | The metallic printed board of multilayer and the module of moulding thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112243314A (en) * | 2019-07-18 | 2021-01-19 | 华为技术有限公司 | Circuit board assembly, manufacturing method of circuit board assembly and electronic equipment |
| WO2021008592A1 (en) * | 2019-07-18 | 2021-01-21 | 华为技术有限公司 | Circuit board assembly, manufacturing method for circuit board assembly, and electronic device |
| CN113727516A (en) * | 2021-08-27 | 2021-11-30 | Oppo广东移动通信有限公司 | Circuit board packaging structure and method thereof, and electronic equipment |
| CN113727516B (en) * | 2021-08-27 | 2023-02-03 | Oppo广东移动通信有限公司 | Circuit board packaging structure and method thereof, and electronic equipment |
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Application publication date: 20190426 |